CN108093104B

CN108093104B - Electronic device

Info

Publication number: CN108093104B
Application number: CN201711435724.9A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2020-07-03
Anticipated expiration: 2037-12-26
Also published as: CN108093104A

Abstract

The electronic device disclosed by the invention comprises a shell, an input/output module, a vibration module and a piezoelectric element. The input and output module is arranged in the shell and comprises an encapsulation shell, a structured light projector, a proximity infrared lamp and a light sensor. The packaging shell comprises a packaging substrate, and the structured light projector, the proximity infrared lamp and the light sensor are all packaged in the packaging shell and are carried on the packaging substrate. The structured light projector and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light. The vibration module is installed on the casing, and piezoelectric element combines and with the input/output module interval with the vibration module, and piezoelectric element is used for taking place deformation so that the vibration module vibrates when being exerted the electrical signal. The integration level of input/output module is higher, and the volume is less, and electron device adopts piezoelectric element and vibration module to realize bone conduction transaudient, can effectively guarantee the privacy of conversation content.

Description

Electronic device

Technical Field

The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, an infrared light supplement lamp and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone can occupy too much space.

Disclosure of Invention

The embodiment of the invention provides an electronic device.

An electronic device according to an embodiment of the present invention includes:

a housing;

the input and output module is arranged in the shell and comprises a packaging shell, a structured light projector, a proximity infrared lamp and a light sensor, the packaging shell comprises a packaging substrate, the structured light projector, the proximity infrared lamp and the light sensor are all packaged in the packaging shell and are borne on the packaging substrate, the structured light projector and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light;

the vibration module is arranged on the shell; and

the piezoelectric element is combined with the vibration module and is spaced from the input and output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate.

In some embodiments, the vibration module includes a display screen and a transparent cover plate, the display screen is disposed on the housing and forms an accommodation cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodation cavity, the display screen is combined with the cover plate, the housing is provided with a housing approach through hole, a housing structure light through hole, a housing light sensation through hole, and a housing vibration through hole, the approach infrared lamp corresponds to the housing approach through hole, the structure light projector corresponds to the housing structure light through hole, the light sensor corresponds to the housing light sensation through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.

In some embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.

In some embodiments, the input-output module further comprises a chip, and the structured light projector, the proximity infrared lamp, and the light sensor are formed on one piece of the chip.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a structured light window, a proximity window and a light sensation window, the structured light window corresponds to the structured light projector, the proximity window corresponds to the proximity infrared lamp, and the light sensation window corresponds to the light sensation device.

In some embodiments, the input-output module further comprises a proximity lamp lens disposed within the enclosure and corresponding to the proximity infrared lamp; and/or the input/output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.

In some embodiments, the input/output module further includes a proximity lamp lens and a light-sensitive lens disposed in the package housing, the proximity lamp lens corresponds to the proximity infrared lamp, the light-sensitive lens corresponds to the light-sensitive device, and the proximity lamp lens and the light-sensitive lens are disposed on the same transparent substrate.

In some embodiments, the input-output module further comprises a plurality of metal shielding plates respectively located in the package housing and between any two of the structured light projector, the proximity infrared lamp, and the light sensor.

In some embodiments, the input-output module further comprises an optical enclosure made of a light transmissive material formed on the package substrate and located within the package housing, the optical enclosure enclosing the proximity infrared lamp and the light sensor.

In some embodiments, the input-output module further comprises a plurality of light-emitting partitions, each of the light-emitting partitions being formed in the optical enclosure and located between any two of the structured light projector, the proximity infrared light, and the light sensor.

In some embodiments, a ground pin, a structured light pin, a proximity lamp pin, and a light sensing pin are formed on the input/output module, and when the ground pin and the structured light pin are enabled, the structured light projector emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.

In some embodiments, the surface of the cover plate coupled to the chassis is formed with an infrared transparent ink that transmits only infrared light, the infrared transparent ink blocking at least one of the chassis access through hole, the chassis structured light through hole, and the chassis vibration through hole.

In some embodiments, the electronic device further includes a proximity sensor and an imaging module, the imaging module includes a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base includes a mounting surface located between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module is installed on the housing, the imaging module includes a camera housing and a lens module, the top surface of the camera housing is a step surface and includes a first sub-top surface and a second sub-top surface which are connected, the second sub-top surface is opposite to the first sub-top surface and inclines to form a notch with the first sub-top surface, the top surface has been provided with a light-emitting through hole, the lens module is accommodated in the camera housing and corresponds to the light-emitting through hole, and the proximity sensor is disposed at the first sub-top surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module includes a camera housing and two lens modules, a notch is formed on a top surface of the camera housing to form a stepped top surface, the top surface includes a first step surface and a second step surface lower than the first step surface, two light-emitting through holes are formed on the first step surface, each light-emitting through hole corresponds to the lens module, and the proximity sensor is disposed at the second step surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module includes a lens holder, a lens barrel mounted on the lens holder, and a substrate partially disposed in the lens holder, and the proximity sensor is disposed on the substrate.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and an infrared light supplement lamp, the centers of the input/output module, the infrared camera, the visible light camera, and the infrared light supplement lamp are located on the same line segment, and the piezoelectric element is located between the line segment and the top of the housing.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and an infrared light supplement lamp, the number of the piezoelectric elements is plural, the number of the casing vibration through holes is plural, the piezoelectric elements correspond to the casing vibration through holes, each piezoelectric element is accommodated in the corresponding casing vibration through hole, the centers of the input and output module, the infrared camera, the visible light camera, the piezoelectric elements, and the infrared light supplement lamp are located on the same line segment, and at least one of the input and output module, the infrared camera, the visible light camera, and the infrared light supplement lamp is provided between two adjacent piezoelectric elements.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and an infrared light supplement lamp, the piezoelectric element includes a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the casing vibration through holes is multiple, the plurality of piezoelectric bumps correspond to the plurality of casing vibration through holes, each piezoelectric bump is partially accommodated in the corresponding casing vibration through hole and is combined with the cover plate, the input/output module, the infrared camera, the visible light camera, and the light supplement infrared lamp are located between the cover plate and the piezoelectric body, the centers of the input/output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the infrared light supplement lamp are located on the same line segment, and the input/output module, the visible light camera, the plurality of piezoelectric bumps, and the infrared light supplement lamp are located between two adjacent piezoelectric bumps, At least one of the infrared camera, the visible light camera and the infrared light supplement lamp.

In the electronic device of the embodiment of the invention, the input/output module integrates the structured light projector, the proximity infrared lamp and the light sensor into a single packaging body structure, and integrates the functions of three-dimensional imaging, infrared distance measurement for emitting infrared light and visible light intensity detection, so that the input/output module has higher integration level and smaller volume, and saves the space for realizing the functions of three-dimensional imaging, infrared distance measurement for emitting infrared light and visible light intensity detection. In addition, because the structured light projector, the proximity infrared lamp and the light sensor are borne on the same packaging substrate, compared with the structured light projector, the proximity infrared lamp and the light sensor which are manufactured by adopting different wafers respectively and then combined on a PCB substrate for packaging in the traditional process, the packaging efficiency is improved. Furthermore, the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction sound transmission, replaces the traditional telephone receiver structure which is used for transmitting sound through air, effectively ensures the privacy of conversation content on the one hand, and on the other hand, because the original telephone receiver is cancelled, the through hole which corresponds to the telephone receiver is avoided being arranged on the cover plate, the process is simpler, and the appearance is more attractive.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIG. 4 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line V-V;

FIG. 6 is a schematic partial cross-sectional view of the electronic device of FIG. 1 taken along line VI-VI;

FIG. 7 is a perspective view of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention;

fig. 8 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 10 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

fig. 11 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

FIG. 13 is a schematic partial cross-sectional view of the electronic device of FIG. 12 taken along line XIII-XIII;

FIG. 14 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIGS. 15 to 17 are schematic partial cross-sectional views of an electronic device according to an embodiment of the present invention taken along a position corresponding to the XV-XV line in FIG. 1;

fig. 18 is a perspective view of a proximity sensor and an input/output module of an electronic device according to an embodiment of the invention;

fig. 19 to 26 are schematic perspective views of a proximity sensor and an imaging module of an electronic device according to an embodiment of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout. In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic component includes an input/output module 10, a proximity sensor 50 (as shown in fig. 7), a vibration module 30a (as shown in fig. 5), a piezoelectric element 70, an imaging module 60 (as shown in fig. 7), and an infrared fill-in light 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 and 3, the input/output module 10 is a single package structure, and includes a package housing 11, a structured light projector 12, a proximity infrared lamp 13, and a light sensor 1 d.

The package case 11 is used to simultaneously package the structured light projector 12, the proximity infrared lamp 13, and the light sensor 1d, or the structured light projector 12, the proximity infrared lamp 13, and the light sensor 1d are simultaneously packaged in the package case 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10. In the present embodiment, the centers of the structured light projector 12, the proximity infrared lamp 13, and the photosensor 1d are located on the same line segment, for example: a structured light projector 12, a near infrared lamp 13 and a light sensor 1d are sequentially arranged from one end to the other end of the line segment; or, the proximity infrared lamp 13, the structured light projector 12 and the light sensor 1d are sequentially arranged from one end to the other end of the line segment; alternatively, the proximity infrared lamp 13, the optical sensor 1d, and the structured light projector 12 are sequentially arranged along one end of the line segment to the other end. In other embodiments, the line joining the centers of the structured light projector 12, the proximity infrared lamp 13, and the light sensor 1d is triangular.

The package substrate 111 is used to carry the structured light projector 12, the proximity infrared lamp 13, and the photo sensor 1 d. In manufacturing the input/output module 10, the structured light projector 12, the proximity infrared lamp 13, and the photo sensor 1d may be formed on one chip 14, and then the structured light projector 12, the proximity infrared lamp 13, the photo sensor 1d, and the chip 14 may be disposed on the package substrate 111 together, specifically, the chip 14 may be bonded to the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100.

The package sidewall 112 may be disposed around the structured light projector 12, the proximity infrared lamp 13 and the optical sensor 1d, the package sidewall 112 extends from the package substrate 111, the package sidewall 112 may be combined with the package substrate 111, and preferably, the package sidewall 112 and the package substrate 111 are detachably connected, so as to facilitate maintenance of the structured light projector 12, the proximity infrared lamp 13 and the optical sensor 1d after the package sidewall 112 is removed. The package side walls 112 may be made of an infrared opaque material to prevent infrared light emitted by the structured light projector 12 or the proximity infrared lamp 13 from passing through the package side walls 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a structured light window 1131, a proximity window 1132 and a light sensing window 1133, the structured light window 1131 corresponds to the structured light projector 12, and structured light (infrared light) emitted by the structured light projector 12 passes out of the structured light window 1131; the proximity window 1132 corresponds to the proximity infrared lamp 13, and infrared light emitted by the proximity infrared lamp 13 passes out of the proximity window 1132; the light sensing window 1133 corresponds to the light sensor 1d, and the visible light can pass through the light sensing window 1133 and be incident on the light sensor 1 d. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the structured light window 1131, the proximity window 1132 and the light-sensing window 1133 are all through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is fabricated by combining an infrared opaque material, a visible opaque material, and specifically, the structure light window 1131 and the proximity window 1132 are fabricated by an infrared opaque material, the light sensing window 1133 is fabricated by a visible opaque material, and the rest is fabricated by an infrared opaque material and a visible opaque material. Further, the structured light window 1131 and the proximity window 1132 may be formed with a lens structure to improve an infrared light emission angle from the structured light window 1131 and the proximity window 1132, for example, the structured light window 1131 is formed with a concave lens structure to make the light passing through the structured light window 1131 diverge and exit outwards; the proximity window 1132 is formed with a convex lens structure, so that light passing through the proximity window 1132 is gathered and emitted outwards; the light sensing window 1133 may also be formed with a lens structure to improve the visible light emitting angle incident from the light sensing window 1133, for example, the light sensing window 1133 has a convex lens structure to gather and project the light incident from the light sensing window 1133 onto the light sensor 1 d.

The structured light projector 12, the proximity infrared lamp 13 and the light sensor 1d can be formed on one chip 14, so that the volume of the structured light projector 12, the proximity infrared lamp 13 and the light sensor 1d after integration is further reduced, and the preparation process is simple. The structured light projector 12 can emit structured light outwards, the structured light can form an infrared laser speckle pattern, the structured light is projected onto the surface of the target object, the structured light pattern modulated by the target object is collected by the infrared camera 62 (as shown in fig. 1), and a depth image of the target object is obtained by analyzing and calculating the modulated structured light pattern (at this time, the structured light projector 12 is used for stereo imaging). In an embodiment of the present invention, the structured light projector 12 includes a light source 121, a frame 122, a lens 123, and a Diffractive Optical Elements (DOEs) 124. The light beam emitted from the light source 121 is collimated or converged by the lens 123, expanded by the diffractive optical element 124, and emitted outward in a certain light beam pattern. In particular, the light source 121 may be formed on the chip 14, and the lens 123 and the diffractive optical element 124 may be fixed to the frame 122, for example by gluing to the frame 122. The proximity infrared lamp 13 may emit infrared light that passes through the proximity window 1132 and reaches the surface of the object, and the proximity sensor 50 (shown in fig. 7) of the electronic device 100 receives the infrared light reflected by the object to detect the distance of the object from the electronic device 100. Specifically, the proximity sensor 50 may receive infrared light emitted by the proximity infrared lamp 13 and reflected by the object for determining the distance of the object from the electronic apparatus 100.

The structured light projector 12 and the proximity infrared lamp 13 can emit infrared light to the outside of the packaging shell 11 at different powers, specifically, the structured light projector 12 and the proximity infrared lamp 13 can emit infrared light at the same time, and the input and output module 10 is used for three-dimensional imaging and infrared distance measurement at the same time; the structured light projector 12 can emit light rays but not emit light rays near the infrared lamp 13, and the input and output module 10 is only used for three-dimensional imaging; the structured light projector 12 may emit no light but light near the infrared lamp 13, and the input/output module 10 is only used for infrared distance measurement.

Referring to fig. 4, in the embodiment of the invention, the input/output module 10 is formed with a ground pin 15, a structured light pin 16, a proximity light pin 17 and a light sensing pin 1 f. The ground pin 15, the structured light pin 16, the proximity lamp pin 17, and the light sensing pin 1f may be formed on the package substrate 111, and when the ground pin 15 and the structured light pin 16 are enabled (i.e., when the ground pin 15 and the structured light pin 16 are connected to a circuit and turned on), the structured light projector 12 emits infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are on), the proximity infrared lamp 13 emits infrared light; when the ground pin 15 and the light sensing pin 1f are enabled (i.e., when the ground pin 15 and the light sensing pin 1f are connected to the circuit, the light sensor 1d detects the intensity of the visible light, which is used as a basis for controlling the display brightness of the display screen 90.

Referring to fig. 1 and 5, the housing 20 may serve as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The chassis 20 may be a housing of the electronic device 100.

Referring to fig. 1, 5 and 6, the housing 20 includes a top portion 21 and a bottom portion 22, and at a position corresponding to the electronic component, the housing 20 is formed with a housing approaching through hole 23, a housing structure light through hole 24, a housing light sensing through hole 2f and a housing vibration through hole 2a which are spaced from each other. When the input/output module 10 is disposed in the housing 20, the proximity infrared lamp 13 corresponds to the housing proximity through hole 23, the structured light projector 12 corresponds to the housing structured light through hole 24, and the light sensor 1d corresponds to the housing light sensor through hole 2 f. The light emitted by the near infrared lamp 13 corresponding to the case near through hole 23 can pass through the case near through hole 23, specifically, the near infrared lamp 13 is opposite to the case near through hole 23, or the light emitted by the near infrared lamp 13 passes through the case near through hole 23 after being acted by the light guide element. The structured light projector 12 corresponds to the housing structured light through hole 24, and the description thereof is omitted here. The light sensor 1d and the case light sensing through hole 2f correspond to each other, and the visible light can pass through the case light sensing through hole 2f and be incident on the light sensor 1d, specifically, the light sensor 1d is opposite to the case light sensing through hole 2f, or the incident light of the visible light passes through the case light sensing through hole 2f and is incident on the light sensor 1d after the light guide element acts on the light sensor. In the embodiment shown in fig. 6, the chassis approach through hole 23, the chassis structure light through hole 24, and the chassis light sensing through hole 2f may be spaced from each other, but of course, in other embodiments, the chassis approach through hole 23, the chassis structure light through hole 24, and the chassis light sensing through hole 2f may be communicated with each other.

The vibration module 30a is mounted on the cabinet 20. The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 and the cover plate 30 are combined to form the vibration module 30a, so as to improve the rigidity of the vibration module 30 a. The display screen 90 is disposed on the housing 20 and forms a receiving cavity 91 with the housing 20, and the cover plate 30 is disposed on the housing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the input/output module 10 according to the embodiment of the invention can occupy a smaller volume, the volume for disposing the display screen 90 in the housing 20 can be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the display 90, the input/output module 10 and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22, and the top portion 21 is located above the bottom portion 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, the input/output module 10 may be disposed between the display 90 and the top portion 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.

The piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a twin wafer, or a laminated piezoelectric element 70. The piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the input-output module 10. Specifically, the piezoelectric element 70 is accommodated in the casing vibration through hole 2a, is coupled to the cover plate 30, and is spaced apart from the casing 20, and may be: the piezoelectric element 70 is partially accommodated in the chassis vibration through hole 2a, or the piezoelectric element 70 is entirely accommodated in the chassis vibration through hole 2 a. When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 is mechanically deformed, for example, expanded or contracted, due to the inverse piezoelectric effect, thereby causing the vibration module 30a coupled to the piezoelectric element 70 to vibrate according to the frequency of the electric signal. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth). In this way, the user can realize the functions of voice call, listening to music, etc. through the piezoelectric element 70 and the vibration module 30 a. In an embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal and apply an electrical signal corresponding to the sound signal to the two ends of the piezoelectric element 70.

It can be understood that the traditional receiver structure adopts air conduction sound, the local sound pressure of the receiver is usually about 90 dB-100 dB when the receiver works, and the sound is still about 50 dB-60 dB even if the sound is transmitted to the range of 1 meter around in the quiet surrounding environment (such as in the general office environment of about 50 dB), which causes the conversation content among the callers to be perceived around, resulting in privacy leakage. The electronic device 100 according to the embodiment of the invention adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and the sound of the call is mainly sensed by the bone conduction of the vibration and can effectively ensure the privacy of the call content.

Referring again to fig. 5 and 6, the piezoelectric element 70 and the display screen 90 are attached to the cover plate 30 by the joint 30 b. The bonding member 30b is an adhesive, a double-sided tape, an adhesive tape, or the like having a thermosetting property and an ultraviolet curing property. For example, the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet-curing acrylic adhesive). The area of the cover 30 bonded to the piezoelectric element 70 is spaced apart from the area of the cover 30 bonded to the display screen 90 to prevent the display of the display screen 90 from being interfered with by the piezoelectric element 70. Of course, the cover 30 can also be coupled to the housing 20 by the coupling member 30b, so that compared with the case where the cover 30 is directly disposed on the housing 20, the vibration of the vibration module 30a can be prevented from being directly transmitted to the housing 20, thereby reducing the possibility that the user may drop the electronic device 100 due to the excessive vibration amplitude of the housing 20.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 6, the cover plate 30 covers the chassis structure light through hole 24, the chassis approach through hole 23, the chassis light sensing through hole 2f, and the chassis vibration through hole 2a, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered with the infrared transmissive ink 40 with naked eyes in normal use. Specifically, the infrared transmissive ink 40 may cover areas of the inner surface 32 that do not correspond to the display 90 and the chassis light sensing through holes 2 f.

The infrared transparent ink 40 can further shield at least one of the chassis approach through hole 23, the chassis structure optical through hole 24, and the chassis vibration through hole 2a, that is, the infrared transparent ink 40 can simultaneously shield the chassis approach through hole 23, the chassis structure optical through hole 24, and the chassis vibration through hole 2a (as shown in fig. 6), so that a user can hardly see the internal structure of the electronic device 100 through the chassis approach through hole 23, the chassis structure optical through hole 24, and the chassis vibration through hole 2a, and the electronic device 100 has a more beautiful appearance; the infrared transmitting ink 40 can also cover the chassis approach through hole 23, and does not cover the chassis structure optical through hole 24 and the chassis vibration through hole 2 a; the infrared transmitting ink 40 can also cover the chassis structure light through hole 24, and does not cover the chassis approach through hole 23 and the chassis vibration through hole 2 a; the infrared transmitting ink 40 can also cover the chassis vibration through hole 2a, and does not cover the chassis approach through hole 23 and the chassis structure light through hole 24; the infrared transmitting ink 40 can also cover the chassis approach through hole 23 and the chassis structure light through hole 24, and does not cover the chassis vibration through hole 2 a; the infrared transmitting ink 40 can also cover the chassis structure light through hole 24 and the chassis vibration through hole 2a, and does not cover the chassis approach through hole 23; the ir pass-through ink 40 may also cover the chassis access through hole 23 and the chassis vibration through hole 2a, and uncover the chassis structured light through hole 24.

Referring to fig. 7, the proximity sensor 50 is a single package structure. The infrared light emitted from the proximity infrared lamp 13 is reflected by an external object and then received by the proximity sensor 50, and the proximity sensor 50 determines the distance between the external object and the electronic device 100 according to the received infrared light reflected by the object.

Referring to fig. 1 and 7, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 7, the proximity sensor 50 is disposed on the mounting surface 631, and specifically, the orthogonal projection of the proximity sensor 50 on the plane of the mounting surface 631 at least partially falls on the mounting surface 631, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two together is small.

Referring to fig. 1, the infrared fill-in light 80 is used to emit infrared light, and after the infrared light is reflected by the surface of an external object, the infrared camera 62 of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object.

In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70 and the infrared fill-in light 80 are located on the same line segment. Specifically, the input/output module 10, the infrared fill light 80, the piezoelectric element 70, the infrared camera 62, and the visible light camera 61 (as shown in fig. 8) are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 may form a dual-camera (as shown in fig. 23); or an input/output module 10, an infrared camera 62, a piezoelectric element 70, a visible light camera 61 and an infrared fill-in light 80 (as shown in fig. 1) are sequentially arranged from one end of the line segment to the other end; or the infrared camera 62, the input/output module 10, the piezoelectric element 70, the visible light camera 61 and the infrared light supplement lamp 80 are arranged in sequence from one end of the line segment to the other end; or the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the input/output module 10 and the infrared light supplement lamp 80 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double-camera (as shown in fig. 23). Of course, the arrangement of the input/output module 10, the infrared camera 62, the piezoelectric element 70, the visible light camera 61, and the infrared fill-in lamp 80 is not limited to the above example, and may be other shapes, such as a shape in which the centers of the electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Referring to fig. 9, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The centers of the input/output module 10, the infrared camera 62, the visible light camera 61 and the infrared light supplement lamp 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the casing 20. Specifically, the input/output module 10, the infrared light supplement lamp 80, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment; or the input/output module 10, the infrared camera 62, the visible light camera 61 and the infrared light supplement lamp 80 are sequentially arranged from one end to the other end of the line segment (as shown in fig. 9); or the infrared camera 62, the input/output module 10, the visible light camera 61 and the infrared light supplement lamp 80 are arranged from one end of the line segment to the other end in sequence; or the infrared camera 62, the visible light camera 61, the input/output module 10 and the infrared light supplement lamp 80 are sequentially arranged from one end of the line segment to the other end of the line segment. Of course, the arrangement of the input/output module 10, the infrared camera 62, the visible light camera 61, and the infrared fill-in lamp 80 is not limited to the above example. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, so that the lateral space occupied by each electronic component (the input/output module 10, the infrared camera 62, the visible light camera 61, the infrared fill light 80, etc.) on the cover plate 30 is saved.

Further, referring to fig. 7, the proximity sensor 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, and of course, the proximity sensor 50 may not be disposed on the mounting surface 631, and for example, the proximity sensor 50 may be disposed adjacent to the input/output module 10, or may be disposed adjacent to the piezoelectric element 70, which is not limited herein.

In summary, in the electronic device 100 according to the embodiment of the invention, the input/output module 10 integrates the structured light projector 12, the proximity infrared lamp 13 and the optical sensor 1d into a single package structure, and integrates the functions of stereo imaging, infrared distance measurement for emitting infrared light, and visible light intensity detection, so that the input/output module 10 has a higher integration level and a smaller volume, and the input/output module 10 saves space for realizing the functions of stereo imaging, infrared distance measurement for emitting infrared light, and visible light intensity detection. In addition, since the structured light projector 12, the proximity infrared lamp 13 and the optical sensor 1d are supported on the same package substrate 111, compared with the structured light projector 12, the proximity infrared lamp 13 and the optical sensor 1d in the conventional art, which need to be manufactured by different wafers and then assembled on a PCB substrate for packaging, the packaging efficiency is improved. Moreover, the electronic device 100 adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and replaces the traditional receiver structure which conducts sound through air, so that on one hand, the privacy of the conversation content can be effectively ensured; on the other hand, the original telephone receiver is eliminated, so that a through hole corresponding to the telephone receiver is not formed in the cover plate 30, the process is simpler, the appearance is more attractive, and dust or moisture can be prevented from entering the electronic device 100.

Referring to fig. 6 and 10, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach through hole 23, a casing structure light through hole 24, a casing light sensing through hole 2f, and a casing vibration through hole 2a, which are spaced apart from each other. The proximity infrared lamp 13 corresponds to the case proximity through hole 23, the structured light projector 12 corresponds to the case structured light through hole 24, and the light sensor 1d corresponds to the case light sensor through hole 2 f. The number of the piezoelectric elements 70 is plural, the number of the chassis vibration through holes 2a is plural, the plural piezoelectric elements 70 correspond to the plural chassis vibration through holes 2a, and each piezoelectric element 70 is accommodated in the corresponding chassis vibration through hole 2 a. The center of input/output module 10, infrared camera 62, visible light camera 61, a plurality of piezoelectric element 70 and infrared light filling lamp 80 is located same line segment, is provided with at least one in input/output module 10, infrared camera 62, visible light camera 61 and the infrared light filling lamp 80 between two adjacent piezoelectric element 70. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric elements 70, the input/output module 10, the infrared fill-in light 80, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 are sequentially arranged from one end to the other end of the line segment (as shown in fig. 10); or the piezoelectric element 70, the input/output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the infrared light supplement lamp 80 and the like are sequentially arranged from one end to the other end of the line segment. For another example, the number of the piezoelectric elements 70 is three, and the piezoelectric elements 70, the input/output module 10, the infrared fill-in light 80, the piezoelectric elements 70, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 (as shown in fig. 11) are arranged in sequence from one end to the other end of the line segment; or the piezoelectric element 70, the input/output module 10, the piezoelectric element 70, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the infrared fill light 80, and the like are sequentially arranged from one end to the other end of the line segment. Of course, the number of the piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the input/output module 10, the infrared camera 62, the visible light camera 61, and the infrared fill-in light 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric elements 70 are combined with the cover plate 30, and specifically, the plurality of piezoelectric elements 70 are respectively attached to the cover plate 30 by the joining members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to two ends of the piezoelectric elements 70, and the piezoelectric elements 70 are mechanically deformed, so that the piezoelectric elements 70 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality of piezoelectric elements 70 simultaneously drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is uniform and has higher intensity, which is beneficial to stably transmitting the bone conduction sound to the auditory nerve of the user.

Referring to fig. 6, 12 and 13, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach through hole 23, a casing structure light through hole 24, a casing light sensing through hole 2f, and a casing vibration through hole 2a, which are spaced apart from each other. The proximity infrared lamp 13 corresponds to the case proximity through hole 23, the structured light projector 12 corresponds to the case structured light through hole 24, and the light sensor 1d corresponds to the case light sensor through hole 2 f. The piezoelectric element 70 includes a piezoelectric body 71 and a plurality of piezoelectric bumps 72 extending from the piezoelectric body 71, the number of the piezoelectric bumps 72 is plural, the number of the chassis vibration through holes 2a is plural, the plurality of piezoelectric bumps 72 correspond to the plurality of chassis vibration through holes 2a, and each piezoelectric bump 72 is partially received in the corresponding chassis vibration through hole 2a and is coupled to the cover plate 30. The input/output module 10, the infrared camera 62, the visible light camera 61, and the infrared light supplement lamp 80 are located between the cover plate 30 and the piezoelectric body 71. The center of input/output module 10, infrared camera 62, visible light camera 61, a plurality of piezoelectricity lug 72 and infrared light filling lamp 80 is located same line segment, is provided with at least one in input/output module 10, infrared camera 62, visible light camera 61 and the infrared light filling lamp 80 between two adjacent piezoelectricity lugs 72. For example, the number of the piezoelectric bumps 72 is two, and the piezoelectric bumps 72, the input/output module 10, the infrared fill-in light 80, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the input/output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the infrared light supplement lamp 80 and the like are sequentially arranged from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is three, and the piezoelectric bumps 72, the input/output module 10, the infrared fill light 80, the piezoelectric bumps 72, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the input/output module 10, the piezoelectric bump 72, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the infrared light supplement lamp 80, and the like are sequentially arranged from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is five, and the piezoelectric bumps 72, the input/output module 10, the piezoelectric bumps 72, the infrared fill light 80, the piezoelectric bumps 72, the infrared camera 62, the piezoelectric bumps 72, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 13). Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the input/output module 10, the infrared camera 62, the visible light camera 61, and the infrared fill-in light 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric bumps 72 are combined with the cap plate 30, and more specifically, the plurality of piezoelectric bumps 72 are respectively attached to the cap plate 30 by the bonding members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bumps 72 is mechanically deformed, so that the piezoelectric bumps 72 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment shown in fig. 13, the casing 20 is provided with a casing vibration through hole 2a, an input/output through hole 25, a light supplement through hole 26, an infrared light through hole 27, and a visible light through hole 28, which are spaced apart from each other. The shell vibration through hole 2a corresponds to the piezoelectric bump 72, the input/output through hole 25 corresponds to the input/output module 10, the light supplement through hole 26 corresponds to the infrared light supplement lamp 80, the infrared light through hole 27 corresponds to the infrared camera 62, and the visible light through hole 28 corresponds to the visible light camera 61. The input/output through hole 25 may be replaced by the above-mentioned spaced chassis approach through hole 23, chassis structure optical through hole 24, and chassis light sensing through hole 2f, or the input/output through hole 25 is formed by the above-mentioned chassis approach through hole 23, chassis structure optical through hole 24, and chassis light sensing through hole 2f communicating with each other. In addition, the light supplement through hole 26 and the infrared light supplement lamp 80 correspond to each other, that is, infrared light emitted by the infrared light supplement lamp 80 can pass through the light supplement through hole 26, that the infrared light through hole 27 and the infrared light camera 62 correspond to each other, that the infrared light camera 62 can receive infrared light reflected by an object from the infrared light through hole 27, that the visible light through hole 28 and the visible light camera 61 correspond to each other, that the visible light camera 61 can receive visible light reflected by the object from the visible light through hole 28.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is more uniform and stronger, which is beneficial to stably transmitting bone conduction sound to the auditory nerve of the user; in addition, the plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, so that an electrical signal can be simultaneously applied to the plurality of piezoelectric bumps 72, and the vibration module 30a can be driven to vibrate synchronously from a plurality of different positions; furthermore, the input/output module 10, the infrared camera 62, the visible light camera 61, and the infrared light supplement lamp 80 are located between the cover plate 30 and the piezoelectric body 71, and the piezoelectric bumps 72 are inserted, so that the electronic device 100 has a small overall size and saves space.

Referring to fig. 3, in some embodiments, the input/output module 10 further includes a proximity lens 19 and a photo lens 1 e. The proximity lamp lens 19 is provided inside the package case 11 and corresponds to the proximity infrared lamp 13. The light sensor lens 1e is disposed in the package case 11 and corresponds to the light sensor 1 d. The infrared light emitted from the proximity infrared lamp 13 is focused by the proximity lamp lens 19 into the proximity window 1132 and exits, reducing the amount of light emitted to other areas of the package sidewall 112 and package top 113. Similarly, when the visible light entering from the light sensing window 1133 is incident on the light sensing lens 1e, the light sensing lens 1e converges the visible light on the light sensor 1d, so as to reduce the amount of the visible light transmitted to the area outside the light sensor 1 d. Specifically, the proximity lamp lens 19 and the light-sensitive lens 1e may be both located on the same transparent substrate, and more specifically, the proximity lamp lens 19 and the light-sensitive lens 1e may be both integrally formed with the transparent substrate. Of course, the input/output module 10 may be provided with only one of the proximity lamp lens 19 and the photo lens 1e, or may not be provided with the proximity lamp lens 19 and the photo lens 1 e.

Referring to fig. 3, in some embodiments, the input/output module 10 further includes a plurality of metal shielding plates 1a, the plurality of metal shielding plates 1a are all located in the package housing 11, and the plurality of metal shielding plates 1a are respectively located between any two of the structured light projector 12, the proximity infrared lamp 13, and the optical sensor 1 d. When the centers of the structured light projector 12, the proximity infrared lamp 13 and the light sensor 1d are located on the same line segment, the number of the metal shielding plates 1a is two; if the structural light projector 12, the proximity infrared lamp 13 and the light sensor 1d are arranged from one end to the other end of the line segment in sequence, the two metal shielding plates 1a are respectively positioned between the structural light projector 12 and the proximity infrared lamp 13 and between the proximity infrared lamp 13 and the light sensor 1 d; if the proximity infrared lamp 13, the structured light projector 12 and the light sensor 1d are arranged from one end to the other end of the line segment in sequence, the two metal shielding plates 1a are respectively positioned between the structured light projector 12 and the proximity infrared lamp 13 and between the structured light projector 12 and the light sensor 1 d; if the proximity infrared lamp 13, the light sensor 1d and the structured light projector 12 are sequentially arranged from one end to the other end of the line segment, the two metal shielding plates 1a are respectively positioned between the light sensor 1d and the proximity infrared lamp 13 and between the structured light projector 12 and the light sensor 1 d. The metal shielding plate 1a is located between the structured light projector 12 and the near infrared lamp 13, on one hand, the metal shielding plate 1a can shield electromagnetic interference between the structured light projector 12 and the near infrared lamp 13, the luminous intensity and the time sequence of the structured light projector 12 and the near infrared lamp 13 cannot be influenced mutually, on the other hand, the metal shielding plate 1a can be used for isolating a cavity where the structured light projector 12 is located and a cavity where the near infrared lamp 13 is located, and light cannot enter another cavity from one cavity. The metal shielding plate 1a is located between the structured light projector 12 and the light sensor 1d or between the light sensor 1d and the proximity infrared lamp 13, so that infrared light initially emitted by the structured light projector 12 and the proximity infrared lamp 13 can be prevented from being incident on the light sensor 1d, and electromagnetic interference between the structured light projector 12 and the light sensor 1d or electromagnetic interference between the proximity infrared lamp 13 and the light sensor 1d can be shielded.

Referring to fig. 14, in some embodiments, the input/output module 10 further includes an optical enclosure 1 b. The optical enclosure 1b is made of a light-transmissive material, and the optical enclosure 1b is formed on the package substrate 111 and located inside the package case 11. The optical enclosure 1b encloses the proximity infrared lamp 13 and the optical sensor 1 d. Specifically, the optical enclosure 1b may be formed by a potting injection molding process, the optical enclosure 1b may be made of a transparent thermosetting epoxy resin so as to be not easily softened in use, the optical enclosure 1b may fix a relative position between the proximity infrared lamp 13 and the light sensor 1d, and the proximity infrared lamp 13 and the light sensor 1d are not easily shaken in the package housing 11.

In addition, referring to fig. 14, the input/output module 10 further includes a plurality of light-emitting partition plates 1c, and the light-emitting partition plates 1c are formed in the optical enclosure 1b and located among the structured light projector 12, the proximity infrared lamp 13 and the optical sensor 1 d. When the centers of the structured light projector 12, the proximity infrared lamp 13 and the light sensor 1d are positioned on the same line segment, the number of the light-emitting partition plates 1c is two; if the structural light projector 12, the proximity infrared lamp 13 and the light sensor 1d are arranged from one end to the other end of the line segment in sequence, the two light-emitting partition plates 1c are respectively positioned between the structural light projector 12 and the proximity infrared lamp 13 and between the proximity infrared lamp 13 and the light sensor 1 d; if the proximity infrared lamp 13, the structured light projector 12 and the light sensor 1d are arranged from one end to the other end of the line segment in sequence, the two light-emitting partition plates 1c are respectively positioned between the structured light projector 12 and the proximity infrared lamp 13 and between the structured light projector 12 and the light sensor 1 d; if the proximity infrared lamp 13, the light sensor 1d and the structured light projector 12 are sequentially arranged from one end to the other end of the line segment, the two light-emitting partition plates 1c are respectively positioned between the light sensor 1d and the proximity infrared lamp 13 and between the structured light projector 12 and the light sensor 1 d. The light exit spacer 1c may be used to separate the structured light projector 12 from the proximity infrared lamp 13, and the light emitted from the structured light projector 12 will not pass through the proximity window 1132, and the light emitted from the proximity infrared lamp 13 will not pass through the structured light window 1131. The light-emitting partition 1c can block infrared light initially emitted by the structured light projector 12 and the proximity infrared lamp 13 from being incident on the light sensor 1d, and simultaneously block visible light entering from the light sensing window 1133 and emitted to the light sensor 1d from affecting the light emission of the structured light projector 12 and the proximity infrared lamp 13.

Referring to fig. 7, in some embodiments, the proximity sensor 50 of the above embodiments may be disposed on the mounting surface 631 of the mirror base 63. The lens mount 63 can be the lens mount 63 of the infrared camera 62, and can also be the lens mount 63 of the visible camera 61.

Referring to fig. 15, in some embodiments, the cover plate 30 may further have a cover plate structure light through hole 34, the cover plate structure light through hole 34 corresponds to the chassis structure light through hole 24, and the structure light emitted by the structure light projector 12 passes through the chassis structure light through hole 24 and then passes out of the electronic device 100 from the cover plate structure light through hole 34. In this case, the infrared transmitting ink 40 may be provided on the cover 30 at a position corresponding to the chassis approach through hole 23, so that the user cannot easily see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach through hole 23, and the electronic device 100 has a good appearance.

Referring to fig. 16, in some embodiments, the cover 30 may further include a cover approaching through hole 33, the cover approaching through hole 33 corresponds to the chassis approaching through hole 23, and the infrared light emitted by the approaching infrared lamp 13 passes through the chassis approaching through hole 23 and then passes through the cover approaching through hole 33 to the electronic device 100. In this case, the infrared transmissive ink 40 may be disposed on the cover 30 at a position corresponding to the chassis structured light passing hole 24, so that the user is difficult to see the structured light projector 12 inside the electronic device 100 through the chassis structured light passing hole 24, and the electronic device 100 has a beautiful appearance.

Referring to fig. 17, in some embodiments, the cover plate 30 may further have a cover plate light sensing through hole 36, the cover plate light sensing through hole 36 corresponds to the case light sensing through hole 2f and the light sensor 1d, and visible light outside the electronic device 100 may pass through the cover plate light sensing through hole 36 and the case light sensing through hole 2f and then be incident on the light sensor 1 d. At this time, the infrared transparent ink 40 may be disposed on the cover 30 at a position corresponding to the chassis approach through hole 23, so that the user is difficult to see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach through hole 23; the cover 30 may be provided with the infrared transmissive ink 40 at a position corresponding to the chassis structured light passing hole 24, so that the user is difficult to see the structured light projector 12 inside the electronic device 100 through the chassis structured light passing hole 24, and the electronic device 100 has a beautiful appearance.

Referring to fig. 18, in some embodiments, the proximity sensor 50 may be disposed on the package substrate 111. Specifically, a part of the package substrate 111 is used for carrying the structural light projector 12, the proximity infrared lamp 13, and the optical sensor 1d, or corresponds to a space surrounded by the package side walls 112; another portion of the package substrate 111 protrudes outward, and the proximity sensor 50 may be fixed on the package substrate 111 and located outside the package housing 11. The package substrate 111 may have traces running thereon, which may be control and drive traces for the structured light projector 12 and the proximity infrared lamp 13, in one example in the form of an FPC, which may be simultaneously connected to the proximity sensor 50 for simultaneously transmitting control and drive signals for the proximity sensor 50.

Referring to fig. 19, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror base 63, another part of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with a main board of the electronic device 100. When the proximity sensor 50 is provided on the substrate 66, the proximity sensor 50 is provided outside the mirror base 63, and the proximity sensor 50 may be connected to an FPC.

The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the proximity sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 50 may be fixed on a substrate 66 of the infrared camera 62. Further, base plate 66 still includes the stiffening plate, and the stiffening plate setting is in the one side that carries on the back mutually with proximity sensor 50 to increase base plate 66's bulk strength, make FPC be difficult for taking place around rolling over, be difficult for taking place to rock when proximity sensor 50 sets up on base plate 66 simultaneously. In one example, the proximity sensor 50 may also be fixed to an outer sidewall of the mirror base 63, for example, by means of bonding.

Referring to fig. 20, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. The proximity sensor 50 is disposed at the first sub-top surface 671. In this embodiment, the imaging module 60 may be a visible light camera 61, and the proximity sensor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62.

The imaging module 60 of the present embodiment has a notch 675, and the proximity sensor 50 is disposed on the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the horizontal space occupied by the two is small, thereby saving the installation space in the electronic device 100.

With continued reference to fig. 20, in some embodiments, the proximity sensor 50 of the above embodiments is disposed on the first sub-top surface 671 and is located outside the camera housing 67, and specifically, a projection of the entire proximity sensor 50 along a direction perpendicular to the first sub-top surface 671 may be located within the first sub-top surface 671 (as shown in fig. 20); alternatively, a portion of the proximity sensor 50 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is, at least a portion of the proximity sensor 50 is located directly above the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two is small, thereby further saving the installation space in the electronic device 100.

Referring to fig. 21, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light external to the electronic device 100 can pass through the light transmissive hole 676 and pass onto the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are easily mounted on the housing 20.

Referring to fig. 22, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 may be fixed on the substrate 66 and housed in a camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the proximity sensor 50 may also be connected to the FPC.

The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and the proximity sensor 50 on the substrate 66, so that the proximity sensor 50 can be stably installed in the camera housing 67.

Referring to fig. 23, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the second tread 678, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is positioned between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The proximity sensor 50 is provided on the second step face 678 and is located outside the camera housing 67. The proximity sensor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.

The imaging module 60 of the present embodiment has a notch 675, and the proximity sensor 50 is disposed on the second step surface 678, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, the two occupy a smaller lateral space, and the installation space in the electronic device 100 is saved.

Referring to fig. 24, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, relative to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 can be made wider, thereby facilitating the arrangement of the proximity sensor 50 on the second tread 678.

Referring to fig. 23 and 24, in some embodiments, the proximity sensor 50 of the above embodiments is disposed on the second tread 678 and outside the camera housing 67. Specifically, when the cutout 675 is opened at the edge position of the top surface 670, the entire proximity sensor 50 projected along the direction perpendicular to the second tread 678 may be located within the second tread 678; alternatively, a projection of a portion of the proximity sensor 50 along a direction perpendicular to the second tread 678 is located within the second tread 678 (as shown in fig. 23). That is, at least a portion of the proximity sensor 50 is located directly above the second tread 678. When the cutout 675 is opened at the middle position of the top surface 670, the entire proximity sensor 50 projected in a direction perpendicular to the second step surface 678 may be located within the second step surface 678 (as shown in fig. 24). Thus, the proximity sensor 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the proximity sensor and the imaging module is small, so that the installation space in the electronic device 100 is further saved.

Referring to fig. 25, the second step surface 678 of the above embodiment is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light external to the electronic device 100 can pass through the light transmissive hole 676 and pass onto the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are easily mounted on the housing 20.

Referring to fig. 26, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 may be fixed on the substrate 66 and housed in a camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the proximity sensor 50 may also be connected to the FPC.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

a housing;

the input/output module is of a single packaging body structure and is arranged in the shell; the input and output module comprises a packaging shell, a structured light projector, a proximity infrared lamp and a light sensor, wherein the packaging shell comprises a packaging substrate, the structured light projector, the proximity infrared lamp and the light sensor are packaged in the packaging shell and are borne on the packaging substrate, the structured light projector and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light;

the vibration module is arranged on the shell; the vibration module comprises a display screen and a cover plate, wherein the display screen is attached to the cover plate through a joint; and

the piezoelectric element is combined with the cover plate through the joint and is spaced from the input and output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate; the shell is provided with a shell vibration through hole; the piezoelectric element is accommodated in the shell vibration through hole, combined with the cover plate and spaced from the shell; the area where the cover plate is combined with the piezoelectric element is separated from the area where the cover plate is combined with the display screen;

the piezoelectric element comprises a piezoelectric body and a plurality of piezoelectric lugs extending out of the piezoelectric body, the number of the piezoelectric lugs is multiple, the number of the shell vibration through holes is multiple, the piezoelectric lugs correspond to the shell vibration through holes, and each piezoelectric lug is partially accommodated in the corresponding shell vibration through hole and combined with the cover plate;

the electronic device further comprises an infrared camera, a visible light camera and an infrared light supplementing lamp, the input and output module comprises the infrared camera, the visible light camera and the infrared light supplementing lamp are located between the cover plate and the piezoelectric body, and the piezoelectric lugs are arranged between the input and output module, the infrared camera, the visible light camera and the structured light projector in an inserting mode.

2. The electronic device of claim 1, wherein the vibration module comprises a display panel and a transparent cover plate, the display panel is disposed on the housing and forms a receiving cavity together with the housing, the cover plate is disposed on the housing and is located on a side of the display panel away from the receiving cavity, the display panel is combined with the cover plate, the housing is provided with a housing approaching through hole, a housing structure optical through hole, a housing light sensation through hole, and a housing vibration through hole, the approaching infrared lamp corresponds to the housing approaching through hole, the structure light projector corresponds to the housing structure optical through hole, and the light sensor corresponds to the housing light sensation through hole.

3. The electronic device of claim 1, wherein the input-output module further comprises a chip, and the structured light projector, the proximity infrared lamp, and the light sensor are formed on one piece of the chip.

4. The electronic device of claim 1, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and being connected between the package top and the package substrate, the package top forming a structured light window, a proximity window and a light-sensing window, the structured light window corresponding to the structured light projector, the proximity window corresponding to the proximity infrared lamp, and the light-sensing window corresponding to the light sensor.

5. The electronic device of claim 1, wherein the input-output module further comprises a proximity lamp lens disposed within the package housing and corresponding to the proximity infrared lamp; and/or

The input and output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.

6. The electronic device of claim 1, wherein the input/output module further comprises a proximity lamp lens and a light sensor lens disposed in the package housing, the proximity lamp lens corresponds to the proximity infrared lamp, the light sensor lens corresponds to the light sensor, and the proximity lamp lens and the light sensor lens are disposed on a same transparent substrate.

7. The electronic device of claim 1, wherein the input-output module further comprises a plurality of metal shielding plates respectively located within the package housing and between any two of the structured light projector, the proximity infrared lamp, and the light sensor.

8. The electronic device of claim 1, wherein the input-output module further comprises an optical enclosure made of a light transmissive material formed on the package substrate and located within the package housing, the optical enclosure enclosing the proximity infrared lamp and the light sensor.

9. The electronic device of claim 8, wherein the input-output module further comprises a plurality of light-exiting baffles, each of the plurality of light-exiting baffles being formed within the optical enclosure and between any two of the structured light projector, the proximity infrared light, and the light sensor.

10. The electronic device of claim 1, wherein the input-output module has a ground pin, a structured-light pin, a proximity-light pin, and a light-sensing pin, and the structured-light projector emits infrared light when the ground pin and the structured-light pin are enabled; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.

11. The electronic device of claim 2, wherein a surface of the cover plate coupled to the housing is formed with an infrared transparent ink that is transparent only to infrared light, the infrared transparent ink blocking at least one of the housing access through hole, the housing structure light through hole, and the housing vibration through hole.

12. The electronic device according to claim 1, further comprising a proximity sensor and an imaging module, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor accommodated in the lens base, the lens base comprises a mounting surface located between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.

13. The electronic device according to claim 1, further comprising an imaging module and a proximity sensor, wherein the imaging module is mounted on the housing, the imaging module comprises a camera housing and a lens module, a top surface of the camera housing is a step surface and comprises a first sub-top surface and a second sub-top surface connected to each other, the second sub-top surface is inclined with respect to the first sub-top surface and forms a notch with the first sub-top surface, the top surface has a light exit hole, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the proximity sensor is disposed at the first sub-top surface.

14. The electronic device according to claim 1, further comprising an imaging module and a proximity sensor, wherein the imaging module comprises a camera housing and two lens modules, a top surface of the camera housing is cut to form a stepped top surface, the top surface comprises a first step surface and a second step surface lower than the first step surface, the first step surface is provided with two light-emitting through holes, each light-emitting through hole corresponds to one lens module, and the proximity sensor is disposed at the second step surface.

15. The electronic device of claim 1, further comprising an imaging module and a proximity sensor, wherein the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and a substrate partially disposed in the lens holder, and the proximity sensor is disposed on the substrate.

16. The electronic device according to claim 1, wherein centers of the input/output module, the infrared camera, the visible light camera, and the infrared fill light are located on a same line segment, and the piezoelectric element is located between the line segment and a top of the housing.

17. The electronic device according to claim 1, wherein the number of the piezoelectric elements is plural, the number of the case vibration through holes is plural, the plural piezoelectric elements correspond to the plural case vibration through holes, each piezoelectric element is accommodated in the corresponding case vibration through hole, centers of the input/output module, the infrared camera, the visible light camera, the plural piezoelectric elements, and the infrared light supplement lamp are located on a same line segment, and at least one of the input/output module, the infrared camera, the visible light camera, and the infrared light supplement lamp is provided between two adjacent piezoelectric elements.

18. The electronic device according to claim 2, wherein centers of the input/output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the infrared light supplement lamp are located on a same line segment, and at least one of the input/output module, the infrared camera, the visible light camera, and the infrared light supplement lamp is disposed between two adjacent piezoelectric bumps.