CN108093104A

CN108093104A - Electronic device

Info

Publication number: CN108093104A
Application number: CN201711435724.9A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2018-05-29
Anticipated expiration: 2037-12-26
Also published as: CN108093104B

Abstract

Electronic device disclosed by the invention includes casing, input and output module, vibration module and piezoelectric element.Input and output module is arranged in casing, and input and output module includes encapsulating housing, structured light projector, close to infrared lamp and optical flame detector.Encapsulating housing includes package substrate, and structured light projector is encapsulated in encapsulating housing close to infrared lamp and optical flame detector and is carried on package substrate.Structured light projector can emit infrared light with different power from close to infrared lamp outside encapsulating housing, and optical flame detector is used to receive the visible ray in ambient light, and detects the intensity of visible ray.Vibrate module be mounted on casing on, piezoelectric element with vibration module is combined and with input and output module interval, piezoelectric element be used for deformed upon when being applied in electric signal so that vibrate module vibrates.The integrated level of input and output module is higher, small volume, and electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, can effectively ensure that the privacy of dialog context.

Description

Electronic device

Technical field

The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.

Background technology

As the function that mobile phone is supported is more and more rich and varied, the type and quantity for the function element that mobile phone needs are set It is more and more, in order to realize distance detection, ambient light detection with the functions such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, infrared light compensating lamp, and in order to arrange Numerous function elements can occupy the excessive space of mobile phone.

The content of the invention

Embodiment of the present invention provides a kind of electronic device.

The electronic device of embodiment of the present invention includes：

Casing；

Input and output module, the input and output module are arranged in the casing, and the input and output module includes envelope Fill housing, structured light projector, close to infrared lamp and optical flame detector, the encapsulating housing includes package substrate, and the structure light is thrown Emitter, it is described be encapsulated in the encapsulating housing and carried on the package substrate close to infrared lamp and the optical flame detector, The structured light projector can emit infrared light with different power close to infrared lamp from described outside the encapsulating housing, The optical flame detector is used to receive the visible ray in ambient light, and detects the intensity of the visible ray；

Module is vibrated, the vibration module installation is on the housing；With

Piezoelectric element, the piezoelectric element with it is described vibration module combined and with the input and output module interval, it is described Piezoelectric element is used to deform upon when being applied in electric signal so that the vibration module vibration.

In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board is set on the housing and positioned at the display screen The one side away from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing Through hole is vibrated close to through hole, casing structure light through hole, casing light sensation through hole and casing, it is described close to infrared lamp and the casing It is corresponded to close to through hole, the structured light projector is corresponding with the casing structure light through hole, the optical flame detector and the casing light Feel through hole to correspond to, the piezoelectric element is housed in the casing vibration through hole and is combined with the cover board.

In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.

In some embodiments, the input and output module further includes chip, the structured light projector, described close Infrared lamp and the optical flame detector are both formed on a piece of chip.

In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, and structure is formed at the top of the encapsulation Light window, close to window and light sensation window, the structure light window is corresponding with the structured light projector, it is described close to window with Described to be corresponded to close to infrared lamp, the light sensation window is corresponding with the optical flame detector.

In some embodiments, the input and output module is further included close to lamp lens, described to be set close to lamp lens In the encapsulating housing and with it is described corresponding close to infrared lamp；And/or the input and output module further includes light sensation lens, institute Light sensation lens are stated to be arranged in the encapsulating housing and corresponding with the optical flame detector.

In some embodiments, the input and output module further includes that be arranged on the encapsulating shell in vivo saturating close to lamp Mirror and light sensation lens, it is described close to lamp lens with described corresponding close to infrared lamp, the light sensation lens are corresponding with the optical flame detector, It is described to be located at close to lamp lens and the light sensation lens on same transparent base.

In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide Baffle is located in the encapsulating housing and is located at the structured light projector, is described close in infrared lamp and the optical flame detector respectively It is arbitrary between the two.

In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps described close to red Outer lamp and the optical flame detector.

In some embodiments, the input and output module further include it is multiple go out light clapboard, it is multiple it is described go out light clapboard It is respectively formed in the optics sealing cover and is located at the structured light projector, is described close in infrared lamp and the optical flame detector Arbitrarily between the two.

In some embodiments, grounding pin, structure light pin are formed on the input and output module, drawn close to lamp When foot and light sensation pin, the grounding pin and the structure light pin are enabled, the structured light projector emits infrared light Line；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light；The grounding lead When foot and the light sensation pin are enabled, the intensity of the optical flame detector detection visible ray.

In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared transmission ink blocks the casing and shakes close to through hole, the casing structure light through hole and the casing It is at least one in dynamic through hole.

In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules Lens barrel including microscope base, on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include position Mounting surface between the lens barrel and described image sensor, the proximity sensor are arranged on the mounting surface.

In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules On the housing, the imaging modules include camera case and camera lens module, and the top surface of the camera case is ladder for installation Face and including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination of the second sub- top surface and with The first sub- top surface forms notch, and the top surface offers light extraction through hole, and the camera lens module is housed in the camera case Interior and corresponding with the light extraction through hole, the proximity sensor is arranged at the described first sub- top surface.

In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules Including camera case and two camera lens modules, notch is offered to form step-like top surface on the top surface of the camera case, The top surface includes the first tread and the second tread less than first tread, opens up that there are two light extractions on first tread Through hole, each light extraction through hole is corresponding with the camera lens module, and the proximity sensor is arranged at second tread.

In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules Lens barrel and part including microscope base, on the microscope base are arranged on the substrate in the microscope base, and the proximity sensor is set It puts on the substrate.

In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and infrared benefit Light lamp, the input and output module, the infrared pick-up head, the center of the visible image capturing head and the infrared light compensating lamp On same line segment, the piezoelectric element is between the line segment and the top of the casing.

In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and infrared benefit Light lamp, the quantity of the piezoelectric element be it is multiple, the quantity of the casing vibration through hole be it is multiple, multiple piezoelectric elements with Multiple casing vibration through holes correspond to, and each piezoelectric element is housed in the corresponding casing vibration through hole, described Input and output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements and the infrared light filling The center of lamp is located on same line segment, and the input and output module, described red is provided between the two neighboring piezoelectric element It is at least one in outer light video camera head, the visible image capturing head and the infrared light compensating lamp.

In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and infrared benefit Light lamp, the piezoelectric element include piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the casing vibrates through hole Quantity to be multiple, multiple piezoelectricity convex blocks are corresponding with multiple casings vibration through holes, each the piezoelectricity convex portion It is housed in the corresponding casing vibration through hole and is combined with the cover board, the input and output module, the infrared light are taken the photograph Picture head, the visible image capturing head and the infrared light compensating lamp are between the cover board and the piezoelectric body, the input Export module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and the infrared light compensating lamp Center is located on same line segment, and the input and output module, the infrared light are provided between the two neighboring piezoelectricity convex block It is at least one in camera, the visible image capturing head and the infrared light compensating lamp.

In the electronic device of embodiment of the present invention, input and output module by structured light projector, close to infrared lamp and light Sensor is integrated into a single package body structure, has gathered three-dimensional imaging, transmitting infrared light with the intensity of infrared distance measurement and visible ray The function of detection, therefore, the integrated level of input and output module are higher, small volume, and it is three-dimensional that input and output module has saved realization Imaging, transmitting infrared light are with infrared distance measurement and the space of the function of the intensity detection of visible ray.Further, since project structured light Device is carried on close to infrared lamp and optical flame detector on same package substrate, structured light projector compared to traditional handicraft, close Infrared lamp and optical flame detector, which need different wafers are respectively adopted, to be manufactured recombinants and is encapsulated to PCB substrate, improves packaging efficiency.Again Have, electronic device using piezoelectric element and vibration module realize osteoacusis it is transaudient, instead of it is traditional by air transmitted sound by Device structure is talked about, the privacy of dialog context is on the one hand effectively ensured, on the other hand, due to eliminating the receiver of script, avoids Open up corresponding with receiver through hole on the cover board, it is simpler in technique, it is also more aesthetically pleasing in appearance.

The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.

Description of the drawings

The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains substantially and is readily appreciated that, wherein：

Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；

Fig. 2 is the stereoscopic schematic diagram of the input and output module of the electronic device of embodiment of the present invention；

Fig. 3 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；

Fig. 4 is the stereoscopic schematic diagram of the input and output module of the electronic device of embodiment of the present invention；

Fig. 5 is schematic cross-section of the electronic device along V-V lines in Fig. 1；

Fig. 6 is partial sectional schematic view of the electronic device in Fig. 1 along line VI -- VI；

Fig. 7 is the proximity sensor of the electronic device of certain embodiments of the present invention and the stereoscopic schematic diagram of imaging modules；

Fig. 8 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；

Fig. 9 is the structure diagram of the electronic device of embodiment of the present invention；

Figure 10 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；

Figure 11 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；

Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；

Figure 13 is partial sectional schematic view of the electronic device along XIII-XIII lines in Figure 12；

Figure 14 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；

Figure 15 to Figure 17 be embodiment of the present invention electronic device along with XV-XV lines correspondence position intercepts in Fig. 1 portion Partial cross-section schematic diagram；

Figure 18 is stereoscopic schematic diagram of the proximity sensor with input and output module of the electronic device of embodiment of the present invention；

Figure 19 to Figure 26 is the proximity sensor of the electronic device of embodiment of the present invention and the three-dimensional signal of imaging modules Figure.

Specific embodiment

Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.In addition, the sheet described below in conjunction with the accompanying drawings The embodiment of invention is exemplary, and is only used for explaining embodiments of the present invention, and it is not intended that limit of the invention System.

In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features contact directly or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.

Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component include input and output module 10, proximity sensor 50 (such as Fig. 7), vibration module 30a (such as Fig. 5), piezoelectric element 70, Imaging modules 60 (such as Fig. 7) and infrared light compensating lamp 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligence Energy wrist-watch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, Ke Yili Solution, the concrete form of electronic device 100 can be other, and this is not restricted.

Fig. 2 and Fig. 3 are referred to, input and output module 10 is single package body structure, including encapsulating housing 11, project structured light Device 12, close to infrared lamp 13 and optical flame detector 1d.

Encapsulating housing 11 for encapsulating structure light projector 12 simultaneously, close to infrared lamp 13 and optical flame detector 1d, in other words, knot Structure light projector 12 is encapsulated in close to infrared lamp 13 and optical flame detector 1d in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes encapsulation Substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, input and output module 10 had an impact to avoid extraneous electromagnetic interference.This In embodiment, structured light projector 12 is located at close to the center of infrared lamp 13 and optical flame detector 1d on same line segment, such as：Edge One end of line segment is followed successively by structured light projector 12, close to infrared lamp 13 and optical flame detector 1d to the other end；Alternatively, one along line segment The other end is held to be followed successively by close to infrared lamp 13, structured light projector 12 and optical flame detector 1d；Alternatively, along one end of line segment to another End is followed successively by close to infrared lamp 13, optical flame detector 1d and structured light projector 12.In other embodiments, structured light projector 12nd, it is triangular in shape close to the line of centres of infrared lamp 13 and optical flame detector 1d.

Package substrate 111 for bearing structure light projector 12, close to infrared lamp 13 and optical flame detector 1d.It is defeated in manufacture input When going out module 10, structured light projector 12 can be formed in close to infrared lamp 13 and optical flame detector 1d on a piece of chip 14, then will knot Structure light projector 12 is set along close to infrared lamp 13, optical flame detector 1d and chip 14 on package substrate 111, specifically, can be with Chip 14 is bonded on package substrate 111.Meanwhile package substrate 111 can be used for other zero with electronic device 100 Part (such as the casing 20 of electronic device 100, mainboard etc.) connects, and input and output module 10 is fixed in electronic device 100.

Package wall 112 can be set with coil structure light projector 12, close to infrared lamp 13 and optical flame detector 1d, package wall 112 extend from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 and encapsulation Substrate 111 is detachably connected, in order to remove after package wall 112 to structured light projector 12, close to 13 and of infrared lamp Optical flame detector 1d is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid project structured light Device 12 or the infrared light sent close to infrared lamp 13 pass through package wall 112.

Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 It is formed with structure light window 1131, close to window 1132 and light sensation window 1133, structure light window 1131 and structured light projector 12 correspond to, and the structure light (infrared light) that structured light projector 12 emits is pierced by from structure light window 1131；Close to window 1132 with It is corresponded to close to infrared lamp 13, the infrared light emitted close to infrared lamp 13 is pierced by from close to window 1132；Light sensation window 1133 and light Sensor 1d is corresponded to, it is seen that light can pass through light sensation window 1133 and incide on optical flame detector 1d.Encapsulation top 113 and package wall 112 integrally formed can obtain, can also split shape to obtain.In one example, structure light window 1131, close to window 1132 and light sensation window 1133 be through hole, the making material at encapsulation top 113 for impermeable infrared light and visible ray material. In another example, encapsulation top 113 by the material of impermeable infrared light, saturating infrared light, be opaque to visible light but and thoroughly visible ray material Co-manufactured forms, and specifically, structure light window 1131 and is made close to window 1132 of the material of saturating infrared light, light sensation window 1133 are made of the material of saturating visible ray, remaining position is made of impermeable infrared light and the material being opaque to visible light but.Further, Structure light window 1131 and lens arrangement is could be formed with close to window 1132, to improve from structure light window 1131 and close to window The infrared light emission angles that mouth 1132 projects, such as structure light window 1131 are formed with concavees lens structure, so as to pass through structure light The divergence of beam of window 1131 outwards projects；Convex lens structures are formed with close to window 1132, so as to pass through close to window 1132 Light gather outside injection；Light sensation window 1133 can also be formed with lens arrangement, incident from light sensation window 1133 to improve VISIBLE LIGHT EMISSION angle, such as light sensation window 1133 has convex lens structures so as to be gathered by the incident light of light sensation window 1133 And it projects on optical flame detector 1d.

Structured light projector 12 can be formed in close to infrared lamp 13 and optical flame detector 1d on a piece of chip 14, further Reduce structured light projector 12, integrated close to infrared lamp 13 and optical flame detector 1d after volume, and preparation process is simpler.Structure light The projector 12 outwards emitting structural light, structure light can form infrared laser speckle pattern, project structured light to object body surface Face, by the acquisition (as shown in Figure 1) of infrared pick-up first 62 by the modulated structured light patterns of target object, by being modulated Structured light patterns carry out analysis calculate obtain target object depth image (at this point, structured light projector 12 for it is three-dimensional into Picture).In embodiments of the present invention, structured light projector 12 includes light source 121, mirror holder 122, lens 123 and diffraction optical element (diffractive optical elements, DOE) 124.The light beam that light source 121 is sent is after lens 123 are collimated or converged It is expanded by diffraction optical element 124 and is outwards emitted with certain beam pattern.Specifically, light source 121 can be formed in chip On 14, lens 123 and diffraction optical element 124 can be fixed on mirror holder 122, such as mirror holder is fixed on by way of gluing On 122.Infrared light can be emitted close to infrared lamp 13, infrared light passes through close to window 1132 and reaches body surface, electronic device 100 proximity sensor 50 is (as shown in Figure 7) receive the infrared light that is reflected by the object with detection object to electronic device 100 away from From.Specifically, proximity sensor 50 can be received by the infrared light for emitting and being reflected by the object close to infrared lamp 13 for sentencing Disconnected object is to the distance of electronic device 100.

Structured light projector 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11 Line, specifically, structured light projector 12 with that can emit infrared light simultaneously close to infrared lamp 13, and input and output module 10 is simultaneously For three-dimensional imaging and infrared distance measurement；Can also structured light projector 12 emit light and do not emit light close to infrared lamp 13, Input and output module 10 is only used for three-dimensional imaging；Can also structured light projector 12 do not emit light and emit close to infrared lamp 13 Light, input and output module 10 are only used for infrared distance measurement.

Incorporated by reference to Fig. 4, in embodiments of the present invention, grounding pin 15 is formed on input and output module 10, structure light is drawn Foot 16, close to lamp pin 17 and light sensation pin 1f.Grounding pin 15, structure light pin 16, close to lamp pin 17 and light sensation pin 1f can be formed on package substrate 111, (that is, 15 He of grounding pin when grounding pin 15 and structure light pin 16 are enabled When structure light pin 16 accesses circuit turn-on), structured light projector 12 emits infrared light；Draw when grounding pin 15 and close to lamp When foot 17 is enabled (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), emit close to infrared lamp 13 infrared Light；(that is, grounding pin 15 and light sensation pin 1f access circuit turn-ons when grounding pin 15 and light sensation pin 1f are enabled When), optical flame detector 1d detection visual intensities, using the foundation of the display brightness as control display screen 90.

It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of input and output module 10, in other words, input and output Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100.

Also referring to Fig. 1, Fig. 5 and Fig. 6, casing 20 includes top 21 and bottom 22, corresponding with electronic component Position, casing 20 offer spaced casing close to through hole 23, casing structure light through hole 24, casing light sensation through hole 2f and Casing vibration through hole 2a.It is right close to through hole 23 with casing close to infrared lamp 13 when input and output module 10 is arranged in casing 20 Should, structured light projector 12 is corresponding with casing structure light through hole 24, and optical flame detector 1d is corresponding with casing light sensation through hole 2f.It is wherein close Infrared lamp 13 and casing can be passed through close to the corresponding light sent close to infrared lamp 13 that refers to of through hole 23 from casing close to through hole 23, be had Body, can be passed through close to infrared lamp 13 and casing close to 23 face of through hole or close to the light of the transmitting of infrared lamp 13 Casing is passed through after light-guide device effect close to through hole 23.Structured light projector 12 is corresponding with casing structure light through hole 24 similarly, This is not repeated.The optical flame detector 1d visible rays that refer to corresponding with casing light sensation through hole 2f can pass through simultaneously incidence from casing light sensation through hole 2f Can be optical flame detector 1d and casing light sensation through hole 2f faces or the light of visible ray incidence specifically onto optical flame detector 1d Line through casing light sensation through hole 2f and is incided into after light-guide device acts on optical flame detector 1d.In the embodiment illustrated in fig. 6, Casing close to through hole 23, casing structure light through hole 24 and casing light sensation through hole 2f can be apart from one another by certainly, in other realities It applies in example, casing can also be interconnected close to through hole 23, casing structure light through hole 24 and casing light sensation through hole 2f.

Module 30a is vibrated to be mounted on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words Display screen 90 combines to form vibration module 30a with cover board 30, to promote the rigidity of vibration module 30a.Display screen 90 is arranged on casing Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and is located at the separate host cavity 91 of display screen 90 One side, to protect display screen 90.Since the input and output module 10 of embodiment of the present invention can occupy smaller volume, because This, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve the screen accounting of electronic device 100.Tool Body, display screen 90, input and output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, are normally made in user In the state of electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, input and output module 10 can be set Between display screen 90 and top 21.In other embodiments, display screen 90 can be that screen opens up jagged, display screen comprehensively 90 surround input and output module 10, and input and output module 10 exposes from the notch of display screen 90.

Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with input and output module 10.Specifically, piezoelectricity Element 70 is housed in casing vibration through hole 2a and is combined with cover board 30, and is spaced with casing 20, Ke Yishi：Piezoelectric element 70 It point is housed in casing vibration through hole 2a or piezoelectric element 70 is housed in completely in the logical 2a holes of casing vibration.When piezoelectric element 70 Both ends when being applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation occurs for piezoelectric element 70, such as expansion or receives Contracting drives the vibration module 30a combined with piezoelectric element 70 to be vibrated according to the frequency of the electric signal as a result,.When the body of user When being contacted with vibration module 30a, osteoacusis sound is by the body of user with vibrating part that module 30a is contacted (for example, external ear Cartilage, tooth) it is sent to the auditory nerve of user.In this way, user can realize language by piezoelectric element 70 and vibration module 30a Sound such as is conversed, listens to music the functions.In embodiments of the present invention, the processor of electronic device 100 is for obtaining voice signal, and The both ends of piezoelectric element 70 apply electric signal corresponding with the voice signal.

It is appreciated that traditional telephone receiver structure uses air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transferred to week It encloses 1 meter of scope and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.

Referring to Fig. 5 and Fig. 6, piezoelectric element 70 and display screen 90 are attached to by fastener 30b on cover board 30. Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can To be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 is combined with piezoelectric element 70 Region and cover board 30 combined with display screen 90 it is interregional every being subject to piezoelectric element 70 with the display for preventing display screen 90 Interference.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set directly at compared to cover board 30 on casing 20, The vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because the Oscillation Amplitude of casing 20 Excessive and the electronic device 100 that drops possibility.

Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 6 It applies in example, it is logical close to the vibration of through hole 23, casing light sensation through hole 2f and casing that cover board 30 covers casing structure light through hole 24, casing Hole 2a penetrates ink 40 on the inner surface 32 of cover board 30 coated with infrared, it is infrared have through ink 40 to infrared light it is higher saturating Rate is crossed, such as can reach 85% or more, and has higher attenuation rate to visible ray, such as can reach more than 70% so that is used Family during normal use, is visually difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically, it is red It is outer to cover region not corresponding with display screen 90 and casing light sensation through hole 2f on inner surface 32 through ink 40.

It is logical close to the vibration of through hole 23, casing structure light through hole 24 and casing that infrared transmission ink 40 can also block casing It is at least one in the 2a of hole, i.e. infrared to cover casing simultaneously close to through hole 23, casing structure light through hole 24 through ink 40 With casing vibration through hole 2a (as shown in Figure 6), user is difficult to through casing close to through hole 23, casing structure light through hole 24 and casing Vibration through hole 2a sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to penetrate ink 40 Casing can be covered close to through hole 23, and do not cover casing structure light through hole 24 and casing vibration through hole 2a；It is infrared to penetrate ink 40 can also cover casing structure light through hole 24, and not cover casing close to through hole 23 and casing vibration through hole 2a；Infrared transmission Ink 40 can also cover casing vibration through hole 2a, and not cover casing close to through hole 23 and casing structure light through hole 24；It is infrared Casing can also be covered close to through hole 23 and casing structure light through hole 24 through ink 40, and does not cover casing vibration through hole 2a； It is infrared to cover casing structure light through hole 24 and casing vibration through hole 2a through ink 40, and casing is not covered close to through hole 23；It is infrared to cover casing close to through hole 23 and casing vibration through hole 2a through ink 40, and casing structure light is not covered Through hole 24.

Referring to Fig. 7, proximity sensor 50 is single package body structure.The infrared light sent out close to infrared lamp 13, quilt After external object reflection, received by proximity sensor 50, proximity sensor 50 is according to the infrared light being reflected by the object received To judge the distance between external object and electronic device 100.

It please refers to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment as shown in figure 7, proximity sensor 50 is arranged on mounting surface 631, and specifically, proximity sensor 50 exists Plane orthographic projection where mounting surface 631 is at least partly dropped on mounting surface 631, in this way, proximity sensor 50 and imaging mould Group 60 sets compacter, and the horizontal space that the two occupies jointly is smaller.

Referring to Fig. 1, infrared light compensating lamp 80 emits infrared light for outside, after infrared light is reflected by external object surface, The infrared pick-up of electronic device 100 first 62 receives the infrared light that is reflected by the object to obtain the image information of object.

In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated Enter to export that module 10, infrared pick-up are first 62, visible image capturing is first 61, the center of piezoelectric element 70 and infrared light compensating lamp 80 is located at On same line segment.Specifically, input and output module 10, infrared light compensating lamp 80, piezoelectricity are followed successively by from one end of line segment to the other end Element 70, infrared pick-up are first 62, visible image capturing first 61 (as shown in Figure 8), at this point, visible image capturing first 61 and infrared light are taken the photograph Double photography/videography heads (as shown in figure 23) can be formed as first 62；Or input and output mould is followed successively by from one end of line segment to the other end Group 10, infrared pick-up are first 62, piezoelectric element 70, visible image capturing are first 61, infrared light compensating lamp 80 (as shown in Figure 1)；Or from One end of line segment is followed successively by infrared pick-up first 62, input and output module 10, piezoelectric element 70, visible image capturing head to the other end 61st, infrared light compensating lamp 80；Or be followed successively by from one end of line segment to the other end infrared pick-up is first 62, visible image capturing is first 61, Piezoelectric element 70, input and output module 10, infrared light compensating lamp 80, at this point, visible image capturing first 61 and infrared pick-up first 62 can To form double photography/videography heads (as shown in figure 23).Certainly, input and output module 10, infrared pick-up be first 62, piezoelectric element 70, can See that light video camera head 61, the arrangement mode of infrared light compensating lamp 80 are not limited to above-mentioned citing, there can also be other, such as each electronics member The center of device arranges the shapes such as in the arc-shaped, center arrangement is rectangular.

Referring to Fig. 9, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62.Input and output module 10th, infrared pick-up is first 62, the center of visible image capturing first 61 and infrared light compensating lamp 80 is located on same line segment, piezoelectric element 70 Between line segment and the top 21 of casing 20.Specifically, be followed successively by from one end of line segment to the other end input and output module 10, Infrared light compensating lamp 80, infrared pick-up are first 62, visible image capturing first 61；Or input is followed successively by from one end of line segment to the other end Export that module 10, infrared pick-up are first 62, visible image capturing is first 61, infrared light compensating lamp 80 (as shown in Figure 9)；Or from line segment One end is followed successively by that infrared pick-up first 62, input and output module 10, visible image capturing be first 61, infrared light compensating lamp 80 to the other end； Or it is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, input and output module 10, red from one end of line segment to the other end Outer light compensating lamp 80.Certainly, input and output module 10, infrared pick-up be first 62, visible image capturing is first 61, the row of infrared light compensating lamp 80 Row mode is not limited to above-mentioned citing.In embodiments of the present invention, the center of piezoelectric element 70 is not located on the line segment, saves (input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, infrared light compensating lamp for each electronic component on cover board 30 80 etc.) horizontal space occupied.

Further, incorporated by reference to Fig. 7, proximity sensor 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, It can also be arranged on the mounting surface 631 of visible image capturing first 61, certainly, proximity sensor 50 can not also be arranged on mounting surface On 631, for example, proximity sensor 50 can be disposed adjacent with input and output module 10 or is disposed adjacent with piezoelectric element 70, This is not restricted.

To sum up, in the electronic device 100 of embodiment of the present invention, input and output module 10 by structured light projector 12, connect Near-infrared lamp 13 and optical flame detector 1d is integrated into a single package body structure, has gathered three-dimensional imaging, transmitting infrared light with infrared survey Away from and visible ray intensity detection function, therefore, the integrated level of input and output module 10 is higher, small volume, input and output Module 10, which has been saved, realizes three-dimensional imaging, transmitting infrared light with infrared distance measurement and the space of the function of the intensity detection of visible ray. Further, since structured light projector 12, being carried on same package substrate 111 close to infrared lamp 13 and optical flame detector 1d, compare Structured light projector 12 in traditional handicraft needs close to infrared lamp 13 from optical flame detector 1d that different wafers manufactures group again is respectively adopted It closes and is encapsulated in PCB substrate, improve packaging efficiency.Further more, electronic device 100 is using piezoelectric element 70 and vibration module 30a Realize that osteoacusis is transaudient, instead of traditional telephone receiver structure by air transmitted sound, on the one hand, can effectively ensure that in call The privacy of appearance；On the other hand, due to eliminating the receiver of script, avoid opened up on cover board 30 it is corresponding with receiver Through hole, it is simpler in technique, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering in electronic device 100.

Fig. 6 and Figure 10 are referred to, in some embodiments, imaging modules 60 include visible image capturing first 61 and infrared light Camera 62.Casing 20 offers spaced casing close to through hole 23, casing structure light through hole 24, casing light sensation through hole 2f and casing vibration through hole 2a., structured light projector 12 and casing structure corresponding close to through hole 23 with casing close to infrared lamp 13 Light through hole 24 corresponds to, and optical flame detector 1d is corresponding with casing light sensation through hole 2f.The quantity of piezoelectric element 70 is multiple, casing vibration through hole For the quantity of 2a to be multiple, it is corresponding that multiple piezoelectric elements 70 and multiple casings vibrate through hole 2a, and each piezoelectric element 70 is housed in pair In the casing vibration through hole 2a answered.Input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, multiple piezoelectricity member The center of part 70 and infrared light compensating lamp 80 is located on same line segment, and input and output mould is provided between two neighboring piezoelectric element 70 Group 10, infrared pick-up are first 62, at least one in visible image capturing first 61 and infrared light compensating lamp 80.For example, piezoelectric element 70 Quantity for two, piezoelectric element 70, input and output module 10, infrared light compensating lamp are followed successively by from one end of line segment to the other end 80th, infrared pick-up is first 62, visible image capturing is first 61, piezoelectric element 70 (as shown in Figure 10)；Or from one end of line segment to another One end be followed successively by piezoelectric element 70, input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70, Infrared light compensating lamp 80 etc..In another example the quantity of piezoelectric element 70 is three, piezoelectricity member is followed successively by from one end of line segment to the other end Part 70, input and output module 10, infrared light compensating lamp 80, piezoelectric element 70, infrared pick-up are first 62, visible image capturing is first 61, pressure Electric device 70 (as shown in figure 11)；Or be followed successively by from one end of line segment to the other end piezoelectric element 70, input and output module 10, Piezoelectric element 70, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70, infrared light compensating lamp 80 etc..Certainly, piezoelectricity The quantity and piezoelectric element 70 of element 70, input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, infrared The arrangement mode of light compensating lamp 80 is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 and 30 knot of cover board It closes, is in particular that multiple piezoelectric elements 70 are attached to by fastener 30b on cover board 30 respectively.The processor of electronic device 100 For obtaining voice signal, and apply electric signal corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 simultaneously, it is more Mechanical deformation occurs for a piezoelectric element 70, and multiple piezoelectric elements 70 are from the multiple and different band of positions combined with cover board 30 as a result, Dynamic vibration module 30a is vibrated according to the frequency of the electric signal.When the body of user is contacted with vibration module 30a, osteoacusis sound The sense of hearing god of user is sent to the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted by the body of user Through.

In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.

Fig. 6, Figure 12 and Figure 13 are referred to, in some embodiments, imaging modules 60 include first 61 He of visible image capturing Infrared pick-up first 62.Casing 20 offers spaced casing close to through hole 23, casing structure light through hole 24, casing light sensation Through hole 2f and casing vibration through hole 2a., structured light projector 12 and casing corresponding close to through hole 23 with casing close to infrared lamp 13 Structure light through hole 24 corresponds to, and optical flame detector 1d is corresponding with casing light sensation through hole 2f.Piezoelectric element 70 includes piezoelectric body 71 and presses certainly The piezoelectricity convex block 72 that electric body 71 stretches out, the quantity of piezoelectricity convex block 72 is multiple, and casing vibrates the quantity of through hole 2a to be multiple, more A piezoelectricity convex block 72 is corresponding with multiple casings vibration through hole 2a, and each 72 partial receipt of piezoelectricity convex block is logical in the vibration of corresponding casing It is combined in the 2a of hole and with cover board 30.Input and output module 10, infrared pick-up are first 62, visible image capturing first 61 and infrared light filling Lamp 80 is between cover board 30 and piezoelectric body 71.Input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, The center of multiple piezoelectricity convex blocks 72 and infrared light compensating lamp 80 is located on same line segment, is provided between two neighboring piezoelectricity convex block 72 Input and output module 10, infrared pick-up are first 62, at least one in visible image capturing first 61 and infrared light compensating lamp 80.For example, The quantity of piezoelectricity convex block 72 is two, and piezoelectricity convex block 72, input and output module 10, red is followed successively by from one end of line segment to the other end Outer light compensating lamp 80, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72；Or from one end of line segment to the other end It is followed successively by that piezoelectricity convex block 72, input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72, infrared Light compensating lamp 80 etc..In another example the quantity of piezoelectricity convex block 72 is three, piezoelectricity convex block is followed successively by from one end of line segment to the other end 72nd, input and output module 10, infrared light compensating lamp 80, piezoelectricity convex block 72, infrared pick-up be first 62, visible image capturing is first 61, piezoelectricity Convex block 72；Or piezoelectricity convex block 72, input and output module 10, piezoelectricity convex block 72, red is followed successively by from one end of line segment to the other end Outer light video camera head 62, visible image capturing are first 61, piezoelectricity convex block 72, infrared light compensating lamp 80 etc..For another example the quantity of piezoelectricity convex block 72 For five, piezoelectricity convex block 72, input and output module 10, piezoelectricity convex block 72, infrared benefit are followed successively by from one end of line segment to the other end Light lamp 80, piezoelectricity convex block 72, infrared pick-up are first 62, piezoelectricity convex block 72, visible image capturing are first 61,72 (such as Figure 13 of piezoelectricity convex block It is shown).Certainly, the quantity of piezoelectricity convex block 72 and piezoelectricity convex block 72, input and output module 10, infrared pick-up are first 62, visible Light video camera head 61, the arrangement mode of infrared light compensating lamp 80 are not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectricity are convex Block 72 is combined with cover board 30, and more specifically multiple piezoelectricity convex blocks 72 are attached to by fastener 30b on cover board 30 respectively.Electronics The processor of device 100 applies piezoelectric element 70 electric signal corresponding with the voice signal, bag for obtaining voice signal Include the piezoelectric element 70 including piezoelectric body 71 and piezoelectricity convex block 72 and mechanical deformation occur, as a result, multiple piezoelectricity convex blocks 72 from Multiple and different positions that cover board 30 combines drive vibration module 30a to be vibrated according to the frequency of the electric signal.When user body with When vibrating module 30a contacts, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft Bone, tooth) it is sent to the auditory nerve of user.

In as shown for example in fig.13, casing 20 offers spaced casing vibration through hole 2a, input and output Through hole 25, light filling through hole 26, infrared light through hole 27, visible ray through hole 28.Casing vibration through hole 2a is corresponding with piezoelectricity convex block 72, defeated It is corresponding with input and output module 10 to enter to export through hole 25, light filling through hole 26 is corresponding with infrared light compensating lamp 80, infrared light through hole 27 with Infrared pick-up first 62 corresponds to, it is seen that light through hole 28 is corresponding with visible image capturing first 61.Wherein, input and output through hole 25 is replaceable Into above-mentioned spaced casing close to through hole 23, casing structure light through hole 24 and casing light sensation through hole 2f or input and output Through hole 25 is connected with casing light sensation through hole 2f and formed close to through hole 23, casing structure light through hole 24 by said machine casing.In addition, light filling Through hole 26 is corresponding with infrared light compensating lamp 80, which to refer to the infrared light that infrared light compensating lamp 80 is sent, to be passed through from light filling through hole 26, and infrared light leads to Hole 27 is corresponding with infrared pick-up first 62 refer to infrared pick-up first 62 can be received from infrared light through hole 27 be reflected by the object it is infrared Light, it is seen that the visible image capturing first 61 that refers to corresponding with visible image capturing first 61 of light through hole 28 can be received from visible ray through hole 28 by object The visible ray of reflection.

In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, input and output module 10, infrared light Camera 62, visible image capturing first 61 and infrared light compensating lamp 80 are interted and are provided between cover board 30 and piezoelectric body 71 Piezoelectricity convex block 72,100 overall volume of electronic device is smaller, saves space.

Referring to Fig. 3, in some embodiments, input and output module 10 is further included close to lamp lens 19 and light sensation lens 1e.It is arranged on close to lamp lens 19 in encapsulating housing 11 and corresponding with close to infrared lamp 13.Light sensation lens 1e is arranged on encapsulating shell It is in body 11 and corresponding with optical flame detector 1d.The infrared light emitted close to infrared lamp 13 is connect being converged to close under the action of lamp lens 19 It is projected in nearly window 1132, reduces the light quantity in other regions for being transmitted to package wall 112 and encapsulation top 113.Similarly, by light When the visible ray that sense window 1133 enters is incided on light sensation lens 1e, light sensation lens 1e will be seen that light converges to optical flame detector 1d On, transmission of visible light is reduced to optical flame detector 1d with the light quantity of exterior domain.Specifically, close to lamp lens 19 and light sensation lens 1e To be located on same transparent base, more specifically, can be with transparent base one close to lamp lens 19 and light sensation lens 1e Shaping is made.Certainly, input and output module 10 can also be provided only with close to one in lamp lens 19 and light sensation lens 1e, It can be not provided with close to lamp lens 19 and light sensation lens 1e.

Referring to Fig. 3, in some embodiments, input and output module 10 further includes multiple metal shutter 1a, multiple Metal shutter 1a is respectively positioned in encapsulating housing 11, and multiple metal shutter 1a are located at structured light projector 12, approach respectively Infrared lamp 13 and optical flame detector 1d is arbitrarily between the two.When structured light projector 12, the center close to infrared lamp 13 and optical flame detector 1d When on same line segment, the quantity of metal shutter 1a is two；If one end of line segment is followed successively by structure light to the other end and throws Emitter 12, be located at respectively close to infrared lamp 13 and optical flame detector 1d, two metal shutter 1a structured light projector 12 with close to red Between outer lamp 13 and close between infrared lamp 13 and optical flame detector 1d；If one end of line segment is followed successively by the other end close to infrared lamp 13rd, structured light projector 12 and optical flame detector 1d, two metal shutter 1a be located at respectively structured light projector 12 with close to infrared Between lamp 13 and between structured light projector 12 and optical flame detector 1d；If one end of line segment is followed successively by the other end close to infrared lamp 13rd, optical flame detector 1d and structured light projector 12, two metal shutter 1a respectively be located at optical flame detector 1d with close to infrared lamp 13 it Between and structured light projector 12 and optical flame detector 1d between.Metal shutter 1a be located at structured light projector 12 with close to infrared lamp Between 13, metal shutter 1a on the one hand can be with shielding construction light projector 12 with being done close to the mutual electromagnetism of infrared lamp 13 It disturbs, structured light projector 12 will not interact with the luminous intensity close to infrared lamp 13 and sequential, and another aspect metal blocks Plate 1a can be used for 12 place cavity of isolation structures light projector and close to the cavity where infrared lamp 13, light will not be from one Enter another cavity in cavity.Metal shutter 1a is between structured light projector 12 and optical flame detector 1d or positioned at optical flame detector 1d and close to structured light projector 12 and infrared light close to 13 initial transmissions of infrared lamp between infrared lamp 13, can be avoided to enter It is mapped on optical flame detector 1d, moreover it is possible to which the electromagnetic interference mutual with optical flame detector 1d of shielding construction light projector 12 is shielded close to red Outer lamp 13 and electromagnetic interference mutual optical flame detector 1d.

4 are please referred to Fig.1, in some embodiments, input and output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b It is made of light transmissive material, optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b is wrapped up Firmly close to infrared lamp 13 and optical flame detector 1d.Specifically, optics sealing cover 1b can be formed by encapsulating injection molding and forming technology, optics envelope Cover 1b may be employed transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 1b, which can be fixed, to be connect Relative position between near-infrared lamp 13 and optical flame detector 1d, and cause close to infrared lamp 13 and optical flame detector 1d in encapsulating housing 11 It is not easy to rock.

In addition, please refer to Fig.1 4, input and output module 10 further include it is multiple go out light clapboard 1c, it is multiple go out light clapboard 1c formed In optics sealing cover 1b and it is located at structured light projector 12, close between infrared lamp 13 and optical flame detector 1d three.When structure light is thrown Emitter 12, close to the center of infrared lamp 13 and optical flame detector 1d be located on same line segment when, go out light clapboard 1c quantity be two；If One end of line segment is followed successively by structured light projector 12, close to infrared lamp 13 and optical flame detector 1d to the other end, and two go out light clapboard 1c It is located at structured light projector 12 respectively and close between infrared lamp 13 and close between infrared lamp 13 and optical flame detector 1d；If line segment One end be followed successively by the other end close to infrared lamp 13, structured light projector 12 and optical flame detector 1d, two go out light clapboard 1c difference Positioned at structured light projector 12 and close between infrared lamp 13 and between structured light projector 12 and optical flame detector 1d；If line segment One end is followed successively by the other end close to infrared lamp 13, optical flame detector 1d and structured light projector 12, and two go out light clapboard 1c difference position In optical flame detector 1d and close between infrared lamp 13 and between structured light projector 12 and optical flame detector 1d.Go out light clapboard 1c can be used for Spacer structure light projector 12 and close to infrared lamp 13, the light that structured light projector 12 is sent will not be from close to window 1132 It is pierced by, the light sent close to infrared lamp 13 will not be pierced by from structure light window 1131.Going out light clapboard 1c being capable of barrier structure Light projector 12 and infrared light close to 13 initial transmissions of infrared lamp are incided on optical flame detector 1d, while are stopped from light sensation window 1133 visible rays for entering simultaneously directive optical flame detector 1d influence structured light projector 12 and shining close to infrared lamp 13.

Referring to Fig. 7, in some embodiments, the proximity sensor 50 of the above embodiment can be arranged on microscope base 63 Mounting surface 631 on.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62 or the microscope base of visible image capturing first 61 63。

Referring again to Figure 15, covering plate structure light through hole 34 can also be offered in some embodiments, on cover board 30, covered Harden structure light through hole 34 is corresponding with casing structure light through hole 24, and the structure light that structured light projector 12 emits passes through casing structure light Electronic device 100 can be pierced by after through hole 24 from covering plate structure light through hole 34.At this point, with casing close to through hole 23 on cover board 30 Corresponding position can set infrared transmission ink 40, and user is difficult to see electronic device 100 close to through hole 23 by casing It is internal close to infrared lamp 13, the shape of electronic device 100 is more beautiful.

6 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through hole 33, cover board approaches Through hole 33 is corresponding close to through hole 23 with casing, can be from close to after through hole 23 through casing close to the infrared light that infrared lamp 13 emits Cover board is pierced by electronic device 100 close in through hole 33.It at this point, can be with 24 corresponding position of casing structure light through hole on cover board 30 Infrared transmission ink 40 is set, and user is difficult to see by casing structure light through hole 24 structure light of the inside of electronic device 100 The projector 12, the shape of electronic device 100 are more beautiful.

7 are please referred to Fig.1, cover board light sensation through hole 36, cover board light sensation can also be opened up in some embodiments, on cover board 30 Through hole 36 and casing light sensation through hole 2f and optical flame detector 1d are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through hole It can be incided on optical flame detector 1d after 36 and casing light sensation through hole 2f.It is at this point, corresponding close to through hole 23 with casing on cover board 30 Position can set infrared transmission ink 40, and user is difficult to close to through hole 23 see by casing the inside of electronic device 100 Close to infrared lamp 13；Infrared transmission ink 40 on cover board 30 with 24 corresponding position of casing structure light through hole can also be set, used Family is difficult to see by casing structure light through hole 24 structured light projector 12 of the inside of electronic device 100, electronic device 100 Shape is more beautiful.

8 are please referred to Fig.1, in some embodiments, proximity sensor 50 can be arranged on package substrate 111.Specifically Ground, the part of package substrate 111 for bearing structure light projector 12, close to infrared lamp 13 and optical flame detector 1d, in other words with The space that package wall 112 surrounds corresponds to；Another part of package substrate 111 is protruding, and proximity sensor 50 can be fixed On package substrate 111 and outside encapsulating housing 11.On package substrate 111 can laying-out, circuit can be structure light throw Emitter 12 and the control close to infrared lamp 13 and driver circuit, in one example, circuit are the form of FPC, and FPC can be simultaneously It is connected with proximity sensor 50, control and drive signal for simultaneous transmission proximity sensor 50.

9 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, proximity sensor 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66 Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography Sensor 65, the other end can be connected with the mainboard of electronic device 100.When proximity sensor 50 is arranged on substrate 66, close to biography Sensor 50 is arranged on outside microscope base 63, and proximity sensor 50 can also be connected with FPC.

Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically, Proximity sensor 50 can be fixed on the substrate 66 of visible image capturing first 61；Proximity sensor 50 can be fixed on infrared light and take the photograph On the substrate 66 of picture first 62.Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on opposite with proximity sensor 50 One side, to increase the integral strength of substrate 66 so that FPC is not susceptible to around folding, while proximity sensor 50 is arranged on substrate 66 It was not susceptible to rock when upper.In one example, proximity sensor 50 may be also secured on the lateral wall of microscope base 63, such as logical Cohesive mode is crossed to be fixed on the lateral wall of microscope base 63.

Figure 20 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould Group 68 is simultaneously transferred on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 50 is set At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61, and proximity sensor 50 is Single package body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62.

The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 50 is arranged on the first son and is pushed up On face 671, proximity sensor 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section Installation space about in electronic device 100.

Please continue to refer to Figure 20, in some embodiments, the proximity sensor 50 of the above embodiment is arranged on first On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 50 is along perpendicular to the first sub- top surface 671 projection can be located in the first sub- top surface 671 (as shown in figure 20)；Alternatively, part proximity sensor 50 along perpendicular to The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 50 is at least part of The surface of first sub- top surface 671, in this way, proximity sensor 50 sets compacter with imaging modules 60, the two occupies jointly Horizontal space it is smaller, further save the installation space in electronic device 100.

Figure 21 is referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 50 It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transfer Onto proximity sensor 50.The proximity sensor 50 of present embodiment is arranged in camera case 67, make proximity sensor 50 with The structure of camera case 67 is more stablized and convenient for proximity sensor 50 and imaging modules 60 is installed on casing 20.

Figure 22 is referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image Sensor 65 is arranged on substrate 66, and proximity sensor 50 may be also secured on substrate 66 and be housed in camera case 67. Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another End can be connected with the mainboard of electronic device 100.In other embodiments, proximity sensor 50 can also be connected with FPC.

The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and camera case 67 Structure more stablize and convenient for proximity sensor 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 Substrate 66 is set and proximity sensor 50 is arranged on substrate 66, proximity sensor 50 is enable to be firmly mounted to camera shell In body 67.

Figure 23 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be transferred on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time Corresponding camera lens module.Proximity sensor 50 is arranged on the second tread 678 and outside camera case 67.Proximity sensor 50 For single package body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62, at this time two camera lens moulds Group 68 is first 62 corresponding camera lens module of infrared pick-up.In yet another embodiment, imaging modules 60 are taken the photograph including visible ray As first 61 and infrared pick-up first 62, one of camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up at this time, Another camera lens module 68 is first 61 corresponding camera lens module of visible image capturing.

The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 50 is arranged on the second tread On 678, proximity sensor 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves Installation space in electronic device 100.

Figure 24 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Compared with the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 50 is arranged on the second tread On 678.

Figure 23 and Figure 24 is referred to, in some embodiments, the proximity sensor 50 of the above embodiment is arranged on On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670, Entire proximity sensor 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part connects Nearly sensor 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 23).That is, it connects The nearly at least part of surface for being located at the second tread 678 of sensor 50.When notch 675 is opened in the interposition of top surface 670 When putting, entire proximity sensor 50 can be located in the second tread 678 (as schemed along perpendicular to the projection of the second tread 678 Shown in 24).In this way, proximity sensor 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, Further save the installation space in electronic device 100.

Figure 25 is referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 50 is located at It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transferred to On proximity sensor 50.The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and phase The structure of casing body 67 is more stablized and convenient for proximity sensor 50 and imaging modules 60 is installed on casing 20.

Figure 26 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Proximity sensor 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing Device 65 is arranged on substrate 66, and proximity sensor 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard with electronic device 100.In other embodiments, proximity sensor 50 can also be connected with FPC.

In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.

Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims

1. a kind of electronic device, which is characterized in that including：

Casing；

Input and output module, the input and output module are arranged in the casing, and the input and output module includes encapsulating shell Body, structured light projector, close to infrared lamp and optical flame detector, the encapsulating housing includes package substrate, the project structured light Device described be encapsulated in the encapsulating housing close to infrared lamp and the optical flame detector and carry on the package substrate, institute Infrared light can be emitted with different power close to infrared lamp from described outside the encapsulating housing by stating structured light projector, institute Optical flame detector is stated for receiving the visible ray in ambient light, and detects the intensity of the visible ray；

Module is vibrated, the vibration module installation is on the housing；With

Piezoelectric element, the piezoelectric element with it is described vibration module combined and with the input and output module interval, the piezoelectricity Element is used to deform upon when being applied in electric signal so that the vibration module vibration.

2. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Plate, the display screen set on the housing and host cavity are collectively formed with the casing, and the cover board is arranged on the machine On shell and positioned at the one side away from the host cavity of the display screen, the display screen is combined with the cover board, the casing It offers spaced casing and vibrates through hole close to through hole, casing structure light through hole, casing light sensation through hole and casing, it is described Corresponding close to through hole with the casing close to infrared lamp, the structured light projector is corresponding with the casing structure light through hole, institute It is corresponding with the casing light sensation through hole to state optical flame detector, the piezoelectric element be housed in casing vibration through hole and with the lid Hardened conjunction.

3. electronic device according to claim 2, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.

4. electronic device according to claim 1, which is characterized in that the input and output module further includes chip, described Structured light projector described is both formed in close to infrared lamp and the optical flame detector on a piece of chip.

5. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with structure light window, close to window and light sensation window, the structure light window and the project structured light Device correspond to, it is described close to window with described corresponding close to infrared lamp, the light sensation window is corresponding with the optical flame detector.

6. electronic device according to claim 1, which is characterized in that the input and output module further includes saturating close to lamp Mirror, it is described be arranged on close to lamp lens in the encapsulating housing and with it is described corresponding close to infrared lamp；And/or

The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with the light Sensor corresponds to.

7. electronic device according to claim 1, which is characterized in that the input and output module further include be arranged on it is described Encapsulating shell is in vivo close to lamp lens and light sensation lens, it is described close to lamp lens with described corresponding close to infrared lamp, the light sensation Lens are corresponding with the optical flame detector, described to be located at close to lamp lens and the light sensation lens on same transparent base.

8. electronic device according to claim 1, which is characterized in that the input and output module further includes multiple metals and hides Baffle, multiple metal shutters are located in the encapsulating housing and are located at the structured light projector, is described close respectively In infrared lamp and the optical flame detector it is arbitrary between the two.

9. electronic device according to claim 1, which is characterized in that the input and output module is further included by light transmissive material Manufactured optics sealing cover, the optics sealing cover are formed on the package substrate and in the encapsulating housing, the optics Sealing cover wraps described close to infrared lamp and the optical flame detector.

10. electronic device according to claim 9, which is characterized in that the input and output module further includes multiple light extractions Partition plate, it is multiple it is described go out light clapboard be respectively formed in the optics sealing cover and positioned at the structured light projector, described close In infrared lamp and the optical flame detector it is arbitrary between the two.

11. electronic device according to claim 1, which is characterized in that be formed with grounding lead on the input and output module Foot, structure light pin, close to lamp pin and light sensation pin, the grounding pin and the structure light pin be enabled when, it is described Structured light projector emits infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp Emit infrared light；When the grounding pin and the light sensation pin are enabled, the intensity of the optical flame detector detection visible ray.

12. electronic device according to claim 2, which is characterized in that the surface shape that the cover board is combined with the casing The infrared through ink of infrared light is only transmitted into having, the infrared ink that penetrates blocks the casing close to through hole, the casing It is at least one in structure light through hole and casing vibration through hole.

13. electronic device according to claim 1, which is characterized in that the electronic device further include proximity sensor and Imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and the image being housed in the microscope base Sensor, the microscope base include the mounting surface between the lens barrel and described image sensor, and the proximity sensor is set It puts in the mounting surface.

14. electronic device according to claim 1, which is characterized in that the electronic device further includes imaging modules and connects Nearly sensor, on the housing, the imaging modules include camera case and camera lens module, described for the imaging modules installation The top surface of camera case is for cascaded surface and including connected the first sub- top surface and the second sub- top surface, and the second sub- top surface is with respect to institute It states the first sub- top surface inclination and forms notch with the described first sub- top surface, the top surface offers light extraction through hole, the camera lens mould Group is housed in the camera case and corresponding with the light extraction through hole, and the proximity sensor is arranged on the described first sub- top surface Place.

15. electronic device according to claim 1, which is characterized in that the electronic device further includes imaging modules and connects Nearly sensor, the imaging modules include camera case and two camera lens modules, offer and cut on the top surface of the camera case Mouthful to form step-like top surface, the top surface includes the first tread and the second tread less than first tread, and described the It is opened up on one tread there are two light extraction through hole, each light extraction through hole is corresponding with the camera lens module, the proximity sensor It is arranged at second tread.

16. electronic device according to claim 1, which is characterized in that the electronic device further includes imaging modules and connects Nearly sensor, the imaging modules include microscope base, the lens barrel on the microscope base and part and are arranged in the microscope base Substrate, the proximity sensor are set on the substrate.

17. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and infrared light compensating lamp, the input and output module, the infrared pick-up head, the visible image capturing head It is located at the center of the infrared light compensating lamp on same line segment, the piezoelectric element is located at the top of the line segment and the casing Between.

18. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and infrared light compensating lamp, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is more A, multiple piezoelectric elements are corresponding with multiple casing vibration through holes, and each piezoelectric element is housed in corresponding institute It states in casing vibration through hole, it is the input and output module, the infrared pick-up head, the visible image capturing head, multiple described The center of piezoelectric element and the infrared light compensating lamp is located on same line segment, is set between the two neighboring piezoelectric element State at least one in input and output module, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp It is a.

19. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and infrared light compensating lamp, the piezoelectric element include piezoelectric body and the piezoelectricity stretched out from the piezoelectric body Convex block, the quantity of the casing vibration through hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through holes, Each piezoelectricity convex portion is housed in the corresponding casing vibration through hole and is combined with the cover board, and the input is defeated Go out module, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp and be located at the cover board and the pressure Between electric body, the input and output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity are convex The center of block and the infrared light compensating lamp is located on same line segment, and the input is provided between the two neighboring piezoelectricity convex block It exports at least one in module, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp.