CN110572539A

CN110572539A - Electronic device

Info

Publication number: CN110572539A
Application number: CN201910623150.0A
Authority: CN
Inventors: 姚坤
Original assignee: Realme Chongqing Mobile Communications Co Ltd
Current assignee: Realme Chongqing Mobile Communications Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2019-12-13
Also published as: WO2020259614A1

Abstract

The embodiment of the application provides electronic equipment, which comprises a circuit board, a first photosensitive sensor, a first bracket and a first lens; the circuit board is provided with a control circuit for controlling the electronic equipment; the first photosensitive sensor is welded on the circuit board; the first bracket is arranged on the circuit board and provided with a first mounting hole, and the first mounting hole is opposite to the first photosensitive sensor; the first lens is arranged in the first mounting hole of the first support, and the first lens is opposite to the first photosensitive sensor. A base plate is omitted, the thickness of the base plate is reduced by the camera module for shooting, the overall thickness of the camera module is reduced, the space in the electronic equipment is saved, and the electronic equipment can be made thinner.

Description

Electronic device

Technical Field

The present application relates to the field of electronic technologies, and in particular, to an electronic device.

Background

With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. In the daily use process of the electronic equipment, the camera shooting function of the electronic equipment is more and more important, and the requirement on the camera shooting effect is higher and higher.

In the related art, a camera module includes a substrate, and a photosensitive sensor, a lens, and the like provided on the substrate. The camera module is installed on the circuit board of the electronic equipment through the substrate, and the camera module is electrically connected with the circuit board through the board-to-board connector. The camera module has a high overall height, which affects the thickness of the electronic device and cannot make the thickness of the electronic device thin.

Disclosure of Invention

The embodiment of the application provides an electronic equipment, can reduce the thickness of camera module, can let the thinness that electronic equipment did.

An embodiment of the present application provides an electronic device, which includes:

The circuit board is provided with a control circuit for controlling the electronic equipment;

The first photosensitive sensor is welded on the circuit board;

The first support is arranged on the circuit board and provided with a first mounting hole, and the first mounting hole is opposite to the first photosensitive sensor;

The first lens is arranged in the first mounting hole of the first support, and the first lens is opposite to the first photosensitive sensor.

In the embodiment of the application, first light sensor direct welding is on control electronic equipment's circuit board, first support also directly sets up on the circuit board, first light sensor and first support no longer set up on the base plate, set up the base plate on the circuit board again, a base plate has been saved, the camera module that is used for making a video recording simultaneously has also reduced the thickness of a base plate, reduce the whole thickness of camera module, the space in the electronic equipment has been practiced thrift, can let the thinness that electronic equipment did.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present application.

fig. 2 is a schematic view of a first structure of a first camera module in an electronic device according to an embodiment of the present disclosure.

Fig. 3 is a schematic structural diagram of a circuit board in an electronic device according to an embodiment of the present application.

Fig. 4 is an enlarged schematic view of a portion X of the circuit board shown in fig. 3.

Fig. 5 is a schematic view of a second structure of a first camera module in an electronic device according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a third structure of a first camera module in an electronic device according to an embodiment of the present application.

Fig. 7 is an exploded view of the first camera map module shown in fig. 6.

fig. 8 is a schematic structural diagram of a circuit board in an electronic device according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device according to an embodiment of the present application.

Fig. 10 is another schematic structural diagram of the first camera module and the second camera module of the circuit board in the electronic device according to the embodiment of the present application.

Fig. 11 is a second structural schematic diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.

The embodiment of the application provides electronic equipment. The electronic device may be a smart phone, a tablet computer, or other devices, and may also be a game device, an AR (Augmented Reality) device, a data storage device, an audio playing device, a video playing device, a wearable device, or other devices, where the wearable device may be a smart band, smart glasses, or other devices.

Referring to fig. 1 and fig. 2, fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present disclosure, and fig. 2 is a first structural schematic diagram of a first camera module in the electronic device according to the embodiment of the present disclosure. The electronic device 100 in the embodiment of the present application includes a circuit board 120, a first photosensor 140, a first support 160, and a first lens 180.

the circuit board 120 is provided with a control circuit (not shown) for controlling the electronic device 100, and the circuit board 120 may be a main circuit board of the electronic device 100 or an auxiliary circuit board. The main circuit board may be provided with a control circuit for controlling the electronic device 100 to implement multiple functions, the control circuit on the main circuit board may include a main chip, a memory, a clock circuit, an image processing circuit, etc., and the auxiliary circuit board may be provided with a control circuit for controlling the electronic device 100 to implement some functions, for example, the control circuit on the auxiliary circuit board may include one or more of a power control circuit, a power amplifier circuit, a radio frequency circuit, etc. It should be noted that in some embodiments, the electronic device 100 may have no auxiliary circuit board, only the main circuit board, and the control circuits on the auxiliary circuit board are all disposed on the main circuit board.

The first photosensor 140 is soldered to the circuit board 120. The first photosensor 140 includes a plurality of pins, and the first photosensor 140 can be directly soldered to the circuit board 120 through the plurality of pins.

The first bracket 160 is disposed on the circuit board 120, the first bracket 160 has a first mounting hole 162, and the first mounting hole 162 faces the first photosensor 140.

The first lens 180 is mounted in the first mounting hole 162 of the first bracket 160, and the first lens 180 faces the first photosensor 140. The first lens 180 and the first photosensor 140 may cooperate to obtain an external optical signal, and cooperate with other components to realize imaging, and the first lens 180 and the first photosensor 140 are main components of the first camera module 110.

Because first light-sensitive sensor 140 welds directly on the circuit board 120 of control electronic equipment 100, first support 160 also directly sets up on circuit board 120, first light-sensitive sensor 140 and first support 160 no longer set up on solitary base plate 212, set up base plate 212 on circuit board 120 again, a base plate 212 has been saved, the thickness of a base plate 212 has also been reduced to first camera module 110 that is used for making a video recording simultaneously, reduce the whole thickness of camera module, the space in electronic equipment 100 has been practiced thrift, can let electronic equipment 100 do thinner. In addition, because the substrate 212 is removed and is directly wired on the circuit board 120, the circuit on the substrate 212 cannot be interfered (because the circuit is removed), the anti-interference capability of the camera module is improved, and the condition of interfering the radio frequency of the antenna during working is correspondingly reduced.

referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of a circuit board in an electronic device according to an embodiment of the present application, and fig. 4 is an enlarged schematic diagram of an X portion of the circuit board shown in fig. 3. The circuit board 120 is provided with printed traces (not shown), and the first photosensor 140 is electrically connected to the control circuit through the printed traces. The first photosensor 140 no longer needs to be connected to the control circuit through a board-to-board connector, and the first photosensor 140 is electrically connected to the control circuit through printed traces on the circuit board 120, eliminating a board-to-board (BTB) connector. The first photosensor 140 includes a plurality of printed pins 142, and the first photosensor 140 is soldered to the circuit board 120 through the plurality of printed pins 142 and electrically connected to the control circuit on the circuit board 120. The circuit board 120 may be a multi-layer board, and the printed trace electrically connecting the first photosensor 140 and the control circuit may be disposed on a surface layer of the circuit board 120 or disposed on an intermediate layer of the circuit board 120.

The number of the first photosensors 140 may be at least two, the number of the first lenses 180 may be at least two, and at least two of the first photosensors 140 and at least two of the first lenses 180 correspond to each other one by one. The electronic device 100 may include at least two first photosensors 140 and at least two first lenses 180, where at least two first photosensors 140 and at least two first lenses 180 correspond to each other one-to-one, and it may also be understood that the electronic device 100 has a plurality of camera modules, and the first photosensor 140 of each camera module is directly soldered on the circuit board 120.

The first supporter 160 may be plural, one first supporter 160 is provided corresponding to one first photosensor 140, and the plural first supporters 160 have plural first mounting holes 162. The number of the first mounting holes 162 of the first bracket 160 may be at least two, and at least two of the first mounting holes 162 correspond to at least two of the first lenses 180 in a one-to-one manner. It can also be understood that one first bracket 160 has a plurality of first mounting holes 162, and each first lens 180 is correspondingly mounted in one first mounting hole 162, so that one first bracket 160 is shared by a plurality of lenses, and only one bracket wall is arranged between the two lenses, thereby reducing the total length of the bracket.

At least two first camera lens 180 includes main camera lens, wide angle camera lens, blurring camera lens and camera lens closely, camera lens wide angle camera lens blurring camera lens with camera lens closely corresponds respectively and sets up in one in first mounting hole 162. First support 160 includes 4 first mounting holes 162, or 4 first supports 160, every first support 160 includes a first mounting hole 162, 4 different camera lenses correspond the setting in a first mounting hole 162, 4 different camera lenses correspond different first light sensor 140 respectively, each camera lens and its corresponding first light sensor 140, and other parts of complex form a camera module, also can understand that electronic equipment 100 includes 4 camera modules, be main camera module respectively, wide-angle camera module, make up camera module and camera module closely, 4 different camera module realize different functions respectively, 4 different first light sensor 140 that 4 camera modules correspond all directly welds on circuit board 120.

Referring to fig. 5, fig. 5 is a schematic view of a second structure of a first camera module in an electronic device according to an embodiment of the present disclosure. The electronic device 100 further includes a coil motor 130, the coil motor 130 is disposed in the first mounting hole 162 of the first bracket 160, the coil motor 130 has a second mounting hole 132, the first lens 180 is disposed in the second mounting hole 132, and the coil motor 130 is configured to drive the first lens 180 to move toward or away from the first photosensor 140. The coil motor 130 is mounted in the first mounting hole 162 of the first bracket 160, and the coil motor 130 has a plurality of motor pins which may be directly soldered to corresponding pads or wires on the circuit board 120.

It should be noted that the camera module in the embodiment of the present application may not be provided with the coil motor 130. The coil motor 130 may be provided in the entire camera modules in the embodiment of the present application, or the coil motor 130 may be provided in part, as needed.

Referring to fig. 6 and 7, fig. 6 is a third schematic structural diagram of a first camera module in an electronic device according to an embodiment of the present disclosure, and fig. 7 is an exploded schematic diagram of the first camera module shown in fig. 6. The first camera module 110 further includes a base 112, the base 112 is mounted on the circuit board 120, the first photo sensor 140 is disposed in a middle frame region in the middle of the base 112, a component 116 matched with the first photo sensor 140 is further disposed on the periphery of the first photo sensor 140, and a filter 114 is disposed above the first photo sensor 140 and can be blue glass, an infrared filter, and the like. The first bracket 160 is mounted on the base 112, and the first lens 180 is mounted on the first bracket 160. It should be noted that, in some other embodiments, the first camera module 110 may not be provided with the base 112, and the first bracket 160 integrates the functions of the base 112.

Referring to fig. 8, fig. 8 is a schematic view of another structure of a circuit board in an electronic device according to an embodiment of the present disclosure. The electronic device 100 further includes an analog-to-digital converter 152 and an image processor 154, where the analog-to-digital converter 152 and the image processor 154 are both soldered on the circuit board 120, the analog-to-digital converter 152 is electrically connected to the first photosensitive sensor 140 and is configured to convert a signal of the first photosensitive sensor 140 into a digital signal, and the image processor 154 is electrically connected to the analog-to-digital converter 152 and is configured to process the digital signal of the analog-to-digital converter 152 to obtain an image signal. The image processor 154 is electrically connected to the control circuit 170, and the control circuit 170 generates an image after obtaining the image signal and displays the image on the display screen.

The analog-to-digital converter 152 and the image processor 154 are directly disposed on the circuit board 120, the analog-to-digital converter 152 and the image processor 154 can be directly soldered on the circuit board 120 by using a Surface Mount Technology (SMT) or the like, the circuit board 120 can be directly printed with a circuit for disposing functional devices such as the analog-to-digital converter 152 and the image processor 154, and the camera circuit of the camera module and the control circuit on the circuit board 120 can be completed by the same process.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device according to an embodiment of the present disclosure. The electronic device 100 may further include a second camera module 210, where the second camera module 210 includes a substrate 212, a second photosensor 214, a second bracket 216, and a second lens 218, the second photosensor 214 and the second bracket 216 are disposed on the substrate 212, the substrate 212 is disposed on the circuit board 120, and the substrate 212 is connected to the control circuit through a connector 213.

The second camera module 210 has a substrate 212, the second photosensor 214, the second bracket 216 and the second lens 218 of the second camera module 210 are disposed on the substrate 212, the substrate 212 of the second camera module 210 is disposed on the circuit board 120, and the second camera module 210 is connected to the control circuit through the connector 123(BTB connector). The first camera module 110 does not have the substrate 212, and the first photosensor 140 and the first bracket 160 of the first camera module 110 are both directly disposed on the circuit board 120.

The second camera module 210 can be used as a front camera of the electronic device 100, and the first camera module 110 can be used as a rear camera of the electronic device 100. The first camera module 110 and the second camera module 210 may both be a front camera or a rear camera of the electronic device 100.

The electronic device 100 further includes a rear cover 190, the rear cover 190 has a light-transmitting portion 192, the first camera module 110 and the second camera module 210 are disposed adjacent to each other, the first lens 180 and the second lens 218 are both disposed opposite to the light-transmitting portion 192, and obtain an external optical signal through the light-transmitting portion 192, the first lens 180 has a first distance from the light-transmitting portion 192, the second lens 218 has a second distance from the light-transmitting portion 192, and the first distance is smaller than or equal to the second distance. The second camera module 210 may be smaller in size than the first camera module 110. The first camera module 110 does not have the substrate 212, but the first lens 180 of the first camera module 110 is closer to the light-transmitting portion 192 of the back cover 190 than the second lens 218 of the second camera module 210, or is spaced apart from the light-transmitting portion 192 of the back cover 190.

It should be noted that, if the second camera module 210 does not have the coil motor 130, the first pitch may be understood as a distance between the first lens 180 and the transparent portion 192 after the coil motor 130 drives the first lens 180 to move to be closest to the transparent portion 192. If the first camera module 110 and the second camera module 210 both have the coil motor 130, the first pitch may be understood as a distance between the first lens 180 and the light-transmitting portion 192 after the coil motor 130 drives the first lens 180 to move to be closest to the light-transmitting portion 192, and the second pitch may be understood as a distance between the second lens 218 and the light-transmitting portion 192 after the coil motor 130 drives the second lens 218 to move to be closest to the light-transmitting portion 192.

The light-transmitting portion 192 of the rear cover 190 may be a protective lens, and the protective lens may be colorless transparent glass, plastic, or the like.

Wherein the pixels of the first photo-sensor 140 are larger than the pixels of the second photo-sensor 214. The pixels of the first photo-sensor 140 of the first camera module 110 may be larger than the pixels of the second photo-sensor 214 of the second camera module 210. Generally speaking, the higher the pixels of the camera module, the larger the size of the camera module, and the larger the occupied space, the first photosensor 140 of the first camera module 110 with the higher pixels is directly soldered on the circuit board 120, so that the height of the first camera module 110 can be reduced.

Referring to fig. 10, fig. 10 is another schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device according to an embodiment of the present disclosure. Wherein, first camera module 110 can be main camera module and/or wide-angle camera module, and second camera module 210 can be for blurring camera module and/or closely camera module. In some other embodiments, the first camera module 110 and the second camera module 210 may be other camera modules.

It should be noted that the foremost funnel-shaped graph of the lens 120 in fig. 2, 6-7, and 8 is used to illustrate the visible range and is not a solid component.

The electronic equipment in the embodiment of the application can further comprise a flash lamp, and the flash lamp can be arranged adjacent to the first camera module. When the camera module includes a plurality of camera modules, the flash light can set up between two camera modules, also can set up in all camera module one side.

Referring to fig. 11 in combination with fig. 1, fig. 11 is a schematic view of a second structure of an electronic device according to an embodiment of the present disclosure. The electronic device 100 may further include a display screen 310, a middle frame 332, a main board 334, and a battery 336.

The display screen 310 may be mounted on the middle frame 332 and connected to the rear cover 170 through the middle frame 332, and the display screen 310 may form a display surface of the electronic device 100 for displaying information such as images and texts. The Display screen 310 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display screen.

It will be appreciated that a cover plate may also be provided over the display screen 310. The cover plate covers the display screen 310 to protect the display screen 310 from being scratched or damaged by water. Wherein the cover may be a clear glass cover so that a user may view the information displayed by the display screen 310 through the cover. For example, the cover plate may be a glass cover plate of sapphire material.

The middle frame 332 may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The middle frame 332 is used for providing a supporting function for the electronic components or functional assemblies in the electronic device 100, so as to mount the electronic components or functional assemblies in the electronic device 100 together.

The middle frame 332 and the rear cover 170 may together form a housing of the electronic device 100, for accommodating or mounting electronic elements, functional components, and the like of the electronic device 100. In addition, functional components such as a camera, a receiver, a circuit board, a battery, and the like of the electronic apparatus 100 may be mounted on the center frame 332 or the main board 334 to be fixed. It is understood that the material of the middle frame 332 may include metal or plastic.

The main board 334 may be mounted on the middle frame 332. The motherboard 334 may be a circuit board of the electronic device 100 in the above-described embodiment. One or more of the functional components such as a microphone, a speaker, a receiver, an earphone interface, a camera, an acceleration sensor, a gyroscope, and the processor 150 may be integrated on the main board 334. Meanwhile, the display screen 310 may be electrically connected to the motherboard 334 to control the display of the display screen 310 by the processor 150 on the motherboard 334.

The battery 336 may be mounted on the center frame 332. Meanwhile, the battery 336 is electrically connected to the motherboard 334 to enable the battery 336 to power the electronic device 100. The motherboard 334 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 336 to the various electronic components in the electronic device 100.

The rear cover 170 may be integrally formed. In the forming process of the rear cover 170, a rear lens hole and other structures can be formed on the rear cover 170, and the lens hole is opposite to the camera module. The rear cover 170 may be fixedly coupled to the center frame 332 by a double-sided adhesive.

the electronic device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. an electronic device, comprising:

The first photosensitive sensor is welded on the circuit board;

2. The electronic device according to claim 1, wherein printed traces are disposed on the circuit board, and the first photosensor is electrically connected to the control circuit through the printed traces.

3. the electronic device of claim 1, wherein the number of the first photo sensors is at least two, the number of the first lenses is at least two, and at least two of the first photo sensors and at least two of the first lenses are in one-to-one correspondence.

4. The electronic device according to claim 3, wherein the number of the first mounting holes of the first bracket is at least two, and at least two of the first mounting holes correspond to at least two of the first lenses one to one.

5. The electronic device of claim 4, wherein the at least two first lenses comprise a main camera lens, a wide-angle camera lens, a blurring camera lens and a close-range camera lens, and the camera lens, the wide-angle camera lens, the blurring camera lens and the close-range camera lens are respectively and correspondingly arranged in one of the first mounting holes.

6. the electronic device of claim 1, further comprising a coil motor disposed within the first mounting hole of the first bracket, the coil motor having a second mounting hole, the first lens disposed within the second mounting hole, the coil motor configured to drive the first lens toward or away from the first photosensor.

7. The electronic device according to claim 1, further comprising an analog-to-digital converter and an image processor, both of which are soldered on the circuit board, wherein the analog-to-digital converter is electrically connected to the first photosensitive sensor and is configured to convert a signal of the first photosensitive sensor into a digital signal, and the image processor is electrically connected to the analog-to-digital converter and is configured to process the digital signal of the analog-to-digital converter to obtain an image signal.

8. The electronic device according to any one of claims 1-7, further comprising a second camera module, wherein the second camera module comprises a substrate, a second photosensor, a second bracket, and a second lens, the second photosensor and the second bracket are disposed on the substrate, the substrate is disposed on the circuit board, and the substrate is connected to the control circuit through a connector.

9. The electronic device of claim 8, further comprising a rear cover, wherein the rear cover has a light-transmitting portion, the first lens and the second lens are disposed opposite to the light-transmitting portion and capture external light signals through the light-transmitting portion, the first lens has a first distance from the light-transmitting portion, the second lens has a second distance from the light-transmitting portion, and the first distance is smaller than or equal to the second distance.

10. The electronic device of claim 8, wherein the pixels of the first photo-sensitive sensor are larger than the pixels of the second photo-sensitive sensor.