WO2020259614A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2020259614A1
WO2020259614A1 PCT/CN2020/098199 CN2020098199W WO2020259614A1 WO 2020259614 A1 WO2020259614 A1 WO 2020259614A1 CN 2020098199 W CN2020098199 W CN 2020098199W WO 2020259614 A1 WO2020259614 A1 WO 2020259614A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
lens
circuit board
photosensitive sensor
bracket
Prior art date
Application number
PCT/CN2020/098199
Other languages
French (fr)
Chinese (zh)
Inventor
姚坤
Original Assignee
RealMe重庆移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RealMe重庆移动通信有限公司 filed Critical RealMe重庆移动通信有限公司
Publication of WO2020259614A1 publication Critical patent/WO2020259614A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the field of electronic technology, in particular to an electronic device.
  • the embodiment of the present application provides an electronic device, which can reduce the thickness of the camera module, and can make the electronic device thinner.
  • An embodiment of the application provides an electronic device, which includes:
  • a circuit board the circuit board is provided with a control circuit for controlling the electronic device
  • the first photosensitive sensor is soldered on the circuit board
  • the first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
  • the first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
  • FIG. 1 is a schematic diagram of the first structure of an electronic device provided by an embodiment of this application.
  • FIG. 2 is a schematic diagram of a first structure of a first camera module in an electronic device provided by an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of a circuit board in an electronic device provided by an embodiment of the application.
  • Fig. 4 is an enlarged schematic diagram of part X in the circuit board shown in Fig. 3.
  • FIG. 5 is a schematic diagram of a second structure of a first camera module in an electronic device provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a third structure of the first camera module in the electronic device provided by an embodiment of the application.
  • FIG. 7 is an exploded schematic diagram of the first camera module shown in FIG. 6.
  • FIG. 8 is a schematic diagram of another structure of a circuit board in an electronic device provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device provided by an embodiment of the application.
  • FIG. 10 is another schematic structural diagram of the first camera module and the second camera module of the circuit board in the electronic device provided by the embodiment of the application.
  • FIG. 11 is a schematic diagram of a second structure of an electronic device provided by an embodiment of this application.
  • An embodiment of the application provides an electronic device, which includes:
  • a circuit board the circuit board is provided with a control circuit for controlling the electronic device
  • the first photosensitive sensor is soldered on the circuit board
  • the first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
  • the first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
  • the circuit board is provided with printed wiring, and the first photosensitive sensor is electrically connected to the control circuit through the printed wiring.
  • the number of the first photosensitive sensor is at least two
  • the number of the first lens is at least two
  • the at least two first photosensitive sensors and the at least two first lenses are in one-to-one correspondence.
  • the number of the first mounting holes of the first bracket is at least two, and at least two of the first mounting holes are in one-to-one correspondence with at least two of the first lenses.
  • At least two of the first lenses include a main camera lens, a wide-angle camera lens, a blur camera lens, and a close-range camera lens, the camera lens, the wide-angle camera lens, the blur camera lens, and the close-up camera lens.
  • the distance camera lenses are respectively correspondingly arranged in one of the first mounting holes.
  • At least one of the first mounting holes is provided with a coil motor, the coil motor has a second mounting hole, the second mounting hole can accommodate one of the first lens, and the coil motor is used to drive the The first lens moves toward or away from the first photosensitive sensor.
  • the electronic device further comprises a coil motor, the coil motor is disposed in the first mounting hole of the first bracket, and the coil motor has a second mounting hole The first lens is disposed in the second mounting hole, and the coil motor is used to drive the first lens to move toward or away from the first photosensitive sensor.
  • the coil motor has a plurality of motor pins, and the plurality of motor pins are soldered and connected to corresponding pads or lines on the circuit board.
  • the electronic device further includes an analog-to-digital converter and an image processor, the analog-to-digital converter and the image processor are both soldered on the circuit board, and the analog-to-digital converter and the first photosensitive
  • the sensor is electrically connected and used to convert the signal of the first photosensitive sensor into a digital signal.
  • the image processor is electrically connected to the analog-to-digital converter and is used to process the digital signal of the analog-to-digital converter. Get the image signal.
  • the image processor is electrically connected to the control circuit, and the control circuit can obtain the image signal to generate an image, and the image can be displayed on the display screen of the electronic device.
  • analog-to-digital converter and the image processor are both soldered to the circuit board through surface mount technology.
  • the electronic device further includes a base, the base is mounted on the circuit board, the base has a hollow area, the first sensor is disposed in the hollow area of the base, and the first bracket is mounted on the base. Mentioned base.
  • the electronic device further includes a filter, the filter is mounted on the base, and the filter is disposed between the first sensor and the first lens.
  • the electronic device further includes a second camera module
  • the second camera module includes a substrate, a second photosensitive sensor, a second bracket and a second lens, the second photosensitive sensor and the second bracket are arranged On the substrate, the substrate is arranged on the circuit board, and the substrate is connected to the control circuit through a connector.
  • the electronic device further includes a back cover, the back cover has a light-transmitting portion, the first lens and the second lens are arranged directly opposite to the light-transmitting portion, and the light-transmitting portion obtains external information
  • the first lens and the light-transmitting portion have a first distance
  • the second lens and the light-transmitting portion have a second distance
  • the first distance is less than or equal to the second distance.
  • the pixels of the first photosensitive sensor are larger than the pixels of the second photosensitive sensor.
  • the size of the second camera module is smaller than the size of the first camera module.
  • the first lens includes a main camera lens and a wide-angle camera lens
  • the second lens includes a virtual camera lens and a close-range camera lens.
  • a coil motor is installed in the first installation hole
  • the first lens is installed in the second installation hole of the coil motor
  • the second lens is directly installed on the second bracket.
  • the electronic device further includes a flash, and the flash is arranged adjacent to the first lens.
  • the embodiment of the application provides an electronic device.
  • Electronic devices can be smart phones, tablet computers, etc., but also game devices, AR (Augmented Reality) devices, data storage devices, audio playback devices, video playback devices, wearable devices, etc., among which wearable devices can be It is smart bracelet, smart glasses, etc.
  • the camera module of the electronic device includes a substrate, and components such as a photosensitive sensor and a lens provided on the substrate.
  • the camera module is mounted on the circuit board of the electronic device through its substrate, and the camera module is electrically connected to the circuit board through a board-to-board connector.
  • the overall height of the camera module is relatively high, which will affect the thickness of the electronic device and cannot make the thickness of the electronic device thinner.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of this application
  • FIG. 2 is a schematic diagram of a first camera module in an electronic device provided by an embodiment of this application.
  • the electronic device 100 in the embodiment of the present application includes a circuit board 120, a first photosensitive sensor 140, a first bracket 160, and a first lens 180.
  • the circuit board 120 is provided with a control circuit (not shown in the figure) for controlling the electronic device 100.
  • the circuit board 120 may be a main circuit board of the electronic device 100 or an auxiliary circuit board.
  • the main circuit board can be provided with a control circuit that controls the electronic device 100 to achieve multiple functions.
  • the control circuit on the main circuit board can include the main chip, memory, clock circuit, image processing circuit, etc., and the auxiliary circuit board can be provided with the control electronic device 100
  • the control circuit that implements certain functions, for example, the control circuit on the auxiliary circuit board may include one or more of a power control circuit, a power amplifier circuit, and a radio frequency circuit. It should be noted that, in some embodiments, there may be no auxiliary circuit board in the electronic device 100, only the main circuit board, and the control circuits on the auxiliary circuit board are all provided on the main circuit board.
  • the first photosensitive sensor 140 is soldered on the circuit board 120.
  • the first photosensitive sensor 140 includes a plurality of pins, and the first photosensitive sensor 140 can be directly soldered to the circuit board 120 through the plurality of pins.
  • the first bracket 160 is disposed on the circuit board 120, the first bracket 160 has a first mounting hole 162, and the first mounting hole 162 faces the first photosensitive sensor 140.
  • the first lens 180 is installed in the first installation hole 162 of the first bracket 160, and the first lens 180 faces the first photosensitive sensor 140.
  • the first lens 180 and the first photosensitive sensor 140 can cooperate to obtain external light signals and cooperate with other components to realize imaging.
  • the first lens 180 and the first photosensitive sensor 140 are main components of the first camera module 110.
  • the first bracket 160 is also directly disposed on the circuit board 120, and the first photosensitive sensor 140 and the first bracket 160 are no longer disposed on a separate substrate 212
  • the substrate 212 is then arranged on the circuit board 120, eliminating the need for a substrate 212.
  • the first camera module 110 used for imaging also reduces the thickness of a substrate 212, reducing the overall thickness of the camera module and saving The space in the electronic device 100 can make the electronic device 100 thinner.
  • the substrate 212 is removed, and the wiring is directly routed on the circuit board 120, the wiring on the substrate 212 will not be disturbed (because it is removed), and the anti-interference ability of the camera module is improved.
  • the interference of the antenna radio frequency during operation is also corresponding cut back.
  • FIG. 3 is a schematic structural diagram of a circuit board in an electronic device provided by an embodiment of the application
  • FIG. 4 is an enlarged schematic diagram of part X of the circuit board shown in FIG. 3.
  • the circuit board 120 is provided with printed wiring (not shown in the figure), and the first photosensitive sensor 140 is electrically connected to the control circuit through the printed wiring.
  • the first photosensitive sensor 140 no longer needs to be connected to the control circuit through a board-to-board connector, and the first photosensitive sensor 140 is electrically connected to the control circuit through printed traces on the circuit board 120, eliminating the need for a board-to-board (BTB) connection Device.
  • the first photosensitive sensor 140 includes a plurality of printed pins 142.
  • the first photosensitive sensor 140 is soldered on the circuit board 120 through the plurality of printed pins 142, and is electrically connected to the control circuit on the circuit board 120.
  • the circuit board 120 may be a multilayer board, and the printed traces that electrically connect the first photosensitive sensor 140 and the control circuit may be arranged on the surface layer of the circuit board 120 or on the middle layer of the circuit board 120.
  • the number of the first photosensitive sensor 140 may be at least two, the number of the first lens 180 may be at least two, at least two of the first photosensitive sensor 140 and at least two of the first lens 180 are one One correspondence.
  • the electronic device 100 may include at least two first photosensitive sensors 140 and at least two first lenses 180, wherein at least two of the first photosensitive sensors 140 and at least two of the first lenses 180 correspond to each other, or It is understood that the electronic device 100 has multiple camera modules, and the first photosensitive sensor 140 of each camera module is directly soldered on the circuit board 120.
  • first brackets 160 There may be multiple first brackets 160.
  • One first bracket 160 is provided corresponding to one first photosensitive sensor 140, and the multiple first brackets 160 have a plurality of first mounting holes 162.
  • the number of the first mounting holes 162 of the first bracket 160 is at least two, at least two of the first mounting holes 162 and at least two of the first lenses 180 one by one correspond.
  • a first bracket 160 has a plurality of first mounting holes 162, and each first lens 180 is correspondingly mounted in one first mounting hole 162, so that multiple lenses share one first bracket 160, and two There is only a layer of bracket wall between the lenses, which can reduce the total length of the bracket.
  • At least two of the first lenses 180 include a main camera lens, a wide-angle camera lens, a virtual camera lens, and a close-range camera lens.
  • the camera lens, the wide-angle camera lens, the virtual camera lens and the short-range camera lens The camera lenses are respectively correspondingly arranged in one of the first mounting holes 162.
  • the first bracket 160 includes 4 first mounting holes 162, or 4 first brackets 160, each first bracket 160 includes a first mounting hole 162, and 4 different lenses are correspondingly disposed in one first mounting hole 162 , 4 different lenses correspond to different first photosensitive sensors 140, and each lens, its corresponding first photosensitive sensor 140, and other matching components form a camera module.
  • the electronic device 100 includes 4 Camera modules, which are the main camera module, wide-angle camera module, virtual camera module and close-range camera module. 4 different camera modules realize different functions, and 4 camera modules correspond to 4 Different first photosensitive sensors 140 are directly soldered on the circuit board 120.
  • FIG. 5 is a schematic diagram of the second structure of the first camera module in the electronic device provided by an embodiment of the application.
  • the electronic device 100 further includes a coil motor 130 disposed in the first mounting hole 162 of the first bracket 160, the coil motor 130 has a second mounting hole 132, and the first lens 180 Set in the second mounting hole 132, the coil motor 130 is used to drive the first lens 180 toward or away from the first photosensitive sensor 140.
  • the coil motor 130 is installed in the first mounting hole 162 of the first bracket 160.
  • the coil motor 130 has a plurality of motor pins, and the motor pins can be directly welded to corresponding pads or wires on the circuit board 120.
  • the camera module in the embodiment of the present application may not be provided with the coil motor 130. According to needs, the plurality of camera modules in the embodiment of the present application may be provided with coil motors 130 all or part of them.
  • FIG. 6 is a schematic diagram of a third structure of the first camera module in the electronic device provided by an embodiment of the application
  • FIG. 7 is an exploded schematic diagram of the first camera module shown in FIG.
  • the first camera module 110 also includes a base 112, the base 112 is mounted on the circuit board 120, the first photosensitive sensor 140 is arranged in the middle frame area in the middle of the base 112, and the first photosensitive sensor 140 is also provided with components that cooperate with it. 116.
  • a filter 114 is provided above the first photosensitive sensor 140, and the filter may be blue glass, infrared filter, or the like.
  • the first bracket 160 is installed on the base 112, and the first lens 180 is installed on the first bracket 160. It should be noted that in some other embodiments, the first camera module 110 may not be provided with the base 112, and the first bracket 160 integrates the function of the base 112.
  • FIG. 8 is a schematic diagram of another structure of a circuit board in an electronic device provided by an embodiment of the application.
  • the electronic device 100 further includes an analog-to-digital converter 152 and an image processor 154. Both the analog-to-digital converter 152 and the image processor 154 are soldered on the circuit board 120, and the analog-to-digital converter 152 is connected to the circuit board 120.
  • the first photosensitive sensor 140 is electrically connected and used to convert the signal of the first photosensitive sensor 140 into a digital signal.
  • the image processor 154 is electrically connected to the analog-to-digital converter 152 and is used to The digital signal processing of the analog-to-digital converter 152 obtains an image signal.
  • the image processor 154 is electrically connected to the control circuit 170.
  • the control circuit 170 generates an image after obtaining the image signal and displays the image on the display screen.
  • the analog-to-digital converter 152 and the image processor 154 are directly arranged on the circuit board 120, and the analog-to-digital converter 152 and the image processor 154 can be directly soldered on the circuit board by means of Surface Mounted Technology (SMT).
  • SMT Surface Mounted Technology
  • the circuit board 120 can be directly printed with circuits for functional devices such as the analog-to-digital converter 152 and the image processor 154.
  • the camera circuit of the camera module and the control circuit on the circuit board 120 can be completed through the same process.
  • FIG. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device provided by an embodiment of the application.
  • the electronic device 100 may further include a second camera module 210.
  • the second camera module 210 includes a substrate 212, a second photosensitive sensor 214, a second bracket 216, and a second lens 218.
  • the second photosensitive sensor 214 And the second bracket 216 is disposed on the substrate 212, the substrate 212 is disposed on the circuit board 120, and the substrate 212 is connected to the control circuit through a connector 213.
  • the second camera module 210 has a substrate 212.
  • the second photosensitive sensor 214, the second bracket 216, and the second lens 218 of the second camera module 210 are all disposed on the substrate 212.
  • the substrate 212 of the second camera module 210 is disposed on the substrate 212.
  • the second camera module 210 is connected to the control circuit through a connector 123 (BTB connector).
  • the first camera module 110 does not have a substrate 212, and the first photosensitive sensor 140 and the first bracket 160 of the first camera module 110 are directly arranged on the circuit board 120.
  • the second camera module 210 can be used as a front camera of the electronic device 100, and the first camera module 110 can be used as a rear camera of the electronic device 100.
  • the first camera module 110 and the second camera module 210 can also be used as a front camera or a rear camera of the electronic device 100.
  • the electronic device 100 further includes a back cover 190, the back cover 190 has a light-transmitting portion 192, the first camera module 110 and the second camera module 210 are arranged adjacently, the first lens 180 and the second lens The lenses 218 are arranged directly opposite to the light-transmitting portion 192, and obtain external light signals through the light-transmitting portion 192.
  • the first lens 180 and the light-transmitting portion 192 have a first distance
  • the second The lens 218 and the transparent portion 192 have a second distance
  • the first distance is less than or equal to the second distance.
  • the size of the second camera module 210 may be smaller than that of the first camera module 110.
  • the first camera module 110 does not have a substrate 212, but the first lens 180 of the first camera module 110 is closer to the light-transmitting portion 192 of the back cover 190 than the second lens 218 of the second camera module 210, or is connected to the back cover 190 The distance of the light transmitting part 192 is the same.
  • the first distance can be understood as the coil motor 130 drives the first lens 180 to move to the first lens 180 and the light transmitting portion 192 closest to the light transmitting portion 192 the distance. If the first camera module 110 and the second camera module 210 both have a coil motor 130, the first distance can be understood as the coil motor 130 drives the first lens 180 to move to the first lens 180 and the transparent portion 192 closest to the transparent portion 192. The distance between the light portion 192 and the second distance can be understood as the distance between the second lens 218 and the light transmission portion 192 after the second lens 218 is moved closest to the light transmission portion 192 by the coil motor 130.
  • the light-transmitting portion 192 of the back cover 190 may be a protective lens, and the protective lens may be colorless and transparent glass, plastic, or the like.
  • the pixels of the first photosensitive sensor 140 are larger than the pixels of the second photosensitive sensor 214.
  • the pixels of the first photosensitive sensor 140 of the first camera module 110 may be larger than the pixels of the second photosensitive sensor 214 of the second camera module 210.
  • the higher the pixel of the camera module the larger the size and the larger the space occupied.
  • the first photosensitive sensor 140 of the first camera module 110 with higher pixels is directly soldered to the circuit board 120. The height of the first camera module 110 can be reduced.
  • FIG. 10 is another structural diagram of the first camera module and the second camera module of the circuit board in the electronic device provided by an embodiment of the application.
  • the first camera module 110 may be a main camera module and/or a wide-angle camera module
  • the second camera module 210 may be a virtual camera module and/or a close-range camera module.
  • the first camera module 110 and the second camera module 210 may be other camera modules.
  • funnel-shaped graphics at the forefront of the lens 120 in FIGS. 2, 6-7, and 8 are used to illustrate the visible range, and are not physical components.
  • the electronic device in the embodiment of the present application may further include a flash, and the flash may be arranged adjacent to the first camera module.
  • the flash can be set between the two camera modules or on one side of all camera modules.
  • FIG. 11 is a schematic diagram of a second structure of an electronic device provided by an embodiment of this application.
  • the electronic device 100 may further include a display screen 310, a middle frame 332, a main board 334, and a battery 336.
  • the display screen 310 may be installed on the middle frame 332 and connected to the back cover 170 through the middle frame 332.
  • the display screen 310 may form the display surface of the electronic device 100 for displaying information such as images and text.
  • the display screen 310 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED).
  • a cover plate may also be provided on the display screen 310.
  • the cover plate covers the display screen 310 to protect the display screen 310 from being scratched or damaged by water.
  • the cover plate may be a transparent glass cover plate, so that the user can observe the information displayed on the display screen 310 through the cover plate.
  • the cover plate may be a glass cover plate made of sapphire.
  • the middle frame 332 may have a thin plate-like or sheet-like structure, or a hollow frame structure.
  • the middle frame 332 is used to provide support for the electronic components or functional components in the electronic device 100 to install the electronic components and functional components in the electronic device 100 together.
  • the middle frame 332 and the back cover 170 can jointly form a housing of the electronic device 100, for accommodating or installing electronic components and functional components of the electronic device 100.
  • the camera, receiver, circuit board, battery and other functional components of the electronic device 100 can be mounted on the middle frame 332 or the main board 334 for fixing. It can be understood that the material of the middle frame 332 may include metal or plastic.
  • the main board 334 can be installed on the middle frame 332.
  • the main board 334 may be the circuit board of the electronic device 100 in the above embodiment.
  • the main board 334 may be integrated with one or more of functional components such as a microphone, a speaker, a receiver, a headset interface, a camera, an acceleration sensor, a gyroscope, and a processor 150.
  • the display screen 310 may be electrically connected to the main board 334 to control the display of the display screen 310 through the processor 150 on the main board 334.
  • the battery 336 may be installed on the middle frame 332. At the same time, the battery 336 is electrically connected to the main board 334 so that the battery 336 can supply power to the electronic device 100.
  • the main board 334 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 336 to various electronic components in the electronic device 100.
  • the back cover 170 may be integrally formed. During the molding process of the back cover 170, a structure such as a rear lens hole may be formed on the back cover 170, and the lens hole faces the camera module.
  • the back cover 170 may be fixedly connected to the middle frame 332 by double-sided adhesive.

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  • Signal Processing (AREA)
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Abstract

The embodiments of the present application provide an electronic device. The electronic device comprises a circuit board, a first light-sensitive sensor, a first support and a first lens. The circuit board is provided with a control circuit for controlling the electronic device; the first light-sensitive sensor is bonded to the circuit board; the first support is disposed on the circuit board and is provided with a first mounting hole; the first mounting hole directly faces the first light-sensitive sensor; the first lens is mounted in the first mounting hole of the first support; the first lens directly faces the first light-sensitive sensor.

Description

电子设备Electronic equipment
本申请要求于2019年06月28日提交中国专利局、申请号为201910623150.0、申请名称为“电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the Chinese Patent Office with the application number 201910623150.0 and the application name "Electronic Equipment" on June 28, 2019, the entire content of which is incorporated into this application by reference.
技术领域Technical field
本申请涉及电子技术领域,特别涉及一种电子设备。This application relates to the field of electronic technology, in particular to an electronic device.
背景技术Background technique
随着通信技术的发展,诸如智能手机等电子设备越来越普及。在电子设备的日常使用过程中,电子设备的摄像功能越来越重要,对摄像的效果要求也越来越高。With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. In the daily use of electronic equipment, the camera function of the electronic equipment becomes more and more important, and the requirements for the effect of the camera are also higher and higher.
发明内容Summary of the invention
本申请实施例提供一种电子设备,可以降低摄像头模组的厚度,可以让电子设备做的更薄。The embodiment of the present application provides an electronic device, which can reduce the thickness of the camera module, and can make the electronic device thinner.
本申请实施例提供一种电子设备,其包括:An embodiment of the application provides an electronic device, which includes:
电路板,所述电路板上设有控制所述电子设备的控制电路;A circuit board, the circuit board is provided with a control circuit for controlling the electronic device;
第一感光传感器,焊接于所述电路板上;The first photosensitive sensor is soldered on the circuit board;
第一支架,设置于所述电路板上,所述第一支架具有第一安装孔,所述第一安装孔正对所述第一感光传感器;The first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
第一镜头,安装于所述第一支架的第一安装孔内,所述第一镜头正对所述第一感光传感器。The first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
附图说明Description of the drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。In order to more clearly describe the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings that need to be used in the description of the embodiments.
图1为本申请实施例提供的电子设备的第一种结构示意图。FIG. 1 is a schematic diagram of the first structure of an electronic device provided by an embodiment of this application.
图2为本申请实施例提供的电子设备中第一摄像头模组的第一种结构示意图。2 is a schematic diagram of a first structure of a first camera module in an electronic device provided by an embodiment of the application.
图3为本申请实施例提供的电子设备中电路板的结构示意图。FIG. 3 is a schematic structural diagram of a circuit board in an electronic device provided by an embodiment of the application.
图4为图3所示电路板中X部分的放大示意图。Fig. 4 is an enlarged schematic diagram of part X in the circuit board shown in Fig. 3.
图5为本申请实施例提供的电子设备中第一摄像头模组的第二种结构示意图。FIG. 5 is a schematic diagram of a second structure of a first camera module in an electronic device provided by an embodiment of the application.
图6为本申请实施例提供的电子设备中第一摄像头模组的第三种结构示意图。FIG. 6 is a schematic diagram of a third structure of the first camera module in the electronic device provided by an embodiment of the application.
图7为图6所示第一摄像头图模组的分解示意图。FIG. 7 is an exploded schematic diagram of the first camera module shown in FIG. 6.
图8为本申请实施例提供的电子设备中电路板的另一种结构示意图。FIG. 8 is a schematic diagram of another structure of a circuit board in an electronic device provided by an embodiment of the application.
图9为本申请实施例提供的电子设备中电路板的第一摄像头模组和第二摄像头模组的结构示意图。FIG. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device provided by an embodiment of the application.
图10为本申请实施例提供的电子设备中电路板的第一摄像头模组和第二摄像头模组的另一结构示意图。FIG. 10 is another schematic structural diagram of the first camera module and the second camera module of the circuit board in the electronic device provided by the embodiment of the application.
图11为本申请实施例提供的电子设备的第二种结构示意图。FIG. 11 is a schematic diagram of a second structure of an electronic device provided by an embodiment of this application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例,都属于本申请的保护范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of this application.
本申请实施例提供一种电子设备,其包括:An embodiment of the application provides an electronic device, which includes:
电路板,所述电路板上设有控制所述电子设备的控制电路;A circuit board, the circuit board is provided with a control circuit for controlling the electronic device;
第一感光传感器,焊接于所述电路板上;The first photosensitive sensor is soldered on the circuit board;
第一支架,设置于所述电路板上,所述第一支架具有第一安装孔,所述第一安装孔正对所述第一感光传感器;The first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
第一镜头,安装于所述第一支架的第一安装孔内,所述第一镜头正对所述第一感光传感器。The first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
其中,所述电路板上设有印刷走线,所述第一感光传感器通过所述印刷走线与所述控制电路电性连接。Wherein, the circuit board is provided with printed wiring, and the first photosensitive sensor is electrically connected to the control circuit through the printed wiring.
其中,所述第一感光传感器的数量为至少两个,所述第一镜头的数量为至 少两个,至少两个所述第一感光传感器和至少两个所述第一镜头一一对应。Wherein, the number of the first photosensitive sensor is at least two, the number of the first lens is at least two, and the at least two first photosensitive sensors and the at least two first lenses are in one-to-one correspondence.
其中,所述第一支架的第一安装孔的数量为至少两个,至少两个所述第一安装孔与至少两个所述第一镜头一一对应。Wherein, the number of the first mounting holes of the first bracket is at least two, and at least two of the first mounting holes are in one-to-one correspondence with at least two of the first lenses.
其中,至少两个所述第一镜头包括主摄像镜头、广角摄像镜头、虚化摄像镜头和近距离摄像镜头,所述摄像镜头、所述广角摄像镜头、所述虚化摄像镜头和所述近距离摄像镜头分别对应设置于一个所述第一安装孔内。Wherein, at least two of the first lenses include a main camera lens, a wide-angle camera lens, a blur camera lens, and a close-range camera lens, the camera lens, the wide-angle camera lens, the blur camera lens, and the close-up camera lens. The distance camera lenses are respectively correspondingly arranged in one of the first mounting holes.
其中,至少一个所述第一安装孔内设置有线圈马达,所述线圈马达具有第二安装孔,所述第二安装孔能够容纳一个所述第一镜头,所述线圈马达用于驱动所述第一镜头朝向或远离所述第一感光传感器运动。7、根据权利要求1所述的电子设备,其中,所述电子设备还包括线圈马达,所述线圈马达设置于所述第一支架的第一安装孔内,所述线圈马达具有第二安装孔,所述第一镜头设置于所述第二安装孔内,所述线圈马达用于驱动所述第一镜头朝向或远离所述第一感光传感器运动。Wherein, at least one of the first mounting holes is provided with a coil motor, the coil motor has a second mounting hole, the second mounting hole can accommodate one of the first lens, and the coil motor is used to drive the The first lens moves toward or away from the first photosensitive sensor. 7. The electronic device according to claim 1, wherein the electronic device further comprises a coil motor, the coil motor is disposed in the first mounting hole of the first bracket, and the coil motor has a second mounting hole The first lens is disposed in the second mounting hole, and the coil motor is used to drive the first lens to move toward or away from the first photosensitive sensor.
其中,所述线圈马达具有多个马达引脚,多个所述马达引脚与所述电路板上对应的焊盘或线路焊接连接。Wherein, the coil motor has a plurality of motor pins, and the plurality of motor pins are soldered and connected to corresponding pads or lines on the circuit board.
其中,所述电子设备还包括模数转换器和图像处理器,所述模数转换器和所述图像处理器均焊接于所述电路板上,所述模数转换器与所述第一感光传感器电性连接,并用于将所述第一感光传感器的信号转换成数字信号,所述图像处理器与所述模数转换器电性连接,并用于将所述模数转换器的数字信号处理得到图像信号。Wherein, the electronic device further includes an analog-to-digital converter and an image processor, the analog-to-digital converter and the image processor are both soldered on the circuit board, and the analog-to-digital converter and the first photosensitive The sensor is electrically connected and used to convert the signal of the first photosensitive sensor into a digital signal. The image processor is electrically connected to the analog-to-digital converter and is used to process the digital signal of the analog-to-digital converter. Get the image signal.
其中,所述图像处理器与所述控制电路电性连接,所述控制电路能够得到所述图像信号后生成图像,所述图像能够在所述电子设备的显示屏上显示。Wherein, the image processor is electrically connected to the control circuit, and the control circuit can obtain the image signal to generate an image, and the image can be displayed on the display screen of the electronic device.
其中,所述模数转换器和所述图像处理器均通过表面贴装技术焊接于所述电路板。Wherein, the analog-to-digital converter and the image processor are both soldered to the circuit board through surface mount technology.
其中,所述电子设备还包括底座,所述底座安装于所述电路板,所述底座具有中空区域,所述第一传感器设置于所述底座的中空区域内,所述第一支架安装于所述底座。Wherein, the electronic device further includes a base, the base is mounted on the circuit board, the base has a hollow area, the first sensor is disposed in the hollow area of the base, and the first bracket is mounted on the base. Mentioned base.
其中,所述电子设备还包括滤光镜,所述滤光镜安装于所述底座,所述滤 光镜设置于所述第一传感器和所第一镜头之间。Wherein, the electronic device further includes a filter, the filter is mounted on the base, and the filter is disposed between the first sensor and the first lens.
其中,所述电子设备还包括第二摄像头模组,所述第二摄像头模组包括基板、第二感光传感器、第二支架和第二镜头,所述第二感光传感器和所述第二支架设置于所述基板上,所述基板设置于所述电路板上,所述基板通过连接器与所述控制电路连接。Wherein, the electronic device further includes a second camera module, the second camera module includes a substrate, a second photosensitive sensor, a second bracket and a second lens, the second photosensitive sensor and the second bracket are arranged On the substrate, the substrate is arranged on the circuit board, and the substrate is connected to the control circuit through a connector.
其中,所述电子设备还包括后盖,所述后盖具有透光部,所述第一镜头和所述第二镜头正对所述透光部设置,并通过所述透光部获取外界的光信号,所述第一镜头与所述透光部具有第一间距,所述第二镜头与所述透光部具有第二间距,所述第一间距小于或等于所述第二间距。Wherein, the electronic device further includes a back cover, the back cover has a light-transmitting portion, the first lens and the second lens are arranged directly opposite to the light-transmitting portion, and the light-transmitting portion obtains external information For optical signals, the first lens and the light-transmitting portion have a first distance, the second lens and the light-transmitting portion have a second distance, and the first distance is less than or equal to the second distance.
其中,所述第一感光传感器的像素大于所述第二感光传感器的像素。Wherein, the pixels of the first photosensitive sensor are larger than the pixels of the second photosensitive sensor.
其中,所述第二摄像头模组的尺寸小于所述第一摄像头模组的尺寸。Wherein, the size of the second camera module is smaller than the size of the first camera module.
其中,所述第一镜头包括主摄像头镜头和广角摄像头镜头,所述第二镜头包括虚化摄像头镜头和近距离摄像头镜头。Wherein, the first lens includes a main camera lens and a wide-angle camera lens, and the second lens includes a virtual camera lens and a close-range camera lens.
其中,所述第一安装孔内安装有线圈马达,所述第一镜头安装于所述线圈马达的第二安装孔内,所述第二镜头直接安装于所述第二支架。Wherein, a coil motor is installed in the first installation hole, the first lens is installed in the second installation hole of the coil motor, and the second lens is directly installed on the second bracket.
其中,所述电子设备还包括闪光灯,所述闪光灯相邻所述第一镜头设置。Wherein, the electronic device further includes a flash, and the flash is arranged adjacent to the first lens.
本申请实施例提供一种电子设备。电子设备可以是智能手机、平板电脑等设备,还可以是游戏设备、AR(Augmented Reality,增强现实)设备、数据存储装置、音频播放装置、视频播放装置、可穿戴设备等,其中可穿戴设备可以是智能手环、智能眼镜等。The embodiment of the application provides an electronic device. Electronic devices can be smart phones, tablet computers, etc., but also game devices, AR (Augmented Reality) devices, data storage devices, audio playback devices, video playback devices, wearable devices, etc., among which wearable devices can be It is smart bracelet, smart glasses, etc.
相关技术中,电子设备的摄像头模组包括基板、以及设置在基板上的感光传感器、镜头等部件。摄像头模组通过其基板安装在电子设备的电路板上,摄像头模组通过板对板连接器与电路板电性连接。摄像头模组整体高度较高,会影响电子设备的厚度,无法使电子设备的厚度做薄。In the related art, the camera module of the electronic device includes a substrate, and components such as a photosensitive sensor and a lens provided on the substrate. The camera module is mounted on the circuit board of the electronic device through its substrate, and the camera module is electrically connected to the circuit board through a board-to-board connector. The overall height of the camera module is relatively high, which will affect the thickness of the electronic device and cannot make the thickness of the electronic device thinner.
请参阅图1和图2,图1为本申请实施例提供的电子设备的第一种结构示意图,图2为本申请实施例提供的电子设备中第一摄像头模组的第一种结构示意图。本申请实施例中的电子设备100包括电路板120、第一感光传感器140、第一支架160和第一镜头180。Please refer to FIGS. 1 and 2. FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of this application, and FIG. 2 is a schematic diagram of a first camera module in an electronic device provided by an embodiment of this application. The electronic device 100 in the embodiment of the present application includes a circuit board 120, a first photosensitive sensor 140, a first bracket 160, and a first lens 180.
所述电路板120上设有控制所述电子设备100的控制电路(图中未示出),电路板120可以为电子设备100的主电路板,也可以为辅助电路板。主电路板上可以设置控制电子设备100实现多种功能的控制电路,主电路板上的控制电路可以包括主芯片、存储器、时钟电路、图像处理电路等,辅助电路板上可以设置控制电子设备100实现某些功能的控制电路,例如,辅助电路板上的控制电路可以包括电源控制电路、功放电路、射频电路等中的一项或多项。需要说明的是,在一些实施例中,电子设备100中可以没有辅助电路板,只有主电路板,辅助电路板上的控制电路都设置在主电路板上。The circuit board 120 is provided with a control circuit (not shown in the figure) for controlling the electronic device 100. The circuit board 120 may be a main circuit board of the electronic device 100 or an auxiliary circuit board. The main circuit board can be provided with a control circuit that controls the electronic device 100 to achieve multiple functions. The control circuit on the main circuit board can include the main chip, memory, clock circuit, image processing circuit, etc., and the auxiliary circuit board can be provided with the control electronic device 100 The control circuit that implements certain functions, for example, the control circuit on the auxiliary circuit board may include one or more of a power control circuit, a power amplifier circuit, and a radio frequency circuit. It should be noted that, in some embodiments, there may be no auxiliary circuit board in the electronic device 100, only the main circuit board, and the control circuits on the auxiliary circuit board are all provided on the main circuit board.
第一感光传感器140焊接于所述电路板120上。第一感光传感器140包括多个引脚,第一感光传感器140可以通过其多个引脚直接焊接于所述电路板120上。The first photosensitive sensor 140 is soldered on the circuit board 120. The first photosensitive sensor 140 includes a plurality of pins, and the first photosensitive sensor 140 can be directly soldered to the circuit board 120 through the plurality of pins.
第一支架160设置于所述电路板120上,所述第一支架160具有第一安装孔162,所述第一安装孔162正对所述第一感光传感器140。The first bracket 160 is disposed on the circuit board 120, the first bracket 160 has a first mounting hole 162, and the first mounting hole 162 faces the first photosensitive sensor 140.
第一镜头180安装于所述第一支架160的第一安装孔162内,所述第一镜头180正对所述第一感光传感器140。第一镜头180和第一感光传感器140可以配合获取外部的光信号,并与其他部件配合实现成像,第一镜头180和第一感光传感器140为第一摄像头模组110的主要组成部分。The first lens 180 is installed in the first installation hole 162 of the first bracket 160, and the first lens 180 faces the first photosensitive sensor 140. The first lens 180 and the first photosensitive sensor 140 can cooperate to obtain external light signals and cooperate with other components to realize imaging. The first lens 180 and the first photosensitive sensor 140 are main components of the first camera module 110.
由于第一感光传感器140直接焊接于控制电子设备100的电路板120上,第一支架160也直接设置于电路板120上,第一感光传感器140和第一支架160不再设置在单独的基板212上,再将基板212设置在电路板120上,省去了一块基板212,同时用于摄像的第一摄像头模组110也降低了一块基板212的厚度,降低摄像头模组的整体厚度,节约了电子设备100内的空间,可以让电子设备100做的更薄。另外,因为基板212去掉了,直接在电路板120走线,基板212上的线路不会被干扰(因为被去掉了),提升摄像头模组的抗干扰能力,工作时干扰天线射频的情况也相应减少。Since the first photosensitive sensor 140 is directly soldered to the circuit board 120 of the control electronic device 100, the first bracket 160 is also directly disposed on the circuit board 120, and the first photosensitive sensor 140 and the first bracket 160 are no longer disposed on a separate substrate 212 The substrate 212 is then arranged on the circuit board 120, eliminating the need for a substrate 212. At the same time, the first camera module 110 used for imaging also reduces the thickness of a substrate 212, reducing the overall thickness of the camera module and saving The space in the electronic device 100 can make the electronic device 100 thinner. In addition, because the substrate 212 is removed, and the wiring is directly routed on the circuit board 120, the wiring on the substrate 212 will not be disturbed (because it is removed), and the anti-interference ability of the camera module is improved. The interference of the antenna radio frequency during operation is also corresponding cut back.
请参阅图3和图4,图3为本申请实施例提供的电子设备中电路板的结构示意图,图4为图3所示电路板中X部分的放大示意图。所述电路板120上设有印刷走线(图中未示出),所述第一感光传感器140通过所述印刷走线与 所述控制电路电性连接。第一感光传感器140不再需要通过板对板连接器连接控制电路,第一感光传感器140通过电路板120上印刷走线与所述控制电路电性连接,省去了板对板(BTB)连接器。第一感光传感器140包括多个印刷引脚142,第一感光传感器140通过其多个印刷引脚142焊接在电路板120上,并与电路板120上的控制电路电性连接。电路板120可以为多层板,将第一感光传感器140与所述控制电路电性连接的印刷走线可以设置在电路板120的表层,也可以设置在电路板120的中间层。Please refer to FIGS. 3 and 4. FIG. 3 is a schematic structural diagram of a circuit board in an electronic device provided by an embodiment of the application, and FIG. 4 is an enlarged schematic diagram of part X of the circuit board shown in FIG. 3. The circuit board 120 is provided with printed wiring (not shown in the figure), and the first photosensitive sensor 140 is electrically connected to the control circuit through the printed wiring. The first photosensitive sensor 140 no longer needs to be connected to the control circuit through a board-to-board connector, and the first photosensitive sensor 140 is electrically connected to the control circuit through printed traces on the circuit board 120, eliminating the need for a board-to-board (BTB) connection Device. The first photosensitive sensor 140 includes a plurality of printed pins 142. The first photosensitive sensor 140 is soldered on the circuit board 120 through the plurality of printed pins 142, and is electrically connected to the control circuit on the circuit board 120. The circuit board 120 may be a multilayer board, and the printed traces that electrically connect the first photosensitive sensor 140 and the control circuit may be arranged on the surface layer of the circuit board 120 or on the middle layer of the circuit board 120.
所述第一感光传感器140的数量可以为至少两个,所述第一镜头180的数量可以为至少两个,至少两个所述第一感光传感器140和至少两个所述第一镜头180一一对应。电子设备100可以包括至少两个第一感光传感器140、至少两个第一镜头180,其中,至少两个所述第一感光传感器140和至少两个所述第一镜头180一一对应,也可以理解为电子设备100具有多个摄像头模组,并且每一个摄像头模组的第一感光传感器140都直接焊接在电路板120上。The number of the first photosensitive sensor 140 may be at least two, the number of the first lens 180 may be at least two, at least two of the first photosensitive sensor 140 and at least two of the first lens 180 are one One correspondence. The electronic device 100 may include at least two first photosensitive sensors 140 and at least two first lenses 180, wherein at least two of the first photosensitive sensors 140 and at least two of the first lenses 180 correspond to each other, or It is understood that the electronic device 100 has multiple camera modules, and the first photosensitive sensor 140 of each camera module is directly soldered on the circuit board 120.
第一支架160可以为多个,对应一个第一感光传感器140设置有一个第一支架160,多个第一支架160具有多个第一安装孔162。第一支架160也可以为一个,所述第一支架160的第一安装孔162的数量为至少两个,至少两个所述第一安装孔162与至少两个所述第一镜头180一一对应。也可以理解为,一个第一支架160具有多个第一安装孔162,每一个第一镜头180对应安装于一个第一安装孔162内,从而实现多个镜头共用一个第一支架160,两个镜头之间只有一层支架壁,可以减少支架的总长度。There may be multiple first brackets 160. One first bracket 160 is provided corresponding to one first photosensitive sensor 140, and the multiple first brackets 160 have a plurality of first mounting holes 162. There may also be one first bracket 160, the number of the first mounting holes 162 of the first bracket 160 is at least two, at least two of the first mounting holes 162 and at least two of the first lenses 180 one by one correspond. It can also be understood that a first bracket 160 has a plurality of first mounting holes 162, and each first lens 180 is correspondingly mounted in one first mounting hole 162, so that multiple lenses share one first bracket 160, and two There is only a layer of bracket wall between the lenses, which can reduce the total length of the bracket.
至少两个所述第一镜头180包括主摄像镜头、广角摄像镜头、虚化摄像镜头和近距离摄像镜头,所述摄像镜头、所述广角摄像镜头、所述虚化摄像镜头和所述近距离摄像镜头分别对应设置于一个所述第一安装孔162内。第一支架160包括4个第一安装孔162,或者4个第一支架160,每个第一支架160包括一个第一安装孔162,4个不同的镜头对应设置在一个第一安装孔162内,4个不同的镜头分别对应不同的第一感光传感器140,每一个镜头和其对应的第一感光传感器140、以及配合的其他部件形成一个摄像头模组,也可以理解为电子设备100包括4个摄像头模组,分别为主摄像头模组、广角摄像头模组、 虚化摄像头模组和近距离摄像头模组,4个不同的摄像头模组分别实现不同的功能,4个摄像头模组对应的4个不同的第一感光传感器140均直接焊接于电路板120上。At least two of the first lenses 180 include a main camera lens, a wide-angle camera lens, a virtual camera lens, and a close-range camera lens. The camera lens, the wide-angle camera lens, the virtual camera lens and the short-range camera lens The camera lenses are respectively correspondingly arranged in one of the first mounting holes 162. The first bracket 160 includes 4 first mounting holes 162, or 4 first brackets 160, each first bracket 160 includes a first mounting hole 162, and 4 different lenses are correspondingly disposed in one first mounting hole 162 , 4 different lenses correspond to different first photosensitive sensors 140, and each lens, its corresponding first photosensitive sensor 140, and other matching components form a camera module. It can also be understood that the electronic device 100 includes 4 Camera modules, which are the main camera module, wide-angle camera module, virtual camera module and close-range camera module. 4 different camera modules realize different functions, and 4 camera modules correspond to 4 Different first photosensitive sensors 140 are directly soldered on the circuit board 120.
请参阅图5,图5为本申请实施例提供的电子设备中第一摄像头模组的第二种结构示意图。所述电子设备100还包括线圈马达130,所述线圈马达130设置于所述第一支架160的第一安装孔162内,所述线圈马达130具有第二安装孔132,所述第一镜头180设置于所述第二安装孔132内,所述线圈马达130用于驱动所述第一镜头180朝向或远离所述第一感光传感器140运动。线圈马达130安装在第一支架160的第一安装孔162内,线圈马达130具有多个马达引脚,马达引脚可以与电路板120上对应的焊盘或线路直接焊接连接。Please refer to FIG. 5. FIG. 5 is a schematic diagram of the second structure of the first camera module in the electronic device provided by an embodiment of the application. The electronic device 100 further includes a coil motor 130 disposed in the first mounting hole 162 of the first bracket 160, the coil motor 130 has a second mounting hole 132, and the first lens 180 Set in the second mounting hole 132, the coil motor 130 is used to drive the first lens 180 toward or away from the first photosensitive sensor 140. The coil motor 130 is installed in the first mounting hole 162 of the first bracket 160. The coil motor 130 has a plurality of motor pins, and the motor pins can be directly welded to corresponding pads or wires on the circuit board 120.
需要说明的是,本申请实施例中的摄像头模组也可以不设置线圈马达130。根据需要,本申请实施例中的多个摄像头模组可以全部设置线圈马达130,也可以部分设置线圈马达130。It should be noted that the camera module in the embodiment of the present application may not be provided with the coil motor 130. According to needs, the plurality of camera modules in the embodiment of the present application may be provided with coil motors 130 all or part of them.
请参阅图6和图7,图6为本申请实施例提供的电子设备中第一摄像头模组的第三种结构示意图,图7为图6所示第一摄像头图模组的分解示意图。第一摄像头模组110还包括底座112,底座112安装在电路板120上,第一感光传感器140设置于底座112中间的中框区域内,第一感光传感器140周边还设有与其配合的元器件116,第一感光传感器140上方设有滤光镜114,滤光镜可以为蓝玻璃、红外滤光片等。第一支架160安装在底座112上,第一镜头180安装在第一支架160上。需要说明的是,在其他一些实施例中,第一摄像头模组110可以不设置底座112,第一支架160集成底座112的功能。Please refer to FIGS. 6 and 7. FIG. 6 is a schematic diagram of a third structure of the first camera module in the electronic device provided by an embodiment of the application, and FIG. 7 is an exploded schematic diagram of the first camera module shown in FIG. The first camera module 110 also includes a base 112, the base 112 is mounted on the circuit board 120, the first photosensitive sensor 140 is arranged in the middle frame area in the middle of the base 112, and the first photosensitive sensor 140 is also provided with components that cooperate with it. 116. A filter 114 is provided above the first photosensitive sensor 140, and the filter may be blue glass, infrared filter, or the like. The first bracket 160 is installed on the base 112, and the first lens 180 is installed on the first bracket 160. It should be noted that in some other embodiments, the first camera module 110 may not be provided with the base 112, and the first bracket 160 integrates the function of the base 112.
请参阅图8,图8为本申请实施例提供的电子设备中电路板的另一种结构示意图。所述电子设备100还包括模数转换器152和图像处理器154,所述模数转换器152和所述图像处理器154均焊接于所述电路板120上,所述模数转换器152与所述第一感光传感器140电性连接,并用于将所述第一感光传感器140的信号转换成数字信号,所述图像处理器154与所述模数转换器152电性连接,并用于将所述模数转换器152的数字信号处理得到图像信号。图像处理器154与控制电路170电性连接,控制电路170得到图像信号后生成图像并在 显示屏上显示该图像。Please refer to FIG. 8. FIG. 8 is a schematic diagram of another structure of a circuit board in an electronic device provided by an embodiment of the application. The electronic device 100 further includes an analog-to-digital converter 152 and an image processor 154. Both the analog-to-digital converter 152 and the image processor 154 are soldered on the circuit board 120, and the analog-to-digital converter 152 is connected to the circuit board 120. The first photosensitive sensor 140 is electrically connected and used to convert the signal of the first photosensitive sensor 140 into a digital signal. The image processor 154 is electrically connected to the analog-to-digital converter 152 and is used to The digital signal processing of the analog-to-digital converter 152 obtains an image signal. The image processor 154 is electrically connected to the control circuit 170. The control circuit 170 generates an image after obtaining the image signal and displays the image on the display screen.
将模数转换器152和图像处理器154直接设置在电路板120上,可以通过表面贴装技术(Surface Mounted Technology,SMT)等方式将模数转换器152和图像处理器154直接焊接在电路板120上,电路板120上可以直接印刷设置模数转换器152和图像处理器154等功能器件的线路,摄像头模组的摄像电路可以和电路板120上的控制电路可以通过同一流程完成。The analog-to-digital converter 152 and the image processor 154 are directly arranged on the circuit board 120, and the analog-to-digital converter 152 and the image processor 154 can be directly soldered on the circuit board by means of Surface Mounted Technology (SMT). On the circuit board 120, the circuit board 120 can be directly printed with circuits for functional devices such as the analog-to-digital converter 152 and the image processor 154. The camera circuit of the camera module and the control circuit on the circuit board 120 can be completed through the same process.
请参阅图9,图9为本申请实施例提供的电子设备中电路板的第一摄像头模组和第二摄像头模组的结构示意图。所述电子设备100还可以包括第二摄像头模组210,所述第二摄像头模组210包括基板212、第二感光传感器214、第二支架216和第二镜头218,所述第二感光传感器214和所述第二支架216设置于所述基板212上,所述基板212设置于所述电路板120上,所述基板212通过连接器213与所述控制电路连接。Please refer to FIG. 9, which is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device provided by an embodiment of the application. The electronic device 100 may further include a second camera module 210. The second camera module 210 includes a substrate 212, a second photosensitive sensor 214, a second bracket 216, and a second lens 218. The second photosensitive sensor 214 And the second bracket 216 is disposed on the substrate 212, the substrate 212 is disposed on the circuit board 120, and the substrate 212 is connected to the control circuit through a connector 213.
第二摄像头模组210具有基板212,第二摄像头模组210的第二感光传感器214、第二支架216和第二镜头218均设置在基板212上,第二摄像头模组210的基板212在设置于电路板120上,第二摄像头模组210通过连接器123(BTB连接器)与所述控制电路连接。第一摄像头模组110则没有基板212,第一摄像头模组110的第一感光传感器140、第一支架160均直接设置在电路板120上。The second camera module 210 has a substrate 212. The second photosensitive sensor 214, the second bracket 216, and the second lens 218 of the second camera module 210 are all disposed on the substrate 212. The substrate 212 of the second camera module 210 is disposed on the substrate 212. On the circuit board 120, the second camera module 210 is connected to the control circuit through a connector 123 (BTB connector). The first camera module 110 does not have a substrate 212, and the first photosensitive sensor 140 and the first bracket 160 of the first camera module 110 are directly arranged on the circuit board 120.
其中,第二摄像头模组210可以作为电子设备100的前置摄像头,第一摄像头模组110可以作为电子设备100的后置摄像头。第一摄像头模组110和第二摄像头模组210也可以都作为电子设备100的前置摄像头或后置摄像头。The second camera module 210 can be used as a front camera of the electronic device 100, and the first camera module 110 can be used as a rear camera of the electronic device 100. The first camera module 110 and the second camera module 210 can also be used as a front camera or a rear camera of the electronic device 100.
所述电子设备100还包括后盖190,所述后盖190具有透光部192,第一摄像头模组110和第二摄像头模组210相邻设置,所述第一镜头180和所述第二镜头218都正对所述透光部192设置,并透过所述透光部192获取外界的光信号,所述第一镜头180与所述透光部192具有第一间距,所述第二镜头218与所述透光部192具有第二间距,所述第一间距小于或等于所述第二间距。第二摄像头模组210的尺寸可以小于第一摄像头模组110。第一摄像头模组110没有基板212,但第一摄像头模组110的第一镜头180比第二摄像头模组210 的第二镜头218更加靠近后盖190的透光部192,或者与后盖190的透光部192的距离一样。The electronic device 100 further includes a back cover 190, the back cover 190 has a light-transmitting portion 192, the first camera module 110 and the second camera module 210 are arranged adjacently, the first lens 180 and the second lens The lenses 218 are arranged directly opposite to the light-transmitting portion 192, and obtain external light signals through the light-transmitting portion 192. The first lens 180 and the light-transmitting portion 192 have a first distance, and the second The lens 218 and the transparent portion 192 have a second distance, and the first distance is less than or equal to the second distance. The size of the second camera module 210 may be smaller than that of the first camera module 110. The first camera module 110 does not have a substrate 212, but the first lens 180 of the first camera module 110 is closer to the light-transmitting portion 192 of the back cover 190 than the second lens 218 of the second camera module 210, or is connected to the back cover 190 The distance of the light transmitting part 192 is the same.
需要说明的是,若第二摄像头模组210没有线圈马达130,第一间距可以理解为线圈马达130驱动第一镜头180移动到最靠近透光部192后的第一镜头180和透光部192的距离。若第一摄像头模组110和第二摄像头模组210都有线圈马达130,第一间距可以理解为线圈马达130驱动第一镜头180移动到最靠近透光部192后的第一镜头180和透光部192的距离,第二间距可以理解为线圈马达130驱动第二镜头218移动到最靠近透光部192后的第二镜头218和透光部192的距离。It should be noted that if the second camera module 210 does not have the coil motor 130, the first distance can be understood as the coil motor 130 drives the first lens 180 to move to the first lens 180 and the light transmitting portion 192 closest to the light transmitting portion 192 the distance. If the first camera module 110 and the second camera module 210 both have a coil motor 130, the first distance can be understood as the coil motor 130 drives the first lens 180 to move to the first lens 180 and the transparent portion 192 closest to the transparent portion 192. The distance between the light portion 192 and the second distance can be understood as the distance between the second lens 218 and the light transmission portion 192 after the second lens 218 is moved closest to the light transmission portion 192 by the coil motor 130.
后盖190的透光部192可以为保护镜片,保护镜片可以为无色透明的玻璃、塑料等。The light-transmitting portion 192 of the back cover 190 may be a protective lens, and the protective lens may be colorless and transparent glass, plastic, or the like.
其中,所述第一感光传感器140的像素大于所述第二感光传感器214的像素。第一摄像头模组110的第一感光传感器140的像素可以大于第二摄像头模组210的第二感光传感器214的像素。一般而言,摄像头模组的像素越高,其尺寸也越大,占用的空间也越大,将像素较高的第一摄像头模组110的第一感光传感器140直接焊接于电路板120上,可以降低第一摄像头模组110的高度。The pixels of the first photosensitive sensor 140 are larger than the pixels of the second photosensitive sensor 214. The pixels of the first photosensitive sensor 140 of the first camera module 110 may be larger than the pixels of the second photosensitive sensor 214 of the second camera module 210. Generally speaking, the higher the pixel of the camera module, the larger the size and the larger the space occupied. The first photosensitive sensor 140 of the first camera module 110 with higher pixels is directly soldered to the circuit board 120. The height of the first camera module 110 can be reduced.
请参阅图10,图10为本申请实施例提供的电子设备中电路板的第一摄像头模组和第二摄像头模组的另一结构示意图。其中,第一摄像头模组110可以为主摄像头模组和/或广角摄像头模组,第二摄像头模组210可以为虚化摄像头模组和/或近距离摄像头模组。在其他一些实施例中,第一摄像头模组110和第二摄像头模组210可以为其他摄像头模组。Please refer to FIG. 10. FIG. 10 is another structural diagram of the first camera module and the second camera module of the circuit board in the electronic device provided by an embodiment of the application. Among them, the first camera module 110 may be a main camera module and/or a wide-angle camera module, and the second camera module 210 may be a virtual camera module and/or a close-range camera module. In some other embodiments, the first camera module 110 and the second camera module 210 may be other camera modules.
需要说明的是,图2、图6-图7、图8中的镜头120最前面的漏斗状图形是用于示意可视范围的,并不是实体部件。It should be noted that the funnel-shaped graphics at the forefront of the lens 120 in FIGS. 2, 6-7, and 8 are used to illustrate the visible range, and are not physical components.
本申请实施例中电子设备还可以包括闪光灯,闪光灯可以相邻第一摄像头模组设置。摄像头模组包括多个摄像头模组时,闪光灯可以设置在两个摄像头模组之间,也可以设置在所有的摄像头模组一侧。The electronic device in the embodiment of the present application may further include a flash, and the flash may be arranged adjacent to the first camera module. When the camera module includes a plurality of camera modules, the flash can be set between the two camera modules or on one side of all camera modules.
请参阅图11并结合图1,图11为本申请实施例提供的电子设备的第二种结构示意图。其中,电子设备100还可以包括显示屏310、中框332、主板334以及 电池336。Please refer to FIG. 11 in conjunction with FIG. 1. FIG. 11 is a schematic diagram of a second structure of an electronic device provided by an embodiment of this application. The electronic device 100 may further include a display screen 310, a middle frame 332, a main board 334, and a battery 336.
其中,显示屏310可以安装在中框332上,并通过中框332连接至后盖170,显示屏310可以形成电子设备100的显示面,用于显示图像、文本等信息。其中,显示屏310可以包括液晶显示屏(Liquid Crystal Display,LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode,OLED)。The display screen 310 may be installed on the middle frame 332 and connected to the back cover 170 through the middle frame 332. The display screen 310 may form the display surface of the electronic device 100 for displaying information such as images and text. The display screen 310 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED).
可以理解的,显示屏310上还可以设置有盖板。盖板覆盖显示屏310,以对显示屏310进行保护,防止显示屏310被刮伤或者被水损坏。其中,盖板可以为透明玻璃盖板,从而用户可以透过盖板观察到显示屏310显示的信息。例如,盖板可以为蓝宝石材质的玻璃盖板。It is understandable that a cover plate may also be provided on the display screen 310. The cover plate covers the display screen 310 to protect the display screen 310 from being scratched or damaged by water. The cover plate may be a transparent glass cover plate, so that the user can observe the information displayed on the display screen 310 through the cover plate. For example, the cover plate may be a glass cover plate made of sapphire.
中框332可以为薄板状或薄片状的结构,也可以为中空的框体结构。中框332用于为电子设备100中的电子元件或功能组件提供支撑作用,以将电子设备100中的电子元件、功能组件安装到一起。The middle frame 332 may have a thin plate-like or sheet-like structure, or a hollow frame structure. The middle frame 332 is used to provide support for the electronic components or functional components in the electronic device 100 to install the electronic components and functional components in the electronic device 100 together.
其中,中框332以及后盖170可以共同形成电子设备100的壳体,用于容纳或安装电子设备100的电子元件、功能组件等。此外,电子设备100的摄像头、受话器、电路板、电池等功能组件都可以安装到中框332或主板334上以进行固定。可以理解的,中框332的材质可以包括金属或塑胶。Wherein, the middle frame 332 and the back cover 170 can jointly form a housing of the electronic device 100, for accommodating or installing electronic components and functional components of the electronic device 100. In addition, the camera, receiver, circuit board, battery and other functional components of the electronic device 100 can be mounted on the middle frame 332 or the main board 334 for fixing. It can be understood that the material of the middle frame 332 may include metal or plastic.
主板334可以安装在中框332上。主板334可以为上述实施例中电子设备100的电路板。其中,主板334上可以集成有麦克风、扬声器、受话器、耳机接口、摄像头、加速度传感器、陀螺仪以及处理器150等功能组件中的一个或多个。同时,显示屏310可以电连接至主板334,以通过主板334上的处理器150对显示屏310的显示进行控制。The main board 334 can be installed on the middle frame 332. The main board 334 may be the circuit board of the electronic device 100 in the above embodiment. Among them, the main board 334 may be integrated with one or more of functional components such as a microphone, a speaker, a receiver, a headset interface, a camera, an acceleration sensor, a gyroscope, and a processor 150. At the same time, the display screen 310 may be electrically connected to the main board 334 to control the display of the display screen 310 through the processor 150 on the main board 334.
电池336可以安装在中框332上。同时,电池336电连接至主板334,以实现电池336为电子设备100供电。其中,主板334上可以设置有电源管理电路。电源管理电路用于将电池336提供的电压分配到电子设备100中的各个电子元件。The battery 336 may be installed on the middle frame 332. At the same time, the battery 336 is electrically connected to the main board 334 so that the battery 336 can supply power to the electronic device 100. Wherein, the main board 334 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 336 to various electronic components in the electronic device 100.
后盖170可以一体成型。在后盖170的成型过程中,可以在后盖170上形成后置镜片孔等结构,镜片孔正对摄像头模组。后盖170可以通过双面背胶与中框332固定连接。The back cover 170 may be integrally formed. During the molding process of the back cover 170, a structure such as a rear lens hole may be formed on the back cover 170, and the lens hole faces the camera module. The back cover 170 may be fixedly connected to the middle frame 332 by double-sided adhesive.
以上对本申请实施例提供的电子设备进行了详细介绍。本文中应用了具体 个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。The electronic device provided by the embodiment of the present application has been described in detail above. Specific examples are used in this article to illustrate the principles and implementation of the application, and the description of the above examples is only used to help understand the application. At the same time, for those skilled in the art, according to the idea of the application, there will be changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as a limitation of the application.

Claims (19)

  1. 一种电子设备,包括:An electronic device including:
    电路板,所述电路板上设有控制所述电子设备的控制电路;A circuit board, the circuit board is provided with a control circuit for controlling the electronic device;
    第一感光传感器,焊接于所述电路板上;The first photosensitive sensor is soldered on the circuit board;
    第一支架,设置于所述电路板上,所述第一支架具有第一安装孔,所述第一安装孔正对所述第一感光传感器;The first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
    第一镜头,安装于所述第一支架的第一安装孔内,所述第一镜头正对所述第一感光传感器。The first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
  2. 根据权利要求1所述的电子设备,其中,所述电路板上设有印刷走线,所述第一感光传感器通过所述印刷走线与所述控制电路电性连接。3. The electronic device according to claim 1, wherein the circuit board is provided with printed wiring, and the first photosensitive sensor is electrically connected to the control circuit through the printed wiring.
  3. 根据权利要求1所述的电子设备,其中,所述第一感光传感器的数量为至少两个,所述第一镜头的数量为至少两个,至少两个所述第一感光传感器和至少两个所述第一镜头一一对应。The electronic device according to claim 1, wherein the number of the first photosensitive sensor is at least two, the number of the first lens is at least two, at least two of the first photosensitive sensor and at least two The first lens has a one-to-one correspondence.
  4. 根据权利要求3所述的电子设备,其中,所述第一支架的第一安装孔的数量为至少两个,至少两个所述第一安装孔与至少两个所述第一镜头一一对应。4. The electronic device according to claim 3, wherein the number of the first mounting holes of the first bracket is at least two, and at least two of the first mounting holes are in one-to-one correspondence with at least two of the first lenses .
  5. 根据权利要求4所述的电子设备,其中,至少两个所述第一镜头包括主摄像镜头、广角摄像镜头、虚化摄像镜头和近距离摄像镜头,所述摄像镜头、所述广角摄像镜头、所述虚化摄像镜头和所述近距离摄像镜头分别对应设置于一个所述第一安装孔内。The electronic device according to claim 4, wherein at least two of the first lenses include a main camera lens, a wide-angle camera lens, a virtual camera lens, and a close-range camera lens, the camera lens, the wide-angle camera lens, The virtual camera lens and the close-range camera lens are respectively arranged in one of the first mounting holes.
  6. 根据权利要求4所述的电子设备,其中,至少一个所述第一安装孔内设置有线圈马达,所述线圈马达具有第二安装孔,所述第二安装孔能够容纳一个所述第一镜头,所述线圈马达用于驱动所述第一镜头朝向或远离所述第一感光传感器运动。7、根据权利要求1所述的电子设备,其中,所述电子设备还包括线圈马达,所述线圈马达设置于所述第一支架的第一安装孔内,所述线圈马达具有第二安装孔,所述第一镜头设置于所述第二安装孔内,所述线圈马达用于驱动所述第一镜头朝向或远离所述第一感光传感器运动。The electronic device according to claim 4, wherein at least one of the first mounting holes is provided with a coil motor, the coil motor has a second mounting hole, and the second mounting hole can accommodate one of the first lens The coil motor is used to drive the first lens to move toward or away from the first photosensitive sensor. 7. The electronic device according to claim 1, wherein the electronic device further comprises a coil motor, the coil motor is disposed in the first mounting hole of the first bracket, and the coil motor has a second mounting hole The first lens is disposed in the second mounting hole, and the coil motor is used to drive the first lens to move toward or away from the first photosensitive sensor.
  7. 根据权利要求7所述的电子设备,其中,所述线圈马达具有多个马达引脚,多个所述马达引脚与所述电路板上对应的焊盘或线路焊接连接。7. The electronic device according to claim 7, wherein the coil motor has a plurality of motor pins, and the plurality of motor pins are connected to corresponding pads or wires on the circuit board by soldering.
  8. 根据权利要求1所述的电子设备,其中,所述电子设备还包括模数转换器和图像处理器,所述模数转换器和所述图像处理器均焊接于所述电路板上,所述模数转换器与所述第一感光传感器电性连接,并用于将所述第一感光传感器的信号转换成数字信号,所述图像处理器与所述模数转换器电性连接,并用于将所述模数转换器的数字信号处理得到图像信号。The electronic device according to claim 1, wherein the electronic device further comprises an analog-to-digital converter and an image processor, the analog-to-digital converter and the image processor are both soldered on the circuit board, the The analog-to-digital converter is electrically connected to the first photosensitive sensor and used to convert the signal of the first photosensitive sensor into a digital signal. The image processor is electrically connected to the analog-to-digital converter and is used to convert The digital signal processing of the analog-to-digital converter obtains an image signal.
  9. 根据权利要求9所述的电子设备,其中,所述图像处理器与所述控制电路电性连接,所述控制电路能够得到所述图像信号后生成图像,所述图像能够在所述电子设备的显示屏上显示。The electronic device according to claim 9, wherein the image processor is electrically connected to the control circuit, and the control circuit can obtain the image signal to generate an image, and the image can be displayed on the electronic device. Appears on the display.
  10. 根据权利要求9所述的电子设备,其中,所述模数转换器和所述图像处理器均通过表面贴装技术焊接于所述电路板。9. The electronic device according to claim 9, wherein the analog-to-digital converter and the image processor are both soldered to the circuit board by a surface mount technology.
  11. 根据权利要求1所述的电子设备,其中,所述电子设备还包括底座,所述底座安装于所述电路板,所述底座具有中空区域,所述第一传感器设置于所述底座的中空区域内,所述第一支架安装于所述底座。The electronic device according to claim 1, wherein the electronic device further comprises a base mounted on the circuit board, the base has a hollow area, and the first sensor is disposed in the hollow area of the base Inside, the first bracket is installed on the base.
  12. 根据权利要求12所述的电子设备,其中,所述电子设备还包括滤光镜,所述滤光镜安装于所述底座,所述滤光镜设置于所述第一传感器和所第一镜头之间。The electronic device according to claim 12, wherein the electronic device further comprises a filter, the filter is mounted on the base, and the filter is mounted on the first sensor and the first lens between.
  13. 根据权利要求1所述的电子设备,其中,所述电子设备还包括第二摄像头模组,所述第二摄像头模组包括基板、第二感光传感器、第二支架和第二镜头,所述第二感光传感器和所述第二支架设置于所述基板上,所述基板设置于所述电路板上,所述基板通过连接器与所述控制电路连接。The electronic device according to claim 1, wherein the electronic device further comprises a second camera module, the second camera module comprising a substrate, a second photosensitive sensor, a second bracket and a second lens, the first Two photosensitive sensors and the second bracket are arranged on the substrate, the substrate is arranged on the circuit board, and the substrate is connected to the control circuit through a connector.
  14. 根据权利要求14所述的电子设备,其中,所述电子设备还包括后盖,所述后盖具有透光部,所述第一镜头和所述第二镜头正对所述透光部设置,并通过所述透光部获取外界的光信号,所述第一镜头与所述透光部具有第一间距,所述第二镜头与所述透光部具有第二间距,所述第一间距小于或等于所述第二间距。The electronic device according to claim 14, wherein the electronic device further comprises a back cover, the back cover has a light-transmitting part, and the first lens and the second lens are arranged directly opposite to the light-transmitting part, And obtain external light signals through the light transmitting portion, the first lens and the light transmitting portion have a first distance, the second lens and the light transmitting portion have a second distance, the first distance Less than or equal to the second distance.
  15. 根据权利要求14所述的电子设备,其中,所述第一感光传感器的像素大于所述第二感光传感器的像素。The electronic device according to claim 14, wherein the pixels of the first photosensitive sensor are larger than the pixels of the second photosensitive sensor.
  16. 根据权利要求14所述的电子设备,其中,所述第二摄像头模组的尺寸小于所述第一摄像头模组的尺寸。15. The electronic device of claim 14, wherein the size of the second camera module is smaller than the size of the first camera module.
  17. 根据权利要求14所述的电子设备,其中,所述第一镜头包括主摄像头镜头和广角摄像头镜头,所述第二镜头包括虚化摄像头镜头和近距离摄像头镜头。The electronic device according to claim 14, wherein the first lens includes a main camera lens and a wide-angle camera lens, and the second lens includes a virtual camera lens and a close-range camera lens.
  18. 根据权利要求14所述的电子设备,其中,所述第一安装孔内安装有线圈马达,所述第一镜头安装于所述线圈马达的第二安装孔内,所述第二镜头直接安装于所述第二支架。The electronic device according to claim 14, wherein a coil motor is installed in the first mounting hole, the first lens is mounted in the second mounting hole of the coil motor, and the second lens is directly mounted on The second bracket.
  19. 根据权利要求1所述的电子设备,其中,所述电子设备还包括闪光灯,所述闪光灯相邻所述第一镜头设置。The electronic device according to claim 1, wherein the electronic device further comprises a flash, and the flash is disposed adjacent to the first lens.
PCT/CN2020/098199 2019-06-28 2020-06-24 Electronic device WO2020259614A1 (en)

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