WO2020259614A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2020259614A1
WO2020259614A1 PCT/CN2020/098199 CN2020098199W WO2020259614A1 WO 2020259614 A1 WO2020259614 A1 WO 2020259614A1 CN 2020098199 W CN2020098199 W CN 2020098199W WO 2020259614 A1 WO2020259614 A1 WO 2020259614A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
lens
circuit board
photosensitive sensor
bracket
Prior art date
Application number
PCT/CN2020/098199
Other languages
English (en)
Chinese (zh)
Inventor
姚坤
Original Assignee
RealMe重庆移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RealMe重庆移动通信有限公司 filed Critical RealMe重庆移动通信有限公司
Publication of WO2020259614A1 publication Critical patent/WO2020259614A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the field of electronic technology, in particular to an electronic device.
  • the embodiment of the present application provides an electronic device, which can reduce the thickness of the camera module, and can make the electronic device thinner.
  • An embodiment of the application provides an electronic device, which includes:
  • a circuit board the circuit board is provided with a control circuit for controlling the electronic device
  • the first photosensitive sensor is soldered on the circuit board
  • the first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
  • the first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
  • FIG. 1 is a schematic diagram of the first structure of an electronic device provided by an embodiment of this application.
  • FIG. 2 is a schematic diagram of a first structure of a first camera module in an electronic device provided by an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of a circuit board in an electronic device provided by an embodiment of the application.
  • Fig. 4 is an enlarged schematic diagram of part X in the circuit board shown in Fig. 3.
  • FIG. 5 is a schematic diagram of a second structure of a first camera module in an electronic device provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a third structure of the first camera module in the electronic device provided by an embodiment of the application.
  • FIG. 7 is an exploded schematic diagram of the first camera module shown in FIG. 6.
  • FIG. 8 is a schematic diagram of another structure of a circuit board in an electronic device provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device provided by an embodiment of the application.
  • FIG. 10 is another schematic structural diagram of the first camera module and the second camera module of the circuit board in the electronic device provided by the embodiment of the application.
  • FIG. 11 is a schematic diagram of a second structure of an electronic device provided by an embodiment of this application.
  • An embodiment of the application provides an electronic device, which includes:
  • a circuit board the circuit board is provided with a control circuit for controlling the electronic device
  • the first photosensitive sensor is soldered on the circuit board
  • the first bracket is arranged on the circuit board, the first bracket has a first mounting hole, and the first mounting hole faces the first photosensitive sensor;
  • the first lens is installed in the first installation hole of the first bracket, and the first lens is facing the first photosensitive sensor.
  • the circuit board is provided with printed wiring, and the first photosensitive sensor is electrically connected to the control circuit through the printed wiring.
  • the number of the first photosensitive sensor is at least two
  • the number of the first lens is at least two
  • the at least two first photosensitive sensors and the at least two first lenses are in one-to-one correspondence.
  • the number of the first mounting holes of the first bracket is at least two, and at least two of the first mounting holes are in one-to-one correspondence with at least two of the first lenses.
  • At least two of the first lenses include a main camera lens, a wide-angle camera lens, a blur camera lens, and a close-range camera lens, the camera lens, the wide-angle camera lens, the blur camera lens, and the close-up camera lens.
  • the distance camera lenses are respectively correspondingly arranged in one of the first mounting holes.
  • At least one of the first mounting holes is provided with a coil motor, the coil motor has a second mounting hole, the second mounting hole can accommodate one of the first lens, and the coil motor is used to drive the The first lens moves toward or away from the first photosensitive sensor.
  • the electronic device further comprises a coil motor, the coil motor is disposed in the first mounting hole of the first bracket, and the coil motor has a second mounting hole The first lens is disposed in the second mounting hole, and the coil motor is used to drive the first lens to move toward or away from the first photosensitive sensor.
  • the coil motor has a plurality of motor pins, and the plurality of motor pins are soldered and connected to corresponding pads or lines on the circuit board.
  • the electronic device further includes an analog-to-digital converter and an image processor, the analog-to-digital converter and the image processor are both soldered on the circuit board, and the analog-to-digital converter and the first photosensitive
  • the sensor is electrically connected and used to convert the signal of the first photosensitive sensor into a digital signal.
  • the image processor is electrically connected to the analog-to-digital converter and is used to process the digital signal of the analog-to-digital converter. Get the image signal.
  • the image processor is electrically connected to the control circuit, and the control circuit can obtain the image signal to generate an image, and the image can be displayed on the display screen of the electronic device.
  • analog-to-digital converter and the image processor are both soldered to the circuit board through surface mount technology.
  • the electronic device further includes a base, the base is mounted on the circuit board, the base has a hollow area, the first sensor is disposed in the hollow area of the base, and the first bracket is mounted on the base. Mentioned base.
  • the electronic device further includes a filter, the filter is mounted on the base, and the filter is disposed between the first sensor and the first lens.
  • the electronic device further includes a second camera module
  • the second camera module includes a substrate, a second photosensitive sensor, a second bracket and a second lens, the second photosensitive sensor and the second bracket are arranged On the substrate, the substrate is arranged on the circuit board, and the substrate is connected to the control circuit through a connector.
  • the electronic device further includes a back cover, the back cover has a light-transmitting portion, the first lens and the second lens are arranged directly opposite to the light-transmitting portion, and the light-transmitting portion obtains external information
  • the first lens and the light-transmitting portion have a first distance
  • the second lens and the light-transmitting portion have a second distance
  • the first distance is less than or equal to the second distance.
  • the pixels of the first photosensitive sensor are larger than the pixels of the second photosensitive sensor.
  • the size of the second camera module is smaller than the size of the first camera module.
  • the first lens includes a main camera lens and a wide-angle camera lens
  • the second lens includes a virtual camera lens and a close-range camera lens.
  • a coil motor is installed in the first installation hole
  • the first lens is installed in the second installation hole of the coil motor
  • the second lens is directly installed on the second bracket.
  • the electronic device further includes a flash, and the flash is arranged adjacent to the first lens.
  • the embodiment of the application provides an electronic device.
  • Electronic devices can be smart phones, tablet computers, etc., but also game devices, AR (Augmented Reality) devices, data storage devices, audio playback devices, video playback devices, wearable devices, etc., among which wearable devices can be It is smart bracelet, smart glasses, etc.
  • the camera module of the electronic device includes a substrate, and components such as a photosensitive sensor and a lens provided on the substrate.
  • the camera module is mounted on the circuit board of the electronic device through its substrate, and the camera module is electrically connected to the circuit board through a board-to-board connector.
  • the overall height of the camera module is relatively high, which will affect the thickness of the electronic device and cannot make the thickness of the electronic device thinner.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of this application
  • FIG. 2 is a schematic diagram of a first camera module in an electronic device provided by an embodiment of this application.
  • the electronic device 100 in the embodiment of the present application includes a circuit board 120, a first photosensitive sensor 140, a first bracket 160, and a first lens 180.
  • the circuit board 120 is provided with a control circuit (not shown in the figure) for controlling the electronic device 100.
  • the circuit board 120 may be a main circuit board of the electronic device 100 or an auxiliary circuit board.
  • the main circuit board can be provided with a control circuit that controls the electronic device 100 to achieve multiple functions.
  • the control circuit on the main circuit board can include the main chip, memory, clock circuit, image processing circuit, etc., and the auxiliary circuit board can be provided with the control electronic device 100
  • the control circuit that implements certain functions, for example, the control circuit on the auxiliary circuit board may include one or more of a power control circuit, a power amplifier circuit, and a radio frequency circuit. It should be noted that, in some embodiments, there may be no auxiliary circuit board in the electronic device 100, only the main circuit board, and the control circuits on the auxiliary circuit board are all provided on the main circuit board.
  • the first photosensitive sensor 140 is soldered on the circuit board 120.
  • the first photosensitive sensor 140 includes a plurality of pins, and the first photosensitive sensor 140 can be directly soldered to the circuit board 120 through the plurality of pins.
  • the first bracket 160 is disposed on the circuit board 120, the first bracket 160 has a first mounting hole 162, and the first mounting hole 162 faces the first photosensitive sensor 140.
  • the first lens 180 is installed in the first installation hole 162 of the first bracket 160, and the first lens 180 faces the first photosensitive sensor 140.
  • the first lens 180 and the first photosensitive sensor 140 can cooperate to obtain external light signals and cooperate with other components to realize imaging.
  • the first lens 180 and the first photosensitive sensor 140 are main components of the first camera module 110.
  • the first bracket 160 is also directly disposed on the circuit board 120, and the first photosensitive sensor 140 and the first bracket 160 are no longer disposed on a separate substrate 212
  • the substrate 212 is then arranged on the circuit board 120, eliminating the need for a substrate 212.
  • the first camera module 110 used for imaging also reduces the thickness of a substrate 212, reducing the overall thickness of the camera module and saving The space in the electronic device 100 can make the electronic device 100 thinner.
  • the substrate 212 is removed, and the wiring is directly routed on the circuit board 120, the wiring on the substrate 212 will not be disturbed (because it is removed), and the anti-interference ability of the camera module is improved.
  • the interference of the antenna radio frequency during operation is also corresponding cut back.
  • FIG. 3 is a schematic structural diagram of a circuit board in an electronic device provided by an embodiment of the application
  • FIG. 4 is an enlarged schematic diagram of part X of the circuit board shown in FIG. 3.
  • the circuit board 120 is provided with printed wiring (not shown in the figure), and the first photosensitive sensor 140 is electrically connected to the control circuit through the printed wiring.
  • the first photosensitive sensor 140 no longer needs to be connected to the control circuit through a board-to-board connector, and the first photosensitive sensor 140 is electrically connected to the control circuit through printed traces on the circuit board 120, eliminating the need for a board-to-board (BTB) connection Device.
  • the first photosensitive sensor 140 includes a plurality of printed pins 142.
  • the first photosensitive sensor 140 is soldered on the circuit board 120 through the plurality of printed pins 142, and is electrically connected to the control circuit on the circuit board 120.
  • the circuit board 120 may be a multilayer board, and the printed traces that electrically connect the first photosensitive sensor 140 and the control circuit may be arranged on the surface layer of the circuit board 120 or on the middle layer of the circuit board 120.
  • the number of the first photosensitive sensor 140 may be at least two, the number of the first lens 180 may be at least two, at least two of the first photosensitive sensor 140 and at least two of the first lens 180 are one One correspondence.
  • the electronic device 100 may include at least two first photosensitive sensors 140 and at least two first lenses 180, wherein at least two of the first photosensitive sensors 140 and at least two of the first lenses 180 correspond to each other, or It is understood that the electronic device 100 has multiple camera modules, and the first photosensitive sensor 140 of each camera module is directly soldered on the circuit board 120.
  • first brackets 160 There may be multiple first brackets 160.
  • One first bracket 160 is provided corresponding to one first photosensitive sensor 140, and the multiple first brackets 160 have a plurality of first mounting holes 162.
  • the number of the first mounting holes 162 of the first bracket 160 is at least two, at least two of the first mounting holes 162 and at least two of the first lenses 180 one by one correspond.
  • a first bracket 160 has a plurality of first mounting holes 162, and each first lens 180 is correspondingly mounted in one first mounting hole 162, so that multiple lenses share one first bracket 160, and two There is only a layer of bracket wall between the lenses, which can reduce the total length of the bracket.
  • At least two of the first lenses 180 include a main camera lens, a wide-angle camera lens, a virtual camera lens, and a close-range camera lens.
  • the camera lens, the wide-angle camera lens, the virtual camera lens and the short-range camera lens The camera lenses are respectively correspondingly arranged in one of the first mounting holes 162.
  • the first bracket 160 includes 4 first mounting holes 162, or 4 first brackets 160, each first bracket 160 includes a first mounting hole 162, and 4 different lenses are correspondingly disposed in one first mounting hole 162 , 4 different lenses correspond to different first photosensitive sensors 140, and each lens, its corresponding first photosensitive sensor 140, and other matching components form a camera module.
  • the electronic device 100 includes 4 Camera modules, which are the main camera module, wide-angle camera module, virtual camera module and close-range camera module. 4 different camera modules realize different functions, and 4 camera modules correspond to 4 Different first photosensitive sensors 140 are directly soldered on the circuit board 120.
  • FIG. 5 is a schematic diagram of the second structure of the first camera module in the electronic device provided by an embodiment of the application.
  • the electronic device 100 further includes a coil motor 130 disposed in the first mounting hole 162 of the first bracket 160, the coil motor 130 has a second mounting hole 132, and the first lens 180 Set in the second mounting hole 132, the coil motor 130 is used to drive the first lens 180 toward or away from the first photosensitive sensor 140.
  • the coil motor 130 is installed in the first mounting hole 162 of the first bracket 160.
  • the coil motor 130 has a plurality of motor pins, and the motor pins can be directly welded to corresponding pads or wires on the circuit board 120.
  • the camera module in the embodiment of the present application may not be provided with the coil motor 130. According to needs, the plurality of camera modules in the embodiment of the present application may be provided with coil motors 130 all or part of them.
  • FIG. 6 is a schematic diagram of a third structure of the first camera module in the electronic device provided by an embodiment of the application
  • FIG. 7 is an exploded schematic diagram of the first camera module shown in FIG.
  • the first camera module 110 also includes a base 112, the base 112 is mounted on the circuit board 120, the first photosensitive sensor 140 is arranged in the middle frame area in the middle of the base 112, and the first photosensitive sensor 140 is also provided with components that cooperate with it. 116.
  • a filter 114 is provided above the first photosensitive sensor 140, and the filter may be blue glass, infrared filter, or the like.
  • the first bracket 160 is installed on the base 112, and the first lens 180 is installed on the first bracket 160. It should be noted that in some other embodiments, the first camera module 110 may not be provided with the base 112, and the first bracket 160 integrates the function of the base 112.
  • FIG. 8 is a schematic diagram of another structure of a circuit board in an electronic device provided by an embodiment of the application.
  • the electronic device 100 further includes an analog-to-digital converter 152 and an image processor 154. Both the analog-to-digital converter 152 and the image processor 154 are soldered on the circuit board 120, and the analog-to-digital converter 152 is connected to the circuit board 120.
  • the first photosensitive sensor 140 is electrically connected and used to convert the signal of the first photosensitive sensor 140 into a digital signal.
  • the image processor 154 is electrically connected to the analog-to-digital converter 152 and is used to The digital signal processing of the analog-to-digital converter 152 obtains an image signal.
  • the image processor 154 is electrically connected to the control circuit 170.
  • the control circuit 170 generates an image after obtaining the image signal and displays the image on the display screen.
  • the analog-to-digital converter 152 and the image processor 154 are directly arranged on the circuit board 120, and the analog-to-digital converter 152 and the image processor 154 can be directly soldered on the circuit board by means of Surface Mounted Technology (SMT).
  • SMT Surface Mounted Technology
  • the circuit board 120 can be directly printed with circuits for functional devices such as the analog-to-digital converter 152 and the image processor 154.
  • the camera circuit of the camera module and the control circuit on the circuit board 120 can be completed through the same process.
  • FIG. 9 is a schematic structural diagram of a first camera module and a second camera module of a circuit board in an electronic device provided by an embodiment of the application.
  • the electronic device 100 may further include a second camera module 210.
  • the second camera module 210 includes a substrate 212, a second photosensitive sensor 214, a second bracket 216, and a second lens 218.
  • the second photosensitive sensor 214 And the second bracket 216 is disposed on the substrate 212, the substrate 212 is disposed on the circuit board 120, and the substrate 212 is connected to the control circuit through a connector 213.
  • the second camera module 210 has a substrate 212.
  • the second photosensitive sensor 214, the second bracket 216, and the second lens 218 of the second camera module 210 are all disposed on the substrate 212.
  • the substrate 212 of the second camera module 210 is disposed on the substrate 212.
  • the second camera module 210 is connected to the control circuit through a connector 123 (BTB connector).
  • the first camera module 110 does not have a substrate 212, and the first photosensitive sensor 140 and the first bracket 160 of the first camera module 110 are directly arranged on the circuit board 120.
  • the second camera module 210 can be used as a front camera of the electronic device 100, and the first camera module 110 can be used as a rear camera of the electronic device 100.
  • the first camera module 110 and the second camera module 210 can also be used as a front camera or a rear camera of the electronic device 100.
  • the electronic device 100 further includes a back cover 190, the back cover 190 has a light-transmitting portion 192, the first camera module 110 and the second camera module 210 are arranged adjacently, the first lens 180 and the second lens The lenses 218 are arranged directly opposite to the light-transmitting portion 192, and obtain external light signals through the light-transmitting portion 192.
  • the first lens 180 and the light-transmitting portion 192 have a first distance
  • the second The lens 218 and the transparent portion 192 have a second distance
  • the first distance is less than or equal to the second distance.
  • the size of the second camera module 210 may be smaller than that of the first camera module 110.
  • the first camera module 110 does not have a substrate 212, but the first lens 180 of the first camera module 110 is closer to the light-transmitting portion 192 of the back cover 190 than the second lens 218 of the second camera module 210, or is connected to the back cover 190 The distance of the light transmitting part 192 is the same.
  • the first distance can be understood as the coil motor 130 drives the first lens 180 to move to the first lens 180 and the light transmitting portion 192 closest to the light transmitting portion 192 the distance. If the first camera module 110 and the second camera module 210 both have a coil motor 130, the first distance can be understood as the coil motor 130 drives the first lens 180 to move to the first lens 180 and the transparent portion 192 closest to the transparent portion 192. The distance between the light portion 192 and the second distance can be understood as the distance between the second lens 218 and the light transmission portion 192 after the second lens 218 is moved closest to the light transmission portion 192 by the coil motor 130.
  • the light-transmitting portion 192 of the back cover 190 may be a protective lens, and the protective lens may be colorless and transparent glass, plastic, or the like.
  • the pixels of the first photosensitive sensor 140 are larger than the pixels of the second photosensitive sensor 214.
  • the pixels of the first photosensitive sensor 140 of the first camera module 110 may be larger than the pixels of the second photosensitive sensor 214 of the second camera module 210.
  • the higher the pixel of the camera module the larger the size and the larger the space occupied.
  • the first photosensitive sensor 140 of the first camera module 110 with higher pixels is directly soldered to the circuit board 120. The height of the first camera module 110 can be reduced.
  • FIG. 10 is another structural diagram of the first camera module and the second camera module of the circuit board in the electronic device provided by an embodiment of the application.
  • the first camera module 110 may be a main camera module and/or a wide-angle camera module
  • the second camera module 210 may be a virtual camera module and/or a close-range camera module.
  • the first camera module 110 and the second camera module 210 may be other camera modules.
  • funnel-shaped graphics at the forefront of the lens 120 in FIGS. 2, 6-7, and 8 are used to illustrate the visible range, and are not physical components.
  • the electronic device in the embodiment of the present application may further include a flash, and the flash may be arranged adjacent to the first camera module.
  • the flash can be set between the two camera modules or on one side of all camera modules.
  • FIG. 11 is a schematic diagram of a second structure of an electronic device provided by an embodiment of this application.
  • the electronic device 100 may further include a display screen 310, a middle frame 332, a main board 334, and a battery 336.
  • the display screen 310 may be installed on the middle frame 332 and connected to the back cover 170 through the middle frame 332.
  • the display screen 310 may form the display surface of the electronic device 100 for displaying information such as images and text.
  • the display screen 310 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED).
  • a cover plate may also be provided on the display screen 310.
  • the cover plate covers the display screen 310 to protect the display screen 310 from being scratched or damaged by water.
  • the cover plate may be a transparent glass cover plate, so that the user can observe the information displayed on the display screen 310 through the cover plate.
  • the cover plate may be a glass cover plate made of sapphire.
  • the middle frame 332 may have a thin plate-like or sheet-like structure, or a hollow frame structure.
  • the middle frame 332 is used to provide support for the electronic components or functional components in the electronic device 100 to install the electronic components and functional components in the electronic device 100 together.
  • the middle frame 332 and the back cover 170 can jointly form a housing of the electronic device 100, for accommodating or installing electronic components and functional components of the electronic device 100.
  • the camera, receiver, circuit board, battery and other functional components of the electronic device 100 can be mounted on the middle frame 332 or the main board 334 for fixing. It can be understood that the material of the middle frame 332 may include metal or plastic.
  • the main board 334 can be installed on the middle frame 332.
  • the main board 334 may be the circuit board of the electronic device 100 in the above embodiment.
  • the main board 334 may be integrated with one or more of functional components such as a microphone, a speaker, a receiver, a headset interface, a camera, an acceleration sensor, a gyroscope, and a processor 150.
  • the display screen 310 may be electrically connected to the main board 334 to control the display of the display screen 310 through the processor 150 on the main board 334.
  • the battery 336 may be installed on the middle frame 332. At the same time, the battery 336 is electrically connected to the main board 334 so that the battery 336 can supply power to the electronic device 100.
  • the main board 334 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 336 to various electronic components in the electronic device 100.
  • the back cover 170 may be integrally formed. During the molding process of the back cover 170, a structure such as a rear lens hole may be formed on the back cover 170, and the lens hole faces the camera module.
  • the back cover 170 may be fixedly connected to the middle frame 332 by double-sided adhesive.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

Les modes de réalisation de la présente invention concernent un dispositif électronique. Le dispositif électronique comprend une carte de circuit imprimé, un premier capteur sensible à la lumière, un premier support et une première lentille. La carte de circuit imprimé est pourvue d'un circuit de commande pour commander le dispositif électronique ; le premier capteur sensible à la lumière est lié à la carte de circuit imprimé ; le premier support est disposé sur la carte de circuit imprimé et est pourvu d'un premier trou de montage ; le premier trou de montage fait face directement au premier capteur sensible à la lumière ; la première lentille est montée dans le premier trou de montage du premier support ; la première lentille fait directement face au premier capteur sensible à la lumière.
PCT/CN2020/098199 2019-06-28 2020-06-24 Dispositif électronique WO2020259614A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910623150.0A CN110572539A (zh) 2019-06-28 2019-06-28 电子设备
CN201910623150.0 2019-06-28

Publications (1)

Publication Number Publication Date
WO2020259614A1 true WO2020259614A1 (fr) 2020-12-30

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CN110572539A (zh) * 2019-06-28 2019-12-13 RealMe重庆移动通信有限公司 电子设备
CN113126365B (zh) * 2020-01-15 2022-11-08 RealMe重庆移动通信有限公司 电子设备及其液晶显示组件
CN113784024A (zh) * 2021-08-17 2021-12-10 盐城鸿石智能科技有限公司 一种可拆卸式摄像头及其摄像系统
CN115022502B (zh) * 2022-05-25 2023-12-05 Oppo广东移动通信有限公司 摄像头模组及电子设备
CN114760406B (zh) * 2022-06-16 2022-11-15 荣耀终端有限公司 摄像组件及电子设备

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CN108668068A (zh) * 2018-08-23 2018-10-16 Oppo广东移动通信有限公司 一种摄像头模组及电子设备
CN108924404A (zh) * 2018-09-29 2018-11-30 西安易朴通讯技术有限公司 一种摄像头模组及终端
CN110572539A (zh) * 2019-06-28 2019-12-13 RealMe重庆移动通信有限公司 电子设备

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