CN210381085U - Decoration component and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a decoration subassembly and electronic equipment, decoration subassembly includes decoration body and decoration lens, the decoration lens install in on the decoration body, the decoration body has and deviates from the first sound conduction hole of decoration lens, the decoration body have with the sound conduction recess of first sound conduction hole intercommunication, the decoration lens have with the second sound conduction hole of sound conduction recess intercommunication, first sound conduction hole with the second sound conduction hole with the different positions of sound conduction recess intercommunication. The decoration component not only provides an optical path of the optical sensor, but also provides an acoustic path of the acoustic sensor, and the decoration component is matched with other components to realize an optical function and an acoustic function.

Description

Decoration component and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to decoration subassembly and electronic equipment.

Background

With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. In the daily use process of the electronic equipment, the camera shooting function of the electronic equipment is more and more important, and the requirement on the camera shooting effect is higher and higher.

Among the correlation technique, electronic equipment's the function of making a video recording uses more and more frequently in user's daily life, and electronic equipment corresponds the camera and can sets up the decoration subassembly, and the decoration subassembly can be used for guaranteeing that the camera acquires sufficient external light signal, also can protect the camera simultaneously. But the trim component requires more space and less functionality.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a decoration subassembly and electronic equipment, can cooperate other parts to provide more functions.

The embodiment of the application provides a decoration subassembly, it includes decoration body and decoration lens, the decoration lens install in on the decoration body, the decoration body has and deviates from the first sound conduction hole of decoration lens, the decoration body have with the sound conduction recess of first sound conduction hole intercommunication, the decoration lens have with the second sound conduction hole of sound conduction recess intercommunication, first sound conduction hole with the second sound conduction hole with the different positions intercommunication of sound conduction recess.

An embodiment of the present application further provides an electronic device, which includes:

a housing having an opening;

the optical sensor is arranged in the shell and is arranged opposite to the opening;

an acoustic sensor disposed within the housing and disposed opposite the opening;

the decoration assembly is installed in the opening, the decoration assembly is as described above, and the first sound transmission hole is arranged opposite to the acoustic sensor.

In the embodiment of the application, the decoration component not only provides the optical path of the optical sensor, but also provides the acoustic path of the acoustic sensor, and the decoration component is matched with other parts to realize not only the optical function, but also the acoustic function.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a schematic structural diagram of a trim component according to an embodiment of the present application.

Fig. 2 is an exploded schematic view of a trim component provided in an embodiment of the present application.

Fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 4 is a partially exploded schematic view of an electronic device according to an embodiment of the present application.

Fig. 5 is a schematic partial screenshot of an electronic device according to an embodiment of the present application.

Fig. 6 is another partially exploded schematic view of an electronic device according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a decoration element assembly and a circuit board of an electronic device according to an embodiment of the present application.

Fig. 8 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.

The embodiment of the application provides a decoration subassembly and electronic equipment. The electronic device may be a smart phone, a tablet computer, or the like, or may be a game device, an AR (Augmented Reality) device, a data storage device, an audio playing device, a video playing device, a wearable device, or the like, where the wearable device may be a smart band, smart glasses, a smart watch, or the like.

The decoration is explained in detail below. Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a decoration element according to an embodiment of the present application, and fig. 2 is an exploded schematic diagram of the decoration element according to the embodiment of the present application. The deco assembly 200 includes a deco body 220 and a deco lens 240, the deco lens 240 being mounted on the deco body 220.

The trim body 220 has a first sound transmission aperture 222 facing away from the trim lens 240, the trim body 220 has a sound conduction groove 224 in communication with the first sound transmission aperture 222, the trim lens 240 has a second sound transmission aperture 226 in communication with the sound conduction groove 224, the first and second sound transmission apertures 222, 226 being in communication with different locations of the sound conduction groove 224.

The garnish assembly 200 provides not only an optical path of the optical sensor but also an acoustic path of the acoustic sensor, and the garnish assembly 200 can perform not only an optical function but also an acoustic function in cooperation with other components. If the acoustic path is a straight strip, external sharp foreign objects may directly enter the acoustic path and damage the acoustic sensor. In the acoustic path of the present embodiment, the second sound transmission hole 226 located in the trim lens 240 and the first sound transmission hole 222 located in the trim body 220 are arranged in a staggered manner, so that the acoustic path is a curved path, and external foreign objects are not easy to enter the sound transmission path to damage the internal acoustic sensor. The first sound transmission hole 222 and the second sound transmission hole 226 are arranged in a staggered mode and communicated through the sound guide groove 224, sound signal transmission is not affected, and meanwhile dust can be prevented.

The decoration body 220 has a mounting groove 228 facing one side of the decoration lens 240, the decoration lens 240 is mounted in the mounting groove 228, the decoration body has a bottom 229 forming the mounting groove 228, the bottom 229 has a sound guide groove 224 facing one side of the decoration lens 240, and the first sound transmission hole 222 penetrates through the bottom 229.

The sound guide grooves 224 are positioned in the mounting groove 228 and face the decoration lens 240, and the first sound transmission holes 222 penetrate through the bottom 229 of the mounting groove 228, so that the decoration body with the structure is simple in structure and convenient to manufacture. Forming the mounting groove 228 and the sound guide groove 224 may be completed in one large process. For example, the installation groove 228 and the sound guide groove 224 can be formed by an external processing device, and the installation operation can be performed by adjusting the processing parameters of the external processing device, without changing the external processing device or adjusting the position of the garnish body 220 (for example, without changing the other side).

In other embodiments, the sound guide groove may be formed on the other side of the bottom, that is, the bottom has a sound guide groove on the side away from the lens of the decoration, the bottom has a sound guide through hole spaced apart from the first sound transmission hole, the sound guide through hole is located in the groove and penetrates through the bottom, and the sound guide through hole is communicated with the second sound transmission hole.

Lead the sound recess and not form towards decoration lens one side, but form deviating from decoration lens one side, lead the sound recess and be difficult to the deposition, lead the sound through-hole moreover and run through the bottom, the outward appearance dust is difficult to pile up leading the sound recess, guarantees to lead the conduction effect of sound recess sound signal.

The optical pathway of the trim component 200 is not open and does not have water ingress problems. The acoustic path of the garnish assembly 200 has a bent structure, but there is a risk of water entering, and therefore, the sealing member 260 can be added to the acoustic path to achieve a waterproof effect. Specifically, the sealing member 260 of the decoration member assembly 200 is disposed in the sound guide groove 224, the sealing member 260 is made of a waterproof sound guide material, and the sealing member 260 made of the waterproof sound guide material can achieve a waterproof effect and does not affect transmission of sound signals. The seal 260 may be a material sealing foam or the like.

The garnish body 220 may have at least two through holes 230, and the at least two through holes 230 are used to provide different types of optical sensors. For example, at least two through holes 230 are used to dispose an image pickup sensor, a light emitting sensor, and the like, respectively. For another example, the at least two through holes 230 are used to provide sensors such as a camera and a flash, respectively.

Wherein, can at least two through-holes 230 communicate, because, at least two through-holes 230 all are used for setting up optical sensor, when two optical sensor can cooperate the use, can communicate two through-holes 230 that set up two optical sensor, the corresponding optical sensor of easy to assemble. For example, two through holes 230 for arranging the camera and the flash lamp can be communicated, and the through holes 230 can be more conveniently arranged on the decoration body 220, so that the processing process is simplified.

In some embodiments, the through holes may include a first through hole for disposing the image capture sensor, a second through hole for disposing the flash, and another second through hole for disposing the laser focus sensor and/or the infrared emission sensor. Because the sizes of the image acquisition sensor, the flash lamp, the laser focusing sensor and the infrared emission sensor are different, the sizes of the correspondingly arranged through holes are also different. It will be appreciated that the size of the first through-hole is much larger than the size of the second through-hole, and that through-holes of different sizes are used for mounting different types of optical sensors. In view of the small size of the light emitting sensors such as the flash lamp, the laser focus sensor, and the infrared emission sensor, the light emitting sensor (at least one of the flash lamp, the laser focus sensor, and the infrared emission sensor) may be mounted to the garnish assembly to form a large part, and may be mounted to other devices (e.g., a mobile phone, a tablet computer, etc.) after being formed as a large part. It should be noted that the formed large component may or may not include an acoustic sensor.

An electronic device according to an embodiment of the present application is further provided, please refer to fig. 3 and fig. 4, where fig. 3 is a schematic structural diagram of the electronic device according to the embodiment of the present application, and fig. 4 is a partially exploded schematic diagram of the electronic device according to the embodiment of the present application. The electronic device includes a housing 120, an optical sensor 140, an acoustic sensor 160, and a trim component 200.

Wherein, the housing 120 has an opening 122; the optical sensor 140 is disposed in the housing 120 and opposite to the opening 122; an acoustic sensor 160 is disposed within the housing 120 and opposite the opening 122; the trim element 200 is mounted in the opening 122, and the trim element 200 may be the trim element 200 of any of the above embodiments, which will not be described herein, wherein the first sound transmission hole 222 of the trim element 200 is disposed opposite to the acoustic sensor 160.

The trim assembly 200 provides not only an optical path for the optical sensor 140 but also an acoustic path for the acoustic sensor 160, and the trim assembly 200 in combination with the optical sensor 140 and the acoustic sensor 160 can perform not only an optical function but also an acoustic function. If the acoustic path is a straight strip, external sharp foreign objects may directly enter the acoustic path and damage the acoustic sensor 160. In the acoustic path of the present embodiment, the second sound transmission hole 226 located in the trim lens 240 and the first sound transmission hole 222 located in the trim body 220 are disposed in a staggered manner, so that external foreign objects are not easy to enter the sound transmission channel and damage the acoustic sensor 160 inside. The first sound transmission hole 222 and the second sound transmission hole 226 are arranged in a staggered mode and communicated through the sound guide groove 224, sound signal transmission is not affected, and meanwhile dust can be prevented.

It should be noted that the acoustic sensor 160 may be a microphone, a speaker, an earphone, or the like. That is, the acoustic sensor 160 may be a sound generating device (i.e., an energy conversion device that converts an electric signal into a sound signal) or a sound receiving device (i.e., an energy conversion device that converts a sound signal into an electric signal).

Referring to fig. 5, fig. 5 is a schematic partial screenshot of an electronic device according to an embodiment of the present application. The optical sensor 140 may include an image capture sensor 142 and a luminescence sensor 144 disposed at intervals; the decoration body 220 of the decoration assembly has a first through hole 232 corresponding to the image capture sensor 142 and a second through hole 234 corresponding to the light emitting sensor 144. The decoration body 220 is provided with corresponding through holes corresponding to different optical sensors 140, so that the optical sensors 140 can be well installed. The through hole of the garnish body 220 is used to fix the optical sensor 140, and through holes of different sizes may be provided corresponding to different optical sensors 140. For example, the first through hole 232 corresponding to the image capturing sensor 142 has a larger size, and the second through hole 234 corresponding to the light emitting sensor 144 has a smaller size, so that the through holes 230 with different sizes can enable different optical devices to obtain better performance, and can also be used as positioning marks to determine the installation orientation of the decoration body during the installation process.

It should be noted that the number of the image capturing sensors 142 may be 1, or may be multiple, and the electronic device 100 may be provided with different numbers of image capturing sensors 142 as needed. The number of the light emitting sensors 144 may be 1, or may be plural, and the electronic device 100 may be provided with different numbers and different types of the light emitting sensors 144 as needed.

Referring to fig. 6, fig. 6 is another partially exploded schematic view of an electronic device according to an embodiment of the present disclosure. The number of the image capturing sensors 142 may be at least two, the number of the first through holes corresponds to the number of the image sensors, that is, the number is also at least two, the light emitting sensor 144 includes a flash 1442, the flash 1442 is disposed between the two image capturing sensors 142, and the second through hole 234 is disposed between the two first through holes 232.

The image pickup sensor 142 and the flash 1442 may be disposed adjacent to each other with the flash 1442 disposed between the two image pickup sensors 142, and accordingly, the second through hole 234 of the corresponding flash 1442 is located between the two first through holes 232 of the corresponding two image pickup sensors 142. The garnish body 220 may be provided in cooperation with the image pickup sensor 142 and the flash, so that the garnish body 220 does not become a member that restricts the optical sensor 140.

Wherein the second through hole 234, and the two first through holes 232 at both sides thereof may communicate with each other. The flash lamp can cooperate adjacent image acquisition sensor 142 work, and corresponding second through-hole 234 communicates with first through-hole 232, makes the better cooperation image acquisition sensor 142 of light signal of flash lamp 1442, can not improve the light signal's of flash lamp 1442 utilization ratio because the isolation part between first through-hole 232 and the second through-hole 234 shelters from partial light signal.

Of course, in other embodiments, the second through hole and the two first through holes 232 on both sides thereof may be spaced apart from each other, i.e., have a partition therebetween. The second through hole may be communicated with only one first through hole on one side thereof and spaced from one first through hole on the other side thereof.

The light emitting sensor 144 may include a laser focus sensor 1444 and/or an infrared emission sensor in addition to the flash lamp, and the laser focus sensor 1444 and/or the infrared emission sensor may interfere with the image capturing sensor 142, and thus, the second through hole 234 provided corresponding to the laser focus sensor 1444 and/or the infrared emission sensor is provided spaced apart from the first through hole 232. For example, the second through hole 234 corresponding to the laser focus sensor 1444 and/or the infrared emission sensor is provided at the bottom end of the deco body 220, and the first through hole 232 corresponding to the image pickup sensor 142 is provided at the top end of the deco body 220.

It is to be understood that the electronic device may include a trim component, an image capture sensor, a flash lamp, a laser focus sensor and/or an infrared emission sensor, an acoustic sensor, etc., the trim component including a first through hole corresponding to the image capture sensor, a second through hole corresponding to the flash lamp, a second through hole corresponding to the laser focus sensor and/or the infrared emission sensor, and a first sound transmission hole corresponding to the acoustic sensor. Because the sizes of the image acquisition sensor, the flash lamp, the laser focusing sensor and the infrared emission sensor are different, the sizes of the correspondingly arranged through holes are also different. It will be appreciated that the size of the first through-hole is much larger than the size of the second through-hole, and that through-holes of different sizes are used for mounting different types of optical sensors.

The laser focus sensor 1444 may be used to allow the image capture sensor 142 to focus faster. The infrared emission sensor can be used for realizing infrared remote control, infrared distance measurement and other functions. The light emitting device may also be a distance measuring sensor or the like.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a decoration element assembly and a circuit board of an electronic device according to an embodiment of the present disclosure. The light sensor 144 and the acoustic sensor 160 are smaller devices than the image capturing sensor 142, and the light sensor 144 and the acoustic sensor 160 can be disposed on the same circuit board 180. By providing the light emitting sensor 144 and the acoustic sensor 160 at the same time through one circuit board 180, the circuit connection can be simplified while achieving various functions.

The number of the image capturing sensors 142 may be multiple, and the circuit board 180 may also include multiple branch circuit boards 182, where each branch circuit board 182 is provided with at least one light emitting sensor 144 or acoustic sensor 160. The branching plate 182 is located between two image capturing sensors 142, or the image capturing sensors 142 are located between two branching plates 182. The light emitting sensor 144 and the acoustic sensor 160 are smaller devices than the image capturing sensor 142, and the space utilization rate can be improved by accommodating the light emitting sensor 144 and the acoustic sensor 160 in the space between the image capturing sensors 142.

The image capturing sensor 142 may be a camera, the camera may include a main body 1422 and a lens 1424, the main body 1422 is larger than the lens 1424, the lens 1424 of the camera faces the trim lens 240, and the branch circuit board 182 of the circuit board 180 and the light emitting sensor 144 and the acoustic sensor 160 disposed thereon may be disposed in a space between the lenses 1424, so as to improve the stacking utilization rate and maximize the use of the space. A motor may be included in main body 1422, and may be used to drive lens 1424 to move for an auto-focus function.

The light emitting sensor 144 and the acoustic sensor 160 may be disposed on the main body part 1422 of the camera, enhancing the mounting stability thereof.

It should be noted that, the decoration assembly 200 is disposed corresponding to the acoustic sensor 160 and the plurality of optical sensors 140, the decoration body and the decoration lens 240 can be widened, and the acoustic sensor 160 and the plurality of optical sensors 140 (such as a laser focusing sensor, a flash lamp, and a microphone) are integrated in the decoration body, so as to improve the stacking utilization rate.

The number of the image capturing sensors 142 may be three, the light emitting sensor 144 may include a laser focusing sensor and a flash lamp, the sound is emitted from the decoration lens 240 by providing an acoustic path on the decoration body 220, the laser focusing sensor is also placed below the decoration lens 240 and emits light through the decoration lens 240, and the flash lamp is also placed below the decoration lens 240 and emits light through the decoration lens 240. The acoustic sensor 160 is disposed between the laser focus sensor and the flash lamp. The three image capturing sensors 142, the flash lamp, and the laser focusing sensor may be arranged substantially on the same column, and the acoustic sensor 160 is arranged on one side, i.e. not on the same column as the image capturing sensors 142, so as to facilitate the arrangement of the acoustic path.

It should be noted that the image capture sensor may be one or more of a main camera module, a long-focus camera module, a depth-of-field camera module, a macro camera module, a TOF (time of flight) camera module, and a blurring camera module.

It can be understood that the decoration component can be arranged on the rear cover of the electronic equipment, namely, the rear camera module, and the decoration component can also be arranged on the front cover of the electronic equipment, namely, the front camera module.

Referring to fig. 8, fig. 8 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 100 may further include a display screen 110, a middle frame 132, a circuit board 134, and a battery 136.

Wherein the display screen 110 may be mounted on the middle frame 132 and connected to the rear cover through the middle frame 132, the display screen 110 may form a display surface of the electronic device 100 for displaying information such as images, texts, etc. The Display screen 110 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display screen.

It is understood that a cover plate may also be disposed on the display screen 110. The cover plate covers the display screen 110 to protect the display screen 110 and prevent the display screen 110 from being scratched or damaged by water. Wherein the cover may be a clear glass cover so that a user may view the information displayed by the display screen 110 through the cover. For example, the cover plate may be a glass cover plate of sapphire material.

The middle frame 132 may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The middle frame 132 is used for providing a supporting function for the electronic components or functional assemblies in the electronic device 100, so as to mount the electronic components or functional assemblies in the electronic device 100 together.

Wherein, the middle frame 132 and the rear cover may together form a housing of the electronic device 100 for accommodating or mounting electronic elements, functional components, and the like of the electronic device 100. In addition, functional components such as a camera, a receiver, a circuit board, a battery, and the like of the electronic apparatus 100 may be mounted on the center frame 132 or the circuit board 134 for fixation. It is understood that the material of the middle frame 132 may include metal or plastic.

The circuit board 134 may be mounted on the middle frame 132. The circuit board 134 may be a motherboard of the electronic device 100. One or more of the functional components such as a microphone, a speaker, a receiver, an earphone interface, a camera, an acceleration sensor, a gyroscope, and the processor 150 may be integrated on the circuit board 134. Meanwhile, the display screen 110 may be electrically connected to the circuit board 134 to control the display of the display screen 110 by the processor 150 on the circuit board 134.

The battery 136 may be mounted on the center frame 132. Meanwhile, the battery 136 is electrically connected to the circuit board 134 to enable the battery 136 to power the electronic device 100. The circuit board 134 may be provided thereon with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 136 to the various electronic components in the electronic device 100.

The rear cover may be integrally formed. In the forming process of the rear cover, a decoration component opening structure can be formed on the rear cover, and the lens hole is just opposite to the camera module. The rear cover can be fixedly connected with the middle frame through double-sided back glue.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The wearable electronic device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (14)

1. The decoration component is characterized by comprising a decoration body and a decoration lens, wherein the decoration lens is installed on the decoration body, the decoration body is provided with a first sound transmission hole deviating from the decoration lens, the decoration body is provided with a sound conduction groove communicated with the first sound transmission hole, the decoration lens is provided with a second sound transmission hole communicated with the sound conduction groove, and the first sound transmission hole and the second sound transmission hole are communicated with different positions of the sound conduction groove.

2. A decorative element assembly according to claim 1, wherein the decorative element body has a mounting groove facing a side of the decorative element lens, the decorative element lens is mounted in the mounting groove, the decorative element originally has a bottom portion forming the mounting groove, the bottom portion has the sound guide groove facing the side of the decorative element lens, and the first sound transmission hole penetrates the bottom portion.

3. A decorative element assembly according to claim 1 wherein the decorative element body has a mounting groove facing a side of the decorative element lens, the decorative element lens is mounted in the mounting groove, the decorative element has a base portion forming the mounting groove, the base portion has the sound guide recess on a side facing away from the decorative element lens, the base portion has a sound guide through hole spaced from the first sound transmission hole, the sound guide through hole is located in the recess and extends through the base portion, and the sound guide through hole communicates with the second sound transmission hole.

4. A decorative element assembly according to any one of claims 1 to 3 further comprising a sealing element disposed within the sound guiding recess, the sealing element being of a water resistant sound guiding material.

5. A trim component according to claim 1 wherein the trim body further has at least two through holes for providing different types of optical sensors.

6. A decorative piece assembly according to claim 5, wherein the through holes comprise at least two first through holes for providing an image capture sensor and at least two second through holes, one for providing a flash and the other for providing a laser focus sensor and/or an infrared emission sensor.

7. A trim assembly according to claim 5 wherein at least two of the through holes communicate.

8. An electronic device, comprising:

a housing having an opening;

the optical sensor is arranged in the shell and is arranged opposite to the opening;

an acoustic sensor disposed within the housing and disposed opposite the opening;

a trim component mounted within the opening, the trim component according to any of claims 1-7, the first sound-transmitting aperture being disposed opposite the acoustic sensor.

9. The electronic device of claim 8, wherein the optical sensor comprises an image capture sensor and a light sensor spaced apart;

the decoration body of the decoration assembly corresponds to the image acquisition sensor and is provided with a first through hole, and the decoration body of the decoration assembly corresponds to the light-emitting sensor and is provided with a second through hole.

10. The electronic device according to claim 9, wherein the number of the image capturing sensors is at least two, the number of the first through holes is at least two, the light emitting sensor includes a flash lamp, the flash lamp is disposed between the two image capturing sensors, and the second through hole is disposed between the two first through holes.

11. The electronic device according to claim 10, wherein the second through hole and the two first through holes on both sides thereof communicate with each other.

12. The electronic device according to any one of claims 9 to 11, wherein the light emitting sensor comprises a laser focus sensor and/or an infrared emission sensor, and the second through hole corresponding to the laser focus sensor and/or the infrared emission sensor is spaced apart from the first through hole.

13. The electronic device of any of claims 9-11, wherein the light emitting sensor and the acoustic sensor are disposed on a same circuit board.

14. The electronic device of claim 13, wherein the number of the image capturing sensors is plural, the circuit board comprises a plurality of branch circuit boards, and each branch circuit board is provided with at least one of the light emitting sensor or the acoustic sensor;

the branch circuit board is located between the two image acquisition sensors, or the image acquisition sensors are located between the two branch circuit boards.

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