CN117793224A - Electronic equipment - Google Patents

Abstract

The application provides electronic equipment for reduce the occupation space of speaker module and camera module on the circuit board, reduce the occupation space of circuit board inside electronic equipment, increase power module can be at the inside occupation space of electronic equipment, help promoting power module's capacity, improve electronic equipment's duration. The electronic equipment comprises a shell, a circuit board, a loudspeaker module and a camera module, wherein the circuit board, the loudspeaker module and the camera module are all installed in the shell. The housing includes a frame. The circuit board is mounted on the frame. The circuit board is provided with a first avoidance hole and a second avoidance hole, and the first avoidance hole and the second avoidance hole penetrate through the circuit board along a first direction. Along the second direction, the first and second relief holes at least partially overlap. The speaker module comprises a first speaker unit which is arranged on the frame body and penetrates through the first avoidance hole. The camera shooting module is arranged on the frame body and penetrates through the second avoidance hole.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the continuous development of science and technology, electronic devices such as mobile phones are widely applied to daily lives and works of people, and have become indispensable daily necessities for people. In the current electronic equipment, the loudspeaker module and the camera module occupy a large amount of space of the circuit board, so that the occupied space of the circuit board in the electronic equipment is increased, the occupied space of the power supply module in the electronic equipment is greatly compressed, the capacity of the power supply module is limited, and the cruising ability of the electronic equipment is reduced.

Disclosure of Invention

The application provides electronic equipment for reduce the occupation space of speaker module and camera module on the circuit board, reduce the occupation space of circuit board inside electronic equipment, increase power module can be at the inside occupation space of electronic equipment, help promoting power module's capacity, improve electronic equipment's duration.

In a first aspect, the application provides an electronic device, including casing, circuit board, speaker module and module of making a video recording, circuit board, speaker module and the inside of making a video recording the module and all installing in the casing. The housing includes a frame. The circuit board is mounted on the frame. The circuit board is provided with a first avoidance hole and a second avoidance hole, and the first avoidance hole and the second avoidance hole penetrate through the circuit board along a first direction. Along the second direction, the first and second relief holes at least partially overlap. The speaker module comprises a first speaker unit which is arranged on the frame body and penetrates through the first avoidance hole. The camera shooting module is arranged on the frame body and penetrates through the second avoidance hole.

In the electronic equipment shown in the application, along the second direction, the first avoidance hole and the second avoidance hole are at least partially overlapped. That is, at least part of the first avoidance holes multiplex the space of the second avoidance holes in the second direction, so that the space occupation of the first avoidance holes and the second avoidance holes on the circuit board in the second direction is reduced, the size of the circuit board in the second direction is reduced, the space occupation of the circuit board in the electronic equipment in the second direction is reduced, the occupied space of the power supply module in the electronic equipment is increased, the capacity of the power supply module is improved, and the cruising ability of the electronic equipment is improved.

In addition, along the second direction, at least part of the first avoidance hole and the second avoidance hole overlap, which means that the projection of the first avoidance hole on the plane perpendicular to the second direction at least partially overlaps with the projection of the second avoidance hole on the plane perpendicular to the second direction.

The frame body may be a middle frame of the electronic device, or the frame body may be other structural members of the electronic device that play a supporting role.

The camera module is a rear camera of the electronic equipment.

It should be noted that, penetrating means penetrating, for example, the first speaker unit penetrates the first avoidance hole means that the first speaker unit penetrates the first avoidance hole, and at this time, the first speaker unit may penetrate the first avoidance hole along the first direction.

In one embodiment, the first speaker unit and the camera module at least partially overlap in the second direction. That is, at least part of the first speaker unit multiplexes the space of the camera module in the second direction, so as to reduce the space occupation of the first speaker unit and the camera module on the circuit board in the second direction, which is helpful to reduce the size of the circuit board in the second direction, and further is helpful to reduce the space occupation of the circuit board in the electronic device in the second direction, increase the occupied space of the power module in the electronic device, and improve the capacity of the power module and the cruising ability of the electronic device.

In one embodiment, the speaker module further includes a second speaker unit, where the second speaker unit is located on a side of the circuit board facing away from the frame body, and in a second direction, the second speaker unit at least partially overlaps the second avoidance hole. That is, at least part of the second speaker units multiplex the space of the second avoidance holes in the second direction, so as to reduce the space occupation of the second speaker units and the second avoidance holes on the circuit board in the second direction, thereby being beneficial to reducing the size of the circuit board in the second direction, further being beneficial to reducing the space occupation of the circuit board in the electronic equipment in the second direction, increasing the occupied space of the power supply module in the electronic equipment, improving the capacity of the power supply module and improving the cruising ability of the electronic equipment.

In one embodiment, the second speaker unit completely overlaps the second avoidance hole in the second direction. That is, the second speaker unit completely multiplexes the space of the second avoidance hole in the second direction, so as to further reduce the space occupation of the second speaker unit and the second avoidance hole on the circuit board in the second direction, which is helpful to reduce the size of the circuit board in the second direction, and further is helpful to reduce the space occupation of the circuit board in the electronic device in the second direction, increase the occupied space of the power module in the electronic device, increase the capacity of the power module, and increase the cruising ability of the electronic device.

In an embodiment, electronic equipment still includes support and decoration, and the support is equipped with dodges the hole, dodges the hole and runs through the support along first direction, and support mounting is in the surface that the circuit board deviates from the framework, and the hole is dodged still worn to locate to the module of making a video recording, and the decoration is installed in the surface that the support deviates from the circuit board, and covers support and the module of making a video recording to improve electronic equipment's appearance exquisite degree.

In one embodiment, the bracket is provided with a through hole penetrating the bracket along a first direction, and the second speaker unit is mounted on the bracket and covers the through hole;

the decoration is equipped with speaker groove and speaker hole, and speaker groove sets up with the through-hole relatively, and forms the front sound chamber of second speaker unit with the through-hole, and the outside of speaker hole intercommunication second speaker unit's front sound chamber and decoration.

The sound that the second speaker unit during operation produced can be transmitted to the outside of electronic equipment from the front sound chamber of second speaker unit from the loudspeaker hole, that is, the sound that the second speaker unit during operation produced can be transmitted to the outside of electronic equipment through-hole, loudspeaker groove and loudspeaker hole in proper order to realize the sound production of second speaker unit.

In one embodiment, the stand is provided with a sound cavity groove, the second speaker unit is mounted to the stand and covers an opening of the sound cavity groove, and the sound cavity groove forms a front sound cavity of the second speaker unit.

The decoration is provided with a loudspeaker hole which is communicated with the front sound cavity of the second loudspeaker unit and the outside of the decoration.

The sound that the second speaker unit during operation produced can be transmitted to the outside of electronic equipment from the front sound chamber of second speaker unit from the hole of raising one's voice, that is, the sound that the second speaker unit during operation produced can be transmitted to the outside of electronic equipment through sound chamber groove and hole of raising one's voice in proper order to realize the sound production of second speaker unit.

In one embodiment, the bracket is further provided with a communication hole, and the communication hole is communicated with the sound cavity groove and the loudspeaker hole.

The sound that the second speaker unit during operation produced can be followed the preceding sound chamber of second speaker unit and passed to electronic equipment's outside from intercommunicating pore and loudspeaker hole, and the sound that the second speaker unit during operation produced promptly can be passed to electronic equipment's outside through sound chamber groove, intercommunicating pore and loudspeaker hole in proper order to realize the sound production of second speaker unit.

In one embodiment, the bracket is provided with a sound cavity groove, the second speaker unit is mounted on the bracket and covers the opening of the sound cavity groove, and the sound cavity groove forms a front sound cavity of the second speaker unit;

the frame body is provided with a loudspeaker hole, and the loudspeaker hole is communicated with the front sound cavity of the second loudspeaker unit and the outside of the frame body.

The sound that the second speaker unit during operation produced can be transmitted to the outside of electronic equipment from the front sound chamber of second speaker unit from the hole of raising one's voice, that is, the sound that the second speaker unit during operation produced can be transmitted to the outside of electronic equipment through sound chamber groove and hole of raising one's voice in proper order to realize the sound production of second speaker unit.

In one embodiment, the bracket is further provided with a communication hole, and the communication hole is communicated with the sound cavity groove and the loudspeaker hole.

The sound that the second speaker unit during operation produced can be passed to electronic equipment's outside from the preceding sound chamber of second speaker unit through intercommunicating pore and loudspeaker hole in proper order, and the sound that the second speaker unit during operation produced promptly can be passed to electronic equipment's outside through sound chamber groove, intercommunicating pore and loudspeaker hole in proper order to realize the sound production of second speaker unit.

In one embodiment, the circuit board is provided with a through hole penetrating the circuit board along a first direction and communicating the communication hole and the speaker hole.

The sound that the second speaker unit during operation produced can be passed to electronic equipment's outside from the front sound chamber of second speaker unit through intercommunicating pore, through-hole and loudspeaker hole in proper order, that is, the sound that the second speaker unit during operation produced can pass through sound chamber groove, intercommunicating pore, through-hole and loudspeaker hole in proper order and pass to electronic equipment's outside to realize the sound production of second speaker unit.

In one embodiment, the frame body is further provided with a speaker groove, and the speaker groove is communicated with the through hole and the speaker hole.

The sound that the second speaker unit during operation produced can be passed to electronic equipment's outside from the preceding sound chamber of second speaker unit through intercommunicating pore, through-hole, speaker groove and speaker hole in proper order, and the sound that the second speaker unit during operation produced promptly can be passed to electronic equipment's outside through sound chamber groove, intercommunicating pore, through-hole, speaker groove and speaker hole in proper order to realize the sound production of second speaker unit.

In one embodiment, the second speaker unit is spaced apart from the circuit board along the first direction. The electronic device of the electronic equipment can be arranged on the circuit board and positioned between the second loudspeaker unit and the circuit board, so that the space utilization rate of the interior of the electronic equipment is improved, and the integration level of the electronic equipment is improved.

In one embodiment, the first speaker unit is a tweeter unit and the second speaker unit is a full frequency unit. The second speaker unit can be used for sounding in cooperation with the first speaker unit, so that the power consumption of the speaker module can be reduced, and the duration of the electronic equipment can be prolonged.

In one embodiment, the first speaker unit is a full frequency unit and the second speaker unit is a full frequency unit. The loudspeaker module can realize three-channel sounding, and is favorable for improving sounding quality of the loudspeaker module.

In one embodiment, the frame is provided with a through slot penetrating the frame in a first direction, the first speaker unit covers the through slot, and the through slot forms a front sound cavity of the first speaker unit;

the frame body is equipped with the play sound hole, or, electronic equipment still includes the display module assembly, and the display module assembly is installed in the upper surface of frame body, and the display module assembly is equipped with out the sound hole, and it runs through the display module assembly to go out the sound hole along first direction, or, the display module assembly encloses with the frame body and closes and form out the sound hole, or, electronic equipment still includes the auxiliary member, and the auxiliary member is installed in the frame body, and encloses with the frame body and close and form out the sound hole, goes out the preceding sound chamber of sound hole intercommunication first speaker unit.

Wherein, the auxiliary piece can be a cover plate made of polycarbonate, or the auxiliary piece can be a Mylar.

The sound that the first speaker unit during operation produced can be transmitted to the outside of electronic equipment from the front sound chamber of first speaker unit through the sound hole, that is, the sound that the first speaker unit during operation produced can be transmitted to the outside of electronic equipment through logical groove and sound hole in proper order to realize the sound production of first speaker unit.

In one embodiment, the frame body is further provided with a communication groove, and the communication groove is communicated with the communication groove and the sound outlet hole.

The sound that first speaker unit during operation produced can be followed the sound cavity of first speaker unit and passed to electronic equipment's outside through intercommunication groove and play sound hole, that is, the sound that first speaker unit during operation produced can pass through the outside of logical groove, intercommunication groove and play sound hole in proper order to realize the sound production of first speaker unit.

In one embodiment, the width direction of the electronic device is an X-axis direction, the length direction of the electronic device is a Y-axis direction, the X-axis direction and the Y-axis direction form an XY plane, and the second direction is parallel to the XY plane.

Wherein the second direction is parallel to the Y-axis direction, or the second direction is parallel to the X-axis direction.

In one embodiment, the first avoidance hole and the second avoidance hole are arranged at intervals, and the distance between the first avoidance hole and the second avoidance hole is equal to or greater than 3mm. And the distance between the first avoidance hole and the second avoidance hole along the X-axis direction is equal to or greater than 3mm. In the second direction, a distance between the first avoidance hole and the second avoidance hole is equal to or greater than 3mm.

It should be noted that, the circuit board is located the first portion of dodging between hole and the second and dodges the hole, is used for walking circuits such as radio frequency signal line and control line generally, and the distance between hole is dodged to first and second is equal to or greater than 3mm, can be convenient for arrange circuits such as radio frequency signal line and control line, guarantees the reliability in use of circuit board.

In one embodiment, the first avoidance hole is positioned at the top of the circuit board, the second avoidance hole is positioned at the middle of the circuit board, and the second avoidance hole is arranged at intervals with the bottom end surface of the circuit board.

It should be noted that, devices such as a charging chip and a BTB connector may be located between the second avoidance hole and the bottom end surface of the circuit board. It should be understood that the charging chip can reduce the charging impedance of the electronic device, and since at least part of the first avoidance holes multiplex the space of the second avoidance holes in the second direction, more space can be reserved on the circuit board in the axial direction to mount the charging chip, which is beneficial to increasing the size of the charging chip in the second direction and further is beneficial to improving the charging power of the electronic device.

In one embodiment, the electronic device further includes a power module, and the power module is mounted on the frame and arranged along the second direction with the circuit board.

In one embodiment, the electronic device further comprises a rear cover, the rear cover is provided with an avoidance hole, the avoidance hole penetrates through the rear cover along the display module, the rear cover is mounted on the lower surface of the frame body, and the camera module penetrates through the avoidance hole of the rear cover.

Drawings

In order to more clearly describe the technical solutions of the embodiments of the present application, the following description will describe the drawings that are required to be used in the embodiments of the present application.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic view of the electronic device of FIG. 1 at another angle;

FIG. 3 is an exploded view of the electronic device of FIG. 1;

FIG. 4 is a schematic view of a frame of the electronic device shown in FIG. 3;

FIG. 5 is a schematic view of the frame of FIG. 4 at another angle;

FIG. 6 is a schematic view of the structure of the rear cover in the electronic device shown in FIG. 3;

FIG. 7 is a schematic diagram of a display module in the electronic device shown in FIG. 3;

FIG. 8 is a schematic diagram of a circuit board in the electronic device shown in FIG. 3;

FIG. 9 is a schematic diagram of an assembly structure of a frame, a circuit board, a camera module, a speaker module, and a power module in the electronic device shown in FIG. 3;

FIG. 10 is a schematic view of the structure of a cradle in the electronic device shown in FIG. 3;

FIG. 11 is a schematic view of the bracket of FIG. 10 at another angle;

FIG. 12 is a schematic diagram of an assembled structure of a frame, a circuit board, a bracket, a camera module, a speaker module, and a power module in the electronic device shown in FIG. 3;

FIG. 13 is a schematic view of the structure of the decoration in the electronic device shown in FIG. 3;

FIG. 14 is a schematic view of the trim piece of FIG. 13 at another angle;

FIG. 15 is a schematic cross-sectional view of the electronic device of FIG. 2 taken along line I-I;

FIG. 16 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line II-II;

fig. 17 is a schematic structural diagram of a frame in a second electronic device according to an embodiment of the present application;

FIG. 18 is a schematic view of the frame of FIG. 17 at another angle;

fig. 19 is a schematic structural diagram of a circuit board in a second electronic device according to an embodiment of the present application;

fig. 20 is a schematic diagram of an assembly structure of a frame, a circuit board, a camera module, a speaker module, and a power module in a second electronic device according to an embodiment of the present disclosure;

fig. 21 is a schematic structural diagram of a bracket in a second electronic device according to an embodiment of the present application;

FIG. 22 is a schematic view of the bracket of FIG. 21 at another angle;

fig. 23 is a schematic cross-sectional structure of a second electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of an electronic device 1000 according to an embodiment of the present application, fig. 2 is a schematic structural diagram of the electronic device 1000 shown in fig. 1 at another angle, and fig. 3 is an exploded structural diagram of the electronic device 1000 shown in fig. 1.

The electronic device 1000 may be an electronic product such as a mobile phone, a tablet computer, a notebook computer, a car phone, a smart watch, a smart bracelet, a POS machine (point of sales terminal, point of sale terminal), etc. Next, the embodiment of the present application will be described taking the electronic device 1000 as an example of a mobile phone. For convenience of description, a width direction of the electronic device 1000 is defined as an X-axis direction, a length direction of the electronic device 1000 is defined as a Y-axis direction, a thickness direction of the electronic device 1000 is defined as a Z-axis direction, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other, the X-axis direction and the Y-axis direction form an XY plane, the X-axis direction and the Z-axis direction form an XZ plane, and the Y-axis direction and the Z-axis direction form a YZ plane.

The electronic device 1000 includes a housing 100, a display module 200, a circuit board 300, a stand 400, a processor (not shown), a camera module 500, a speaker module 600, a power module 700, and a decoration 800. The display module 200 is mounted at one side of the case 100. The circuit board 300, the bracket 400, the processor, the camera module 500, the speaker module 600 and the power module 700 are all mounted on the inner side of the housing 100. The processor may be mounted to the circuit board 300 and electrically connected to the circuit board 300. The processor may be a CPU (central processing unit ) of the electronic device 1000. The decoration 800 is installed at the other side of the case 100 and covers the bracket 400.

Referring to fig. 3, fig. 4 and fig. 5, fig. 4 is a schematic structural view of the housing 110 in the electronic device 1000 shown in fig. 3, and fig. 5 is a schematic structural view of the housing 110 shown in fig. 4 at another angle.

The housing 100 includes a frame 110 and a rear cover 120, and the rear cover 120 is mounted to the frame 110. The housing 110 is provided with a first mounting groove 1101 and a second mounting groove 1102. The openings of the first mounting groove 1101 and the second mounting groove 1102 are located on the lower surface (not shown) of the frame 110. The first mounting groove 1101 and the second mounting groove 1102 are each recessed from the lower surface of the housing 110 in the direction (the positive Z-axis direction in the drawing) of the upper surface (not shown). The first mounting groove 1101 is located on one side of the second mounting groove 1102 facing the Y-axis positive direction, and is spaced apart from the second mounting groove 1102. The housing 110 is illustratively a center of the electronic device 1000. In other embodiments, the housing 110 may be other structural members for supporting the electronic device 1000.

In this application, terms such as "top", "bottom", "upper", "lower", "left" and "right" are used in the description of the directions shown in fig. 1, and are not intended to limit the application because they are used to indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and be "top" in the positive direction of the Y axis, be "bottom" in the negative direction of the Y axis, be "up" in the positive direction of the Z axis, be "down" in the negative direction of the Z axis, be "right" in the positive direction of the X axis, or be "left" in the negative direction of the X axis.

In this embodiment, the bottom wall (not shown) of the first mounting groove 1101 is provided with a fitting projection 111. The fitting projection 111 extends from the bottom wall of the first mounting groove 1101 toward the opening direction (negative Z-axis direction in the drawing) of the first mounting groove 1101. Specifically, the fitting projection 111 is located on top of the first mounting groove 1101 and is connected to the groove side wall of the first mounting groove 1101. Wherein the height of the fitting projection 111 is smaller than the depth of the first mounting groove 1101. Illustratively, the mounting tab 111 is square. In other embodiments, the mounting tab 111 may be circular or other shapes.

The housing 110 is further provided with a mounting groove 1103, a communication groove 1104, and a through groove 1105. The opening of the mounting groove 1103 is located on the lower surface (not shown) of the fitting projection 111. The mounting groove 1103 is recessed from the lower surface of the fitting projection 111 toward the upper surface of the housing 110 (positive Z-axis direction in the drawing). The communication groove 1104 and the communication groove 1105 are both located at the top of the frame 110. The opening of the communication groove 1104 is located on the upper surface of the frame 110. The communication groove 1104 is recessed from the upper surface of the housing 110 toward the lower surface (negative Z-axis direction in the drawing). The through groove 1105 penetrates the frame 110 in the first direction, and communicates the mounting groove 1103 and the communication groove 1104. Wherein the through groove 1105 penetrates the bottom wall of the mounting groove 1103 and the upper surface of the housing 110. Illustratively, the first direction is the illustrated Z-axis direction, i.e., the first direction is the thickness direction of the electronic device 1000.

Referring to fig. 3 and 6, fig. 6 is a schematic structural diagram of the rear cover 120 in the electronic device 1000 shown in fig. 3.

In this embodiment, the rear cover 120 may be a battery cover of the electronic device 1000. The rear cover 120 is provided with a relief hole 1201, and the relief hole 1201 is located at the top of the rear cover 120. The opening of the escape hole 1201 is located on the upper surface (not shown) of the rear cover 120. The escape hole 1201 is recessed from the upper surface of the rear cover 120 toward the lower surface (not shown) in a direction (negative Z-axis direction shown) and penetrates the lower surface of the rear cover 120. That is, the escape hole 1201 penetrates the rear cover 120 in the first direction. Illustratively, the relief hole 1201 is a square hole. In other embodiments, the relief hole 1201 may also be a circular hole or other shaped hole.

Specifically, the rear cover 120 is mounted to one side of the frame 110. Wherein, the rear cover 120 covers the second mounting groove 1102, and the avoidance hole 1201 communicates with the first mounting groove 1101. Illustratively, the rear cover 120 may be removably mounted to the frame 110 to facilitate maintenance and replacement of components or modules within the electronic device 1000.

Referring to fig. 3 and fig. 7, fig. 7 is a schematic structural diagram of the display module 200 in the electronic device 1000 shown in fig. 3.

In this embodiment, the display module 200 may be a display screen such as an LCD (liquid crystal display) or an OLED (organic light-emitting diode) and is used for displaying information such as images or text. The display module 200 is provided with a sound outlet 2001, and the sound outlet 2001 is located at the top of the display module 200. Specifically, the opening of the sound outlet 2001 is located on the lower surface (not shown) of the display module 200. The sound emitting hole 2001 is recessed from the lower surface of the display module 200 toward the upper surface (not shown) (positive Z-axis direction shown) and penetrates the upper surface of the display module 200. That is, the sound emitting hole 2001 penetrates the display module 200 in the first direction (the Z-axis direction in the drawing). The sound emitting hole 2001 also penetrates the top surface of the display module 200. In other embodiments, the sound outlet 2001 may not penetrate the top surface of the display module 200.

The display module 200 is mounted on the other side of the frame 110. That is, the display module 200 is mounted on a side of the frame 110 facing away from the rear cover 120. That is, the display module 200 and the rear cover 120 are respectively mounted to opposite sides of the frame 110. When a user uses the electronic device 1000, the display module 200 is placed toward the user, and the rear cover 120 is placed away from the user. Wherein, the sound outlet 2001 of the display module 200 is communicated with the communication groove 1104 (as shown in fig. 5) of the frame 110.

In other embodiments, the display module 200 may not be provided with a sound outlet 2001, the top of the display module 200 and the top of the frame 110 enclose the sound outlet 2001, or the frame 110 is provided with the sound outlet 2001, or the electronic device 1000 may include an auxiliary member mounted on the frame 110 and enclosed with the frame 110 to form the sound outlet 2001, where the auxiliary member may be a cover plate made of Polycarbonate (PC), or the auxiliary member may be a mylar sheet. The structure of the sound outlet 2001 is not particularly limited in this application.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a circuit board 300 in the electronic device 1000 shown in fig. 3.

The circuit board 300 may be a main board (main board) of the electronic device 1000. The circuit board 300 is provided with a first avoidance hole 3001 and a second avoidance hole 3002, and the first avoidance hole 3001 and the second avoidance hole 3002 are arranged at intervals. Openings of the first avoidance holes 3001 and the second avoidance holes 3002 are located on an upper surface (not shown) of the circuit board 300. The first and second escape holes 3001 and 3002 are each recessed from the upper surface of the circuit board 300 toward the lower surface (not shown) in a direction (negative Z-axis direction in the drawing) and penetrate the lower surface of the circuit board 300. That is, the first escape holes 3001 and the second escape holes 3002 each penetrate the circuit board 300 in the thickness direction (Z-axis direction in the drawing) of the circuit board 300.

The first avoidance hole 3001 is located at the top of the circuit board 300 and penetrates through a top end surface (not shown) of the circuit board 300. The second escape hole 3002 is located in the middle of the circuit board 300. The second escape holes 3002 are spaced apart from a bottom end surface (not shown) of the circuit board 300. Note that, the electronic device 1000 may further include a device such as a charging chip and a BTB (board to board) connector, and the device such as the charging chip and the BTB connector may be located between the second avoidance hole 3002 and a bottom end surface (not shown) of the circuit board 300. It should be appreciated that the charging chip may reduce the charging impedance of the electronic device 1000, and since at least part of the first avoidance holes 3001 multiplex the space of the second avoidance holes 3002 in the Y-axis direction, more space may be reserved on the circuit board 300 in the Y-axis direction to mount the charging chip, which is helpful for increasing the size of the charging chip in the Y-axis direction, and thus is helpful for increasing the charging power of the electronic device 1000.

The first avoidance holes 3001 and the second avoidance holes 3002 are arranged at intervals, and the distance between the first avoidance holes 3001 and the second avoidance holes 3002 is equal to or greater than 3mm. Specifically, in the X-axis direction, the distance between the first avoidance hole 3001 and the second avoidance hole 3002 is w. In the Y-axis direction, the distance between the first avoidance hole 3001 and the second avoidance hole 3002 is h. Wherein w is equal to or greater than 3mm and h is equal to or greater than 3mm. It should be noted that, the portion of the circuit board 300 located between the first avoidance hole 3001 and the second avoidance hole 3002 is generally used for routing the circuits such as the radio frequency signal line and the control line, where the distance between the first avoidance hole 3001 and the second avoidance hole 3002 is equal to or greater than 3mm, so that the circuits such as the radio frequency signal line and the control line can be conveniently arranged, and the reliability of the circuit board 300 is ensured.

Further, in the second direction, the first escape holes 3001 and the second escape holes 3002 partially overlap. That is, part of the first avoidance holes 3001 multiplex the space of the second avoidance holes 3002 in the second direction, so as to reduce the space occupation of the first avoidance holes 3001 and the second avoidance holes 3002 on the circuit board 300 in the second direction, which is helpful for reducing the size of the circuit board 300 in the second direction. Illustratively, the second direction is parallel to the Y-axis direction, i.e., the second direction is the length direction of the electronic device 1000. In other embodiments, the second direction may also be the X-axis direction, as long as the second direction is parallel to the XY plane.

It can be appreciated that in the second direction of the electronic device 1000, there are mainly two components of the circuit board 300 and the power module 700, and since the size of the circuit board 300 in the second direction is reduced, the occupied space of the power module 700 in the second direction can be increased, the capacity of the power module 700 is improved, and the cruising ability of the electronic device 1000 is improved.

It should be noted that, along the second direction, the first avoidance hole 3001 and the second avoidance hole 3002 partially overlap, that is, the projection of the first avoidance hole 3001 on a plane (XZ plane) perpendicular to the second direction coincides with the projection of the second avoidance hole 3002 on a plane perpendicular to the second direction, which will be understood in the same manner as described below.

In other embodiments, along the second direction, the first avoidance hole 3001 and the second avoidance hole 3002 completely overlap, that is, the first avoidance hole 3001 completely multiplexes the space of the second avoidance hole 3002 in the second direction, so as to maximally reduce the space occupation of the first avoidance hole 3001 and the second avoidance hole 3002 on the circuit board 300 in the second direction, which is not particularly limited herein, so long as the first avoidance hole 3001 and the second avoidance hole 3002 at least partially overlap along the second direction.

Referring to fig. 8 and 9, fig. 9 is a schematic diagram illustrating an assembly structure of the frame 110, the circuit board 300, the camera module 500, the speaker module 600 and the power module 700 in the electronic device 1000 shown in fig. 3.

The circuit board 300, the camera module 500 and the speaker module 600 are all mounted in the first mounting groove 1101 of the frame 110, and the power module 700 is mounted in the second mounting groove 1102 of the frame 110 and is arranged at intervals along the second direction with the circuit board 300. Specifically, the circuit board 300 is mounted to a bottom wall (not shown) of the first mounting groove 1101. The first avoidance hole 3001 of the circuit board 300 is avoided from the fitting protrusion 111 of the frame 110. That is, the fitting projection 111 is inserted into the first escape hole 3001 of the circuit board 300.

It should be noted that, in the embodiment of the present application, the penetrating means that the fitting bump 111 penetrates through the first avoiding hole 3001, for example, the fitting bump 111 penetrates through the first avoiding hole 3001, and the fitting bump 111 penetrates through the first avoiding hole 3001 along the first direction (the Z-axis direction in the drawing) as will be understood similarly hereinafter.

The power module 700 is mounted on a bottom wall (not shown) of the second mounting groove 1102, and is electrically connected to the circuit board 300. The power module 700 may be a battery. Illustratively, a lower surface (not shown) of the power module 700 may be flush with a lower surface of the housing 110 to facilitate subsequent assembly between the cover 120 and the housing 110.

The image capturing module 500 is mounted on the bottom wall of the first mounting groove 1101, and penetrates through the second avoidance hole 3002 of the circuit board 300. The camera module 500 may be used as a rear camera module of the electronic device 1000. Specifically, the camera module 500 protrudes with respect to the lower surface of the circuit board 300 and the lower surface of the frame 110. The camera module 500 is electrically connected to the circuit board 300 to achieve electrical connection with the processor. The camera module 500 may receive the information collection signal sent by the processor through the circuit board 300, and collect light outside the electronic device 1000 to form corresponding image data.

The speaker module 600 is located on top of the electronic device 1000 and serves as a top speaker module for the electronic device 1000. The speaker module 600 includes a first speaker unit 610 and a second speaker unit 620. The first speaker unit 610 is mounted to the mounting groove 1103 and covers the through groove 1105. Specifically, the first speaker unit 610 is disposed through the first avoidance hole 3001 of the circuit board 300 and electrically connected to the circuit board 300, so as to realize electrical connection with the processor. The first speaker unit 610 may be a high frequency unit, and may be used as an earpiece of the electronic device 1000. The first speaker unit 610 may receive the audio signal sent by the processor through the circuit board 300, vibrate and sound according to the audio signal, and diffuse sound to the external environment to realize sound of the earpiece of the electronic device 1000.

The second speaker unit 620 is mounted on the lower surface of the circuit board 300 and is electrically connected with the circuit board 300 to achieve an electrical connection with the processor. The second speaker unit 620 may be a full frequency unit, and may be used as a speaker of the electronic apparatus 1000. The second speaker unit 620 may receive the audio signal transmitted by the processor through the circuit board 300, vibrate and sound according to the audio signal, and diffuse sound into the external environment to realize speaker sound of the electronic device 1000. At this time, the second speaker unit 620 can generate sound in cooperation with the first speaker unit 610, so as to reduce the power consumption of the speaker module 600, and thus, the duration of the electronic device 1000 can be prolonged. In other embodiments, the first speaker unit 610 and the second speaker unit 620 may be all-frequency units, and the speaker module 600 may realize three-channel sounding, which is helpful for improving the sounding quality of the speaker module 600.

In this embodiment, along the X-axis direction, the first speaker unit 610 is disposed at a distance from the camera module 500, and the second speaker unit 620 is disposed at a distance from the camera module 500. In the second direction (Y-axis direction in the drawing), the first speaker unit 610 partially overlaps the image capturing module 500, and the second speaker unit 620 completely overlaps the second avoidance hole 3002 of the circuit board 300. Wherein the second speaker unit 620 also completely overlaps the camera module 500. It is to be understood that, in other embodiments, the first speaker unit 610 and the camera module 500 may also completely overlap along the second direction, which is not particularly limited in this application, so long as the first speaker unit 610 and the camera module 500 at least partially overlap along the second direction.

At this time, part of the first speaker units 610 multiplexes the space of the camera module 500 in the second direction, the second speaker units 620 completely multiplexes the space of the second avoidance hole 3002 (or the camera module 500) in the second direction, which is helpful for reducing the space occupation of the speaker module 600 on the circuit board 300 in the second direction, reducing the size of the circuit board 300 in the second direction, increasing the space occupation of the power module 700 in the second direction, improving the capacity of the power module 700, and improving the cruising ability of the electronic device 1000.

In other embodiments, a portion of the second speaker unit 620 may overlap the second avoidance hole 3002 of the circuit board 300 along the second direction, which is not particularly limited in this application, as long as the second speaker unit 620 at least partially overlaps the second avoidance hole 3002 of the circuit board 300 along the second direction.

In addition, the electronic device 1000 may further include another speaker module (not shown), which is located at the bottom of the electronic device 1000 and is used as a bottom speaker module of the electronic device 1000. At this time, the electronic device 1000 may simultaneously adopt the top speaker module and the bottom speaker module to generate sound, so as to realize a "double-horn" sound generating mode of the electronic device 1000, which is helpful for improving the sound generating quality of the electronic device 1000.

Referring to fig. 10 and 11, fig. 10 is a schematic structural view of a stand 400 in the electronic device 1000 shown in fig. 3, and fig. 11 is a schematic structural view of the stand 400 shown in fig. 10 at another angle.

The bracket 400 is provided with a relief hole 4001 and a through hole 4002. Openings of the escape holes 4001 and the through holes 4002 are both located on the upper surface (not shown) of the bracket 400. The escape holes 4001 and the through holes 4002 are each recessed from the upper surface of the bracket 400 toward the lower surface (not shown) in the direction (negative direction of the Z axis shown) and penetrate the lower surface of the bracket 400. That is, the escape hole 4001 and the through hole 4002 each penetrate the bracket 400 in a first direction (the illustrated Z-axis direction). Specifically, the avoidance hole 4001 is located in the middle of the bracket 400, and the through hole 4002 is located at one side of the avoidance hole 4001 facing the negative direction of the X axis and is spaced from the avoidance hole 4001. The shape of the avoiding hole 4001 is adapted to the shape of the camera module 500.

Further, the bracket 400 is also provided with an fitting groove 4003, and the fitting groove 4003 is provided around the through hole 4002 and communicates with the through hole 4002. The opening of the fitting groove 4003 is located at the upper surface of the bracket 400. The mounting groove 1103 is recessed from the upper surface of the bracket 400 toward the lower surface (negative direction of the Z axis is shown) and penetrates the wall of the through hole 4002 to communicate with the through hole 4002. Illustratively, the fitting groove 4003 is in the shape of a square ring. In other embodiments, the mounting groove 4003 may be annular or otherwise annular.

In this embodiment, the bracket 400 includes a bracket body 410 and a boss 420, and the boss 420 is fixedly connected to the bracket body 410. The holder body 410 is adapted to the shape of the first mounting groove 1101 (shown in fig. 4) of the frame 110. The boss 420 is fixedly coupled to the lower surface of the bracket body 410. The boss 420 protrudes from the lower surface of the holder body 410 in a direction away from the upper surface (positive Z-axis direction shown). Wherein the boss 420 is provided with a relief hole 4001, a through hole 4002 and an assembly groove 4003.

Referring to fig. 9 and 12, fig. 12 is a schematic diagram illustrating an assembly structure of the frame 110, the circuit board 300, the bracket 400, the camera module 500, the speaker module 600 and the power module 700 in the electronic device 1000 shown in fig. 3.

The bracket 400 is mounted to the first mounting groove 1101 of the frame 110. Specifically, the bracket 400 is mounted on a surface of the circuit board 300 facing away from the frame 110 (i.e., a lower surface of the circuit board 300). Illustratively, the bracket 400 may be mounted to the circuit board 300 by fasteners such as screws. Wherein the stand 400 covers the first speaker unit 610. The camera module 500 is disposed through the avoidance hole 4001, and the second speaker unit 620 is mounted in the mounting groove 4003 and covers the through hole 4002. In addition, the lower surface of the holder body 410 may be flush with the lower surface of the frame 110 to facilitate the subsequent assembly of the rear cover 120 with the frame 110.

Referring to fig. 13 and 14, fig. 13 is a schematic structural view of a decoration 800 in the electronic device 1000 shown in fig. 3, and fig. 14 is a schematic structural view of the decoration 800 shown in fig. 13 at another angle.

The decoration 800 has a square shape. The garnish 800 is provided with a receiving groove 8001, a speaker groove 8002, and a speaker hole 8003. The opening of the receiving groove 8001 is located on an upper surface (not shown) of the garnish 800. The receiving groove 8001 is recessed from an upper surface of the garnish 800 toward a lower surface (not shown) in a direction (negative Z-axis direction in the drawing). The shape of the receiving groove 8001 is adapted to the shape of the boss 420 (shown in fig. 10) of the stand 400.

The speaker groove 8002 and the speaker hole 8003 are both located on the left side of the garnish 800. Specifically, the opening of the speaker groove 8002 is located at the groove bottom wall (not shown) of the housing groove 8001. The speaker groove 8002 is recessed from the groove bottom wall of the housing groove 8001 toward the lower surface of the garnish 800 (in the negative Z-axis direction in the drawing). The speaker hole 8003 includes two openings. One opening of the speaker hole 8003 is located at a groove side wall of the speaker groove 8002, and the other opening is located at a peripheral side face (not shown) of the garnish 800, so that the speaker hole 8003 communicates the speaker groove 8002 with an outside of the garnish 800. Illustratively, the speaker aperture 8003 is one. In other embodiments, there may be a plurality of speaker holes 8003, and a plurality of speaker holes 8003 may be provided at intervals, and the number of speaker holes 8003 is not particularly limited in this application.

In addition, the decoration 800 may further be provided with an image capturing hole (not shown), and an opening of the image capturing hole is located at a bottom wall of the receiving groove 8001. The imaging hole is recessed from the bottom wall of the accommodation groove 8001 toward the lower surface of the garnish 800, and penetrates the lower surface of the garnish 800. Wherein, external light can enter the accommodating groove 8001 of the decoration 800 through the image pick-up hole.

Referring to fig. 12, 15 and 16, fig. 15 is a schematic cross-sectional structure of the electronic device 1000 shown in fig. 2 taken along the line I-I, and fig. 16 is a schematic cross-sectional structure of the electronic device 1000 shown in fig. 1 taken along the line II-II. Wherein, the section along the I-I is the section along the plane of the I-I line, and the rest similar descriptions can be understood in the same way in the application.

The decoration 800 is mounted on the surface of the bracket 400 facing away from the frame 110, and covers the bracket 400 and the camera module 500. The bracket 400, the camera module 500, and the decoration 800 are all disposed through the avoidance hole 1201 of the rear cover 120 (as shown in fig. 6). Specifically, the receiving groove 8001 of the garnish 800 receives the boss 420 of the bracket 400. The speaker groove 8002 of the garnish 800 is provided opposite to the through hole 4002 of the holder 400, and communicates with the through hole 4002 of the holder 400. In addition, the image capturing hole of the decoration 800 is disposed opposite to the image capturing module 500. The camera module 500 can collect light outside the electronic device 1000 through the camera hole and form corresponding image data to realize camera shooting.

The through groove 1105 forms a front sound cavity 6101 of the first speaker unit 610. The sound outlet 2001 of the display module 200 is connected to the front sound cavity 6101 of the first speaker unit 610. The sound generated by the first speaker unit 610 during operation can be transmitted from the front sound cavity 6101 to the outside of the electronic device 1000 through the communication groove 1104 and the sound outlet 2001 of the display module 200, that is, can be sequentially transmitted to the outside of the electronic device 1000 through the communication groove 1105 of the frame 110, the communication groove 1104 and the sound outlet 2001 of the display module 200, so as to realize sound production of the first speaker unit 610.

The through hole 4002 of the holder 400 and the speaker groove 8002 of the garnish 800 form a front sound cavity 6201 of the second speaker unit 620. Wherein the speaker hole 8003 of the garnish 800 communicates with the front acoustic chamber 6201 of the second speaker unit 620. Sound emitted by the second speaker unit 620 during operation can be transmitted from the front sound cavity 6201 to the outside of the electronic device 1000 through the speaker hole 8003, that is, can be sequentially transmitted to the outside of the electronic device 1000 through the through hole 4002 of the bracket 400, the speaker groove 8002 of the decoration 800, and the speaker hole 8003, so as to realize sound production of the second speaker unit 620.

In other embodiments, the stand 400 may be provided with a sound cavity groove (not shown), the opening of the sound cavity groove is located at the bottom wall of the assembly groove 4003, the second speaker unit 620 covers the opening of the sound cavity groove, the sound cavity groove forms the front sound cavity 6201 of the second speaker unit 620, at this time, the decoration 800 may not be provided with the speaker groove 8002, but only with the speaker hole 8003, the speaker hole 8003 communicates with the front sound cavity 6201 of the second speaker unit 620 and the exterior of the decoration 800, or the stand 400 may be further provided with a communication hole, the communication hole communicates with the sound cavity groove and the speaker hole 8003, and sound production of the second speaker unit 620 may be achieved as well.

In addition, the electronic device 1000 further includes a first adhesive layer 910 and a second adhesive layer 920. The first adhesive layer 910 is adhered between the second speaker unit 620 and the bracket 400. Specifically, the upper surface (not shown) of the first adhesive layer 910 adheres to the second speaker unit 620, and the lower surface (not shown) of the first adhesive layer 910 adheres to the groove bottom wall of the fitting groove 4003 of the bracket 400. Wherein, the first adhesive layer 910 is provided with a through hole (not shown), and the through hole penetrates through the first adhesive layer 910 along a first direction (a Z-axis direction in the drawing), and communicates the through hole 4002 of the bracket 400 and the assembly groove 4003 of the bracket 400, so as to ensure that the first adhesive layer 910 does not obstruct the sound production of the second speaker unit 620.

In other embodiments, the second speaker unit 620 may not be mounted to the circuit board 300, but may be mounted to the bracket 400 through the first adhesive layer 910. At this time, the second speaker unit 620 is spaced from the circuit board 300 along the Z-axis direction, and the electronic device of the electronic apparatus 1000 may be mounted on the circuit board 300 and located between the second speaker unit 620 and the circuit board 300, so as to improve the space utilization of the interior of the electronic apparatus 1000 and improve the integration level of the electronic apparatus 1000.

The second adhesive layer 920 is adhered between the holder 400 and the decoration 800. Specifically, the lower surface of the second adhesive layer 920 is adhered to the bottom wall of the receiving groove 8001 of the decoration 800, and the upper surface of the second adhesive layer 920 is adhered to the lower surface of the boss 420 of the bracket 400, so as to realize the assembly between the bracket 400 and the decoration 800, and improve the assembly stability of the decoration 800. The second adhesive layer 920 is provided with a through hole (not shown), and the through hole penetrates the second adhesive layer 920 along the first direction (the Z-axis direction in the drawing), and communicates the through hole 4002 of the bracket 400 and the speaker groove 8002 of the decoration 800, so as to ensure that the second adhesive layer 920 does not obstruct the sound production of the second speaker unit 620.

In this embodiment, along the Y-axis direction, the first speaker unit 610 and the camera module 500 at least partially overlap, and the second speaker unit 620 and the camera module 500 completely overlap, so that the occupied space of the speaker module 600 in the Y-axis direction can be saved, the size of the circuit board 300 in the Y-axis direction can be reduced, the occupied space of the power module 700 in the Y-axis direction can be increased, the capacity of the power module 700 can be increased, and the cruising ability of the electronic device 1000 can be improved.

Referring to fig. 17 and fig. 18, fig. 17 is a schematic structural diagram of a frame 110 in a second electronic device 1000 according to an embodiment of the present disclosure, and fig. 18 is a schematic structural diagram of the frame 110 shown in fig. 17 at another angle.

The electronic apparatus 1000 shown in the present embodiment is different from the electronic apparatus 1000 shown in the above-described embodiment in that the garnish 800 is not provided with the speaker groove 8002 and the speaker hole 8003, and the frame 110 is provided with the speaker groove 1106 and the speaker hole 1107. Specifically, the speaker groove 1106 is located at a side of the communication groove 1104 facing the negative X-axis direction, and is spaced apart from the communication groove 1104. The opening of the speaker groove 1106 is located at the groove bottom wall of the first mounting groove 1101 of the frame 110. The speaker groove 1106 is recessed from the groove bottom wall of the first mounting groove 1101 toward the upper surface of the frame 110, and penetrates the upper surface of the frame 110. The speaker hole 1107 includes two openings. One opening of the speaker hole 1107 is located at a groove side wall of the speaker groove 1106, and the other opening is located at a top end face of the frame 110 so that the speaker hole 1107 communicates with the outside of the speaker groove 1106 and the frame 110. Illustratively, there are a plurality of speaker holes 1107, and the plurality of speaker holes 1107 are arranged at intervals along the X-axis direction. In other embodiments, there may be only one speaker hole 1107, and the number of speaker holes 1107 is not particularly limited in the present application.

Referring to fig. 19 and 20, fig. 19 is a schematic structural diagram of a circuit board 300 in a second electronic device 1000 according to an embodiment of the present application, and fig. 20 is a schematic structural diagram of an assembly of a frame 110, the circuit board 300, a camera module 500, a speaker module 600 and a power module 700 in the second electronic device 1000 according to an embodiment of the present application.

The circuit board 300 is provided with a through hole 3003, and the through hole 3003 is located at the top of the circuit board 300 and is spaced from the first avoidance hole 3001 and the second avoidance hole 3002. Specifically, the opening of the through-hole 3003 is located on the lower surface of the circuit board 300. The through hole 3003 is recessed from the lower surface of the circuit board 300 toward the upper surface, and penetrates the upper surface of the circuit board 300. That is, the through-hole 3003 penetrates the circuit board 300 in a first direction (a Z-axis direction in the drawing). In this embodiment, the circuit board 300 is mounted in the first mounting groove 1101 of the housing 110, and the through hole 3003 communicates with the speaker groove 1106 of the housing 110.

Referring to fig. 21 and 22, fig. 21 is a schematic structural view of a stand 400 in a second electronic device 1000 according to an embodiment of the present disclosure, and fig. 22 is a schematic structural view of the stand 400 shown in fig. 21 at another angle.

The lower surface of the bracket 400 is convexly provided with a mounting protrusion 430. The mounting bumps 430 are located on top of the bracket 400. The mounting boss 430 protrudes from the lower surface of the bracket 400 in a direction away from the upper surface (the positive Z-axis direction is shown). The holder 400 is provided with a sound cavity groove 4004 and a communication hole 4005, the communication hole 4005 communicating with the sound cavity groove 4004. Specifically, the opening of the sound cavity groove 4004 is located at the groove bottom wall of the fitting groove 4003. The sound cavity groove 4004 is recessed from the groove bottom wall of the fitting groove 4003 in the direction of the lower surface of the holder 400 (negative Z-axis direction in the drawing).

The communication hole 4005 penetrates the groove wall of the sound cavity groove 4004 to communicate with the sound cavity groove 4004. The communication hole 4005 includes a first portion 4006, a second portion 4007, and a third portion 4008, and the first portion 4006, the second portion 4007, and the third portion 4008 are connected in order along the extending direction of the through hole 4002. The first portion 4006 extends from the cavity slot 4004 in the direction of the mounting tab 430. The included angle θ between the extending direction of the first portion 4006 and the Y-axis direction is 0 degrees or more and less than 90 degrees. The extending direction of the second portion 4007 is parallel to the X-axis direction. The third portion 4008 extends through the lower surface of the mounting bump 430, and the direction of extension of the third portion 4008 is parallel to the Z-axis direction. In other embodiments, each portion of the communication hole 4005 may take other structures, and the structure of the communication hole 4005 is not particularly limited in this application.

Referring to fig. 23, fig. 23 is a schematic cross-sectional structure of a second electronic device 1000 according to an embodiment of the present disclosure. In which the electronic device 1000 shown in fig. 23 does not show a decorative member.

The mounting projection 430 of the bracket 400 is disposed opposite to the through hole 3003 of the circuit board 300, and the communication hole 4005 of the bracket 400 communicates with the through hole 3003 of the circuit board 300. Wherein the second speaker unit 620 covers the opening of the sound cavity groove 4004. The sound cavity groove 4004 forms a front sound cavity 6201 of the second speaker unit 620. Sound emitted when the second speaker unit 620 operates is transmitted from the front sound cavity 6201 to the outside of the electronic apparatus 1000 through the first portion 4006, the second portion 4007, the third portion 4008 of the communication hole 4005, the through hole 3003 of the circuit board 300, the speaker groove 1106 and the speaker hole 1107 of the housing 110 in this order, thereby realizing sound emission of the second speaker unit 620.

In other embodiments, the bracket 400 may not be provided with the communication hole 4005, the sound cavity groove 4004 is directly communicated with the speaker hole 1107, or the circuit board 300 may not be provided with the through hole 3003, the communication hole 4005 is directly communicated with the speaker hole 1107, or the frame 110 may not be provided with the speaker groove 1106, the through hole 3003 is directly communicated with the speaker hole 1107, and the sound production of the second speaker unit 620 may be achieved.

It can be appreciated that, compared to the first electronic device 1000, in the electronic device 1000 shown in the present embodiment, by forming the sound outlet channel of the second speaker unit 620 by punching holes in the bracket 400 and the frame 110, the holes on the outer surface of the decoration 800 can be avoided, the uniformity of the appearance of the decoration 800 is ensured, and the appearance refinement of the electronic device 1000 is improved.

The foregoing description is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and should be covered in the scope of the present application; embodiments of the present application and features of embodiments may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (21)

1. The electronic equipment is characterized by comprising a frame body, a circuit board, a loudspeaker module and a camera module, wherein the circuit board is arranged on the frame body and is provided with a first avoidance hole and a second avoidance hole, the first avoidance hole and the second avoidance hole penetrate through the circuit board along a first direction, and the first avoidance hole and the second avoidance hole at least partially overlap along a second direction; the loudspeaker module comprises a first loudspeaker unit, the first loudspeaker unit is installed in the frame body and penetrates through the first avoiding hole, and the camera module is installed in the frame body and penetrates through the second avoiding hole.

2. The electronic device of claim 1, wherein the first speaker unit and the camera module at least partially overlap in the second direction.

3. The electronic device of claim 1 or 2, wherein the speaker module further comprises a second speaker unit, the second speaker unit is located on a side of the circuit board facing away from the frame body, and the second speaker unit at least partially overlaps the second avoidance hole along the second direction.

4. The electronic device of claim 3, wherein the second speaker unit completely overlaps the second avoidance hole in the second direction.

5. The electronic device of claim 3 or 4, further comprising a bracket and a decoration, wherein the bracket is provided with an avoidance hole, the avoidance hole penetrates through the bracket along the first direction, the bracket is mounted on the surface of the circuit board, which is away from the frame body, the camera module is further arranged in the avoidance hole in a penetrating manner, and the decoration is mounted on the surface of the bracket, which is away from the circuit board, and covers the bracket and the camera module.

6. The electronic apparatus according to claim 5, wherein the bracket is provided with a through hole penetrating the bracket in the first direction, and the second speaker unit is mounted to the bracket and covers the through hole;

the decoration is provided with a loudspeaker groove and a loudspeaker hole, the loudspeaker groove is opposite to the through hole, the loudspeaker groove and the through hole form a front sound cavity of the second loudspeaker unit, and the loudspeaker hole is communicated with the front sound cavity of the second loudspeaker unit and the outside of the decoration.

7. The electronic device according to claim 5, wherein the stand is provided with a sound cavity groove, the second speaker unit is mounted to the stand and covers an opening of the sound cavity groove, the sound cavity groove forming a front sound cavity of the second speaker unit;

the decoration is provided with a loudspeaker hole, and the loudspeaker hole is communicated with the front sound cavity of the second loudspeaker unit and the outside of the decoration.

8. The electronic apparatus according to claim 7, wherein the bracket is further provided with a communication hole that communicates the sound cavity groove and the speaker hole.

9. The electronic device according to claim 5, wherein the stand is provided with a sound cavity groove, the second speaker unit is mounted to the stand and covers an opening of the sound cavity groove, the sound cavity groove forming a front sound cavity of the second speaker unit;

the frame body is provided with a loudspeaker hole, and the loudspeaker hole is communicated with the front sound cavity of the second loudspeaker unit and the outside of the frame body.

10. The electronic apparatus according to claim 9, wherein the bracket is further provided with a communication hole that communicates the sound cavity groove and the speaker hole.

11. The electronic apparatus according to claim 10, wherein the circuit board is provided with a through hole that penetrates the circuit board in the first direction and communicates the communication hole and the speaker hole.

12. The electronic device according to claim 11, wherein the frame body is further provided with a speaker groove that communicates the through hole and the speaker hole.

13. The electronic device of any one of claims 3-12, wherein the second speaker unit is spaced apart from the circuit board along the first direction.

14. The electronic device of any one of claims 3-13, wherein the first speaker unit is a tweeter unit or a full frequency unit and the second speaker unit is a full frequency unit.

15. The electronic device according to any one of claims 1 to 14, wherein the frame body is provided with a through groove penetrating the frame body in the first direction, the first speaker unit covers the through groove, the through groove forming a front sound cavity of the first speaker unit;

the frame body is equipped with out the sound hole, perhaps, electronic equipment still includes the display module assembly, the display module assembly install in the upper surface of frame body, the display module assembly is equipped with out the sound hole, it runs through to go out the sound hole the display module assembly is followed first direction, perhaps, the display module assembly with the frame body encloses and closes and form out the sound hole, perhaps, electronic equipment still includes the auxiliary member, the auxiliary member install in the frame body, and with the frame body encloses and closes and form out the sound hole, it communicates to go out the sound hole the preceding sound chamber of first speaker unit.

16. The electronic device according to claim 15, wherein the frame body is further provided with a communication groove that communicates the communication groove and the sound outlet hole.

17. The electronic device of any one of claims 1-16, wherein a width direction of the electronic device is an X-axis direction, a length direction of the electronic device is a Y-axis direction, a thickness direction of the electronic device is a Z-axis direction, the X-axis direction and the Y-axis direction form an XY plane, the first direction is the Z-axis direction, and the second direction is parallel to the XY plane.

18. The electronic device of any one of claims 1-17, wherein the first and second avoidance holes are spaced apart, a distance between the first and second avoidance holes being equal to or greater than 3mm.

19. The electronic device of any one of claims 1-18, wherein the first relief hole is located at a top of the circuit board and the second relief hole is spaced from a bottom end surface of the circuit board.

20. The electronic device of any one of claims 1-19, further comprising a power module mounted to the frame and arranged along the second direction with the circuit board.

21. The electronic device of any one of claims 1-20, further comprising a rear cover provided with an avoidance hole penetrating the rear cover in the first direction, the rear cover being mounted to a lower surface of the frame, the camera module further penetrating the avoidance hole of the rear cover.