CN208300113U - Circuit board assemblies, photoelectricity mould group, depth camera and electronic device - Google Patents
Circuit board assemblies, photoelectricity mould group, depth camera and electronic device Download PDFInfo
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- CN208300113U CN208300113U CN201820837973.4U CN201820837973U CN208300113U CN 208300113 U CN208300113 U CN 208300113U CN 201820837973 U CN201820837973 U CN 201820837973U CN 208300113 U CN208300113 U CN 208300113U
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Abstract
The utility model discloses a kind of circuit board assemblies.Circuit board assemblies include heat-radiating substrate, heater element, circuit board and heat dissipation element.Heat-radiating substrate includes loading end and the joint face opposite with loading end, forms the first conducting element on loading end, forms the second conducting element on joint face.Heater element is arranged on loading end and is electrically connected with the first conducting element.Circuit board is arranged on joint face and is electrically connected with the second conducting element, and circuit board opens up at least one via hole.Heat dissipation element wears via hole and is arranged on joint face.On the loading end that heater element is arranged in the circuit board assemblies of the utility model embodiment, circuit board is arranged and opens up via hole on joint face and on circuit boards so that heat dissipation element wears via hole connect with joint face, to which the heat of heater element is passed through heat-radiating substrate and heat dissipation element conduction evacuation, good heat dissipation effect.A kind of photoelectricity mould group, depth camera and electronic device is also disclosed in the utility model.
Description
Technical field
The utility model relates to consumer electronics fields, more specifically, be related to a kind of circuit board assemblies, photoelectricity mould group,
Depth camera and electronic device.
Background technique
Due to light-emitting diode (Light Emitting Diode, LED) lamp, the laser emitter of recognition of face sensor
Electric current/luminous power it is big, therefore calorific value is big, and especially in numbers such as mobile phones, excessive calorific value will cause complete machine work temperature
The problems such as degree height, infrared laser band discontinuity, directly affect properties of product.The LED light of the relevant technologies, recognition of face sensor
Laser emitter is bonded by silver paste die bond and flexible circuit board (Flexible Printed Circuit, FPC), but in FPC
Containing stack materials such as polyimides, binder, solder mask, conductive adhesive film and copper foils, average thermal conductance coefficient is only≤0.38 watt
Special/(rice is opened) (W/ (mK)), heat dissipation effect is poor.
Utility model content
The utility model embodiment provides a kind of circuit board assemblies, photoelectricity mould group, depth camera and electronic device.
The circuit board assemblies of the utility model embodiment include heat-radiating substrate, heater element, circuit board and heat dissipation element.
The heat-radiating substrate includes loading end and the joint face opposite with the loading end, and the first conductive element is formed on the loading end
Part is formed with the second conducting element on the joint face.The heater element is arranged on the loading end and with described first
Conducting element electrical connection.The circuit board is arranged on the joint face and is electrically connected with second conducting element, the electricity
Road plate offers at least one via hole.The heat dissipation element wears the via hole and is arranged on the joint face.
The circuit board assemblies of the utility model embodiment by the way that heater element is arranged on the loading end of heat-radiating substrate,
Circuit board is arranged on the joint face of heat-radiating substrate and open up via hole on circuit boards so that heat dissipation element wear via hole with
Joint face connection, so that the heat of heater element is passed through heat-radiating substrate and heat dissipation element conduction evacuation, good heat dissipation effect.
In some embodiments, first conducting element includes at least one pad, and the heater element setting exists
On the pad of first conducting element, second conducting element includes at least one pad, and the heat dissipation element setting exists
On the pad of second conducting element.
Since the first conducting element and the second conducting element can be pad, pad relative to conventional conducting wire and
Speech, area is relatively large, so the pad of the first conducting element connects heater element, the pad of the second conducting element connects heat dissipation
Element facilitates welding and connection is than stronger；Moreover, the contact between pad and heater element, between pad and heat dissipation element
Area is larger, can faster the heat that heater element generates be evacuated and be absorbed, improving radiating effect.
In some embodiments, the heat-radiating substrate includes ceramic substrate or metal substrate.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of conventional flexible circuit board, ceramic substrate and metal substrate
Thermal conductivity coefficient it is higher, heat dissipation effect is preferable.
In some embodiments, the thermal conductivity coefficient of the heat-radiating substrate is greater than or equal to 2.5W/ (mK).
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of Traditional flexible circuit plate, the thermal conductivity coefficient of heat-radiating substrate is big
In or equal to 2.5W/ (mK), thermal conductivity coefficient is higher, good heat dissipation effect.
In some embodiments, the heat dissipation element includes any in graphite flake, copper foil, heat-conducting glue and copper alloy block
It is one or more.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of Traditional flexible circuit plate, graphite flake, copper foil, heat-conducting glue or
Copper alloy block thermal conductivity coefficient is higher, and heater element can be transmitted to the heat rapid evacuation of heat-radiating substrate, heat dissipation effect faster
Fruit is good.
In some embodiments, the heat-radiating substrate offers multiple through-holes, and the inner wall of the through-hole is provided with metal
Layer, first conducting element are electrically connected with second conducting element by the metal layer, and one end of the circuit board is set
It sets on the joint face and is electrically connected with second conducting element.
First conducting element and the second conducting element are electrically connected by metal layer, and the first conducting element and the both may be implemented
The electrical connection of two conducting elements, to guarantee the signal transmission of circuit board and heater element, can also carry out it is thermally conductive, by fever member
Part is transmitted to the heat on the first conducting element and passes through on metal layer conductive to the second conducting element, to realize that heater element produces
The evacuation of raw heat.
In some embodiments, the circuit board assemblies further include stiffening plate, and the stiffening plate is arranged in the circuit
On the surface opposite with the joint face of plate, the stiffening plate offers at least one perforation, the perforation of the stiffening plate with
The via hole of the circuit board is relatively and perforating for the stiffening plate covers the via hole of the circuit board.
Stiffening plate is used to the intensity of accentuator plate and heat-radiating substrate join domain, and perforation and the circuit board of stiffening plate
The via hole of via hole alignment and covering board is to guarantee that heat dissipation element passes through, to guarantee the evacuation of heat.
In some embodiments, the stiffening plate is also provided with multiple thermal vias, and the thermal vias is located at described
Region except perforation region.
Stiffening plate offers multiple thermal vias and thermal vias is located at the region except punched areas, is guaranteeing circuit board
With in the case where heat-radiating substrate join domain intensity mitigate circuit board assemblies quality, and thermal vias can carry out heat dredge
It dissipates.
In some embodiments, the circuit board assemblies further include temperature-sensitive element, and the temperature-sensitive element is arranged described
It is electrically connected on loading end and with first conducting element.
Temperature-sensitive element be arranged on loading end, can with the temperature of real-time detection heat-radiating substrate, thus in temperature anomaly into
The corresponding processing of row, prevents the excessively high damage circuit board assemblies of temperature.
The photoelectricity mould group of the utility model includes the circuit board assemblies of any of the above-described embodiment and is arranged in the circuit
Optical module on board group part.The optical module is corresponding with the circuit board assemblies.
The photoelectricity mould group of the utility model embodiment, will by the way that heater element to be arranged on the loading end of heat-radiating substrate
Circuit board is arranged on the joint face of heat-radiating substrate and opens up via hole on circuit boards so that heat dissipation element wears via hole and company
Junction connection, so that the heat of heater element is passed through heat-radiating substrate and heat dissipation element conduction evacuation, good heat dissipation effect.
The depth camera of the utility model include photoelectricity mould group, image acquisition device described in any of the above-described embodiment and
Processor.The heater element is light source and is used to emit laser, and the optical module includes being arranged in the circuit board assemblies
On light beam generator, the light beam generator is corresponding with the light source interval and for converting the laser to form laser figure
Case.Described image collector is used to acquire the laser pattern projected by the photoelectricity mould group.The processor respectively with the light
Electric mould group and the connection of described image collector, the processor is for handling the laser pattern to obtain depth image.
The depth camera of the utility model embodiment, will by the way that heater element to be arranged on the loading end of heat-radiating substrate
Circuit board is arranged on the joint face of heat-radiating substrate and opens up via hole on circuit boards so that heat dissipation element wears via hole and company
Junction connection, so that the heat of heater element is passed through heat-radiating substrate and heat dissipation element conduction evacuation, good heat dissipation effect.
The electronic device of the utility model embodiment includes depth camera described in shell and above embodiment.It is described
Depth camera is arranged in the shell and from shell exposure to obtain depth image.
The electronic device of the utility model embodiment, will by the way that heater element to be arranged on the loading end of heat-radiating substrate
Circuit board is arranged on the joint face of heat-radiating substrate and opens up via hole on circuit boards so that heat dissipation element wears via hole and company
Junction connection, so that the heat of heater element is passed through heat-radiating substrate and heat dissipation element conduction evacuation, good heat dissipation effect.
The additional aspect and advantage of the embodiments of the present invention will be set forth in part in the description, partially will be from
Become obvious in following description, or is recognized by the practice of the embodiments of the present invention.
Detailed description of the invention
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the electronic device of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the depth camera of the utility model embodiment；
Fig. 3 is the structural schematic diagram of the photoelectricity mould group of the utility model embodiment；
Fig. 4 is the stereoscopic schematic diagram of the circuit board assemblies of the utility model embodiment；
Fig. 5 is partial sectional schematic view of the circuit board assemblies in Fig. 4 along V-V line；
Fig. 6 is the floor map at another visual angle of the circuit board assemblies in Fig. 4；With
Fig. 7 is the structural schematic diagram of the photoelectricity mould group of another embodiment of the utility model.
Specific embodiment
The embodiments of the present invention is described further below in conjunction with attached drawing.Same or similar label in attached drawing
Same or similar element or element with the same or similar functions are indicated from beginning to end.
In addition, the embodiments of the present invention described with reference to the accompanying drawing is exemplary, it is only used for explaining this reality
With novel embodiment, and should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Referring to Fig. 1, the electronic device 1000 of the utility model embodiment includes shell 200 and depth camera 100.Electricity
Sub-device 1000 can be mobile phone, tablet computer, laptop computer, game machine, head and show equipment, access control system, automatic teller machine etc., this reality
It is illustrated so that electronic device 1000 is mobile phone as an example with new embodiment, it will be understood that the concrete form of electronic device 1000
It can be other, this is not restricted.Depth camera 100 is arranged in shell 200 and from the exposure of shell 200 to obtain depth map
Picture, shell 200 can provide the protection such as dust-proof, waterproof, shatter-resistant to depth camera 100, offer on shell 200 and depth camera
100 corresponding holes, so that light is pierced by from hole or penetrates shell 200.
Referring to Fig. 2, depth camera 100 include photoelectricity mould group 10 (at this point, photoelectricity mould group 10 be project structured light mould group),
Image acquisition device 20 and processor 30.It could be formed with projection window 40 corresponding with photoelectricity mould group 10 on depth camera 100, and
Acquisition window 50 corresponding with image acquisition device 20.Photoelectricity mould group 10 is used to project laser to object space by projection window 40
Pattern.The laser pattern is the structure light (coding being combined by the collection of limited sub-pattern with uniqueness by coding
Pattern), for example, two-dimensional encoded structured light patterns, which is known as reference pattern, each unique figure in reference pattern
Pattern in case window is all unique.Image acquisition device 20 is used to acquire by acquisition window 50 modulated by target object
Laser pattern, i.e. imagewise pattern.In one example, the laser that photoelectricity mould group 10 projects is infrared light, and image acquisition device 20 is
Infrared camera.Processor 30 is all connected with photoelectricity mould group 10 and image acquisition device 20, and processor 30 is for handling imagewise pattern
To obtain depth image.Specifically, processor 30 is decoded by the imagewise pattern to coding, finds out each pixel in the imagewise pattern
The corresponding relationship of point each pixel corresponding with reference pattern, further obtains the laser pattern further according to the corresponding relationship
Depth image.
Above-mentioned photoelectricity mould group 10 can be 3D depth of field camera module, such as project structured light mould group 10, flight time (Time
Of Flight, TOF) imaging modules etc.；Certain photoelectricity mould group 10 is also possible to other imaging modules, such as recognition of face passes
Sensor mould group, specially camera module；Photoelectricity mould group 10 can also be pure light source emitter, such as LED, automobile lamp etc..
It is appreciated that the concrete form of photoelectricity mould group 10 can also be other devices, such as the element that any calorific value is big, do not make herein
Limitation.
Referring to Fig. 3, in one example, photoelectricity mould group 10 is project structured light mould group 10.Project structured light mould group 10
For projecting laser pattern to object space, which can be speckle pattern, or coding pattern.Pass through acquisition
With processing by the modulated laser pattern of target object, the depth image of the target object in object space can be obtained.
Project structured light mould group 10 includes circuit board assemblies 11, lens barrel 12, optical module 13.
Fig. 4 to fig. 6 is please referred to, circuit board assemblies 11 include heat-radiating substrate 111, heater element 112, circuit board 113, heat dissipation
Element 114, stiffening plate 115, connector 116 and temperature-sensitive element 117.
Specifically, heat-radiating substrate 111 includes loading end 1111, the joint face 1112 opposite with loading end 1111, is formed in
The first conducting element 1113 on loading end 1111, the second conducting element 1114, the metal layer being formed on joint face 1112
1115 and through loading end 1111 to multiple through-holes 1116 of joint face 1112.Heater element 112 is arranged in loading end 1111
On, heat dissipation element 114 is arranged on joint face 1112, and loading end 1111 is for carrying lens barrel 12 (Fig. 3 shows) and heater element
112.Metal layer 1115 is arranged on the inner wall of through-hole 1116, and the second conducting element 1114 and the first conducting element 1113 pass through gold
Belong to layer 1115 to be electrically connected, being electrically connected for the first conducting element 1113 and the second conducting element 1114 had both may be implemented in metal layer 1115
It connects, can also carry out thermally conductive.Heater element 112 issues and the heat being transmitted on the first conducting element 1113 passes through metal layer
1115 are transmitted on the second conducting element 1114 to realize the evacuation of the heat of heater element 112.Wherein, the number of through-hole 1116
Amount is determined according to radiating requirements.Metal layer 1115 is not only thermally conductive but also conductive material, such as at least one of metallic iron, copper and silver
Or it is a variety of.
Heat-radiating substrate 111 can be ceramic substrate or metal substrate.Ceramic substrate is made of ceramic materials, ceramic material packet
Include aluminium nitride (AlN) lamina, aluminium nitride (AlN) multilayer co-firing wiring board, aluminium oxide (Al2O3) lamina, aluminium oxide
(Al2O3) any one in multilayer co-firing wiring board and low-temp, co-fired ceramic multi-layer wiring board.Wherein, aluminium nitride (AlN) is single
The thermal conductivity coefficient of laminate is up to 170W/ (mK), compared to the thermal conductivity coefficient (≤0.38W/ (m of conventional flex circuits plate
K)), the thermal conductivity coefficient of aluminium nitride (AlN) lamina is higher, and high thermal conductivity makes radiating efficiency high, and single layer circuit board technique
Simply, at low cost；The thermal conductivity coefficient of aluminium nitride (AlN) multilayer co-firing wiring board is up to 170W/ (mK), and high thermal conductivity to dissipate
The thermal efficiency is high, and can walk multilayer line, and cabling is more；The thermal conductivity coefficient of aluminium oxide (Al2O3) lamina is higher, reaches 24W/ (m
K), high thermal conductivity makes radiating efficiency high, and single layer wiring board simple process and low cost；Aluminium oxide (Al2O3) multilayer co-firing line
Road plate thermal conductivity coefficient is higher, reaches 24W/ (mK), and it is high that high thermal conductivity makes radiating efficiency, and can walk multilayer line, and cabling is more；
Low-temp, co-fired ceramic multi-layer wiring board thermal conductivity coefficient is good, reaches 2.5W/ (mK), simple process is at low cost, and radiating efficiency is higher.
Metal substrate is made of metal material, and metal material includes copper alloy metal substrate, Al-alloy metal substrate and stainless steel alloy
Any one in metal substrate.Wherein, copper alloy metal substrate thermal conductivity coefficient is up to 385W/ (mK), soft compared to tradition
The thermal conductivity coefficient (≤0.38W/ (mK)) of property circuit board, the thermal conductivity coefficient of copper alloy metal substrate is higher, and high thermal conductivity makes
Radiating efficiency is high, and can walk single layer route, simple process.Al-alloy metal substrate thermal conductivity coefficient be up to 201W/ (mK) and
Multilayer line can be walked, cabling is more, and high thermal conductivity makes radiating efficiency height；Stainless steel alloy metal substrate thermal conductivity coefficient is higher, reaches
To 17W/ (mK), single layer route can be walked, at low cost and simple process, radiating efficiency is higher.When using ceramic substrate, it can pass through
The first conducting element 1113 is formed in the etching of loading end 1111 of heat-radiating substrate 111, heater element 112 is mounted by conductive silver paste
On the first conducting element 1113, the heat that heater element 112 generates is dredged by the first conducting element 1113 and ceramic substrate
It dissipates and absorbs；When using metal substrate, is handled using NiPdAu or chemical nickel gold processing heat-radiating substrate 111 obtains the first conductive element
Part 1113, heater element 112 are fitted on the first conducting element 1113, and the heat that heater element 112 generates is conductive by first
Element 1113 and metal substrate are evacuated and are absorbed.Certainly, heat-radiating substrate 111 is in addition to using above-mentioned ceramic material and metal material
Except, heat-radiating substrate 111 can also use other suitable materials, it is only necessary to meet radiating requirements, such as: thermal conductivity coefficient is greater than
Or it is equal to 2.5W/ (mK).The material of the heat-radiating substrate 111 of the utility model embodiment is aluminium nitride (AlN) single layer
Plate.
Heater element 112 can be light source 112, and light source 112 can be laser emitter, and laser emitter can be vertical cavity surface
Emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), light source 112 or LED
Lamp, in present embodiment, heater element 112 is VCSEL.VCSEL includes the luminous member of semiconductor substrate and setting on substrate
Single light-emitting component can be set in part, substrate, and the array laser being made of a plurality of light-emitting elements also can be set, specifically,
A plurality of light-emitting elements can be arranged on substrate in the form of regularly or irregularly two-dimensional pattern.Certainly, heater element 112
It is also possible to other electronic components, such as: photodetector, temperature sensor etc..
First conducting element 1113 includes at least one pad 1117, and the first conducting element 1113 is arranged in light source 112
On pad 1117.Second conducting element 1114 includes at least one pad 1118, and circuit board 113 offers at least one via hole
1132, heat dissipation element 114 wears via hole 1132 and is arranged on the pad 1118 of the second conducting element 1114, via hole 1132 it is big
The small size with heat dissipation element 114 matches.For conventional conducting wire, the pad of the first conducting element 1113
1117 and second conducting element 1114 pad 1118 area it is relatively large, facilitate welding and connection be than stronger, first leads
The pad 1117 of electric device 1113 and 112 contact area of light source are big, the pad 1118 and heat dissipation element of the second conducting element 1114
114 contact area is big, the first conducting element 1113,114 phase of heat-radiating substrate 111, the second conducting element 1114 and heat dissipation element
Cooperation is to quickly evacuate and absorb, improving radiating effect to the heat that light source 112 generates.
One end of circuit board 113, which is arranged on joint face 1112 and covers, is located at heat dissipation element in the second conducting element 1114
Region except 114 regions, the region may be pad 1118.The weldering of circuit board 113 and the second conducting element 1114
The bonded area of disk 1118 is larger, it is ensured that bond strength.The other end of circuit board 113 is provided with connector 116, connector
116 can be connected to project structured light mould group 10 on the mainboard of the electronic device 1000 in Fig. 1 embodiment.Circuit board 113 is logical
Cross the pad that surface mounting technology (Surface Mount Technology, SMT) technique is mounted on the second conducting element 1114
On 1118, difficulty of processing is lower, binding yield height and automation easy to accomplish.1114 electricity of circuit board 113 and the second conducting element
Connection can be cooperated in this way by the second conducting element 1114, metal layer 1115 and the first conducting element 1113 thus by circuit
Plate 113 and the electrical connection of light source 112 are to realize the control to light source 112.Circuit board 113 can be printed circuit board, flexible circuit
Any one in plate, Rigid Flex.Heat dissipation element 114 includes any in graphite flake, copper foil, heat-conducting glue or copper alloy block
It is one or more.For example, heat dissipation element 114 is graphite flake；Alternatively, heat dissipation element 114 is copper foil；Alternatively, heat dissipation element 114 is
Heat-conducting glue；Alternatively, heat dissipation element 114 is copper alloy block；Alternatively, heat dissipation element 114 is graphite flake and copper foil；Alternatively, heat dissipation member
Part 114 is graphite flake and heat-conducting glue；Alternatively, heat dissipation element 114 is copper foil and heat-conducting glue；Alternatively, heat dissipation element 114 is graphite
Piece, copper foil and heat-conducting glue；Alternatively, heat dissipation element 114 is graphite flake, copper foil, heat-conducting glue and copper alloy block.The utility model is real
The heat dissipation element 114 for applying mode is graphite flake, and graphite flake is for conventional flexible circuit board, and thermal conductivity coefficient is larger and matter
Amount is lighter, is conducive to improve heat dissipation effect and loss of weight.
Stiffening plate 115 offers at least one perforation 1152 and multiple thermal vias 1154.Stiffening plate 115 is arranged in circuit
On the surface opposite with joint face 1112 of plate 113, in other words, circuit board 113 be located at joint face 1112 and stiffening plate 115 it
Between, stiffening plate 115 can be with the intensity of accentuator plate 113 and 111 join domain of heat-radiating substrate.Perforation 1152 and circuit board 113
Via hole 1132 is opposite and the via hole 1132 of 1152 covering board 113 of perforation of stiffening plate 115, in other words, heat dissipation element
114 can also pass through the perforation 1152 of stiffening plate 115.Thermal vias 1154 is corresponding with circuit board 113 and light source 112, may is that
Thermal vias 1154 only with it is corresponding with the region of 112 face of light source on circuit board 113, be also possible to: thermal vias 1154
It is corresponding with the whole region that heat-radiating substrate 111 connects with circuit board 113, thus the heat that light source 112 is generated quickly conduct and
Evacuation.The quantity of thermal vias 1154 is determined according to the intensity needs of circuit board assemblies 11, loss of weight demand and radiating requirements.Reinforcement
Plate 115 can be metal, such as copper, iron or copper alloy, facilitate processing and good heat conduction effect.Certainly, stiffening plate 115 can also be with
It is other materials, it is only necessary to meet intensity requirement and cooling requirements.The stiffening plate 115 of the utility model embodiment is copper
Alloy stiffening plate.
Incorporated by reference to Fig. 2, temperature-sensitive element 117 is arranged on loading end 1111 and is electrically connected with the first conducting element 1113, the
One conducting element 1113 is electrically connected with the second conducting element 1114, and circuit board 113 is electrically connected with the second conducting element 1114, thus
So that temperature-sensitive element 117 is electrically connected with circuit board 113.When light source 112, which works, generates heat, 117 real-time detection of temperature-sensitive element
The temperature conditions of heat-radiating substrate 111, processor 30 control the operating power of light source 112 according to temperature conditions.For example, in temperature mistake
The power of light source 112 is reduced when high to prevent the excessively high damage circuit board assemblies 11 of temperature.
When circuit board assemblies 11 work, light source 112 generates heat, is transmitted to heat dissipation base by the first conducting element 1113
Plate 111 is transmitted to the second conducting element 1114 by metal layer 1115 and heat-radiating substrate 111, then the second conducting element 1114
Heat dissipation element 114 is conducted heat to evacuate.Due to the first conducting element 1113, heat-radiating substrate 111, metal layer 1115,
Second conducting element 1114 and heat dissipation element 114 all have good thermal conductivity coefficient, and the effect for conducting heat is good, so as to incite somebody to action
The heat of heater element 112 quickly loses, and integral heat sink is high-efficient.
Referring to Fig. 3, lens barrel 12 is carried on circuit board assemblies 11 and receiving is collectively formed with circuit board assemblies 11
Chamber 121, one end of circuit board 113 are arranged on the loading end 1111 of heat-radiating substrate 111 and are located at outside lens barrel 12, circuit board
113 other end extends to the outside of heat-radiating substrate 111 and is provided with connector 116, and connector 116 can be by project structured light
Mould group 10 is connected on the mainboard of the electronic device 1000 in Fig. 1 embodiment.The material of lens barrel 12 can be plastics, light source 112
It is housed in accommodating chamber 121 with optical module 13.Light source 112 is for emitting laser.Optical module 13 is used for the diffraction laser
To form laser pattern.Optical module 13 may include collimating element 131 and (the Diffractive Optical of diffraction element 132
Elements, DOE).Collimating element 131 is used for the laser converged or collimated light source 112 issues, is formed on diffraction element 132
It is capable of the diffraction structure of laser of the diffraction after collimating element 131.When project structured light mould group 10 works, VCSEL is issued
Laser successively after collimating element 131 and diffraction element 132, project laser pattern outward.
To sum up, the circuit board assemblies 11 of the utility model embodiment are by being arranged heater element 112 in heat-radiating substrate
On 111 loading end 1111, circuit board 113 is arranged on the joint face 1112 of heat-radiating substrate 111 and is opened on circuit board 113
If via hole 1132 is so that heat dissipation element 114 wears via hole 1132 connect with joint face 1112, thus by the heat of heater element 112
Amount passes through heat-radiating substrate 111 and the conduction evacuation of heat dissipation element 114, good heat dissipation effect.
In some embodiments, Heat Conduction Material such as heat-conducting glue can be set inside through-hole 1116 and thermal vias 1154
Deng.In this way, the evacuation speed of heat, improving radiating effect can be accelerated.
Referring to Fig. 7, in other embodiments, photoelectricity mould group 10 can be camera module.Camera module can be
Visible image capturing head mould group, is also possible to infrared camera mould group.Camera module includes circuit board assemblies 11, lens barrel 12 and light
Learn component 13.At this point, heater element 112 can be complementary metal oxide semiconductor (CMOS, Complementary Metal
Oxide Semiconductor) image sensor chip or charge coupled cell (CCD, Charge-coupled Device) figure
As sensing chip, lens barrel 12 is carried on circuit board assemblies 11 and accommodating chamber 121 is collectively formed with circuit board assemblies 11.Lens barrel 12
Include gluing with the connection type of circuit board assemblies 11, engage.Image sensor chip 112 and optical module 13 are housed in lens barrel
In 12.Optical module 13 includes camera lens 133, and the image side of camera lens 133, specifically, optical module is arranged in image sensor chip 112
13 optical axis is overlapped with the centre normal of image sensor chip 112.When photoelectricity mould group 10 works, by the light of target object reflection
It is imaged on image sensor chip 112 after optical module 13.In the present embodiment, camera lens 133 can be individual lens,
The lens are convex lens or concavees lens；Or be more pieces of lens, more pieces of lens can be convex lens or concavees lens, or part is convex
Lens are partially concavees lens.
Please continue to refer to Fig. 6, further, optical module 13 further includes optical filter 134, such as cutoff filter
(photoelectricity mould group 10 is visible image capturing head mould group at this time), optical filter 134 is used to adjust the wavelength of light section of imaging, specific to use
It can enter circuit board assemblies 11 in filtering out the infrared light in natural light and making it not, to prevent infrared light to visual light imaging shape
At colors of image impacted with clarity.Certainly, optical filter 134 can also be infrared by optical filter (photoelectricity mould at this time
Group 10 is infrared camera mould group), optical filter 134 is used to adjust the wavelength of light section being imaged, specifically for only allowing infrared light
Into circuit board assemblies 11 (prevent visible light enter circuit board assemblies 11), with guarantee colors of image that infrared imaging is formed with
Clarity.Optical filter 134 is housed in accommodating chamber 121 and is arranged between circuit board assemblies 11 and optical module 13.In photoelectricity
When mould group 10 works, photoelectricity mould group 10 is entered by the light that target object reflects, successively passes through camera lens 133, optical filter 134 and is scheming
As being imaged on sensing chip 112.
Referring to Fig. 1, the utility model also provides a kind of electronic device 1000, which may include in Fig. 7
Photoelectricity mould group 10.In other words, above-mentioned to can also be applied to electronic device 1000 for the photoelectricity mould group 10 of camera module.At this point,
Photoelectricity mould group 10 can be used for obtaining visible images or infrared light image etc..
Similarly, the electronic device 1000 of the utility model embodiment, photoelectricity mould group 10 and circuit board assemblies 11 pass through
Heater element 112 is arranged on the loading end 1111 of heat-radiating substrate 111, circuit board 113 is arranged in the company of heat-radiating substrate 111
Via hole 1132 is opened up in junction 1112 and on circuit board 113 so that heat dissipation element 114 wears via hole 1132 and joint face
1112 connections, so that the heat of heater element 112 is passed through heat-radiating substrate 111 and the conduction evacuation of heat dissipation element 114, heat dissipation effect
It is good.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment of the utility model or show
In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And
And particular features, structures, materials, or characteristics described can be in any one or more embodiments or example to close
Suitable mode combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three, unless otherwise specifically defined.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
It inside can make changes, modifications, alterations, and variations to the above described embodiments, the scope of the utility model is by claim and its is equal
Object limits.
Claims (12)
1. a kind of circuit board assemblies, which is characterized in that the circuit board assemblies include:
Heat-radiating substrate, the heat-radiating substrate include loading end and the joint face opposite with the loading end, shape on the loading end
At there is the first conducting element, the second conducting element is formed on the joint face；
Heater element, the heater element are arranged on the loading end and are electrically connected with first conducting element；
Circuit board on the joint face is set, and the circuit board is electrically connected with second conducting element, the circuit board
Offer at least one via hole；With
Heat dissipation element, the heat dissipation element wear the via hole and are arranged on the joint face.
2. circuit board assemblies according to claim 1, which is characterized in that first conducting element includes at least one weldering
Disk, the heater element are arranged on the pad of first conducting element, and second conducting element includes at least one weldering
Disk, the heat dissipation element are arranged on the pad of second conducting element.
3. circuit board assemblies according to claim 1, which is characterized in that the heat-radiating substrate includes ceramic substrate or metal
Substrate.
4. circuit board assemblies according to claim 1, which is characterized in that the thermal conductivity coefficient of the heat-radiating substrate is more than or equal to
2.5W/m·K。
5. circuit board assemblies according to claim 1, which is characterized in that the heat dissipation element includes graphite flake, copper foil, leads
Hot glue or copper alloy block.
6. circuit board assemblies according to claim 1, which is characterized in that the heat-radiating substrate offers multiple through-holes, institute
The inner wall for stating through-hole is provided with metal layer, and first conducting element is electrically connected with second conducting element by the metal layer
It connects, one end of the circuit board is arranged on the joint face and is electrically connected with second conducting element.
7. circuit board assemblies according to claim 1, which is characterized in that the circuit board assemblies further include stiffening plate, institute
It states stiffening plate to be arranged on the surface opposite with the joint face of the circuit board, the stiffening plate offers at least one and wears
The perforation in hole, the perforation stiffening plate opposite and described with the via hole of the circuit board of the stiffening plate covers the mistake of the circuit board
Hole.
8. circuit board assemblies according to claim 7, which is characterized in that it is logical that the stiffening plate is also provided with multiple heat dissipations
Hole, the thermal vias are located at the region except the perforation region.
9. circuit board assemblies according to claim 1, which is characterized in that the circuit board assemblies further include temperature-sensitive element,
The temperature-sensitive element is arranged on the loading end and is electrically connected with first conducting element.
10. a kind of photoelectricity mould group characterized by comprising
Circuit board assemblies described in claim 1 to 9 any one；With
Optical module on the circuit board assemblies is set, and the optical module is corresponding with the circuit board assemblies.
11. a kind of depth camera characterized by comprising
Photoelectricity mould group described in any one of claim 10, the heater element are light source and are used to emit laser, the optical module packet
The light beam generator being arranged on the circuit board assemblies is included, the light beam generator is corresponding with the light source interval and for inciting somebody to action
The laser is converted to form laser pattern；
Image acquisition device, described image collector are used to acquire the laser pattern projected by the photoelectricity mould group；And
Processor, the processor are connect with the photoelectricity mould group and described image collector respectively, and the processor is for locating
The laser pattern is managed to obtain depth image.
12. a kind of electronic device characterized by comprising
Shell；And
Depth camera described in claim 11, the depth camera are arranged in the shell and from shell exposure to obtain
Take depth image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820837973.4U CN208300113U (en) | 2018-05-31 | 2018-05-31 | Circuit board assemblies, photoelectricity mould group, depth camera and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820837973.4U CN208300113U (en) | 2018-05-31 | 2018-05-31 | Circuit board assemblies, photoelectricity mould group, depth camera and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208300113U true CN208300113U (en) | 2018-12-28 |
Family
ID=64723329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820837973.4U Active CN208300113U (en) | 2018-05-31 | 2018-05-31 | Circuit board assemblies, photoelectricity mould group, depth camera and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208300113U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557878A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
-
2018
- 2018-05-31 CN CN201820837973.4U patent/CN208300113U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557878A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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