CN110557881A - Circuit board assembly, photoelectric module, depth camera and electronic device - Google Patents

Circuit board assembly, photoelectric module, depth camera and electronic device Download PDF

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Publication number
CN110557881A
CN110557881A CN201810551924.9A CN201810551924A CN110557881A CN 110557881 A CN110557881 A CN 110557881A CN 201810551924 A CN201810551924 A CN 201810551924A CN 110557881 A CN110557881 A CN 110557881A
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CN
China
Prior art keywords
circuit board
conductive element
board assembly
heat
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810551924.9A
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Chinese (zh)
Inventor
陈楠
陈孝培
陈华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Biometric Identification Technology Co Ltd
Original Assignee
Nanchang OFilm Biometric Identification Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nanchang OFilm Biometric Identification Technology Co Ltd filed Critical Nanchang OFilm Biometric Identification Technology Co Ltd
Priority to CN201810551924.9A priority Critical patent/CN110557881A/en
Publication of CN110557881A publication Critical patent/CN110557881A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0277Details of the structure or mounting of specific components for a printed circuit board assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • H05K1/0281Reinforcement details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Studio Devices (AREA)

Abstract

The invention discloses a circuit board assembly. The circuit board assembly includes a heat-dissipating substrate, a heat-generating element, and a reinforcing plate. The heat dissipation substrate comprises a bearing surface and a connecting surface opposite to the bearing surface, a first conductive element is formed on the bearing surface, and a second conductive element is formed on the connecting surface. The heating element is arranged on the bearing surface and is electrically connected with the first conductive element. The circuit board is arranged on the connecting surface and electrically connected with the second conductive element, and at least one through hole is formed in the circuit board. The stiffening plate sets up circuit board with connect on the face of face mutually the back of the body mutually, the stiffening plate includes the reinforcement body and from the boss that the reinforcement body extends, the boss wear to establish the hole and contact with the heat dissipation base plate. According to the circuit board assembly provided by the embodiment of the invention, the heat of the heating element is conducted and dissipated through the heat dissipation substrate and the heat-conducting reinforcing plate through the reinforcing plate which is directly contacted with the heat dissipation substrate and penetrates through the circuit board, so that the heat dissipation effect is good. The invention also discloses an optoelectronic module, a depth camera and an electronic device.

Description

Circuit board assembly, photoelectric module, depth camera and electronic device
Technical Field
The present invention relates to the field of consumer electronics, and more particularly, to a circuit board assembly, an optoelectronic module, a depth camera and an electronic device.
Background
Because the current/luminous power of the laser emitters of a Light Emitting Diode (LED) lamp and a face recognition sensor is large, the heat productivity is large, especially in digital codes such as mobile phones, and the excessive heat productivity causes the problems of high working temperature of the whole machine, infrared laser band offset and the like, and directly affects the product performance. In the related art, the laser transmitters of the LED lamps and the face recognition sensors are bonded to a Flexible Printed Circuit (FPC) through silver paste die bonding, but the FPC contains a polyimide, a binder, a solder resist ink, a conductive adhesive film, a copper foil and other stacking materials, and has an average thermal conductivity of only not more than 0.38 watt/(meter · K) (W/(m · K)), and a poor heat dissipation effect.
Disclosure of Invention
the embodiment of the invention provides a circuit board assembly, an optoelectronic module, a depth camera and an electronic device.
The circuit board assembly of the embodiment of the invention comprises a heat dissipation substrate, a heating element, a circuit board and a heat conduction reinforcing plate. The radiating substrate comprises a bearing surface and a connecting surface opposite to the bearing surface, a first conductive element is formed on the bearing surface, and a second conductive element is formed on the connecting surface. The heating element is arranged on the bearing surface and is electrically connected with the first conductive element. The circuit board is arranged on the connecting surface and electrically connected with the second conductive element, and the circuit board is provided with a via hole. The reinforcing plate is arranged on the surface of the circuit board, which is back to the connecting surface, and comprises a reinforcing body and a boss extending from the reinforcing body, and the boss penetrates through the through hole and contacts with the heat dissipation substrate.
according to the circuit board assembly provided by the embodiment of the invention, the heating element is arranged on the bearing surface of the heat dissipation substrate, the circuit board is arranged on the connecting surface of the heat dissipation substrate, and the through hole is formed in the circuit board, so that the boss of the reinforcing plate penetrates through the through hole to be in contact with the heat dissipation substrate, the heat of the heating element is conducted and dispersed through the heat dissipation substrate and the heat conduction reinforcing plate, and the heat dissipation effect is good.
in some embodiments, the first conductive element includes a pad, and the heat generating element is disposed on the pad of the first conductive element.
Compared with the conventional conductive circuit, the area of the bonding pad is relatively large, so that the bonding pad of the first conductive element is connected with the heating element, the welding is convenient, and the connection is firmer; moreover, the contact area between the bonding pad and the heating element is large, so that heat generated by the heating element can be quickly evacuated and absorbed, and the heat dissipation effect is improved.
In some embodiments, the heating element is attached to the pad of the first conductive element by a conductive silver paste.
Compared with the thermal conductivity coefficient (< ═ 0.38W/(m.K)) of the conventional flexible circuit board, the thermal conductivity coefficient of the conductive silver paste is high, and the heat dissipation effect is good.
In some embodiments, the circuit board assembly further comprises a non-emissive source electrical component disposed on the first conductive element by solder paste.
Compared with the thermal conductivity coefficient (< ═ 0.38W/(m.K)) of a conventional flexible circuit board, the thermal conductivity coefficient of the solder paste is high, the heat dissipation effect is good, and the connection is stable when the connection is carried out through the solder paste.
In some embodiments, the second conductive element includes a pad, and the bump is disposed on the pad of the second conductive element, the bump corresponding to the heat generating element.
Compared with a conventional conductive circuit, the area of the bonding pad is relatively large, so that the boss is arranged on the bonding pad of the second conductive element, the welding is convenient, and the connection is firm; moreover, the contact area between the bonding pad and the boss is large, so that heat generated by the heating element can be conducted and evacuated more quickly, and the heat dissipation effect is improved.
In some embodiments, the lands are disposed on the pads of the second conductive element by solder paste.
Compared with the thermal conductivity coefficient (< ═ 0.38W/(m.K)) of a conventional flexible circuit board, the thermal conductivity coefficient of the solder paste is high, the heat dissipation effect is good, and the connection is stable when the connection is carried out through the solder paste.
In some embodiments, the circuit board is disposed on the second conductive element by solder paste.
Compared with the thermal conductivity coefficient (< ═ 0.38W/(m.K)) of a conventional flexible circuit board, the thermal conductivity coefficient of the solder paste is high, the heat dissipation effect is good, and the connection is stable when the connection is carried out through the solder paste.
In some embodiments, the heat-dissipating substrate comprises a ceramic substrate or a metal substrate.
compared with the thermal conductivity coefficient (< ═ 0.38W/(m.K)) of a conventional flexible circuit board, the thermal conductivity coefficient of the ceramic substrate and the metal substrate is high, and the heat dissipation effect is good.
In some embodiments, the thermal conductivity of the heat-dissipating substrate is 2.5W/m-K or greater.
compared with the thermal conductivity coefficient (< ═ 0.38W/(m.K)) of the conventional flexible circuit board, the thermal conductivity coefficient of the heat dissipation substrate is greater than or equal to 2.5W/(m.K), the thermal conductivity coefficient is high, and the heat dissipation effect is good.
In some embodiments, the heat dissipation substrate is provided with a plurality of conductive through holes, inner walls of the conductive through holes are provided with metal layers, the first conductive element and the second conductive element are electrically connected through the metal layers, and one end of the circuit board is disposed on the connection surface and electrically connected to the second conductive element.
The first conductive element and the second conductive element are electrically connected through the metal layer arranged on the inner wall of the conductive through hole, so that the first conductive element and the second conductive element can be electrically connected, the signal transmission of the circuit board and the heating element is ensured, heat conduction can also be carried out, and the heat conducted by the heating element to the first conductive element is conducted to the second conductive element through the metal layer, so that the heat generated by the heating element is evacuated.
In some embodiments, the reinforcing plate further defines a plurality of heat dissipating through holes, and the heat dissipating through holes are located in a region other than the region where the through holes of the reinforcing plate are located.
The stiffening plate is provided with a plurality of heat dissipation through holes and the heat dissipation through holes are located outside the perforated area, so that the quality of the circuit board assembly is reduced under the condition of ensuring the strength of the connection area of the circuit board and the heat dissipation substrate, and heat can be evacuated through the heat dissipation through holes.
In some embodiments, the stiffener is attached to the circuit board by an adhesive.
The stiffening plate is connected with the circuit board through connecting glue, and the connection is comparatively firm.
The optoelectronic module of the present invention includes the circuit board assembly of any of the above embodiments and an optical assembly disposed on the circuit board assembly. The optical assembly corresponds to the circuit board assembly.
according to the photovoltaic module, the heating element is arranged on the bearing surface of the heat dissipation substrate, the circuit board is arranged on the connecting surface of the heat dissipation substrate, the through hole is formed in the circuit board, so that the boss of the reinforcing plate penetrates through the through hole to be in contact with the heat dissipation substrate, the heat of the heating element is conducted and dispersed through the heat dissipation substrate and the heat conduction reinforcing plate, and the heat dissipation effect is good.
The depth camera provided by the invention comprises the photoelectric module, the image collector and the processor in any one of the embodiments. The heating element is a light source and is used for emitting laser, and the optical assembly comprises a light beam generator arranged on the circuit board assembly, wherein the light beam generator corresponds to the light source interval and is used for converting the laser into a laser pattern. The image collector is used for collecting the laser patterns projected by the photoelectric module. The processor is respectively connected with the photoelectric module and the image collector and is used for processing the laser pattern to obtain a depth image.
according to the depth camera provided by the embodiment of the invention, the heating element is arranged on the bearing surface of the heat dissipation substrate, the circuit board is arranged on the connecting surface of the heat dissipation substrate, and the through hole is formed in the circuit board, so that the boss of the reinforcing plate penetrates through the through hole to be in contact with the heat dissipation substrate, the heat of the heating element is conducted and dispersed through the heat dissipation substrate and the heat conduction reinforcing plate, and the heat dissipation effect is good.
An electronic device according to an embodiment of the present invention includes a housing and a depth camera according to any one of the above embodiments, the depth camera being disposed in the housing and exposed from the housing to acquire a depth image.
According to the electronic device provided by the embodiment of the invention, the heating element is arranged on the bearing surface of the heat dissipation substrate, the circuit board is arranged on the connecting surface of the heat dissipation substrate, and the through hole is formed in the circuit board, so that the boss of the reinforcing plate penetrates through the through hole to be in contact with the heat dissipation substrate, the heat of the heating element is conducted and dispersed through the heat dissipation substrate and the heat conduction reinforcing plate, and the heat dissipation effect is good.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a depth camera according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an optoelectronic module according to an embodiment of the present invention;
FIG. 4 is a perspective view of the circuit board assembly of FIG. 3;
FIG. 5 is a schematic partial cross-sectional view of the circuit board assembly of FIG. 4 taken along line V-V;
FIG. 6 is a schematic plan view of another perspective of the circuit board assembly of FIG. 4 in accordance with embodiments of the present invention;
FIG. 7 is a schematic partial cross-sectional view of another embodiment of a circuit board assembly taken along line V-V;
FIG. 8 is a schematic partial cross-sectional view of a circuit board assembly of yet another embodiment taken along line V-V; and
fig. 9 is a schematic structural diagram of an optoelectronic module according to another embodiment of the disclosure.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an electronic device 1000 according to an embodiment of the invention includes a housing 200 and a depth camera 100. The electronic device 1000 may be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc., and the embodiment of the present invention is described by taking the electronic device 1000 as a mobile phone, it is understood that the specific form of the electronic device 1000 may be other, and is not limited herein. The depth camera 100 is disposed in the housing 200 and exposed from the housing 200 to obtain a depth image, the housing 200 can provide protection for the depth camera 100, such as dust prevention, water prevention, and falling prevention, and a hole corresponding to the depth camera 100 is formed in the housing 200, so that light passes through the hole or penetrates into the housing 200.
Referring to fig. 2, the depth camera 100 includes an optoelectronic module 10 (in this case, the optoelectronic module 10 is a structured light projection module), an image collector 20 and a processor 30. The depth camera 100 may be formed with a projection window 40 corresponding to the optoelectronic module 10 and a collection window 50 corresponding to the image collector 20. The optoelectronic module 10 is used for projecting a laser pattern to a target space through the projection window 40. The laser pattern is a coded structured light (a coded pattern consisting of a collection of a limited number of unique sub-patterns), for example, a two-dimensional coded structured light pattern, referred to as a reference pattern, in which the pattern in each unique pattern window is unique. The image collector 20 is used for collecting the laser pattern modulated by the target object, i.e. the image pattern, through the collecting window 50. In one example, the laser light projected by the optoelectronic module 10 is infrared light, and the image capturing device 20 is an infrared camera. The processor 30 is connected to the optoelectronic module 10 and the image collector 20, and the processor 30 is configured to process the imaging pattern to obtain a depth image. Specifically, the processor 30 decodes the encoded imaging pattern to find the corresponding relationship between each pixel point in the imaging pattern and each corresponding pixel point in the reference pattern, and further obtains the depth image of the laser pattern according to the corresponding relationship.
the optoelectronic module 10 may be a 3D depth-of-field camera module, such as a structured light projection module 10, a Time of Flight (TOF) imaging module, and the like; of course, the optoelectronic module 10 may also be other imaging modules, such as a face recognition sensor module, specifically a camera module; the optoelectronic module 10 may also be a pure light emitter, such as an LED, an automotive light fixture, or the like. It is understood that the specific form of the photovoltaic module 10 may be other devices, such as any element with a large heat generation amount, and is not limited herein.
Referring to fig. 3, in one example, the optoelectronic module 10 is a structured light projection module 10. The structured light projection module 10 is configured to project a laser pattern, which may be a speckle pattern or an encoding pattern, to a target space. By collecting and processing the laser pattern modulated by the target object, a depth image of the target object in the target space can be obtained.
The optoelectronic module 10 includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13.
Referring to fig. 4 to 6, the circuit board assembly 11 includes a heat dissipating substrate 111, a heat generating element 112, a circuit board 113, a stiffener 114, a connector 115, and a non-emission source device 116.
Specifically, the heat dissipating substrate 111 includes a carrying surface 1111, a connection surface 1112 opposite to the carrying surface 1111, a first conductive element 1113 formed on the carrying surface 1111, a second conductive element 1114 formed on the connection surface 1112, a metal layer 1115, and a plurality of conductive vias 1116 penetrating the carrying surface 1111 toward the connection surface 1112. The heat generating element 112 is disposed on the carrying surface 1111, the carrying surface 1111 of the heat dissipating substrate 111 is used for carrying the lens barrel 12 (shown in fig. 3) and the heat generating element 112, and the circuit board 113 is disposed on the connecting surface 1112. A metal layer 1115 is disposed on the inner wall of the conductive via 1116, and the second conductive element 1114 and the first conductive element 1113 are electrically connected by the metal layer 1115. The metal layer 1115 may be both electrically and thermally conductive to the first conductive element 1113 and the second conductive element 1114. The heat generated by the heat generating element 112 and conducted to the first conductive element 1113 is conducted to the second conductive element 1114 through the metal layer 1115 to dissipate the heat of the heat generating element 112. The number of conductive vias 1116 is determined by the heat dissipation requirements and the functional requirements. The opening position of the conductive via 1116 is determined according to the mounting position of the component on the heat dissipating substrate 111, and may be located in a region where the heating element 112 is located or in a region other than the region where the heating element 112 is located. The metal layer 1115 is a material that is both thermally and electrically conductive, such as at least one or more of metallic iron, copper, and silver.
The heat dissipation substrate 111 may be a ceramic substrate or a metal substrate. The ceramic substrate is made of a ceramic material, and the ceramic material comprises any one of an aluminum nitride (AlN) single-layer board, an aluminum nitride (AlN) multilayer co-fired circuit board, an aluminum oxide (Al2O3) single-layer board, an aluminum oxide (Al2O3) multilayer co-fired circuit board and a low-temperature co-fired ceramic multilayer circuit board. The thermal conductivity of the aluminum nitride (AlN) single-layer board is as high as 170W/(m.K), and compared with that of the traditional flexible circuit board (0.38W/(m.K)), the thermal conductivity of the aluminum nitride (AlN) single-layer board is higher, the heat dissipation efficiency is high due to high thermal conductivity, and the single-layer circuit board is simple in process and low in cost; the thermal conductivity coefficient of the aluminum nitride (AlN) multilayer co-fired circuit board is as high as 170W/(m.K), the high thermal conductivity enables the heat dissipation efficiency to be high, and multilayer circuits can be wired with more wires; the thermal conductivity coefficient of the aluminum oxide (Al2O3) single-layer board is higher and reaches 24W/(m.K), the high thermal conductivity enables the heat dissipation efficiency to be high, and the single-layer circuit board has simple process and low cost; the aluminum oxide (Al2O3) multilayer co-fired circuit board has high thermal conductivity coefficient which reaches 24W/(m.K), high thermal conductivity enables the heat dissipation efficiency to be high, and multilayer circuits can be wired with more wires; the low-temperature co-fired ceramic multilayer circuit board has good thermal conductivity coefficient which reaches 2.5W/(m.K), simple process, low cost and high heat dissipation efficiency. The metal substrate is made of a metal material, and the metal material includes any one of a copper alloy metal substrate, an aluminum alloy metal substrate, and a stainless steel alloy metal substrate. The thermal conductivity of the copper alloy metal substrate is as high as 385W/(m.K), and compared with that of the traditional flexible circuit board (0.38W/(m.K)), the thermal conductivity of the copper alloy metal substrate is higher, the heat dissipation efficiency is high due to the high thermal conductivity, a single-layer circuit can be used, and the process is simple. The thermal conductivity coefficient of the aluminum alloy metal substrate is as high as 201W/(m.K), and a plurality of layers of circuits can be arranged, and the heat dissipation efficiency is high due to high thermal conductivity; the stainless steel alloy metal substrate has high thermal conductivity coefficient reaching 17W/(m.K), can be used for running a single-layer circuit, and has low cost, simple process and high heat dissipation efficiency. When a ceramic substrate is adopted, the first conductive element 1113 can be formed by etching on the carrying surface 1111 of the heat dissipation substrate 111, the heating element 112 is attached to the first conductive element 1113 by conductive silver paste, and heat generated by the heating element 112 is dissipated and absorbed by the first conductive element 1113 and the ceramic substrate; when a metal substrate is used, the first conductive element 1113 is obtained by processing the heat dissipation substrate 111 with ni-pd-au or electroless ni-au, the heating element 112 is attached to the first conductive element 1113, and heat generated by the heating element 112 is dissipated and absorbed through the first conductive element 1113 and the metal substrate. Of course, besides the above ceramic material and metal material, other suitable materials can be adopted for the heat dissipation substrate 111, and only the heat dissipation requirement needs to be satisfied, for example: the thermal conductivity is not less than 2.5W/(mK). The material of the heat dissipating substrate 111 according to the embodiment of the present invention is an aluminum nitride (AlN) single layer plate.
The heating element 112 may be a light source 112, the light source 112 may be a Laser emitter, the Laser emitter may be a Vertical Cavity Surface Emitting Laser (VCSEL), the light source 112 may also be an LED lamp, and in this embodiment, the heating element 112 is a VCSEL. The VCSEL includes a semiconductor substrate and light emitting elements provided on the substrate, and the substrate may be provided with a single light emitting element or an array laser composed of a plurality of light emitting elements, and specifically, the plurality of light emitting elements may be arranged on the substrate in a regular or irregular two-dimensional pattern. Of course, the heating element 112 may be other electronic components, such as: photodetectors, temperature sensors, and the like.
The first conductive member 1113 includes at least one pad 1117, and the light source 112 is disposed on the pad 1117 of the first conductive member 1113 by a conductive silver paste. The second conductive element 1114 includes at least one pad 1118 and the circuit board 113 defines a via 1132. The reinforcing plate 114 includes a reinforcing body 1142 and a boss 1144 extending from the reinforcing body 1142, the boss 1144 penetrates through the via 1132 to contact with the heat dissipation substrate 111, wherein the contact includes direct contact and indirect contact, and the boss 1144 of the embodiment of the present invention indirectly contacts with the heat dissipation substrate 111. Specifically, the via 1132 corresponds to an area where the light source 112 is located, for example, the via 1132 may be located in a projection area of the light source 112 on the circuit board 113, and the size of the via 1132 is matched with the size of the boss 1144 to ensure that the boss 1144 smoothly passes through the via 1132. The boss 1144 penetrates through the via 1132 and is connected with the pad 1118 of the second conductive element 1114 through high-temperature solder paste, so that the indirect contact between the boss 1144 and the second conductive element 1114 is realized through the solder paste. The high-temperature solder paste has high thermal conductivity, can quickly conduct the heat of the heat dissipation substrate 111 to the boss 1144, and therefore is evacuated through the reinforcing plate 114, and has a good heat dissipation effect. The high-temperature solder paste is also high-temperature resistant, is not easily influenced by high-temperature environment after connection, and has good combination stability. In addition, compared with the conventional conductive circuit, the area of the pad 1117 of the first conductive element 1113 and the area of the pad 1118 of the second conductive element 1114 are larger, so that the soldering is facilitated and the connection is firmer, the contact area between the pad 1117 of the first conductive element 1113 and the light source 112 is larger, the contact area between the pad 1118 of the second conductive element 1114 and the boss 1144 is larger, and the first conductive element 1113, the heat dissipation substrate 111, the second conductive element 1114 and the reinforcing plate 114 are matched to quickly disperse and absorb heat generated by the light source 112, thereby improving the heat dissipation effect.
One end of the circuit board 113 is disposed on the connection face 1112 and covers an area of the second conductive element 1114 outside the area where the lands 1144 are located, which may be the pads 1118. The circuit board 113 is arranged on the second conductive element 1114 through high-temperature solder paste, the combination area of the circuit board 113 and the second conductive element 1114 is large, the combination strength can be guaranteed, the high-temperature solder paste is high-temperature resistant, and the combination stability is good. The non-emissive source device 116 is disposed on the first conductive element 1113 by high temperature solder paste. Of course, the connection of the light source 112 and the heat dissipation substrate 111, the connection of the circuit board 113 and the heat dissipation substrate 111, the connection of the boss 1144 and the heat dissipation substrate 111, and the connection of the non-emission source device 116 and the heat dissipation substrate 111 may all be connected by conductive silver paste, or may all be connected by high temperature solder paste. The conductive silver paste has good conductivity and heat conductivity, and the high-temperature solder paste is low in cost, so that the conductive silver paste or the high-temperature solder paste can be determined to be used according to the heat dissipation requirements, the conductive requirements and the cost of different connecting positions, and the cost is saved while the heat dissipation performance and the electric conductivity are considered. The solder paste is divided into high-temperature solder paste and low-temperature solder paste, the high-temperature solder paste has better high-temperature resistance performance relative to the low-temperature solder paste, and the heat generated by the connecting area of the non-emission source device 116 and the heat dissipation substrate 111 and the connecting area of the circuit board 113 and the heat dissipation substrate 111 is less relative to the heat generated by the light source 112, so that the low-temperature solder paste can be used for connection. The heat dissipation substrate 111 and the light source 112 are connected through conductive silver paste, and the heat dissipation substrate 111 and the circuit board 113, the non-emission source device 116 and the boss 1144 are connected through high-temperature solder paste, so that better conductivity, heat dissipation effect and connection stability are obtained. The other end of the circuit board 113 is provided with a connector 115, and the connector 115 can connect the structured light projection module 10 to the main board of the electronic device 1000 in the embodiment of fig. 1. The circuit board 113 is mounted on the pad 1118 by a Surface Mount Technology (SMT) process, which has low processing difficulty, high mounting yield and is easy to automate. The circuit board 113 is electrically connected to the second conductive element 1114, such that the circuit board 113 and the light source 112 can be electrically connected to enable control of the light source 112 by the second conductive element 1114, the metal layer 1115, and the first conductive element 1113 cooperating. The circuit board 113 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flex board.
The reinforcing body 1142 of the reinforcing plate 114 has a plurality of heat dissipating through holes 1146, that is, the heat dissipating through holes 1146 are located in the region outside the region of the boss 1144. The reinforcing plate 114 is disposed on a surface of the circuit board 113 opposite to the connecting surface 1112, that is, the circuit board 113 is located between the connecting surface 1112 and the reinforcing plate 114, and the reinforcing plate 114 can reinforce the strength of the connecting region between the circuit board 113 and the heat dissipating substrate 111. The heat dissipating through hole 1146 corresponds to the circuit board 113 and the light source 112, and may be: the heat dissipation through hole 1146 corresponds to only the area of the circuit board 113 facing the light source 112, and may also be: the heat dissipation through-hole 1146 and the circuit board 113 correspond to the entire area where the heat dissipation substrate 111 is connected, thereby rapidly conducting and dissipating heat generated from the light source 112. The number of the heat dissipating through holes 1146 is determined according to the strength requirement, weight reduction requirement, and heat dissipation requirement of the circuit board assembly 11. The reinforcing plate 114 may be made of metal, such as copper, iron, or copper alloy, etc., which is easy to process and has good heat conduction effect. Of course, the reinforcing plate 114 may be made of other materials, and only the strength requirement and the heat dissipation requirement need to be satisfied. The reinforcing plate 114 according to the embodiment of the present invention is a copper alloy reinforcing plate. The lands 1144 are formed by processing through an etching process or a laser etching process on the surface of the reinforcing plate 114 opposite to the circuit board 113, and the process is simple. The bosses 1144 may also be formed by other processes, for example, the bosses 1144 may be formed by a stamping process (shown in fig. 7) and have high strength, and the bosses 1144 may be formed by a stamping process (shown in fig. 8) and have high processing precision, high strength and light weight.
Referring to fig. 2, 4, 5 and 6, the non-emission source device 116 may be a thermal element 116, the thermal element 116 is disposed on the carrying surface 1111 and electrically connected to the first conductive element 1113, the first conductive element 1113 is electrically connected to the second conductive element 1114, and the circuit board 113 is electrically connected to the second conductive element 1114, so that the thermal element 116 is electrically connected to the circuit board 113, when the light source 112 generates heat during operation, the thermal element 116 detects the temperature condition of the heat dissipation substrate 111 in real time, and the processor 30 controls the operating power of the light source 112 according to the temperature condition. For example, the power of the light source 112 is reduced when the temperature is too high to prevent the circuit board assembly 11 and the like from being damaged by the too high temperature.
when the circuit board assembly 11 is in operation, the light source 112 generates heat, which is conducted to the heat dissipating substrate 111 through the first conductive element 1113, conducted to the second conductive element 1114 through the metal layer 1115 and the heat dissipating substrate 111, and then conducted to the boss 1144 through the second conductive element 1114 to rapidly dissipate the heat through the reinforcing plate 114. Since the first conductive element 1113, the heat dissipation substrate 111, the metal layer 1115, the second conductive element 1114 and the reinforcing plate 114 all have good thermal conductivity, the heat conduction effect is good, so that the heat of the light source 112 is rapidly dissipated, and the heat dissipation efficiency is high.
Referring to fig. 3 again, the lens barrel 12 is carried on the circuit board assembly 11 and forms a receiving cavity 121 together with the circuit board assembly 11, one end of the circuit board 113 is disposed on the carrying surface 1111 of the heat dissipating substrate 111 and located outside the lens barrel 12, the other end of the circuit board 113 is connected to the connector 115, and the connector 115 can connect the structured light projection module 10 to the main board of the electronic device 1000 in the embodiment of fig. 1. The lens barrel 12 may be made of plastic, and the light source 112 and the optical assembly 13 are both accommodated in the accommodating cavity 121. The light source 112 is used to emit laser light. The optical assembly 13 is used to diffract the laser light to form a laser light pattern. The Optical assembly 13 may include a collimating element 131 and a Diffractive element 132 (DOE). The collimating element 131 is used to condense or collimate the laser light emitted from the light source 112, and the diffraction element 132 is formed with a diffraction structure capable of diffracting the laser light passing through the collimating element 131. When the structured light projection module 10 is in operation, laser light emitted from the VCSEL sequentially passes through the collimating element 131 and the diffracting element 132, and then projects a laser light pattern outward.
In summary, in the circuit board assembly 11 according to the embodiment of the invention, the heating element 112 is disposed on the carrying surface 1111 of the heat dissipating substrate 111, the circuit board 113 is disposed on the connecting surface 1112 of the heat dissipating substrate 111, and the through hole 1132 is disposed on the circuit board 113, so that the boss 1144 penetrates through the through hole 1132 and is connected to the connecting surface 1112, and thus heat of the heating element 112 is conducted and dissipated through the heat dissipating substrate 111 and the reinforcing plate 114, and the heat dissipating effect is good.
In some embodiments, a thermally conductive material, such as a thermally conductive paste, may be disposed within the conductive vias 1116 and the heat dissipating vias 1146. Therefore, the heat evacuation speed can be increased, and the heat dissipation effect is improved.
Referring to fig. 9, in another embodiment, the optoelectronic module 10 may be a camera module. The camera module can be a visible light camera module or an infrared camera module. The camera module includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13. At this time, the heating element 112 may be a Complementary Metal Oxide Semiconductor (CMOS) image sensor chip or a Charge-coupled Device (CCD) image sensor chip, and the lens barrel 12 is carried on the circuit board assembly 11 and forms a receiving cavity 121 together with the circuit board assembly 11. The connection mode of the lens barrel 12 and the circuit board assembly 11 includes gluing and clamping. The image sensing chip 112 and the optical assembly 13 are both housed in the lens barrel 12. The optical assembly 13 includes a lens 133, and the image sensing chip 112 is disposed on the image side of the lens 133, specifically, the optical axis of the optical assembly 13 coincides with the center normal of the image sensing chip 112. When the optoelectronic module 10 is in operation, light reflected by the target object passes through the optical assembly 13 and is imaged on the image sensor chip 112. In the present embodiment, the lens 133 may be a separate lens, which is a convex lens or a concave lens; or the lens is a plurality of lenses which can be convex lenses or concave lenses, or part of the lenses is convex lenses and part of the lenses is concave lenses.
Referring to fig. 9, the optical assembly 13 further includes a filter 134, such as an infrared cut filter (in this case, the optoelectronic module 10 is a visible light camera module), where the filter 134 is used to adjust a wavelength range of the imaging light, and specifically, to filter the infrared light in the natural light so that the infrared light cannot enter the circuit board assembly 11, thereby preventing the infrared light from affecting the color and the definition of the image formed by the visible light imaging. Of course, the optical filter 134 may also be an infrared pass filter (at this time, the optoelectronic module 10 is an infrared camera module), and the optical filter 134 is configured to adjust a light wavelength section of the imaging, and specifically, is configured to only allow infrared light to enter the circuit board assembly 11 (to prevent visible light from entering the circuit board assembly 11), so as to ensure color and definition of an image formed by infrared light imaging. The filter 134 is received in the receiving cavity 121 and disposed between the circuit board assembly 11 and the optical assembly 13. When the optoelectronic module 10 is in operation, light reflected by the target object enters the optoelectronic module 10, passes through the lens 133 and the filter 134 in sequence, and is imaged on the image sensor chip 112.
Referring to fig. 1, the present invention further provides an electronic device 1000, and the electronic device 1000 may include the optoelectronic module 10 shown in fig. 9. In other words, the optoelectronic module 10 described above as a camera module can also be applied to the electronic device 1000. At this time, the optoelectronic module 10 can be used to obtain a visible light image or an infrared light image.
Similarly, in the electronic device 1000, the optoelectronic module 10, and the circuit board assembly 11 according to the embodiment of the invention, the heating element 112 is disposed on the carrying surface 1111 of the heat dissipation substrate 111, the circuit board 113 is disposed on the connecting surface 1112 of the heat dissipation substrate 111, and the through hole 1132 is disposed on the circuit board 113, so that the boss 1144 is connected to the connecting surface 1112 through the through hole 1132, and thus heat of the heating element 112 is dissipated by conduction through the heat dissipation substrate 111 and the reinforcing plate 114, and the heat dissipation effect is good.
In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims (15)

1. A circuit board assembly, comprising:
The radiating substrate comprises a bearing surface and a connecting surface opposite to the bearing surface, wherein a first conductive element is formed on the bearing surface, and a second conductive element is formed on the connecting surface;
The heating element is arranged on the bearing surface and is electrically connected with the first conductive element;
the circuit board is arranged on the connecting surface and is electrically connected with the second conductive element, and a through hole is formed in the circuit board; and
The reinforcing plate of heat conduction, the reinforcing plate sets up the circuit board with connect on the face that the face carried on the back mutually, the reinforcing plate includes the reinforcement body and certainly the boss that the reinforcement body extends, the boss wear to establish the via hole and with the heat dissipation base plate contact.
2. the circuit board assembly of claim 1, wherein the first conductive element includes a pad, and the heat generating element is disposed on the pad of the first conductive element.
3. The circuit board assembly of claim 2, wherein the heating element is attached to the pad of the first conductive element by a conductive silver paste.
4. A circuit board assembly according to claim 2, further comprising a non-emissive source electrical device disposed on the first conductive element by solder paste.
5. The circuit board assembly of claim 1, wherein the second conductive element includes a land, and wherein the boss is disposed on the land of the second conductive element, the boss corresponding to the heat generating element.
6. The circuit board assembly of claim 5, wherein the bumps are disposed on the pads of the second conductive element by solder paste.
7. The circuit board assembly of claim 1, wherein the circuit board is disposed on the second conductive element by solder paste.
8. The circuit board assembly of claim 1, wherein the heat-dissipating substrate comprises a ceramic substrate or a metal substrate.
9. the circuit board assembly of claim 1, wherein the thermal conductivity of the heat-dissipating substrate is 2.5W/m-K or greater.
10. The circuit board assembly according to claim 1, wherein the heat dissipation substrate defines a plurality of conductive vias, inner walls of the conductive vias are provided with metal layers, the first conductive element and the second conductive element are electrically connected through the metal layers, and one end of the circuit board is disposed on the connection surface and electrically connected to the second conductive element.
11. The circuit board assembly of claim 1, wherein the stiffener further defines a plurality of heat dissipating through holes, and the heat dissipating through holes are located outside the region of the boss.
12. The circuit board assembly of claim 1, wherein the stiffener is attached to the circuit board by an adhesive.
13. An optoelectronic module, comprising:
The circuit board assembly of any one of claims 1-12; and
An optical assembly disposed on the circuit board assembly, the optical assembly corresponding to the circuit board assembly.
14. A depth camera, comprising:
The optoelectronic module of claim 13, the heat generating element being a light source and configured to emit laser light, the optical assembly including a beam generator disposed on the circuit board assembly, the beam generator being spaced apart from the light source and configured to convert the laser light into a laser light pattern;
The image collector is used for collecting the laser pattern projected by the photoelectric module; and
And the processor is respectively connected with the photoelectric module and the image collector and is used for processing the laser pattern to obtain a depth image.
15. An electronic device, comprising:
A housing; and
the depth camera of claim 14, disposed within and exposed from the housing to acquire a depth image.
CN201810551924.9A 2018-05-31 2018-05-31 Circuit board assembly, photoelectric module, depth camera and electronic device Pending CN110557881A (en)

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WO2022057597A1 (en) * 2020-09-18 2022-03-24 华为技术有限公司 Circuit board assembly, camera module, and electronic device

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KR20180016799A (en) * 2016-08-08 2018-02-20 삼성전자주식회사 Printed circuit board assembly
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KR20180016799A (en) * 2016-08-08 2018-02-20 삼성전자주식회사 Printed circuit board assembly
CN106572592A (en) * 2016-10-31 2017-04-19 努比亚技术有限公司 Circuit board
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