CN106572592A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN106572592A CN106572592A CN201610978487.XA CN201610978487A CN106572592A CN 106572592 A CN106572592 A CN 106572592A CN 201610978487 A CN201610978487 A CN 201610978487A CN 106572592 A CN106572592 A CN 106572592A
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- China
- Prior art keywords
- conductive
- hole
- heat
- circuit board
- heat carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board. Through arranging thermal conductors in the circuit board and between a first conductive through hole and a second conductive through hole of conductive through holes, heat, which is conducted to a conductive base from an electronic component and enters into the first conductive through hole, can be transferred to another wiring surface through the first conductive through hole and be radiated to the outside world, and can be conducted to the second conductive through hole through the thermal conductors, then is transferred to another wiring surface from the second conductive through hole and then is radiated and spread out. Through the thermal conductors, heat in the first conductive through hole is simultaneously conducted and transferred to the outside world from two different paths. At least two thermal conduction ways are adopted. Compared to the prior art, by using the circuit board of the invention, thermal conduction efficiency is increased, and a heat dissipation speed is accelerated so that heat on the circuit can be timely emitted; problems of poor performance and a short service life, which are generated because an electronic component works in a high temperature environment, are avoided; and a service life of electronic equipment is prolonged and a user experience is improved.
Description
Technical field
The present invention relates to electronic device field, more particularly, it relates to a kind of circuit board.
Background technology
With electronic technology development, for the use of the user that preferably fits, terminal unit increasingly tend to it is intelligent and
Miniaturization.For example, the smart mobile phone from original portable phone till now, not only function become more powerful, reaction more
Plus it is sensitive, while volume becomes more compact, facilitate user to carry with, win the welcome of users.
But, as the lifting of terminal unit portable performance develops, the integrated level of terminal inner electronic component inherently into
Increase again.And numerous electronic components that service is provided are carry on circuit board, these electronic components it is when work or many or
Some heats can be all produced less；On the other hand, narrow space on circuit board, each region is precious element setting area
Domain or wiring area, without where special arranging the heat abstractor for electronic component, so electronics unit in prior art
The radiating of part has difficulties.And if heat dissipation problem cannot be solved, the reliability and working life of electronic component will be affected,
So as to have influence on experience of the user to electronic equipments such as terminals；Meanwhile, the heat dissipation problem of electronic component cannot be solved, then circuit
The integrated level of plate can not be lifted preferably, and this is by the development of whole industry, so the heat dissipation problem of circuit board is stranded always
Disturb the big problem of electronic device industry.
The content of the invention
The technical problem to be solved in the present invention is：The radiating of electronic element on circuit board is difficult so as to causing electronic component
Functional reliability be affected not in time the problem even damaged because of radiating, for the technical problem, there is provided a kind of circuit
Plate.
To solve above-mentioned technical problem, the present invention provides a kind of circuit board, and the circuit board is included positioned at two cloth
The conductive through hole of the conductive base electrical communication on line face, the conductive through hole includes that the first conductive through hole and the second conduction are logical
Hole；Heat carrier is provided between first conductive through hole and second conductive through hole inside the circuit board, it is described to lead
Hot body be used for by from electronic component be transmitted to conductive base and into first conductive through hole heat part dispersion be transmitted to
In second conductive through hole, the heat that the electronic component is produced is set to lead via first conductive through hole and described second
Electric through-hole is transferred to the conductive base of another wiring side and radiate.
Further, the circuit board is the multi-layer PCB board for including multiple wiring sides.
Further, it is more than the Heat Conduction Material of air filled with thermal conductivity in the conductive through hole.
Further, the Heat Conduction Material is heat conductive silica gel.
Further, the heat-conducting piece is metal material, the heat-conducting piece contact when different first conductive through hole with
Second conductive through hole.
Further, the heat-conducting piece is the nonmetallic materials of insulation, and first is conductive described in the heat-conducting piece directly contact
Through hole and second conductive through hole.
Further, first conductive through hole is that making for electronic component is deployed on the conductive base being connected with itself
Use conductive through hole；Or the conductive base being connected with itself does not dispose electronic component, but self by the heat carrier with it is described
The unused conductive through hole being joined directly together using conductive through hole；Second conductive through hole is the conductive base being connected with itself
Electronic component is not disposed, and itself is not through heat carrier and the unused conductive through hole being joined directly together using conductive through hole.
Further, it is deployed with radiator on the conductive base being connected with the unused conductive through hole；The radiator
Transfer out next heat from unused conductive through hole and be distributed to the external world for absorbing.
Further, the circuit board includes multiple conductive through holes, and arranges and the plurality of conductive through hole between
Multiple heat carriers.
Further, each described heat carrier described in first conductive through hole and at least two between second conductive through hole
It is an entirety, or each heat carrier is contacted with each other.
Beneficial effect
The embodiment of the present invention provides a kind of circuit board, includes on the circuit board conductive base on two wiring sides is electrical
The conductive through hole of connection, the scheme in the embodiment of the present invention is by the first conductive through hole inside circuit board, in conductive through hole
And second arrange heat carrier between conductive through hole so that be transmitted to conductive base from electronic component and to enter into first conductive logical
Heat in hole can not only be transferred on another wiring side and be radiated the external world by the first conductive through hole, and can also pass through
Heat carrier between first conductive through hole and the second conductive through hole is transmitted to the second conductive through hole and after the second conductive through hole
Re-radiation on another wiring side is transferred to from the second conductive through hole to disperse away.By being arranged on leading between two conductive through holes
Hot body, by the heat in the first conductive through hole from two different paths outwards conduction transfers simultaneously.Passed using at least two heat
Approach is led, compared with prior art, the conduction efficiency of heat is increased, radiating rate is accelerated so that the heat on circuit
Can timely be distributed, it is to avoid poor performance, the problem of short life that electronic component is operated in hot environment class and causes,
The working life of electronic equipment is extended, Consumer's Experience is improve.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is a kind of generalized section of the circuit board provided in first embodiment of the invention；
Fig. 2 leads a kind of schematic diagram of set-up mode of heat carrier between a through hole for what is provided in first embodiment of the invention；
Fig. 3 is another kind of generalized section of the circuit board provided in first embodiment of the invention；
Fig. 4 is a kind of generalized section of the circuit board provided in second embodiment of the invention；
Fig. 5 is a kind of top view of the circuit board provided in second embodiment of the invention；
Fig. 6 is another kind of top view of the circuit board provided in second embodiment of the invention.
Specific embodiment
It should be appreciated that specific embodiment described herein is not intended to limit the present invention only to explain the present invention.
First embodiment：
Electronic element on circuit board radiates not in time in electronic equipment in order to solve the problems, such as prior art, the present embodiment
A kind of circuit board is provided, Fig. 1 is referred to：
Circuit board 10 includes being provided with conductive through hole, and on a circuit board 10, conductive through hole can have one or more,
In the present embodiment, circuit board 10 includes two conductive through holes, and those skilled in the art are it is to be appreciated that the number of conductive through hole
Mesh is arranged according to the actual demand being electrically connected with, and in the middle of other examples of the present embodiment, the number of conductive through hole can also
It is more.Describe for convenience, here two conductive through holes are denoted as into respectively " the first conductive through hole 11 " and " the second conductive through hole
12”.The effect of conductive through hole is the conductive base electrical communication that will be arranged on various wirings face, that is to say, that a conduction is led to
The two ends in hole are connected with two conductive bases on various wirings face, for example, in the middle of Fig. 1, the two ends of the first conductive through hole 11
It is connected to the first conductive base 13 and the second conductive base 14.Likewise, the two ends of the second conductive through hole 12 also respectively with
3rd conductive base 15 and the 4th conductive base 16 are connected.Can be connected with electronic component in each conductive base, for example,
In the middle of Fig. 1, the first conductive base 13 is just connected with the pin of electronic component 17.
Due to needing to realize being electrically connected between conductive base and conductive through hole, therefore, in conductive base and conductive through hole
Substantially the good metal level of electric conductivity is both provided with wall.It is well known that the heat conductivility of electronic metal is all relatively good, institute
With, when electronic component 17 is in work, it will produce heat, heat can be transmitted on the first conductive base 13, and the
One conductive base 13 can conduct heat to the first conductive through hole 11 being attached thereto, in the middle of the first conductive through hole 11, heat
Amount not only can be along the metal layer conductive of the inwall of the first conductive through hole 11 to the second conductive base 14 positioned at another wiring side
On, the external world is radiated by the second conductive base 14, and because the first conductive through hole 11 is hollow, therefore, heat may be used also
From in the middle of the first conductive through hole 11, another wiring side is transferred in the form of hot-fluid.
The first conductive through hole in the present embodiment refers to there is currently heat needs the conductive through hole of conduction transfer, and second
Conductive through hole refers to the conductive through hole of the object that heat transfer is conducted as the first conductive through hole.Therefore, the first conductive through hole with
Second conductive through hole is relative concept, when there is multiple conductive through holes on circuit board, can be simultaneously
There are multiple first conductive through holes, there is also multiple second conductive through holes.
In the present embodiment, heat carrier 18, heat carrier are also included between the first conductive through hole 11 and the second conductive through hole 12
18 inside that circuit board 10 is set, and between the first thermal hole 11 and the second thermal hole 12.Heat carrier 18 can be by heat conduction
The higher non-metallic material of rate is made, it is also possible to be made up of metal material.When heat carrier 18 is by the higher non-metallic material of thermal conductivity
When material is made, if nonmetallic materials do not have electric conductivity, the i.e. nonmetallic materials of 18 insulation of heat carrier, such as thermal conductive silicon
Glue, then its directly can contact with the first conductive through hole 11 and the second conductive through hole 12, and can be with two conductive through holes
Contact simultaneously.But if heat carrier is made up of metal material, or is made up of the preferable nonmetallic materials of conductivity, such as stone
Ink etc., then heat carrier 18 can not simultaneously contact the first conductive through hole 11 and the second conductive through hole 12, because the first conductive through hole 11
It is likely to that electrical communication need not be realized between the second conductive through hole 12.Though it will be appreciated by those skilled in the art that
When so heat carrier 18 is made for metal material, it can not directly connect with the first conductive through hole 11 and the second conductive through hole 12 simultaneously
Touch, but for preferably heat conduction, it can be contacted with the first conductive through hole 11, directly not connect between the second conductive through hole 12
Touch, for example, between the conductive through hole 12 of heat carrier 18 and second heat conduction silicone is applied.
It is provided between first conductive through hole 11 and the second conductive through hole 12 after heat carrier 18, heat can be from heat carrier
It is transmitted on 18 on second conductive through hole 12, and the inwall by the second conductive through hole 12 is transmitted on the 4th conductive base 16 again
The external world is dispersed into, while the hollow pipeline that can also be formed by the second conductive through hole 12 is transmitted to another cloth in the form of hot-fluid
Line.
It should be appreciated that the form of heat carrier can be block or stratiform.Can be between two conductive through holes
One heat carrier is only set, it is also possible to while arrange multiple heat carriers, this multiple heat carrier may be in same plane,
May be in Different Plane.Fig. 2 shows a kind of scheme that heat carrier is arranged in Different Plane, the first heat carrier 181, the
Two heat carriers 182 and the 3rd heat carrier 184 are arranged in different planes, and are parallel to each other.Multiple heat conduction physical abilitys are set
Enough increase heat from the pathway between first the 11 to the second conductive through hole of conductive through hole 12, improve from the first conductive through hole 11 to
Heat conduction efficiency between second conductive through hole 12, further speeds up radiating rate.
In the other in the middle of some examples of the present embodiment, in order to lift conduction efficiency of the conductive through hole to heat, can be with
In the higher Heat Conduction Material of conductive through hole central filler thermal conductivity ratio, it should be understood that, in this case, in conductive through hole simultaneously
It is not hollow, and the thermal conductivity for the Heat Conduction Material of filling should as far as possible be more than air, so just can bring than conduction
Via hollow preferably heat-conducting effect.The material of such as filling can be heat conductive silica gel.
If the conductive base being connected with a conductive through hole is connected with electronic component, we are referred to as the conductive through hole
Using conductive through hole, and if the conductive base at a conductive through hole two ends is in idle state, electronic component is not disposed,
Then the conductive through hole can be divided into unused conductive through hole.In the middle of a kind of example of the present embodiment, can be using
Conductive through hole as the first conductive through hole, using unused conductive through hole as the second conductive through hole.Or those can also be selected
Though do not dispose on conductive base electronic component self by heat carrier be joined directly together not using conductive through hole
Using conductive through hole as the first conductive through hole, and select those neither used conductive through hole, either with or without with using leading
The unused conductive through hole that electric through-hole is joined directly together is used as the second conductive through hole.This have the advantage that, can pass in transfer
The working environment of other components and parts is not affected when heat conduction amount as far as possible.
In the middle of a kind of example of the present embodiment, can dispose on the conductive base that those unused conductive through holes are connected
Radiator；Using radiator absorb from unused conductive through hole transfer out come heat and be distributed to the external world.As shown in figure 3,
Radiator 19 is deployed with 3rd conductive base 15 and the 4th conductive base 16, the material of radiator 19 can be thermal conductive silicon
The higher material of the thermal conductivitys such as glue, graphite.
A kind of circuit board is present embodiments provided, includes electrically connecting the conductive base on two wiring sides on the circuit board
Logical conductive through hole, the scheme in the embodiment of the present invention by the first conductive through hole inside circuit board, in conductive through hole with
And second arrange heat carrier between conductive through hole so that be transmitted to conductive base from electronic component and enter into the first conductive through hole
In heat can not only be transferred on another wiring side and be radiated the external world by the first conductive through hole, and can also be by the
Heat carrier between one conductive through hole and the second conductive through hole be transmitted to the second conductive through hole and after the second conductive through hole from
Second conductive through hole is transferred to re-radiation on another wiring side to be disperseed away.By the heat conduction being arranged between two conductive through holes
Body, by the heat in the first conductive through hole from two different paths outwards conduction transfers simultaneously.Using at least two conduction of heat
Approach, compared with prior art, increased the conduction efficiency of heat, accelerate radiating rate.
Meanwhile, in the present embodiment, can be disposed being not used on conductive base with filling Heat Conduction Material in conductive through hole
Radiator, further increases radiation efficiency of the conductive through hole to the conduction efficiency and conductive base of heat to heat so that electricity
Heat on the plate of road can be distributed in time so that the heat on circuit can be distributed timely, it is to avoid electronics unit
Poor performance, the problem of short life that part is operated in hot environment class and causes, extend the working life of electronic equipment, improve
Consumer's Experience
Second embodiment：
Due to can simultaneously there are multiple conductive through holes on circuit board, therefore, the present embodiment will be more with regard to existing on circuit board
The scheme that heat carrier is arranged during individual conductive through hole is introduced, in order to make it easy to understand, being introduced below in conjunction with Fig. 4：
It is the same with the circuit board provided in first embodiment, it is same including two wirings on the circuit board 40 in the present embodiment
Layer, but those skilled in the art are it is to be appreciated that the thinking provided in the present embodiment is not limited in two wiring layers
Implement on circuit board, the circuit of multiple wiring layers similarly can be with, for example, can be real on the pcb board including multiple wiring sides
Apply.Be provided with four conductive through holes on two wiring layers of the present embodiment circuit board 40, be respectively the first conductive through hole 411,
Second conductive through hole 412, the 3rd conductive through hole 413 and the 4th conductive through hole 414, the two ends of this four conductive through holes are again respectively
It is provided with two conductive bases.Those skilled in the art it is to be appreciated that in the present embodiment conductive through hole unlimited number in
Four, also including three, five, six it is even more many, the number of conductive base is also not necessarily limited to 8.First conductive through hole 411,
Second conductive through hole 412, the arrangement between the 3rd conductive through hole 413 and the dead of the 4th conductive through hole 414 are not necessarily pressed
According to being in straight line shown in Fig. 4, because Fig. 4 is only a kind of front view of circuit board.
Vertical view Fig. 5 of circuit board in Fig. 4 is illustrated below, can more be clearly seen from top view four conductive through holes it
Between position relationship, and in Fig. 5 it can be seen that circuit board 40 in heat carrier set-up mode：First conductive through hole 411, second
Conductive through hole 412, the 3rd conductive through hole 413 and the 4th conductive through hole 414 this four conductive through holes are both provided between any two
Heat carrier, is respectively the first heat carrier 421, the second heat carrier 422, the 3rd heat carrier 423, the 4th heat carrier 424, the 5th heat conduction
Body 425, the 6th heat carrier 426.
It is understood that this six heat carriers can be arranged in approximately the same plane, as shown in Figure 4, it is also possible to arrange
On a different plane.Even, the heat carrier between two conductive through holes can also be regarded as a heat carrier group, such as
Scheme in one embodiment is general, the multiple heat carrier composition radiator groups of the setting between two conductive through holes, and allows one
Multiple heat carriers in individual heat carrier group are in Different Plane or same level.
Heat carrier in Fig. 5 between each conductive through hole is separate not directly contact, therefore, lead when first
When there is the heat for needing to distribute in electric through-hole 411, the approach of heat transfer conduction can only be the first conductive through hole itself, mutually
Independent the first heat carrier 421, the second heat carrier 422 and the 5th heat carrier 425.In order to strengthen radiating effect, can allow each
Heat carrier between individual conductive through hole is contacted with each other, and there is no big gap between heat carrier, and heat can be by contacting with each other
Heat carrier carry out free transfer.Even can be so that as shown in fig. 6, heat carrier 60 is an entirety, this mode be not only helped
Conduct in the transfer of heat, and when heat carrier is produced, technique is also simpler, is favorably improved production efficiency, section
About cost.
The first conductive through hole in the present embodiment refers to there is currently heat needs the conductive through hole of conduction transfer, and second
Conductive through hole refers to the conductive through hole of the object that heat transfer is conducted as the first conductive through hole.Therefore, the first conductive through hole with
Second conductive through hole is relative concept, when there is multiple conductive through holes on circuit board, can be simultaneously
There are multiple first conductive through holes, there is also multiple second conductive through holes.
In the present embodiment, heat carrier can be metal material, for example, metallic copper, or insulated non-metal material
Matter.The thickness of heat carrier can be uniform, it is also possible to uneven.
The circuit board that the present embodiment is provided, not only will can only conduct transfer by a conductive through hole originally by heat carrier
It is transmitted in multiple conductive through holes to extraneous heat, makes this multiple conductive through hole realize that the conduction to heat is shifted jointly, will
One radiating leading point of script is changed into multiple, improves the radiating efficiency of circuit board.And make between multiple conductive through holes
Heat carrier contacts with each other, or the heat carrier of an entirety is arranged between multiple conductive through holes so that the conduction of heat is more certainly
By；The production technology of the also simplified heat carrier of scheme of an overall heat carrier is provided with, the production work of circuit board is simplified
Skill, so as to save the production cost of circuit board.
It should be noted that herein, term " including ", "comprising" or its any other variant are intended to non-row
His property is included, so that a series of process, method, article or device including key elements not only include those key elements, and
And also include other key elements being not expressly set out, or also include for this process, method, article or device institute inherently
Key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
Also there is other identical element in the process of key element, method, article or device.
The embodiments of the present invention are for illustration only, do not represent the quality of embodiment.
Embodiments of the invention are described above in conjunction with accompanying drawing, but be the invention is not limited in above-mentioned concrete
Embodiment, above-mentioned specific embodiment is only schematic, rather than restricted, one of ordinary skill in the art
Under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, can also make a lot
Form, these are belonged within the protection of the present invention.
Claims (10)
1. a kind of circuit board, the circuit board includes leading to the conduction of the conductive base electrical communication on two wiring sides
Hole, the conductive through hole includes the first conductive through hole and the second conductive through hole, it is characterised in that the institute inside the circuit board
State and heat carrier is provided between the first conductive through hole and second conductive through hole, the heat carrier is used to pass from electronic component
Lead conductive base and the heat part dispersion into first conductive through hole is transmitted in second conductive through hole, make institute
The heat for stating electronic component generation is transferred to another wiring side via first conductive through hole and second conductive through hole
Conductive base and radiate.
2. circuit board as claimed in claim 1, it is characterised in that the circuit board is the multi-layer PCB for including multiple wiring sides
Plate.
3. circuit board as claimed in claim 1, it is characterised in that filled with thermal conductivity more than air in the conductive through hole
Heat Conduction Material.
4. circuit board as claimed in claim 3, it is characterised in that the Heat Conduction Material is heat conductive silica gel.
5. circuit board as claimed in claim 1, it is characterised in that the heat-conducting piece is metal material, the heat-conducting piece is different
When contact first conductive through hole with second conductive through hole.
6. circuit board as claimed in claim 1, it is characterised in that the heat-conducting piece is the nonmetallic materials of insulation, described to lead
First conductive through hole described in warmware directly contact and second conductive through hole.
7. circuit board as claimed in claim 1, it is characterised in that first conductive through hole is the conductive base being connected with itself
Electronic component is deployed on seat uses conductive through hole；Or the conductive base being connected with itself does not dispose electronic component, but
Self by the heat carrier and the unused conductive through hole being joined directly together using conductive through hole；Described second is conductive logical
Kong Weiyu itself connected conductive base does not dispose electronic component, and itself be not through heat carrier with it is straight using conductive through hole
Connect connected unused conductive through hole.
8. circuit board as claimed in claim 7, it is characterised in that on the conductive base being connected with the unused conductive through hole
It is deployed with radiator；The radiator is used for absorption and transfers out next heat from unused conductive through hole and be distributed to the external world.
9. the circuit board as described in any one of claim 1-8, it is characterised in that the circuit board includes multiple conductive through holes,
And the multiple heat carriers being arranged between the plurality of conductive through hole.
10. circuit board as claimed in claim 9, it is characterised in that second described in first conductive through hole and at least two
Each described heat carrier between conductive through hole is an entirety, or each heat carrier is contacted with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610978487.XA CN106572592A (en) | 2016-10-31 | 2016-10-31 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610978487.XA CN106572592A (en) | 2016-10-31 | 2016-10-31 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572592A true CN106572592A (en) | 2017-04-19 |
Family
ID=58540254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610978487.XA Pending CN106572592A (en) | 2016-10-31 | 2016-10-31 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106572592A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557878A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
| CN110557881A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936499A (en) * | 1995-07-20 | 1997-02-07 | Airex:Kk | Epoxy based flexible printed wiring board |
| CN202153809U (en) * | 2011-06-30 | 2012-02-29 | 中山市达进电子有限公司 | Aluminum-based circuit board having conducting holes |
| CN104701291A (en) * | 2013-12-05 | 2015-06-10 | 深圳市共进电子股份有限公司 | PCB (printed circuit board) heat-radiation soldering pad used for QFN (quad flat no-lead package) chip, and QFN chip and PCB soldering method |
| CN106061105A (en) * | 2016-07-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | PCB, PCB manufacturing method and mobile terminal |
-
2016
- 2016-10-31 CN CN201610978487.XA patent/CN106572592A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936499A (en) * | 1995-07-20 | 1997-02-07 | Airex:Kk | Epoxy based flexible printed wiring board |
| CN202153809U (en) * | 2011-06-30 | 2012-02-29 | 中山市达进电子有限公司 | Aluminum-based circuit board having conducting holes |
| CN104701291A (en) * | 2013-12-05 | 2015-06-10 | 深圳市共进电子股份有限公司 | PCB (printed circuit board) heat-radiation soldering pad used for QFN (quad flat no-lead package) chip, and QFN chip and PCB soldering method |
| CN106061105A (en) * | 2016-07-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | PCB, PCB manufacturing method and mobile terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557878A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
| CN110557881A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
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Application publication date: 20170419 |