CN106061105A - PCB board, manufacturing method of PCB board and mobile terminal - Google Patents

Abstract

The invention discloses a PCB, a manufacturing method of the PCB and a mobile terminal. The PCB board includes: the multilayer conducting layers are sequentially stacked; and the insulating layer is arranged between every two adjacent conductive layers and comprises an insulating base body and a heat conducting material mixed in the insulating base body. According to the PCB, the heat conducting material is mixed in the insulating base body, so that the heat conducting performance of the insulating layer can be greatly improved, heat generated by the PCB in working can be rapidly transmitted out, the heat radiating performance of the PCB is better, the running reliability of electronic elements and mobile terminals is improved, the heat radiating cost is low, and the integral volume of the PCB cannot be increased.

Description

PCB board, manufacturing method of PCB board and mobile terminal

technical field

The present invention relates to the technical field of mobile terminals, in particular to a PCB board, a method for manufacturing the PCB board, and a mobile terminal with the PCB board.

Background technique

As people's performance requirements for mobile terminals are getting higher and higher, the operation speed of various devices inside the mobile terminal is also getting faster and faster, and the power consumption of various devices is also increasing sharply, resulting in the internal PCB board of the mobile terminal when it is working. Some electronic components on the computer, such as processor chips, transistors, resistors and capacitors, etc., can generate a lot of heat. When the heat accumulates, it will cause abnormal operation of electronic components, burn out or short circuit on the PCB board and the electronic components on it. Therefore, it is very important to quickly and effectively dissipate heat from the electronic components on the PCB.

In the related art, the insulation layer of the PCB board is usually made of polypropylene or epoxy resin material, which is low in cost and good in insulation, but at the same time has poor thermal conductivity. In order to speed up the heat dissipation efficiency of electronic components, it is usually necessary to install a heat dissipation device on the PCB board to dissipate heat from the electronic components. Additional heat dissipation devices on the PCB board will increase the overall volume of the PCB board, which is not conducive to the concentration of mobile terminals. Miniaturization and development, and the cost is high, and the heat dissipation effect is poor.

Contents of the invention

The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, the present invention proposes a PCB board, which can greatly improve the thermal conductivity of the insulating layer by mixing heat-conducting materials in the insulating matrix, so that the heat generated by the PCB board during work can be quickly transferred out, and the PCB board The heat dissipation performance is better, thereby improving the reliability of the operation of electronic components and mobile terminals, and the heat dissipation cost is low, and no additional space is occupied on the PCB board.

The present invention also proposes a method for manufacturing the above-mentioned PCB board.

The present invention further proposes a mobile terminal having the above-mentioned PCB board.

The PCB board according to the embodiment of the first aspect of the present invention includes: a multi-layer conductive layer, the multi-layer conductive layer is stacked in sequence; an insulating layer, the insulating layer is provided between two adjacent conductive layers , wherein the insulating layer includes an insulating matrix and a heat conducting material mixed in the insulating matrix.

According to the PCB board of the present invention, by mixing heat-conducting materials in the insulating matrix, the thermal conductivity of the insulating layer can be greatly improved, so that the heat generated by the PCB board during work can be quickly transferred out, and the heat dissipation performance of the PCB board is better, thereby improving The reliability of the operation of electronic components and mobile terminals, and low heat dissipation cost will not occupy additional space on the PCB board.

In addition, the PCB board according to the present invention can also have the following additional technical features:

According to some embodiments of the present invention, the PCB board is provided with heat dissipation holes, the heat dissipation holes penetrate through the multi-layer conductive layer and the insulating layer in turn, and the heat conduction material is filled in the heat dissipation holes.

According to some embodiments of the present invention, there are a plurality of heat dissipation holes spaced apart from each other on the PCB.

According to some embodiments of the present invention, the heat conducting material is distributed in the insulating matrix in a granular form.

According to some embodiments of the present invention, the insulating matrix is a polypropylene matrix.

According to some embodiments of the present invention, the heat conducting material is polystyrene.

According to some embodiments of the present invention, the heat conducting material is quartz glass.

According to some embodiments of the present invention, the heat conducting material is epoxy resin.

According to the method of manufacturing a PCB board according to the embodiment of the second aspect of the present invention, the manufacturing method includes the following steps: melting the insulating matrix and the thermally conductive material respectively, mixing them, and pressing them into a plate-like structure to form the insulating layer; coating a metal layer or a metal wire on at least one surface of the insulating layer to form the conductive layer; stacking and fixing the insulating layers coated with the conductive layer in sequence.

According to the manufacturing method of the PCB board of the present invention, the insulating matrix and the heat-conducting material are melted and mixed separately, and pressed into a plate-like structure to form an insulating layer, the insulating matrix and the heat-conducting material form a whole, and the overall structural strength of the insulating layer is better , the manufacturing process is simple, and the thermal conductivity of the insulating layer is better.

According to the mobile terminal of the embodiment of the third aspect of the present invention, the PCB board is the PCB board of the embodiment of the first aspect of the present invention.

According to the mobile terminal of the present invention, by setting the PCB board according to the embodiment of the first aspect of the present invention, the heat dissipation performance is better and the operation reliability is higher.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

Fig. 1 is a schematic structural view of a PCB board according to an embodiment of the present invention;

Figure 2 is an enlarged view of A in Figure 1.

Reference signs:

PCB board 100;

Conductive layer 1;

Insulation layer 2 ; insulation base 21 ; heat conduction material 22 ; heat dissipation hole 201 .

detailed description

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The following describes a PCB board 100 according to an embodiment of the first aspect of the present invention with reference to FIGS. 1-2 . The PCB board 100 according to the embodiment of the present invention includes: a multi-layer conductive layer 1 and an insulating layer 2 .

Multi-layer conductive layers 1 are stacked in sequence, and an insulating layer 2 is provided between two adjacent conductive layers 1 , wherein the insulating layer 2 includes an insulating matrix 21 and a heat-conducting material 22 mixed in the insulating matrix 21 . The material of the heat conduction material 22 is a heat conduction material with a relatively high heat conduction coefficient, generally a heat conduction material with a heat conduction coefficient greater than or equal to 10 W/(m·K).

The upper surface of the PCB board 100 is provided with electronic components. Taking the application of the PCB board 100 in a mobile terminal as an example for illustration, when the mobile terminal is working, the electronic components generate heat, and the heat generated in the electronic components is transferred to the conductive layer 1. The conductive layer 1 absorbs the heat of the electronic components and transfers the heat to the insulating layer 2 located below it. The insulating matrix 21 of the insulating layer 2 is mixed with a heat-conducting material 22, and the heat is quickly transferred to the conductive layer 1 of the next layer through the heat-conducting material 22. , so that the heat continues to be transferred downwards, and the heat is quickly transferred out through the multi-layer conductive layer 1 and the insulating layer 2 on the two adjacent conductive layers 1 .

It should be noted that the electronic components mentioned here generally refer to heat-generating devices disposed on the PCB 100 , such as processor chips, power management chips, transistors, resistors, capacitors, and light-emitting diodes.

According to the PCB board 100 of the present invention, by mixing the thermally conductive material 22 in the insulating matrix 21, the thermal conductivity of the insulating layer 2 can be greatly improved, and the heat generated by the electronic components during operation can be quickly transferred out through the conductive layer 1 and the insulating layer 2, Therefore, the reliability of the operation of the electronic components and the mobile terminal is improved, and the heat dissipation cost is low, without occupying additional space on the PCB board 100 .

In some embodiments of the present invention, as shown in FIGS. 1-2 , the thermally conductive material 22 is distributed in the insulating matrix 21 in a granular form, and the thermally conductive material 22 and the insulating matrix 21 can be better mixed together, thereby making the insulation Layer 2 conducts heat better.

In some embodiments of the present invention, the insulating matrix 21 is a polypropylene matrix, which has good insulation and low cost.

In some embodiments of the present invention, the thermally conductive material 22 is polystyrene, which has good thermal conductivity and electrical insulation, and the setting of the thermally conductive material 22 in the insulating matrix 21 is more flexible and will not cause damage to the circuit connection of the PCB board 100. interference.

In some embodiments of the present invention, the heat conduction material 22 is quartz glass, which has good thermal conductivity and electrical insulation, and the setting of the heat conduction material 22 in the insulating matrix 21 is more flexible, and will not interfere with the circuit connection of the PCB board 100 .

In some embodiments of the present invention, the thermally conductive material 22 is epoxy resin, which has good thermal conductivity and has electrical insulation properties. The setting of the thermally conductive material 22 in the insulating matrix 21 is more flexible and will not cause damage to the circuit connection of the PCB board 100. interference.

In some embodiments of the present invention, as shown in FIG. 1 , a heat dissipation hole 201 is provided on the PCB 100, and the heat dissipation hole 201 runs through the multi-layer conductive layer 1 and the insulating layer 2 in turn, and the heat dissipation hole 201 can be filled with a heat conducting material 22, Therefore, the heat generated in the electronic components can also be transferred out through the heat dissipation holes 201, so that there are more heat dissipation paths and higher heat dissipation efficiency.

Preferably, as shown in FIG. 1 , there are multiple heat dissipation holes 201 spaced apart from each other on the PCB 100 , a plurality of heat dissipation holes 201 are provided on the PCB 100 , and each heat dissipation hole 201 is filled with a heat conducting material 22 , Therefore, the thermal conductivity of the insulating layer 2 is better.

The following describes the manufacturing method of the PCB board 100 according to the second aspect embodiment of the present invention. The PCB board 100 is the PCB board 100 of the above-mentioned first aspect embodiment. The manufacturing method includes the following steps: separately mixing after melting, and pressing into a plate-like structure to form an insulating layer 2; coating a metal layer or metal wire on at least one surface of the insulating layer 2 to form a conductive layer 1; applying the insulating layer 2 coated with the conductive layer 1 Stack and secure in turn.

According to the manufacturing method of the PCB board 100 of the present invention, the insulating matrix 21 and the heat conducting material 22 are mixed after being melted respectively, and pressed into a plate-like structure to form the insulating layer 2, the insulating matrix 21 and the heat conducting material 22 form an integral body, and are insulated. The overall structural strength of the layer 2 is better, the manufacturing process is simple, and the thermal conductivity of the insulating layer 2 is better.

The following describes the mobile terminal according to the embodiment of the third aspect of the present invention, including the PCB board 100, and the PCB board 100 is the PCB board 100 according to the embodiment of the first aspect of the present invention.

According to the mobile terminal of the present invention, by setting the PCB board 100 according to the embodiment of the first aspect of the present invention, the heat dissipation performance is better and the operation reliability is better.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" is intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (10)

1. A PCB board, characterized in that, comprising: Multi-layer conductive layers, the multi-layer conductive layers are stacked in sequence; An insulating layer is provided between two adjacent conductive layers, wherein the insulating layer includes an insulating matrix and a heat conducting material mixed in the insulating matrix. 2. The PCB board according to claim 1, wherein the PCB board is provided with cooling holes, and the cooling holes pass through the multi-layer conductive layer and the insulating layer in turn, and the heat conducting material is filled in the in the heat dissipation hole. 3 . The PCB board according to claim 2 , wherein there are multiple heat dissipation holes spaced apart from each other on the PCB board. 4 . 4. The PCB board according to claim 1, wherein the heat conducting material is distributed in the insulating matrix in a granular form. 5. The PCB board according to claim 1, wherein the insulating matrix is a polypropylene matrix. 6. The PCB board according to claim 1, wherein the heat conducting material is polystyrene. 7. The PCB board according to claim 1, wherein the heat conducting material is quartz glass. 8. The PCB board according to claim 1, wherein the heat conducting material is epoxy resin. 9. A method of manufacturing a PCB board according to any one of claims 1-8, wherein the method of manufacturing comprises the steps of: Melting the insulating matrix and the heat conducting material respectively, mixing them, and pressing them into a plate-like structure to form the insulating layer; coating a metal layer or a metal wire on at least one surface of the insulating layer to form the conductive layer; The insulating layers coated with the conductive layer are sequentially stacked and fixed. 10. A mobile terminal, comprising the PCB board according to any one of claims 1-8.