CN108124412A - Shielding case and electronic equipment - Google Patents
Shielding case and electronic equipment Download PDFInfo
- Publication number
- CN108124412A CN108124412A CN201611089986.XA CN201611089986A CN108124412A CN 108124412 A CN108124412 A CN 108124412A CN 201611089986 A CN201611089986 A CN 201611089986A CN 108124412 A CN108124412 A CN 108124412A
- Authority
- CN
- China
- Prior art keywords
- shielding case
- heat
- conducting layer
- default
- surface region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The disclosure is directed to a kind of shielding case and electronic equipment, the shielding case is used to be electromagnetically shielded the preset function module in electronic equipment；The shielding case is equipped at least one handle hole, first position of opening of the handle hole is matched with the default surface region that chip is preset in the preset function module, after the shielding case is made to be assemblied at the preset function module, the heat-conducting layer processing equipment can set a heat-conducting layer by the handle hole at the default surface region, to conduct heat to the shielding case by the heat-conducting layer from the default chip.By the technical solution of the disclosure, the assembly manipulation to shielding case can be made to be separated with the setting operation to heat-conducting layer, to optimize the setting to heat-conducting layer, it is ensured that heat-conducting layer reaches predetermined heat conduction requirement.
Description
Technical field
This disclosure relates to field of terminal technology more particularly to a kind of shielding case and electronic equipment.
Background technology
In the related art, on the one hand, as user is higher and higher to the minimizing of electronic equipment, lightening demand, make
The inner space for obtaining electronic equipment is less and less；On the other hand, the function that electronic equipment integrates is more and more, causes electronic equipment
In functional module group between assembling it is closer, it is necessary to more consider the Electro Magnetic Compatibility EMC to each functional module group
(Electro Magnetic Compatibility) problem.It in the related art, can by assembling shielding case for functional module group
Each functional module group is isolated with realizing, to meet predetermined EMC requirements.
But be terminated to due to functional module group in the accommodating space of shielding case offer, it has obstructed near functional module group
Air circulation affects the heat dissipation effect of functional module group, and the chip inside functional module group may be led to problems such as to overheat, from
And influence the normal use of electronic equipment.
The content of the invention
The disclosure provides a kind of shielding case and electronic equipment, to solve the deficiency in correlation technique.
According to the embodiment of the present disclosure in a first aspect, providing a kind of shielding case, the shielding case is used for in electronic equipment
Preset function module be electromagnetically shielded；The shielding case is equipped at least one handle hole, and the first of the handle hole opens
Hole site is matched with the default surface region that chip is preset in the preset function module, is assemblied in the shielding case described
After at preset function module, the heat-conducting layer processing equipment can set one by the handle hole at the default surface region
Heat-conducting layer, to conduct heat to the shielding case by the heat-conducting layer from the default chip.
Optionally, when being set on the shielding case there are one during handle hole, the first position of opening of the handle hole is described
The central spot of default surface region.
Optionally, when the shielding case is equipped with multiple handle holes, the first position of opening of multiple handle holes is described in
The central point of default surface region is around setting.
Optionally, when the heat-conducting layer is made of gluey heat-conducting medium, the heat-conducting layer processing equipment is set including dispensing
It is standby, and the orifice configurations of the handle hole adapt to the dispensing mouth of the spot gluing equipment.
Optionally, the gluey heat-conducting medium includes：Thermally conductive gel or heat-conducting silicone grease.
Optionally, the shielding case is equipped at least one peep hole, and the second position of opening of the peep hole is matched with
The edge of the default surface region makes the default edge section at the edge be in visibility status in the peep hole.
Optionally, subpoint of the central point of the peep hole in the default surface region is located on the edge.
Optionally, when the shielding case is equipped with multiple peep holes, the second position of opening of multiple peep holes is described in
The central point of default surface region is around setting.
Optionally, the shielding case is integral type shielding case, and the side of the integral shielding cover is welded in described preset
On printed circuit board (PCB) residing for functional module group.
According to the second aspect of the embodiment of the present disclosure, a kind of electronic equipment is provided, including：At least one such as above-described embodiment
In any shielding case.
The technical scheme provided by this disclosed embodiment can include the following benefits：
From above-described embodiment, the disclosure can be grasped the setting of heat-conducting layer by setting handle hole on shielding case
Work is mutual indepedent with the assembly manipulation of shielding case, so as to which heat-conducting layer be avoided to cause harmful effect to the assembly manipulation of shielding case, and
The compactness between heat-conducting layer and shielding case is promoted, to obtain more preferably heat-conducting effect.
It should be appreciated that above general description and following detailed description are only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
Attached drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and for explaining the principle of the disclosure together with specification.
Fig. 1 is the schematic diagram assembled in correlation technique to shielding case.
Fig. 2 is that the shielding case in correlation technique completes the schematic diagram after assembling.
Fig. 3 is the sectional view in A-A directions shown in Fig. 2.
Fig. 4 is the dimensional structure diagram according to a kind of shielding case shown in an exemplary embodiment.
Fig. 5 is the top view of Fig. 4.
Fig. 6 is the sectional view in B-B directions shown in Fig. 4.
Fig. 7 is the schematic diagram according to a kind of setting heat-conducting layer shown in an exemplary embodiment.
Fig. 8 is the sectional view of C-C directions shown in Fig. 7.
Fig. 9 is according to another schematic diagram for setting heat-conducting layer shown in an exemplary embodiment.
Figure 10 is along the sectional view in D-D directions when integral shielding cover is used in Fig. 9.
Figure 11 is the top view of the shielding case 3 shown in Fig. 9-10.
Figure 12 is along the sectional view in D-D directions when split type shielding case is used in Fig. 9.
Specific embodiment
Here exemplary embodiment will be illustrated in detail, example is illustrated in the accompanying drawings.Following description is related to
During attached drawing, unless otherwise indicated, the same numbers in different attached drawings represent the same or similar element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the disclosure.
With reference to figure 1, chip 2 in preset function component etc. is soldered to 1 surface of printed circuit board (PCB) in correlation technique, then
Shielding case 3 is assembled to 1 surface of printed circuit board (PCB)；Since shielding case 3 is in bottomless hollow rectangular parallelepiped structure so that the shielding
Accommodating space inside cover 3 can cover the preset function component, and by the reference ground in the shielding case 3 and printed circuit board (PCB) 1
The electromagnetic shielding to the preset function component is formed, such as Fig. 2 is that shielding case 3 has been assembled to the schematic diagram after printed circuit board (PCB) 1.
It is understood with further reference to Fig. 2 along Fig. 3 of A-A section views：There are certain intervals between shielding case 3 and chip 2；It is real
On border, even if shielding case 3 " fit " in chip 2 just, since the surface of shielding case 3 and chip 2 can not accomplish in ideal
Shiny surface, so that the surface of the two actually includes many tiny bumps, gullies etc., so in shielding case 3 and chip 2
Between will necessarily there are certain intervals so that the heat generated on chip 2 is difficult to outwards conduct by shielding case 3, be easy to cause
Chip 2 occurs superheating phenomenon or even influences the normal operation of chip 2.
Based on the above problem, the solution party that heat-conducting layer 4 is added between chip 2 and shielding case 3 is proposed in correlation technique
Case.With reference to figure 3, heat-conducting layer 4 can fill the gap between chip 2 and shielding case 3, especially when the material using high thermal conductivity
Expect the heat-conducting layer 4 formed, can chip 2 efficiently be generated into heat and be conducted to shielding case 3.And based in correlation technique
The structure of shielding case 3 is understood with reference to figure 1：Before the shielding case 3 is assembled heat-conducting layer must be formed in the upper surface of 2 grade of chip
4, shielding case 3 is then covered in 2 top of chip, to be contacted with the heat-conducting layer 4, realizes the heat conduction to chip 2.
But it needs to examine when first setting heat-conducting layer 4 reassembles shielding case 3, when on the one hand so that assembling shielding case 3
Consider the structural relation between heat-conducting layer 4, may influence to the efficiency of assembling of shielding case 3 and assembling effect, on the other hand due to
Shielding case 3 and chip 2 etc. certainly exist certain machining tolerance and build-up tolerance, but can not when setting heat-conducting layer 4
It is precisely fitted to the machining tolerance and build-up tolerance so that heat-conducting layer 4 can not may be well bonded due to thickness deficiency
It is excessively high in the thickness of shielding case 3 or heat-conducting layer 4 and influence installation to shielding case 3.
Therefore, the disclosure is by improving the structure of shielding case, to solve the above-mentioned technical problem in correlation technique.It ties below
Embodiment is closed to illustrate.
Fig. 4 is the dimensional structure diagram according to a kind of shielding case shown in an exemplary embodiment；Fig. 5 is bowing for Fig. 4
View；Fig. 6 is the sectional view in B-B directions shown in Fig. 4.As Figure 4-Figure 6, set on the shielding case 3 there are one handle hole 31, when
Multiple handle holes 31 can also be so equipped in other embodiments, and the disclosure is not intended to limit the quantity of the handle hole 31；For example, work as
When shielding case 3 is used to be electromagnetically shielded preset function component, if including a chip 2 in the preset function component,
At least one handle hole 31 for the chip 2 can be equipped on shielding case 3, and if including multiple cores in preset function component
During piece 2, each chip 2 can correspond at least one handle hole 31 on shielding case 3.
As Figure 4-Figure 6, handle hole 31 is located at the first position of opening on shielding case 3；Wherein, when the handle hole 31 corresponds to
During chip 2 in preset function module, which is matched with the default surface region of the chip 2.For example,
When the default surface region of chip 2 is the rectangular broken line region shown in Fig. 5, which can be the rectangular broken line
The central spot in region；For example, when handle hole 31 is circular hole, the center of circle O of the handle hole 31 can coincide with the rectangular broken line
The central point in region so that when setting heat-conducting layer 4 by the handle hole 31, which can be from default surface region
Heart point starts, and equably extends and covers to this other positions for presetting surface region, so as to help to realize to the equal of chip 2
Even heat conduction promotes heat-conducting effect.And when chip 2 is there are during multiple corresponding handle holes 31, multiple handle holes 31 corresponding first
Position of opening can be along the central point of the corresponding default surface region of chip 2 around setting, so as to pass through these handle holes 31
When heat-conducting layer 4 is set, heat-conducting layer 4 can be made to be distributed evenly in the default surface region, help to realize uniformly leading to chip 2
Heat promotes heat-conducting effect.
Fig. 7 is the schematic diagram according to a kind of setting heat-conducting layer shown in an exemplary embodiment；Fig. 8 is C-C side shown in Fig. 7
To sectional view.As Figure 7-8, by forming the handle hole 31 corresponding to chip 2 on shielding case 3 so that for shielding
The assembly manipulation of cover 3 is with being separated from each other the setting operation of heat-conducting layer 4：Can shielding case 3 be assemblied in printed circuit board (PCB) 1 first
On, the assembling process is consistent with processing procedure when heat-conducting layer is not provided in correlation technique；Then, complete to shielding case 3
After assembling, reuse heat-conducting layer processing equipment 5 and heat-conducting layer 4 is set by chip 2 surface of the handle hole 31 inside shielding case 3.
Based on the material that heat-conducting layer 4 uses, corresponding heat-conducting layer processing equipment 5 can be chosen.For example, when heat-conducting layer 4
By thermally conductive gel or heat-conducting silicone grease when gluey heat-conducting medium is formed, heat-conducting layer processing equipment 5 can include spot gluing equipment；Accordingly
Ground, the orifice configurations of handle hole 31 should adapt to the dispensing mouth of spot gluing equipment, and (such as the orifice configurations of handle hole 31 are not less than point
The specification of Jiao Kou) so that the dispensing mouth can stretch into the gap location between shielding case 3 and chip 2 by handle hole 31, with note
Enter above-mentioned gluey heat-conducting medium and form heat-conducting layer.
Simultaneously as handle hole 31 maintains a normally open state, thus after 5 filling heat-conductive medium of heat-conducting layer processing equipment, it can
To observe the formational situation of heat-conducting layer 4 by the handle hole 31：If the heat-conducting medium of injection is very few, thickness of heat-conducting layer 4 not
Foot can supplement heat-conducting medium, until heat-conducting layer 4 meets predetermined demand by heat-conducting layer processing equipment 5 from handle hole 31；Together
When, since shielding case 3 has been assembled to printed circuit board (PCB) 1, because without occurring in correlation technique since 4 thickness of heat-conducting layer is excessive
And influence the assembly manipulation to shielding case 3.
Further, Fig. 9 is according to another schematic diagram for setting heat-conducting layer shown in an exemplary embodiment；Figure 10 is
The sectional view of D-D directions shown in Fig. 9.As shown in figs. 9-10, at least one peep hole 32, the sight are also provided on shielding case 3
Examine hole 32 the second position of opening be matched with chip 2 default surface region edge, make the default edge Duan Guan at the edge
It examines and visibility status is in hole 32.In other words, on the one hand by heat-conducting layer processing equipment 5 into handle hole 31 filling heat-conductive medium
To form heat-conducting layer 4, on the other hand can surface district (be preset to the default edge section for presetting surface region by peep hole 32
The edge section that the complete edge in domain can be appeared in by peep hole 32) it is observed, to determine that heat-conducting layer 4 presets surface region to this
Coverage condition.Of course, it is possible to while heat-conducting layer processing equipment 5 is to 31 filling heat-conductive medium of handle hole, pass through peep hole
Coverage condition of 32 pairs of heat-conducting mediums in default surface region is observed, and controls heat-conducting layer processing equipment 5 accordingly to leading
The injection situation of thermal medium so that heat-conducting layer 4 forms the covering that surface region is preset to this just, and can be pasted closely
Together in the inner surface of shielding case 3.
In one embodiment, subpoint of the central point of peep hole 32 in default surface region can be located at the preset table
On the edge in face region.Such as Figure 11 is the top view of the shielding case 3 shown in Fig. 9-10, the shielding case 3 in the Figure 11 includes more
A peep hole 32：First peep hole 321, the second peep hole 322, the 3rd peep hole 323 and the 4th peep hole 324, these observations
Subpoint of the central point in hole 32 in default surface region include the first subpoint M, the second subpoint N, the 3rd subpoint P and
4th subpoint Q is respectively positioned on the edge (being indicated by the circular dashed line in Figure 11) of default surface region.Also, multiple observations
Second position of opening of the hole 32 on shielding case 3 (such as can coincide with circle in Figure 11 along the central point of default surface region
At heart O) around setting, in order to check that heat-conducting layer 4 presets this coverage condition of surface region from all angles, so as in time
Adjust implant operation of the heat-conducting layer processing equipment 5 to heat-conducting medium.
In the above-described embodiment, illustrated by taking the shielding case 3 (i.e. integral shielding cover) of integral structure as an example,
" integral structure " is somebody's turn to do to can be understood as：When shielding case 3 be in bottomless hollow rectangular parallelepiped structure when, the top of the shielding case 3 and
Several (such as four) side walls are in integral structure so that when the shielding case 3 is assemblied in printed circuit board (PCB) 1, if by top and dry side
Wall is assembled as an entirety.
And the technical solution of the disclosure, it is equally applicable to the shielding case 3 (i.e. split type shielding case) of split structure.Such as figure
Shown in 12, it is somebody's turn to do " split structure " and can be understood as：Shielding case 3 equally includes above-mentioned top and several side walls, still " several
Side wall " shows as stent 3A shown in Figure 12, " top " shows as top plate 3B shown in Figure 12, and assembling process can be：It is first
First by stent 3A assemblings (as welded) to printed circuit board (PCB) 1, then top plate 3B is assembled on stent 3A, to be formed to default
The package of functional unit and isolation.So, the handle hole 31 of the disclosure, peep hole 32 etc., still can be arranged at shown in Figure 12
Shielding case 3 in top plate 3B on, details are not described herein again.
Certainly, it is necessary to form protrusion needed for assembling etc. on stent 3A when being assembled due to stent 3A and top plate 3B
Structure so that integral shielding cover can be reduced compared with split type shielding case to the space hold on printed circuit board (PCB) 1, so as to
The overall space that shielding case 3 is reduced in electronic equipment internal occupies.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as illustratively, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be appreciated that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by appended claim.
Claims (10)
1. a kind of shielding case, which is characterized in that the shielding case is used to carry out electromagnetism to the preset function module in electronic equipment
Shielding；The shielding case is equipped at least one handle hole, and the first position of opening of the handle hole is matched with the default work(
The default surface region of chip is preset in energy module, it is described after the shielding case is made to be assemblied at the preset function module
Heat-conducting layer processing equipment can set a heat-conducting layer by the handle hole at the default surface region, with by the default core
Piece conducts heat by the heat-conducting layer to the shielding case.
2. shielding case according to claim 1, which is characterized in that when set on the shielding case there are one handle hole when, institute
The first position of opening for stating handle hole is the central spot of the default surface region.
3. shielding case according to claim 1, which is characterized in that more when the shielding case is equipped with multiple handle holes
First position of opening of a handle hole is along the central point of the default surface region around setting.
4. shielding case according to claim 1, which is characterized in that when the heat-conducting layer is made of gluey heat-conducting medium,
The heat-conducting layer processing equipment includes spot gluing equipment, and the orifice configurations of the handle hole adapt to the dispensing of the spot gluing equipment
Mouthful.
5. shielding case according to claim 4, which is characterized in that the glue heat-conducting medium includes：Thermally conductive gel is led
Hot silicone grease.
6. shielding case according to claim 1, which is characterized in that the shielding case is equipped at least one peep hole, institute
The second position of opening for stating peep hole is matched with the edge of the default surface region, makes the default edge section at the edge in institute
It states and visibility status is in peep hole.
7. shielding case according to claim 6, which is characterized in that the central point of the peep hole is in the default surface district
Subpoint on domain is located on the edge.
8. shielding case according to claim 6, which is characterized in that more when the shielding case is equipped with multiple peep holes
Second position of opening of a peep hole is along the central point of the default surface region around setting.
9. shielding case according to claim 1, which is characterized in that the shielding case be integral type shielding case, the one
The side of formula shielding case is welded on the printed circuit board (PCB) residing for the preset function module.
10. a kind of electronic equipment, which is characterized in that including：At least one shielding as claimed in any one of claims 1-9 wherein
Cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611089986.XA CN108124412A (en) | 2016-11-30 | 2016-11-30 | Shielding case and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611089986.XA CN108124412A (en) | 2016-11-30 | 2016-11-30 | Shielding case and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108124412A true CN108124412A (en) | 2018-06-05 |
Family
ID=62226445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611089986.XA Pending CN108124412A (en) | 2016-11-30 | 2016-11-30 | Shielding case and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108124412A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111107737A (en) * | 2018-10-29 | 2020-05-05 | 北京小米移动软件有限公司 | Shield case structure and electronic device |
| CN111123291A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
| WO2021195980A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市汇顶科技股份有限公司 | Time-of-flight transmission module, time-of-flight detection apparatus, and electronic device |
| WO2021195978A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市汇顶科技股份有限公司 | Time of flight transmission module, time of flight measurement device, and electronic device |
| CN114615791A (en) * | 2020-12-07 | 2022-06-10 | 深圳市万普拉斯科技有限公司 | Circuit board assembly and electronic equipment |
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| CN106793723A (en) * | 2016-11-13 | 2017-05-31 | 上海与德信息技术有限公司 | Radome, circuit board assemblies, the method for implanting of heat conductive silica gel and system |
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| CN1812079A (en) * | 2004-12-22 | 2006-08-02 | 株式会社东芝 | Electronic apparatus and display apparatus equipped with the electric apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111107737A (en) * | 2018-10-29 | 2020-05-05 | 北京小米移动软件有限公司 | Shield case structure and electronic device |
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| CN111123291A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
| WO2021195980A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市汇顶科技股份有限公司 | Time-of-flight transmission module, time-of-flight detection apparatus, and electronic device |
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| CN114615791A (en) * | 2020-12-07 | 2022-06-10 | 深圳市万普拉斯科技有限公司 | Circuit board assembly and electronic equipment |
| CN114615791B (en) * | 2020-12-07 | 2024-03-12 | 深圳市万普拉斯科技有限公司 | Circuit board assembly and electronic equipment |
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Application publication date: 20180605 |