WO2021195980A1

WO2021195980A1 - Time-of-flight transmission module, time-of-flight detection apparatus, and electronic device

Info

Publication number: WO2021195980A1
Application number: PCT/CN2020/082484
Authority: WO
Inventors: 侯志明; 阎小霞
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2020-03-31
Filing date: 2020-03-31
Publication date: 2021-10-07

Abstract

Provided are a time-of-flight (TOF) transmission module, TOF detection apparatus, and electronic device, capable of improving module installation efficiency. The TOF transmission module comprises: a flexible/rigid combination board (110), comprising: a first rigid circuit board (111), a second rigid circuit board (112), a third rigid circuit board (113) and a U-shaped flexible circuit board (115); the first rigid circuit board (111) and the second rigid circuit board (112) are respectively arranged on the upper and lower surfaces of one end of the U-shaped flexible circuit board (115), and the third rigid circuit board (113) is arranged on the lower surface of the other end of the U-shaped flexible circuit board (115); a light-emitting component (120), arranged above the first rigid circuit board (111); a drive component (130) which drives the light-emitting component (120) to emit light, arranged under the second rigid circuit board (112); the third rigid circuit board (113) is electrically connected to the main board of the electronic device by means of a patch.

Description

Time-of-flight transmitter module, time-of-flight detection device and electronic equipment

Technical field

This application relates to the technical field of electronic products, in particular to a time-of-flight transmitting module, a time-of-flight detection device, and electronic equipment.

Background technique

With the development of science and technology, more and more electronic devices with imaging functions are widely used in people’s daily life and work, bringing great convenience to people’s daily life and work, and becoming indispensable for people today. Important tools that are missing.

The Time of Flight (TOF) camera module is a commonly used depth camera module that can be used to measure depth of field information and can realize the imaging function of electronic devices. The TOF camera module generally includes an optical signal transmitting (Tx) module and an optical signal receiving (Rx) module.

At present, for Tx modules, board-to-board connectors (BTB) are used to achieve communication with the motherboard, but this will cause a problem: when assembling Tx modules, they need to be equipped with BTB The TX module (BTB board for short) is buckled to the motherboard. To complete this action, you need to fix the motherboard on the operating platform, and then align the BTB board with the interface on the motherboard to complete the buckle connection. That is to say, the current automation equipment cannot achieve the fully automated BTB board buckling assembly streamline operation. The existing assembly method requires manual completion or more manual intervention. Therefore, the production efficiency is low, and the labor cost is caused. The product cost is high.

Summary of the invention

The present application provides a TOF emission module, a TOF detection device and electronic equipment, which can improve the installation efficiency of the module.

In a first aspect, a TOF transmitting module in an electronic device is provided. The TOF transmitting module includes: a flexible and hard combined board, including: a first rigid circuit board, a second rigid circuit board, a third rigid circuit board, and a U Type flexible circuit board, the first rigid circuit board and the second rigid circuit board are respectively disposed on the upper and lower surfaces of one end of the U-shaped flexible circuit board, and the third rigid circuit board is disposed on the U-shaped flexible circuit On the lower surface of the other end of the board, the U-shaped flexible circuit board is used to electrically connect the first rigid circuit board, the second rigid circuit board and the third rigid circuit board; the light-emitting component is arranged on the first rigid circuit board. The upper part of the circuit board is electrically connected to the first rigid circuit board; the driving component is arranged below the second rigid circuit board, and is electrically connected to the second rigid circuit board, for driving the light-emitting component to emit light ; Wherein, the third rigid circuit board is electrically connected to the main board of the electronic device by means of a patch.

Therefore, the TOF transmitter module of the embodiment of the present application can adopt a folding structure of a flexible and rigid combined board. The structure can be divided into an upper half and a lower half. The two are electrically connected through the FPC, and the rigidity of the lower half The circuit board is electrically connected to an external circuit (such as a terminal main board), so that the TOF transmitter module can receive control signals of the external circuit; the upper and lower surfaces of the upper part are used to electrically connect and fix the light-emitting component and the driving component, and the driving component At the same time, it is also fixed above the rigid circuit board of the lower half, that is, the upper and lower rigid circuit boards sandwich the drive components between the two rigid boards, so that the two rigid boards (including the fixed components on the rigid board) are combined into A single integral module, and the Tx module can be directly mounted on the motherboard through the conductive terminals on the lower half of the rigid circuit board. Such a Tx module is conducive to automated patch production and reduces manual intervention and labor costs. , It is convenient for mass production, reduces production cost, and saves space and cost than the BTB solution.

With reference to the first aspect, in an implementation of the first aspect, the driving assembly includes: a driving unit and a first shielding cover, the driving unit is located in the first shielding cover, the driving unit and the The second rigid circuit board is electrically connected.

In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the driving assembly further includes: a thermally conductive gel filled between the driving unit and the first shielding cover.

In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the first shielding cover has a first opening for injecting the thermally conductive gel through the first opening.

With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the first opening is located on a surface of the first shielding cover opposite to the driving unit.

With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the rigid-flex board further includes a fourth rigid circuit board, and the fourth rigid circuit board is disposed on the U-shaped flexible circuit board. On the upper surface of the other end of the circuit board, the TOF transmitter module further includes: a heat sink located between the first shielding cover and the fourth rigid circuit board.

In combination with the first aspect and the foregoing implementation manners, in another implementation manner of the first aspect, the heat sink device includes a thermally conductive copper sheet.

In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, one surface of the thermally conductive copper sheet is attached to the first shielding cover through a thermally conductive adhesive; and/or, the The other surface of the thermally conductive copper sheet is attached to the upper surface of the fourth rigid circuit board through another thermally conductive adhesive.

With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the driving component includes an auxiliary device for assisting the driving unit to generate a driving signal for driving the light-emitting component.

In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the light-emitting assembly includes: a light-emitting unit and a second shielding cover, the light-emitting unit is located in the second shielding cover, so The light emitting unit is electrically connected to the first rigid circuit board, and the second shielding cover has a second opening to expose the light emitted by the light emitting unit.

In a second aspect, a TOF detection device in an electronic device is provided. The TOF detection device includes: the TOF transmitting module in the first aspect or any possible implementation of the first aspect, and the TOF receiving module, wherein The TOF transmitting module is used for transmitting optical signals, and the TOF receiving module is used for receiving the return optical signals after the object is illuminated by the optical signals.

With reference to the second aspect, in an implementation of the second aspect, the TOF receiving module is electrically connected to the main board of the electronic device through a board-to-board connector BTB.

In a third aspect, an electronic device is provided, the electronic device includes: the TOF transmitting module in the first aspect or any possible implementation of the first aspect, and a motherboard, and the third rigidity of the TOF transmitting module The circuit board is electrically connected with the main board by means of a patch.

With reference to the third aspect, in an implementation of the third aspect, the electronic device further includes: a silicone sleeve disposed between the TOF transmitter module and the back cover of the electronic device, the silicone sleeve having The third opening is to expose the light emitted by the light-emitting unit.

Description of the drawings

Fig. 1 is a schematic diagram of a TOF transmitting module in an electronic device according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of a TOF transmitting module in an electronic device according to another embodiment of the present application.

FIG. 3 is a cross-sectional view of a TOF transmitting module in an electronic device according to still another embodiment of the present application.

FIG. 4 is a three-dimensional exploded schematic diagram of the TOF transmitting module in the electronic device shown in FIG. 3.

Fig. 5 is a schematic diagram of a TOF detection device in an electronic device according to an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

FIG. 1 shows a schematic diagram of a TOF transmitting module 100 in an electronic device 1000 according to an embodiment of the present application. Specifically, as shown in FIG. 1, the electronic device 1000 may include a TOF device, and the TOF device may include a TOF transmitting module (or Tx module) and a TOF receiving module (or Rx module), where , The Tx module is used to emit light signals, the light signal irradiates the object to generate a return light signal, the object can refer to the object to be photographed (or called the shooting target, imaging target, detection target); and the Rx module is used to receive The return light signal, or Rx module, is used to sense the return light signal, and the return light signal carries depth information of the object to be photographed, so that the electronic device can realize the imaging function of the object to be photographed.

Optionally, the electronic device 1000 of the embodiment of the present application may be any electronic device with TOF function requirements, such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, an in-vehicle electronic device, medical treatment, and aviation.

At present, the communication between the overall TOF module composed of the Tx module and the Rx module and the main board of the electronic device is usually realized through the BTB connector. However, this combination of the Rx module and the Tx module is not conducive to maintenance, and any damage will cause the entire TOF The module is scrapped, and subsequent maintenance costs are high. Of course, this combination method also has its advantages, for example, it can save a step when the terminal is assembled. Therefore, using Rx module and Tx module group design to realize the functions of Rx module and Tx module respectively, which is more flexible and can overcome the heat dissipation, parasitic inductance, mass production yield, and cost faced by Tx modules. For example, the Rx module and Tx module group design is conducive to separate heat dissipation, which can reduce mass production and maintenance costs. In the following embodiments of the present application, the Tx module and the Rx module are set as an example for description.

In the embodiment of the present application, as shown in FIG. 1, the Tx module 100 includes: a rigid-flex board 110, a light-emitting assembly 120, and a driving assembly 130, wherein the rigid-flex board 110 is used to fix the light-emitting assembly 12 and the driving assembly. 130, can also be used to realize the electrical connection between the light-emitting component 12 and the driving component 130, and at the same time, it can also be used to electrically connect the light-emitting component 120 and the driving component 130 to the motherboard 200 of the electronic device 1000; the driving component 130 is used to drive the The light emitting component 120 emits light so that the light emitting component 120 emits light required for TOF measurement.

As shown in FIG. 1, the rigid-flex board 110 may include: a first rigid circuit board 111, a second rigid circuit board 112, a third rigid circuit board 113, and a U-shaped flexible printed circuit (FPC) 115, The U-shaped FPC 115 is used to electrically connect the first rigid circuit board 111, the second rigid circuit board 112, and the third rigid circuit board 113. Specifically, the first rigid circuit board 111 and the second rigid circuit board 112 are respectively disposed on the upper and lower surfaces of one end of the U-shaped FPC 115, that is, the first rigid circuit board 111, one end of the U-shaped FPC 115, and the The second rigid circuit board 112 forms a laminated structure. Moreover, the light-emitting component 120 is disposed above the first rigid circuit board 111 and is electrically connected to the first rigid circuit board 111; and the driving component 130 is disposed below the second rigid circuit board 112 and is connected to the second rigid circuit board. The board 112 is electrically connected. In this way, the driving component 130 communicates with the light-emitting component 120 through the laminated structure formed by the second rigid circuit board 112, the U-shaped FPC 115 and the first rigid circuit board 111.

In addition, the third rigid circuit board 113 in the embodiment of the present application includes conductive terminals 116 for patch-mounting the TOF transmitting module 100 to the main board 200 of the electronic device 1000. Specifically, the third rigid circuit board 113 is provided on the lower surface of the other end of the U-shaped FPC 115; the lower surface of the third rigid circuit board 113 is provided with conductive terminals 116 to allow the third rigid circuit board 113 to pass through The conductive terminal 116 is electrically connected to the main board 200 of the electronic device 1000 by means of a patch, so as to realize the electrical connection between the TOF transmitting module 100 and the main board 200 of the electronic device 1000, thereby realizing the TOF transmitting module 100 and the main board 200 of the electronic device 1000. Communication between motherboards 200.

Optionally, the patching method in the embodiment of the present application may include Surface Mounted Technology (SMT). For example, a pad array can be provided on the lower surface of the lower third rigid circuit board 113, that is, the conductive terminal 116 can be a pad array, and the third rigid circuit board 113 can be soldered to the main board 200 of the electronic device 1000 through the pad array. The connection between the TOF transmitter module 100 and the main board 200 of the electronic device 1000 formed by using the rigid-flex board 110 including the third rigid circuit board 113 as the carrier is thus realized, and the connection between the two can also be realized. Functional communication.

Therefore, the Tx module of the embodiment of the present application can adopt a folding structure of a flexible and hard combined board. The structure can be divided into an upper half and a lower half, and the two are electrically connected by FPC to realize the electrical signal in the external circuit. Transmission with Tx module, for example, the control signal from the main control component of the main board of the electronic device can be transmitted to the driving component through the rigid circuit board in the lower half, FPC, and rigid circuit board in the upper half in order to control the light-emitting component ; The upper and lower surfaces of the upper part are used to set the light-emitting component and the driving component respectively, and realize the communication between the light-emitting component and the driving component, and at the same time also shorten the distance between the light-emitting component 120 and the driving component 130 in space, That is, the communication lines between the light-emitting component 120 and the driving component 130 can be vertically distributed in the rigid circuit board, so that the distance between the communication lines is the distance between the two in the vertical direction, and the distance can be shortened to less than 1mm, which can greatly reduce the light-emitting components. The parasitic inductance on the communication line between 120 and the driving component 130 improves the overall performance of the light-emitting component 120 and the driving component 130. For example, for a solution where the light-emitting component and the driving component are placed side by side on the same surface of the circuit board, the distance of the communication line between the light-emitting component and the driving component depends on the separation distance between the two, but consider the problems of interference and heat dissipation. The distance between the component and the driving component should not be too close, and the increase in the communication distance will significantly increase the parasitic inductance, that is, reducing the overall performance of the light-emitting component and the driving component. In addition, the rigid circuit boards of the upper and lower parts of the embodiment of the present application sandwich and fix the drive components between two rigid boards, so that the two rigid boards (including the components fixed on the rigid boards) are combined into a single integral module. ; And the lower half of the Tx module can be directly attached to the Tx module as a single whole through the conductive terminal on the bottom surface (the conductive terminal may be an electrical connection structure in the form of a pad, a contact, etc.) To the motherboard. In this way, the Tx module mounted on the main board of the electronic device through the patch method is conducive to automated patch production, facilitates mass production, reduces production costs, and saves space and cost compared with the BTB solution.

Optionally, as shown in FIG. 1, corresponding to the structure of the lower half of the rigid-flex board 110, the rigid-flex board 110 may further include a fourth rigid circuit board 114, which is located in the U-shape. The upper surface of the other end of the FPC 115 is arranged opposite to the third rigid circuit board 113, but the embodiment of the present application is not limited to this.

It should be understood that the rigid circuit board in the embodiment of the present application may be a printed circuit board (Printed Circuit Board, PCB). For example, the first rigid circuit board 111, the second rigid circuit board 112, the third rigid circuit board 113, and the fourth rigid circuit board 114 in the rigid-flex board 110 may all be PCBs. In addition, for any one of the first rigid circuit board 111, the second rigid circuit board 112, the third rigid circuit board 113, and the fourth rigid circuit board 114 in the embodiment of the present application, it may be a single layer The circuit board may also be a multilayer circuit board, or it may be any one or more layers of a multilayer circuit board.

For example, the first rigid circuit board 111 and the second rigid circuit board 112 can be two independent circuit boards; or the first rigid circuit board 111, the middle flexible circuit board 115, and the second rigid circuit board 112 can also be the same. The three parts in the multi-layer circuit board, where the flexible circuit board included in the multi-layer circuit board is the flexible circuit board 115 in the embodiment of the application, and one or more parts of the multi-layer circuit board are located on the flexible circuit board. The layer circuit board is the first rigid circuit board 111 in the embodiment of the application, and one or more layers of the circuit board located in the lower part of the flexible circuit board in the multilayer circuit board is the second rigid circuit board 112 in the embodiment of the application . Similarly, the third rigid circuit board 113 and the fourth rigid circuit board 114 can also be two independent circuit boards, or the third rigid circuit board 113, the middle flexible circuit board 115 and the fourth rigid circuit board 114 can also be It can be three parts in the same multilayer circuit board, which will not be repeated here.

Optionally, the shape and area of the first rigid circuit board 111 and the second rigid circuit board 112 on the upper half of the rigid-flex board 110 in the embodiment of the present application can be set to be the same, for example, set to have the same size. Similarly, the shape and area of the third rigid circuit board 113 and the fourth rigid circuit board 114 in the lower half of the rigid-flex board 110 can also be set to be the same, for example, to be rectangular with the same size. In addition, the shape and area of the two rigid circuit boards of the upper half and the two rigid circuit boards of the lower half can also be set to be the same; the upper half and the lower half can be arranged in parallel, and both remain Right, that is, the projections of the two rigid circuit boards in the upper half on the surface where the two rigid circuit boards in the lower half are located along the vertical direction are completely overlapped with the two rigid circuit boards in the lower half, so that the In the vertical space, the rigid circuit boards of the upper and lower parts occupy the same size, which will not cause the problem of the rigid circuit boards of the lower half occupying more space.

The Tx module 100 in the embodiment of the present application will be described in detail below in conjunction with the accompanying drawings.

2 and 3 respectively show other possible cross-sectional views of the TOF transmitting module 100 in the electronic device 1000 of an embodiment of the present application, that is, the TOF transmitting module 100 in FIGS. 2 and 3 may be the TOF in FIG. 1 There are two possible implementations of the transmitting module 100; FIG. 4 is a three-dimensional exploded schematic view of the TOF transmitting module 100 in the electronic device 1000 shown in FIG. 3. After assembling FIG. 4, the cross-sectional view shown in FIG. A cross-sectional view cut from top to bottom in the direction indicated by the dashed line AB in FIG. 4.

Optionally, as shown in FIG. 2, FIG. 3, or FIG. 4, the light-emitting assembly 120 in the embodiment of the present application may specifically include a light-emitting unit 121 and a shielding cover 122. To facilitate distinction, the shielding included in the light-emitting assembly 120 may be The cover 122 is called a second shielding cover 122, and the light emitting unit 121 is disposed in the second shielding cover 122. The second shielding cover 122 can shield the electromagnetic interference generated by other external components and avoid the influence on the light emitting unit 121. Specifically, the light-emitting unit 121 is located in the second shielding cover 122, the light-emitting unit 121 is electrically connected to the first rigid circuit board 111, and the light-emitting unit 121 is used to emit light; the second shielding cover 122 may have an opening, Here is called the second opening 123, and the second opening 123 is used to expose the light emitted by the light-emitting unit 121; or, a transparent material is provided at the light-emitting position of the second shield 122 corresponding to the light-emitting unit 121 to expose The light emitted by the light-emitting unit 121.

It should be understood that the light-emitting unit 121 in the embodiment of the present application may be used to emit invisible light. For example, the light-emitting unit 121 may be an infrared laser transmitter. Correspondingly, the Rx module may include a photosensitive sensor, and the photosensitive sensor may be an infrared sensor. .

In the embodiment of the present application, the light emitting unit 121 may specifically be a vertical-cavity surface-emitting laser (VCSEL), but the embodiment of the present application is not limited thereto.

Optionally, the light-emitting assembly 120 may further include other elements. For example, as shown in FIG. 3 or FIG. 4, other elements included in the light-emitting assembly 120, such as inductors, capacitors, or Resistance etc., the embodiments of the present application are not limited thereto.

Optionally, a silicone sleeve 150 can be provided on the outer surface or upper surface of the second shielding cover 122 for sealing, and the silicone sleeve 150 can expose the light emitted by the light-emitting unit 121. For example, as shown in FIG. 3 or FIG. 4, the silicone sleeve 150 may also be provided between the second shielding cover 122 and the back cover 300 of the electronic device 1000 (such as a mobile phone). The shielding cover 122 is made of hard materials, and the two directly abut against each other, and there may be air gaps. The silicone sleeve 150 is relatively soft. The silicone sleeve 150 can seal between the back cover 300 and the second shield 122 It also has the function of dustproof and waterproof at the same time. Specifically, as shown in FIG. 3 or FIG. 4, the silicone sleeve 150 may have a third opening 151 to expose the light emitted by the light-emitting unit 121; and the part of the back cover 300 corresponding to the light-emitting position of the light-emitting unit 121 is usually made of transparent material , Such as glass, so that while the light emitted by the light-emitting unit 121 can be exposed, there is no gap between the back cover 300, the silicone sleeve 150 and the second shielding cover 122, which has the function of dust and water resistance to protect the light-emitting unit 121. . Optionally, it is also possible to expose the light emitted by the light-emitting unit 121 by arranging the silicone sleeve 150 to correspond to the light-emitting position of the light-emitting unit 121 with a transparent material. Wherein, the silicone sleeve 150 can be pasted on the upper surface of the second shielding cover 122 and/or the surface of the back cover 300 by double-sided tape, or directly abuts against the surface of the back cover 300, the embodiment of the present application is not limited to this.

Optionally, the size and shape of the second opening 123 and the third opening 151 can be set according to actual applications, and the shape and size of the second opening 123 and the third opening 151 can be the same or different. For example, as shown in FIGS. 3 and 4, the shapes of the second opening 123 and the third opening 151 may both be set to be rectangular, or the size of the third opening 151 may be set to be larger than that of the second opening 123.

It should be understood that, as shown in FIG. 2, FIG. 3 or FIG. 4, the driving assembly 130 may specifically include: a driving unit 131 and a first shielding cover 132, the driving unit 131 is located in the first shielding cover 132, and the driving unit 131 Electrically connected to the second rigid circuit board 112, the driving unit 131 can be used to drive the light-emitting unit 121 to emit light, and the first shielding cover 132 is used to shield the electromagnetic interference of the driving unit 131 from other external components.

Optionally, in the vertical direction, the driving unit 131 and the light-emitting unit 121 can be arranged in alignment, that is, the driving unit 131 is arranged directly below the light-emitting unit 121, so that the Tx module 100 can be reduced as much as possible. The width of the Tx module 100 is reduced, but the heat of the driving unit 131 and the light-emitting unit 121 are located in the same vertical scheme, and the heat is concentrated, which is not conducive to heat dissipation. On the contrary, in the vertical direction, as shown in FIG. 2, FIG. 3, or FIG. 4, the driving unit 131 and the light-emitting unit 121 can also be staggered, that is, the driving unit 131 is arranged obliquely below the light-emitting unit 121. In this way, although the width of the Tx module 100 cannot be minimized, it can facilitate the heat dissipation of the driving unit 131 and the light emitting unit 121, so that the heat dissipation of the two is relatively dispersed.

In the embodiment of the present application, the driving unit 131 and the light-emitting unit 121 are respectively arranged on the surfaces of the upper and lower rigid circuit boards at one end of the flexible and hard combined board 110, and the electrical and signal communication between the two rigid circuit boards is realized through FPC. Flexible application of the soft and hard board, and narrow the distance between the driving unit 131 and the light-emitting unit 121 in space, that is, the distance of the communication line between the driving unit 131 and the light-emitting unit 121 is the distance between the two in the vertical direction The distance can be shortened to less than 1 mm, which can greatly reduce the parasitic inductance on the communication line between the driving unit 131 and the light-emitting unit 121, thereby improving the overall performance of the driving unit 131 and the light-emitting unit 121. For example, for a solution where the drive unit and the light-emitting unit are placed side by side on the same surface of the circuit board, the distance of the communication line between the drive unit and the light-emitting unit depends on the horizontal separation distance between the two, but interference and heat dissipation are considered. For other problems, the distance between the driving unit and the light-emitting unit should not be too close; for another example, for the solution of arranging the driving unit 111 on the fourth rigid circuit board 124, the distance of the communication line between the driving unit 111 and the light-emitting unit 141 is It is increased from one end of the U-shaped FPC 125 where the driving unit 111 is located to the other end of the U-shaped FPC 125 where the light-emitting unit 141 is located. The light emitting unit 121 is arranged on the surface of the upper and lower rigid circuit boards at one end of the flexible and hard board 110, which will increase the communication distance between the driving unit 111 and the light emitting unit 141, and the increase of the communication distance will make the parasitic inductance obvious. Increase, thereby reducing the overall performance of the driving unit 131 and the light-emitting unit 121.

Optionally, as shown in FIG. 2, in order to improve the heat dissipation capacity of the driving assembly 130 and the light-emitting assembly 120, a heat sink 140 may be provided between the first shielding cover 132 of the driving assembly 130 and the fourth rigid circuit board 114 below, to The heat emitted by the driving assembly 130 is continuously transferred to the outside. Compared with the case where the heat sink 140 is not provided, and the heat is dissipated only by the air on the outer surface of the first shielding cover 132, the heat dissipation speed can be increased; and the heat emitted by the driving assembly 130 The small-area concentrated heat passes through the large-area heat sink 140, which is beneficial to increase the heat dissipation area and improve the heat dissipation efficiency. Moreover, when the third rigid circuit board 113 at the bottom of the Tx module 100 is soldered to the motherboard 200 through pads, The good heat dissipation function of the motherboard 200 can be fully utilized to conduct heat from the driving component 130 and the light-emitting component 120 in the Tx module 100 to the motherboard 200 to achieve a good heat dissipation function.

The heat dissipating device 140 in the embodiment of the present application may include a thermally conductive copper sheet 142, or may also be another good thermal conductor device. With its heat conduction and heat equalization effects, it can quickly conduct heat from a small area of the chip to a large area. On the heat sink 140, it is conducted to the rigid circuit board underneath, and then to the peripheral space such as the main board 200 or the middle frame to achieve rapid heat dissipation and cooling effects.

Optionally, as shown in FIG. 3 or FIG. 4, one surface of the thermally conductive copper sheet 142 of the embodiment of the present application may be bonded to the first shielding cover 132 through a thermally conductive adhesive 141; and/or, the thermally conductive copper sheet 142 The other surface of the fourth rigid circuit board 114 can be attached to the upper surface of the fourth rigid circuit board 114 through another thermally conductive adhesive 143.

In addition, in order to further improve the heat dissipation capability of the driving assembly 130, as shown in FIG. 3 or FIG. 4, the driving assembly 130 may further include: a thermally conductive gel 133 filled between the driving unit 131 and the first shielding cover 132, In this way, the thermally conductive gel 133 can conduct the heat generated by the driving unit 131 to the outside of the first shielding cover 132.

Specifically, the thermal conductive gel 133 can be injected from a reserved hole on the first shielding cover 132 by using a needle, and filled between the upper surface of the driving unit 131 and the first shielding cover 132 by using the flow characteristics of the gel, or using The fluidity of the gel fills the inner space of the first shielding cover 132, that is, the first opening 134 can be provided on the first shielding cover 132 to inject the thermally conductive gel 133 through the first opening 134.

Optionally, the thermally conductive gel 133 may be located between the upper surface of the driving unit 131 and the first shielding cover 132. For example, as shown in FIG. 3 or FIG. The opening 134, that is, a first opening 134 is provided on the surface of the first shielding cover 132 opposite to the driving unit 131, and the thermally conductive gel is injected through the first opening 134, so that the thermally conductive gel 133 is filled in the driving unit 131 Between the upper surface of the upper surface and the first shielding cover 132. Alternatively, the thermally conductive gel 133 may be further filled between the side of the driving unit 131 and the first shielding cover. For example, as shown in FIG. 3 or FIG. A first opening 134 is provided on the top of a shielding cover 132, but different from FIG. 3 or FIG. 4, the gel flow characteristics can be used to make the thermally conductive gel 133 fill the gap between the driving unit 131 and the first shielding cover 132. All upper and side gaps; alternatively, holes can be made in other positions of the first shielding cover 132, for example, holes are made on the side wall of the first shielding cover 132, and the gel flow characteristics are used to make the thermal conductive gel 133 fill the driving unit There are all gaps between 131 and the first shielding cover 132, and the embodiment of the present application is not limited to this.

Considering that the heat of the driving unit 131 and the light-emitting unit 121 on the Tx module is very concentrated, the device is small and cannot be directly added with a heat sink, and in order to shield the electromagnetic interference generated by other external components, the driving unit 131 and the light-emitting unit 121 usually need to be installed The shielding cover uses a thermal pad to dissipate heat and there is a technical problem that the thermal pad cannot pass reflow soldering (if a thermal pad heat dissipation solution is used, the thermal pad needs to be attached to the driver chip first, and then the shield cover is soldered on top of the driver chip by reflow soldering , But the high temperature of the reflow soldering process will cause the thermal pad to expand in the thickness direction, which will cause the shielding cover to be unable to be soldered to the driver chip). Therefore, currently on the market, the driver unit of the Tx module and the shielding cover are generally used Leave blank processing to achieve the minimum heat dissipation requirements through air heat dissipation. However, under such a heat dissipation structure, other parameters of the system will be more balanced. For example, consideration will be given to limiting the luminous power of the drive unit to a certain amount (also The design of the luminous power is limited by the heat dissipation of the module), and the luminous power will affect the detection range (detection distance) of the system, so the heat dissipation problem also affects the application of the current TOF detection or recognition system in scenarios with larger detection distances one of the reasons. However, this case creatively adopts the method of injecting thermally conductive gel between the driving unit 131 and the first shielding cover 132, which can circumvent the technological problem that ordinary thermal pads cannot pass the reflow soldering process. The reserved holes are filled with thermally conductive gel. The thermally conductive gel can fill between the driving unit 131 and the first shielding cover 132, so that there is no air gap between the driving unit 131 and the first shielding cover 132, and the thermally conductive gel can quickly Conduct heat to the external space to achieve rapid cooling of the drive chip, solve the problem of heat dissipation blocked by the air layer between the drive chip and the shield, and improve the heat dissipation efficiency of the chip; furthermore, the flexibility of system design can be improved, which can be applied to more Multiple systems with different detection distance requirements. In addition, a heat dissipating component 140 including a thermally conductive copper sheet 142 is arranged outside the first shielding cover 132, which can realize heat transfer through the thermally conductive gel and the thermally conductive copper sheet, which is beneficial to increase the heat dissipation area and make full use of the good heat dissipation function of the motherboard. Significantly improve the heat dissipation capacity of the Tx module, reduce usage problems, and increase the service life of the module.

It should be understood that the Tx module in the embodiment of the present application is electrically connected to the main board of the electronic device by means of a patch, but the Rx module may be electrically connected to the main board in the same way or in a different way. For example, as shown in FIG. 5, the electronic device 1000 of the embodiment of the present application may include a TOF device, and the TOF device may include the Tx module 100 and the Rx module 400 of the embodiment of the present application. The Tx module 100 can be electrically connected to the motherboard 200 below through a patch method, and the Rx module 400 can be electrically connected to the motherboard of the electronic device 1000 through the BTB connector 410, but the embodiment of the present application is not limited to this.

A person of ordinary skill in the art may realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.

Those skilled in the art can clearly understand that, for the convenience and conciseness of description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed system, device, and method can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solution of the present application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (read-only memory, ROM), random access memory (random access memory, RAM), magnetic disks or optical disks and other media that can store program codes. .

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A time-of-flight TOF transmitting module in an electronic device, which is characterized in that it comprises:

The rigid-flex board (110) includes: a first rigid circuit board (111), a second rigid circuit board (112), a third rigid circuit board (113) and a U-shaped flexible circuit board (115), the first The rigid circuit board (111) and the second rigid circuit board (112) are respectively arranged on the upper and lower surfaces of one end of the U-shaped flexible circuit board (115), and the third rigid circuit board (113) is arranged on the U-shaped flexible circuit board (115). On the lower surface of the other end of the U-shaped flexible circuit board (115), the U-shaped flexible circuit board (115) is used to electrically connect the first rigid circuit board (111), the second rigid circuit board (112) and the first rigid circuit board (112). Three rigid circuit boards (113);

The light-emitting component (120) is arranged above the first rigid circuit board (111) and is electrically connected to the first rigid circuit board (111);

The driving component (130) is arranged under the second rigid circuit board (112), is electrically connected to the second rigid circuit board (112), and is used to drive the light-emitting component (120) to emit light;

Wherein, the third rigid circuit board (113) is electrically connected to the main board of the electronic device by means of a patch.
The TOF transmitter module according to claim 1, wherein the driving assembly (130) comprises: a driving unit (131) and a first shielding cover (132),

The driving unit (131) is located in the first shielding cover (132), and the driving unit (131) is electrically connected to the second rigid circuit board (112).
The TOF transmitter module according to claim 2, wherein the driving assembly (130) further comprises: a thermal conductive condensation filled between the driving unit (131) and the first shielding cover (132) Glue (133).
The TOF transmitter module according to claim 3, wherein the first shielding cover (132) has a first opening (134) to inject the thermally conductive condensate through the first opening (134). Glue (133).
The TOF transmitter module according to claim 4, wherein the first opening (134) is located on a surface of the first shielding cover (132) opposite to the driving unit (131).
The TOF transmitter module according to any one of claims 2 to 5, characterized in that, the rigid-flex board (110) further comprises a fourth rigid circuit board (114), and the fourth rigid circuit board ( 114) arranged on the upper surface of the other end of the U-shaped flexible circuit board (115),

The TOF transmitting module further includes a heat sink (140) located between the first shielding cover (132) and the fourth rigid circuit board (114).
The TOF transmitter module according to claim 6, wherein the heat dissipating device (140) comprises a thermally conductive copper sheet (142).
The TOF transmitter module according to claim 7, wherein one surface of the thermally conductive copper sheet (142) is attached to the first shielding cover (132) through a thermally conductive adhesive; and/or,

The other surface of the thermally conductive copper sheet (142) is attached to the upper surface of the fourth rigid circuit board (114) through another thermally conductive adhesive.
The TOF transmitting module according to any one of claims 2 to 8, wherein the driving assembly (130) comprises:

An auxiliary device is used to assist the driving unit (131) to generate a driving signal for driving the light-emitting component.
The TOF emission module according to any one of claims 1 to 9, wherein the light-emitting assembly (120) comprises: a light-emitting unit (121) and a second shielding cover (122),

The light emitting unit (121) is located in the second shielding cover (122), and the light emitting unit (121) is electrically connected to the first rigid circuit board (111),

The second shielding cover (122) has a second opening (123) to expose the light emitted by the light emitting unit (121).
A TOF detection device for time-of-flight in electronic equipment, which is characterized in that it comprises:

The TOF transmission module according to any one of claims 1 to 10; and

TOF receiving module,

Wherein, the TOF transmitting module is used for transmitting light signals, and the TOF receiving module is used for receiving the return light signals after the object is illuminated by the light signals.
The TOF detection device according to claim 11, wherein the TOF receiving module is electrically connected to the main board of the electronic device through a board-to-board connector BTB.
An electronic device, characterized in that it comprises:

The TOF transmission module according to any one of claims 1 to 10; and

The main board, the third rigid circuit board of the TOF transmitting module is electrically connected to the main board by means of a patch.
The electronic device according to claim 13, wherein the electronic device further comprises:

The silicone sleeve (150) is arranged between the TOF transmitter module and the back cover of the electronic device, and the silicone sleeve (150) has a third opening (151) to expose the light-emitting unit (121) The light emitted.