CN215453690U

CN215453690U - TOF module and TOF device

Info

Publication number: CN215453690U
Application number: CN202120725241.8U
Authority: CN
Inventors: 黄欢; 苏洪志; 全世红; 邓明育
Original assignee: Shenzhen Jinghong Technology Co ltd
Current assignee: Shenzhen Jinghong Technology Co ltd
Priority date: 2021-04-09
Filing date: 2021-04-09
Publication date: 2022-01-07
Anticipated expiration: 2031-04-09

Abstract

The utility model provides a TOF module and a TOF device, wherein the TOF module comprises a heat dissipation support, a TOF emission end and a TOF receiving end, wherein the TOF emission end and the TOF receiving end are arranged on the heat dissipation support; this heat dissipation support integrated into one piece includes: a first bearing part is arranged at one end of the top of the radiating support, and a second bearing part is arranged at the other end of the bottom of the radiating support; the TOF emission end is bonded on the first bearing part; the TOF receiving end is bonded to a second carrier. The product provided by the technical scheme of the utility model has the characteristics of good heat dissipation, light weight and high precision of the acquired depth information.

Description

TOF module and TOF device

Technical Field

The utility model belongs to the technical field of 3D imaging, and particularly relates to a TOF module and a TOF device.

Background

3D imaging is receiving more and more attention from people, and the current technical scheme that can provide 3D imaging mainly has binocular, structured light and flight time (that is TOF) to carry out the range finding and obtain three-dimensional information. The binocular technology is a passive type, adopts the trigonometry principle to carry out depth calculation, and needs strong algorithm and calculation force support; the structured light technology is an active technology, depth calculation is carried out on the basis of the principle of a trigonometry method, the defect of an active light source is limited, distance measurement can be carried out only in a short distance under a dark environment, the cost is high, and the technical threshold is high; TOF technology is also an active technology, does not require the principle of triangulation, but uses the time of flight of light to measure distance, and is rapidly entering the field of consumer electronics with the advantages of being adaptable to more complex environments, good in depth imaging quality and the like. However, the active light source adopted by the TOF technology is a heating source in a working state, overheating is generated, measurement accuracy of an electronic product is easily affected, and even the electronic product fails, so that the electronic device needs to have good heat dissipation performance, and the TOF technology can be better adapted to the development trend of lightness and thinness of the current electronic device.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a TOF module and a TOF device, and aims to solve the problems that in the prior art, the heat productivity is large, and electronic equipment is not light and thin.

The technical scheme provided by the utility model for solving the technical problem is as follows:

in a first aspect, the present invention provides a TOF module, including a heat dissipation support, a TOF transmitting end and a TOF receiving end, where the TOF transmitting end and the TOF receiving end are disposed on the heat dissipation support, and the heat dissipation support is integrally formed, and includes: a first bearing part is arranged at one end of the top of the radiating support, and a second bearing part is arranged at the other end of the bottom of the radiating support; the TOF emission end is bonded on the first bearing part and used for generating an optical signal with a specific wavelength and projecting the optical signal out according to a certain angle; the TOF receiving end is bonded on the second bearing part and used for acquiring the optical signal reflected by the target to obtain depth information data after decoupling.

In a second aspect, the present invention provides a TOF apparatus comprising: the TOF module is used for acquiring depth data of a target object; the shell is used for wrapping the TOF module and other components; the apron is connected and laminates in the top horizontal plane that TOF module receiving end exposes camera lens and transmitting end light source with the shell, and the apron can see through the infrared light for the protection TOF module, also can be used for hiding the TOF module.

The beneficial effects of the utility model include: the utility model provides a heat dissipation bracket integrally formed by aluminum alloy materials, wherein a TOF transmitting end and a TOF receiving end are arranged in a separated layout mode, cavities are arranged for avoiding and separating components to increase the heat dissipation area of each component, and a bonding mode with a heat dissipation effect is used among the components, so that the TOF module has a compact and light-weight structure and a better heat dissipation effect, and the depth information acquired by a TOF device has higher precision.

Drawings

The utility model will be further explained with reference to the drawings.

FIG. 1 is a schematic structural diagram of a TOF module according to an embodiment of the present disclosure

Fig. 2 is a side view of a heat-dissipating bracket according to an embodiment of the present invention.

Fig. 3 is a front view of a heat-dissipating bracket according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a TOF apparatus according to an embodiment of the utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The TOF scheme mainly comprises a transmitting end and a receiving end, wherein the transmitting end and the receiving end are used for controlling a projector to emit modulated near-infrared light waves and reflecting the light waves after encountering an object, and the receiving end calculates the time difference or phase difference between the transmitted light waves and the received light waves and converts the time difference or phase difference into the distance of a shot scene so as to acquire depth information. Thereby at TOF module during operation, thereby transmitting terminal and receiving terminal all can produce the working effect that the heat influences TOF module, adopt integrated into one piece's aluminum alloy heat dissipation support to separate the overall arrangement design with transmitting terminal and receiving terminal, improve heat radiating area and avoid interfering mutually between the components and parts, are an effectual solution.

Referring to fig. 1, fig. 2 and fig. 3, the TOF module according to the present invention includes a heat dissipating support 100, a TOF transmitting end 200 and a TOF receiving end 300, where the TOF transmitting end 200 and the TOF receiving end 300 are disposed on the heat dissipating support, and the heat dissipating support 100 is integrally formed, and includes: a first bearing part 1 is arranged at one end of the top part 37 of the radiating bracket, and a second bearing part 2 is arranged at the other end of the bottom part 38 of the radiating bracket; the TOF transmitting end 200 is bonded on the first bearing part 1 and used for generating an optical signal with a specific wavelength and projecting the optical signal at a certain angle; the TOF receiving end 300 is bonded to the second bearing portion 2, and is configured to acquire an optical signal reflected by the target object for decoupling to obtain depth information data.

Specifically, the heat dissipation support adopts the first bearing part and the second bearing part to separate the layout design and can increase the heat dissipation area of each component and avoid the mutual interference between the components.

In some embodiments, the first carrier surface 37b is recessed from the heat sink support top 37 to form a stepped surface.

Specifically, the design of the stepped surface is beneficial to the matching of the top plane of the light source of the TOF transmitting end and the top plane of the lens of the TOF receiving end in the same horizontal plane when the TOF transmitting end is bonded.

In some embodiments, the heat dissipating bracket 100 further includes a square cavity 31b hollowed out from the second carrier surface 38a, and a circular window 31a is hollowed out in a stepped surface 37a of the top of the heat dissipating bracket corresponding to the second carrier surface 38a, the square cavity 31b communicating with the circular window 31 a.

Specifically, the TOF receiving end is loaded into the heat dissipation bracket from the surface of the second bearing part, and the round window is used for accommodating and exposing a lens of the TOF receiving end; the square cavity is used for accommodating other components of the TOF receiving end.

In some embodiments, the heat-dissipating bracket 100 further comprises a positioning assembly comprising: a plurality of positioning pins 36 provided on the first bearing part surface 37b and the second bearing part surface 38a, respectively; and a buckle 39 arranged on the side surface of the heat dissipation bracket.

Specifically, the first bearing surface is respectively provided with a positioning pin 36c and a positioning pin 36d which can be matched with a positioning hole of the TOF emission end, so that the support and the TOF emission end can be quickly positioned at a relative fixed position during bonding, the support and the TOF emission end are bonded through heat-dissipation silica gel, a large amount of heat generated during the operation of the TOF emission end can be conducted to the support, and the heat can be conducted and dissipated through a large area of the support; positioning

pins

36a and 36b are respectively arranged on the second bearing surface and can be matched with positioning holes of a TOF receiving end, so that the support and the TOF receiving module can be quickly adhered to be in a relative fixed position, and the support and the TOF receiving module are adhered through thermosetting glue; the side surface of the heat dissipation bracket is provided with a buckle for positioning when the heat dissipation bracket is installed on an electronic device. .

In some embodiments, the heat sink bracket 100 further includes a third cavity 33 that is hollowed out from the first carrier surface 37 b.

Specifically, the third cavity is used for matching with other electronic components of the TOF receiving end to avoid positions.

In some embodiments, the heat sink bracket 100 further includes a support body 32 disposed within the square-shaped cavity 31 b.

Specifically, a support body is erected in the middle of the square cavity, and the lens and other components can be separated, so that the square cavity and the round window which are communicated and relatively separated are formed, mutual interference among the components can be prevented, and a better heat dissipation effect is achieved.

In some embodiments, the heat-dissipating bracket further includes a plurality of protrusions 34 disposed on a side adjacent to the bottom 38. Preferably, two protrusions are added on the same side, a first protrusion 34a that is a larger point and a second protrusion 34b that is a smaller point. A locating pin 36a may be provided below the first protrusion 34a to facilitate sealing of the holder with the TOF receiving end during bonding.

In some embodiments, the heat-dissipating bracket further comprises a plurality of cavities 35 that are hollowed out on one or more sides. Specifically, the cavity that the side was excavated is used for avoiding the position or/and increasing heat radiating area when the TOF module is installed to electron device, can avoid components and parts to interfere each other simultaneously.

In some embodiments, the heat sink bracket is an aluminum alloy. Preferably, the support is made of aluminum alloy 6061, has the characteristics of good heat conductivity, weldability, electroplating property, corrosion resistance, high toughness, difficult deformation after machining and the like, and is formed by machining one aluminum alloy through a CNC (computer numerical control) machine tool or die-casting.

Referring to fig. 4, the present invention further provides a TOF apparatus with good heat dissipation, light weight, and high accuracy of collected depth information, including: the TOF module 1000, which is the TOF module described above, is configured to acquire depth data of a target object; a housing 2000 for enclosing the TOF module 1000 and other components; the cover plate 3000 is connected to the housing 2000 and bonded to the top horizontal surface of the exposed lens and light source of the TOF module 1000, and the cover plate 3000 can transmit infrared light for protecting the TOF module 1000 and can also be used for hiding the TOF module 1000.

The technical solution of the present invention is further described below by a preferred embodiment.

The TOF module and the TOF device provided by the preferred embodiment have the scheme that the TOF transmitting end and the TOF receiving end are arranged in a split mode, the heat dissipation area of each component is increased, and the TOF transmitting end and the TOF receiving end are bonded respectively to obtain the TOF module through the heat dissipation support which is integrally formed, so that the TOF module is compact in structure and light and thin, and meanwhile has the smaller, lighter and thinner volume and the excellent heat dissipation effect, and is more convenient to use by a user.

This preferred embodiment provides a heat dissipation support, its characterized in that: the body of the bracket is in a strip shape, the length, width, height and overall dimension of the bracket are not more than 15mm x 11mm x 5mm, and a plurality of cavities, namely a round window 31a, a square cavity 31b and a third cavity 33, are arranged in the bracket; wherein the round window 31a and the square cavity 31b are connected at one side of the bracket to form a through cavity with a round end and a square end; a third cavity 33 is on the other side of the carrier, below the first bearing surface and between the heat sink carrier bottom 38.

The bracket is made of aluminum alloy 6061, and has the characteristics of good heat conductivity, weldability, electroplating property, corrosion resistance, high toughness, difficult deformation after processing and the like. The specific implementation is as follows: processing and forming an aluminum alloy by a CNC machine tool or die-casting to form a plurality of cavities; the round windowing and the square cavity are arranged on the same side of the bracket and are connected to form a through cavity with one round end and one square end, and the through cavity is used for matching with a lens side avoiding position of a TOF receiving end and exposing the lens; the third cavity is arranged on the other side of the bracket and is used for matching with other electronic components of the TOF receiving end to avoid positions. The heat-dissipating mount top 37 may also be provided with a stepped surface for the light-source side to fit in the same horizontal plane as the lens-side top plane when the TOF projection end is bonded.

A fourth cavity can be further arranged below the step surface of the heat dissipation support and can also be used for being matched with other electronic components at the TOF projection end to avoid positions. At least two positioning pins, namely a first positioning pin 36a and a second positioning pin 36b, may be reserved on the bottom 38 of the bracket, specifically on the second bearing surface 38a of the bracket; wherein first locating pin 36a and second locating pin 36b can match TOF receiving terminal's first locating hole 25a and second locating hole 25b respectively for can bond fast between support and the TOF receiving module and be in relative fixed position, and laminate through thermosetting glue. The lower step surface at the top of the support, namely the first bearing part surface 37b, can also include at least two positioning pins reserved, namely a third positioning pin 36c and a fourth positioning pin 36d, wherein the third positioning pin 36c and the fourth positioning pin 36d can be matched with a third positioning hole 12a and a fourth positioning hole 12b of a TOF emission end, so that the support and the TOF emission module can be quickly bonded at a relative fixed position and bonded through heat-dissipating silica gel, a large amount of generated heat can be conducted to the support when the TOF emission end works, and the heat can be conducted and dissipated through a large area of the support, thereby avoiding thermal noise caused by high temperature after the heat generated by the TOF emission end is gathered together, and causing failure of an electronic device in serious cases.

The bonding between support and the TOF emission end can also be strengthened through increasing the adhesive around the bonding department, and the adhesion of avoiding heat dissipation silica gel is low excessively and leads to the separation to drop easily. The adhesive can be ultraviolet curing glue and can be thermosetting glue.

A side of the bracket may further include at least two protrusions for limiting when mounted to the electronic device. In this embodiment, two protrusions are added on the same side, one larger first protrusion 34a and the other smaller second protrusion 34 b. A first locating pin 36a may be provided below the first protrusion 34a to facilitate sealing of the holder with the TOF receiving end during bonding.

One or more sides of the bracket may also include a plurality of hollowed-out cavities 35 for avoiding space and/or increasing heat dissipation area when mounted to an electronic device.

In the TOF module provided by the preferred embodiment, the support is used for supporting, fixing, heat dissipation, protection and limiting; the TOF transmitting end is used for generating an optical signal with a specific wavelength and projecting the optical signal according to a certain angle; the TOF receiving end is used for acquiring an optical signal reflected by the target and decoupling the optical signal to obtain depth information data. The specific implementation process is that a piece of thermosetting glue is provided, coating is carried out through a glue drawing method or a paste printing method, then the bottom of the support is bonded with the second circuit board of the TOF receiving end, and then the support is placed in a constant-temperature oven to be baked to a curing state. Providing a heat-radiating silica gel, coating by a glue drawing method or a paste printing method, bonding the step surface of the bracket with the first circuit board at the TOF emission end, then providing an ultraviolet curing glue, coating the periphery of the bonding part between the first circuit board and the step surface by the glue drawing method, and finally irradiating by using ultraviolet rays for curing.

The preferred embodiment also provides a TOF apparatus comprising: TOF module, outer casing, cover plate; wherein the TOF module is used for gathering the depth data of target, and the apron is used for protecting the TOF module not receive external influence or/and hide the TOF module and easily not discover by the people, and the shell is used for wrapping various subassemblies including the TOF module. The specific implementation mode is that the TOF module is limited in the shell and is electrically connected with other circuits through a connector; the shell links to each other with the apron to combine together after the bonding, the apron can see through invisible infrared light, and cover it on TOF module surface, can hide by TOF module simultaneously and be difficult for people to perceive.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The utility model provides a TOF module, includes heat dissipation support (100), TOF emission end (200) and TOF receiving end (300) of setting on the heat dissipation support, its characterized in that:

the heat dissipation bracket (100) is integrally formed and comprises: a first bearing part (1) is arranged at one end of the top part (37) of the heat dissipation bracket, and a second bearing part (2) is arranged at the other end of the bottom part (38) of the heat dissipation bracket;

the TOF emitting end (200) is bonded to a first carrier part (1);

the TOF receiving end (300) is bonded to a second carrier portion (2).

2. The TOF module of claim 1 wherein the first carrier surface (37b) is countersunk from the heat dissipating support top (37) to form a stepped surface.

3. The TOF module of claim 2, wherein the heat dissipating support (100) further comprises a square cavity (31b) hollowed out of the second carrier surface (38a) and a circular fenestration (31a) hollowed out at a stepped surface (37a) of the top height of the heat dissipating support corresponding to the second carrier surface (38a), the square cavity (31b) communicating with the circular fenestration (31 a).

4. The TOF module of claim 1, wherein the heat dissipating support (100) further comprises a positioning assembly comprising:

a plurality of positioning pins (36) respectively arranged on the first bearing surface (37b) and the second bearing surface (38 a);

and a buckle (39) arranged on the side surface of the heat dissipation bracket.

5. The TOF module of claim 2 wherein the heat dissipating support (100) further comprises a third cavity (33) hollowed out from the first carrier surface (37 b).

6. The TOF module according to claim 3, wherein the heat dissipating support (100) further comprises a support body (32) arranged within the square cavity (31 b).

7. The TOF module of claim 1 wherein the heat dissipating support (100) further comprises a plurality of protrusions (34) disposed on a side adjacent the base (38).

8. The TOF module of claim 1 wherein the heat dissipating support (100) further comprises a plurality of cavities (35) dug out at the sides.

9. The TOF module according to any one of claims 1-8, wherein the heat dissipating support (100) is an aluminum alloy.

10. A TOF apparatus, comprising:

a TOF module (1000) according to any of claims 1 to 9 for acquiring depth data of an object;

a housing (2000) for enclosing the TOF module (1000) and other components;

the cover plate (3000) is connected with the shell (2000) and attached to the top horizontal plane of the light source of the transmitting end and the receiving end exposed lens of the TOF module (1000), and the cover plate (3000) can penetrate infrared light and is used for protecting the TOF module (1000) and hiding the TOF module (1000).