WO2021217365A1 - Fill light structure, photography apparatus, and movable platform - Google Patents

Fill light structure, photography apparatus, and movable platform Download PDF

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Publication number
WO2021217365A1
WO2021217365A1 PCT/CN2020/087313 CN2020087313W WO2021217365A1 WO 2021217365 A1 WO2021217365 A1 WO 2021217365A1 CN 2020087313 W CN2020087313 W CN 2020087313W WO 2021217365 A1 WO2021217365 A1 WO 2021217365A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
board
boss
coupling member
hole
Prior art date
Application number
PCT/CN2020/087313
Other languages
French (fr)
Chinese (zh)
Inventor
郭盛家
张树臣
严绍军
胡振益
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/087313 priority Critical patent/WO2021217365A1/en
Priority to CN202080005486.1A priority patent/CN112789847A/en
Publication of WO2021217365A1 publication Critical patent/WO2021217365A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/55Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/52Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Definitions

  • This application relates to the field of unmanned aerial vehicles, in particular to a supplementary light structure, photographing equipment and a movable platform.
  • a fill light can be set on the drone.
  • the fill light can supplement the light for the camera of the drone when the ambient brightness is low, so as to improve the quality of the image captured by the camera; on the other hand, when the drone takes off or takes off in a low-brightness environment
  • the fill light is usually directly installed on the main board of the drone. However, the heat generated by the fill light will be transferred to the main board under this installation method, which will cause the temperature of the main board to rise and affect the working performance of the main board.
  • the embodiments of the present application provide a supplementary light structure, photographing equipment and a movable platform.
  • the light supplement lamp structure of the embodiment of the present application includes a housing and a light supplement lamp assembly.
  • the housing is provided with a penetrating installation hole.
  • the light-filling lamp assembly includes a light-filling lamp and a light-transmitting lampshade.
  • the supplemental light includes a supplementary light board and a light-emitting chip arranged on the supplementary light board.
  • the supplemental light board is installed on the housing and the light-emitting chip extends into the installation hole.
  • the lampshade is installed in the mounting hole, and the light-emitting chip and the lampshade are respectively located at opposite ends of the mounting hole.
  • the supplemental light board is installed on the housing by at least one of screw connection, clamping, gluing, and welding.
  • the housing includes a bottom wall and a boss.
  • the bottom wall includes a first surface and a second surface opposite to each other.
  • the boss extends from the first surface of the bottom wall.
  • the mounting hole penetrates the boss and the bottom wall, the light supplement lamp board is mounted on the first surface of the boss, and the first surface of the boss is away from the first surface of the bottom wall.
  • the supplemental light panel includes a first side and a second side opposite to each other.
  • the light-emitting chip is arranged on the first surface of the supplementary light board.
  • the first surface of the boss is recessed toward the second surface of the bottom wall to form the mounting hole.
  • the first surface of the supplementary light board is in contact with the first surface of the boss.
  • a first coupling member surrounding the mounting hole is provided on the first surface of the boss, a second coupling member surrounding the light-emitting chip is provided on the first surface of the fill light board, and the first coupling member The part cooperates with the second coupling part.
  • the portion of the first surface of the supplementary light board that is in contact with the first surface of the boss is provided with a copper layer, and the first surface of the boss is connected to the complementary The part where the first side of the light board is connected is processed by laser carving to remove the oxide layer.
  • the number of the first coupling members is multiple, and the plurality of first coupling members are evenly distributed around the center of the mounting hole.
  • the first coupling member is a threaded hole
  • the second coupling member is a threaded hole
  • the fill light structure further includes a screw that passes through the second coupling member and is screwed. And fit into the first coupling member to install the light supplement lamp board on the first surface of the boss.
  • the first coupling member is a clamping hole
  • the second coupling member is a clamping post
  • the clamping post is clamped into the clamping hole to fill the light
  • the light board is installed on the first surface of the boss.
  • the first coupling member is an engaging post
  • the second coupling member is an engaging hole
  • the engaging post is engaged into the engaging hole to fill the light
  • the light board is installed on the first surface of the boss.
  • the first coupling member is a protruding post provided with a threaded hole
  • the second coupling member is a through hole
  • the protruding post penetrates through the through hole
  • the light supplement lamp structure further includes a screw that penetrates the threaded hole and presses the second surface of the light supplement light board to mount the light supplement light board on The first surface of the boss.
  • the first surface of the boss is a flat surface.
  • the first surface of the boss is a stepped surface.
  • the stepped surface includes a first sub-surface, a second sub-surface, and a connecting surface connecting the first sub-surface and the second sub-surface.
  • the supplemental light panel includes a first side surface and a second side surface, and the first side surface is a curved surface.
  • the second side surface is connected to both ends of the first side surface, and the second side surface is a plane.
  • the first sub-surface is in contact with the first surface of the light supplement lamp board, and the second side surface is in contact with the connecting surface.
  • the mounting hole includes a first sub-cavity and a second sub-cavity that are connected.
  • the light-emitting chip is contained in the first sub-cavity and partially extends into the second sub-cavity, and the lampshade is contained in the second sub-cavity.
  • the opening of the second subcavity in a direction from the first surface of the bottom wall to the second surface of the bottom wall, has an outwardly expanding shape.
  • the housing is made of magnesium alloy.
  • the photographing device of the embodiment of the present application includes a main board and the light-filling lamp structure described in any of the above embodiments.
  • the main board is installed in the housing and is electrically connected to the light supplement lamp board.
  • the main board includes a first side and a second side opposite to each other.
  • the first surface of the main board is opposite to the first surface of the bottom wall.
  • the first surface of the main board is provided with an elastic electrical connector, and the electrical connector is electrically connected to the second surface of the light supplement lamp board.
  • the electrical connector includes a pogo pin or a metal shrapnel.
  • the housing is further provided with a through-hole connecting hole, and the connecting hole is spaced from the mounting hole.
  • the photographing equipment further includes a photographing device installed in the coupling hole. The photographing device is electrically connected to the main board, and the photographing device is used for receiving external light for imaging.
  • the movable platform of the embodiment of the present application includes the movable platform body and the photographing equipment described in any of the above embodiments.
  • the photographing equipment is installed on the movable platform body.
  • the fill light structure, the shooting device and the movable platform of the embodiments of the present application mount the fill light assembly on the housing, on the one hand, it can ensure the concentricity between the fill light assembly and the mounting hole of the housing, and on the other hand , The heat generated during the operation of the fill light assembly can be dissipated through the housing, thereby avoiding the problem that the work performance of the motherboard will be affected when the fill light assembly is installed in the main board.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a movable platform according to some embodiments of the present application
  • Fig. 2 is a schematic partial cross-sectional view of the movable platform shown in Fig. 1;
  • Fig. 3 is an enlarged schematic diagram of area III of the movable platform in Fig. 2;
  • Fig. 4 is an enlarged schematic diagram of the IV area of the movable platform in Fig. 2;
  • Fig. 5 is a partial three-dimensional structural diagram of the movable platform shown in Fig. 1;
  • Fig. 6 is an enlarged schematic diagram of the VI area of an embodiment of the movable platform shown in Fig. 5;
  • FIG. 7 is an enlarged schematic diagram of the VI area of another embodiment of the movable platform shown in FIG. 5;
  • Fig. 8 is a schematic cross-sectional view of the movable platform shown in Fig. 5 along line VIII-VIII;
  • Fig. 9 is an enlarged schematic diagram of the IX area of the movable platform in Fig. 8.
  • the first feature “on” or “under” the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. touch.
  • the "above”, “above” and “above” of the first feature on the second feature may mean that the first feature is directly above or diagonally above the second feature, or it simply means that the level of the first feature is higher than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature may be that the first feature is directly below or obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the fill light structure 100 includes a housing 20 and a fill light assembly 10.
  • the housing 20 is provided with a mounting hole 21 penetrating therethrough.
  • the fill light assembly 10 includes a fill light 11 and a light-transmitting lamp cover 12.
  • the fill light 11 includes a fill light board 111 and a light-emitting chip 112 arranged on the fill light board 111.
  • the supplementary light board 111 is mounted on the housing 20 and the light-emitting chip 112 extends into the mounting hole 21.
  • the lampshade 12 is installed in the mounting hole 21.
  • the light-emitting chip 112 and the lampshade 12 are respectively located at opposite ends of the mounting hole 21.
  • the supplementary light assembly 10 may be installed on the main board 200, and the motherboard 200 provides an electrical signal for the supplementary light assembly 10 to make the supplementary light assembly 10 emit light.
  • the fill light assembly 10 emits light
  • heat is generated, and this part of the heat is transferred to the main board 200, causing the temperature of the main board 200 to increase.
  • the increase in the temperature of the main board 200 is not conducive to the normal operation of the main board 200.
  • a circle of heat-conducting elements needs to be placed around the supplementary light assembly 10 to dissipate heat, which will result in a waste of space on the motherboard 200.
  • the mounting hole 21 opened on the housing 20 and the fill light assembly 10 have a high degree of concentricity, so that all the light emitted by the fill light assembly 10 can be emitted to In the outside world. If the fill light assembly 10 is mounted on the main board 200, the concentricity between the fill light assembly 10 and the mounting hole 21 on the housing 20 cannot be guaranteed, which may cause the light emitted by the fill light assembly 10 to fail The problem of passing through the mounting hole 21, which affects the light supplement effect.
  • the fill light assembly 10 is directly mounted on the housing 20.
  • the concentricity between the fill light assembly 10 and the mounting hole 21 opened on the housing 20 is Higher, the light emitted by the fill light assembly 10 can be emitted to the outside.
  • the heat generated during the operation of the supplementary light assembly 10 will be dissipated to the outside through the housing 20, and will not be transferred to the main board 200 to cause the temperature of the main board 200 to rise, thereby avoiding the influence on the working performance of the main board 200.
  • the main board 200 does not need to be provided with a heat conducting element at a position close to the light supplement lamp assembly 10, thereby avoiding the problem of wasting space of the main board 200.
  • an embodiment of the present application further provides a photographing device 400.
  • the photographing equipment 400 includes a supplementary light structure 100, a main board 200, an electrical connector 203 and a photographing device 300.
  • the fill light structure 100 includes a housing 20 and a fill light assembly 10.
  • the housing 20 may be made of magnesium alloy. Magnesium alloy has the advantages of high strength, light weight and good heat dissipation performance, and can effectively assist the heat dissipation of the fill light assembly 10.
  • the housing 20 includes a bottom wall 22, a boss 23, a mounting hole 21, a first coupling member 24 and a coupling hole 25.
  • the bottom wall 22 includes a first surface 221 and a second surface 222 opposite to each other.
  • the boss 23 extends from the first surface 221 of the bottom wall 22.
  • the boss 23 includes a first surface 231, and the first surface 231 of the boss 23 is away from the first surface 221 of the bottom wall 22.
  • the first surface 231 of the boss 23 is a stepped surface.
  • the stepped surface includes a first sub-surface 2311, a second sub-surface 2312 and a connecting surface 2313, and the connecting surface 2313 connects the first sub-surface 2311 and the second sub-surface 2312.
  • the mounting hole 21 is opened on the housing 20 and penetrates the boss 23 and the bottom wall 22. Specifically, the first surface 231 of the boss 23 is recessed toward the second surface 222 of the bottom wall 22 to form the mounting hole 21.
  • the mounting hole 21 includes a first sub-cavity 211 and a second sub-cavity 212, and the first sub-cavity 211 and the second sub-cavity 212 communicate with each other. In the direction from the first surface 221 to the second surface 222 of the bottom wall 22, the opening of the second subcavity 212 is expanded outward.
  • the first coupling member 24 is disposed on the first surface 231 of the boss 23 and is disposed around the mounting hole 21.
  • the number of the first coupling member 24 may be one or more. When the number of the first coupling member 24 is multiple, the plurality of first coupling members 24 are evenly distributed around the center of the mounting hole 21.
  • the coupling hole 25 is opened on the housing 20 and penetrates the housing 20.
  • the coupling hole 25 is spaced from the mounting hole 21.
  • the number of the coupling holes 25 may be one or more. In an example, the number of the coupling holes 25 is two, and the two coupling holes 25 are respectively located on opposite sides of the mounting hole 21 and spaced apart from the mounting hole 21.
  • the fill light assembly 10 is installed on the housing 20.
  • the light-filling lamp assembly 10 includes a light-filling lamp 11, a light-transmissive lampshade 12 and a second coupling member 13.
  • the fill light 11 includes a fill light board 111 and a light-emitting chip 112.
  • the fill light board 111 is installed on the housing 20.
  • the supplementary light board 111 may be installed on the housing 20 by at least one of screw connection, clamping, gluing, and welding.
  • the supplementary light board 111 can be mounted on the housing 20 only by screw connection; or the supplementary light board 111 can be mounted on the housing 20 only by snapping; or the supplementary light board 111 can be installed on the housing 20 at the same time.
  • the way of bonding and gluing is installed on the housing 20, etc., which are not limited here.
  • the supplementary light plate 111 may be disposed on the first surface 231 of the boss 23 of the housing 20.
  • the fill light board 111 includes a first surface 1111 and a second surface 1112. Among them, the first surface 1111 and the second surface 1112 are opposite to each other.
  • the first surface 1111 of the supplementary light plate 111 is in contact with the first surface 231 of the boss 23.
  • the part where the first surface 1111 of the supplementary light board 111 and the first surface 231 of the boss 23 are connected may be provided with a copper layer.
  • the part connected with one side 1111 can be processed by laser carving to remove the oxide layer.
  • the housing 20 is usually painted, that is, there will be a paint layer on the first surface 231 of the boss 23. The presence of the paint layer will slow down the heat transfer between the fill light plate 111 and the boss 23 and affect the heat dissipation of the fill light 11.
  • the part of the first surface 231 of the boss 23 that is in contact with the first surface 1111 of the fill light plate 111 can be laser-engraved to remove the lacquer layer, so that the fill light plate 111 is in contact with the convex light plate 111.
  • the heat transfer between the tables 23 becomes faster, and the heat dissipation of the fill light 11 is accelerated.
  • a copper layer is provided on the part where the first surface 1111 of the supplementary light board 111 and the first surface 231 of the boss 23 are connected.
  • the supplementary light board 111 can be grounded, and on the other hand, copper is a good conductor of heat.
  • the provision of a copper layer can further accelerate the heat dissipation of the fill light 11 and ensure the normal operation of the fill light 11.
  • the fill light board 111 further includes a first side surface 1113 and a second side surface 1114.
  • the first side surface 1113 is a curved surface
  • the second side surface 1114 is a flat surface
  • the second side surface 1114 is connected to both ends of the first side surface 1113.
  • first surface 231 of the boss 23 as a stepped surface can make the second side surface 1114 of the light supplement lamp plate 111 conflict with the connecting surface 2313 of the boss 23, so that the stepped surface (first surface 231) can be used for the light supplement lamp
  • the position of the plate 111 is limited to facilitate the installation between the supplementary light plate 111 and the boss 23.
  • the light-emitting chip 112 is arranged on the supplementary light board 111, specifically, the light-emitting chip 112 is arranged on the first surface 1111 of the supplementary light board 111.
  • the light-emitting chip 112 extends into the mounting hole 21.
  • the light-emitting chip 112 may be received in the first sub-cavity 211 of the mounting hole 21 and partially extend into the second sub-cavity 212.
  • the lamp shade 12 is installed in the mounting hole 21, specifically, the lamp shade 12 may be received in the second subcavity 212 of the mounting hole 21.
  • the light-emitting chip 112 and the lampshade 12 are respectively located at opposite ends of the mounting hole 21.
  • the lampshade 12 is made of materials with high light transmittance, such as glass, plastic, etc., and the light emitted by the fill light 11 is emitted to the outside through the lampshade 12.
  • the lampshade 12 cooperates with the housing 20 to prevent external dust, water vapor, etc. from entering the fill light 11.
  • the second sub-cavity 212 Since the opening of the second sub-cavity 212 is expanded outward from the first surface 221 of the bottom wall 22 to the second surface 222 of the bottom wall 22, the second sub-cavity 212 will not interfere with the fill light 11 The light path is blocked, and the light emitted by the fill light 11 can be emitted to the outside through the lampshade 12.
  • the number of the second coupling member 13 may also be one or more, and the number of the second coupling member 13 is the same as the number of the first coupling member 24.
  • Each second coupling member 13 can cooperate with the first coupling member 24 to mount the light supplement lamp board 111 on the boss 23.
  • the number of the first coupling member 24 and the second coupling member 13 are both two, and the two first coupling members 24 are evenly distributed around the center of the mounting hole 21, and two The second coupling members 13 are respectively arranged at positions corresponding to the two first coupling members 24 of the supplementary light board 111.
  • the first coupling member 24 is a protruding post provided with a threaded hole
  • the second coupling member 13 is a through hole
  • the protruding post is penetrated in the through hole.
  • the fill light structure 100 may also include screws (not shown in the figure).
  • the number of screws is the same as the number of studs, and one screw corresponds to one stud.
  • the screw penetrates the threaded hole in the protruding column and presses the second surface 1112 of the light supplement lamp board 111 to install the light supplement light board 111 on the first surface 231 of the boss 23.
  • the additional screws can make the installation between the light supplement lamp plate 111 and the boss 23 more stable, and prevent the light supplement lamp 11 from falling off from the housing 20.
  • the main board 200 is installed in the housing 20 and is electrically connected to the light supplementary lamp board 111.
  • the main board 200 may provide electrical signals for the supplementary light 11 so that the supplementary light 11 can emit light to the outside.
  • the main board 200 includes a first surface 201 and a second surface 202 opposite to each other.
  • the first surface 201 of the main board 200 is opposite to the first surface 221 of the bottom wall 22.
  • the electrical connector 203 is disposed on the first side 201 of the main board 200.
  • the electrical connector 203 can be welded on the first side 201 of the main board 200.
  • the electrical connector 203 is electrically connected to the second surface 1112 of the supplemental light board 111.
  • the supplemental light board 111 is electrically connected to the main board 200 through the electrical connector 203.
  • the electrical connector 203 may be an elastic electrical connector 203, for example, the electrical connector 203 may be a pogo pin or a metal spring sheet or the like.
  • the elastic electrical connector 203 has the feature of being stretchable, and the use of the elastic electrical connector 203 to electrically connect the main board 200 and the fill light board 111 can avoid the problem of damage to the electrical connector 203 during installation.
  • the imaging device 300 is installed in the coupling hole 25.
  • the imaging device 300 is electrically connected to the main board 200.
  • the photographing device 300 may be used to receive external light for imaging, and the fill light 11 may supplement light for the photographing device 300 in a low-bright environment.
  • the photographing device 300 may be a visible light camera, an infrared camera, etc., which is not limited here.
  • the number of the photographing device 300 may be one or more, and the number of the photographing device 300 is the same as the number of the coupling holes 25. In an example, the number of the photographing devices 300 is two, and the two photographing devices 300 form a binocular stereo vision system to measure depth information.
  • the fill light assembly 10 is installed on the main board 200, the heat generated during the operation of the fill light assembly 10 will be transferred to the main board 200, causing the temperature of the main board 200 to increase.
  • the imaging device 300 is connected to the main board 200, and the heat of the main board 200 is also transferred to the imaging device 300, causing the temperature of the imaging device 300 to also increase.
  • the temperature and height of the photographing device 300 will seriously affect the working performance of the photographing device 300.
  • the photographing device 400 of the embodiment of the present application mounts the fill light assembly 10 on the housing 20, and the housing 20 assists the heat dissipation of the fill light assembly 10, and the heat generated by the fill light assembly 10 will not be transferred to the main board 200. Therefore, the photographing device 300 will not be affected.
  • the fill light assembly 10 is directly mounted on the housing 20.
  • the fill light assembly 10 is concentric with the mounting holes 21 opened on the housing 20. Degree is higher.
  • the heat generated during the operation of the supplementary light assembly 10 will be dissipated to the outside through the housing 20, and will not be transferred to the main board 200 to cause the temperature of the main board 200 to rise, thereby avoiding the influence on the working performance of the main board 200.
  • the main board 200 does not need to be provided with a heat conducting element at a position close to the supplementary light assembly 10, thereby avoiding the problem of wasting space on the motherboard 200.
  • the fill light assembly 10 is assisted by the housing 20 to dissipate heat, and the heat generated by the fill light assembly 10 will not be transferred to the main board 200 and will not affect the imaging device 300.
  • the first surface 231 of the boss 23 may also be a flat surface.
  • the supplementary light board 111 may only include the first side surface 1113 that is arcuate. The first side surface 1113 conflicts with the first surface 231 of the boss 23. Setting the first surface 231 of the boss 23 to be a plane can simplify the manufacturing process of the fill light structure 100.
  • the first coupling member 24 shown in FIG. 6 may be a threaded hole
  • the second coupling member 13 shown in FIG. 6 may also be a threaded hole
  • the fill light structure 100 may also include screws. The screw passes through the second coupling member 13 and is screwed into the first coupling member 24 to install the fill light plate 111 (shown in Figure 6) on the first surface 231 ( Figure 6) of the boss 23 (shown in Figure 6). 6 shown) on.
  • Both the first coupling member 24 and the second coupling member 13 are arranged as threaded holes, and the screws are combined with the two threaded holes, which can ensure a stable connection between the light supplement lamp plate 111 and the boss 23.
  • the first coupling member 24 shown in FIG. 6 may be a clamping hole
  • the second coupling member 13 shown in FIG. 6 may be a clamping post.
  • the engaging column is engaged into the engaging hole to install the light supplement lamp board 111 (shown in FIG. 6) on the first surface 231 (shown in FIG. 6) of the boss 23 (shown in FIG. 6).
  • the first coupling member 24 may also be a clamping post
  • the second coupling member 13 may be a clamping hole
  • the clamping post is clamped into the clamping hole, so that the supplementary light plate 111 is installed on the first part of the boss 23. one side.
  • an embodiment of the present application further provides a movable platform 1000, the movable platform 1000 includes a movable platform body 500 and the photographing device 400 described in any of the above embodiments.
  • the photographing device 400 is installed on the movable platform body 500.
  • the movable platform body 500 may be an unmanned aerial vehicle, an unmanned ship, an unmanned vehicle, etc., which is not limited here.
  • the fill light assembly 10 is directly mounted on the housing 20.
  • the concentricity between the fill light assembly 10 and the mounting hole 21 opened on the housing 20 is relatively high. high.
  • the heat generated during the operation of the supplementary light assembly 10 will be dissipated to the outside through the housing 20, and will not be transferred to the main board 200 to cause the temperature of the main board 200 to rise, thereby avoiding the influence on the working performance of the main board 200.
  • the main board 200 does not need to be provided with a heat conducting member at a position close to the supplementary light assembly 10, thereby avoiding the problem of wasting space on the motherboard 200.
  • the mobile platform 1000 further includes a wireless receiving component (ADS-B) and a GPS circuit board.
  • ADS-B wireless receiving component
  • the wireless receiving component can also be electrically connected to the GPS circuit board through a flexible electrical connector 203 (shown in FIG. 4).
  • Each wireless receiving component can be electrically connected to the GPS circuit board through one or more elastic electrical connectors 203.
  • using the flexible electrical connector 203 to electrically connect the wireless receiving component and the GPS circuit board can improve the assembly yield and ensure the connection between the wireless receiving component and the GPS circuit board. Stable communication, while also reducing costs.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of” means at least two, for example two, three, unless otherwise specifically defined.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A fill light structure (100), a photography apparatus (400), and a movable platform (1000). The fill light structure (100) comprises a housing (20) and a fill light assembly (10). The fill light assembly (10) comprises a fill light (11) and a light-transmissive shade (12). The fill light (11) comprises a fill light panel (111) mounted on the housing (20) and a light-emitting chip (112) disposed on the fill light panel (111), and the light-emitting chip (112) extends into a mounting hole (21) provided on the housing (20). The shade (12) is mounted in the mounting hole (21), and the light-emitting chip (112) and the shade (12) are respectively located at two opposite ends of the mounting hole (21).

Description

补光灯结构、拍摄设备及可移动平台Fill light structure, shooting equipment and movable platform 技术领域Technical field
本申请涉及无人机领域,特别涉及一种补光灯结构、拍摄设备及可移动平台。This application relates to the field of unmanned aerial vehicles, in particular to a supplementary light structure, photographing equipment and a movable platform.
背景技术Background technique
无人机上可以设置有补光灯。一方面,补光灯可以在环境亮度较低时为无人机搭载的摄像头进行补光,以改善摄像头采集的图像的质量;另一方面,当无人机在亮度较低的环境中起飞或降落时,也可以开启补光灯进行补光,以保证无人机起飞或降落时的安全性。目前,补光灯通常直接安装在无人机的主板上,然而,这种安装方式下补光灯产生的热量将传递到主板上,导致主板的温度升高,影响主板的工作性能。A fill light can be set on the drone. On the one hand, the fill light can supplement the light for the camera of the drone when the ambient brightness is low, so as to improve the quality of the image captured by the camera; on the other hand, when the drone takes off or takes off in a low-brightness environment When landing, you can also turn on the fill light to fill light to ensure the safety of the drone during take-off or landing. At present, the fill light is usually directly installed on the main board of the drone. However, the heat generated by the fill light will be transferred to the main board under this installation method, which will cause the temperature of the main board to rise and affect the working performance of the main board.
发明内容Summary of the invention
本申请的实施方式提供了一种补光灯结构、拍摄设备及可移动平台。The embodiments of the present application provide a supplementary light structure, photographing equipment and a movable platform.
本申请实施方式的补光灯结构包括壳体及补光灯组件。所述壳体开设有贯穿的安装孔。所述补光灯组件包括补光灯及透光的灯罩。所述补光灯包括补光灯板及设置在所述补光灯板上的发光芯片。所述补光灯板安装在所述壳体上并使所述发光芯片伸入所述安装孔。所述灯罩安装在所述安装孔内,所述发光芯片与所述灯罩分别位于所述安装孔的相对两端。The light supplement lamp structure of the embodiment of the present application includes a housing and a light supplement lamp assembly. The housing is provided with a penetrating installation hole. The light-filling lamp assembly includes a light-filling lamp and a light-transmitting lampshade. The supplemental light includes a supplementary light board and a light-emitting chip arranged on the supplementary light board. The supplemental light board is installed on the housing and the light-emitting chip extends into the installation hole. The lampshade is installed in the mounting hole, and the light-emitting chip and the lampshade are respectively located at opposite ends of the mounting hole.
在某些实施方式中,所述补光灯板通过螺钉连接、卡合、胶合、焊接方式中的至少一种安装在所述壳体上。In some embodiments, the supplemental light board is installed on the housing by at least one of screw connection, clamping, gluing, and welding.
在某些实施方式中,所述壳体包括底壁及凸台。所述底壁包括相背的第一面及第二面。所述凸台自所述底壁的第一面延伸。所述安装孔贯穿所述凸台及所述底壁,所述补光灯板安装在所述凸台的第一面,所述凸台的第一面远离所述底壁的第一面。In some embodiments, the housing includes a bottom wall and a boss. The bottom wall includes a first surface and a second surface opposite to each other. The boss extends from the first surface of the bottom wall. The mounting hole penetrates the boss and the bottom wall, the light supplement lamp board is mounted on the first surface of the boss, and the first surface of the boss is away from the first surface of the bottom wall.
在某些实施方式中,所述补光灯板包括相背的第一面及第二面。所述发光芯片设置在所述补光灯板的第一面。所述凸台的第一面朝所述底壁的第二面凹陷形成所述安装孔。所述补光灯板的第一面与所述凸台的第一面相接。所述凸台的第一面上设置有围绕所述安装孔的第一结合件,所述补光灯板的第一面设置有围绕所述发光芯片的第二结合件,所述第一结合件与所述第二结合件配合。In some embodiments, the supplemental light panel includes a first side and a second side opposite to each other. The light-emitting chip is arranged on the first surface of the supplementary light board. The first surface of the boss is recessed toward the second surface of the bottom wall to form the mounting hole. The first surface of the supplementary light board is in contact with the first surface of the boss. A first coupling member surrounding the mounting hole is provided on the first surface of the boss, a second coupling member surrounding the light-emitting chip is provided on the first surface of the fill light board, and the first coupling member The part cooperates with the second coupling part.
在某些实施方式中,所述补光灯板的第一面的与所述凸台的第一面的相接的部分设置有铜层,所述凸台的第一面的与所述补光灯板的第一面相接的部分经过镭雕去氧化层处理。In some embodiments, the portion of the first surface of the supplementary light board that is in contact with the first surface of the boss is provided with a copper layer, and the first surface of the boss is connected to the complementary The part where the first side of the light board is connected is processed by laser carving to remove the oxide layer.
在某些实施方式中,所述第一结合件的数量为多个,多个所述第一结合件环绕所述安装孔的中心均匀分布。In some embodiments, the number of the first coupling members is multiple, and the plurality of first coupling members are evenly distributed around the center of the mounting hole.
在某些实施方式中,所述第一结合件为螺纹孔,所述第二结合件为螺纹孔,所述补光灯结构还包括螺钉,所述螺钉穿过所述第二结合件并螺合进所述第一结合件内,以将所述补光灯板安装在所述凸台的第一面。In some embodiments, the first coupling member is a threaded hole, the second coupling member is a threaded hole, and the fill light structure further includes a screw that passes through the second coupling member and is screwed. And fit into the first coupling member to install the light supplement lamp board on the first surface of the boss.
在某些实施方式中,所述第一结合件为卡合孔,所述第二结合件为卡合柱,所述卡合柱卡合进所述卡合孔内,以将所述补光灯板安装在所述凸台的第一面。In some embodiments, the first coupling member is a clamping hole, the second coupling member is a clamping post, and the clamping post is clamped into the clamping hole to fill the light The light board is installed on the first surface of the boss.
在某些实施方式中,所述第一结合件为卡合柱,所述第二结合件为卡合孔,所述卡合柱卡合进所述卡合孔内,以将所述补光灯板安装在所述凸台的第一面。In some embodiments, the first coupling member is an engaging post, the second coupling member is an engaging hole, and the engaging post is engaged into the engaging hole to fill the light The light board is installed on the first surface of the boss.
在某些实施方式中,所述第一结合件为开设有螺纹孔的突柱,所述第二结合件为通孔,所述突柱穿设在所述通孔内。In some embodiments, the first coupling member is a protruding post provided with a threaded hole, the second coupling member is a through hole, and the protruding post penetrates through the through hole.
在某些实施方式中,所述补光灯结构还包括螺钉,所述螺钉穿设所述螺纹孔并压住所述补光灯板的第二面,以将所述补光灯板安装在所述凸台的第一面。In some embodiments, the light supplement lamp structure further includes a screw that penetrates the threaded hole and presses the second surface of the light supplement light board to mount the light supplement light board on The first surface of the boss.
在某些实施方式中,所述凸台的第一面为平面。In some embodiments, the first surface of the boss is a flat surface.
在某些实施方式中,所述凸台的第一面为阶梯面。所述阶梯面包括第一子面、第二子面、及连接所述第一子面与所述第二子面的连接面。所述补光灯板包括第一侧面及第二侧面,所述第一侧面为弧面。所述第二侧面连接所述第一侧面的两端,第二侧面为平面。所述第一子面与所述补光灯板的第一面抵触,所述第二侧面与所述连接面抵触。In some embodiments, the first surface of the boss is a stepped surface. The stepped surface includes a first sub-surface, a second sub-surface, and a connecting surface connecting the first sub-surface and the second sub-surface. The supplemental light panel includes a first side surface and a second side surface, and the first side surface is a curved surface. The second side surface is connected to both ends of the first side surface, and the second side surface is a plane. The first sub-surface is in contact with the first surface of the light supplement lamp board, and the second side surface is in contact with the connecting surface.
在某些实施方式中,所述安装孔包括连通的第一子腔及第二子腔。所述发光芯片收容在所述第一子腔并部分伸入所述第二子腔,所述灯罩收容在所述第二子腔内。In some embodiments, the mounting hole includes a first sub-cavity and a second sub-cavity that are connected. The light-emitting chip is contained in the first sub-cavity and partially extends into the second sub-cavity, and the lampshade is contained in the second sub-cavity.
在某些实施方式中,自所述底壁的第一面至所述底壁的第二面的方向上,所述第二子腔的开口呈外扩状。In some embodiments, in a direction from the first surface of the bottom wall to the second surface of the bottom wall, the opening of the second subcavity has an outwardly expanding shape.
在某些实施方式中,所述壳体由镁合金制成。In some embodiments, the housing is made of magnesium alloy.
本申请实施方式的拍摄设备包括主板及上述任一实施方式所述的补光灯结构。所述主板安装在所述壳体内并与所述补光灯板电连接。The photographing device of the embodiment of the present application includes a main board and the light-filling lamp structure described in any of the above embodiments. The main board is installed in the housing and is electrically connected to the light supplement lamp board.
在某些实施方式中,所述主板包括相背的第一面及第二面。所述主板的第一面与所述底壁的第一面相对。所述主板的第一面设置弹性的电连接件,所述电连接件与所述补光灯板的第二面电性连接。In some embodiments, the main board includes a first side and a second side opposite to each other. The first surface of the main board is opposite to the first surface of the bottom wall. The first surface of the main board is provided with an elastic electrical connector, and the electrical connector is electrically connected to the second surface of the light supplement lamp board.
在某些实施方式中,所述电连接件包括弹簧顶针(pogo pin)或金属弹片。In some embodiments, the electrical connector includes a pogo pin or a metal shrapnel.
在某些实施方式中,所述壳体还开设有贯穿的结合孔,所述结合孔与所述安装孔间隔。所述拍摄设备还包括拍摄装置,所述拍摄装置安装在所述结合孔内。所述拍摄装置与所述主板电连接,所述拍摄装置用于接收外界光线以成像。In some embodiments, the housing is further provided with a through-hole connecting hole, and the connecting hole is spaced from the mounting hole. The photographing equipment further includes a photographing device installed in the coupling hole. The photographing device is electrically connected to the main board, and the photographing device is used for receiving external light for imaging.
本申请实施方式的可移动平台包括可移动平台本体及上述任一实施方式所述的拍摄设备。所述拍摄设备安装在所述可移动平台本体上。The movable platform of the embodiment of the present application includes the movable platform body and the photographing equipment described in any of the above embodiments. The photographing equipment is installed on the movable platform body.
本申请实施方式的补光灯结构、拍摄设备及可移动平台将补光灯组件安装在壳体上,一方面可以保证补光灯组件与壳体的安装孔之间的同心度,另一方面,补光灯组件工作时产生的热量可以通过壳体进行散发,从而避免了将补光灯组件安装在主板中导致主板的工作性能受到影响的问题。The fill light structure, the shooting device and the movable platform of the embodiments of the present application mount the fill light assembly on the housing, on the one hand, it can ensure the concentricity between the fill light assembly and the mounting hole of the housing, and on the other hand , The heat generated during the operation of the fill light assembly can be dissipated through the housing, thereby avoiding the problem that the work performance of the motherboard will be affected when the fill light assembly is installed in the main board.
本申请的实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实施方式的实践了解到。The additional aspects and advantages of the embodiments of the present application will be partly given in the following description, and part of them will become obvious from the following description, or be understood through the practice of the embodiments of the present application.
附图说明Description of the drawings
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:
图1是本申请某些实施方式的可移动平台的立体结构示意图;FIG. 1 is a schematic diagram of a three-dimensional structure of a movable platform according to some embodiments of the present application;
图2是图1所示的可移动平台的部分截面示意图;Fig. 2 is a schematic partial cross-sectional view of the movable platform shown in Fig. 1;
图3是图2中可移动平台的III区域的放大示意图;Fig. 3 is an enlarged schematic diagram of area III of the movable platform in Fig. 2;
图4是图2中可移动平台的IV区域的放大示意图;Fig. 4 is an enlarged schematic diagram of the IV area of the movable platform in Fig. 2;
图5是图1所示的可移动平台的部分立体结构示意图;Fig. 5 is a partial three-dimensional structural diagram of the movable platform shown in Fig. 1;
图6是图5所示的可移动平台的一个实施例的VI区域的放大示意图;Fig. 6 is an enlarged schematic diagram of the VI area of an embodiment of the movable platform shown in Fig. 5;
图7是图5所示的可移动平台的另一个实施例的VI区域的放大示意图;FIG. 7 is an enlarged schematic diagram of the VI area of another embodiment of the movable platform shown in FIG. 5;
图8是图5所示的可移动平台的沿VIII-VIII线的截面示意图;Fig. 8 is a schematic cross-sectional view of the movable platform shown in Fig. 5 along line VIII-VIII;
图9是图8中可移动平台的IX区域的放大示意图。Fig. 9 is an enlarged schematic diagram of the IX area of the movable platform in Fig. 8.
具体实施方式Detailed ways
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。The implementation of the present application will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings indicate the same or similar elements or elements with the same or similar functions throughout.
另外,下面结合附图描述的本申请的实施方式是示例性的,仅用于解释本申请的实施方式,而不能理解为对本申请的限制。In addition, the implementation manners of the present application described below in conjunction with the drawings are exemplary, and are only used to explain the implementation manners of the present application, and should not be construed as limiting the application.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。In this application, unless expressly stipulated and defined otherwise, the first feature “on” or “under” the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. touch. Moreover, the "above", "above" and "above" of the first feature on the second feature may mean that the first feature is directly above or diagonally above the second feature, or it simply means that the level of the first feature is higher than the second feature. The “below”, “below” and “below” of the second feature of the first feature may be that the first feature is directly below or obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
请参阅图2至图4,本申请实施方式提供一种补光灯结构100。补光灯结构100包括壳体20及补光灯组件10。壳体20开设有贯穿的安装孔21。补光灯组件10包括补 光灯11及透光的灯罩12。补光灯11包括补光灯板111及设置在补光灯板111上的发光芯片112。补光灯板111安装在壳体20上并使发光芯片112伸入安装孔21。灯罩12安装在安装孔21内。发光芯片112与灯罩12分别位于安装孔21的相对两端。Please refer to FIG. 2 to FIG. 4, an embodiment of the present application provides a light supplement lamp structure 100. The fill light structure 100 includes a housing 20 and a fill light assembly 10. The housing 20 is provided with a mounting hole 21 penetrating therethrough. The fill light assembly 10 includes a fill light 11 and a light-transmitting lamp cover 12. The fill light 11 includes a fill light board 111 and a light-emitting chip 112 arranged on the fill light board 111. The supplementary light board 111 is mounted on the housing 20 and the light-emitting chip 112 extends into the mounting hole 21. The lampshade 12 is installed in the mounting hole 21. The light-emitting chip 112 and the lampshade 12 are respectively located at opposite ends of the mounting hole 21.
可以理解,补光灯组件10可以安装在主板200上,主板200为补光灯组件10提供电信号以使得补光灯组件10发光。然而,补光灯组件10发光时会产生热量,这一部分热量会传递到主板200上,导致主板200的温度升高。主板200的温度升高不利于主板200的正常工作。并且,补光灯组件10安装在主板200上时,需要在补光灯组件10的周围放置一圈导热件以散热,这将导致主板200的空间浪费。此外,补光灯组件10安装后,要求壳体20上开设的安装孔21与补光灯组件10之间要具有较高的同心度,以使得补光灯组件10发出的光线能够全部出射到外界中。若将补光灯组件10安装在主板200上,则补光灯组件10与壳体20上的安装孔21之间的同心度无法得到保证,可能导致补光灯组件10发出的光线无法全部从安装孔21中通过,从而影响补光效果的问题。It can be understood that the supplementary light assembly 10 may be installed on the main board 200, and the motherboard 200 provides an electrical signal for the supplementary light assembly 10 to make the supplementary light assembly 10 emit light. However, when the fill light assembly 10 emits light, heat is generated, and this part of the heat is transferred to the main board 200, causing the temperature of the main board 200 to increase. The increase in the temperature of the main board 200 is not conducive to the normal operation of the main board 200. In addition, when the supplementary light assembly 10 is installed on the main board 200, a circle of heat-conducting elements needs to be placed around the supplementary light assembly 10 to dissipate heat, which will result in a waste of space on the motherboard 200. In addition, after the fill light assembly 10 is installed, it is required that the mounting hole 21 opened on the housing 20 and the fill light assembly 10 have a high degree of concentricity, so that all the light emitted by the fill light assembly 10 can be emitted to In the outside world. If the fill light assembly 10 is mounted on the main board 200, the concentricity between the fill light assembly 10 and the mounting hole 21 on the housing 20 cannot be guaranteed, which may cause the light emitted by the fill light assembly 10 to fail The problem of passing through the mounting hole 21, which affects the light supplement effect.
本申请实施方式的补光灯结构100中,补光灯组件10直接安装在壳体20上,此种安装方式下补光灯组件10与壳体20上开设的安装孔21之间的同心度较高,补光灯组件10发出的光线都能够出射到外界。并且,补光灯组件10工作时产生的热量会通过壳体20散发到外界,而不会传递到主板200上导致主板200温度上升,避免了对主板200的工作性能的影响。此外,补光灯组件10的热量不通过主板200进行散发时,主板200的靠近补光灯组件10的位置不需要再设置导热件,避免了主板200的空间浪费的问题。In the fill light structure 100 of the embodiment of the present application, the fill light assembly 10 is directly mounted on the housing 20. In this installation mode, the concentricity between the fill light assembly 10 and the mounting hole 21 opened on the housing 20 is Higher, the light emitted by the fill light assembly 10 can be emitted to the outside. In addition, the heat generated during the operation of the supplementary light assembly 10 will be dissipated to the outside through the housing 20, and will not be transferred to the main board 200 to cause the temperature of the main board 200 to rise, thereby avoiding the influence on the working performance of the main board 200. In addition, when the heat of the light supplement lamp assembly 10 is not dissipated through the main board 200, the main board 200 does not need to be provided with a heat conducting element at a position close to the light supplement lamp assembly 10, thereby avoiding the problem of wasting space of the main board 200.
请参阅图1至图4,本申请实施方式还提供一种拍摄设备400。拍摄设备400包括补光灯结构100、主板200、电连接件203及拍摄装置300。补光灯结构100包括壳体20及补光灯组件10。Please refer to FIG. 1 to FIG. 4, an embodiment of the present application further provides a photographing device 400. The photographing equipment 400 includes a supplementary light structure 100, a main board 200, an electrical connector 203 and a photographing device 300. The fill light structure 100 includes a housing 20 and a fill light assembly 10.
请参阅图3、图4、图6及图8,壳体20可以由镁合金制成。镁合金具有高强度、质量轻及散热性能好的优势,可以有效地辅助补光灯组件10的散热。壳体20包括底壁22、凸台23、安装孔21、第一结合件24及结合孔25。底壁22包括相背的第一面221及第二面222。Please refer to FIG. 3, FIG. 4, FIG. 6 and FIG. 8. The housing 20 may be made of magnesium alloy. Magnesium alloy has the advantages of high strength, light weight and good heat dissipation performance, and can effectively assist the heat dissipation of the fill light assembly 10. The housing 20 includes a bottom wall 22, a boss 23, a mounting hole 21, a first coupling member 24 and a coupling hole 25. The bottom wall 22 includes a first surface 221 and a second surface 222 opposite to each other.
凸台23自底壁22的第一面221延伸。凸台23包括第一面231,凸台23的第一面231远离底壁22的第一面221。凸台23的第一面231为阶梯面。该阶梯面包括第一子面2311、第二子面2312及连接面2313,连接面2313连接第一子面2311与第二子面2312。The boss 23 extends from the first surface 221 of the bottom wall 22. The boss 23 includes a first surface 231, and the first surface 231 of the boss 23 is away from the first surface 221 of the bottom wall 22. The first surface 231 of the boss 23 is a stepped surface. The stepped surface includes a first sub-surface 2311, a second sub-surface 2312 and a connecting surface 2313, and the connecting surface 2313 connects the first sub-surface 2311 and the second sub-surface 2312.
安装孔21开设在壳体20上,并贯穿凸台23及底壁22。具体地,凸台23的第一 面231朝底壁22的第二面222凹陷形成有该安装孔21。安装孔21包括第一子腔211和第二子腔212,第一子腔211和第二子腔212连通。自底壁22的第一面221至第二面222的方向上,第二子腔212的开口呈外扩状。The mounting hole 21 is opened on the housing 20 and penetrates the boss 23 and the bottom wall 22. Specifically, the first surface 231 of the boss 23 is recessed toward the second surface 222 of the bottom wall 22 to form the mounting hole 21. The mounting hole 21 includes a first sub-cavity 211 and a second sub-cavity 212, and the first sub-cavity 211 and the second sub-cavity 212 communicate with each other. In the direction from the first surface 221 to the second surface 222 of the bottom wall 22, the opening of the second subcavity 212 is expanded outward.
第一结合件24设置在凸台23的第一面231上,且围绕安装孔21设置。第一结合件24的数量可以为一个或多个。当第一结合件24的数量为多个时,多个第一结合件24环绕安装孔21的中心均匀分布。The first coupling member 24 is disposed on the first surface 231 of the boss 23 and is disposed around the mounting hole 21. The number of the first coupling member 24 may be one or more. When the number of the first coupling member 24 is multiple, the plurality of first coupling members 24 are evenly distributed around the center of the mounting hole 21.
请参阅图3、图5及图8,结合孔25开设在壳体20上,且贯穿壳体20。结合孔25与安装孔21间隔。结合孔25的数量可以为一个或多个。在一个例子中,结合孔25的数量为两个,两个结合孔25分别位于安装孔21的相背两侧,并均与安装孔21间隔。Please refer to FIG. 3, FIG. 5 and FIG. 8, the coupling hole 25 is opened on the housing 20 and penetrates the housing 20. The coupling hole 25 is spaced from the mounting hole 21. The number of the coupling holes 25 may be one or more. In an example, the number of the coupling holes 25 is two, and the two coupling holes 25 are respectively located on opposite sides of the mounting hole 21 and spaced apart from the mounting hole 21.
请参阅图3至图6,补光灯组件10安装在壳体20上。补光灯组件10包括补光灯11、透光的灯罩12及第二结合件13。补光灯11包括补光灯板111及发光芯片112。Referring to FIGS. 3 to 6, the fill light assembly 10 is installed on the housing 20. The light-filling lamp assembly 10 includes a light-filling lamp 11, a light-transmissive lampshade 12 and a second coupling member 13. The fill light 11 includes a fill light board 111 and a light-emitting chip 112.
补光灯板111安装在壳体20上。补光灯板111可以通过螺钉连接、卡合、胶合、焊接方式中的至少一种安装在壳体20上。例如,补光灯板111可以仅通过螺钉连接方式安装在壳体20上;或者,补光灯板111可以仅通过卡合方式安装在壳体20上;或者补光灯板111可以同时通过卡合及胶合的方式安装在壳体20上等,在此不作限制。补光灯板111可以设置在壳体20的凸台23的第一面231上。补光灯板111包括第一面1111及第二面1112。其中,第一面1111和第二面1112相背。The fill light board 111 is installed on the housing 20. The supplementary light board 111 may be installed on the housing 20 by at least one of screw connection, clamping, gluing, and welding. For example, the supplementary light board 111 can be mounted on the housing 20 only by screw connection; or the supplementary light board 111 can be mounted on the housing 20 only by snapping; or the supplementary light board 111 can be installed on the housing 20 at the same time. The way of bonding and gluing is installed on the housing 20, etc., which are not limited here. The supplementary light plate 111 may be disposed on the first surface 231 of the boss 23 of the housing 20. The fill light board 111 includes a first surface 1111 and a second surface 1112. Among them, the first surface 1111 and the second surface 1112 are opposite to each other.
补光灯板111设置在凸台23的第一面231上时,补光灯板111的第一面1111与凸台23的第一面231相接。此时,补光灯板111的第一面1111与凸台23的第一面231的相接的部分可以设置有铜层,凸台23的第一面231的与补光灯板111的第一面1111相接的部分可以经过镭雕去氧化层处理。可以理解,壳体20通常会做喷漆处理,也即凸台23的第一面231上会存在漆层。漆层的存在会导致补光灯板111与凸台23之间的热传递变慢,影响补光灯11的散热。因此,可以对凸台23的第一面231的与补光灯板111的第一面1111相接的部分进行镭雕去氧化层处理以去除掉漆层,从而使得补光灯板111与凸台23之间热传递变快,加快补光灯11的散热。而在补光灯板111的第一面1111与凸台23的第一面231相接的部分设置铜层,一方面可以使得补光灯板111接地,另一方面,铜是热的良导体,设置铜层可以进一步加快补光灯11的散热,保证补光灯11的正常工作。When the supplementary light plate 111 is disposed on the first surface 231 of the boss 23, the first surface 1111 of the supplementary light plate 111 is in contact with the first surface 231 of the boss 23. At this time, the part where the first surface 1111 of the supplementary light board 111 and the first surface 231 of the boss 23 are connected may be provided with a copper layer. The part connected with one side 1111 can be processed by laser carving to remove the oxide layer. It can be understood that the housing 20 is usually painted, that is, there will be a paint layer on the first surface 231 of the boss 23. The presence of the paint layer will slow down the heat transfer between the fill light plate 111 and the boss 23 and affect the heat dissipation of the fill light 11. Therefore, the part of the first surface 231 of the boss 23 that is in contact with the first surface 1111 of the fill light plate 111 can be laser-engraved to remove the lacquer layer, so that the fill light plate 111 is in contact with the convex light plate 111. The heat transfer between the tables 23 becomes faster, and the heat dissipation of the fill light 11 is accelerated. A copper layer is provided on the part where the first surface 1111 of the supplementary light board 111 and the first surface 231 of the boss 23 are connected. On the one hand, the supplementary light board 111 can be grounded, and on the other hand, copper is a good conductor of heat. The provision of a copper layer can further accelerate the heat dissipation of the fill light 11 and ensure the normal operation of the fill light 11.
补光灯板111还包括第一侧面1113及第二侧面1114。其中,第一侧面1113为弧面,第二侧面1114为平面,第二侧面1114连接第一侧面1113的两端。补光灯板111设置在凸台23的第一面231上时,补光灯板111的第一面1111与凸台23的第一子面2311抵触,补光灯板111的第二侧面1114与凸台23的连接面2313抵触。将凸台23的第一面231设置成阶梯面可以使得补光灯板111的第二侧面1114与凸台23的连接面2313抵触,从而可 以利用阶梯面(第一面231)对补光灯板111进行限位,便于补光灯板111与凸台23之间的安装。The fill light board 111 further includes a first side surface 1113 and a second side surface 1114. Among them, the first side surface 1113 is a curved surface, the second side surface 1114 is a flat surface, and the second side surface 1114 is connected to both ends of the first side surface 1113. When the supplemental light board 111 is arranged on the first surface 231 of the boss 23, the first surface 1111 of the supplementary light board 111 and the first sub-surface 2311 of the boss 23 conflict, and the second side surface 1114 of the supplementary light board 111 It conflicts with the connecting surface 2313 of the boss 23. Setting the first surface 231 of the boss 23 as a stepped surface can make the second side surface 1114 of the light supplement lamp plate 111 conflict with the connecting surface 2313 of the boss 23, so that the stepped surface (first surface 231) can be used for the light supplement lamp The position of the plate 111 is limited to facilitate the installation between the supplementary light plate 111 and the boss 23.
请参阅图4,发光芯片112设置在补光灯板111上,具体地,发光芯片112设置在补光灯板111的第一面1111上。在补光灯板111安装在壳体20上时,发光芯片112伸入安装孔21。发光芯片112可以收容在安装孔21的第一子腔211内并部分伸入第二子腔212。Please refer to FIG. 4, the light-emitting chip 112 is arranged on the supplementary light board 111, specifically, the light-emitting chip 112 is arranged on the first surface 1111 of the supplementary light board 111. When the supplemental light board 111 is mounted on the housing 20, the light-emitting chip 112 extends into the mounting hole 21. The light-emitting chip 112 may be received in the first sub-cavity 211 of the mounting hole 21 and partially extend into the second sub-cavity 212.
请继续参阅图4,灯罩12安装在安装孔21内,具体地,灯罩12可以收容在安装孔21的第二子腔212内。发光芯片112与灯罩12分别位于安装孔21的相对两端。灯罩12由高透光率的材料,例如玻璃、塑料等制成,补光灯11发出的光线穿过灯罩12发射到外界。灯罩12与壳体20配合,可以避免外界的灰尘、水汽等进入到补光灯11中。由于自底壁22的第一面221至底壁22的第二面222的方向上,第二子腔212的开口呈外扩状,因此,第二子腔212不会对补光灯11的光路产生遮挡,补光灯11发射的光线都可以经灯罩12出射到外界。Please continue to refer to FIG. 4, the lamp shade 12 is installed in the mounting hole 21, specifically, the lamp shade 12 may be received in the second subcavity 212 of the mounting hole 21. The light-emitting chip 112 and the lampshade 12 are respectively located at opposite ends of the mounting hole 21. The lampshade 12 is made of materials with high light transmittance, such as glass, plastic, etc., and the light emitted by the fill light 11 is emitted to the outside through the lampshade 12. The lampshade 12 cooperates with the housing 20 to prevent external dust, water vapor, etc. from entering the fill light 11. Since the opening of the second sub-cavity 212 is expanded outward from the first surface 221 of the bottom wall 22 to the second surface 222 of the bottom wall 22, the second sub-cavity 212 will not interfere with the fill light 11 The light path is blocked, and the light emitted by the fill light 11 can be emitted to the outside through the lampshade 12.
请参阅图2、图4、图6、图8及图9,第二结合件13设置在补光灯板111的第一面1111上,且围绕发光芯片112设置。第二结合件13的数量也可以为一个或多个,第二结合件13的数量与第一结合件24的数量相同。每个第二结合件13可以与第一结合件24配合,以将补光灯板111安装在凸台23上。在一个例子中,如图6和图8所示,第一结合件24和第二结合件13的数量均为两个,两个第一结合件24环绕安装孔21的中心均匀分布,两个第二结合件13分别设置在补光灯板111的与两个第一结合件24对应的位置。第一结合件24为开设有螺纹孔的突柱,第二结合件13为通孔,突柱穿设在通孔内。如此,通过突柱与通孔的配合,可以将补光灯板111安装在凸台23上。进一步地,补光灯结构100还可以包括螺钉(图未示)。螺钉的数量与突柱的数量相同,一个螺钉对应一个突柱。螺钉穿设突柱内的螺纹孔并压住补光灯板111的第二面1112,以将补光灯板111安装在凸台23的第一面231。增设螺钉可以使得补光灯板111与凸台23之间的安装更加稳固,避免补光灯11从壳体20中脱落。Please refer to FIG. 2, FIG. 4, FIG. 6, FIG. 8 and FIG. The number of the second coupling member 13 may also be one or more, and the number of the second coupling member 13 is the same as the number of the first coupling member 24. Each second coupling member 13 can cooperate with the first coupling member 24 to mount the light supplement lamp board 111 on the boss 23. In an example, as shown in FIGS. 6 and 8, the number of the first coupling member 24 and the second coupling member 13 are both two, and the two first coupling members 24 are evenly distributed around the center of the mounting hole 21, and two The second coupling members 13 are respectively arranged at positions corresponding to the two first coupling members 24 of the supplementary light board 111. The first coupling member 24 is a protruding post provided with a threaded hole, and the second coupling member 13 is a through hole, and the protruding post is penetrated in the through hole. In this way, through the cooperation of the studs and the through holes, the light supplement lamp plate 111 can be installed on the boss 23. Further, the fill light structure 100 may also include screws (not shown in the figure). The number of screws is the same as the number of studs, and one screw corresponds to one stud. The screw penetrates the threaded hole in the protruding column and presses the second surface 1112 of the light supplement lamp board 111 to install the light supplement light board 111 on the first surface 231 of the boss 23. The additional screws can make the installation between the light supplement lamp plate 111 and the boss 23 more stable, and prevent the light supplement lamp 11 from falling off from the housing 20.
请参阅图4,主板200安装在壳体20内并与补光灯板111电连接。主板200可以为补光灯11提供电信号以使得补光灯11能够向外界发射光线。主板200包括相背的第一面201与第二面202。其中,主板200的第一面201与底壁22的第一面221相对。Please refer to FIG. 4, the main board 200 is installed in the housing 20 and is electrically connected to the light supplementary lamp board 111. The main board 200 may provide electrical signals for the supplementary light 11 so that the supplementary light 11 can emit light to the outside. The main board 200 includes a first surface 201 and a second surface 202 opposite to each other. The first surface 201 of the main board 200 is opposite to the first surface 221 of the bottom wall 22.
请继续参阅图4,电连接件203设置在主板200的第一面201上,在一个例子中,电连接件203可以焊接在主板200的第一面201上。电连接件203与补光灯板111的第二面1112电性连接。如此,补光灯板111通过电连接件203实现与主板200的电性连接。电连接件203可以为弹性的电连接件203,例如,电连接件203可以为弹簧顶针(pogo pin)或金属弹片等。可以理解,如果采用柔性电路板来电连接主板200和补光灯板111,则在将补 光灯结构100与主板200安装在一起时,容易导致柔性电路板的损坏。而弹性的电连接件203具有可以伸缩的特性,使用弹性的电连接件203来电连接主板200和补光灯板111可以避免安装时电连接件203的损坏问题。Please continue to refer to FIG. 4, the electrical connector 203 is disposed on the first side 201 of the main board 200. In an example, the electrical connector 203 can be welded on the first side 201 of the main board 200. The electrical connector 203 is electrically connected to the second surface 1112 of the supplemental light board 111. In this way, the supplemental light board 111 is electrically connected to the main board 200 through the electrical connector 203. The electrical connector 203 may be an elastic electrical connector 203, for example, the electrical connector 203 may be a pogo pin or a metal spring sheet or the like. It can be understood that if a flexible circuit board is used to electrically connect the main board 200 and the supplemental light board 111, when the supplementary light structure 100 and the main board 200 are installed together, the flexible circuit board is likely to be damaged. The elastic electrical connector 203 has the feature of being stretchable, and the use of the elastic electrical connector 203 to electrically connect the main board 200 and the fill light board 111 can avoid the problem of damage to the electrical connector 203 during installation.
请参阅图2、图5及图8,拍摄装置300安装在结合孔25内。拍摄装置300与主板200电连接。拍摄装置300可以用于接收外界光线以成像,补光灯11可以在低亮环境下为拍摄装置300进行补光。拍摄装置300可以是可见光相机、红外相机等,在此不作限制。拍摄装置300的数量可以为一个或多个,拍摄装置300的数量与结合孔25的数量相同。在一个例子中,拍摄装置300的数量为两个,两个拍摄装置300组成双目立体视觉系统以进行深度信息的测量。可以理解,如果将补光灯组件10安装在主板200上,补光灯组件10工作时产生的热量会传递到主板200上,导致主板200的温度升高。而拍摄装置300又是与主板200连接的,主板200的热量也会传递到拍摄装置300中,导致拍摄装置300的温度也升高。拍摄装置300的温度身高将严重影响拍摄装置300的工作性能。本申请实施方式的拍摄设备400将补光灯组件10安装在壳体20上,由壳体20辅助补光灯组件10的散热,补光灯组件10产生的热量不会传递到主板200上,也就不会对拍摄装置300产生影响。Please refer to FIG. 2, FIG. 5 and FIG. 8, the imaging device 300 is installed in the coupling hole 25. The imaging device 300 is electrically connected to the main board 200. The photographing device 300 may be used to receive external light for imaging, and the fill light 11 may supplement light for the photographing device 300 in a low-bright environment. The photographing device 300 may be a visible light camera, an infrared camera, etc., which is not limited here. The number of the photographing device 300 may be one or more, and the number of the photographing device 300 is the same as the number of the coupling holes 25. In an example, the number of the photographing devices 300 is two, and the two photographing devices 300 form a binocular stereo vision system to measure depth information. It can be understood that if the fill light assembly 10 is installed on the main board 200, the heat generated during the operation of the fill light assembly 10 will be transferred to the main board 200, causing the temperature of the main board 200 to increase. The imaging device 300 is connected to the main board 200, and the heat of the main board 200 is also transferred to the imaging device 300, causing the temperature of the imaging device 300 to also increase. The temperature and height of the photographing device 300 will seriously affect the working performance of the photographing device 300. The photographing device 400 of the embodiment of the present application mounts the fill light assembly 10 on the housing 20, and the housing 20 assists the heat dissipation of the fill light assembly 10, and the heat generated by the fill light assembly 10 will not be transferred to the main board 200. Therefore, the photographing device 300 will not be affected.
综上,本申请实施方式的拍摄设备400中,补光灯组件10直接安装在壳体20上,此种安装方式下补光灯组件10与壳体20上开设的安装孔21之间的同心度较高。并且,补光灯组件10工作时产生的热量会通过壳体20发散到外界,而不会传递到主板200上导致主板200温度上升,避免了对主板200的工作性能的影响。此外,补光灯组件10的热量不通过主板200进行散发时,主板200的靠近补光灯组件10的位置不需要再设置导热件,避免了主板200的空间浪费的问题。另外,补光灯组件10由壳体20辅助散热,补光灯组件10产生的热量不会传递到主板200上,不会对拍摄装置300产生影响。In summary, in the photographing device 400 of the embodiment of the present application, the fill light assembly 10 is directly mounted on the housing 20. In this installation mode, the fill light assembly 10 is concentric with the mounting holes 21 opened on the housing 20. Degree is higher. In addition, the heat generated during the operation of the supplementary light assembly 10 will be dissipated to the outside through the housing 20, and will not be transferred to the main board 200 to cause the temperature of the main board 200 to rise, thereby avoiding the influence on the working performance of the main board 200. In addition, when the heat of the supplementary light assembly 10 is not dissipated through the main board 200, the main board 200 does not need to be provided with a heat conducting element at a position close to the supplementary light assembly 10, thereby avoiding the problem of wasting space on the motherboard 200. In addition, the fill light assembly 10 is assisted by the housing 20 to dissipate heat, and the heat generated by the fill light assembly 10 will not be transferred to the main board 200 and will not affect the imaging device 300.
请参阅图2和图7,在某些实施方式中,凸台23的第一面231也可以为平面。此时,补光灯板111可以仅包括呈弧面的第一侧面1113。第一侧面1113与凸台23的第一面231抵触。将凸台23的第一面231设置为平面可以简化补光灯结构100的制造工艺。Please refer to FIG. 2 and FIG. 7. In some embodiments, the first surface 231 of the boss 23 may also be a flat surface. At this time, the supplementary light board 111 may only include the first side surface 1113 that is arcuate. The first side surface 1113 conflicts with the first surface 231 of the boss 23. Setting the first surface 231 of the boss 23 to be a plane can simplify the manufacturing process of the fill light structure 100.
在某些实施方式中,图6所示的第一结合件24可以为螺纹孔,图6所示的第二结合件13也可以为螺纹孔。补光灯结构100(图2所示)还可以包括螺钉。螺钉穿过第二结合件13并螺合进第一结合件24内,以将补光灯板111(图6所示)安装在凸台23(图6所示)的第一面231(图6所示)上。将第一结合件24和第二结合件13均设置成螺纹孔,螺钉与两个螺纹孔均结合,可以保障补光灯板111与凸台23之间的稳固连接。In some embodiments, the first coupling member 24 shown in FIG. 6 may be a threaded hole, and the second coupling member 13 shown in FIG. 6 may also be a threaded hole. The fill light structure 100 (shown in FIG. 2) may also include screws. The screw passes through the second coupling member 13 and is screwed into the first coupling member 24 to install the fill light plate 111 (shown in Figure 6) on the first surface 231 (Figure 6) of the boss 23 (shown in Figure 6). 6 shown) on. Both the first coupling member 24 and the second coupling member 13 are arranged as threaded holes, and the screws are combined with the two threaded holes, which can ensure a stable connection between the light supplement lamp plate 111 and the boss 23.
在某些实施方式中,图6所示的第一结合件24可以为卡合孔,图6所示的第二结合件13可以为卡合柱。卡合柱卡合进卡合孔内,以将补光灯板111(图6所示)安装在凸台23(图6所示)的第一面231(图6所示)。或者,第一结合件24也可以为卡合柱,第二结 合件13可以为卡合孔,卡合柱卡合进卡合孔内,以将补光灯板111安装在凸台23的第一面。通过卡合的方式将补光灯板111设置在凸台23上,可以保障补光灯板111与凸台23之间的稳固连接。In some embodiments, the first coupling member 24 shown in FIG. 6 may be a clamping hole, and the second coupling member 13 shown in FIG. 6 may be a clamping post. The engaging column is engaged into the engaging hole to install the light supplement lamp board 111 (shown in FIG. 6) on the first surface 231 (shown in FIG. 6) of the boss 23 (shown in FIG. 6). Alternatively, the first coupling member 24 may also be a clamping post, and the second coupling member 13 may be a clamping hole, and the clamping post is clamped into the clamping hole, so that the supplementary light plate 111 is installed on the first part of the boss 23. one side. By arranging the light supplement lamp board 111 on the boss 23 in a snap-fit manner, a stable connection between the light supplement light board 111 and the boss 23 can be ensured.
请参阅图1及图2,本申请实施方式还提供一种可移动平台1000,可移动平台1000包括可移动平台本体500及上述任一实施方式所述的拍摄设备400。拍摄设备400安装在可移动平台本体500上。可移动平台本体500可以是无人机、无人船、无人车等,在此不作限制。1 and FIG. 2, an embodiment of the present application further provides a movable platform 1000, the movable platform 1000 includes a movable platform body 500 and the photographing device 400 described in any of the above embodiments. The photographing device 400 is installed on the movable platform body 500. The movable platform body 500 may be an unmanned aerial vehicle, an unmanned ship, an unmanned vehicle, etc., which is not limited here.
本申请实施方式的可移动平台1000中,补光灯组件10直接安装在壳体20上,此种安装方式下补光灯组件10与壳体20上开设的安装孔21之间的同心度较高。并且,补光灯组件10工作时产生的热量会通过壳体20发散到外界,而不会传递到主板200上导致主板200温度上升,避免了对主板200的工作性能的影响。此外,补光灯组件10的热量不通过主板200进行散发时,主板200的靠近补光灯组件10的位置不需要再设置导热件,避免了主板200空间浪费的问题。In the movable platform 1000 of the embodiment of the present application, the fill light assembly 10 is directly mounted on the housing 20. In this installation mode, the concentricity between the fill light assembly 10 and the mounting hole 21 opened on the housing 20 is relatively high. high. In addition, the heat generated during the operation of the supplementary light assembly 10 will be dissipated to the outside through the housing 20, and will not be transferred to the main board 200 to cause the temperature of the main board 200 to rise, thereby avoiding the influence on the working performance of the main board 200. In addition, when the heat of the supplementary light assembly 10 is not dissipated through the main board 200, the main board 200 does not need to be provided with a heat conducting member at a position close to the supplementary light assembly 10, thereby avoiding the problem of wasting space on the motherboard 200.
在某些实施方式中,可移动平台1000还包括无线接收组件(ADS-B)及GPS电路板。其中,无线接收组件的数量可以为一个或多个。无线接收组件也可以通过弹性的电连接件203(图4所示)与GPS电路板电连接。每个无线接收组件可以通过一个或多个弹性的电连接件203与GPS电路板电连接。与使用柔性电路板连接无线接收组件和GPS电路板相比,使用弹性的电连接件203电连接无线接收组件和GPS电路板,可以提升组装良率,保证无线接收组件和GPS电路板之间的稳定通信,同时还可以降低成本。In some embodiments, the mobile platform 1000 further includes a wireless receiving component (ADS-B) and a GPS circuit board. Wherein, the number of wireless receiving components may be one or more. The wireless receiving component can also be electrically connected to the GPS circuit board through a flexible electrical connector 203 (shown in FIG. 4). Each wireless receiving component can be electrically connected to the GPS circuit board through one or more elastic electrical connectors 203. Compared with using a flexible circuit board to connect the wireless receiving component and the GPS circuit board, using the flexible electrical connector 203 to electrically connect the wireless receiving component and the GPS circuit board can improve the assembly yield and ensure the connection between the wireless receiving component and the GPS circuit board. Stable communication, while also reducing costs.
在本说明书的描述中,参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, reference to the description of the terms "certain embodiments", "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. means to incorporate the implementation The specific features, structures, materials or characteristics described by the examples or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples and the features of the different embodiments or examples described in this specification without contradicting each other.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个,除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of" means at least two, for example two, three, unless otherwise specifically defined.
尽管上面已经示出和描述了本申请的实施例,可以理解的是,上述实施例是示例性的, 不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can comment on the foregoing within the scope of the present application. The embodiments are subject to changes, modifications, substitutions and modifications, and the scope of this application is defined by the claims and their equivalents.

Claims (20)

  1. 一种补光灯结构,其特征在于,包括:A light supplement lamp structure, which is characterized in that it comprises:
    壳体,所述壳体开设有贯穿的安装孔;及A housing, the housing is provided with a through mounting hole; and
    补光灯组件,所述补光灯组件包括补光灯及透光的灯罩,所述补光灯包括补光灯板及设置在所述补光灯板上的发光芯片,所述补光灯板安装在所述壳体上并使所述发光芯片伸入所述安装孔,所述灯罩安装在所述安装孔内,所述发光芯片与所述灯罩分别位于所述安装孔的相对两端。A light-filling lamp assembly, the light-filling lamp assembly includes a light-filling lamp and a light-transmissive lampshade, the light-filling lamp includes a light-filling lamp board and a light-emitting chip arranged on the light-filling board, the light-filling lamp The board is installed on the housing so that the light-emitting chip extends into the mounting hole, the lamp shade is installed in the mounting hole, and the light-emitting chip and the lamp shade are respectively located at opposite ends of the mounting hole .
  2. 根据权利要求1所述的补光灯结构,其特征在于,所述补光灯板通过螺钉连接、卡合、胶合、焊接方式中的至少一种安装在所述壳体上。The light supplement lamp structure according to claim 1, wherein the light supplement lamp board is installed on the housing by at least one of screw connection, clamping, gluing, and welding.
  3. 根据权利要求1所述的补光灯结构,其特征在于,所述壳体包括:The light supplement lamp structure according to claim 1, wherein the housing comprises:
    底壁,所述底壁包括相背的第一面及第二面;及A bottom wall, the bottom wall including a first surface and a second surface opposite to each other; and
    自所述底壁的第一面延伸的凸台,所述安装孔贯穿所述凸台及所述底壁,所述补光灯板安装在所述凸台的第一面,所述凸台的第一面远离所述底壁的第一面。A boss extending from the first surface of the bottom wall, the mounting hole penetrates the boss and the bottom wall, the light supplement lamp board is installed on the first surface of the boss, the boss The first surface of is away from the first surface of the bottom wall.
  4. 根据权利要求3所述的补光灯结构,其特征在于,所述补光灯板包括相背的第一面及第二面,所述发光芯片设置在所述补光灯板的第一面;所述凸台的第一面朝所述底壁的第二面凹陷形成所述安装孔;所述补光灯板的第一面与所述凸台的第一面相接;所述凸台的第一面上设置有围绕所述安装孔的第一结合件,所述补光灯板的第一面设置有围绕所述发光芯片的第二结合件,所述第一结合件与所述第二结合件配合。The light-filling lamp structure according to claim 3, wherein the light-filling lamp board includes a first surface and a second surface opposite to each other, and the light-emitting chip is disposed on the first surface of the light-filling lamp board. The first surface of the boss is recessed toward the second surface of the bottom wall to form the mounting hole; the first surface of the light supplement lamp board is in contact with the first surface of the boss; the convex The first surface of the table is provided with a first coupling member surrounding the mounting hole, and the first surface of the supplementary light board is provided with a second coupling member surrounding the light-emitting chip. The second coupling member cooperates.
  5. 根据权利要求4所述的补光灯结构,其特征在于,所述补光灯板的第一面的与所述凸台的第一面的相接的部分设置有铜层,所述凸台的第一面的与所述补光灯板的第一面相接的部分经过镭雕去氧化层处理。The light supplement lamp structure according to claim 4, wherein a portion of the first surface of the light supplement lamp plate that is in contact with the first surface of the boss is provided with a copper layer, and the boss The part of the first surface of the light-filling lamp board that is connected to the first surface is processed by laser carving to remove the oxide layer.
  6. 根据权利要求4所述的补光灯结构,其特征在于,所述第一结合件的数量为多个,多个所述第一结合件环绕所述安装孔的中心均匀分布。The light supplement lamp structure according to claim 4, wherein the number of the first coupling member is multiple, and the plurality of first coupling members are evenly distributed around the center of the mounting hole.
  7. 根据权利要求4所述的补光灯结构,其特征在于,所述第一结合件为螺纹孔,所述第二结合件为螺纹孔,所述补光灯结构还包括螺钉,所述螺钉穿过所述第二结合件并螺合进所述第一结合件内,以将所述补光灯板安装在所述凸台的第一面。The light supplement lamp structure according to claim 4, wherein the first coupling member is a threaded hole, the second coupling member is a threaded hole, the supplement light structure further comprises a screw, and the screw penetrates Pass the second coupling member and screw into the first coupling member to install the light supplement lamp board on the first surface of the boss.
  8. 根据权利要求4所述的补光灯结构,其特征在于,所述第一结合件为卡合孔,所述第二结合件为卡合柱,所述卡合柱卡合进所述卡合孔内,以将所述补光灯板安装在所述凸台的第一面;或The light supplement lamp structure according to claim 4, wherein the first coupling member is an engaging hole, the second coupling member is an engaging post, and the engaging post is engaged into the engaging In the hole to install the light supplement lamp board on the first surface of the boss; or
    所述第一结合件为卡合柱,所述第二结合件为卡合孔,所述卡合柱卡合进所述卡合孔内,以将所述补光灯板安装在所述凸台的第一面。The first coupling member is an engaging post, the second coupling member is an engaging hole, and the engaging post is engaged into the engaging hole to install the supplementary light board on the convex The first side of the table.
  9. 根据权利要求4所述的补光灯结构,其特征在于,所述第一结合件为开设有螺纹孔的突柱,所述第二结合件为通孔,所述突柱穿设在所述通孔内。The light supplement lamp structure according to claim 4, wherein the first coupling member is a protruding post with threaded holes, the second coupling member is a through hole, and the protruding post penetrates through the Inside the through hole.
  10. 根据权利要求9所述的补光灯结构,其特征在于,所述补光灯结构还包括螺钉,所述螺钉穿设所述螺纹孔并压住所述补光灯板的第二面,以将所述补光灯板安装在所述凸台的第一面。The light-filling lamp structure according to claim 9, wherein the light-filling lamp structure further comprises a screw, and the screw penetrates the threaded hole and presses the second surface of the light-filling lamp board to The supplementary light board is installed on the first surface of the boss.
  11. 根据权利要求4所述的补光灯结构,其特征在于,所述凸台的第一面为平面。The light supplement lamp structure according to claim 4, wherein the first surface of the boss is a flat surface.
  12. 根据权利要求4所述的补光灯结构,其特征在于,所述凸台的第一面为阶梯面,所述阶梯面包括第一子面、第二子面、及连接所述第一子面与所述第二子面的连接面;The light fill lamp structure according to claim 4, wherein the first surface of the boss is a stepped surface, and the stepped surface includes a first sub-surface, a second sub-surface, and a first sub-surface connected to the first sub-surface. The connecting surface of the surface and the second sub-surface;
    所述补光灯板包括第一侧面及第二侧面,所述第一侧面为弧面,所述第二侧面连接所述第一侧面的两端,所述第二侧面为平面,所述第一子面与所述补光灯板的第一面抵触,所述第二侧面与所述连接面抵触。The supplemental light board includes a first side surface and a second side surface, the first side surface is an arc surface, the second side surface is connected to both ends of the first side surface, the second side surface is a flat surface, and the first side surface is a curved surface. A sub-surface conflicts with the first surface of the light supplement lamp board, and the second side surface conflicts with the connecting surface.
  13. 根据权利要求4所述的补光灯结构,其特征在于,所述安装孔包括连通的第一子腔及第二子腔,所述发光芯片收容在所述第一子腔并部分伸入所述第二子腔,所述灯罩收容在所述第二子腔内。The light-filling lamp structure according to claim 4, wherein the mounting hole includes a first sub-cavity and a second sub-cavity that are connected, and the light-emitting chip is contained in the first sub-cavity and partially extends into the first sub-cavity. In the second sub-cavity, the lampshade is accommodated in the second sub-cavity.
  14. 根据权利要求13所述的补光灯结构,其特征在于,自所述底壁的第一面至所述底壁的第二面的方向上,所述第二子腔的开口呈外扩状。The fill light structure according to claim 13, wherein the opening of the second subcavity is in an outwardly expanding shape from the first surface of the bottom wall to the second surface of the bottom wall .
  15. 根据权利要求13所述的补光灯结构,其特征在于,所述壳体由镁合金制成。The light supplement lamp structure according to claim 13, wherein the housing is made of magnesium alloy.
  16. 一种拍摄设备,其特征在于,包括:A photographing equipment, characterized in that it comprises:
    主板;及Main board; and
    权利要求1-15任意一项所述的补光灯结构,所述主板安装在所述壳体内并与所述补光灯板电连接。The light supplement lamp structure according to any one of claims 1-15, wherein the main board is installed in the housing and is electrically connected to the light supplement lamp board.
  17. 根据权利要求16所述的拍摄设备,其特征在于,所述主板包括相背的第一面及第二面,所述主板的第一面与所述底壁的第一面相对;所述主板的第一面设置弹性的电连接件,所述电连接件与所述补光灯板的第二面电性连接。The photographing device according to claim 16, wherein the main board includes a first surface and a second surface opposite to each other, and the first surface of the main board is opposite to the first surface of the bottom wall; the main board An elastic electrical connection piece is provided on the first surface of the light-filling lamp board, and the electrical connection piece is electrically connected to the second surface of the light supplement lamp board.
  18. 根据权利要求17所述的拍摄设备,其特征在于,所述电连接件包括弹簧顶针(pogo pin)或金属弹片。The photographing device according to claim 17, wherein the electrical connection member comprises a pogo pin or a metal shrapnel.
  19. 根据权利要求16所述的拍摄设备,其特征在于,所述壳体还开设有贯穿的结合孔,所述结合孔与所述安装孔间隔,所述拍摄设备还包括:The photographing device according to claim 16, wherein the housing is further provided with a through-hole combining hole, and the combining hole is spaced from the mounting hole, and the photographing device further comprises:
    拍摄装置,所述拍摄装置安装在所述结合孔内,所述拍摄装置与所述主板电连接,所述拍摄装置用于接收外界光线以成像。A photographing device, the photographing device is installed in the coupling hole, the photographing device is electrically connected to the main board, and the photographing device is used for receiving external light for imaging.
  20. 一种可移动平台,其特征在于,包括:A movable platform, characterized in that it comprises:
    可移动平台本体;及The movable platform body; and
    权利要求16至19任意一项所述的拍摄设备,所述拍摄设备安装在所述可移动平台本体上。The photographing device according to any one of claims 16 to 19, which is mounted on the movable platform body.
PCT/CN2020/087313 2020-04-27 2020-04-27 Fill light structure, photography apparatus, and movable platform WO2021217365A1 (en)

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CN115297235A (en) * 2022-07-21 2022-11-04 杭州海康威视数字技术股份有限公司 Image acquisition apparatus and control method of image acquisition apparatus
CN115297235B (en) * 2022-07-21 2023-09-01 杭州海康威视数字技术股份有限公司 Image acquisition apparatus and control method of image acquisition apparatus

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