CN217820872U - Light emitting module, camera module and electronic equipment - Google Patents

Abstract

The utility model relates to a light emission module, module and electronic equipment make a video recording. The light emitting module includes: the radiating device comprises a substrate, a laser, an emission circuit board and a radiating support, wherein the substrate is provided with a first surface and a second surface which are opposite, the laser is arranged on the first surface and is electrically connected with the substrate, the emission circuit board and the laser are arranged at intervals, and the radiating support is connected with the second surface. Through the second face of base plate and the mode of heat dissipation leg joint, the heat that the laser instrument produced can directly transmit to the heat dissipation support through the base plate to can conduct away the produced heat of laser instrument fast effectively, and then can improve optical transmission module's radiating effect.

Description

Light emitting module, camera module and electronic equipment

Technical Field

The utility model relates to a technical field that makes a video recording especially relates to a light emission module, module and electronic equipment make a video recording.

Background

The 3D imaging is more and more emphasized by people, and the current technical scheme capable Of providing 3D imaging mainly includes binocular, structured light and Time Of Flight (TOF for short) to perform distance measurement and obtain three-dimensional information. The TOF technology utilizes the flight time of light to measure distance through the camera module, the camera module generally comprises a light emitting module and a light receiving module, the light emitting module emits measuring light to a target object, and the measuring light is reflected back to the light receiving module through the target object, so that the space distance of the target object can be obtained according to the propagation time of the measuring light in the propagation path.

In traditional TOF technique, the produced heat of laser instrument among the optical transmission module utilizes the copper foil of transmission circuit board to dispel the heat usually, but along with the development trend of making a video recording module group frivolous design, the heat dissipation requirement to optical transmission module is more and more high, and traditional radiating method effect is poor, does not reach the heat dissipation requirement, and then the heat is too high easily leads to the laser instrument to be burnt out, leads to making a video recording module group's life weak point.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model discloses optical transmission module, module and electronic equipment make a video recording can conduct away the produced heat of optical transmission module's laser instrument fast effectively, improves optical transmission module's radiating effect.

In order to achieve the above object, in a first aspect, the present invention discloses a light emitting module, including:

a substrate having opposing first and second faces;

the laser is arranged on the first surface and is electrically connected with the substrate;

the transmitting circuit board is arranged on the first surface and is arranged at intervals with the laser 11, and the transmitting circuit board is electrically connected with the substrate; and

and the heat dissipation bracket is connected with the second surface.

Through the structure design, set up laser instrument and transmission circuit board in the first face of base plate, and with the second face and the heat dissipation leg joint of base plate, make the heat that the laser instrument produced dispel the heat through the heat dissipation support, for directly pasting the scheme on the transmission circuit board with the base plate, because transmission circuit board radiating effect itself is very poor, the heat that leads to the laser instrument to produce is difficult to play directly with the quick conduction effect of heat, and this scheme directly pastes the base plate on the heat dissipation support, make the heat that the laser instrument produced can directly transmit to the heat dissipation support through the base plate, thereby can conduct away the produced heat of laser instrument fast effectively, and then can improve optical emission module's radiating effect. In addition, it can be known that, in the light emitting module in the related art, the transmitting circuit board is usually disposed between the substrate and the heat dissipation bracket, and the thickness of the light emitting module includes the thickness of the laser, the thickness of the substrate, the thickness of the transmitting circuit board, and the thickness of the heat dissipation bracket.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the material of the heat dissipation bracket is metal or ceramic, and it is understood that the metal may be one or more of copper, aluminum, gold, or silver; the ceramic may be one or more of alumina, aluminum nitride, silicon nitride. Compared with a heat dissipation support made of polymer, the heat dissipation support made of metal or ceramic has better heat conductivity, heat conducted from the substrate is conducted to the outside at a higher speed, and therefore the temperature of the working environment of the laser is reduced, and the heat dissipation requirement of the light emitting module is met.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the heat dissipation bracket faces a side of the second face and is provided with a containing groove, the containing groove has a bottom surface and an inner side wall surface, the inner side wall surface is annularly provided at an outer periphery of the bottom surface, the substrate is located in the containing groove, the second face is connected to the bottom surface, the substrate has an outer peripheral surface surrounding the first face and the second face, and the inner side wall surface is abutted to the outer peripheral surface. By adopting the above embodiment, through setting up the containing groove on the heat dissipation support, and set up the base plate in the containing groove, on the one hand, the second face of base plate and the bottom surface butt of containing groove, so that the heat that the laser instrument produced can be conducted to the bottom surface of containing groove through the second face of base plate and dispel the heat, the inside wall face of containing groove wraps up in the outer peripheral face of base plate simultaneously, so that the heat that the laser instrument produced can also be conducted to the inside wall face of containing groove through the outer peripheral face of base plate and dispel the heat, thereby more be favorable to the base plate to spread the heat of laser instrument to the heat dissipation support fast, further improve the radiating effect of optical transmission module; on the other hand, the space occupied by the substrate is mainly the inner space of the heat dissipation support, so that the thickness of the light emitting module is mainly the thickness including the laser and the thickness of the heat dissipation support, the thickness of the substrate can be roughly cancelled, the overall thickness of the light emitting module can be reduced, and the light and thin design of the light emitting module is facilitated.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the light emitting module further includes a heat dissipation glue layer, and the heat dissipation glue layer is connected to the heat dissipation support and the second surface. On one hand, the heat dissipation adhesive layer has good bonding performance, so that the heat dissipation support and the substrate can be bonded by the heat dissipation adhesive layer to stabilize the position of the substrate on the heat dissipation support, and the connection stability between the substrate and the heat dissipation support can be improved; on the other hand, the heat dissipation glue layer also has good heat-conducting property, and can conduct heat from the substrate to the heat dissipation support quickly, so that the heat dissipation effect of the light emitting module is further improved.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the transmitting circuit board is an annular circuit board having a hollow portion, and the laser is located in the hollow portion of the transmitting circuit board. Compared with the mode that the transmitting circuit board is the U-shaped circuit board, the annular circuit board has larger space for designing welding spots, so that the setting positions of the welding spots on the transmitting circuit board are more flexible, the setting positions of the welding spots on the transmitting circuit board can be adjusted conveniently according to the welding spot positions of the base plate, the electric connection between the transmitting circuit board and the base plate is convenient to realize, the annular circuit board is not easy to deform due to the fact that the structural characteristics are not easily influenced by temperature in the welding process, the transmitting circuit board is beneficial to keeping flat, and the structural stability is high.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the light emitting module further includes a fixing component, and the fixing component is configured to fix the transmitting circuit board on the heat dissipating bracket. Because the base plate is fixed on the heat dissipation support, the position of the base plate on the heat dissipation support is relatively fixed, the transmitting circuit board is fixed on the heat dissipation support through the fixing component, the connection stability of the transmitting circuit board on the heat dissipation support can be improved, the positions of the transmitting circuit board and the base plate can be kept relatively fixed, dislocation of the transmitting circuit board and the base plate is avoided, the acting force born by electric connection between the transmitting circuit board and the base plate is relieved, the risk of electric connection disconnection is reduced, and the electric conduction reliability of the transmitting circuit board and the base plate is further ensured.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the first face is provided with a first welding portion, the first welding portion is electrically connected to the laser, the transmission circuit board is provided with a second welding portion, and the second welding portion is electrically connected to the first welding portion. The laser and the transmitting circuit board can be ensured to be well electrically connected in a welding connection mode, and meanwhile, the transmitting circuit board and the substrate are more stable in connection.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the light emitting module further includes a housing, the housing cover is disposed at an outer periphery of the laser, and the housing has a light passing hole, and the light passing hole corresponds to the laser setting. Through establishing the periphery at the laser instrument with the casing cover, perhaps can cover the periphery of establishing at laser instrument and other components and parts with the casing simultaneously for the casing can be used for protecting laser instrument and other components and parts not to receive external environment and destroy, and in addition, sets up the casing, will set up logical unthreaded hole, just so can set up the diffuser in leading to the unthreaded hole, thereby can utilize the diffuser to form the light that has certain light type distribution, density and degree of consistency with the light diffusion.

In a second aspect, the utility model discloses a camera module, camera module includes light receiving module, main circuit board and the first aspect light emission module, light receiving module with heat dissipation support interval set up in on the main circuit board, light receiving module with main circuit board electricity is connected, the transmission circuit board with main circuit board electricity is connected. The light receiving module and the light emitting module share the main circuit board, so that circuits do not need to be designed and connectors do not need to be arranged independently, the number of formed materials is reduced, the structure of the camera module is more compact, the process of the assembly process of the camera module is simplified, and the cost is lower. And have above-mentioned optical transmission module's the module of making a video recording, can be effectively with the produced heat rapid conduction of laser instrument in the optical transmission module, improve optical transmission module's radiating effect.

In a third aspect, the present invention discloses an electronic device, wherein the electronic device has the camera module according to the second aspect. The electronic equipment with the camera module can effectively conduct heat generated by a laser in the light emitting module quickly and improve the heat dissipation effect of the light emitting module.

Compared with the prior art, the beneficial effects of the utility model reside in that:

through the structure design, the embodiment of the utility model provides an among the optical transmission module, set up laser instrument and transmission circuit board in the first face of base plate, and with the second face and the heat dissipation leg joint of base plate, make the heat that the laser instrument produced dispel the heat through the heat dissipation support, for directly pasting the scheme on the transmission circuit board with the base plate, because the radiating effect of transmission circuit board itself is very poor, the heat that leads to the laser instrument to produce is difficult to play directly with the quick conduction effect of heat, and this scheme directly pastes the base plate on the heat dissipation support, make the heat that the laser instrument produced can directly transmit to the heat dissipation support through the base plate, thereby can conduct away the produced heat of laser instrument fast effectively, and then can improve optical transmission module's radiating effect. In addition, the transmitting circuit board is attached to the first surface of the substrate, the thickness of the laser can cover the thickness of the transmitting circuit board, and the thickness of the light emitting module comprises the thickness of the laser, the thickness of the substrate and the thickness of the heat dissipation support at the moment, so that the thickness of the transmitting circuit board can be eliminated, the thickness of the light emitting module can be reduced, and the light and thin design of the light emitting module is realized.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a light emitting module according to an embodiment of the present invention;

FIG. 2 is an exploded view of the optical transmitter module shown in FIG. 1;

FIG. 3 is a cross-sectional view of the optical transmit module of FIG. 1 taken along line I-I;

fig. 4 is a schematic diagram of a tiled structure of a transmitting circuit board disclosed in an embodiment of the present invention;

fig. 5 is a schematic view of another tiled structure of the transmitting circuit board disclosed in the embodiment of the present invention;

fig. 6 is a schematic view of a camera module disclosed in the embodiment of the present invention;

fig. 7 is a schematic view of an electronic device according to an embodiment of the present invention.

Icon: 1. a light emitting module; 10. a substrate; 101. a first side; 101a, a first weld; 102. a second face; 103. an outer peripheral surface; 11. a laser; 12. a transmitting circuit board; 121. a second weld; 122. a first portion; 123. a second portion; 124. a third portion; 13. a heat dissipation bracket; 131. a containing groove; 131a and an inner side wall surface; 131b, a bottom surface; 132. an accommodating space; 14. a heat dissipation adhesive layer; 15. a fixing member; 16. a housing; 161. a light through hole; 162. a diffuser; 2. a light receiving module; 3. a main circuit board; 1000. a camera module; 2000. an electronic device.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.

Referring to fig. 1 to 3, the present invention provides an optical transmit module 1, where the optical transmit module 1 includes a substrate 10, a laser 11, a transmitting circuit board 12 and a heat dissipating bracket 13, the substrate 10 has a first surface 101 and a second surface 102 opposite to each other, the laser 11 is disposed on the first surface 101 and electrically connected to the substrate 10, the transmitting circuit board 12 is disposed on the first surface 101 and spaced apart from the laser 11, the transmitting circuit board 12 is electrically connected to the substrate 10 to electrically connect the laser 11 and the transmitting circuit board 12, and the heat dissipating bracket 13 is connected to the second surface 102.

Through the above structural design, set up laser instrument 11 and transmission circuit board 12 at the first face 101 of base plate 10, and connect the second face 102 and the heat dissipation support 13 of base plate 10, make the heat that laser instrument 11 produced can dispel the heat through heat dissipation support 13, for the scheme of directly pasting base plate 10 on transmission circuit board 12, because transmission circuit board 12 itself radiating effect is very poor, the heat that leads to laser instrument 11 to produce is difficult to play directly with the heat quick conduction effect, and this scheme directly pastes base plate 10 on heat dissipation support 13, make the heat that laser instrument 11 produced can directly transmit to heat dissipation support 13 through base plate 10, thereby can effectively conduct away the heat that laser instrument 11 produced fast, and then can improve the radiating effect of optical transmission module 1. In addition, it can be known that, in the optical transmitter module 1 in the related art, the transmitting circuit board 12 is usually disposed between the substrate 10 and the heat dissipating bracket 13, and the thickness of the optical transmitter module 1 includes the thickness of the laser 11, the thickness of the substrate 10, the thickness of the transmitting circuit board 12 and the thickness of the heat dissipating bracket 13, while the transmitting circuit board 12 of the present embodiment is attached to the first surface 101 of the substrate 10, the thickness of the laser 11 can cover the thickness of the transmitting circuit board 12, and at this time, the thickness of the optical transmitter module 1 includes the thickness of the laser 11, the thickness of the substrate 10 and the thickness of the heat dissipating bracket 13, and the thickness of the transmitting circuit board 12 can be eliminated, so that the thickness of the optical transmitter module 1 can be reduced, and the light and thin design of the optical transmitter module 1 can be realized.

In some embodiments, the heat dissipation bracket 13 may be made of metal, ceramic, or the like, and it is understood that the metal may be one or more of copper, aluminum, gold, or silver; the ceramic may be one or more of alumina, aluminum nitride, silicon nitride. Compared with the heat dissipation bracket 13 made of polymer, the heat dissipation bracket 13 made of metal or ceramic has better heat conductivity, which is beneficial to conducting heat conducted by the substrate 10 to the outside at a higher speed, and further beneficial to reducing the temperature of the working environment of the laser 11 so as to meet the heat dissipation requirement of the light emitting module 1.

In some embodiments, the substrate 10 may be a ceramic substrate, and the material of the ceramic substrate may be one or more of aluminum oxide, aluminum nitride, and silicon nitride. The ceramic substrate has good thermal conductivity and excellent solderability, high adhesion strength and current carrying capacity, so that a circuit is formed on the first surface 101 of the substrate 10 by a Direct Copper plating (DPC) process for mounting the laser 11 and other components.

In some embodiments, the transmitting circuit board 12 may include a first portion 122, a second portion 123 and a third portion 124, the first portion 122 is disposed on the first surface 101 of the substrate 10, one end of the second portion 123 is electrically connected to the first portion 122, and the other end is bent to be electrically connected to the third portion 124. Specifically, the first portion 122 and the third portion 124 may be a flexible circuit board, a rigid-flexible board, or a rigid-flexible board, and the second portion 123 may be a flexible circuit board, a rigid-flexible board, or a rigid-flexible board, as needed to be bent.

Further, when the first portion 122, the second portion 123 and the third portion 124 are all flexible circuit boards or rigid-flex boards, the first portion, the second portion and the third portion may be integrally disposed, and then when assembling, the heat dissipation bracket 13 may be placed on the third portion 124, and then the second portion 123 is bent to dispose the first portion 122 on the first side 101 of the substrate 10; when the first portion 122, the second portion 123 and the third portion 124 are made of different materials, for example, if the first portion 122 is a rigid circuit board, the second portion 123 is a flexible circuit board and the third portion 124 is a rigid circuit board, the first portion 122 and the second portion 123 and the third portion 124 can be pressed or adhered to form a transmitting circuit board with reliable electrical connection among the first portion, the second portion and the third portion. In summary, it can be understood that, if the adjacent portions of the first portion 122, the second portion 123 and the third portion 124 are made of the same material, the first portion, the second portion and the third portion may be integrally disposed to simplify the process of the transmitting circuit board, and if the adjacent portions are made of different materials, the reliable electrical connection structure needs to be formed by pressing or gluing.

In some embodiments, an accommodating space 132 is disposed on a side of the heat dissipation bracket 13 away from the substrate 10, and the third portion 124 covers an opening of the accommodating space 132, so that part of components of the light emitting module 1 may be disposed on the third portion 124 and located in the accommodating space 132, so as to utilize the accommodating space 132 to accommodate components required by the light emitting module 1, thereby avoiding that all components of the light emitting module 1 are disposed on the first surface 101 of the substrate 10, and reducing the number of components required to be carried by the substrate 10, on one hand, the process difficulty of the substrate 10 may be reduced, that is, the circuit requirement required to be formed through the DPC process is less; on the other hand, the number of heat sources at the periphery of the laser 11 can be reduced, so that the heat dissipation burden of the heat dissipation support 13 can be reduced, the temperature of the working environment of the laser 11 can be reduced by utilizing the heat dissipation support 13, and the heat dissipation requirement of the light emitting module 1 is met.

In some embodiments, the laser 11 may be a vertical cavity surface laser, which has many advantages such as small size and low power consumption compared to a conventional diode laser, and is widely used in TOF technology to measure a distance by using a flight time of light.

In some embodiments, as shown in fig. 2 and 4, the first surface 101 of the substrate 10 is provided with a first soldering portion 101a, the first soldering portion 101a is electrically connected to the laser 11 through a wire formed by a DPC process, the transmitting circuit board 12 is provided with a second soldering portion 121, and the second soldering portion 121 is electrically connected to the first soldering portion 101a to electrically connect the transmitting circuit board 12 and the substrate 10. The connection mode through welding can ensure that the laser 11 and the transmitting circuit board 12 are connected stably while good electric connection is kept between the transmitting circuit board 12 and the substrate 10. The first bonding portion 101a may be a pad or a solder joint, and the second bonding portion 121 may also be a pad or a solder joint.

For example, the transmitting circuit board 12 may be a U-shaped circuit board having a hollow portion, two side walls of the U-shaped circuit board are provided with second soldering portions 121, and the first soldering portions 101a may be disposed on two opposite sides of the substrate 10, such that the second soldering portion 121 on one side wall of the U-shaped circuit board is electrically connected to the first soldering portion 101a on one side of the substrate 10, and the second soldering portion 121 on the other side wall of the U-shaped circuit board is electrically connected to the first soldering portion 101a on the other side of the substrate 10, so as to achieve electrical connection between the transmitting circuit board 12 and the substrate 10, and the laser 11 is located in the hollow portion of the transmitting circuit board 12.

As another example, as shown in fig. 2 and 5, the transmitting circuit board 12 may be a ring-shaped circuit board having a hollow portion, and the laser 11 is located in the hollow portion of the transmitting circuit board 12. Since the annular circuit board is equivalent to the U-shaped circuit board having one more connecting portion connected to the two side walls than the U-shaped circuit board, the transmitting circuit board 12 is an annular circuit board, and the two side walls can be provided with solder joints (i.e. the second soldering portion 121) and the connecting portions can also be provided with solder joints, so that the transmitting circuit board 12 is an annular circuit board, which not only has a larger space for designing the solder joints, so that the position of the solder joints on the transmitting circuit board 12 is more flexible, and the position of the solder joints on the transmitting circuit board 12 can be adjusted according to the position of the solder joints on the substrate 10, thereby facilitating the electrical connection between the transmitting circuit board 12 and the substrate 10, but also the annular circuit board is not easily deformed due to temperature influence in the soldering process, which is beneficial for the transmitting circuit board 12 to be kept flat and has high structural stability.

In some embodiments, as shown in fig. 2, the light emitting module further includes a fixing member 15, and the fixing member 15 is used to fix the emitting circuit board 12 to the heat dissipation bracket 13. Since the substrate 10 is fixed on the heat dissipation bracket 13, the position of the substrate 10 on the heat dissipation bracket 13 is relatively fixed, so that the transmitting circuit board 12 is fixed on the heat dissipation bracket 13 by the fixing component 15, the connection stability of the transmitting circuit board 12 on the heat dissipation bracket 13 can be improved, and the positions of the transmitting circuit board 12 and the substrate 10 can be kept relatively fixed, so as to relieve the acting force born by the electric connection between the transmitting circuit board 12 and the substrate 10, reduce the risk of the electric connection disconnection between the first welding part and the second welding part, and further ensure the electric conduction reliability between the transmitting circuit board and the substrate.

Further, the fixing part 15 may be one or more of thermosetting glue, ultraviolet glue, hot melt glue, and the like. It can be understood that the fixing member 15 has a strong adhesive force, which is beneficial to fixing the transmitting circuit board on the heat dissipating bracket more stably, and the shape and position of the fixing member 15 can be reasonably adjusted according to actual requirements. Exemplarily, the number of the fixing parts 15 in the present solution may be two, and the two fixing parts 15 are respectively disposed on two opposite sides of the transmitting circuit board, so that the transmitting circuit board is stressed in a balanced manner, which is more beneficial to improving the connection stability of the transmitting circuit board on the heat dissipation bracket, and further beneficial to keeping the positions of the transmitting circuit board and the substrate relatively fixed, avoiding the transmitting circuit board and the substrate from being dislocated, reducing the risk of electrical disconnection between the first welding part and the second welding part, and further ensuring the conductive reliability between the transmitting circuit board and the substrate.

Alternatively, the fixing member may have a long bar shape, so that the fixing member may cover the joint of the emission circuit board and the heat dissipation bracket 13 as much as possible, so that the fixing effect of the fixing member is better.

In some embodiments, as shown in fig. 2, a receiving groove 131 is disposed on a surface of the heat dissipation bracket 13 facing the second surface 102, the receiving groove 131 has a bottom surface 131b and an inner sidewall surface 131a, the inner sidewall surface 131a is annularly disposed on an outer periphery of the bottom surface 131b, the substrate 10 is located in the receiving groove 131, and the second surface 102 is connected to the bottom surface 131b, by adopting the above embodiments, a contact area between the heat dissipation bracket 13 and the substrate 10 includes not only the second surface 102 of the substrate 10, but also the outer peripheral surface 103 of the substrate 10, which is beneficial for the substrate 10 to quickly spread heat of the laser 11 to the heat dissipation bracket 13, and further improves the heat dissipation effect of the light emitting module 1.

In one embodiment, the substrate 10 further has an outer peripheral surface 103 connected to the first surface 101 and the second surface 102, and the inner sidewall surface 131a is spaced from the outer peripheral surface 103, so that heat of the laser 11 can be dissipated from the outer peripheral surface 103 and then dissipated to the inner sidewall surface of the accommodating groove through air in the gap between the outer peripheral surface and the inner sidewall surface, thereby further improving the heat dissipation effect of the optical transmission module 1.

In another embodiment, the substrate 10 further includes an outer peripheral surface 103 connected to the first surface 101 and the second surface 102, and the inner wall surface 131a abuts against the outer peripheral surface 103. Since the inner sidewall 131a abuts against the outer peripheral surface 103, the heat emitted from the outer peripheral surface 103 can be directly conducted to the inner sidewall of the accommodating groove to be diffused, so that the heat conduction speed is higher and the heat dissipation effect of the light emitting module 1 is better than that of the above embodiment.

In some embodiments, the light emitting module 1 further includes a heat dissipation adhesive layer 14, and the light emitting module 1 further includes the heat dissipation adhesive layer 14, where the heat dissipation adhesive layer 14 is connected to the heat dissipation support 13 and the second surface 102. On one hand, the heat dissipation adhesive layer 14 has good adhesion performance, so that the heat dissipation support 13 and the substrate 10 can be adhered by the heat dissipation adhesive layer 14 to stabilize the position of the substrate 10 on the heat dissipation support 13, and further, the connection stability between the substrate 10 and the heat dissipation support 13 can be improved; on the other hand, the heat dissipation glue layer 14 has good heat conduction performance, and can quickly conduct heat from the substrate 10 to the heat dissipation bracket 13, thereby being beneficial to further improving the heat dissipation effect of the light emitting module 1.

When the heat dissipating bracket 13 is provided with the receiving groove 131, the heat dissipating adhesive layer 14 may be connected to the bottom surface 131b of the receiving groove 131 and the second surface 102 of the substrate 10, which mainly considers that: the second surface 102 of the substrate 10 is generally larger than the outer peripheral surface 103 of the substrate 10, and the heat dissipation adhesive layer 14 is connected to the second surface 102 of the substrate 10 and the bottom surface 131b of the accommodating groove 131, instead of connecting the heat dissipation adhesive layer 14 only to the outer peripheral surface 103 of the substrate 10, which is beneficial to using a heat dissipation adhesive layer 14 with a larger area and improving the connection stability between the substrate 10 and the heat dissipation bracket 13.

Optionally, the bottom surface 131b of the accommodating groove 131 is provided with a groove, the groove is used for accommodating the heat dissipation adhesive layer 14, and compared with a mode that the bottom surface 131b of the accommodating groove 131 is not provided with a groove, the thickness of the heat dissipation adhesive layer 14 can be eliminated, the light and thin design of the light emitting module 1 is facilitated, the position and the amount of the heat dissipation adhesive layer 14 can be limited by the groove, and the risk that the appearance is bad due to overflow of the heat dissipation adhesive layer 14 is reduced.

The heat dissipation adhesive layer 14 may be a heat dissipation film or a heat dissipation silver paste, and it can be understood that the heat dissipation adhesive layer 14 has a good heat dissipation performance and a strong adhesive force. Illustratively, the heat dissipation adhesive layer 14 of the present embodiment is a heat dissipation silver paste, and the heat dissipation effect of the light emitting module 4 can be better improved by utilizing the characteristic of high thermal conductivity of silver element.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the optical transmission module 1 further includes a housing 16, the housing 16 is covered on the periphery of the laser 11, and the housing 16 has a light passing hole 161, and the light passing hole 161 is disposed corresponding to the laser 11. Through establishing the periphery at laser 11 with the casing 16 cover, perhaps can establish the periphery at laser 11 and other components and parts with casing 16 cover simultaneously for casing 16 can be used for protecting laser 11 and other components and parts and do not receive external environment to destroy, and, set up casing 16, will can set up logical unthreaded hole 161, just so can set up diffuser 162 in leading to unthreaded hole 161, thereby can utilize diffuser 162 to form the light that has certain light type distribution, density and degree of consistency with the light diffusion.

It can be understood that there is a gap between the housing 16 and the light emitting circuit board 12, and a sealant can be applied to fill the gap, so as to prevent moisture and dust in the environment from entering the light emitting module 1 to contaminate the laser 11, thereby improving the performance of the light emitting module 1.

Referring to fig. 6, the present invention discloses a camera module 1000, the camera module 1000 includes a light receiving module 2, a main circuit board 3 and the light emitting module 1, the light receiving module 2 and the heat dissipating support 13 are disposed on the main circuit board 3 at intervals, the light receiving module 2 is electrically connected to the main circuit board 3, and the light emitting circuit board 12 is electrically connected to the main circuit board 3. It can be understood that the main circuit board 3 includes the third portion 124, and since the light receiving module 2 and the light emitting module 1 share the main circuit board 3, there is no need to separately design circuits and set connectors, so that the number of constituent materials is reduced, the structure of the camera module 1000 is more compact, the process of the assembly process of the camera module 1000 is simplified, and the cost is lower.

In some embodiments, the main circuit board 3 may also be a flexible circuit board, a rigid-flex circuit board, or the like. Alternatively, the transmitting circuit board 12 may be integrally provided with the main circuit board 3, or may be separately provided. When the transmitting circuit board 12 and the main circuit board 3 are separately arranged, the transmitting circuit board 12 and the main circuit board 3 can form a reliable electrical connection structure by pressing or gluing.

Optionally, when the main circuit board 3 is a flexible circuit board or a rigid-flex board, a reinforcing plate may be disposed on a side of the main circuit board 3 away from the light receiving module 2, so as to improve the strength of the main circuit board 3.

In summary, the camera module 1000 having the light emitting module 1 can effectively and rapidly conduct heat generated by the laser 11 in the light emitting module 1, thereby improving the heat dissipation effect of the light emitting module 1.

Referring to fig. 6, the present invention further provides an electronic device 2000, wherein the electronic device 2000 has the camera module 1000 according to the foregoing embodiment. Specifically, the electronic device 2000 has the aforementioned camera module 1000. The electronic device 2000 may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a monitor, and the like. It can be understood that the electronic device 2000 having the camera module 1000 according to the foregoing embodiment also has all the technical effects of the light emitting module according to the foregoing embodiment, that is, the heat generated by the laser in the light emitting module can be effectively and quickly conducted, and the heat dissipation effect of the light emitting module is improved.

The above detailed descriptions are given to the light emitting module, the camera module and the electronic device disclosed in the embodiments of the present invention, and the specific examples are applied herein to explain the principles and embodiments of the present invention, and the descriptions of the above embodiments are only used to help understanding the light emitting module, the camera module and the electronic device and the core idea thereof, and are not limited to be applied to the TOF technology, but also applied to the structured light technology or other technologies with a transmitting end; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, and in summary, the content of the present specification should not be understood as the limitation of the present invention.

Claims (10)

1. An optical transmit module, comprising:

a substrate having opposing first and second faces;

the laser is arranged on the first surface and is electrically connected with the substrate;

the transmitting circuit board is arranged on the first surface and is arranged at intervals with the laser, and the transmitting circuit board is electrically connected with the substrate; and

and the heat dissipation bracket is connected with the second surface.

2. The optical transmit module of claim 1, wherein the heat sink support is made of metal or ceramic.

3. The optical transmit module of claim 1, wherein a side of the heat sink support facing the second side is provided with a receiving groove, the receiving groove has a bottom surface and an inner sidewall surface, the inner sidewall surface surrounds an outer periphery of the bottom surface, the substrate is located in the receiving groove, and the second side of the substrate is connected to the bottom surface.

4. The light emitting module of claim 1, further comprising a heat sink adhesive layer coupled to the heat sink bracket and the second face.

5. The optical transmit module of any of claims 1-4, wherein the transmit circuit board is a ring-shaped circuit board having a hollow portion, the laser being located in the hollow portion of the transmit circuit board.

6. The optical transmit module of any of claims 1-4, further comprising a securing member for securing the transmit circuit board to the heat sink bracket.

7. The optical transmit module of any of claims 1-4, wherein the first face is provided with a first solder portion, the first solder portion being electrically connected to the laser, and the transmit circuit board is provided with a second solder portion, the second solder portion being electrically connected to the first solder portion.

8. The optical transmit module of any of claims 1-4 further comprising a housing, wherein the housing covers the periphery of the laser, and the housing has a light hole, and the light hole is disposed corresponding to the laser.

9. A camera module, comprising a light receiving module, a main circuit board and the light emitting module of any one of claims 1 to 8, wherein the light receiving module and the heat dissipation bracket are disposed on the main circuit board at an interval, the light receiving module is electrically connected to the main circuit board, and the light emitting module is electrically connected to the main circuit board.

10. An electronic apparatus characterized by having the camera module according to claim 9.

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