CN219834478U - Micro LED electric connection structure - Google Patents

Abstract

The utility model discloses a miniature LED electric connection structure which comprises a substrate, miniature LED chips and a heat radiation plate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged, through holes penetrating through the first surface and the second surface are formed in the substrate, the heat radiation plate is arranged on the second surface, grooves communicated with the through holes are formed in the heat radiation plate, and the miniature LED chips are arranged in the grooves through the through holes. The miniature LED chip is installed in the groove through the through hole, so that the miniature LED chip is directly contacted with the radiating plate, the radiating effect of the miniature LED electric connection structure is improved, and the miniature LED chip is installed in the groove due to the fact that the radiating plate is provided with the groove, the height difference between the upper surface and the first surface of the miniature LED chip can be reduced, the stability of electric connection between the miniature LED chip and the plate body is improved, positioning of the miniature LED chip is facilitated, the operation is convenient, the routing strength is improved, and the integral installation stability is improved.

Description

Micro LED electric connection structure

Technical Field

The utility model relates to the technical field of circuit connection, in particular to a miniature LED electric connection structure.

Background

With the rapid development of miniaturization of electronic products, display technologies are being continuously advanced together with the electronic products, and various portable band-type electronic display products, VR and AR products enter our view, so that Micro LED display technologies are generated. The Micro LED display technology is a display technology in which Micro LEDs are used as light emitting pixel units, and the light emitting pixel units are assembled on a driving panel to form a high-density LED array. In the aspect of display, compared with an LCD and an OLED, the Micro LED has the advantages of small chip size and high integration level besides the advantages of larger brightness, resolution, contrast, energy consumption, service life, response speed, thermal stability and the like.

Therefore, when the Micro LED chip drives the display, the conventional soft board has a structure and an external dimension which are not suitable for the Micro LED chip with a small size because of the small size and a large heat productivity. In the traditional design scheme, the heat dissipation plate is directly attached to the micro LED electric connection structure, a layer of micro LED electric connection structure is arranged between the heat dissipation plate and the chip, and the heat dissipation effect of the chip is poor.

Disclosure of Invention

The utility model aims to provide a miniature LED electric connection structure, and aims to solve the problems that an existing radiating plate is directly attached to the miniature LED electric connection structure, a layer of miniature LED electric connection structure is arranged between the radiating plate and a chip, and the radiating effect of the chip is poor.

In order to solve the technical problems, the utility model provides a micro LED electric connection structure, which comprises a substrate, a micro LED chip and a heat dissipation plate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged, a through hole penetrating through the first surface and the second surface is formed in the substrate, the heat dissipation plate is arranged on the second surface, a groove communicated with the through hole is formed in the heat dissipation plate, and the micro LED chip is arranged in the groove through the through hole and is electrically connected with the substrate.

In one embodiment, the micro LED chip includes a body, and a first solder leg connected to the body, a first bonding pad corresponding to the first solder leg is disposed on the substrate, a surface of the first bonding pad is flush with the first surface, and a surface of the first solder leg protrudes from the first surface.

In one embodiment, the surface of the first fillet protrudes from the first face by a dimension between 0.2mm and 0.3mm.

In one embodiment, the micro LED electrical connection structure further includes a gold wire connecting the first bonding pad and the first bonding pad.

In one embodiment, the substrate is strip-shaped, and each of the first fillets is disposed along a width direction of the substrate.

In one embodiment, the substrate is a flexible board.

In one embodiment, the heat dissipation plate is an aluminum plate.

In one embodiment, the aluminum plate has a thickness dimension between 0.7mm and 1.5mm.

In one embodiment, gaps are arranged between the side walls of the micro LED chip and the side walls in the heat dissipation plate.

In one embodiment, the gap is between 0.05mm and 0.15mm in size.

The embodiment of the utility model has the following beneficial effects:

the groove communicated with the through hole is formed in the heat radiation plate, and the micro LED chip is arranged in the groove through the through hole, so that the micro LED chip is directly contacted with the heat radiation plate, the heat radiation effect of the micro LED electric connection structure is improved, the groove is formed in the heat radiation plate, the height difference between the upper surface and the first surface of the micro LED chip can be reduced, the stability of electric connection between the micro LED chip and the plate body is improved, and the micro LED chip is conveniently positioned by arranging the micro LED chip in the groove, so that the operation is convenient, the wire bonding strength is improved, and the integral installation stability is further improved.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Wherein:

FIG. 1 is a schematic diagram of an electrical connection structure of a micro LED in one embodiment.

Fig. 2 is an exploded view of the micro LED electrical connection structure of fig. 1.

Fig. 3 is a schematic diagram of a second electrical connection structure of the micro LED shown in fig. 1.

FIG. 4 is a schematic diagram of an aluminum-based substrate in the micro LED electrical connection structure of FIG. 1.

Fig. 5 is a schematic view of a substrate in the micro LED electrical connection structure shown in fig. 1.

Reference numerals: 100. a substrate; 110. a first face; 120. a second face; 130. a first bonding pad; 140. a through hole; 200. a micro LED chip; 210. a body; 220. a first leg; 300. a heat dissipation plate; 310. a groove; 400. gold wire.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are correspondingly changed.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1 to 5, the micro LED electrical connection structure of an embodiment includes a substrate 100, a micro LED chip 200 and a heat dissipation plate 300, wherein the substrate 100 includes a first surface 110 and a second surface 120 disposed opposite to each other, a through hole 140 penetrating the first surface 110 and the second surface 120 is disposed on the substrate 100, and the heat dissipation plate 300 is mounted on the second surface 120. In one embodiment _， The heat dissipation plate 300 is provided with a groove 310 communicating with the through hole 140, and the micro LED chip 200 is mounted in the groove 310 through the through hole 140 and electrically connected with the substrate 100. The Micro LED electric connection structure comprises a Micro LED circuit board and a Mini LED circuit board.

It can be appreciated that, since the recess 310 communicated with the through hole 140 is formed on the heat dissipation plate 300, the micro LED chip 200 is mounted in the recess 310 through the through hole 140, so that the micro LED chip 200 is directly contacted with the heat dissipation plate 300, thereby improving the heat dissipation effect of the micro LED electrical connection structure, and since the recess 310 is formed on the heat dissipation plate 300, the micro LED chip 200 is mounted in the recess 310, the height difference between the upper surface of the micro LED chip 200 and the first surface 110 can be reduced, the stability of the electrical connection between the micro LED chip 200 and the plate body 210 is improved, the positioning of the micro LED chip 200 is facilitated, the operation is convenient, and meanwhile, the wire bonding strength is improved, the wire bonding operation is facilitated, and the overall mounting stability is further improved due to the reduction of the height difference between the upper surface of the micro LED chip 200 and the first surface 110.

Specifically, the bottom wall and four side walls are arranged in the heat dissipation plate 300, the bottom wall and the four side walls enclose to form a groove 310, gaps are formed between the side walls of the micro LED chip 200 and each side wall in the heat dissipation plate 300, so that the micro LED chip 200 is conveniently mounted in the groove 310, glue is coated on one side, close to the bottom wall, of the micro LED chip 200, and the micro LED chip 200 is firmly fixed in the groove 310 through the glue. Preferably, the Micro LED chip 200 is a Micro LED chip or a Mini LED chip.

Further, referring to fig. 1, the size of the gap between the side wall of the micro LED chip 200 and each side wall in the heat dissipation plate 300 is between 0.05mm and 0.15mm, and in this embodiment, the size of the gap is selected to be 0.05mm, 0.1mm or 0.15mm. The size range can further facilitate operation wire bonding, improve wire bonding strength, and simultaneously avoid the problem that the size of the micro LED electric connection structure is too large due to too large gaps or the micro LED chip 200 is inconvenient to install due to too small gaps.

In an embodiment, referring to fig. 4, the heat dissipation plate 300 is an aluminum plate, which takes away heat of the micro LED chip 200 by using good heat conduction property of the aluminum plate, and the aluminum plate may also serve to reinforce the substrate 100. Specifically, the length and width dimensions of the aluminum plate are compatible with the substrate 100. In one embodiment _， The preferred thickness dimension of the aluminum plate is between 0.7mm and 1.5mm. Further, the size of the aluminum plate may be selected to be 0.7mm, 1mm, 1.2mm or 1.5mm.

In an embodiment, referring to fig. 1 to 3, the micro LED chip 200 includes a body 210 and a first solder leg 220 connected to the body 210, a first bonding pad 130 corresponding to the first solder leg 220 is disposed on the substrate 100, the surface of the first bonding pad 130 is flush with the first surface 110, and after the mounting and fixing, the surface of the first solder leg 220 protrudes out of the first surface 110, so as to avoid the influence on normal operation due to too high temperature of the micro LED chip 200 after the mounting, thereby facilitating the heat dissipation of the micro LED chip 200.

Specifically, in an embodiment, the size of the first solder leg 220 protruding from the first surface 110 is between 0.2mm and 0.3mm, and the size of the first solder leg 220 protruding from the first surface 110 is between 0.2mm and 0.3mm, so that the height difference between the upper surface of the micro LED chip 200 and the first surface 110 can be reduced, the insufficient tensile strength of wire bonding is avoided, the wire bonding strength is improved, the wire bonding operation is convenient, the overall installation stability is improved, the quality and performance of the product are improved, the upper surface of the micro LED chip 200 can be slightly higher than that of the first surface 110, the influence on the normal operation due to the overhigh temperature of the micro LED chip 200 due to the too deep groove 310 is further avoided, and the heat dissipation is convenient.

In this embodiment, the size of the surface of the first fillets 220 protruding from the first face 110 is selected to be 0.2mm, 0.25mm, or 0.3mm.

Specifically, in one embodiment _， The miniature LED electric connection structure further comprises a gold wire 400, the gold wire 400 is connected with the first welding leg 220 and the first welding pad 130, one end of the gold wire 400 is connected with the first welding leg 220 through a wire bonding machine, and the other end of the gold wire 400 is connected with the first welding pad 130, and the gold wire 400 has the characteristics of good corrosion resistance and good conductivity, so that the service life of the miniature LED electric connection structure can be prolonged by using the gold wire 400 for connection, and the circuit transmission accuracy is ensured.

Further, the first bonding pads 220 are provided with a plurality of first bonding pads 130, and are arranged in one-to-one correspondence with the first bonding pads 220, so as to improve the electrical connection strength between the micro LED chip 200 and the substrate 100, and each bonding pad can be used for transmitting different signals, so as to ensure the normal operation of the micro LED electrical connection structure.

In the present embodiment, the substrate 100 is strip-shaped, each of the first fillets 220 is disposed along the width direction of the substrate 100, and the operator is further facilitated to wire by disposing each of the first fillets 220 along the width direction of the substrate 100.

In an embodiment, referring to fig. 1, the substrate 100 is a flexible board, so that the micro LED electrical connection structure and the applied device can be assembled together, and the substrate 100 is selected as the flexible board, so that more installation scenes can be applied, and the adaptability of the micro LED electrical connection structure is improved.

The foregoing disclosure is illustrative of the present utility model and is not to be construed as limiting the scope of the utility model, which is defined by the appended claims.

Claims (10)

1. A micro LED electrical connection structure, comprising: the LED lamp comprises a substrate, a miniature LED chip and a heat dissipation plate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged, a through hole penetrating through the first surface and the second surface is formed in the substrate, the heat dissipation plate is installed on the second surface, a groove communicated with the through hole is formed in the heat dissipation plate, and the miniature LED chip is installed in the groove through the through hole and is electrically connected with the substrate.

2. The micro LED electrical connection structure according to claim 1, wherein the micro LED chip comprises a body and a first soldering leg connected to the body, a first bonding pad corresponding to the first soldering leg is arranged on the substrate, the surface of the first bonding pad is flush with the first surface, and the surface of the first soldering leg protrudes out of the first surface.

3. The micro LED electrical connection structure of claim 2, wherein the surface of the first solder tail protrudes from the first face by a dimension between 0.2mm and 0.3mm.

4. The micro LED electrical connection structure of claim 2 or 3, further comprising a gold wire connecting the first bonding pad and the first bonding pad.

5. The micro LED electrical connection structure according to claim 4, wherein the substrate is strip-shaped, and each of the first fillets is disposed along a width direction of the substrate.

6. The micro LED electrical connection structure of claim 1, wherein the substrate is a flexible board.

7. A micro LED electrical connection structure according to any one of claims 1-3, wherein the heat dissipating plate is an aluminum plate.

8. The micro LED electrical connection structure of claim 7, wherein the aluminum plate has a thickness dimension between 0.7mm and 1.5mm.

9. The micro LED electrical connection structure according to claim 1, wherein gaps are provided between the sidewalls of the micro LED chip and the sidewalls in the heat dissipation plate.

10. The micro LED electrical connection structure of claim 9, wherein the gap has a size between 0.05mm and 0.15mm.