CN220896782U - Camera chip heat conduction structure and camera module - Google Patents
Camera chip heat conduction structure and camera module Download PDFInfo
- Publication number
- CN220896782U CN220896782U CN202322457559.4U CN202322457559U CN220896782U CN 220896782 U CN220896782 U CN 220896782U CN 202322457559 U CN202322457559 U CN 202322457559U CN 220896782 U CN220896782 U CN 220896782U
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- chip
- lens
- heat conducting
- circuit board
- camera
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- 239000004020 conductor Substances 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims 2
- 239000003292 glue Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- Studio Devices (AREA)
Abstract
The application provides a camera chip heat conduction structure and a camera module, which comprises a base, a lens, a circuit board, a lens component, a chip and a heat conduction piece, wherein one side of the base is provided with the lens, the other side of the base is provided with the circuit board, the circuit board is provided with a containing hole, the containing hole is internally provided with the chip which is opposite to the lens, the lens component is arranged between the lens and the chip in the base, and one side of the circuit board far away from the base is provided with the heat conduction piece which is abutted with the chip.
Description
Technical Field
The utility model relates to the technical field of camera equipment, in particular to a camera chip heat conduction structure and a camera module.
Background
With the progress of technology and the need of social and economic development, the application fields of the image pickup device are more and more, and the requirements of people on the image pickup device for recording high-specification and high-frame-rate video are more and more, so that the requirements on the heat dissipation performance of the video recording device are higher. However, the existing camera chip has a complex structure and general heat conduction efficiency, and needs to be improved.
Disclosure of utility model
The utility model provides a heat conduction structure of a camera chip, which aims at the technical problems of complex structure and general heat conduction efficiency of the traditional camera chip.
Based on the above, the utility model provides a heat conduction structure of an image pickup chip, which comprises a base, wherein one side of the base is provided with a lens, the other side of the base is provided with a circuit board, the circuit board is provided with a containing hole, a chip which is opposite to the lens is arranged in the containing hole, a lens component is arranged between the lens and the chip in the base, and one side of the circuit board, which is far away from the base, is provided with a heat conduction piece which is abutted to the chip.
According to the heat conduction structure of the camera chip, the boss which extends into the accommodating hole to be abutted with the chip is arranged on the heat conduction piece.
In the heat conducting structure of the camera chip, the surface of the boss facing the chip and/or the surface of the heat conducting piece facing the circuit board is a rough surface.
According to the heat conduction structure of the camera chip, the chip is integrally arranged in the accommodating hole.
According to the heat conduction structure of the camera chip, the heat conduction material layer is filled between the chip and the heat conduction piece.
The camera chip heat conduction structure comprises the lens support arranged on the circuit board and the lens arranged on the lens support and positioned between the lens and the circuit board.
According to the heat conduction structure of the camera chip, the bonding pad is arranged on the circuit board, and the bonding pad is electrically connected with the chip through the conductive wire.
According to the heat conduction structure of the camera chip, the bonding pad and the chip are surrounded by the lens support, and a sealing space is formed together with the lens.
The heat conduction structure of the camera chip further comprises a fastener which sequentially penetrates through the heat conduction piece and the circuit board and is then locked and attached to the base.
The second object of the present application is to provide a camera module, which includes a housing, wherein the heat dissipation structure of the camera chip is installed in the housing, and the housing contacts with the heat conducting member.
The embodiment of the utility model has the following beneficial effects:
The application provides a camera chip heat conduction structure and a camera module, which comprises a base, a lens, a circuit board, a lens component, a chip and a heat conduction piece, wherein one side of the base is provided with the lens, the other side of the base is provided with the circuit board, the circuit board is provided with a containing hole, the containing hole is internally provided with the chip which is opposite to the lens, the lens component is arranged between the lens and the chip in the base, and one side of the circuit board far away from the base is provided with the heat conduction piece which is abutted with the chip.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of a camera chip heat conducting structure of the present application;
FIG. 2 is another cross-sectional schematic view of a thermally conductive structure of a camera chip of the present application;
fig. 3 is an exploded view of a heat conducting structure of an image pickup chip according to the present application.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-3, a heat conducting structure of a camera chip comprises a base 1, wherein a lens 2 is arranged on one side of the base 1, a circuit board 3 is arranged on the other side of the base, a containing hole 30 is formed in the circuit board 3, a chip 5 opposite to the lens 2 is arranged in the containing hole 30, a lens component 4 is arranged between the lens 2 and the chip 5 in the base 1, and a heat conducting piece 6 abutted to the chip 5 is arranged on one side, away from the base 1, of the circuit board 3.
The application provides a heat conduction structure of a camera chip, which comprises a base, a lens, a circuit board, a lens component, a chip and a heat conduction piece, wherein the lens is arranged on one side of the base, the circuit board is arranged on the other side of the base, a containing hole is formed in the circuit board, the chip which is opposite to the lens is arranged in the containing hole, the lens component is arranged between the lens and the chip in the base, and the heat conduction piece which is abutted with the chip is arranged on one side of the circuit board, which is far away from the base.
Further, the heat conducting piece 6 is provided with a boss 61 extending into the accommodating hole 30 to be abutted to the chip 5, the boss safely stretches into the accommodating hole 30 to support and conduct heat to the chip, the stretching height can be designed according to the requirement, the size of the heat conducting piece can be adjusted according to the actual situation, and the larger the heat conducting piece is, the better the heat conducting efficiency is.
Further, the heat conducting piece and the circuit board are fixed through the glue 62, glue is filled on the overlapped surfaces of the heat conducting piece and the circuit board, the bonding strength of the heat conducting piece and the circuit board can be enhanced, the heat conducting piece can also play a role in reinforcing the circuit board, and when the module is impacted, the chip can be protected.
Further, the surface of the boss 61 facing the chip 5 and/or the surface of the heat conducting member 6 facing the circuit board 3 is rough, and the surface of the boss facing the chip and the surface of the heat conducting member bonded to the circuit board may be subjected to surface treatment, such as laser etching, etc., to increase the roughness of the surface, thereby increasing the bonding strength of the heat conducting sheet and the bonding strength of the chip.
Further, the chip 5 is integrally disposed in the accommodating hole 30, the opening of the circuit board for fixing the chip is larger than the chip size, and the chip can be completely disposed in the opening of the circuit board. The chip is placed in the accommodating hole of the circuit board, the distance between the light sensitive surface of the chip and the front surface of the circuit board is defined as sinking amount, and the sinking amount can be controlled by the height of the boss of the heat conducting fin. As the amount of sinking increases, the whole circuit board moves toward the lens, and the distance from the highest point of the lens to the bottom surface of the circuit board is defined as the total height of the module, so that the total height of the module decreases with the increase of the amount of sinking, which is helpful for the reduction of the size of the module.
Further, a heat conductive material layer 62 is filled between the chip 5 and the heat conductive member 6. The heat transfer efficiency of the chip can be improved. The back of the chip is in non-hard contact with the heat conducting strip, so that the stress of the chip is more uniform, the influence on the chip is smaller, a heat conducting material is filled between the chip and the heat conducting strip, the heat conducting strip is prevented from being uneven due to manufacturing problems, the heat conducting strip is insufficient in contact with the chip and poor in heat conducting efficiency, or the stress of the chip is uneven and damaged, the heat conducting material layer can be selected to conduct heat, the heat conducting silver glue has higher heat conducting coefficient, heat generated by the chip can be rapidly transferred to the heat conducting strip through the heat conducting silver glue, and the heat conducting strip is a hardware with higher heat conducting coefficient and can be selected to be copper alloy. The heat conducting fin becomes a good heat carrier of the chip, and can effectively share the heat of the chip.
Further, the lens assembly 4 includes a lens holder 41 provided on the circuit board 3, and a lens 42 provided on the lens holder 41 and located between the lens 2 and the circuit board 3, the lens being fixed to the lens holder and then integrally fixed to the circuit board.
Further, the circuit board 3 is provided with a bonding pad for communicating with a chip, the bonding pad is electrically connected with the chip 5 through a conductive wire 31, and the chip is in communication connection with the circuit board through a conductive wire.
Further, the lens support 41 encloses the bonding pads and the chip 5, and forms a sealed space together with the lens 42, so as to completely cover the chip and the corresponding bonding pads on the circuit board, and the lens support can completely wrap the bonding pads on the circuit board, so that the chip and the conductive wires can be completely sealed.
Further, the gap between the chip and the circuit board is filled with a fixing material 51, such as glue, for reliable fixing of the chip, and the glue may cover the conductive lines, which protects the conductive lines.
Further, the heat conducting structure of the camera chip further comprises a fastener 7 which sequentially penetrates through the heat conducting piece 6 and the circuit board 3 and is then locked and attached to the base 1.
Further, the glass lens is tightly combined with the bracket through glue, no gap exists between the glass lens and the bracket, the bracket is tightly combined with the circuit board through glue 43, a sealed space can be formed, the chip is completely located in the sealed space, and the chip can be prevented from being damaged.
Further, the lens is fixed on the base by a lens fixing material 21, which may be selected as UV glue. The surface of the two glues are both provided with surface treatment, such as laser carving, to increase the bonding strength of the glues. And a gap is reserved between the axial direction and the radial direction of the lens and the base and is used for adjusting the position between the lens and the chip so as to make imaging clearer.
The application relates to a camera shooting module, which comprises a shell, wherein the camera shooting chip radiating structure is arranged in the shell, and comprises a base, a lens, a circuit board, a lens component, a chip and a heat conducting piece, wherein one side of the base is provided with the lens, the other side of the base is provided with the circuit board, a containing hole is formed in the circuit board, the chip which is opposite to the lens is arranged in the containing hole, the lens component is arranged between the lens and the chip in the base, the heat conducting piece which is abutted to the chip is arranged on one side of the circuit board, which is far away from the base, of the circuit board, the shell is in contact with the heat conducting piece on the rear side of the circuit board.
While the foregoing is directed to the preferred embodiments of the present utility model, it should be noted that modifications and variations could be made by those skilled in the art without departing from the principles of the present utility model, and such modifications and variations are to be regarded as being within the scope of the utility model.
Claims (10)
1. The utility model provides a chip heat conduction structure makes a video recording, its characterized in that, including base (1), base (1) one side is equipped with camera lens (2), opposite side are equipped with circuit board (3), accommodation hole (30) have been seted up on circuit board (3), be provided with in accommodation hole (30) with chip (5) that camera lens (2) set up relatively, be located in base (1) camera lens (2) with be equipped with lens subassembly (4) between chip (5), circuit board (3) are kept away from one side of base (1) be equipped with heat-conducting piece (6) of chip (5) butt.
2. The heat conducting structure of the camera chip according to claim 1, wherein the heat conducting member (6) is provided with a boss (61) extending into the accommodating hole (30) to abut against the chip (5).
3. The camera chip heat conducting structure according to claim 2, wherein the surface of the boss (61) facing the chip (5) and/or the surface of the heat conducting member (6) facing the circuit board (3) is a roughened surface.
4. The camera chip heat conducting structure according to claim 1, wherein the chip (5) is integrally disposed in the accommodating hole (30).
5. A camera chip heat conducting structure according to any of claims 1-4, characterized in that a layer (62) of heat conducting material is filled between the chip (5) and the heat conducting member (6).
6. A camera chip heat conducting structure according to claim 1, characterized in that the lens assembly (4) comprises a lens holder (41) provided on the circuit board (3), and a lens (42) provided on the lens holder (41) and located between the lens (2) and the circuit board (3).
7. The camera chip heat conducting structure according to claim 6, wherein a bonding pad is arranged on the circuit board (3), and the bonding pad is electrically connected with the chip (5) through a conductive wire (31).
8. The camera chip heat conducting structure according to claim 7, wherein the lens support (41) encloses the bonding pad and the chip (5) and forms a sealed space together with the lens (42).
9. The camera chip heat conducting structure according to claim 1, further comprising a fastener (7) which is sequentially inserted through the heat conducting member (6) and the circuit board (3) and then is locked to the base (1).
10. A camera module comprising a housing, wherein the camera chip heat conducting structure according to any one of claims 1 to 9 is mounted in the housing, and the housing is in contact with the heat conducting member (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322457559.4U CN220896782U (en) | 2023-09-08 | 2023-09-08 | Camera chip heat conduction structure and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322457559.4U CN220896782U (en) | 2023-09-08 | 2023-09-08 | Camera chip heat conduction structure and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220896782U true CN220896782U (en) | 2024-05-03 |
Family
ID=90875422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322457559.4U Active CN220896782U (en) | 2023-09-08 | 2023-09-08 | Camera chip heat conduction structure and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220896782U (en) |
-
2023
- 2023-09-08 CN CN202322457559.4U patent/CN220896782U/en active Active
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