WO2020142955A1 - Ranging device and mobile platform - Google Patents

Abstract

A ranging device and a mobile platform. The ranging device comprises: an emitter (203) configured to emit a light pulse sequence; a temperature control device (224) configured to heat or cool the emitter (203); a temperature collection module (221) configured to collect temperature data of the emitter (203); a control module (223) configured to compare the temperature data with target temperature to control the temperature control device (224) for heating or cooling; a substrate (220) comprising a first surface and a second surface opposite to each other, wherein the emitter (203) and the temperature collection module (221) are provided on the first surface of the substrate (220); and a circuit board (222) comprising a first surface and a second surface opposite to each other, wherein the second surface of the substrate (220) is attached to the first surface of the circuit board (222). The ranging device can effectively monitor the temperature conditions of the emitter (203), and achieves accurate control of the temperature range by means of the heating or cooling of the temperature control device (224).

Description

Distance measuring device and mobile platform

Instructions

Technical field

The invention generally relates to the technical field of distance measuring devices, and more particularly to a range measuring device system and a mobile platform.

Background technique

Lidar is a perception system of the outside world. By transmitting and receiving light wave information, the three-dimensional and three-dimensional information of the outside world can be obtained. The principle is to actively emit a laser pulse signal to the outside, detect the reflected pulse signal, and judge the distance of the measured object according to the time difference between transmission and reception; combined with the information of the angle of emission of the optical pulse, the three-dimensional depth information can be reconstructed and learned. Laser ranging is an application field similar to the principle of lidar. It also needs to know the time difference between the transmitted pulse and the received pulse to know the distance of the measured object. However, the laser rangefinder does not have angle information, and can only obtain the single-dimensional spatial distance information in the emission direction.

In the fields of laser radar and optical fiber communication, lasers are used as signal sources to emit laser signals with specific wavelengths and optical power according to specific applications. Some typical application scenarios of lidar, such as automobiles, intelligent robots, drones, etc. for autonomous driving or map mapping, have a wide environmental temperature range, covering an ambient temperature range of -40 to 85°C.

The wavelength of the pulsed laser diode (PLD) varies greatly with temperature. In the above temperature range, the wavelength change reaches more than 40nm. In order to adapt to the laser wavelength change, the design bandwidth of the receiving filter must be greater than 40nm, so that the received noise increases and the signal noise The ratio deteriorates and the range decreases. On the other hand, the laser lifetime decays significantly with increasing temperature. The detection distance is mainly related to the power of the emitted laser. Under the premise of the same receiving sensitivity, the greater the power, the farther the detection distance. However, the wavelength and optical power of the laser diode are shifted as the ambient temperature changes. Therefore, the laser wavelength, power stability, and a wider ambient temperature range have become a major contradiction. Therefore, a complete temperature control scheme must be designed for the laser. A complete temperature control scheme includes external heat dissipation and internal heat transfer, local cooling, and some or all of the working strategies at different ambient temperatures. It is necessary to provide a temperature control scheme to control the temperature of the transmitter within a reasonable interval, so as to ensure that the performance of the device is not affected by the complex external environment.

Summary of the invention

The present invention has been proposed to solve at least one of the above problems. Specifically, in one aspect, the present invention provides a distance measuring device. The distance measuring device includes:

Transmitter, used to emit light pulse sequence;

Temperature control device, used to heat or cool the transmitter;

A temperature collection module, used to collect temperature data of the transmitter;

A control module, configured to compare the temperature data with a target temperature to control the temperature control device to heat or cool;

A substrate, the substrate includes a first surface and a second surface disposed oppositely, wherein the transmitter and the temperature collection module are disposed on the first surface of the substrate;

A circuit board, the circuit board includes a first surface and a second surface disposed oppositely, wherein the second surface of the substrate is attached to the first surface of the circuit board.

Exemplarily, the target temperature includes a first target temperature and a second target temperature, where the first target temperature is less than the second target temperature, and the control module is specifically configured to:

Controlling the temperature control device to perform heating or cooling to control the temperature of the transmitter between the first target temperature and the second target temperature.

Exemplarily, the control module includes:

A controller for acquiring the temperature data, and comparing the temperature data with the target temperature to generate a control signal;

A control circuit is used to obtain the control signal and control the temperature control device to perform heating or cooling according to the control signal.

Exemplarily, the control signal includes a first control signal and a second control signal, wherein the first control signal instructs the temperature control device to heat, and the second control signal instructs the temperature control device to cool .

Exemplarily, the controller is specifically used to:

Generating the first control signal when the temperature data is lower than the first target temperature; and

The second control signal is generated when the temperature data is higher than the second target temperature.

Exemplarily, the distance measuring device further includes:

A power detection circuit, which is used to detect the current luminous power data of the transmitter;

The control module is further configured to control the luminous power of the transmitter to stabilize at the target power based on the comparison result of the current luminous power data and the target power.

Exemplarily, during the heating or cooling process of the temperature control device, the control module is further specifically used to:

When the comparison result is that the current light emission power data is greater than the target power, controlling the transmitter to lower the voltage to reduce the light emission power of the transmitter to the target power; and

When the comparison result is that the current light emission power data is less than the target power, the transmitter is controlled to increase the voltage to increase the light emission power of the transmitter to the target power.

Exemplarily, the control module is further specifically configured to: control the transmitter to decrease or increase the voltage in proportion.

Exemplarily, the ratio includes a ratio of target power to the current light emission power data.

Exemplarily, the control module is also used to:

When the temperature data is greater than the second target temperature, controlling the temperature control device to cool at full power; and

When the temperature data is less than the first target temperature, the temperature control device is controlled to heat at full power.

Exemplarily, the target temperature further includes a predetermined target temperature that is between the first target temperature and the second target temperature, wherein when the temperature data is less than the second target temperature is greater than When the predetermined target temperature, or when the temperature data is greater than the first target temperature and less than the predetermined target temperature, the control module is further configured to:

Based on the PID algorithm, the temperature control device is controlled to heat or cool until the temperature data is adjusted to the predetermined target temperature.

Exemplarily, the temperature control device is disposed on the second surface of the circuit board and is opposite to the emitter, or the temperature control device is disposed on the first surface of the circuit board and is The device is opposite and is located between the second surface of the substrate and the first surface of the circuit board.

Exemplarily, the power detection circuit is provided on the first surface of the circuit board.

Exemplarily, the control circuit and the temperature control device are disposed on the same surface of the circuit board.

Exemplarily, the transmitter includes a laser diode chip for emitting a laser pulse sequence, wherein the laser diode chip and the temperature acquisition module are disposed on the same substrate.

Exemplarily, the first target temperature range is between 0° and 50°, and/or, the second target temperature range is between 0° and 50°.

Exemplarily, the transmitter and the temperature acquisition module are packaged together.

Exemplarily, the transmitter and the temperature acquisition module are packaged together on the first surface of the substrate.

Exemplarily, the temperature control device includes a semiconductor refrigerator, and/or, the temperature acquisition module includes a temperature sensor.

Exemplarily, the distance measuring device includes a laser radar.

In yet another aspect of the present invention, a mobile platform is provided, the mobile platform including the foregoing distance measuring device; and

A platform body, the distance measuring device is installed on the platform body.

Illustratively, the mobile platform includes a drone, robot, car or boat.

In the distance measuring device of the present invention, the temperature data of the transmitter is materialized by a temperature collection module, and the temperature data is compared with the target temperature by a control module to control the temperature control device to heat or cool, that is, to control the temperature control The device cools at high temperature to cool the transmitter, and controls the temperature control device to heat at low temperature to heat the transmitter. Compared with passive heat dissipation methods such as heat sinks, the temperature of the transmitter can be effectively monitored. The temperature range can be accurately controlled by heating or cooling with a temperature control device to ensure that the transmitter is always in a good working temperature range and stabilize the light emitted by the transmitter The wavelength of the pulse sequence and the power of the transmitter are within a reasonable range, thereby improving the stability and performance of the ranging device.

In addition, because the transmitter and the temperature acquisition module are mounted on the same substrate, the distance between the two is closer to the micron level, reducing the temperature difference between the two, making the temperature measured by the temperature acquisition module closer to the transmitter The actual temperature of the temperature improves the accuracy of the temperature collection module to the temperature collection of the transmitter, so that the control module can make a more accurate judgment, thereby achieving precise control of the temperature range.

BRIEF DESCRIPTION

In order to more clearly explain the technical solutions in the embodiments of the present invention, the drawings required in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For a person of ordinary skill in the art, without paying any creative labor, other drawings can also be obtained based on these drawings.

FIG. 1 shows a schematic structural diagram of a distance measuring device in an embodiment of the present invention;

2 shows a schematic structural diagram of a distance measuring device in another embodiment of the present invention;

FIG. 3 shows a control flowchart of the temperature control device in an embodiment of the present invention;

4 shows a schematic structural diagram of a distance measuring device in still another embodiment of the present invention;

FIG. 5 shows a schematic structural diagram of a distance measuring device in still another embodiment of the present invention;

6 shows a control flowchart of a power detection circuit in an embodiment of the invention;

7 shows a schematic structural diagram of a distance measuring device in an embodiment of the present invention;

FIG. 8 shows a schematic diagram of a distance measuring device in an embodiment of the present invention.

detailed description

In order to make the purpose, technical solutions and advantages of the present invention more obvious, an exemplary embodiment according to the present invention will be described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited by the exemplary embodiments described herein. Based on the embodiments of the present invention described in the present invention, all other embodiments obtained by those skilled in the art without paying any creative work should fall within the protection scope of the present invention.

In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.

It should be understood that the present invention can be implemented in different forms and should not be interpreted as being limited to the embodiments presented herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used herein is for describing specific embodiments only and is not intended as a limitation of the present invention. As used herein, the singular forms "a", "an", and "said/the" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "composition" and/or "comprising", when used in this specification, determine the existence of the described features, integers, steps, operations, elements and/or components, but do not exclude one or more other The presence or addition of features, integers, steps, operations, elements, components, and/or groups. As used herein, the term "and/or" includes any and all combinations of the listed items.

In order to thoroughly understand the present invention, a detailed structure will be proposed in the following description in order to explain the technical solution proposed by the present invention. The optional embodiments of the present invention are described in detail below. However, in addition to these detailed descriptions, the present invention may have other embodiments.

Current heat dissipation solutions for transmitters such as lasers mainly rely on optimizing heat transfer paths to reduce thermal resistance, increase heat transfer area, and increase fans to enhance convection heat transfer efficiency; optimization measures for heat transfer paths include the use of high thermal conductivity Structures with good heat transfer performance such as metal, heat pipe or graphite sheet realize the transfer of heat from the laser tube to the radar heat dissipation shell. The mating surfaces of different structures often use silicone grease, thermal pads and other interface materials to reduce the contact thermal resistance; by increasing the radar The shell area or long heat dissipation teeth can effectively increase the heat dissipation area, thereby increasing the heat transfer ability of the radar shell to the outside world, making the radar shell temperature lower under the same heat input conditions, thereby reducing the internal laser temperature; convection by natural heat dissipation The heat transfer coefficient is low, and the convection heat transfer coefficient of the radar heat dissipation structure can be increased several times through the scheme of adding a fan, thereby achieving more efficient heat transfer capacity under limited volume.

However, the above solutions are based on the positive temperature difference heat transfer scheme that emits heat to the environment. The heat can only be transferred from the high temperature component to the low temperature component, but not from the low temperature component to the high temperature component; this solution is optimized to the extreme and cannot achieve the laser temperature Target below ambient temperature.

In order to ensure the reliable and efficient operation of the laser, it is necessary to not only cool the laser at a high temperature but also heat the laser at a low temperature to ensure that the laser is always in an optimal operating temperature range; the current solution is to install and print on the laser A heating circuit is additionally designed on the circuit board (PCB) to heat the laser, which increases the circuit complexity to a certain extent.

Generally, the laser and the temperature sensor are separate devices. When laying the hardware, place the temperature sensor as close to the laser as possible, and use the temperature sensor's temperature to approximate the temperature of the laser, but the solution is still affected by the placement distance, installation method, Due to the influence of various factors such as the intermediate thermal resistance, it is difficult to accurately measure the temperature of the laser, so that it is impossible to accurately control the temperature of the laser.

In order to solve the above technical problems, the present invention provides a distance measuring device. The distance measuring device includes:

Transmitter, used to emit light pulse sequence;

Temperature control device, used to heat or cool the transmitter;

A temperature collection module, used to collect temperature data of the transmitter;

A control module, configured to compare the temperature data with a target temperature to control the temperature control device to heat or cool;

A substrate, the substrate includes a first surface and a second surface disposed oppositely, wherein the transmitter and the temperature collection module are disposed on the first surface of the substrate;

A circuit board, the circuit board includes a first surface and a second surface disposed oppositely, wherein the second surface of the substrate is attached to the first surface of the circuit board.

In the distance measuring device of the present invention, the temperature data of the transmitter is materialized by a temperature collection module, and the temperature data is compared with the target temperature by a control module to control the temperature control device to heat or cool, that is, to control the temperature control The device cools at high temperature to cool the transmitter, and controls the temperature control device to heat at low temperature to heat the transmitter. Compared with passive heat dissipation methods such as heat sinks, the temperature of the transmitter can be effectively monitored. The temperature range can be accurately controlled by heating or cooling with a temperature control device to ensure that the transmitter is always in a good working temperature range and stabilize the light emitted by the transmitter The wavelength of the pulse sequence and the power of the transmitter are within a reasonable range, thereby improving the stability and performance of the ranging device.

In addition, because the transmitter and the temperature acquisition module are mounted on the same substrate, the distance between the two is closer to the micron level, reducing the temperature difference between the two, making the temperature measured by the temperature acquisition module closer to the transmitter The actual temperature of the temperature improves the accuracy of the temperature collection module to the temperature collection of the transmitter, so that the control module can make a more accurate judgment, thereby achieving precise control of the temperature range.

The distance measuring device of the present application will be described in detail below with reference to the drawings. In the case of no conflict, the features in the following examples and implementations can be combined with each other.

In one embodiment, as shown in FIG. 1, the distance measuring device includes a transmitter 203 for emitting a sequence of light pulses, such as a sequence of laser pulses. In some embodiments, the transmitter 203 may include a laser diode chip through which laser pulses in the nanosecond level are emitted. Further, the laser pulse receiving time may be determined, for example, by detecting the rising edge time and/or the falling edge time of the electrical signal pulse.

The distance measuring device further includes a temperature collection module 221 for collecting temperature data of the transmitter 203. For example, the temperature of the surrounding environment of the transmitter 203 is collected as the temperature data of the transmitter 203. The temperature collection module 221 includes a temperature sensor, and the temperature sensor may include a thermocouple, a thermistor, or the like capable of detecting temperature.

The distance measuring device further includes a temperature control device 224 for heating or cooling the transmitter 203. The temperature control device 224 may be any device that can be used for both heating and cooling. For example, the temperature control device 224 includes a TEC (Thermo Electric Cooler) (thermoelectric cooler or semiconductor cooler). TEC is an application of the Peltier effect, based on semiconductor materials, and can be used as an electronic component for small heat pumps. When a DC voltage is applied across the TEC, heat will flow from one side of the device to the other side of the device. At this time, the temperature at one end will decrease and the temperature at the other end will increase. Changing the direction of current can change the direction of heat flow, so you can use a TEC to achieve both heating and cooling functions.

The distance measuring device also controls a module, which is used to compare the temperature data with a target temperature to control the temperature control device to heat or cool. The temperature data collection module 221 collects the temperature data of the transmitter 203, and the control module obtains the temperature data and compares the temperature data with the target temperature to control the temperature control device to heat or cool. For example, when the temperature data is higher than the target temperature, the temperature control device is controlled to cool, and when the temperature data is lower than the target temperature, the temperature control device is controlled to heat until the transmitter collected by the temperature collection module 221 The temperature data of 203 is close to or equal to the target temperature, and the target temperature may also be a temperature range interval. When the temperature data of the reflector 203 collected by the temperature collection module 221 falls within the temperature range interval, the temperature control device is controlled to stop heating or cooling . Wherein, the above target temperature means that when the target temperature or the range of the target temperature range, the wavelength and power of the emitted light beam of the transmitter are stable with small fluctuations.

In one embodiment, the target temperature is a target temperature range interval, and the target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is less than the second target temperature, for example, the A target temperature is the upper limit of the target temperature, and the second target temperature is the lower limit of the target temperature. Once the temperature data of the transmitter is less than the first target temperature or the temperature data is greater than the second target temperature, the wavelength and power of the transmitter's emitted beam There will be fluctuations, and the control module is specifically used to control the temperature control device to heat or cool to control the temperature of the transmitter between the first target temperature and the second target temperature.

The first target temperature range is between 0° and 50°, and/or, the second target temperature range is between 0° and 50°, the above temperature range is only an example, and for other The temperature ranges of wavelength and power temperature can also be applied to the embodiments of the present invention. In a specific example, the first target temperature is 0° and the second target temperature is 50°, and the control module is specifically used to control The temperature control device performs heating or cooling to control the temperature of the transmitter between the 0°-50°. In other embodiments, the first target temperature is 5° and the second target temperature is 40°, the control module is specifically used to control the temperature control device to heat or cool, so as to The temperature is controlled between 4° and 45°. Or, in one embodiment, the first target temperature is 1° to 45° lower than the second target temperature, or 5° to 30° lower, and the first target temperature and the second target The temperature range of the temperature is still between 0° and 50°.

In a specific embodiment, as shown in the control flowchart shown in FIG. 3, the temperature data collection module collects the temperature data of the transmitter, the control module receives the temperature data, and compares the temperature data with the target temperature. The target temperature includes the first A target temperature and a second target temperature, the first target temperature is less than the second target temperature, and if the result of the comparison is that the temperature data is greater than the second target temperature, the temperature control device (such as TEC) is controlled to perform cooling to Reduce the temperature of the transmitter, and continue the temperature collection by the temperature collection module until the collected temperature data reaches the second target temperature, stop cooling, and if the comparison result is that the temperature data is less than the first target temperature, control the temperature control device (For example, TEC) heating to increase the temperature of the transmitter and continue temperature collection by the temperature collection module until the collected temperature data reaches the first target temperature, and the heating is stopped. In this way, the temperature of the transmitter can be controlled within the first target temperature and the second target range, thereby achieving precise control of the temperature range, to ensure that the power of the transmitter does not change with temperature, and to ensure that the light pulse sequence emitted by the transmitter The degree of wavelength shift is within the acceptable range.

In a specific embodiment, as shown in FIG. 1, the control module includes a controller 218 and a control circuit 223. The controller 218 is used to obtain the temperature data and compare the temperature data with the target temperature Generating a control signal, for example, the control signal includes a first control signal and a second control signal, wherein the first control signal instructs the temperature control device to heat, and the second control signal instructs the control Temperature device for cooling. The control circuit 223 is used to obtain the control signal and control the temperature control device to perform heating or cooling according to the control signal, for example, heating according to the first control signal, or performing according to the second control signal Refrigeration. The control circuit 223 includes, for example, a TEC control circuit, which is electrically connected to the TEC and used to control the TEC to perform heating or cooling according to the control signal. In one embodiment, the controller 218 is specifically configured to generate the first control signal when the temperature data is lower than the first target temperature; and when the temperature data is higher than the second target temperature The second control signal is generated. According to the above settings, the temperature of the transmitter can be accurately controlled at the target temperature, thereby stabilizing the wavelength and power of the light pulse emitted by the transmitter.

The controller 218 may include any suitable controller, including, for example, a microcontroller (MCU). The microcontroller includes a central processor core, program memory (such as read-only memory or flash memory), data memory (such as random access memory), one or Multiple timers/timers and input/output ports used to communicate with peripheral devices and extended resources, all of which can be integrated on a single integrated circuit chip.

As shown in FIG. 1, the distance measuring device further includes a substrate 220, and the substrate 220 includes a first surface and a second surface disposed oppositely, wherein the transmitter 203 and the temperature collection module 221 are disposed on the The first surface of the substrate 220 constitutes a multi-chip package (MCP). Because the two are integrated on the same substrate, the distance between the temperature collection module and the transmitter is very close, so that the temperature collection module collects The temperature data is closer to the actual temperature of the transmitter, so that the temperature of the transmitter can be accurately measured, which is helpful for accurate temperature control of the transmitter. In one embodiment, the transmitter 203 includes a laser diode chip for transmitting a laser pulse sequence. The laser diode chip and the temperature acquisition module 221 (eg, temperature sensor) are disposed on the same substrate 220, for example, both On the first surface of the substrate 220, the arrangement is such that the distance between the laser diode chip and the temperature collection module can be closer, which is convenient for improving the accuracy of temperature collection.

In one embodiment, the transmitter 203 further includes a driving chip (not shown) for controlling the laser diode chip to emit a laser pulse sequence, and the driving chip may also be mounted on the first surface of the substrate , The driving chip 310 and the laser diode chip that control the emission of the laser diode chip are packaged together, and both are packaged in the accommodating space formed between the substrate and the cover body, and the current TO package can be eliminated by the arrangement The inductance between the laser diode chip and the drive circuit next to the laser diode chip, the distributed inductance on the line, to reduce the distributed inductance of the packaged module, to achieve high-power laser emission, and to achieve narrow pulse laser drive. In another embodiment, the driving chip may also be mounted on another substrate, and the substrate is also mounted on the first surface of the circuit board. In other embodiments, the driving chip may also be directly mounted on the first surface of the circuit board.

In a specific embodiment of the present invention, the transmitter further includes a switch chip (not shown), wherein the switch chip is also disposed in the same accommodation space as the laser diode chip, wherein the switch chip includes a switch circuit The switch circuit is used to control the laser diode chip to emit laser light under the drive of the drive circuit.

In one example, the transmitter 203 and the temperature collection module 221 are packaged together, for example, on the same side of the same substrate. In particular, the transmitter and the temperature collection module are packaged together on the substrate On the first surface, and/or can also be packaged in the same cover (not shown) at the same time, the cover is provided on the first surface of the substrate 220, between the substrate 220 and the cover An accommodating space is formed, in which the light-transmitting area is at least partially provided on the surface of the cover opposite to the substrate 220, and the light pulse sequence emitted by the emitter is emitted from the light-transmitting area, so that the emitter and the temperature collection module 221 are close Is in the same space, which is more conducive to improving the accuracy of temperature collection.

In a specific embodiment, the laser diode chip may be a bare die and/or the temperature sensor is a bare chip, that is, a small piece of "die" with a line cut from a wafer (wafer) is installed by A die (bond) is mounted on the substrate 220. Die bonding refers to the process of bonding the chip to a designated area of the substrate through a gel, generally a conductive glue or an insulating glue, to form a thermal path or an electrical path, and to provide conditions for subsequent wire bonding.

Compared with the traditional use of the transmitter (such as a laser) and the temperature sensor as separate devices, when the hardware is laid out, the temperature sensor is as close as possible to the transmitter, and the temperature of the temperature sensor is used to approximate the temperature of the transmitter, but this solution Affected by various factors such as the distance between the two, the installation method, and the intermediate thermal resistance, it is difficult to accurately measure the temperature of the transmitter, so that the temperature of the transmitter cannot be accurately controlled. In the solution of the present invention, the transmitter and the temperature are The acquisition modules are packaged together, especially on the same side of the same substrate, and can be packaged in the same space, forming a multi-chip packaging structure, thereby significantly shortening the distance between the two, reaching the micron level, reducing the gap between the two The temperature difference makes the temperature measured by the temperature acquisition module closer to the current temperature of the transmitter, so that the temperature of the transmitter is accurately measured, which is conducive to accurate temperature control of multiple transmitters.

The substrate 220 may include various types of substrates such as a PCB substrate (Printed Circuit Board), a ceramic substrate, a pre-mold substrate, and the like. The ceramic substrate may be an aluminum nitride or aluminum oxide substrate.

Continuing as shown in FIG. 1, the distance measuring device further includes a circuit board 222 including a first surface and a second surface disposed oppositely, wherein the second surface of the substrate 220 is attached to the circuit board On the first surface of 222, the circuit board 222 is used to carry the substrate 220.

Optionally, the circuit board 222 includes a printed circuit board (PCB), and since it is used to carry the transmitter, the circuit board may be referred to as a transmitter board. The PCB is made of different components and a variety of complex technological processes, and the structure of the PCB circuit board has a single-layer, double-layer, multi-layer structure, and the manufacturing method is different for different hierarchical structures. Optionally, the printed circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, fillers, electrical boundaries, etc. Further, the common layer structure of printed circuit boards includes single-layer board (Single Layer PCB), double-layer board (Double Layer PCB) and multi-layer board (Multi Layer PCB).

In one example, the temperature control device 224 is disposed on the second surface of the circuit board 222 and is opposite to the emitter 203. In another example, as shown in FIG. 2, the temperature control device 224 is disposed on the first surface of the circuit board 222 and is opposite to the emitter 203, and is located on the second surface of the substrate and the Between the first surfaces of the circuit board 222. The above setting methods are beneficial to the temperature control device directly heating or cooling the transmitter 203, and can shorten the heat exchange path.

In one example, the control circuit 223 and the temperature control device 224 are disposed on the same surface of the circuit board 222, for example, as shown in FIG. 1, the control circuit 223 and the temperature control device 224 are disposed on the circuit board On the second surface of 222, or, for example, as shown in FIG. 1, the control circuit 223 and the temperature control device 224 are both provided on the first surface of the circuit board 222.

The control circuit 223 may be any suitable control circuit, and may include, for example, a switch tube (MOS tube), which is controlled by a control signal to turn on or off the switch tube, and may also include other resistors, capacitors, etc., which will not be detailed here. limit.

In another embodiment, as shown in FIG. 4, the distance measuring device further includes a power detection circuit 225 for detecting the current light emission power data of the transmitter 203. The power detection circuit 225 may use any suitable optical power detection circuit known to those skilled in the art. In a specific embodiment, the power detection circuit may be received from the transmitter through a photodiode such as an avalanche photodiode (APD) or PIN photodiode. The optical signal is converted into a current signal, and the resulting current signal is output as a digital signal with a differential standard swing through a transimpedance amplifier (TIA) and a limiting amplifier (LA). At the same time, a current signal is obtained through the function of a current mirror circuit Mirror current, which is converted to voltage by the amplification of the current-voltage (IV) converter and transmitted to a controller such as a microcontroller (MCU) for sampling processing, and then the power value of the received optical signal can be obtained by calculation . The above power detection circuit is only an example, and other circuits that can detect the current light emission power data of the transmitter can also be applied to the present invention.

In one example, the power detection circuit 225 is provided on the first surface of the circuit board 222. Furthermore, in order to facilitate the power detection circuit 225 to obtain the optical pulse signal emitted by the transmitter 203, the power detection circuit 225 and the transmitter 203 are disposed on the same side surface of the circuit board 222. For example, as shown in FIG. 4, the control circuit 223 and the temperature control device 224 are disposed on the second surface of the circuit board 222, and the power detection circuit 225 and the transmitter 203 and the temperature collection module 221 are disposed on the first side of the circuit board 222 The surface, or, for example, as shown in FIG. 5, the control circuit 223, the temperature control device 224, the power detection circuit 225, the transmitter 203, and the temperature acquisition module 221 are all provided on the first surface of the circuit board 222.

Further, the control module is further configured to control the emission power of the transmitter to stabilize at the target power based on the comparison result of the current emission power data and the target power. In one embodiment, during the heating or cooling process of the temperature control device, the control module is further specifically configured to: when the comparison result is that the current luminous power data is greater than the target power, control the transmission Lower the voltage by, for example, controlling the transmitter 203 to lower the voltage in proportion to reduce the luminous power of the transmitter to the target power; and when the comparison result is that the current luminous power data is less than the target power , Control the transmitter 203 to increase the voltage, for example, control the transmitter 203 to increase the voltage in proportion to increase the luminous power of the transmitter to the target power. The aforementioned ratio may be a ratio set according to actual power requirements, or the ratio includes a ratio of target power to the current light emission power data.

In the embodiments shown in FIGS. 4 and 5, the control module includes a controller 218 and a control circuit (not shown). The controller 218 is also used to obtain the current luminous power data detected by the power detection circuit, and The current luminous power is compared with the target power, if the result of the comparison is that the current luminous power is greater than the target power, a control signal indicating that the voltage of the transmitter is lowered is generated, and if the result of the comparison is that the current luminous power is less than the target power, an instruction to increase is generated The control signal of the voltage of the transmitter. The control circuit is used for acquiring control signals, and controlling the voltage of the transmitter to be adjusted down or up according to the control signals.

In one embodiment, the target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is less than the second target temperature, and the control module is further configured to: when the temperature data When the temperature is greater than the second target temperature, the temperature control device is controlled to cool at full power; and when the temperature data is less than the first target temperature, the temperature control device is controlled to heat at full power to quickly control the transmitter Adjust the temperature.

In another embodiment, the target temperature further includes a predetermined target temperature that is between the first target temperature and the second target temperature, wherein the temperature data is less than the second When the target temperature is greater than the predetermined target temperature, or when the temperature data is greater than the first target temperature and less than the predetermined target temperature, the control module is further configured to: control the heating or cooling of the temperature control device based on the PID algorithm, Until the temperature data is adjusted to the predetermined target temperature. The proportional-integral-derivative (PID) control method is a typical representative of classic control algorithms. The PID controller consists of a proportional unit (P), an integral unit (I), and a differential unit (D).

In order to make the entire control strategy more flexible, a power detection circuit is used to monitor the luminous power of an emitter such as a laser, and a laser power signal and a temperature signal are used to comprehensively control a temperature control device such as TEC. The control strategy in a specific embodiment will be explained and explained below with reference to FIG. 6.

First, after the distance measuring device starts to work, the temperature data collection module collects the temperature data of the transmitter; then, the control module compares the temperature data with the target temperature upper limit value (for example, 50°), the target temperature upper limit value It can be reasonably set according to the needs. For example, when the temperature of the transmitter exceeds the upper limit of the target temperature, the deviation of power and wavelength will become larger. If the temperature data is greater than the upper limit of the target temperature, the temperature control device such as TEC is controlled. Full power cooling; if the temperature data is not greater than the upper temperature limit, use PID algorithm to adjust the temperature control device, such as TEC, towards the target temperature (the target temperature can be set lower than the target temperature upper limit according to actual needs) Temperature value) adjustment, during the adjustment process, it is also necessary to adjust the voltage by collecting the target power to keep the target power stable during the temperature adjustment process. In the above cooling process, the power detection circuit detects the current luminous power data of the transmitter, and when the current luminous power data is greater than the target power, the control module controls the transmitter to lower the voltage proportionally to reduce The luminous power of the transmitter to the target power; and when the current luminous power data is less than the target power, controlling the transmitter to proportionally increase the voltage to increase the luminous power of the transmitter to the target Target power. Then the temperature acquisition cycle is repeated.

In summary, the distance measuring device of the present invention uses a temperature acquisition module to perform material on the temperature data of the transmitter, and uses the control module to compare the temperature data with the target temperature to control the temperature control device to heat or cool, that is, The temperature control device controls cooling at a high temperature to cool the transmitter, and the temperature control device heats at a low temperature to heat the transmitter. Compared with passive heat dissipation methods such as heat sinks, the temperature of the transmitter can be effectively monitored. The temperature range can be accurately controlled by heating or cooling with a temperature control device (especially TEC) to ensure that the transmitter is always in a good working temperature range and stable The wavelength of the light pulse sequence emitted by the transmitter and the power of the transmitter are within a reasonable range, thereby improving the stability and performance of the ranging device.

In addition, because the transmitter and the temperature acquisition module are mounted on the same substrate, the distance between the two is closer to the micron level, reducing the temperature difference between the two, making the temperature measured by the temperature acquisition module closer to the transmitter The actual temperature of the temperature improves the accuracy of the temperature collection module to the temperature collection of the transmitter, so that the control module can make a more accurate judgment, thereby achieving precise control of the temperature range.

Next, a structure of a distance measuring device in an embodiment of the present invention will be described in more detail with reference to FIGS. 7 and 8. The distance measuring device includes a laser radar, and the distance measuring device is only used as an example. For other suitable distance measuring devices The distance device can also be applied to this application.

The above solutions provided by various embodiments of the present invention may be applied to a distance measuring device, and the distance measuring device may be an electronic device such as a laser radar or a laser distance measuring device. In one embodiment, the distance measuring device is used to sense external environment information, for example, distance information, azimuth information, reflection intensity information, speed information, etc. of the environmental target. In an implementation manner, the distance measuring device can detect the distance between the detecting object and the distance measuring device by measuring the time of light propagation between the distance measuring device and the detection object, that is, Time-of-Flight (TOF). Alternatively, the distance measuring device may also detect the distance between the detected object and the distance measuring device through other techniques, such as a distance measuring method based on phase shift measurement, or a distance measuring method based on frequency shift measurement. There are no restrictions.

For ease of understanding, the following describes the working process of distance measurement in conjunction with the distance measurement device 100 shown in FIG. 7.

As shown in FIG. 7, the distance measuring device 100 may include a transmitting circuit 110, a receiving circuit 120, a sampling circuit 130 and an arithmetic circuit 140.

The transmission circuit 110 may transmit a sequence of light pulses (for example, a sequence of laser pulses). The receiving circuit 120 can receive the optical pulse sequence reflected by the detected object, and photoelectrically convert the optical pulse sequence to obtain an electrical signal, which can be output to the sampling circuit 130 after processing the electrical signal. The sampling circuit 130 may sample the electrical signal to obtain the sampling result. The arithmetic circuit 140 may determine the distance between the distance measuring device 100 and the detected object based on the sampling result of the sampling circuit 130.

Optionally, the distance measuring device 100 may further include a control circuit 150, which can control other circuits, for example, can control the working time of each circuit and/or set parameters for each circuit.

It should be understood that although the distance measuring device shown in FIG. 7 includes a transmitting circuit, a receiving circuit, a sampling circuit, and an arithmetic circuit for emitting a beam of light for detection, the embodiments of the present application are not limited thereto, and the transmitting circuit , The number of any one of the receiving circuit, the sampling circuit, and the arithmetic circuit may also be at least two, for emitting at least two light beams in the same direction or respectively in different directions; wherein, the at least two light paths may be simultaneously The shot may be shot at different times. In one example, the light-emitting chips in the at least two emission circuits are packaged in the same module. For example, each emitting circuit includes a laser emitting chip, and the die in the laser emitting chips in the at least two emitting circuits are packaged together and housed in the same packaging space.

In some implementations, in addition to the circuit shown in FIG. 7, the distance-measuring device 100 may further include a scanning module for changing the propagation direction of at least one laser pulse sequence emitted from the transmitting circuit.

Among them, the module including the transmitting circuit 110, the receiving circuit 120, the sampling circuit 130, and the arithmetic circuit 140, or the module including the transmitting circuit 110, the receiving circuit 120, the sampling circuit 130, the arithmetic circuit 140, and the control circuit 150 may be referred to as a measurement Distance module, the distance measuring module may be independent of other modules, for example, a scanning module.

A coaxial optical path may be used in the distance measuring device, that is, the light beam emitted by the distance measuring device and the reflected light beam share at least part of the optical path in the distance measuring device. For example, after at least one laser pulse sequence emitted by the transmitting circuit is emitted by the scanning module to change the propagation direction, the laser pulse sequence reflected by the detection object passes through the scanning module and enters the receiving circuit. Alternatively, the distance measuring device may also adopt an off-axis optical path, that is, the light beam emitted from the distance measuring device and the reflected light beam are respectively transmitted along different optical paths in the distance measuring device. FIG. 8 shows a schematic diagram of an embodiment of the distance measuring device of the present invention using a coaxial optical path.

The distance measuring device 200 includes a distance measuring module 210. The distance measuring module 210 includes a transmitter 203 (which may include the above-mentioned transmitting circuit), a collimating element 204, and a detector 205 (which may include the above-mentioned receiving circuit, sampling circuit, and arithmetic circuit) and Optical path changing element 206. The distance measuring module 210 is used to emit a light beam and receive back light, and convert the back light into an electrical signal. Among them, the transmitter 203 may be used to transmit a light pulse sequence. In one embodiment, the transmitter 203 may emit a sequence of laser pulses. Optionally, the laser beam emitted by the transmitter 203 is a narrow-bandwidth beam with a wavelength outside the visible light range. The collimating element 204 is disposed on the exit optical path of the emitter, and is used to collimate the light beam emitted from the emitter 203, and collimate the light beam emitted by the emitter 203 into parallel light to the scanning module. The collimating element is also used to converge at least a part of the return light reflected by the detection object. The collimating element 204 may be a collimating lens or other element capable of collimating the light beam.

In the embodiment shown in FIG. 8, the optical path changing element 206 is used to combine the transmitting optical path and the receiving optical path in the distance measuring device before the collimating element 204, so that the transmitting optical path and the receiving optical path can share the same collimating element, so that the optical path More compact. In some other implementation manners, the transmitter 203 and the detector 205 may respectively use respective collimating elements, and the optical path changing element 206 is disposed on the optical path behind the collimating element.

In the embodiment shown in FIG. 8, since the beam aperture of the light beam emitted by the transmitter 203 is small and the beam aperture of the return light received by the distance measuring device is large, the light path changing element can use a small-area mirror to convert The transmitting optical path and the receiving optical path are combined. In some other implementations, the light path changing element may also use a reflector with a through hole, where the through hole is used to transmit the outgoing light of the emitter 203, and the reflector is used to reflect the return light to the detector 205. In this way, the support of the small mirror will block the return light when the small mirror is used.

In the embodiment shown in FIG. 8, the optical path changing element is offset from the optical axis of the collimating element 204. In some other implementations, the optical path changing element may also be located on the optical axis of the collimating element 204.

The distance measuring device 200 further includes a scanning module 202. The scanning module 202 is placed on the exit optical path of the distance measuring module 210. The scanning module 202 is used to change the transmission direction of the collimated light beam 219 emitted through the collimating element 204 and project it to the outside environment, and project the return light to the collimating element 204 . The returned light is converged on the detector 205 via the collimating element 204.

In one embodiment, the scanning module 202 may include at least one optical element for changing the propagation path of the light beam, wherein the optical element may change the propagation path of the light beam by reflecting, refracting, diffracting, etc. the light beam. For example, the scanning module 202 includes a lens, a mirror, a prism, a galvanometer, a grating, a liquid crystal, an optical phased array (Optical Phased Array), or any combination of the above optical elements. In one example, at least part of the optical element is moving, for example, the at least part of the optical element is driven to move by a driving module, and the moving optical element can reflect, refract or diffract the light beam to different directions at different times. In some embodiments, multiple optical elements of the scanning module 202 may rotate or vibrate about a common axis 209, and each rotating or vibrating optical element is used to continuously change the direction of propagation of the incident light beam. In one embodiment, the multiple optical elements of the scanning module 202 may rotate at different rotation speeds, or vibrate at different speeds. In another embodiment, at least part of the optical elements of the scanning module 202 can rotate at substantially the same rotational speed. In some embodiments, the multiple optical elements of the scanning module may also rotate around different axes. In some embodiments, the multiple optical elements of the scanning module may also rotate in the same direction, or rotate in different directions; or vibrate in the same direction, or vibrate in different directions, which is not limited herein.

In one embodiment, the scanning module 202 includes a first optical element 214 and a driver 216 connected to the first optical element 214. The driver 216 is used to drive the first optical element 214 to rotate about a rotation axis 209 to change the first optical element 214 The direction of the collimated light beam 219. The first optical element 214 projects the collimated light beam 219 to different directions. In one embodiment, the angle between the direction of the collimated light beam 219 after the first optical element changes and the rotation axis 209 changes as the first optical element 214 rotates. In one embodiment, the first optical element 214 includes a pair of opposed non-parallel surfaces through which the collimated light beam 219 passes. In one embodiment, the first optical element 214 includes a prism whose thickness varies along at least one radial direction. In one embodiment, the first optical element 214 includes a wedge-angle prism, aligning the straight beam 219 for refraction.

In one embodiment, the scanning module 202 further includes a second optical element 215 that rotates about a rotation axis 209. The rotation speed of the second optical element 215 is different from the rotation speed of the first optical element 214. The second optical element 215 is used to change the direction of the light beam projected by the first optical element 214. In one embodiment, the second optical element 215 is connected to another driver 217, and the driver 217 drives the second optical element 215 to rotate. The first optical element 214 and the second optical element 215 may be driven by the same or different drivers, so that the first optical element 214 and the second optical element 215 have different rotation speeds and/or rotations, thereby projecting the collimated light beam 219 to the outside space Different directions can scan a larger spatial range. In one embodiment, the controller 218 controls the drivers 216 and 217 to drive the first optical element 214 and the second optical element 215, respectively. The rotation speeds of the first optical element 214 and the second optical element 215 can be determined according to the area and pattern expected to be scanned in practical applications. Drives 216 and 217 may include motors or other drives.

In one embodiment, the second optical element 215 includes a pair of opposed non-parallel surfaces through which the light beam passes. In one embodiment, the second optical element 215 includes a prism whose thickness varies along at least one radial direction. In one embodiment, the second optical element 215 includes a wedge angle prism.

In one embodiment, the scanning module 202 further includes a third optical element (not shown) and a driver for driving the third optical element to move. Optionally, the third optical element includes a pair of opposed non-parallel surfaces through which the light beam passes. In one embodiment, the third optical element includes a prism whose thickness varies along at least one radial direction. In one embodiment, the third optical element includes a wedge angle prism. At least two of the first, second and third optical elements rotate at different rotational speeds and/or turns.

The rotation of each optical element in the scanning module 202 can project light into different directions, such as the direction and direction 213 of the projected light 211, thus scanning the space around the distance measuring device 200. When the light 211 projected by the scanning module 202 hits the detection object 201, a part of the light is reflected by the detection object 201 to the distance measuring device 200 in a direction opposite to the projected light 211. The returned light 212 reflected by the detection object 201 passes through the scanning module 202 and enters the collimating element 204.

The detector 205 is placed on the same side of the collimating element 204 as the emitter 203. The detector 205 is used to convert at least part of the returned light passing through the collimating element 204 into an electrical signal.

In one embodiment, each optical element is coated with an antireflection coating. Optionally, the thickness of the antireflection film is equal to or close to the wavelength of the light beam emitted by the emitter 203, which can increase the intensity of the transmitted light beam.

In one embodiment, a filter layer is plated on the surface of an element on the beam propagation path in the distance measuring device, or a filter is provided on the beam propagation path to transmit at least the wavelength band of the beam emitted by the transmitter, Reflect other bands to reduce the noise caused by ambient light to the receiver.

In some embodiments, the transmitter 203 may include a laser diode through which laser pulses in the order of nanoseconds are emitted. Further, the laser pulse reception time can be determined, for example, by detecting the rising edge time and/or the falling edge time of the electrical signal pulse. In this way, the distance measuring device 200 can calculate the TOF using the pulse reception time information and the pulse emission time information, thereby determining the distance between the detection object 201 and the distance measuring device 200.

The distance and orientation detected by the distance measuring device 200 can be used for remote sensing, obstacle avoidance, mapping, modeling, navigation, and the like. In one embodiment, the distance measuring device of the embodiment of the present invention can be applied to a mobile platform, and the distance measuring device can be installed on the platform body of the mobile platform. A mobile platform with a distance measuring device can measure the external environment, for example, measuring the distance between the mobile platform and obstacles for obstacle avoidance and other purposes, and performing two-dimensional or three-dimensional mapping on the external environment. In some embodiments, the mobile platform includes at least one of an unmanned aerial vehicle, a car, a remote control car, a robot, a boat, and a camera. When the distance measuring device is applied to an unmanned aerial vehicle, the platform body is the fuselage of the unmanned aerial vehicle. When the distance measuring device is applied to an automobile, the platform body is the body of the automobile. The car may be a self-driving car or a semi-automatic car, and no restriction is made here. When the distance measuring device is applied to a remote control car, the platform body is the body of the remote control car. When the distance measuring device is applied to a robot, the platform body is a robot. When the distance measuring device is applied to a camera, the platform body is the camera itself.

Although example embodiments have been described herein with reference to the drawings, it should be understood that the above example embodiments are merely exemplary, and are not intended to limit the scope of the present invention thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

Those of ordinary skill in the art may realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application of the technical solution and design constraints. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

In the several embodiments provided in this application, it should be understood that the disclosed device and method may be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a division of logical functions. In actual implementation, there may be other divisions, for example, multiple units or components may be combined or Can be integrated into another device, or some features can be ignored, or not implemented.

The specification provided here explains a lot of specific details. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this description.

Similarly, it should be understood that in order to streamline the invention and help understand one or more of the various inventive aspects, in describing the exemplary embodiments of the invention, the various features of the invention are sometimes grouped together into a single embodiment, figure , Or in its description. However, the method of the present invention should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. Rather, as reflected in the corresponding claims, its invention lies in that the corresponding technical problems can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following a specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present invention.

Those skilled in the art will understand that apart from mutually exclusive features, any combination of all the features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all of the methods or devices disclosed in this specification can be used in any combination. Processes or units are combined. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose.

In addition, those skilled in the art can understand that although some of the embodiments described herein include certain features included in other embodiments rather than other features, the combination of features of different embodiments is meant to be within the scope of the present invention And form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

The various component embodiments of the present invention may be implemented in hardware, or implemented in software modules running on one or more processors, or implemented in a combination thereof. Those skilled in the art should understand that, in practice, a microprocessor or a digital signal processor (DSP) may be used to implement some or all functions of some modules according to embodiments of the present invention. The present invention can also be implemented as a device program (for example, a computer program and a computer program product) for performing a part or all of the method described herein. Such a program implementing the present invention may be stored on a computer-readable medium, or may have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

It should be noted that the above-mentioned embodiments illustrate the present invention rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs between parentheses should not be constructed as limitations on the claims. The invention can be realized by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims enumerating several devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third does not indicate any order. These words can be interpreted as names.

Claims (22)

1. A distance measuring device, characterized in that the distance measuring device includes:

   Transmitter, used to emit light pulse sequence;

   A temperature control device for heating or cooling the transmitter;

   A temperature collection module, used to collect temperature data of the transmitter;

   A control module, configured to compare the temperature data with a target temperature to control the temperature control device to heat or cool;

   A substrate, the substrate includes a first surface and a second surface disposed oppositely, wherein the transmitter and the temperature collection module are disposed on the first surface of the substrate;

   A circuit board, the circuit board includes a first surface and a second surface disposed oppositely, wherein the second surface of the substrate is attached to the first surface of the circuit board.
2. The distance measuring device according to claim 1, wherein the target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is less than the second target temperature, and the control module Specifically used for:

   Controlling the temperature control device to perform heating or cooling to control the temperature of the transmitter between the first target temperature and the second target temperature.
3. The distance measuring device according to claim 2, wherein the control module comprises:

   A controller for acquiring the temperature data, and comparing the temperature data with the target temperature to generate a control signal;

   A control circuit is used to obtain the control signal and control the temperature control device to perform heating or cooling according to the control signal.
4. The distance measuring device according to claim 3, wherein the control signal includes a first control signal and a second control signal, wherein the first control signal instructs the temperature control device to heat, and the first Two control signals instruct the temperature control device to perform cooling.
5. The distance measuring device according to claim 4, wherein the controller is specifically used to:

   Generating the first control signal when the temperature data is lower than the first target temperature; and

   The second control signal is generated when the temperature data is higher than the second target temperature.
6. The distance measuring device according to claim 1, wherein the distance measuring device further comprises:

   A power detection circuit, which is used to detect the current luminous power data of the transmitter;

   The control module is further configured to control the luminous power of the transmitter to stabilize at the target power based on the comparison result of the current luminous power data and the target power.
7. The distance measuring device according to claim 6, wherein during the heating or cooling process of the temperature control device, the control module is further specifically used for:

   When the comparison result is that the current light emission power data is greater than the target power, controlling the transmitter to lower the voltage to reduce the light emission power of the transmitter to the target power; and

   When the comparison result is that the current light emission power data is less than the target power, the transmitter is controlled to increase the voltage to increase the light emission power of the transmitter to the target power.
8. The distance measuring device according to claim 7, wherein the control module is further specifically configured to control the transmitter to decrease or increase the voltage in proportion.
9. The distance measuring device according to claim 8, wherein the ratio includes a ratio of target power to the current light emission power data.
10. The distance measuring device according to claim 2, wherein the control module is further used to:

    When the temperature data is greater than the second target temperature, controlling the temperature control device to cool at full power; and

    When the temperature data is less than the first target temperature, the temperature control device is controlled to heat at full power.
11. The distance measuring device according to claim 2, wherein the target temperature further comprises a predetermined target temperature, the predetermined target temperature being between the first target temperature and the second target temperature, wherein, When the temperature data is less than the second target temperature and greater than the predetermined target temperature, or when the temperature data is greater than the first target temperature and less than the predetermined target temperature, the control module is further configured to:

    Based on the PID algorithm, the temperature control device is controlled to heat or cool until the temperature data is adjusted to the predetermined target temperature.
12. The distance measuring device according to claim 1, wherein the temperature control device is disposed on the second surface of the circuit board and is opposite to the transmitter, or the temperature control device is disposed on the circuit The first surface of the board is opposite to the emitter, and is located between the second surface of the substrate and the first surface of the circuit board.
13. The distance measuring device according to claim 6, wherein the power detection circuit is provided on the first surface of the circuit board.
14. The distance measuring device according to claim 3, wherein the control circuit and the temperature control device are disposed on the same surface of the circuit board.
15. The distance measuring device according to claim 1, wherein the transmitter includes a laser diode chip for emitting a laser pulse sequence, wherein the laser diode chip and the temperature acquisition module are disposed on the same substrate on.
16. The distance measuring device according to claim 2, 5, 10 or 11, wherein the first target temperature range is between 0° and 50°, and/or the second target temperature range is 0°～50°.
17. The distance measuring device according to any one of claims 1 to 15, wherein the transmitter and the temperature acquisition module are packaged together.
18. The distance measuring device according to any one of claims 1 to 15, wherein the transmitter and the temperature acquisition module are packaged together on the first surface of the substrate.
19. The distance measuring device according to any one of claims 1 to 15, wherein the temperature control device includes a semiconductor refrigerator, and/or, the temperature acquisition module includes a temperature sensor.
20. The distance measuring device according to any one of claims 1 to 15, wherein the distance measuring device includes a laser radar.
21. A mobile platform, characterized in that the mobile platform includes:

    The distance measuring device according to any one of claims 1 to 20; and

    A platform body, the distance measuring device is installed on the platform body.
22. The mobile platform of claim 21, wherein the mobile platform includes a drone, a robot, a car, or a boat.

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