CN107703590A - A kind of optical module and its temprature control method - Google Patents
A kind of optical module and its temprature control method Download PDFInfo
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- CN107703590A CN107703590A CN201710889974.3A CN201710889974A CN107703590A CN 107703590 A CN107703590 A CN 107703590A CN 201710889974 A CN201710889974 A CN 201710889974A CN 107703590 A CN107703590 A CN 107703590A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
- Lasers (AREA)
Abstract
This application provides a kind of optical module and its temprature control method.The application increases a set of second radiating subassembly on the basis of the first radiating subassembly.Controller according to the detection temperature of laser, can control the temperature of the first TEC adjustment lasers, and according to the detection temperature of the pcb board, the temperature of control the 2nd TEC adjustment pcb boards, the operating temperature for making laser and pcb board keep relative stability.In addition, when the temperature of laser alreadys exceed the first TEC adjustment limit, controller can also be according to the detection temperature of laser, start the 2nd TEC, auxiliary adjustment is carried out to the temperature of laser by the 2nd TEC, so as to alleviate the first TEC regulation and control pressure, the ability of the anti-extreme environment of optical module is improved.In addition, the 2nd TEC can enter working condition when the temperature of pcb board or laser exceedes preset value, can save energy resource consumption to a certain extent as a kind of auxiliary heat dissipation element.
Description
Technical field
The application is related to optical-fibre communications field, more particularly to a kind of optical module and its temprature control method.
Background technology
Optical module is that opto-electronic conversion or the important devices of electro-optic conversion are realized in optical fiber telecommunications system, and its enclosed inside has light
Component, and the pcb board electrically connected with optical assembly one end.The other end of optical assembly is connected with external fiber coupling, to realize light
Signal transmission between module and external device (ED).Optical module is commonly applied to outdoor environment, to reduce environment temperature to optical module work
Make the influence of performance, it is internal it is generally necessary to configuration temperature control system.
Fig. 1 is a kind of structural representation of common light emission secondary module.As seen from Figure 1, the light emission secondary module includes
Main casing 1, and it is packaged in optical assembly 3 (including laser LD, lens array, isolator etc.), pcb board 4 inside main casing 1
And temperature control system, wherein, temperature control system includes being used for TEC 501 (semiconductor cooler, the English for adjusting temperature
Full name：Thermo Electric Cooler), and corresponding TEC drive circuits 502.In order to realize that optical module miniaturization needs
Ask, and reduce the influence of the environmental factors such as electromagnetic radiation, optical assembly 3 is generally packaged in inside closed assembly housing 2.In light
In emission secondary module, laser is important photo-electric conversion element, very sensitive to temperature change, therefore, TEC 501 generally with
Laser is together encapsulated in inside assembly housing 2, and is electrically connected by TEC drive circuits 502 with the controller 41 on pcb board 4,
TEC 501 can be freezed or be heated under the control of controller 41, so as to maintain the normal working temperature model of laser
Enclose.
But when light emission secondary module and external device (ED) carry out long distance signal transmission, in order to ensure wavelength of optical signal
And the stability of luminous power, laser usually require laser driving circuit 44 and provide great driving current so that the light
The internal temperature of emission secondary module skyrockets, especially when the light emission secondary module runs (such as -40 DEG C under extreme condition of work
~85 DEG C) when, it is more likely that beyond TEC 501 temperature adjusting ability, the hot unbalance of laser is caused, triggers luminous power to fall
And wave length shift so that optical module can not steady operation in extreme temperature conditions.In addition, too high or too low operating temperature
Also the service life of each electronic component on laser and pcb board 4 can be influenceed so that the application of optical module is by very big
Limitation.
The content of the invention
This application provides a kind of optical module and its temprature control method, to solve existing temperature control system because over long distances
Large-drive-current needed for transmission so that heat is unbalance inside optical module, causes optical module can not meet extreme condition of work technology
Problem.
In a first aspect, this application provides a kind of optical module, the optical module includes：
Main casing, and optical assembly, pcb board and the first radiating subassembly inside the main casing are packaged in, wherein,
The optical assembly includes laser, and controller, the laser and controller electricity are integrated with the pcb board
Connection；
First radiating subassembly is packaged in assembly housing jointly with the optical assembly, and first radiating subassembly includes
First temperature sensor and the first TEC, first temperature sensor are used for the temperature for detecting the laser；
The optical module also includes：Second radiating subassembly,
Second radiating subassembly includes second temperature sensor and the 2nd TEC, and the second temperature sensor is used to examine
Survey the temperature of the pcb board, pcb board and the laser described in the 2nd TEC supports；
The controller is used for the detection temperature according to the laser, controls the first TEC and the 2nd TEC to adjust
The temperature of the whole laser, and the detection temperature according to the pcb board, the 2nd TEC is controlled to adjust the pcb board
Temperature.
Second aspect, present invention also provides a kind of temprature control method of optical module, methods described includes：
According to the detection temperature of laser and the first preset temperature, the first driving current is exported to the first TEC；
Judge whether the detection temperature of pcb board is more than the second preset temperature；
If so, the second positive driving current is then exported to the 2nd TEC；
Otherwise, judge whether the detection temperature of the pcb board is less than the 3rd preset temperature；
If so, the second reverse driving current is then exported to the 2nd TEC, wherein, second preset temperature is more than described
3rd preset temperature；
Judge whether the detection temperature of the laser is less than the 5th preset temperature, the 5th preset temperature is less than described
First preset temperature；
If so, the second reverse driving current is then exported to the 2nd TEC；
Judge whether the detection temperature of the laser is more than the 4th preset temperature, the 4th preset temperature is more than described
First preset temperature；
If so, the second positive driving current is then exported to the 2nd TEC.
The application's has the beneficial effect that：This application provides a kind of optical module and its temprature control method.The application exists
Increase a set of second radiating subassembly on the basis of first radiating subassembly.Controller can control according to the detection temperature of laser
First TEC adjusts the temperature of laser, and according to the detection temperature of the pcb board, the temperature of control the 2nd TEC adjustment pcb boards
Degree, the operating temperature for making laser and pcb board keep relative stability.In addition, the temperature in laser alreadys exceed the first TEC's
When adjusting the limit, controller can also start the 2nd TEC, by the 2nd TEC to laser according to the detection temperature of laser
Temperature carries out auxiliary adjustment, so as to while pcb board normal working temperature is ensured, alleviate the first TEC regulation and control pressure, improves
The ability of the anti-extreme environment of optical module.In addition, the 2nd TEC is as a kind of auxiliary heat dissipation element, can be in the temperature of pcb board or laser
Degree enters working condition when exceeding preset value, can save energy resource consumption to a certain extent.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of the application, letter will be made to the required accompanying drawing used in embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of common light emission secondary module；
Fig. 2 is a kind of Structure explosion diagram for optical module that the embodiment of the present application provides；
Fig. 3 is a kind of structural representation for optical module that the embodiment of the present application provides；
Fig. 4 is a kind of decomposing schematic representation for laser that the embodiment of the present application provides；
Fig. 5 is a kind of method flow diagram for optical module temprature control method that the embodiment of the present application provides；
Symbol represents：
1- main casings, 2- assembly housings, 3- optical assemblies, 31- lasers, 4-PCB plates, 41- controllers, 42- first drive
Circuit, the drive circuits of 43- second, 44- laser driving circuit, the temperature sensors of 51- first, 52- the first TEC, 53- is heat sink,
501-TEC, 502-TEC drive circuit, 61- second temperature sensors, 62- the 2nd TEC, 63- heat-conducting glues.
Embodiment
The application can not meet extreme condition of work for existing temperature control system and make what optical module application was limited
Technical problem, it is proposed that a kind of optical module and its temprature control method.This optical module includes the first radiating subassembly and the second radiating
Component, the first radiating subassembly are packaged in assembly housing 2 jointly with optical assembly 3, are swashed for being adjusted under the control of controller 41
The temperature of light device 31；Second radiating subassembly is used for the temperature that pcb board 4 and laser 31 are adjusted under the control of controller 41.This
The core concept of application is：The application increases a set of second radiating subassembly on the basis of the first radiating subassembly.In laser 31
The adjustment limit of the temperature more than the first TEC52 when, controller 41 can start second according to the detection temperature of laser 31
TEC62, auxiliary adjustment is carried out to the temperature of laser 31 by the 2nd TEC62, so as to ensure the normal working temperature of pcb board 4
While, the first TEC52 of alleviation regulation and control pressure, the ability of the raising anti-extreme environment of optical module.
Referring to Fig. 2 and Fig. 3, shown is respectively a kind of Structure explosion diagram for optical module that the embodiment of the present application provides and sheet
Apply for a kind of structural representation for optical module that embodiment provides.From Fig. 2 and Fig. 3, this optical module includes main casing 1, with
And it is packaged in optical assembly 3, pcb board 4, the first radiating subassembly and the second radiating subassembly inside the main casing 1, the first radiating group
Part is mainly used in adjusting the operating temperature of optical assembly 3, and the second radiating subassembly is mainly used in adjusting the operating temperature of pcb board 4.
The optical module that the present embodiment provides is a kind of smooth emission secondary module, and optical assembly 3 includes laser 31 and and laser
The lens array and isolator that device 31 is of coupled connections, in the present embodiment, lens array can include collimation lens, light multiplexing group
The optical elements such as part, condenser lens and optoisolator, above optical element according to the function and type of optical secondary module not
Together, in the predetermined direction be sequentially arranged in inside assembly housing 2.
Can be integrated on pcb board 4 a variety of electronic components, including controller 41, laser driving circuit, TEC drive circuits with
And amplifying circuit etc., wherein, laser 31 is electrically connected with controller 41, and controller 41 can be sent to electric signal and be converted into light letter
Number, this optical signal is transmitted to external fiber along other optical elements, so as to realize that the signal of optical module and receiving end device transmits.
In the present embodiment, the first radiating subassembly is packaged in assembly housing 2 jointly with optical assembly 3, for adjusting laser
31 operating temperature.First radiating subassembly includes the first temperature sensor 51 and the first TEC52, and the first temperature sensor 51 is with swashing
The surface of light device 31 is in contact, and is electrically connected with controller 41, for the surface temperature of detection laser, and by the detection of laser
Temperature reports to controller 41；First TEC52 one side is in contact with laser 31, and another side is in contact with assembly housing 2, uses
The temperature of laser 31 is adjusted under the control in controller 41.
Second radiating subassembly includes the TEC62 of second temperature sensor 61 and the 2nd, second temperature sensor 61 and pcb board 4
Surface be in contact, and electrically connected with controller 41, for detecting the surface temperature of pcb board 4, and by the detection temperature of pcb board
Report to controller 41；Pcb board 4 and the laser 31 described in the 2nd TEC62 supports, specifically, the one of the 2nd TEC62
Face is in contact with pcb board 4 and laser 31, and another side is in contact with main casing 1, for being adjusted under the control of controller 41
The temperature of pcb board 4 and laser 31.In the present embodiment, second temperature sensor 61 can be the TEMP being independently arranged
Device or the temperature collecting cell being integrated in inside controller 41.
In the present embodiment, the detection temperature for reporting laser can be that the first temperature sensor 51 is actively sent out to controller 41
Censorship thermometric degrees of data or controller 41 actively gather the detection temperature data of the first temperature sensor 51.Pcb board
Reporting for detection temperature reports the principle identical with the detection temperature of laser, repeats no more here.
Include the galvanic couple of two kinds of semi-conducting material compositions in first TEC52, when DC current is by a TEC52, its
Simultaneously freeze, simultaneously absorb heat, form chill surface and heating face.Chill surface and heating face can be determined by the direction of DC current, be made
Cold and heating speed can be determined by the size of DC current.For example, when laser 31 needs refrigeration, can be to the first TEC52
Forward current is exported, now, the face that the first TEC52 is in contact with laser 31 is chill surface, for cooling for laser 31, phase
Reverse side is heating face, and heat caused by heating face can be exported by the heat sink or grade of assembly housing 2 heat-conduction component, with reduction pair
The influence of chill surface refrigeration, so as to obtain refrigeration on the whole；, can be to first when laser 31 needs to heat
TEC52 exports reverse current, and now, the first TEC52 switches to heating face with the face that laser 31 is in contact, for for laser
31 heating, opposing face are chill surface, and chill surface can absorb heat by heat-conduction component, to reduce the influence to heating face, from
And heating effect is obtained on the whole.2nd TEC62 operation principle is similar with the first TEC52, repeats no more here.
In the present embodiment, controller 41 is MCU, it is of course also possible to be that other have calculating, the processing of control function dress
Put.Controller 41 can generate the adjustable pwm signal of dutycycle according to the detection temperature of laser, and be controlled by pwm signal
First TEC52 size of current and direction, so as to control the first TEC52 to be heated or be freezed, and heating and refrigeration
Speed.Specifically, the first TEC52 can be electrically connected by the first drive circuit 42 with controller 41, the first drive circuit 42 it is defeated
Enter end to electrically connect with the output end of the controller 41, output end electrically connects with the binding post of the first TEC.First driving
Circuit 42 can drive the first TEC52 using TEC digital PWMs power driving circuit, and using the switching characteristic of FET, be
First TEC52 provides size precision, the adjustable driving current in direction.
In addition, controller 41 can also generate high level signal or low level signal according to the detection temperature of pcb board, and lead to
Too high low level signal controls the 2nd TEC62 size of current and direction, so as to control the 2nd TEC62 to be heated or made
It is cold, and the speed of heating and refrigeration.Specifically, the 2nd TEC62 can be electrically connected by the second drive circuit 43 with controller 41,
The input of second drive circuit 43 electrically connects with the output end of the controller 41, output end and the 2nd TEC62 terminals
Son electrical connection.Second drive circuit 43 can be using TEC digital PWMs power driving circuit to drive the 2nd TEC62, and is imitated using field
Should pipe switching characteristic, provide that size is accurate, the adjustable driving current in direction for the 2nd TEC62.
Laser 31 is more sensitive for temperature, and the requirement to operating temperature is also more strict, usually requires that operating temperature
Be maintained within the temperature range of 20 DEG C~30 DEG C, this require the first radiating subassembly can fast and accurate adjustment temperature, still
Under extreme temperature environment (- 55 DEG C~90 DEG C), the dynamics and scope of temperature adjusting are easy to the tune beyond the first radiating subassembly
Whole ability, although the 2nd TEC62 can reduce the bulk temperature inside optical module to a certain extent, not and laser
31 are directly contacted, and action intensity is limited, and certain risk is brought for the stable operation of laser 31.Therefore, other are preferred by the application
In embodiment, optical assembly 3 is arranged on the bearing of trend of the pcb board 4, the 2nd TEC62 upper surface and optical assembly 3 and PCB
Plate 4 is in contact, and the 2nd TEC lower surface is in contact with the bottom surface of main casing 1, and so, the 2nd TEC can be in the control of controller 41
The temperature of the lower common adjustment pcb board 4 of system and optical assembly 3, it can effectively alleviate the adjustment pressure of the first radiating subassembly.
First temperature sensor 51, the first TEC52 and laser 31 can have a variety of positions arrangement, for example, can directly by
First TEC52 is arranged at the lower surface of laser 31, and the first temperature sensor 51 is arranged at the upper surface of laser 31, still,
The mode so directly contacted is unfavorable for heat transfer, and on laser 31 each point temperature difference it is also larger, make laser
Detection temperature can not accurately reflect the operating temperature of laser 31 comprehensively, increase the control error of controller 41.In order to carry
The accuracy of the high collecting temperature of first temperature sensor 51, and the first TEC52 thermal conduction effect, the application other embodiment
In to be provided with heat sink 53, heat sink 53 can be the metal material with high thermal conductivity coefficient, such as fine copper.
Referring to Fig. 4, a kind of decomposing schematic representation of laser 31 of the embodiment of the present application offer is shown.From fig. 4, it can be seen that group
In part housing 2, the first TEC52 upper surface is in contact with heat sink 53, the first TEC52 lower surface and the bottom surface of assembly housing 2
It is in contact, the first temperature sensor 51 is located at heat sink 53 upper surface with laser 31.So, when laser 31 needs
During heating, heat caused by the first TEC52 can uniformly, be quickly conducted to the surface of laser 31 by heat sink 53；Similarly,
When laser 31 needs cooling, heat caused by laser 31 can uniformly, be quickly conducted to first by heat sink 53
TEC52 surface.Simultaneously as the first temperature sensor 51 is located at heat sink 53 upper surface with laser 31 so that first
The detection temperature for the laser that temperature sensor 51 gathers more can effectively react the bulk temperature of laser 31, improve temperature and adopt
The accuracy of collection.
In addition, in order to strengthen the heat-conductive characteristic of pcb board 4, in the application other embodiment, can also pcb board 4 with
Heat-conducting glue 63 is set between main casing 1, and the TEC62 of heat-conducting glue 63 and the 2nd is respectively arranged at the both sides of pcb board 4, is led so as to utilize
Hot glue 63 aids in the 2nd TEC62 to carry out temperature adjusting to pcb board 4.
The application increases a set of second radiating subassembly on the basis of the first radiating subassembly.Controller 41 can be according to laser
The detection temperature of device 31, the temperature of control the first TEC52 adjustment lasers 31, and according to the detection temperature of the pcb board 4,
Control the temperature of the 2nd TEC62 adjustment pcb boards 4, the operating temperature for making laser 31 and pcb board 4 keep relative stability.In addition,
When the temperature of laser 31 alreadys exceed the first TEC52 adjustment limit, controller 41 can also be according to the inspection of laser 31
Testing temperature, start the 2nd TEC62, auxiliary adjustment is carried out to the temperature of laser 31 by the 2nd TEC62, so as to ensure PCB
While 4 normal working temperature of plate, alleviate the first TEC52 regulation and control pressure, improve the ability of the anti-extreme environment of optical module.Separately
Outside, the 2nd TEC62 can enter work as a kind of auxiliary heat dissipation element when the temperature of pcb board 4 or laser 31 exceedes preset value
Make state, energy resource consumption can be saved to a certain extent.
Based on the structure of above optical module, the application also provides a kind of temprature control method of optical module, existing for solving
There is temperature control system can not meet extreme condition of work and make the limited technical problem of optical module application.It is shown referring to Fig. 5
A kind of method flow diagram of the optical module temprature control method provided for the embodiment of the present application, its executive agent are in embodiment one
Controller 41.As seen from Figure 5, this method may include following steps：
Step S101：According to the detection temperature of laser and the first preset temperature, to the first TEC outputs the first driving electricity
Stream.
Laser 31 is more sensitive for temperature, and the requirement to operating temperature is also more strict, and therefore, the present embodiment can be set
A target adjustment temperature, i.e. the first preset temperature are put, and controls the first TEC52 work shape in real time using control closed loop circuit
State, accurately to control the operating temperature of laser 31.First preset temperature may be provided between 20~30 DEG C, and the present embodiment is by
One preset temperature is arranged to 25 DEG C.Step S101 specifically may include following steps：
Step S1011：Default PID coefficient, the PID coefficient include proportionality coefficient, integral coefficient and differential coefficient.
Step S1012：The deviation of this sampling is calculated, the deviation is the laser of the first temperature sensor 51 collection
Detection temperature and the difference of the first preset temperature.
Step S1013：According to the PID coefficient and the deviation that this is sampled, the first radiating group next time is calculated
The controlling increment of part, the first positive driving current is exported to the first TEC according to the controlling increment.
PID control is a kind of closed loop control method based on feedback, more can accurately control adjustment increment, so as to essence
Really the first TEC52 of control refrigeration or heats power.Specifically the controlling increment calculation formula can be：
Outvalue=Pset*Et+Iset* (Et-Et1)+Dset* (Et-2*Et1+Et2)
Wherein, Outvalue is the controlling increment calculated by increment type PID algorithm, and Pset, Iset, Dset are respectively
Default proportionality coefficient, integral coefficient and differential coefficient, Et are the deviation of this sampling, and Et1 is the deviation of last sampling,
Et2 is upper sampling deviation twice.The present embodiment calculates controlling increment by increment type PID algorithm, and according to controlling increment
(output quantity) controls the dutycycle of PWM pulse width signals, and then electric to the driving of the first TEC outputs first by the first drive circuit 42
Stream, control the first TEC52 working condition.
Step S102：Judge whether the detection temperature of pcb board is more than the second preset temperature, if the detection of the pcb board
Temperature is more than second preset temperature, then performs step S103；If the detection temperature of the pcb board is less than or equal to institute
The second preset temperature is stated, then performs step S104.
Step S103：Second driving current positive to the 2nd TEC outputs.
Step S104：Judge whether the detection temperature of pcb board is less than the 3rd preset temperature, second preset temperature is more than
3rd preset temperature, if the detection temperature of the pcb board is less than the 3rd preset temperature, perform step S105.
Step S105：Second driving current reverse to the 2nd TEC outputs.
Normal electronics, being capable of the stable operation within the scope of a larger temperature to the less demanding of temperature.Therefore,
The present embodiment can control the 2nd TEC62 running status by the way of timesharing intervention.I.e. when the detection temperature of pcb board is too high or
When person is too low, it is then turned on the 2nd TEC62 and enters corresponding refrigeration or heating state.Such control mode, can not only be
In time starting in the case of larger fluctuation occurs in temperature, protects electronic component not influenceed by temperature fluctuation, can also be certain
Alleviate the first TEC52 regulation and control pressure in degree.In addition, the 2nd TEC62 (second preset temperatures and the 3rd pre- between nonclient area
If between temperature) off working state is in, be advantageous to save power consumption, avoid the energy expense that optical module is unnecessary.
In the present embodiment, the second preset temperature may be configured as 60 DEG C, and the 3rd preset temperature may be configured as 0 DEG C, that is, work as pcb board
Detection temperature when being more than 60 DEG C, show that the temperature of pcb board 4 is too high, now start and simultaneously export positive second to the 2nd TEC and drive
Streaming current, so as to control the 2nd TEC62 to be freezed；When the detection temperature of pcb board is less than 0 DEG C, show the temperature of pcb board 4
It is too low, start and the second reverse driving current is exported to the 2nd TEC, so as to control the 2nd TEC62 of control to be heated；When
When the detection temperature of pcb board is between 0 DEG C~60 DEG C, show the temperature of pcb board 4 in the range of one can receive, this
When close the 2nd TEC62, to avoid unnecessary energy consumption from wasting.Certainly, can also be according to optical mode in the application other embodiment
The practical application scene of block is configured and adjusted.
Because the 2nd TEC62 uses the control mode of timesharing intervention so that the continuity of the 2nd TEC62 work is poor, because
This is, it is necessary to a relatively large driving current, to start the 2nd TEC62 within the as far as possible short time；Further, since second is pre-
If temperature is in an of a relatively high temperature, and the 3rd preset temperature has also been in a relatively low temperature,
The 2nd TEC62 is needed with larger Power operation, to regulate and control the temperature of optical module within the as far as possible short time.
Based on above reason, in the application other embodiment, step S103 includes：If the detection temperature of the pcb board
More than second preset temperature, then the first predetermined level signal is exported to the second drive circuit 43, control the second radiating subassembly
Freezed with peak power.In the present embodiment, the first predetermined level signal is low level signal, i.e. the detection temperature when pcb board
When degree is more than 60 DEG C, MCU output low level signals, this low level signal is after the second drive circuit, to the 2nd TEC outputs just
To electric current, now, the 2nd TEC is freezed with peak power.
Step S105 includes：If the detection temperature of the pcb board is less than the 3rd preset temperature, to the second driving
Circuit 43 exports the second predetermined level signal, and the second radiating subassembly of control is heated with peak power.In the present embodiment, second
Predetermined level signal is high level signal, i.e., when the detection temperature of pcb board is less than 0 DEG C, MCU output high level signals, this is high
Level signal exports reverse current after the second drive circuit, to the 2nd TEC, and now, the 2nd TEC is with peak power system
Heat.
In the present embodiment, the control mode of the second radiating subassembly is simple, effective, without complexity, accurately control flow, energy
It is enough effectively to coordinate with the first radiating subassembly.When environmental temperature fluctuation is larger, or electronic building brick, optical assembly power consumption is excessive causes light
When inside modules temperature rises on foot, easily reach the regulation and control limit of the first radiating subassembly, the temperature operation to laser 31 brings wind
Danger.Further, since the first radiating subassembly is packaged in independent assembly housing 2, its temperature is adjusted primarily directed to laser 31,
Due to the first TEC52 heating, while freeze, therefore, inside whole optical module, its heat is substantially at poised state,
There is no temperature control effect substantially to the pcb board 4 outside assembly housing 2.The design for the second radiating subassembly that the present embodiment provides is lucky
Above-mentioned risk and limitation are compensate for, the 2nd TEC62 is arranged between pcb board 4 and main casing 1, the face being in contact with pcb board 4
Heated or freezed, energy caused by one side is exported to outside from main casing 1 in addition.2nd TEC62 keeps peak power
Temperature adjusting is carried out, the internal temperature of optical module on the basis of simplified control circuit, can be fast and effectively controlled, ensure
The normal working temperature of pcb board 4, make up risk and the limitation of the first radiating subassembly.
Although the 2nd TEC62 can reduce the bulk temperature inside optical module to a certain extent, not and laser
Device 31 directly contacts, and action intensity is limited.Therefore, the 2nd TEC62 upper surface can be in contact with optical assembly 3 and pcb board 4,
2nd TEC62 lower surface is in contact with the bottom surface of main casing 1, and so, the 2nd TEC62 can adjust pcb board 4 and optical assembly simultaneously
3 temperature, so as to effectively alleviate the adjustment pressure of the first radiating subassembly.Based on said structure, if the detection temperature of the pcb board
Degree is less than or equal to second preset temperature, then this method also includes：
Step S106：Judge whether the detection temperature of the laser is more than the 4th preset temperature, if the laser
Detection temperature be more than the 4th preset temperature, then perform step S103.
If the detection temperature of the laser is not more than the 4th preset temperature, step S107 is performed.
In addition, this method also includes：
Step S107：Judge whether the detection temperature of the laser is less than the 5th preset temperature, if the laser
Detection temperature be less than the 5th preset temperature, then perform step S105.
In the present embodiment, the 2nd TEC62 working condition is controlled by the detection temperature of laser and the detection temperature of pcb board
Two conditions, when the detection temperature of pcb board does not meet the 2nd TEC entry condition, it can be opened by the detection temperature of laser
Dynamic 2nd TEC.Wherein, the 4th preset temperature is more than the first preset temperature；5th preset temperature is less than the first preset temperature.Than
Such as, in the present embodiment, the first preset temperature can be 25 DEG C, and the second preset temperature can be 60 DEG C, and the 3rd preset temperature can be 0 DEG C,
4th preset temperature can be 30 DEG C, and the 5th preset temperature can be 20 DEG C.Due to being integrated in the electronic component of pcb board 4 to temperature
Less demanding, therefore, the temperature difference between the second preset temperature (60 DEG C) and the 3rd preset temperature (0 DEG C) is generally larger, works as laser
When the detection temperature of device is 40 DEG C, the detection temperature of pcb board is probably fallen between 0 DEG C~60 DEG C, and can not pass through pcb board
Detection temperature start the 2nd TEC62.But when laser detection temperature be 40 DEG C when, far surpassed the first preset temperature (25 DEG C,
That is the desired control temperature of laser 31), show that the temperature of now laser 31 is too high, the first very possible nothings of TEC52
Method carries out Effective Regulation in a short time.Under scenarios above, the present embodiment can be used as startup by the detection temperature of laser
Condition, start the 2nd TEC62.When the detection temperature of laser is 40 DEG C, more than the 4th preset temperature (30 DEG C), MCU starts
2nd TEC62, and the 2nd TEC62 and the first TEC52 co-ordinations are controlled, while laser 31 is freezed, so as to effectively
Alleviate the first TEC52 temperaturing control pressure, avoid laser 31 because heat is unbalance and trigger luminous power to fall and wave length shift, influence
The stability of optical signal.
In addition, the 2nd TEC62 is while coordinating the first TEC52 to carry out temperature adjusting to laser 31, additionally it is possible to PCB
Electronic component on plate 4 carries out temperature control, and because the 4th preset temperature is usually less than the second preset temperature, the 5th preset temperature is usual
Higher than the 3rd preset temperature, therefore, the temperature control method that the present embodiment provides can be smaller at one by the temperature control of pcb board 4
Within the temperature range of, the situation for occurring larger fluctuation for temperature in optical module provides the sufficient temperature control time, reduces regulation and control failure
Risk.
In the specific implementation, the present invention also provides a kind of computer-readable storage medium, wherein, the computer-readable storage medium can store
There is program, the program may include the part or all of step in each embodiment of method of calling provided by the invention when performing.Institute
The storage medium stated can be magnetic disc, CD, read-only memory (English：Read-only memory, referred to as：ROM) or with
Machine storage memory (English：Random access memory, referred to as：RAM) etc..
It is required that those skilled in the art can be understood that the technology in the embodiment of the present invention can add by software
The mode of general hardware platform realize.Based on such understanding, the technical scheme in the embodiment of the present invention substantially or
Say that the part to be contributed to prior art can be embodied in the form of software product, the computer software product can be deposited
Storage is in storage medium, such as ROM/RAM, magnetic disc, CD, including some instructions are causing a computer equipment (can be with
Be personal computer, server, either network equipment etc.) perform some part institutes of each embodiment of the present invention or embodiment
The method stated.Invention described above embodiment is not intended to limit the scope of the present invention..
Claims (9)
1. a kind of optical module, including：Main casing, and it is packaged in optical assembly, pcb board and the first radiating inside the main casing
Component, wherein,
The optical assembly includes laser, and controller is integrated with the pcb board, and the laser is electrically connected with the controller
Connect；Characterized in that,
First radiating subassembly is packaged in assembly housing jointly with the optical assembly, and first radiating subassembly includes first
Temperature sensor and the first TEC, first temperature sensor are used for the temperature for detecting the laser；
The optical module also includes：Second radiating subassembly,
Second radiating subassembly includes second temperature sensor and the 2nd TEC, and the second temperature sensor is used to detect institute
State the temperature of pcb board, pcb board and the laser described in the 2nd TEC supports；
The controller is used for the detection temperature according to the laser, controls the first TEC and the 2nd TEC adjustment institute
The temperature of laser, and the detection temperature according to the pcb board are stated, controls the 2nd TEC to adjust the temperature of the pcb board
Degree.
2. optical module according to claim 1, it is characterised in that bearing of trend of the optical assembly along the pcb board is set
Put, the upper surface of the 2nd TEC is in contact with the optical assembly and the pcb board, the lower surface of the 2nd TEC with it is described
The bottom surface of main casing is in contact, and the 2nd TEC is used to adjust the pcb board and the light group under the control of the controller
The temperature of part.
3. optical module according to claim 1, it is characterised in that first radiating subassembly also include it is heat sink, described the
One TEC upper surface with it is described it is heat sink be in contact, the lower surface of the first TEC is in contact with the bottom surface of the assembly housing,
First temperature sensor is located at the heat sink upper surface with the laser.
4. optical module according to claim 1, it is characterised in that the optical module also includes the first drive circuit and second
Drive circuit, wherein,
The input of first drive circuit electrically connects with the output end of the controller, the output end and described first
TEC binding post electrical connection, for export according to the controller pwm signal output the first driving current, described first
Driving current is used to drive the first TEC to be freezed or heated；
The input of second drive circuit electrically connects with the output end of the controller, the output end and described second
TEC binding post electrical connection, for the predetermined level signal exported according to the controller, exports the second driving current, institute
The second driving current is stated to be used to drive the 2nd TEC to be freezed or heated.
5. optical module according to claim 4, it is characterised in that
When first driving current is forward drive current, for driving the first TEC to be heated；
When first driving current is reverse drive electric current, for driving the first TEC to be freezed；
When second driving current is forward drive current, for driving the 2nd TEC to be heated；
When second driving current is reverse drive electric current, for driving the 2nd TEC to be freezed.
6. a kind of temprature control method of optical module, it is characterised in that methods described includes：
According to the detection temperature of laser and the first preset temperature, the first driving current is exported to the first TEC；
Judge whether the detection temperature of pcb board is more than the second preset temperature；
If so, the second positive driving current is then exported to the 2nd TEC；
Otherwise, judge whether the detection temperature of the pcb board is less than the 3rd preset temperature；
If so, the second reverse driving current is then exported to the 2nd TEC, wherein, second preset temperature is more than the described 3rd
Preset temperature；
Judge whether the detection temperature of the laser is more than the 4th preset temperature, the 4th preset temperature is more than described first
Preset temperature；
If so, the second positive driving current is then exported to the 2nd TEC；
Judge whether the detection temperature of the laser is less than the 5th preset temperature, the 5th preset temperature is less than described first
Preset temperature；
If so, the second reverse driving current is then exported to the 2nd TEC.
7. according to the method for claim 6, it is characterised in that described according to the detection temperature of laser and the first default temperature
Degree, exporting the first driving current to the first TEC includes：
Default PID coefficient, the PID coefficient include proportionality coefficient, integral coefficient and differential coefficient；
Calculate the deviation of this sampling, the deviation is the detection temperature of the laser of the first temperature sensor collection and first pre-
If the difference of temperature；
According to the PID coefficient and the deviation that this is sampled, the controlling increment of the first radiating subassembly next time, root are calculated
According to the controlling increment to the first adjustable pwm signal of drive circuit output duty cycle.
8. according to the method for claim 6, it is characterised in that if the detection temperature of the pcb board is more than described
Second preset temperature, then exporting the second driving current to the 2nd TEC includes：
It is default to the second drive circuit output first if the detection temperature of the pcb board is more than second preset temperature
Level signal, the second radiating subassembly of control are freezed with peak power.
9. according to the method for claim 6, it is characterised in that if the detection temperature of the pcb board is less than described
3rd preset temperature, then exporting the second reverse driving current to the 2nd TEC includes：
It is default to the second drive circuit output second if the detection temperature of the pcb board is less than the 3rd preset temperature
Level signal, the second radiating subassembly of control are heated with peak power.
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| CN201710889974.3A CN107703590A (en) | 2017-09-27 | 2017-09-27 | A kind of optical module and its temprature control method |
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| CN111684298A (en) * | 2019-01-09 | 2020-09-18 | 深圳市大疆创新科技有限公司 | Distance measuring device and mobile platform |
| CN113629485A (en) * | 2021-08-05 | 2021-11-09 | 尚宁光电无锡有限公司 | Temperature drift control method of optical communication active device |
| CN114447760A (en) * | 2021-12-07 | 2022-05-06 | 金雷 | Temperature control optical module and working method thereof |
| CN114764170A (en) * | 2021-01-13 | 2022-07-19 | 青岛海信宽带多媒体技术有限公司 | Method and device with health record function and optical module |
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