CN206992473U - The temperature control equipment of ROF radio frequency fiber optic transmitting modules is integrated for multichannel - Google Patents
The temperature control equipment of ROF radio frequency fiber optic transmitting modules is integrated for multichannel Download PDFInfo
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- CN206992473U CN206992473U CN201720781984.0U CN201720781984U CN206992473U CN 206992473 U CN206992473 U CN 206992473U CN 201720781984 U CN201720781984 U CN 201720781984U CN 206992473 U CN206992473 U CN 206992473U
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- semiconductor cooler
- laser
- heat sink
- temperature control
- radio frequency
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Abstract
The utility model provides a kind of temperature control equipment that ROF radio frequency fiber optic transmitting modules are integrated for multichannel, the device includes first order semiconductor cooler, second level semiconductor cooler and metal heat sink, the multichannel, which integrates ROF radio frequency fiber optic transmittings module, includes laser component and shell, the first order semiconductor cooler is located in laser component, the metal heat sink is located at below laser component, the second level semiconductor cooler is located at below metal heat sink, the hot face of second level semiconductor cooler is Nian Jie with shell, huyashi-chuuka (cold chinese-style noodles) is close to metal heat sink.The utility model has used two-stage conductor refrigeration, can preferably realize that laser temperature is stable, so as to realize the stable output of laser emission wavelength.
Description
Technical field
Domain of control temperature is the utility model is related to, being used for multichannel more particularly, to one kind integrates the transmission of ROF radio frequency fiber optics
The temperature control equipment of transmitter module.
Background technology
Currently have frequency microwave ROF sending modules, the input of radiofrequency signal all the way typically used is modulated to light all the way
Launch transmission in fibre, its used laser is typically Distributed Feedback Laser, and operating temperature range is usually -40 DEG C~70 DEG C, very
To larger range of -55 DEG C~70 DEG C.To ensure that laser emission wavelength meets to apply the wavelength in the integrated lower wave multiplexer of multichannel
Window requirement, will typically be adjusted to chip of laser operating temperature, make its work in a certain temperature conditions so that hair
The wavelength for penetrating output reaches the operation wavelength of requirement.To enable laser to obtain comparatively ideal operating ambient temperature, generally
It is to use semiconductor cooler to provide stable temperature environment for laser works.
Under some industrial environments, it is desirable to low to -40 DEG C even lower to -55 DEG C of operating temperature, and be to ensure laser
Launch wavelength is stablized and reaches the technical requirement of the lower wave multiplexer window wavelength of multichannel application multiplex transmission, it is desirable in laser
Portion's chip of laser operating ambient temperature maintains+50 DEG C or so, and so the operating temperature range of semiconductor cooler is brought
Harsh requirement.And the semiconductor cooler that current industry is usually used, its hot and cold general maximum of face operating temperature difference is 70
Degree left and right, thus under wide temperature range requirement, how to realize that the reliably working of semiconductor cooler brings problem, generally
The Level One semiconductor refrigerator temperature control equipment used can not meet the temperature stabilization requirement under such wide temperature range.
Utility model content
The purpose of this utility model is：The problem of existing for prior art, there is provided one kind is used for the integrated ROF of multichannel and penetrated
The temperature control equipment of frequency optical fiber transmitting module, -55 DEG C~70 can not be met by solving existing frequency microwave ROF sending modules
The problem of temperature stabilization control DEG C so under wide temperature range.
The purpose of this utility model is achieved through the following technical solutions：
A kind of temperature control equipment that ROF radio frequency fiber optic transmitting modules are integrated for multichannel, the device include first
Level semiconductor refrigerator, second level semiconductor cooler and metal heat sink, the multichannel integrate ROF radio frequency fiber optic transmitting moulds
Block includes laser component and shell, and the first order semiconductor cooler is located in laser component, and the metal heat sink is set
Below laser component, the second level semiconductor cooler is located at below metal heat sink, second level semiconductor cooler
Hot face is Nian Jie with shell, huyashi-chuuka (cold chinese-style noodles) is close to metal heat sink
Preferably, the laser component is provided with four, the first order semiconductor cooler in every two laser components
Controlled after series connection by a temperature control drive circuit, second level semiconductor cooler is controlled by a temperature control drive circuit.
Preferably, the laser component includes producing the chip of laser of transmitting optical maser wavelength, the output of laser backlight
Detection chip, thermistor, first order semiconductor cooler, signal connection subcarrier and optical lens module.
Compared with prior art, the utility model has used two-stage conductor refrigeration, can preferably realize laser temperature
Degree is stable, so as to realize the stable output of laser emission wavelength.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
The utility model is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment
The utility model uses two-stage semiconductor cooler scheme, and wherein first order semiconductor cooler is separately mounted to four
In individual independent laser component, second level semiconductor cooler is placed on road and integrates ROF radio frequency fiber optic transmitting modules
In complete machine.To reduce the installation requirement that circuit devcie quantity meets smaller space, the present invention program is by first order conductor refrigeration
Device is used in series, and the semiconductor cooler of the second level uses single drive control circuit, has so used three solely
Vertical semiconductor cooler drive circuit.
Specifically, the utility model provides a kind of temperature control that ROF radio frequency fiber optic transmitting modules are integrated for multichannel
Device processed, as shown in figure 1, the device includes first order semiconductor cooler, second level semiconductor cooler 5 and metal heat sink 4.
Multichannel, which integrates ROF radio frequency fiber optic transmittings module, includes laser component 1 and shell.First order semiconductor cooler is located at sharp
In light device part 1, metal heat sink 4 is located at the lower section of laser component 1, and second level semiconductor cooler 5 is located under metal heat sink 4
Side, the hot face of second level semiconductor cooler 5 is Nian Jie with shell, huyashi-chuuka (cold chinese-style noodles) is close to metal heat sink.Laser component 1 is provided with four,
After first order semiconductor cooler out of left first, second laser component of number is connected by circuit 2, by external one
Temperature control drive circuit is driven control, and the TEMP of temperature control circuit is derived from second laser component；From left number the 3rd,
After first order semiconductor cooler in 4th laser component is connected by circuit 3, electricity is driven by an external temperature control
Road is driven control, and the TEMP of temperature control circuit is derived from No. threeth laser.Second level semiconductor cooler uses one
Individual temperature control drive circuit is driven control, and the TEMP of temperature control circuit is derived from first or the 4th in four lasers
In temperature sensor.
Laser component 1, it is sealing structure using general laser emission element, it is main to include producing transmitting laser
The chip of laser of wavelength, laser backlight output detection chip, thermistor, first order semiconductor cooler, signal connection
The parts such as subcarrier, optical lens module are formed.
This programme has used two-stage conductor refrigeration, and the first order carries out temperature control inside laser, works as environment temperature
The operating point temperature of laser setting is increased to over, such as at 50 DEG C, first order semiconductor cooler controls according to TEMP,
The face for placing chip of laser is freezed (huyashi-chuuka (cold chinese-style noodles)), heat caused by laser works is quickly transmitted to conductor refrigeration
The another side (hot face) of device, hot face is connected with laser shell to be conducted heat on shell, shell and the heat sink company in module
Connect, conduct the heat on heat sink.
Equivalent to one fin of metal heat sink, it is on the other hand heat sink to put again below at this moment on the one hand by heat loss through radiation
Second level semiconductor cooler is equipped with, is at this moment controlled also according to the TEMP in laser, to second level semiconductor cooler
Freezed, its huyashi-chuuka (cold chinese-style noodles) contacts with metal heat sink is transmitted to the another of second level semiconductor cooler by the heat on metal heat sink
Face (hot face), accelerate the export of heat sink upper heat, at this moment the shell of the hot face connection ROF modules of second level semiconductor cooler
On, by shell and with the rack rail of cage connection etc., heat can be achieved and quickly conduct and distribute so that laser work
Make temperature reduces and stably on the operating temperature point of setting as early as possible；Because operating point temperature is higher (such as 50 DEG C), work as maximum
When temperature is reached at 70 DEG C, semiconductor cooler can increase driving current by drive circuit and increase refrigeration work consumption, but its is hot and cold
The face temperature difference is not up to maximum of 70 degree more than it, as long as thus laser works point temperature setting is reasonable under high temperature, generally
Will not be problematic.
When environment temperature declines, when temperature is less than operating point temperature (such as 50 DEG C) that laser is set, at this moment partly lead
Body refrigerator changes direction of current flow under drive circuit driving, is changed to heating operations, first order semiconductor cooler one is
The face (hot face) that laser is placed by being conducted heat to face (huyashi-chuuka (cold chinese-style noodles)) refrigeration for connecting shell is heated to laser,
Hot face is directly heated second, being flowed through by electric current, laser. operating temperature is increased.
Second level semiconductor cooler controls also according to temperature sensor in laser, also changes under drive circuit driving
Direction of current flow carries out heating operations, first, face (huyashi-chuuka (cold chinese-style noodles)) refrigeration for connecting ROF module housings is conducted heat to and heat
Heat sink temperature is lifted on the face (hot face) of heavy connection, while directly hot face is heated by electric current flowing, in low temperature and laser
Under device operating point temperature spread is little, this heating operations will soon reach laser. operating temperature requirement, keep laser
Launch wavelength is stable, but when low temperature be reduced to -30 DEG C it is even lower when, at this moment environment temperature and operating point temperature (such as 50 DEG C)
More than 70 degree, if only using Level One semiconductor refrigerator, even if at this moment increasing driving current under the peak power of refrigerator,
Because cold and hot surface temperature difference index is no more than 70 degree, the hot-face temperature for causing laser to connect can not continue stabilization, can only follow
Environment temperature to decline and reduce, laser emission wavelength will be caused to drift about；
At this moment the effect just embodied using two-stage semiconductor cooler, first second level semiconductor cooler are first right
It is heat sink to be heated, lift heat sink temperature, that is, with the environment temperature that ROF shells are joined directly together carried out necessarily every
From, and the first order semiconductor cooler in laser at this moment through the second level semiconductor cooler heating after, connect it is heat sink
Shell would not be so big with laser internal difference in temperature so that the cold and hot surface temperature difference of the first order semiconductor cooler in laser
Reduce not over 70 degree, thus can realizes that temperature stabilization is realized in the face of connecting laser by temperature control circuit, so as to real
The stable output of existing laser emission wavelength.
Preferred embodiment of the present utility model is the foregoing is only, not to limit the utility model, should be referred to
Go out, all made within spirit of the present utility model and principle all any modification, equivalent and improvement etc., all should include
Within the scope of protection of the utility model.
Claims (3)
- A kind of 1. temperature control equipment that ROF radio frequency fiber optic transmitting modules are integrated for multichannel, it is characterised in that the device Including first order semiconductor cooler, second level semiconductor cooler and metal heat sink, the multichannel integrates ROF radio frequency fiber optics and passed Defeated transmitter module includes laser component and shell, and the first order semiconductor cooler is located in laser component, the gold Belong to heat sink to be located at below laser component, the second level semiconductor cooler is located at below metal heat sink, the second level semiconductor The hot face of refrigerator is Nian Jie with shell, huyashi-chuuka (cold chinese-style noodles) is close to metal heat sink.
- A kind of 2. temperature control dress that ROF radio frequency fiber optic transmitting modules are integrated for multichannel according to claim 1 Put, it is characterised in that the laser component is provided with four, the first order semiconductor cooler string in every two laser components Controlled after connection by a temperature control drive circuit, second level semiconductor cooler is controlled by a temperature control drive circuit.
- A kind of 3. temperature control dress that ROF radio frequency fiber optic transmitting modules are integrated for multichannel according to claim 1 Put, it is characterised in that the laser component includes producing the chip of laser of transmitting optical maser wavelength, the output inspection of laser backlight Survey chip, thermistor, first order semiconductor cooler, signal connection subcarrier and optical lens module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720781984.0U CN206992473U (en) | 2017-06-30 | 2017-06-30 | The temperature control equipment of ROF radio frequency fiber optic transmitting modules is integrated for multichannel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720781984.0U CN206992473U (en) | 2017-06-30 | 2017-06-30 | The temperature control equipment of ROF radio frequency fiber optic transmitting modules is integrated for multichannel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206992473U true CN206992473U (en) | 2018-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720781984.0U Active CN206992473U (en) | 2017-06-30 | 2017-06-30 | The temperature control equipment of ROF radio frequency fiber optic transmitting modules is integrated for multichannel |
Country Status (1)
| Country | Link |
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| CN (1) | CN206992473U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112701561A (en) * | 2020-12-30 | 2021-04-23 | 深圳市利拓光电有限公司 | Packaging structure and packaging method of high-speed 25G semiconductor laser chip |
| CN113747774A (en) * | 2021-10-11 | 2021-12-03 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling system and use method thereof |
-
2017
- 2017-06-30 CN CN201720781984.0U patent/CN206992473U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112701561A (en) * | 2020-12-30 | 2021-04-23 | 深圳市利拓光电有限公司 | Packaging structure and packaging method of high-speed 25G semiconductor laser chip |
| CN112701561B (en) * | 2020-12-30 | 2022-02-22 | 深圳市利拓光电有限公司 | Packaging structure and packaging method of high-speed 25G semiconductor laser chip |
| CN113747774A (en) * | 2021-10-11 | 2021-12-03 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling system and use method thereof |
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