CN102385124A - Internal-cooled heat-blocking modular laser packaging system - Google Patents
Internal-cooled heat-blocking modular laser packaging system Download PDFInfo
- Publication number
- CN102385124A CN102385124A CN2011103054993A CN201110305499A CN102385124A CN 102385124 A CN102385124 A CN 102385124A CN 2011103054993 A CN2011103054993 A CN 2011103054993A CN 201110305499 A CN201110305499 A CN 201110305499A CN 102385124 A CN102385124 A CN 102385124A
- Authority
- CN
- China
- Prior art keywords
- package
- laser
- box
- heating radiator
- individual laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Provided is an internal laser module, which has substantially the same high performance as a conventional internal-cooled laser module and also has the advantages of improved cost efficiency and manufacturability. In the internal-cooled laser module, laser subassemblies of a coaxial semiconductor laser are arranged on a thermoelectric cooler cooling substrate which is packaged in a box with appropriate patterns. The thermoelectric cooler cooling substrate has several other assembles. The technology and the design principle are suitable to increase the heat insulation and photoelectric parameters of the internal-cooled laser module, so as to increase or optimize the performance stability of a laser within the wide temperature dynamic range.
Description
The cross reference of related application
That the present invention requires to submit on August 25th, 2010 and denomination of invention is the U.S. Provisional Patent Application No.61/337 of the modular laser device package system of heat-seal " inner colded, ", 059 right of priority and interests, and quote it as a reference at this.
Background technology
Semiconductor laser is widely used in multiple use.The performance of semiconductor laser is acted upon by temperature changes.If environment temperature changes, the optics of semiconductor laser and electrical parameter also will change and worsen the performance of laser instrument.In order to satisfy application conditions and the needs of in wide temperature range, operating, usually semiconductor laser is encapsulated and is categorized into three main cooling types, promptly non-cooling, inner cooling and external refrigeration.Briefly, non-cooling system comprises chip of laser and the opticator that is installed in the same enclosure, and does not have cooling device.An example of non-cooling system is the coaxial semiconductor laser instrument.The external refrigeration system comprises the cooling device on being installed in outside the laser diode shell.In addition, inner cooling system comprises laser diode chip, opticator and is installed in the cooling device in the same enclosure.An example of inner cooling system is a metal butterfly laser instrument.
As known, the encapsulation of uncooled laser device does not comprise any active cooling package.Change such as wavelength, output power, electricity to laser activities such as luminous power transformation efficiency is perhaps out in the cold when using, and perhaps feeds back through electricity or light to compensate.An example of uncooled laser device encapsulation is a coaxial packaging, and is as shown in Figure 2, and wherein chip of laser 1 and monitor photo-diode 2 are installed in the transistor package (TO) 3, and by lens cap 5 sealings.Use lens 6 that laser coupled is advanced in optical fiber 9 or the fiber stub.The optical fiber coupling unit is by sleeve pipe 7 and plastic tube 8 protections.Because TO head and lens cap are used for CD or DVD laser instrument by a large amount of production, thereby it is very low to encapsulate this packaging cost with respect to butterfly.Yet, the almost direct and environment temperature variation variation pro rata of chip of laser temperature.
For the application that requires laser instrument under controllable temperature, to work, can external refrigeration be applied to other uncooled laser device encapsulation.Common use or the description in invention formerly in industry of such external refrigeration laser module; As with the open No.2007/0189677 of the United States Patent (USP) of Murry etc. for example, wherein coaxial laser encapsulation inner clamps is provided with the heating radiator that is fixed to outside TEC.The external circuit board further is connected to coaxial laser to adapt to other areal coverage.Yet the external refrigeration individual laser package is worked under overtemperature unlike inside cooling encapsulation is such well.For example, the butterfly individual laser package can easily obtain 50 ℃ the temperature difference between chip of laser and surrounding environment, and shown in Fig. 1 curve 2, by contrast, the encapsulation of conventional external cooling laser device can only obtain 30 ℃ or the littler temperature difference.This structure also causes the inefficient work of TEC, and thereby consumes more power than butterfly individual laser package significantly.
Typically, inner cooling laser device encapsulation allows through automatic temperature-adjusting control compensation variation of ambient temperature the semiconductor laser diode chip to be worked under fixed temperature.Usually, temperature control is to realize through intraware, and for example thermoelectric (al) cooler (TEC) and electric heating are regulated sensor, and wherein electric heating adjusting sensor is worked under from the backfeed loop of external power circuit.
An example of inner cooling laser device encapsulation is the encapsulation that is described as 14-pin " butterfly encapsulation " usually, and is as shown in Figure 3.This module comprises laser diode 1, back monitor photo-diode 2 and thermistor 3, and it all is installed on the heat conductance subbase platform 9, is welded to the cold side of TEC8 successively.The coupling assembly that is used to improve lens and the optical isoaltion structure 7 of optical property also is soldered to identical TEC8 and goes up to keep identical with the temperature of chip of laser.Also can make up in the module with helping to isolate DC and RF and output to the electrical bias T and the radio frequency impedance matching circuit of laser diode.If owing to be exposed to moisture, laser diode and monitor photo-diode can be degenerated, therefore having all, the butterfly encapsulation of its intraware is typically sealed.Thereby whole butterfly packaging body is processed by metal and stupalith.
Summary of the invention
In the present invention, a kind of inner laser device module is disclosed.Inner laser device module can provide the similar high-performance that is provided as conventional internal cooling laser device module, and has the cost efficiency and the manufacturability of raising.In exemplary inside cooling laser device module; As being installed on thermoelectric (al) cooler (TEC) cooling base for the laser instrument sub-component of coaxial semiconductor laser instrument, wherein thermoelectric (al) cooler cooling base portion has several other interior assemblies of designed enclosures rightly that are included in.Technology and design concept are suitable for increasing the thermal insulation and the photoelectric parameter of inner cooling laser device module, so that increase or maximization stablizing in wide temperature dynamic scope inner laser device performance.
For the laser instrument that comprises TEC in the enclosure is installed, have two main thermals source.The first main thermal source is the heat energy that is produced by chip of laser, and second thermal source is to be transferred to the heat energy on the laser instrument, for example surrounding air by thermal source on every side.The former is direct and laser bias current is proportional, and the temperature difference between the latter and laser instrument and the surrounding environment is proportional, and wherein temperature difference is to drive heat energy to be transferred to the power on the laser instrument.
Usually, the exterior circumferential thermal source that relates to thermal stability appears at has three kinds of main heat energy transmission modes in the thermoelectric-cooled laser module.Three kinds of main modes are: 1) thermal conductance or diffusion; 2) convection current; 3) radiation.Thermal conductance technology conducts to the inner surface of shell, inner surface circumference air then with external heat.This technology can produce air convection current or even directly with heat radiation to laser module.The interior at interval filling insulation media of inside modules can reduce these thermal process to be taken place.Media with high thermal resistance can reduce convection effects and radiation, makes heat conducting generation minimization therebetween.In laser module; When the whole heat energy that comprise the heat energy that is flow to by thermal source (for example air) on every side appear on the laser assembly; Heat transfer will reach steady state (SS), and the heat energy that produced by laser bias current of time per unit equals the amount being drawn and distributed by TEC.The ratio of the heat energy that heat energy that time per unit flows to and time per unit are drawn and distributed by the TEC refrigeratory can represent that how high the temperature difference between chip of laser and the surrounding environment is.Ratio is high more, and the ambient temperature that then laser instrument can works fine is higher.Among the present invention, described several novel technology and method, it provides the relative high thermal stability with traditional expensive metal butterfly laser module, novel low-cost external refrigeration laser module.
About the cost contrast, inner cooling encapsulation is the most expensive, secondly is the external refrigeration encapsulation, and non-on the contrary cooling encapsulation is the most cheap usually.Each embodiment described here provides low-cost, inner cooling semiconductor laser package system, it has combined effective heat management and good radio frequency signals transmission between external bias circuit and the laser diode.The example package system comprises: the heat-seal shell; The optically-coupled subsystem; Preferably be positioned near the heating radiator of thermal source; Thermal sensor; Thermoelectric (al) cooler; And biasing circuit.This combined feature is the low-power consumption when keeping the constant working temperature of laser instrument and causes practicing thrift significant amount of energy.In addition, can further strengthen RF and optical property through the element in the adjustment biasing circuit.
Description of drawings
Through making more comprehensively understanding to the present invention with reference to detail specifications that combines accompanying drawing and claim, wherein run through the identical reference marker of full text and represent similar structure, and:
Fig. 1 representes to be used to contrast the curve map of the cooling performance that has laser module and exemplary laser device module now;
Fig. 2 representes existing uncooled laser device encapsulation;
Fig. 3 is existing inner cooling butterfly individual laser package;
Fig. 4 representes the exploded view of the inner cooling laser device of exemplary laser device package system;
Fig. 5 representes the exploded view of the inner cooling laser device of another exemplary laser device package system;
The example embodiment of the under(-)chassis that Fig. 6 representes to be cut open;
Fig. 7 representes the exploded view of exemplary internal laser assembly;
The example embodiment of Fig. 8 indication circuit plate;
Fig. 9 representes to have the example embodiment of the circuit board of radio frequency connector;
Figure 10 representes that the positive radio frequency of example connects the exploded view of Optical Maser System shell; And
Figure 11 representes to be used for the example embodiment of the support that the turning is arranged of inner cooling laser device encapsulation.
Embodiment
According to various functional modules and various processing step the present invention is described at this.Should be understood that this functional module can be by the material of any amount or the construction package that is configured to carry out appointed function realize.For example, the present invention can adopt various assemblies and the material that is fit to structure for various purposes.Yet,, example embodiment of the present invention is described in this connecting inner cooling laser device module just to purpose of description.
The present invention relates to use with respect to as be the apparatus and method of the conventional internal cooling laser device module compactness of metal butterfly laser module and cheap laser module.Laser module is configured to control and management is adiabatic and conduction.An example embodiment relates at high temperature can provide the inside of highly stable performance cooling laser device package system.
Fig. 1 representes the temperature variation of the typical laser chip that changes with surrounding environment of 4 types individual laser package.In Fig. 1 (the temporary transient temperature variation that produces by laser bias current of ignoring), curve 1 expression uncooled laser device module, it demonstrates because module has temperature control capability not at all, thus chip temperature and ambient temperature increase fast.The exemplary distribution of curve 2 expression conventional external cooling laser device modules, wherein very limited the and maximum temperature difference scope of the control ability of chip temperature is about and has 20 ℃, and its reference work temperature is 25 ℃.Curve 3 demonstrates the very strong temperature stability with respect to the inner cooling laser device of traditional metal butterfly module chip of laser, and has 50-55 ℃ temperature range.Curve 4 expression is based on the novel inside cooling laser device module of technology described in the invention, the temperature range that it has typically～45 ℃.The main difference of the temperature relation between the laser module of these types is by individual laser package being advanced Module Design and technical basic difference causes.
An example embodiment comprises the frame-box of an integral body, and it is equipped with optical coupling assembly, thermoelectric (al) cooler, temperature sensor and circuit, makes its thermal behavior be similar to the butterfly individual laser package.
In different example embodiment, inner cooling laser device package system comprises an internal optics coupled subsystem, and this internal optics coupling assembly is being connected light source (for example laser diode), coupling optical device and optical fiber.Laser diode can be sealed in the air-tight packaging, for example transistor package head and lid.The transistor package head can be monitor photo-diode and thermal sensor with other interior assembly of lid.Lid can have the built-in lens that are used to be coupled from the light of laser instrument to optical fiber.Optical fiber extends and terminates to optical conenctor from shell.Before getting into optical fiber, the isolation body can be set in the laser fiber path.Optical fiber can be the perhaps multimode of single mode.These parts can be similar to independent uncooled laser device product, wherein independent uncooled laser device product with provide by other people those are similar with the PLMR series that originates from AGx technology company.
According to example embodiment and with reference to figure 4, laser assembly 1 is similar to uncooled laser device encapsulation, and comprise optical coupling assembly 10, transistor package (TO) 19, optical fiber with pin 11 draws (fiber-out) end 20 and stand 21.In addition, laser assembly 1 further comprises chip of laser and monitor photo-diode, is similar to the assembly of describing with reference to figure 2.Though what Fig. 4 described is four-limbed laser assembly 1, other embodiment of laser assembly 1 also can use three pins or five pins.
In different example embodiment, laser assembly 1 can be installed on the turning support 2 through eutectic temperature scolder and/or pyroconductivity resin.What contact with the bottom that turning support 2 is arranged is thermoelectric (al) cooler (TEC) 4.In various embodiment, there is turning support 2 to be designed to allow the pin 11 of laser assembly 1 to pass support.There is turning support 2 to comprise and is used for pin or cuts the through hole that permission pin 11 partly passes.Further, have turning support 2 can comprise thermistor access point 13, thermistor access point 13 is designed for fixedly thermistor.Thermistor is the temperature-sensing element that is made up of the sintered semiconductor material, for the temperature-sensing element temperature slightly change can make its resistance produce huge change.In addition, if thermal sensor not in the TO head, then can embed or be fixed to the heating radiator of the effective temperature control that is used under the external feedback.
Continuation is with reference to figure 4, and TEC 4 can be between bottom that turning support 2 is arranged and heating radiator 6.The TEC of mounted inside adjusts heat radiation according to ambient temperature usually automatically, so that keep chip of laser under the appointment steady temperature, to work.Keep constant working temperature to prevent that usually the thermal induction of the laser characteristics of laser instrument from changing, for example the luminous power transformation efficiency of wavelength, output power, electricity to light etc.In addition, for wide-band applications, lead-in wire 23 can be used to provide the suitable ground connection of TEC 4.
Various embodiment comprises and is used to isolate intraware with extraneous and as the frame-box of the integral body of the part of thermal sub-system.Can adopt any suitable material to make this frame-box, for example metal or plastics.Prevent advection heat transmission in order to improve insulator, use soft and adiabatic O-ring seal comes seal box, those that for example make by the closed chamber silicone foams.This has constituted a hot system of sealing, uses the hot system help of sealing for the temperature stabilization laser diode temperature performance needs are provided.
Refer again to Fig. 4, laser module 1 and the support 2 that the turning is arranged can be sealed in the combination box that comprises bottom bracket 7, upper cap 14 and heat sink 6.Heat sink 6 can separate with bottom bracket 7 and fix simply, maybe can be integrated in the bottom bracket 7.In example embodiment, the heat that laser diode chip produces during operation sheds through the TO head.At that, heat is propagated the high thermal conductance heating radiator that into is fixed to the TO head effectively.Radiator material can be made up of high heat-conducting ceramic, and for example aluminium nitride also can be made up of high-thermal conductive metal, for example copper, copper tungsten, brass, bronze or other suitable metal.This structure can form low thermal resistance between laser instrument and heating radiator.
In various embodiment, optical subsystem and fiber optic point side flatly are provided with to keep the individual laser package profile low.TEC 4 is horizontally disposed with extract heat under optical subsystem in vertical direction.The heat of support 2 main transmission in turning from box to the upper board of TEC 4 of optical subsystem is arranged.Epoxy resin or scolder can be used for there being the turning support to be fixed on the upper board of TEC.The downside of TEC can be led on the substrate 6 through the height that scolder or resin are fixed to box.
Example embodiment comprises the heat sink of being processed by high-thermal conductive metal (for example copper, copper tungsten, brass, bronze or other suitable metal) and constitute the substrate of seal box 6.In the embodiment of different laser device encapsulation, box and metallic heat radiating plate 6 can be thermally connected to external heat sink.In this embodiment, to substrate exert pressure so that its interface remain valid ground heat transfer.Through hole (or other suitable structure) can be formed on the substrate 6 so that adopt screw that substrate is installed on user's the device external heating radiator.The screw mounting hole also can be on box.Mechanically, box preferably via liner contact internal optics coupled subsystem, is applied to substrate with the bending force on the sensitization optical device that prevents the optical coupled subsystem with pressure simultaneously.In one embodiment, the hot weld dish is between substrate and external heat sink support.The hot weld dish provides buffering to prevent bending force during enclosure.
In various embodiment, fill/do not fill and build the chamber in appropriate insulating material custom-designed and the hole is suitable for making possible thermal conductance and convection current technology to minimize.Build the edge in the custom-designed box with platform minimizes or fully reduce to flow through the interior external heat of box.In various embodiment, bottom bracket 7 comprises several chambeies 8 and 22 with upper cap 14, and its sidewall through midfeather 18 and bottom bracket 7 or upper cap 14 forms.Chamber 8 and 22 can be used for keeping the thermal resistance media.Near the thermal resistance media, the gap between uncooled laser box and the wall 18 is filled with the second layer of air as thermal insulation.Further, the cylindrical cavity that is formed by two semicircle post jambs 9 of bottom bracket 7 and upper cap 14 is arranged to the optical coupling assembly 10 in the optical fiber exit 20 of part covering laser module.In addition, inner chamber 22 can be filled with thermal medium and draw the interval with the optical fiber of enclosure.7 kinds of bottom brackets, in base section, form window 15 and be fixed to heating radiator 6 with heating side with TEC 4.In various embodiment, the edge 17 of window 15 tilts and gets back to the box to stop from the upwards mobile heat of heating radiator 6.
In inner cooling laser device module, the proper orientation of the electric current of the element of the TEC 4 that flows through and the cooling of strength control laser module.Comprise that the control transfer of heat that flows to the heat energy of laser instrument by the heat of work chip of laser generation with from the enclosure outside realizes through bottom " heating " side that makes heat be delivered to TEC 4 downwards.In various embodiment, TEC 4 with advance the heating radiator 6 that surrounding environment dispels the heat through transmission and contact.In various embodiment, the electric current of adjusting TEC 4 can change from the quantity of the heat of other part transmission of chip of laser and laser module 1.The adjusting of electric current can be automatically performed through thermistor contrast laser temperature and design temperature by feedback control system.It is poor that thermistor produces a correspondent voltage, and voltage difference is sent to controlled DC current source.The DC current source can be configured to respond through the suitable current of driving via the thermal coupling element of TEC 4.In various embodiment, for laser instrument, need to the ambient temperature of about+75 ℃ of scopes, work well at about-20 ℃ with TEC control system, keep the chip of laser temperature simultaneously near 25-35 ℃.The typical relation of the temperature between the chip of laser and the external world is represented through the curve among Fig. 13.
In an embodiment, except adopting thermal insulation material, also there is purpose to comprise gap, chamber and air pocket efficient with the whole heat guard of optimization.Describe based on further specifying in Fig. 5 of heat guard of the present invention.In example embodiment, the chamber 8 of selecting suitable thermal medium 24 and 26 to fill in bottom bracket 7 and the upper cap 14.For optimization or abundant increasing based on thermal insulation of the present invention, the width in thermal medium and the chamber that is filled with air compares the scope at 1: 1 to 2: 1.Thermal medium can be had less than the low thermal conductance material of the thermal conductance value of 0.4W/ (M*K) by silicone foams or other to be processed.In various embodiment, two half blocks of adiabatic media 25 constitute circular holes and fill chamber 22 and carry out thermal energy exchange at interval to stop to draw via the optical fiber of box.The platform 21 that the position in chamber 22 is arranged to comprise laser instrument sub-component 1 is to increase hot distance through increasing extra path.
Fig. 6 has described the another embodiment with different bottom bracket designs.Two parts 7A and 7B with suitable lock pin 28 and through hole 29 constitute a complete bottom bracket 7.Split design and be convenient to more easily assemble all component that inner cooling laser device package system is shown, in other embodiments, also can use monolithic to form whole bottom bracket 7.
According to different example embodiment and with reference to figure 7; The heat conduction and the electroconductive resin that adopt eutectic temperature scolder and/or be fit to select have been installed in laser instrument sub-component 1 on the turning support 2, periphery 30 and TO lower surface 19 are connected to the match surface 31 and 33 of turning support 2.There is turning support 2 can adopt material to process, for example copper, copper tungsten, brass, bronze or as be pottery or other suitable material of aluminium nitride with good thermal conductivity.In order to prevent that metal pin 11 and metal from having turning support 2 to electrically contact, insulating sleeve 11A is used for covering pin 11.Select proper dielectric constant and size, even support good RF characteristic with length pin 11.In addition, insulating sleeve 11A can be configured to pin 11 provides support structure and through the elasticity that material has pliability is provided.In various embodiment, the range of size in hole 12 is from about 0.5-2mm, and cylindrical casing 30 can be from about 0.25-1.0mm, and the specific inductive capacity of insulating sleeve 11A can be from about 2.8-4.5.In various embodiment, the hot surface of the cold surface of TEC 4 and TEC 4 can through eutectic temperature scolder or heat-conducting resin be respectively fixed on the basal surface of turning support 2 with heat sink 6 on.
Fig. 8 has described according to of the present invention has dissimilar pin-go into and pin-go out an another embodiment of pattern.For example, circuit board 5A has 14 regular pin pattern 34, and circuit board 5B has 10 pin pattern 35; Circuit board 5C has 14 pin bending patterns 36, and circuit board 5D has 10 pin bending patterns 37.In crooked circuit pattern 5C and 5D, non-conductive polyimide plate is installed to the crooked pin in both sides so that provide structural stable and feasible assembling simple.It will be apparent to those skilled in the art that other structure that realizes similar connection can be used for other pin-go out.
Embodiments of the invention can comprise that combination makes signal arrive the inner panel of bias voltage, modulation and the RF circuit of separated leads.Multi-form lead-in wire, broadband connection device and/or straight line pin; PCB and crooked circuit, for example SMB, SSMB, SMA, miniature BNC, GPO, straight line pin, coplane tape etc. can combine the input and output as the internal circuit board that is connected to package system.Owing to be internal circuit, so they can be with very soft formal construction.Be different from traditional, laser diode chip and need remain on the butterfly individual laser package in the clean environment extremely; According to individual laser package of the present invention system the type and the material of circuit board and intraware are formed not restriction, allow big flexible making to comprise extra regulating circuit in the package system of the present invention.
In various embodiment and with reference to figure 9, dissimilar pin RF connector patterns can be used in the higher frequency purposes.In circuit board pattern 5E and 5F, 7 pin circuit boards comprise according to using needs to be positioned at the RF connector 40,41 of diverse location.RF connector 40,41 can the carry high frequency rate, yet other pin can be the DC lead-in wire.Pattern 5E foundes a shorter RF propagation distance from the RF connector, and thereby with circuit board pattern 5F mutually specific energy better transmission property is provided.But circuit board pattern 5F can substitute traditional inside refrigerating module, because it is suitable for identical traditional pin standard and layout.For the application that requires special bandwidth for transmission with special modulation, show a kind of circuit board pattern 5G that on circuit board distolateral, has RF connector 42.Connector 40,41,42 can be but be not limited to SMA, SMB, SSMB or GPO, K connector according to the present invention.For the ease of statement, shown circuit board has 14 pins, but to one skilled in the art, also can be the pin and the structure of other quantity.
Figure 10 has described the another example embodiment of the bottom bracket 7A and the upper cap 14A of the box with distolateral RF connector.Circular open 43,45 forms a through hole that matees with the distolateral RF connector that is positioned at circuit board 44.
In addition, in various embodiment and with reference to Figure 11, can use the dissimilar turning supports that have.Three various embodiment have been described, the first embodiment 2A be foregoing have through hole wear mouthfuls 12 the turning support arranged.For there being the turning support to adopt two different patterns to replace having 4 through holes wearing mouthful opening.The second embodiment 2B described have two otch 46 the turning support arranged, and the 3rd embodiment 2C described have single, a big otch 47 the turning support arranged.In different otch embodiment, extra hot material can add the hot tie-in path to not reduce improving component efficiency under the situation that heat energy sheds.
In an embodiment, the use of metal heat sink has also kept good RF signal transmission characteristics.In order to solve the problem with grounding of nonmetal surgery, the present invention has combined suitable earthing method to reduce interfering bigger backflow loss or impedance mismatching defective by the stray capacitance of TEC and the caused possible RF of pin of self-induction and TO head in heating radiator.The combination of the suitable dimension of the through hole in the support and the selection of insulating sleeve has prevented the loss of high-frequency RF signal flow when pin.Good RF is corresponding can to remain to 6GHz.
In when work, embodiments of the invention can help to keep chip of laser under steady temperature, to work, and supply with similar TEC electric current with respect to the butterfly laser instrument simultaneously, and the electric current that reduces greatly with respect to the external refrigeration unit feeding.Therefore the present invention has obtained comparable heat and RF performance, and its cost is very low.With respect to the external refrigeration laser instrument, the present invention can practice thrift a large amount of energy under similar cost.
More than shown with describe practical implementation be illustrating of different example embodiment and best mode, and it can not be interpreted as and limits scope of the present invention by any way.Under the situation that does not exceed scope of the present invention, can make a change or revise the disclosed embodiments.These mean with other change and modification and are included in the scope defined by the following claims of the present invention.The corresponding construction of all characteristics as claimed in claim, in the claim, material, action and equivalent mean and comprise any structure, material or the action that is used to carry out the function that combines with other claim characteristic.Scope of the present invention should confirm through accompanying claims and their legal equivalents, but not given example more than passing through.Described singulative " one " key element does not mean " one or only one ", only if come to describe clearly with " one or more ".In addition; At least one the such wording of using in the claim among A, B, the C of being similar to means A and can separately exist among the embodiment; B can separately exist among the embodiment; C can separately exist among the embodiment, and perhaps any combination of characteristic A, B, C may reside among the single embodiment; For example A and B, A and C, B and C, A and B and C.
Claims (32)
1. individual laser package system comprises:
Box, said box comprises a plurality of through holes, and wherein each through hole each pin of allowing to be encapsulated in the internal optics coupled subsystem in the said box passes;
Internal circuit board;
A plurality of insulators, each in said a plurality of insulators are configured for each in the said a plurality of through holes of heat seal.
2. individual laser package as claimed in claim 1 system, said box is made up of a plurality of assemblings.
3. individual laser package as claimed in claim 2 system, wherein said a plurality of is to be made up of non-conductive and adiabatic and hard material.
4. individual laser package as claimed in claim 3 system, wherein said a plurality of further comprise chamber, edge and the hole of building in a plurality of.
5. individual laser package as claimed in claim 1 system further comprises heating radiator, and the bottom of wherein said box is fixed to said heating radiator.
6. individual laser package as claimed in claim 1 system, each in wherein said a plurality of insulators is to be made up of soft, non-conductive and adiabatic material.
7. individual laser package as claimed in claim 6 system, wherein said non-conductive and adiabatic material comprises silicone rubber.
8. individual laser package as claimed in claim 5 system, wherein said heating radiator is to be made up of the metal with high heat conductance.
9. individual laser package as claimed in claim 8 system, wherein said heating radiator is made up of in copper, copper tungsten, brass, bronze or their combination one or more.
10. individual laser package as claimed in claim 1 system, wherein said internal optics coupled system comprises laser diode, coupling optical device and optical fiber.
11. individual laser package as claimed in claim 10 system, wherein said laser diode is sealed in the level Hermetic Package, and said level Hermetic Package comprises transistor package (TO) Tou Hegai.
12. individual laser package as claimed in claim 11 system further comprises one or more in the monitor photo-diode that is sealed in the said level Hermetic Package and the thermal sensor.
13. individual laser package as claimed in claim 11 system, wherein said lid comprises the lens that couple light to optical fiber that are used for from laser instrument.
14. individual laser package as claimed in claim 11 system further comprises the heating radiator that is coupled to said TO head, wherein said TO epicranium is configured to the heat that produces from said laser diode is distributed to the said heating radiator that is coupled to said TO head.
15. individual laser package as claimed in claim 14 system further comprises thermal sensor, this thermal sensor is fixed to the said heating radiator that is coupled to said TO head.
16. individual laser package as claimed in claim 10 system further comprises:
Be encapsulated in the thermoelectric (al) cooler (TEC) in the said box; And
Be coupled to the heating radiator of said TEC.
17. a method that is used to make the individual laser package system comprises following a plurality of step:
Make box, said box comprises a plurality of through holes, and each through hole is used to allow each lead-in wire to pass through;
Connect the substrate that is coupled to said box;
Connect a plurality of insulators, each in said a plurality of insulators is used for sealing respectively each of said a plurality of through holes;
Installation is sealed in the internal optics coupled subsystem in the said box; And
The fixed, internal plate.
18. method as claimed in claim 17, wherein assembled said box comprise chamber, edge, platform and the hole of building in a plurality of.
19. method as claimed in claim 19, wherein said box are to be made up of non-conductive and adiabatic and hard material.
20. method as claimed in claim 17 further comprises the connection heating radiator, wherein said substrate is fixed to heating radiator.
21. method as claimed in claim 17, each in wherein said a plurality of insulators is to be made up of soft, non-conductive and adiabatic material.
22. method as claimed in claim 21, wherein said non-conductive and adiabatic material comprises silicone rubber.
23. method as claimed in claim 17, wherein said substrate are to be made up of the metal with high heat conductance.
24. method as claimed in claim 23, wherein said substrate is made up of in copper, copper tungsten, brass, bronze or their combination one or more.
25. method as claimed in claim 17 further comprises a plurality of number of assembling steps, wherein said internal optics coupled system comprises laser diode, coupling optical device and optical fiber.
26. method as claimed in claim 25 further comprises the step of a plurality of sealings, wherein said laser diode is sealed in the level Hermetic Package, and wherein level Hermetic Package comprises transistor package (TO) Tou Hegai.
27. method as claimed in claim 26 further comprises making being sealed in the interior monitor photo-diode of said level Hermetic Package and a plurality of steps of the one or more linkings in the thermal sensor.
28. method as claimed in claim 26 further comprises the step of a plurality of installations, wherein said lid comprises the lens that couple light to optical fiber that are used for from laser instrument.
29. method as claimed in claim 26 further comprises a plurality of steps that are connected the heating radiator that is coupled to said TO head, wherein said TO epicranium is configured to the heat that produces from said laser diode is distributed to the heating radiator that is coupled to said TO head.
30. method as claimed in claim 29 further comprises a plurality of steps that are connected thermal sensor, said thermal sensor is fixed to the heating radiator that is coupled to said TO head.
31. method as claimed in claim 25 further comprises the step of a plurality of linkings:
Be connected and be encapsulated in the thermoelectric (al) cooler (TEC) in the said box; And
Be connected the heating radiator that is coupled to said TEC.
32. method as claimed in claim 25 further comprises the step of a plurality of structures and linking, wherein said through hole is used to receive the lead-in wire from a plurality of broadband connectors or straight line pin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37705910P | 2010-08-25 | 2010-08-25 | |
| US61/377,059 | 2010-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102385124A true CN102385124A (en) | 2012-03-21 |
Family
ID=45824704
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110216290XA Pending CN102386557A (en) | 2010-08-25 | 2011-07-20 | Internal-cooled heat-blocking modular laser packaging system |
| CN2011103054993A Pending CN102385124A (en) | 2010-08-25 | 2011-08-25 | Internal-cooled heat-blocking modular laser packaging system |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110216290XA Pending CN102386557A (en) | 2010-08-25 | 2011-07-20 | Internal-cooled heat-blocking modular laser packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN102386557A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104793300A (en) * | 2015-04-30 | 2015-07-22 | 东南大学 | Optical module assembly with inner heat dispassion channel and composite heat dispassion structure thereof |
| CN105705975A (en) * | 2013-11-05 | 2016-06-22 | 思科技术公司 | Method and system for an optical communication device |
| CN105784199A (en) * | 2016-03-17 | 2016-07-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN106443910A (en) * | 2016-11-17 | 2017-02-22 | 武汉电信器件有限公司 | Precise temperature control coupled platform device for photoelectronic device |
| CN107101415A (en) * | 2017-05-17 | 2017-08-29 | 内蒙古科技大学 | A kind of hot superconductive radiating TEC liquid refrigerators |
| US9859680B2 (en) | 2013-12-17 | 2018-01-02 | Lasermax, Inc. | Shock resistant laser module |
| CN109491023A (en) * | 2018-11-21 | 2019-03-19 | 湖北菲尔博光电技术有限公司 | Butterfly laser automatic coupling grasping system and its application method |
| CN110071413A (en) * | 2018-01-23 | 2019-07-30 | 广东安捷康光通科技有限公司 | Dual wavelength 14PIN butterfly laser and preparation method thereof |
| CN110412544A (en) * | 2019-08-23 | 2019-11-05 | 上海禾赛光电科技有限公司 | Laser transmitting system and laser radar including the laser transmitting system |
| CN111352192A (en) * | 2018-12-20 | 2020-06-30 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112198599A (en) * | 2020-12-07 | 2021-01-08 | 武汉乾希科技有限公司 | Coupling method and apparatus for optical communication device |
| CN112213832A (en) * | 2019-07-09 | 2021-01-12 | 美商祥茂光电科技股份有限公司 | Thermoelectric cooler having top and bottom plates with asymmetric thermal conductivity and optical subassembly implementing same |
| CN113620234A (en) * | 2021-05-28 | 2021-11-09 | 上海曦智科技有限公司 | Chip packaging structure, control method and optical computing equipment |
| WO2023097497A1 (en) * | 2021-11-30 | 2023-06-08 | 华为技术有限公司 | Light source module, detection device and terminal device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107516B (en) * | 2017-12-19 | 2019-09-24 | 四川梓冠光电科技有限公司 | Butterfly laser |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238898A (en) * | 1996-12-06 | 1999-12-15 | 康宁股份有限公司 | Package for temp.-sensitive planar optical components |
| US20020031150A1 (en) * | 2000-03-31 | 2002-03-14 | The Furukawa Electric Co., Ltd. | Semiconductor laser module |
| CN1395123A (en) * | 2001-06-28 | 2003-02-05 | 康宁Oti股份公司 | Optical bench for photoelectric device |
| KR20030073232A (en) * | 2002-03-09 | 2003-09-19 | 엘지전자 주식회사 | Device of cooler for laser diode system |
-
2011
- 2011-07-20 CN CN201110216290XA patent/CN102386557A/en active Pending
- 2011-08-25 CN CN2011103054993A patent/CN102385124A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238898A (en) * | 1996-12-06 | 1999-12-15 | 康宁股份有限公司 | Package for temp.-sensitive planar optical components |
| US20020031150A1 (en) * | 2000-03-31 | 2002-03-14 | The Furukawa Electric Co., Ltd. | Semiconductor laser module |
| CN1395123A (en) * | 2001-06-28 | 2003-02-05 | 康宁Oti股份公司 | Optical bench for photoelectric device |
| KR20030073232A (en) * | 2002-03-09 | 2003-09-19 | 엘지전자 주식회사 | Device of cooler for laser diode system |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105705975A (en) * | 2013-11-05 | 2016-06-22 | 思科技术公司 | Method and system for an optical communication device |
| US9628184B2 (en) | 2013-11-05 | 2017-04-18 | Cisco Technology, Inc. | Efficient optical communication device |
| US9755752B2 (en) | 2013-11-05 | 2017-09-05 | Cisco Technology, Inc. | Method for manufacturing an optical communication device |
| CN105705975B (en) * | 2013-11-05 | 2018-01-16 | 思科技术公司 | Method and system for optical communication device |
| US10735101B2 (en) | 2013-11-05 | 2020-08-04 | Cisco Technology, Inc. | Method for manufacturing an optical communication device |
| US9859680B2 (en) | 2013-12-17 | 2018-01-02 | Lasermax, Inc. | Shock resistant laser module |
| CN104793300A (en) * | 2015-04-30 | 2015-07-22 | 东南大学 | Optical module assembly with inner heat dispassion channel and composite heat dispassion structure thereof |
| CN105784199A (en) * | 2016-03-17 | 2016-07-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN106443910A (en) * | 2016-11-17 | 2017-02-22 | 武汉电信器件有限公司 | Precise temperature control coupled platform device for photoelectronic device |
| CN107101415A (en) * | 2017-05-17 | 2017-08-29 | 内蒙古科技大学 | A kind of hot superconductive radiating TEC liquid refrigerators |
| CN110071413A (en) * | 2018-01-23 | 2019-07-30 | 广东安捷康光通科技有限公司 | Dual wavelength 14PIN butterfly laser and preparation method thereof |
| CN109491023A (en) * | 2018-11-21 | 2019-03-19 | 湖北菲尔博光电技术有限公司 | Butterfly laser automatic coupling grasping system and its application method |
| CN111352192A (en) * | 2018-12-20 | 2020-06-30 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111352192B (en) * | 2018-12-20 | 2021-08-10 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11631960B2 (en) | 2018-12-20 | 2023-04-18 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| CN112213832A (en) * | 2019-07-09 | 2021-01-12 | 美商祥茂光电科技股份有限公司 | Thermoelectric cooler having top and bottom plates with asymmetric thermal conductivity and optical subassembly implementing same |
| CN110412544A (en) * | 2019-08-23 | 2019-11-05 | 上海禾赛光电科技有限公司 | Laser transmitting system and laser radar including the laser transmitting system |
| CN112198599A (en) * | 2020-12-07 | 2021-01-08 | 武汉乾希科技有限公司 | Coupling method and apparatus for optical communication device |
| CN112198599B (en) * | 2020-12-07 | 2021-02-12 | 武汉乾希科技有限公司 | Coupling method and apparatus for optical communication device |
| CN113620234A (en) * | 2021-05-28 | 2021-11-09 | 上海曦智科技有限公司 | Chip packaging structure, control method and optical computing equipment |
| CN113620234B (en) * | 2021-05-28 | 2024-01-12 | 上海曦智科技有限公司 | Chip packaging structure, control method and optical computing device |
| WO2023097497A1 (en) * | 2021-11-30 | 2023-06-08 | 华为技术有限公司 | Light source module, detection device and terminal device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102386557A (en) | 2012-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102385124A (en) | Internal-cooled heat-blocking modular laser packaging system | |
| CN108390255A (en) | Optical secondary module and optical module | |
| US20130051413A1 (en) | Internally cooled, thermally closed modular laser package system | |
| US20120045161A1 (en) | Semiconductor optical modulation device | |
| TWI514794B (en) | Methods and systems for dissipating heat in optical communications modules | |
| US20170365976A1 (en) | To-type optical element package for high-speed communication | |
| CN201936040U (en) | Cooling coaxial package light emission tube core | |
| CN102650718A (en) | Refrigeration-type coaxial packaging light-emitting tube core | |
| JP2015088641A (en) | Optical module | |
| JP2011108937A (en) | To-can type tosa module | |
| KR20210001972U (en) | Optical emitting module, optical transceiver module and optical cable module | |
| CN114514663B (en) | Base with housing for electronic components for high-frequency signal transmission | |
| CN102313937A (en) | Refrigeration coaxial light-emitting pipe core | |
| TWM588374U (en) | Connectors with metamaterials | |
| CN101154404B (en) | Optical pickup device | |
| CN105431756B (en) | Onboard transceiver | |
| CN114637079B (en) | Optical module | |
| CN201707474U (en) | Coaxial light emission tube core with cooling function | |
| JP2006066888A (en) | Container for laser diode module | |
| CN110165544A (en) | A kind of direct modulated laser structure | |
| CN107750478B (en) | Buried block-free RF power amplifier | |
| CN104718672B (en) | photoelectric subassembly | |
| KR101473650B1 (en) | Temperature controllable high bit rate Laser Diode | |
| CN105406352A (en) | Device and method for reducing power consumption of light emitting assembly with refrigeration function | |
| CN114124232B (en) | Radio frequency wireless light emitting module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120321 |