CN105784199A - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- CN105784199A CN105784199A CN201610153923.XA CN201610153923A CN105784199A CN 105784199 A CN105784199 A CN 105784199A CN 201610153923 A CN201610153923 A CN 201610153923A CN 105784199 A CN105784199 A CN 105784199A
- Authority
- CN
- China
- Prior art keywords
- temperature
- module
- laser instrument
- junction
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to the communication technical field and especially relates to an optical module, and is to improve laser temperature monitoring accuracy, improve laser performance and overcome the defect that laser temperature monitoring is not accurate, and the performance of an optical assembly is reduced in the prior art. An embodiment of the invention provides the optical module, which comprises an optical assembly and a temperature monitoring module. A laser is packaged in the optical assembly. The temperature monitoring module comprises a temperature measurement element; the temperature measurement element is connected with a housing corresponding to the laser in the optical assembly through a heat conduction piece; the heat conduction piece is used for conducting the heat dissipated by the laser to the temperature measurement element; the temperature monitoring module is used for adjusting a drive current of the laser according to the temperature detected by the temperature measurement element to allow the drive current of the laser to be matched with optical power current of the laser corresponding to the detected temperature. The optical module is used for production and manufacturing of the optical module.
Description
Technical field
The present invention relates to communication technical field, particularly relate to a kind of optical module.
Background technology
In optical module, the characteristic of laser instrument is had a great impact by temperature, owing to the luminous power electric current of described laser instrument changes with the variations in temperature of described laser instrument, and the electric current that drives of described laser instrument needs the luminous power electric current with described laser instrument to match, to ensure that laser instrument can export required output signal, therefore, by the temperature of laser instrument is monitored controlling the driving electric current of described laser instrument, the luminous power electric current driving electric current and the described laser instrument corresponding to this temperature making described laser instrument matches, it is thus possible to improve the stability of laser output signal.
In the prior art, generally adopt the chip with temperature sensor that the temperature of optical module environment is detected, increasing the temperature calculating laser instrument on the basis of offset, it is inaccurate that this mode detects temperature, the carrying out being difficult to the temperature to described laser instrument is accurately monitored, and then affects laser performance.
Summary of the invention
The present invention provides a kind of optical module, improves the monitoring accuracy of laser temperature, improves laser performance.
For reaching above-mentioned purpose, the present invention adopts the following technical scheme that
The embodiment of the present invention provides a kind of optical module, including: optical assembly and temperature monitoring module, described optical assembly is packaged with laser instrument；Described temperature monitoring module includes:
Temperature element, described temperature element is connected by heat-conducting piece with the shell corresponding to laser instrument in described optical assembly, described heat-conducting piece is conducted to described temperature element for the heat distributed by laser instrument, described temperature monitoring module regulates the driving electric current of described laser instrument for the temperature detected according to described temperature element so that the luminous power electric current driving the described laser instrument at electric current and this detection temperature of described laser instrument matches.
The embodiment of the present invention provides a kind of optical module.Wherein, the shell corresponding to laser instrument in described optical assembly is connected by heat-conducting piece with described temperature element, the heat that can be directly distributed by laser instrument is efficiently conducted to described temperature element, compared with prior art, it can be avoided that the variations in temperature caused by the heat of additional conductive, it is thus possible to improve the accuracy of monitoring temperature, and vary with temperature the driving electric current to described laser instrument and be adjusted, drive electric current and the luminous power electric current detecting the described laser instrument at temperature in real time that make described laser instrument match, it is thus possible to improve the stability of laser output signal.Overcome in prior art the monitoring temperature of laser instrument is inaccurate so that the defect that the performance of laser instrument reduces.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The structural representation of a kind of optical module that Fig. 1 provides for the embodiment of the present invention；
The entity structure schematic diagram of a kind of optical module that Fig. 2 provides for the embodiment of the present invention；
The circuit connection diagram of a kind of temperature control modules that Fig. 3 provides for the embodiment of the present invention；
The graph of relation of the voltage-temperature of a kind of temperature element with PN junction that Fig. 4 provides for the embodiment of the present invention；
The circuit connection diagram of a kind of temperature control modules increasing fixed value resistance based on Fig. 3 that Fig. 5 provides for the embodiment of the present invention；
The circuit connection diagram of a kind of temperature control modules increasing analog-to-digital conversion module based on Fig. 5 that Fig. 6 provides for the embodiment of the present invention；
A kind of circuit connection diagram increasing the temperature control modules controlling module based on Fig. 6 that Fig. 7 provides for the embodiment of the present invention；
The circuit connection diagram of a kind of temperature control modules increasing chip based on Fig. 7 that Fig. 8 provides for the embodiment of the present invention；
The circuit connection diagram of a kind of temperature control modules increasing calibration module based on Fig. 8 that Fig. 9 provides for the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
In describing the invention, it will be appreciated that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " be based on orientation shown in the drawings or position relationship; be for only for ease of the description present invention and simplifying and describe; rather than instruction or imply indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.In describing the invention, except as otherwise noted, " multiple " are meant that two or more.
The embodiment of the present invention provides a kind of optical module, referring to Fig. 1 and Fig. 2, including: optical assembly 1 and temperature monitoring module 2, described optical assembly 1 is packaged with laser instrument, described temperature monitoring module 2 includes:
Temperature element 21, described temperature element 21 is connected by heat-conducting piece 22 with the shell corresponding to laser instrument in described optical assembly 1, described heat-conducting piece 22 is conducted to described temperature element 21 for the heat distributed by laser instrument, described temperature monitoring module 2 regulates the driving electric current of described laser instrument for the temperature detected according to described temperature element 21 so that the luminous power electric current driving the described laser instrument at electric current and this detection temperature of described laser instrument matches.
Wherein, described optical assembly 1 refers to the opto-electronic device in optical module, is divided into light emission module, Optical Receivers, the integrated module of optical transceiver and light forwarding module, and at this, the embodiment of the present invention is applicable to be packaged with the optical assembly of laser instrument.
The embodiment of the present invention provides a kind of optical module.Wherein, the shell corresponding to laser instrument in described optical assembly 1 is connected by heat-conducting piece 22 with described temperature element 21, the heat that can be directly distributed by laser instrument is efficiently conducted to described temperature element 21, with in prior art by compared with the chip of temperature sensor the temperature of laser instrument being carried out detection, it can be avoided that the variations in temperature caused by the heat of additional conductive, it is thus possible to improve the accuracy of monitoring temperature, and vary with temperature the driving electric current to described laser instrument and be adjusted, drive electric current and the luminous power electric current detecting the described laser instrument at temperature in real time that make described laser instrument match, it is thus possible to improve the stability of laser output signal.
Wherein, described heat-conducting piece 22 is not limited.
In one embodiment of the invention, described heat-conducting piece 22 is heat-conducting glue.
Heat-conducting glue is the heat transmission medium of electronic devices and components, has high flexibility, it is possible to reduce pressure required between components and parts, can cover the irregular surface of microcosmic so that components and parts are fully contacted and improve heat conduction efficiency simultaneously.
Wherein, the connected mode of described temperature element 21 with the shell corresponding to laser instrument in described optical assembly 1 is not limited.
In one embodiment of the invention, described optical module also includes die casting support 3, the lower surface of described heat-conducting piece 22 is connected with the upper surface interference fit of described die casting support 3, in described optical assembly 1, the shell corresponding to laser instrument is connected with a part of upper surface interference fit of described heat-conducting piece 22, and described temperature element 21 is connected with the upper surface interference fit of another part of described heat-conducting piece 22.
In embodiments of the present invention, when described heat-conducting piece 22 is attached with remaining part, the joint face of described heat-conducting piece 22 deforms upon and makes to produce between described heat-conducting piece 22 and the mating surface of remaining part very big pressure, it is capable of interference fit to connect, so, heat-conducting piece 22 and remaining part can be made closely to be fully contacted conduct heat, improve heat transfer efficiency.Further, owing to described heat-conducting piece 22 is heat-conducting glue, owing to heat-conducting glue 22 has good ductility, the irregular surface of microcosmic can be covered so that components and parts are fully contacted, it is thus possible to improve heat conduction efficiency to the full extent, and the position of described temperature element 21 and described optical assembly 1 can be fixed, it is prevented that occur position to move.
Wherein, the composition of described heat-conducting glue 22 is not limited.
Preferably, described heat-conducting glue 22 is HD6000 heat-conducting silica gel sheet.
Wherein, described temperature element 21 not being limited, described temperature element 21 can be critesistor, it is also possible to for audion.
In another embodiment of the present invention, described temperature element 21 is diode or audion.
Owing to diode and audion have PN junction, in one piece of single crystal semiconductor, a part is P-type semiconductor mixed with acceptor impurity, and when another part is N-type semiconductor mixed with donor impurity, the transition region near the interface of P-type semiconductor and N-type semiconductor is called PN junction.Described PN junction has very good temperature linearity, has that volume is little, thermal response speed fast, and deviation from linearity is little, the feature that interchangeability is good, therefore, it is possible to realize the accurate monitoring of the temperature to described laser instrument.
In one embodiment of the invention, referring to Fig. 3, described temperature monitoring module 2 also includes: constant-current source 23, described constant-current source 23 for passing through the PN junction of described temperature element 21 by constant current forward, described temperature element 21 is for detecting the variations in temperature of described laser instrument, and the forward voltage drop at PN junction two ends is exported as measuring signal.
Wherein, described constant-current source 23 is the current source of output constant current hold.Referring to Fig. 4, the described temperature element with PN junction is a kind of negative temperature coefficient temperature-voltage switching device, namely temperature raises, PN junction both end voltage declines, utilize the principle that the forward voltage drop of PN junction reduces with the rising of detection temperature, using the forward voltage drop at described PN junction two ends as measuring signal output, it is possible to the temperature of described laser instrument is carried out monitor in real time.
Wherein, the size of described constant current is not limited.
In one embodiment of the invention, described constant current is 100-300 μ A.
Due to flow through the electric current of the PN junction of described temperature element 21 from tens microamperes just can normal operation, but, if described constant current is too small, then easily by external interference, if described constant current is excessive, described temperature element 21 self heats up and makes temperature survey inaccurate.Wherein, constant current changes in suitable scope, without influence on the linearity that temperature element 21 is measured.
In one embodiment of the invention, referring to Fig. 5, described temperature monitoring module 2 also includes: fixed value resistance 24, and one end of described fixed value resistance 24 is connected with the positive pole of described constant-current source 23, the other end of described fixed value resistance 24 is connected with the positive electrical of described PN junction, the minus earth of described PN junction.
In embodiments of the present invention, by being connected with described PN junction by fixed value resistance 24, playing the effect of dividing potential drop, exemplary, if the voltage that V is constant-current source 23, fixed value resistance is R, then flow through the electric current i of PN junctionf=(V-Vf)/R, VfFor the output voltage of PN junction, due to the minus earth of described PN junction, therefore, the output voltage of described PN junction is the forward voltage drop at described PN junction two ends.
Wherein it is desired to illustrate, diode is one piece of P-type semiconductor and one piece of N-type semiconductor is bound tightly together and constitutes.Forming an interface on their interface, this interface just claims PN junction.Respectively plus a lead-in wire in P type with N-type semiconductor, then it is packaged, just constitutes a diode.This PN junction is just called the PN junction of diode.Described audion is made up of two PN junctions, and described audion has NPN type triode and PNP type triode, and any one PN junction in described audion all can be connected serially in circuit and form temperature element.
In another embodiment of the present invention, described PN junction is the emitter junction of NPN type triode.
NPN type triode is made up of one piece of P-type semiconductor of 2 pieces of N-type semiconductor sandwich, the PN junction formed between launch site and base is called emitter junction, in circuit connects, described PN junction mainly has two kinds of connected modes, the first connected mode is: the base stage of described audion electrically connects with described fixed value resistance, the grounded emitter of described audion；The second connected mode is: the base stage of described audion electrically connects with described fixed value resistance, the grounded emitter of described audion, and the base stage short circuit of the colelctor electrode of described audion and described audion, in both modes, constant current all can pass through the emitter junction of described audion.
In one embodiment of the invention, the base stage short circuit of the colelctor electrode of described audion and described audion.
In one embodiment of the invention, referring to Fig. 6, described temperature monitoring module also includes: analog-to-digital conversion module 25, and described analog-to-digital conversion module 25 is connected with the voltage output end of described temperature element 21, for the forward voltage drop of described PN junction is converted to temperature signal.
Output signal generally, due to described temperature element 21 is an analogue signal, described analogue signal can be converted to temperature signal by described analog-to-digital conversion module 25.
In another embodiment of the present invention, referring to Fig. 7, described temperature monitoring module also includes: control module 26；Described control module 26 electrically connects with the signal output part of described analog-to-digital conversion module 25, and described control module 26, for receiving the temperature signal that described analog-to-digital conversion module 25 sends, controls the driving electric current of described laser instrument according to described temperature signal.
By arranging control module 26, it is possible to the driving electric current of described laser instrument is carried out real-time monitoring according to actual temperature change situation, improve reliability and the accuracy of monitoring temperature.
In one embodiment of the invention, referring to Fig. 8, described temperature monitoring module includes: chip 27, and described constant-current source 23 is integrated on described chip 27 with described control module 26.
In another embodiment of the present invention, referring to Fig. 9, described temperature monitoring module also includes: calibration module 28, described calibration module 28 electrically connects with the signal input part of the signal output part of described analog-to-digital conversion module 25 and described control module 26 respectively, described calibration module 28 is for receiving the temperature signal that described analog-to-digital conversion module 25 sends, and this temperature signal is calibrated, make the temperature that described temperature element 21 detects consistent with the actual temperature of the shell corresponding to described laser instrument, and the temperature signal after calibration is sent to described control module 26.
In temperature conduction process, although described heat-conducting glue 22 has the good capacity of heat transmission, but, also have partial heat to be scattered and disappeared by heat-conducting glue 22 and die casting support 3, so that temperature detection has certain error, by arranging calibration module 28, it is possible to reduce error, improve the accuracy of monitoring temperature further.
Wherein, described calibration module 28 can be the application software that storage has matched curve.
The temperature of shell corresponding to described laser instrument is detected in real time by thermometer, this temperature is set as the calibration temperature reference point of temperature element again, the matched curve of the temperature of shell corresponding to laser instrument and the detection temperature of described temperature element it is obtained in that such that it is able to ensure the accuracy of temperature element measurement temperature by fitting software.
The above; being only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any those familiar with the art is in the technical scope that the invention discloses; change can be readily occurred in or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (10)
1. an optical module, including: optical assembly and temperature monitoring module, described optical assembly is packaged with laser instrument；It is characterized in that,
Described temperature monitoring module includes:
Temperature element, described temperature element is connected by heat-conducting piece with the shell corresponding to laser instrument in described optical assembly, described heat-conducting piece is conducted to described temperature element for the heat distributed by laser instrument, described temperature monitoring module regulates the driving electric current of described laser instrument for the temperature detected according to described temperature element so that the luminous power electric current driving electric current and the described laser instrument corresponding to this detection temperature of described laser instrument matches.
2. optical module according to claim 1, it is characterised in that
Described optical module also includes die casting support, the lower surface of described heat-conducting piece is connected with the upper surface interference fit of described die casting support, in described optical assembly, the shell corresponding to laser instrument is connected with a part of upper surface interference fit of described heat-conducting piece, and described temperature element is connected with the upper surface interference fit of another part of described heat-conducting piece.
3. optical module according to claim 1, it is characterised in that
Described temperature element is diode or audion.
4. optical module according to claim 3, it is characterised in that
Described temperature monitoring module also includes: constant-current source, described constant-current source for passing through the PN junction of described temperature element by constant current forward, described temperature element is for detecting the variations in temperature of described laser instrument, and the forward voltage drop at PN junction two ends is exported as measuring signal.
5. optical module according to claim 3, it is characterised in that
Described temperature monitoring module also includes: fixed value resistance, and one end of described fixed value resistance is connected with the positive pole of described constant-current source, and the other end of described fixed value resistance is connected with the positive electrical of described PN junction, the minus earth of described PN junction.
6. optical module according to claim 4, it is characterised in that
Described PN junction is the emitter junction of NPN audion.
7. optical module according to claim 4, it is characterised in that described temperature monitoring module also includes: analog-to-digital conversion module, described analog-to-digital conversion module is connected with the voltage output end of described PN junction, for the forward voltage drop of described PN junction is converted to temperature signal.
8. optical module according to claim 7, it is characterised in that described temperature monitoring module also includes: control module；Described control module electrically connects with the signal output part of described analog-to-digital conversion module, and described control module is for receiving the temperature signal that described analog-to-digital conversion module sends, and regulates the driving electric current of described laser instrument according to described temperature signal.
9. on chip described in optical module according to claim 8, it is characterised in that described temperature monitoring module also includes: chip, described constant-current source and described control module set Cheng Yu.
10. optical module according to claim 8, it is characterized in that, described temperature monitoring module also includes: calibration module, described calibration module electrically connects with the signal input part of the signal output part of described analog-to-digital conversion module and described control module respectively, described calibration module is for receiving the temperature signal that described analog-to-digital conversion module sends, and this temperature signal is calibrated, make the temperature that described temperature element detects consistent with the actual temperature of the shell corresponding to described laser instrument, and the temperature signal after calibration is sent to described control module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610153923.XA CN105784199B (en) | 2016-03-17 | 2016-03-17 | A kind of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610153923.XA CN105784199B (en) | 2016-03-17 | 2016-03-17 | A kind of optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105784199A true CN105784199A (en) | 2016-07-20 |
| CN105784199B CN105784199B (en) | 2019-06-14 |
Family
ID=56393963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610153923.XA Active CN105784199B (en) | 2016-03-17 | 2016-03-17 | A kind of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105784199B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107967009A (en) * | 2018-01-05 | 2018-04-27 | 北京是卓科技有限公司 | A kind of laser that can be temperature automatically controlled |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5024535A (en) * | 1989-12-20 | 1991-06-18 | United Technologies Corporation | Semiconductor light source temperature measurement |
| US20020090012A1 (en) * | 2001-01-05 | 2002-07-11 | Richard Kroeger | Thermoelectric cooler driver utilizing unipolar pulse width modulated synchronous rectifiers |
| CN1652419A (en) * | 2005-01-07 | 2005-08-10 | 清华大学 | Semiconductor laser driving current control method and multi-mode working driving power supply |
| CN1883090A (en) * | 2003-11-18 | 2006-12-20 | 松下电器产业株式会社 | Laser driving device, optical head comprising laser driving device, and optical disk device |
| CN201398013Y (en) * | 2009-04-30 | 2010-02-03 | 中国电子科技集团公司第三十四研究所 | Laser module with temperature control device |
| CN102385124A (en) * | 2010-08-25 | 2012-03-21 | Agx技术股份有限公司 | Internal-cooled heat-blocking modular laser packaging system |
| CN202977955U (en) * | 2012-06-26 | 2013-06-05 | 青岛海信宽带多媒体技术有限公司 | Million optical module with temperature control function |
| CN203178831U (en) * | 2013-02-06 | 2013-09-04 | 南京千韵电子科技有限公司 | Chip internal temperature control device and experimental instrument |
| CN103306851A (en) * | 2013-05-30 | 2013-09-18 | 天津大学 | Cylinder sleeve temperature difference generation device for internal combustion engine waste heat recovery |
-
2016
- 2016-03-17 CN CN201610153923.XA patent/CN105784199B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5024535A (en) * | 1989-12-20 | 1991-06-18 | United Technologies Corporation | Semiconductor light source temperature measurement |
| US20020090012A1 (en) * | 2001-01-05 | 2002-07-11 | Richard Kroeger | Thermoelectric cooler driver utilizing unipolar pulse width modulated synchronous rectifiers |
| CN1883090A (en) * | 2003-11-18 | 2006-12-20 | 松下电器产业株式会社 | Laser driving device, optical head comprising laser driving device, and optical disk device |
| CN1652419A (en) * | 2005-01-07 | 2005-08-10 | 清华大学 | Semiconductor laser driving current control method and multi-mode working driving power supply |
| CN201398013Y (en) * | 2009-04-30 | 2010-02-03 | 中国电子科技集团公司第三十四研究所 | Laser module with temperature control device |
| CN102385124A (en) * | 2010-08-25 | 2012-03-21 | Agx技术股份有限公司 | Internal-cooled heat-blocking modular laser packaging system |
| CN202977955U (en) * | 2012-06-26 | 2013-06-05 | 青岛海信宽带多媒体技术有限公司 | Million optical module with temperature control function |
| CN203178831U (en) * | 2013-02-06 | 2013-09-04 | 南京千韵电子科技有限公司 | Chip internal temperature control device and experimental instrument |
| CN103306851A (en) * | 2013-05-30 | 2013-09-18 | 天津大学 | Cylinder sleeve temperature difference generation device for internal combustion engine waste heat recovery |
Non-Patent Citations (1)
| Title |
|---|
| 林志琦等: "采用半导体激光器自身PN结特性测温的半导体激光器恒温控制", 《发光学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107967009A (en) * | 2018-01-05 | 2018-04-27 | 北京是卓科技有限公司 | A kind of laser that can be temperature automatically controlled |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105784199B (en) | 2019-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5076460B2 (en) | Optical subassembly with thermistor | |
| CN103217229B (en) | A kind of junction temperature measurement method of light emitting diode and application | |
| CN112198600B (en) | Multichannel optical receiving component for optical communication and optical path coupling method thereof | |
| CN202929500U (en) | Accelerometer and its temperature control circuit | |
| CN201796077U (en) | Laser device bias current monitoring circuit with APC (automatic phase control) function | |
| JP2006278361A (en) | Semiconductor light-emitting device module | |
| CN109298316B (en) | Thermal resistance testing method for linear voltage stabilizer | |
| CN105784199A (en) | Optical module | |
| CN103236644B (en) | Regulate method and the device of small package hot-pluggable optical module working temperature | |
| CN204741166U (en) | Sharp light controlling circuit that power is adjustable | |
| JP2011165714A (en) | Optical transceiver | |
| CN202406334U (en) | Rapid automatic temperature compensating and driving module of superradiation light emitting diode | |
| CN109347545A (en) | A kind of APD axis light receiving unit for OTDR | |
| US8170077B2 (en) | Internal memory for transistor outline packages | |
| CN202857050U (en) | SLED light source based on temperature and power feedback control | |
| CN210982821U (en) | Optical module and optical transmission device | |
| US7826998B1 (en) | System and method for measuring the temperature of a device | |
| KR20120084952A (en) | The apparatus and method for measurement of generated heat from led | |
| CN210167800U (en) | Structure for carrying out chip over-temperature protection by using temperature characteristic of triode | |
| CN202384374U (en) | PIN-FET optical receiving module | |
| CN112563257B (en) | Method for adjusting CTR of automobile optocoupler and optocoupler | |
| CN112271163A (en) | High-precision linear photoelectric coupler structure | |
| CN111463336A (en) | Preparation method of L ED lamp | |
| CN105352620A (en) | Method for measuring junction temperature of light-emitting diode and application thereof | |
| CN113092974B (en) | IGBT module internal chip junction temperature measuring system, measuring method and IGBT module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |