CN202977955U - Million optical module with temperature control function - Google Patents
Million optical module with temperature control function Download PDFInfo
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- CN202977955U CN202977955U CN 201220301677 CN201220301677U CN202977955U CN 202977955 U CN202977955 U CN 202977955U CN 201220301677 CN201220301677 CN 201220301677 CN 201220301677 U CN201220301677 U CN 201220301677U CN 202977955 U CN202977955 U CN 202977955U
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- laser
- chip microcomputer
- photodiode
- optical modules
- temperature
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Abstract
The utility model discloses a million optical module with a temperature control function, comprising a laser, a one-chip microcomputer, a photodiode, a heating apparatus, a temperature sensor and a current amplification apparatus. The photodiode is arranged at one side of the laser and used for generating a light current proportional to the luminous intensity of the light beam emitted by the laser; the heating apparatus is arranged adjacent to the laser and is electrically connected with the output terminal of the photodiode; the temperature sensor is arranged in the laser and is electrically connected with the one-chip microcomputer for feeding the temperature in the laser back to the one-chip microcomputer; and the input terminal of the current amplification apparatus is electrically connected with the one-chip microcomputer, the output terminal is electrically connected with the heating apparatus, the current of the heating apparatus is amplified through the control signal transmitted by the one-chip microcomputer, and the work temperature of the laser is adjusted. According to the million optical module with a temperature control function, the work temperature range of the laser is enlarged, in additional, the power consumption and volume of the optical module are effectively controlled, the production cost is low, and the million optical module with the temperature control function is suitable for batch production.
Description
Technical field
The utility model relates to the optical module of light communication technical field, particularly a kind of 10,000,000,000 optical modules with temp. control function.
Background technology
At present, the transport vehicle between high in the clouds data center and 10G Ethernet is 10,000,000,000 optical modules.Be 10G VCSEL laser due to what 10,000,000,000 optical modules in present industry adopted, and 10G VCSEL laser is operated in namely 0 ~ 70 ℃ of business level temperature range more.Lower than 0 ℃ or during higher than 70 ℃, the bandwidth of laser will be deteriorated gradually when temperature; During lower than-20 ℃, the shape of ray plot is deteriorated obviously when temperature, and signal level "0" and level"1" produce the phenomenons such as two-wire is even multi-thread, ring, overshoot.So just make 10,000,000,000 optical modules that use this laser can't work in the technical grade temperature range is-40 ℃ ~ 85 ℃, thereby the scope of application of 10,000,000,000 optical modules is restricted.
The multiplex temperature in laser of semiconductor cooler temperature control system is controlled, but the semiconductor cooler temperature control system needs the device of employing many because the function implementation is complicated, volume is large, power consumption is large, and price is also quite expensive, so and is not suitable for employing for 10,000,000,000 optical modules.
As from the foregoing, be necessary to provide a kind of operating temperature range that can enlarge 10,000,000,000 optical modules, can effectively control again 10,000,000,000 optical modules of power consumption, volume and cost.
The utility model content
The utility model provides a kind of operating temperature range that can enlarge 10,000,000,000 optical modules, can effectively control again 10,000,000,000 optical modules of power consumption, volume and cost.
The purpose of this utility model is achieved through the following technical solutions: a kind of 10,000,000,000 optical modules with temp. control function, comprise laser and single-chip microcomputer, described 10,000,000,000 optical modules also comprise photodiode, electro-heat equipment, temperature sensor and current-amplifying device:
Described photodiode is arranged at laser one side, for the proportional photogenerated current of luminous intensity generation of the light beam that sends according to laser;
The setting adjacent with described laser of described electro-heat equipment, and be electrically connected to the output of described photodiode, the photogenerated current that described photodiode produces makes described electro-heat equipment heating, to improve the working temperature of laser;
It is inner and is electrically connected to single-chip microcomputer that described temperature sensor is arranged at laser, for the temperature feedback of laser inside to single-chip microcomputer;
The input of described current-amplifying device is electrically connected to described single-chip microcomputer, and output is electrically connected to described electro-heat equipment, amplifies in order to the electric current to heater, to regulate the working temperature of laser.
Wherein, the spacing distance of described photodiode and described laser is 0.47 ~ 0.53 millimeter.
The spacing distance of described electro-heat equipment and described laser is 0.125 ~ 0.175 millimeter.
Current-amplifying device is the amplifier chip.
Described electro-heat equipment is heating resistor.
Wherein, described heating resistor can make the operating temperature range of laser improve maximum 40 ℃.
Described single-chip microcomputer is current signal or voltage signal to the control signal that current-amplifying device sends.
The curent change value of the changing value of described voltage signal or current signal and described current-amplifying device is proportional relationship.
10,000,000,000 optical modules encapsulate by XFP.
As seen from the above technical solution, photodiode and heating resistor and laser be adjacent setting all, photodiode produces proportional photogenerated current according to laser luminous intensity size, the working temperature of resistance heating raising laser after heating resistor thereby photogenerated current is flowed through.Simultaneously, establish temperature sensor in laser inside, temperature sensor inputs to single-chip microcomputer with the temperature signal of laser.Single-chip microcomputer determines whether heat to laser according to temperature signal.If the laser internal temperature is lower than set point, just single-chip microcomputer sends control signal to current amplification circuit, increase the electric current that is input to heating resistor.Due to the electric current increase, the temperature of heating resistor is just higher, thereby improves the working temperature of laser, realizes the temperature of laser is controlled, and has guaranteed its stablizing of service behaviour at a lower temperature.Simultaneously, because the device that heater of the present utility model adopts is less, so its volume and power consumption are all less, and low price.Therefore the operating temperature range that the utility model can the expansion of laser light device can effectively control again power consumption and the volume of optical module, and production cost is low, is suitable for batch production.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art.Apparently, the accompanying drawing in below describing is only embodiment more of the present utility model, for those of ordinary skills, can also obtain according to these accompanying drawing illustrated embodiments other embodiment and accompanying drawing thereof.
Fig. 1 shows operation principle block diagram of the present utility model;
Fig. 2 shows the location diagram of photodiode and heating resistor and laser.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, referring to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
Fig. 1 shows the operation principle block diagram of 10,000,000,000 optical modules with temp. control function, and as shown in Figure 1,10,000,000,000 optical modules comprise laser 1 and single-chip microcomputer 2, and single-chip microcomputer 2 is in order to control the working temperature of laser 1.10,000,000,000 optical modules also comprise photodiode 3 and heating resistor 4.Photodiode 3 is arranged at a side of laser 1, heating resistor 4 setting adjacent with laser 1, and an end of heating resistor 4 is connected with the current output terminal of photodiode 3, and the other end is connected to current-amplifying device 5.In the utility model, current-amplifying device 5 adopts the amplifier chip.The input of amplifier chip is electrically connected to single-chip microcomputer 2, and output is electrically connected to heating resistor 4.Simultaneously laser 1 inside is provided with temperature sensor 6, and temperature sensor 6 is electrically connected to single-chip microcomputer 2 and with the temperature feedback single-chip microcomputer 2 of laser 1 inside.Last 10,000,000,000 optical modules encapsulate by XFP.
Fig. 2 shows the position relationship of photodiode 3 and heating resistor 4 and laser 1.As shown in Figure 2, photodiode 3 is 0.47 ~ 0.53 millimeter with the spacing distance of laser 1, and preferably, photodiode 3 is selected 0.5 millimeter with the spacing distance of laser 1.Heating resistor 4 is 0.125 ~ 0.175 millimeter with the spacing distance of laser 1, and preferably, heating resistor 4 is selected 0.15 millimeter with the spacing distance of laser 1.
Now operation principle of the present utility model is described in detail:
In the adjacent position of laser 1, photodiode 3 and heating resistor 4 are set respectively, photodiode 3 produces proportional photogenerated current according to laser 1 luminous intensity size, the photogenerated current rear resistance heating of heating resistor 4 of flowing through, thus the working temperature around laser 1 improves.Simultaneously establish temperature sensor 6 in laser 1 inside, temperature sensor 6 inputs to single-chip microcomputer 2 with the temperature signal of laser 1, and whether single-chip microcomputer 2 determines to laser 1 heating according to temperature signal.When temperature sensor 6 detects laser 1 internal temperature lower than set point, single-chip microcomputer 2 is just given control signal of amplifier chip, and the electric current that is input to heating resistor is increased.This control signal can be current signal, also can be voltage signal, and wherein, the curent change value of the changing value of voltage signal or current signal and the output of amplifier chip is proportional relationship.Because temperature and the electric current of heating resistor is linear relationship, namely to increase the heat that heating resistor produces more along with electric current.Therefore along with the electric current that is input to heating resistor increases, the heat that heating resistor produces improves the working temperature of laser 1.Therefore after the working temperature of laser 1 was lower than 0 ℃, single-chip microcomputer 2 was controlled heating resistors and is generated heat to improve the working temperature of laser 1, thereby had guaranteed laser 1 service behaviour stable at a lower temperature.Empirical tests, heating resistor 4 heatings in the utility model can make the operating temperature range of laser 1 improve nearly 40 ℃.Therefore laser 1 is in the technical grade temperature range, just can work in namely-40 ℃ ~ 85 ℃.Thereby enlarged the operating temperature range of laser 1.
Because the device of heater employing of the present utility model is less, so its volume and power consumption are all less, the cost of components and parts is lower simultaneously.
Therefore the operating temperature range that the utility model can expansion of laser light device 1 can effectively control again power consumption and the volume of optical module, and its production cost is lower, is suitable for batch production.
The above is only preferred embodiment of the present utility model, is not be used to limiting protection range of the present utility model.All within spirit of the present utility model and principle, any modification of doing, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. 10,000,000,000 optical modules with temp. control function, comprise laser and single-chip microcomputer, it is characterized in that, described 10,000,000,000 optical modules also comprise photodiode, electro-heat equipment, temperature sensor and current-amplifying device:
Described photodiode is arranged at laser one side, for the proportional photogenerated current of luminous intensity generation of the light beam that sends according to laser;
The setting adjacent with described laser of described electro-heat equipment, and be electrically connected to the output of described photodiode, the photogenerated current that described photodiode produces makes described electro-heat equipment heating, to improve the working temperature of laser;
It is inner and is electrically connected to single-chip microcomputer that described temperature sensor is arranged at laser, for the temperature feedback of laser inside to single-chip microcomputer;
The input of described current-amplifying device is electrically connected to described single-chip microcomputer, and output is electrically connected to described electro-heat equipment, amplifies in order to the electric current to heater, to regulate the working temperature of laser.
2. 10,000,000,000 optical modules as claimed in claim 1, wherein, the spacing distance of described photodiode and described laser is 0.47~0.53 millimeter.
3. 10,000,000,000 optical modules as claimed in claim 1, wherein, the spacing distance of described electro-heat equipment and described laser is 0.125~0.175 millimeter.
4. 10,000,000,000 optical modules as claimed in claim 1, wherein, current-amplifying device is the amplifier chip.
5. 10,000,000,000 optical modules as described in any one in claim 1 to 4, wherein, described electro-heat equipment is heating resistor.
6. 10,000,000,000 optical modules as claimed in claim 1, wherein, 10,000,000,000 optical modules encapsulate by XFP.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201220301677 CN202977955U (en) | 2012-06-26 | 2012-06-26 | Million optical module with temperature control function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201220301677 CN202977955U (en) | 2012-06-26 | 2012-06-26 | Million optical module with temperature control function |
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CN202977955U true CN202977955U (en) | 2013-06-05 |
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CN 201220301677 Expired - Lifetime CN202977955U (en) | 2012-06-26 | 2012-06-26 | Million optical module with temperature control function |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105784199A (en) * | 2016-03-17 | 2016-07-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN113839301A (en) * | 2021-09-23 | 2021-12-24 | 成都英思嘉半导体技术有限公司 | Shell assembly of high-speed optical signal emitting device and high-speed optical signal emitting device |
-
2012
- 2012-06-26 CN CN 201220301677 patent/CN202977955U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105784199A (en) * | 2016-03-17 | 2016-07-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN105784199B (en) * | 2016-03-17 | 2019-06-14 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
CN113839301A (en) * | 2021-09-23 | 2021-12-24 | 成都英思嘉半导体技术有限公司 | Shell assembly of high-speed optical signal emitting device and high-speed optical signal emitting device |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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CX01 | Expiry of patent term |
Granted publication date: 20130605 |