CN102313937A - Refrigeration coaxial light-emitting pipe core - Google Patents
Refrigeration coaxial light-emitting pipe core Download PDFInfo
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- CN102313937A CN102313937A CN2010102178763A CN201010217876A CN102313937A CN 102313937 A CN102313937 A CN 102313937A CN 2010102178763 A CN2010102178763 A CN 2010102178763A CN 201010217876 A CN201010217876 A CN 201010217876A CN 102313937 A CN102313937 A CN 102313937A
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Abstract
The invention provides a refrigeration coaxial light-emitting pipe core, which comprises a TO (transmission optical) pipe shell and a sealing pipe cap with a light window. The TO pipe shell comprises a pipe shell base and a laser mounting sleeve connected with the pipe shell base in a sealing way, the pipe shell base is provided with a plurality of pins electrically connected with an external system, the inner sidewall of the laser mounting sleeve is provided with a mounting platform, a heat dissipating surface of a refrigerator is arranged on the surface of the mounting platform, a refrigeration surface of the refrigerator is used for the arrangement of a laser carrier, the surface of the laser is provided with an electro-absorption modulated n laser chip, a thermistor and a backlight detector, and the light-emitting optical axis of the laser chip is arranged coaxial with the central axis OA of the TO pipe shell and is output by the light window of the sealing pipe cap. Heat dissipation of the whole device is achieved by the laser mounting sleeve instead of the base of the traditional TO pipe shell, and the problem of laser cooling is solved. The pipe core with the structure is coupled with an external optical element of the TO pipe shell to manufacture the light-emitting component with the appearance complying with multi-source agreements XMD (Xilinx microprocessor debugger) for small devices of 10 Gb/s.
Description
Technical field
The present invention relates to a kind of optical communication system and use the light-emitting tube core, relate in particular to a kind of band refrigeration axis light emission tube core.
Background technology
The light-emitting tube core of existing two types of bands refrigeration in the optical communication system; To be the light-emitting tube core 100 as shown in Figure 2 that uses in the surface attaching type light emission component described in the CN200510007732.4 be assembled in the square metal housing 114 of band multi-layer ceramics RF radiofrequency signal feed-in interface 113 by elements such as a silicon optical bench 107 of an externally modulated laser chip 101, a back light detector 104, a band build-out resistor 105 and a microstrip line 106, a thermoelectric cooling module 108, a thermistor 109, collimation lens 110, an optoisolator 111, condenser lenses 112 a kind of Chinese invention patent application number as shown in Figure 1, and lead-in wire 115 is horizontally arranged in the afterbody of square metal housing.This emission tube core 100 is surface attaching types, and collimation lens 110 must critically be installed on the light path of the silicon optical bench 107 in the square metal housing 114 with optoisolator 111, has designed accurate V-type groove for collimation lens 110 is installed on the silicon optical bench 107; And light path adopts the double lens design, forms coupling optical path through collimation lens on the silicon optical bench 107 110 and the condenser lens 112 that is contained on the housing with external fiber adapter; RF radiofrequency signal feed-in interface 113 adopts the sealing-in of multi-layer ceramics technology on square metal housing 114, and light path design is complicated, and cost of manufacture is high, and whole tube core volume is bigger.
Coaxial type light emission component described in the another kind of U.S. Patent Publication US20070159773A1 as shown in Figure 3; Adopt transistor external form TO (Transistor Outline as shown in Figure 4; Hereinafter to be referred as TO) emission tube core 200; Comprise that elements such as a chip of laser 201, back light detector 203, light steering component 204, the carrier 205 that contains circuit component and refrigerator 206 are installed on the TO base 207, and utilize flat window pipe cap 208 sealing backs to form TO emission tube cores 200.Chip of laser 201 levels are mounted on the carrier 205 in this structure; It is vertical with external fiber adapter optical axis OA (also being TO base 207 central shafts) direction to cause the bright dipping optical axis of chip of laser 201 to be positioned at horizontal direction; Therefore need turn on the fiber adapter optical axis OA direction through the bright dipping optical axis of light steering component 204 chip of laser 201; Complex manufacturing technology, cost is high.The modulation signal of laser instrument is through adopting conductor wire 210 pressure welding connected mode feed-ins between the pin 209 of carrier 205 and base 207 bottoms; This connected mode makes modulation signal feed-in circuit have the serious discontinuous problem of impedance, and especially serious distortion can take place signal during the High Speed Modulation signal more than transmission 2.5Gb/s.In addition, refrigerator 206 levels are mounted on the TO base 207, and most of heat relies on base 207 bottoms to conduct; In the application of optical module, be distributed with many pins 209 owing to base 207 bottoms; Pin must directly weld or be welded on the circuit board of optical module through flexible PCB, has limited the installation of heat radiator, and the bottom area of dissipation is little simultaneously; Radiating efficiency is low; This design can not reach the purpose of high efficiency and heat radiation, can not bring into play the effect of refrigerator 206 effectively, thereby has limited the temperature application range of overall optical emitting module.
Summary of the invention
The present invention provides a kind of compact conformation, and technology is simple, the band refrigeration axis light emission tube core that cost is low.
For reaching above goal of the invention; The present invention provides a kind of band refrigeration axis light emission tube core; Comprise that a TO shell and is provided with the sealing pipe cap of optical window; Said TO shell comprises a shell base and the laser instrument installing sleeve that is tightly connected with it, and said shell base is used to install many pins that are electrically connected with external system, and the madial wall of said laser instrument installing sleeve is provided with a mounting platform; The radiating surface of one refrigerator is positioned over the surface of said mounting platform; The chill surface of said refrigerator is used to install a laser instrument carrier, and this carrier surface is equipped with an Electroabsorption Modulated Laser chip, a thermistor and a back light detector, and optical window through the said sealing pipe cap output coaxial with said TO shell central shaft OA of said chip of laser bright dipping optical axis.
Said pin is 7, and semiconductor laser positive pole, thermistor one utmost point, the back light detector that connects positive and negative electrode, the chip of laser of said refrigerator respectively is anodal, the electroabsorption modulator positive pole and the ground connection GND of chip of laser.
Said sealing pipe cap is a flat window pipe cap.
Said sealing pipe cap is one to be provided with the pipe cap of globe lens.
Said sealing pipe cap is one to be provided with the pipe cap of non-globe lens.
The becket that also comprises a surface gold-plating, said sealing pipe cap is sealedly connected and fixed through this becket and said laser instrument installing sleeve.
Said laser instrument carrier also is provided with the lead-in wire steering gear, and this device is used for being connected with pin after the lead-in wire switching separately of said thermistor and back light detector again.
Said lead-in wire steering gear is the derby of two surface gold-plating.
Band refrigeration axis light emission tube core in the said structure; Because TO shell base only is used to install pin; The cryomite that connects the laser instrument carrier then is installed on the set mounting platform of laser instrument installing sleeve madial wall, i.e. the heat radiation of entire device is converted to by the laser instrument installing sleeve by traditional T O shell base and accomplishes, and has solved the laser instrument heat dissipation problem preferably; And simplified technology, reduced cost.With the direct connected mode FD feed of conductive solder, reduced distorted signals through the microstrip line on the laser instrument carrier and High Speed Modulation signal feed-in pin, its operating rate can reach 10Gb/s or higher.Just can be made into outward appearance after this structure band refrigeration axis light emission tube core and the external optical element of TO shell such as elements such as optoisolator, fiber adapter are of coupled connections and meet 10Gb/s miniature device multi-source agreement (Multi-source Agreement of 10Gb/s Miniature Device; Abbreviation XMD) light emission component (the Transmitter Optical Sub-Assembly in; Be called for short TOSA), also can be applied to conduct transmitting illuminant wherein in all kinds of single fiber bi-directional assemblies or single fiber three port assemblies.
Description of drawings
Fig. 1 representes the structural representation of a kind of surface attaching type light emission component in the prior art;
Fig. 2 representes the structural representation of emission tube core shown in Figure 1;
Fig. 3 representes the structural representation of another kind of coaxial type light emission component in the prior art;
Fig. 4 representes the structural representation of emission tube core shown in Figure 3;
Fig. 5 representes a kind of band refrigeration of the present invention axis light emission tube core part blast structural representation;
Fig. 6 representes the blast structural representation of TO shell shown in Figure 5;
Fig. 7 representes laser instrument carrier structure synoptic diagram shown in Figure 5.
Embodiment
Describe most preferred embodiment of the present invention in detail below in conjunction with accompanying drawing.
Band refrigeration axis light emission tube core like Fig. 5; Comprise that a TO shell 10 and is provided with the sealing pipe cap 50 of optical window; This pipe cap can be flat window pipe cap, also can be the pipe cap that is provided with globe lens or other non-globe lens, selects for use according to the design of coupling optical path; Plating antireflective film in optical window surface is to reduce the influence of reflected light to laser instrument.TO shell 10 as shown in Figure 6 comprises a shell base 11 and the laser instrument installing sleeve 12 that is tightly connected with it; Its material can be copper or the good material of other heat conduction; When laser instrument installing sleeve 12 does not match with the material that seals pipe cap 50; The becket 40 that also comprises a surface gold-plating, sealing pipe cap 50 are connected with laser instrument installing sleeve 12 to fix with realization through this becket and are tightly connected.Shell base 11 is used to install the many pins 1101 that are electrically connected with external system; The madial wall of laser instrument installing sleeve 12 is provided with a platform 1201; The radiating surface 2001 of one refrigerator 20 is positioned on platform 1201 surfaces, and the chill surface 2002 of refrigerator 20 is used to install a laser instrument carrier 30 as one kind.Laser instrument carrier 30 as one kind mounted on surface as shown in Figure 7 has an Electroabsorption Modulated Laser chip 31, a thermistor 32 and a back light detector 33; During installation; Make and the optical window output through sealing pipe cap 50 coaxial of chip of laser 31 bright dipping optical axises with TO shell 10 central shaft OA; The laser instrument carrier 30 as one kind can also be provided with lead-in wire steering gear 34; With being connected with pin 1101 after the lead-in wire switching separately of thermistor 32 and back light detector 33, the steering gear that goes between can be the derby of two surface gold-plating again.
In the assembling process of band refrigeration axis light emission tube core of the present invention; Radiating surface 2001 usefulness conductive solder with refrigerator 20 mount on the platform 1201 earlier; The laser instrument carrier 30 as one kind is a base material with aluminium nitride (AIN) or the low material of other heat transfer efficiency high-k; Be positioned at laser instrument carrier 30 as one kind surface and mounted elements such as chip of laser 31, thermistor 32 and a back light detector 33 with conductive solder (like 80Au20Sn); Mount the laser instrument carrier 30 as one kind on the chill surface 2002 of refrigerator 20 with conductive solder after accomplishing wire bonding; And make chip of laser 31 bright dipping optical axises coaxial with TO shell 10 central shaft OA, overall package is accomplished in sealing pipe cap that is provided with optical window 50 and the 12 sealing welding of laser instrument installing sleeve.Chip of laser 31 is integrated by electroabsorption modulator and semiconductor laser, forms externally modulated laser.Thermistor 32 is temperature monitorings that the chip-scale element pasted on surface is used for chip of laser 31.Back light detector 33 is photodiodes of a kind of chip-scale, is mounted on the direction backlight of chip of laser 31, is used to monitor the backlight power of laser instrument.Lead-in wire steering gear 34 is derbies (or other material) of a surface gold-plating (or other conductive material), is used to realize two lead-in wire switchings on the vertical plane.Refrigerator 20 is semiconductor coolers of a kind of miniaturization; Utilize Peltier (Peltier) effect conversion thermal energy; Its radiating surface 2001 and chill surface 2002 are generally processed by pottery or aluminium nitride (AlN) material or the good material of other heat conduction; The thermopair that is pasted with the bismuth telluride semiconductor material formation of a plurality of N types and P type between the two sides is in series; The electrode at thermopair two ends is drawn in radiating surface 2001 inboards, and the outside surface metallization of radiating surface 2001 and chill surface 2002 as gold-plated so that mount also can be at outside surface elder generation's pre-burned one deck conductive solder such as 58Bi42Sn so that mount.
Be connected with the platform 1201 of shell base 11 inside surfaces with conducting resinl or conductive solder ground pad the laser instrument carrier 30 as one kind; The ground of laser instrument carrier 30 as one kind and the ground connection GND pin of shell base 11 are connected; Be connected with High Speed Modulation signal feed-in pin in the pin 1101 connecting the anodal microstrip line of chip of laser 31 electroabsorption modulators on the laser instrument carrier 30 as one kind with conducting resinl such as silver slurry or conductive solder such as 58Bi42Sn; Laser instrument carrier 30 as one kind side is non-conductive during installation is close to shell base 11 upper surfaces, makes microstrip line the shortest with being connected of High Speed Modulation signal feed-in pin.Being connected to the lead-in wire that will connect back light detector 33 and thermistor 32 on the lead-in wire steering gear 34 with lead-in wire like spun gold at last is transferred to respectively on the pin 1101.Pin 1101 the bests are 7, connect semiconductor laser (LD) anodal (its negative pole is connected with ground connection GND), thermistor 32 1 utmost points (another utmost point is connected with ground connection GND), back light detector 33 positive poles (negative pole is connected with ground connection GND) of positive and negative electrode, the chip of laser 31 of said refrigerator 20, electroabsorption modulator positive pole (negative pole is connected with ground connection GND) and the ground connection GND of chip of laser 31 respectively.7 pins are distributed on the shell base 11, except that grounding pin GND with conductive solder such as AgCu28 scolder and 11 welding of shell base, adopt the electric isolating seal of glass insulator sintering to be connected between other pin and the shell base 11.Be biased electric current for the semiconductor laser of chip of laser 31 by external power source, it is anodal to connect electroabsorption modulator through High Speed Modulation signal feed-in pin, and negative pole is connected with ground pad, gives the electroabsorption modulator FD feed.
Claims (8)
1. a band refrigeration axis light is launched tube core; It is characterized in that; Comprise that a TO shell and is provided with the sealing pipe cap of optical window; Said TO shell comprises a shell base and the laser instrument installing sleeve that is tightly connected with it, and said shell base is used to install many pins that are electrically connected with external system, and the madial wall of said laser instrument installing sleeve is provided with a mounting platform; The radiating surface of one refrigerator is positioned over the surface of said mounting platform; The chill surface of said refrigerator is used to install a laser instrument carrier, and this carrier surface is equipped with an Electroabsorption Modulated Laser chip, a thermistor and a back light detector, and optical window through the said sealing pipe cap output coaxial with said TO shell central shaft OA of said chip of laser bright dipping optical axis.
2. band refrigeration axis light emission tube core according to claim 1; It is characterized in that; Said pin is 7, and semiconductor laser positive pole, thermistor one utmost point, the back light detector that connects positive and negative electrode, the chip of laser of said refrigerator respectively is anodal, the electroabsorption modulator positive pole and the ground connection GND of chip of laser.
3. band refrigeration axis light emission tube core according to claim 2 is characterized in that said sealing pipe cap is a flat window pipe cap.
4. band refrigeration axis light according to claim 2 emission tube core is characterized in that, said sealing pipe cap is one to be provided with the pipe cap of globe lens.
5. band refrigeration axis light according to claim 2 emission tube core is characterized in that, said sealing pipe cap is one to be provided with the pipe cap of non-globe lens.
6. according to claim 3,4 or 5 described band refrigeration axis light emission tube cores, it is characterized in that also comprise the becket of a surface gold-plating, said sealing pipe cap is sealedly connected and fixed through this becket and said laser instrument installing sleeve.
7. the band refrigeration axis light emission tube core of stating according to claim 6 is characterized in that said laser instrument carrier also is provided with the lead-in wire steering gear, this device be used for said thermistor be connected with pin again after back light detector lead-in wire is separately transferred.
8. the band refrigeration axis light emission tube core of stating according to claim 7 is characterized in that said lead-in wire steering gear is the derby of two surface gold-plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102178763A CN102313937A (en) | 2010-07-02 | 2010-07-02 | Refrigeration coaxial light-emitting pipe core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102178763A CN102313937A (en) | 2010-07-02 | 2010-07-02 | Refrigeration coaxial light-emitting pipe core |
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| Publication Number | Publication Date |
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| CN102313937A true CN102313937A (en) | 2012-01-11 |
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| CN2010102178763A Pending CN102313937A (en) | 2010-07-02 | 2010-07-02 | Refrigeration coaxial light-emitting pipe core |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104201557A (en) * | 2014-08-28 | 2014-12-10 | 青岛海信宽带多媒体技术有限公司 | Packaging structure of adjustable laser device and packaging method therefor |
| CN104697556A (en) * | 2015-02-28 | 2015-06-10 | 武汉联钧科技有限公司 | Double-waveband photoelectric sensor |
| CN104734782A (en) * | 2013-12-19 | 2015-06-24 | 华为技术有限公司 | Optical emitter assembly and assembling method thereof |
| CN107332624A (en) * | 2017-06-20 | 2017-11-07 | 武汉光迅科技股份有限公司 | A kind of DML devices for completing linear modulation mode |
| WO2020103277A1 (en) * | 2018-11-23 | 2020-05-28 | 武汉电信器件有限公司 | High-speed eml coaxial transmitting module and manufacturing method therefor |
| CN111999823A (en) * | 2020-08-06 | 2020-11-27 | 武汉电信器件有限公司 | Light receiving device and method for manufacturing the same |
| WO2021146914A1 (en) * | 2020-01-21 | 2021-07-29 | 齐鲁工业大学 | Coaxial laser transistor-outline can package |
| CN114063222A (en) * | 2020-07-31 | 2022-02-18 | 华星光通科技股份有限公司 | Light emitter with multi-channel heat dissipation structure |
| CN114637081A (en) * | 2020-12-16 | 2022-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN116780329A (en) * | 2023-05-31 | 2023-09-19 | 河北杰微科技有限公司 | Refrigeration type laser TO packaging structure and packaging method thereof |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104734782A (en) * | 2013-12-19 | 2015-06-24 | 华为技术有限公司 | Optical emitter assembly and assembling method thereof |
| CN104201557A (en) * | 2014-08-28 | 2014-12-10 | 青岛海信宽带多媒体技术有限公司 | Packaging structure of adjustable laser device and packaging method therefor |
| CN104697556A (en) * | 2015-02-28 | 2015-06-10 | 武汉联钧科技有限公司 | Double-waveband photoelectric sensor |
| CN104697556B (en) * | 2015-02-28 | 2017-09-12 | 武汉联钧科技有限公司 | A kind of two waveband photoelectric sensor |
| CN107332624A (en) * | 2017-06-20 | 2017-11-07 | 武汉光迅科技股份有限公司 | A kind of DML devices for completing linear modulation mode |
| CN107332624B (en) * | 2017-06-20 | 2019-09-10 | 武汉光迅科技股份有限公司 | A kind of DML device of achievable linear modulation mode |
| WO2020103277A1 (en) * | 2018-11-23 | 2020-05-28 | 武汉电信器件有限公司 | High-speed eml coaxial transmitting module and manufacturing method therefor |
| WO2021146914A1 (en) * | 2020-01-21 | 2021-07-29 | 齐鲁工业大学 | Coaxial laser transistor-outline can package |
| CN114063222A (en) * | 2020-07-31 | 2022-02-18 | 华星光通科技股份有限公司 | Light emitter with multi-channel heat dissipation structure |
| CN114063222B (en) * | 2020-07-31 | 2023-05-09 | 华星光通科技股份有限公司 | Light emitter with multi-channel heat radiation structure |
| CN111999823A (en) * | 2020-08-06 | 2020-11-27 | 武汉电信器件有限公司 | Light receiving device and method for manufacturing the same |
| CN114637081A (en) * | 2020-12-16 | 2022-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN116780329A (en) * | 2023-05-31 | 2023-09-19 | 河北杰微科技有限公司 | Refrigeration type laser TO packaging structure and packaging method thereof |
| CN116780329B (en) * | 2023-05-31 | 2024-04-16 | 河北杰微科技有限公司 | Refrigeration type laser TO packaging structure and packaging method thereof |
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Application publication date: 20120111 |