CN213240598U

CN213240598U - Small-volume light emitting assembly and multichannel parallel optical device

Info

Publication number: CN213240598U
Application number: CN202021860735.9U
Authority: CN
Inventors: 万仁; 李林科; 吴天书; 杨现文; 张健
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2021-05-18
Anticipated expiration: 2030-08-31

Abstract

The utility model relates to a parallel optical device of little volume optical transmission subassembly and multichannel, little volume optical transmission subassembly include tube, lens and semiconductor laser, and the one end of tube is connected with the adapter, and the other end of tube is equipped with the opening, be fixed with insulating substrate in the opening, sealed this opening, insulating substrate's one end is located the tube, and outside insulating substrate's the other end was located the tube, semiconductor laser fixed on insulating substrate to be located the tube, be equipped with many gilts along the longitudinal extension of tube on the insulating substrate, the one end of gilt is located the tube, and the other end of gilt is located outside the tube for realize the inside and outside electrical apparatus of tube and connect. Directly sintering a ceramic carrier of a chip and a machined kovar part together to form a device tube shell; sintering glass lens makes novel TOSA on the casing, and its signal transmission quality is high, and light path stable in structure, the reliability is high, more is favorable to the chip heat dissipation, improves chip working life.

Description

Small-volume light emitting assembly and multichannel parallel optical device

Technical Field

The utility model belongs to the technical field of the optical device encapsulation, concretely relates to parallel optical device of little volume light emission component and multichannel.

Background

The BOX and TO coaxial packaging technology is the main packaging technology of the current optical devices and is applied TO a plurality of fields such as optical communication, medical equipment, detection equipment and the like; among them, the TO package technology, that is, the transistorline package technology, is a core choice for most optical device package manufacturers due TO its advantages of low manufacturing cost, high reliability, high package automation degree, and the like. The BOX packaging technology has the main advantages of good high-frequency performance and better heat dissipation of devices.

A conventional TO package manufacturing TOSA (light emitting module) is shown in fig. 9, in which a 1# component is TO, a 2# component is a sealing tube body, a 3# component is an adjusting ring, a 4# component adapter, and a 5# component is a flexible PCB; the 1# TO component is a core component, and its internal structure is shown in FIG. 10.

The existing TO packaging technology has the following defects:

in the existing TO packaging form, an input signal is loaded TO a laser (R) through pins (C, C), a lead (R) and a lead (R), so that the laser (R) is driven TO emit light, and the conversion of an electric signal into an optical signal is completed; according to the signal integrity theory, the impedance continuity of the link formed by the pins (fifthly) and (sixthly) and the leads (fifthly) and (sixthly) is difficult to ensure, and signal energy reflection and resonance are caused, so that the signal quality is influenced; in addition, the shorter the link length is, the smaller the parasitic inductance is, the better the impedance continuity is, and the trueness of the signal transmitted to the laser device (R) can be ensured. However, due TO the limitation of the existing TO packaging process, the length of pins (c), (c) and the leads (r) and (r) cannot be further shortened after being reduced TO a certain critical value, and the problem of discontinuity of link impedance exists all the time, so when the signal rate is further increased, the parasitic effect caused by the pins (c), (c) and the leads (r) and (r) seriously affects the signal quality, and the existing TO is difficult TO realize high-rate signal transmission application.

The existing TO heat dissipation channel is as follows: the chip (heat source) has long heat dissipation length, poor heat dissipation performance and influences the performance of the chip at high temperature.

The existing TO packaging process welds a pipe cap on a base through resistance welding, and simultaneously welds a sealing welding pipe body on the base through resistance welding, so that the support is that parts are adjusting rings, and the welding of a No. 4 part adapter is complex in manufacturing process.

The BXO package manufacturing TOSA (light emitting assembly) implementation is as shown in fig. 11, where the # 1 part is a tube, the # 2 part is a lens, the # 3 part is a coc (chip carrier), the # 4 part transition block, the # 5 part TEC, the # 6 part is an adjusting ring, the # 7 part is an adapter, the # 8 part is a flexible PCB, the Box package device generally operates in a scene where the operating temperature of a chip needs to be controlled, and a TEC (thermoelectric cooler) element needs to be added in the device; the Box device lens 2 is fixed by a gluing process, so it must be placed above the TEC5 to ensure that the relative position of the lens and the # 1 COC is not changed by the external ambient temperature change.

The existing BOX packaging technology has the following disadvantages:

the prior BOX packaging device needs a 5# component TEC and a 4# component heat sink to pad up the chip, so that the chip light-emitting strip is arranged in the center of the light port of the shell, and the structure is used in a scene of 'uncooled chip' and is redundant.

The temperature of the conventional BOX packaging device, a 2# component lens and a 3# component COC (chip Carrier) must be controlled, otherwise, when the working temperature of the device changes, the glue for fixing the 2# component lens changes the light path due to the deformation caused by thermal expansion and cold contraction, so that the optical device fails.

Disclosure of Invention

The utility model aims to overcome at least one defect in the prior art and provides a small-volume light emitting component and a multi-channel parallel optical device, which directly sinters the ceramic carrier of a chip and a machining kovar part together to form a device tube shell; sintering glass lens makes novel TOSA on the casing, and its signal transmission quality is high, and light path stable in structure, the reliability is high, more is favorable to the chip heat dissipation, improves chip working life.

The technical scheme of the utility model is realized like this: the utility model discloses a little volume light emission subassembly, including tube, lens and semiconductor laser, the one end of tube is connected with the adapter, and the other end of tube is equipped with the opening, be fixed with insulating substrate in the opening, sealed this opening, insulating substrate's one end is located the tube, and insulating substrate's the other end is located outside the tube, and semiconductor laser fixes on insulating substrate to be located the tube, lens are fixed on the tube is close to the terminal surface of adapter one side, or lens are fixed on the adapter, the light that semiconductor laser sent transmits to in the optic fibre of adapter behind the lens.

Furthermore, a plurality of gold-plated layers extending along the longitudinal direction of the tube shell are arranged on the insulating substrate, one end of each gold-plated layer is positioned in the tube shell, the other end of each gold-plated layer is positioned outside the tube shell and used for realizing the connection of an internal electrical appliance and an external electrical appliance of the tube shell, and the semiconductor laser is electrically connected with the corresponding gold-plated layer on the insulating substrate; the gold-plated layer on the insulating substrate is correspondingly electrically connected with the circuit board positioned outside the tube shell; the circuit board is fixed on the insulating substrate.

Furthermore, a backlight detector is fixed on the insulating substrate, and the semiconductor laser backlight enters the backlight detector to generate a photo-generated current for monitoring the size of light emitted by the semiconductor laser; the backlight detector is electrically connected with the corresponding gold-plated layer on the insulating substrate.

Furthermore, the insulating substrate is provided with at least two layers, at least two insulating substrate layers are laminated and fixed to form an integral step-shaped insulating substrate, the semiconductor laser and the backlight detector are respectively arranged on the upper end faces of different insulating substrate layers, gold-plated layers are arranged on the insulating substrate layers on which the semiconductor laser and the backlight detector are arranged, and the semiconductor laser and the backlight detector in the tube shell are electrically connected with a circuit board outside the tube shell.

Furthermore, the tube shell is square, and the bottom surface of the insulating substrate is fixed with the upper end surface of the bottom plate of the tube shell; the bottom plate of the opening end of the pipe shell is longer than the side plate and the top plate; the upper end of the tube shell is provided with an opening, and a cover plate for plugging the opening is fixed at the upper end of the tube shell to form an airtight packaging structure.

Further, the lens is die-cast with the tube shell after being melted to form an airtight structure; sintering and welding the tube shell and the insulating substrate; the semiconductor laser is eutectic welded on the insulating substrate; the insulating substrate is a ceramic substrate; the tube shell is made of metal materials or ceramic materials.

Further, the adapter is connected with the tube shell through an adjusting ring, and the adjusting ring is used for adjusting the relative position of the adapter and the semiconductor laser; an isolator is arranged in the adapter and used for reducing light reflected by the end face of the optical fiber from entering the semiconductor laser.

Furthermore, an optical fiber fixing device is fixed at one end of the tube shell close to the adapter, an optical fiber is fixedly coupled to the optical fiber fixing device, and the other end of the optical fiber is connected with the adapter and used for guiding laser into the adapter; an isolator is arranged between the optical fiber fixing device and the semiconductor laser and used for reducing light reflected by the end face of the optical fiber from entering the semiconductor laser; the optical fiber fixing device adopts a V-shaped groove substrate.

The utility model discloses a light emission subassembly still includes the refrigerator, the lower terminal surface at the tube bottom plate is fixed to the refrigerator.

Part of the metal portion of the adapter is replaced with a thermally insulating material. For example, the circumferential wall of the adapter is provided with a groove for filling heat insulation glue.

The utility model discloses a parallel optical device of multichannel, including at least two the utility model discloses a light emission subassembly. All light emitting assemblies are arranged side by side. All the light emitting assemblies share one circuit board, and the insulating substrates of all the light emitting assemblies are fixedly connected with the same circuit board.

The utility model discloses following beneficial effect has at least: compared with the prior four-level structure of 'circuit board-Kovar base-base pin-tube seat TO heat sink connecting gold wire-heat sink-chip bonding gold wire-chip' used by the TO, the light-emitting component of the utility model shortens the link length, reduces the number of impedance discontinuity points, leads the loss and reflection of high-speed signals on the link TO be less and improves the signal transmission quality by adopting the four-level structure of 'flexible circuit board-ceramic base-chip bonding gold wire-semiconductor laser'.

The heat dissipation channel of the existing light emission component is a chip (heat source) -a heat sink-a base projection-a base, wherein the base and a base boss are made of kovar alloy, the heat conductivity coefficient of the kovar alloy is only 17W/K, the heat dissipation of the chip is not facilitated, and the working performance of a device and the service life of the chip are influenced; and the utility model discloses a light emission component's heat dissipation channel does: the semiconductor laser (heat source) -ceramic substrate-metal tube shell is made of ALN ceramic material, the heat conductivity coefficient reaches 220W/K, the metal tube shell can be made of tungsten copper material, the heat conductivity coefficient reaches 200W/K, the heat conduction channel is shorter, the thermal resistance is smaller, the heat dissipation of a chip is facilitated, and the service life of the chip is prolonged;

the utility model discloses a light emission subassembly has saved TEC and heat sink part with the ceramic part beading of BOX casing in the casing bottom for the structure of this patent is simpler, more is fit for using in the scene of "uncooled chip".

The utility model discloses a light emission subassembly does not need to use hot pressure welding to accomplish being connected of pipe cap, seal welding body and base with the direct melting of lens to metal casing, makes device manufacturing process simpler.

The utility model discloses a light emission subassembly is with lens direct fusion to metal casing on, and the current BOX uses glue fixed lens for the light path stable in structure of this patent, the reliability is high.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a small-volume light emitting module according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of a small-volume light emitting module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a ceramic substrate of a small-volume light emitting module according to an embodiment of the present invention;

FIG. 4 is a schematic view of the bottom structure of the ceramic substrate of FIG. 3;

FIG. 5 is a schematic structural diagram of the bottom two layers of the ceramic substrate of FIG. 3;

fig. 6 is a schematic structural diagram of a pigtail type light emitting module according to a second embodiment of the present invention;

fig. 7 is a schematic structural diagram of a light emitting assembly with a TEC refrigeration function according to a third embodiment of the present invention;

fig. 8 is a schematic structural diagram of a multi-channel parallel optical device according to the fourth embodiment of the present invention;

fig. 9 is a schematic structural view of a light emitting module fabricated by a conventional TO package;

FIG. 10 is an internal schematic view of the TO section of an optical transmit package made from a prior art TO package;

fig. 11 is a schematic structural diagram of a light emitting module fabricated by a conventional BOX package.

In the drawing, 001 is the insulating substrate, 002 is the tube, 003 is the apron, 004 is the adjustable ring, 005 is the adapter, 006 is the circuit board, 007 is the lens, 008 is the isolator, 009 is the semiconductor laser, 010 is the detector in a poor light, 011 is the gold tin solder, 012 is square isolator, 013 is the V-arrangement groove base plate, 014 is the optic fibre, 015 is the tail optical fiber adapter, 016 is the refrigerator, 017 is the heat-insulating glue, gold-plated layer for ground connection, 019 is the gold-plated layer for laser connection, 020 is the gold-plated layer for MPD connection.

Detailed Description

The technical solutions in the embodiments of the present invention are described below clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Example one

Referring to fig. 1 to 5, the embodiment of the utility model provides a little volume light emission subassembly, including tube 002, lens 007 and semiconductor laser 009, the one end of tube 002 is connected with adapter 005, and the other end of tube 002 is equipped with the opening, be fixed with insulating substrate 001 in the opening, seal this opening, the one end of insulating substrate 001 is located tube 002, and the other end of insulating substrate 001 is located outside tube 002, and semiconductor laser 009 fixes on insulating substrate 001 to be located tube 002, lens 007 fixes on the terminal surface that tube 002 is close to adapter 005 one side, or lens 007 fixes on adapter 005, the light that semiconductor laser 009 sent transmits to the optic fibre of adapter 005 after passing through lens 007. The lens 007 is fused to the tube shell 002, and may be incorporated into the tube shell 002, welded to the outside of the tube shell 002, or welded to the adapter 005. Preferably, the lens 007 is die cast with the tube shell 002 after melting to form a gas-tight structure. The lens 007 is die-cast on the housing in a melting manner, and two functions of an airtight packaging structure and fixation of the lens 007 are realized simultaneously. The lens 007 can be a collimating lens 007 or a converging lens 007 which changes divergent light into convergent light and can be directly coupled to an optical fiber, so that an adapter is directly used at the back; the collimating lens converts diverging light into parallel light, so a lens is also needed to convert flat light into converging light to couple the light to the optical fiber. The lens 007 of this embodiment is a converging lens 007, and if the collimating lens 007 is replaced, the adapter 005 needs to be replaced with a collimating adapter 005. The utility model discloses with the direct eutectic welding of chip on insulating substrate 001, need not bond other parts like TEC, heat sink. Furthermore, a plurality of gold-plated layers extending along the longitudinal direction of the tube shell 002 are arranged on the insulating substrate 001, one end of each gold-plated layer is positioned in the tube shell 002, the other end of each gold-plated layer is positioned outside the tube shell 002 and used for realizing the internal and external electric connection of the tube shell 002, and the semiconductor laser 009 is electrically connected with the corresponding gold-plated layer on the insulating substrate 001; the gold plating layer on the insulating substrate 001 is correspondingly electrically connected with the circuit board 006 outside the tube shell 002; the circuit board 006 is fixed to the insulating substrate 001. The insulating substrate 001 is provided with a gold plating layer for grounding, a gold plating layer for laser connection, and a gold plating layer for MPD connection.

The circuit board 006 may be a flexible circuit board or a motherboard PCB, and at this time, the electrical connection is directly completed by soldering the pad and the motherboard PCB, or by gold wire bonding.

The circuit board 006 fixed on the insulating substrate 001 of the present embodiment is a flexible circuit board for flexible connection of the TOSA device and the driving board.

Further, a backlight detector 010 is fixed on the insulating substrate 001, and the semiconductor laser 009 backlight enters the backlight detector 010 to generate photo-generated current for monitoring the size of light emitted from the semiconductor laser 009; the backlight detector 010 is electrically connected with a corresponding gold plating layer on the insulating substrate 001.

Further, the insulating substrate 001 is provided with at least two layers, wherein the semiconductor laser 009 and the backlight detector 010 are respectively arranged on different insulating substrate layers, and gold-plated layers 018 are respectively arranged on the insulating substrate layers on which the semiconductor laser 009 and the backlight detector 010 are arranged, so that the semiconductor laser 009 and the backlight detector 010 in the tube shell 002 are electrically connected with the circuit board 006 outside the tube shell 002. The multi-layer of the present embodiment means at least two layers. The end faces of the insulating substrate layers 001 at one end in the case 002 are not aligned but are stepped so that the semiconductor laser 009 and the backlight detector 010 can be fixed to the upper end faces of different insulating substrate layers.

The insulating substrate 001 of this embodiment is sequentially provided with a first insulating substrate layer, a second insulating substrate layer, and a third insulating substrate layer from bottom to top. The gold-plated layers of the first and second insulating substrate layers may be electrically connected by a transition gold-plated layer, or may be electrically connected by vias filled or coated with metal.

The semiconductor laser 009 of this embodiment is fixed on the first insulating substrate layer, the backlight detector 010 is fixed on the second insulating substrate layer, the first insulating substrate layer of the insulating substrate 001 is provided with a gold-plating layer for grounding 018, the laser connection gold-plating layer 019 and the MPD connection gold-plating layer 020, the second insulating substrate layer of the insulating substrate 001 is provided with a gold-plating layer for MPD connection, the circuit board 006 is fixed on the first insulating substrate layer of the insulating substrate 001, and the gold-plating layer for grounding, the laser connection gold-plating layer and the MPD connection gold-plating layer which are respectively corresponding to and provided with the first insulating substrate layer are electrically connected. The positive electrode and the negative electrode of the backlight detector 010 are respectively and electrically connected with two spaced and insulated gold-plated layers for MPD connection on a second insulating substrate layer, and the two spaced and insulated gold-plated layers for MPD connection on the second insulating substrate layer are respectively and correspondingly electrically connected with the two spaced and insulated gold-plated layers for MPD connection on a first insulating substrate layer through via holes. The positive and negative electrodes of the semiconductor laser 009 are electrically connected to two spaced and insulated gold-plating layers for laser connection on the first insulating substrate layer, respectively.

In the embodiment, the laser is eutectic-welded on a gold-plated layer for laser connection on a first insulating substrate layer through gold-tin solder 011, and the cathode of the laser is arranged on the back of the laser, so that the electrical connection between the cathode of the laser and the gold-plated layer for laser connection on the first insulating substrate layer is completed after the eutectic welding; the positive electrode of the laser is arranged on the front surface of the laser, and the positive electrode of the laser is electrically connected with the other laser connecting gold-plated layer on the first insulating substrate layer through a gold wire. The positive electrode and the negative electrode of the backlight detector 010 are electrically connected with two spaced and insulated gold-plated layers for MPD connection on the second insulating substrate layer through gold wires respectively.

The insulating substrate 001 of this embodiment is provided with three layers. The insulating substrate 001 is provided with multiple layers to utilize the longitudinal space, and if a single-layer design is used, the length of the device is increased, and the structure of the part is as follows: ceramic-laser gold layer-ceramic-detector gold layer-ceramic; in fact, the structure of three-layer ceramic + two-layer circuit; the multilayer ceramic is formed by pressing together at high temperature, and the gold layers are clamped by two layers of ceramic, so that the gold layers in the ceramic are insulated from the gold layers, and the gold layers and the shell are insulated from metal.

The insulating substrate 001 is a ceramic substrate, and ALN, AL2O3 or other ceramic materials may be used. Of course, the insulating substrate 001 may be replaced with the PCB 006. The insulating substrate 001 may be made of a semiconductor material such as silicon. Pure silicon has very low conductivity at room temperature, close to an insulator. Doping silicon, due to its small bandgap, can form either a p-type or n-type semiconductor, the conductivity of which is again determined by the doping concentration. After gold plating on the upper surface of the silicon, the current will go away with gold and not with silicon because of the resistance.

Preferably, the insulating substrate 001 of the present embodiment is a ceramic substrate, and is formed by laminating multiple layers of ceramics at a high temperature, wherein two layers of ceramics are plated with gold to realize electrical connection between the inside and the outside of the case.

Further, the tube shell 002 is square, and the bottom surface of the insulating substrate 001 is fixed with the upper end surface of the bottom plate of the tube shell 002; the bottom plate of the opening end of the tube shell 002 is longer than the side plate and the top plate; an opening is formed in the upper end of the tube shell 002, and a cover plate 003 for plugging the opening is fixed to the upper end of the tube shell. The cover plate 003 and the tube shell 002 are welded together through a parallel seal welding process to form an airtight packaging structure.

Further, the tube shell 002 is sintered and welded with the insulating substrate 001; eutectic soldering of the semiconductor laser 009 on the insulating substrate 001 through the gold-tin solder 011 on the insulating substrate 001; the semiconductor laser 009 implements photoelectric conversion.

The tube shell 002 is made of metal material or ceramic material. The semiconductor laser 009 uses a DFB chip, which may be replaced with an EML (electro absorption modulated laser) chip or other laser chip.

Preferably, the tube shell 002 of the present embodiment is a metal tube shell 002, which is machined from a high thermal conductivity metal material, and is sintered and welded with the ceramic substrate to form a novel TOSA housing.

Further, the adapter 005 is connected to the tube housing 002 through an adjusting ring 004, and the adjusting ring 004 is used for adjusting the relative position of the adapter 005 and the semiconductor laser 009; an isolator 008 is arranged in the adapter 005 and used for reducing light reflected by the end face of the optical fiber from entering the semiconductor laser 009. The adjusting ring 004 is welded and fixed with the adapter 005 and the tube shell 002 respectively. And an adapter 005 for connecting an external optical fiber.

The optical path design of the light emitting module of the present embodiment is as follows:

the semiconductor laser 009 emits divergent light, which is converged into the optical fiber of the adapter 005 after passing through the lens 007 melted on the metal case 002; the backlight of the semiconductor laser 009 enters the backlight detector 010 to generate photo-generated current for monitoring the amount of light emitted from the semiconductor laser 009.

The light emitting module of the present embodiment is assembled as follows:

step 1: melting the lens 007, and cooling and sintering the melted lens and the metal shell together in a mold to obtain a first assembly;

step 2: sintering the ceramic and the component I together by using high-degree solder, and obtaining a component II;

and step 3: the semiconductor laser 009 and the gold-tin solder 011 sheet are welded on a second component by using a eutectic soldering process, and the second component is called a third component;

and 4, step 4: the backlight detector 010 is fixedly crystallized on a component III by using silver adhesive, and the component III is called as a component IV;

and 5: the gold wire bonding process of the semiconductor laser 009 and the backlight detector 010 is completed, and the semiconductor laser 009 and the backlight detector 010 are connected with a ceramic electrical appliance, which is called as a component five;

step 6: the cover plates 003 are welded together by a parallel seal welding process to form an airtight mechanism, namely a component six;

and 7: welding the adapter 005 and the adjusting ring 004 to the sixth assembly by using a coupling welding process to complete the manufacture of the novel TOSA;

and finishing assembly of the components.

Example two

Referring to fig. 6, the adapter 005 and adjustment ring 004 assembly of the first embodiment may be replaced by fiber bonding, i.e., the tube housing 002 of the present embodiment is connected to the adapter 005 through a fiber. The concrete structure is as follows:

one end of the tube shell 002, which is close to the adapter 005, is fixed with a V-shaped groove substrate 013, an optical fiber is fixedly coupled to the V-shaped groove substrate 013, and the other end of the optical fiber is connected with the pigtail adapter 015, so as to guide laser into the pigtail adapter 015; a square isolator 012 is arranged between the V-groove substrate 013 and the semiconductor laser 009 for reducing light reflected from the end face of the optical fiber entering the semiconductor laser 009. Preferably, the lens 007 is fixed to the end surface of the tube housing 002 on the side close to the adapter 005 to form an airtight structure. The pigtail adapter 015 is used to connect external optical fibers. The bottom plate of the tube case 002 near the end of the adapter 005 is longer than the side plate and the top plate.

The light emitting module of the present embodiment is assembled as follows:

step 1: melting the lens 007, and cooling and sintering the lens 007 and the metal tube shell 002 together in a mold to form a first assembly;

step 2: sintering the ceramic substrate and the first component together by using high-degree solder, and obtaining a second component;

and 7: the bottom surface of the V-groove substrate 013 is gold plated, soldered to the bottom plate of the tube housing 002 using low temperature solder, and the optical fiber is coupled to the V-groove substrate 013.

And finishing assembly of the components.

Other technical features of the present embodiment are the same as those of the first embodiment.

EXAMPLE III

Referring to fig. 7, the light emitting assembly of the present embodiment further includes a thermo electric cooler 016(TEC) for controlling the overall temperature of the device; the thermoelectric refrigerator 016 is fixed on the lower end face of the tube shell 002 bottom plate.

Further, the circumferential wall of the adapter 005 is provided with a groove.

Part of the metal portion of the adapter is replaced with a thermally insulating material. This embodiment cuts the metal portion of adapter 005 and fills with thermal insulating glue 017 in order to prevent the heat from the metal portion of adapter 005 from being transferred.

Example four

Referring to fig. 8, the present invention discloses a multi-channel parallel optical device, which comprises at least two light emitting modules of the first embodiment, wherein all the light emitting modules are arranged side by side. All the light emitting modules share one circuit board 006, and the insulating substrates of all the light emitting modules are fixedly connected with the same circuit board.

Of course, the multi-channel parallel optical device of the present invention can also adopt the light emitting module of the second embodiment or the third embodiment.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a small size light emission subassembly, includes tube, lens and semiconductor laser, and the one end of tube is connected with adapter, its characterized in that: the other end of tube is equipped with the opening, be fixed with insulating substrate in the opening, sealed this opening, insulating substrate's one end is located the tube, and insulating substrate's the other end is located outside the tube, and semiconductor laser fixes on insulating substrate to be located the tube, lens are fixed on the terminal surface that the tube is close to adapter one side, or lens are fixed on the adapter, the light that semiconductor laser sent transmits to in the optic fibre of adapter behind the lens.

2. A low-volume light emitting assembly as claimed in claim 1, wherein: the semiconductor laser device comprises a tube shell, an insulating substrate, a semiconductor laser and a plurality of gold-plated layers, wherein the insulating substrate is provided with the plurality of gold-plated layers extending along the longitudinal direction of the tube shell, one end of each gold-plated layer is positioned in the tube shell, the other end of each gold-plated layer is positioned outside the tube shell and used for realizing the connection of an internal electrical appliance and an external electrical appliance of the tube shell, and; the gold-plated layer on the insulating substrate is correspondingly electrically connected with the circuit board positioned outside the tube shell; the circuit board is fixed on the insulating substrate.

3. A low-volume light emitting assembly as claimed in claim 2, wherein: a backlight detector is also fixed on the insulating substrate, and the semiconductor laser backlight enters the backlight detector to generate photoproduction current for monitoring the size of light emitted by the semiconductor laser; the backlight detector is electrically connected with the corresponding gold-plated layer on the insulating substrate.

4. A low-volume light emitting assembly as claimed in claim 3, wherein: the insulating substrate is provided with at least two layers, at least two insulating substrate layers are laminated and fixed to form an integral step-shaped insulating substrate, the semiconductor laser and the backlight detector are arranged on the upper end faces of the different insulating substrate layers respectively, gold-plated layers are arranged on the insulating substrate layers provided with the semiconductor laser and the backlight detector, and the semiconductor laser and the backlight detector in the tube shell are electrically connected with a circuit board outside the tube shell.

5. A low-volume light emitting assembly as claimed in claim 1, wherein: the tube shell is square, and the bottom surface of the insulating substrate is fixed with the upper end surface of the bottom plate of the tube shell; the bottom plate of the opening end of the pipe shell is longer than the side plate and the top plate; the upper end of the tube shell is provided with an opening, and a cover plate for plugging the opening is fixed at the upper end of the tube shell to form an airtight packaging structure.

6. A low-volume light emitting assembly as claimed in claim 1, wherein: the lens is die-cast with the tube shell after being melted to form an airtight structure; sintering and welding the tube shell and the insulating substrate; the semiconductor laser is eutectic welded on the insulating substrate; the insulating substrate is a ceramic substrate; the tube shell is made of metal materials or ceramic materials.

7. A low-volume light emitting assembly as claimed in claim 1, wherein: the adapter is connected with the tube shell through an adjusting ring, and the adjusting ring is used for adjusting the relative position of the adapter and the semiconductor laser; an isolator is arranged in the adapter and used for reducing light reflected by the end face of the optical fiber from entering the semiconductor laser.

8. A low-volume light emitting assembly as claimed in claim 1, wherein: an optical fiber fixing device is fixed at one end, close to the adapter, of the tube shell, an optical fiber is fixedly coupled to the optical fiber fixing device, and the other end of the optical fiber is connected with the adapter and used for guiding laser into the adapter; an isolator is arranged between the optical fiber fixing device and the optical window of the tube shell and used for reducing light reflected by the end face of the optical fiber from entering the semiconductor laser; the optical fiber fixing device adopts a V-shaped groove substrate.

9. A low-volume light emitting assembly as claimed in claim 1, wherein: the refrigerator is fixed on the lower end surface of the tube shell bottom plate.

10. A multi-channel parallel optical device, comprising: comprising at least two low-volume light emitting assemblies as claimed in any of claims 1 to 9, all arranged side by side.