CN213814047U

CN213814047U - High-frequency light emitter with refrigeration and high-frequency light emitting assembly

Info

Publication number: CN213814047U
Application number: CN202023119865.XU
Authority: CN
Inventors: 林桂光; 司马卫武
Original assignee: Hunan Guangzhi Communication Technology Co ltd
Current assignee: Hunan Guangzhi Communication Technology Co ltd
Priority date: 2020-12-22
Filing date: 2020-12-22
Publication date: 2021-07-27
Anticipated expiration: 2030-12-22

Abstract

The utility model discloses a take cryogenic high frequency light emitter, including tube socket, pipe cap and lens, the tube socket includes pedestal, TEC, radiator, LD chip, thermistor and a plurality of pin, and the radiator is including fixing the first radiating part and the vertical second radiating part that sets up above first radiating part at TEC's upper surface, and thermistor sets up on first radiating part, and the LD chip sets up at second radiating part and its play plain noodles just to lens. The utility model discloses a TO encapsulation, it is small, and it realizes the cooling through the TEC, avoids influencing the output wavelength because of the high temperature of LD chip TO ensure that the output wavelength is stable. The thermistor is arranged at the first heat dissipation part, and the LD chip is arranged at the second heat dissipation part, so that the heat dissipation effect is good; meanwhile, the LD chip is vertically pasted on the lens, a reflector is not needed for light path reflection, and the coupling efficiency is high. In addition, the utility model also discloses a coaxial cryogenic high frequency light emission subassembly of taking.

Description

High-frequency light emitter with refrigeration and high-frequency light emitting assembly

Technical Field

The utility model relates to an optical communication technical field especially relates to a take cryogenic high frequency light transmitter and coaxial band refrigerated high frequency light emission subassembly.

Background

Optical fiber communication has been developed as one of the main communication methods because of its advantages of large communication capacity, long transmission distance, and strong anti-electromagnetic interference capability. The optical transmitter is a main light source for optical fiber communication and is a core device of the optical fiber communication. Because the output wavelength of the LD chip of the optical transmitter is affected by high temperature, when the temperature of the LD chip is kept below a certain temperature, the output wavelength can be kept stable, and the conventional optical transmitter without a refrigeration function often cannot meet the application requirements of a DWDM (dense optical wavelength division multiplexing) system.

Therefore, an optical transmitter with a thermoelectric cooler is proposed, and since the optical transmitter with a thermoelectric cooler in the prior art is usually a box-type (box-type) package (such as chinese patent CN201120018424.2), the size is large, and it is difficult to meet the current increasingly miniaturized package requirements, and the cost is high and the performance is unstable. In addition, the signal transmission pin of the LD chip of the existing light emitter is directly connected with the pin of the tube seat in a wiring way, and the signal transmission pin and the pin of the LD chip have extremely small radial sizes, so that the wiring difficulty is high; moreover, a plurality of metal wires cannot be connected between the pin and the signal transmission pin of the LD chip, and are only suitable for transmitting low-frequency signals (e.g., 10G), and cannot meet the transmission requirement of high-frequency signals (e.g., 25G).

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a refrigerated high frequency light transmitter in area that small, radiating effect are good and output wavelength is stable.

Another object of the present invention is to provide a coaxial high-frequency light emitting assembly with refrigeration, which has small volume, good heat dissipation effect and stable output wavelength.

In order to achieve the above object, the present invention provides a high frequency light emitter with refrigeration, which comprises a tube socket, a cap on the upper portion of the tube socket and a lens on the top of the cap. The tube seat comprises a seat body, a TEC, a radiator, an LD chip, a thermistor and a plurality of pins, wherein the TEC, the radiator, the LD chip and the thermistor are arranged on the upper surface of the seat body, and the pins are inserted and fixed on the seat body. The heat radiator comprises a first heat dissipation part fixed on the upper surface of the TEC and a second heat dissipation part vertically arranged above the first heat dissipation part. The thermistor is arranged on the first heat dissipation part, a gasket is arranged on the side wall of the second heat dissipation part, the LD chip is arranged on the gasket, and the light emitting surface of the LD chip is opposite to the lens.

Preferably, a backlight detector is further disposed on the first heat dissipation portion, and the backlight detector is located right below the LD chip.

Preferably, the first heat sink part includes a first heat sink area and a second heat sink area located at opposite sides of the second heat sink part, an upper surface of the first heat sink area is an inclined surface inclined downward from a side close to the second heat sink part, and the backlight detector and the thermistor are disposed on the upper surface of the first heat sink area.

Preferably, the upper surface of the second heat dissipation area is a horizontal plane, and the area of the second heat dissipation area is smaller than that of the first heat dissipation area.

Preferably, the heat sink is made of copper.

Preferably, a first metal plating layer is formed on the side of the gasket where the LD chip is disposed, the LD chip is electrically connected to the first metal plating layer, a binding post is disposed on the upper surface of the base, a second metal plating layer is formed on the side of the binding post, the second metal plating layer is eutectic-welded to a signal transmission pin of the plurality of pins, and the second metal plating layer is electrically connected to the first metal plating layer through a plurality of metal wires.

Preferably, the wiring terminal is opposite to the gasket, and the second metal plating layer is parallel to and has the same orientation as the first metal plating layer.

Specifically, the high-frequency light emitter comprises two signal transmission pins and a binding post, and the gasket is formed with two first metal plating layers arranged at intervals.

To achieve the above-mentioned another object, the present invention provides a coaxial band-cooling high-frequency light emitting assembly, which includes a band-cooling high-frequency light emitter, an axial adjusting ring, an adapter, and an isolator. The axial adjusting ring is in a hollow cylindrical shape and is coaxially arranged with the high-frequency light emitter. The adapter comprises a shell and an inserting core inserted in the shell, the lower part of the shell penetrates through the axial adjusting ring, and the isolator is arranged in the shell. The high frequency light emitter is as described above.

Specifically, the axial adjustment ring includes a side wall portion coaxial with a tube cap of the high-frequency light emitter and a flange portion formed by outward protruding arrangement of a bottom of the side wall portion, a sleeve is covered on an outer portion of the tube cap, a through hole exposing the lens is formed in a top wall of the sleeve, and the flange portion and the top wall of the sleeve are welded and fixed.

Compared with the prior art, the utility model discloses a TO encapsulation, it is small, with low costs, it realizes the cooling through the TEC, avoids influencing its output wavelength because of the high temperature of LD chip TO ensure output wavelength's stability, can be applicable TO the DWDM system. Moreover, the utility model is also provided with a radiator, the thermistor is arranged at the first radiating part, and the LD chip is arranged at the second radiating part, so that the radiating effect is good; meanwhile, the second heat dissipation part is vertically designed, the LD chip is vertically pasted with the lens, a reflector is not needed for light path reflection, the coupling efficiency is high, and the cost of the reflector is saved. In addition, compared with a mode of directly wiring and electrically connecting the signal transmission pins of the LD chip with very small signal transmission pins, the arrangement of the first metal plating layer and the second metal plating layer can provide a larger wiring area, so that a plurality of metal wires can be electrically connected with the second metal plating layer and the first metal plating layer, the transmission requirement of high-frequency signals can be met, and the processing is easy. In addition, the backlight detector is arranged right below the LD chip, and the conventional front light receiving chip is adopted, so that the process is simple.

Drawings

Fig. 1 is a schematic perspective view of a coaxial high-frequency light emitting module with refrigeration according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view of the light emitting assembly shown in fig. 1.

Fig. 3 is a schematic diagram of a partial structure of the light emitter shown in fig. 1.

Fig. 4 is another angle of the structure shown in fig. 3.

Fig. 5 is a top view of the structure shown in fig. 3.

Detailed Description

In order to explain technical contents, structural features, and effects achieved by the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

In the description of the present invention, it should be understood that the terms "upper", "lower", "bottom", "top", "horizontal", "vertical", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and thus, are not to be construed as limiting the protection of the present invention.

Referring to fig. 1 to 5, the present invention discloses a coaxial band cooling high frequency light emitting module 100, which has stable output wavelength and can be applied to DWDM system. The optical transmission assembly 100 includes a high-frequency light emitter 10 with a cooling function, an axial adjusting ring 20, an adapter 30 and an isolator (not shown), wherein the axial adjusting ring 20 is in a hollow cylindrical shape and is coaxially disposed with the high-frequency light emitter 10, the adapter 30 includes a housing 31 and an insert core 32 inserted into the housing 31, a lower portion of the housing 31 is inserted into the axial adjusting ring 20, and the isolator is disposed in an accommodating groove 311 (shown in fig. 2) at a lower portion of the housing 31. The high-frequency light emitter 10 comprises a tube seat, a tube cap 11 sleeved on the upper portion of the tube seat, a lens 12 arranged on the top of the tube cap 11, and a sleeve 110 covering the outside of the tube cap 11, wherein a through hole 111 exposing the lens 12 is formed in the top wall of the sleeve 110, and the bottom of the axial adjusting ring 20 is fixed with the top wall of the sleeve 110. The base comprises a base body 13, a TEC141 arranged on the upper surface of the base body 13, a thermistor 142, a heat sink 15, an LD chip 161, and a plurality of pins 17 inserted and fixed on the base body 13, wherein the heat sink 15 comprises a first heat dissipation part 151 fixed on the upper surface of the TEC141 and a second heat dissipation part 152 vertically arranged on the first heat dissipation part 151, the thermistor 142 is arranged on the first heat dissipation part 151, a gasket 162 is arranged on the side wall of the second heat dissipation part 152, the LD chip 161 is arranged on the gasket 162, and the light-emitting surface of the LD chip 161 is opposite to the lens 12. The heat sink 15 is made of copper, which has a good heat dissipation effect, but should not be limited thereto.

As shown in fig. 3, a first metal plating layer 163 is formed on a side surface of the pad 162 where the LD chip 161 is disposed, and a signal transmission pin of the LD chip 161 is electrically connected to the first metal plating layer 163. A wiring terminal 18 is disposed on the upper surface of the base 13, a second metal plating layer 180 is formed on a side surface of the wiring terminal 18, the second metal plating layer 180 is eutectic-welded with a signal transmission pin (a pin for transmitting a signal, hereinafter referred to as 171) of the plurality of pins 17, and the second metal plating layer 180 is electrically connected with the first metal plating layer 163 through a plurality of metal wires (not shown). Through setting up first metal coating 163, terminal 18 and set up second metal coating 180 in the side of terminal 18, first metal coating 163, second metal coating 180 can provide bigger wiring area, consequently can connect many metal conductors at second metal coating 180, first metal coating 163 electricity to can satisfy the transmission demand of high frequency signal, and workable.

As shown in fig. 5, the high-frequency light emitter 10 includes two signal transmission pins 171 (a positive pin and a negative pin, which are finally electrically connected to the positive pin and the negative pin of the LD chip 161, respectively), and correspondingly, two terminals 18 are disposed on the base 13, and the two terminals 18 are spaced apart from each other. Similarly, the pad 162 is formed with two first metal plating layers 163, the two first metal plating layers 163 are disposed at intervals (as shown in fig. 3), and each second metal plating layer 180 is electrically connected to one first metal plating layer 163 through a plurality of metal wires. In the embodiment shown in fig. 3, two of the terminals 18 are respectively located on two opposite sides of the pad 162 and are disposed opposite to the pad 162, and the second metal plating layer 180 is parallel to and oriented in the same direction (in the direction of the thermistor 142) as the two first metal plating layers 163. Therefore, the first metal plating layer 163 and the second metal plating layer 180 are conveniently electrically connected, and the processing difficulty is reduced. In this embodiment, the height of the two posts 18 is slightly lower than that of the heat sink 15, but it should not be limited thereto.

Further, a backlight detector (MPD)19 is disposed on the first heat sink portion 151, and the backlight detector 19 is located directly below the LD chip 161. The backlight detector 19 adopts a conventional front light receiving chip, and the process is simple.

As shown in fig. 3 and 4, the high frequency light emitter 10 includes seven pins, two of which are signal transmission pins 171, and the remaining five pins 17 are used for connecting the TEC141, the thermistor 142, the backlight detector 19, and the ground (prior art). Each of the

pins

17 and 171 includes a portion exposed to the upper surface of the housing 13 and a portion located below the housing 13. Incidentally, the upper surface of the heat sink 15 further has a plurality of soldering regions (not shown) arranged at intervals, the TEC141, the thermistor 142, the backlight detector 19, and the like are electrically connected to the corresponding soldering regions, and each soldering region is electrically connected to the corresponding pin 17, so as to electrically connect each component and the pin 17.

As shown in fig. 3 and 4, the first heat sink portion 151 includes a first heat sink area 1511 and a second heat sink area 1512 located at two opposite sides of the second heat sink portion 152, an upper surface of the first heat sink area 1511 is an inclined surface inclined downward from a side close to the second heat sink portion 152, and the backlight detector 19 and the thermistor 142 are disposed on the upper surface of the first heat sink area 1511. The upper surface of the second heat dissipation area 1512 is a horizontal plane, and the area of the second heat dissipation area 1512 is smaller than the area of the first heat dissipation area 1511.

As shown in fig. 1 and 2, the axial adjustment ring 20 includes a side wall portion 21 disposed coaxially with the pipe cap 11, and a flange portion 22 formed by protruding outward from a bottom portion of the side wall portion 21, and the flange portion 22 is welded and fixed to a top wall of the sleeve 110. In the embodiment shown in fig. 1 and 2, the radial dimension of the axial adjustment ring 20 is smaller than the radial dimension of the sleeve 110, and the top wall of the sleeve 110 extends outward beyond the flange portion 22, but this should not be construed as limiting.

TO sum up, the utility model discloses a TO encapsulation, it is small, with low costs, it realizes the cooling through TEC141, avoids influencing its output wavelength because of LD chip 161's high temperature TO ensure output wavelength's stability, can be applicable TO the DWDM system. Moreover, the utility model is also provided with a radiator 15, the thermistor 142 is arranged at the first heat dissipation part 151, and the LD chip 161 is arranged at the second heat dissipation part 152, so that the heat dissipation effect is good; meanwhile, the second heat dissipation part 152 is designed vertically, the LD chip 161 is directly mounted on the lens 12 vertically, and a reflector is not needed for light path reflection, so that the coupling efficiency is high, and the reflector cost is saved. In addition, compared with the way of directly connecting the pins of the LD chip 161 and the very thin signal transmission pins 171 electrically, the arrangement of the first metal plating layer 163 and the second metal plating layer 180 can provide a larger connection area, so that a plurality of metal wires can be electrically connected to the second metal plating layer 180 and the first metal plating layer 163, thereby meeting the transmission requirement of high-frequency signals and being easy to process. In addition, the backlight detector 19 is arranged right below the LD chip 161, and a conventional front light receiving chip is adopted, so that the process is simple. In addition, the coaxial design of the high-frequency light emitting assembly 100 is also beneficial to further realizing miniaturization, and meanwhile, the high-frequency light emitting assembly can also be suitable for most optical modules.

The above disclosure is only a preferred embodiment of the present invention, and certainly, the scope of the present invention should not be limited thereto, and therefore, the scope of the present invention is not limited to the above embodiments.

Claims

1. The high-frequency light emitter with refrigeration is characterized by comprising a tube seat, a tube cap and a lens, wherein the tube cap is sleeved on the upper portion of the tube seat, the lens is arranged at the top of the tube cap, the tube seat comprises a seat body, a TEC, a radiator, an LD chip, a thermistor and a plurality of pins, the TEC, the radiator, the LD chip and the thermistor are arranged on the upper surface of the seat body, the pins are inserted and fixed on the seat body, the radiator comprises a first radiating portion and a second radiating portion, the first radiating portion is fixed on the upper surface of the TEC, the second radiating portion is vertically arranged on the first radiating portion, a gasket is arranged on the side wall of the second radiating portion, the LD chip is arranged on the gasket, and the light emitting surface of the LD chip is right opposite to the lens.

2. The high-frequency light emitter according to claim 1, wherein a backlight detector is further provided on the first heat sink portion, the backlight detector being located directly below the LD chip.

3. The high-frequency light emitter according to claim 2, wherein the first heat sink member includes a first heat sink region and a second heat sink region on opposite sides of the second heat sink member, an upper surface of the first heat sink region is an inclined surface inclined downward from a side close to the second heat sink member, and the backlight detector and the thermistor are provided on the upper surface of the first heat sink region.

4. The high-frequency optical transmitter according to claim 3, wherein an upper surface of the second heat dissipation region is a horizontal plane, and an area of the second heat dissipation region is smaller than an area of the first heat dissipation region.

5. The high frequency optical transmitter of claim 1 wherein said heat sink is copper metal.

6. The high-frequency light emitter of claim 1, wherein the spacer has a first metal plating layer formed on a side surface thereof on which the LD chip is disposed, the LD chip is electrically connected to the first metal plating layer, a post is disposed on an upper surface of the base, a second metal plating layer is formed on a side surface of the post, the second metal plating layer is eutectic-welded to a signal transmission pin of the plurality of pins, and the second metal plating layer is electrically connected to the first metal plating layer through a plurality of metal wires.

7. The high frequency light emitter of claim 6 wherein said post is disposed opposite said spacer, and said second metallization layer is parallel to and facing the same direction as said first metallization layer.

8. The high-frequency optical transmitter according to claim 6, comprising two signal transmission pins and two terminals, wherein the spacer is formed with two spaced first metal plating layers.

9. The coaxial high-frequency light emitting assembly with refrigeration is characterized by comprising a high-frequency light emitter with refrigeration, an axial adjusting ring, an adapter and an isolator, wherein the axial adjusting ring is hollow and cylindrical and is coaxially arranged with the high-frequency light emitter, the adapter comprises a shell and an inserting core inserted in the shell, the lower portion of the shell is arranged in the axial adjusting ring in a penetrating mode, the isolator is arranged in the shell, and the high-frequency light emitter is as claimed in any one of claims 1 to 8.

10. The coaxial high-frequency light emitting assembly with refrigeration of claim 9, wherein the axial adjustment ring comprises a sidewall coaxially disposed with the cap of the high-frequency light emitter and a flange formed by protruding the bottom of the sidewall, the cap is covered with a sleeve, the top wall of the sleeve is opened with a through hole exposing the lens, and the flange is welded and fixed with the top wall of the sleeve.