CN219777989U - Miniaturized multichannel photoelectric module - Google Patents
Miniaturized multichannel photoelectric module Download PDFInfo
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- CN219777989U CN219777989U CN202223483602.6U CN202223483602U CN219777989U CN 219777989 U CN219777989 U CN 219777989U CN 202223483602 U CN202223483602 U CN 202223483602U CN 219777989 U CN219777989 U CN 219777989U
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- shell
- housing
- pcb assembly
- notch
- boss
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- 239000013307 optical fiber Substances 0.000 claims description 8
- 230000005693 optoelectronics Effects 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum alloy Chemical class 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model discloses a miniaturized multichannel photoelectric module assembly, which comprises: a first housing, a second housing, and a PCB assembly, the second housing having a cutout; the PCB assembly is arranged between the first shell and the second shell, a convex connecting table is arranged on the PCB assembly, and the connecting table is matched with the notch and extends out of the notch. The photoelectric module assembly adopts a patch type packaging structure, so that the size of a shell is greatly reduced, the miniaturization packaging of the 24-channel receiving and transmitting integrated 25G parallel optical module is substantially improved, meanwhile, the internal packaging structure is changed, and the heat dissipation is improved by utilizing the contact of a boss and a chip, so that the overall power consumption of the photoelectric module is reduced.
Description
Technical Field
The utility model belongs to the technical field of photoelectric modules, and particularly relates to a miniaturized multichannel photoelectric module.
Background
The steady development of the global telecommunication industry and the steady growth of broadband users lay a solid foundation for the development of the optical communication industry. With the continuous increase of global bandwidth demands and the expansion of application fields of data centers and security monitoring optical communication industries, optical fiber broadband access has become a mainstream communication mode.
The main stream research and development and large-scale application of the 24-channel transceiving integrated 25G parallel optical module in the prior art 25G commercial specification are packaged into QSFP28 and SFP28 squirrel-cage forms, and the shell of the packaged optical module is large in thickness and size and cannot meet the requirements of miniaturized multichannel optical transmission because the shell is required to meet the requirements of plug-in interfaces and heat dissipation.
Disclosure of Invention
Aiming at the problems in the prior art, the utility model provides the following technical scheme:
a miniaturized multi-channel optoelectronic module assembly comprising:
a first housing;
the second shell is provided with a notch;
and the PCB assembly is arranged between the first shell and the second shell, and is provided with a convex connecting table which is matched with the notch and extends out of the notch.
Preferably, the four corners of the second shell are provided with connecting holes.
Preferably, a recessed receiving cavity is provided on the first housing, the receiving cavity matching the PCB assembly.
Preferably, the second shell is further provided with a protruding limiting step, the limiting step is attached to the inner wall of the edge of the accommodating cavity, and the limiting step compresses the PCB assembly in the accommodating cavity.
Preferably, through holes are formed in the diagonal sides of the accommodating cavity, and threaded holes corresponding to the through holes are formed in the second shell.
Preferably, a first locking groove is formed in the first shell, a second locking groove is formed in the second shell, and when the first shell and the second shell are combined, the first locking groove and the second locking groove are also combined into a complete through groove, a tail sleeve is fixed in the through groove, and optical fibers on the PCB assembly are thrown out of the tail sleeve.
Preferably, the accommodating cavity is internally provided with a convex boss, the boss corresponds to the chip on the PCB assembly in position, the printed board of the PCB assembly is windowed to fix the chip on the boss, and the boss is made of heat-conducting metal.
The beneficial effects of the utility model are as follows: the photoelectric module assembly adopts a patch type packaging structure, so that the size of a shell is greatly reduced, the miniaturization packaging of the 24-channel receiving and transmitting integrated 25G parallel optical module is substantially improved, meanwhile, the internal packaging structure is changed, and the heat dissipation is improved by utilizing the contact of a boss and a chip, so that the overall power consumption of the photoelectric module is reduced.
Drawings
Fig. 1 shows a schematic structure of an optoelectronic module;
fig. 2 shows a schematic structural view of the second housing;
fig. 3 shows a schematic structural view of the first housing;
FIG. 4 is a schematic structural view of a PCB assembly;
fig. 5 is a schematic view showing a state in which the PCB assembly is assembled into the first housing.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments.
Fig. 1 shows a schematic structure of a photovoltaic module. The photoelectric module comprises a first shell 10, a second shell 20 and a PCB assembly 30, wherein the first shell 10 and the second shell 20 are combined and fixed to form a box body fixed to the PCB assembly 30, and the PCB assembly 30 is fixedly arranged between the first shell 10 and the second shell 20.
In this embodiment, the first housing 10 is an upper cover, the second housing 20 is a lower cover, the second housing 20 is attached to and fixed to an electrical connector to be connected during installation, the first housing 10 is exposed to the outside, and correspondingly, the PCB assembly 30 is provided with a protruding connection platform 31, the second housing 20 is provided with a notch 21 corresponding to the connection platform 31 to expose the connection platform 31, and contacts are integrated on the connection platform 31, so that signal interconnection is realized by contact between the contacts and the electrical connector.
In fig. 1, the four corners of the second housing 20 are provided with connection holes 22 to facilitate the surface mounting of the optoelectronic module on the electrical connector to be connected for signal transmission.
Fig. 2 shows a schematic structural view of the second housing 20. The second shell 20 is provided with a notch 21 and a connecting hole 22, and is also provided with a threaded hole 23, the threaded hole 23 is matched with a screw to fix the first shell 10 and the second shell 20, and the second shell 20 is also provided with a protruding limiting step 24.
Fig. 3 shows a schematic structural view of the first housing 10. The first shell 10 is provided with a concave accommodating cavity 11, the accommodating cavity 11 is matched with the appearance of the PCB assembly 30 and is used for accommodating and fixing the PCB assembly 30, and after the PCB assembly 30 is placed in the accommodating cavity 11, the limiting step 24 compresses and fixes the PCB assembly 30 again when being covered; the bottom of the accommodating cavity 11 is also provided with a protruding boss 12, the diagonal side of the accommodating cavity 11 is provided with a through hole 13, and a screw is matched with a threaded hole 23 on the second shell 20 to fix the first shell 10 and the second shell 20 after passing through the through hole 13.
In fig. 1 to 3, a first locking groove 14 is formed in the first casing 10, a second locking groove 25 is formed in the second casing 20, and when the first casing 10 and the second casing 20 are assembled, the first locking groove 14 and the second locking groove 25 are also assembled into a complete through groove, a tail sleeve 40 is fixed inside the through groove, and the tail sleeve 40 is used for accommodating optical fibers and protecting the thrown optical fibers.
Fig. 4 is a schematic structural view of the PCB assembly 30. The PCB assembly 30 includes a connection board 31, a printed board 32, a power chip 33, an MCU34, and a transceiver component, where the power chip 33, the MCU34, and the transceiver component are all soldered to the printed board 32, and the 24-way transceiver integrated 25G parallel optical module provided in this embodiment has six groups of identical transceiver components, and each group of transceiver components includes a receiving driving chip, a transmitting driving chip, an optical fiber array, a VCSEL chip, and a PD chip. The optical fibers in the six pairs of optical fiber arrays are combined through the heat shrink tube, and the protection fiber is produced through the tail sleeve 40.
Fig. 5 is a schematic view showing a state in which the PCB assembly 30 is assembled into the first housing 10. The number and the position of the boss 12 correspond to the receiving and transmitting assembly, and correspondingly, the printed board 32 is windowed at the position of the boss 12 to form a PCB window, and because the receiving driving chip, the transmitting driving chip and the like on the receiving and transmitting assembly generate large heat, the chips with large heat are directly fixed on the boss 12 and welded with the printed board 32 through flying leads, the boss 12 and the first shell 10 are integrally formed, the first shell 10 and the second shell 20 are all made of heat conducting metals, such as aluminum alloy, copper and the like, so that a large amount of heat generated by the receiving driving chip and the transmitting driving chip is directly transmitted to the first shell 10 through the boss 12 and is radiated through the outer surface of the first shell 10, and the problem that the overall heat radiation performance is poor due to poor air heat conductivity due to the fact that the chips are arranged in the shells is avoided. On the other hand, as the 24-channel transceiving integrated 25G parallel optical module and other electric connectors are provided with a plurality of contact elements for realizing signal interconnection, the conventional QSFP28 and SFP28 squirrel-cage type packaging structure is adopted to design a larger interface, the size of the shell is larger under the common influence of the size of the interface and the size of the printed board, the structure of the shell is completely changed, the interface is designed on the surface of the printed board through the patch type, the size of the interface can be compressed into the thickness of the interface, the interface is further exposed through the windowing structure, the size of the shell is further compressed, and the miniaturization characteristic of the 24-channel transceiving integrated 25G parallel optical module is greatly improved.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting.
Claims (5)
1. A miniaturized multi-channel optoelectronic module comprising:
a first housing;
the second shell is provided with a notch;
the PCB assembly is arranged between the first shell and the second shell, and is provided with a protruding connecting table which is matched with the notch and extends out of the notch;
a concave accommodating cavity is formed in the first shell and matched with the PCB assembly;
the second shell is further provided with a protruding limiting step, the limiting step is attached to the inner wall of the edge of the accommodating cavity, and the limiting step compresses the PCB assembly in the accommodating cavity.
2. A miniaturized multi-channel optoelectronic module as set forth in claim 1 wherein the corners of the second housing are provided with attachment holes.
3. A miniaturized multichannel optoelectronic module according to claim 1, characterized in that the diagonal side of the housing cavity is provided with a through hole and the second housing is provided with a threaded hole corresponding to the through hole.
4. The miniaturized multi-channel optoelectronic module of claim 1 wherein the first housing is provided with a first locking slot and the second housing is provided with a second locking slot, and when the first housing and the second housing are assembled, the first locking slot and the second locking slot are also assembled into a complete through slot, the tail sleeve is fixed in the through slot, and the optical fiber on the PCB assembly is thrown out of the tail sleeve.
5. The miniaturized multi-channel optoelectronic module of claim 1 wherein the receiving cavity is provided with a raised boss corresponding to the position of the chip on the PCB assembly, the printed board of the PCB assembly being windowed to secure the chip to the boss, the boss being of a thermally conductive metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223483602.6U CN219777989U (en) | 2022-12-24 | 2022-12-24 | Miniaturized multichannel photoelectric module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223483602.6U CN219777989U (en) | 2022-12-24 | 2022-12-24 | Miniaturized multichannel photoelectric module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219777989U true CN219777989U (en) | 2023-09-29 |
Family
ID=88133275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223483602.6U Active CN219777989U (en) | 2022-12-24 | 2022-12-24 | Miniaturized multichannel photoelectric module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219777989U (en) |
-
2022
- 2022-12-24 CN CN202223483602.6U patent/CN219777989U/en active Active
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