CN213122369U - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN213122369U
CN213122369U CN202021933027.3U CN202021933027U CN213122369U CN 213122369 U CN213122369 U CN 213122369U CN 202021933027 U CN202021933027 U CN 202021933027U CN 213122369 U CN213122369 U CN 213122369U
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lens array
light
optical
lens
different wavelengths
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CN202021933027.3U
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Chinese (zh)
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王建
李丹
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Hisense Broadband Multimedia Technology Co Ltd
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Hisense Broadband Multimedia Technology Co Ltd
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Abstract

The application provides an optical module, which comprises a light emission submodule. The cavity of the light emission secondary module is internally provided with a laser chip array, a first lens array, a second lens array, a wavelength division multiplexer and a third lens in sequence. The laser chip array is used for emitting optical signals with different wavelengths. The first lens array is used for collimating optical signals with different wavelengths emitted by the laser chip array to obtain collimated light with different wavelengths. The second lens array is used for converging the collimated light with different wavelengths to obtain converging light with different wavelengths. The wavelength division multiplexer is realized based on the arrayed waveguide grating and is used for converging the converged light with different wavelengths into a total converged light. The third lens is used to couple the total collected light into the fiber optic adapter. In this application, the cooperation of second lens array and first lens array is used, has improved the subsides dress precision of the lens array that first lens array and second lens array constitute in other words, and then has improved the coupling efficiency of emission of light secondary module.

Description

Optical module
Technical Field
The application relates to the technical field of communication, in particular to an optical module.
Background
In a conventional optical module, a two-lens optical system is usually adopted to realize multiplexing of output light of a four-path laser into a mixed light including four different wavelengths. Wherein, a lens array and a lens are respectively positioned at two ends of the wavelength division multiplexer. Because the output light of the laser is collimated only by the lens at the front end of the wavelength division multiplexer, the mounting precision of the lens at the front end of the laser has higher requirements. When the lens is mounted beyond the mounting accuracy requirement of the lens, excessive coupling loss is caused.
SUMMERY OF THE UTILITY MODEL
The application provides an optical module, which improves coupling efficiency.
A light module, comprising:
a circuit board;
the light emission secondary module is electrically connected with the circuit board, and a laser chip array, a first lens array, a second lens array, a wavelength division multiplexer and a third lens are sequentially arranged in the cavity;
the laser chip array is used for emitting optical signals with different wavelengths;
the first lens array is used for collimating optical signals with different wavelengths to obtain collimated light with different wavelengths;
the second lens array is used for converging the collimated light with different wavelengths to obtain converging light with different wavelengths;
the wavelength division multiplexer is realized based on the arrayed waveguide grating and is used for converging the converged light with different wavelengths into a total converged light;
and the third lens is positioned between the wavelength division multiplexer and the optical fiber adapter and used for coupling the total converged light into the optical fiber adapter.
Has the advantages that: the application provides an optical module, which comprises a circuit board and a light emission sub-module electrically connected with the circuit board. The cavity of the light emission secondary module is internally provided with a laser chip array, a first lens array, a second lens array, a wavelength division multiplexer and a third lens in sequence. The laser chip array is used for emitting optical signals with different wavelengths. The first lens array is used for collimating the optical signals with different wavelengths emitted by the laser chip array to obtain collimated light with different wavelengths. And the second lens array is used for converging the collimated light with different wavelengths to obtain converged light with different wavelengths. The wavelength division multiplexer is realized based on the arrayed waveguide grating and is used for converging the converged light with different wavelengths into a total converged light. And the third lens is positioned between the wavelength division multiplexer and the optical fiber adapter and used for coupling the total converged light into the optical fiber adapter. In this application, the cooperation of second lens array and first lens array is used, has improved the subsides dress precision of the lens array that first lens array and second lens array constitute in other words, and then has improved the coupling efficiency of emission of light secondary module.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;
fig. 4 is an exploded schematic structural diagram of an optical module according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of an embodiment of an tosa module with a cover removed;
FIG. 6 is an exploded view of the tosa of the present application with the cover removed;
fig. 7 is a schematic structural diagram of a first lens array, a second lens light array, a wavelength division multiplexer, and a third lens provided in an embodiment of the present application;
FIG. 8 is a cross-sectional view of a tosa according to an embodiment of the present invention with the cover removed.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the optical module realizes optical connection with external optical fibers through an optical interface, the external optical fibers are connected in various ways, and various optical fiber connector types are derived; the method is characterized in that the electric connection is realized by using a golden finger at an electric interface, which becomes the mainstream connection mode of the optical module industry, and on the basis, the definition of pins on the golden finger forms various industry protocols/specifications; the optical connection mode realized by adopting the optical interface and the optical fiber connector becomes the mainstream connection mode of the optical module industry, on the basis, the optical fiber connector also forms various industry standards, such as an LC interface, an SC interface, an MPO interface and the like, the optical interface of the optical module also makes adaptive structural design aiming at the optical fiber connector, and the optical fiber adapters arranged at the optical interface are various.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical interface of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and establishes a bidirectional electrical signal connection with the optical network terminal 100; bidirectional interconversion of optical signals and electric signals is realized inside the optical module, so that information connection is established between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber 101.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used for accessing the network cable 103 and establishing a bidirectional electrical signal connection (generally, an electrical signal of an ethernet protocol, which is different from an electrical signal used by an optical module in protocol/type) with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is an upper computer of the optical module, provides data signals for the optical module and receives the data signals from the optical module, and a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network terminal and a network cable.
Common local information processing apparatuses include routers, home switches, electronic computers, and the like; common optical network terminals include an optical network unit ONU, an optical line terminal OLT, a data center server, a data center switch, and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and used for accessing an electrical interface (such as a gold finger) of the optical module; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into an optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a tosa 301, a tosa 400, and an optical fiber receptacle 302;
the upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.
The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitter sub-module 301 and the optical receiver sub-module 400 inside the optical module; the photoelectric devices such as the circuit board 300, the light-emitting sub-module 301, the light-receiving sub-module 400 and the like are positioned in the packaging cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the transmitter sub-module 301, the receiver sub-module 400 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.
The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).
The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.
The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.
The tosa 301 is located at the edge of the circuit board 300, and the tosa 301 and the rosa 400 are staggered on the surface of the circuit board 300, which is beneficial to achieving better electromagnetic shielding effect.
The tosa 301 is disposed on the surface of the circuit board 300, and in another common packaging method, the tosa is physically separated from the circuit board and electrically connected to the circuit board through a flexible board; the rosa 400 is disposed on the surface of the circuit board 300, and in another common packaging method, the rosa is physically separated from the circuit board and electrically connected through a flexible board.
The optical transmitter sub-module 301 is positioned in a packaging cavity formed by the upper shell and the lower shell, and the circuit board 300 is provided with a notch for placing the optical transmitter sub-module 301; the notch can be arranged in the middle of the circuit board 300 or at the edge of the circuit board 300; the tosa 301 is embedded in the notch of the circuit board 300, so that the circuit board 301 can be inserted into the tosa 301, and the tosa 301 and the circuit board 300 can be fixed together.
The tosa 301 is configured to emit an optical signal. The optical receive sub-module 400 is configured to receive an optical signal.
And the optical fiber socket 302 is connected with an optical fiber at one end and an optical fiber plug outside the optical module at the other end, and is used for realizing optical connection between the inside and the outside of the optical module, so that light forming the light emission sub-module is transmitted to the optical fiber socket 302 through the optical fiber and is transmitted to the outside of the optical module through the optical fiber plug.
Fig. 5 is a schematic structural diagram of the tosa according to an embodiment of the present disclosure with the cover removed. Fig. 6 is an exploded view of the tosa according to the embodiment of the present disclosure without a cover plate. Fig. 7 is a schematic structural diagram of the first lens array, the second lens light array, the wavelength division multiplexer, and the third lens provided in the embodiment of the present application. FIG. 8 is a cross-sectional view of a tosa according to an embodiment of the present invention with the cover removed. As shown in fig. 4-8, in the embodiment of the present application, the tosa 301 includes a cover plate and a cavity 3011, a laser chip array 3012, a first lens array 3013, a second lens array 3014, a wavelength division multiplexer 3015, and a third lens 3016 are disposed in the cavity 3011, a through hole 3017 is disposed at one end of the cavity 3011, and an optical fiber adapter 3018 is disposed in the through hole 3017. In particular, the method comprises the following steps of,
and the laser chip array 3012 is used for emitting optical signals with different wavelengths. Specifically, the laser chip array 3012 includes a plurality of laser chips 30121, each laser chip 30121 emits an optical signal with one wavelength, and the laser chip array 3012 including the plurality of laser chips 30121 emits a plurality of optical signals with different wavelengths. The number of the laser chips 3012 is at least 2.
The first lens array 3013 is configured to collimate optical signals with different wavelengths to obtain collimated light with different wavelengths. Specifically, the first lens array 3013 includes a plurality of first lenses 30131, where each first lens 30131 is a collimating lens, and each first lens 30131 collimates an optical signal emitted by the corresponding laser chip 30121 to obtain collimated light, and then the first lens array 3013 including the plurality of first lenses 30131 collimates optical signals with a plurality of different wavelengths to obtain collimated light with a plurality of different wavelengths.
Each first lens 30131 of the first lens array 3013 is attached to the cavity 3011 of the tosa in a passive mounting manner.
The second lens array 3014 is configured to converge collimated light with different wavelengths to obtain converged light with different wavelengths. Specifically, the second lens array 3014 includes a plurality of second lenses 30141, each second lens 30141 is a converging lens, and each second lens 30141 converges the collimated light emitted by the corresponding first lens 30131 to obtain converging light, and then the second lens array 3014 including the plurality of second lenses 30141 converges the collimated light with a plurality of different wavelengths to obtain converging light with a plurality of different wavelengths.
Each second lens 30141 of the second lens array 3014 is attached to the cavity 3011 of the tosa in an active mounting manner.
In a conventional optical module, a lens array and a lens are respectively attached to two ends of a wavelength division multiplexer, and the lens array comprises a plurality of lenses. The optical signal emitted by the laser chip is coupled to the wavelength division multiplexer through the plurality of lenses positioned at the front end of the wavelength division multiplexer, and is emitted into the lens positioned at the rear end of the wavelength division multiplexer after being converged by the wavelength division multiplexer, and the optical signal is coupled to the optical fiber adapter through the lens positioned at the rear end of the wavelength division multiplexer. However, since only one lens array is disposed between the wavelength division multiplexer and the laser chip array, in order to increase the coupling efficiency of the tosa, a high requirement for the mounting accuracy of the lens is required. Because when the mounting accuracy of the lenses in the lens array is low, the coupling efficiency into the fiber adapter is easily caused to be low. In the embodiment of the present invention, the first lens array 3013 and the second lens array 3014 are disposed between the laser chip array 3012 and the wavelength division multiplexer 3015, and the first lens array 3013 and the second lens array 3014 are used in cooperation, which is equivalent to improving the mounting accuracy of the lens arrays. Even if the mounting accuracy of the first lens array 3013 is low, the optical signal coupled to the optical fiber adapter is small, and the coupling efficiency is low, the mounting accuracy of the second lens array 3014 can be adjusted to improve the number of optical signals coupled to the optical fiber adapter, and thus the coupling efficiency is improved.
The first lens array 3013 and the second lens array 3014 are used together, which is essentially equivalent to dispersing a strict requirement for mounting accuracy errors into two sets of lens arrays with relatively loose mounting accuracy errors. Even if the mounting precision error requirement is exceeded by the mounting of one lens array, more optical signals can be coupled into the optical fiber adapter through the mounting of the other lens array, and the coupling efficiency is improved.
And the wavelength division multiplexer 3015 is configured to condense the condensed light with different wavelengths into a total condensed light. Specifically, the wavelength division multiplexer 3015 is a wavelength division multiplexer implemented based on an arrayed waveguide grating, and the wavelength division multiplexer condenses the condensed light of a plurality of different wavelengths into one total condensed light. The total concentrated light includes a plurality of concentrated lights of different wavelengths.
And a third lens 3016 to couple the total combined light into a fiber optic adapter 3018. Specifically, the third lens 3016 is a converging lens, and the third lens 3016 couples the total converging light into the fiber adapter 3018.
The mounting process of each lens is as follows: firstly, the third lens 3016 is mounted between the optical fiber adapter 3018 and the wavelength division multiplexer 3015 in a passive mounting mode; secondly, a first lens 30131 of the first lens array 3013 is attached between the laser chip array 3012 and the wavelength division multiplexer 3015 in a passive mounting manner; finally, the second lenses 30141 of the second lens array 3014 are mounted between the first lens array 3013 and the wavelength division multiplexer 3015 in an active mounting manner.
And the optical fiber adapter 3018 is used for being inserted into the tosa to receive the optical signal converged by the third lens 3016. Specifically, the optical fiber adapter 3018 is located in a through hole 3017 at one end of the cavity 3011, one end of the optical fiber adapter is located in the cavity 3011, and the other end of the optical fiber adapter is located outside the cavity 3011. The optical fiber adapter 3018 is located in the cavity 3011, and has one end for receiving the optical signal converged by the third lens 3016, and the end located outside the cavity 3011 and the optical fiber 303 pass through the optical fiber socket 302.
As shown in fig. 8, a heat sink substrate 3019 is further disposed in the cavity 3011 of the tosa provided in the embodiments of the present application. The laser chip array 3012, the first lens array 3013, the second lens array 3014, the wavelength division multiplexer 3015, and the third lens 3016 are all disposed on the heat sink substrate 3019. The heat sink substrate 3019 provides support for the laser chip array 3012, the first lens array 3013, the second lens array 3014, the wavelength division multiplexer 3015, and the third lens 3016, so that the converged light emitted by the third lens 3016 is coupled into the fiber adapter 3018.
The application provides an optical module, which comprises a circuit board and a light emission sub-module electrically connected with the circuit board. The cavity of the light emission secondary module is internally provided with a laser chip array, a first lens array, a second lens array, a wavelength division multiplexer and a third lens in sequence. The laser chip array is used for emitting optical signals with different wavelengths. The first lens array is used for collimating the optical signals with different wavelengths emitted by the laser chip array to obtain collimated light with different wavelengths. And the second lens array is used for converging the collimated light with different wavelengths to obtain converged light with different wavelengths. The wavelength division multiplexer is realized based on the arrayed waveguide grating and is used for converging the converged light with different wavelengths into a total converged light. And the third lens is positioned between the wavelength division multiplexer and the optical fiber adapter and used for coupling the total converged light into the optical fiber adapter. In this application, the cooperation of second lens array and first lens array is used, has improved the subsides dress precision of the lens array that first lens array and second lens array constitute in other words, and then has improved the coupling efficiency of emission of light secondary module.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (5)

1. A light module, comprising:
a circuit board;
the light emission secondary module is electrically connected with the circuit board, and a laser chip array, a first lens array, a second lens array, a wavelength division multiplexer and a third lens are sequentially arranged in the cavity;
the laser chip array is used for emitting optical signals with different wavelengths;
the first lens array is used for collimating optical signals with different wavelengths to obtain collimated light with different wavelengths;
the second lens array is used for converging the collimated light with different wavelengths to obtain converging light with different wavelengths;
the wavelength division multiplexer is realized based on the arrayed waveguide grating and is used for converging the converged light with different wavelengths into a total converged light;
the third lens is positioned between the wavelength division multiplexer and the optical fiber adapter and used for coupling the total light into the optical fiber adapter.
2. The optical module of claim 1, wherein the laser chip array comprises a plurality of laser chips.
3. The light module of claim 1, wherein the first lens array comprises a plurality of first lenses.
4. The light module of claim 1, wherein the second lens array comprises a plurality of second lenses.
5. The photonic module as claimed in claim 1, wherein the first lens array is attached to the cavity of the tosa in a passive attachment manner, and the second lens array is attached to the cavity of the tosa in an active attachment manner.
CN202021933027.3U 2020-09-07 2020-09-07 Optical module Active CN213122369U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114325971A (en) * 2022-01-13 2022-04-12 深圳市易飞扬通信技术有限公司 Packaging method of light emitting assembly and light emitting assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114325971A (en) * 2022-01-13 2022-04-12 深圳市易飞扬通信技术有限公司 Packaging method of light emitting assembly and light emitting assembly

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