CN112505855A

CN112505855A - Optical module

Info

Publication number: CN112505855A
Application number: CN202011507499.7A
Authority: CN
Inventors: 张加傲; 王欣南; 于琳; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2021-03-16

Abstract

The application provides an optical module includes circuit board and light emitting device, light emitting device includes ceramic substrate, EML laser instrument subassembly and a plurality of passageway, a passageway includes drive assembly, drive multiplexing pad, drive power supply pad and EML multiplexing pad, wherein drive multiplexing pad sets up near drive chip in order to guarantee drive chip's normal work, drive multiplexing pad's main function is to providing first voltage and realizing to EML laser instrument chip transmission signal to drive chip, drive power supply pad's main function is to providing the second voltage to drive chip, EML multiplexing pad's main function is to providing voltage and guaranteeing that EML laser instrument chip receives the signal that comes from drive chip to EML laser instrument chip. Through the method, a multi-channel driving peripheral circuit, an EML peripheral circuit and the like can be arranged on the ceramic substrate, and the normal work of the driving chip and the EML laser chip is ensured.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

The EML laser comprises an electric absorption modulation region and a light emitting region, wherein the electric absorption modulation region and the light emitting region are respectively realized through an EA (electro-absorption) modulator and a DFB (distributed feedback) laser, and a modulator driver in the conventional optical module is usually placed on a circuit board and then connected with a packaging shell through a flexible circuit board, so that the distance between the modulator driver and the EA modulator is longer, and the channel link loss is increased; and the peripheral circuit of the modulator driver and the peripheral circuit of the EA modulator need to be arranged near the modulator driver, on the premise, for a multi-channel optical module, a large area is reserved on a circuit board for arranging the peripheral circuit of the modulator driver and the peripheral circuit of the EA modulator, so that the layout of the circuit board is more tense, and the available space is smaller. Therefore, a solution is needed to implement the layout of the peripheral circuit devices of the multi-channel optical module.

Disclosure of Invention

The application provides an optical module, which realizes the layout of various devices such as a driving peripheral circuit, an EML peripheral circuit and the like of a multi-channel optical module.

A light module, comprising:

a circuit board;

the light emitting device is electrically connected with the circuit board and used for converting an electric signal into an optical signal;

the light emitting device includes:

the ceramic substrate is used for bearing a device;

an EML laser assembly including an EML laser chip;

a plurality of channels carried by the ceramic substrate, wherein one channel comprises:

the driving assembly is arranged on the surface of the ceramic substrate and comprises a driving chip;

the driving multiplexing bonding pad is arranged on the surface of the ceramic substrate and used for electrically connecting a signal bonding pad of the driving chip with one end of a first magnetic bead, and the other end of the first magnetic bead is connected with a first voltage;

the first magnetic bead is used for electrically connecting one end of the first magnetic bead with one end of the DC blocking capacitor;

the EML multiplexing bonding pad is arranged on the surface of the ceramic substrate and used for electrically connecting the other end of the blocking capacitor with the other end of the second magnetic bead;

the EML laser chip is also used for electrically connecting the EML laser component with the other end of the second magnetic bead, and one end of the second magnetic bead is connected to the power supply voltage of the EML laser chip.

Has the advantages that: the application provides an optical module, which comprises a circuit board and an optical emitting device, wherein the optical emitting device comprises a ceramic substrate, the surface of the ceramic substrate is provided with a plurality of channels, adjacent channels are shielded and isolated, the channels respectively comprise a driving assembly, an EML laser assembly, a driving multiplexing bonding pad, a driving power supply bonding pad and an EML multiplexing bonding pad, the driving assembly comprises a driving chip and a first substrate, the EML laser assembly comprises an EML laser chip and a second substrate, a driving multiplexing bonding pad is arranged near the driving chip to guarantee normal work of the driving chip, the driving multiplexing bonding pad has the main function of providing first voltage for the driving chip and realizing signal transmission to the EML laser chip, the driving power supply bonding pad has the main function of providing second voltage for the driving chip, and the EML multiplexing bonding pad has the main function of providing voltage for the EML laser chip and guaranteeing that the EML laser chip receives signals from the driving chip. The specific connection mode is as follows: one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with a first magnetic bead, the first magnetic bead is electrically connected with a power supply pin on the circuit board so as to provide a first voltage for the driving chip, one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with a blocking capacitor, and the blocking capacitor is electrically connected with the EML multiplexing bonding pad so as to realize communication between the driving chip and the EML laser chip; one end of the driving chip is electrically connected with one end of the driving power supply bonding pad, the other end of the driving power supply bonding pad is electrically connected with one end of the filter capacitor, and the other end of the filter capacitor is electrically connected with a power supply pin on the circuit board so as to input a second voltage to the driving chip; the EML multiplexing pad is connected with the second magnetic bead to provide voltage for the EML laser chip, and is connected with the DC blocking capacitor to receive signals from the driving chip. Through the process, a multi-channel driving peripheral circuit, an EML peripheral circuit and the like can be arranged on the ceramic substrate, and the normal work of the driving chip and the EML laser chip is ensured.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 5 is a diagram illustrating a structure of a circuit board according to an embodiment of the present invention;

FIG. 6 is an exploded view of the circuit board according to the embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an appearance of a light emitting device provided in an embodiment of the present application;

fig. 8 is an exploded view of a light emitting device according to an embodiment of the present application;

fig. 9 is a schematic connection diagram of internal structures of a light emitting device according to an embodiment of the present application;

fig. 10 is a partial schematic view of the internal structures of a light emitting device according to an embodiment of the present application;

fig. 11 is an equivalent circuit diagram illustrating connection of components in a light emitting device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver module 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module comprises an optical transmitter and an optical receiver, which are respectively used for transmitting optical signals and receiving optical signals. Fig. 5 is a schematic structural diagram of a circuit board 300 according to an embodiment of the present disclosure, and fig. 6 is an exploded structural diagram of the circuit board 300 according to the embodiment of the present disclosure. As shown in fig. 5 and 6, the optical module 200 includes at least two light emitting devices and light receiving assemblies 402, the at least two light emitting devices are electrically connected to the circuit board 300 through the first flexible board, the light receiving assemblies 402 are electrically connected to the circuit board 300 through the second flexible board 500, and the light emitting devices and the light receiving assemblies 402 are stacked instead of disposing the light emitting devices and the light receiving assemblies on the surface of the circuit board 300, so that the space requirement of the circuit board 300 is not increased, the size of the optical module is reduced, and the optical module is packaged in a small size.

In this example, the at least two light emitting devices may include a first light emitting device 401 and a second light emitting device 403, the first light emitting device 401 is electrically connected to the circuit board 300 through the first flexible board 700, and the second light emitting device 403 is electrically connected to the circuit board 300 through the third flexible board 800, implementing a layout of the multi-channel light emitting chip.

The light emitting device generally includes a housing, a light emitter fixed inside the housing for emitting a light beam, and a lens assembly; the lens component is positioned on a light emitting path of the light emitter, is fixed inside the shell and is used for changing the transmission direction of the light beam so that the laser light beam enters the external optical fiber. That is, light emitted by the light emitter is reflected by the lens assembly and enters the optical fiber.

It should be noted that, the above description is made by taking a dual transmission structure and a dual reception structure as an example, and a single transmission structure and a single reception structure are also within the scope of the present application.

Fig. 7 is a schematic structural diagram of an appearance of a light emitting device provided in an embodiment of the present application; fig. 8 is an exploded view of a light emitting device according to an embodiment of the present application; as shown in fig. 7 and 8, the light emitting device 401 provided by the present application includes a cover plate 401a and a cavity 401b, the cover plate 401a and the cavity 401b are covered and connected, and a ceramic substrate 601, a driving chip 602, an EML laser chip 603, and the like are disposed in the cavity 401 b.

Fig. 9 is a schematic connection diagram of internal structures of a light emitting device according to an embodiment of the present application; in fig. 9, taking an integrated eight-channel as an example, the light emitting device includes a ceramic substrate, an EML laser component, and several channels, wherein one channel includes a driving component, a driving multiplexing pad, and an EML multiplexing pad, and the following describes each structure specifically with reference to fig. 9 and 10.

Fig. 9 is a schematic connection diagram of internal structures of a light emitting device according to an embodiment of the present application; fig. 10 is a partial schematic view of the internal structures of a light emitting device according to an embodiment of the present application; in this embodiment, a driving assembly is disposed on the surface of the ceramic substrate 601, the driving assembly includes a driving chip 602 and a first substrate, the first substrate is provided with a positive electrode connection region and a negative electrode connection region, a positive electrode of the driving chip 602 is electrically connected to the positive electrode connection region, and a negative electrode is electrically connected to the negative electrode connection region. A driving multiplexing bonding pad 6042 and a driving power supply bonding pad 6044 are arranged near the driving chip 602, the driving multiplexing bonding pad 6042 is used for electrically connecting a signal bonding pad of the driving chip 602 with one end of the first magnetic bead 606, and the other end of the first magnetic bead 606 is connected to a first voltage; and also serves to electrically connect one end of dc blocking capacitor 608 to one end of first magnetic bead 606.

The driving multiplexing pad 6042 mainly integrates power supply and signal transmission functions to the EML laser chip 603, the driving multiplexing pad 6042 may provide a first voltage to the driving chip 602, and the driving power supply pad 6044 may provide a second voltage to the driving chip 602, where the first voltage and the second voltage are different, and may provide different voltages to the driving chip 602 to ensure normal operation thereof. Specifically, the positive electrode of the driving chip 602 is electrically connected to a positive electrode connection region on the first substrate, the positive electrode connection region is connected to a driving multiplexing pad 6042 in a routing manner, the driving multiplexing pad 6042 is electrically connected to the first magnetic bead 606, and the first magnetic bead 606 is electrically connected to a power supply pin on the circuit board 300, so that a voltage on the power supply pin is transmitted to the driving chip 602 through the first magnetic bead and the driving multiplexing pad 6042 to provide a first voltage for the driving chip 602; the positive electrode of the driving chip 602 is electrically connected to the positive electrode connection area on the first substrate, the positive electrode connection area is connected to the driving multiplexing bonding pad 6042 in a routing manner, the driving multiplexing bonding pad 6042 is electrically connected to the filter capacitor 609, and the filter capacitor 609 is electrically connected to the power supply pin on the circuit board 300, so that the voltage on the power supply pin is transmitted to the driving chip 602 through the filter capacitor 609 and the driving multiplexing bonding pad 6042 to provide a second voltage for the driving chip 602; wherein the first voltage and the second voltage have different voltage values.

The surface of the ceramic substrate 601 is further provided with an EML laser assembly, the EML laser assembly comprises an EML laser chip 603 and a second substrate, the second substrate is also provided with a positive electrode connecting area and a negative electrode connecting area, the positive electrode of the EML laser chip 603 is electrically connected with the positive electrode connecting area, and the negative electrode of the EML laser chip 603 is electrically connected with the negative electrode connecting area. An EML multiplexing pad 6052 is arranged near the EML laser chip 603, and the EML multiplexing pad 6052 is used for electrically connecting the other end of the blocking capacitor 608 with the other end of the second magnetic bead 607; and the other end of the second magnetic bead 607 is electrically connected to the EML laser module, and one end of the second magnetic bead 607 is connected to the power supply voltage of the EML laser chip 603.

The EML mux pad 6052 mainly integrates two functions of supplying a voltage to the EML laser chip 603 and receiving a driving signal from the driving chip 602. Specifically, the anode of the EML laser chip 603 is electrically connected to the anode connection region on the second substrate, the anode connection region is connected to the EML multiplexing pad 6052 in a routing manner, the EML multiplexing pad 6052 is electrically connected to the second magnetic bead 607, and the second magnetic bead 607 is electrically connected to the power supply pin on the circuit board 300, so that the voltage on the power supply pin is transmitted to the EML laser chip 603 through the two magnetic beads 607 and the EML multiplexing pad 6052 to provide voltage for the EML laser chip 603.

The positive electrode of the driving chip 602 is electrically connected to the positive electrode connection area on the first substrate, the positive electrode connection area is connected to the driving multiplexing pad 6042 in a routing manner, the driving multiplexing pad 6042 is electrically connected to one end of the dc blocking capacitor 608, the other end of the dc blocking capacitor 608 is electrically connected to the EML multiplexing pad 6052, the EML multiplexing pad 6052 is electrically connected to the positive electrode connection area of the second substrate, and the positive electrode connection area of the second substrate is electrically connected to the positive electrode of the EML laser chip 603, so that the driving signal generated by the driving chip 602 is transmitted to the EML laser chip 603, and the EML laser chip 603 performs normal operation according to the driving signal.

Taking the left-right direction in fig. 7 as an example, the driving multiplexing pad 6042 enables the driving chip 602 to transmit driving signals to the right, and provides voltage to the driving chip 602 to the left, and the two branches work in parallel with opposite directions.

The EML mux pad 6052 receives signals from the driver chip 602 and provides voltages to the right for the EML laser chip 603, and the two branches operate in parallel.

In the embodiment of the present application, one end of the filter capacitor 609 is electrically connected to the power supply pin on the circuit board 300, and the other end is grounded.

In the embodiment of the present application, one end of the first magnetic bead 606 is electrically connected to a power supply pin on the circuit board 300, the other end is electrically connected to the dc blocking capacitor 608, one end of the second magnetic bead 607 is electrically connected to the power supply pin on the circuit board 300, and the other end is electrically connected to the dc blocking capacitor 608. Taking the left-right direction in fig. 7 as an example, the driving chip 602 is located on the left side, the EML laser chip 603 is located on the right side, the voltage transmitted by the first magnetic bead is transmitted to the left to provide voltage for the driving chip 602, and the voltage transmitted by the second magnetic bead is transmitted to the right to provide voltage for the EML laser chip 603.

In this embodiment, the surface of the ceramic substrate 601 is further provided with a first ground pad 6041, which is disposed adjacent to the driving chip 602 and is used for electrically connecting the cathode of the driving chip 602 and the ceramic substrate 601 to ground the cathode of the driving chip 602; specifically, the cathode of the driver chip 602 is electrically connected to the cathode connection area of the first substrate, the cathode connection area of the first substrate is wire-bonded to the first ground pad 6041, the first ground pad 6041 is wire-bonded to the ceramic substrate 601, and the ceramic substrate 601 is electrically connected to the ground pin on the circuit board 300, so that the cathode of the driver chip 602 is grounded.

The second ground pad 6043 is disposed adjacent to the driving chip 602, and is configured to electrically connect a negative electrode of the driving chip 602 and a negative electrode of the EML laser chip to achieve isolation between channels. Specifically, the cathode of the driver chip 602 is wire-bonded to the second ground pad 6043, the second ground pad 6043 is electrically connected to the fourth ground pad 6053, the fourth ground pad 6053 is connected to the cathode connection area of the second substrate, and the cathode connection area of the second substrate is electrically connected to the EML laser chip 603, so that the cathode of the driver chip 602 is electrically connected to the EML laser chip 603 to achieve isolation between channels.

A third ground pad 6051 is disposed adjacent to the EML laser chip 603, and is configured to electrically connect the negative electrode of the EML laser chip 603 and the ceramic substrate to ground the negative electrode of the EML laser chip; specifically, the cathode of the EML laser chip 603 is electrically connected to the cathode connection area of the second substrate, the cathode connection area of the second substrate is wire-bonded to the third ground pad 6051, the third ground pad 6051 is wire-bonded to the ceramic substrate 601, and the ceramic substrate 601 is electrically connected to the ground pin on the circuit board 300, so that the cathode of the driver chip 602 is grounded.

Fig. 11 is an equivalent circuit schematic diagram illustrating connection of components in a light emitting device according to an embodiment of the present disclosure, and as shown in fig. 11, a peripheral circuit of a driving chip 602 includes a first branch 6061 connected in series to a power line and a second branch 6062 connected in parallel to the power line, where the first branch includes a first magnetic bead 607, and a first voltage is provided to the driving chip 602 through the first magnetic bead 607; the peripheral circuit of the EML laser chip 603 includes a third branch 6071 connected in series to the power line and a fourth branch 6072 connected in parallel to the power line, where the third branch 6071 has a second magnetic bead 608, and supplies a voltage to the EML laser chip 603 through the second magnetic bead 608. The peripheral circuit of the driver chip 602 and the peripheral circuit of the EML laser chip 603 are isolated from each other by a dc blocking capacitor 608, so that voltages of the peripheral circuit of the driver chip 602 and the peripheral circuit of the EML laser chip 603 are not interfered with each other.

The application provides an optical module, including circuit board and light emitting device, light emitting device includes ceramic substrate, ceramic substrate surface bears a plurality of passageways, shield between the adjacent passageway and keep apart, the passageway all includes drive chip, EML laser instrument drive chip, drive multiplexing pad, drive power supply pad and EML multiplexing pad, wherein drive multiplexing pad sets up near drive chip in order to guarantee drive chip's normal work, drive multiplexing pad's main function is to providing first voltage and realizing to EML laser instrument chip transmission signal to drive chip, drive power supply pad's main function is to providing the second voltage to drive chip, EML multiplexing pad's main function is to providing voltage and guaranteeing that EML laser instrument chip receives the signal that comes from drive chip to EML laser instrument chip. The specific connection mode is as follows: one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with a first magnetic bead, the first magnetic bead is electrically connected with a power supply pin on the circuit board so as to provide a first voltage for the driving chip, one end of the driving chip is electrically connected with the driving multiplexing bonding pad, the driving multiplexing bonding pad is electrically connected with a blocking capacitor, and the blocking capacitor is electrically connected with the EML multiplexing bonding pad so as to realize communication between the driving chip and the EML laser chip; one end of the driving chip is electrically connected with one end of the driving power supply bonding pad, the other end of the driving power supply bonding pad is electrically connected with one end of the filter capacitor, and the other end of the filter capacitor is electrically connected with a power supply pin on the circuit board so as to input a second voltage to the driving chip; the EML multiplexing pad is connected with the second magnetic bead to provide voltage for the EML laser chip, and is connected with the DC blocking capacitor to receive signals from the driving chip. Through the process, a multi-channel driving peripheral circuit, an EML peripheral circuit and the like can be arranged on the ceramic substrate, and the normal work of the driving chip and the EML laser chip is ensured.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A light module, comprising:

a circuit board;

the light emitting device includes:

the ceramic substrate is used for bearing a device;

an EML laser assembly including an EML laser chip;

2. The optical module of claim 1, further comprising on the channel:

and the driving power supply bonding pad is arranged on the surface of the ceramic substrate and used for electrically connecting the signal bonding pad of the driving chip with the filter capacitor, and the filter capacitor is electrically connected with the power supply pin on the circuit board so as to supply a second voltage to the driving chip.

3. The light module of claim 1, wherein the channel further comprises:

the first grounding bonding pad is arranged adjacent to the driving chip and used for electrically connecting the cathode of the driving chip and the ceramic substrate so as to realize the grounding of the cathode of the driving chip;

and the second grounding bonding pad is arranged adjacent to the driving chip and is used for electrically connecting the negative electrode of the driving chip and the negative electrode of the EML laser chip so as to realize the isolation between channels.

4. The light module of claim 1, wherein the channel further comprises:

the third grounding bonding pad is arranged adjacent to the EML laser chip and used for electrically connecting the cathode of the EML laser chip and the ceramic substrate so as to realize the grounding of the cathode of the EML laser chip;

and the fourth grounding bonding pad is arranged adjacent to the EML laser chip and is used for electrically connecting the cathode of the EML laser chip and the cathode of the driving chip so as to realize the isolation between channels.

5. The optical module of claim 2, wherein one end of the filter capacitor is electrically connected to a power supply pin on the circuit board, and the other end of the filter capacitor is grounded.

6. The optical module according to claim 1, wherein one end of the first magnetic bead is electrically connected to a power supply pin of the circuit board, and the other end of the first magnetic bead is electrically connected to the dc blocking capacitor, and one end of the second magnetic bead is electrically connected to the power supply pin of the circuit board, and the other end of the second magnetic bead is electrically connected to the dc blocking capacitor.

7. The optical module of claim 1, wherein one end of the driving multiplexing pad is electrically connected to the driving chip, the other end of the driving multiplexing pad is electrically connected to one end of the first magnetic bead, and the other end of the first magnetic bead is electrically connected to a power supply pin of the circuit board to supply a first voltage to the driving chip.

8. The optical module of claim 1, wherein one end of the driving multiplexing pad is electrically connected to the driving chip, the other end of the driving multiplexing pad is electrically connected to one end of the blocking capacitor, the other end of the blocking capacitor is connected to the EML multiplexing pad, and the EML multiplexing pad is electrically connected to the EML laser chip, so as to realize signal transmission between the driving chip and the EML laser chip.

9. The optical module according to claim 2, wherein one end of the driving power supply pad is electrically connected to one end of the filter capacitor, and the other end of the filter capacitor is electrically connected to a power supply pin of the circuit board to supply the second voltage to the driving chip.

10. The optical module of claim 1, wherein one end of the EML multiplexing pad is electrically connected to the EML laser chip, the other end of the EML multiplexing pad is electrically connected to one end of the second magnetic bead, and the other end of the second magnetic bead is electrically connected to a power supply pin of the circuit board to supply voltage to the EML laser chip.