CN214375429U

CN214375429U - Optical module

Info

Publication number: CN214375429U
Application number: CN202120777111.9U
Authority: CN
Inventors: 郭蓉; 熊轶
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2021-10-08
Anticipated expiration: 2031-04-16

Abstract

The application provides an optical module, includes: a shell, one end of which is provided with an electric port; one end of the first circuit board extends out of the electric port, and a first groove is formed in the side edge of the first circuit board; the second circuit board is arranged above the first circuit board and positioned in the shell, and a second groove is formed in the side edge of the second circuit board; the flexible circuit board is arranged in the first groove and the second groove, one end of the flexible circuit board is electrically connected with the first circuit board, and the other end of the flexible circuit board is connected with the second circuit board; the light emission sub-module is arranged in the shell and electrically connected with the first circuit board and the second circuit board; and the light receiving secondary module is arranged in the shell and is electrically connected with the first circuit board. The application provides an optical module, through setting up first circuit board and the second circuit board that electricity is connected and set up from top to bottom, make full use of light module intracavity space is used for the electric area of connecting the electrical part in order to increase the optical module in the circuit board, satisfies the demand to the electric connection electrical part area of circuit board in the more and less little space of multichannel optical module.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

Generally, to increase the transmission rate of an optical module, increasing the transmission channel in the optical module may be used, such as modifying the conventional optical module including one set of tosa (emitting light of one wavelength) and one set of rosa (receiving light of one wavelength) to include two sets of tosa (each set emitting light of one wavelength) and two sets of rosa (each set receiving light of one wavelength). Therefore, the occupied volumes of the optical transmitting sub-module and the optical receiving sub-module in the optical module are continuously increased, the space reserved for a circuit board is smaller and smaller, and further the further development of the optical module is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module so as to increase the area of a circuit board in the optical module and meet the requirement of the circuit board in smaller and smaller spaces in the optical module.

The application provides an optical module, includes:

a shell, one end of which is provided with an electric port;

one end of the first circuit board extends out of the electric port, and a first groove is formed in the side edge of the first circuit board;

the second circuit board is arranged above the first circuit board and positioned in the shell, and a second groove is formed in the side edge of the second circuit board;

the flexible circuit board is arranged in the first groove and the second groove, one end of the flexible circuit board is electrically connected with the first circuit board, and the other end of the flexible circuit board is connected with the second circuit board;

the light emission sub-module is arranged in the shell and electrically connected with the first circuit board and the second circuit board;

and the light receiving secondary module is arranged in the shell and is electrically connected with the first circuit board.

The optical module provided by the application comprises a shell, a first circuit board, a second circuit board, a flexible circuit board, a light emitting secondary module and a light receiving secondary module; one end of the first circuit board extends out of an electric port of the shell and is used as a main circuit board of the optical module, the second circuit board is arranged in the shell, a first groove is formed in the side edge of the first circuit board, a second groove is formed in the side edge of the second circuit board, the flexible circuit board is located in the first groove and the second groove, one end of the flexible circuit board is electrically connected with the first circuit board, the other end of the flexible circuit board is electrically connected with the second circuit board, and the second circuit board is located above the first circuit board. The application provides an optical module, through setting up first circuit board and the second circuit board that electricity is connected and set up from top to bottom, the area that the electric part is used for the electricity to connect in order to increase the optical module in the high space of make full use of optical module intracavity satisfies the demand to the electric part area of connecting of circuit board in the more and less little space of multichannel optical module.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 5 is a first schematic view illustrating an assembly of a light emission sub-module, a light reception sub-module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 6 is a second schematic view illustrating an assembly of a light emission sub-module, a light reception sub-module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a lower housing according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram illustrating a first circuit and a second circuit board mounted on a lower housing according to an embodiment of the present application;

fig. 9 is a first cross-sectional view of an optical module according to an embodiment of the present disclosure;

fig. 10 is a second cross-sectional view of an optical module according to an embodiment of the present application;

fig. 11 is a third cross-sectional view of an optical module according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of an upper housing according to an embodiment of the present application;

fig. 13 is a first schematic structural diagram illustrating a first circuit and a second circuit board mounted on an upper housing according to an embodiment of the present disclosure;

fig. 14 is a second schematic structural diagram illustrating a structure in which a first circuit and a second circuit board are mounted on an upper housing according to an embodiment of the present application;

fig. 15 is a fourth cross-sectional view of an optical module according to an embodiment of the present application;

fig. 16 is a cross-sectional view of a fifth optical module according to an embodiment of the present application;

fig. 17 is a sixth cross-sectional view of an optical module according to an embodiment of the present application;

fig. 18 is a cross-sectional view seven of an optical module according to an embodiment of the present application;

fig. 19 is a sectional view eight of an optical module according to an embodiment of the present application;

fig. 20 is a cross-sectional view nine of an optical module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a tosa 400, and a tosa 500.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a third shell, and the third shell covers the two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned on two sides of the third shell and are perpendicular to the third shell, and the two side walls are combined with the two side plates to cover the upper shell on the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitter sub-module 400 and the optical receiver sub-module 500 inside the optical module; the optoelectronic devices such as the circuit board 300, the transmitter sub-assembly 400, the receiver sub-assembly 500, etc. are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the transmitter sub-module 400, the receiver sub-module 500 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board 300 is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when a single chip with three functions is provided on the circuit board.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

In the embodiment of the present application, the tosa 400 and the rosa 500 are disposed at one end of the circuit board 300 and electrically connected to the circuit board 300, respectively. However, as the number of channels in the tosa 400 and the rosa 500 increases, the volume ratio of the tosa 400 to the rosa 500 in the optical module increases, and the space left for the circuit board 300 inside the optical module decreases. In particular, when the tosa 400 and the rosa 500 are disposed at one end of the circuit board 300, the space left for the circuit board 300 in the longitudinal direction of the optical module is further reduced. Under the condition that the space reserved for the circuit board 300 in the length direction of the optical module is continuously reduced, in order to meet the use requirement of the optical module on the circuit board 300, in the optical module provided by the application, the circuit board 300 comprises a first circuit board and a second circuit board, the first circuit board and the second circuit board are stacked in the optical module shell, if the second circuit board is arranged above the second circuit and the first circuit board and the second circuit board are arranged, the space in the height direction in the optical module shell is fully utilized, and the area of the circuit board in the optical module, which is used for electrically connecting electric devices, is increased; the first circuit board is a main circuit board of the optical module, and one end of the first circuit board is provided with a golden finger and main devices in the optical module. Optionally, the first circuit board and the second circuit board are electrically connected through a flexible circuit board or a connector, etc.

Fig. 5 is a first schematic view illustrating an assembly of a light emission sub-module, a light reception sub-module, and a circuit board in an optical module according to an embodiment of the present disclosure, and fig. 6 is a second schematic view illustrating an assembly of a light emission sub-module, a light reception sub-module, and a circuit board in an optical module according to an embodiment of the present disclosure. As shown in fig. 5 and fig. 6, in the optical module provided in the embodiment of the present application, the circuit board 300 includes a first circuit board 301 and a second circuit board 302, the first circuit board 301 and the second circuit board 302 are electrically connected through a flexible circuit board 303, and the flexible circuit board 303 facilitates electrical connection between the first circuit board 301 and the second circuit board 302 and assembly of the first circuit board 301 and the second circuit board 302. As shown in fig. 6, the second circuit board 302 is disposed above the first circuit board 301, and the length of the second circuit board 302 is smaller than that of the first circuit board 301, so that the first circuit board 301 can extend out of the electrical port 205, and the second circuit board 302 is located in the inner cavity formed by the housing. Therefore, the second circuit board 302 is arranged above the first circuit board 301, the effective length of the circuit board 300 can be increased within the length range of the first circuit board 301, and the circuit board area required by the arrangement of the electrical devices in the optical module is further ensured.

Optionally, a first groove 3011 is disposed on a side of the first circuit board 301, and a second groove 3021 is disposed on a side of the second circuit board 302, so that when the first circuit board 301 and the second circuit board 302 are assembled into the optical module housing, a relatively wide gap is formed between the first circuit board 301 and the second circuit board 302 and a sidewall of the optical module housing through the first groove 3011 and the second groove 3021; the first recess 3011 is used to electrically connect one end of the flexible circuit board 303, and the second recess 3021 is used to electrically connect the other end of the flexible circuit board 303, so that the first recess 3011 and the second recess 3021 facilitate installation of the flexible circuit board 303. As shown in fig. 5, the first recess 3011 and the second recess 3021 are disposed correspondingly, that is, when the first circuit board 301 and the second circuit board 302 are relatively fixed, the first recess 3011 and the second recess 3021 overlap, which facilitates the mounting of the flexible circuit board 303.

As shown in fig. 5 and 6, the tosa 400 and the rosa 500 are stacked at one end of the first circuit board 301 and the second circuit board 302, and are physically separated from the first circuit board 301 and the second circuit board 302; of course, in the embodiment of the present application, the tosa 400 or the rosa 500 may be disposed on the surface of the first circuit board 301.

The transmitter sub-module 400 and the receiver sub-module 500 are electrically connected to the first circuit board 301 and the second circuit board 302 through flexible circuit boards, respectively; for example, the tosa 400 is electrically connected to the first circuit board 301 through the first flexible circuit board 401, the tosa 400 is electrically connected to the second circuit board 302 through the second flexible circuit board 402, and the rosa 500 is electrically connected to the first circuit board 301 through the third flexible circuit board 501. Optionally, the second circuit board 302 is electrically connected to the second flexible circuit board 402 through a connector, so that the connection between the second circuit board 302 and the second flexible circuit board 402 is conveniently realized, and the assembly is convenient.

Further, as shown in fig. 6, in the embodiment of the present application, the tosa 400 includes a light emitting cavity 403, and the light emitting cavity 403 is used for packaging an electrical device and an optical device configured to generate the emitted signal light; optionally, the tosa 400 combines the multiple-wavelength signal light into one signal light through electrical devices and optical devices disposed in the light emitting cavity 403. As shown in fig. 6, one end of the light emission cavity 403 is provided with an electrical connector 404, such as a ceramic connector; one end of the electrical connector 404 extends into the light emission cavity 402 to be electrically connected to the electrical components in the light emission cavity 403, and the other end of the electrical connector 404 is located outside the light emission cavity 403 to connect the first circuit board 301 and the second circuit board 302 through the first flexible circuit board 401 and the second flexible circuit board 402.

As shown in fig. 6, in the embodiment of the present application, the rosa 500 includes a light receiving cavity 502, and the light receiving cavity 502 is used for packaging the electrical devices and the optical devices configured to receive the signal light; optionally, the light receiving sub-module 500 implements beam splitting reception of the multi-wavelength signal light through electrical and optical devices disposed in the light receiving cavity 502. The third flexible circuit board 501 is disposed through the light receiving cavity 502, such that one end of the third flexible circuit board 501 is located inside the light receiving cavity 502, another end of the third flexible circuit board 501 is located outside the light receiving cavity 502, another end of the third flexible circuit board 501 located inside the light receiving cavity 502 is electrically connected to the electrical components inside the light receiving cavity 502, and another end of the third flexible circuit board 501 located outside the light receiving cavity 502 is electrically connected to the first circuit board 301.

In the embodiment of the present application, in order to fully utilize the space in the optical module cavity, the second circuit board 302 is located above the first circuit board 301, and since the flexible circuit board 303 is used to connect the first circuit board 301 and the second circuit board 302, when the first circuit board 301 is disposed and assembled in the optical module cavity, the flexible circuit board 303 cannot support the second circuit board 302, so that a support structure needs to be disposed on the housing of the optical module to fix the first circuit board 301 and the second circuit board 302, so that there is a sufficient space between the first circuit board 301 and the second circuit board 302. Alternatively, the first circuit board 301 and the second circuit board 302 are fixed in the optical module by the pressing action of the upper housing 201 and the lower housing 202, for example, fixing stages are respectively disposed on the sides of the upper housing 201 and the lower housing 202, and then the first circuit board 301 and the second circuit board 302 are fixed by the corresponding fixing stages.

Fig. 7 is a schematic structural diagram of a lower housing according to an embodiment of the present application. As shown in fig. 7, a first fixing table 2021 and a second fixing table 2022 are disposed on the inner side wall of the lower housing 202, and the top surface of the first fixing table 2021 and the top surface of the second fixing table 2022 are located at different heights, so that the first circuit board 301 and the second circuit board 302 are located at different heights in the lower housing 202; the top supporting surface of the first fixing table 2021 is used for contacting a surface of the first circuit board 301, and the top supporting surface of the second fixing table 2022 is used for contacting a surface of the second circuit board 302; correspondingly, a plurality of fixing tables are arranged on the side of the upper casing 201, the first fixing table 2021 supports the first circuit board 301 in the direction of the upper casing 201, the second fixing table 2022 supports the second circuit board 302 in the direction of the upper casing 201, the fixing table on the upper casing 201 supports the first circuit board 301 and the second circuit board 302 in the direction of the lower casing 202, and further the fixing tables on the side of the upper casing 201 are matched with the first fixing table 2021 and the second fixing table 2022 to fix the first circuit board 301 and the second circuit board 302 in the optical module. In the embodiment of the present application, the first fixing table 2021 and the second fixing table 2022 may be structures protruding on the inner side wall of the lower housing 202 and having supporting top surfaces.

In the embodiment of the present application, the number of the first fixing table 2021 and the second fixing table 2022 is usually plural, and the plural numbers are respectively distributed at different positions of the sidewall of the lower housing 202, and the shapes of the first fixing table 2021 and the second fixing table 2022 may be different. In the process of assembling the optical module, the assembled first circuit board 301 and second circuit board 302 may be assembled into the lower housing 202, and the first fixing table 2021 and second fixing table 2022 support the first circuit board 301 and second circuit board 302, respectively.

Further, as shown in fig. 7, in order to ensure the mounting accuracy of the first circuit board 301 and the second circuit board 302, a first position-limiting post 2023 and a second position-limiting post 2024 are further disposed on the side wall of the lower housing 202; the first limiting column 2023 is used for limiting the first circuit board 301, and the first limiting column 2023 can not only realize the mounting and positioning of the first circuit board 301, but also realize the fixing of the first circuit board 301 in the length direction of the optical module; the second position-limiting column 2024 is used for limiting the position of the second circuit board 302, and the second position-limiting column 2024 can not only realize the mounting and positioning of the second circuit board 302, but also realize the fixing of the second circuit board 302 in the length direction of the optical module.

Fig. 8 is a schematic structural diagram illustrating a first circuit and a second circuit board mounted on a lower housing according to an embodiment of the present application. As shown in fig. 8, a first position-limiting opening 3012 is formed on a side of the first circuit board 301, the first position-limiting opening 3012 is connected to the first position-limiting post 2023 in a snap-fit manner, a second position-limiting opening 3022 is formed on a side of the second circuit board 302, and the second position-limiting opening 3022 is connected to the second position-limiting post 2024 in a snap-fit manner. In the embodiment of the present application, the number of the first position-limiting columns 2023 and the second position-limiting columns 2024 may be multiple, and a plurality of first position-limiting ports 3012 and second position-limiting ports 3022 are correspondingly disposed on the corresponding side edges of the first circuit board 301 and the second circuit board 302.

Fig. 9 is a first cross-sectional view of an optical module according to an embodiment of the present application, fig. 10 is a second cross-sectional view of the optical module according to the embodiment of the present application, fig. 11 is a third cross-sectional view of the optical module according to the embodiment of the present application, and fig. 9 to 11 show an assembly structure of the lower housing 202, the first circuit board 301, and the second circuit board 302 according to the embodiment of the present application. As shown in fig. 9-11, the top surface of the first fixing stage 2021 supports the lower surface of the first circuit board 301, the top surface of the second fixing stage 2022 supports the lower surface of the second circuit board 302, the first position-limiting opening 3012 is connected to the first position-limiting post 2023 in a snap-fit manner, and the second position-limiting opening 3022 is connected to the second position-limiting post 2024 in a snap-fit manner.

Fig. 12 is a schematic structural diagram of an upper housing according to an embodiment of the present application. As shown in fig. 12, a third fixing stand 2011 and a fourth fixing stand 2012 are provided at the side of the upper case 201, and the top surface of the third fixing stand 2011 and the top surface of the fourth fixing stand 2012 are located at different heights. Optionally, a plurality of third fixed stages 2011 and a plurality of fourth fixed stages 2012 are respectively disposed on two sides of the upper casing 201, and the third fixed stages 2011 and the fourth fixed stages 2012 are respectively disposed on two sides of the upper casing 201. The third and fourth fixing

stages

2011 and 2012 may protrude from the side of the upper case 201 and have a supporting top surface.

Fig. 13 is a first structural schematic diagram of a first circuit and a second circuit board assembled on an upper housing according to an embodiment of the present disclosure. As shown in fig. 13, a top surface of the third fixing table 2011 is for contacting another surface (an upper surface in the direction of fig. 12) of the first circuit board 301, and a top surface of the fourth fixing table 2012 is for contacting another surface of the second circuit board 302. When the upper housing 201 and the lower housing 202 are assembled and fixed, the first fixing table 2021 and the third fixing table 2011 respectively press the first circuit board 301, so that the first circuit board 301 and the optical module housing are fixed; the second fixing table 2022 and the fourth fixing table 2012 respectively press the second circuit board 302, so as to fix the second circuit board 302 and the optical module housing.

Fig. 14 is a second structural diagram illustrating a structure in which the first circuit and the second circuit board are mounted on the upper housing according to the embodiment of the present application. As shown in fig. 12 to 14, both sides of the upper housing 201 are provided with a third fixing table 2011 and a fourth fixing table 2012, so that the first circuit board 301 and the second circuit board 302 can be uniformly fixed by pressing. The third fixing table 2011 and the fourth fixing table 2012 may not have the same shape.

Fig. 15 is a fourth cross-sectional view of an optical module provided in an embodiment of the present application, fig. 16 is a fifth cross-sectional view of the optical module provided in the embodiment of the present application, and fig. 15 and 16 show an assembly structure of an upper housing 201 and a lower housing 202 in the embodiment of the present application. As shown in fig. 15 and 16, a third fixing table 2011 and a fourth fixing table 2012 are disposed on both side edges of the upper housing 201, and a first fixing table 2021 and a second fixing table 2022 are disposed on the side wall of the lower housing 202. When the upper case 201 and the lower case 202 are assembled and the first circuit board 301 and the second circuit board 302 are not assembled; the plane of the top surface of the first fixing table 2021 and the plane of the top surface of the third fixing table 2011 have a height difference, and the height difference is used for installing the first circuit board 301; the plane of the top supporting surface of the second fixing table 2022 and the plane of the top supporting surface of the fourth fixing table 2012 have a height difference, and the height difference is used for mounting the second circuit board 302.

Fig. 17 is a sixth cross-sectional view of an optical module according to an embodiment of the present application, fig. 18 is a seventh cross-sectional view of an optical module according to an embodiment of the present application, fig. 19 is an eighth cross-sectional view of an optical module according to an embodiment of the present application, fig. 20 is a ninth cross-sectional view of an optical module according to an embodiment of the present application, and fig. 17 to 20 show an assembly structure of an upper housing 201 and a lower housing 202 with a first circuit board 301 and a second circuit board 302 according to an embodiment of the present application. As shown in fig. 17 to 20, the top surface of the third fixing table 2011 presses the first circuit board 301 toward the lower housing 202, the top surface of the fourth fixing table 2012 presses the second circuit board 302 toward the lower housing 202, and the first fixing table 2021 and the second fixing table 2022 on the lower housing 202 are engaged to fix the first circuit board 301 and the second circuit board 302. In the embodiment of the present application, the second circuit board 302 is closer to the top surface of the upper housing 201 than the first circuit board 301, so that the third fixing platform 2011 presses the first circuit board 301, a notch 3024 is disposed on the second circuit board 302, and the third fixing platform 2011 passes through the notch 3024 to contact the first circuit board 301.

As shown in fig. 20, a DSP chip 304 is provided on the first circuit board 301, and the DSP chip 304 is electrically connected to the first circuit board 301. The DSP chip 304 is a main signal processing chip in the optical module, and generates a large amount of heat during the working process of the optical module, so as to facilitate heat dissipation of the DSP chip 304, a heat conducting platform 2013 is disposed on the inner wall of the top of the upper housing 201, a through hole 3023 is disposed on the second circuit board 302, and the heat conducting platform 2013 penetrates through the through hole 3023 to be connected to the DSP chip 304 in a heat conducting manner, for example, the DSP chip 304 is connected to the heat conducting adhesive and the heat conducting pad. Because the upper shell 201 is a main heat dissipation shell of the optical module, the heat generated by the DSP chip 304 is directly transmitted to the upper shell 201 through the heat conduction platform 2013, so that the heat dissipation of the DSP chip 304 is accelerated, and the influence of the heat generated by the DSP chip 304 on other devices in the optical module is reduced.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a shell, one end of which is provided with an electric port;

2. The optical module according to claim 1, wherein the housing comprises a lower housing and an upper housing, a first fixing table and a second fixing table are arranged on the inner side of the lower housing, and a third fixing table and a fourth fixing table are arranged on the side of the upper housing;

the first fixing table is in contact connection with one surface of the first circuit board, the third fixing table is in contact connection with the other surface of the first circuit board, and the first fixing table and the third fixing table are matched and used for fixing the first circuit board; the two fixed tables are connected with one surface of the second circuit board, the fourth fixed table is in contact connection with the other surface of the second circuit board, and the two fixed tables and the fourth fixed table are matched and fixed with the second circuit board.

3. The optical module according to claim 1, wherein a first limit post and a second limit post are disposed on a sidewall of the housing; the first circuit board is provided with a first limiting port, and the first limiting port is clamped and connected with the first limiting column; and a second limiting port is arranged on the second circuit board, and the second limiting port is clamped and connected with the second limiting column.

4. The optical module of claim 2, wherein the second circuit board is provided with a notch, and the third fixing platform passes through the notch to be in contact connection with the first circuit board.

5. The optical module according to claim 2, further comprising a DSP chip, wherein the DSP chip is disposed on the first circuit board, the second circuit board is disposed with a through hole, and a heat conducting platform is disposed on an inner wall of a top of the upper housing, and the heat conducting platform penetrates through the through hole to be thermally connected to the DSP chip.

6. The optical module of claim 1, wherein the tosa and the rosa are stacked at the optical port end of the housing.

7. The optical module of claim 1, wherein the tosa includes an electrical connector electrically connected to the first circuit board via a first flexible circuit board and to the second circuit board via a second flexible circuit board.

8. The optical module of claim 1, wherein the rosa is electrically connected to the first circuit board through a third flexible circuit board.

9. The optical module of claim 7, wherein the tosa comprises an optical cavity, and the electrical connector is embedded in the optical cavity.

10. The optical module as claimed in claim 8, wherein the rosa comprises a light receiving cavity, a through hole is disposed at an end of the light receiving cavity, and the third flexible circuit board is disposed through the through hole.