CN117353825A - High-speed light emitting system integrating single-end welding FPC and driving and control method - Google Patents
High-speed light emitting system integrating single-end welding FPC and driving and control method Download PDFInfo
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- 238000013461 design Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
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- H—ELECTRICITY
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- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
- H04B10/504—Laser transmitters using direct modulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
- H04B10/505—Laser transmitters using external modulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/516—Details of coding or modulation
- H04B10/5161—Combination of different modulation schemes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
The invention discloses a high-speed light emitting system integrating single-end welding of FPC and driving and a control method, wherein the system comprises a tube shell, an FPC, a laser, a built-in driver and an FPC bonding pad; the front end of the FPC is of a hard board structure, the rear end of the FPC is of a soft board structure, the front end of the FPC stretches into the tube shell and is provided with an FPC bonding pad, the built-in driver is respectively adjacent to the FPC bonding pad and the laser, and the built-in driver is respectively connected with the FPC bonding pad and the laser through gold wire bonding. According to the invention, the FPC and the optical device are combined without welding, the FPC is only required to be welded once when being combined with the module, most of other parts can be bonded, the replacement of an internal laser is more convenient, impedance discontinuity is not generated at a welding position, and higher operation bandwidth and higher product performance can be provided. The built-in driver can effectively simulate and forecast the failure time of the laser according to the light emitting condition of the continuous laser of the comparison and analysis laser, and has better practicability.
Description
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to a high-speed light emitting system integrating single-end welding of FPC and driving and a control method.
Background
In recent years, as 5G technology matures, commercial use advances gradually, and the construction of base stations brings about the need for massive light emitting devices. The light emitting device is a functional device for carrying out optical/electrical conversion and transmission on signals in an optical transmission network, and is an important component of an optical transmission system. The chip of the conventional light emitting device is bonded to a bonding pad or a metal pin by using a gold wire, and the bonding pad or the metal pin is connected with the FPC by soldering tin, so that the manufacturing process has more steps. The conventional light emitting device can place the driving chip outside the light device, the laser also needs to lead the anode and the cathode outside the light device, and the laser is controlled to emit light through an external power supply, so that the conditions of low integration level, unmatched FPC impedance and metal pad impedance of the conventional light emitting device are caused.
With the increasing optical communication rate, the impedance discontinuity of the connection of the bonding pad or the metal pin through soldering tin and the FPC affects the quality of high-frequency signals, and the problem of reducing the operation bandwidth of the driving chip and the semiconductor laser is more and more prominent, so that the performance of the high-speed light emitting device is seriously affected. Secondly, the driving chip of the conventional light emitting device is usually placed outside the device, and can be connected with the laser only through PCB wiring, soldering tin welding and gold wire bonding; the anode and the cathode of the laser are also required to be led out, and the outside is required to be independently powered up for control; lasers which continuously operate in conventional optical devices are susceptible to temperature effects, which can lead to unstable output power and thus unstable signals loaded onto the light, and particularly, can have serious effects on the application of light emitting devices with a rate of more than 25G; and the failure tendency of the laser is not easily found at the first time. The design ensures that when the light emitting device works at the speed of more than 25G, the impedance matching of the laser and the driving chip is very poor, thus the performance of the light emitting device is very poor, the fault tolerance rate of the manufacturing process is low, and the precision of the manufacturing process is high.
As shown in fig. 1, the elements related to the light emitting device without the integrated driving chip mainly include a laser, a package pad, an FPC, and a package. The traditional light emitting device is not integrated with a driving chip, the laser is connected with the tube shell through a tube shell bonding pad, the laser is connected with the tube shell bonding pad in a bonding way, and the tube shell is connected with the FPC through the tube shell bonding pad in a bonding way. The traditional light emitting device is not integrated with a driving chip, has poor impedance matching effect, cannot meet high-speed application, and can only be suitable for low-speed application. In addition, the conventional light emitting device may be "misplaced" when the FPC is soldered to the package pad, which exacerbates impedance mismatch. As shown in fig. 2, the light emitting device may be "misplaced" when the FPC is soldered to the package pads, which exacerbates impedance mismatch.
Disclosure of Invention
The invention aims to provide a high-speed light emitting system integrating single-end welding of FPC and driving and a control method thereof, and aims to solve the problems. The invention realizes the early warning of the aging of the laser through the control method and has better practicability.
The invention is realized mainly by the following technical scheme:
the high-speed light emitting system integrating single-end welding of FPC and drive comprises a tube shell, an FPC, a laser, a built-in driver and an FPC bonding pad; the front end of the FPC is of a hard board structure, the rear end of the FPC is of a soft board structure, the front end of the FPC stretches into the tube shell and is provided with an FPC bonding pad, the built-in driver is respectively adjacent to the FPC bonding pad and the laser, and the built-in driver is respectively connected with the FPC bonding pad and the laser through gold wire bonding. Further, in the present invention, the laser may be placed on the FPC or not, depending on the specific scheme, so that the description is omitted. The laser is correspondingly matched with the lens isolator and the optical fiber adapter, and is in the prior art, so that the description is omitted.
In order to better realize the invention, the built-in driver is directly adhered to the metalized pattern of the front hard plate of the FPC through conductive adhesive, so that the gnd at the bottom of the built-in driver is directly connected with the gnd of the metalized pattern of the front hard plate of the FPC.
In order to better realize the invention, a built-in driver is arranged between the FPC bonding pad and the laser.
In order to better realize the invention, the built-in driver is further internally provided with an APC control circuit, a digital interface and a reset unit, wherein the APC control circuit is used for stabilizing the light emission of a laser which continuously works; the digital interface is used for reading the current of the laser, recording the value of the feedback current, monitoring the current condition of the laser in real time and finding out the current abnormality of the laser in time; the reset unit is used for restarting the built-in driver under the condition that the power supply is not turned off, so that irreversible damage to the laser caused by sudden turn-off of the built-in driver is reduced.
In order to better realize the invention, the system further comprises a laser aging early warning module for finding the failure problem of the laser based on algorithm simulation comparison.
In order to better realize the invention, the system further comprises a photoelectric detector MPD, wherein the built-in driver comprises a communication circuit, a high-frequency related control circuit, an automatic voltage control circuit, an MPD recorder and an analog regulation feedback circuit, and the high-frequency related control circuit is used for carrying out phase and frequency modulation on light; the automatic voltage control circuit is used for controlling the voltage of the laser so as to adjust the current of the laser; the MPD recorder is used for recording an MPD detection value; the analog regulation feedback circuit is used for determining threshold current ITH of the laser; the high-frequency related control circuit, the automatic voltage control circuit, the MPD recorder and the analog regulation feedback circuit are respectively connected with the laser through the communication circuit and the photoelectric detector MPD, and the photoelectric detector MPD is connected with the laser.
In order to better realize the invention, the system further comprises an external modulator, wherein the external modulator is respectively connected with the laser and the built-in driver; the external modulator is a micro-ring modulator or a Mach-Zehnder modulator. As shown in fig. 6, or directly drive the DML, EML lasers.
In order to better realize the invention, the built-in driver is further integrated with an MPD monitoring feedback unit and a driving equalizer, wherein the driving equalizer is used for compensating the modulated optical signals according to signals with different frequencies; the MPD monitoring feedback unit is used for automatically regulating and controlling the continuous luminous laser according to the light emitting condition of the laser monitored by the photoelectric detector MPD, so that the light emitting power of the laser is consistent and stable. Preferably, the built-in driver is further integrated with a heater controller, and the heater of the silicon-based PIC is controlled to perform temperature rise and fall change on the light coupled into the silicon-based PIC, so as to modulate the phase, frequency and the like of the light.
The invention is realized mainly by the following technical scheme:
the control method for the high-speed light emitting system integrating single-end welding of the FPC and driving is carried out by adopting the high-speed light emitting system and comprises the following steps of:
step S1: changing the voltage VMOD value of the laser, and recording the numerical variation information of the MPD value and the IDD value of the laser current caused by the luminous output of the laser; determining a threshold current ITH of the laser through a built-in driver;
step S2: during normal operation, a built-in driver gives a fixed voltage value VMOD to a laser, the laser correspondingly generates a current value IDD and a photoelectric detector MPD value, when any one of the VMOD, the IDD and the photoelectric detector MPD value is abnormal, the communication circuit feeds back the abnormality, and the automatic voltage control circuit adjusts the laser voltage VMOD to enable the value of the photoelectric detector MPD and the IDD to approach to fixed initial values;
step S3: and when the recording times exceed a set threshold value, directly starting automatic voltage regulation, calculating the ITH value of the laser again, comparing the ITH value with an ITH initial value, and evaluating the aging condition of the laser by dividing the absolute value of the difference value of the ITH value and the ITH initial value by the percentage of the ITH initial value. Preferably, the set threshold value of the number of recordings may be set to three.
In order to better implement the present invention, further, in the step S1, determining the threshold current ITH of the laser includes the steps of:
step S11: the built-in driver directly supplies power to the laser and the photo detector MPD;
step S12: adjusting the VMOD value of the voltage at the two ends of the laser, and adjusting one VMOD value at intervals of 0.1 within the range of VMOD=0.7V-2.5V, wherein different VMOD values correspond to different IDD values;
step S13: different IDD values correspond to different laser luminous powers, and when the laser current exceeds a threshold value, the laser current is fed back to the built-in driver to turn off the power supply of the laser;
step S14: different current IDD values correspond to different current IMPD values of the photodetector MPD, and the IDD values and the IMPD values are in a linear relationship, idd=a—impd+ith, where a is a slope; and controlling the VMOD change to obtain different IDD values and different IMPD values, and further obtaining the threshold current ITH of the laser through a simulation curve.
Preferably, in step S13, when the current of the laser is too large and exceeds a certain range (IDD is generally in the range of 0-120 ma), the feedback is given to the built-in driver, and the power supply of the laser is turned off.
The beneficial effects of the invention are as follows:
(1) The FPC is combined with the optical device without welding, the FPC is only required to be welded once when being combined with the module, the OSA is assembled into the module, and the FPC of the OSA is required to be welded to the module. Compared with the traditional optical device without welding of an FPC and an optical device bonding pad or an optical device metal pin, the invention can not generate impedance discontinuity of the welding part, and can provide higher operation bandwidth and higher product performance;
(2) The built-in driver and the laser are adjacently arranged, the laser and the built-in driver are directly connected by bonding through the extremely short gold wire, the impedance matching effect is good, the laser does not need to be independently led out for driving by an external power supply, and can be driven by being connected with an internal driver, so that the integration level of the light emitting device is improved, the space is effectively utilized, and the manufacturing process flow is reduced;
(3) The FPC is a soft and hard combined board, the front end hard board of the FPC has good mechanical stability and good heat dissipation, the operations such as bonding of a driver of the built-in driver, bonding of gold wires and the like can be well realized, the front end hard board can be subjected to metallization routing and metallization patterns, the driver of the built-in driver is directly bonded on the metallization patterns of the FPC hard board through conductive adhesive, the gnd at the bottom of the driver of the built-in driver can be directly connected with the gnd of the metallization patterns of the FPC hard board, and the grounding effect of the driver of the built-in driver is increased by the design mode, so that the performance of the light emitting device is improved; the flexible board at the rear end of the FPC has better flexibility, and can be better assembled and interconnected with the flexibility of the subsequent optical module;
(4) The built-in driver can directly supply power to the MPD, a control circuit is arranged in the built-in driver, and the built-in driver can automatically regulate and control the laser which emits light continuously according to the light emitting condition of the laser monitored by the MPD, so that the light emitting power of the laser is more consistent and stable. Secondly, unlike conventional scheme, built-in driver can be according to contrast, analysis laser instrument continuous laser instrument light-emitting condition in a period of time, effective simulation, prediction laser instrument dead time, simultaneously because optical device FPC only need once weld, and the most bondability of other parts is accomplished, when inside laser instrument damages, it is also more convenient to change, has solved the difficult prediction of laser instrument dead time, has changed trouble problem. In addition, unlike other schemes, when the laser is out of control, the built-in chip can also automatically turn off the laser, so that unnecessary damage to the whole device caused by the out-of-control laser is prevented; the built-in driver has a reset function, and under the condition of not closing a power supply, the chip can be restarted, so that irreversible damage to the laser caused by sudden shutdown of the built-in chip is reduced, and especially when the modulation application of an optical signal is higher than a speed of more than 25G, the adaptability of the light emitting device to the environment is improved; meanwhile, the manual control mode can be started according to actual application, so that the power consumption of the light emitting device is effectively utilized;
(5) The invention is internally provided with a driver, and can be used in combination with silicon-based PIC, high-power CW laser, FA and other optical active and passive devices. The optical modulation system can realize the optical modulation mode output of different modes by controlling the heater of the silicon-based PIC to perform temperature rise and fall change on light coupled into the silicon-based PIC so as to modulate the phase, the frequency and the like of the light or by matching optical components such as FA and a high-power CW laser; the method can also be matched with a DML laser, an EML laser and the like to carry out direct modulation according to different requirements, and can be applied to single-channel, four-channel and other schemes. The driver can be compatible with various amplitude modulation modes such as PAM4, NRZ and the like, is suitable for high-speed optical devices with the speed more than 25G, and greatly reduces the cost problem of the original scheme.
Drawings
Fig. 1 is a schematic structural view of a conventional light emitting device without integrated built-in driver;
FIG. 2 is a schematic diagram of a dislocation structure of FPC soldered to a package pad;
FIG. 3 is a schematic diagram of a high-speed light emitting system with a single-ended solder FPC according to the present invention;
FIG. 4 is a schematic block diagram of a high-speed light emitting system of the single-ended solder FPC of the present invention;
FIG. 5 is a schematic diagram of determining a threshold current ITH of a laser;
fig. 6 is a control schematic diagram of the high-speed light emitting system of the single-ended solder FPC of the present invention.
Wherein: 1-tube shell, 2-FPC, 3-laser, 4-built-in driver, 5-FPC pad.
Detailed Description
Example 1:
a high-speed light emitting system integrating single-ended soldering of FPC and driving, as shown in FIG. 3, comprises a package 1, an FPC2, a laser 3, a built-in driver 4 and FPC pads 5. The FPC2 is a soft board and hard board combined structure, and the front hard board of the FPC2 is provided with an FPC pad 5. The built-in driver 4 is connected to the FPC pad 5 by gold wire bonding; the built-in driver 4 is placed adjacent to the FPC pad 5, and the built-in driver 4 is placed adjacent to the laser 3, so that the gold wire bonding length between the driver and the FPC pad 5 and the gold wire bonding length between the driver and the laser 3 are extremely short, and excellent impedance matching can be obtained. The present invention does not require soldering of FPC2 to the package pads, and thus there is no impedance mismatch and no resulting degradation of the performance of the light device, relative to the conventional light emitting device shown in fig. 1 and 2.
Preferably, the front hard board of the FPC2 has better mechanical stability and better heat dissipation, the operations such as bonding and gold wire bonding of the built-in driver 4 can be better realized, the front hard board can be metallized with wires and metallized patterns, and the built-in driver 4 can be directly bonded on the metallized patterns of the hard board of the FPC2 through conductive adhesive to realize the direct connection between gnd at the bottom of the built-in driver 4 and gnd of the metallized patterns of the hard board of the FPC 2. The design mode increases the grounding effect of the built-in driver 4 and improves the performance of the light emitting device; the flexible board at the rear end of the FPC2 has better flexibility, and can better realize flexible assembly interconnection with a subsequent optical module.
As shown in fig. 1, the external built-in driver 4 mode is adopted, and the method can only be used for low-speed communication, because the high-speed communication has very high requirement on impedance matching; further, even if the built-in driver 4 is included, the impedance matching effect is poor due to the plurality of times of soldering of the FPC2 and the like, which easily affects the high-speed performance. The built-in driver 4 of the light emitting device reduces the impedance mismatch caused by factors such as welding dislocation of the FPC2 while considering the high integration of the light emitting device, and has excellent impedance matching performance.
Preferably, the built-in driver is internally provided with the APC control circuit, so that the continuous working laser 3 emits light more stably, the built-in driver is also provided with a digital interface, the feedback current value can be recorded, the current of the laser 3 can be read through the digital interface, the current condition of the laser 3 can be monitored in real time, and the current abnormality of the laser 3 can be found in time.
Secondly, unlike the conventional scheme, the built-in driver can effectively know the failure degree of the laser 3 according to the change data such as the current and the voltage of the laser 3 and the MPD change data and the continuous light emitting condition of the laser 3 in a period of time, meanwhile, as the FPC2 of the optical device is only required to be welded once, the rest part is mostly completed by bonding, when the internal laser 3 fails or is about to fail, the prediction can be better, the replacement of the laser 3 is also more convenient than the original scheme, and the problems that the failure of the laser 3 is difficult to predict, the replacement is troublesome, the shell and other parts in the shell can be recycled and the like in the prior design scheme are solved.
In addition, unlike other schemes, when the laser 3 is out of control, the built-in driver 4 can automatically turn off the laser 3, so that unnecessary damage to the whole device caused by the out-of-control laser 3 is prevented; the built-in driver chip also has a reset function, and the chip can be restarted under the condition of not shutting down the power supply, so that irreversible damage to the laser 3 caused by sudden shutdown of the built-in chip is reduced.
Preferably, the built-in driver of the invention also integrates the function of driving an equalizer, and compensates the modulated optical signals according to signals with different frequencies; the driver can normally supply power with the laser 3 and the MPD only by normal power supply, and does not need any external independent power supply; the built-in driver is led out through the integrated Flexible Printed Circuit (FPC) 2, the power-on operation is simple and convenient, and a reset function is built in, so that the reset can be restarted once communication is disordered; the built-in driver is suitable for drivers integrating the functions of a heater controller, MPD monitoring feedback, an equalizer and the like, reduces the requirements of the optical device on an external circuit, and increases the anti-interference capability of the optical device. Preferably, the built-in driver can be matched with optical active devices and passive devices such as PIC, high-power CW laser 3, FA and the like at the same time, and is widely applied to a DML scheme, an EML scheme, an MZ scheme and the like; is suitable for single-channel and multi-channel light emitting devices.
Preferably, as shown in fig. 4 and 6, the system further comprises an external modulator and a photo detector MPD, the built-in driver 4 comprises a communication circuit, a high-frequency related control circuit automatic voltage control circuit, an MPD recorder and an analog regulation feedback circuit, and the high-frequency related control circuit is used for modulating the phase and the frequency of light; the high-frequency related control circuit, the automatic voltage control circuit, the MPD recorder and the analog regulation feedback circuit are respectively connected with the laser 3 through the communication circuit and the photoelectric detector MPD, the photoelectric detector MPD is connected with the laser 3, and the external modulator is respectively connected with the laser 3 and the built-in driver 4.
Preferably, as shown in fig. 6, the device may be formed byAnd->The two modes modulate the laser light, and correspond to modes such as Mach-Zehnder modulator and direct modulation modes such as DML and EML respectively. The high-frequency related control circuit can be matched with an external micro-ring modulator or a Mach-Zehnder modulator for use, and can realize various modulation mode applications, such as PAM4, NRZ and the like; the phase and frequency modulation can be performed, when the DML scheme and the EML scheme are used, the external micro-ring modulator or the Mach-Zehnder modulator part can not be connected, and when the external micro-ring modulator or the Mach-Zehnder modulator is connected, the phase and frequency modulation can be performed on light, so that the cost problem of the original scheme is greatly reduced, and the use flexibility is increased.
In summary, unlike the process of fig. 1 and 2, which requires continuous soldering, the intermediate process of single-end soldering of FPC2 of the present invention does not require soldering, and the impedance stability and continuity of FPC2 are better. The laser 3 may alternatively be placed on the FPC2 or not on the FPC2, depending on the specific scheme. Comparing fig. 1 and fig. 2, the invention solves the defect that the shell and other elements in the shell cannot be reused for multiple times due to the fact that the laser 3 is aged fast and the welding process of the FPC2 is too much in the traditional scheme.
Example 2:
a control method for a high-speed light emitting system integrating single-end welding FPC and driving comprises the following steps:
1) By changing the voltage VMOD value of the laser 3, numerical change information such as MPD4 value change, laser 3 current IDD value change and the like caused by the light emitting output of the laser 3 is recorded, and the driver uses an algorithm (as shown in fig. 5) to determine the initial value of the threshold value ITH of the laser 3 (the ITH value is continuously tested three times, and the value is averaged three times and set as the initial value of the ITH).
2) When the device works normally, the Driver gives a fixed voltage value VMOD to the laser 3, the laser 3 correspondingly generates a current value IDD and a photoelectric detector MPD value, when any one of the VMOD, the IDD and the photoelectric detector MPD value is abnormal, the voltage VMOD of the laser 3 is regulated through the automatic voltage control circuit, the MPD recorder and the analog regulation feedback circuit by feedback of the communication circuit, so that the MPD4 value and the IDD approach to the fixed initial value.
3) Every time the voltage VMOD value of the laser 3 is regulated, the numerical variation information of the MPD value of the photoelectric detector and the IDD value of the current of the laser 3, which are caused by the luminous output of the laser 3, is recorded once, when the recording times are more than three times, the automatic voltage regulation is directly started, the ITH value of the laser 3 is calculated again, and is compared with the previous ITH initial value, the absolute value of the absolute value I ITH initial value-ITH calculated value I is divided by the percentage of the ITH initial value (the ITH initial value is not degraded by the laser 3 by more than 10 percent), the aging condition of the laser 3 is known, and the basis is provided for finding the abnormality of the laser 3 in time and rapidly replacing the laser 3.
Preferably, as shown in fig. 5, determining the threshold current ITH of the laser 3 comprises the steps of:
step S11: the built-in driver 4 directly supplies power to the laser 3 and the photo detector MPD;
step S12: by adjusting the voltage VMOD values of the two ends of the laser 3, one VMOD value is adjusted every 0.1 within the range of VMOD=0.7V-2.5V, and different VMOD values correspond to different IDD values;
step S13: different IDD values correspond to different luminous powers of the laser 3, when the current of the laser 3 is overlarge and exceeds a certain range (the IDD is in a general range of 0-120 mA), the current is fed back to the built-in driver 4, and the power supply of the laser 3 is closed;
step S14: the different current IDD values correspond to the current IMPD values of the different photodetectors MPD, and the IDD values and the IMPD values are in a linear relationship, idd=a×impd+ith, and the VMOD is controlled to change to obtain different IDD values, so as to obtain different IMPD values, and further obtain the threshold current ITH of the laser 3 through a simulation curve.
Compared with the prior art, the invention creatively increases the aging early warning of the laser 3, and timely discovers the failure problem of the laser 3 by using algorithm simulation and comparison.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any simple modification, equivalent variation, etc. of the above embodiment according to the technical matter of the present invention fall within the scope of the present invention.
Claims (10)
1. The high-speed light emitting system integrating single-end welding of FPC and driving is characterized by comprising a tube shell (1), an FPC (2), a laser (3), a built-in driver (4) and an FPC bonding pad (5); the front end of the FPC (2) is of a hard board structure, the rear end of the FPC is of a soft board structure, the front end of the FPC (2) stretches into the tube shell (1) and is provided with an FPC bonding pad (5), the built-in driver (4) is respectively adjacent to the FPC bonding pad (5) and the laser (3), and the built-in driver (4) is respectively in gold wire bonding connection with the FPC bonding pad (5) and the laser (3).
2. The high-speed light emitting system integrating single-ended soldering with FPC and driving according to claim 1, wherein said built-in driver (4) is directly adhered to the metallized pattern of the front hard board of FPC (2) by conductive adhesive to realize the direct connection of gnd at the bottom of built-in driver (4) and gnd of the metallized pattern of the front hard board of FPC (2).
3. The high-speed light emitting system integrating single-ended soldering of FPC and driving according to claim 1, characterized in that a built-in driver (4) is provided between the FPC pad (5) and the laser (3).
4. The high-speed light emitting system integrating single-ended soldering (FPC) and driving according to claim 1, wherein said built-in driver (4) is built-in with an APC control circuit for stabilizing the light emission of a continuously operating laser (3), a digital interface and a reset unit; the digital interface is used for reading the current of the laser (3), recording the feedback current value, monitoring the current condition of the laser (3) in real time and finding out the current abnormality of the laser (3) in time; the reset unit is used for restarting the built-in driver (4) under the condition that the power supply is not turned off, so that irreversible damage to the laser (3) caused by the fact that the built-in driver (4) is suddenly turned off is reduced.
5. The high-speed light emitting system integrating single-ended welded FPCs and driving according to claim 1, further comprising a laser (3) aging pre-warning module for finding out failure problems of the laser (3) based on algorithmic simulation contrast.
6. The high-speed light emission system integrating single-ended welded FPC with drive according to any of claims 1-5, characterized in that said system further comprises a photo detector MPD, said built-in driver (4) comprising a communication circuit, a high-frequency dependent control circuit for phase, frequency modulation of light, an automatic voltage control circuit, an MPD recorder and an analog regulation feedback circuit; the automatic voltage control circuit is used for controlling the voltage of the laser (3) so as to adjust the current of the laser (3); the MPD recorder is used for recording an MPD detection value; the analog regulation feedback circuit is used for determining the threshold current ITH of the laser (3); the high-frequency related control circuit, the automatic voltage control circuit, the MPD recorder and the analog regulation feedback circuit are respectively connected with the laser (3) through the communication circuit and the photoelectric detector MPD, and the photoelectric detector MPD is connected with the laser (3).
7. The high-speed optical emission system integrating single-ended soldering FPC and driving according to claim 6, characterized in that it further comprises an external modulator connected to the laser (3) and the built-in driver (4), respectively; the external modulator is a micro-ring modulator or a Mach-Zehnder modulator.
8. The high-speed optical emission system integrating single-ended soldering FPC and driving according to claim 6, characterized in that said built-in driver (4) is further integrated with an MPD monitoring feedback unit and a driving equalizer for compensating modulated optical signals according to signals of different frequencies; the MPD monitoring feedback unit is used for automatically regulating and controlling the continuous luminous laser (3) according to the light emitting condition of the laser (3) monitored by the photoelectric detector MPD, so that the light emitting power of the laser (3) is consistent and stable.
9. A control method for a high-speed light emitting system integrating single-end soldering of FPC and driving, using the high-speed light emitting system according to any one of claims 6 to 8, characterized by comprising the steps of:
step S1: changing the voltage VMOD value of the laser (3), and recording the numerical variation information of the MPD value of the photoelectric detector and the current IDD value of the laser (3) caused by the luminous output of the laser (3); determining a threshold current ITH of the laser (3) by means of the built-in driver (4);
step S2: during normal operation, a built-in driver (4) gives a fixed voltage value VMOD to a laser (3), the laser (3) correspondingly generates a current value IDD and a photoelectric detector MPD value, when any one of the VMOD, the IDD and the photoelectric detector MPD value is abnormal, the communication circuit feeds back the abnormality, and the automatic voltage control circuit adjusts the voltage VMOD of the laser (3) to enable the value of the photoelectric detector MPD and the IDD to approach to a fixed initial value;
step S3: and (3) recording the numerical variation information of the MPD value of the photoelectric detector and the IDD value of the current of the laser (3) caused by the luminous output of the laser (3) once when the voltage VMOD value of the laser (3) is regulated once, directly starting automatic voltage regulation when the recording times exceed a set threshold value, calculating the ITH value of the laser (3) again, comparing the ITH value with an ITH initial value, and evaluating the ageing condition of the laser (3) by dividing the absolute value of the difference value of the ITH value and the ITH initial value by the percentage of the ITH initial value.
10. The method for controlling the high-speed optical emission system integrating single-ended soldering FPC and driving according to claim 9, wherein in said step S1, determining the threshold current ITH of the laser (3) comprises the steps of:
step S11: the built-in driver (4) directly supplies power to the laser (3) and the photo detector MPD;
step S12: by adjusting the VMOD values of the voltages at the two ends of the laser (3), one VMOD value is adjusted every 0.1 within the range of VMOD=0.7V-2.5V, and different VMOD values correspond to different IDD values;
step S13: different IDD values correspond to different luminous power of the laser (3), when the current of the laser (3) exceeds a threshold value, the current is fed back to the built-in driver (4), and the power supply of the laser (3) is closed;
step S14: different current IDD values correspond to different current IMPD values of the photodetector MPD, and the IDD values and the IMPD values are in a linear relationship, idd=a—impd+ith, where a is a slope; and controlling the VMOD change to obtain different IDD values and different IMPD values, and further obtaining the threshold current ITH of the laser (3) through a simulation curve.
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