CN113625399B

CN113625399B - Optical module

Info

Publication number: CN113625399B
Application number: CN202010382332.6A
Authority: CN
Inventors: 李丹; 付孟博; 谢一帆; 傅钦豪
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2024-04-05
Anticipated expiration: 2040-05-08
Also published as: CN113625399A; WO2021223448A1

Abstract

In the optical module that this application provided, including the optical emission submodule piece cavity in the optical emission submodule piece, make things convenient for the setting of luminous chip and lens, set up the through-hole on the lateral wall of optical emission submodule piece cavity. One end of the optical fiber adapter stretches into the through hole, the other end of the optical fiber adapter is connected with the optical fiber socket through the optical fiber, and then the through hole facilitates connection of the cavity of the optical emission sub-module and the optical fiber adapter, and then facilitates signal light output by the optical emission sub-module to be coupled into the first optical fiber, and then the signal light is transmitted to the optical module through the first optical fiber socket to be connected with an external optical fiber. The side wall of the cavity of the light emission sub-module is provided with a through hole, the connection mode of the optical fiber adapter and the optical fiber, and the combination mode of the optical fiber adapter and the through hole, so that the distance can be adapted through the movement of the optical fiber adapter in the through hole. The through hole is inclined to the top surface of the cavity of the light emission sub-module, so that the axial direction of the through hole is not parallel to the optical axis direction of the signal light before being transmitted to the optical fiber adapter, and the signal light output by the light emission sub-module is efficiently coupled into the first optical fiber.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

In the new business and application modes of cloud computing, mobile internet, video, etc., the optical communication technology can be used. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, is one of key devices in optical communication equipment, and the intensity of an optical signal input into an external optical fiber by the optical module directly influences the quality of optical fiber communication.

The light emitting part of the light module is packaged in micro-optics mode, namely, the light emitted by the light chip enters the air, devices such as a lens, an optical fiber adapter and the like are arranged on the optical path, the light emitted by the light chip is coupled into the optical fiber adapter after passing through the lens, and the optical fiber adapter is connected with an optical fiber. The efficiency of coupling light from the optical chip into the optical fiber affects the optical power of the optical signal, and the transmission loss of light in the optical fiber also affects the optical power of the optical signal.

Disclosure of Invention

The embodiment of the application provides an optical module, which reduces the loss of light in the optical module and improves the light output of the optical module.

The application provides an optical module, include:

the light emission sub-module is used for outputting signal light;

the first optical fiber is used for transmitting the signal light output by the light emission sub-module;

the optical fiber adapter is connected with the light emission sub-module at one end and connected with one end of the first optical fiber at the other end, and is used for coupling the signal light output by the light emission sub-module to the first optical fiber;

One end of the first optical fiber socket is connected with the other end of the first optical fiber and is used for connecting the optical module with an external optical fiber;

the light emission sub-module includes:

the optical fiber adapter comprises a light emitting sub-module cavity, wherein a through hole is formed in the side wall of the light emitting sub-module cavity and is used for being inserted into one end of the optical fiber adapter;

the light-emitting chip is arranged in the cavity of the light-emitting sub-module and is used for generating signal light;

the lens is arranged in the light emission sub-module cavity and on the transmission light path of the signal light and is used for converging the signal light to the optical fiber coupler;

the through hole is inclined to the top surface of the cavity of the light emitting sub-module, so that the axial direction of the through hole is not parallel to the optical axis direction of the lens.

In the optical module that this application provided, including the optical emission submodule piece cavity in the optical emission submodule piece, not only make things convenient for the setting of luminous chip and lens, set up the through-hole on the lateral wall of optical emission submodule piece cavity simultaneously. One end of the optical fiber adapter stretches into the through hole, the other end of the optical fiber adapter is connected with the optical fiber socket through the optical fiber, and then the through hole facilitates connection of the cavity of the optical emission sub-module and the optical fiber adapter, and then facilitates signal light output by the optical emission sub-module to be coupled into the first optical fiber, and then the signal light is transmitted to the optical module through the first optical fiber socket to be connected with an external optical fiber.

Meanwhile, because the size of the optical fiber is difficult to accurately match in mass production, the problem that the optical fiber between the light emission sub-module and the optical fiber socket is extremely easy to be overlong or too short is caused, and in the optical module provided by the application, the optical fiber adapter can move in the through hole in the assembly process, and then can move back and forth in the through hole through the optical fiber adapter, so that the distance between the light emission sub-module and the optical fiber socket can be adapted. The side wall of the cavity of the light emission sub-module is provided with a through hole, the connection mode of the optical fiber adapter and the optical fiber, and the combination mode of the optical fiber adapter and the through hole, so that the distance can be adapted through the movement of the optical fiber adapter in the through hole.

In addition, the through hole is inclined to the top surface of the cavity of the light emission sub-module, so that the axial direction of the through hole is not parallel to the optical axis direction of the signal light before being transmitted to the optical fiber adapter, and the optical axis of the signal light coupled to the first optical fiber through the optical fiber adapter is parallel or nearly parallel to the axial direction of the first optical fiber, and the signal light output by the light emission sub-module is efficiently coupled into the first optical fiber.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;

fig. 2 is a schematic diagram of an optical network unit structure;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a cross-sectional view of an optical module structure according to an embodiment of the present application;

fig. 6 is a schematic diagram of an assembly structure of a light emission sub-module and a fiber socket according to an embodiment of the present disclosure;

FIG. 7 is an exploded view of a light emitting sub-module according to an embodiment of the present application;

FIG. 8 is a schematic diagram illustrating an assembly cross-section of a light emitting sub-module and a fiber optic adapter according to an embodiment of the present application;

fig. 9 is a schematic diagram of an exploded structure of a back-illuminated photoelectric conversion device according to an embodiment of the present disclosure;

FIG. 10 is an exploded schematic illustration of a light emitting sub-module and a fiber optic adapter according to an embodiment of the present application;

FIG. 11 is a second exploded view of a light emitting sub-module and a fiber optic adapter according to an embodiment of the present disclosure;

FIG. 12 is an exploded cross-sectional schematic view of a fiber optic adapter according to an embodiment of the present application;

FIG. 13 is a schematic view of a partial assembly cross-section of a light emitting sub-module and fiber optic adapter provided in an embodiment of the present application;

Fig. 14A is a schematic view of an optical path structure of a light emitting sub-module according to the prior art;

FIG. 14B is a simulation diagram of the coupling efficiency of the optical path structure of FIG. 14A;

FIG. 15A is a schematic view of an optical path structure of a light emitting sub-module according to the prior art;

FIG. 15B is a simulation diagram of the coupling efficiency of the optical path structure of FIG. 15A;

FIG. 15C is a simulation graph of coupling efficiency of an optical axis through the center of a focusing lens into a tilted fiber ferrule;

fig. 16A is a schematic view of an optical path structure of a light emitting sub-module according to an embodiment of the present application;

FIG. 16B is a simulation diagram of the coupling efficiency of the optical path structure of FIG. 16A.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

One of the key links of optical communication is the mutual conversion of optical and electrical signals. The optical communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, etc., and can realize the low-cost and low-loss information transmission by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.

The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network unit 100 with the optical module 200.

The optical port of the optical module 200 is connected to the optical fiber 101, and a bidirectional optical signal connection is established with the optical fiber. The electrical port of the optical module 200 is connected to the optical network unit 100, and a bidirectional electrical signal connection is established with the optical network unit. The optical module enables the interconversion of optical signals and electrical signals, thereby enabling the establishment of a connection between the optical fiber 101 and the optical network unit 100.

Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber 101. The optical module 200 is a tool for realizing photoelectric signal conversion, and does not have a function of processing data, and in the photoelectric conversion process, the carrier of information is converted between light and electricity, but the information itself is not changed.

The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing a bi-directional electrical signal connection with the optical module 200. The optical network unit is provided with a network cable interface 104 which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; a connection is established between the optical module 200 and the network cable 103 via an optical network unit. Specifically, the optical network unit transmits a signal from the optical module to the network cable, transmits the signal from the network cable to the optical module, and monitors the operation of the optical module as an upper computer of the optical module.

So far, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber 101, the optical module 200, the optical network unit 100 and the network cable 103 in sequence.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal OLT and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, there is a circuit board 105 in the optical network unit 100, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector connected with the circuit board 105 is arranged in the cage 106 and used for accessing an electrical port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as fins that increase a heat dissipation area.

The optical module 200 is inserted into the optical network unit 100, in particular an electrical connector in the cage 106, the optical port of the optical module being connected to the optical fiber 101.

The cage 106 is located on the circuit board 105 of the optical network unit 100, and wraps the electrical connectors on the circuit board 105 in the cage; the optical module is inserted into the cage, the optical module is fixed by the cage, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the radiator 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module provided in the embodiment of the present application, and fig. 4 is an exploded schematic structural diagram of an optical module provided in the embodiment of the present application, as shown in fig. 3 and fig. 4, an optical module 200 provided in the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, an optical emission sub-module 400, an optical receiving sub-module 500, and an optical fiber receptacle 502.

The upper shell 201 and the lower shell 202 form a package cavity with two ports, specifically, two ports (204, 205) in the same direction or two ports in different directions; one of the ports is an electrical port 204, which is used for being inserted into an upper computer such as an optical network unit; the other port is an optical port 205 for connecting the external optical fiber 101; the circuit board 300, the light emitting sub-module 400, the light receiving sub-module 500, and other optoelectronic devices are located in a package cavity formed by the upper and lower housings.

The upper shell and the lower shell are generally made of metal materials, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that upper casing and lower casing combine is adopted, is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module into an organic whole structure, and when devices such as circuit board are assembled like this, positioning part, heat dissipation and electromagnetic shield structure are inconvenient for the installation, are unfavorable for production automation.

The unlocking handle 203 is positioned on the outer wall of the wrapping cavity/lower shell 202, and the tail end of the unlocking handle can be pulled to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the unlocking handle 203 is used for clamping the cage 106, so that the optical module is fixed in the upper computer; the unlocking handle is pulled to release the engagement between the optical module 200 and the cage 106, so that the optical module can be pulled out from the host computer.

The circuit board 300 is disposed in a package cavity formed by the upper and the housing, and the circuit board 300 is electrically connected with the light emitting sub-module 400 and the light receiving sub-module 500, and is provided with electrical devices such as a chip, a capacitor, and a resistor. Corresponding chips are selected according to the requirements of products, and common chips comprise a microprocessor MCU, a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip and the like. Wherein the transimpedance amplifier is closely related TO the optical detection chip, and part of the product can encapsulate the transimpedance amplifier and the optical detection chip together, such as in the same TO tube shell or the same shell; the optical detection chip and the transimpedance amplifier can be separated and packaged, and the transimpedance amplifier is arranged on the circuit board.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driving chip and an MCU chip are integrated into one chip, or a laser driving chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is a circuit integration, but the functions of the circuits are not lost due to aggregation, only the circuit shows a change in morphology, and the chip still has the circuit morphology. Therefore, when the circuit board is provided with three independent chips of the MCU, the laser driving chip and the limiting amplifier chip, the scheme is equivalent to that of the circuit board 300 provided with a single chip with three functions.

The surface of the end part of the circuit board 300 is provided with a golden finger, the golden finger consists of a pin which is mutually independent, the circuit board is inserted into an electric connector in a cage, and the golden finger is connected with a clamping elastic piece in the electric connector in a conducting way; the golden fingers can be arranged on one side surface of the circuit board only, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large pin quantity requirement; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.

The optical module further includes a light emitting sub-module and a light receiving sub-module, which may be collectively referred to as an optical sub-module. As shown in fig. 4, the optical module provided in the embodiment of the present invention includes an optical transmitting sub-module 400 and an optical receiving sub-module 500, where the optical transmitting sub-module 400 is located at an edge of the circuit board 300, and the optical transmitting sub-module 400 and the optical receiving sub-module 500 are staggered on a surface of the circuit board 300, so as to facilitate realization of a better electromagnetic shielding effect.

The light emitting sub-module 400 is disposed on the surface of the circuit board 300, and in another common packaging manner, the light emitting sub-module is physically separated from the circuit board, and is electrically connected through a flexible board. In the present embodiment, the light emitting sub-module 400 is connected to the first fiber receptacle 502 through the first optical fiber 501.

As shown in fig. 4, the circuit board 300 is provided with a notch 301 for placing the light emitting sub-module; the notch 301 may be disposed in the middle of the circuit board or may be disposed at an edge of the circuit board; the light emission sub-module is arranged in the notch 301 of the circuit board in an embedded manner, so that the circuit board can extend into the light emission sub-module, and the light emission sub-module and the circuit board can be fixed together. Alternatively, the light emitting sub-module 400 may be fixedly supported by the lower case 202.

The light receiving sub-module 500 is disposed on the surface of the circuit board 300, and in another common packaging manner, the light receiving sub-module is physically separated from the circuit board, and is electrically connected through a flexible board. In the embodiment of the present application, the light receiving sub-module 500 is connected to the second fiber socket 504 through the second optical fiber 503. The signal light outside the optical module is transmitted to the second optical fiber receptacle 504 through the external optical fiber, is transmitted to the second optical fiber 503, and is then transmitted to the light receiving sub-module 500 through the second optical fiber 503, and the receiving sub-module 500 converts the received signal light into a current signal.

Further, the light receiving sub-module 500 includes an optical device and a photoelectric conversion device. Among them are optical devices such as fiber adapters, arrayed waveguide gratings, lenses, etc. The second optical fiber 503 transmits the signal light to the optical device, then converts the signal light beam transmission path of the optical device, and finally transmits the signal light beam to the photoelectric conversion device.

Fig. 5 is a cross-sectional view of an optical module structure according to an embodiment of the present application. As shown in fig. 5, the optical module provided in the embodiment of the present invention includes a lower case 202, a circuit board 300, a light emitting sub-module 400, and a light receiving sub-module 500. The light emitting sub-module 400 and the light receiving sub-module 500 are located on the circuit board 300.

The first fiber optic receptacle 502 is connected to the light emitting sub-module 400 by a first optical fiber 501 and the second fiber optic receptacle 504 is connected to the light receiving sub-module 500 by a second optical fiber 503. The following description will take an example in which the first fiber receptacle 502 is connected to the light emitting sub-module 400 through the first optical fiber 501.

The lower housing 202 is used for carrying a circuit board 300 and a second fiber optic receptacle 502, and the circuit board 300 carries the light emitting sub-module 400. Alternatively, the lower case 202 has a card slot 206, and a gap 206a is provided in the card slot 206, and the card slot 206 may be formed by upwardly protruding the surface of the lower case.

The first fiber optic receptacle 502 includes a body 502a and a protrusion 502b, the protrusion 502b being located on a surface of the body 502a, the protrusion protruding relative to the body. The first fiber optic receptacle 502 is assembled and secured to the card slot 206 on the lower housing 202. Specifically, the fiber optic receptacle is secured to the lower housing by placing the protrusion 502b in the gap 206a of the card slot 206. Further, the structure and fixing manner of the second fiber optic receptacle 504 can be referred to as the first fiber optic receptacle 502.

The clamping groove 206 divides the lower housing into two areas, the circuit board 300 is arranged in one of the areas, and a convex column is formed on the surface of the lower housing in the area to fix the circuit board 300; the light emitting sub-module 400 is fixed with the circuit board 300, and the light emitting sub-module is fixed on the lower case by fixing the circuit board 300. Of course, the light emitting sub-module may be directly fixed to the lower case without being indirectly fixed through the circuit board 300.

The fiber optic receptacle is disposed in another one of the regions into which an external fiber optic plug extends to interface with the fiber optic receptacle. Accordingly, the circuit board 300 and the fiber optic receptacle are fixed to the lower housing, that is, the positions of the light emitting sub-module 400 and the fiber optic receptacle 502 are relatively fixed, and thus the optical fibers 501a connecting the light emitting sub-module and the fiber optic receptacle need to have a specific size.

Fig. 6 is a schematic diagram of an assembly structure of a light emitting sub-module and a fiber socket according to an embodiment of the present application. As shown in fig. 6, the light emitting sub-module 400 is connected to the first fiber receptacle 502 through the fiber optic adapter 600 and the first optical fiber 501 in sequence. The first optical fiber 501 has one end connected to the fiber optic adapter 600 and the other end connected to the first fiber optic receptacle 502.

The optical fiber adapter 600 is used for being inserted into the light emitting sub-module to receive the light converged by the optical lens; the first optical fiber socket 502 is connected with the first optical fiber 501 and an optical fiber plug outside the optical module respectively, and is used for realizing optical connection between the inside of the optical module and the outside of the optical module, so that light forming the light emission sub-module is accessed into the optical fiber through the optical fiber adapter, is transmitted to the first optical fiber socket 502 through the optical fiber, and is transmitted to the outside of the optical module through the first optical fiber socket 502.

Fig. 7 is an exploded view of a light emitting sub-module according to an embodiment of the present application. As shown in fig. 7, a laser component 404 is disposed in the light emitting sub-module provided in the embodiment of the present application, and the laser component 404 includes a laser chip 404a, a collimator lens 404b, a metallized ceramic 404c, and a semiconductor refrigerator 404d. The common light emitting chip of the optical module is a laser chip, the laser chip 404a is arranged on the surface of the metallized ceramic 404c, and a circuit pattern is formed on the surface of the metallized ceramic 404c, so that power can be supplied to the laser chip; meanwhile, the metallized ceramic 404C has better heat conduction performance and can be used as a heat sink of the laser chip 404a for heat dissipation. The laser becomes a preferred light source for optical module and even optical fiber transmission with better single wavelength characteristic and better wavelength tuning characteristic; other types of light, such as LED light, are not generally adopted in a common optical communication system, and even if such a light source is adopted in a special optical communication system, the characteristics and the chip structure of the light source are greatly different from those of the laser, so that the optical module adopting the laser is greatly different from those adopting other light sources in technology, and those skilled in the art generally cannot consider that the two types of optical modules can mutually give technical advices.

The optical lens is used for converging light, and the light emitted from the light emitting chip is in a divergent state, so that the light needs to be converged for facilitating subsequent light path design and light coupling into the optical fiber. The common convergence is to converge divergent light into parallel light and converge divergent light and parallel light into converged light. Fig. 7 shows a collimator lens 404b and a focusing lens 407, wherein the collimator lens 404b is disposed on the light-emitting path of the laser chip to collect the divergent light of the laser chip into parallel light; the focusing lens 407 is disposed on a side close to the optical fiber adapter 600, and condenses the parallel light into the optical fiber adapter 600.

Depending on the transmission design and the characteristics of the laser chip, a semiconductor cooler TEC404d may also be included in the light emitting sub-module. TEC404d is directly or indirectly arranged on the bottom surface of the cavity of the light emitting sub-module, metallized ceramic is arranged on the surface of TEC404d, and TEC404d is used for balancing heat to maintain the set working temperature of the laser chip.

The light emitting sub-module has a packaging structure for packaging laser chips and the like, and the existing packaging structure comprises a coaxial packaging TO-CAN, a silicon light packaging, a chip-on-board LENS assembly packaging COB-LENS and a micro-optical XMD packaging. The package is also divided into airtight package and non-airtight package, wherein the package provides stable and reliable working environment for the laser chip on one hand, and forms external electric connection and light output on the other hand.

Depending on the product design and process, the light module may be packaged differently to make a light emitting sub-module. The laser chip has vertical cavity surface for emitting light and side for emitting light, and the different light emitting directions of the laser chip can influence the selection of packaging forms. The various packages have obvious technical differences, and the technical directions of the structures and the processes are different, so those skilled in the art know that although the purposes of realizing different packages have certain same points, the different packages belong to different technical routes, and the technical directions of the different packaging technologies cannot be mutually given.

As shown in fig. 6 and 7, the light emitting sub-module 400 provided in this embodiment of the present application further includes a cover 401 and a light emitting sub-module cavity (hereinafter referred to as cavity) 402, the cavity 402 is covered by the cover 401 from above, one side wall of the cavity 402 has an opening 403 for inserting the circuit board 300, and the circuit board 300 is fixed with the lower housing of the light module. A laser component 404 is disposed in the cavity 402, and the circuit board 300 extending into the cavity is electrically connected with the laser component 404, and the laser component has components such as a laser chip and a collimating lens, so as to form collimated light for emitting. The cavity 402 is provided with an optical multiplexing device 405, and the optical multiplexing device 405 receives a plurality of light beams from the laser device 404, and combines the light beams into one light beam, wherein the one light beam comprises light beams with different wavelengths. The other side wall of the cavity 402 has a through hole 406, and a beam of light combined by the light multiplexing component 405 is injected into the through hole 406. A focusing lens 407 may also be provided between the through hole 406 and the light multiplexing component 405, through which the light is collected for subsequent coupling of light. The fiber optic adapter 600 extends into the through hole 406 to couple light from the optical multiplexing component, the fiber optic adapter tail is connected to the first fiber optic receptacle 502 by the first optical fiber 501, and light received by the fiber optic adapter 600 is transmitted to the first fiber optic receptacle 502 via the first optical fiber 501.

Specifically, 4 metallized ceramics 404c, 4 laser chips 404a, and 4 collimating lenses 404b are shown in fig. 7. The 4 laser chips emit light with 4 different wavelengths, the data transmission capacity is improved by increasing the number of light paths, and the collimating lens 404b is positioned in the light emitting direction of the laser chips and is used for converging divergent light emitted by the laser chips into 4 paths of parallel light, and the light multiplexing component combines the 4 paths of parallel light into 1 path of light.

Fig. 8 is an assembly schematic cross-sectional view of a light emitting sub-module and an optical fiber adapter provided in an embodiment of the present application, and fig. 9 is an assembly schematic exploded cross-sectional view of a light emitting sub-module and an optical fiber adapter provided in an embodiment of the present application. As shown in fig. 8 and 9, in the space surrounded by the cover plate 401 and the cavity 402 of the light emitting sub-module 400, there are a laser component 404, a light multiplexing component 405, a focusing lens 407 and a through hole 406, and the optical fiber adapter 600 is inserted into the through hole 406 to fix the light emitting sub-module 400; during assembly, fiber optic adapter 600 may be moved within throughbore 406 to select a securing position.

The first optical fiber 501 is located between the optical emission sub-module 400 and the optical fiber receptacle 502, and the distance between the optical emission sub-module and the optical fiber receptacle is relatively fixed, so that the optical fiber has a size that meets the distance requirements of the optical emission sub-module and the optical fiber receptacle, and considering the existence of a process error, in practice, the optical fiber has a problem of too short or too long size. The optical fiber is too short to realize connection; the optical fiber is bent when being too long, and the bent optical fiber is unfavorable for the propagation of optical signals.

Through holes 406 are formed in the side wall of the cavity 402, the optical fiber adapter stretches into the through holes 406 to be fixed with the cavity 402, the optical fiber adapter 600 can move back and forth in the through holes 406 through the design of the assembling structure, the required size of the optical fiber between the light emitting sub-module and the optical fiber plug can be adjusted, and when the optical fiber is short, the optical fiber adapter can move backwards (towards the outer direction of the cavity) in the through holes so as to meet the requirement of the connecting size; when the optical fiber is long, the optical fiber adapter can be moved forward (toward the inside of the cavity) in the through hole to straighten the optical fiber and avoid bending the optical fiber.

Optionally, in the embodiment of the present application, an end of the through hole 406 near the interior of the cavity 402 is provided with a step with the bottom of the cavity 402. When the optical fiber adapter 600 is assembled into the through hole 406, the end surface of the optical fiber adapter 600 extending into the through hole 406 abuts against the step, and the fixing of the assembling position of the optical fiber adapter 600 is realized through the step, so that the optical coupling efficiency in the optical fiber adapter 600 is ensured by utilizing the machining precision.

When the fixation of the optical fiber adapter and the cavity is completed, the optical fiber adapter is fixed in the through hole and cannot move, but the through hole and the optical fiber adapter can adjust the bending degree of the optical fiber in the assembly process, so that the problem that the optical fiber is too short or too long is avoided.

As shown in fig. 8 and 9, the light emitted from the laser chip in the laser component 404 is converged into parallel light by the collimator lens 404b and then is injected into the light multiplexing component 405, and after being combined into one beam by the light multiplexing component 405, the light is injected into the optical fiber adapter by the focusing lens 407; the optical fiber adapter 600 includes an isolator 602 and an optical fiber ferrule 603, and light is refracted at the optical fiber ferrule 603, so that the original propagation direction is changed.

Although the light is converged through the focusing lens 407, the optical axis direction is not changed before and after the convergence, namely the light is injected along the center of the focusing lens, the injection direction can ensure that the converged light has the mode spot distribution before the convergence to the greatest extent, and regular circular light spots are presented, so that the efficiency is improved in the subsequent coupling process; the light is incident along the center of the focusing lens, specifically, the light is converged through the center of the focusing lens, and in an ideal state, the center of the light beam passes through the center of the focusing lens; the refraction generated on the light incident surface of the optical fiber core changes the direction of the optical axis.

In this embodiment, as shown in fig. 8 and 9, the through hole 406 is inclined to the plane of the cover plate 401, that is, the axis of the through hole 406 is inclined to the plane of the cover plate 401, and the axis direction of the through hole 406 is not parallel to the optical axis direction of the lens, so that the optical axis direction before the light enters the isolator 602 is not parallel to the axis direction of the through hole 406, and further, the optical axis direction before the light enters the isolator 602 is not parallel to the axis direction of the optical fiber ferrule 603. The light is refracted at the light incident surface of the optical fiber ferrule 603, so that the original propagation direction is changed, and the changed propagation direction of the optical axis is parallel to (ideally coincides with) the axial direction of the optical fiber in the optical fiber ferrule. In this embodiment of the present application, through the inclination of the through hole 406, the control of the included angle between the optical axis direction before the light enters the isolator 602 and the axial direction of the optical fiber ferrule 603 is realized, the difficulty of controlling the included angle between the optical axis direction before the light enters the isolator 602 and the axial direction of the optical fiber ferrule 603 is reduced, and the production difficulty is reduced.

Alternatively, the through hole 406 is inclined at an inclination angle of 2 ° to 7 °, such as 3 °, or the like, to the plane of the cover plate 401.

In addition, the optical fiber is soft and is not easy to carry out high-precision position fixing with the light emitting sub-module, so that the optical fiber insert core is designed. The optical fiber core insert is formed by wrapping the optical fiber with a harder material capable of realizing high-precision processing, and fixing the optical fiber is realized by fixing the material. Specifically, the optical fiber core insert can be formed by wrapping an optical fiber with a ceramic material, the optical fiber is used for transmitting light, the ceramic has higher processing precision, high-precision position alignment can be realized, the optical fiber core insert is formed by combining the optical fiber and the ceramic, and the optical fiber is fixed by fixing the ceramic. The ceramic material limits the fixing direction of the optical fiber in the optical fiber inserting core, the ceramic is generally processed into a cylinder, a linear through hole is arranged in the center of the ceramic cylinder, and the optical fiber is inserted into the through hole of the ceramic cylinder to realize fixing, so that the optical fiber is straightly fixed in the ceramic body. In the optical fiber ferrule, the axial direction of the optical fiber is parallel to the axial direction of the optical fiber ferrule.

Fig. 10 is a first exploded schematic view of a light emitting sub-module and an optical fiber adapter according to an embodiment of the present application, and fig. 11 is a second exploded schematic view of a light emitting sub-module and an optical fiber adapter according to an embodiment of the present application. As shown in fig. 10 and 11, the optical fiber adapter 600 provided in the embodiment of the present application includes a tube shell 601, an isolator 602, and an optical fiber ferrule 603. The package 601, the isolator 602, and the fiber stub 603 are all cylindrical structures, and the through hole 106 is a cylindrical through hole.

The isolator 602 and the fiber ferrule 603 are provided in the package 601, respectively, and the fiber ferrule 603 is connected to the optical fiber 501 a. The secure fit of the cartridge 601 with the through hole 406 effects the securement of the fiber optic adapter 600 with the cavity 402. The tube housing 601 is used for fixing the isolator 602 and the optical fiber ferrule 603, and facilitates the installation of the isolator 602 and the optical fiber ferrule 603. The isolator 602 allows light to pass in one direction and is blocked in the opposite direction to prevent reflected light from returning into the laser chip. Of course, the cutoff capability of the isolator 602 does not allow all light to be blocked.

In order to facilitate the fixation of the isolator and the optical fiber lock pin, a baffle is arranged in the tube shell and used for limiting the isolator and the optical fiber lock pin. Fig. 12 is an exploded cross-sectional view of a fiber optic adapter according to an embodiment of the present application. As shown in fig. 12, a baffle 605a is provided in the envelope 601 to divide the space of the envelope 601 into a first cavity 604 and a second cavity 605. The isolator 602 is arranged in the first cavity 604, the optical fiber inserting core 603 is arranged in the second cavity 605, the baffle 605a is positioned between the isolator 602 and the optical fiber inserting core 603, and the moving process of the optical fiber inserting core 603 extending into the second cavity 605 is blocked by the baffle, so that the position of the optical fiber inserting core 603 is limited; the isolator 602 is placed in the first cavity and may be positioned with reference to the baffle. The baffle 605a plays a role in separating and fixing the isolator 602 and the optical fiber ferrule 603.

Or, set up the hole that is used for installing isolator and optic fibre lock pin in the tube shell for the aperture size of the hole of installing isolator and optic fibre lock pin is different, and then is convenient for spacing of isolator and optic fibre lock pin when installing isolator and optic fibre lock pin, guarantees the installation accuracy of isolator and optic fibre lock pin.

Alternatively, in the embodiment of the present application, the axial direction of the isolator 602 is parallel to the axial direction of the fiber stub 603, e.g., the axial direction of the isolator 602 coincides with the axial direction of the fiber stub 603. Specifically, the axial direction of the isolator 602 and the axial direction of the fiber stub 603 may be achieved by the axial direction of the first cavity 604 coinciding with the axial direction of the second cavity 605.

Fig. 13 is a schematic view of a partial assembly cross section of a light emitting sub-module and a fiber optic adapter according to an embodiment of the present application. As shown in fig. 13, in the embodiment of the present application, the through hole 406 is inclined in a direction away from the bottom end of the cavity 402, and thus the axial direction C of the through hole 406 intersects with the optical axis direction D before the light enters the isolator 602. As shown in fig. 13, the axial direction C of the through hole 406 is parallel to (desirably, coincides with) the axial direction B of the optical fiber ferrule 603, and the optical axis direction D before the light enters the isolator 602 intersects with the axial direction B of the optical fiber ferrule 603.

Light is injected into the optical fiber of the optical fiber lock pin through air, refraction does not occur when the light is perpendicularly injected into the optical fiber end face of the optical fiber lock pin, the angular relationship between the light emitting direction of the laser chip and the optical fiber lock pin is easy to control by adopting the mode, but the reflected light returns along an original light path after the perpendicular incidence, and the returned light returns into the laser chip to influence the light emitting of the laser chip.

In order to prevent reflected light from returning along an original light path, the light is not vertically incident to the end face of the optical fiber in the light path design; in order to realize the non-normal incidence of light to the end face of the optical fiber, the light incident surface of the optical fiber ferrule is ground into an inclined surface. Specifically, as shown in fig. 13, the optical fiber is wrapped in ceramic to form an optical fiber ferrule 603, the end face of the optical fiber ferrule 603 is ground into an inclined face, and the end face of the optical fiber in the optical fiber ferrule 603 forms an inclined face 603a. The inclined surface 603a is inclined toward the bottom surface of the cavity 402 by an angle of 6 ° to 15 °, such as 7 °. Light transmitted to the end face of the optical fiber insert 603 is refracted through the inclined plane 603a and enters the optical fiber insert 603, and then the inclined plane 603a and the inclined through hole 406 are combined to achieve that the optical axis direction of signal light refracted into the optical fiber insert 603 is parallel or nearly parallel to the axial direction of the optical fiber insert 603, and finally high-efficiency coupling of signal light output by the light emission sub-module into the first optical fiber is achieved.

Further, in the embodiment of the application, the optical fiber ferrule is formed by wrapping the optical fiber by a ceramic cylinder, the axial direction of the optical fiber ferrule is the same as the axial direction of the optical fiber, and the light incident surface of the optical fiber ferrule is ground into an inclined surface, namely the light incident surface of the optical fiber is ground into the same inclined surface; the optical fiber is composed of a core layer and a cladding layer with different refractive indexes, and light is totally reflected at the interface of the core layer and the cladding layer, so that the light is restrained from being transmitted in the core layer.

Total reflection occurs on the premise of having a sufficiently large incident angle. Therefore, light is totally reflected in the optical fiber, and after the light is refracted at the light incident surface of the optical fiber, the refraction angle is small enough to satisfy that the light has a large enough incident angle when being reflected in the optical fiber again. And a refraction angle small enough is formed after refraction, and an incident angle small enough is formed when refraction is needed; in order to achieve a better coupling efficiency, the optical axis of the optical fiber after entering the optical fiber is required to be parallel to the optical fiber axis, and the light beam entering the optical fiber is required to be symmetrical in central axis. Thus, the light incident on the light incident surface of the optical fiber has a specific incident angle range.

The light emitted by the laser chip is centered on the optical axis, and the light entering the optical fiber is also centered on the optical axis, and is illustrated by taking three typical light rays as examples, and the light rays at the optical axis are illustrated schematically.

Fig. 14A is a schematic diagram of an optical path structure of a light emitting sub-module according to the prior art, and fig. 14B is a simulation diagram of coupling efficiency of the optical path structure in fig. 14A. As shown in fig. 14A, the laser chip 404A, the collimator lens 404b, and the focusing lens 407 are respectively located in the light emitting sub-module cavity 402. The axis direction of the optical fiber lock pin is parallel to the light-emitting optical axis direction of the laser chip, the axis direction A of the optical fiber adapter is parallel to the axis direction of the optical fiber lock pin, and the axis direction of the optical fiber lock pin is parallel to the axis direction of the optical fiber in the optical fiber lock pin (overlapped in ideal state). The divergent light emitted by the laser chip is converged into parallel light by the collimating lens, and the parallel light is converged by the center of the focusing lens and then enters the light incident surface of the optical fiber ferrule 603. The light after the two times of convergence keeps the original optical axis direction, the light spot shape is unchanged, and the light spot is a circular light spot in an ideal state. The converged light meets the angle requirement of total reflection of the optical fiber, and the optical axis of the converged light is perpendicular to the light incident surface of the optical fiber. As shown in fig. 14B, the light is converged by the center of the focusing lens 407, the converged light is coupled into the optical fiber ferrule 603, most of the light is transmitted through the optical fiber at the center of the optical fiber ferrule, less light is distributed around the optical fiber, and the optical path structure of fig. 14A achieves higher coupling efficiency.

The optical axis is perpendicular to the light incident surface, and refraction occurs at this time with a minimum incident angle (0 °) and a minimum refraction angle. The optical path design adopted in fig. 14A can meet the angle requirement of total reflection of the optical fiber, and the light spot shape is favorable for optical coupling, but the reflected light generated on the light incident surface of the optical fiber returns along the original optical path, thereby affecting the light output of the laser chip.

The optical path design of fig. 14A and 14B has the advantages that the center of the focusing lens is adopted for optical path convergence, so that a better spot mode can be maintained, and the disadvantage is that reflected light generated by the light incident surface of the optical fiber can return to the laser chip along the original optical path.

Fig. 15A is a schematic view of an optical path structure of a light emitting sub-module provided in the prior art, and fig. 15B is a simulation diagram of coupling efficiency of the optical path structure in fig. 15A. The inclined directions of the inclined planes of the optical fiber lock pins are different only in view angles, the optical fiber lock pins are cylinders, and the inclined directions of the inclined planes are different in rotation view angles. As shown in fig. 15A, the laser chip 404a, the collimator lens 404b, and the focusing lens 407 are respectively located in the cavity 402 of the optical emission sub-module, the axis direction of the fiber ferrule (the axis of the optical fiber) is parallel to the light-emitting optical axis direction of the laser chip, the axis direction a of the fiber adapter is parallel to the axis direction of the fiber ferrule 603, and the axis direction of the fiber ferrule is parallel to the axis direction of the optical fiber in the fiber ferrule (which is desirably coincident). The divergent light emitted by the laser chip is converged into parallel light by the collimating lens, and the parallel light is converged by the focusing lens and then enters the light incident surface of the optical fiber ferrule 603. In order to prevent the reflected light from being reflected back to the laser chip, the light entrance surface of the optical fiber ferrule 603 is an inclined surface. In order to make the light entering the optical fiber meet the condition of total reflection by utilizing the refraction principle, the light enters the non-center position of the focusing lens 407, the light is converged by the non-center of the focusing lens 407, and the light enters the light incident inclined plane of the optical fiber after the optical axis direction of the light is changed by the focusing lens 407; light refraction occurs at the light entrance slope to enter the optical fiber.

As shown in fig. 15A, the light incident surface of the optical fiber is inclined, and the axial direction of the optical fiber in the optical fiber stub is not changed, so that the propagation direction of the converged light cannot be maintained as shown in fig. 14A, in order to satisfy the condition of total reflection of the refracted light. Specifically, if the optical axis is kept in the direction in fig. 14A and is parallel to the light-emitting optical axis direction of the laser chip, the incident light enters the light-entering surface of the light beam in a non-perpendicular direction, the incident angle is reduced, and the refraction angle is also reduced, which is unfavorable for total reflection. In order to increase the incident angle, the optical axis direction in fig. 14A is changed in the scheme of fig. 15A, and the optical axis direction converged by the focusing lens is not parallel to the light-emitting optical axis direction of the laser chip, so as to increase the incident angle at the time of refraction.

As can be seen from the simulation diagram in fig. 15B, the optical axis direction of the light converged by the focusing lens is changed so that the converged light is different from the propagation direction in fig. 14B, and the light is converged at the non-center position of the focusing lens 407. In order to achieve total reflection in the light, the light incident on the light incident surface of the optical fiber has a specific incident angle range, which also defines the light converged by the focusing lens 407, and cannot be converged through the center of the focusing lens 407.

With the optical path design shown in fig. 15A, the optical axis does not pass through the center of the focusing lens 407, the direction of the optical axis is changed after the light passes through the focusing lens, the light spot is greatly deformed, the shape of the light spot is distorted, the mode field distribution of the light spot is irregular, and the coupling efficiency into the optical fiber is obviously reduced.

The optical path design shown in fig. 15A and 15B has the advantage of preventing reflected light generated by the light incident surface of the optical fiber from returning to the laser chip along the original optical path, and has the disadvantage that the optical path is converged without adopting the center of a focusing lens, and the form of the converged light spot pattern is greatly degraded.

FIG. 15C is a simulation of the coupling efficiency of an optical axis through the center of a focusing lens into a tilted fiber stub. As shown in fig. 15C, the light incident surface of the optical fiber ferrule is an inclined surface, and the light emitted by the laser chip 404a is collimated by the collimating lens 404b and then converged by the focusing lens 407 to be injected into the optical fiber adapter 603; the light is converged through the center of the focusing lens 407, the axis direction A of the optical fiber adapter is parallel to the central axis direction A of the focusing lens 407, the axis direction of the optical fiber insert 603 is parallel to the axis direction A of the optical fiber adapter, the central axis direction of the focusing lens is parallel to the axis direction of the optical fiber adapter, and the axis direction of the optical fiber insert is parallel to the axis direction of the optical fiber in the optical fiber insert (the axis direction is overlapped in ideal state); the light is coupled into the optical fiber adapter after refraction, a large amount of light can be seen to be emitted from the optical fiber of the optical fiber adapter, and the coupling efficiency is low.

Fig. 16A is a schematic view of an optical path structure of a light emitting sub-module according to an embodiment of the present application, and fig. 16B is a simulation diagram of coupling efficiency of the optical path structure in fig. 16A. The inclined through hole realizes the inclination of the optical fiber inserting core axis, meanwhile, the inclined direction of the inclined plane of the optical fiber inserting core is only different in view angle, the optical fiber inserting core is a cylinder, and the inclined direction of the inclined plane is different in rotation view angle.

As shown in fig. 16A, the laser chip 404a, the collimator lens 404b and the focusing lens 407 are respectively located in the light emitting sub-module cavity 402; the axial direction of the fiber stub 603 is parallel to the axial direction a of the fiber adapter, and the fiber direction in the fiber stub 603 is parallel to (and ideally coincides with) the axial direction of the fiber stub 603; the axial direction of the light ray inserting core is parallel to the axial direction of the optical fiber adapter/the optical fiber adapter shell; the axial direction of the through hole on the cavity 402 is not parallel to the light-emitting optical axis direction of the laser chip, and the axial direction of the optical fiber adapter/optical fiber adapter shell is parallel to the axial direction of the through hole on the cavity 402, so that the light-emitting optical axis direction of the laser chip is not parallel to the axial direction of the optical fiber adapter/optical fiber adapter shell; the divergent light emitted from the laser chip is converged into parallel light by the collimator lens, and the parallel light is converged by the focusing lens and then enters the inclined plane 603a of the optical fiber ferrule 603.

In order to prevent reflected light from being reflected back to the laser chip reversibly, the light incident surface of the optical fiber is an inclined surface; in order to inject light into the optical fiber by using the refraction principle, the light emitted from the laser chip is emitted through the center of the focusing lens, the original optical axis direction is not changed in the focusing process, and when the light is injected into the inclined plane 603a of the optical fiber ferrule 603, the light is refracted into the optical fiber ferrule 603 through the inclined plane 603a of the optical fiber ferrule 603. The signal light is refracted into the optical fiber ferrule 603 through the inclined surface 603a, and the inclination angle of the inclined surface 603a and the inclination angle of the through hole are controlled in coordination so that the optical axis direction of the signal light refracted into the optical fiber ferrule 603 is parallel or nearly parallel to the axial direction of the optical fiber ferrule 603.

The optical path design provided in fig. 16A is designed to maintain a better spot mode after light is converged, and matches with the light incident slope of the optical fiber ferrule 603, and the optical axis direction of the signal light refracted into the optical fiber ferrule 603 is parallel to the axial direction of the optical fiber ferrule 603, so as to accomplish efficient coupling of light into the optical fiber.

In order to keep a good spot mode after light is converged, the light is converged through the center of the focusing lens 407, the light is emitted through the center of the focusing lens, the direction of the optical axis after focusing is not changed, the light after convergence keeps a spot mode before convergence, and a circular spot mode can be kept under an ideal state, so that the optical coupling efficiency is improved.

In order to prevent the reflected light generated by the light incident surface of the optical fiber from returning to the laser chip along the original light path, the light incident surface of the optical fiber ferrule/the light incident surface of the optical fiber is designed to be an inclined surface, however, the light path structure shown in fig. 14A shows that when the light is converged through the center of the focusing lens, the light incident surface of the optical fiber matched with the light incident surface cannot be an inclined surface, so that the light refracted at the light incident surface can be totally reflected and transmitted; the optical path structure shown in fig. 15A shows that when the light incident surface is an inclined surface, the light matched with the light incident surface cannot be converged through the center of the focusing lens, so that the light refracted at the light incident surface can be transmitted in a total reflection manner.

In order to make the light coupled into the optical fiber totally reflect, the embodiment of the present application provides a new structural design, and by the inclination of the through hole on the cavity 402, the axial direction of the optical fiber ferrule 603 is not parallel to the light emitting direction of the laser chip, and the optical fiber ferrule is inclined at a certain angle relative to the light emitting direction of the laser chip.

After light is refracted into the optical fiber, the light is in a specific angle relation with the axis of the optical fiber, and the angle relation is identical in fig. 14A, 15A and 16A, which is also the necessary requirement that the light is fully emitted in the optical fiber.

As shown in fig. 16B, with the optical path structure of fig. 16A, light is converged through the center of the focusing lens 407, the light incident surface of the optical fiber ferrule is inclined (inclined surface 603 a), and light converged by the focusing lens can be efficiently coupled into the optical fiber, and most of the light enters the optical fiber.

In fig. 15A and 16A, the optical fiber light incident angle 603a is the same, and the angle after light refraction is the same. The difference is that: the optical fiber axis direction in fig. 15A is parallel to the light-emitting direction of the laser chip, and the optical axis passes through the non-center region of the focusing lens; in fig. 16A, the axis direction of the optical fiber is not parallel to the light emitting direction of the laser chip, and the optical axis passes through the center region of the focusing lens. Furthermore, the optical path design provided by the embodiment of the application realizes that the optical axis direction of the signal light which is refracted into the optical fiber insert 603 is parallel to the axial direction of the optical fiber insert 603, and light is coupled into the optical fiber with high efficiency.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module, comprising:

the light emission sub-module is used for outputting signal light;

the optical fiber adapter is connected with the light emission sub-module at one end and connected with one end of the first optical fiber at the other end, and is used for coupling the signal light output by the light emission sub-module to the first optical fiber; the optical fiber adapter comprises a tube shell, an optical fiber inserting core and an isolator, wherein the optical fiber inserting core is embedded in a cavity of the tube shell, the isolator is positioned in the cavity of the tube shell, the light inlet end face of the optical fiber inserting core faces the isolator, and the optical fiber inserting core is connected with the first optical fiber;

the light emission sub-module includes:

the light emission sub-module cavity is provided with a through hole which transversely penetrates through the side wall, the through hole is inclined to the top surface of the light emission sub-module cavity, the through hole is communicated with one end of the inner cavity of the light emission sub-module cavity to form a step, and the pipe shell is embedded in the through hole and the end part of the pipe shell abuts against the step;

The laser component is arranged on the bottom surface of the cavity of the light emitting sub-module and emits a plurality of signal lights;

the optical multiplexing assembly is arranged on the bottom surface of the cavity of the optical emission sub-module and is positioned on the output optical path of the laser assembly and used for combining a plurality of signal lights into one signal light; wherein, in the light emitting sub-module cavity, the bottom surface of the light emitting sub-module cavity for supporting the laser component is lower than the bottom surface of the light emitting sub-module cavity for supporting the light multiplexing component;

the lens is arranged in the light emission sub-module cavity and between the light multiplexing component and the optical fiber adapter and is used for converging the signal light beams to the optical fiber adapter;

the laser component comprises a laser chip and a collimating lens, wherein the collimating lens is arranged on a transmission light path of the laser chip and the light multiplexing component, an optical axis of an emitted light signal of the laser chip is parallel to an optical axis direction of the collimating lens, the optical axis direction of the optical fiber lock pin is parallel to an axial direction of the through hole, the optical axis direction of the collimating lens is not parallel to the axial direction of the optical fiber lock pin, the optical axis direction of the lens is not parallel to the axial direction of the optical fiber lock pin, and the optical axis direction of an incident light signal of the optical fiber lock pin is parallel or approximately parallel to the axial direction of the optical fiber lock pin.

2. The optical module of claim 1, wherein the axial direction of the tube housing is parallel to the axial direction of the fiber ferrule, and the light entrance surface of the fiber ferrule is an inclined surface.

3. The light module of claim 1 further comprising a lower housing supportably connected to the light emission sub-module cavity;

the inner surface of the lower shell is provided with a clamping groove, a gap is formed in the clamping groove, and a protrusion is arranged on the first optical fiber socket; the protrusion is disposed in the gap to secure the first fiber optic receptacle to the lower housing.

4. A light module as recited in claim 3, further comprising a circuit board, wherein the light emission sub-module cavity is provided with an opening, the circuit board extending into the cavity through the opening, the circuit board being secured to the lower housing.

5. The optical module of claim 2, wherein a baffle is further disposed within the package, the isolator being located on one side of the baffle, the fiber stub being located on the other side of the baffle.

6. The optical module of claim 2, wherein the first optical fiber is positioned in the optical fiber ferrule, and wherein an axial direction of the optical fiber is parallel to an axial direction of the optical fiber ferrule.

7. The optical module of claim 2, wherein the axial direction of the fiber stub is parallel to the axial direction of the through-hole.

8. The optical module of claim 5, wherein the axis of the isolator is parallel to the axis of the package.

9. A light module as recited in claim 1, wherein the through hole is inclined to the top surface of the light emission sub-module cavity by an inclination angle of 3 °.

10. The light module of claim 2, wherein the incline angle of the incline is 7 °.