CN110471148B

CN110471148B - Optical module

Info

Publication number: CN110471148B
Application number: CN201910824702.4A
Authority: CN
Inventors: 葛建平; 傅钦豪; 黄绪杰; 谢一帆
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-09-02
Filing date: 2019-09-02
Publication date: 2021-11-05
Anticipated expiration: 2039-09-02
Also published as: CN110471148A

Abstract

The invention discloses an optical module, which comprises a shell and an optical fiber adapter positioned at one end of the shell, wherein the shell comprises a laser chip, a first filter, a reflector plate, a second filter, a reflecting prism assembly and a light receiving chip. An optical signal emitted by the laser chip enters the optical fiber adapter through the first filter plate and then is emitted; the optical signal from the optical fiber adapter is reflected by the first filter plate and the reflector plate and then transmitted to the reflecting prism assembly through the second filter plate; the light incident surface of the reflecting prism component and the propagation direction of the optical signal form a non-vertical angle which can reduce the return loss of received light, the end surface of the tail end of the reflecting prism component is an inclined reflecting inclined surface, and the optical signal is propagated to the reflecting inclined surface, reflected and emitted to the light emergent bottom surface to be received by the light receiving chip below the light emergent bottom surface. Therefore, the optical module provided by the invention can be used for tilting the light incident surface of the reflecting prism assembly, so that the return loss of received light can be reduced, the influence on optical signal transmission is further reduced, and the optical coupling effect is ensured.

Description

Optical module

Technical Field

The invention relates to the technical field of optical fiber communication, in particular to an optical module.

Background

Due to the increasing demand for communication bandwidth in the field of optical fiber communication, global optical communication is in a rapid development period. In the field of high-speed data communication, in order to ensure that data can be transmitted at a high speed over a long distance, optical modules are generally used in the field to realize the transmission and reception of light with different wavelengths.

The existing optical module generally refers to an integrated module for photoelectric conversion, and the optical fiber adapters are respectively equipped for the optical transmitter and the optical receiver to form a coaxially packaged optical module. However, since the optical fiber adapters have a large volume, the optical module is adapted to the two optical fiber adapters, which easily causes a gap between the optical device and the optical module housing, so that the optical module has a large volume and cannot meet SFP packaging requirements. Therefore, the person in the art proposes a small-sized packaged optical module having a single-fiber bidirectional structure.

In a single-fiber bidirectional optical module, a light emitting device and a light receiving device share a fiber adapter, and therefore, an optical signal needs to be optically bent during propagation to receive the optical signal. The optical signal is very easy to generate optical return loss in the turning process, and the transmission of the optical signal is affected, so that the optical coupling effect is poor.

Disclosure of Invention

The invention provides an optical module, which aims to solve the problem that the optical coupling effect is influenced because the existing optical module is easy to generate optical return loss.

The present invention provides an optical module, comprising: the optical fiber adapter comprises a shell and an optical fiber adapter positioned at one end of the shell;

the shell comprises a laser chip, a first filter, a reflector plate, a second filter, a reflecting prism assembly and a light receiving chip;

the optical signal emitted by the laser chip enters the optical fiber adapter through the first filter plate and then is emitted out;

the optical signal from the optical fiber adapter is reflected by the first filter plate and then emitted to the reflector plate, and is reflected by the reflector plate and then emitted to the reflecting prism assembly through the second filter plate;

the light incident surface of the reflecting prism assembly and the propagation direction of the optical signal form a non-vertical angle, the end surface of the tail end of the reflecting prism assembly is an inclined reflecting inclined surface, and the light receiving chip is arranged below the light emergent bottom surface of the reflecting prism assembly;

and the light signal from the second filter plate is emitted into the reflecting prism assembly from the light inlet surface, is transmitted to the reflecting inclined surface, is reflected and then is emitted to the light outlet bottom surface so as to be received by the light receiving chip below the light outlet bottom surface.

According to the technical scheme, the optical module provided by the embodiment of the invention comprises a shell and an optical fiber adapter positioned at one end of the shell, wherein the shell comprises a laser chip, a first filter, a reflector plate, a second filter, a reflecting prism assembly and a light receiving chip. An optical signal emitted by the laser chip enters the optical fiber adapter through the first filter plate and then is emitted; the optical signal from the optical fiber adapter is reflected by the first filter plate and then emitted to the reflector plate, and is reflected by the reflector plate and then emitted to the reflecting prism assembly through the second filter plate; the light incident surface of the reflecting prism component and the propagation direction of the optical signal form a non-vertical angle which can reduce the return loss of received light, the end surface of the tail end of the reflecting prism component is an inclined reflecting inclined surface used for reflecting the optical signal to the light emergent bottom surface, and the optical signal from the second filter plate penetrates through the light incident surface to generate optical turning, is propagated to the reflecting inclined surface and reflected to the light emergent bottom surface to be received by a light receiving chip below the light emergent bottom surface. Therefore, the optical module provided by the invention can be used for tilting the light incident surface of the reflecting prism assembly, so that the return loss of received light can be reduced, the influence on optical signal transmission is further reduced, and the optical coupling effect is ensured.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any inventive exercise.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

FIG. 3 is a schematic structural diagram of an optical module;

FIG. 4 is an exploded view of an optical module according to an embodiment of the present invention;

fig. 5 is a schematic diagram of an overall structure of an optical transceiver according to an embodiment of the present invention;

fig. 6 is an exploded view of an optical transceiver according to an embodiment of the present invention;

fig. 7 is a schematic diagram of an internal structure of an optical transceiver according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of an alternative configuration of an optical transceiver according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of an optical bench according to an embodiment of the present invention;

fig. 10 is a schematic view of another angular structure of an optical bench according to an embodiment of the present invention.

FIG. 11 is a schematic structural diagram of a light emission cavity provided in an embodiment of the invention;

FIG. 12 is a schematic diagram of an alternative internal configuration of an optical transceiver according to an embodiment of the present invention;

fig. 13 is a partial side view of a light receiving cavity provided by an embodiment of the present invention;

fig. 14 is a schematic structural diagram of a reflecting prism assembly according to an embodiment of the present invention;

FIG. 15 is a schematic diagram of an optical path propagation path of a reflecting prism assembly according to an embodiment of the present invention;

fig. 16 is a schematic structural diagram of a first TEC assembly according to an embodiment of the present invention;

fig. 17 is a schematic structural diagram of a light receiving cavity provided in an embodiment of the present invention;

fig. 18 is a schematic structural diagram of a second TEC assembly according to an embodiment of the present invention;

fig. 19 is a schematic structural diagram of a second TEC assembly at another angle according to an embodiment of the present invention.

Detailed Description

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103; one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network unit 100 having the optical module.

An optical port of the optical module 200 is connected with the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit 100; the optical module 200 converts an optical signal and an electrical signal to each other, so as to establish a connection between the optical fiber 101 and the optical network unit 100. Specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit 100 has an optical module interface 102, which is used for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200; the optical network unit 100 has a network cable interface 104 for accessing the network cable 103 and establishing a bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network unit 100. Specifically, the optical network unit 100 transmits a signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, and the optical network unit 100 monitors the operation of the optical module 200 as an upper computer of the optical module 200.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the onu 100 is an upper computer of the optical module 200, and provides a data signal to the optical module 200 and receives a data signal from the optical module 200, and a common upper computer of the optical module also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module 200 is inserted into an electrical connector in the cage 106, and an optical port of the optical module 200 is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board 105, and the electrical connector on the circuit board 105 is wrapped in the cage 106; the optical module 200 is inserted into the cage 106, the cage 106 fixes the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 through the optical module case and finally diffused by the heat sink 107 on the cage 106.

Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, an optical module 200 according to an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, and an optical transceiver 400.

The upper shell 201 and the lower shell 202 form a package cavity with two openings, specifically, two ends of the package cavity are opened (204, 205) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 204 for being inserted into an upper computer such as an optical network unit, the other opening is an optical port 205 for external optical fiber access to connect internal optical fibers, and the photoelectric devices such as the circuit board 300 and the optical transceiver 400 are located in the package cavity.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper casing, lower casing to combine is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the unlocking handle fixes the optical module in the cage of the upper computer, and the clamping relation between the optical module and the upper computer is released by pulling the unlocking handle, so that the optical module can be drawn out from the cage of the upper computer.

In order to improve the coupling effect of the optical module and reduce the influence of received light return loss on optical signal transmission, the embodiment of the invention provides the optical module which has the characteristic of single-fiber bidirectional and has a better coupling effect.

Fig. 5 is a schematic diagram of an overall structure of an optical transceiver according to an embodiment of the present invention; fig. 6 is an exploded schematic view of an optical transceiver according to an embodiment of the present invention.

An optical module provided in an embodiment of the present invention, specifically, an optical transceiver shown in fig. 5 and 6, includes: the shell 1, the shell 1 comprises apron 110 and cavity 120, and the apron 110 lock constitutes confined cavity on cavity 120, holds light emitting device 6 and light receiving device 8 in the cavity. The optical module provided by the embodiment of the invention has the characteristic of single-fiber bidirectional, so that the light emitting device 6 and the light receiving device 8 are encapsulated in the same cavity, the shell 1 is communicated with the optical fiber adapter 2, and the optical fiber adapter 2 simultaneously receives and sends optical signals.

When the optical module works, heat generated by the light emitting device 6 can be diffused to the area where the light receiving device 8 is located, so that the light emitting device 6 and the light receiving device 8 are prone to generating a thermal crosstalk phenomenon, the effect of the light receiving device in screening optical signals by using the TEC temperature control is influenced, and the wavelength adjustment precision is influenced.

Therefore, in order to avoid thermal crosstalk between the light emitting device 6 and the light receiving device 8, referring to the schematic internal structural diagram of the light receiving device shown in fig. 7, in the optical module provided in the embodiment of the present invention, a heat insulation board 5 is disposed in the housing 1, and the heat insulation board 5 is disposed in the housing 1 and divides the housing 1 into two regions, so that the heat insulation board 5 and the housing 1 form a light emitting cavity 101 and a light receiving cavity 102. The light emitting device 6 is placed in the light emitting cavity 101 and the light receiving device 8 is placed in the light receiving cavity 102.

In this embodiment, the optical fiber adapter 2 is disposed at the corresponding housing of the light emitting cavity 101, that is, the optical fiber adapter 2 is communicated with the light emitting cavity 101. The through hole 14 is arranged at the position of the housing 1 where the optical fiber adapter 2 is installed, in order to ensure the fixing stability of the optical fiber adapter 2, the housing 1 further comprises a hollow tube shell 130, the tube shell 130 is fixed on the side wall of the cavity 120, the tube shell 130 is communicated with the through hole 14, the tube shell 130 is used for installing the optical fiber adapter 2, so that the optical fiber insertion core 21 of the optical fiber adapter 2 is exposed out of the through hole 14, the optical fiber insertion core 21 is convenient to receive an optical signal emitted by the light emitting device 6, and the emitted optical signal is received by the light receiving device 8. In this embodiment, the case 130 may be integrally formed with the cavity 120.

The light outlet of the light emitting device 6 in the light emitting cavity 101 corresponds to the light inlet of the optical fiber adapter 2, so that light emitted by the light emitting device 6 can enter the optical fiber adapter 2, the optical fiber ferrule 21 is installed in the optical fiber adapter 2, and the received light emitted by the light emitting device 6 is emitted by the optical fiber ferrule 21. In the signal conversion process, the optical transmitter 6 receives the electrical signal, converts the electrical signal into an optical signal, and emits the optical signal into the optical fiber adapter 2 corresponding to the optical transmitter 6.

In order to supply power to the optical devices (the light emitting device 6 and the light receiving device 8), the optical module provided in this embodiment configures corresponding flexible circuit boards for the light emitting device 6 and the light receiving device 8, that is, the first flexible circuit board 3 and the second flexible circuit board 4 are installed at one end of the housing 1. Two flexible circuit boards and optical fiber adapter 2 are installed on different sides of casing 1, and flexible board mounting groove 13 is seted up to the one end lateral wall of casing relative with the mounted position of optical fiber adapter 2, fixes first flexible circuit board 3 and second flexible circuit board 4 in flexible board mounting groove 13.

The light emitting cavity 101 is internally provided with a light emitting device 6, the first flexible circuit board 3 extends into the light emitting cavity 101, and the first flexible circuit board 3 is electrically connected with the light emitting device 6. The first flexible circuit board 3 supplies power and an electric signal to the light emitting device 6, and the light emitting device 6 converts the received electric signal into an optical signal and emits the optical signal. The light receiving device 8 is arranged in the light receiving cavity 102, the second flexible circuit board 4 extends into the light receiving cavity 102, the second flexible circuit board 4 is electrically connected with the light receiving device 8, and the light receiving device 8 receives the optical signal from the optical fiber adapter 2 and then transmits the optical signal to the second flexible circuit board 4 to form an electrical signal.

The optical module provided by the present embodiment is a single-fiber bidirectional optical module, and the light emitting device 6 and the light receiving device 8 share one optical fiber adapter 2, that is, the optical fiber adapter 2 simultaneously receives and transmits optical signals. In order to receive the optical signal, the light outlet of the light emitting device 6 corresponds to the light inlet of the optical fiber adapter 2, and the light emitted by the light emitting device 6 enters the optical fiber adapter 2 through the light inlet and then is emitted.

Because the light emitting device 6 and the light receiving device 8 are packaged in the same cavity, the optical fiber adapter 2 and the light emitting device 6 are arranged correspondingly, the optical signal from the optical fiber adapter 2 can be firstly transmitted in the light emitting cavity 101, the light receiving device 8 is positioned at one side of the light emitting device 6, and the light outlet of the optical fiber adapter 2 cannot correspond to the light inlet of the light receiving device 8, so that the optical signal from the optical fiber adapter 2 cannot be received by the light receiving device 8. Therefore, in order for the light receiving device 8 to receive the optical signal from the optical fiber adapter 2, the optical signal in the light emitting cavity 101 needs to be reflected into the light receiving cavity 102 and then received by the light receiving device 8.

And in order to avoid thermal crosstalk between the light emitting device 6 and the light receiving device 8, a thermal insulating plate 5 is provided between the light emitting device 6 and the light receiving device 8. Then, when the optical signal in the light emitting cavity 101 is reflected into the light receiving cavity 102, the optical signal needs to pass through the heat insulation board 5, and therefore, the optical module provided in the present embodiment is provided with the light through hole 51 on the heat insulation board 5.

Because the optical fiber ferrule 21 in the optical fiber adapter 2 faces the light emitting device 6, but does not face the light receiving device 8, the optical signal from the optical fiber adapter 2 will propagate in the light emitting cavity 101 first, in order to make the light receiving device 8 receive the optical signal from the optical fiber adapter 2 through the light port 51, as shown in the structural schematic diagram of another angle of the optical transceiver shown in fig. 8, the first filter 88 arranged obliquely is arranged in the light emitting cavity 101, the first filter 88 is located at the light port 51 and located at one side close to the light emitting device 6, and the oblique direction of the first filter 88 is the direction from the optical fiber adapter 2 to the light emitting device 6. The first filter 88 is disposed on the propagation path of the optical signal transmitted from the fiber adapter 2 so that the optical signal from the fiber adapter 2 can propagate on the first filter 88 disposed obliquely, thereby generating reflection.

When the optical signal from the optical fiber adapter 2 propagates in the direction of the light emitting device 6, it propagates to the first filter 88 located between the light emitting device 6 and the optical fiber adapter 2, and the first filter 88 reflects the optical signal, and the formed reflected light enters the light receiving cavity 102 through the light through hole 51 and is emitted into the light receiving device 8.

It can be seen that the optical module provided in the embodiment of the present invention has a single-fiber bidirectional structure, and the optical fiber adapter 2 concurrently implements transmission and reception of optical signals, that is, the light emitting device 6 and the light receiving device 8 are packaged in the same housing 1, and the same optical fiber adapter 2 receives the optical signal transmitted by the light emitting device 6 and simultaneously transmits the optical signal to be received by the light receiving device 8, thereby implementing conversion of optical-electrical signals and improving coupling effect.

When the optical module provided by the embodiment of the present invention realizes receiving and transmitting of optical signals, the housing 1 includes a laser chip 61, a first filter 88, a second filter 83, a reflector 82, a reflecting prism assembly 84, and a light receiving chip 85. The optical device can realize the single-fiber bidirectional structure of the optical module, and for clarity, the following embodiments are described with the light emitting cavity 101 and the light receiving cavity 102 respectively according to the propagation path of the optical signal.

In the optical module provided by the embodiment of the present invention, in the light emitting cavity 101, the light emitting device 6 includes a laser chip 61, a converging lens 63, an optical isolator 64, and an optical platform 65. The laser chip 61 is used for emitting optical signals according to the electric signals; the converging lens 63 is used for converging the dispersed optical signals into parallel light, so that optical loss during long-distance transmission is avoided; the optical isolator 64 is a passive device which allows light to pass in one direction and prevents the light from passing in the opposite direction, and is used for limiting the propagation direction of the light, so that the light can be transmitted only in one direction, the light reflected by the optical fiber echo can be well isolated by the optical isolator 64, and the light wave transmission efficiency is improved; optical platform 65 is as unable adjustment base for fix other light emitting device, such as optical isolator 64, focusing lens 80 and first filter 88 to adjust light emitting device's height, make light emitting device 6's light-emitting outlet can correspond with the income light inlet of fiber optic adapter 2, improve the optical coupling effect.

In the light emitting cavity 101, the propagation path of the optical signal generates an optical signal for the laser chip 61, and the optical signal enters the fiber ferrule 21 of the fiber adapter 2 and then is emitted. Since the optical signal generated by the laser chip 61 is divergent light, in order to avoid optical loss during long-distance transmission, the converging lens 63 is disposed in the direction of the optical signal, and the optical signal generated by the laser chip 61 is converted into parallel light by the converging lens 63 and continues to propagate in the direction of the optical fiber adapter 2.

In order to prevent the optical signal from being reflected back after entering the fiber ferrule 21, and entering the laser chip 61 according to the original propagation path, which affects the performance of the laser chip 61, in this embodiment, an optical isolator 64 is disposed between the converging lens 63 and the fiber adapter 2, and the converging lens 63 is disposed between the laser chip 61 and the optical isolator 64. The optical signal enters the optical isolator 64, is rotated in the polarization direction of light, and is emitted, and the emitted optical signal enters the fiber stub 21 of the fiber adapter 2.

If optical signal produces the reflection at optic fibre lock pin 21 department, the reflected light propagates to the light-emitting port of optical isolator 64 again along former propagation path, but because optical signal's polarization direction changes, the reflected light can't get into in optical isolator 64 according to former propagation path again, consequently, can avoid the reflected light to get into laser chip 61 through optical isolator 64 again in, avoids influencing laser chip 61's luminous performance.

FIG. 9 is a schematic structural diagram of an optical bench according to an embodiment of the present invention; fig. 10 is a schematic view of another angular structure of an optical bench according to an embodiment of the present invention.

In order to precisely adjust the height of the light emitting device in the optical path transmission so that the light outlet of the light emitting device corresponds to the light inlet of the optical fiber adapter 2, in this embodiment, the optical isolator 64 is fixed to the side wall of the optical platform 65. Referring to fig. 9 and 10, the present embodiment provides an optical bench 65 having a boss 651, the boss 651 being used to adjust the height of the optical isolator 64 and the first filter 88 in optical path transmission.

The boss 651 has a first through hole 653 penetrating the front and rear surfaces, the light inlet of the first through hole 653 faces the laser chip 61, and the light outlet of the first through hole 653 faces the fiber adapter 2. The first through hole 653 is a light path provided in the optical platform, and a light outlet of the light path corresponds to a light inlet of the optical fiber adapter 2. The optical path is used to propagate the optical signal through the optical isolator 64, and the optical signal emitted from the optical path can enter the fiber adapter.

The optical isolator 64 is arranged in the light inlet of the first through hole 653, so that the light inlet of the optical isolator 64 faces the laser chip 61, the light outlet of the optical isolator 64 is communicated with the light passing path formed by the first through hole 653, and the light signal emitted by the laser chip 61 can be emitted through the first through hole 653 after reentering the optical isolator 64.

The rear surface of the boss 651 forms a first inclined surface 650, the first inclined surface 650 is located on a side of the boss 651 facing the fiber optic adapter 2, and the light outlet of the first through hole 653 is located on the first inclined surface 650. The first filter 88 is disposed on the first slope 650 and covers the first through hole 653, so that the optical signal emitted through the first through hole 653 passes through the first filter 88 to obtain the optical signal of a specific wavelength. The optical signal passing through the first filter 88 enters the fiber stub 21 of the fiber adapter 2 and then exits.

Therefore, referring to the schematic structural diagram of the light emission cavity shown in fig. 11, as the path indicated by the dotted arrow in the figure, in the light emission cavity 101, the propagation path of the optical signal is: after an optical signal emitted by the laser chip 61 is converged by the converging lens 63, the formed parallel light enters the light-passing path through the optical isolator 64 and is emitted, and the formed emergent light enters the optical fiber ferrule 21 in the optical fiber adapter 2 and is emitted.

The first slope 650 is a surface that is disposed obliquely, and is inclined in the direction from the fiber optic adapter 2 to the light emitting device 6. The first filter 88 is disposed on the first inclined surface 650 to ensure that the optical signal from the fiber adapter 2 can be reflected after propagating to the first filter 88, and the direction of the reflection is toward the light receiving cavity 102.

In the light receiving cavity 102, the light receiving device 8 needs to reflect the optical signal propagating in the light emitting cavity 101 into the light receiving cavity 102 when receiving the optical signal from the optical fiber adapter 2. For this reason, in the present embodiment, reflection of the optical signal is achieved by the first filter 88 disposed obliquely to be received by the light receiving device 8 in the light receiving cavity 102.

The optical signal from the fiber adapter 2 is divergent light, and in order to improve the optical coupling efficiency and avoid optical loss, in this embodiment, a focusing lens 80 is disposed between the first filter 88 and the fiber adapter 2. The optical signal from the optical fiber adapter 2 passes through the focusing lens 80, propagates on the first filter 88, and is reflected, and the formed reflected light enters the light receiving cavity 102 through the light through hole 51 and is emitted into the light receiving device 8.

The focusing lens 80 is disposed between the optical platform 65 and the optical fiber adapter 2, and the light outlet of the optical platform 65 is located on the first inclined plane 650, at this time, in the area between the optical platform 65 and the optical fiber adapter 2, the path of the optical signal received by the optical fiber adapter 2 coincides with the path of the outgoing optical signal, so that when the optical fiber adapter 2 receives the optical signal emitted by the laser chip 61, the optical signal also passes through the focusing lens 80, and the optical signal passes through the focusing lens 80 to form a convergent light, and then is emitted into the optical fiber adapter 2.

The optical signal from the optical fiber adapter 2 is collimated by the focusing lens 80 and then propagates in the direction of the optical platform 65, and further propagates on the first filter 88 to generate reflection, and the reflection light enters the light receiving cavity 102 along the light through hole 51 on the heat insulation board 5.

The light receiving device 8 is disposed in the light receiving cavity 102, and in order to receive the light signal reflected from the light emitting cavity 101 into the light receiving cavity 102, in this embodiment, the light path changing platform 81 is further disposed in the housing 1. Referring to fig. 9 and 10 again, in order to receive the optical signal reflected by first filter 88, a light-changing path is disposed in optical path changing platform 81, light inlet 812 of the light-changing path corresponds to light through hole 51, that is, corresponds to first through hole 653, light inlet 812 of the light-changing path faces first filter 88, and the optical signal reflected by first filter 88 and light through hole 51 in light emitting cavity 101 enters into the light-changing path through light inlet 812 and propagates.

The optical signal propagation path in the light changing path is perpendicular to the propagation path of the optical signal from the optical fiber adapter 2 in the light emitting cavity 101, and in order to change the optical signal propagation path, the optical path changing platform 81 has a second through hole 811 penetrating through the left and right surfaces, and the second through hole 811 communicates with the light changing path.

The second inclined plane 810 is formed at a position of the left surface of the second through hole 811, and the reflection sheet 82 is disposed on the second inclined plane 810 and attached to the second through hole 811. The second through hole 811 is located on the right surface 813 and is an optical outlet, and the reflected optical signal propagates from the optical outlet to the light receiving chip 85. The reflecting plate 82 inclined at one side of the optical path changing platform 81 is used for reflection, and the optical signal reflected by the first filter 88 propagates to the reflecting plate 82 via the dimming path and is reflected again and then emitted to the second filter 83.

Therefore, as shown in fig. 12, the internal structure diagram of the optical transceiver at another angle, see the path shown by the dashed arrow in the figure, the optical signal propagation path at the optical path changing platform 81 is: the optical signal from the optical fiber adapter 2 enters the light changing path in the optical path changing platform 81 through the light inlet 812, the optical signal propagates to the reflection sheet 82 attached to the second inclined plane 810 at the left side of the second through hole 811 to be reflected, and the reflected light passes through the second through hole 811 and propagates from the light outlet second filter 83 of the right surface 813 to the direction of the light receiving chip 85.

As shown in the partial side view of the light receiving cavity in fig. 13, the second filter 83 is disposed in the optical signal propagation path, and the second filter 83 is perpendicular to the bottom plate 11 of the housing 1 and perpendicular to the side wall 12 of the housing 1 so that the optical signal can pass through the second filter 83. A reflection prism assembly 84 is arranged at the light outlet of the second filter 83, and a light receiving chip 85 is arranged at the light outlet of the reflection prism assembly 84. The reflection prism assembly 84 receives the optical signal filtered by the second filter 83, and reflects the optical signal to the light receiving chip 85 located below the reflection prism assembly 84, and the light receiving chip 85 receives the optical signal.

The structure of the reflecting prism assembly is schematically shown in fig. 14, in which the dashed arrows indicate the optical signal propagation paths in the reflecting prism assembly. Reflecting prism assembly 84 provided by embodiments of the present invention is used to change the propagation path of an optical signal. The optical signal emitted from the optical fiber adapter 2 has a certain height, and the photosensitive surface of the optical receiving chip 85 faces upward, that is, the propagation path of the optical signal from the optical fiber adapter 2 is not consistent with the optical receiving path of the optical receiving chip 85, so that in order to facilitate the optical receiving chip 85 to receive the optical signal, the reflecting prism assembly 84 is required to reflect the optical signal with higher propagation downward into the optical receiving chip 85.

The reflecting prism assembly 84 includes an incident surface 841, a reflecting inclined surface 842, and a light emergent bottom surface 843. The light incident surface 841 faces the second filter 83, and is configured to receive the optical signal passing through the second filter 83. The reflection slope 842 is disposed on the propagation path of the optical signal and is inclined such that the optical signal incident from the light incident surface 841 can be reflected downward after propagating on the reflection slope 842. The light exit bottom surface 843 is disposed on the reflection path, and a second condensing lens 844 is disposed on the light exit bottom surface 843, and the reflected light is condensed by the second condensing lens 844.

Since the optical signal transmitted through the second filter 83 needs to pass through a section of air and then enter the reflection prism assembly 84, and when the optical signal propagates in the air medium and strikes the light incident surface 841 of the reflection prism assembly 84, the optical signal is easily reflected at the light incident surface 841, so that the reflected light propagates in the direction opposite to the original propagation path of the optical signal, and the optical return loss occurs, and the optical coupling effect of the optical receiving chip 85 is poor.

Therefore, in order to reduce the optical return loss caused by the light incident surface 841, in the optical module provided in this embodiment, the light incident surface 841 is obliquely disposed, so that the light incident surface 41 of the reflecting prism assembly 84 and the propagation direction of the optical signal form a non-perpendicular angle, that is, the angle between the light incident surface 841 and the propagation path of the optical signal forms an acute angle or an obtuse angle, and the non-perpendicular angle can reduce the received light return loss.

In order to make the optical signal incident on reflecting prism assembly 84 through incident surface 841 propagate along a position deviated from the original propagation path, it is necessary that incident surface 841 of reflecting prism assembly 84 is inclined along the direction from bottom to top, the inclination direction is the same as the propagation direction of the optical signal. In order to ensure the coupling effect of the optical signals, in the embodiment, the included angle between the propagation paths of the optical signals on the light-in surface 841 and the light-out bottom surface 843 is in the range of 30-135 degrees (excluding 90 degrees).

Since light receiving chip 85 is disposed below reflecting prism assembly 84 with the light sensitive side of light receiving chip 85 facing upward, reflecting prism assembly 84 is required to reflect the optical signal downward in order for light receiving chip 85 to receive the optical signal propagating through reflecting prism assembly 84. Therefore, in this embodiment, the end surface of the reflecting prism assembly 84 is an inclined reflecting slope 842, and the light receiving chip 85 is disposed below the light exit bottom surface 843 of the reflecting prism assembly 84.

The inclined reflection plane 842 is inclined such that the light signal propagating through the light incident plane 841 is reflected after propagating through the inclined reflection plane 842. To make the reflection direction face downward, the reflection slope 842 needs to be inclined in a direction from the bottom end to the top end, and the inclination direction is opposite to the propagation direction of the optical signal, that is, the reflection slope 842 is connected to the light-emitting bottom surface 843 at an acute angle. In this embodiment, in order to enable the optical signal reflected by the reflection slope 842 to pass through the light exit bottom surface 843 and ensure the coupling effect of the optical signal, an included angle between the reflection slope 842 and the light exit bottom surface 843 is set to be 40-70 degrees.

Therefore, the propagation path of the optical signal received by the optical receiving chip 85 is: the optical signal from the optical fiber adapter 2 is reflected by the first filter 88 and then transmitted to the reflector 82, and then transmitted to the second filter 83 after being reflected by the reflector 82, and the optical signal transmitted through the second filter 83 is transmitted into the reflection prism assembly 84 through the light incident surface 841, transmitted to the reflection inclined surface 842 and reflected and then transmitted to the light emergent bottom surface 843, so as to be received by the light receiving chip 85 below the light emergent bottom surface 843.

In order to reduce the loss of the light receiving chip 85 for receiving the light signal, in this embodiment, a second focusing lens 844 is disposed on the light exit bottom surface 843 of the reflection prism assembly 84, and the second focusing lens 844 is used for focusing the light signal reflected by the reflection inclined plane 842, so that the focused light is received by the light receiving chip 85 below the second focusing lens 844.

As shown in FIG. 15, the optical path of the reflecting prism assembly is schematically illustrated, the path indicated by solid arrows is the path of the optical signal from second filter 83 entering reflecting prism assembly 84 and exiting, and the path indicated by dashed arrows is the path of the reflected light entering reflecting prism assembly 84 and exiting.

When the light receiving chip 85 receives the optical signal emitted from the second focusing lens 844, a small portion of the optical signal is reflected by the photosensitive surface of the light receiving chip 85. Since the propagation path of the optical signal incident into the reflecting prism assembly 84 through the light incident surface 841 deviates from the original propagation path, that is, the optical signal is deflected downward by a certain angle and then propagates onto the inclined reflecting surface 842, when the reflected light generated on the inclined reflecting surface 842 propagates downward, the propagation path is not perpendicular to the light incident surface of the second focusing lens 844, that is, the optical signal propagating downward as shown by the solid arrow is not vertically incident into the light receiving chip 85.

Since the optical signal incident from second focusing lens 844 to light receiving chip 85 is not perpendicular to the photosensitive surface, when the optical signal is reflected, the reflected light will not enter reflection prism assembly 84 again along the original propagation path, but will enter reflection prism assembly 84 through second focusing lens 844 along the path indicated by the dashed arrow and continue to propagate. The propagation path of the optical signal emitted from the reflecting prism assembly 84 does not coincide with the original propagation path, i.e. the emitted light and the incident light form a certain angle, which can prevent the reflected light from returning to the optical fiber ferrule 21 of the optical fiber adapter 2 and affecting the signal transmission. Therefore, the light incident surface 841 is obliquely arranged, so that the light incident surface 841 and the light emitting bottom surface 843 form a non-perpendicular angle, the influence of light return loss received by the light receiving chip 85 on optical signal transmission is reduced, and the optical coupling effect of the light receiving chip 85 can be ensured.

The reflecting prism assembly 84 provided in this embodiment has a length, a height and a width of 2mm, 1.5mm and 1mm, respectively. The second focusing lens 844 is formed by gluing the reflecting prism assembly 84 with the second focusing lens 844, the reflecting prism assembly 84 bends the parallel light, and the second focusing lens 844 focuses the parallel light after being bent to the photosensitive surface of the light receiving chip 85, so as to receive the optical signal.

In order to reduce the light return loss, in this embodiment, the material of the second focusing lens 844 can be L-LAH84 or other materials, and the material of the reflecting prism assembly 84 can be L-LAH84 or other materials.

As shown in FIG. 15, the S10 surface is the light incident surface 841 of the reflecting prism assembly 84, and the S10 surface is AR coated to increase the light flux and reduce the interface reflection. The included angle between the S10 surface and the S30 surface (horizontal plane) is 85 degrees (or other non-vertical angles, the angle range is 30-135 degrees, and 90 degrees is not included), and the non-vertical angle can reduce the return loss of received light. The surface S20 is a reflection inclined surface 842 of the reflection prism assembly 84, the surface S20 is not coated, and the light path turning is realized by utilizing the total reflection characteristic from the optically dense medium to the optically sparse medium.

The S40 plane is the upper flat plane of the second focusing lens 844, S30 is the light exit bottom surface 843 of the reflecting prism assembly 84, the middle of the S40 plane and the S30 plane is bonded by optical cement, and the refractive index of the optical cement is the same as or similar to that of the second focusing lens 844 and the reflecting prism assembly 84; if the refractive index of the optical cement is different from that of the second focusing lens 844 and the reflecting prism assembly 84, AR coating needs to be coated on the surface S40 or the surface S30 to reduce the interface reflection.

The S50 plane is an interface between the light-emitting plane of the second condenser lens 844 and air, and the S50 plane is AR-coated to increase the luminous flux and reduce the reflection.

Through software simulation calculation, the embodiment of the invention optimizes the inclination of the S10 plane, and the received light return loss value can be improved by 10dB, so that the light receiving chip 85 reduces the reception of the light return loss, further reduces the influence of the light return loss on the transmission of optical signals, and ensures the optical coupling effect.

The optical module provided by the embodiment of the invention comprises a shell 1 and an optical fiber adapter 2 positioned at one end of the shell 1, wherein the shell 1 comprises a laser chip 61, a first filter 88, a reflector 82, a second filter 83, a reflecting prism assembly 84 and a light receiving chip 85. The optical signal emitted by the laser chip 61 enters the optical fiber adapter 2 through the first filter 88 and then is emitted; the optical signal from the fiber adapter 2 is reflected by the first filter 88 and then transmitted to the reflector 82, and is reflected by the reflector 82 and then transmitted to the prism assembly 84 through the second filter 83; the light incident surface 841 of the reflecting prism assembly 84 forms a non-perpendicular angle with the propagation direction of the optical signal, the non-perpendicular angle can reduce the received light return loss, the end surface of the end of the reflecting prism assembly 84 is an inclined reflecting inclined surface 842 for reflecting the optical signal to the light emergent bottom surface 843, the optical signal from the second filter 83 passes through the light incident surface 841 to undergo optical turning, propagates to the reflecting inclined surface 842 and is reflected to the light emergent bottom surface 843 to be received by the light receiving chip 85 below the light emergent bottom surface 843. Therefore, the optical module provided by the invention can reduce the return loss of received light by tilting the light incident surface 841 of the reflecting prism assembly, thereby reducing the influence on optical signal transmission and ensuring the optical coupling effect.

In the optical module provided by the embodiment of the present invention, the optical signal generated by the laser chip 61 in the light emitting cavity 101 is converted from the electrical signal provided by the first flexible circuit board 3, and the optical receiving chip 85 in the light receiving cavity 102 needs to be converted into an electrical signal after receiving the optical signal and then is transmitted to the second flexible circuit board 4. Therefore, to achieve the conversion of the photoelectric signal, the first ceramic substrate 60 is disposed within the light emission cavity 101, and the first conductive metal layer 62 and the photodetector 66 are disposed on the first ceramic substrate 60. A second ceramic substrate 86 is provided within the light receiving cavity 102, and a second conductive metal layer 87 is provided on the second ceramic substrate 86.

In the light emission cavity 101, the first ceramic substrate 60 is used for adjusting the heights of the laser chip 61 and the condensing lens 63 in optical path transmission, so that the optical axes of the laser chip and the condensing lens 63 are overlapped, and are overlapped with the optical axis of the optical isolator 64 and the optical axis of the optical fiber ferrule 21 in the optical fiber adapter 2, thereby improving the optical coupling effect. The surface of the first ceramic substrate 60 is coated with a first conductive metal layer 62, the laser chip 61 is disposed on the first conductive metal layer 62, the laser chip 61 is connected with the anode of the first conductive metal layer 62 by wire bonding, and the first conductive metal layer 62 is used for transmitting an electrical signal to the laser chip 61. The first ceramic substrate 60 is connected to the first flexible circuit board 3 through a first conductive metal layer 62, and an electrical signal of the first conductive metal layer 62 is provided by the first flexible circuit board 3.

The optical detector 66 is located behind the laser chip 61, the optical fiber adapter 2 is located in front of the laser chip 61, and the light sensing surface of the optical detector 66 corresponds to a light outlet of the laser chip 61 for emitting a light signal backwards. The laser chip 61 emits an optical signal, wherein the high-power optical signal propagates toward the fiber adapter 2 (forward propagation), and the low-power optical signal propagates toward the optical detector 66 (backward propagation).

The low-power optical signal emitted by the laser chip 61 is received by the optical detector 66, and the optical detector 66 is used for monitoring the power of the low-power optical signal emitted by the laser chip 61. The optical power entering the optical detector 66 is generally much smaller than the total power of the light wave emitted from the laser chip 61, and the power entering the optical detector 66 for power detection is generally set to 1/10 of the total power.

In light emission cavity 101, laser chip 61 is fixed on first ceramic substrate 60, convergent lens 63 is located laser chip 61's light-emitting propagation path, optical isolator 64 is fixed on optical platform 65, laser chip 61 can be realized, the highly accurate regulation of convergent lens 63 and optical isolator 64, make laser chip 61's light-emitting outlet correspond with the income light inlet of convergent lens 63, convergent lens 63's light-emitting outlet corresponds with the income light inlet of optical isolator 64, optical isolator 64's light-emitting outlet corresponds with the income light inlet of optical fiber adapter 2, the light signal that laser chip 61 sent can be all received by optical fiber adapter 2, in order to guarantee the optical coupling effect.

Within the light receiving cavity 102, a second conductive metal layer 87, a reflecting prism assembly 84 and a light receiving chip 85 are disposed on a second ceramic substrate 86. Second ceramic substrate 86 is used to fix reflection prism assembly 84 and light receiving chip 85, and adjust the height of the light receiving device on the optical path transmission, so that the light exit of reflection prism assembly 84 corresponds to the photosensitive surface of light receiving chip 85, and light receiving chip 85 can receive the optical signal transmitted by reflection prism assembly 84, thereby avoiding optical loss.

The light receiving chip 85 is connected to the second conductive metal layer 87, the second ceramic substrate 86 is connected to the second flexible circuit board 4 through the second conductive metal layer 87, and the optical signal received by the light receiving chip 85 is transmitted to the second flexible circuit board 4 through the second conductive metal layer 87, so that the optical signal is converted into an electrical signal, and the photoelectric conversion of the optical module is realized.

In order to obtain optical signals with different wavelengths, wavelength division multiplexing is commonly used in the art to modulate the optical signals with different wavelengths in the optical module, so as to improve the optical fiber communication capacity. For this purpose, thermal conditioning by means of a TEC (thermal refrigerator) is required. When a light emitting device in an optical module emits a light signal, a laser chip in the light emitting device generates heat, and in order to stabilize the temperature of the laser chip and avoid changing the light emitting wavelength of the laser chip, the temperature of the laser chip needs to be maintained to be stable by means of a TEC (thermoelectric cooler) so as to obtain a stable light signal; when the optical receiving device receives optical signals, because there are a plurality of lights from the optical fiber adapter, in order to screen out optical signals with appropriate wavelengths, the optical receiving device needs to screen out optical signals with different wavelengths by means of another TEC in a temperature control manner.

In order to avoid the phenomenon that the optical receiving device 8 and the optical emitting device 6 generate thermal crosstalk and the TEC assemblies (7 and 9) cannot modulate optical signals when the optical module works, the performance of the optical receiving device 8 and the optical emitting device 6 and the normal work of the optical module are influenced. In the optical module provided by the embodiment, the first TEC assembly 7 is disposed in the light emitting cavity 101, and the second TEC assembly 9 is disposed in the light receiving cavity 102.

Fig. 16 is a schematic structural diagram of a first TEC assembly according to an embodiment of the present invention. Specifically, in the light emission cavity 101, as shown in fig. 16, a first TEC assembly 7 is disposed on the bottom plate 11 of the housing 1, a laser chip 61 is disposed on an upper surface of the first TEC assembly 7, and the first TEC assembly 7 is configured to conduct heat generated by the laser chip 61 out of the bottom plate 11. The first TEC assembly 7 is disposed at the bottom of the first ceramic substrate 60, and the laser chip 61 on the first ceramic substrate 60 is liable to generate heat when emitting an optical signal, which is a main source of heat generated in the light emitting device.

Specifically, the first TEC assembly 7 includes a first TEC assembly upper heat exchange surface 71, a first TEC assembly structure 72, and a first TEC assembly lower heat exchange surface 73. The first ceramic substrate 60 is arranged on the top of the heat exchange surface 71 on the first TEC assembly, and the heat exchange surface 71 on the first TEC assembly is used for absorbing heat generated by the laser chip 61 on the first ceramic substrate 60. The bottom of the heat exchange surface 71 on the first TEC assembly is connected with a first TEC assembly structure 72, the first TEC assembly structure 72 is fixed on the heat exchange surface 73 under the first TEC assembly, the first TEC assembly structure 72 is used for transferring the heat absorbed by the heat exchange surface 71 on the first TEC assembly to the heat exchange surface 73 under the first TEC assembly, and the heat exchange surface 73 under the first TEC assembly is fixed on the bottom plate 11, therefore, the heat carried by the heat exchange surface 73 under the first TEC assembly can be conducted out to the outside of the housing 1 by the bottom plate 11.

In this embodiment, the first TEC assembly 7 further includes a first electrode 74, and the first electrode 74 is used to supply power to the first TEC assembly 7, so as to achieve a heat dissipation effect. One end of the first electrode 74 is electrically connected to the first flexible circuit board 3, and the other end of the first electrode 74 is fixed to the first TEC assembly lower heat exchange surface 73. The first conductive metal layer 62 transmits a part of electric energy to the laser chip 61 to ensure the normal operation of the laser chip 61; the first flexible circuit board 3 transmits electrical energy to the first electrode 74 to ensure proper operation of the first TEC assembly 7 by the first electrode 74. In order for the first conductive metal layer 62 on the first ceramic substrate 60 to smoothly supply power to the first electrode 74, it is necessary that the height of the first electrode 74 is flush with the height of the first ceramic substrate 6.

It can be seen that, in the light emission cavity 101, the heat dissipation and leading-out path of the heat generated by the light emitting device is: the upper heat exchange surface 71 of the first TEC assembly absorbs heat generated by the laser chip 61 through the first ceramic substrate 60, and conducts the heat to the lower heat exchange surface 73 of the first TEC assembly through the first TEC assembly structural member 72, and then the lower heat exchange surface 73 of the first TEC assembly conducts the heat out through the bottom plate 11.

The first TEC assembly 7 guides heat generated by the laser chip 61 out of the housing 1 along the bottom plate 11, and also guides heat generated by the first TEC assembly 7 out of the bottom plate 11 through the heat dissipation guide path, so that the light emitting device 6 and the first TEC assembly 7 are both in a normal temperature environment, thermal crosstalk does not occur, and the effect of modulating an optical signal by the first TEC assembly 7 is not affected, thereby ensuring the performance of the light emitting device 6 and the first TEC assembly 7.

Fig. 17 is a schematic structural diagram of a light receiving cavity according to an embodiment of the present invention. When the light receiving chip 85 receives the light signal, the element that needs to filter the light signal with different wavelengths is the second filter 83, and then the second TEC assembly 9 controls the temperature of the second filter 83 to filter the light signal with different wavelengths.

For guaranteeing the coupling effect of light, when the second TEC assembly 9 realizes the heat dissipation of the absorbed heat during the refrigeration of the second filter 83, the second TEC assembly 9 can also be used to fix the second filter 83 to adjust the height of the second filter 83 in the optical path transmission, and ensure that the light incident axes of the optical devices in the light receiving cavity 102 can be overlapped, i.e. the light outlet of the optical path changing platform 81 corresponds to the light incident opening of the second filter 83, and the light outlet of the second filter 83 corresponds to the light incident opening of the reflection prism assembly 84, so as to improve the optical coupling effect of receiving the optical signals by light.

Specifically, in the light receiving cavity 102, as shown in fig. 17, since the second filter 83 is disposed vertically, that is, the second filter 83 is perpendicular to the bottom plate 11 of the housing 1 and perpendicular to the transmission path of the optical signal, the optical signal passes through the second filter 83. Therefore, in order to adjust the temperature of the second filter 83 for the second TEC assembly 9 and to screen the optical signals with different wavelengths by controlling the temperature, the second filter 83 needs to be disposed on the sidewall of the second TEC assembly 9, and further the second TEC assembly 9 needs to be disposed vertically, i.e. to stand on the side in the light receiving cavity 102 and to be perpendicular to the bottom plate 11.

Because second TEC subassembly 9 sets up between reflector 82 and second filter 83, that is to say, the light signal that reflector 82 reflects need first get into second filter 83 after second TEC subassembly 9, for avoiding second TEC subassembly 9 to produce the loss to the light signal, in this embodiment, be equipped with logical unthreaded hole on second TEC subassembly 9, it is relative with reflector 82's light-emitting direction to lead to the unthreaded hole, and second filter 83 is attached on leading to the unthreaded hole.

Specifically, referring to the schematic structural diagram of the second TEC assembly shown in fig. 18 and the schematic structural diagram of another angle of the second TEC assembly shown in fig. 19, to realize that the second filter 83 screens optical signals with different wavelengths by adjusting the temperature, the second TEC assembly 9 includes a second TEC assembly upper heat exchange surface 91, a second TEC assembly structural member 92 and a second TEC assembly lower heat exchange surface 96, which are respectively disposed on the sides, and the second TEC assembly 9 is disposed on a second TEC assembly base 93, that is, the second TEC assembly lower heat exchange surface 96 is disposed on the second TEC assembly base 93.

The lower heat exchanging surface 96 of the second TEC assembly and the second TEC assembly base 93 both need to be provided with a light through port, that is, a first light through port 95 is disposed on the second TEC assembly base 93, a second light through port 920 is disposed at a position corresponding to the lower heat exchanging surface 96 of the second TEC assembly, and a third light through port (not shown in the figure) is disposed at a position corresponding to the upper heat exchanging surface 91 of the second TEC assembly. When second filter 83 is fixed on heat exchange surface 91 on the second TEC subassembly, it is attached on third light passing opening to need to make second filter 83 for the light signal reflected by reflector plate 82 can get into second filter 83 after passing through three light passing openings on second TEC subassembly 9 in succession, and the second TEC subassembly 9 of being convenient for carries out the light signal of the different wavelength of temperature control screening to second filter 83.

Therefore, in the light receiving cavity 102, the propagation path of the optical signal is: the optical signal from the optical fiber adapter 2 is collimated by the focusing lens 80 and then transmitted to the first filter 88 to generate reflection, the reflected light enters the light receiving cavity 102 through the light port 51, the light emitted into the light receiving cavity 102 through the light port 51 is transmitted to the reflector 82 to be reflected, the reflected light enters the filter 83 through the first light port 95, the second light port 920 and the third light port of the second TEC assembly 9, so that the different wavelengths of the optical signal are screened, the screened optical signal enters the reflecting prism assembly 84, and the reflected light passing through the reflecting prism assembly 84 is emitted downwards to enter the light receiving chip 85.

In this embodiment, the second TEC assembly 9 adjusts the temperature of the second filter 83, and when the optical signals with different wavelengths are screened in the temperature control manner, the adopted heat dissipation path is led out from the side wall 12 of the housing 1.

Specifically, the outer side wall of the heat exchange surface 91 on the second TEC assembly is provided with the third filter 83, and the heat exchange surface 91 on the second TEC assembly is used for absorbing heat generated when the temperature of the third filter 83 is controlled. The inner side wall of the upper heat exchange surface 91 of the second TEC assembly is connected with the second TEC assembly structural member 92, the second TEC assembly structural member 92 is fixed on the lower heat exchange surface 96 of the second TEC assembly, and two ends of the second TEC assembly structural member 92 are respectively connected with the upper heat exchange surface 91 of the second TEC assembly and the lower heat exchange surface 96 of the second TEC assembly. The second TEC assembly lower heat exchanging surface 96 is fixed to a side wall of the second TEC assembly base 93, the second TEC assembly lower heat exchanging surface 96 is used for transferring heat absorbed by the second TEC assembly upper heat exchanging surface 91 to the second TEC assembly base 93, and one end of the second TEC assembly base 93 is connected to the side wall 12 of the housing 1, so that heat carried by the second TEC assembly base 93 can be conducted out of the outer side of the housing 1 by the side wall 12 of the housing 1.

It can be seen that, within the light receiving cavity 102, the heat dissipation exit path of the second TEC assembly 9 is: the heat exchange surface 91 on the second TEC assembly absorbs heat generated when the temperature of the third filter 83 is controlled, and transmits the heat to the heat exchange surface 96 under the second TEC assembly through the second TEC assembly structural member 92, and then transmits the heat to the second TEC assembly base 93 through the heat exchange surface 96 under the second TEC assembly, and the second TEC assembly base 93 transmits the heat out through the side wall 12 of the housing 1.

The second TEC assembly mount 93 is configured to carry a second TEC assembly lower heat exchange surface 96 to conduct heat transferred from the second TEC assembly lower heat exchange surface 96 to the side wall 12 of the housing 1. Because the light propagation path is horizontal direction and is on a parallel with lateral wall 12, the optical signal that the transmission was come needs to pass through third filter 83, consequently, need third filter 83 perpendicular to bottom plate 11 and lateral wall 12 setting simultaneously to attached on second TEC subassembly heat exchange surface 91, make on the second TEC subassembly heat exchange surface 91 also perpendicular with bottom plate 11 and lateral wall 12 simultaneously, be convenient for thermal transmission, second TEC subassembly base 93 need perpendicular to bottom plate 11 and lateral wall 12 simultaneously.

Within the light receiving cavity 102, heat exchange is effected by the side walls 12 of the housing, rather than the bottom plate 11 as employed in the light emitting cavity 101. The bottom plate 11 and the side wall 12 are perpendicular, so that the heat absorbed by the two heat exchange surfaces (the heat exchange surface 91 on the second TEC assembly and the heat exchange surface 71 on the first TEC assembly) is conducted through different surfaces of the housing 1, and the thermal crosstalk between the two cavities (the light emitting cavity 101 and the light receiving cavity 102) can be avoided.

For improving the heat removal effect, the second TEC assembly base 93 is Z-shaped, including: perpendicular to the heat receiving part 931 and the heat deriving part 932 of the base plate 11, respectively. The heat receiving portion 931 is configured to receive heat conducted by the lower heat exchanging surface 96 of the second TEC assembly, and the heat guiding portion 932 is configured to guide the heat received by the heat receiving portion 931 along the side wall 12, so as to increase a contact area between the base 93 of the second TEC assembly and the side wall 12, and improve heat dissipation efficiency.

The heat receiving portion 931 is attached to the lower heat exchanging surface 96 of the second TEC assembly, one end of the heat receiving portion 931 is vertically connected to the heat guiding portion 932, the heat guiding portion 932 is fixed to the side wall 12, and the heat guiding portion 932 is an extending portion of the second TEC assembly base 93 extending along the side wall 12. The heat transferred from the lower heat exchange surface 96 of the second TEC assembly can be absorbed by the heat receiving portion 931 and conducted to the outside of the housing 1 through the side wall 12 by the heat conducting portion 932. Since the heat receiving portion 931 is perpendicular to the side wall 12, the heat dissipating portion 932 is attached to the side wall 12, and the heat dissipating portion 932 can increase the heat dissipating area and improve the heat dissipating effect.

In order to enable the second TEC assembly 9 to work normally, in this embodiment, a power supply part 933 is provided at the other end of the second TEC assembly base 93. It can be seen that the extending portion of the second TEC assembly base 93 extending along the side wall 12 forms a heat derivation portion 932, and in order to avoid the power supply portion 933 from affecting the transmission of the optical signal, the power supply portion 933 is disposed on the side close to the heat shield 5, that is, the power supply portion 933 is formed at the portion of the second TEC assembly base 93 extending in the direction opposite to the side wall 12, and the heat derivation portion 932, the heat receiving portion 931, and the power supply portion 933 form a Z-shaped structure. The power supply part 933 is perpendicularly connected to the other end of the heat receiving part 931 and extends toward the second ceramic substrate 86, so that the second ceramic substrate 86 supplies power to the power supply part 933.

The portion of the second TEC assembly base 93 extending toward the side wall 12 is larger than the portion of the second TEC assembly base 93 extending in the opposite direction to the side wall 12, so that the area of the heat lead-out part 932 is larger than the area of the power supply part 933. Increasing the area of the heat discharging part 932 can increase the contact area of the heat discharging part 932 with the side wall 12 to improve the heat dissipation efficiency. The power supply part 933 is used to supply power to the second TEC assembly 9, and therefore the size of the power supply part 933 may be sufficient to satisfy the electrical conduction requirement.

In order to enable the second TEC assembly 9 to work normally, in this embodiment, a component for supplying power is disposed on the second TEC assembly base 93. That is, one end of the second TEC assembly 9 is provided with the power supply block 94, specifically, the power supply part 933 is provided on the second TEC assembly base 93, and the power supply part 933 is vertically connected to the other end of the heat receiving part 931. In order to prevent the power feeding portion 933 from affecting transmission of the optical signal, the power feeding portion 933 is disposed on a side close to the heat insulating board 5.

A third conductive metal layer is disposed on the power supply block 94, and is coated on the sidewall 941 and the upper surface 942 of the power supply block 94. The power supply block 94 supplies power to the light receiving device through the second flexible circuit board 4, that is, the second conductive metal layer 87 is connected to the conductive metal layer on the sidewall 941 of the power supply block 94, the conductive metal layer on the sidewall 941 is connected to the conductive metal layer on the upper surface 942 of the power supply block 94, and the conductive metal layer on the upper surface 942 is connected to the heat exchanging surface 91 on the second TEC assembly, so that the second flexible circuit board 4 supplies power to the heat exchanging surface 91 on the second TEC assembly through the second conductive metal layer 87 and the third conductive metal layer, respectively, to ensure the normal operation of the second TEC assembly 9.

It can be seen that, when heat dissipation is implemented in the light-receiving cavity 102, the heat dissipation path of the light-receiving device 8 in the light-receiving cavity 102 is different from the heat dissipation path of the light-emitting device 6 in the light-emitting cavity 101, the heat dissipation path of the light-emitting device 6 is led out from the bottom plate 11 of the housing 1, and the heat dissipation path of the light-receiving device 8 is led out from the side wall 12 of the housing 1. The two cavities adopt different heat dissipation leading-out paths for heat dissipation, so that the heat dissipation effect of the two cavities can be ensured, the mutual influence of the heat dissipated by the two cavities due to the same heat dissipation leading-out path is avoided, and the heat dissipation efficiency is reduced.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. A light module, comprising: the optical fiber adapter comprises a shell and an optical fiber adapter positioned at one end of the shell;

the shell comprises a laser chip, a first filter, a boss, a light path changing platform, a reflector, a second filter, a reflecting prism component and a light receiving chip;

the boss comprises a first through hole and a first inclined plane, a light inlet of the first through hole faces the laser chip, a light outlet of the first through hole faces the optical fiber adapter and is positioned on the first inclined plane, and the first filter is arranged on the first inclined plane and covers the first through hole;

the optical signal emitted by the laser chip enters the optical fiber adapter through the first through hole and the first filter plate and then is emitted out, and the first filter plate is used for screening the optical signal emitted by the laser chip, passing the optical signal meeting the specific wavelength and filtering the optical signal not meeting the specific wavelength;

a light changing path and a second through hole penetrating through the left surface and the right surface are arranged in the light path changing platform, a light inlet of the light changing path corresponds to the first through hole, the second through hole is communicated with the light changing path, a second inclined plane is formed on the left surface, and the reflector plate is arranged on the second inclined plane and attached to the second through hole;

the optical signal from the optical fiber adapter enters a light-changing path from a light inlet of the light-changing path after being reflected by the first filter plate, and is emitted to the reflector plate attached to the second inclined plane at the left side of the second through hole, and the optical signal reflected by the reflector plate passes through the second through hole, is emitted to the second filter plate from a light-changing path light outlet at the right surface, and is emitted to the reflecting prism assembly through the second filter plate, and the second filter plate is used for screening the optical signal from the optical fiber adapter, passing the optical signal meeting the specific wavelength and filtering the optical signal not meeting the specific wavelength;

the light signal from the second filter plate is emitted into the reflection prism assembly through the light inlet surface, is transmitted to the reflection inclined surface and is emitted to the light outlet bottom surface after being reflected so as to be received by the light receiving chip below the light outlet bottom surface, and the transmission direction of the light signal passing through the light outlet bottom surface forms a non-vertical angle with the photosensitive surface of the light receiving chip.

2. The optical module as claimed in claim 1, wherein the light exit bottom surface of the reflecting prism assembly is provided with a second converging lens to receive the light reflected from the reflecting slope; the light receiving chip is positioned below the second converging lens to receive the converging light of the second converging lens.

3. The optical module of claim 1, wherein the light incident surface of the reflecting prism assembly is inclined in a direction from bottom to top, the inclination direction is the same as the propagation direction of the optical signal, and the angle between the light incident surface and the propagation path of the optical signal is an acute angle or an obtuse angle.

4. The optical module of claim 1, wherein the reflective slope is inclined in a direction from a bottom end to a top end, the direction of the inclination is opposite to a propagation direction of an optical signal, and the reflective slope is connected to the light-emitting bottom surface at an acute angle.

5. The optical module of claim 1, further comprising a converging lens, an optical isolator, and an optical platform within the housing; the optical isolator is arranged on the optical platform, and the converging lens is arranged between the laser chip and the optical isolator; the optical signal sent by the laser chip sequentially penetrates through the convergent lens, the optical isolator and the first filter, enters the optical fiber adapter and then is emitted.

6. The optical module of claim 5, wherein a rear surface of the optical platform forms a first slope, the first filter being disposed on the first slope.

7. The optical module of claim 1, further comprising a focusing lens disposed between the first filter and the fiber optic adapter, wherein the optical signal from the fiber optic adapter propagates through the focusing lens onto the first filter and is reflected toward the reflector.

8. The optical module according to claim 1, further comprising a light path changing platform in the housing, wherein a light-changing path is disposed in the light path changing platform, and a light inlet of the light-changing path faces the first filter; the light path changing platform is provided with a light path changing platform, one side of the light path changing platform is provided with the inclined reflector plate, and the light signal reflected by the first filter plate is transmitted to the reflector plate through the light changing path to be reflected again and then is emitted to the second filter plate.