CN212543788U

CN212543788U - Optical module

Info

Publication number: CN212543788U
Application number: CN202021160289.0U
Authority: CN
Inventors: 闫洪平
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-06-19
Filing date: 2020-06-19
Publication date: 2021-02-12
Anticipated expiration: 2030-06-19

Abstract

The application provides an optical module, which divides an optical signal transmitted by an optical fiber into a plurality of paths of sub-optical signals by utilizing a demultiplexing component, and each path of sub-optical signal only contains one optical wavelength. Meanwhile, according to the number of paths of the sub optical signals output by the demultiplexing component, a corresponding number of optical receiving chips are arranged; in addition, a power supply circuit of the optical receiving chip is configured to select one optical receiving chip to supply power based on the received enable signal, so that the powered optical receiving chip converts a path of target sub-optical signal into an electrical signal, wherein the optical wavelength included in the target sub-optical signal is the target receiving wavelength indicated by the enable signal. The power supply circuit is switched to different light receiving chips for supplying power, so that the target wavelength received by the optical module is selected, and tuning response time can be further shortened; in addition, because the demultiplexing component fixedly outputs multiple paths of sub-optical signals, power supply and heating are not needed, and the power consumption can be greatly reduced.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the increase of communication demand, the Optical fiber access technology is rapidly developed, and among them, the Optical fiber access technology mainly based on Passive Optical Network (PON) technology has been widely applied in various forms around the world.

At present, PON technologies mainly fall into two main categories: a passive optical network based on a time division multiplexing technology (TDM-PON) and a passive optical network based on a wavelength division multiplexing technology (WDM-PON). The passive optical network based on the wavelength division multiplexing technology takes the wavelength as the identification of a user end (ONU), adopts the wavelength division multiplexing technology to realize the access of different user terminal links, can provide wider working bandwidth for each user, and realizes the real symmetrical broadband access; meanwhile, the introduction of the WDM technology can also avoid a plurality of technical difficulties of distance measurement, rapid bit synchronization and the like of a user end in the time division multiple access technology, and has obvious advantages in the aspects of network management and system upgrading performance.

For WDM-PON, in order to facilitate the construction and maintenance of the system, the user side needs to adopt colorless ONUs, that is, the OUN side needs Tunable transmission (Tunable transceiver) and Tunable reception (Tunable filter), for example, an ONU of NG-PON2(Next Generation Passive Optical Network 2) needs to realize Tunable reception of four wavelengths.

In order to realize the adjustability of the receiving wavelength, a scheme that is commonly adopted at present is to control the temperature of a tunable filter by using a TEC (Thermoelectric Cooler) to select the received wavelength. However, in the above-described method, since a certain time is required for the temperature change of the tunable filter, there is a problem that the tuning time is long, and further, since power needs to be continuously supplied to the TEC, the above-described method has a problem that power consumption is large.

SUMMERY OF THE UTILITY MODEL

In view of the foregoing problems, embodiments of the present application provide an optical module.

The optical module provided by the embodiment of the application mainly comprises:

a circuit board;

a light receiving part electrically connected to the circuit board for receiving a light signal;

the light-receiving portion includes:

the optical fiber is used for transmitting the optical signal received by the optical fiber to the demultiplexing component;

the demultiplexing component is connected to the optical fiber and configured to divide the optical signal into a corresponding number of sub optical signals according to the number of optical wavelengths included in the optical signal, where each sub optical signal includes only one optical wavelength.

The light receiving chips are respectively arranged at the light outlets of the demultiplexing component, and the number of the light receiving chips is the same as the number of paths of the sub optical signals;

and the power supply circuit is respectively electrically connected with each light receiving chip and is used for selecting one light receiving chip to supply power based on the received enable signal so that the powered light receiving chip converts a path of target sub-optical signal into an electric signal, wherein the enable signal is used for indicating a target receiving wavelength, and the optical wavelength contained in the target sub-optical signal is the same as the target receiving wavelength.

The optical module provided by the embodiment of the application is based on the characteristic that the ONU only analyzes the optical signal with one wavelength at the same time, and divides the optical signal transmitted by the optical fiber into multiple paths of sub-optical signals by using the demultiplexing component, and each path of sub-optical signal only contains one optical wavelength. Meanwhile, according to the number of paths of the sub optical signals output by the demultiplexing component, a corresponding number of optical receiving chips are arranged, namely the optical receiving chips and the sub optical signals are arranged in a one-to-one correspondence manner; in addition, a power supply circuit of the optical receiving chip is configured to select one optical receiving chip to supply power based on the received enable signal, so that the powered optical receiving chip converts a path of target sub-optical signal into an electrical signal, wherein the optical wavelength included in the target sub-optical signal is the target receiving wavelength indicated by the enable signal. According to the embodiment of the application, the power supply circuit is switched to different light receiving chips for power supply, so that the target wavelength received by the optical module is selected, the tuning time can be increased from the ms magnitude to the us magnitude or even the ns magnitude based on the response speed of the current electronic element, and the tuning response time can be further shortened; in addition, because the demultiplexing component fixedly outputs multiple paths of sub-optical signals, power supply and heating are not needed, and the power consumption can be greatly reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present application;

fig. 5 is a schematic diagram of a circuit board and a light receiving portion in an optical module provided in an embodiment of the present application;

fig. 6 is a block diagram illustrating a structure of a first light receiving portion according to an embodiment of the present application;

fig. 7 is a block diagram illustrating a second light receiving section according to an embodiment of the present application;

fig. 8 is a block diagram illustrating a third light receiving section according to an embodiment of the present application;

fig. 9 is a block diagram of a fourth light receiving portion according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the optical module realizes optical connection with external optical fibers through an optical interface, the external optical fibers are connected in various ways, and various optical fiber connector types are derived; the method is characterized in that the electric connection is realized by using a golden finger at an electric interface, which becomes the mainstream connection mode of the optical module industry, and on the basis, the definition of pins on the golden finger forms various industry protocols/specifications; the optical connection mode realized by adopting the optical interface and the optical fiber connector becomes the mainstream connection mode of the optical module industry, on the basis, the optical fiber connector also forms various industry standards, such as an LC interface, an SC interface, an MPO interface and the like, the optical interface of the optical module also makes adaptive structural design aiming at the optical fiber connector, and the optical fiber adapters arranged at the optical interface are various.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical interface of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and establishes a bidirectional electrical signal connection with the optical network terminal 100; bidirectional interconversion of optical signals and electric signals is realized inside the optical module, so that information connection is established between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber 101.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used for accessing the network cable 103 and establishing a bidirectional electrical signal connection (generally, an electrical signal of an ethernet protocol, which is different from an electrical signal used by an optical module in protocol/type) with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is an upper computer of the optical module, provides data signals for the optical module and receives the data signals from the optical module, and a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network terminal and a network cable.

Common local information processing apparatuses include routers, home switches, electronic computers, and the like; common optical network terminals include an optical network unit ONU, an optical line terminal OLT, a data center server, a data center switch, and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and used for accessing an electrical interface (such as a gold finger) of the optical module; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module structure provided in the embodiment of the present application, and fig. 4 is an exploded schematic diagram of the optical module provided in the embodiment of the present application. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a light emitting portion 400, and a light receiving portion 500;

the upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical interface 204, and a gold finger of the circuit board extends out of the electrical interface 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical interface 205 where a fiber optic adapter inside the optical module is located for connection with an external fiber optic connector (external fiber); the circuit board 300, the lens assembly, the optical fiber array, the optical fiber adapter and other photoelectric devices are positioned in the wrapping cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the lens assembly, the optical fiber array, the optical fiber adapter and other devices can be conveniently installed in the shell, and the upper shell and the lower shell form the outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, and the integrated housing is not beneficial to the assembly of devices in the housing.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

As shown in fig. 4, the light emitting portion 400 in the embodiment of the present application is located at the edge of the circuit board 300, and the light emitting portion 400 and the light receiving portion 500 are arranged in a staggered manner on the surface of the circuit board 300, which is beneficial to achieve better electromagnetic shielding effect.

The light emitting part 400 is disposed on the surface of the circuit board 300, and in another common packaging manner, the light emitting part is physically separated from the circuit board and is electrically connected through a flexible board. In the embodiment of the present application, the light emitting portion 400 is connected to the fiber receptacle 601 through the optical fiber 401.

The light emitting part is positioned in a packaging cavity formed by the upper shell and the lower shell, and as shown in fig. 4, the circuit board 300 is provided with a notch 301 for placing the light emitting part; the notch 301 may be disposed in the middle of the circuit board, or may be disposed at the edge of the circuit board; the light emitting portion is disposed in the notch 301 of the circuit board by insertion so that the circuit board can be inserted into the light emitting portion, and the light emitting portion and the circuit board can be fixed together.

The light receiving part 500 is disposed on a surface of the circuit board 300, and in another common packaging manner, the light receiving part is physically separated from the circuit board and is electrically connected through a flexible board. In the embodiment of the present application, the light receiving part 500 is connected to the optical fiber receptacle 602 through the optical fiber 501. An optical signal outside the optical module is transmitted to the optical fiber receptacle 602 through an external optical fiber, transmitted to the optical fiber 501, and then transmitted to the light receiving part 500 through the optical fiber 501, and the light receiving part 500 converts the received optical signal into a current signal. Further, the light receiving part 500 includes an optical device and an electrical device. Among them, optical devices such as optical fiber splices, arrayed waveguide gratings, etc. The optical fiber 501 transmits an optical signal to the optical device, then converts the optical device into an optical signal beam transmission path, and finally transmits the optical signal beam to the photoelectric conversion device.

Further, in order to realize the tunability of the wavelength received by the light receiving part 500, the embodiment of the present application also designs the light receiving part 500. Fig. 5 is a schematic diagram of a circuit board and a light receiving portion in an optical module according to an embodiment of the present application, and fig. 6 is a block diagram of a first light receiving portion according to an embodiment of the present application. As shown in fig. 5 and 6, the light receiving section in the embodiment of the present application mainly includes an optical fiber 501, a demultiplexing section 502, a light receiving chip 503, a transimpedance amplification chip 504, a clip amplification chip 505, and a power supply circuit 506.

Wherein the optical fiber 501 transmits the optical signal it receives to the demultiplexing component 502 connected thereto. The demultiplexing section 502 divides the optical signal into a corresponding number of sub optical signals according to the number of optical wavelengths included in the optical signal, and each sub optical signal includes only one optical wavelength. For example, the optical signal transmitted by the optical fiber 501 includes optical signals of 4 optical wavelengths (e.g., 1596.3nm, 1597.19nm, 1598.04nm, 1598.89nm, respectively), and the demultiplexing unit 502 divides the optical signals into 4 paths of sub-optical signals according to the wavelengths, and each path of sub-optical signal includes only one optical wavelength, i.e., 1596.3nm, 1597.19nm, 1598.04nm, and 1598.89nm, respectively. In the present embodiment, in order to distinguish between an optical signal including multiple wavelengths transmitted by the optical fiber 501 and an optical signal including a single wavelength output from the demultiplexing unit 502, the optical signal output from the demultiplexing unit 502 is referred to as a sub optical signal.

The demultiplexing component 502 in this embodiment adopts an arrayed waveguide grating to realize its light splitting function, and one end of the arrayed waveguide grating is provided with an optical fiber connector and the other end is provided with an inclined plane. The optical fiber connector is connected to the optical fiber 501, and transmits light transmitted from the optical fiber 501 to the arrayed waveguide grating, and the light is split by the arrayed waveguide grating and transmitted to the inclined surface thereof, and then reflected by the inclined surface to the light receiving chip 503. Therefore, the arrayed waveguide grating in the embodiment of the present application can not only perform signal light splitting but also change the transmission direction of the signal light.

Of course, the demultiplexing component 502 is not limited to the arrayed waveguide grating, and may also be a combination of a splitting component and a filter, for example. The optical splitting component is connected to the optical fiber 501, and it should be noted that the connection described in this embodiment is not limited to a physical connection, and may also be an optical connection, and the optical splitting component splits the optical signal into the corresponding number of optical beams according to the number of optical wavelengths included in the optical signal transmitted by the optical fiber 501; an optical filter is arranged at the light outlet of each path of light beam of the light splitting component, and each path of sub-optical signal is filtered from the received light beam by the optical filter, wherein each path of sub-optical signal only contains one optical wavelength.

The light receiving chips 503 are disposed at the light exit of the demultiplexing component 502, and the number of the light exit is the same as the number of paths of the sub optical signals output by the demultiplexing component 502, for example, as shown in fig. 6, in this embodiment, the demultiplexing component 502 divides the optical signal transmitted by the optical fiber 501 into 4 paths of sub optical signals, four light receiving chips are correspondingly disposed, in this embodiment, the four light receiving chips are respectively named as a first light receiving chip 5031, a second light receiving chip 5032, a third light receiving chip 5033 and a fourth light receiving chip 5034, and each light receiving chip is configured to receive one path of sub optical signals.

In this embodiment, the light receiving chip 503 is attached to the circuit board 300, but other packaging methods can be adopted in other embodiments, for example, the light receiving chip 503 is disposed on the circuit board 300 through a metalized pad, the light receiving chip 503 is packaged in a metal shell, and the like.

The power supply circuit 506 is electrically connected to each optical receiving chip, and the power supply circuit 506 selects one optical receiving chip to supply power based on the received enable signal, so that the powered optical receiving chip converts one path of target sub optical signal into an electrical signal. For example, the enable signal received by the power supply circuit 506 indicates that the optical signal with the 1596.3nm wavelength is received, that is, the target wavelength of the optical module received signal is 1596.3nm, and then the power supply circuit 506 selects to supply power to the first optical receiving chip 5031 corresponding to the sub optical signal with 1596.3nm output by the demultiplexing component 502, since the optical receiving chip can normally operate only in the case of supplying power, the first optical receiving chip 5031 can convert the optical signal with the 1596.3nm wavelength into an electrical signal, and other optical receiving chips do not operate, and further the optical signals with other wavelengths are not converted. Therefore, the power supply circuit 506 can be switched to supply power to different optical receiving chips, so that the wavelength received by the optical module can be tuned.

When the photoelectric avalanche diode is selected as the light receiving chip, the working voltage of the photoelectric avalanche diode is higher than the normal working voltage of the optical module, so that a booster circuit is added in the optical module, and the booster circuit is used for providing working high voltage for the photoelectric avalanche diode. Accordingly, as shown in fig. 6, the power supply circuit 506 includes a voltage boosting circuit 5061 and a switching circuit 5062, wherein an enable pin of the switching circuit 5062 is electrically connected to the microprocessor 507, an input pin is electrically connected to an output pin of the voltage boosting circuit 5061, and the output pins are electrically connected to the respective avalanche diodes, for selecting the voltage boosting circuit to supply power to one avalanche diode based on an enable signal from the microprocessor 507.

The boost circuit 5061 may be disposed in the transimpedance amplifier chip 504 or on the circuit board 300, and may be in the form of a chip, a circuit, or a combination of a main chip and a peripheral circuit. In addition, as for the generation mode of the enable signal, the optical module and the upper computer communicate in the mode of I2C, the upper computer sends the wavelength information to be analyzed by the optical module to the microprocessor 507, the microprocessor 507 analyzes the information and sends the enable signal to the switching circuit 5062, and of course, in other embodiments, the signal transmitted by the upper computer may not be analyzed by the microprocessor 507, that is, the signal is directly transmitted to the power supply circuit 506 through a golden finger, or may be sent by other enable signal generation modules in the optical module.

Further, since the optical module at the ONU side only selects one optical wavelength signal for analysis when operating, that is, only one optical receiver chip operates at the same time, in this embodiment, one transimpedance amplifier chip 504 is provided, and the output end of each optical receiver chip is connected to the transimpedance amplifier chip 504, but in other embodiments, a plurality of optical receiver chips may be provided.

Based on the above-mentioned packaging manner in which the light receiving chip 503 is disposed on the circuit board 300, the top surface of the transimpedance amplifier chip 504 in this embodiment is provided with a plurality of pins, and the light receiving chip 503 and the transimpedance amplifier chip 504 are connected by wire bonding. In the embodiment of the present application, the connection may be through a semiconductor Wire Bonding Wire (Gold Wire Bonding). However, when the length of the wire bonding is longer, the inductance generated by the wire bonding is larger, the signal mismatching is also larger, and the signal output by the light receiving chip 503 is a small signal, which further causes the signal quality to be reduced, so that the light receiving chip 503 and the transimpedance amplifier chip 504 are as close as possible, the length of the wire bonding is reduced, and the signal transmission quality is ensured. The photocurrent signal output by the light receiving chip 503 enters the transimpedance amplification chip 504, is amplified and converted into a voltage signal, and the voltage signal is output from the transimpedance amplification chip 504, wherein the voltage signal is preferably output in a differential manner.

The amplitude limiting amplifier chip 505 is disposed on the circuit board 300, and the amplitude limiting amplifier chip 505 and the transimpedance amplifier chip 504 may be connected by wire bonding, and are configured to receive an optical voltage signal. The amplitude limiting amplifier chip 505 further amplifies the optical voltage signal and limits the amplified optical voltage signal to a set output differential amplitude.

Fig. 7 is a block diagram of a second light receiving section according to an embodiment of the present application. As shown in fig. 7, the main difference between the present embodiment and the foregoing embodiment is that a filter 508 is further disposed between the optical fiber 501 and the demultiplexing component 502, and stray light in the optical signal is filtered by the filter 508, in the present embodiment, light with a wavelength that is not used for transmitting signals in the optical signal is referred to as stray light, for example, the optical signal transmitted by the optical fiber 501 has optical signals of 1596.3nm, 1597.19nm, 1598.04nm, and 1598.89nm, and stray light outside 1596.3nm, 1597.19nm, 1598.04nm, and 1598.89 bands is filtered by the filter 508, so as to improve purity of the optical signal entering the demultiplexing component 502, and further improve isolation between optical signals output by the demultiplexing component 502.

In the embodiment, the power supply circuit is switched to supply power to different light receiving chips to select the target wavelength received by the optical module, and the tuning time can be increased from the ms magnitude to the us magnitude or even the ns magnitude based on the response speed of the current electronic element, so that the tuning response time can be shortened; in addition, because the demultiplexing component fixedly outputs multiple paths of sub-optical signals, power supply and heating are not needed, and the power consumption can be greatly reduced.

Fig. 8 is a block diagram of a third light receiving portion according to an embodiment of the present application. As shown in fig. 8, the main difference between this embodiment and the first embodiment is that a transimpedance amplifier chip is provided at the output terminal of each light-receiving chip in this embodiment.

That is, the output terminal of the first light receiving chip 5031 is connected to the first transimpedance amplifier chip 5041, the output terminal of the second light receiving chip 5032 is connected to the second transimpedance amplifier chip 5042, the output terminal of the third light receiving chip 5033 is connected to the third transimpedance amplifier chip 5043, and the output terminal of the fourth light receiving chip 5034 is connected to the fourth transimpedance amplifier chip 5044.

The enable pin of the switching circuit 508 can be electrically connected with the microprocessor to receive an enable signal, for the generation mode of the enable signal, the optical module and the upper computer communicate in an I2C mode, the upper computer sends the wavelength information to be analyzed of the optical module to the microprocessor, and the microprocessor analyzes the information and sends the enable signal to the switching circuit 508; in addition, the switching circuit 508 may also be directly electrically connected to the gold finger, or connected to another enable signal output module inside another optical module, or the switching circuit 508 itself may directly output a control signal based on the wavelength information to be analyzed by the optical module. In addition, the switching circuit 508 may also be directly disposed in the corresponding transimpedance amplification chip.

An output pin of the switching circuit 508 is electrically connected to each transimpedance amplifier chip, and the switching circuit 508 selects one transimpedance amplifier chip to operate based on an enable signal received by the transimpedance amplifier chip, so that a current signal output by the light receiving chip can be converted into a voltage signal and then output to the amplitude limiting amplifier chip 505, thereby tuning the wavelength received by the optical module.

Of course, in addition to the plurality of transimpedance amplifier chips, tuning of the wavelength received by the optical module is realized by enabling the transimpedance amplifier chips, or one transimpedance amplifier chip may be provided, and tuning of the wavelength received by the optical module is realized by setting the switching circuit 508 between each of the photoreceiving chips and the transimpedance amplifier chip in a manner of selecting the current output by one of the photoreceiving chips to be supplied to the transimpedance amplifier chip.

Fig. 9 is a block diagram of a fourth light receiving portion according to an embodiment of the present application. As shown in fig. 9, the main difference between this embodiment and the third embodiment is that in this embodiment, a clipping amplifier chip is provided at the output end of each transimpedance amplifier chip.

That is, the output terminal of the first transimpedance amplifier chip 5041 is connected to the first slice amplifier chip 5051, the output terminal of the second transimpedance amplifier chip 5042 is connected to the second slice amplifier chip 5052, the output terminal of the third transimpedance amplifier chip 5043 is connected to the third slice amplifier chip 5053, and the output terminal of the fourth transimpedance amplifier chip 5044 is connected to the fourth slice amplifier chip 5054.

An output pin of the switching circuit 508 is electrically connected to each amplitude limiting amplifier chip, and the switching circuit 508 selects one amplitude limiting amplifier chip to operate based on the received enable signal, so that the signal output by the amplitude limiting amplifier chip is output through a gold finger, and tuning of the wavelength received by the optical module is further achieved.

Of course, in addition to setting a plurality of amplitude limiting amplification chips, tuning of the wavelength received by the optical module is realized by enabling the amplitude limiting amplification chips, and also by setting a switching circuit 508 between each transimpedance amplification chip and the amplitude limiting amplification chip, tuning of the wavelength received by the optical module is realized in a manner of selecting a signal output by one transimpedance amplification chip to the amplitude limiting amplification chip. Or, the output pin of the switching circuit 508 may be connected to the output end of each amplitude limiting amplifier chip, so as to select a signal output by one amplitude limiting amplifier chip to be output through a gold finger, thereby tuning the wavelength received by the optical module.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A light module, comprising:

a circuit board;

the light-receiving portion includes:

the demultiplexing component is connected with the optical fiber and is used for dividing the optical signal into corresponding paths of sub optical signals according to the number of optical wavelengths contained in the optical signal, wherein each path of sub optical signal only contains one optical wavelength;

2. The optical module according to claim 1, wherein the light receiving part further comprises:

and the filter plate is arranged between the optical fiber and the demultiplexing component and is used for filtering stray light in the optical signal.

3. The optical module according to claim 1, wherein the light receiving chip is an avalanche diode, and the power supply circuit includes a switching circuit and a voltage boosting circuit, wherein:

an enabling pin of the switching circuit is electrically connected with a microprocessor in the optical module, an input pin of the switching circuit is electrically connected with an output pin of the boosting circuit, and an output pin of the switching circuit is electrically connected with each avalanche diode respectively, so that the boosting circuit is selected to supply power to one avalanche diode based on the enabling signal from the microprocessor.

4. An optical module as claimed in claim 1, characterized in that the demultiplexing component is an arrayed waveguide grating.

5. The optical module of claim 1, wherein the optical signal comprises 4 optical wavelengths, and the demultiplexing component is configured to split the optical signal into 4 sub-optical signals.

6. The optical module according to claim 1, wherein the light receiving part further comprises:

the transimpedance amplification chip is arranged on the circuit board, is electrically connected with each light receiving chip and is used for converting the current signal output by each light receiving chip into a voltage signal;

and the amplitude limiting amplification chip is arranged on the circuit board, is electrically connected with the transimpedance amplification chip and is used for carrying out amplitude adjustment on the voltage signal.

7. The optical module of claim 1, wherein the light receiving chip is disposed on the circuit board and electrically connected to the circuit board by wire bonding.