CN211603626U

CN211603626U - Optical module

Info

Publication number: CN211603626U
Application number: CN202020576456.3U
Authority: CN
Inventors: 郑龙; 杨思更
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-09-29
Anticipated expiration: 2030-04-17

Abstract

The utility model discloses an optical module, including last casing, lower casing, go up casing and lower casing body formation parcel cavity. A circuit board is arranged in the wrapping cavity, and the distance between the circuit board and the lower shell is smaller than the distance between the circuit board and the upper shell. The upper surface of the circuit board is connected with one end of the heat conducting piece, and the other end of the heat conducting piece is connected with the upper shell. An IC chip and a lens assembly covering the IC chip are arranged on the lower surface of the circuit board. And the IC chip is used for generating optical signals. The lens assembly is used for changing the propagation direction of the optical signal. Because the IC chip is arranged on the lower surface of the circuit board, and the heat conducting piece is connected with the upper surface of the circuit board and the upper shell, heat generated when the IC chip operates is transmitted to the upper shell through the circuit board and the heat conducting piece in sequence. Because the distance between the upper shell and the radiator is smaller than the distance between the upper shell and the radiator, when heat is transmitted to the upper shell, air flow sent by the radiator can quickly dissipate the heat, and the heat dissipation efficiency is effectively improved.

Description

Optical module

Technical Field

The utility model relates to an optical fiber communication technical field especially relates to an optical module.

Background

The optical communication technology can be used in novel business and application modes such as cloud computing, mobile internet, video and the like, and the optical module is a key device in optical communication equipment. The speed and power consumption of the optical module are also higher and higher, and the heat dissipation design of the optical module becomes very important.

In a conventional optical module, a lens assembly on an upper surface of a circuit board is covered over an IC chip (integrated circuit), and a lower surface of the circuit board is connected to a lower housing through a thermal conductive adhesive. When the traditional optical module radiates, heat is transmitted to the lower shell through the circuit board and the heat conducting glue in sequence.

Because the upper computer is provided with the cage, the cage is provided with the radiator. And because the distance between the radiator and the upper shell is smaller than the distance between the radiator and the lower shell, when the optical module is inserted into the cage, the airflow emitted by the radiator firstly enters the upper shell. Therefore, when the optical module dissipates heat through the lower case, the heat dissipation efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model provides an optical module has improved the radiating efficiency.

A light module, comprising:

an upper housing;

the lower shell is matched with the upper shell to form a wrapping cavity;

the circuit board is arranged in the packaging cavity, and the distance between the circuit board and the lower shell is smaller than the distance between the circuit board and the upper shell;

one end of the heat conducting piece is connected with the upper shell, and the other end of the heat conducting piece is connected with the upper surface of the circuit board and used for conducting heat;

the IC chip is arranged on the lower surface of the circuit board and used for generating optical signals and generating heat during operation;

and the lens assembly is arranged on the lower surface of the circuit board, covers the IC chip and is used for changing the propagation direction of the optical signal.

Has the advantages that: the utility model provides an optical module, including last casing, lower casing, go up casing and lower casing body formation parcel cavity. A circuit board is arranged in the wrapping cavity, and the distance between the circuit board and the lower shell is smaller than the distance between the circuit board and the upper shell. The upper surface of the circuit board is connected with one end of the heat conducting piece, and the other end of the heat conducting piece is connected with the upper shell. An IC chip and a lens assembly covering the IC chip are arranged on the lower surface of the circuit board. And the IC chip is used for generating optical signals and generating heat during operation. The lens assembly is used for changing the propagation direction of the optical signal. Because the IC chip is arranged on the lower surface of the circuit board, and the heat conducting piece is connected with the upper surface of the circuit board and the upper shell, heat generated when the IC chip operates is transmitted to the upper shell through the circuit board and the heat conducting piece in sequence. Because the distance between the upper shell and the radiator is smaller than the distance between the upper shell and the radiator, when heat is transmitted to the upper shell, air flow sent by the radiator can quickly dissipate the heat, and the heat dissipation efficiency is effectively improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;

fig. 4 is an exploded view of an optical module according to an embodiment of the present invention;

fig. 5 is a schematic side view of the inside of the wrapping cavity according to an embodiment of the present invention;

fig. 6 is a schematic partial structural diagram of an optical module having two lens assemblies according to an embodiment of the present invention;

fig. 7 is a schematic diagram of a first partial structure of an optical module having four lens assemblies according to an embodiment of the present invention;

fig. 8 is a schematic diagram of a second partial structure of an optical module having four lens assemblies according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of a third part of an optical module having four lens assemblies according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

In the following, some embodiments of the present invention will be described in detail with reference to the accompanying drawings, and features in the following examples and embodiments may be combined with each other without conflict.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, an optical module 200 provided by an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a lens assembly 400, an optical fiber array 500, and an optical fiber receptacle 600.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the lens assembly 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the lens assembly 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the lens assembly 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with a light emitting chip, a driving chip, a light receiving chip, a transimpedance amplifier chip, an amplitude limiting amplifier chip, and a microprocessor chip, wherein the light emitting chip and the light receiving chip are directly attached to the circuit board of the optical module, and such a configuration is referred to as cob (chip on board) package in the industry.

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; when the lens component and the corresponding optical chip are positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; flexible circuit boards are commonly used in conjunction with rigid circuit boards.

The lens assembly 400 is disposed on the lower surface of the circuit board 300, and covers the optical chips (the optical chips mainly include light emitting chips, driving chips, light receiving chips, transimpedance amplification chips, amplitude limiting amplification chips, and other chips related to the photoelectric conversion function), and the lens assembly 400 and the circuit board 300 form a cavity for wrapping the light emitting chips, the light receiving chips, and other optical chips. Light emitted by the light emitting chip is reflected by the lens assembly 400 and enters the optical fiber, light from the optical fiber is reflected by the lens assembly and enters the light receiving chip, and the lens assembly establishes mutual optical connection among the light emitting chip, the optical power monitoring chip and the optical fiber array. The lens assembly not only serves to seal the optical chip, but also to establish optical connection between the optical chip and the optical fiber.

Optical fiber array 500 has one end in optical connection with lens assembly 400 and the other end in optical connection with fiber receptacle 600. The optical fiber array is composed of a plurality of optical fibers, transmits light from the lens assembly to the optical fiber socket to send out optical signals to the outside, transmits the light from the optical fiber socket to the lens assembly, and receives the optical signals from the outside of the optical module. The optical fiber array and the lens component have good optical coupling design, the multi-path converged light from the lens component enters the multi-path optical fibers of the optical fiber array, and the optical structure of the lens component is utilized to realize optical connection with the light emission chip; multiple paths of light from the optical fiber array are incident into the lens assembly, and optical connection with the light receiving chip is realized by the optical structure of the lens assembly.

The optical fiber receptacle 600 is a connector for connecting the optical module to an optical fiber outside the optical module. Fiber optic receptacles are generally of a standard shape and size to facilitate insertion of an external fiber optic plug, and have a plurality of fiber optic interfaces therein, including an optical signal outlet interface and an optical signal inlet interface. A common fiber optic plug is an MT plug (e.g., MPO (Multi-fiber Push On) fiber optic jumper connector). The optical fiber plug is inserted into the optical fiber socket of the optical module, so that optical signals inside the optical module can be transmitted into the external optical fiber, and optical signals outside the optical module can be transmitted into the optical module.

Fig. 5 is a schematic side view of the inside of the wrapping cavity according to the embodiment of the present invention. As shown in fig. 5, the circuit board 300, the IC chip 401, the lens assembly 400 and the heat conducting member 700 are disposed in the package cavity formed by the cooperation of the upper housing 201 and the lower housing 202 of the optical module of the present invention. In particular, the method comprises the following steps of,

the circuit board 300 is provided with a gold finger 301, and the gold finger 301 extends out of an electrical port of the optical module. The distance between the circuit board 300 where the gold finger 301 is located and the upper case 201 is L1, the distance between the circuit board 300 and the lower case 202 is L2, and L2 is smaller than L1. Furthermore, both L1 and L2 are standard sizes and cannot be modified.

In the present invention, the upper case 201 and the lower case 202 are specifically referred to, and do not refer to the upper and lower in spatial position. Specifically, the upper case 201 refers to a case whose distance from the circuit board 300 is L1, the lower case 202 refers to a case whose distance from the circuit board 300 is L2, and L2 is smaller than L1. When in actual work scene, because the needs of installation environment, the optical module position changes for go up casing 201 down, when lower casing 202 was up, obviously this kind of position change can not change the utility model discloses go up casing 201 and casing 202's specific meaning down.

The circuit board 300 includes an upper surface and a lower surface, the upper surface of the circuit board 300 is provided with a heat conductive member 700, and the lower surface of the circuit board 300 is provided with an IC chip 401 and a lens assembly 400 covering the IC chip 401.

An IC chip 401(Integrated Circuit) is a chip formed by placing an Integrated Circuit formed by a large number of microelectronic devices (transistors, resistors, capacitors, etc.) on a plastic substrate. Almost all chips seen so far may be called IC chips 401. In the present application, the IC chip 401 is specifically an optical chip.

The IC chip 401 is used to generate an optical signal. Specifically, since the optical chip is a light emitting chip, the light emitting chip generates an emission light signal, that is, the IC chip 401 generates an emission light signal.

A lens assembly 400 for changing the direction of propagation of the optical signal generated by the IC chip 401. Specifically, the lens assembly 400 changes the direction of propagation of the emitted optical signal emitted by the light emitting chip.

The IC chip 401 generates heat during operation. Since the circuit board 300 has the heat conduction member embedded therein, the heat conduction member is disposed between the heat conduction member 700 and the IC chip 401, and the heat conduction member is used to conduct heat, heat generated when the IC chip 401 operates is conducted to the heat conduction member 700 through the heat conduction member embedded in the circuit board 300.

The heat-conducting member 700 is a solid heat-conducting member made of heat-conducting paste. The heat-conducting glue is silica gel which is prepared by mixing organic silica gel serving as a main body with polymer materials such as filling materials, heat-conducting materials and the like, and has good heat-conducting and electric-insulating properties.

The heat-conducting member 700 has one end connected to the upper surface of the circuit board 300 and the other end connected to the upper case 201 for conducting heat. Specifically, the heat of the heat-conducting member 700 is conducted to the upper housing 201.

Because the outer surface of the upper shell 201 is provided with the plurality of radiating fins, when the optical module is inserted into the upper computer, airflow emitted by the radiator in the cage of the upper computer firstly enters the upper shell 201, heat entering the upper shell 201 can be quickly dissipated, and the radiating efficiency is effectively improved.

In order to further improve the heat dissipation efficiency, as shown in fig. 4-5, the lens assemblies 400 and the heat conducting members 700 are equal in number and correspond to each other one by one.

Since there may be a 4-way driving chip and a 4-way transimpedance amplifier chip in the lens assembly 400, and there may also be a 4-way driving chip or a 4-way transimpedance amplifier chip, the lower surface of the circuit board 300 may be provided with 2 or 4 lens assemblies 400.

When a 4-channel driver chip and a 4-channel transimpedance amplifier chip are disposed in the lens assembly 400, the number of the lens assemblies 400 disposed on the lower surface of the circuit board 300 is 2, the number of the heat-conducting members 700 is 2, and the lens assemblies 400 and the heat-conducting members 700 are in one-to-one correspondence.

When a 4-way driving chip or a 4-way transimpedance amplifier chip is disposed in the lens assembly 400, the number of the lens assemblies 400 disposed on the lower surface of the circuit board 300 is 4, the number of the heat-conducting members 700 is 4, and the lens assemblies 400 correspond to the heat-conducting members 700 one by one.

Since one end of the optical fiber array 500 is connected to the lens assembly 400 and the other end is connected to the optical fiber receptacle 600, the number of the lens assemblies 400 is equal to that of the optical fiber array 500, and the lens assemblies 400 correspond to the optical fiber array 500. When the number of the lens assemblies 400 is 2, the number of the optical fiber arrays 500 is 2. When the number of the lens assembly 400 is 4, the number of the optical fiber arrays is 4.

However, when the vertical distance between any adjacent two lens assemblies 400 disposed on the lower surface of the circuit board 300 is equal to 0, the two optical fiber arrays 500 connected to the two lens assemblies 400 may overlap. Since the distance between the circuit board 300 and the lower housing 202 is small, the relatively long one of the two optical fiber arrays 500 located between the circuit board 300 and the lower housing 202 is at risk of being crushed. Therefore, there are requirements for the layout of the lens assembly 400 on the lower surface of the circuit board 300 and the placement of the optical fiber array 500.

The layout of any two adjacent lens assemblies 400 and the positional placement requirements between any two adjacent fiber arrays 500 are described below.

Fig. 6 is a schematic partial structural diagram of an optical module having two lens assemblies according to an embodiment of the present invention. As shown in fig. 6, in the optical module provided by the embodiment of the present invention, the number of the lens assemblies 400 and the number of the optical fiber arrays 500 are 2, the optical fiber arrays have 8 optical fibers, two lens assemblies 400 are parallel to each other, two optical fiber arrays 500 connected to two lens assemblies 400 are parallel to each other, and the lengths of the two optical fiber arrays 500 are different. The two lens assemblies 400 being parallel to each other means that the perpendicular distance between the two lens assemblies 400 is not less than 0. The two fiber arrays 500 are parallel to each other, which means that the vertical distance between the two fiber arrays 500 is not less than 0.

Fig. 7 is a schematic diagram of a first partial structure of an optical module having four lens assemblies according to an embodiment of the present invention. Fig. 8 is a second partial structure schematic diagram of an optical module with four lens assemblies provided in the embodiment of the present invention, and fig. 9 is a third partial structure schematic diagram of an optical module with four lens assemblies provided in the embodiment of the present invention. As shown in fig. 7-9, in the optical module provided in the embodiments of the present invention, the number of the lens assemblies 400 and the number of the optical fiber arrays 500 are both 4, and there are 4 optical fibers in the optical fiber arrays. The four lens assemblies are sequentially defined as a first lens assembly, a second lens assembly, a third lens assembly and a fourth lens assembly from top to bottom. As shown in FIG. 7, the first lens assembly and the fourth lens assembly are located at the same vertical position, and the second lens assembly and the third lens assembly are located at the same vertical position. As shown in FIG. 8, the first lens assembly and the third lens assembly are located at the same vertical position and the second lens assembly and the fourth lens assembly are located at the same vertical position. As shown in FIG. 9, the first lens assembly and the fourth lens assembly are located at the same vertical position, and the second lens assembly and the third lens assembly are located at the same vertical position.

As shown in fig. 7-9, any two adjacent lens assemblies are not necessarily in the same vertical position, but any two adjacent lens assemblies 400 are parallel to each other, and any two adjacent optical fiber arrays 500 connected to any two adjacent lens assemblies 400 are parallel to each other. The fact that any two adjacent lens assemblies 400 are parallel to each other means that the perpendicular distance between any two adjacent lens assemblies 400 is not less than 0. Any two adjacent fiber arrays 500 are parallel to each other, which means that the vertical distance between any two adjacent fiber arrays 500 is not less than 0.

As shown in fig. 6-9, in the embodiment of the present invention, the vertical distance between any two adjacent lens assemblies 400 is not less than 0, and the vertical distance between any two adjacent optical fiber arrays 500 is not less than 0. When the vertical distance and the horizontal distance between any two adjacent lens assemblies 400 are not less than 0, and any two adjacent optical fiber arrays 500 are parallel to each other, the vertical distance between any two adjacent optical fiber arrays 500 is not equal to 0, and any two adjacent optical fiber arrays 500 are not overlapped, so that the risk that the optical fiber arrays 500 are crushed is avoided.

The utility model provides an optical module, including last casing, lower casing, go up casing and lower casing body formation parcel cavity. A circuit board is arranged in the wrapping cavity, and the distance between the circuit board and the lower shell is smaller than the distance between the circuit board and the upper shell. The upper surface of the circuit board is connected with one end of the heat conducting piece, and the other end of the heat conducting piece is connected with the upper shell. An IC chip and a lens assembly covering the IC chip are arranged on the lower surface of the circuit board. And the IC chip is used for generating optical signals and generating heat during operation. The lens assembly is used for changing the propagation direction of the optical signal. Because the IC chip is arranged on the lower surface of the circuit board, and the heat conducting piece is connected with the upper surface of the circuit board and the upper shell, heat generated when the IC chip operates is transmitted to the upper shell through the circuit board and the heat conducting piece in sequence. Because the distance between the upper shell and the radiator is smaller than the distance between the upper shell and the radiator, when heat is transmitted to the upper shell, air flow sent by the radiator can quickly dissipate the heat, and the heat dissipation efficiency is effectively improved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A light module, comprising:

an upper housing;

the lower shell is matched with the upper shell to form a wrapping cavity;

2. The optical module of claim 1, wherein a thermal conductor is embedded in the circuit board;

the heat conduction piece is arranged between the heat conduction piece and the IC chip and used for conducting heat.

3. The light module of claim 2, further comprising:

and one end of the optical fiber array is connected with the lens component, and the other end of the optical fiber array is connected with an optical fiber socket.

4. The optical module according to claim 1, characterized in that an outer surface of the upper housing is provided with a plurality of heat dissipating fins.

5. The optical module of claim 3, wherein when there are one 4-way driver chip and one 4-way transimpedance amplifier chip in the lens assembly, the number of the lens assembly and the optical fiber array is 2, and the optical fiber array has 8 optical fibers.

6. The optical module of claim 3, wherein when there is a 4-way driving chip or a 4-way transimpedance amplifier chip in the lens assembly, the number of the lens assembly and the optical fiber array is 4, and the optical fiber array has 4 optical fibers.

7. The optical module according to claim 5 or 6, wherein a vertical distance between any two adjacent lens assemblies is not less than 0, and a vertical distance between any two adjacent optical fiber arrays is not less than 0.

8. The optical module of claim 3, wherein the lens assembly, the optical fiber array, and the thermal conductor are equal in number.