CN207051542U - CXP optical modules and its communication equipment - Google Patents
CXP optical modules and its communication equipment Download PDFInfo
- Publication number
- CN207051542U CN207051542U CN201720650464.6U CN201720650464U CN207051542U CN 207051542 U CN207051542 U CN 207051542U CN 201720650464 U CN201720650464 U CN 201720650464U CN 207051542 U CN207051542 U CN 207051542U
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- Prior art keywords
- optical modules
- laser
- heat
- radiator
- housing
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of CXP optical modules and its communication equipment.The CXP optical modules include housing, laser, pedestal, laser housing, radiator and heat sink, laser housing is arranged in housing, laser, pedestal and heat sink it is arranged in laser housing, laser is arranged on the side of pedestal, the heat sink opposite side for being arranged on pedestal, for transfer laser device caused heat at work, one end of radiator be arranged on laser housing and it is heat sink between, the other end of radiator is arranged on the inner side of housing, and radiator is used to transmit heat.The utility model can improve heat transfer efficiency.
Description
Technical field
Technical field of photo communication is the utility model is related to, more particularly to a kind of CXP (12 × Small Form-factor
Pluggable, 12 road small sizes are pluggable) optical module and its communication equipment.
Background technology
Optical module plays an important role during optical-fibre communications, but can produce substantial amounts of heat while communication,
In order to ensure being normally carried out, it is necessary to which heat caused by optical module is distributed in time of optical communication.
The optical module of prior art carries out transmission heat by semiconductor cooler, exceedes in the electric current of semiconductor cooler
During default threshold value, semiconductor cooler can not realize refrigeration, can only generate heat, in order to reduce the temperature of optical module, at present
Reduction temperature is realized by modes such as radiatings, the hot junction of usual semiconductor cooler is radiated by alloy shell, but is led
The thermal efficiency is low.
Utility model content
The utility model is mainly solving the technical problems that provide a kind of CXP optical modules and its communication equipment, it is possible to increase
Heat transfer efficiency.
In order to solve the above technical problems, the technical scheme that the utility model uses is：A kind of CXP optical modules are provided,
It includes housing, laser, pedestal, laser housing, radiator and heat sink, and laser housing is arranged in housing, laser
Device, pedestal and it is heat sink be arranged in laser housing, laser is arranged on the side of pedestal, heat sink to be arranged on the another of pedestal
Side, for transfer laser device caused heat at work, one end of radiator be arranged on laser housing and it is heat sink between,
The other end of radiator is arranged on the inner side of housing, and radiator is used to transmit heat.
Wherein, radiator includes heat pipe, and heat pipe is included positioned at the evaporation ends of one end of radiator and positioned at radiator
The condensation end of the other end.
Wherein, CXP optical modules further comprise semiconductor cooler, are arranged on heat sink between pedestal, semiconductor refrigerating
Device includes hot junction and cold end, and cold end is arranged on the opposite side of pedestal, for transferring heat to hot junction.
Wherein, it is heat sink to be used for the heat transfer in hot junction to evaporation ends, evaporation ends by by the heat transfer in hot junction to cold
Solidifying end.
Wherein, CXP optical modules further comprise thermistor, and thermistor is arranged on the same side of pedestal with laser.
Wherein, CXP optical modules further comprise process chip, are connected with thermistor, and process chip is used to detect laser
Device caused heat at work.
Wherein, CXP optical modules further comprise radiating fin, and radiating fin corresponds to radiator and is arranged on the outer of housing
Side, for transmitting the heat of radiator.
Wherein, CXP optical modules further comprise case fan, and air outlet and the radiating fin of case fan are correspondingly arranged.
Wherein, CXP optical modules further comprise being arranged on the interface on housing and laser housing, the light that laser is sent
Pass through interface light extraction.
In order to solve the above technical problems, another technical scheme that the utility model uses is：A kind of communication equipment is provided,
It includes above-mentioned CXP optical modules.
The beneficial effects of the utility model are：Be different from the situation of prior art, the utility model pass through radiator one
End be arranged on laser housing and it is heat sink between, the other end of radiator is arranged on the inner side of housing, and radiator is used to transmit heat
Amount；Radiator can transmit heat in time, realize radiating, improve heat transfer efficiency.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawings.Wherein：
Fig. 1 is the structural representation of the CXP optical modules of the embodiment of the utility model one；
Fig. 2 is the operation principle schematic diagram of radiator in Fig. 1；
Fig. 3 is the structural representation of the CXP optical modules of another embodiment of the utility model；
Fig. 4 is the structural representation of the communication equipment of the embodiment of the utility model one.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that described embodiment is only the utility model part of the embodiment, rather than all real
Apply example.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of performing creative labour is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Shown in Figure 1, Fig. 1 is the structural representation of the CXP optical modules of the embodiment of the utility model one.The present embodiment
The speed of disclosed CXP optical modules 10 can reach 120Gbit/s, and its single pass speed is 10Gbit/s.
As shown in figure 1, the CXP optical modules 10 include housing 11, laser 12, pedestal 13, laser housing 15, radiator
16 and heat sink 17.Wherein, laser housing 15 is arranged in housing 11；Laser 12, pedestal 13 and heat sink 17 are arranged on
In laser housing 15, i.e., the receiving space of laser housing 15 is used to house laser 12, pedestal 13 and heat sink 17, housing
11 receiving space is used to house laser housing 15 and radiator 16.
Specifically, laser 12 is arranged on the side 131 of pedestal 13, and heat sink 17 are arranged on the opposite side 132 of pedestal 13,
Radiator 16 is arranged on heat sink 17, and heat sink 17 are used for heat transfer caused by laser 12 to radiator 16, and heat sink 17
Temperature not with transmit heat size and change, heat sink 17 can be miniature fin.
One end 161 of radiator 16 is arranged between laser housing 15 and heat sink 17, and the other end 162 of radiator 16 is set
Put in the inner side of housing 11, radiator 16 is used to transmit heat.Wherein, radiator 16 can be in time produced by transfer laser device 12
Heat, realize radiating, improve the efficiency of heat conduction.
Specifically, radiator 16 can include heat pipe, and heat pipe includes the evaporation ends 161 and position positioned at one end of radiator 16
In the condensation end 162 of the other end of radiator 16, evaporation ends 161 are by the heat transfer in hot junction 142 to condensation end 162.
As shown in Fig. 2 heat pipe includes shell 163, liquid-sucking core 164 and end cap (figure does not regard), wherein the inside quilt of heat pipe
Negative pressure state is pumped into, and is filled with appropriate liquid 167, the low boiling point of the liquid 167 is readily volatilized.Liquid-sucking core 164 is arranged on pipe
The inner side of shell 163, liquid-sucking core 164 are made up of the how empty material of capillary.
When evaporation ends 161 are heated, the liquid 167 in liquid-sucking core 164 can gasify rapidly, form steam 168, steam 168
Condensation end 162 is flowed in the presence of the power of thermal diffusion, and is coagulated in condensation end 162 and discharges heat, forms liquid 167,
Liquid 167 flows back to evaporation ends 161 further along liquid-sucking core 164, according to above-mentioned circulation, until the temperature and condensation end of evaporation ends 161
162 temperature is equal.The circulation of heat pipe is quickly carried out, can be rapidly by heat transfer, and the capacity of heat transmission of heat pipe is than gold
The capacity of heat transmission of category is strong.
Alternatively, CXP optical modules 10 further comprise thermistor R, process chip 18, interface 21, radiating fin 22 with
And case fan 23.Thermistor R is arranged on the same side 131 of pedestal 13 with laser 12, and thermistor R can be different
At a temperature of there is different resistance values.Process chip 18 is connected with thermistor R, for detecting thermistor R resistance value, and
According to the caused heat at work of resistance value detection laser 12.Process chip 18 can further connect with laser 12
Connect, for controlling laser 12 to work.
Wherein, process chip 18 can be by the calorie value detected compared with default heat threshold, if processing core
When piece 18 determines calorie value and is more than heat threshold, process chip 18 can control laser 12 to be stopped, to avoid laser
Device 12 is operated at high temperature, and then improves the life-span of laser 12.
Radiating fin 22 corresponds to the outside that radiator 16 is arranged on housing 11, for transmitting the heat of radiator 16, i.e.,
Radiating fin 22 is arranged on the outside of the housing 11 corresponding to condensation end 162.Housing 11 can be metal shell, to improve heat
Transmission efficiency.The side of the radiating fin 22 away from housing 11 is in bow font, to improve contact of the radiating fin 22 with air
Face, improve heat transfer efficiency.
The air outlet 231 of case fan 23 is correspondingly arranged with radiating fin 22, to cause wind caused by case fan 23 to lead to
Cross air outlet 231 and blow radiating fin 22, further to improve the radiating efficiency of radiating fin 22, then improve heat transfer efficiency.
Interface 21 is arranged on housing 11 and laser housing 15, and the light that laser 12 is sent passes through the light extraction of interface 21.Its
In, interface 21 can be multidiameter delay optical fiber interface, and interface 21 can be connected with optical fiber (figure not depending on), for laser 12 to be sent out
The optical transport gone out is to optical fiber.
The working condition of the CXP optical modules 10 described in detail below.
When process chip 18 receives electric signal by electrical interface (figure not depending on), process chip 18 controls according to electric signal
The normal work of laser 12, to send light.When laser 12 works, laser 12 produces heat, and heat sink 17 by laser 12
Evaporation ends 161 of the caused heat transfer to radiator 16.
When evaporation ends 161 receive heat, the liquid 167 in liquid-sucking core 164 can gasify rapidly, form steam 168, steam
Vapour 168 flows to condensation end 162 in the presence of the power of thermal diffusion.Condensation end 162 rejects heat to radiating fin 22, steam
168 form liquid 167, and liquid 167 flows back to evaporation ends 161 further along liquid-sucking core 164.Circulate successively, heat is transmitted rapidly
To radiating fin 22.
Laser 12, pedestal 13, laser housing 15 disclosed in the present embodiment, heat sink 17, process chip 18 and heat
Quick resistance R is the sending module of CXP optical modules 10, further comprises receiving module (figure in other embodiment CXP optical modules 10
Do not regard), heat pipe can be arranged on receiving module by one of ordinary skill in the art completely, further to improve heat transfer efficiency.
In other embodiments, CXP optical modules 10 can be the optical mode that 100G optical modules or speed are more than 120Gbit/s
Block.
The present embodiment transfers heat to rapidly radiating fin 22 by radiator 16, i.e., transmits heat by heat pipe, dissipates
Hot device 16 can transmit heat in time, realize radiating, improve heat transfer efficiency.
The utility model further provides for the CXP optical modules of another embodiment, and it is in the CXP light disclosed in above-described embodiment
The difference of module 10 is：As shown in figure 3, the CXP optical modules 30 further comprise semiconductor cooler 34.Wherein, half
Conductor refrigerator 34 is arranged between heat sink 37 and pedestal 33, i.e., semiconductor cooler 34 is arranged on the opposite side 332 of pedestal 33,
Heat sink 37 are arranged on semiconductor cooler 34, and semiconductor cooler 34 is used for the caused heat at work of transfer laser device 32
Amount.
Wherein, semiconductor cooler 34 is coupled to by one piece of N-type semiconductor material and one piece of p-type semiconductor material, in N-type
Have between semi-conducting material and p-type semiconductor material electric current by when, heat will be produced between the both ends of semiconductor cooler 34
The transmission of amount, heat can be delivered to the other end from one end, and then produce the temperature difference, form hot and cold side.
Semiconductor cooler 34 includes cold end 341 and hot junction 342, and cold end 341 is arranged on the opposite side 332 of pedestal 33, uses
In transferring heat to hot junction 342.Because semiconductor itself has resistance, heat can be produced when electric current flows through semiconductor, from
And influence heat transfer；Therefore cold end 341 and hot junction 342 carry out reverse heat transfer by air and semi-conducting material itself, cold
Reach certain temperature difference between end 341 and hot junction 342, cold end 341 is equal with the heat that hot junction 342 is transmitted.
Wherein, heat sink 37 it is arranged between the hot junction 342 of semiconductor cooler 34 and the evaporation ends 361 of radiator 36, heat
Heavy 37 are used for the heat transfer in hot junction 342 to evaporation ends 361.When semiconductor cooler 34 can not freeze, the energy of radiator 36
It is enough to transmit heat in time, radiating is realized, improves the efficiency of heat conduction.
The working condition of the CXP optical modules 10 described in detail below.
When laser 32 works, laser 32 produces heat.The cold end 341 of semiconductor cooler 34 draws laser 32
The heat sent, and hot junction 342 is transferred heat to, hot junction 342 transfers heat to radiator 36 by heat sink 17
Evaporation ends 361, evaporation ends 361 transfer heat to condensation end 362, and then heat is delivered to rapidly radiating fin by radiator 36
39。
The present embodiment sets semiconductor cooler 34 between heat sink 17 and substrate 33, further improves heat transfer efficiency.
The utility model further provides for a kind of communication equipment, as shown in figure 4, the communication equipment 40 includes CXP optical modules
41 and optical fiber 42, optical fiber 42 be connected with the interface of CXP optical modules 41, the CXP optical modules 41 be above-described embodiment disclosed in CXP
Optical module, it will not be repeated here.
In summary, the utility model by one end of radiator be arranged on laser housing and semiconductor cooler it
Between, the other end of radiator is arranged on the inner side of housing, and radiator is used to transmit heat；Radiator can transmit heat in time,
Radiating is realized, improves heat transfer efficiency.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is all
It is the equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or directly or indirectly uses
In other related technical areas, similarly it is included in scope of patent protection of the present utility model.
Claims (10)
- A kind of 1. CXP optical modules, it is characterised in that the CXP optical modules include housing, laser, pedestal, laser housing, Radiator and heat sink, the laser housing is arranged in the housing, the laser, the pedestal and described heat sink It is arranged in the laser housing, the laser is arranged on the side of the pedestal, described heat sink to be arranged on the pedestal Opposite side, for transmitting the laser caused heat at work, one end of the radiator, which is arranged on, described swashs Light device housing and it is described it is heat sink between, the other end of the radiator is arranged on the inner side of the housing, and the radiator is used for Transmit the heat.
- 2. CXP optical modules according to claim 1, it is characterised in that the radiator includes heat pipe, and the heat pipe includes The condensation end of the other end positioned at the evaporation ends of one end of the radiator and positioned at the radiator.
- 3. CXP optical modules according to claim 2, it is characterised in that the CXP optical modules further comprise semiconductor system Cooler, it is arranged between described heat sink and described pedestal, the semiconductor cooler includes hot junction and cold end, and the cold end is set In the opposite side of the pedestal, for by the heat transfer to the hot junction.
- 4. CXP optical modules according to claim 3, it is characterised in that described heat sink for the heat in the hot junction to be passed It is delivered to the evaporation ends, the evaporation ends are by by the heat transfer in the hot junction to the condensation end.
- 5. CXP optical modules according to claim 4, it is characterised in that the CXP optical modules further comprise temperature-sensitive electricity Resistance, the thermistor are arranged on the same side of the pedestal with the laser.
- 6. CXP optical modules according to claim 5, it is characterised in that the CXP optical modules further comprise handling core Piece, it is connected with the thermistor, the process chip is used to detect the laser caused heat at work.
- 7. CXP optical modules according to claim 1, it is characterised in that the CXP optical modules further comprise heat radiating fin Piece, the radiating fin corresponds to the outside that the radiator is arranged on the housing, for transmitting the heat of the radiator.
- 8. CXP optical modules according to claim 7, it is characterised in that the CXP optical modules further comprise cabinet wind Fan, the air outlet of the case fan are correspondingly arranged with the radiating fin.
- 9. CXP optical modules according to claim 1, it is characterised in that the CXP optical modules further comprise being arranged on institute The interface on housing and the laser housing is stated, the light that the laser is sent passes through the interface light extraction.
- 10. a kind of communication equipment, it is characterised in that the communication equipment includes the CXP optical modes as described in claim 1-9 is any Block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720650464.6U CN207051542U (en) | 2017-06-05 | 2017-06-05 | CXP optical modules and its communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720650464.6U CN207051542U (en) | 2017-06-05 | 2017-06-05 | CXP optical modules and its communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207051542U true CN207051542U (en) | 2018-02-27 |
Family
ID=61492096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720650464.6U Expired - Fee Related CN207051542U (en) | 2017-06-05 | 2017-06-05 | CXP optical modules and its communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207051542U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107247312A (en) * | 2017-06-05 | 2017-10-13 | 深圳市光为光通信科技有限公司 | CXP optical modules and its communication equipment |
-
2017
- 2017-06-05 CN CN201720650464.6U patent/CN207051542U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107247312A (en) * | 2017-06-05 | 2017-10-13 | 深圳市光为光通信科技有限公司 | CXP optical modules and its communication equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180227 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |