WO2020142957A1 - Distance measurement apparatus and mobile platform - Google Patents

Distance measurement apparatus and mobile platform Download PDF

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Publication number
WO2020142957A1
WO2020142957A1 PCT/CN2019/071044 CN2019071044W WO2020142957A1 WO 2020142957 A1 WO2020142957 A1 WO 2020142957A1 CN 2019071044 W CN2019071044 W CN 2019071044W WO 2020142957 A1 WO2020142957 A1 WO 2020142957A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
measuring device
distance measuring
temperature
circuit
Prior art date
Application number
PCT/CN2019/071044
Other languages
French (fr)
Chinese (zh)
Inventor
黄森洪
吴敬阳
徐宗财
刘祥
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201980005657.8A priority Critical patent/CN111670376B/en
Priority to PCT/CN2019/071044 priority patent/WO2020142957A1/en
Publication of WO2020142957A1 publication Critical patent/WO2020142957A1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means

Definitions

  • the invention generally relates to the technical field of distance measuring devices, and more particularly to a range measuring device system and a mobile platform.
  • Lidar is a perception system of the outside world. By transmitting and receiving light wave information, the three-dimensional and three-dimensional information of the outside world can be obtained.
  • the principle is to actively emit a laser pulse signal to the outside, detect the reflected pulse signal, and judge the distance of the measured object according to the time difference between transmission and reception; combined with the information of the angle of emission of the optical pulse, the three-dimensional depth information can be reconstructed and learned.
  • Laser ranging is an application field similar to the principle of lidar. It also needs to know the time difference between the transmitted pulse and the received pulse to know the distance of the measured object. However, the laser rangefinder does not have angle information, and can only obtain the single-dimensional spatial distance information in the emission direction.
  • lidar In the fields of laser radar and optical fiber communication, lasers are used as signal sources to emit laser signals with specific wavelengths and optical power according to specific applications.
  • the wavelength of the pulsed laser diode varies greatly with temperature. In the above temperature range, the wavelength change reaches more than 40nm. In order to adapt to the laser wavelength change, the design bandwidth of the receiving filter must be greater than 40nm, so that the received noise increases and the signal noise The ratio deteriorates and the range decreases. On the other hand, the laser lifetime decays significantly with increasing temperature.
  • the detection distance is mainly related to the power of the emitted laser. Under the premise of the same receiving sensitivity, the greater the power, the farther the detection distance. However, the wavelength and optical power of the laser diode are shifted as the ambient temperature changes. Therefore, the laser wavelength, power stability, and a wider ambient temperature range have become a major contradiction. Therefore, a complete temperature control scheme must be designed for the distance measuring device.
  • one aspect of the present invention provides a distance measuring device, the distance measuring device includes a transmitting module, a receiving module, and a temperature control system,
  • the transmitting module is used to emit light pulses
  • the receiving module is configured to receive at least part of the optical pulse reflected back by the object, and determine the distance of the object relative to the distance measuring device according to the received at least part of the optical pulse;
  • the temperature control system includes:
  • a heating circuit and/or a heat dissipation module the heating circuit is used to heat the temperature control device, and the heat dissipation module is used to dissipate heat to the temperature control device;
  • the control module is configured to control the heating circuit and/or the heat dissipation module to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the temperature-controlling device.
  • control module includes:
  • a processor configured to obtain the ambient temperature of the temperature-controlled device, and compare the current ambient temperature with the target temperature to generate a control signal
  • a heating control circuit and/or a heat dissipation control circuit the heating control circuit is used to obtain the control signal, and the heating circuit is controlled to operate or shut down according to the control signal, and the heat dissipation control circuit is used to obtain the control signal , Control the heat dissipation module to run or shut down according to the control signal.
  • the target temperature includes a first target temperature and a second target temperature, where the first target temperature is less than the second target temperature, and the processor is specifically configured to:
  • Obtain the current ambient temperature of the temperature-controlled device compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a first control signal for controlling The heating circuit operates or controls the heat dissipation module to be turned off. If the current ambient temperature is greater than the second target temperature, a second control signal is generated for controlling the heating circuit to turn off or the heat dissipation module to operate.
  • the heating control circuit includes a first switching circuit, a control terminal of the first switching circuit is connected to the control signal, and the control signal is used to control the on-off time of the first switching circuit.
  • control signal includes a PWM signal
  • the on-off time of the first switching circuit is controlled by the duty cycle of the PWM signal to control the running time or the off time of the heating circuit.
  • the input terminal of the first switching circuit is electrically connected to the output terminal of the heating circuit, and the output terminal of the first switching circuit is grounded;
  • the input end of the heating circuit is electrically connected to the power supply voltage.
  • the first switching circuit includes a first MOS tube, the control signal is connected to a control terminal of the first MOS tube, and one of the source terminal and the drain terminal of the first MOS tube serves as the first One input terminal of the switch circuit, the other serves as the output terminal of the first switch circuit.
  • the heating control circuit further includes a first filtering circuit for filtering the control signal input to the first switching circuit.
  • the input terminal of the first filter circuit is electrically connected to the control signal, and the output terminal of the first filter circuit is grounded.
  • the first filter circuit includes a resistor and a capacitor arranged in parallel.
  • the distance measuring device further includes a switching power supply for converting the control signal into a DC voltage, so that the heating circuit continuously generates heat.
  • the switching power supply includes:
  • a second switching circuit for controlling the charging and discharging of the energy storage circuit of the switching power supply
  • An energy storage circuit for storing electrical energy when the second switching circuit is on and discharging when the second switching circuit is off;
  • the output filter circuit is used for charging when the second switching circuit is turned on and discharging when the second switching circuit is turned off.
  • the input terminal of the second switch circuit is electrically connected to the power supply voltage
  • the output terminal of the second switch circuit is electrically connected to the input terminal of the energy storage circuit
  • the output terminal of the energy storage circuit is electrically connected to the input terminal of the output filter circuit, and the output terminal of the output filter circuit is grounded.
  • the second switch circuit includes a second MOS tube, wherein one end of the source and drain terminals of the second MOS tube is electrically connected to the power supply voltage, and the other end is electrically connected to the power storage circuit. Input.
  • the first switching circuit includes one of an NMOS transistor and a PMOS transistor, and/or, the second MOS transistor includes a PMOS transistor.
  • the switching power supply further includes:
  • a freewheeling circuit the freewheeling circuit is turned on when the second switching circuit is turned off, and is used for a freewheeling function to provide a discharge circuit of the energy storage circuit.
  • one end of the freewheeling circuit is electrically connected to the input end of the energy storage circuit, and the other end is grounded.
  • the freewheeling circuit includes a diode, wherein the cathode of the diode is electrically connected to the input terminal of the energy storage circuit, and the anode of the diode is grounded.
  • the temperature control system further includes a voltage dividing circuit, and the voltage dividing node of the voltage dividing circuit is electrically connected to the control terminal of the second switching circuit, and is used to control the second switching circuit to be turned on or off.
  • the output terminal of the voltage dividing circuit is electrically connected to the input terminal of the heating control circuit, and the input terminal of the voltage dividing circuit is electrically connected to the power supply voltage.
  • the voltage dividing circuit includes at least two resistors connected in series.
  • the switching power supply includes a BUCK switching power supply, wherein the energy storage circuit includes an inductor, and/or, the output filter circuit includes a capacitor.
  • the temperature control system further includes:
  • the second filter circuit is used to filter the voltage output by the power supply voltage.
  • the temperature control system further includes:
  • the input terminal of the second filter circuit is electrically connected to the power supply voltage, and the output terminal of the second filter circuit is grounded.
  • the first filter circuit includes at least one capacitor.
  • the heating circuit includes at least one heating resistor.
  • the heating circuit includes at least two heating resistors arranged in parallel.
  • the distance measuring device further includes:
  • a circuit board, the temperature-controlling device is arranged on the circuit board;
  • a heat conduction layer, the heat conduction layer is disposed below the temperature-controlling device, and is used to conduct the heat generated by the heating resistor to the temperature-controlling device.
  • At least one thermal island is provided on the thermal conductive layer, and the thermal island is used to isolate the thermal conductive layers on opposite sides of the thermal island.
  • a plurality of the thermal islands are arranged in a ring shape along the circumference of the device to be controlled.
  • the ring shape includes a circular ring shape or a polygonal ring shape.
  • each of the thermal islands has a long shape.
  • the thermal island is an opening penetrating the thermal conductive layer.
  • the material of the thermal conductive layer includes a ground layer.
  • the target temperature includes a first target temperature and a second target temperature
  • the second target temperature is greater than the first target temperature
  • the heat dissipation control circuit is specifically configured to:
  • the heat dissipation module is controlled to operate.
  • the target temperature further includes a third target temperature and a fourth target temperature, wherein the third target temperature is greater than the second target temperature, and the fourth target temperature is greater than the third target temperature
  • the heat dissipation control circuit is also specifically used for:
  • the heat dissipation rate of the heat dissipation module is controlled to be maintained at the first rate.
  • the heat dissipation control circuit is also specifically used for:
  • controlling the heat dissipation rate of the heat dissipation module to be between the first rate and the second rate, wherein the first The second rate is greater than the first rate
  • the heat dissipation control circuit is also specifically used for:
  • the heat dissipation module is controlled to operate.
  • the heat dissipation control circuit is also specifically used for:
  • the heat dissipation module is controlled to be turned off.
  • the heat dissipation module includes a fan, and the heat dissipation control circuit is also specifically used for:
  • the heat dissipation rate of the heat dissipation module is controlled, where the greater the duty ratio, the greater the heat dissipation rate of the heat dissipation module.
  • the duty cycle includes a first duty cycle and a second duty cycle, the second duty cycle is greater than the first duty cycle, wherein the heat dissipation control circuit is specifically configured to:
  • the heat dissipation control circuit is specifically used for:
  • the heat dissipation module includes a fan, and the heat dissipation control circuit is also specifically used for:
  • the duty ratio of the fan is controlled to be zero to control the heat dissipation module to be turned off.
  • the temperature-controlling device is installed in a receiving cavity in the housing, wherein the heat dissipation module is used to dissipate heat to the housing.
  • the heat dissipation module includes a fan.
  • the temperature control system further includes:
  • a temperature detection circuit is used to detect the current ambient temperature of the temperature-controlled device.
  • the distance measuring device further includes:
  • the heat-conducting medium includes a heat dissipation portion, and at least a part of the surface of the heat dissipation portion is attached to at least a part of the heat dissipation surface of the temperature-controlling device, and is used to extract heat from the temperature-controlling device.
  • the distance measuring device includes at least two of the thermally conductive media, wherein at least a part of the surface of the heat dissipation portion of each of the thermally conductive media is attached to different temperature-controlling devices for respectively corresponding to The heat of the temperature-control device is derived.
  • the temperature-controlling device is installed in a housing cavity of the housing, and two opposite surfaces of the heat-dissipating portion of the heat-conducting medium respectively at least partially fit the heat-radiating surface of the temperature-controlling device and the housing Part of the surface.
  • the heat conductive medium further includes an installation portion, wherein the installation portion is used to install the heat conductive medium on the housing.
  • the mounting portion and the heat dissipation portion are connected to each other at a predetermined angle, and/or, the mounting portion and the heat dissipation portion are integrally formed.
  • the predetermined angle is substantially 90°.
  • the distance measuring device further includes at least one connecting member and at least one waist hole provided on the mounting portion, the connecting member passes through the waist hole to install the thermally conductive medium on the housing,
  • the housing is located in the receiving cavity of the housing.
  • the length of the waist hole is greater than the radial length of the connecting member to adjust the position of the conductive medium along the length of the waist hole before the connecting member is fastened; and/or,
  • the radial length of the connecting member is smaller than the width of the waist hole to adjust the position of the conductive medium along the width direction of the waist hole before the connecting member is fastened.
  • the length extension direction of the waist hole is perpendicular to the heat dissipation surface of the temperature-controlling device, so as to adjust the heat dissipation portion to fit the temperature-control device along the length extension direction.
  • a gasket is further provided between an end of the connecting member facing away from the housing and the waist hole.
  • the thickness of the region where the installation portion is provided with the waist hole is smaller than the thickness of other regions of the thermally conductive medium.
  • the connecting member includes at least one of screws and bolts.
  • the heat dissipation portion includes a first surface and a second surface that are oppositely arranged, and a bump is further provided on the first surface of the heat dissipation portion adjacent to the temperature-control device, and the bump At least part of the surface opposite to the first surface conforms to the heat dissipation surface of the device to be temperature controlled.
  • the size of the surface of the bump that fits the device to be temperature-controlled is smaller than the size of the first surface of the heat dissipation part.
  • the first surface and the second surface of the heat dissipation portion are opposite, not parallel surfaces.
  • the temperature control system includes at least two of the heat conduction media, wherein the bumps are provided on the heat dissipation portions of the heat conduction media of the at least two heat conduction media.
  • the distance measuring device includes a first temperature-controlling device and a second temperature-controlling device, wherein the temperature control system includes a first heat-conducting medium and a second heat-conducting medium.
  • the protrusions are provided on the heat dissipation portion, the protrusions on the first heat conduction medium are attached to at least a part of the heat dissipation surface of the first temperature-controlling device, and the heat dissipation portion of the second heat conduction medium is attached to the first 2. At least part of the heat dissipation surface of the device to be temperature controlled.
  • the first temperature-controlled device includes an emitter, and/or the second temperature-controlled device includes a detector.
  • the material of the heat-conducting medium includes a metal, wherein the metal includes copper.
  • the distance measuring device includes a laser radar.
  • a mobile platform including the foregoing distance measuring device;
  • a platform body, the distance measuring device is installed on the platform body.
  • the mobile platform includes a drone, robot, car or boat.
  • the distance measuring device of the present invention starts heating when the ambient temperature is too low through the heating circuit, and the heat dissipation module is used for heat dissipation at high temperature, so that the target temperature is controlled below the ambient temperature at high temperature and the target temperature at low temperature Controlling above the ambient temperature effectively reduces the temperature range of, for example, the transmitter module including the transmitter, controls the wavelength variation range, reduces the design bandwidth of the receiving filter, reduces noise, and improves the signal-to-noise ratio. The range is increased, and the life of the transmitter is increased.
  • FIG. 1 shows a schematic structural diagram of a distance measuring device in an embodiment of the present invention
  • FIG. 2 shows a schematic diagram of a distance measuring device in an embodiment of the present invention
  • FIG. 3 shows a flow chart of a control strategy of a temperature control system including a heating circuit in an embodiment of the invention
  • FIG. 4 shows a circuit diagram of a temperature control system including a heating circuit in an embodiment of the present invention
  • FIG. 5 shows a circuit diagram of a temperature control system including a heating circuit in another embodiment of the present invention.
  • FIG. 6 shows a schematic diagram of a thermal island in an embodiment of the present invention
  • FIG. 7 shows a schematic diagram of the installation of the thermally conductive medium in an embodiment of the present invention.
  • FIG. 8 is a schematic perspective view of a heat-conducting medium in another embodiment of the present invention.
  • FIG. 9 shows a perspective schematic view of a distance-measuring device equipped with a thermally conductive medium in an embodiment of the present invention.
  • FIG. 10 shows a top view of the distance measuring device in FIG. 9;
  • FIG. 11 shows a partial schematic diagram of a distance-measuring device installed with a heat-conducting medium in an embodiment of the present invention
  • FIG. 12 shows a partial schematic view of one side of a distance-measuring device installed with a thermally conductive medium in an embodiment of the present invention
  • FIG. 13 shows a flow chart of a control strategy of a temperature control system including a heat dissipation module in an embodiment of the invention
  • FIG. 14 shows a schematic diagram of a fan speed regulation strategy of a temperature control system in an embodiment of the present invention.
  • the distance measuring device includes a laser radar
  • the distance measuring device is only used as an example, for other suitable measurement
  • the distance device can also be applied to this application.
  • the distance measuring device may be an electronic device such as a laser radar or a laser distance measuring device.
  • the distance measuring device is used to sense external environment information, for example, distance information, azimuth information, reflection intensity information, speed information, etc. of the environmental target.
  • the distance measuring device can detect the distance between the detecting object and the distance measuring device by measuring the time of light propagation between the distance measuring device and the detection object, that is, Time-of-Flight (TOF).
  • TOF Time-of-Flight
  • the distance measuring device may also detect the distance between the detected object and the distance measuring device through other techniques, such as a distance measuring method based on phase shift measurement, or a distance measuring method based on frequency shift measurement. There are no restrictions.
  • the distance measuring device includes a transmitting module, a receiving module and a temperature control system, the transmitting module is used to emit light pulses; the receiving module is used to receive at least part of the optical pulses reflected back by the object, and according to the received at least Part of the light pulse determines the distance of the object relative to the distance measuring device.
  • the transmitting module includes a transmitting circuit 110; the receiving module includes a receiving circuit 120, a sampling circuit 130, and an arithmetic circuit 140.
  • the transmitting circuit 110 may emit a light pulse sequence (for example, a laser pulse sequence).
  • the receiving circuit 120 can receive the optical pulse sequence reflected by the detected object, and photoelectrically convert the optical pulse sequence to obtain an electrical signal, which can be output to the sampling circuit 130 after processing the electrical signal.
  • the sampling circuit 130 may sample the electrical signal to obtain the sampling result.
  • the arithmetic circuit 140 may determine the distance between the distance measuring device 100 and the detected object based on the sampling result of the sampling circuit 130.
  • the distance measuring device 100 may further include a control circuit 150, which can control other circuits, for example, can control the working time of each circuit and/or set parameters for each circuit.
  • a control circuit 150 can control other circuits, for example, can control the working time of each circuit and/or set parameters for each circuit.
  • the distance measuring device shown in FIG. 1 includes a transmitting circuit, a receiving circuit, a sampling circuit, and an arithmetic circuit for emitting a beam of light for detection
  • the embodiments of the present application are not limited thereto, and the transmitting circuit
  • the number of any one of the receiving circuit, the sampling circuit, and the arithmetic circuit may also be at least two, for emitting at least two light beams in the same direction or respectively in different directions; wherein, the at least two light paths may be simultaneously
  • the shot may be shot at different times.
  • the light-emitting chips in the at least two emission circuits are packaged in the same module.
  • each emitting circuit includes a laser emitting chip, and the die in the laser emitting chips in the at least two emitting circuits are packaged together and housed in the same packaging space.
  • the distance measuring device 100 may further include a scanning module for changing at least one laser pulse sequence emitted by the transmitting circuit to change the propagation direction.
  • the module including the transmitting circuit 110, the receiving circuit 120, the sampling circuit 130, and the arithmetic circuit 140, or the module including the transmitting circuit 110, the receiving circuit 120, the sampling circuit 130, the arithmetic circuit 140, and the control circuit 150 may be referred to as a measurement Distance module, the distance measuring module may be independent of other modules, for example, a scanning module.
  • a coaxial optical path may be used in the distance measuring device, that is, the light beam emitted by the distance measuring device and the reflected light beam share at least part of the optical path in the distance measuring device.
  • the distance measuring device may also adopt an off-axis optical path, that is, the light beam emitted from the distance measuring device and the reflected light beam are respectively transmitted along different optical paths in the distance measuring device.
  • FIG. 2 shows a schematic diagram of an embodiment of the distance measuring device of the present invention using a coaxial optical path.
  • the distance measuring device 200 includes a distance measuring module 210.
  • the distance measuring module 210 includes a transmitter 203 (which may include the above-mentioned transmitting circuit), a collimating element 204, and a detector 205 (which may include the above-mentioned receiving circuit, sampling circuit, and arithmetic circuit) and Optical path changing element 206.
  • the distance measuring module 210 is used to emit a light beam and receive back light, and convert the back light into an electrical signal.
  • the transmitter 203 may be used to transmit a light pulse sequence.
  • the transmitter 203 may emit a sequence of laser pulses.
  • the laser beam emitted by the transmitter 203 is a narrow-bandwidth beam with a wavelength outside the visible light range.
  • the collimating element 204 is disposed on the exit optical path of the emitter, and is used to collimate the light beam emitted from the emitter 203, and collimate the light beam emitted by the emitter 203 into parallel light to the scanning module.
  • the collimating element is also used to converge at least a part of the return light reflected by the detection object.
  • the collimating element 204 may be a collimating lens or other element capable of collimating the light beam.
  • the optical path changing element 206 is used to combine the transmitting optical path and the receiving optical path in the distance measuring device before the collimating element 204, so that the transmitting optical path and the receiving optical path can share the same collimating element, so that the optical path More compact.
  • the transmitter 203 and the detector 205 may respectively use respective collimating elements, and the optical path changing element 206 is disposed on the optical path behind the collimating element.
  • the light path changing element can use a small-area mirror to convert The transmitting optical path and the receiving optical path are combined.
  • the light path changing element may also use a reflector with a through hole, where the through hole is used to transmit the outgoing light of the emitter 203, and the reflector is used to reflect the return light to the detector 205. In this way, it is possible to reduce the blocking of the return light by the support of the small mirror in the case of using the small mirror.
  • the optical path changing element is offset from the optical axis of the collimating element 204. In some other implementations, the optical path changing element may also be located on the optical axis of the collimating element 204.
  • the distance measuring device 200 further includes a scanning module 202.
  • the scanning module 202 is placed on the exit optical path of the distance measuring module 210.
  • the scanning module 202 is used to change the transmission direction of the collimated light beam 219 emitted through the collimating element 204 and project it to the outside environment, and project the return light to the collimating element 204 .
  • the returned light is converged on the detector 205 via the collimating element 204.
  • the scanning module 202 may include at least one optical element for changing the propagation path of the light beam, wherein the optical element may change the propagation path of the light beam by reflecting, refracting, diffracting, etc. the light beam.
  • the scanning module 202 includes a lens, a mirror, a prism, a galvanometer, a grating, a liquid crystal, an optical phased array (Optical Phased Array), or any combination of the above optical elements.
  • at least part of the optical element is moving, for example, the at least part of the optical element is driven to move by a driving module, and the moving optical element can reflect, refract or diffract the light beam to different directions at different times.
  • multiple optical elements of the scanning module 202 may rotate or vibrate about a common axis 209, and each rotating or vibrating optical element is used to continuously change the direction of propagation of the incident light beam.
  • the multiple optical elements of the scanning module 202 may rotate at different rotation speeds, or vibrate at different speeds.
  • at least part of the optical elements of the scanning module 202 can rotate at substantially the same rotational speed.
  • the multiple optical elements of the scanning module may also rotate around different axes.
  • the multiple optical elements of the scanning module may also rotate in the same direction, or rotate in different directions; or vibrate in the same direction, or vibrate in different directions, which is not limited herein.
  • the scanning module 202 includes a first optical element 214 and a driver 216 connected to the first optical element 214.
  • the driver 216 is used to drive the first optical element 214 to rotate about a rotation axis 209 to change the first optical element 214 The direction of the collimated light beam 219.
  • the first optical element 214 projects the collimated light beam 219 to different directions.
  • the angle between the direction of the collimated light beam 219 after the first optical element changes and the rotation axis 209 changes as the first optical element 214 rotates.
  • the first optical element 214 includes a pair of opposed non-parallel surfaces through which the collimated light beam 219 passes.
  • the first optical element 214 includes a prism whose thickness varies along at least one radial direction.
  • the first optical element 214 includes a wedge-angle prism, aligning the straight beam 219 for refraction.
  • the scanning module 202 further includes a second optical element 215 that rotates about a rotation axis 209.
  • the rotation speed of the second optical element 215 is different from the rotation speed of the first optical element 214.
  • the second optical element 215 is used to change the direction of the light beam projected by the first optical element 214.
  • the second optical element 215 is connected to another driver 217, and the driver 217 drives the second optical element 215 to rotate.
  • the first optical element 214 and the second optical element 215 may be driven by the same or different drivers, so that the first optical element 214 and the second optical element 215 have different rotation speeds and/or rotations, thereby projecting the collimated light beam 219 to the outside space Different directions can scan a larger spatial range.
  • the controller 218 controls the drivers 216 and 217 to drive the first optical element 214 and the second optical element 215, respectively.
  • the rotation speeds of the first optical element 214 and the second optical element 215 can be determined according to the area and pattern expected to be scanned in practical applications.
  • Drives 216 and 217 may include motors or other drives.
  • the second optical element 215 includes a pair of opposed non-parallel surfaces through which the light beam passes. In one embodiment, the second optical element 215 includes a prism whose thickness varies along at least one radial direction. In one embodiment, the second optical element 215 includes a wedge angle prism.
  • the scanning module 202 further includes a third optical element (not shown) and a driver for driving the third optical element to move.
  • the third optical element includes a pair of opposed non-parallel surfaces through which the light beam passes.
  • the third optical element includes a prism whose thickness varies along at least one radial direction.
  • the third optical element includes a wedge angle prism. At least two of the first, second and third optical elements rotate at different rotational speeds and/or turns.
  • each optical element in the scanning module 202 can project light into different directions, such as the direction and direction 213 of the projected light 211, thus scanning the space around the distance measuring device 200.
  • the light 211 projected by the scanning module 202 hits the detection object 201, a part of the light is reflected by the detection object 201 to the distance measuring device 200 in a direction opposite to the projected light 211.
  • the returned light 212 reflected by the detection object 201 passes through the scanning module 202 and enters the collimating element 204.
  • the detector 205 is placed on the same side of the collimating element 204 as the emitter 203.
  • the detector 205 is used to convert at least part of the returned light passing through the collimating element 204 into an electrical signal.
  • each optical element is coated with an antireflection coating.
  • the thickness of the antireflection film is equal to or close to the wavelength of the light beam emitted by the emitter 203, which can increase the intensity of the transmitted light beam.
  • a filter layer is plated on the surface of an element on the beam propagation path in the distance measuring device, or a filter is provided on the beam propagation path to transmit at least the wavelength band of the beam emitted by the transmitter, Reflect other bands to reduce the noise caused by ambient light to the receiver.
  • the transmitter 203 may include a laser diode through which laser pulses in the order of nanoseconds are emitted.
  • the laser pulse receiving time may be determined, for example, by detecting the rising edge time and/or the falling edge time of the electrical signal pulse.
  • the distance measuring device 200 can calculate the TOF using the pulse reception time information and the pulse emission time information, thereby determining the distance between the detection object 201 and the distance measuring device 200.
  • the distance and orientation detected by the distance measuring device 200 can be used for remote sensing, obstacle avoidance, mapping, modeling, navigation, and the like.
  • lidar In the fields of laser radar and optical fiber communication, lasers are used as signal sources to emit laser signals with specific wavelengths and optical power according to specific applications.
  • the wavelength of the pulsed laser diode varies greatly with temperature. In the above temperature range, the wavelength change reaches more than 40nm. In order to adapt to the laser wavelength change, the design bandwidth of the receiving filter must be greater than 40nm, so that the received noise increases and the signal noise The ratio deteriorates and the range decreases. On the other hand, the laser lifetime decays significantly with increasing temperature.
  • the detection distance is mainly related to the power of the emitted laser. Under the premise of the same receiving sensitivity, the greater the power, the farther the detection distance. However, the wavelength and optical power of the laser diode are shifted as the ambient temperature changes. Therefore, the laser wavelength, power stability, and a wider ambient temperature range have become a major contradiction. Therefore, a complete temperature control scheme must be designed for the distance measuring device.
  • the distance measuring device in one embodiment of the present invention further includes a temperature control system
  • the temperature control system includes a heating circuit and/or a heat dissipation module, the heating circuit is used to control the temperature The device is heated, and the heat dissipation module is used to dissipate heat to the temperature-control device;
  • the temperature control system further includes a control module to control the temperature control device based on the comparison result of the current ambient temperature and the target temperature of the temperature-control device The heating circuit and/or the heat dissipation module are operated or turned off.
  • the above distance measuring device includes a heating circuit to start heating when the ambient temperature is too low, and the heat dissipation module is used to dissipate heat at high temperatures, so that the target temperature is controlled below the ambient temperature at high temperatures, and the target temperature is controlled at low temperatures.
  • the temperature range of the transmitter module including the transmitter is effectively reduced, the wavelength variation range is controlled, the design bandwidth of the receiving filter is reduced, the noise is reduced, the signal-to-noise ratio is increased, and the Range, and improve the life of the transmitter.
  • the temperature control system includes a heating circuit for heating the device to be controlled, the heating circuit may be any suitable circuit capable of heating, and the heating circuit includes at least one heating resistor . Furthermore, the heating circuit includes at least two heating resistors arranged in parallel.
  • the distance measuring device in order to detect the ambient temperature of the temperature-controlled device, further includes a temperature detection circuit for detecting the current ambient temperature of the temperature-controlled device.
  • the temperature detection circuit includes a temperature sensor, and the temperature sensor may be any type of sensor that can be used for temperature detection, including but not limited to a thermocouple or a thermistor.
  • the temperature control system further includes a control module for controlling the heating circuit to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the device to be controlled.
  • the control module specifically includes a processor and a heating control circuit (not shown).
  • the processor is used to obtain the ambient temperature of the temperature-controlling device, and convert the current ambient temperature A control signal is generated after comparing with the target temperature, for example, the temperature detection circuit detects the current ambient temperature of the device to be controlled, and the processor receives the current ambient temperature and compares the current ambient temperature with the target temperature After the control signal is generated.
  • the target temperature in this article refers to that the wavelength and power of the emitted beam of the transmitter are stable with small fluctuations at the target temperature or the range of the target temperature range.
  • the target temperature is a target temperature range interval
  • the target temperature includes a first target temperature (that is, target temperature 1 in FIG. 3) and a second target temperature (that is, The target temperature 2) in FIG. 3, wherein the first target temperature is less than the second target temperature, for example, the first target temperature is the upper limit of the target temperature, and the second target temperature is the lower limit of the target temperature, once detected If the current ambient temperature of the device to be controlled is less than the first target temperature or the temperature data is greater than the second target temperature, then the wavelength and power of the emitted beam of the transmitter will fluctuate.
  • the processor is specifically used to:
  • the current ambient temperature of the temperature-to-be-controlled device may also be referred to as a device to be heated), compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a A control signal for controlling the operation (including startup) of the heating circuit, if the current ambient temperature is greater than a second target temperature, a second control signal is generated for controlling the heating circuit to shut down, the shutting down includes controlling the heating
  • the circuit is always closed, or it may be that during the heating process of the heating circuit, once it is detected that the current ambient temperature is greater than the second target temperature, a second control signal for controlling the heating circuit to stop is generated.
  • the first target temperature range is between 0° and 50°, and/or, the second target temperature range is between 0° and 50°, the above temperature range is only an example, and for other The temperature ranges of wavelength and power temperature can also be applied to the embodiments of the present invention.
  • the first target temperature is 0° and the second target temperature is 50°
  • the control module is specifically used to control The temperature control device performs heating or cooling to control the temperature of the transmitter between the 0°-50°.
  • the first target temperature is 5° and the second target temperature is 40°
  • the control module is specifically used to control the temperature control device to heat or cool, so as to The temperature is controlled between 4° and 45°.
  • the first target temperature is 1° to 45° lower than the second target temperature, or 5° to 30° lower, and the first target temperature and the second target The temperature range of the temperature is still between 0° and 50°.
  • the heating control circuit is used to obtain the control signal and control the heating circuit to operate or shut down according to the control signal.
  • the control circuit may be any suitable circuit, and the processor may include a microprocessor (MCU).
  • MCU microprocessor
  • the control signal generated by the processor according to the comparison between the current ambient temperature and the target temperature is, for example, a PWM signal.
  • the heating control circuit includes a first switch circuit, a control terminal of the first switch circuit is connected to a control signal such as a PWM signal, and the control signal is used to control the first switch The on-off time of the circuit.
  • the control signal includes a PWM signal, and the on-off time of the first switching circuit is controlled by the duty cycle of the PWM signal to control the running time or the off time of the heating circuit.
  • the input terminal of the first switch circuit is electrically connected to the output terminal of the heating circuit, the output terminal of the first switch circuit is grounded, and the input terminal of the heating circuit is electrically connected to the power supply voltage VCC, which is To provide the working voltage for the heating circuit, the voltage value of the power supply voltage is reasonably set according to actual needs, and is not specifically limited here.
  • the first switching circuit includes a first MOS transistor Q1, the control signal is connected to the control terminal G of the first MOS transistor, and the source terminal of the first MOS transistor is One of the drain terminals serves as an input terminal of the first switching circuit, and the other serves as an output terminal of the first switching circuit.
  • the first switching circuit includes one of an NMOS transistor and a PMOS transistor, and the ON or OFF of the NMOS transistor or the PMOS transistor is controlled by a control signal to control the operation or shutdown of the heating circuit.
  • the control signal is connected to the control terminal G of the first MOS transistor
  • the source terminal of the first MOS transistor is One of the drain terminals serves as an input terminal of the first switching circuit, and the other serves as an output terminal of the first switching circuit.
  • the first switching circuit includes one of an NMOS transistor and a PMOS transistor, and the ON or OFF of the NMOS transistor or the PMOS transistor is controlled by a control signal to control the operation or shutdown of the heating circuit.
  • the first switching circuit includes an NMOS transistor, the gate G of the NMOS transistor is electrically connected to a control signal (eg, a PWM signal), the source S of the NMOS transistor is grounded, and the drain D of the NMOS transistor is electrically connected to the output of the heating circuit, wherein
  • the NMOS transistor turns on when connected to a high level, the heating circuit starts to heat, and turns off when connected to a low level, and the heating circuit is turned off.
  • the heating control circuit further includes a first filter circuit for filtering the control signal input to the first switching circuit.
  • the input terminal of the first filter circuit is electrically connected to the control signal, and the output terminal of the first filter circuit is grounded (that is, connected to a low potential).
  • the first filter circuit may be any suitable filter circuit, and may include at least one of a capacitor, a resistor, or an inductor capable of performing a filter function.
  • the first filter circuit includes A resistor R1 and a capacitor C1.
  • the temperature control system further includes a second filter circuit for filtering the voltage output by the power supply voltage VCC.
  • the input terminal of the second filter circuit is electrically connected to the power supply voltage, and the output terminal of the second filter circuit is grounded.
  • the second filter circuit may be any suitable filter circuit, and may include at least one of a capacitor, a resistor, or an inductor capable of performing a filtering function.
  • the second filter circuit includes a capacitor C2 The input terminal of the capacitor is electrically connected to the power supply voltage, and the output terminal is grounded.
  • the heating circuit includes four heating resistors R2, R3, R4, and R5 connected in parallel, or may include other numbers of heating resistors, which are not specifically limited herein.
  • the heating circuit includes a heating resistor. Due to the low cost of the heating resistor, the cost of the entire temperature control system can be reduced, and the processor (such as a microprocessor) is used to directly control the first duty cycle of the control signal (such as the PWM signal). The on-off time of the switch circuit (such as MOS tube), and then control the heating heat of the heating resistor, the higher the duty cycle of the PWM signal, the greater the heat generation, so as to achieve the heating of the temperature control device at low temperature.
  • the processor such as a microprocessor
  • the heating control circuit includes a first switching circuit, a control terminal of the first switching circuit is connected to a control signal such as a PWM signal, and the control signal is used to control the first The on-off time of the switching circuit.
  • the control signal includes a PWM signal, and the on-off time of the first switching circuit is controlled by the duty cycle of the PWM signal to control the running time or the off time of the heating circuit.
  • the input terminal of the first switching circuit is electrically connected to the output terminal of the heating circuit, and the output terminal of the first switching circuit is grounded.
  • the first switching circuit includes a first MOS transistor Q1, the control signal is connected to the control terminal G of the first MOS transistor, and the source terminal of the first MOS transistor is One of the drain terminals serves as an input terminal of the first switching circuit, and the other serves as an output terminal of the first switching circuit.
  • the first switch circuit includes one of an NMOS transistor and a PMOS transistor, and the control signal controls the on or off of the NMOS transistor or the PMOS transistor, thereby controlling the heating circuit to operate or shut off.
  • the first MOS transistor Q1 may be an NMOS transistor.
  • the gate G of the NMOS transistor is connected to a control signal, such as a PWM signal, and is turned on when the control signal is at a high level, and the circuit between the control power supply and the ground is turned on.
  • the temperature control system further includes a switching power supply for converting the control signal into a DC voltage, so that the heating circuit continues to generate heat.
  • the design of the switching power supply realizes the conversion of the control signal, such as the PWM signal, to DC, and the heating circuit can continue to generate heat to make the heat generation more uniform.
  • the duty ratio of the control signal of the PWM signal controls the heating value of the heating circuit. The higher the duty ratio, the higher the output voltage of the switching power supply, and the higher the operating voltage of the heating circuit and the greater the heating value.
  • the switching power supply may be any suitable switching power supply, such as a BUCK switching power supply.
  • the switching power supply is a BUCK switching power supply.
  • the switching power supply includes a second switching circuit, an energy storage circuit, an output filter circuit, and a freewheeling circuit.
  • the second switching circuit is used to control the charging and discharging of the energy storage circuit of the switching power supply.
  • the second switching circuit includes a second MOS transistor Q2, wherein one end of the source and drain terminals of the second MOS transistor is electrically connected to the power supply voltage, and the other end is electrically connected to the energy storage circuit
  • the second MOS transistor Q2 is a PMOS transistor.
  • the energy storage circuit is used for storing electrical energy when the second switching circuit is on and discharging when the second switching circuit is off.
  • the energy storage circuit includes at least one inductor L1.
  • the output filter circuit is used for charging when the second switch circuit is on and discharging when the second switch circuit is off; for example, the output filter circuit includes a capacitor C2.
  • the freewheeling circuit is turned on when the second switch circuit is turned off, and is used for freewheeling to provide a discharge circuit of the energy storage circuit.
  • the freewheeling circuit includes a diode D1, or other suitable circuits or components.
  • the input end of the second switch circuit is electrically connected to the power supply voltage
  • the output end of the second switch circuit is electrically connected to the input end of the energy storage circuit
  • the output end of the energy storage circuit is electrically connected to the The input end of the output filter circuit, the output end of the output filter circuit is grounded; one end of the freewheeling circuit is electrically connected to the input end of the energy storage circuit, and the other end is grounded, for example, the diode D1 of the freewheeling circuit
  • the cathode of is electrically connected to the input end of the energy storage circuit, and the anode of the diode is grounded.
  • the distance measuring device further includes a voltage divider circuit, a voltage divider node of the voltage divider circuit is electrically connected to the control terminal of the second switch circuit, and is used to control the second switch circuit to be turned on or off . Since the turn-on and turn-off of the voltage dividing circuit is controlled by the first switch circuit, that is, when the first switch circuit is turned on, the second switch circuit is also turned on, and when the first switch circuit is turned off, the second switch circuit is also turned off. Furthermore, the output terminal of the voltage dividing circuit is electrically connected to the input terminal of the heating control circuit, and the input terminal of the voltage dividing circuit is electrically connected to the power supply voltage.
  • the voltage dividing circuit includes at least two resistors connected in series, for example, as shown in FIG. 5, the voltage dividing circuit includes a resistor R1 and a resistor R2 connected in series, wherein the voltage dividing node is located between the two resistors
  • the control terminal of the second switching circuit is the gate G of the PMOS transistor, which is electrically connected to the voltage dividing node of the voltage dividing circuit, so that the voltage connected to the PMOS transistor is less than the power supply voltage VCC electrically connected to the source S of the PMOS transistor Therefore, when the first switching circuit is turned on, the second switching circuit including the PMOS transistor is also turned on.
  • the diode D1 electrically connected to the PMOS transistor is turned off, and the energy storage inductor L1 is magnetized and flows through the inductor The current increases linearly while charging capacitor C2 to provide energy to the heating circuit.
  • the heating circuit includes parallel heating resistors R3, R4, R5, and R6 to provide energy. At this time, the heating circuit works to heat the temperature control device, and the first switch When the circuit is turned off, the second switching circuit including the PMOS transistor is also turned off.
  • the diode D1 is turned on, the energy storage inductor L1 is discharged through the diode D1, the inductor current decreases linearly, the output voltage is discharged by the output filter capacitor C2 and the reduced inductance The current is maintained to continue to provide energy to the heating circuit so that the heating circuit can continue to generate heat.
  • the duty cycle of the PWM signal controls the heating value of the heating resistor. The higher the duty cycle, the higher the output voltage of the BUCK switching power supply, and the higher the operating voltage of the heating resistor and the greater the heating value.
  • the distance measuring device further includes a circuit board (not shown), and the temperature-to-be-controlled device 301 is disposed on the circuit board.
  • the temperature control device includes at least one of the foregoing transmitter, receiver, and analog circuit.
  • the distance measuring device further includes a thermally conductive layer 300, which is disposed on the circuit board below the temperature-to-be-controlled device 301, and is used to conduct the heat generated by the heating resistor to all Narrate temperature control device 301.
  • the heat conductive layer 300 may be any suitable metal heat conductive layer, such as copper, silver, aluminum and other metals.
  • the material of the thermally conductive layer includes a ground layer, which can be used not only for electrically connecting devices in the circuit that need to be grounded, but also as a thermal conductive layer to conduct the heat generated by the heating resistor to the temperature to be controlled Device 301.
  • the heat of the heating circuit may be conducted to other devices to be controlled, and other unnecessary areas may also be heated, affecting the heating efficiency.
  • at least one thermal island 302 is provided on the thermal conductive layer 300, the thermal island is used to isolate the thermal conductive layers 300 on opposite sides of the thermal island, so that the heat will be more concentratedly conducted to the temperature-controlled device 301.
  • PMOS can realize the heating resistance through the heat conduction layer of the ground layer for thermal conduction, and can form a thermal island on the circuit board to reduce the area of the heating object and improve the heating efficiency, especially the When the embodiment is incorporated in FIG. 4.
  • the plurality of thermal islands 302 are arranged in a ring shape at intervals along the circumference of the device to be controlled.
  • the ring shape includes a circular ring shape or a polygonal ring shape, or another ring shape with a suitable shape.
  • each of the thermal islands 302 has a long shape.
  • the thermal island 302 may be an opening penetrating the thermal conductive layer 300, or may also be a layer of thermal insulation material penetrating the thermal conductive layer 300, such as an insulating layer or other materials with poor thermal conductivity.
  • the temperature of the distance measuring device especially the device to be temperature controlled
  • a copper block is used between the internal device of the product and the housing Thermally conductive media can reduce thermal resistance and ensure the thermal conductivity of internal devices.
  • the position of some devices relative to the case is fixed. Simply select the inner surface of a case parallel to the heat dissipation surface of the device, and press the copper block between these two parallel surfaces. When the case is installed, both sides of the copper block It will naturally closely fit the internal devices and the shell to achieve good heat transfer, as shown in Figure 7, and the position of some devices relative to the shell may be adjusted unless the copper block of different thickness or the position of the shell is adjustable. The method does not apply. Therefore, in one embodiment of the present invention, an adjustable thermal conductive medium is provided, and the thermal conductive medium will be exemplarily described below with reference to FIGS. 8 to 12.
  • the distance measuring device further includes at least one thermally conductive medium 700, and the thermally conductive medium 700 includes a heat dissipation portion 701, and at least a part of the surface of the heat dissipation portion fits the to-be-controlled At least a part of the heat dissipation surface of the temperature device (not shown) is used to extract the heat of the temperature-control device.
  • the material of the heat conducting medium includes metal, wherein the metal includes copper.
  • the thermally conductive medium 700 further includes an installation portion 703, wherein the installation portion 703 is used to install the thermally conductive medium 700 on the housing of the distance measuring device, and the housing may be used for installation Housings of various optical elements of the distance measuring device, such as collimating elements, optical elements in the scanning module, optical path changing elements, etc.
  • the mounting portion 703 and the heat dissipation portion 701 are connected to each other at a predetermined angle, and/or, the mounting portion 703 and the heat dissipation portion 701 are integrally formed.
  • the predetermined angle is substantially 90°.
  • the specific shape of the heat dissipation part 701 can be matched according to the housing space between the housing of the actual distance-measuring device and the device to be temperature-controlled.
  • the thickness of the area where the mounting portion 703 is provided with the waist hole 704 is smaller than the thickness of other areas of the heat conductive medium 700. Since the thickness of other regions is thicker, the thermal resistance can be reduced.
  • At least one waist hole 704 is provided on the mounting portion 703, and the length of the waist hole 704 is greater than the radial length of the connecting member passing through the waist hole to fasten the connecting member Adjust the position of the conductive medium in the length direction of the waist hole at the front, so that the heat dissipation part of the conductive medium is closer to the device to be temperature controlled, which is beneficial to the heat extraction of the device to be temperature controlled.
  • the radial length of the connecting piece (when the cross-section of the connecting piece is circular, the length of the connecting piece refers to the diameter of the connecting piece) is smaller than the width of the waist hole, so that before the connecting piece is fastened
  • the width direction of the waist hole adjusts the position of the conductive medium, so that the heat dissipation portion of the conductive medium is closer to the device to be temperature controlled, which is beneficial to the heat extraction of the device to be temperature controlled.
  • the length extension direction of the waist hole 704 is perpendicular to the heat dissipation surface of the temperature-controlling device, so as to adjust the heat dissipation portion to fit the Temperature control device.
  • the distance measuring device further includes at least one connector 705, and the connector includes at least one of screws and bolts.
  • the connecting member 705 passes through the waist hole to install the heat conductive medium 700 on the housing 900.
  • a gasket 706 is further provided between the end of the connecting member 705 facing away from the housing 900 and the waist hole, and the diameter of the gasket 706 should be greater than the width of the waist hole.
  • the heat dissipation portion 701 includes a first surface and a second surface that are disposed oppositely.
  • the first surface and the second surface of the heat dissipation portion 701 are opposite, not parallel surfaces.
  • a bump 702 is further provided on the first surface of the heat dissipation portion adjacent to the temperature-controlling device, and at least a part of the surface of the bump 702 opposite to the first surface conforms to the temperature-controlling device Cooling surface.
  • the size of the surface of the bump 702 that fits the temperature-control device is smaller than the size of the first surface of the heat dissipation portion 701. Among them, the function of the bump 702 is to avoid heat reflow.
  • bumps may be provided on only part of the thermally conductive medium, wherein the material of the bumps includes any good thermally conductive materials, such as metal materials, and the metal materials include copper or other materials.
  • the bumps may be welded or bonded
  • the heat sink 701 may be integrally formed with the heat sink 701.
  • the distance measuring device includes at least two of the thermally conductive media, wherein the protrusions are provided on the heat dissipation portions of the thermally conductive media of the at least two of the thermally conductive media.
  • the distance measuring device includes a first temperature-controlled device and a second temperature-controlled device, wherein the distance measuring device includes a first heat-conductive medium and a second heat-conductive medium, and the The bumps are provided on the heat dissipation part, and the bumps on the first heat-conducting medium are attached to at least part of the heat dissipation surface of the first temperature-controlling device. For example, as shown in FIG.
  • the device includes an emitter 203, and a bump 702 is provided only on the thermally conductive medium 700 attached to the emitter 203; the heat dissipation portion of the second thermally conductive medium is attached to at least a part of the heat dissipation surface of the second temperature-controlled device.
  • the second temperature-controlled device includes a detector 205.
  • the distance measuring device includes at least two of the thermally conductive media, wherein at least a part of the surface of the heat dissipation portion of each of the thermally conductive media conforms to different temperatures to be controlled
  • a device for respectively deriving the heat of the corresponding temperature-controlling device for example, including a heat-conducting medium 800 and a heat-conducting medium 700, the heat dissipation portion of the heat-conducting medium 800 is at least partially surface-fitted to the detector 205, and the heat dissipation portion of the heat-conducting medium 700 is at least Part of the surface is attached to the emitter 203.
  • the temperature-to-be-controlled device is installed in the accommodating cavity of the housing 400, and two opposite surfaces of the heat dissipation portion of the heat-conducting medium 700 are at least partially attached to the heat dissipation surface of the device to be temperature-controlled and Part of the surface of the housing 400 is used to conduct the heat of the device to be temperature controlled (for example, the transmitter 203) to the housing 400 through the heat conductive medium 700, thereby achieving heat dissipation.
  • the housing is located in the receiving cavity of the housing.
  • one plane of the housing is perpendicular to the heat dissipation surface of the device to be temperature-controlled, ensuring that there are two vertical first planes and second planes corresponding to the heat conductive medium such as a copper block structure.
  • the heat-conducting medium can be translated on the second plane to adjust the position.
  • the heat-conducting medium can also be closely attached when the housing is installed.
  • the first plane and the second plane respectively serve as a fitting surface and a mounting surface for the temperature-controlled device.
  • An elongated waist hole is formed on the second plane, and the width and length of the waist hole are larger than the diameter of the screw.
  • the copper block can still use the gap to adjust in different directions. In other non-critical parts, the copper block can be increased in thickness as much as possible to reduce the thermal resistance.
  • the structure of the heat conduction medium (such as copper block) designed by the invention can be in the same specification, so that the heat conduction medium is closely adhered to the temperature-controlled device and the casing at the same time, and the position of the casing is not adjusted.
  • the above heat conduction medium is good for heat conduction Channels to direct heat out of the enclosure.
  • the temperature control system of the present invention further includes a heat dissipation module, and the heat dissipation module is used to dissipate heat to the temperature-controlled device.
  • the heat dissipation module may include a fan or other devices for heat dissipation.
  • the temperature control system further includes a control module for controlling the heat dissipation module to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the device to be controlled.
  • control module includes a processor and a heat dissipation control circuit, configured to obtain the ambient temperature of the temperature-controlled device, and compare the current ambient temperature with the target temperature to generate a control signal;
  • the heat dissipation control circuit is used to obtain the control signal and control the heat dissipation module to operate or shut down according to the control signal.
  • the target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is less than the second target temperature
  • the processor is specifically configured to: obtain the current ambient temperature of the temperature-controlling device , Compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a first control signal for controlling the heat dissipation module to shut down, if the current environment If the temperature is greater than the second target temperature, a second control signal is generated for controlling the operation of the heat dissipation module.
  • the target temperature includes a first target temperature and a second target temperature
  • the second target temperature is greater than the first target temperature
  • the heat dissipation control circuit is specifically configured to: when the current ambient temperature is less than The first target temperature controls the heat dissipation module to be turned off; when the current ambient temperature is greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
  • the heat dissipation control circuit may receive the above control signal generated by the processor, and perform corresponding actions according to the control signal.
  • the distance measuring device further includes a temperature detection circuit for detecting the current ambient temperature of the temperature control device.
  • the temperature detection circuit includes a temperature sensor, and the temperature sensor may be any type of sensor that can be used for temperature detection, including but not limited to a thermocouple or a thermistor.
  • the distance measuring device is powered on, for example, the lidar is powered on
  • the temperature detection circuit detects the current ambient temperature of the temperature-controlled device
  • the current environment is controlled by the control module
  • the temperature is compared with a second target temperature (for example, target temperature a)
  • the heat dissipation module is controlled to be turned off, for example, the fan is stopped, if the current ambient temperature is greater than or equal to the At the second target temperature, the speed is adjusted according to the speed regulation strategy.
  • FIG. 14 shows a speed regulation strategy in a specific embodiment.
  • the target temperature includes a first target temperature (temperature d), a second target temperature (temperature a), a third target temperature (temperature b), and a fourth target temperature (for example, temperature c), where the first target temperature is greater than the first
  • the above temperature can be set reasonably according to the temperature requirements of the device. For example, the above temperatures can all be set between 0 and 50°, within a smaller temperature range.
  • the heat dissipation control circuit is further specifically configured to: if the current ambient temperature is between the second target temperature and the third target temperature, control the heat dissipation rate of the heat dissipation module to be maintained at the first rate; The current ambient temperature is greater than or equal to the third target temperature and less than the fourth target temperature, and the heat dissipation rate of the heat dissipation module is controlled between the first rate and the second rate, wherein the second rate Greater than the first rate; and if the current ambient temperature is greater than or equal to the fourth target temperature, controlling the rate of heat dissipation of the heat dissipation module to be maintained at the second rate.
  • the heat dissipation control circuit is further specifically configured to: when the current ambient temperature gradually increases from less than the first target temperature to between the first target temperature and the second target temperature, control The heat dissipation module is turned off; when the current ambient temperature continues to rise to greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
  • the heat dissipation control circuit is further specifically configured to: when the current ambient temperature decreases from greater than or equal to the second target temperature to between the first target temperature and the second target temperature, control The heat dissipation rate of the heat dissipation module is maintained at a first rate; when the current ambient temperature decreases to less than the first target temperature, the heat dissipation module is controlled to be turned off.
  • the heat dissipation rate of the heat dissipation module is adjusted appropriately, which can increase the heat dissipation rate when the temperature is high, so as to quickly cool the temperature, but at a slightly higher temperature, but does not meet the target
  • the heat can be dissipated at a slightly lower heat dissipation rate.
  • the heat dissipation module can be kept closed to improve the heat dissipation efficiency and improve the temperature control accuracy of the distance measuring device.
  • the aforementioned heat dissipation module includes a fan
  • the heat dissipation control circuit is further specifically used to: control the rotation speed of the fan by controlling the duty ratio of the fan, thereby controlling the heat dissipation rate of the heat dissipation module, wherein, the duty The greater the ratio, the greater the heat dissipation rate of the heat dissipation module.
  • the duty cycle includes a first duty cycle X and a second duty cycle Y, the second duty cycle is greater than the first duty cycle
  • the heat dissipation control circuit is specifically Used to: control the fan to operate at the first duty ratio to control the heat dissipation rate of the heat dissipation module to maintain the first rate; control the fan to operate at the second duty ratio to control The heat dissipation rate of the heat dissipation module is maintained at the second rate; and the duty ratio of the fan is controlled to change between the first duty ratio and the second duty ratio to control the heat dissipation module The heat dissipation rate is between the first rate and the second rate.
  • the heat dissipation control circuit is specifically configured to: control the duty ratio of the fan to change linearly between the first duty ratio and the second duty ratio to control the heat dissipation module
  • the heat dissipation rate is between the first rate and the second rate; the duty ratio of the fan is controlled to be zero to control the heat dissipation module to be turned off.
  • the temperature-to-be-controlled device is installed in a receiving cavity in the housing, wherein the heat dissipation module is used to dissipate heat to the housing.
  • the shell may include a metal shell or the like having a good thermal conductivity.
  • the lidar performs temperature comparison after power-on. If the current ambient temperature of the device to be controlled is measured to be less than or equal to temperature a, the fan stops, otherwise the fan is adjusted as shown in Figure 14.
  • the speed strategy adjusts the duty cycle of the fan, and then realizes the adjustment control of the rotation speed; specific adjustment methods include but are not limited to the linear speed regulation shown in FIG. 14.
  • the speed regulation strategy shown in Figure 14 includes the following strategies:
  • the duty cycle of the fan is linearly adjusted between X and 100%;
  • the fan duty cycle maintains the fan speed setting maximum duty cycle Y;
  • the fan duty cycle is adjusted to X, and work begins;
  • the fan duty cycle is adjusted to 0, and the fan stops working.
  • the temperature control scheme of the distance measuring device of the present invention is more reasonable, and the heat of the temperature-controlled devices (such as the transmitter and receiver) is quickly transferred to the housing of the distance measuring device through a low thermal resistance transmission path such as a thermally conductive medium. Then control the heat dissipation module of the fan to work to dissipate heat to the housing of the distance measuring device, and start heating through the heating circuit when the ambient temperature is too low to heat the temperature control device.
  • a low thermal resistance transmission path such as a thermally conductive medium.
  • the target temperature is controlled below the ambient temperature when high temperature is achieved, and the target temperature is controlled above the ambient temperature when low temperature, which effectively reduces the temperature range of the transmitter, controls the wavelength variation range, and reduces the design of the receiving filter Bandwidth reduces noise, improves signal-to-noise ratio, and increases range. Moreover, the life of the transmitter is improved, and the temperature is accurately controlled, and the stability of the distance measuring device is improved.
  • the distance measuring device of the embodiment of the present invention can be applied to a mobile platform, and the distance measuring device can be installed on the platform body of the mobile platform.
  • a mobile platform with a distance measuring device can measure the external environment, for example, measuring the distance between the mobile platform and obstacles for obstacle avoidance and other purposes, and performing two-dimensional or three-dimensional mapping on the external environment.
  • the mobile platform includes at least one of an unmanned aerial vehicle, a car, a remote control car, a robot, a boat, and a camera.
  • the platform body is the fuselage of the unmanned aerial vehicle.
  • the distance measuring device is applied to an automobile, the platform body is the body of the automobile.
  • the car may be a self-driving car or a semi-automatic car, and no restriction is made here.
  • the platform body is the body of the remote control car.
  • the platform body is a robot.
  • the distance measuring device is applied to a camera, the platform body is the camera itself.
  • the disclosed device and method may be implemented in other ways.
  • the device embodiments described above are only schematic.
  • the division of the units is only a division of logical functions.
  • there may be other divisions for example, multiple units or components may be combined or Can be integrated into another device, or some features can be ignored, or not implemented.
  • the various component embodiments of the present invention may be implemented in hardware, or implemented in software modules running on one or more processors, or implemented in a combination thereof.
  • a microprocessor or a digital signal processor (DSP) may be used to implement some or all functions of some modules according to embodiments of the present invention.
  • DSP digital signal processor
  • the present invention can also be implemented as a device program (for example, a computer program and a computer program product) for performing a part or all of the method described herein.
  • a program implementing the present invention may be stored on a computer-readable medium, or may have the form of one or more signals.
  • Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

Abstract

A distance measurement apparatus (100) and a mobile platform. The distance measurement apparatus (100) comprises a transmission module, a receiving module, and a temperature control system, wherein the transmission module is used for emitting an optical pulse; the receiving module is used for receiving at least part of the optical pulse reflected by an object, and determining a distance of the object with respect to the distance measurement apparatus (100) according to the received at least part of the optical pulse; the temperature control system comprises: a heating circuit and/or a heat dissipation module, the heating circuit being used for heating a device (301) to be temperature-controlled, and the heat dissipation module is used for performing heat dissipation on the device (301); and the distance measurement device further comprises a control module which is used for controlling the operation or turn-off of the heating circuit and/or the heat dissipation module on the basis of a comparison result of the current environment temperature of the device (301) and a target temperature. Accurate control of a temperature range is implemented by means of a heating function of the heating circuit or a refrigeration function of the heat dissipation module.

Description

一种测距装置及移动平台Distance measuring device and mobile platform
说明书Instructions
技术领域Technical field
本发明总地涉及测距装置技术领域,更具体地涉及一种测距装置统及移动平台。The invention generally relates to the technical field of distance measuring devices, and more particularly to a range measuring device system and a mobile platform.
背景技术Background technique
激光雷达是一种外界的感知系统,通过发射并接收处理光波信息可以获知外界的立体三维信息,不再局限于相机等对外界的平面感知方式。其原理为主动对外发射激光脉冲信号,探测到反射回来的脉冲信号,根据发射—接收之间的时间差,判断被测物体的距离;结合光脉冲的发射角度信息,便可重建获知三维深度信息。激光测距是与激光雷达原理类似的应用领域,同样需要获知发射脉冲与接收脉冲之间的时间差信息以获知被测物体距离。但激光测距仪没有角度信息,只能获知发射方向上的单维空间距离信息。Lidar is a perception system of the outside world. By transmitting and receiving light wave information, the three-dimensional and three-dimensional information of the outside world can be obtained. The principle is to actively emit a laser pulse signal to the outside, detect the reflected pulse signal, and judge the distance of the measured object according to the time difference between transmission and reception; combined with the information of the angle of emission of the optical pulse, the three-dimensional depth information can be reconstructed and learned. Laser ranging is an application field similar to the principle of lidar. It also needs to know the time difference between the transmitted pulse and the received pulse to know the distance of the measured object. However, the laser rangefinder does not have angle information, and can only obtain the single-dimensional spatial distance information in the emission direction.
在激光雷达、光纤通信等领域,激光器作为信号源,根据具体应用场合,发射特定范围波长、光功率的激光信号。激光雷达一些典型应用场景,比如自动驾驶或地图测绘的汽车、智能机器人、无人机等环境温度范围跨度很大,覆盖-40~85℃的环境温度范围。In the fields of laser radar and optical fiber communication, lasers are used as signal sources to emit laser signals with specific wavelengths and optical power according to specific applications. Some typical application scenarios of lidar, such as automobiles, intelligent robots, drones, etc. for autonomous driving or map mapping, have a wide environmental temperature range, covering an ambient temperature range of -40 to 85°C.
而脉冲激光二极管(PLD)发光波长随温度变化很大,在以上温度范围内波长变化达到40nm以上,为了适应激光器波长变化接收滤波器设计带宽就要大于40nm,从而接收到的噪声增加,信噪比恶化,量程降低。另一方面,激光器寿命随着温度升高显著衰减。而探测距离主要与发射激光功率相关,接收灵敏度一致的前提下,功率越大,探测距离越远。但是激光二极管的波长、光功率随着环境温度的改变而发生偏移,因此激光的波长、功率稳定性和较宽环境温度范围就成为一对主要矛盾。因此必须针对测距装置设计完备的温控方案。The wavelength of the pulsed laser diode (PLD) varies greatly with temperature. In the above temperature range, the wavelength change reaches more than 40nm. In order to adapt to the laser wavelength change, the design bandwidth of the receiving filter must be greater than 40nm, so that the received noise increases and the signal noise The ratio deteriorates and the range decreases. On the other hand, the laser lifetime decays significantly with increasing temperature. The detection distance is mainly related to the power of the emitted laser. Under the premise of the same receiving sensitivity, the greater the power, the farther the detection distance. However, the wavelength and optical power of the laser diode are shifted as the ambient temperature changes. Therefore, the laser wavelength, power stability, and a wider ambient temperature range have become a major contradiction. Therefore, a complete temperature control scheme must be designed for the distance measuring device.
发明内容Summary of the invention
为了解决上述问题中的至少一个而提出了本发明。具体地,本发明一方面提供一种测距装置,所述测距装置包括发射模块、接收模块和温度控制系统,The present invention has been proposed to solve at least one of the above problems. Specifically, one aspect of the present invention provides a distance measuring device, the distance measuring device includes a transmitting module, a receiving module, and a temperature control system,
所述发射模块用于出射光脉冲;The transmitting module is used to emit light pulses;
所述接收模块用于接收经物体反射回的至少部分光脉冲,以及根据所述接收的至少部分光脉冲确定所述物体相对所述测距装置的距离;The receiving module is configured to receive at least part of the optical pulse reflected back by the object, and determine the distance of the object relative to the distance measuring device according to the received at least part of the optical pulse;
所述温度控制系统包括:The temperature control system includes:
加热电路和/或散热模块,所述加热电路用于对待控温器件进行加热,所述散热模块用于对所述待控温器件进行散热;A heating circuit and/or a heat dissipation module, the heating circuit is used to heat the temperature control device, and the heat dissipation module is used to dissipate heat to the temperature control device;
控制模块,用于基于所述待控温器件的当前环境温度和目标温度的比较结果,控制所述加热电路和/或所述散热模块运行或关闭。The control module is configured to control the heating circuit and/or the heat dissipation module to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the temperature-controlling device.
示例性地,所述控制模块包括:Exemplarily, the control module includes:
处理器,用于获取所述待控温器件的环境温度,并将所述当前环境温度与所述目标温度进行比较后生成控制信号;A processor, configured to obtain the ambient temperature of the temperature-controlled device, and compare the current ambient temperature with the target temperature to generate a control signal;
加热控制电路和/或散热控制电路,所述加热控制电路用于获取所述控制信号,以及控制所述加热电路根据所述控制信号运行或关闭,所述散热控制电路用于获取所述控制信号,控制所述散热模块根据所述控制信号运行或关闭。A heating control circuit and/or a heat dissipation control circuit, the heating control circuit is used to obtain the control signal, and the heating circuit is controlled to operate or shut down according to the control signal, and the heat dissipation control circuit is used to obtain the control signal , Control the heat dissipation module to run or shut down according to the control signal.
示例性地,所述目标温度包括第一目标温度和第二目标温度,其中,所述第一目标温度小于所述第二目标温度,所述处理器具体用于:Exemplarily, the target temperature includes a first target temperature and a second target temperature, where the first target temperature is less than the second target temperature, and the processor is specifically configured to:
获取所述待控温器件的当前环境温度,将所述当前环境温度与所述目标温度进行比较,若所述当前环境温度小于所述第一目标温度,则生成第一控制信号,用于控制所述加热电路运行或控制所述散热模块关闭,若所述当前环境温度大于第二目标温度,则生成第二控制信号,用于控制所述加热电路关闭或控制所述散热模块运行。Obtain the current ambient temperature of the temperature-controlled device, compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a first control signal for controlling The heating circuit operates or controls the heat dissipation module to be turned off. If the current ambient temperature is greater than the second target temperature, a second control signal is generated for controlling the heating circuit to turn off or the heat dissipation module to operate.
示例性地,所述加热控制电路包括第一开关电路,所述第一开关电路的控制端连接所述控制信号,所述控制信号用于控制所述第一开关电路的通断时间。Exemplarily, the heating control circuit includes a first switching circuit, a control terminal of the first switching circuit is connected to the control signal, and the control signal is used to control the on-off time of the first switching circuit.
示例性地,所述控制信号包括PWM信号,通过所述PWM信号的占空比控制所述第一开关电路的通断时间,以控制所述加热电路的运行时间或关闭时间。Exemplarily, the control signal includes a PWM signal, and the on-off time of the first switching circuit is controlled by the duty cycle of the PWM signal to control the running time or the off time of the heating circuit.
示例性地,所述第一开关电路的输入端电连接所述加热电路的输出端,所述第一开关电路的输出端接地;Exemplarily, the input terminal of the first switching circuit is electrically connected to the output terminal of the heating circuit, and the output terminal of the first switching circuit is grounded;
和/或,所述加热电路的输入端电连接电源电压。And/or, the input end of the heating circuit is electrically connected to the power supply voltage.
示例性地,所述第一开关电路包括第一MOS管,所述控制信号连接所述第一MOS管的控制端,所述第一MOS管的源端和漏端中的一个作为所述第一开关电路的输入端,另一个作为所述第一开关电路的输出端。Exemplarily, the first switching circuit includes a first MOS tube, the control signal is connected to a control terminal of the first MOS tube, and one of the source terminal and the drain terminal of the first MOS tube serves as the first One input terminal of the switch circuit, the other serves as the output terminal of the first switch circuit.
示例性地,加热控制电路还包括第一滤波电路,用于对输入至所述第一开关电路之前的控制信号进行滤波。Exemplarily, the heating control circuit further includes a first filtering circuit for filtering the control signal input to the first switching circuit.
示例性地,所述第一滤波电路的输入端电连接所述控制信号,所述第一滤波电路的输出端接地。Exemplarily, the input terminal of the first filter circuit is electrically connected to the control signal, and the output terminal of the first filter circuit is grounded.
示例性地,所述第一滤波电路包括并联设置的一个电阻和一个电容。Exemplarily, the first filter circuit includes a resistor and a capacitor arranged in parallel.
示例性地,所述测距装置还包括开关电源,用于将所述控制信号转换为直流电压,以使所述加热电路持续发热。Exemplarily, the distance measuring device further includes a switching power supply for converting the control signal into a DC voltage, so that the heating circuit continuously generates heat.
示例性地,所述开关电源包括:Exemplarily, the switching power supply includes:
第二开关电路,用于控制所述开关电源的储能电路的充放电;A second switching circuit for controlling the charging and discharging of the energy storage circuit of the switching power supply;
储能电路,用于在所述第二开关电路导通时储存电能以及在所述第二开关电路截止时放电;An energy storage circuit for storing electrical energy when the second switching circuit is on and discharging when the second switching circuit is off;
输出滤波电路,用于在所述第二开关电路导通时充电以及在所述第二开关电路截止时放电。The output filter circuit is used for charging when the second switching circuit is turned on and discharging when the second switching circuit is turned off.
示例性地,所述第二开关电路的输入端电连接电源电压,所述第二开关电路的输出端电连接所述储能电路的输入端;以及Exemplarily, the input terminal of the second switch circuit is electrically connected to the power supply voltage, and the output terminal of the second switch circuit is electrically connected to the input terminal of the energy storage circuit; and
所述储能电路的输出端电连接所述输出滤波电路的输入端,所述输出滤波电路的输出端接地。The output terminal of the energy storage circuit is electrically connected to the input terminal of the output filter circuit, and the output terminal of the output filter circuit is grounded.
示例性地,所述第二开关电路包括第二MOS管,其中,所述第二MOS管的源端和漏端中的一端电连接所述电源电压,另一端电连接所述储能电路的输入端。Exemplarily, the second switch circuit includes a second MOS tube, wherein one end of the source and drain terminals of the second MOS tube is electrically connected to the power supply voltage, and the other end is electrically connected to the power storage circuit. Input.
示例性地,所述第一开关电路包括NMOS晶体管和PMOS晶体管中的一个,和/或,所述第二MOS管包括PMOS晶体管。Exemplarily, the first switching circuit includes one of an NMOS transistor and a PMOS transistor, and/or, the second MOS transistor includes a PMOS transistor.
示例性地,所述开关电源还包括:Exemplarily, the switching power supply further includes:
续流电路,所述续流电路在所述第二开关电路截止时导通,用于起到续流作用,以提供所述储能电路的放电回路。A freewheeling circuit, the freewheeling circuit is turned on when the second switching circuit is turned off, and is used for a freewheeling function to provide a discharge circuit of the energy storage circuit.
示例性地,所述续流电路的一端电连接所述储能电路的输入端,另一端 接地。Exemplarily, one end of the freewheeling circuit is electrically connected to the input end of the energy storage circuit, and the other end is grounded.
示例性地,所述续流电路包括二极管,其中,所述二极管的阴极电连接储能电路的输入端,所述二极管的阳极接地。Exemplarily, the freewheeling circuit includes a diode, wherein the cathode of the diode is electrically connected to the input terminal of the energy storage circuit, and the anode of the diode is grounded.
示例性地,所述温度控制系统还包括分压电路,所述分压电路的分压节点电连接所述第二开关电路的控制端,用于控制所述第二开关电路导通或截止。Exemplarily, the temperature control system further includes a voltage dividing circuit, and the voltage dividing node of the voltage dividing circuit is electrically connected to the control terminal of the second switching circuit, and is used to control the second switching circuit to be turned on or off.
示例性地,所述分压电路的输出端电连接所述加热控制电路的输入端,所述分压电路的输入端电连接所述电源电压。Exemplarily, the output terminal of the voltage dividing circuit is electrically connected to the input terminal of the heating control circuit, and the input terminal of the voltage dividing circuit is electrically connected to the power supply voltage.
示例性地,所述分压电路包括串联的至少两个电阻。Exemplarily, the voltage dividing circuit includes at least two resistors connected in series.
示例性地,所述开关电源包括BUCK开关电源,其中,所述储能电路包括电感,和/或,所述输出滤波电路包括电容。Exemplarily, the switching power supply includes a BUCK switching power supply, wherein the energy storage circuit includes an inductor, and/or, the output filter circuit includes a capacitor.
示例性地,温度控制系统还包括:Exemplarily, the temperature control system further includes:
第二滤波电路,用于对电源电压输出的电压进行滤波处理。The second filter circuit is used to filter the voltage output by the power supply voltage.
示例性地,所述温度控制系统还包括:Exemplarily, the temperature control system further includes:
所述第二滤波电路的输入端电连接电源电压,所述第二滤波电路的输出端接地。The input terminal of the second filter circuit is electrically connected to the power supply voltage, and the output terminal of the second filter circuit is grounded.
示例性地,第一滤波电路包括至少一个电容。Illustratively, the first filter circuit includes at least one capacitor.
示例性地,所述加热电路包括至少一个加热电阻。Exemplarily, the heating circuit includes at least one heating resistor.
示例性地,所述加热电路包括至少两个并联设置的加热电阻。Exemplarily, the heating circuit includes at least two heating resistors arranged in parallel.
示例性地,所述测距装置还包括:Exemplarily, the distance measuring device further includes:
电路板,所述待控温器件设置在所述电路板上;A circuit board, the temperature-controlling device is arranged on the circuit board;
导热层,所述导热层设置在所述待控温器件的下方,用于将所述加热电阻产生的热量传导至所述待控温器件。A heat conduction layer, the heat conduction layer is disposed below the temperature-controlling device, and is used to conduct the heat generated by the heating resistor to the temperature-controlling device.
示例性地,在所述导热层上设置有至少一个热孤岛,所述热孤岛用于隔离其相对两侧的导热层。Exemplarily, at least one thermal island is provided on the thermal conductive layer, and the thermal island is used to isolate the thermal conductive layers on opposite sides of the thermal island.
示例性地,多个所述热孤岛沿所述待控温器件的四周间隔排布成环形。Exemplarily, a plurality of the thermal islands are arranged in a ring shape along the circumference of the device to be controlled.
示例性地,所述环形包括圆环形或多边环形。Exemplarily, the ring shape includes a circular ring shape or a polygonal ring shape.
示例性地,每个所述热孤岛呈长条形。Exemplarily, each of the thermal islands has a long shape.
示例性地,所述热孤岛为贯穿所述导热层的开口。Exemplarily, the thermal island is an opening penetrating the thermal conductive layer.
示例性地,所述导热层的材料包括地层。Exemplarily, the material of the thermal conductive layer includes a ground layer.
示例性地,所述目标温度包括第一目标温度和第二目标温度,所述第二目标温度大于所述第一目标温度,所述散热控制电路具体用于:Exemplarily, the target temperature includes a first target temperature and a second target temperature, the second target temperature is greater than the first target temperature, and the heat dissipation control circuit is specifically configured to:
当所述当前环境温度小于所述第一目标温度,控制所述散热模块关闭;When the current ambient temperature is lower than the first target temperature, controlling the heat dissipation module to be turned off;
当所述当前环境温度大于或等于所述第二目标温度,控制所述散热模块运行。When the current ambient temperature is greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
示例性地,所述目标温度还包括第三目标温度和第四目标温度,其中,所述第三目标温度大于所述第二目标温度,所述第四目标温度大于所述第三目标温度,所述散热控制电路还具体用于:Exemplarily, the target temperature further includes a third target temperature and a fourth target temperature, wherein the third target temperature is greater than the second target temperature, and the fourth target temperature is greater than the third target temperature, The heat dissipation control circuit is also specifically used for:
若所述当前环境温度介于所述第二目标温度和所述第三目标温度之间,控制所述散热模块的散热速率维持在第一速率。If the current ambient temperature is between the second target temperature and the third target temperature, the heat dissipation rate of the heat dissipation module is controlled to be maintained at the first rate.
示例性地,所述散热控制电路还具体用于:Exemplarily, the heat dissipation control circuit is also specifically used for:
若所述当前环境温度大于或等于所述第三目标温度并小于所述第四目标温度,控制所述散热模块的散热速率在所述第一速率和第二速率之间,其中,所述第二速率大于所述第一速率;以及If the current ambient temperature is greater than or equal to the third target temperature and less than the fourth target temperature, controlling the heat dissipation rate of the heat dissipation module to be between the first rate and the second rate, wherein the first The second rate is greater than the first rate; and
若所述当前环境温度大于或等于所述第四目标温度,控制所述散热模块的散热速率维持在所述第二速率。If the current ambient temperature is greater than or equal to the fourth target temperature, control the heat dissipation rate of the heat dissipation module to be maintained at the second rate.
示例性地,所述散热控制电路还具体用于:Exemplarily, the heat dissipation control circuit is also specifically used for:
当所述当前环境温度从小于所述第一目标温度逐渐升高至所述第一目标温度和所述第二目标温度之间,控制所述散热模块关闭;When the current ambient temperature is gradually increased from less than the first target temperature to between the first target temperature and the second target temperature, controlling the heat dissipation module to be turned off;
当所述当前环境温度继续升高到大于或等于所述第二目标温度,控制所述散热模块运行。When the current ambient temperature continues to increase to be greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
示例性地,所述散热控制电路还具体用于:Exemplarily, the heat dissipation control circuit is also specifically used for:
当所述当前环境温度从大于或等于所述第二目标温度降低到所述第一目标温度和所述第二目标温度之间,控制所述散热模块的散热速率维持在第一速率;When the current ambient temperature decreases from greater than or equal to the second target temperature to between the first target temperature and the second target temperature, controlling the heat dissipation rate of the heat dissipation module to be maintained at the first rate;
当所述当前环境温度降低到小于所述第一目标温度,控制所述散热模块关闭。When the current ambient temperature drops below the first target temperature, the heat dissipation module is controlled to be turned off.
示例性地,所述散热模块包括风机,散热控制电路还具体用于:Exemplarily, the heat dissipation module includes a fan, and the heat dissipation control circuit is also specifically used for:
通过控制所述风机的占空比以控制所述风机的转速,从而控制所述散热模块的散热速率,其中,所述占空比越大所述散热模块的散热速率越大。By controlling the duty ratio of the fan to control the rotational speed of the fan, the heat dissipation rate of the heat dissipation module is controlled, where the greater the duty ratio, the greater the heat dissipation rate of the heat dissipation module.
示例性地,所述占空比包括第一占空比和第二占空比,所述第二占空比大于所述第一占空比,其中,所述散热控制电路具体用于:Exemplarily, the duty cycle includes a first duty cycle and a second duty cycle, the second duty cycle is greater than the first duty cycle, wherein the heat dissipation control circuit is specifically configured to:
控制所述风机以所述第一占空比运转,以控制所述散热模块的散热速率维持在所述第一速率;Controlling the fan to operate at the first duty ratio to control the heat dissipation rate of the heat dissipation module to be maintained at the first rate;
控制所述风机以所述第二占空比运转,以控制所述散热模块的散热速率维持在所述第二速率;以及Controlling the fan to operate at the second duty cycle to control the heat dissipation rate of the heat dissipation module to be maintained at the second rate; and
控制所述风机的占空比在所述第一占空比和所述第二占空比之间变化,以控制所述散热模块的散热速率在所述第一速率和所述第二速率之间。Controlling the duty ratio of the fan to vary between the first duty ratio and the second duty ratio to control the heat dissipation rate of the heat dissipation module to be between the first rate and the second rate between.
示例性地,所述散热控制电路具体用于:Exemplarily, the heat dissipation control circuit is specifically used for:
控制所述风机的占空比在所述第一占空比和所述第二占空比之间线性变化,以控制所述散热模块的散热速率在所述第一速率和所述第二速率之间。Controlling the duty ratio of the fan to change linearly between the first duty ratio and the second duty ratio to control the heat dissipation rate of the heat dissipation module between the first rate and the second rate between.
示例性地,所述散热模块包括风机,散热控制电路还具体用于:Exemplarily, the heat dissipation module includes a fan, and the heat dissipation control circuit is also specifically used for:
控制所述风机的占空比为零,以控制所述散热模块关闭。The duty ratio of the fan is controlled to be zero to control the heat dissipation module to be turned off.
示例性地,所述待控温器件安装于外壳内的容纳腔中,其中,所述散热模块用于对所述外壳散热。Exemplarily, the temperature-controlling device is installed in a receiving cavity in the housing, wherein the heat dissipation module is used to dissipate heat to the housing.
示例性地,所述散热模块包括风机。Exemplarily, the heat dissipation module includes a fan.
示例性地,所述温度控制系统还包括:Exemplarily, the temperature control system further includes:
温度检测电路,用于检测所述待控温器件的当前环境温度。A temperature detection circuit is used to detect the current ambient temperature of the temperature-controlled device.
示例性地,所述测距装置还包括:Exemplarily, the distance measuring device further includes:
至少一个导热介质,所述导热介质包括散热部,所述散热部的至少部分表面贴合所述待控温器件的至少部分散热面,用于将所述待控温器件的热量导出。At least one heat-conducting medium, the heat-conducting medium includes a heat dissipation portion, and at least a part of the surface of the heat dissipation portion is attached to at least a part of the heat dissipation surface of the temperature-controlling device, and is used to extract heat from the temperature-controlling device.
示例性地,所述测距装置包括至少两个所述导热介质,其中,每个所述导热介质的散热部的至少部分表面贴合不同的所述待控温器件,用于分别将对应的所述待控温器件的热量导出。Exemplarily, the distance measuring device includes at least two of the thermally conductive media, wherein at least a part of the surface of the heat dissipation portion of each of the thermally conductive media is attached to different temperature-controlling devices for respectively corresponding to The heat of the temperature-control device is derived.
示例性地,所述待控温器件安装于外壳的容纳腔内,所述导热介质的散热部的相对的两个表面分别至少部分贴合所述待控温器件的散热面和所述外壳的部分表面。Exemplarily, the temperature-controlling device is installed in a housing cavity of the housing, and two opposite surfaces of the heat-dissipating portion of the heat-conducting medium respectively at least partially fit the heat-radiating surface of the temperature-controlling device and the housing Part of the surface.
示例性地,所述导热介质还包括安装部,其中,所述安装部用于将所述导热介质安装于壳体上。Exemplarily, the heat conductive medium further includes an installation portion, wherein the installation portion is used to install the heat conductive medium on the housing.
示例性地,所述安装部和所述散热部彼此连接并呈预定夹角,和/或,所述安装部和所述散热部一体成型。Exemplarily, the mounting portion and the heat dissipation portion are connected to each other at a predetermined angle, and/or, the mounting portion and the heat dissipation portion are integrally formed.
示例性地,所述预定夹角大体为90°。Exemplarily, the predetermined angle is substantially 90°.
示例性地,所述测距装置还包括至少一个连接件和设置在所述安装部上的至少一个腰孔,所述连接件穿过所述腰孔将所述导热介质安装于壳体上,所述壳体位于所述外壳的容纳腔内。Exemplarily, the distance measuring device further includes at least one connecting member and at least one waist hole provided on the mounting portion, the connecting member passes through the waist hole to install the thermally conductive medium on the housing, The housing is located in the receiving cavity of the housing.
示例性地,所述腰孔的长度大于所述连接件的径向长度,以在所述连接件紧固之前沿所述腰孔的长度方向调整所述导电介质的位置;和/或,Exemplarily, the length of the waist hole is greater than the radial length of the connecting member to adjust the position of the conductive medium along the length of the waist hole before the connecting member is fastened; and/or,
所述连接件的径向长度小于所述腰孔的宽度,以在所述连接件紧固之前沿所述腰孔的宽度方向调整所述导电介质的位置。The radial length of the connecting member is smaller than the width of the waist hole to adjust the position of the conductive medium along the width direction of the waist hole before the connecting member is fastened.
示例性地,所述腰孔的长度延伸方向与所述待控温器件的散热面垂直,以沿该长度延伸方向调整所述散热部贴合所述待控温器件。Exemplarily, the length extension direction of the waist hole is perpendicular to the heat dissipation surface of the temperature-controlling device, so as to adjust the heat dissipation portion to fit the temperature-control device along the length extension direction.
示例性地,在所述连接件背离所述壳体的一端和所述腰孔之间还设置有垫片。Exemplarily, a gasket is further provided between an end of the connecting member facing away from the housing and the waist hole.
示例性地,所述安装部设置有所述腰孔的区域的厚度小于所述导热介质其他区域的厚度。Exemplarily, the thickness of the region where the installation portion is provided with the waist hole is smaller than the thickness of other regions of the thermally conductive medium.
示例性地,所述连接件包括螺钉、螺栓中的至少一种。Exemplarily, the connecting member includes at least one of screws and bolts.
示例性地,所述散热部包括相对设置的第一表面和第二表面,在所述散热部邻近所述待控温器件的所述第一表面上还设置有凸块,所述凸块与所述第一表面相对的至少部分表面贴合所述待控温器件的散热面。Exemplarily, the heat dissipation portion includes a first surface and a second surface that are oppositely arranged, and a bump is further provided on the first surface of the heat dissipation portion adjacent to the temperature-control device, and the bump At least part of the surface opposite to the first surface conforms to the heat dissipation surface of the device to be temperature controlled.
示例性地,所述凸块贴合所述待控温器件的表面的尺寸小于与所述散热部的第一表面的尺寸。Exemplarily, the size of the surface of the bump that fits the device to be temperature-controlled is smaller than the size of the first surface of the heat dissipation part.
示例性地,所述散热部的第一表面和第二表面为相对而非平行的表面。Exemplarily, the first surface and the second surface of the heat dissipation portion are opposite, not parallel surfaces.
示例性地,所述温度控制系统包括至少两个所述导热介质,其中,在所述至少两个所述导热介质的部分导热介质的所述散热部上设置所述凸块。Exemplarily, the temperature control system includes at least two of the heat conduction media, wherein the bumps are provided on the heat dissipation portions of the heat conduction media of the at least two heat conduction media.
示例性地,所述测距装置包括第一待控温器件和第二待控温器件,其中,所述温度控制系统包括第一导热介质和第二导热介质,所述第一导热介质的所述散热部上设置所述凸块,所述第一导热介质上的凸块贴合所述第一待控温器件的至少部分散热面,所述第二导热介质的散热部贴合所述第二待控温器件的至少部分散热面。Exemplarily, the distance measuring device includes a first temperature-controlling device and a second temperature-controlling device, wherein the temperature control system includes a first heat-conducting medium and a second heat-conducting medium. The protrusions are provided on the heat dissipation portion, the protrusions on the first heat conduction medium are attached to at least a part of the heat dissipation surface of the first temperature-controlling device, and the heat dissipation portion of the second heat conduction medium is attached to the first 2. At least part of the heat dissipation surface of the device to be temperature controlled.
示例性地,所述第一待控温器件包括发射器,和/或,所述第二待控温器件包括探测器。Exemplarily, the first temperature-controlled device includes an emitter, and/or the second temperature-controlled device includes a detector.
示例性地,所述导热介质的材料包括金属,其中,所述金属包括铜。Exemplarily, the material of the heat-conducting medium includes a metal, wherein the metal includes copper.
示例性地,所述测距装置包括激光雷达。Exemplarily, the distance measuring device includes a laser radar.
本发明再一方面还提供一种移动平台,所述移动平台包括前述的测距装置;和In yet another aspect of the present invention, a mobile platform is provided, the mobile platform including the foregoing distance measuring device; and
平台本体,所述测距装置安装在所述平台本体上。A platform body, the distance measuring device is installed on the platform body.
示例性地,所述移动平台包括无人机、机器人、车或船。Illustratively, the mobile platform includes a drone, robot, car or boat.
本发明的测距装置通过加热电路在环境温度过低的时候启动加热,而散热模块则用于在高温时进行散热,从而实现高温时将目标温度控制在环境温度之下,低温时将目标温度控制在环境温度之上,有效减小了例如包括发射器的发射模块的温度范围,控制了波长的变化范围,减小了接收滤波器的设计带宽,减小了噪声,提高了信噪比,增加了量程,并且提高了发射器的寿命。The distance measuring device of the present invention starts heating when the ambient temperature is too low through the heating circuit, and the heat dissipation module is used for heat dissipation at high temperature, so that the target temperature is controlled below the ambient temperature at high temperature and the target temperature at low temperature Controlling above the ambient temperature effectively reduces the temperature range of, for example, the transmitter module including the transmitter, controls the wavelength variation range, reduces the design bandwidth of the receiving filter, reduces noise, and improves the signal-to-noise ratio. The range is increased, and the life of the transmitter is increased.
附图说明BRIEF DESCRIPTION
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly explain the technical solutions in the embodiments of the present invention, the drawings required in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For a person of ordinary skill in the art, without paying any creative labor, other drawings can also be obtained based on these drawings.
图1示出了本发明一实施例中的测距装置的架构示意图;FIG. 1 shows a schematic structural diagram of a distance measuring device in an embodiment of the present invention;
图2示出了本发明一个实施例中的测距装置的示意图;2 shows a schematic diagram of a distance measuring device in an embodiment of the present invention;
图3示出了本发明一个实施例中包括加热电路的温度控制系统的控制策略流程图;3 shows a flow chart of a control strategy of a temperature control system including a heating circuit in an embodiment of the invention;
图4示出了本发明一个实施例中包括加热电路的温度控制系统的电路图;4 shows a circuit diagram of a temperature control system including a heating circuit in an embodiment of the present invention;
图5示出了本发明另一个实施例中包括加热电路的温度控制系统的电路图;5 shows a circuit diagram of a temperature control system including a heating circuit in another embodiment of the present invention;
图6示出了本发明一个实施例中的热孤岛的示意图;6 shows a schematic diagram of a thermal island in an embodiment of the present invention;
图7示出了本发明一个实施例中的导热介质的安装示意图;7 shows a schematic diagram of the installation of the thermally conductive medium in an embodiment of the present invention;
图8示出了本发明另一个实施例中的导热介质的立体示意图;8 is a schematic perspective view of a heat-conducting medium in another embodiment of the present invention;
图9示出了本发明一个实施例中的安装有导热介质的测距装置的立体 示意图;9 shows a perspective schematic view of a distance-measuring device equipped with a thermally conductive medium in an embodiment of the present invention;
图10示出了图9中测距装置的俯视图;10 shows a top view of the distance measuring device in FIG. 9;
图11示出了本发明一个实施例中的安装有导热介质的测距装置的局部示意图;FIG. 11 shows a partial schematic diagram of a distance-measuring device installed with a heat-conducting medium in an embodiment of the present invention;
图12示出了本发明一个实施例中的安装有导热介质的测距装置的一侧局部示意图;FIG. 12 shows a partial schematic view of one side of a distance-measuring device installed with a thermally conductive medium in an embodiment of the present invention;
图13示出了本发明一个实施例中包括散热模块的温度控制系统的控制策略流程图;13 shows a flow chart of a control strategy of a temperature control system including a heat dissipation module in an embodiment of the invention;
图14示出了本发明一个实施例中温度控制系统的风机转速调速策略的示意图。14 shows a schematic diagram of a fan speed regulation strategy of a temperature control system in an embodiment of the present invention.
具体实施方式detailed description
为了使得本发明的目的、技术方案和优点更为明显,下面将参照附图详细描述根据本发明的示例实施例。显然,所描述的实施例仅仅是本发明的一部分实施例,而不是本发明的全部实施例,应理解,本发明不受这里描述的示例实施例的限制。基于本发明中描述的本发明实施例,本领域技术人员在没有付出创造性劳动的情况下所得到的所有其它实施例都应落入本发明的保护范围之内。In order to make the purpose, technical solutions and advantages of the present invention more obvious, an exemplary embodiment according to the present invention will be described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited by the exemplary embodiments described herein. Based on the embodiments of the present invention described in the present invention, all other embodiments obtained by those skilled in the art without paying any creative work should fall within the protection scope of the present invention.
在下文的描述中,给出了大量具体的细节以便提供对本发明更为彻底的理解。然而,对于本领域技术人员而言显而易见的是,本发明可以无需一个或多个这些细节而得以实施。在其他的例子中,为了避免与本发明发生混淆,对于本领域公知的一些技术特征未进行描述。In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.
应当理解的是,本发明能够以不同形式实施,而不应当解释为局限于这里提出的实施例。相反地,提供这些实施例将使公开彻底和完全,并且将本发明的范围完全地传递给本领域技术人员。It should be understood that the present invention can be implemented in different forms and should not be interpreted as being limited to the embodiments presented herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
在此使用的术语的目的仅在于描述具体实施例并且不作为本发明的限制。在此使用时,单数形式的“一”、“一个”和“所述/该”也意图包括复数形式,除非上下文清楚指出另外的方式。还应明白术语“组成”和/或“包括”,当在该说明书中使用时,确定所述特征、整数、步骤、操作、元件和/或部件的存在,但不排除一个或更多其它的特征、整数、步骤、操作、元件、部件和/或组的存在或添加。在此使用时,术语“和/或”包括相关所列项目的任何及所有组合。The terminology used herein is for describing specific embodiments only and is not intended as a limitation of the present invention. As used herein, the singular forms "a", "an", and "said/the" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "composition" and/or "comprising", when used in this specification, determine the existence of the described features, integers, steps, operations, elements and/or components, but do not exclude one or more other The presence or addition of features, integers, steps, operations, elements, components, and/or groups. As used herein, the term "and/or" includes any and all combinations of the listed items.
为了彻底理解本发明,将在下列的描述中提出详细的结构,以便阐释本发明提出的技术方案。本发明的可选实施例详细描述如下,然而除了这些详 细描述外,本发明还可以具有其他实施方式。In order to thoroughly understand the present invention, a detailed structure will be proposed in the following description in order to explain the technical solution proposed by the present invention. The alternative embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may have other embodiments.
下面结合附图,对本申请的测距装置进行详细说明。在不冲突的情况下,下述的实施例及实施方式中的特征可以相互组合。The distance measuring device of the present application will be described in detail below with reference to the drawings. In the case of no conflict, the features in the following examples and implementations can be combined with each other.
首先,参考图1和图2对本发明实施例中的一种测距装置的结构做更详细的示例性地描述,测距装置包括激光雷达,该测距装置仅作为示例,对于其他适合的测距装置也可以应用于本申请。First, with reference to FIGS. 1 and 2, a more detailed exemplary description of the structure of a distance measuring device in an embodiment of the present invention, the distance measuring device includes a laser radar, the distance measuring device is only used as an example, for other suitable measurement The distance device can also be applied to this application.
本发明各个实施例提供的方案可以应用于测距装置,该测距装置可以是激光雷达、激光测距设备等电子设备。在一种实施方式中,测距装置用于感测外部环境信息,例如,环境目标的距离信息、方位信息、反射强度信息、速度信息等。一种实现方式中,测距装置可以通过测量测距装置和探测物之间光传播的时间,即光飞行时间(Time-of-Flight,TOF),来探测探测物到测距装置的距离。或者,测距装置也可以通过其他技术来探测探测物到测距装置的距离,例如基于相位移动(phase shift)测量的测距方法,或者基于频率移动(frequency shift)测量的测距方法,在此不做限制。The solutions provided by the embodiments of the present invention may be applied to a distance measuring device, and the distance measuring device may be an electronic device such as a laser radar or a laser distance measuring device. In one embodiment, the distance measuring device is used to sense external environment information, for example, distance information, azimuth information, reflection intensity information, speed information, etc. of the environmental target. In an implementation manner, the distance measuring device can detect the distance between the detecting object and the distance measuring device by measuring the time of light propagation between the distance measuring device and the detection object, that is, Time-of-Flight (TOF). Alternatively, the distance measuring device may also detect the distance between the detected object and the distance measuring device through other techniques, such as a distance measuring method based on phase shift measurement, or a distance measuring method based on frequency shift measurement. There are no restrictions.
为了便于理解,以下将结合图1所示的测距装置100对测距的工作流程进行举例描述。For ease of understanding, the following describes the working process of distance measurement in conjunction with the distance measurement device 100 shown in FIG. 1.
所述测距装置包括发射模块、接收模块和温度控制系统,所述发射模块用于出射光脉冲;所述接收模块用于接收经物体反射回的至少部分光脉冲,以及根据所述接收的至少部分光脉冲确定所述物体相对所述测距装置的距离。The distance measuring device includes a transmitting module, a receiving module and a temperature control system, the transmitting module is used to emit light pulses; the receiving module is used to receive at least part of the optical pulses reflected back by the object, and according to the received at least Part of the light pulse determines the distance of the object relative to the distance measuring device.
具体地,如图1所示,所述发射模块包括发射电路110;所述接收模块包括接收电路120、采样电路130和运算电路140。Specifically, as shown in FIG. 1, the transmitting module includes a transmitting circuit 110; the receiving module includes a receiving circuit 120, a sampling circuit 130, and an arithmetic circuit 140.
发射电路110可以出射光脉冲序列(例如激光脉冲序列)。接收电路120可以接收经过被探测物反射的光脉冲序列,并对该光脉冲序列进行光电转换,以得到电信号,再对电信号进行处理之后可以输出给采样电路130。采样电路130可以对电信号进行采样,以获取采样结果。运算电路140可以基于采样电路130的采样结果,以确定测距装置100与被探测物之间的距离。The transmitting circuit 110 may emit a light pulse sequence (for example, a laser pulse sequence). The receiving circuit 120 can receive the optical pulse sequence reflected by the detected object, and photoelectrically convert the optical pulse sequence to obtain an electrical signal, which can be output to the sampling circuit 130 after processing the electrical signal. The sampling circuit 130 may sample the electrical signal to obtain the sampling result. The arithmetic circuit 140 may determine the distance between the distance measuring device 100 and the detected object based on the sampling result of the sampling circuit 130.
可选地,该测距装置100还可以包括控制电路150,该控制电路150可以实现对其他电路的控制,例如,可以控制各个电路的工作时间和/或对各个电路进行参数设置等。Optionally, the distance measuring device 100 may further include a control circuit 150, which can control other circuits, for example, can control the working time of each circuit and/or set parameters for each circuit.
应理解,虽然图1示出的测距装置中包括一个发射电路、一个接收电路、一个采样电路和一个运算电路,用于出射一路光束进行探测,但是本申请实施例并不限于此,发射电路、接收电路、采样电路、运算电路中的任一种电 路的数量也可以是至少两个,用于沿相同方向或分别沿不同方向出射至少两路光束;其中,该至少两束光路可以是同时出射,也可以是分别在不同时刻出射。一个示例中,该至少两个发射电路中的发光芯片封装在同一个模块中。例如,每个发射电路包括一个激光发射芯片,该至少两个发射电路中的激光发射芯片中的die封装到一起,容置在同一个封装空间中。It should be understood that although the distance measuring device shown in FIG. 1 includes a transmitting circuit, a receiving circuit, a sampling circuit, and an arithmetic circuit for emitting a beam of light for detection, the embodiments of the present application are not limited thereto, and the transmitting circuit , The number of any one of the receiving circuit, the sampling circuit, and the arithmetic circuit may also be at least two, for emitting at least two light beams in the same direction or respectively in different directions; wherein, the at least two light paths may be simultaneously The shot may be shot at different times. In one example, the light-emitting chips in the at least two emission circuits are packaged in the same module. For example, each emitting circuit includes a laser emitting chip, and the die in the laser emitting chips in the at least two emitting circuits are packaged together and housed in the same packaging space.
一些实现方式中,除了图1所示的电路,测距装置100还可以包括扫描模块,用于将发射电路出射的至少一路激光脉冲序列改变传播方向出射。In some implementations, in addition to the circuit shown in FIG. 1, the distance measuring device 100 may further include a scanning module for changing at least one laser pulse sequence emitted by the transmitting circuit to change the propagation direction.
其中,可以将包括发射电路110、接收电路120、采样电路130和运算电路140的模块,或者,包括发射电路110、接收电路120、采样电路130、运算电路140和控制电路150的模块称为测距模块,该测距模块可以独立于其他模块,例如,扫描模块。Among them, the module including the transmitting circuit 110, the receiving circuit 120, the sampling circuit 130, and the arithmetic circuit 140, or the module including the transmitting circuit 110, the receiving circuit 120, the sampling circuit 130, the arithmetic circuit 140, and the control circuit 150 may be referred to as a measurement Distance module, the distance measuring module may be independent of other modules, for example, a scanning module.
测距装置中可以采用同轴光路,也即测距装置出射的光束和经反射回来的光束在测距装置内共用至少部分光路。例如,发射电路出射的至少一路激光脉冲序列经扫描模块改变传播方向出射后,经探测物反射回来的激光脉冲序列经过扫描模块后入射至接收电路。或者,测距装置也可以采用异轴光路,也即测距装置出射的光束和经反射回来的光束在测距装置内分别沿不同的光路传输。图2示出了本发明的测距装置采用同轴光路的一种实施例的示意图。A coaxial optical path may be used in the distance measuring device, that is, the light beam emitted by the distance measuring device and the reflected light beam share at least part of the optical path in the distance measuring device. For example, after at least one laser pulse sequence emitted by the transmitting circuit is emitted by the scanning module to change the propagation direction, the laser pulse sequence reflected by the detection object passes through the scanning module and enters the receiving circuit. Alternatively, the distance measuring device may also adopt an off-axis optical path, that is, the light beam emitted from the distance measuring device and the reflected light beam are respectively transmitted along different optical paths in the distance measuring device. FIG. 2 shows a schematic diagram of an embodiment of the distance measuring device of the present invention using a coaxial optical path.
测距装置200包括测距模块210,测距模块210包括发射器203(可以包括上述的发射电路)、准直元件204、探测器205(可以包括上述的接收电路、采样电路和运算电路)和光路改变元件206。测距模块210用于发射光束,且接收回光,将回光转换为电信号。其中,发射器203可以用于发射光脉冲序列。在一个实施例中,发射器203可以发射激光脉冲序列。可选的,发射器203发射出的激光束为波长在可见光范围之外的窄带宽光束。准直元件204设置于发射器的出射光路上,用于准直从发射器203发出的光束,将发射器203发出的光束准直为平行光出射至扫描模块。准直元件还用于会聚经探测物反射的回光的至少一部分。该准直元件204可以是准直透镜或者是其他能够准直光束的元件。The distance measuring device 200 includes a distance measuring module 210. The distance measuring module 210 includes a transmitter 203 (which may include the above-mentioned transmitting circuit), a collimating element 204, and a detector 205 (which may include the above-mentioned receiving circuit, sampling circuit, and arithmetic circuit) and Optical path changing element 206. The distance measuring module 210 is used to emit a light beam and receive back light, and convert the back light into an electrical signal. Among them, the transmitter 203 may be used to transmit a light pulse sequence. In one embodiment, the transmitter 203 may emit a sequence of laser pulses. Optionally, the laser beam emitted by the transmitter 203 is a narrow-bandwidth beam with a wavelength outside the visible light range. The collimating element 204 is disposed on the exit optical path of the emitter, and is used to collimate the light beam emitted from the emitter 203, and collimate the light beam emitted by the emitter 203 into parallel light to the scanning module. The collimating element is also used to converge at least a part of the return light reflected by the detection object. The collimating element 204 may be a collimating lens or other element capable of collimating the light beam.
在图2所示实施例中,通过光路改变元件206来将测距装置内的发射光路和接收光路在准直元件204之前合并,使得发射光路和接收光路可以共用同一个准直元件,使得光路更加紧凑。在其他的一些实现方式中,也可以是发射器203和探测器205分别使用各自的准直元件,将光路改变元件206设置在准直元件之后的光路上。In the embodiment shown in FIG. 2, the optical path changing element 206 is used to combine the transmitting optical path and the receiving optical path in the distance measuring device before the collimating element 204, so that the transmitting optical path and the receiving optical path can share the same collimating element, so that the optical path More compact. In some other implementation manners, the transmitter 203 and the detector 205 may respectively use respective collimating elements, and the optical path changing element 206 is disposed on the optical path behind the collimating element.
在图2所示实施例中,由于发射器203出射的光束的光束孔径较小,测距装置所接收到的回光的光束孔径较大,所以光路改变元件可以采用小面积的反射镜来将发射光路和接收光路合并。在其他的一些实现方式中,光路改变元件也可以采用带通孔的反射镜,其中该通孔用于透射发射器203的出射光,反射镜用于将回光反射至探测器205。这样可以减小采用小反射镜的情况中小反射镜的支架会对回光的遮挡。In the embodiment shown in FIG. 2, since the beam aperture of the light beam emitted by the transmitter 203 is small and the beam aperture of the returned light received by the distance measuring device is large, the light path changing element can use a small-area mirror to convert The transmitting optical path and the receiving optical path are combined. In some other implementations, the light path changing element may also use a reflector with a through hole, where the through hole is used to transmit the outgoing light of the emitter 203, and the reflector is used to reflect the return light to the detector 205. In this way, it is possible to reduce the blocking of the return light by the support of the small mirror in the case of using the small mirror.
在图2所示实施例中,光路改变元件偏离了准直元件204的光轴。在其他的一些实现方式中,光路改变元件也可以位于准直元件204的光轴上。In the embodiment shown in FIG. 2, the optical path changing element is offset from the optical axis of the collimating element 204. In some other implementations, the optical path changing element may also be located on the optical axis of the collimating element 204.
测距装置200还包括扫描模块202。扫描模块202放置于测距模块210的出射光路上,扫描模块202用于改变经准直元件204出射的准直光束219的传输方向并投射至外界环境,并将回光投射至准直元件204。回光经准直元件204汇聚到探测器205上。The distance measuring device 200 further includes a scanning module 202. The scanning module 202 is placed on the exit optical path of the distance measuring module 210. The scanning module 202 is used to change the transmission direction of the collimated light beam 219 emitted through the collimating element 204 and project it to the outside environment, and project the return light to the collimating element 204 . The returned light is converged on the detector 205 via the collimating element 204.
在一个实施例中,扫描模块202可以包括至少一个光学元件,用于改变光束的传播路径,其中,该光学元件可以通过对光束进行反射、折射、衍射等等方式来改变光束传播路径。例如,扫描模块202包括透镜、反射镜、棱镜、振镜、光栅、液晶、光学相控阵(Optical Phased Array)或上述光学元件的任意组合。一个示例中,至少部分光学元件是运动的,例如通过驱动模块来驱动该至少部分光学元件进行运动,该运动的光学元件可以在不同时刻将光束反射、折射或衍射至不同的方向。在一些实施例中,扫描模块202的多个光学元件可以绕共同的轴209旋转或振动,每个旋转或振动的光学元件用于不断改变入射光束的传播方向。在一个实施例中,扫描模块202的多个光学元件可以以不同的转速旋转,或以不同的速度振动。在另一个实施例中,扫描模块202的至少部分光学元件可以以基本相同的转速旋转。在一些实施例中,扫描模块的多个光学元件也可以是绕不同的轴旋转。在一些实施例中,扫描模块的多个光学元件也可以是以相同的方向旋转,或以不同的方向旋转;或者沿相同的方向振动,或者沿不同的方向振动,在此不作限制。In one embodiment, the scanning module 202 may include at least one optical element for changing the propagation path of the light beam, wherein the optical element may change the propagation path of the light beam by reflecting, refracting, diffracting, etc. the light beam. For example, the scanning module 202 includes a lens, a mirror, a prism, a galvanometer, a grating, a liquid crystal, an optical phased array (Optical Phased Array), or any combination of the above optical elements. In one example, at least part of the optical element is moving, for example, the at least part of the optical element is driven to move by a driving module, and the moving optical element can reflect, refract or diffract the light beam to different directions at different times. In some embodiments, multiple optical elements of the scanning module 202 may rotate or vibrate about a common axis 209, and each rotating or vibrating optical element is used to continuously change the direction of propagation of the incident light beam. In one embodiment, the multiple optical elements of the scanning module 202 may rotate at different rotation speeds, or vibrate at different speeds. In another embodiment, at least part of the optical elements of the scanning module 202 can rotate at substantially the same rotational speed. In some embodiments, the multiple optical elements of the scanning module may also rotate around different axes. In some embodiments, the multiple optical elements of the scanning module may also rotate in the same direction, or rotate in different directions; or vibrate in the same direction, or vibrate in different directions, which is not limited herein.
在一个实施例中,扫描模块202包括第一光学元件214和与第一光学元件214连接的驱动器216,驱动器216用于驱动第一光学元件214绕转动轴209转动,使第一光学元件214改变准直光束219的方向。第一光学元件214将准直光束219投射至不同的方向。在一个实施例中,准直光束219经第一光学元件改变后的方向与转动轴209的夹角随着第一光学元件214的转动而变化。在一个实施例中,第一光学元件214包括相对的非平行的一对表面, 准直光束219穿过该对表面。在一个实施例中,第一光学元件214包括厚度沿至少一个径向变化的棱镜。在一个实施例中,第一光学元件214包括楔角棱镜,对准直光束219进行折射。In one embodiment, the scanning module 202 includes a first optical element 214 and a driver 216 connected to the first optical element 214. The driver 216 is used to drive the first optical element 214 to rotate about a rotation axis 209 to change the first optical element 214 The direction of the collimated light beam 219. The first optical element 214 projects the collimated light beam 219 to different directions. In one embodiment, the angle between the direction of the collimated light beam 219 after the first optical element changes and the rotation axis 209 changes as the first optical element 214 rotates. In one embodiment, the first optical element 214 includes a pair of opposed non-parallel surfaces through which the collimated light beam 219 passes. In one embodiment, the first optical element 214 includes a prism whose thickness varies along at least one radial direction. In one embodiment, the first optical element 214 includes a wedge-angle prism, aligning the straight beam 219 for refraction.
在一个实施例中,扫描模块202还包括第二光学元件215,第二光学元件215绕转动轴209转动,第二光学元件215的转动速度与第一光学元件214的转动速度不同。第二光学元件215用于改变第一光学元件214投射的光束的方向。在一个实施例中,第二光学元件215与另一驱动器217连接,驱动器217驱动第二光学元件215转动。第一光学元件214和第二光学元件215可以由相同或不同的驱动器驱动,使第一光学元件214和第二光学元件215的转速和/或转向不同,从而将准直光束219投射至外界空间不同的方向,可以扫描较大的空间范围。在一个实施例中,控制器218控制驱动器216和217,分别驱动第一光学元件214和第二光学元件215。第一光学元件214和第二光学元件215的转速可以根据实际应用中预期扫描的区域和样式确定。驱动器216和217可以包括电机或其他驱动器。In one embodiment, the scanning module 202 further includes a second optical element 215 that rotates about a rotation axis 209. The rotation speed of the second optical element 215 is different from the rotation speed of the first optical element 214. The second optical element 215 is used to change the direction of the light beam projected by the first optical element 214. In one embodiment, the second optical element 215 is connected to another driver 217, and the driver 217 drives the second optical element 215 to rotate. The first optical element 214 and the second optical element 215 may be driven by the same or different drivers, so that the first optical element 214 and the second optical element 215 have different rotation speeds and/or rotations, thereby projecting the collimated light beam 219 to the outside space Different directions can scan a larger spatial range. In one embodiment, the controller 218 controls the drivers 216 and 217 to drive the first optical element 214 and the second optical element 215, respectively. The rotation speeds of the first optical element 214 and the second optical element 215 can be determined according to the area and pattern expected to be scanned in practical applications. Drives 216 and 217 may include motors or other drives.
在一个实施例中,第二光学元件215包括相对的非平行的一对表面,光束穿过该对表面。在一个实施例中,第二光学元件215包括厚度沿至少一个径向变化的棱镜。在一个实施例中,第二光学元件215包括楔角棱镜。In one embodiment, the second optical element 215 includes a pair of opposed non-parallel surfaces through which the light beam passes. In one embodiment, the second optical element 215 includes a prism whose thickness varies along at least one radial direction. In one embodiment, the second optical element 215 includes a wedge angle prism.
一个实施例中,扫描模块202还包括第三光学元件(图未示)和用于驱动第三光学元件运动的驱动器。可选地,该第三光学元件包括相对的非平行的一对表面,光束穿过该对表面。在一个实施例中,第三光学元件包括厚度沿至少一个径向变化的棱镜。在一个实施例中,第三光学元件包括楔角棱镜。第一、第二和第三光学元件中的至少两个光学元件以不同的转速和/或转向转动。In one embodiment, the scanning module 202 further includes a third optical element (not shown) and a driver for driving the third optical element to move. Optionally, the third optical element includes a pair of opposed non-parallel surfaces through which the light beam passes. In one embodiment, the third optical element includes a prism whose thickness varies along at least one radial direction. In one embodiment, the third optical element includes a wedge angle prism. At least two of the first, second and third optical elements rotate at different rotational speeds and/or turns.
扫描模块202中的各光学元件旋转可以将光投射至不同的方向,例如投射的光211的方向和方向213,如此对测距装置200周围的空间进行扫描。当扫描模块202投射出的光211打到探测物201时,一部分光被探测物201沿与投射的光211相反的方向反射至测距装置200。探测物201反射的回光212经过扫描模块202后入射至准直元件204。The rotation of each optical element in the scanning module 202 can project light into different directions, such as the direction and direction 213 of the projected light 211, thus scanning the space around the distance measuring device 200. When the light 211 projected by the scanning module 202 hits the detection object 201, a part of the light is reflected by the detection object 201 to the distance measuring device 200 in a direction opposite to the projected light 211. The returned light 212 reflected by the detection object 201 passes through the scanning module 202 and enters the collimating element 204.
探测器205与发射器203放置于准直元件204的同一侧,探测器205用于将穿过准直元件204的至少部分回光转换为电信号。The detector 205 is placed on the same side of the collimating element 204 as the emitter 203. The detector 205 is used to convert at least part of the returned light passing through the collimating element 204 into an electrical signal.
一个实施例中,各光学元件上镀有增透膜。可选的,增透膜的厚度与发射器203发射出的光束的波长相等或接近,能够增加透射光束的强度。In one embodiment, each optical element is coated with an antireflection coating. Optionally, the thickness of the antireflection film is equal to or close to the wavelength of the light beam emitted by the emitter 203, which can increase the intensity of the transmitted light beam.
一个实施例中,测距装置中位于光束传播路径上的一个元件表面上镀有滤光层,或者在光束传播路径上设置有滤光器,用于至少透射发射器所出射的光束所在波段,反射其他波段,以减少环境光给接收器带来的噪音。In one embodiment, a filter layer is plated on the surface of an element on the beam propagation path in the distance measuring device, or a filter is provided on the beam propagation path to transmit at least the wavelength band of the beam emitted by the transmitter, Reflect other bands to reduce the noise caused by ambient light to the receiver.
在一些实施例中,发射器203可以包括激光二极管,通过激光二极管发射纳秒级别的激光脉冲。进一步地,可以确定激光脉冲接收时间,例如,通过探测电信号脉冲的上升沿时间和/或下降沿时间确定激光脉冲接收时间。如此,测距装置200可以利用脉冲接收时间信息和脉冲发出时间信息计算TOF,从而确定探测物201到测距装置200的距离。测距装置200探测到的距离和方位可以用于遥感、避障、测绘、建模、导航等。In some embodiments, the transmitter 203 may include a laser diode through which laser pulses in the order of nanoseconds are emitted. Further, the laser pulse receiving time may be determined, for example, by detecting the rising edge time and/or the falling edge time of the electrical signal pulse. In this way, the distance measuring device 200 can calculate the TOF using the pulse reception time information and the pulse emission time information, thereby determining the distance between the detection object 201 and the distance measuring device 200. The distance and orientation detected by the distance measuring device 200 can be used for remote sensing, obstacle avoidance, mapping, modeling, navigation, and the like.
在激光雷达、光纤通信等领域,激光器作为信号源,根据具体应用场合,发射特定范围波长、光功率的激光信号。激光雷达一些典型应用场景,比如自动驾驶或地图测绘的汽车、智能机器人、无人机等环境温度范围跨度很大,覆盖-40~85℃的环境温度范围。In the fields of laser radar and optical fiber communication, lasers are used as signal sources to emit laser signals with specific wavelengths and optical power according to specific applications. Some typical application scenarios of lidar, such as automobiles, intelligent robots, drones, etc. for autonomous driving or map mapping, have a wide environmental temperature range, covering an ambient temperature range of -40 to 85°C.
而脉冲激光二极管(PLD)发光波长随温度变化很大,在以上温度范围内波长变化达到40nm以上,为了适应激光器波长变化接收滤波器设计带宽就要大于40nm,从而接收到的噪声增加,信噪比恶化,量程降低。另一方面,激光器寿命随着温度升高显著衰减。而探测距离主要与发射激光功率相关,接收灵敏度一致的前提下,功率越大,探测距离越远。但是激光二极管的波长、光功率随着环境温度的改变而发生偏移,因此激光的波长、功率稳定性和较宽环境温度范围就成为一对主要矛盾。因此必须针对测距装置设计完备的温控方案。The wavelength of the pulsed laser diode (PLD) varies greatly with temperature. In the above temperature range, the wavelength change reaches more than 40nm. In order to adapt to the laser wavelength change, the design bandwidth of the receiving filter must be greater than 40nm, so that the received noise increases and the signal noise The ratio deteriorates and the range decreases. On the other hand, the laser lifetime decays significantly with increasing temperature. The detection distance is mainly related to the power of the emitted laser. Under the premise of the same receiving sensitivity, the greater the power, the farther the detection distance. However, the wavelength and optical power of the laser diode are shifted as the ambient temperature changes. Therefore, the laser wavelength, power stability, and a wider ambient temperature range have become a major contradiction. Therefore, a complete temperature control scheme must be designed for the distance measuring device.
为了对测距装置的温度进行精确控制,本发明一个实施例中的测距装置还包括温度控制系统,所述温度控制系统包括加热电路和/或散热模块,所述加热电路用于对待控温器件进行加热,所述散热模块用于对所述待控温器件进行散热;温度控制系统还包括控制模块,用于基于所述待控温器件的当前环境温度和目标温度的比较结果,控制所述加热电路和/或所述散热模块运行或关闭。上述测距装置包括加热电路在环境温度过低的时候启动加热,而散热模块则用于在高温时进行散热,从而实现高温时将目标温度控制在环境温度之下,低温时将目标温度控制在环境温度之上,有效减小了例如包括发射器的发射模块的温度范围,控制了波长的变化范围,减小了接收滤波器的设计带宽,减小了噪声,提高了信噪比,增加了量程,并且提高了发射器的寿 命。In order to accurately control the temperature of the distance measuring device, the distance measuring device in one embodiment of the present invention further includes a temperature control system, the temperature control system includes a heating circuit and/or a heat dissipation module, the heating circuit is used to control the temperature The device is heated, and the heat dissipation module is used to dissipate heat to the temperature-control device; the temperature control system further includes a control module to control the temperature control device based on the comparison result of the current ambient temperature and the target temperature of the temperature-control device The heating circuit and/or the heat dissipation module are operated or turned off. The above distance measuring device includes a heating circuit to start heating when the ambient temperature is too low, and the heat dissipation module is used to dissipate heat at high temperatures, so that the target temperature is controlled below the ambient temperature at high temperatures, and the target temperature is controlled at low temperatures. Above the ambient temperature, the temperature range of the transmitter module including the transmitter is effectively reduced, the wavelength variation range is controlled, the design bandwidth of the receiving filter is reduced, the noise is reduced, the signal-to-noise ratio is increased, and the Range, and improve the life of the transmitter.
下面,参考图3至图5对包括加热电路的温度控制系统进行示例性描述。Hereinafter, a temperature control system including a heating circuit will be exemplarily described with reference to FIGS. 3 to 5.
在一个实施例中,如图3所示,温度控制系统包括用于对待控温器件进行加热的加热电路,该加热电路可以是任意适合的能够实现加热的电路,该加热电路包括至少一个加热电阻。更进一步地,所述加热电路包括至少两个并联设置的加热电阻。In one embodiment, as shown in FIG. 3, the temperature control system includes a heating circuit for heating the device to be controlled, the heating circuit may be any suitable circuit capable of heating, and the heating circuit includes at least one heating resistor . Furthermore, the heating circuit includes at least two heating resistors arranged in parallel.
在一个示例中,如图3所示,为了实现对待控温器件的环境温度的检测,所述测距装置还包括温度检测电路,用于检测所述待控温器件的当前环境温度。其中,所述温度检测电路包括温度传感器,所述温度传感器可以是任意类型的能够用于温度检测的传感器,包括但不限于热电偶或热敏电阻等。In one example, as shown in FIG. 3, in order to detect the ambient temperature of the temperature-controlled device, the distance measuring device further includes a temperature detection circuit for detecting the current ambient temperature of the temperature-controlled device. Wherein, the temperature detection circuit includes a temperature sensor, and the temperature sensor may be any type of sensor that can be used for temperature detection, including but not limited to a thermocouple or a thermistor.
所述温度控制系统还包括控制模块,用于基于所述待控温器件的当前环境温度和目标温度的比较结果,控制所述加热电路运行或关闭。在一个具体实施例中,如图3所示,控制模块具体包括处理器和加热控制电路(未示出),处理器用于获取所述待控温器件的环境温度,并将所述当前环境温度与所述目标温度进行比较后生成控制信号,例如,温度检测电路检测待控温器件的当前环境温度,而处理器接收该当前环境温度,并将所述当前环境温度与所述目标温度进行比较后生成控制信号。本文中目标温度是指在该目标温度或者目标温度范围区间时,发射器的发射光束的波长和功率等稳定具有很小的波动。The temperature control system further includes a control module for controlling the heating circuit to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the device to be controlled. In a specific embodiment, as shown in FIG. 3, the control module specifically includes a processor and a heating control circuit (not shown). The processor is used to obtain the ambient temperature of the temperature-controlling device, and convert the current ambient temperature A control signal is generated after comparing with the target temperature, for example, the temperature detection circuit detects the current ambient temperature of the device to be controlled, and the processor receives the current ambient temperature and compares the current ambient temperature with the target temperature After the control signal is generated. The target temperature in this article refers to that the wavelength and power of the emitted beam of the transmitter are stable with small fluctuations at the target temperature or the range of the target temperature range.
在一个示例中,继续如图3所示,所述目标温度为目标温度范围区间,所述目标温度包括第一目标温度(也即图3中的目标温度1)和第二目标温度(也即图3中的目标温度2),其中,所述第一目标温度小于所述第二目标温度,例如,所述第一目标温度是目标温度上限,而第二目标温度是目标温度下限,一旦检测到的待控温器件的当前环境温度小于该第一目标温度或者温度数据大于该第二目标温度,则发射器的发射光束的波长和功率将出现波动,所述处理器具体用于:获取所述待控温器件(也可以称为待加热器件)的当前环境温度,将所述当前环境温度与所述目标温度进行比较,若所述当前环境温度小于所述第一目标温度,则生成第一控制信号,用于控制所述加热电路运行(包括启动),若所述当前环境温度大于第二目标温度,则生成第 二控制信号,用于控制所述加热电路关闭,该关闭包括控制加热电路始终处于关闭的状态,也可以是在加热电路加热过程中,一旦检测到当前环境温度大于第二目标温度时,则生成用于控制加热电路停止的第二控制信号。In one example, as shown in FIG. 3, the target temperature is a target temperature range interval, and the target temperature includes a first target temperature (that is, target temperature 1 in FIG. 3) and a second target temperature (that is, The target temperature 2) in FIG. 3, wherein the first target temperature is less than the second target temperature, for example, the first target temperature is the upper limit of the target temperature, and the second target temperature is the lower limit of the target temperature, once detected If the current ambient temperature of the device to be controlled is less than the first target temperature or the temperature data is greater than the second target temperature, then the wavelength and power of the emitted beam of the transmitter will fluctuate. The processor is specifically used to: The current ambient temperature of the temperature-to-be-controlled device (may also be referred to as a device to be heated), compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a A control signal for controlling the operation (including startup) of the heating circuit, if the current ambient temperature is greater than a second target temperature, a second control signal is generated for controlling the heating circuit to shut down, the shutting down includes controlling the heating The circuit is always closed, or it may be that during the heating process of the heating circuit, once it is detected that the current ambient temperature is greater than the second target temperature, a second control signal for controlling the heating circuit to stop is generated.
所述第一目标温度范围在0°~50°之间,和/或,所述第二目标温度范围在为0°~50°,上述温度范围仅作为示例,对于其他的能够保证发射器的波长和功率温度的温度区间也可以适用于本发明的实施例,在一个具体示例中,所述第一目标温度为0°,而第二目标温度为50°,所述控制模块具体用于控制所述控温装置进行加热或制冷,以将所述发射器的温度控制在所述0°~50°之间。在其他实施例中,所述第一目标温度为5°,而第二目标温度为40°,所述控制模块具体用于控制所述控温装置进行加热或制冷,以将所述发射器的温度控制在所述4°~45°之间。或者,在一个实施例中,所述第一目标温度比所述第二目标温度低1°~45°,或者,低5°~30°,并且所述第一目标温度和所述第二目标温度的温度范围仍然在0°~50°。The first target temperature range is between 0° and 50°, and/or, the second target temperature range is between 0° and 50°, the above temperature range is only an example, and for other The temperature ranges of wavelength and power temperature can also be applied to the embodiments of the present invention. In a specific example, the first target temperature is 0° and the second target temperature is 50°, and the control module is specifically used to control The temperature control device performs heating or cooling to control the temperature of the transmitter between the 0°-50°. In other embodiments, the first target temperature is 5° and the second target temperature is 40°, the control module is specifically used to control the temperature control device to heat or cool, so as to The temperature is controlled between 4° and 45°. Or, in one embodiment, the first target temperature is 1° to 45° lower than the second target temperature, or 5° to 30° lower, and the first target temperature and the second target The temperature range of the temperature is still between 0° and 50°.
所述加热控制电路用于获取所述控制信号,以及控制所述加热电路根据所述控制信号运行或关闭。可选地,所述控制电路可以是任意适合的的电路,所述处理器可以包括微处理器(MCU)。由处理器根据当前环境温度和目标温度的比较生成控制信号例如为PWM信号。The heating control circuit is used to obtain the control signal and control the heating circuit to operate or shut down according to the control signal. Optionally, the control circuit may be any suitable circuit, and the processor may include a microprocessor (MCU). The control signal generated by the processor according to the comparison between the current ambient temperature and the target temperature is, for example, a PWM signal.
在一个具体实施例中,如图4所示,加热控制电路包括第一开关电路,所述第一开关电路的控制端连接控制信号例如PWM信号,所述控制信号用于控制所述第一开关电路的通断时间。示例性地,所述控制信号包括PWM信号,通过所述PWM信号的占空比控制所述第一开关电路的通断时间,以控制所述加热电路的运行时间或关闭时间。In a specific embodiment, as shown in FIG. 4, the heating control circuit includes a first switch circuit, a control terminal of the first switch circuit is connected to a control signal such as a PWM signal, and the control signal is used to control the first switch The on-off time of the circuit. Exemplarily, the control signal includes a PWM signal, and the on-off time of the first switching circuit is controlled by the duty cycle of the PWM signal to control the running time or the off time of the heating circuit.
更进一步地,所述第一开关电路的输入端电连接所述加热电路的输出端,所述第一开关电路的输出端接地,所述加热电路的输入端电连接电源电压VCC,该电源电压为加热电路提供工作电压,该电源电压的电压值根据实际需要合理设定,在此不做具体限定。Furthermore, the input terminal of the first switch circuit is electrically connected to the output terminal of the heating circuit, the output terminal of the first switch circuit is grounded, and the input terminal of the heating circuit is electrically connected to the power supply voltage VCC, which is To provide the working voltage for the heating circuit, the voltage value of the power supply voltage is reasonably set according to actual needs, and is not specifically limited here.
在一个示例中,如图4所示,所述第一开关电路包括第一MOS管Q1,所述控制信号连接所述第一MOS管的控制端G,所述第一MOS管的源端和漏端中的一个作为所述第一开关电路的输入端,另一个作为所述第一开关电路的输出端。例如,所述第一开关电路包括NMOS晶体管和PMOS晶体管中的一个,通过控制信号控制NMOS晶体管或PMOS晶体管的导通或截止,从 而控制加热电路运行或关闭,在图4所示的实施例中,所述第一开关电路包括NMOS晶体管,NMOS晶体管的栅极G电连接控制信号(例如PWM信号),NMOS晶体管的源极S接地,NMOS晶体管的漏极D电连接加热电路的输出端,其中,NMOS晶体管接高电平时导通,加热电路开始加热,接低电平时截止,加热电路关闭。In one example, as shown in FIG. 4, the first switching circuit includes a first MOS transistor Q1, the control signal is connected to the control terminal G of the first MOS transistor, and the source terminal of the first MOS transistor is One of the drain terminals serves as an input terminal of the first switching circuit, and the other serves as an output terminal of the first switching circuit. For example, the first switching circuit includes one of an NMOS transistor and a PMOS transistor, and the ON or OFF of the NMOS transistor or the PMOS transistor is controlled by a control signal to control the operation or shutdown of the heating circuit. In the embodiment shown in FIG. 4 The first switching circuit includes an NMOS transistor, the gate G of the NMOS transistor is electrically connected to a control signal (eg, a PWM signal), the source S of the NMOS transistor is grounded, and the drain D of the NMOS transistor is electrically connected to the output of the heating circuit, wherein The NMOS transistor turns on when connected to a high level, the heating circuit starts to heat, and turns off when connected to a low level, and the heating circuit is turned off.
在一个示例中,加热控制电路还包括第一滤波电路,用于对输入至所述第一开关电路之前的控制信号进行滤波。其中,所述第一滤波电路的输入端电连接所述控制信号,所述第一滤波电路的输出端接地(也即接低电位)。所述第一滤波电路可以是任意适合的滤波电路,可以包括能够起到滤波作用的电容、电阻或电感中的至少一个,例如,如图3所示,所述第一滤波电路包括并联设置的一个电阻R1和一个电容C1。In one example, the heating control circuit further includes a first filter circuit for filtering the control signal input to the first switching circuit. The input terminal of the first filter circuit is electrically connected to the control signal, and the output terminal of the first filter circuit is grounded (that is, connected to a low potential). The first filter circuit may be any suitable filter circuit, and may include at least one of a capacitor, a resistor, or an inductor capable of performing a filter function. For example, as shown in FIG. 3, the first filter circuit includes A resistor R1 and a capacitor C1.
在一个示例中,如图3所示,所述温控系统还包括第二滤波电路,用于对电源电压VCC输出的电压进行滤波处理。示例性地,所述第二滤波电路的输入端电连接电源电压,所述第二滤波电路的输出端接地。所述第二滤波电路可以是任意适合的滤波电路,可以包括能够起到滤波作用的电容、电阻或电感中的至少一个,例如,如图3所示,所述第二滤波电路包括一个电容C2,该电容的输入端电连接电源电压,输出端接地。In one example, as shown in FIG. 3, the temperature control system further includes a second filter circuit for filtering the voltage output by the power supply voltage VCC. Exemplarily, the input terminal of the second filter circuit is electrically connected to the power supply voltage, and the output terminal of the second filter circuit is grounded. The second filter circuit may be any suitable filter circuit, and may include at least one of a capacitor, a resistor, or an inductor capable of performing a filtering function. For example, as shown in FIG. 3, the second filter circuit includes a capacitor C2 The input terminal of the capacitor is electrically connected to the power supply voltage, and the output terminal is grounded.
在图3的实施例中,加热电路包括四个并联的加热电阻R2、R3、R4和R5,或者,也可以包括其他数目的加热电阻,在此不做具体限定。In the embodiment of FIG. 3, the heating circuit includes four heating resistors R2, R3, R4, and R5 connected in parallel, or may include other numbers of heating resistors, which are not specifically limited herein.
其中加热电路包括加热电阻,由于加热电阻的成本低,因此可以降低整个控温系统的成本,并且利用处理器(例如微处理器)直接通过控制信号(例如PWM信号)的占空比控制第一开关电路(例如MOS管)的通断时间,进而控制加热电阻的发热热量,PWM信号的占空比越高,发热量越大,从而实现在低温下对待控温器件的加热。The heating circuit includes a heating resistor. Due to the low cost of the heating resistor, the cost of the entire temperature control system can be reduced, and the processor (such as a microprocessor) is used to directly control the first duty cycle of the control signal (such as the PWM signal). The on-off time of the switch circuit (such as MOS tube), and then control the heating heat of the heating resistor, the higher the duty cycle of the PWM signal, the greater the heat generation, so as to achieve the heating of the temperature control device at low temperature.
在另一个具体实施例中,如图5所示,加热控制电路包括第一开关电路,所述第一开关电路的控制端连接控制信号例如PWM信号,所述控制信号用于控制所述第一开关电路的通断时间。示例性地,所述控制信号包括PWM信号,通过所述PWM信号的占空比控制所述第一开关电路的通断时间,以控制所述加热电路的运行时间或关闭时间。In another specific embodiment, as shown in FIG. 5, the heating control circuit includes a first switching circuit, a control terminal of the first switching circuit is connected to a control signal such as a PWM signal, and the control signal is used to control the first The on-off time of the switching circuit. Exemplarily, the control signal includes a PWM signal, and the on-off time of the first switching circuit is controlled by the duty cycle of the PWM signal to control the running time or the off time of the heating circuit.
更进一步地,所述第一开关电路的输入端电连接所述加热电路的输出端, 所述第一开关电路的输出端接地。Furthermore, the input terminal of the first switching circuit is electrically connected to the output terminal of the heating circuit, and the output terminal of the first switching circuit is grounded.
在一个示例中,如图5所示,所述第一开关电路包括第一MOS管Q1,所述控制信号连接所述第一MOS管的控制端G,所述第一MOS管的源端和漏端中的一个作为所述第一开关电路的输入端,另一个作为所述第一开关电路的输出端。例如,所述第一开关电路包括NMOS晶体管和PMOS晶体管中的一个,通过控制信号控制NMOS晶体管或PMOS晶体管的导通或截止,从而控制加热电路运行或关闭,在图5所示的实施例中,第一MOS管Q1可以是NMOS晶体管,NMOS晶体管的栅极G接控制信号,例如PWM信号,在该控制信号为高电平时导通,控制电源到地之间的电路导通。In one example, as shown in FIG. 5, the first switching circuit includes a first MOS transistor Q1, the control signal is connected to the control terminal G of the first MOS transistor, and the source terminal of the first MOS transistor is One of the drain terminals serves as an input terminal of the first switching circuit, and the other serves as an output terminal of the first switching circuit. For example, the first switch circuit includes one of an NMOS transistor and a PMOS transistor, and the control signal controls the on or off of the NMOS transistor or the PMOS transistor, thereby controlling the heating circuit to operate or shut off. In the embodiment shown in FIG. 5 The first MOS transistor Q1 may be an NMOS transistor. The gate G of the NMOS transistor is connected to a control signal, such as a PWM signal, and is turned on when the control signal is at a high level, and the circuit between the control power supply and the ground is turned on.
继续如图5所示,所述温度控制系统还包括开关电源,用于将所述控制信号转换为直流电压,以使所述加热电路持续发热。开关电源设计实现例如PWM信号的控制信号转换为直流,加热电路可以持续发热,使发热量更加均匀。同样地,例如PWM信号的控制信号的占空比控制加热电路的发热量,占空比越高,开关电源的输出电压越高,那么加热电路的工作电压也越高,发热量越大。所述开关电源可以是任意适合的开关电源,例如BUCK开关电源。Continuing as shown in FIG. 5, the temperature control system further includes a switching power supply for converting the control signal into a DC voltage, so that the heating circuit continues to generate heat. The design of the switching power supply realizes the conversion of the control signal, such as the PWM signal, to DC, and the heating circuit can continue to generate heat to make the heat generation more uniform. Similarly, for example, the duty ratio of the control signal of the PWM signal controls the heating value of the heating circuit. The higher the duty ratio, the higher the output voltage of the switching power supply, and the higher the operating voltage of the heating circuit and the greater the heating value. The switching power supply may be any suitable switching power supply, such as a BUCK switching power supply.
在一个示例中,如图5所示,所述开关电源为一种BUCK开关电源,所述开关电源包括第二开关电路、储能电路、输出滤波电路和续流电路。In one example, as shown in FIG. 5, the switching power supply is a BUCK switching power supply. The switching power supply includes a second switching circuit, an energy storage circuit, an output filter circuit, and a freewheeling circuit.
具体地,第二开关电路用于控制所述开关电源的储能电路的充放电。可选地,所述第二开关电路包括第二MOS管Q2,其中,所述第二MOS管的源端和漏端中的一端电连接所述电源电压,另一端电连接所述储能电路的输入端,例如,第二MOS管Q2为PMOS晶体管。Specifically, the second switching circuit is used to control the charging and discharging of the energy storage circuit of the switching power supply. Optionally, the second switching circuit includes a second MOS transistor Q2, wherein one end of the source and drain terminals of the second MOS transistor is electrically connected to the power supply voltage, and the other end is electrically connected to the energy storage circuit For example, the second MOS transistor Q2 is a PMOS transistor.
储能电路用于在所述第二开关电路导通时储存电能以及在所述第二开关电路截止时放电。可选地,所述储能电路包括至少一个电感L1。The energy storage circuit is used for storing electrical energy when the second switching circuit is on and discharging when the second switching circuit is off. Optionally, the energy storage circuit includes at least one inductor L1.
输出滤波电路用于在所述第二开关电路导通时充电以及在所述第二开关电路截止时放电;例如,所述输出滤波电路包括电容C2。The output filter circuit is used for charging when the second switch circuit is on and discharging when the second switch circuit is off; for example, the output filter circuit includes a capacitor C2.
所述续流电路在所述第二开关电路截止时导通,用于起到续流作用,以提供所述储能电路的放电回路。可选地,所述续流电路包括二极管D1,或者其他适合的电路或者元件。The freewheeling circuit is turned on when the second switch circuit is turned off, and is used for freewheeling to provide a discharge circuit of the energy storage circuit. Optionally, the freewheeling circuit includes a diode D1, or other suitable circuits or components.
示例性地,所述第二开关电路的输入端电连接电源电压,所述第二开关 电路的输出端电连接所述储能电路的输入端;以及所述储能电路的输出端电连接所述输出滤波电路的输入端,所述输出滤波电路的输出端接地;所述续流电路的一端电连接所述储能电路的输入端,另一端接地,例如,所述续流电路的二极管D1的阴极电连接储能电路的输入端,所述二极管的阳极接地。Exemplarily, the input end of the second switch circuit is electrically connected to the power supply voltage, the output end of the second switch circuit is electrically connected to the input end of the energy storage circuit; and the output end of the energy storage circuit is electrically connected to the The input end of the output filter circuit, the output end of the output filter circuit is grounded; one end of the freewheeling circuit is electrically connected to the input end of the energy storage circuit, and the other end is grounded, for example, the diode D1 of the freewheeling circuit The cathode of is electrically connected to the input end of the energy storage circuit, and the anode of the diode is grounded.
在一个示例中,所述测距装置还包括分压电路,所述分压电路的分压节点电连接所述第二开关电路的控制端,用于控制所述第二开关电路导通或截止。由于分压电路的导通和截止由第一开关电路控制,那么也即在第一开关电路导通时,第二开关电路也导通,第一开关电路截止时,第二开关电路也截止。更进一步,所述分压电路的输出端电连接所述加热控制电路的输入端,所述分压电路的输入端电连接所述电源电压。示例性地,所述分压电路包括串联的至少两个电阻,例如,如图5所示,所述分压电路包括串联的电阻R1和电阻R2,其中,分压节点位于两个电阻之间,第二开关电路的控制端为PMOS晶体管的栅极G,该栅极电连接分压电路的分压节点,使得连接到PMOS晶体管的电压小于与PMOS晶体管的源极S电连接的电源电压VCC,因此,在第一开关电路导通时,包括PMOS晶体管的第二开关电路也导通,此时,与PMOS晶体管电连接的二极管D1截止,而储能电感L1被充磁,流经电感的电流线性增加,同时给电容C2充电,给加热电路提供能量,加热电路包括并联的加热电阻R3、R4、R5、R6提供能量,此时加热电路工作对待控温器件进行加热,而在第一开关电路截止时,包括PMOS晶体管的第二开关电路也截止,此时,二极管D1导通,储能电感L1通过二极管D1放电,电感电流线性减少,输出电压靠输出滤波电容C2放电以及减小的电感电流维持,从而继续对加热电路提供能量,使得加热电路能够持续发热。同样地,PWM信号的占空比控制加热电阻的发热量,占空比越高,BUCK开关电源的输出电压越高,那么加热电阻的工作电压也越高,发热量越大。In one example, the distance measuring device further includes a voltage divider circuit, a voltage divider node of the voltage divider circuit is electrically connected to the control terminal of the second switch circuit, and is used to control the second switch circuit to be turned on or off . Since the turn-on and turn-off of the voltage dividing circuit is controlled by the first switch circuit, that is, when the first switch circuit is turned on, the second switch circuit is also turned on, and when the first switch circuit is turned off, the second switch circuit is also turned off. Furthermore, the output terminal of the voltage dividing circuit is electrically connected to the input terminal of the heating control circuit, and the input terminal of the voltage dividing circuit is electrically connected to the power supply voltage. Exemplarily, the voltage dividing circuit includes at least two resistors connected in series, for example, as shown in FIG. 5, the voltage dividing circuit includes a resistor R1 and a resistor R2 connected in series, wherein the voltage dividing node is located between the two resistors The control terminal of the second switching circuit is the gate G of the PMOS transistor, which is electrically connected to the voltage dividing node of the voltage dividing circuit, so that the voltage connected to the PMOS transistor is less than the power supply voltage VCC electrically connected to the source S of the PMOS transistor Therefore, when the first switching circuit is turned on, the second switching circuit including the PMOS transistor is also turned on. At this time, the diode D1 electrically connected to the PMOS transistor is turned off, and the energy storage inductor L1 is magnetized and flows through the inductor The current increases linearly while charging capacitor C2 to provide energy to the heating circuit. The heating circuit includes parallel heating resistors R3, R4, R5, and R6 to provide energy. At this time, the heating circuit works to heat the temperature control device, and the first switch When the circuit is turned off, the second switching circuit including the PMOS transistor is also turned off. At this time, the diode D1 is turned on, the energy storage inductor L1 is discharged through the diode D1, the inductor current decreases linearly, the output voltage is discharged by the output filter capacitor C2 and the reduced inductance The current is maintained to continue to provide energy to the heating circuit so that the heating circuit can continue to generate heat. Similarly, the duty cycle of the PWM signal controls the heating value of the heating resistor. The higher the duty cycle, the higher the output voltage of the BUCK switching power supply, and the higher the operating voltage of the heating resistor and the greater the heating value.
在上述实施例的温度控制系统下,如图6所示,所述测距装置还包括电路板(未示出),所述待控温器件301设置在所述电路板上。其中待控温器件包括前述的发射器、接收器和模拟电路中的至少一种。In the temperature control system of the above embodiment, as shown in FIG. 6, the distance measuring device further includes a circuit board (not shown), and the temperature-to-be-controlled device 301 is disposed on the circuit board. The temperature control device includes at least one of the foregoing transmitter, receiver, and analog circuit.
继续如图6所示,所述测距装置还包括导热层300,所述导热层300设置在所述待控温器件301的下方的电路板上,用于将加热电阻产生的热量传导至所述待控温器件301。所述导热层300可以是任意适合的金属导热层, 例如铜、银、铝等金属。在本实施例中,所述导热层的材料包括地层,该地层既可以用于电连接电路中的需要接地的器件,又同时可以作为导热层将加热电阻产生的热量传导至所述待控温器件301。Continuing as shown in FIG. 6, the distance measuring device further includes a thermally conductive layer 300, which is disposed on the circuit board below the temperature-to-be-controlled device 301, and is used to conduct the heat generated by the heating resistor to all Narrate temperature control device 301. The heat conductive layer 300 may be any suitable metal heat conductive layer, such as copper, silver, aluminum and other metals. In this embodiment, the material of the thermally conductive layer includes a ground layer, which can be used not only for electrically connecting devices in the circuit that need to be grounded, but also as a thermal conductive layer to conduct the heat generated by the heating resistor to the temperature to be controlled Device 301.
在一个示例中,由于例如地层的导热层的铺设面积大,使得加热电路的热量除了传导至待控温器件之外,其他不必要的区域也可能会被加热,影响加热的效率,因此,如图3所示,在所述导热层300上设置有至少一个热孤岛302,所述热孤岛用于隔离其相对两侧的导热层300,使得热量会更集中的传导至待控温器件301。其中,通过PMOS可以实现加热电阻通过例如地层的导热层进行热传导,并在电路板上可以形成导热层的热孤岛,缩小加热对象的面积,提高加热的效率,特别是将该图6所示的实施例结合到图4中时。In one example, due to the large laying area of the thermal conductive layer of the ground layer, for example, the heat of the heating circuit may be conducted to other devices to be controlled, and other unnecessary areas may also be heated, affecting the heating efficiency. As shown in FIG. 3, at least one thermal island 302 is provided on the thermal conductive layer 300, the thermal island is used to isolate the thermal conductive layers 300 on opposite sides of the thermal island, so that the heat will be more concentratedly conducted to the temperature-controlled device 301. Among them, PMOS can realize the heating resistance through the heat conduction layer of the ground layer for thermal conduction, and can form a thermal island on the circuit board to reduce the area of the heating object and improve the heating efficiency, especially the When the embodiment is incorporated in FIG. 4.
可选地,多个所述热孤岛302沿所述待控温器件的四周间隔排布成环形。所述环形包括圆环形或多边环形,或者其他适合形状的环形。特别是,如图6所示,每个所述热孤岛302呈长条形。示例性地,所述热孤岛302可以为贯穿所述导热层300的开口,或者也可以是贯穿所述导热层300的隔热材料层,例如绝缘层或者其他导热性差的材料。Optionally, the plurality of thermal islands 302 are arranged in a ring shape at intervals along the circumference of the device to be controlled. The ring shape includes a circular ring shape or a polygonal ring shape, or another ring shape with a suitable shape. In particular, as shown in FIG. 6, each of the thermal islands 302 has a long shape. Exemplarily, the thermal island 302 may be an opening penetrating the thermal conductive layer 300, or may also be a layer of thermal insulation material penetrating the thermal conductive layer 300, such as an insulating layer or other materials with poor thermal conductivity.
当测距装置特别是待控温器件的温度较高时,往往需要将热量传导至测距装置的外壳之外,而进行散热,在某些位置,产品内部器件与外壳之间使用铜块作为导热介质,可以减小热阻,保证对内部器件的导热效果。When the temperature of the distance measuring device, especially the device to be temperature controlled, is high, it is often necessary to conduct heat to the outside of the housing of the distance measuring device for heat dissipation. In some locations, a copper block is used between the internal device of the product and the housing Thermally conductive media can reduce thermal resistance and ensure the thermal conductivity of internal devices.
有些器件相对于外壳的位置是固定的,只需选定一个外壳的内表面与器件散热表面平行,将铜块压在这两个平行表面之间,则在外壳安装的时候,铜块的两面会自然与内部器件和外壳紧密贴合,实现良好传热,如图7所示,而有些器件相对于外壳的位置可能会有调整,除非选用不同厚度的铜块或外壳位置可调,否则以上方法并不适用。因此,本发明的一个实施例中提供一种可调整的导热介质,下面参考图8至图12对该导热介质做示例性描述。The position of some devices relative to the case is fixed. Simply select the inner surface of a case parallel to the heat dissipation surface of the device, and press the copper block between these two parallel surfaces. When the case is installed, both sides of the copper block It will naturally closely fit the internal devices and the shell to achieve good heat transfer, as shown in Figure 7, and the position of some devices relative to the shell may be adjusted unless the copper block of different thickness or the position of the shell is adjustable. The method does not apply. Therefore, in one embodiment of the present invention, an adjustable thermal conductive medium is provided, and the thermal conductive medium will be exemplarily described below with reference to FIGS. 8 to 12.
在一个具体实施例中,如图8所示,所述测距装置还包括至少一个导热介质700,所述导热介质700包括散热部701,所述散热部的至少部分表面贴合所述待控温器件(未示出)的至少部分散热面,用于将所述待控温器件的热量导出。所述导热介质的材料包括金属,其中,所述金属包括铜。In a specific embodiment, as shown in FIG. 8, the distance measuring device further includes at least one thermally conductive medium 700, and the thermally conductive medium 700 includes a heat dissipation portion 701, and at least a part of the surface of the heat dissipation portion fits the to-be-controlled At least a part of the heat dissipation surface of the temperature device (not shown) is used to extract the heat of the temperature-control device. The material of the heat conducting medium includes metal, wherein the metal includes copper.
如图8所示,所述导热介质700还包括安装部703,其中,所述安装部703用于将所述导热介质700安装于测距装置的壳体上,该壳体可以是用于 安装测距装置的各种光学元件的壳体,光学元件例如包括准直元件,扫描模块中的光学元件,光路改变元件等。所述安装部703和所述散热部701彼此连接并呈预定夹角,和/或,所述安装部703和所述散热部701一体成型。示例性地,所述预定夹角大体为90°。散热部701的具体形状可以根据实际的测距装置的壳体和待控温器件之间的容纳空间相匹配。As shown in FIG. 8, the thermally conductive medium 700 further includes an installation portion 703, wherein the installation portion 703 is used to install the thermally conductive medium 700 on the housing of the distance measuring device, and the housing may be used for installation Housings of various optical elements of the distance measuring device, such as collimating elements, optical elements in the scanning module, optical path changing elements, etc. The mounting portion 703 and the heat dissipation portion 701 are connected to each other at a predetermined angle, and/or, the mounting portion 703 and the heat dissipation portion 701 are integrally formed. Exemplarily, the predetermined angle is substantially 90°. The specific shape of the heat dissipation part 701 can be matched according to the housing space between the housing of the actual distance-measuring device and the device to be temperature-controlled.
示例性地,如图8所示,所述安装部703设置有所述腰孔704的区域的厚度小于所述导热介质700其他区域的厚度。由于使得其他区域的厚度均较厚,可以减小热阻。Exemplarily, as shown in FIG. 8, the thickness of the area where the mounting portion 703 is provided with the waist hole 704 is smaller than the thickness of other areas of the heat conductive medium 700. Since the thickness of other regions is thicker, the thermal resistance can be reduced.
继续如图8所示,所述安装部703上设置至少一个腰孔704,所述腰孔704的长度大于穿过该腰孔的连接件的径向长度,以在所述连接件紧固之前沿所述腰孔的长度方向调整所述导电介质的位置,以使导电介质的散热部更加贴近于待控温器件,有利于待控温器件热量的导出。并且,所述连接件的径向长度(在连接件的截面为圆形时,连接件的长度是指连接件的直径)小于所述腰孔的宽度,以在所述连接件紧固之前沿所述腰孔的宽度方向调整所述导电介质的位置,以使导电介质的散热部更加贴近于待控温器件,有利于待控温器件热量的导出。Continuing as shown in FIG. 8, at least one waist hole 704 is provided on the mounting portion 703, and the length of the waist hole 704 is greater than the radial length of the connecting member passing through the waist hole to fasten the connecting member Adjust the position of the conductive medium in the length direction of the waist hole at the front, so that the heat dissipation part of the conductive medium is closer to the device to be temperature controlled, which is beneficial to the heat extraction of the device to be temperature controlled. Moreover, the radial length of the connecting piece (when the cross-section of the connecting piece is circular, the length of the connecting piece refers to the diameter of the connecting piece) is smaller than the width of the waist hole, so that before the connecting piece is fastened The width direction of the waist hole adjusts the position of the conductive medium, so that the heat dissipation portion of the conductive medium is closer to the device to be temperature controlled, which is beneficial to the heat extraction of the device to be temperature controlled.
在一个示例中,如图8和图9所示,所述腰孔704的长度延伸方向与所述待控温器件的散热面垂直,以沿该长度延伸方向调整所述散热部贴合所述待控温器件。In one example, as shown in FIGS. 8 and 9, the length extension direction of the waist hole 704 is perpendicular to the heat dissipation surface of the temperature-controlling device, so as to adjust the heat dissipation portion to fit the Temperature control device.
如图9所示,所述测距装置还包括至少一个连接件705,所述连接件包括螺钉、螺栓中的至少一种。所述连接件705穿过腰孔将所述导热介质700安装于所述壳体900上。示例性地,在所述连接件705背离所述壳体900的一端和所述腰孔之间还设置有垫片706,而706垫片直径应大于腰孔宽度。As shown in FIG. 9, the distance measuring device further includes at least one connector 705, and the connector includes at least one of screws and bolts. The connecting member 705 passes through the waist hole to install the heat conductive medium 700 on the housing 900. Exemplarily, a gasket 706 is further provided between the end of the connecting member 705 facing away from the housing 900 and the waist hole, and the diameter of the gasket 706 should be greater than the width of the waist hole.
如图10所示,所述散热部701包括相对设置的第一表面和第二表面,例如,所述散热部701的第一表面和第二表面为相对而非平行的表面。在所述散热部邻近所述待控温器件的所述第一表面上还设置有凸块702,所述凸块702与所述第一表面相对的至少部分表面贴合所述待控温器件的散热面。可选地,所述凸块702贴合所述待控温器件的表面的尺寸小于与所述散热部701的第一表面的尺寸。其中,凸块702的作用是避免热量回流。其中,可以仅在部分导热介质上设置凸块,其中,所述凸块的材料包括任意良好的导热材 料,例如金属材料,金属材料包括铜或者其他材料,该凸块可以是焊接或者粘接在散热部701上,也可以是和散热部701一体成型。As shown in FIG. 10, the heat dissipation portion 701 includes a first surface and a second surface that are disposed oppositely. For example, the first surface and the second surface of the heat dissipation portion 701 are opposite, not parallel surfaces. A bump 702 is further provided on the first surface of the heat dissipation portion adjacent to the temperature-controlling device, and at least a part of the surface of the bump 702 opposite to the first surface conforms to the temperature-controlling device Cooling surface. Optionally, the size of the surface of the bump 702 that fits the temperature-control device is smaller than the size of the first surface of the heat dissipation portion 701. Among them, the function of the bump 702 is to avoid heat reflow. Wherein, bumps may be provided on only part of the thermally conductive medium, wherein the material of the bumps includes any good thermally conductive materials, such as metal materials, and the metal materials include copper or other materials. The bumps may be welded or bonded The heat sink 701 may be integrally formed with the heat sink 701.
所述测距装置包括至少两个所述导热介质,其中,在所述至少两个所述导热介质的部分导热介质的所述散热部上设置所述凸块。具体地,所述测距装置包括第一待控温器件和第二待控温器件,其中,所述测距装置包括第一导热介质和第二导热介质,所述第一导热介质的所述散热部上设置所述凸块,所述第一导热介质上的凸块贴合所述第一待控温器件的至少部分散热面,例如,如图11所示,所述第一待控温器件包括发射器203,仅在与发射器203贴合的导热介质700上设置凸块702;所述第二导热介质的散热部贴合所述第二待控温器件的至少部分散热面,所述第二待控温器件包括探测器205。The distance measuring device includes at least two of the thermally conductive media, wherein the protrusions are provided on the heat dissipation portions of the thermally conductive media of the at least two of the thermally conductive media. Specifically, the distance measuring device includes a first temperature-controlled device and a second temperature-controlled device, wherein the distance measuring device includes a first heat-conductive medium and a second heat-conductive medium, and the The bumps are provided on the heat dissipation part, and the bumps on the first heat-conducting medium are attached to at least part of the heat dissipation surface of the first temperature-controlling device. For example, as shown in FIG. The device includes an emitter 203, and a bump 702 is provided only on the thermally conductive medium 700 attached to the emitter 203; the heat dissipation portion of the second thermally conductive medium is attached to at least a part of the heat dissipation surface of the second temperature-controlled device. The second temperature-controlled device includes a detector 205.
如图9、图10和图12所示,所述测距装置包括至少两个所述导热介质,其中,每个所述导热介质的散热部的至少部分表面贴合不同的所述待控温器件,用于分别将对应的所述待控温器件的热量导出,例如包括导热介质800和导热介质700,导热介质800的散热部至少部分表面贴合探测器205,导热介质700的散热部至少部分表面贴合发射器203。As shown in FIG. 9, FIG. 10 and FIG. 12, the distance measuring device includes at least two of the thermally conductive media, wherein at least a part of the surface of the heat dissipation portion of each of the thermally conductive media conforms to different temperatures to be controlled A device for respectively deriving the heat of the corresponding temperature-controlling device, for example, including a heat-conducting medium 800 and a heat-conducting medium 700, the heat dissipation portion of the heat-conducting medium 800 is at least partially surface-fitted to the detector 205, and the heat dissipation portion of the heat-conducting medium 700 is at least Part of the surface is attached to the emitter 203.
如图11所示,所述待控温装置安装于外壳400的容纳腔内,所述导热介质700的散热部的相对的两个表面分别至少部分贴合所述待控温器件的散热面和所述外壳400的部分表面,以通过导热介质700将待控温器件(例如发射器203)的热量传导至外壳400上,从而实现散热。所述壳体位于所述外壳的容纳腔内。As shown in FIG. 11, the temperature-to-be-controlled device is installed in the accommodating cavity of the housing 400, and two opposite surfaces of the heat dissipation portion of the heat-conducting medium 700 are at least partially attached to the heat dissipation surface of the device to be temperature-controlled and Part of the surface of the housing 400 is used to conduct the heat of the device to be temperature controlled (for example, the transmitter 203) to the housing 400 through the heat conductive medium 700, thereby achieving heat dissipation. The housing is located in the receiving cavity of the housing.
在一个示例中,外壳的一个平面与待控温器件的散热面垂直,保证导热介质例如铜块结构上对应有两个垂直的第一平面和第二平面。导热介质可以在第二平面上平移调整位置,当第一平面与待控温器件贴合时固定在第二平面,随后外壳安装的时候也可以与导热介质紧密贴合。In one example, one plane of the housing is perpendicular to the heat dissipation surface of the device to be temperature-controlled, ensuring that there are two vertical first planes and second planes corresponding to the heat conductive medium such as a copper block structure. The heat-conducting medium can be translated on the second plane to adjust the position. When the first plane and the device to be temperature-controlled are fixed on the second plane, the heat-conducting medium can also be closely attached when the housing is installed.
如果采用螺钉固定如图8所示的导热介质例如铜块。第一平面和第二平面分别作为与待控温器件的贴合表面和安装表面。第二平面上开有长条形腰孔,腰孔宽度和长度均大于螺钉直径,当螺钉穿过的时候,铜块仍可以利用空隙进行不同方向的调节。在其他非关键部位,铜块可以尽量增加厚度以减小热阻。If screws are used to fix the thermally conductive medium such as copper block as shown in FIG. 8. The first plane and the second plane respectively serve as a fitting surface and a mounting surface for the temperature-controlled device. An elongated waist hole is formed on the second plane, and the width and length of the waist hole are larger than the diameter of the screw. When the screw passes through, the copper block can still use the gap to adjust in different directions. In other non-critical parts, the copper block can be increased in thickness as much as possible to reduce the thermal resistance.
本发明设计的导热介质(例如铜块)结构可以在相同规格下,使得导热 介质都同时与待控温器件和外壳都紧密贴合,同时不需调整外壳位置,以上导热介质很好的作为导热通道,将热量导出到外壳之外。The structure of the heat conduction medium (such as copper block) designed by the invention can be in the same specification, so that the heat conduction medium is closely adhered to the temperature-controlled device and the casing at the same time, and the position of the casing is not adjusted. The above heat conduction medium is good for heat conduction Channels to direct heat out of the enclosure.
为了能够使删除到外壳的热量很快速散出,本发明的温度控制系统还包括散热模块,所述散热模块用于对所述待控温器件进行散热。所述散热模块可以包括风机或者其他的用于散热的装置。In order to enable the heat removed to the housing to be quickly dissipated, the temperature control system of the present invention further includes a heat dissipation module, and the heat dissipation module is used to dissipate heat to the temperature-controlled device. The heat dissipation module may include a fan or other devices for heat dissipation.
进一步,温度控制系统还包括控制模块,控制模块用于基于所述待控温器件的当前环境温度和目标温度的比较结果,控制散热模块运行或关闭。Further, the temperature control system further includes a control module for controlling the heat dissipation module to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the device to be controlled.
更进一步地,所述控制模块包括处理器和散热控制电路,用于获取所述待控温器件的环境温度,并将所述当前环境温度与所述目标温度进行比较后生成控制信号;所述散热控制电路用于获取所述控制信号,控制所述散热模块根据所述控制信号运行或关闭。Further, the control module includes a processor and a heat dissipation control circuit, configured to obtain the ambient temperature of the temperature-controlled device, and compare the current ambient temperature with the target temperature to generate a control signal; The heat dissipation control circuit is used to obtain the control signal and control the heat dissipation module to operate or shut down according to the control signal.
所述目标温度包括第一目标温度和第二目标温度,其中,所述第一目标温度小于所述第二目标温度,所述处理器具体用于:获取所述待控温器件的当前环境温度,将所述当前环境温度与所述目标温度进行比较,若所述当前环境温度小于所述第一目标温度,则生成第一控制信号,用于控制所述散热模块关闭,若所述当前环境温度大于第二目标温度,则生成第二控制信号,用于控制散热模块运行。The target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is less than the second target temperature, and the processor is specifically configured to: obtain the current ambient temperature of the temperature-controlling device , Compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a first control signal for controlling the heat dissipation module to shut down, if the current environment If the temperature is greater than the second target temperature, a second control signal is generated for controlling the operation of the heat dissipation module.
在一个示例中,所述目标温度包括第一目标温度和第二目标温度,所述第二目标温度大于所述第一目标温度,所述散热控制电路具体用于:当所述当前环境温度小于所述第一目标温度,控制所述散热模块关闭;当所述当前环境温度大于或等于所述第二目标温度,控制所述散热模块运行。其中,散热控制电路可以接收由处理器生成的上述控制信号,根据该控制信号执行相应的动作。In an example, the target temperature includes a first target temperature and a second target temperature, the second target temperature is greater than the first target temperature, and the heat dissipation control circuit is specifically configured to: when the current ambient temperature is less than The first target temperature controls the heat dissipation module to be turned off; when the current ambient temperature is greater than or equal to the second target temperature, the heat dissipation module is controlled to operate. The heat dissipation control circuit may receive the above control signal generated by the processor, and perform corresponding actions according to the control signal.
为了实现对待控温器件的环境温度的检测,所述测距装置还包括温度检测电路,用于检测所述待控温器件的当前环境温度。其中,所述温度检测电路包括温度传感器,所述温度传感器可以是任意类型的能够用于温度检测的传感器,包括但不限于热电偶或热敏电阻等。In order to realize the detection of the ambient temperature of the temperature control device, the distance measuring device further includes a temperature detection circuit for detecting the current ambient temperature of the temperature control device. Wherein, the temperature detection circuit includes a temperature sensor, and the temperature sensor may be any type of sensor that can be used for temperature detection, including but not limited to a thermocouple or a thermistor.
在图13所示的一个实施例中的散热模块的控制策略,首先,测距装置上电,例如激光雷达上电,温度检测电路检测待控温器件的当前环境温度,由 控制模块将当前环境温度和第二目标温度(例如目标温度a)进行比较,当所述当前环境温度小于所述第二目标温度,控制所述散热模块关闭,例如控制风机停转,若当前环境温度大于或等于第二目标温度时,根据调速策略进行转速调节。In the control strategy of the heat dissipation module in an embodiment shown in FIG. 13, first, the distance measuring device is powered on, for example, the lidar is powered on, the temperature detection circuit detects the current ambient temperature of the temperature-controlled device, and the current environment is controlled by the control module The temperature is compared with a second target temperature (for example, target temperature a), when the current ambient temperature is less than the second target temperature, the heat dissipation module is controlled to be turned off, for example, the fan is stopped, if the current ambient temperature is greater than or equal to the At the second target temperature, the speed is adjusted according to the speed regulation strategy.
图14中示出了一种具体实施例中的调速策略。所述目标温度包括第一目标温度(温度d)、第二目标温度(温度a)、第三目标温度(温度b)和第四目标温度(例如温度c),其中,第一目标温度大于第二目标温度,第三目标温度大于第二目标温度,第四目标温度大于第三目标温度。上述温度可以根据器件对温度的要求进行合理设定,例如上述温度可以均设置在0~50°之间,更小的温度范围内。FIG. 14 shows a speed regulation strategy in a specific embodiment. The target temperature includes a first target temperature (temperature d), a second target temperature (temperature a), a third target temperature (temperature b), and a fourth target temperature (for example, temperature c), where the first target temperature is greater than the first The second target temperature, the third target temperature is greater than the second target temperature, and the fourth target temperature is greater than the third target temperature. The above temperature can be set reasonably according to the temperature requirements of the device. For example, the above temperatures can all be set between 0 and 50°, within a smaller temperature range.
所述散热控制电路还具体用于:若所述当前环境温度介于所述第二目标温度和所述第三目标温度之间,控制所述散热模块的散热速率维持在第一速率;若所述当前环境温度大于或等于所述第三目标温度并小于所述第四目标温度,控制所述散热模块的散热速率在所述第一速率和第二速率之间,其中,所述第二速率大于所述第一速率;以及若所述当前环境温度大于或等于所述第四目标温度,控制所述散热模块的散热速率维持在所述第二速率。The heat dissipation control circuit is further specifically configured to: if the current ambient temperature is between the second target temperature and the third target temperature, control the heat dissipation rate of the heat dissipation module to be maintained at the first rate; The current ambient temperature is greater than or equal to the third target temperature and less than the fourth target temperature, and the heat dissipation rate of the heat dissipation module is controlled between the first rate and the second rate, wherein the second rate Greater than the first rate; and if the current ambient temperature is greater than or equal to the fourth target temperature, controlling the rate of heat dissipation of the heat dissipation module to be maintained at the second rate.
在一个示例中,所述散热控制电路还具体用于:当所述当前环境温度从小于所述第一目标温度逐渐升高至所述第一目标温度和所述第二目标温度之间,控制所述散热模块关闭;当所述当前环境温度继续升高到大于或等于所述第二目标温度,控制所述散热模块运行。In an example, the heat dissipation control circuit is further specifically configured to: when the current ambient temperature gradually increases from less than the first target temperature to between the first target temperature and the second target temperature, control The heat dissipation module is turned off; when the current ambient temperature continues to rise to greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
在一个示例中,所述散热控制电路还具体用于:当所述当前环境温度从大于或等于所述第二目标温度降低到所述第一目标温度和所述第二目标温度之间,控制所述散热模块的散热速率维持在第一速率;当所述当前环境温度降低到小于所述第一目标温度,控制所述散热模块关闭。In one example, the heat dissipation control circuit is further specifically configured to: when the current ambient temperature decreases from greater than or equal to the second target temperature to between the first target temperature and the second target temperature, control The heat dissipation rate of the heat dissipation module is maintained at a first rate; when the current ambient temperature decreases to less than the first target temperature, the heat dissipation module is controlled to be turned off.
通过上述控制方式,根据当前环境温度所在的温度范围,对散热模块的散热速率进行适当调整,可以使得在温度高时增加散热速率,从而快速降温,而在温度稍微高,而又没有满足对目标温度的要求时,可以以稍微低速的散热速率进行散热,而当温度低时,保持散热模块关闭,从而提高散热效率,以及改善测距装置的温控准确性。Through the above control method, according to the temperature range of the current ambient temperature, the heat dissipation rate of the heat dissipation module is adjusted appropriately, which can increase the heat dissipation rate when the temperature is high, so as to quickly cool the temperature, but at a slightly higher temperature, but does not meet the target When the temperature is required, the heat can be dissipated at a slightly lower heat dissipation rate. When the temperature is low, the heat dissipation module can be kept closed to improve the heat dissipation efficiency and improve the temperature control accuracy of the distance measuring device.
其中,前述的散热模块包括风机,散热控制电路还具体用于:通过控制 所述风机的占空比以控制所述风机的转速,从而控制所述散热模块的散热速率,其中,所述占空比越大所述散热模块的散热速率越大。Wherein, the aforementioned heat dissipation module includes a fan, and the heat dissipation control circuit is further specifically used to: control the rotation speed of the fan by controlling the duty ratio of the fan, thereby controlling the heat dissipation rate of the heat dissipation module, wherein, the duty The greater the ratio, the greater the heat dissipation rate of the heat dissipation module.
如图3所示,所述占空比包括第一占空比X和第二占空比Y,所述第二占空比大于所述第一占空比,其中,所述散热控制电路具体用于:控制所述风机以所述第一占空比运转,以控制所述散热模块的散热速率维持在所述第一速率;控制所述风机以所述第二占空比运转,以控制所述散热模块的散热速率维持在所述第二速率;以及控制所述风机的占空比在所述第一占空比和所述第二占空比之间变化,以控制所述散热模块的散热速率在所述第一速率和所述第二速率之间。As shown in FIG. 3, the duty cycle includes a first duty cycle X and a second duty cycle Y, the second duty cycle is greater than the first duty cycle, wherein the heat dissipation control circuit is specifically Used to: control the fan to operate at the first duty ratio to control the heat dissipation rate of the heat dissipation module to maintain the first rate; control the fan to operate at the second duty ratio to control The heat dissipation rate of the heat dissipation module is maintained at the second rate; and the duty ratio of the fan is controlled to change between the first duty ratio and the second duty ratio to control the heat dissipation module The heat dissipation rate is between the first rate and the second rate.
在一个示例中,所述散热控制电路具体用于:控制所述风机的占空比在所述第一占空比和所述第二占空比之间线性变化,以控制所述散热模块的散热速率在所述第一速率和所述第二速率之间;控制所述风机的占空比为零,以控制所述散热模块关闭。In one example, the heat dissipation control circuit is specifically configured to: control the duty ratio of the fan to change linearly between the first duty ratio and the second duty ratio to control the heat dissipation module The heat dissipation rate is between the first rate and the second rate; the duty ratio of the fan is controlled to be zero to control the heat dissipation module to be turned off.
在一个示例中,所述待控温器件安装于外壳内的容纳腔中,其中,所述散热模块用于对所述外壳散热。所述外壳可以包括金属外壳等具有良好导热性的外壳。In one example, the temperature-to-be-controlled device is installed in a receiving cavity in the housing, wherein the heat dissipation module is used to dissipate heat to the housing. The shell may include a metal shell or the like having a good thermal conductivity.
下面参考图13和图14对例如风机的散热模块的控制策略进行示例性描述。The control strategy of the heat dissipation module of the fan, for example, will be described below with reference to FIGS. 13 and 14.
首先,如图13所示,激光雷达上电后进行温度比对,如果测得待控温器件的当前环境温度小于或等于温度a,则风机停转,否则风机按照如图14所示的调速策略进行风机占空比调节,继而实现对转速的调节控制;具体调节方式包括但不限于图14所示的线性调速。First, as shown in Figure 13, the lidar performs temperature comparison after power-on. If the current ambient temperature of the device to be controlled is measured to be less than or equal to temperature a, the fan stops, otherwise the fan is adjusted as shown in Figure 14. The speed strategy adjusts the duty cycle of the fan, and then realizes the adjustment control of the rotation speed; specific adjustment methods include but are not limited to the linear speed regulation shown in FIG. 14.
如图14所示的调速策略包括以下策略:The speed regulation strategy shown in Figure 14 includes the following strategies:
当检测待控温器件(例如发射器)的当前环境温度T大于温度a小于温度b,风机占空比维持X不变;When detecting that the current ambient temperature T of the device to be controlled (such as the transmitter) is greater than temperature a and less than temperature b, the duty cycle of the fan remains X unchanged;
当当前环境温度T大于或等于温度b并小于温度c时,风机占空比在X到100%之间线性调节;When the current ambient temperature T is greater than or equal to temperature b and less than temperature c, the duty cycle of the fan is linearly adjusted between X and 100%;
当当前环境温度T大于或等于温度c,风机占空比维持风机转速设置最大占空比Y;When the current ambient temperature T is greater than or equal to the temperature c, the fan duty cycle maintains the fan speed setting maximum duty cycle Y;
其中,温度a和温度d之间为温度回滞区域:Among them, the temperature hysteresis area between temperature a and temperature d:
当当前环境温度T小于d,风机占空比为0,控制风机停转;When the current ambient temperature T is less than d, the duty cycle of the fan is 0, and the fan is controlled to stop;
当当前环境温度T从小于温度d逐渐升高到温度d和温度a之间,此区间风机占空比为0,风机停转;When the current ambient temperature T gradually increases from less than the temperature d to between the temperature d and the temperature a, the duty ratio of the fan in this interval is 0, and the fan stops;
当当前环境温度T继续升高到大于或等于温度a,风机占空比调节到X,开始工作;When the current ambient temperature T continues to rise to greater than or equal to the temperature a, the fan duty cycle is adjusted to X, and work begins;
当当前环境温度T从大于或等于温度a降低到不小于温度d的区间,风机占空比保持X不变,风机工作;When the current ambient temperature T decreases from greater than or equal to the temperature a to the interval not less than the temperature d, the fan duty ratio remains X unchanged, and the fan works;
当当前环境温度T继续降低到小于温度b,风机占空比调节到0,风机停止工作。When the current ambient temperature T continues to decrease to less than temperature b, the fan duty cycle is adjusted to 0, and the fan stops working.
综上,本发明的测距装置的温控方案更加合理,通过导热介质这样的低热阻传递通路将待控温器件(例如发射器和接收器)的热量快捷的传递给测距装置的外壳,然后控制例如风机的散热模块工作给测距装置外壳散热,通过加热电路在环境温度过低的时候启动加热,对待控温器件进行加热。实现高温时将目标温度控制在环境温度之下,低温时将目标温度控制在环境温度之上,有效减小了发射器的温度范围,控制了波长的变化范围,减小了接收滤波器的设计带宽,减小了噪声,提高了信噪比,增加了量程。而且提高了发射器的寿命,并实现对温度的精确控制,提高测距装置的稳定性。In summary, the temperature control scheme of the distance measuring device of the present invention is more reasonable, and the heat of the temperature-controlled devices (such as the transmitter and receiver) is quickly transferred to the housing of the distance measuring device through a low thermal resistance transmission path such as a thermally conductive medium. Then control the heat dissipation module of the fan to work to dissipate heat to the housing of the distance measuring device, and start heating through the heating circuit when the ambient temperature is too low to heat the temperature control device. The target temperature is controlled below the ambient temperature when high temperature is achieved, and the target temperature is controlled above the ambient temperature when low temperature, which effectively reduces the temperature range of the transmitter, controls the wavelength variation range, and reduces the design of the receiving filter Bandwidth reduces noise, improves signal-to-noise ratio, and increases range. Moreover, the life of the transmitter is improved, and the temperature is accurately controlled, and the stability of the distance measuring device is improved.
在一种实施方式中,本发明实施方式的测距装置可应用于移动平台,测距装置可安装在移动平台的平台本体。具有测距装置的移动平台可对外部环境进行测量,例如,测量移动平台与障碍物的距离用于避障等用途,和对外部环境进行二维或三维的测绘。在某些实施方式中,移动平台包括无人飞行器、汽车、遥控车、机器人、船、相机中的至少一种。当测距装置应用于无人飞行器时,平台本体为无人飞行器的机身。当测距装置应用于汽车时,平台本体为汽车的车身。该汽车可以是自动驾驶汽车或者半自动驾驶汽车,在此不做限制。当测距装置应用于遥控车时,平台本体为遥控车的车身。当测距装置应用于机器人时,平台本体为机器人。当测距装置应用于相机时,平台本体为相机本身。In one embodiment, the distance measuring device of the embodiment of the present invention can be applied to a mobile platform, and the distance measuring device can be installed on the platform body of the mobile platform. A mobile platform with a distance measuring device can measure the external environment, for example, measuring the distance between the mobile platform and obstacles for obstacle avoidance and other purposes, and performing two-dimensional or three-dimensional mapping on the external environment. In some embodiments, the mobile platform includes at least one of an unmanned aerial vehicle, a car, a remote control car, a robot, a boat, and a camera. When the distance measuring device is applied to an unmanned aerial vehicle, the platform body is the fuselage of the unmanned aerial vehicle. When the distance measuring device is applied to an automobile, the platform body is the body of the automobile. The car may be a self-driving car or a semi-automatic car, and no restriction is made here. When the distance measuring device is applied to a remote control car, the platform body is the body of the remote control car. When the distance measuring device is applied to a robot, the platform body is a robot. When the distance measuring device is applied to a camera, the platform body is the camera itself.
尽管这里已经参考附图描述了示例实施例,应理解上述示例实施例仅仅是示例性的,并且不意图将本发明的范围限制于此。本领域普通技术人员可以在其中进行各种改变和修改,而不偏离本发明的范围和精神。所有这些改 变和修改意在被包括在所附权利要求所要求的本发明的范围之内。Although example embodiments have been described herein with reference to the drawings, it should be understood that the above example embodiments are merely exemplary, and are not intended to limit the scope of the present invention thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.
本领域普通技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。Those of ordinary skill in the art may realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application of the technical solution and design constraints. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.
在本申请所提供的几个实施例中,应该理解到,所揭露的设备和方法,可以通过其它的方式实现。例如,以上所描述的设备实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个设备,或一些特征可以忽略,或不执行。In the several embodiments provided in this application, it should be understood that the disclosed device and method may be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a division of logical functions. In actual implementation, there may be other divisions, for example, multiple units or components may be combined or Can be integrated into another device, or some features can be ignored, or not implemented.
在此处所提供的说明书中,说明了大量具体细节。然而,能够理解,本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中,并未详细示出公知的方法、结构和技术,以便不模糊对本说明书的理解。The specification provided here explains a lot of specific details. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this description.
类似地,应当理解,为了精简本发明并帮助理解各个发明方面中的一个或多个,在对本发明的示例性实施例的描述中,本发明的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而,并不应将该本发明的方法解释成反映如下意图:即所要求保护的本发明要求比在每个权利要求中所明确记载的特征更多的特征。更确切地说,如相应的权利要求书所反映的那样,其发明点在于可以用少于某个公开的单个实施例的所有特征的特征来解决相应的技术问题。因此,遵循具体实施方式的权利要求书由此明确地并入该具体实施方式,其中每个权利要求本身都作为本发明的单独实施例。Similarly, it should be understood that in order to streamline the invention and help understand one or more of the various inventive aspects, in describing the exemplary embodiments of the invention, the various features of the invention are sometimes grouped together into a single embodiment, figure , Or in its description. However, the method of the present invention should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. Rather, as reflected in the corresponding claims, its invention lies in that the corresponding technical problems can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following a specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present invention.
本领域的技术人员可以理解,除了特征之间相互排斥之外,可以采用任何组合对本说明书(包括伴随的权利要求、摘要和附图)中公开的所有特征以及如此公开的任何方法或者设备的所有过程或单元进行组合。除非另外明确陈述,本说明书(包括伴随的权利要求、摘要和附图)中公开的每个特征可以由提供相同、等同或相似目的替代特征来代替。Those skilled in the art will understand that apart from mutually exclusive features, any combination of all the features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all of the methods or devices disclosed in this specification can be used in any combination. Processes or units are combined. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose.
此外,本领域的技术人员能够理解,尽管在此所述的一些实施例包括其它实施例中所包括的某些特征而不是其它特征,但是不同实施例的特征的组合意味着处于本发明的范围之内并且形成不同的实施例。例如,在权利要求书中,所要求保护的实施例的任意之一都可以以任意的组合方式来使用。In addition, those skilled in the art can understand that although some of the embodiments described herein include certain features included in other embodiments rather than other features, the combination of features of different embodiments is meant to be within the scope of the present invention And form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.
本发明的各个部件实施例可以以硬件实现,或者以在一个或者多个处理 器上运行的软件模块实现,或者以它们的组合实现。本领域的技术人员应当理解,可以在实践中使用微处理器或者数字信号处理器(DSP)来实现根据本发明实施例的一些模块的一些或者全部功能。本发明还可以实现为用于执行这里所描述的方法的一部分或者全部的装置程序(例如,计算机程序和计算机程序产品)。这样的实现本发明的程序可以存储在计算机可读介质上,或者可以具有一个或者多个信号的形式。这样的信号可以从因特网网站上下载得到,或者在载体信号上提供,或者以任何其他形式提供。The various component embodiments of the present invention may be implemented in hardware, or implemented in software modules running on one or more processors, or implemented in a combination thereof. Those skilled in the art should understand that, in practice, a microprocessor or a digital signal processor (DSP) may be used to implement some or all functions of some modules according to embodiments of the present invention. The present invention can also be implemented as a device program (for example, a computer program and a computer program product) for performing a part or all of the method described herein. Such a program implementing the present invention may be stored on a computer-readable medium, or may have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.
应该注意的是上述实施例对本发明进行说明而不是对本发明进行限制,并且本领域技术人员在不脱离所附权利要求的范围的情况下可设计出替换实施例。在权利要求中,不应将位于括号之间的任何参考符号构造成对权利要求的限制。本发明可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中,这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。It should be noted that the above-mentioned embodiments illustrate the present invention rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs between parentheses should not be constructed as limitations on the claims. The invention can be realized by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims enumerating several devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third does not indicate any order. These words can be interpreted as names.

Claims (68)

  1. 一种测距装置,其特征在于,所述测距装置包括发射模块、接收模块和温度控制系统,A distance measuring device, characterized in that the distance measuring device includes a transmitting module, a receiving module and a temperature control system,
    所述发射模块用于出射光脉冲;The transmitting module is used to emit light pulses;
    所述接收模块用于接收经物体反射回的至少部分光脉冲,以及根据所述接收的至少部分光脉冲确定所述物体相对所述测距装置的距离;The receiving module is configured to receive at least part of the optical pulse reflected back by the object, and determine the distance of the object relative to the distance measuring device according to the received at least part of the optical pulse;
    所述温度控制系统包括:The temperature control system includes:
    加热电路和/或散热模块,所述加热电路用于对待控温器件进行加热,所述散热模块用于对所述待控温器件进行散热;A heating circuit and/or a heat dissipation module, the heating circuit is used to heat the temperature control device, and the heat dissipation module is used to dissipate heat to the temperature control device;
    控制模块,用于基于所述待控温器件的当前环境温度和目标温度的比较结果,控制所述加热电路和/或所述散热模块运行或关闭。The control module is configured to control the heating circuit and/or the heat dissipation module to operate or shut down based on the comparison result of the current ambient temperature and the target temperature of the temperature-controlling device.
  2. 如权利要求1所述的测距装置,其特征在于,所述控制模块包括:The distance measuring device according to claim 1, wherein the control module comprises:
    处理器,用于获取所述待控温器件的环境温度,并将所述当前环境温度与所述目标温度进行比较后生成控制信号;A processor, configured to obtain the ambient temperature of the temperature-controlled device, and compare the current ambient temperature with the target temperature to generate a control signal;
    加热控制电路和/或散热控制电路,所述加热控制电路用于获取所述控制信号,以及控制所述加热电路根据所述控制信号运行或关闭,所述散热控制电路用于获取所述控制信号,控制所述散热模块根据所述控制信号运行或关闭。A heating control circuit and/or a heat dissipation control circuit, the heating control circuit is used to obtain the control signal, and the heating circuit is controlled to operate or shut down according to the control signal, and the heat dissipation control circuit is used to obtain the control signal , Control the heat dissipation module to run or shut down according to the control signal.
  3. 如权利要求2所述的测距装置,其特征在于,所述目标温度包括第一目标温度和第二目标温度,其中,所述第一目标温度小于所述第二目标温度,所述处理器具体用于:The distance measuring device according to claim 2, wherein the target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is less than the second target temperature, and the processor Specifically used for:
    获取所述待控温器件的当前环境温度,将所述当前环境温度与所述目标温度进行比较,若所述当前环境温度小于所述第一目标温度,则生成第一控制信号,用于控制所述加热电路运行或控制所述散热模块关闭,若所述当前环境温度大于第二目标温度,则生成第二控制信号,用于控制所述加热电路关闭或控制所述散热模块运行。Obtain the current ambient temperature of the temperature-controlled device, compare the current ambient temperature with the target temperature, and if the current ambient temperature is less than the first target temperature, generate a first control signal for controlling The heating circuit operates or controls the heat dissipation module to be turned off. If the current ambient temperature is greater than the second target temperature, a second control signal is generated for controlling the heating circuit to turn off or the heat dissipation module to operate.
  4. 如权利要求2所述的测距装置,其特征在于,所述加热控制电路包括第一开关电路,所述第一开关电路的控制端连接所述控制信号,所述控制信号用于控制所述第一开关电路的通断时间。The distance measuring device according to claim 2, wherein the heating control circuit includes a first switch circuit, a control terminal of the first switch circuit is connected to the control signal, and the control signal is used to control the On-off time of the first switch circuit.
  5. 如权利要求4所述的测距装置,其特征在于,所述控制信号包括PWM 信号,通过所述PWM信号的占空比控制所述第一开关电路的通断时间,以控制所述加热电路的运行时间或关闭时间。The distance measuring device according to claim 4, wherein the control signal includes a PWM signal, and the on-off time of the first switching circuit is controlled by a duty ratio of the PWM signal to control the heating circuit Operating time or off time.
  6. 如权利要求4所述的测距装置,其特征在于,所述第一开关电路的输入端电连接所述加热电路的输出端,所述第一开关电路的输出端接地;The distance measuring device according to claim 4, wherein the input terminal of the first switching circuit is electrically connected to the output terminal of the heating circuit, and the output terminal of the first switching circuit is grounded;
    和/或,所述加热电路的输入端电连接电源电压。And/or, the input end of the heating circuit is electrically connected to the power supply voltage.
  7. 如权利要求4所述的测距装置,其特征在于,所述第一开关电路包括第一MOS管,所述控制信号连接所述第一MOS管的控制端,所述第一MOS管的源端和漏端中的一个作为所述第一开关电路的输入端,另一个作为所述第一开关电路的输出端。The distance measuring device according to claim 4, wherein the first switching circuit includes a first MOS tube, the control signal is connected to a control terminal of the first MOS tube, and the source of the first MOS tube One of the terminal and the drain terminal serves as an input terminal of the first switching circuit, and the other serves as an output terminal of the first switching circuit.
  8. 如权利要求4所述的测距装置,其特征在于,加热控制电路还包括第一滤波电路,用于对输入至所述第一开关电路之前的控制信号进行滤波。The distance measuring device according to claim 4, wherein the heating control circuit further includes a first filter circuit for filtering the control signal input to the first switch circuit.
  9. 如权利要求8所述的测距装置,其特征在于,所述第一滤波电路的输入端电连接所述控制信号,所述第一滤波电路的输出端接地。8. The distance measuring device according to claim 8, wherein the input terminal of the first filter circuit is electrically connected to the control signal, and the output terminal of the first filter circuit is grounded.
  10. 如权利要求9所述的测距装置,其特征在于,所述第一滤波电路包括并联设置的一个电阻和一个电容。The distance measuring device according to claim 9, wherein the first filter circuit includes a resistor and a capacitor arranged in parallel.
  11. 如权利要求4所述的测距装置,其特征在于,所述测距装置还包括开关电源,用于将所述控制信号转换为直流电压,以使所述加热电路持续发热。The distance measuring device according to claim 4, characterized in that the distance measuring device further comprises a switching power supply for converting the control signal into a DC voltage, so that the heating circuit continuously generates heat.
  12. 如权利要求11所述的测距装置,其特征在于,所述开关电源包括:The distance measuring device according to claim 11, wherein the switching power supply comprises:
    第二开关电路,用于控制所述开关电源的储能电路的充放电;A second switching circuit for controlling the charging and discharging of the energy storage circuit of the switching power supply;
    储能电路,用于在所述第二开关电路导通时储存电能以及在所述第二开关电路截止时放电;An energy storage circuit for storing electrical energy when the second switching circuit is on and discharging when the second switching circuit is off;
    输出滤波电路,用于在所述第二开关电路导通时充电以及在所述第二开关电路截止时放电。The output filter circuit is used for charging when the second switching circuit is turned on and discharging when the second switching circuit is turned off.
  13. 如权利要求12所述的测距装置,其特征在于,The distance measuring device according to claim 12, wherein:
    所述第二开关电路的输入端电连接电源电压,所述第二开关电路的输出端电连接所述储能电路的输入端;以及The input terminal of the second switch circuit is electrically connected to the power supply voltage, and the output terminal of the second switch circuit is electrically connected to the input terminal of the energy storage circuit; and
    所述储能电路的输出端电连接所述输出滤波电路的输入端,所述输出滤波电路的输出端接地。The output terminal of the energy storage circuit is electrically connected to the input terminal of the output filter circuit, and the output terminal of the output filter circuit is grounded.
  14. 如权利要求12所述的测距装置,其特征在于,所述第二开关电路包 括第二MOS管,其中,所述第二MOS管的源端和漏端中的一端电连接电源电压,另一端电连接所述储能电路的输入端。The distance measuring device according to claim 12, wherein the second switching circuit includes a second MOS tube, wherein one end of the source and drain terminals of the second MOS tube is electrically connected to a power supply voltage, and One end is electrically connected to the input end of the energy storage circuit.
  15. 如权利要求14所述的测距装置,其特征在于,所述第一开关电路包括NMOS晶体管和PMOS晶体管中的一个,和/或,所述第二MOS管包括PMOS晶体管。The distance measuring device according to claim 14, wherein the first switching circuit includes one of an NMOS transistor and a PMOS transistor, and/or, the second MOS transistor includes a PMOS transistor.
  16. 如权利要求12所述的测距装置,其特征在于,所述开关电源还包括:The distance measuring device according to claim 12, wherein the switching power supply further comprises:
    续流电路,所述续流电路在所述第二开关电路截止时导通,用于起到续流作用,以提供所述储能电路的放电回路。A freewheeling circuit, the freewheeling circuit is turned on when the second switching circuit is turned off, and is used for a freewheeling function to provide a discharge circuit of the energy storage circuit.
  17. 如权利要求16所述的测距装置,其特征在于,所述续流电路的一端电连接所述储能电路的输入端,另一端接地。The distance measuring device according to claim 16, wherein one end of the freewheeling circuit is electrically connected to the input end of the energy storage circuit, and the other end is grounded.
  18. 如权利要求16所述的测距装置,其特征在于,所述续流电路包括二极管,其中,所述二极管的阴极电连接储能电路的输入端,所述二极管的阳极接地。16. The distance measuring device according to claim 16, wherein the freewheeling circuit includes a diode, wherein the cathode of the diode is electrically connected to the input end of the energy storage circuit, and the anode of the diode is grounded.
  19. 如权利要求12所述的测距装置,其特征在于,所述温度控制系统还包括分压电路,所述分压电路的分压节点电连接所述第二开关电路的控制端,用于控制所述第二开关电路导通或截止。The distance measuring device according to claim 12, wherein the temperature control system further comprises a voltage divider circuit, and the voltage divider node of the voltage divider circuit is electrically connected to the control terminal of the second switch circuit for controlling The second switch circuit is turned on or off.
  20. 如权利要求19所述的测距装置,其特征在于,所述分压电路的输出端电连接所述加热控制电路的输入端,所述分压电路的输入端电连接所述电源电压。The distance measuring device of claim 19, wherein the output terminal of the voltage dividing circuit is electrically connected to the input terminal of the heating control circuit, and the input terminal of the voltage dividing circuit is electrically connected to the power supply voltage.
  21. 如权利要求20所述的测距装置,其特征在于,所述分压电路包括串联的至少两个电阻。The distance measuring device of claim 20, wherein the voltage dividing circuit includes at least two resistors connected in series.
  22. 如权利要求12所述的测距装置,其特征在于,所述开关电源包括BUCK开关电源,其中,所述储能电路包括电感,和/或,所述输出滤波电路包括电容。The distance measuring device according to claim 12, wherein the switching power supply includes a BUCK switching power supply, wherein the energy storage circuit includes an inductor, and/or, the output filter circuit includes a capacitor.
  23. 如权利要求8至22任一项所述的测距装置,其特征在于,温度控制系统还包括:The distance measuring device according to any one of claims 8 to 22, wherein the temperature control system further comprises:
    第二滤波电路,用于对电源电压输出的电压进行滤波处理。The second filter circuit is used to filter the voltage output by the power supply voltage.
  24. 如权利要求23所述的测距装置,其特征在于,所述温度控制系统还包括:The distance measuring device according to claim 23, wherein the temperature control system further comprises:
    所述第二滤波电路的输入端电连接电源电压,所述第二滤波电路的输出 端接地。The input terminal of the second filter circuit is electrically connected to the power supply voltage, and the output terminal of the second filter circuit is grounded.
  25. 如权利要求10所述的测距装置,其特征在于,第一滤波电路包括至少一个电容。The distance measuring device of claim 10, wherein the first filter circuit includes at least one capacitor.
  26. 如权利要求8至22任一项所述的测距装置,其特征在于,所述加热电路包括至少一个加热电阻。The distance measuring device according to any one of claims 8 to 22, wherein the heating circuit includes at least one heating resistor.
  27. 如权利要求8至22任一项所述的测距装置,其特征在于,所述加热电路包括至少两个并联设置的加热电阻。The distance measuring device according to any one of claims 8 to 22, wherein the heating circuit includes at least two heating resistors arranged in parallel.
  28. 如权利要求1所述的测距装置,其特征在于,所述测距装置还包括:The distance measuring device according to claim 1, wherein the distance measuring device further comprises:
    电路板,所述待控温器件设置在所述电路板上;A circuit board, the temperature-controlling device is arranged on the circuit board;
    导热层,所述导热层设置在所述待控温器件的下方,用于将所述加热电阻产生的热量传导至所述待控温器件。A heat conduction layer, the heat conduction layer is disposed below the temperature-controlling device, and is used to conduct the heat generated by the heating resistor to the temperature-controlling device.
  29. 如权利要求28所述的测距装置,其特征在于,在所述导热层上设置有至少一个热孤岛,所述热孤岛用于隔离其相对两侧的导热层。The distance measuring device according to claim 28, wherein at least one thermal island is provided on the thermal conductive layer, and the thermal island is used to isolate the thermal conductive layers on opposite sides of the thermal island.
  30. 如权利要求28所述的测距装置,其特征在于,多个所述热孤岛沿所述待控温器件的四周间隔排布成环形。The distance measuring device according to claim 28, wherein a plurality of the thermal islands are arranged in a ring shape at intervals along the circumference of the device to be controlled.
  31. 如权利要求28所述的测距装置,其特征在于,所述环形包括圆环形或多边环形。The distance measuring device according to claim 28, wherein the ring shape includes a circular ring shape or a polygonal ring shape.
  32. 如权利要求28所述的测距装置,其特征在于,每个所述热孤岛呈长条形。The distance measuring device according to claim 28, wherein each of the thermal islands has a long shape.
  33. 如权利要求28至32任一项所述的测距装置,其特征在于,所述热孤岛为贯穿所述导热层的开口。The distance measuring device according to any one of claims 28 to 32, wherein the thermal island is an opening penetrating the thermal conductive layer.
  34. 如权利要求28至32任一项所述的测距装置,其特征在于,所述导热层的材料包括地层。The distance measuring device according to any one of claims 28 to 32, wherein the material of the thermally conductive layer includes a ground layer.
  35. 如权利要求1所述的测距装置,其特征在于,所述目标温度包括第一目标温度和第二目标温度,所述第二目标温度大于所述第一目标温度,所述散热控制电路具体用于:The distance measuring device according to claim 1, wherein the target temperature includes a first target temperature and a second target temperature, the second target temperature is greater than the first target temperature, and the heat dissipation control circuit is specific Used for:
    当所述当前环境温度小于所述第一目标温度,控制所述散热模块关闭;When the current ambient temperature is lower than the first target temperature, controlling the heat dissipation module to be turned off;
    当所述当前环境温度大于或等于所述第二目标温度,控制所述散热模块运行。When the current ambient temperature is greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
  36. 如权利要求35所述的测距装置,其特征在于,所述目标温度还包括 第三目标温度和第四目标温度,其中,所述第三目标温度大于所述第二目标温度,所述第四目标温度大于所述第三目标温度,所述散热控制电路还具体用于:The distance measuring device according to claim 35, wherein the target temperature further includes a third target temperature and a fourth target temperature, wherein the third target temperature is greater than the second target temperature, and the first The fourth target temperature is greater than the third target temperature, and the heat dissipation control circuit is also specifically used to:
    若所述当前环境温度介于所述第二目标温度和所述第三目标温度之间,控制所述散热模块的散热速率维持在第一速率。If the current ambient temperature is between the second target temperature and the third target temperature, the heat dissipation rate of the heat dissipation module is controlled to be maintained at the first rate.
  37. 如权利要求36所述的测距装置,其特征在于,所述散热控制电路还具体用于:The distance measuring device according to claim 36, wherein the heat dissipation control circuit is further specifically used for:
    若所述当前环境温度大于或等于所述第三目标温度并小于所述第四目标温度,控制所述散热模块的散热速率在所述第一速率和第二速率之间,其中,所述第二速率大于所述第一速率;以及If the current ambient temperature is greater than or equal to the third target temperature and less than the fourth target temperature, controlling the heat dissipation rate of the heat dissipation module to be between the first rate and the second rate, wherein the first The second rate is greater than the first rate; and
    若所述当前环境温度大于或等于所述第四目标温度,控制所述散热模块的散热速率维持在所述第二速率。If the current ambient temperature is greater than or equal to the fourth target temperature, control the heat dissipation rate of the heat dissipation module to be maintained at the second rate.
  38. 如权利要求36所述的测距装置,其特征在于,所述散热控制电路还具体用于:The distance measuring device according to claim 36, wherein the heat dissipation control circuit is further specifically used for:
    当所述当前环境温度从小于所述第一目标温度逐渐升高至所述第一目标温度和所述第二目标温度之间,控制所述散热模块关闭;When the current ambient temperature is gradually increased from less than the first target temperature to between the first target temperature and the second target temperature, controlling the heat dissipation module to be turned off;
    当所述当前环境温度继续升高到大于或等于所述第二目标温度,控制所述散热模块运行。When the current ambient temperature continues to increase to be greater than or equal to the second target temperature, the heat dissipation module is controlled to operate.
  39. 如权利要求38所述的测距装置,其特征在于,所述散热控制电路还具体用于:The distance measuring device according to claim 38, wherein the heat dissipation control circuit is further specifically used for:
    当所述当前环境温度从大于或等于所述第二目标温度降低到所述第一目标温度和所述第二目标温度之间,控制所述散热模块的散热速率维持在第一速率;When the current ambient temperature decreases from greater than or equal to the second target temperature to between the first target temperature and the second target temperature, controlling the heat dissipation rate of the heat dissipation module to be maintained at the first rate;
    当所述当前环境温度降低到小于所述第一目标温度,控制所述散热模块关闭。When the current ambient temperature drops below the first target temperature, the heat dissipation module is controlled to be turned off.
  40. 如权利要求37所述的测距装置,其特征在于,所述散热模块包括风机,散热控制电路还具体用于:The distance measuring device according to claim 37, wherein the heat dissipation module includes a fan, and the heat dissipation control circuit is further specifically used for:
    通过控制所述风机的占空比以控制所述风机的转速,从而控制所述散热模块的散热速率,其中,所述占空比越大所述散热模块的散热速率越大。By controlling the duty ratio of the fan to control the rotational speed of the fan, the heat dissipation rate of the heat dissipation module is controlled, where the greater the duty ratio, the greater the heat dissipation rate of the heat dissipation module.
  41. 如权利要求40所述的测距装置,其特征在于,所述占空比包括第一 占空比和第二占空比,所述第二占空比大于所述第一占空比,其中,所述散热控制电路具体用于:The distance measuring device of claim 40, wherein the duty cycle includes a first duty cycle and a second duty cycle, the second duty cycle is greater than the first duty cycle, wherein , The heat dissipation control circuit is specifically used for:
    控制所述风机以所述第一占空比运转,以控制所述散热模块的散热速率维持在所述第一速率;Controlling the fan to operate at the first duty ratio to control the heat dissipation rate of the heat dissipation module to be maintained at the first rate;
    控制所述风机以所述第二占空比运转,以控制所述散热模块的散热速率维持在所述第二速率;以及Controlling the fan to operate at the second duty cycle to control the heat dissipation rate of the heat dissipation module to be maintained at the second rate; and
    控制所述风机的占空比在所述第一占空比和所述第二占空比之间变化,以控制所述散热模块的散热速率在所述第一速率和所述第二速率之间。Controlling the duty ratio of the fan to vary between the first duty ratio and the second duty ratio to control the heat dissipation rate of the heat dissipation module to be between the first rate and the second rate between.
  42. 如权利要求41所述的测距装置,其特征在于,所述散热控制电路具体用于:The distance measuring device according to claim 41, wherein the heat dissipation control circuit is specifically used for:
    控制所述风机的占空比在所述第一占空比和所述第二占空比之间线性变化,以控制所述散热模块的散热速率在所述第一速率和所述第二速率之间。Controlling the duty ratio of the fan to change linearly between the first duty ratio and the second duty ratio to control the heat dissipation rate of the heat dissipation module between the first rate and the second rate between.
  43. 如权利要求35所述的测距装置,其特征在于,所述散热模块包括风机,散热控制电路还具体用于:The distance measuring device according to claim 35, wherein the heat dissipation module includes a fan, and the heat dissipation control circuit is further specifically used for:
    控制所述风机的占空比为零,以控制所述散热模块关闭。The duty ratio of the fan is controlled to be zero to control the heat dissipation module to be turned off.
  44. 如权利要求35所述的测距装置,其特征在于,所述待控温器件安装于外壳内的容纳腔中,其中,所述散热模块用于对所述外壳散热。The distance measuring device according to claim 35, wherein the temperature-controlling device is installed in a receiving cavity in the housing, wherein the heat dissipation module is used to dissipate heat to the housing.
  45. 如权利要求1、35至44任一项所述的测距装置,其特征在于,所述散热模块包括风机。The distance measuring device according to any one of claims 1, 35 to 44, wherein the heat dissipation module includes a fan.
  46. 如权利要求1至22、35至44任一项所述的测距装置,其特征在于,所述温度控制系统还包括:The distance measuring device according to any one of claims 1 to 22 and 35 to 44, wherein the temperature control system further comprises:
    温度检测电路,用于检测所述待控温器件的当前环境温度。A temperature detection circuit is used to detect the current ambient temperature of the temperature-controlled device.
  47. 如权利要求1所述的测距装置,其特征在于,所述测距装置还包括:The distance measuring device according to claim 1, wherein the distance measuring device further comprises:
    至少一个导热介质,所述导热介质包括散热部,所述散热部的至少部分表面贴合所述待控温器件的至少部分散热面,用于将所述待控温器件的热量导出。At least one heat-conducting medium, the heat-conducting medium includes a heat dissipation portion, and at least a part of the surface of the heat dissipation portion is attached to at least a part of the heat dissipation surface of the temperature-controlling device, and is used to extract heat from the temperature-controlling device.
  48. 如权利要求47所述的测距装置,其特征在于,所述测距装置包括至少两个所述导热介质,其中,每个所述导热介质的散热部的至少部分表面贴合不同的所述待控温器件,用于分别将对应的所述待控温器件的热量导出。The distance measuring device according to claim 47, wherein the distance measuring device includes at least two of the thermally conductive media, wherein at least a part of the surface of the heat dissipation portion of each of the thermally conductive media conforms to different ones The temperature-to-be-controlled device is used to separately extract the heat of the corresponding temperature-to-be-controlled device.
  49. 如权利要求47所述的测距装置,其特征在于,所述待控温器件安装 于外壳的容纳腔内,所述导热介质的散热部的相对的两个表面分别至少部分贴合所述待控温器件的散热面和所述外壳的部分表面。The distance measuring device according to claim 47, wherein the temperature-controlling device is installed in a housing cavity of the housing, and two opposite surfaces of the heat-dissipating portion of the heat-conducting medium respectively at least partially fit the The heat dissipation surface of the temperature control device and part of the surface of the housing.
  50. 如权利要求47所述的测距装置,其特征在于,所述导热介质还包括安装部,其中,所述安装部用于将所述导热介质安装于壳体上。The distance measuring device according to claim 47, wherein the thermally conductive medium further includes an installation portion, wherein the installation portion is used to install the thermally conductive medium on the housing.
  51. 如权利要求50所述的测距装置,其特征在于,所述安装部和所述散热部彼此连接并呈预定夹角,和/或,所述安装部和所述散热部一体成型。The distance measuring device according to claim 50, wherein the mounting portion and the heat dissipation portion are connected to each other at a predetermined angle, and/or the mounting portion and the heat dissipation portion are integrally formed.
  52. 如权利要求51所述的测距装置,其特征在于,所述预定夹角大体为90°。The distance measuring device of claim 51, wherein the predetermined angle is substantially 90°.
  53. 如权利要求50所述的测距装置,其特征在于,所述测距装置还包括至少一个连接件和设置在所述安装部上的至少一个腰孔,所述连接件穿过所述腰孔将所述导热介质安装于壳体上,所述壳体位于所述外壳的容纳腔内。The distance measuring device of claim 50, wherein the distance measuring device further comprises at least one connecting member and at least one waist hole provided on the mounting portion, the connecting member passes through the waist hole The heat-conducting medium is installed on the housing, and the housing is located in the accommodating cavity of the housing.
  54. 如权利要求53所述的测距装置,其特征在于,The distance measuring device according to claim 53, wherein
    所述腰孔的长度大于所述连接件的径向长度,以在所述连接件紧固之前沿所述腰孔的长度方向调整所述导电介质的位置;和/或,The length of the waist hole is greater than the radial length of the connecting member to adjust the position of the conductive medium along the length of the waist hole before the connecting member is fastened; and/or,
    所述连接件的径向长度小于所述腰孔的宽度,以在所述连接件紧固之前沿所述腰孔的宽度方向调整所述导电介质的位置。The radial length of the connecting member is smaller than the width of the waist hole to adjust the position of the conductive medium along the width direction of the waist hole before the connecting member is fastened.
  55. 如权利要求53所述的测距装置,其特征在于,所述腰孔的长度延伸方向与所述待控温器件的散热面垂直,以沿该长度延伸方向调整所述散热部贴合所述待控温器件。The distance measuring device according to claim 53, wherein the length extension direction of the waist hole is perpendicular to the heat dissipation surface of the temperature-controlling device, so that the heat dissipation portion is adjusted to fit the Temperature control device.
  56. 如权利要求53所述的测距装置,其特征在于,在所述连接件背离所述壳体的一端和所述腰孔之间还设置有垫片。The distance measuring device according to claim 53, wherein a gasket is further provided between an end of the connecting member facing away from the housing and the waist hole.
  57. 如权利要求53所述的测距装置,其特征在于,所述安装部设置有所述腰孔的区域的厚度小于所述导热介质其他区域的厚度。The distance-measuring device according to claim 53, wherein the thickness of the area where the waist hole is provided in the mounting portion is smaller than the thickness of other areas of the heat-conducting medium.
  58. 如权利要求53至57任一项所述的测距装置,其特征在于,所述连接件包括螺钉、螺栓中的至少一种。The distance measuring device according to any one of claims 53 to 57, wherein the connecting member includes at least one of a screw and a bolt.
  59. 如权利要求47所述的测距装置,其特征在于,所述散热部包括相对设置的第一表面和第二表面,在所述散热部邻近所述待控温器件的所述第一表面上还设置有凸块,所述凸块与所述第一表面相对的至少部分表面贴合所述待控温器件的散热面。The distance-measuring device according to claim 47, wherein the heat dissipation portion includes a first surface and a second surface disposed oppositely, and the first surface of the heat dissipation portion adjacent to the temperature-controlled device A bump is also provided, and at least a part of the surface of the bump opposed to the first surface conforms to the heat dissipation surface of the temperature-controlling device.
  60. 如权利要求59所述的测距装置,其特征在于,所述凸块贴合所述待 控温器件的表面的尺寸小于与所述散热部的第一表面的尺寸。The distance-measuring device according to claim 59, wherein the size of the surface of the bump that fits the temperature-controlled device is smaller than the size of the first surface of the heat dissipation portion.
  61. 如权利要求59所述的测距装置,其特征在于,所述散热部的第一表面和第二表面为相对而非平行的表面。The distance-measuring device according to claim 59, wherein the first surface and the second surface of the heat dissipation portion are opposite but not parallel surfaces.
  62. 如权利要求59所述的测距装置,其特征在于,所述温度控制系统包括至少两个所述导热介质,其中,在所述至少两个所述导热介质的部分导热介质的所述散热部上设置所述凸块。The distance measuring device according to claim 59, wherein the temperature control system includes at least two of the thermally conductive media, and wherein the heat dissipation portion of the thermally conductive media is part of the at least two of the thermally conductive media The bump is provided on the top.
  63. 如权利要求62所述的测距装置,其特征在于,所述测距装置包括第一待控温器件和第二待控温器件,其中,所述温度控制系统包括第一导热介质和第二导热介质,所述第一导热介质的所述散热部上设置所述凸块,所述第一导热介质上的凸块贴合所述第一待控温器件的至少部分散热面,所述第二导热介质的散热部贴合所述第二待控温器件的至少部分散热面。The distance measuring device according to claim 62, wherein the distance measuring device includes a first temperature-controlling device and a second temperature-controlling device, wherein the temperature control system includes a first heat-conducting medium and a second A thermally conductive medium, the convex portion is provided on the heat dissipation portion of the first thermally conductive medium, and the convex portion on the first thermally conductive medium is attached to at least a part of the heat dissipation surface of the first temperature-controlling device, the first The heat dissipation portions of the two heat-conducting media are attached to at least part of the heat dissipation surface of the second temperature-controlling device.
  64. 如权利要求63所述的测距装置,其特征在于,所述第一待控温器件包括发射器,和/或,所述第二待控温器件包括探测器。The distance measuring device according to claim 63, wherein the first temperature-controlled device includes a transmitter, and/or the second temperature-controlled device includes a detector.
  65. 如权利要求59至64任一项所述的测距装置,其特征在于,所述导热介质的材料包括金属,其中,所述金属包括铜。The distance measuring device according to any one of claims 59 to 64, wherein the material of the heat-conducting medium includes a metal, wherein the metal includes copper.
  66. 如权利要求1所述的测距装置,其特征在于,所述测距装置包括激光雷达。The distance measuring device according to claim 1, wherein the distance measuring device comprises a laser radar.
  67. 一种移动平台,其特征在于,所述移动平台包括:A mobile platform, characterized in that the mobile platform includes:
    权利要求1至66任一项所述的测距装置;和The distance measuring device according to any one of claims 1 to 66; and
    平台本体,所述测距装置安装在所述平台本体上。A platform body, the distance measuring device is installed on the platform body.
  68. 如权利要求67所述的移动平台,其特征在于,所述移动平台包括无人机、机器人、车或船。The mobile platform of claim 67, wherein the mobile platform includes a drone, a robot, a car, or a boat.
PCT/CN2019/071044 2019-01-09 2019-01-09 Distance measurement apparatus and mobile platform WO2020142957A1 (en)

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