WO2019047340A1

WO2019047340A1 - Optical distance measurement device

Info

Publication number: WO2019047340A1
Application number: PCT/CN2017/107248
Authority: WO
Inventors: 宋佳; 吴江; 王婷; 疏达; 李�远
Original assignee: 北醒（北京）光子科技有限公司
Priority date: 2017-09-08
Filing date: 2017-10-23
Publication date: 2019-03-14
Also published as: CN208888368U; CN208888369U; CN109188450A; CN109031335A

Abstract

An optical distance measurement device, comprising an emission module, a reception module and a calculation module; an emitted light beam is emitted from the emission module, and at least a portion of the emitted light beam is reflected by the distance measurement target as a reflected light beam and then enters the reception module; the calculation module calculates the measured distance between the optical distance measurement device and the distance measurement target or the measured light intensity according to the signal transmitted by the reception module; the emitted light beam exits through an optical emission cavity (11) in the optical distance measurement device, and the reflected light beam is incident through an optical reception cavity (12) in the optical distance measurement device, and the emitted light beam and the reflected light beam are separated in the optical distance measurement device; the emission module and the reception module are provided on the same PCB board (2), the emitted light beam is separated from the external light at a connection portion between the optical emission cavity (11) and the PCB board (2), and the reflected light beam is separated from the external light at a connection portion between the optical reception cavity (12) and the PCB board (2). The present invention reduces mutual interference and external interference during measurement of the emitted light beam and the reflected light beam, reducing the test noise.

Description

Optical distance measuring device

This application claims the priority of the Chinese Patent Application, filed on Sep. 08, 2008, the entire disclosure of which is hereby incorporated by reference.

Technical field

The present invention relates to the field of radar measurement technologies, and in particular, to an optical distance measuring device.

Background technique

The optical scanning distance measuring device is a device for performing non-contact scanning ranging by using a collimated beam and using time-of-flight (TOF), triangulation, and the like. At present, a conventional optical scanning distance measuring device includes a light emitting module, an optical lens, and a chip that receives and processes signals. The light emitting module emits a light beam, and the optical lens is located on the optical path of the light emitting module, and the collimated light beam is emitted to the surface of the object to be measured. After encountering the obstacle, the light beam is reflected onto the receiving chip, and the receiving chip is transmitted between the receiving and receiving. The time, phase difference, and known speed of light can be used to determine the distance of the measured object to the device. Such a device installs components such as a light-emitting module, an optical lens, and a light-receiving module for ranging, on a continuously rotatable platform to perform scanning of a collimated beam, and a 360-degree environmental distance signal can be obtained by rotating the motor. The rotating part and the fixed part are powered by the conductive slip ring and transmit data; or can be fixedly mounted on the moving upper machine, and the obstacles of the corresponding measuring area are detected as the upper machine advances, retreats or turns, the above two modes Currently widely used in robot environment scanning, planning paths, obstacle avoidance navigation, security detection and so on.

In the existing optical scanning distance measuring device, in order to reduce the occupied space of the device, the transmitting beam and the receiving beam tend to be mixed with part of the background light, or the transmitting beam and the receiving beam emit interference interference inside the optical scanning distance measuring device. Crosstalk affects the accuracy of the test.

Summary of the invention

It is an object of the present invention to provide an optical ranging device that reduces the transmitted and received beams by separating the transmitted and received beams within the optical ranging device and separating the transmitted and received beams from ambient light. The mutual interference and external interference during measurement solve the problem of high test noise in the prior art.

The invention provides an optical distance measuring device, comprising: a transmitting module, a receiving module and a calculating module;

The emitted light beam is emitted from the transmitting module, and at least part of the emitted light beam is reflected by the ranging target The reflected beam enters the receiving module;

The calculation module calculates a measurement distance or a measurement light intensity of the optical distance measuring device and the ranging target according to the signal transmitted by the receiving module;

The emitted light beam is emitted through an emission optical cavity in the optical distance measuring device, and the reflected light beam is incident through the receiving optical cavity in the optical distance measuring device, and the emitted light beam and the reflected light beam are separated in the optical distance measuring device; The transmitting module and the receiving module are disposed on the same PCB board, and the emitted light beam is separated from the external light at a connection between the emitting optical cavity and the PCB board, and the receiving light beam is at a connection between the receiving optical cavity and the PCB board. Separated from the outside light.

Preferably, the emitting optical cavity and the receiving optical cavity are respectively independent chambers; or, the emitting optical cavity and the receiving optical cavity share a cavity, and are separated by light shielding through the light shielding plate.

Preferably, the light-shielding plate is made of a flexible light-blocking material and abuts on the PCB; or the light-shielding plate is made of a hard light-shielding material, and the light-shielding plate is made of a hard light-shielding material. The first light-shielding cotton is abutted on the PCB board.

Preferably, the emitting optical cavity and/or the receiving optical cavity are soldered to the PCB board by ultrasonic or hot melt;

Alternatively, the emitting optical cavity and/or the receiving optical cavity are connected to the PCB board by a light blocking glue or a second light blocking cotton.

Preferably, the emitting optical cavity and the receiving optical cavity and the PCB board are respectively positioned by a positioning hole column structure.

Preferably, the corresponding emitting optical cavity and the receiving optical cavity of the PCB board are respectively provided with positioning holes, and the emitting optical cavity and the receiving optical cavity are disposed inside the outer casing, and the inner wall of the outer casing is provided with a positioning matching with the positioning hole. column.

Preferably, a heat sink disposed on the PCB board is further included.

Preferably, the heat dissipating device comprises a heat dissipating plate and an insulating heat conducting pin or an insulating and thermally conductive adhesive layer connected between the heat dissipating plate and the PCB board, the heat dissipating plate being attached on the PCB board or disposed on the shell of the optical distance measuring device Outside the body.

Preferably, the heat dissipation plate is an aluminum plate or a graphene plate.

Preferably, the transmitting module comprises a transmitting light source and a driving circuit for driving the emitting light source to emit a light beam; the receiving module comprises a photosensitive chip, and the calculating module comprises a signal transmitted according to the photosensitive chip The calculation circuit calculates a measurement distance or a measurement light intensity, and the calculation circuit includes a microprocessor.

Preferably, the outer side of the photosensitive chip is further provided with a band pass filter.

Preferably, an emission lens or an emission lens group for condensing the emitted light beam is disposed on the emission light path, the emission lens is disposed on the exit port of the emission optical cavity; and the receiving lens or the receiving lens group for collecting the received light beam is disposed on the receiving optical path. The receiving lens is disposed on a receiving port of the receiving optical cavity.

Preferably, the emitting optical cavity extends from the exit port to the outside of the optical distance measuring device with an exit light-shielding cylinder; the receiving optical cavity extends from the receiving port to the outside of the optical distance measuring device and has a receiving light-shielding cylinder.

Preferably, the exit light-shielding tube is provided with a first annular stage for mounting an emitting lens, and the inner side wall of the outgoing light-shielding tube is provided with a first dispensing channel;

A second annular stage for mounting a receiving lens is disposed on the receiving light-shielding cylinder, and a second dispensing channel is disposed on an inner sidewall of the receiving light-shielding cylinder.

Preferably, a high-pass filter or a band-pass filter is respectively disposed on the exit port of the emitting optical cavity and the receiving port of the receiving optical cavity.

Preferably, the method further includes: a power source;

The power source supplies power to the photosensitive chip through a boosting circuit;

The power source supplies power to the emission light source through a step-down circuit;

The power supply provides power to the microprocessor via a low dropout linear regulator.

Preferably, the method further includes: a RC filter circuit;

The microprocessor communicates with the host computer through the RC filter circuit;

The RC filter circuit includes a transmission RC filter circuit and a RC filter circuit;

The transmitting RC filter circuit includes: a first resistor and a first capacitor;

The transmitting port of the microprocessor is connected to the receiving port of the upper computer through the first resistor; the transmitting port of the microprocessor is grounded through the first resistor and the first capacitor connected in series;

The receiving RC filter circuit includes: a second resistor and a second capacitor;

The receiving port of the microprocessor is grounded through the second capacitor, and the receiving port of the microprocessor is connected to the sending port of the upper computer through the second resistor.

Preferably, the method further includes: a level conversion circuit;

The level conversion circuit is configured to convert a signal level range output by the photosensitive chip into a signal level range within a receiving range of the microprocessor.

Compared with the prior art, the present application has the following beneficial effects:

By separating the transmitted and received beams in the optical distance measuring device and separating the transmitted and received beams from the external light, mutual interference and external interference of the transmitted and received beams during measurement are reduced, and test noise is reduced. Improve test accuracy and improve test efficiency. The arrangement of the heat dissipating device improves the operational stability and measurement accuracy of the optical distance measuring device.

DRAWINGS

1 is a first schematic structural view of an optical distance measuring device according to Embodiment 1 of the present invention.

2 is a second schematic structural view of an optical distance measuring device according to Embodiment 1 of the present invention.

3 is a circuit configuration diagram of an optical distance measuring device provided by the present invention.

4 is a schematic diagram of a RC filter circuit provided by the present invention.

In the picture:

1, outer casing; 2, PCB board; 3, light-shielding cotton; 4, light-shielding board; 5, exit light-shielding tube; 6, receiving light-shielding tube; 11, emitting optical cavity; 12, receiving optical cavity; 13, positioning column; Photosensitive chip; 22, emission light source; 23, band pass filter; 24, positioning hole; 51, emission lens; 61, receiving lens; 320, microprocessor; 330, power supply; 340, boost circuit; Buck circuit; 360, low dropout linear regulator; 370, level conversion circuit; 380, RC filter circuit; 390, host computer; R1, first resistor; R2, second resistor; C1, first capacitor; C2, the second capacitor.

Detailed ways

The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict. The invention will be described in detail below with reference to the drawings in conjunction with the embodiments.

The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present application. It is an embodiment of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope shall fall within the scope of the application.

It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or order. It should be understood that the data so used may be interchanged where appropriate, so that the application described herein Please take the example. In addition, the terms "comprises" and "comprises" and "the" and "the" are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to Those steps or units may include other steps or units not explicitly listed or inherent to such processes, methods, products or devices.

Example 1

An optical ranging device, as shown in FIG. 1-2, includes: a transmitting module, a receiving module, and a calculating module, wherein a transmitting beam is emitted from the transmitting module, and at least part of the emitted beam is reflected by the ranging target and then received as a reflected beam. a module, the calculation module calculates a measurement distance or a measurement light intensity of the optical distance measuring device and the ranging target according to the signal transmitted by the receiving module;

The emitted light beam is emitted through an emission light chamber 11 in an optical distance measuring device, the reflected light beam being incident through the receiving optical cavity 12 in the optical distance measuring device, the emitted light beam and the reflected light beam being separated in the optical distance measuring device The transmitting module and the receiving module are disposed on the same PCB board 2, and the emitted light beam is separated from the external light at the junction of the emitting optical cavity 11 and the PCB board 2, and the receiving beam is in the receiving optical cavity 12 and The PCB board 2 joint is separated from the outside light.

The transmitting module includes a transmitting light source 22 and a driving circuit that drives the emitting light source 22 to emit a light beam, and the emitting light source may be a laser or an LED light source.

Preferably, the emission source 22 can be an LED lamp.

The receiving module includes a photosensitive chip 21.

The calculation module includes a calculation circuit that calculates a measurement distance or a measurement light intensity based on a signal transmitted from the photosensitive chip 21, the calculation circuit including a microprocessor 320.

The main wavelength of the infrared light emitted by the LED lamp is 850 nm, and a band pass filter 23 is disposed outside the photosensitive chip 21, and the band pass filter 23 only allows light of 850±30 nm to pass.

By separating the transmitting beam and the receiving beam in the optical ranging device, the transmitting beam and the receiving beam are separated from the external light, thereby reducing mutual interference and external interference of the transmitting beam and the receiving beam during measurement, reducing test noise and improving Test accuracy and improved test efficiency.

The emitting optical cavity 11 and the receiving optical cavity 12 share a cavity, and the cavity is disposed in the outer casing 1 of the optical distance measuring device, and the cavity is separated from the corresponding transmitting module by the light shielding plate 4 The receiving module forms a transmitting optical cavity 11 and a receiving optical cavity 12, and the transmitting optical cavity 11 and the receiving optical cavity 12 may be a combination of one or more of a cylindrical structure, a square tube structure or a cone structure, the PCB board 2-way A screw is fixed to the emitting optical cavity 11 and the receiving optical cavity 12.

In order to keep the emitting optical cavity 11 and the receiving optical cavity 12 in close contact with the PCB board 2, the light outside the optical cavity is shielded from the optical cavity, the emitting optical cavity 11 and the receiving optical cavity 12 and the PCB board 2 is soldered by ultrasonic or hot melt; or preferably, the light emitting cavity 11 and the receiving optical cavity 12 are connected to the PCB 2 by a light blocking glue or a second light blocking cotton.

Further, in order to keep the spacing between the transmitting optical cavity 11 and the receiving optical cavity 12 in close contact with the PCB board 2, the light blocking plate 4 is made of a flexible light-blocking material and abuts on the PCB board 2.

Preferably, for the convenience of assembly and the control of structural dimensional accuracy, the light-shielding plate 4 is made of a hard light-shielding material, and the light-shielding plate 4 made of a hard light-shielding material is abutted by the first light-shielding cotton 3 On the PCB board 2. The first light-blocking cotton 3 and the second light-blocking cotton are preferably foam.

For ease of installation and accuracy, the emitting optical cavity 11 and the receiving optical cavity 12 and the PCB board 2 are respectively positioned by a positioning hole column structure. The positioning hole column structure includes a positioning hole 24 and a positioning post 13 corresponding to the positioning hole 24, and the positioning hole 24 may be disposed on the optical cavity or on the PCB board 2.

Preferably, for the convenience of processing, the corresponding transmitting optical cavity 11 and the receiving optical cavity 12 of the PCB board 2 are respectively provided with positioning holes 24, and the emitting optical cavity 11 and the receiving optical cavity 12 are disposed inside the outer casing 1, the outer casing A positioning post 13 matching the positioning hole 24 is defined in the inner wall of the inner wall.

In order to further adapt to the integration and miniaturization of the PCB board 2, the operational stability and measurement accuracy of the optical distance measuring device are improved, and the optical distance measuring device further includes a heat dissipating device disposed on the PCB board 2.

The heat sink may be disposed inside the optical distance measuring device or may be disposed outside the optical distance measuring device. When the heat dissipating device is disposed inside the optical distance measuring device, the optical distance measuring device comprises a heat dissipating plate and an insulating thermal conductive adhesive layer connected between the heat dissipating plate and the PCB board 2, wherein the insulating and thermal conductive adhesive layer can be all Or only for the heating element soldered on the PCB board 2.

In order to accommodate the need for centralized volume reduction of the optical distance measuring device, preferably, the heat sink is disposed outside the optical distance measuring device.

The heat dissipating device comprises a heat dissipating plate and an insulating and thermally conductive pin connected between the heat dissipating plate and the PCB board 2, wherein the insulating and heat conducting pin leads the heat in the optical distance measuring device, and is dissipated through the heat dissipating plate, the heat dissipating plate It can be a separate heat sink or shared with the host computer connected to the optical distance measuring device. A heat sink. Preferably, the heat dissipation plate is an aluminum plate or a graphene plate.

In order to further improve the degree of collimation of the emitted light beam emitted from the optical ranging device, an emission lens 51 or an emission lens group for condensing the emitted light beam is further disposed on the emission optical path. Preferably, the emission lens 51 is disposed in the emission optical cavity. 11 on the exit.

Preferably, the emission lens group includes an inner converging lens or a total internal reflection reflection (TIR) lens sealed outside the lamp cap of the LED lamp, and an outer converging lens disposed on the exit port of the emission optical cavity 11. . That is, the LED lamp is encapsulated in the lamp cap by the TIR lens, and the beam emitted by the LED lamp is concentrated and emitted after passing through the condenser lens or the TIR lens, thereby improving the intensity and collimation of the emission source 22. The outer converging lens on the exit opening of the light-emitting cavity 11 further converges the emitted light beam as it exits.

In order to further improve the collimation and/or light intensity of the light beam received by the optical distance measuring device, a receiving lens 61 or a receiving lens group for collecting the received light beam is disposed on the receiving optical path, and the receiving lens 61 is disposed at the receiving The receiving port of the optical cavity 12 is on.

Preferably, the receiving lens group includes an inner receiving lens and an outer receiving lens, and the inner receiving lens is disposed on a receiving optical path between the photosensitive chip 21 and the receiving port of the receiving optical cavity 12, or the outer receiving lens Set on the receiving port.

Preferably, a high-pass filter device or a band-pass filter device is further disposed on the exit port of the emitting optical cavity 11 and the receiving port of the receiving optical cavity 12.

The band pass filter device may be a sheet structure or a film structure, and the band pass filter device only allows light having a dominant wavelength of 850±30 nm to pass; the high pass filter device may be a high pass filter or a high pass. A filter film that allows only light having a dominant wavelength of 700 nm or more to pass. Preferably, the high-pass filter device or the band-pass filter device is disposed on the outer surface of the transmitting lens 51 and the receiving lens 61 in the form of a coating film, which simplifies the structure of the optical distance measuring device, reduces space occupation, and reduces Production costs.

In order to avoid the influence of the external environment on the transmitting lens 51 and the receiving lens 61, the adhesion of the rainwater dust is reduced, and the emitting optical cavity 11 extends to the outside of the optical distance measuring device at the exit port to have an exit light blocking cylinder 5; the receiving optical cavity 12 is The receiving port extends to the outside of the optical distance measuring device to have a receiving light blocking tube 6.

Preferably, the exit light-shielding cylinder 5 is provided with a first annular stage for mounting the emission lens 51, and the inner side wall of the exit light-shielding cylinder 5 is provided with a first dispensing channel; the emission lens 51 passes through the point The adhesive is pasted on the first annular table; the receiving light-shielding tube 6 is provided with a second annular table for mounting the receiving lens 61, and the inner side wall of the receiving light-shielding tube 6 is provided with a second dispensing channel, The receiving lens 61 is pasted on the second annular stage by dispensing.

Preferably, the outer side of the exit light-shielding tube 5 and/or the receiving light-shielding tube 6 is detachably connected with a dust cover, so that the emission lens 51 and the receiving lens 61 are completely protected when the optical distance measuring device is not in operation. .

Example 2

Different from the embodiment 1, the emitting optical cavity 11 and the receiving optical cavity 12 are independent chambers respectively; the emitting optical cavity 11 and the receiving optical cavity 12 may be integrally formed, or may be independent of each other and installed separately. Preferably, the emitting optical cavity 11 and the receiving optical cavity 12 are integrally formed, which simplifies the installation procedure of the transmitting optical cavity 11 and the receiving optical cavity 12 and the PCB board 2, and reduces the number of positioning hole column structures. Assembly is more accurate and convenient.

In summary, by separating the transmitting beam and the receiving beam in the optical ranging device, and separating the transmitting beam and the receiving beam from the external light, mutual interference and external interference of the transmitting beam and the receiving beam during measurement are reduced. , reducing test noise, improving test accuracy and improving test efficiency. The arrangement of the heat dissipating device improves the operational stability and measurement accuracy of the optical distance measuring device.

The above embodiment describes the hardware structure of the optical ranging device, and the circuit implementation portion of the optical ranging device provided by the present application is described in detail below with reference to the accompanying drawings.

Referring to FIG. 3, this figure is a circuit structural diagram of an optical ranging device provided by the present application.

In the optical ranging device provided by this embodiment, the transmitting module includes a transmitting light source 22, the receiving module includes a photosensitive chip 21, and the computing module includes a microprocessor 320.

For example, the emission source 22 can be an LED lamp.

Microprocessor 320 can be an MCU.

In addition, the optical distance measuring device provided by this embodiment further includes: a power source 330;

The power source 330 supplies power to the photosensitive chip 21 through the boosting circuit 340; for example, the boosting circuit 340 can employ a Boost circuit.

The power source 330 provides power to the emission source 22 through the buck circuit 350; for example, the buck circuit 350 can employ a Buck circuit.

The power source 330 passes through a low dropout linear regulator 360 (LDO, Low Dropout Regulator) The microprocessor 320 is powered.

In addition, the method further includes: a level conversion circuit 370;

The level conversion circuit 370 is configured to convert a signal level range output by the photosensitive chip 21 into a signal level range within a range of reception of the microprocessor 320.

For example, the sensor chip 21 outputs a voltage of 5 V, and the MCU receives a voltage of 3.3 V, so that level conversion is required to convert the level of the signal output from the sensor chip 21 into a signal level that the MCU can process.

It can be understood that the above boost circuit 340, buck circuit 350, LDO and level shift circuit 370 are all voltages required to convert the voltage of the power source 330 into a power device.

In addition, in order to reduce the electromagnetic interference (EMI) of the entire optical distance measuring device, the RC filter circuit 380 is further included.

For details, refer to FIG. 4 , which is a schematic diagram of a RC filter circuit provided by the present application.

The microprocessor 320 communicates with the host computer 390 through the RC filter circuit 380.

The RC filter circuit 380 includes a transmission RC filter circuit and a RC filter circuit;

The transmitting RC filter circuit includes: a first resistor R1 and a first capacitor C1;

The transmitting port of the microprocessor 320 is connected to the receiving port of the host computer 390 through the first resistor R1; the transmitting port of the microprocessor 320 is grounded through the first resistor R1 and the first capacitor C1 connected in series;

The receiving RC filter circuit includes: a second resistor R2 and a second capacitor C2;

The receiving port of the microprocessor 320 is grounded through the second capacitor C2, and the receiving port of the microprocessor 320 is connected to the transmitting port of the upper computer 390 through the second resistor R2.

As the user demands higher and higher performance parameters of the product, the interference of the electromagnetic radiation generated by the high frequency on the operation of the device and the interference of the external user also need to be solved, and the resistance-capacitance filter circuit can be improved in the present application. User experience.

The upper computer 390 may be a CPU of a device using an optical distance measuring device, for example, the device is a drone or a robot. The drone uses this optical ranging device to measure the height of the drone from the ground. In addition, the robot can use the optical ranging device to detect the distance of the surrounding obstacle from itself.

The technical principles of the present invention have been described above in connection with specific embodiments. The descriptions are merely illustrative of the principles of the invention and are not to be construed as limiting the scope of the invention. Based on here It is to be understood that those skilled in the art will be able to devise other embodiments of the present invention without departing from the scope of the invention.

Claims

An optical distance measuring device, comprising: a transmitting module, a receiving module and a calculating module;

The emitted light beam is emitted from the transmitting module, and at least part of the emitted light beam is reflected by the ranging target and then enters the receiving module as a reflected light beam;

The calculation module calculates a measurement distance or a measurement light intensity of the optical distance measuring device and the ranging target according to the signal transmitted by the receiving module;

The emitted light beam is emitted through an emission optical cavity in the optical distance measuring device, and the reflected light beam is incident through the receiving optical cavity in the optical distance measuring device, and the emitted light beam and the reflected light beam are separated in the optical distance measuring device; The transmitting module and the receiving module are disposed on the same PCB board, and the emitted light beam is separated from the external light at a connection between the emitting optical cavity and the PCB board, and the receiving light beam is at a connection between the receiving optical cavity and the PCB board. Separated from the outside light.
The optical distance measuring device according to claim 1, wherein the emitting optical cavity and the receiving optical cavity are independent chambers respectively; or the emitting optical cavity and the receiving optical cavity share a cavity, The light panels are separated from each other by light.
The optical distance measuring device according to claim 2, wherein the light blocking plate is made of a flexible light blocking material and abuts on the PCB; or the light blocking plate is made of a hard light blocking material. The light barrier plate made of a hard light-shielding material is abutted on the PCB board by a first light-shielding cotton.
The optical distance measuring device according to claim 1, wherein the emitting optical cavity and/or the receiving optical cavity are soldered to the PCB board by ultrasonic or hot melt;

Alternatively, the emitting optical cavity and/or the receiving optical cavity are connected to the PCB board by a light blocking glue or a second light blocking cotton.
The optical distance measuring device according to claim 1, wherein the emitting optical cavity and the receiving optical cavity and the PCB board are respectively positioned by a positioning hole column structure.
The optical distance measuring device according to claim 5, wherein the corresponding emitting optical cavity and the receiving optical cavity of the PCB board are respectively provided with positioning holes, and the emitting optical cavity and the receiving optical cavity are disposed inside the outer casing. The inner wall of the outer casing is provided with a positioning post matched with the positioning hole.
The optical distance measuring device according to any one of claims 1 to 6, further comprising A heat sink that is placed on the PCB.
The optical distance measuring device according to claim 7, wherein the heat dissipating device comprises a heat dissipating plate and an insulating heat conducting pin or an insulating and thermally conductive adhesive layer connected between the heat dissipating plate and the PCB board, wherein the heat dissipating plate is attached On the PCB board or outside the housing of the optical distance measuring device.
The optical distance measuring device according to claim 8, wherein the heat dissipation plate is an aluminum plate or a graphene plate.
The optical distance measuring device according to claim 1, wherein the transmitting module comprises a transmitting light source and a driving circuit for driving the emitting light source to emit a light beam; the receiving module comprises a photosensitive chip, and the calculating module comprises a photosensitive chip according to The transmitted signal calculates a calculation circuit that measures the distance or measures the light intensity, the calculation circuit including a microprocessor.
The optical distance measuring device according to claim 10, wherein a band pass filter is further disposed on an outer side of the photosensitive chip.
The optical distance measuring device according to claim 1, wherein an emission lens or an emission lens group for condensing the emitted light beam is disposed on the emission light path, and the emission lens is disposed on an exit port of the emission optical cavity; A receiving lens or a receiving lens group for concentrating the received light beam is provided, the receiving lens being disposed on the receiving opening of the receiving optical cavity.
The optical distance measuring device according to claim 12, wherein the emitting optical cavity extends from the exit port to the outside of the optical distance measuring device with an exit light blocking cylinder; the receiving optical cavity is outside the receiving port to the optical distance measuring device The extension has a receiving light-shielding tube.
The optical distance measuring device according to claim 13, wherein the exit light-shielding cylinder is provided with a first annular stage for mounting an emitting lens, and the inner side wall of the outgoing light-shielding cylinder is provided with a first dispensing channel ;

A second annular stage for mounting a receiving lens is disposed on the receiving light-shielding cylinder, and a second dispensing channel is disposed on an inner sidewall of the receiving light-shielding cylinder.
The optical distance measuring device according to claim 1, wherein a high-pass filter or a band-pass filter is disposed on the exit port of the light-emitting cavity and the receiving port of the light-receiving cavity, respectively.
The optical distance measuring device according to claim 10, further comprising: a power source;

The power source supplies power to the photosensitive chip through a boosting circuit;

The power source supplies power to the emission light source through a step-down circuit;

The power supply provides power to the microprocessor via a low dropout linear regulator.
The optical distance measuring device according to claim 10, further comprising: a RC filter circuit;

The microprocessor communicates with the host computer through the RC filter circuit;

The RC filter circuit includes a transmission RC filter circuit and a RC filter circuit;

The transmitting RC filter circuit includes: a first resistor and a first capacitor;

The transmitting port of the microprocessor is connected to the receiving port of the upper computer through the first resistor; the transmitting port of the microprocessor is grounded through the first resistor and the first capacitor connected in series;

The receiving RC filter circuit includes: a second resistor and a second capacitor;

The receiving port of the microprocessor is grounded through the second capacitor, and the receiving port of the microprocessor is connected to the sending port of the upper computer through the second resistor.
The optical distance measuring device according to claim 10, further comprising: a level shifting circuit;

The level conversion circuit is configured to convert a signal level range output by the photosensitive chip into a signal level range within a receiving range of the microprocessor.