CN206877029U - Laser projection device - Google Patents

Abstract

The utility model, which provides a kind of laser projection device and its depth camera, laser projection device, includes VCSEL array, microlens array, main lens and pattern generation optical element；Lenticule unit receives and focuses on the light beam of one-to-one VCSEL units transmitting therewith；The light beam of microlens array is carried out secondary focusing imaging by main lens.The secondary imaging light path being made up of microlens array and main lens, realizes lower multiplication factor, so as to improve the image quality of laser projection module, while has smaller volume.Needed according further to different application scenarios, the distance between microlens array and main lens can be adjusted when mounted to increase or reduce multiplication factor, the size of required speckle patterns during so as to meet at a distance or closely.

Description

Laser projection device

Technical field

It the utility model is related to optics and electronic technology field, more particularly to a kind of laser projection device.

Background technology

The depth information that depth camera can obtain target realizes 3D scannings, scene modeling, gesture interaction whereby, and current The RGB camera being widely used is compared, and depth camera is just progressively paid attention to by all trades and professions.Such as utilize depth camera and electricity Somatic sensation television game can be realized depending on combinations such as, computers to reach the two-in-one effect of game and body-building, light in the KINECT of Microsoft, ratio difficult to understand ASTRA be representative therein.In addition, the tango projects of Google are directed to bringing depth camera into mobile device, as flat board, Mobile phone, the usage experience overturned completely is brought with this, for example very real AR game experiencings can be realized, can entered using it The functions such as row indoor map creates, navigation.

Core component in depth camera is laser projection module, according to the difference of depth camera species, laser projection mould The structure of group is also had any different with function, for example the projection module disclosed in patent CN201610977172A is used for into space For projection speckle patterns to realize structure light depth survey, this spot structure light depth camera is also more ripe and extensive at present The scheme of use.With the continuous extension of depth camera application field, laser projection module by less and less volume and Constantly evolved in higher and higher performance.Existing all multi-schemes can run into the problem of many during volume is reduced, For example speckle noise is larger, speckle contrast's degree is low, spot intensity is uneven etc., cause image quality not high.

Utility model content

To solve the above problems, the utility model provides laser projection device and its depth camera of correlation, can effectively carry The image quality of high laser projection module.

The utility model provides a kind of laser projection device, including VCSEL array, and the VCSEL array includes multiple VCSEL units, for launching the first light beam；Microlens array, including it is consistent with the VCSEL element numbers and one-to-one Multiple lenticule units, the lenticule unit include at least one optical surface, the optical surface and the VCSEL units At intervals of the first distance, for receiving, focusing on first light beam of corresponding VCSEL units transmitting, and launch second Light beam；Main lens, the main lens and the microlens array are at intervals of second distance, for receiving, converging second light Beam, and launch the 3rd light beam；Pattern generation optical element, the pattern generation optical element are used to receive the 3rd light beam simultaneously Outwards launch the 4th overlapped light beam of multiple at least part.

According to an embodiment, VCSEL units are arranged with irregular pattern, and VCSEL units and lenticule unit are separately provided And correspond, lenticule unit is configured to identical shape, and master is concurrently incident upon to focus on the light beam of VCSEL units transmitting On lens, main lens carries out secondary focusing to light beam, and pattern generation optical element carries out increasing beam to the light beam after secondary focusing, sends out Penetrate structure light.Or alternatively, lenticule unit is configured to different shapes, by controlling corresponding VCSEL units list Solely open or open simultaneously, make different, the of different sizes or different density pattern of microlens array transmitting forming shape.Or replace Ground, identical lenticule unit, its optical surface do different processing so that microlens array transmitting forming shape is different, size Different or different density patterns.

According to an embodiment, VCSEL units are arranged with irregular pattern, and lenticule unit is integrated in the light of VCSEL units Outlet so that lenticule unit keeps strict one-to-one relationship with light source, further reduces volume.

According to an embodiment, VCSEL array is made into VCSEL semiconductor slice chips, is placed on base, is used for into one Step reduces volume, and quick heat radiating.

The utility model also provides a kind of depth camera, including laser projection device as described above, for target empty Between middle projection structure light beam image；Image collecting device, for gathering the structured light beam images in object space；Place Device is managed, the structured light beam images gathered by described image harvester is received and generates institute according to the structured light beam images State the depth image of object space.What the depth image according to the structured light beam images generation object space referred to It is using the deviation value between the matching algorithm calculating structured light beam images and reference beam image, according to the deviation value Calculate the depth image.

The beneficial effects of the utility model：Pass through VCSEL array light source, microlens array, main lens and pattern generation light Learn the reasonable Arrangement successively and design of element so that microlens array focuses on the light beam that VCSEL array light source is launched, then by leading Secondary imaging is realized in lens convergence, compared to only main lens or microlens array, can obtain lower multiplication factor so that The structured light patterns ultimately formed are more concentrated, and identical luminous power for transmission to farther distance and can keep higher figure Case quality, while laser projection device has smaller volume.Needed according further to different application scenarios, when mounted can be with The distance between microlens array and main lens are adjusted to increase or reduce multiplication factor, during so as to meet at a distance or closely The size of required speckle patterns.

Brief description of the drawings

Fig. 1 is the depth camera side schematic view based on structure light in a kind of embodiment of the utility model.

Fig. 2 is the side view of laser projection device in a kind of embodiment of the utility model.

Fig. 3 a are microlens array schematic diagram in a kind of embodiment of the utility model.

Fig. 3 b are microlens array schematic diagram in a kind of embodiment of the utility model.

Fig. 3 c are microlens array schematic diagram in a kind of embodiment of the utility model.

Fig. 4 is the side view of laser projection device in a kind of embodiment of the utility model.

Fig. 5 is the structural representation of the vertical cavity surface generating laser of integral micro-lens in a kind of embodiment of the utility model Figure.

Fig. 6 is VCSEL array front view in a kind of embodiment of the utility model.

Fig. 7 is the polycrystalline substance schematic diagram of laser projection device in a kind of embodiment of the utility model.

Fig. 8 is the polycrystalline substance schematic diagram of laser projection device in a kind of embodiment of the utility model.

Fig. 9 is the polycrystalline substance schematic diagram of laser projection device in a kind of embodiment of the utility model.

Figure 10 is the polycrystalline substance schematic diagram of laser projection device in a kind of embodiment of the utility model.

Embodiment

With reference to embodiment and compare accompanying drawing the utility model is described in further detail, it should be emphasised that It is, what the description below was merely exemplary, rather than in order to limit the scope of the utility model and its application.

In description of the present utility model, it is to be understood that term " first ", " second ", " the 3rd ", " the 4th " only use In description purpose, and it is not intended that instruction or hint relative importance or the implicit number for indicating indicated technical characteristic Amount.Thus, define " first ", " second ", " the 3rd ", the feature of " the 4th " can express either implicitly include one or More this feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly having The restriction of body.

Utility model utility model depth camera by species be broadly divided into structure light depth camera, TOF depth cameras and Binocular vision depth camera.

Encoded standard knots are projected into space using laser projection device based on the trigon depth camera of structure light Structure light pattern, the difference of target depth is modulated normal structure light pattern in space, is obtained by image correlation scheduling algorithm The difference of structure light image and normal structure light pattern after modulation is taken, it is deep with target to establish the difference according to structure light trigonometry Relation between degree can solve the depth image of whole object space.

Depth camera based on time flight method, to objective emission laser pulse, is filled using laser projection device by light-receiving Put and obtain pulse and record the light flight time for being transmitted into reception, the depth map of target can be calculated according to the flight time Picture.

Depth camera based on Binocular Vision Principle, substantially similar to structure light trigonometry principle, difference is structure Light trigonometry is actively to measure, and binocular vision is then passive measurement.Difference of the image obtained using left and right camera on parallax Not, the depth value for further calculating target after the parallax using triangulation principle and is obtained by vision algorithm.

Usually, be required in first two depth camera by means of laser projection device come into space projection optics believe Number, and for binocular vision depth camera, also usually it can increase object in space using laser projection device at present Texture information is to improve measurement accuracy.Because laser projection device is abnormal important for depth camera, often laser projection Performance, volume, the power consumption of device will directly affect precision, volume of depth camera etc..

The utility model proposes a kind of laser projection device and the depth camera based on this.Will be right in explanation below Illustrated exemplified by laser projection device and depth camera, but be not meant to that this laser projection device is only capable of applying in depth Spend in camera, it is every in any other device to be directly or indirectly intended to be included in protection model of the present utility model using the program Within enclosing.

The depth camera side schematic view based on structure light shown in Fig. 1.101 main building block of depth camera has laser Module 104, collection module 105, mainboard 103 and processor 102 are projected, RGB camera is further provided with some depth cameras 107.Laser projection module 104, collection module 105 and RGB camera 107 are generally mounted at same depth camera plane On, and same baseline is in, each module or camera correspond to a light portal 108.Usually, processor 102 is collected Into on mainboard 103, and laser projection module 104 is connected with collection model 105 by interface 106 with mainboard, is implemented in one kind Interface described in example is FPC interfaces.Wherein, laser projection module is used to project encoded structure light figure into object space Case, collection module are collected after the structure light image by the processing of processor so as to obtain the depth image of object space. In one embodiment, structure light image is infrared laser speckle pattern, and pattern is relatively uniform with distribution of particles but with very high Local irrelevance, local irrelevance here refers to that each sub-regions all have higher uniqueness in pattern.It is right The collection module 105 answered be and 104 corresponding infrared camera of laser projection module.Depth image is obtained using processor specifically After finger receives the speckle pattern collected by collection module, by calculating the deviation between speckle pattern and reference speckle pattern Value further obtains depth image.

Fig. 2 is a kind of embodiment of laser projection module 104 in Fig. 1.Project module 104 include base 201, light source 202, Microlens array 204, lens 205 and diffraction optical element (DOE) 206.Base 201 is used for fixed light source 202, in some realities Apply and be also used for providing the effects such as radiating, electrical connection, such as the base collectively constituted by radiating piece, circuit board in example.At other Embodiment center base 201 can be semiconductor base, and VCSEL light source array is directly made in semiconductor substrate surface.Light source 202 It is used to launch multiple beamlets (the first light beam) comprising multiple sub-light sources, light source can be that visible ray, black light are for example infrared, purple It is outer to wait LASER Light Source, the species of light source can be edge emitting laser can also vertical cavity surface laser, in order that overall projection Device volume is smaller, and optimal scheme is that selection vertical cavity surface arrangement of laser emitters (VCSEL array) is used as light source.It is in figure Facilitate signal, only list 3 sub-light sources on one-dimensional, in fact VCSEL array is to fix the two dimension of two-dimensional pattern arrangement Light source.The pattern launched to produce laser projection device has the characteristic such as uniform, uncorrelated, and the arrangement pattern of light source is not Regular pattern, i.e. light source are arranged not with regular array with certain irregular pattern.In certain embodiments, VCSEL array entirety size only in micron dimension, such as 5mmX5mm sizes, is arranged tens even individual light sources up to a hundred above, The distance between each light source is in micron dimension, such as 10 μm.Microlens array 204 receives the first light from light source 202 Beam, and light beam is focused and launches the second light beam, in order to reach the effect of focusing, microlens array 204 comprises at least one Individual lens face 203, lens face here are generally sphere.In some embodiments, it is also possible to be aspherical, such as in a reality Apply in example when the first beam shape that light source is sent for it is oval when, oval-shaped beam can be carried out by cylindrical lens face whole Shape with formed circle the second light beam.And for example in one embodiment, by the non-spherical lens of particular design to eliminate lens Ball-shaped aberration to form more accurate speckle patterns.

The second light beam that multiple lenticules are launched, its shape can be with identical, can also be different, such as in one embodiment Circular light beam is shaped to by the beam shape with uniform shapes by the non-spherical lens of particular design, this set can make Obtaining the spot that overall laser projection device is launched has unified non-circular shape, is advantageous to improve depth in some cases The accuracy of calculating；And for example in one embodiment, by the sphere of particular design and non-spherical lens by the first beam shaping Into with the second light beam of different shapes, further increase incoherent characteristic, be advantageous to improve the accuracy of depth calculation.

When each lenticule unit only has a lens face 203 in microlens array 204, lens face 203 can be put Towards light source can also be placed in backlight while.In certain embodiments, each lens unit can also There is lens face on two sides.

Each lenticule unit corresponds with light source 202 respectively in microlens array 204, i.e., in microlens array 204 The arrangement of each lenticule unit is consistent with light source 202, i.e., quantity is equal, and arrangement pattern is identical.Each lenticule unit difference For receiving the first light beam of corresponding light source 202 and focusing on, shaping.

The geometry of lenticule unit can have various shapes, than shown in round-shaped and Fig. 3 b as shown in Figure 3 a Hexagonal configuration or the shape such as unshowned square, rhombus.In certain embodiments, lenticule unit can also have A variety of geometries collectively form, for example half lenticule unit is hexagonal configuration in same microlens array, and second half is micro- Lens unit is round-shaped, and a kind of preferred embodiment as shown in Figure 3 c, is mutually in staggered distribution between different shapes.This Kind embodiment is advantageous in that, light source corresponding to different shape is separately controlled, for example hexagonal configuration lenticule unit is corresponding Light source light source corresponding with round-shaped lenticule unit be grouped control, it is possible to achieve it is independent open and it is synchronous open with Launch the second light beam, form different, the of different sizes or different density pattern of shape.For example individually open hexagonal configuration lenticule During corresponding with individually the opening round-shaped lenticule unit VCSEL light source of VCSEL light source corresponding to unit, the transmitting that is emitted The shape of beam pattern is different；Such as only open VCSEL light source corresponding to hexagonal configuration or round-shaped lenticule unit with it is complete Portion's opening VCSEL light source is relative, and the density for the beam pattern being emitted is also different.It is to be appreciated that in explanation here only List and be divided into two groups of example, in fact, a greater variety of packets can also be carried out, for same shaped microlenses unit Corresponding VCSEL light source can also be grouped control, even, independent control can be carried out to each VCSEL light source.

When the shape difference of lenticule unit, its corresponding focal length typically also has difference, when microlens array with The timing of the distance between VCSEL light source one, the cross-sectional sizes that focal length difference can cause each light source to be finally emitted also can be different.I.e. When to make lenticule unit be same shape, the focal length of lenticule unit can also be arranged to difference has difference to produce size Different transmitting beam pattern, in theory for, this mode can improve transmitting beam pattern non-correlation degree, but then can Increase the cost of manufacture.

In a word, by the independence of VCSEL light source, packet and integrally control, and to lenticule list in microlens array The setting of first shape, focal length etc., the different transmitting light beam such as shape, size, density can be launched to meet not Same application demand.

Fig. 2 is returned to, lenticule unit focuses of the light beam into focal plane 207, and main lens 205 is provided with after focal plane 207, main saturating Mirror 205 receives, converges the second light beam of multiple lenticule transmittings, and launches the 3rd light beam.Main lens 205 is used for lenticule battle array The light beam of row carries out secondary focusing imaging, and another aspect main lens 205 also plays the effect for being diffused beamlet, here Diffusion refer to that by the light beam by main lens for the light beam of the surface of emission of light source 202 diameter of light beam is expanded It is big.By multiple beam Propagations of main lens 205 to diffraction optical element (DOE) 206, and carried out by DOE206 with integral multiple Expand (the 4th light beam).If the quantity than light source 202 is 100, i.e. 100 beamlets, by being carried out after DOE with 500 times Expand, ultimately form the pattern projection of 50000 spots into space.It should be noted, this 50000 spots are spatially not Overlapping phenomenon occurs in same distance, therefore often spot number can be less than 50000.In other words, DOE effect is by light source 202 patterns formed carry out duplication at double in space, it should be noted that due to pattern density to be improved, are carrying out During duplication, it can be overlapped between two adjacent width patterns, overlapping another effect is can to improve the not phase of global pattern Pass degree.

Main lens 205 and DOE206 can be fabricated on same optical element in certain embodiments, to reach contracting The effect of small size, the optical element have two surfaces, are respectively intended to perform the function of lens and diffraction optical element.

The another way for reducing volume is using wafer scale optical technology that light source 202, microlens array 204, master is saturating Mirror 205, diffraction optical element (DOE) 206 all directly make on a semiconductor substrate.On the one hand the benefit of this technique reduces whole The volume of body module, on the other hand N number of module can be made simultaneously on wafer, last cleaved formation is multiple independent Module, so as to increase substantially production efficiency.

The distance between microlens array and light source need especially to be set, and usually need two conditions of satisfaction, and one It is to ensure that only by the light beam of single source, interference is not had between adjacent beams for each lenticule unit；Second, light source is best Beyond 2 times of focal lengths of lenticule unit, to ensure that light beam fully focuses on.The distance of microlens array and lens is more preferably greater than saturating Mirror focal length and lenticule unit focal length and.It is not to this reality it should be noted that only giving a kind of optimal case here With the limitation of new scheme.

In addition, the distance between main lens and microlens array should typically be less than the focal length of main lens, it is a kind of preferable In embodiment, this distance is less than main lens focal length and lenticule unit focal length sum.Between main lens and microlens array Distance only meet above-mentioned condition, both formed secondary imaging light path could realize lower multiplication factor.

The light path arrangement figure of laser projection device of the present utility model is in fact also the secondary imaging to light source 202, with The light path arrangement figure of single lens is compared in prior art, and the multiplication factor of secondary imaging can adjust, and the integrated level of system It is higher.The multiplication factor of single lens is typically 200 or so at present, and the utility model is made up of microlens array and main lens The multiplication factor of optical system can then realize 40~200.Smaller multiplication factor then means the speckle pattern ultimately formed Case is more concentrated, and identical luminous power for transmission to farther distance and can keep higher pattern quality, and depth map calculates Precision will be higher.Needed according further to different application scenarios, for example for telemeasurement, then can adjust microlens array The distance between main lens increases the projection spot size of laser projection module to increase multiplication factor, to ensure remote Apart from when remain to obtain the speckle patterns of better quality, it is on the contrary then reduce multiplication factor.

Adjust the distance between microlens array and main lens when mounted, multiplication factor can be between 40-200 Any one numerical value, the multiplication factor of laser projection device has determined that after installation.It is existing to use different focal lens Laser projection device, because the multiplication factor of single lens is generally 200 or so, single lens can not realize lower put Big multiple, makes that the speckle pattern noise that ultimately forms is big, contrast is low, brightness irregularities.Therefore, laser of the present utility model is thrown On image device, either cost or implementation, all there is bigger advantage than existing laser projection device.

Diffraction optical element 206 is DOE, and DOE is configured to receive the 3rd light beam and export structure of main lens transmitting Light, feature (such as the spot or point) sum that its structure light includes are more than the feature sum that the 3rd light beam includes.Use this Kind optical element, can make in the structured pattern of output can have than more features in VCSEL unit.So as to such as fruiting period Hope and produce the structured light pattern with 1,000 features, then 1,000 VCSEL units are not needed in VCSEL array, can be with The overall size and volume of VCSEL array are effectively reduced, and reduces overall size and cost.In an alternate embodiment, diffraction Optical element is implemented as microlens array or grating.

Shown in Fig. 4 is according to another laser projection device schematic diagram of the present utility model.It is whole in order to further reduce The volume of the laser projection device of body, lenticule and VCSEL light source are integrated, and the situation after integrating is this as shown in 401 Mode can make it that overall volume is smaller, and lens and light source will not be pacified the strict one-to-one relation of holding Error influences caused by dress etc..

Fig. 5 is the VCSEL light source details for being further described integral micro-lens.VCSEL active layer 505 is in centre, with having Active layer connection is limiting layer 506, and the effect of limiting layer is to realize the control to laser shape etc. for controlling light field and electric current There is the semiconductor mirror 504 and 507 of p-type and N-type at system, active layer both ends, and the opposite side of speculum 507 is top electrodes 508 (P poles, positive poles), the side of speculum 504 is Semiconductor substrate 503 and bottom electrode 502 (N poles, negative pole) respectively.Swash Light beam is sent between P poles 508, by making lenticule 509 on speculum 507 to realize the effect integrated, such as one By depositing SiO on speculum 507 in kind embodiment₂-Si₃N₄So as to form the lenticule of projection.By integral micro-lens As shown in fig. 6, VCSEL light source is arranged on substrate with irregular pattern, each light source surface has with it one by one VCSEL array Corresponding lenticule.

Control to each light in VCSEL array can have different patterns, in one embodiment, all VCSEL Light source is in synchronized control opening and closed；In another embodiment, VCSEL light source is controlled to produce difference by independent or packet Illumination density.The shape of single VCSEL light source, area can also differ.

In certain embodiments, VCSEL array light source can also be packaged into chip by special purposes, similar to electricity The chips such as the CPU of brain, both positive and negative polarity is connected by being connected to pin in the same side with the external world.For depth described in the utility model Spend for camera embodiment, in order to reach the effect of small volume, a kind of preferably processing mode is directly by unencapsulated VCSEL Semiconductor slice chip is placed on base 201.The bottom of chip is connected with negative pole, and top is connected with positive pole.

, can be directly by unencapsulated VCSEL semiconductor slices for laser projection device in order to further reduce volume Chip is placed on base 201, the bottom cathode connection of chip, the connection of top positive pole.To be cut into slices core with VCSEL in the following description Illustrated exemplified by piece, it will be appreciated that encapsulation chip is also contained in the scope of protection of the utility model.Explained in following In stating, in order to make it easy to understand, VCSEL array mentioned above will be replaced with the word such as " chip ", " array chip ".

Chip has been required for carrying and bindiny mechanism, to ensure the normal function of chip.Such as its promising independence of computer CPU The bite type connection of design and fixed mechanism；For the little special chip of some caloric values, it can directly pass through pin and mainboard It is joined directly together；And for chip described in the utility model, typically there is higher caloric value, and need firm consolidate Determine device.VCSEL array chip due to be for launching light beam, it is necessary to larger power, caloric value is larger, further need exist for by It is integrated into the micromodule equipment of small volume, heat dissipation problem needs to solve；On the other hand, for depth camera, laser is thrown The relative position requirement of shadow module is very firm, to ensure to have stabilization, accurate depth image to export.Therefore, VCSEL array core The carrying of piece and bindiny mechanism require both to possess small volume in order to integrated, need preferable heat dispersion and steady again Solid connection.

Laser projection device of the present utility model realizes volume in depth camera using a kind of special structure type Small, the advantages that radiating is high, the structure is in the bottom of laser projection device, specifically, including support member, for carrying core Piece；Thermal component, for heat caused by chip is scattered and disappeared；Control unit, worked for control chip, the base 201 in Fig. 2 It is to be used to carrying and connecting VCSEL array chip, base 201 is configured to chip flush mounting 801 as shown in Figure 7, i.e., Base 201 plays the triple role of support, radiating and control chip.Chip is specially VCSEL array chip 806；Control unit Specific is circuit board 803, accesses electrode by its interface 804 to power or control VCSEL array chip 806；Support member Be specially same part with thermal component, i.e. substrate 802, for placing and carrying chip, and be connected with chip play it is scattered The thermally and/or electrically effect of pole connection, conventional material are that copper is gold-plated, ceramic etc..The device can be controlled easily with other Unit such as mainboard is attached, and can stably support chip.

In order to reduce overall volume, what is taken is the form of the increase hole among circuit board 803, substrate 802 and electricity Road plate 803 is glued, and covers hole (usually, being overlapped among hole center and circuit board 802), is then placed in chip It is connected in hole and with substrate.This set, which is advantageous in that, can take into account connection between circuit board and chip and whole simultaneously The control of body thickness.

In another embodiment, chip flush mounting 801, as shown in figure 8, circuit board 803 is flexible PCB (FPC), Substrate 802 is copper gilding, and VCSEL array chip 806 is located at hole center, and is connected by conductive silver paste with substrate 802, Substrate 802 is glued with circuit board 803.Some pads 805 are arranged around FPC hole, pad 805 passes through circuit and interface 804 connections.In fig. 8, positive terminal pad is connected by gold thread 807 with VCSEL chips apex electrode 806, and negative terminal pad passes through gold Line 808 is directly connected with substrate 802, because substrate is connected with the bottom electrode of chip by conductive silver paste, thus is also just realized Pad and bottom electrode are indirectly connected with.Further, since VCSEL chips are connected with substrate 802, and substrate has and led well It is hot, therefore the heat dissipation problem of VCSEL chips is also resolved.

In another embodiment, physical connection, such as bolt etc. are passed through between circuit board 803 and substrate 802.If utilize glue Water connects, advantage be to be not take up space, simple operation, but shortcoming be due to glue resistance it is larger, thus be unfavorable for radiating, Power consumption can be increased.Specific connected mode does not limit herein.

In another embodiment, circuit board 803 is the combination of printed circuit board (PCB) and flexible PCB (FPC), i.e., soft Circuit board is closed in scleroma, and compared with FPC, PCB hardness is high, and load-carrying properties are preferable, but connects then more difficult.Therefore, in this reality Apply in example, employ the mode of the two combination, i.e. position FPC where interface, and at the position being connected with substrate using soft or hard Board.In other embodiments, circuit board 803 can be all using printed circuit board (PCB).

The connection of circuit board and chip and substrate, more clearly visible Fig. 9.In fig.9, circuit board 803 passes through gold thread 807 It is connected respectively with chip 806 and substrate 802 with 808.Usually, the bore hole size of circuit board should be greater than the size of chip 806, On the one hand it is easily installed and reserves operation space for the connection of gold thread 808 and substrate 802, on the other hand further increases base The heat dispersion at bottom 802.Hole it is generally circular or square, do not limit herein.In other embodiments, connection is used Gold thread can also be that other any can realize the material being conductively connected.

In another embodiment, can be chip recessing in substrate, such as Figure 10 institutes in order to further reduce volume Show, this mode can further reduce overall thickness.It should be noted that when substrate thickness itself with regard to it is relatively thin when it is not recommended that Recessing, to avoid when chip adstante febre can cause the deformation of base material.

It is understood that substrate can also be other Heat Conduction Materials, such as ceramics.Now, VCSEL chips and substrate be only Heat conduction connects, and is conductively connected with the positive and negative electrode of circuit board, connected mode can take any other to realize what is be conductively connected Mode, do not limit herein.Substrate can also be designed to the shape for being adapted to radiating, for example the increase mode such as flabellum is scattered to increase Hot area etc..With equipment such as mobile phones substrate and other heat sink materials can also be attached to be lifted in integrating process Heat dispersion.

Laser projection device, it can be fixed in depth camera using chip flush mounting, the chip insertion dress Put, be embedded by opening up hole on control unit, and by VCSEL array chip, can fully reduce the entirety of device Volume, while chip directly contacts connection with thermal component, thermal component plays a part of supporting chip, ensured to chip simultaneously Offer is radiated to greatest extent.Compared with prior art, utility model can not only realize small size, high radiating, low-power consumption, also Lower multiplication factor and Geng Gao image quality can be realized.

Above content is to combine specific/preferred embodiment further detailed description of the utility model, no It can assert that specific implementation of the present utility model is confined to these explanations.For the common skill of the utility model art For art personnel, without departing from the concept of the premise utility, it can also make to the embodiment that these have been described Some replacements or modification, and these are substituted or variant should all be considered as belonging to the scope of protection of the utility model.

Claims (13)

1. A kind of 1. laser projection device, it is characterised in that including：

   VCSEL array, including multiple VCSEL units, for launching the first light beam；

   Microlens array, including consistent with the VCSEL element numbers and one-to-one multiple lenticule units, it is described micro- Mirror unit includes at least one optical surface, and the optical surface and the VCSEL unit intervals are the first distance, for connecing Receive, focus on first light beam of corresponding VCSEL units transmitting, and launch the second light beam；

   Main lens, the main lens and the microlens array are at intervals of second distance, for receiving, converging second light Beam, and launch the 3rd light beam；

   Pattern generation optical element, the pattern generation optical element be used for receive the 3rd light beam and outwards launch it is multiple extremely The 4th overlapped light beam of small part.
2. 2. device as claimed in claim 1, it is characterised in that each lenticule unit is arranged on each VCSEL The light-emitting window of unit.
3. 3. device as claimed in claim 1, it is characterised in that the pattern generation optical element includes DOE, lenticule battle array One kind in row, grating.
4. 4. device as claimed in claim 1, it is characterised in that first distance is more than the focal length of the lenticule unit.
5. 5. device as claimed in claim 4, it is characterised in that first distance is more than 2 times of Jiao of the lenticule unit Away from.
6. 6. device as claimed in claim 1, it is characterised in that the second distance be more than the main lens focal length with it is described micro- The sum of lens unit focal length.
7. 7. device as claimed in claim 1, it is characterised in that the multiple VCSEL units are in the form of irregular alignment with shape Into the VCSEL array.
8. 8. device as claimed in claim 1, it is characterised in that second light beam tool of the multiple lenticule unit transmitting There is unified shape.
9. 9. device as claimed in claim 1, it is characterised in that second light beam tool of the multiple lenticule unit transmitting There is different shapes.
10. 10. device as claimed in claim 1, it is characterised in that two kinds of different shapes are comprised at least in the microlens array Or the lenticule unit of different focal.
11. 11. device as claimed in claim 1, it is characterised in that the main lens is set with the pattern generation optical element Put on same optical element.
12. 12. a kind of depth camera, it is characterised in that the depth camera includes：

    Laser projection device as described in claim 1-11 is any, for the projection structure light beam image into object space；

    Image collecting device, for gathering the structured light beam images in object space；

    Processor, receive the structured light beam images that are gathered by described image harvester and according to the structured light beam images Generate the depth image of the object space；

    The depth image that the object space is generated according to the structured light beam images refers to utilizing matching algorithm meter The deviation value between the structured light beam images and reference beam image is calculated, the depth map is calculated according to the deviation value Picture.
13. 13. depth camera according to claim 12, it is characterised in that the laser projection device also includes：Supporting part Part, for carrying the VCSEL array；Thermal component, for heat caused by the VCSEL array is scattered and disappeared；Control unit, For controlling the VCSEL array to work, and hole is provided with the control unit, the VCSEL array is embedded into described Connection is contacted in hole and with thermal component, now thermal component plays a part of support member, so that the laser projection Device realizes small volume and high radiating.