CN109683439A - Optical projection mould group, sensing device, equipment and optical projection module group assembling method - Google Patents
Optical projection mould group, sensing device, equipment and optical projection module group assembling method Download PDFInfo
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- CN109683439A CN109683439A CN201811526683.9A CN201811526683A CN109683439A CN 109683439 A CN109683439 A CN 109683439A CN 201811526683 A CN201811526683 A CN 201811526683A CN 109683439 A CN109683439 A CN 109683439A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 90
- 238000000034 method Methods 0.000 title claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 28
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
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- 230000005611 electricity Effects 0.000 claims 1
- 239000003351 stiffener Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 5
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2545—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with one projection direction and several detection directions, e.g. stereo
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2013—Plural light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The application is suitable for optics and electronic technology field, provide a kind of optical projection mould group, three-dimensional sense survey is carried out in the patterned beam to measured target object with predetermined pattern for projecting comprising light source, circuit board, stiffening plate, lens barrel and the optical element being arranged on lens barrel.Light source setting is on circuit boards and and circuit board electrical connection.The stiffening plate is fitted in the circuit board another side opposite with light source.The lens barrel is arranged in circuit board and is assembled on a side surface of light source and cover said light source.The optical element and source alignment so that the light beam that light source is issued is formed after the modulation of optical element there is the patterned beam of predetermined pattern to be projected on measured target object.
Description
Technical Field
The present application belongs to the field of optical technologies, and in particular, to an optical projection module, a sensing device, an apparatus, and an assembling method of the optical projection module.
Background
The height of the existing Three-Dimensional (3D) structure light emitting module in the light emitting direction is too large, and the trend of light and thin module cannot be satisfied. On the other hand, the surface mount process in the conventional module manufacturing process may also damage the lens barrel and the optical element disposed on the lens barrel due to high temperature.
Disclosure of Invention
The present application provides an optical projection module, a sensing device, an apparatus and an assembling method of the optical projection module to solve the above technical problems.
The embodiment of the application provides an optical projection module for projecting a patterned beam with a preset pattern onto a target object to be detected for three-dimensional sensing, which includes a light source, a circuit board, a reinforcing plate, a lens barrel and an optical element arranged on the lens barrel. The light source is arranged on the circuit board and electrically connected with the circuit board. The reinforcing plate is attached to the other side face, opposite to the light source, of the circuit board. The lens cone is arranged on the surface of one side of the circuit board, which is assembled with the light source, and covers the light source. The optical element is aligned with the light source, so that the light beam emitted by the light source forms a patterned light beam with a preset pattern after being modulated by the optical element and is projected onto a measured target.
In some embodiments, the reinforcing plate is made of a material with high thermal conductivity, selected from any one of a steel sheet, a copper sheet, and a combination thereof, and is used for increasing the strength of the circuit board and dissipating heat of the light source on the circuit board.
In some embodiments, the optical element further includes a protective cover plate disposed in the accommodating groove at an end of the lens barrel away from the circuit board and located on a light exit side of the optical element.
In some embodiments, the lens further comprises a passive component and a connector, wherein the passive component and the connector are arranged on the circuit board at a part outside the lens barrel through a surface mounting process.
In certain embodiments, the optical element is selected from one of a collimating element, a beam expanding element, a microlens array, a grating, and a diffractive optical element, and combinations thereof.
In some embodiments, the light source includes a semiconductor substrate and a plurality of light emitting units formed on the semiconductor substrate, the light emitting units are distributed on the semiconductor substrate in a two-dimensional lattice form, a reference sub-region exists in the light emitting units, and a product of a ratio of a set of light emitting unit sub-regions having a correlation coefficient greater than or equal to a preset threshold value with respect to the reference sub-region to all light emitting units and an average value of the correlation coefficients corresponding to the respective light emitting unit sub-regions in the set is greater than or equal to 0.25 and less than 1.
In some embodiments, the correlation coefficient is a normalized correlation coefficient, and the preset correlation coefficient threshold is 0.3.
The embodiment of the application provides a sensing device, which is used for sensing three-dimensional information of a measured object, and comprises a sensing module and the optical projection module in any one of the above embodiments, wherein the sensing module is used for sensing a preset pattern projected by the optical module on the measured object and acquiring the three-dimensional information of the measured object by analyzing an image of the preset pattern.
The embodiment of the application provides equipment, which comprises the sensing device in the embodiment, and the equipment executes corresponding functions according to the three-dimensional information of the detected target object sensed by the sensing device.
The embodiment of the present application provides an assembling method of an optical projection module, where the optical projection module includes a light source, a circuit board, a passive element, a reinforcing plate, a lens barrel, and an optical element, the passive element, the reinforcing plate, the lens barrel, and the optical element are disposed on the lens barrel, and the assembling method includes the following steps: disposing an optical element on the lens barrel; attaching the reinforcing plate to the circuit board; arranging a passive element on the circuit board through a surface mounting process; arranging a light source on the circuit board; determining the relative position between the lens barrel assembled with the optical element and the light source on the circuit board through active alignment; and fixing the lens barrel assembled with the optical element on the circuit board at the determined position on the circuit board by dispensing.
The optical projection module, the sensing device, the equipment and the assembling method of the optical projection module provided by the embodiment of the application utilize the light and thin reinforcing plate to increase the strength of the circuit board and dissipate heat of the light source. Meanwhile, the mode that the lens cone assembly and the circuit board assembly are carried out separately and synchronously is adopted, so that the assembly efficiency can be improved, and the risk of preventing the optical element 17 on the lens cone 16 from being damaged by high-temperature operation can be reduced.
Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.
Drawings
Fig. 1 is a schematic structural diagram of an optical projection module according to a first embodiment of the present disclosure.
Fig. 2 is a schematic view of the structure of the light source shown in fig. 1.
Fig. 3 is a schematic view of a distribution of light emitting units of the light source of fig. 1.
Fig. 4 is a schematic structural diagram of a sensing device according to a second embodiment of the present application.
Fig. 5 is a schematic structural diagram of an apparatus provided in a third embodiment of the present application.
FIG. 6 is a flowchart illustrating steps of a method for assembling an optical projection module according to the present disclosure.
Fig. 7 is a schematic structural diagram of steps in fig. 6.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application. In the description of the present application, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any order or number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either mechanically or electrically or in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship or combination of two or more elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the present application, only the components and settings of a specific example are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repeat use is intended to provide a simplified and clear description of the present application and is not intended to suggest any particular relationship between the various embodiments and/or arrangements discussed. In addition, the various specific processes and materials provided in the following description of the present application are only examples of implementing the technical solutions of the present application, but one of ordinary skill in the art should recognize that the technical solutions of the present application can also be implemented by other processes and/or other materials not described below.
Further, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the subject technology can be practiced without one or more of the specific details, or with other structures, components, and so forth. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the focus of the application.
As shown in fig. 1, a first embodiment of the present application provides an optical projection module for projecting a predetermined sensing light spot pattern onto a target object to be measured for three-dimensional sensing. The optical projection module 1 includes a light source 12, a circuit board 14, a reinforcing plate 15, a lens barrel 16, an optical element 17 disposed on the lens barrel 16, and a protective cover 18 disposed on the light-emitting side of the optical element 17. The light beam emitted by the light source 12 is modulated by the optical element 14 to form an emergent light beam with a preset pattern, and the emergent light beam is projected. The Optical element 14 includes, but is not limited to, one of a collimating element, a beam expanding element, a microlens array, a grating, and a Diffractive Optical Element (DOE), and combinations thereof.
In the present embodiment, the optical projection module 1 is a three-dimensional sensing device for sensing three-dimensional data of a target object. The light source 12 emits a set of light beams having a predetermined light field distribution. The light beam may be a light beam having a specific wavelength according to sensing principles and application scenarios. In this embodiment, the light beam is used for sensing three-dimensional information of a target object, and may be an infrared or near-infrared wavelength light beam, and the wavelength range is 750 nanometers (nm) to 1650 nm.
As shown in fig. 2, the light source 12 includes a semiconductor substrate 120, a plurality of light emitting cells 122 formed on the semiconductor substrate 120, an anode 124, and a cathode 126. The light emitting unit 122 is a semiconductor structure capable of emitting light under the action of electrical excitation, and is formed on the semiconductor substrate 120 through photolithography, etching, and/or metal organic chemical vapor deposition. For example, the light emitting unit 122 may be, but is not limited to, a Vertical Cavity Surface Emitting Laser (VCSEL). The anode 124 and the cathode 126 are respectively disposed on two opposite end surfaces of the semiconductor substrate 120 to introduce a current signal to excite the light emitting unit 122 to emit light. The excitation current is greater than 1 mA.
It is understood that, in other embodiments, the light emitting unit 122 may also be a Light Emitting Diode (LED) or a Laser Diode (LD). Therefore, the light emitting unit 122 is selected from any one of VCSEL, LED and LD and a combination thereof.
As shown in fig. 3, the light emitting cells 122 are distributed in the light emitting region of the semiconductor substrate 120 in a two-dimensional lattice, wherein at least three adjacent light emitting cells 122 are arranged on the semiconductor substrate 120 at unequal intervals. The entire light emitting units 122 have a correlation as a whole.
The correlation of the arrangement pattern composed of the plurality of light emitting units 122 is generally evaluated by calculating a correlation coefficient f between the plurality of light emitting units 122nIf it is calculated to obtainCorrelation coefficient f ofnIf the value is greater than or equal to the preset threshold, it is determined that there is a correlation between the light emitting units 122.
The correlation coefficient fnThe calculation formula (b) of (c) may be, but is not limited to, a normalized correlation Coefficient formula (NCC), which is expressed as follows:
wherein,the R is0The reference sub-region R is referenced by the light emitting unit 122 to arbitrarily select the light emitting unit 122 reference sub-region among all the light emitting units 122 on the semiconductor substrate 120 according to the preset condition0Traverse the entire semiconductor substrate 120 except for R0Other parts than the reference sub-region R of the light emitting unit 122 and calculating0And the sub-region R of the light-emitting unit passing through in the traversing processnCorrelation coefficient f ofn. The above-mentioned H is the sub-region R of the light-emitting cell 122 under considerationnW is the sub-region R of the considered light-emitting cell 122nIs measured. The selected light emitting unit 122 is referred to as a sub-region R0The predetermined condition is that the ratio of the number of the light emitting cells 122 included in the selected reference sub-region of the light emitting cells 122 to the total number of all the light emitting cells 122 is greater than or equal to 10% or that the selected reference sub-region of the light emitting cells 122 includes more than ten light emitting cells 122. The total number of all the light emitting units 122 is greater than or equal to 50.
It will be appreciated that the light emitting unit 122 is referenced to the sub-region R0Using translation in a rectangular plane coordinate systemThe mode is traversed. In order to eliminate the influence of the background region other than the light-emitting unit 122 on the normalized correlation coefficient in the arrangement pattern when calculating the normalized correlation coefficient of the light-emitting unit 122, the region of the light-emitting unit 122 is expanded before calculation with the center of the light-emitting unit 122 as the origin, so as to avoid that the normalized correlation coefficient calculated by the above formula cannot reflect the actual correlation between the light-emitting units 122 due to the excessive proportion of the background region in the entire arrangement pattern when the physical size of the light-emitting unit 122 is small. For example, the arrangement pattern of the light emitting units 122 with low correlation can also calculate a high normalized correlation coefficient. After the expansion of the light emitting unit 122 region, the specific gravity of the background region is reduced, and the calculated normalized correlation coefficient of the arrangement pattern of the light emitting unit 122 can reflect the actual correlation between the light emitting units 122 to the maximum extent. Each of the light emitting unit 122 regions is expanded in the same dimension to such an extent that the adjacent light emitting unit 122 regions do not overlap each other after the expansion.
In addition, only the reference sub-region R of the light emitting unit 122 may be taken when the normalized correlation coefficient calculation is performed according to the above formula0And the traversed light-emitting-unit sub-region RnThe corresponding coordinates of the area occupied by the light emitting unit 122 are not taken, and the corresponding coordinates of the background area are not taken. That is, R (i, j) ═ 1(i, j takes the corresponding coordinates within the area occupied by the light-emitting unit) to exclude the influence of the background area on the actual correlation of the light-emitting unit 122 when the normalized correlation coefficient is calculated.
It is understood that in other embodiments, the light emitting unit 122 is referenced to the sub-region R0Traversal may also be performed in a polar coordinate system in a rotational manner about the origin of coordinates.
Normalized correlation coefficient f calculated according to the above normalized correlation coefficient formulanHas a value range of 0 to fnLess than or equal to 1. If fnWhen the value is 0, the reference sub-region R of the selected light emitting unit 122 is described0The sub-region R of the light-emitting unit 122 passing through the light-emitting unit 12 and traversingnWithout any overlap, i.e. the light-emitting unit 122 is referenced to the sub-region R0And a sub-region R of the light emitting unit 12nIs completely irrelevant.
If fnThe reference sub-region R of the selected light-emitting unit 122 is stated as 10The sub-region R of the light-emitting unit 122 passing through the light-emitting unit 12 and traversingnI.e. the light emitting unit 122 is referenced to the sub-region R0And a sub-region R of the light emitting unit 122nAre completely correlated.
If 0<fn<1 indicates that the selected light-emitting unit 122 refers to the sub-region R0The light-emitting unit 122 in (1) and the sub-region R of the light-emitting unit 122 passing through during traversalnThat said light emitting unit 122 is referenced to the sub-region R0And a sub-region R of the light emitting unit 122nPartial correlation, the normalized correlation coefficient fnThe larger the size of the reference sub-region R of the selected light-emitting unit 1220The light-emitting unit 122 in (1) and the sub-region R of the light-emitting unit 122 passing through during traversalnThe more the light-emitting units 122 overlap each other, i.e. the light-emitting units 122 refer to the sub-region R0And a sub-region R of the light emitting unit 122nThe higher the correlation between them.
If the normalized correlation coefficient fnNot less than 0.3, the light-emitting unit 122 is considered as the reference sub-region R0And a sub-region R of the light emitting unit 122nIn this regard, the light emitting units 122 have a correlation therebetween. If the normalized correlation coefficient fnNot less than 0.5, it can be considered that the light-emitting unit 122 refers to the sub-region R0And a sub-region R of the light emitting unit 12nHigh correlation, there is a high correlation between the light emitting units 12.
In this embodiment, the correlation coefficient is a normalized correlation coefficient fnThe preset threshold is 0.3, that is, the light emitting unit 122 refers to the sub-region R0If the normalized correlation coefficient f calculated in the traversing process existsnNot less than 0.3, or said luminescenceCell 12 reference sub-region R0Normalized correlation coefficient f calculated in the course of traversalnPeak value f ofn_maxThe correlation between the light emitting units 122 as a whole can be considered to be more than or equal to 0.3.
The correlation between the light emitting units 122 is evaluated in consideration of the normalized correlation coefficient of the light emitting units 122 as well as the ratio of the light emitting units 122 greater than or equal to a preset normalized correlation coefficient threshold value to all the light emitting units 122 to evaluate the correlation between the light emitting units 122 more objectively.
Thereby, a correlation intensity function for evaluating the intensity of the correlation between the light emitting units 122 is definedWherein a is the proportion of the light-emitting units 22 with the correlation coefficient greater than or equal to the preset threshold value of the correlation coefficient to all the light-emitting units 122, and the calculation formula isP＝{R0,R1,…,RNIn which R is0The sub-region R is referenced by the light-emitting unit 22 for the light-emitting unit 122 selected according to the preset condition0Traversing the whole light emitting region of the semiconductor substrate 120 and calculating the reference sub-region R of the light emitting unit 1220The light emitting region of the entire semiconductor substrate 120 except for R0Other than the correlation coefficient, assuming that there are N and R0The sub-regions of the light emitting unit 122 having a correlation coefficient greater than or equal to the preset correlation coefficient threshold are respectively denoted as R1,…,RNThen P represents the reference sub-region R of the light emitting unit 122 in the entire light emitting region of the semiconductor substrate 1200Set of all light emitting units 122 having a correlation coefficient therebetween greater than or equal to a preset correlation coefficient threshold value { R }0,R1,…,RNR, the set P ═ R0,R1,…,RNThere is a correlation between the light emitting cells 122 in (1). S is the entire semiconductor substrate 120, the set of all light emitting cells. The ratio may be, but not limited to, a ratio of the number of the light emitting units 122 having the correlation to the total number of all the light emitting units 122, or a ratio of the area of the region where the light emitting units 122 having the correlation are located to the total surface of the entire light emitting region.
The P and S may be the number of light emitting cells 122 in the corresponding set of light emitting cells 122. If the light emitting units 122 are uniformly distributed, the P and S may also be areas of regions where the corresponding light emitting units 122 are collected. It will be appreciated that where P and S are calculated for R0,R1,…,RNThe overlapping portion that may occur in (a) is calculated only once without repeating the calculation.
The above-mentionedIs the set P ═ { R ═ R0,R1,…,RNSub-regions R of all light-emitting units 122 inn(0<N is less than or equal to N) and the reference sub-region R of the light emitting unit 1220Normalized correlation coefficient f betweennIs calculated by the formulaWherein f isnIs Rn(0<N is less than or equal to N) and R0Normalized correlation coefficient therebetween.
In this embodiment, since the preset threshold value of the correlation coefficient is 0.3, i.e. when fnWhen the ratio is more than or equal to 0.3, the corresponding sub-region R of the light-emitting unit 122 is consideredn(0<N ≦ N) and the reference sub-region R of the selected light-emitting cells 1220Having a correlation therebetween, the sub-region R of the light emitting unit 122n(0<N ≦ N) may be applied to the correlation strength function defined aboveTo evaluate the overall correlation of all the light emitting cells 122 on the semiconductor substrate 120.
A is a ratio of the light emitting cells 122 having a correlation to all the light emitting cells 122, so that a is 0. ltoreq. a.ltoreq.1. The above-mentionedTo normalize the correlation coefficient fnAverage value of (1), soTherefore, the correlation strength functionThe calculated correlation strength value F also satisfies the value range of 0 to 1. It is defined herein that if the correlation strength value F satisfies 0 ≦ F<0.1, all the light emitting cells 122 on the semiconductor substrate 120 are irrelevant as a whole. If the correlation strength value F satisfies 0.1 ≤ F<0.25, all the light emitting cells 122 on the semiconductor substrate 20 are weakly correlated as a whole. If the correlation strength value F satisfies 0.25 ≤ F<0.5, all the light emitting cells 122 on the semiconductor substrate 120 have correlation as a whole. If the correlation strength value F satisfies 0.5 ≦ F ≦ 1, all the light emitting units 122 on the semiconductor substrate 120 are strongly correlated as a whole.
It is understood that for the same arrangement pattern of the light emitting units 122 on the semiconductor substrate 120, the calculated correlation strength value F may be referenced to the sub-region R along with the light emitting units 122 selected in the calculation process0Is not always consistent, so that the sub-region R is referred to by all the light emitting units 122 satisfying the predetermined condition when determining the correlation intensity of all the light emitting units 122 on the semiconductor substrate 120 as a whole0The maximum value among the calculated correlation strength values F is determined. That is, the reference sub-region R is selected according to a preset condition as long as there is a light emitting unit 122 selected according to the preset condition0So that the sub-region R is referenced according to the light emitting unit 1220The calculated correlation intensity value F satisfies the above-defined corresponding range of correlation intensity, and it is determined that the light emitting unit 12 on the semiconductor substrate 120 is located on the light emitting unit 122 have corresponding correlation strengths as a whole.
In the present embodiment, all the light emitting cells 122 on the semiconductor substrate 120 have correlation as a whole. Maximum value F of correlation intensity values F of all the light emitting units 122 as a wholemaxGreater than or equal to 0.25 and less than 1. I.e. there is a reference sub-region R of the light emitting unit 122 selected according to a preset condition0The calculated correlation strength value F is greater than or equal to 0.25 and less than 1.
It is understood that in other embodiments, all of the light emitting units 122 on the semiconductor substrate 120 have a strong correlation as a whole. Maximum value F of correlation intensity values F of all the light emitting units 122 as a wholemaxGreater than or equal to 0.5 and less than 1. I.e. there is a reference sub-region R of the light emitting unit 122 selected according to a preset condition0The calculated correlation strength value F is greater than or equal to 0.5 and less than 1.
As shown in fig. 1, the light source 12 is disposed on a circuit board 14 and electrically connected to the circuit board 14. Specifically, in the present embodiment, the light source 12 is fixed on the circuit board 14 by dispensing, and is electrically connected to the corresponding circuit node on the circuit board 14 by wire bonding. The circuit board 14 may be a flexible circuit board, a rigid-flex board, or a hard board. It is understood that the circuit board 14 is further provided with a connector 11 for external electrical connection and one or more passive components 13. The connector 11 and the passive component 13 are disposed on the circuit board 14 through a Surface Mount Technology (SMT) process.
The reinforcing plate 15 is provided on the other side surface of the circuit board 14 opposite to the light source 12. The reinforcing plate 15 is used to reinforce the strength of the circuit board 14 and simultaneously dissipate heat from the light source on the circuit board 14. The material of the reinforcing plate 15 is selected from steel sheets, copper sheets and other metals with high thermal conductivity. The reinforcing plate 15 is attached to the circuit board 14 by a heat conductive adhesive.
The lens barrel 16 is a hollow cylinder, and may be a cube, a cuboid, a cylinder, or other suitable structure. The lens barrel 16 is disposed on a side surface of the circuit board 14 where the light source 12 is assembled, and the light source 12 is housed in the lens barrel 16. The lens barrel 16 includes a first end 160 connected to the circuit board 14 and a second end 162 disposed opposite the first end 160. The first end 160 is fixed to the circuit board 14 by dispensing. A receiving groove 164 is correspondingly formed at the second end 162 away from the circuit board 14 for mounting the optical element 17 and the protective cover 18. The lens barrel 16 may be made of one or more of heat conductive ceramics, plastics or alloy materials by integral molding through injection molding or compression molding, or may be made by separately processing into several parts and then combining them. In the present embodiment, the optical element 17 is a DOE.
Referring to fig. 4 and 5, a second embodiment of the present application provides a sensing device 2 for sensing three-dimensional information of a target object. The three-dimensional information includes, but is not limited to, three-dimensional information of the surface of the measured object, position information of the measured object in space, size information of the measured object, and other three-dimensional information related to the measured object. The sensed spatial information of the object under test can be used to identify the object under test or to construct a three-dimensional model of the object under test.
The sensing device 2 includes the optical projection module 1 and the sensing module 20 provided in the first embodiment. The optical projection module 1 is used for projecting a preset sensing light spot pattern onto a measured target object. The sensing module 20 includes a lens 21, an image sensor 22, and an image analysis processor 23. The image sensor 22 senses the sensing light spot pattern projected onto the target object through the lens 21. The image analysis processor 23 analyzes the sensed sensing light spot pattern to acquire three-dimensional information of the measured object.
In the present embodiment, the sensing device 2 is a three-dimensional face recognition device that senses three-dimensional information of a surface of a measured object and recognizes an identity of the measured object according to the three-dimensional information.
The sensing module 2 analyzes the three-dimensional information of the surface of the detected object according to the shape change of the preset light spot pattern projected on the detected object by the sensed light spot pattern, and performs face recognition on the detected object according to the three-dimensional information.
As shown in fig. 5, the third embodiment of the present application provides a device 3, such as a mobile phone, a notebook, a tablet, a touch interactive screen, a door, a vehicle, a robot, an automatic numerical control machine, and the like. The apparatus 3 comprises at least one sensing device 2 as provided in the second embodiment above. The device 3 is used for correspondingly executing corresponding functions according to the sensing result of the sensing device 2. The corresponding functions include but are not limited to unlocking after identifying the identity of the user, paying, starting a preset application program, avoiding obstacles, and judging any one or more of the emotion and the health condition of the user by utilizing a deep learning technology after identifying the facial expression of the user.
Compared with the prior art, the optical projection module, the sensing device and the equipment provided by the application increase the strength of the circuit board by adopting the laminating reinforcing plate, have the heat dissipation function and are simple and light in structure.
Referring to fig. 6 and 7, the present application further provides an assembly method of the optical projection module 1, in which the optical projection module 1 includes a light source 12, a circuit board 14, a reinforcing plate 15, a lens barrel 16, an optical element 17 disposed on the lens barrel, and a protective cover 18 disposed on a light-emitting side of the optical element 17. The light beam emitted by the light source 12 is modulated by the optical element 17 to form an outgoing light beam with a specific function and is projected. The assembling method comprises the following steps:
in step S01, the optical element 17 is provided on the lens barrel 16. The second end 162 of the lens barrel 16 is provided with a plurality of accommodating grooves 164 corresponding to the optical elements 17 and the protective cover 18, respectively, and the number of the accommodating grooves 164 is determined according to the number of the optical elements 17 to be assembled. The optical element 17 is disposed relatively close to the light source 12 and assembled in the receiving groove 164 close to the first end 160. The optical element 17 is fixed in the corresponding accommodation groove 164 by dispensing. The optical element 17 includes, but is not limited to, one of a collimating element, a beam expanding element, a microlens array, a grating, and a Diffractive Optical Element (DOE), and combinations thereof. If there are a plurality of optical elements 17, they are sequentially assembled into the corresponding accommodating grooves 164 according to the optical path design. In this embodiment, the optical element is a DOE.
In step S02, a protective cover 18 is provided on the lens barrel 16. The protective cover 18 is disposed at the outermost side of the second end 162 of the lens barrel 16 and is assembled in the top accommodation groove 164 of the second end 162. The protective cover 18 is fixed in the corresponding receiving groove 164 by dispensing.
Step S03 is to attach the reinforcing plate 15 to the circuit board 14. The reinforcing plate 15 is attached to the circuit board 14 through a heat-conducting adhesive. The reinforcing plate 15 is used to increase the strength of the circuit board 14, and the reinforcing plate 15 is made of a material with high thermal conductivity, so that the circuit board can be cooled.
In step S04, the passive component 13 and/or the connector 11 are disposed on the circuit board 14. The passive component 13 and/or the connector 11 are mounted at corresponding positions on the circuit board 14 by an SMT process. The operation temperature of the SMT process is high and can reach 260 ℃.
Step S05, disposing the light source 12 on the circuit board 14. The light source 12 is a light emitting chip, fixed on the circuit board 14 by dispensing, and electrically connected with the circuit board 14 by routing.
In step S06, the relative position between the assembled optical element 17 and the lens barrel 16 of the protective cover 18 and the light source 12 on the circuit board 14 is determined by Active Alignment (AA). The active alignment adjusts the position of the lens barrel 16 in real time according to an imaging pattern formed by a light beam emitted by the light source 12 passing through an optical element, and performs positioning according to the relative position of the lens barrel 16 and the circuit board 14 when the optimal imaging pattern is obtained.
In step S07, the lens barrel 16 assembled with the optical element 17 and the protective cover 18, which are positioned on the circuit board 14, is fixed on the circuit board 14 on which the passive element 13 and the light source 12 have been provided by dispensing.
It is understood that steps 01 and 02 of assembling with respect to the lens barrel 16 and steps S03, S04, and S05 of assembling with respect to the circuit board 14 may be simultaneously performed, respectively, to improve efficiency.
Compared with the prior art, the assembling method of the optical projection module 1 provided by the application can be used for assembling the circuit board 14 and the lens barrel 16 which relate to high temperature separately and synchronously, so that the assembling efficiency can be improved, and the risk of damage to the optical element 17 on the lens barrel 16 caused by high-temperature operation can be reduced.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the present application, and any modifications, equivalents and improvements made within the spirit and principle of the present application are intended to be included within the scope of the present application.
Claims (10)
1. The utility model provides an optical projection module for throw the patterning light beam that has preset pattern and carry out three-dimensional sensing to being surveyed on the target object, its includes light source, circuit board, stiffening plate, lens cone and sets up the optical element on the lens cone, the light source sets up on the circuit board and is connected with the circuit board electricity, the stiffening plate laminating is in the another side that circuit board and light source are relative, the lens cone sets up and covers on the side surface that the circuit board was assembled with the light source, optical element aligns with the light source so that the light beam that the light source sent forms the patterning light beam that has preset pattern after optical element's modulation and throws to being surveyed on the target object.
2. The optical projection module as claimed in claim 1, wherein the stiffener is made of a material with high thermal conductivity selected from any one of a steel sheet, a copper sheet and a combination thereof, and is used to increase the strength of the circuit board and dissipate heat from the light source on the circuit board.
3. The optical projection module as claimed in claim 1, further comprising a protective cover plate disposed in the receiving cavity at an end of the lens barrel away from the circuit board and located at a light exit side of the optical element.
4. The optical projection module as claimed in claim 1, further comprising a passive component and a connector, wherein the passive component and the connector are disposed on the circuit board at a portion outside the lens barrel by a surface mount process.
5. The optical projection module of claim 1 wherein the optical element is selected from the group consisting of a collimating element, a beam expanding element, a microlens array, a grating, and a diffractive optical element, and combinations thereof.
6. The optical projection module as claimed in claim 1, wherein the light source includes a semiconductor substrate and a plurality of light emitting units formed on the semiconductor substrate, the light emitting units are distributed on the semiconductor substrate in a two-dimensional lattice form, a reference sub-area exists in the light emitting units, and a product of a ratio of a set of light emitting unit sub-areas having a correlation coefficient greater than or equal to a predetermined threshold with respect to the reference sub-area to all light emitting units and an average value of the correlation coefficients corresponding to the respective light emitting unit sub-areas in the set is greater than or equal to 0.25 and less than 1.
7. The optical projection module of claim 6 wherein: the correlation coefficient is a normalized correlation coefficient, and the preset threshold value of the correlation coefficient is 0.3.
8. A sensing device for sensing three-dimensional information of an object to be measured, comprising a sensing module and the optical projection module according to any one of claims 1 to 7, wherein the sensing module is used for sensing a predetermined pattern projected on the object to be measured by the optical module and acquiring the three-dimensional information of the object to be measured by analyzing an image of the predetermined pattern.
9. An apparatus comprising the sensing device of claim 8, the apparatus performing a corresponding function according to three-dimensional information of an object to be measured sensed by the sensing device.
10. An assembling method of an optical projection module, the optical projection module comprises a light source, a circuit board, a passive element arranged on the circuit board, a reinforcing plate, a lens barrel and an optical element arranged on the lens barrel, the assembling method comprises the following steps:
disposing an optical element on the lens barrel;
attaching the reinforcing plate to the circuit board;
arranging a passive element on the circuit board through a surface mounting process;
arranging a light source on the circuit board;
determining the relative position between the lens barrel assembled with the optical element and the light source on the circuit board through active alignment; and
and fixing the lens barrel assembled with the optical element on the circuit board, which is well positioned on the circuit board, on the circuit board provided with the passive element and the light source through dispensing.
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| CN201811526683.9A CN109683439B (en) | 2018-12-13 | 2018-12-13 | Optical projection module, sensing device, equipment and optical projection module assembling method |
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| CN201811526683.9A CN109683439B (en) | 2018-12-13 | 2018-12-13 | Optical projection module, sensing device, equipment and optical projection module assembling method |
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| CN109683439B (en) | 2024-03-29 |
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