CN208386606U - Framework, in-out box and electronic device - Google Patents

Abstract

The utility model discloses a kind of framework, in-out box and electronic devices.Framework is for installing input and output mould group, framework is an integral molding structure and including ontology, input and output mould group includes laser projection mould group, visual light imaging mould group and infrared imaging mould group, ontology includes opposite the first face and the second face, second face offers accommodating chamber, first face offers the through-hole being connected to accommodating chamber, input and output mould group is housed in accommodating chamber and exposes from through-hole, accommodating chamber includes the first chamber being arranged successively, second chamber and third chamber, first chamber is for installing infrared imaging mould group, second chamber is for installing visual light imaging mould group, third chamber is for installing laser projection mould group.In the framework of the utility model, in-out box and electronic device, since framework is integrally formed, laser projection mould group, visual light imaging mould group and infrared imaging mould group are mounted in the same framework, and the relative position of three will not change, thus preferably cooperating.

Description

Framework, in-out box and electronic device

Technical field

The utility model relates to consumer electronics technical fields, more specifically, are related to a kind of framework, in-out box And electronic device.

Background technique

In the related art, electronic device usually utilizes laser projection mould group to target object projective structure light, then sharp It is acquired by the modulated laser of target object with image acquiring device (such as infrared camera) to obtain the depth map of target object Picture, therefore the depth image of electronic device acquisition target object generally requires multiple functional module groups and cooperates, however work as some When the position of functional module group changes so that the relative position of the functional module group and other functional module groups change without It can be well matched with work, such as obtained depth image precision is lower.

Utility model content

The utility model embodiment provides a kind of framework, in-out box and electronic device.

For installing input and output mould group, the framework is an integral molding structure simultaneously the framework of the utility model embodiment Including ontology, the input and output mould group includes laser projection mould group, visual light imaging mould group and infrared imaging mould group, and described Body includes opposite the first face and the second face, and second face offers accommodating chamber, and first face offers and the receiving The through-hole of chamber connection, the input and output mould group are housed in the accommodating chamber and expose from the through-hole, the accommodating chamber packet Including the first chamber, the second chamber and third chamber being arranged successively, first chamber is for installing the infrared imaging mould group, and described second Chamber is for installing the visual light imaging mould group, and the third chamber is for installing the laser projection mould group.

In some embodiments, the through-hole includes first through hole, the second through-hole and third through-hole, and described first is logical Hole, second through-hole and the third through-hole are connected to first chamber, second chamber and the third chamber respectively.

In some embodiments, the first through hole, second through-hole, the third through-hole center be located at it is same On straight line.

In some embodiments, second face offers first separate space, described in first separate space interval One chamber and second chamber.

In some embodiments, second face offers second separate space, described in second separate space interval Two chambers and the third chamber.

In some embodiments, the framework offers the first locating slot in the side wall of the first through hole, and described A positioning groove is used to limit the installation site of the infrared imaging mould group.

In some embodiments, the framework offers the second locating slot in the side wall of second through-hole, and described Two locating slots are used to limit the installation site of the visual light imaging mould group.

In some embodiments, the ontology includes side wall, and the side wall connects first face and second face, The side wall includes opposite side wall and downside wall, and the side wall offers scarce in position corresponding with the third chamber Mouthful.

In some embodiments, framework location hole is offered on first face, the framework location hole is for positioning The installation site of the framework.

The in-out box of the utility model embodiment includes:

Input and output mould group, the input and output mould group include laser projection mould group, visual light imaging mould group and it is infrared at As mould group；With

Framework described in any of the above-described embodiment, the infrared imaging mould group be mounted on it is described first intracavitary, it is described can Light-exposed imaging modules are mounted on described second intracavitary, and it is intracavitary that the laser projection mould group is mounted on the third.

The electronic device of the utility model embodiment includes:

Shell；With

In-out box described in above embodiment, the in-out box are mounted in the shell.

In some embodiments, the electronic device further includes being fixed on the intracorporal mainboard of the shell, and the input is defeated Depanning group is electrically connected with the mainboard, and the mainboard is formed with installing port, the framework wear the installing port and with the master Plate is fixedly connected.

In some embodiments, the shell includes front housing and rear shell, the front housing and the rear shell respectively with it is described First face and second face offset to clamp the framework.

In some embodiments, the in-out box further include receiver, infrared light compensating lamp, proximity sensor and Optical flame detector, the electronic device further include the flexible circuit board of installation on the housing, the receiver, the infrared light filling Lamp, the proximity sensor and the optical flame detector are installed on the flexible circuit board.

In some embodiments, the flexible circuit board includes first segment, second segment and linkage section, and the linkage section connects The first segment and the second segment are connect, the first segment is arranged in parallel with the second segment, and the infrared light compensating lamp described connects Nearly sensor and the optical flame detector are both connected on the first segment, and the receiver is connected on the second segment.

In some embodiments, the receiver, the infrared light compensating lamp, the proximity sensor and the optical flame detector It is respectively positioned on the side opposite with second chamber of first chamber；Or it is the receiver, the infrared light compensating lamp, described close Sensor and the optical flame detector are respectively positioned on the side opposite with second chamber of the third chamber.

In some embodiments, the electronic device further includes cover board, the cover board and the input and output mould splits Not Wei Yu the front housing opposite two sides, the front housing offer the first perforation, second perforation and third perforation, described first wears Hole is corresponding with the infrared imaging mould group, and second perforation is corresponding with the visual light imaging mould group, the third perforate and The laser projection mould group is corresponding, the cover board be formed with first perforation and third perforation corresponding position it is infrared Cross ink.

In the framework of the utility model, in-out box and electronic device, since framework is integrally formed, laser projection mould Group, visual light imaging mould group and infrared imaging mould group are mounted in the same framework, and the relative position of three will not change To preferably cooperating.

The additional aspect and advantage of the embodiments of the present invention will be set forth in part in the description, partially will be from Become obvious in following description, or is recognized by the practice of the embodiments of the present invention.

Detailed description of the invention

In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment It will be apparent and be readily appreciated that, in which:

Fig. 1 is the perspective exploded view of the electronic device of the utility model embodiment；

Fig. 2 is the plane assembling schematic diagram of the in-out box of the utility model embodiment；

Fig. 3 is the plane assembling schematic diagram at another visual angle of the in-out box in Fig. 2；

Fig. 4 is the perspective exploded view of the in-out box in Fig. 2；

Fig. 5 is the perspective exploded view at another visual angle of the in-out box in Fig. 2；

Fig. 6 is the plane assembling schematic diagram of the in-out box of the utility model embodiment；

Fig. 7 is the flexible circuit board of the electronic device of the utility model embodiment, receiver, infrared light compensating lamp, approaches The three-dimensional assembling schematic diagram of sensor and optical flame detector；

Fig. 8 is the partial structure diagram of the electronic device of the utility model embodiment；

Fig. 9 to Figure 12 is that the part-structure of the laser projection mould group of the in-out box of the utility model embodiment shows It is intended to.

Specific embodiment

The embodiments of the present invention is described further below in conjunction with attached drawing.Same or similar label in attached drawing Same or similar element or element with the same or similar functions are indicated from beginning to end.

In addition, the embodiments of the present invention described with reference to the accompanying drawing is exemplary, it is only used for explaining this reality With novel embodiment, and should not be understood as limiting the present invention.

In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down " It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.

Referring to Fig. 1, the electronic device 100 of the utility model embodiment includes shell 10, mainboard 20 and input and output Component 30.Electronic device 100 can be mobile phone, tablet computer, laptop computer, game machine, head and show equipment, access control system, teller Machine etc., the utility model embodiment are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the tool of electronic device 100 Body form can be other, and this is not restricted.

Referring to Fig. 1, shell 10 can be used as the installation carrier of mainboard 20 and in-out box 30, shell 10 can be given Mainboard 20 and in-out box 30 provide the protection of dust-proof, waterproof, shatter-resistant, and display screen, electricity are also equipped on shell 10 The components such as pond.Shell 10 include front housing 11 and rear shell 12, front housing 11 be combined with each other with rear shell 12 and by mainboard 20 and input it is defeated Component 30 is housed between front housing 11 and rear shell 12 out, and front housing 11 and rear shell 12 can be using materials such as stainless steel, aluminium alloy, plastics Material is made.

Referring to Fig. 1, mainboard 20 is fixed in shell 10, specifically, mainboard 20 can be solid by the modes such as screwing togather, engaging It is scheduled in front housing 11 or rear shell 12.Mainboard 20 can be connect with each input and output mould group 31 (such as Fig. 3) of in-out box 30, Processing chip, the control chip etc. of electronic device 100 can also be connected on mainboard 20, the route being laid on mainboard 20 can be used for Transmission telecommunications number.Installing port is formed on mainboard 20, installing port is passed through for in-out box 30, reduces mainboard 20 and input is defeated Component 30 is mounted on the space occupied when in shell 10 out.

It please refers to Fig.1 to Fig.3, in-out box 30 is mounted in shell 10, and in-out box 30 includes that input is defeated Depanning group 31 and framework 32, input and output mould group 31 are mounted in framework 32.

Input and output mould group 31 can outwardly issue signal and perhaps receive extraneous signal or be provided simultaneously with outwardly It issues signal and receives the function of extraneous signal, wherein signal can be light signal, voice signal, touch signal etc..It can To understand, according to the different function demand of electronic device 100, the specific type of input and output mould group 31 and every kind of input and output mould The quantity of group 31 can be varied.

In the utility model embodiment, input and output mould group 31 includes infrared imaging mould group 311, visual light imaging mould group 312 and laser projection mould group 313.Wherein, laser projection mould group 313 can be used for the projection of the target object outside electronic device 100 Laser pattern, laser can be infrared laser, and it is red to generate that infrared imaging mould group 311 can be used for receiving extraneous infrared signal Outer image, in one example, infrared imaging mould group 311 can receive laser projection mould group 313 transmitting and it is anti-by target object The laser pattern to be formed is penetrated, laser projection mould group 313 and infrared imaging mould group 311 are provided commonly for obtaining the depth letter of target object Breath.Visual light imaging mould group 312 can receive extraneous visible light signal to generate color image, infrared imaging mould group 311, visible Light imaging modules 312 and laser projection mould group 313 can also be provided commonly for obtaining the depth image of target user, input and output mould Connector 33 can be set in group 31, connector 33 is inserted on mainboard 20 on specific attachment base, with electrical property and machine Tool connects input and output mould group 31 and mainboard 20, by connector 33 extracted from attachment base then can by input and output mould group 31 with Mainboard 20 separates and disconnects electric connection between the two.

It please refers to Fig.1 to Fig.3, framework 32 is an integral molding structure, and framework 32 is for installing input and output mould group 31.Framework 32 include ontology 321.

Ontology 321 includes the first face 3211, the second face 3212 and side wall 3213.3212 phase of first face 3211 and the second face Back, side wall 3213 connect the first face 3211 and the second face 3212, and side wall 3213 includes opposite side wall 3214 and downside wall 3215.When in-out box 30 to be mounted in shell 10, front housing 11 can offset with the first face 3211, and rear shell 12 can be with It offsets with the second face 3212 to clamp framework 32, avoids framework 32 and input and output mould group 31 along the thickness side of electronic device 100 It is mobile to (Z-direction as shown in figure 1), meanwhile, the installation corresponding with the position of the installing port of mainboard 20 of framework 32, the side wall of framework 32 3213 can offset with the inner wall of installing port, so that framework 32 is stuck in installing port, it is only necessary to fix the position of mainboard 20, just It is mobile along the width direction (Y-direction as shown in figure 1) of electronic device 100 to can avoid framework 32 and input and output mould group 31.

Incorporated by reference to Fig. 4 and Fig. 5, the second face 3212 offers accommodating chamber 322, and accommodating chamber 322 is located at side wall 3214 and bottom Between side wall 3215.First face 3211 offers through-hole 323 corresponding with accommodating chamber 322.Accommodating chamber 322 is defeated for accommodating input Depanning group 31.The concrete shape of accommodating chamber 322 is corresponding with the shape of corresponding input and output mould group 31, the cavity of accommodating chamber 322 Can be slightly larger than input and output mould group 31 in order to the dispensing in accommodating chamber 322, the cavity of accommodating chamber 322 also can be slightly less than defeated Enter to export mould group 31 so that input and output mould group 31 can be mounted in accommodating chamber 322 by interference fit.Accommodating chamber 322 it is specific Quantity can also be equal with the particular number of input and output mould group 31.It is defeated when input and output mould group 31 is mounted in framework 32 Enter to export mould group 31 from the exposure of through-hole 323.Specifically, accommodating chamber 322 includes the first chamber 3221, the second chamber 3222 being arranged successively With third chamber 3223.On the length direction along framework 32, it can be understood as the first chamber 3221, the second chamber 3222 and third chamber 3223 array from left to right, it is understood that for the first chamber 3221, the second chamber 3222 and third chamber 3223 from right to left according to Secondary arrangement.First chamber 3221 is used to install visual light imaging mould group 312 for installing infrared imaging mould group 311, the second chamber 3222, Third chamber 3223 is for installing laser projection mould group 313.It in other words, can be by infrared imaging mould group 311, visual light imaging mould Group 312 and laser projection mould group 313 are sequentially arranged at the first chamber 3221, the second chamber 3222, third chamber 3223.Multiple accommodating chambers 322 can be apart from one another by, for example, the first chamber 3221, the second chamber 3222 and third chamber 3223 pass through between separate space 324 (such as Fig. 3) successively Interval, the accommodating chamber 322 for being also possible to any two or three etc. interconnects, such as the first chamber 3221 and the second chamber 3222 Connection, the second chamber 3222 are spaced with third chamber 3223.

Through-hole 323 includes first through hole 3231, the second through-hole 3232 and third through-hole 3233, first through hole 3231, second Through-hole 3232 and third through-hole 3233 are connected to the first chamber 3221, the second chamber 3222 and third chamber 3223 respectively, in other words, the One through-hole 3231 is connected to the first chamber 3221, and the second through-hole 3232 is connected to the second chamber 3222, third through-hole 3233 and third chamber 3223 connections.The center of first through hole 3231, the second through-hole 3232 and third through-hole 3233 is located on same straight line L (such as Fig. 2). Infrared imaging mould group 311, visual light imaging mould group 312 and laser projection mould group 313 installation after, infrared imaging mould group 311 from The exposure of first through hole 3231, it is seen that for light imaging modules 312 from the exposure of the second through-hole 3232, laser projection mould group 313 is logical from third The exposure of hole 3233, the optical axis of three is in the same plane, and is easy to three and works in coordination work.Infrared imaging mould group 311, laser The top surface of projective module group 313 and visual light imaging mould group 312 flushes, specifically, incidence surface, the laser of infrared imaging mould group 311 The light-emitting surface of projective module group 313 and the incidence surface of visual light imaging mould group 312 can be in approximately the same plane.It is practical at this In novel embodiment, exposure refers to see input and output mould group 31, example from the first face 3211 or from the second face 3212 Such as, input and output mould group 31 can pass through the through-hole 323 in the first face 3211 and expose from the first face 3211, input and output mould group 31 Through-hole 323 can also not be passed through, but by through-hole 323 it can be seen that input and output mould group 31.

To sum up, the electronic device 100 of the utility model embodiment, since framework 32 is integrally formed, infrared imaging mould group 311, visual light imaging mould group 312 and laser projection mould group 313 are mounted in the same framework 32, and the relative position of three will not It changes, thus preferably cooperating.In addition, multiple input and output mould groups 31 are housed in the accommodating chamber of framework 32 together In 322, and do not have to the multiple frameworks of setting to fix multiple input and output mould groups 31, saves the installation inside electronic device 100 Space.

Fig. 3 and Fig. 5 are please referred to, in some embodiments, the second face 3212 offers first separate space 3241, between first Separate space 3241 is spaced the first chamber 3221 and the second chamber 3222.Specifically, ontology 321 further includes multiple spaced walls 3216.Side wall 3214, a separate space 324 is collectively formed in downside wall 3215 and spaced walls 3216.Between separate space 324 include first separate space 3241.Red After outer imaging modules 311 and visual light imaging mould group 312 are mounted in framework 32, first separate space 3241 is spaced infrared imaging mould Group 311 and visual light imaging mould group 312.

Please continue to refer to Fig. 3 and Fig. 5, in some embodiments, the second face 3212 offers second separate space 3242, the Two separate spaces 3242 are spaced the second chamber 3222 and third chamber 3223.Specifically, ontology 321 further includes multiple spaced walls 3216.Top A separate space 324 is collectively formed in side wall 3214, downside wall 3215 and spaced walls 3216.Between separate space 324 include second separate space 3242. After visual light imaging mould group 312 and laser projection mould group 313 are mounted on framework 32, second separate space 3242 be spaced visible light at As mould group 312 and laser projection mould group 313.

Fig. 3 and Fig. 6 are please referred to, in some embodiments, first separate space 3241 and second in above embodiment Between separate space 3242 be provided with heat sink material 325.Since the heat generated when input and output mould group 31 works compares concentration, it is easy to make Temperature drift is generated at some optical elements of input and output mould group 31, influences the precision of input and output mould group 31.In addition, input and output Mould group 31 is chronically at hot environment, shortens the service life of input and output mould group 31.In first separate space 3241 and second Between heat sink material 325 is set in separate space 3242, while can be that single input and output mould group 31 radiates, moreover it is possible to reduce adjacent two The heat that a input and output mould group 31 generates influences each other.In the present embodiment, heat sink material 325 can for heat-conducting silicone grease, Heat-conducting metal (such as silver, copper, gold etc.) can also be ceramic material.When heat sink material 325 is heat-conducting silicone grease, heat sink material 325 can be laid on the second face 3212 and the surface of spaced walls 3216.When heat sink material 325 is heat-conducting metal, radiate material Material 325 can be laid on the second face 3212 and the surface of spaced walls 3216 in the form of single layer or multilayer, for example, silver layer, Layers of copper is alternately laid with.When heat sink material 325 is ceramic material, heat sink material 325 can fill it is completely entire between separate space 324.

Fig. 4 and Fig. 5 are please referred to, in some embodiments, framework 32 offers first in the side wall of first through hole 3231 Locating slot 3217, the first locating slot 3217 are used to limit the installation site of infrared imaging mould group 311.Specifically, infrared imaging mould Group 311 includes the first protrusion 3111 for being formed in lens barrel periphery.The position of first locating slot 3217 and quantity and the first protrusion The position in portion 3111 and quantity are corresponding.The quantity of first protrusion 3111 can be one or more, and in the present embodiment, first is convex The quantity in portion 3111 is two out, and the lens barrel periphery that two the first protrusions 3111 are formed in infrared imaging mould group 311 is opposite Two sides, the quantity of the first locating slot 3217 is also two, and two the first locating slots 3217 are provided with first through hole respectively On the side wall of 3231 opposite sides.The first chamber 3221 is mounted in infrared imaging mould group 311 and is exposed from first through hole 3231 When, the first locating slot 3217 engages with the first protrusion 3111 to indicate to be installed in place.

Fig. 4 and Fig. 5 are please referred to, in some embodiments, framework 32 offers second in the side wall of the second through-hole 3232 Locating slot 3218, the second locating slot 3218 are used to limit the installation site of visual light imaging mould group 312.Specifically, it is seen that light at As mould group 312 includes the second protrusion 3121 for being formed in lens barrel periphery.The position of second locating slot 3218 and quantity and second The position of protrusion 3121 and quantity are corresponding.The quantity of second protrusion 3121 can be one or more, in the present embodiment, The quantity of two protrusions 3121 is two, and two the second protrusions 3121 are formed in the lens barrel week of visual light imaging mould group 312 The opposite two sides of edge, the quantity of the second locating slot 3218 are also two, and two the second locating slots 3218 are provided with second respectively On the side wall of the opposite sides of through-hole 3232.The second chamber 3222 is mounted in visual light imaging mould group 312 and from the second through-hole When 3232 exposure, the second locating slot 3218 engages with the second protrusion 3121 to indicate to be installed in place.

Fig. 3 and Fig. 5 are please referred to, in some embodiments, side wall 3214 is opened in position corresponding with third chamber 3223 Equipped with notch 3219.Since the space of third chamber 3223 is smaller, therefore can be corresponding with third chamber 3223 in side wall 3214 Position opens up notch 3219.In the lesser laser projection mould group 313 of installation volume, it is convenient for the dispensing in third chamber 3223.Please In conjunction with Fig. 1, when the framework 32 that will install input and output mould group 31 is installed on the housing 10, the projective structure of shell 10 is protruded into Notch 3219, to limit the installation site of framework 32.

Fig. 2 and Fig. 4 are please referred to, in some embodiments, offers framework location hole 326, framework on the first face 3211 Location hole 326 is used for the installation site of positioning frame body 32.Specifically, the quantity of framework location hole 326 can be one or more, In the present embodiment, the quantity of framework location hole 326 is two, and two framework location holes 326 are provided with the diagonally opposing corner of ontology 321 Position.It is corresponding, incorporated by reference to Fig. 1, it can be protruded on front housing 11 and be formed with front case locating pole 114, when the first face 3211 is with before When shell 11 offsets, front case locating pole 114 protrudes into framework location hole 326 and cooperates with framework location hole 326, is positioned by front housing The cooperation of column 114 and framework location hole 326 can quick positioning frame body 32 installation site, and further avoid framework 32 in shell It is shaken in body 10.

Fig. 1 and Fig. 7 are please referred to, in some embodiments, in-out box 30 further includes receiver 35, infrared light filling Lamp 36, proximity sensor 37 and optical flame detector 38, electronic device 100 further include the flexible circuit board 34 of installation on the housing 10, by Words device 35, infrared light compensating lamp 36, proximity sensor 37 and optical flame detector 38 are installed on flexible circuit board 34.Specifically, called Device 35 sends out sound wave under the action of driving signal and realizes the functions such as call.Infrared light compensating lamp 36 is infrared for launching outward Light, the distance that proximity sensor 37 is used to detect target object to electronic device 100, optical flame detector 38 is for detecting the strong of environment light Degree.Under front housing 11 and the clamping action of rear shell 12, flexible circuit board 34 is fixed on the inside of shell 10.Flexible circuit board 34 One end may be coupled on mainboard 20.Receiver 35, infrared light compensating lamp 36, proximity sensor 37 and optical flame detector 38 can pass through Same 34 electrically connected mainboard 20 of flexible circuit board, in this way, the overall structure of in-out box 30 is more simple and compact.

Referring to Fig. 7, in some embodiments, flexible circuit board 34 includes first segment 341, second segment 342 and connection Section 343.Linkage section 343 connects first segment 341 and second segment 342, and first segment 341 is arranged in parallel with second segment 342.Infrared light filling Lamp 36, proximity sensor 37 and optical flame detector 38 are arranged on first segment 341, and receiver 35 is arranged on second segment 342.Second It could be formed with contact 344 in section 342.Receiver 35 includes the sound mouth 351 and connection bullet positioned at the opposite two sides of receiver 35 Piece (not shown), connection elastic slice are protruded along the direction of the sound mouth 351 far from receiver 35.Connection elastic slice is supported with contact 344 Touching is to be electrically connected receiver 35 and flexible circuit board 34.In one example, the contact 344 on flexible circuit board 34 can have more Group, connection elastic slice is contradicted with any one group of contact 344 can be electrically connected receiver 35 and mainboard 20.

Fig. 5 and Fig. 7 are please referred to, in some embodiments, receiver 35, infrared light compensating lamp 36,37 and of proximity sensor Optical flame detector 38 is respectively positioned on the side opposite with the second chamber 3222 of the first chamber 3221.It is appreciated that in the side along 32 length of framework Upwards, be equipped with receiver 35, infrared light compensating lamp 36, proximity sensor 37 and optical flame detector 38 flexible circuit board 34, it is infrared at As mould group 311, visible optical mode group 312 and laser projection mould group 313 are arranged successively.Alternatively, receiver 35, infrared light compensating lamp 36, Proximity sensor 37 and optical flame detector 38 are respectively positioned on the side opposite with the second chamber 3222 of third chamber 3223, at this point, along framework On the direction of 32 length, infrared imaging mould group 311, visible optical mode group 312, laser projection mould group 313 and be equipped with receiver 35, The flexible circuit board 34 of infrared light compensating lamp 36, proximity sensor 37 and optical flame detector 38 is arranged successively.

Fig. 1 and Fig. 8 are please referred to, in some embodiments, electronic device 100 further includes cover board 40, cover board 40 and input Output mould group 31 is located at the opposite two sides of front housing 11.Front housing 11 offers the first perforation 111, second perforation 112 and third Perforation 113.First perforation 111 is corresponding with infrared imaging mould group 311, and the second perforation 112 is corresponding with visual light imaging mould group 312, Third perforation 113 is corresponding with laser projection mould group 313.Cover board 40 is respectively corresponding with the first perforation 111 and third perforation 113 Place is formed with infrared through ink 50.

Specifically, cover board 40 can be light transmission, and the material of cover board 40 can be the glass of light transmission, resin, plastics etc..Lid First perforation of the covering of plate 40,111, second perforation 112 and third perforation 113.Ambient is perforated after passing through cover board 40 by first 111 enter infrared imaging mould group 311.Ambient enters visual light imaging mould group by the second perforation 112 after cover board 40 312.The laser that laser projection mould group 313 issues is pierced by cover board 40 after passing through third perforation 113.In the present embodiment, cover board 40 It is infrared through ink 50 being formed with the first perforation 111 and 113 corresponding positions of third perforation.The infrared ink 50 that penetrates is to infrared light Have higher transmitance, such as can reach 85% or more, and have higher attenuation rate to visible light, for example, can reach 70% with On, so that user is during normal use, visually it is difficult to see that on electronic device 100 by the infrared region covered through ink 50. In this way, user is difficult to see that the internal structure of electronic device 100 (is difficult to see that by the first perforation 111 and third perforation 113 Infrared imaging mould group 311 and laser projection mould group 313), the shape of electronic device 100 is more beautiful.

Referring to Fig. 9, in some embodiments, laser projection mould group 313 include board unit 3131, lens barrel 3132, Light source 3133, collimating element 3134, diffraction optical element (diffractive optical elements, DOE) 3135 and guarantor Protecting cover 3136.

Board unit 3131 includes substrate 31311 and circuit board 31312.Circuit board 31312 is arranged on substrate 31311, Circuit board 31312 is used to connect the mainboard 20 of light source 3133 Yu electronic device 100, circuit board 31312 can be hardboard, soft board or Rigid Flex.

Lens barrel 3132 is fixedly connected with board unit 3131, and lens barrel 3132 is formed with accommodating cavity 31321, and lens barrel 3132 includes The peripheral wall 31324 of roof 31322 and the annular extended from roof 31322, peripheral wall 31324 are arranged on board unit 3131, top Wall 31322 offers the light hole 31325 being connected to accommodating cavity 31321.Peripheral wall 31324 can pass through viscous with circuit board 31312 Glue connection.

Protection cap 3136 is arranged on roof 31322.Protection cap 3136 includes the baffle for offering out light through-hole 31360 31362 and from baffle 31362 extend annular sidewall 31364.

Light source 3133 and collimating element 3134 are arranged in accommodating cavity 31321, and diffraction optical element 3135 is mounted on mirror On cylinder 3132, collimating element 3134 and diffraction optical element 3135 are successively set in the luminous optical path of light source 3133.Collimation member The laser that part 3134 issues light source 3133 collimates, and laser is then passed through diffraction optical element after passing through collimating element 3134 3135 to form laser pattern.

Light source 3133 can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) or edge-emitting laser (edge-emitting laser, EEL), in embodiment as shown in Figure 9, Light source 3133 is edge-emitting laser, and specifically, light source 3133 can be distributed feedback laser (Distributed Feedback Laser, DFB).Light source 3133 is for emitting laser into accommodating cavity 31321.Incorporated by reference to Figure 10, light source 3133 is whole Body is in the form of a column, and an end face of the light source 3133 far from board unit 3131 forms light-emitting surface 31331, and laser is from light-emitting surface 31331 It issues, light-emitting surface 31331 is towards collimating element 3134.Light source 3133 is fixed on board unit 3131, specifically, light source 3133 It can be bonded on board unit 3131 by sealing 3137, such as the one side opposite with light-emitting surface 31331 of light source 3133 is viscous It connects on board unit 3131.Incorporated by reference to Fig. 9 and Figure 11, the side 31332 of light source 3133 can also be bonded in board unit On 3131, sealing 3137 wraps the side 31332 of surrounding, can also only bond some face and the substrate in batch of side 31332 Part 3131 bonds certain several face and board unit 3131.Sealing at this time 3137 can be heat-conducting glue, and light source 3133 is worked The heat of generation is conducted into board unit 3131.

Referring to Fig. 9, diffraction optical element 3135 is carried on roof 31322 and is housed in protection cap 3136.Diffraction The opposite two sides of optical element 3135 are contradicted with protection cap 3136 and roof 31322 respectively, and baffle 31362 includes close to light hole 31325 resistance surface 31363, diffraction optical element 3135 and resistance surface 31363 contradict.

Specifically, diffraction optical element 3135 includes opposite the diffraction plane of incidence 31352 and diffraction exit facet 31354.Spread out Optical element 3135 is penetrated to be carried on roof 31322, the close light hole 31325 of diffraction exit facet 31354 and baffle 31362 Surface (resistance surface 31363) contradicts, and the diffraction plane of incidence 31352 and roof 31322 contradict.Light hole 31325 and accommodating cavity 31321 Alignment, light through-hole 31360 is aligned with light hole 31325 out.Roof 31322, annular sidewall 31364 and baffle 31362 and diffraction Optical element 3135 contradicts, to prevent diffraction optical element 3135 from falling off out of protection cap 3136 along light direction.Certain In embodiment, protection cap 3136 is pasted on roof 31322 by glue.

The light source 3133 of above-mentioned laser projection mould group 313 use edge-emitting laser, one side edge-emitting laser compared with The temperature drift of VCSEL array is smaller, on the other hand, since edge-emitting laser is single-point light emitting structure, is not necessarily to array of designs structure, Production is simple, and the cost of light source of laser projection mould group 313 is lower.

The laser of distributed feedback laser obtains the gain of power by the feedback of optical grating construction when propagating.It mentions The power of high distributed feedback laser is needed by increasing Injection Current and/or increasing the length of distributed feedback laser, Since increase Injection Current can make the power consumption of distributed feedback laser increase and serious problem of generating heat occurs, In order to guarantee that distributed feedback laser can work normally, needs to increase the length of distributed feedback laser, cause to be distributed Feedback laser is generally in elongate strip structure.When the light-emitting surface 31331 of edge-emitting laser is towards collimating element 3134, side Emitting laser is placed in vertical, and since edge-emitting laser is in elongate strip structure, edge-emitting laser, which is easy to appear, to be fallen, moves Position or shaking etc. are unexpected, therefore can be fixed edge-emitting laser by the way that sealing 3137 is arranged, and prevent edge-emitting laser Fall, be displaced or shake etc. and is unexpected.

Fig. 9 and Figure 12 are please referred to, in some embodiments, light source 3133 can also be using fixation side as shown in figure 12 Formula is fixed on board unit 3131.Specifically, laser projection mould group 313 includes multiple supporting blocks 3138, and supporting block 3138 can To be fixed on board unit 3131, the common ambient light source 3133 of multiple supporting blocks 3138 during installation can be by light source 3133 It is directly installed between multiple supporting blocks 3138.In one example, the clamping light source 3133 jointly of multiple supporting blocks 3138, with into One step prevents light source 3133 from shaking.

In some embodiments, protection cap 3136 can be omitted, and diffraction optical element 3135, which can be set, at this time is holding It sets in chamber 31321, the diffraction exit facet 31354 of diffraction optical element 3135 can offset with roof 31322, and laser passes through diffraction Light hole 31325 is pierced by after optical element 3135 again.In this way, diffraction optical element 3135 is not easily to fall off.

In some embodiments, substrate 31311 can save, and light source 3133 can be directly anchored to circuit board 31312 On to reduce the integral thickness of laser projection mould group 313.

In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment of the utility model or show In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And And particular features, structures, materials, or characteristics described can be in any one or more embodiments or example to close Suitable mode combines.

In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one described feature.The meaning of " plurality " is at least two, such as two in the description of the present invention, It is a, three, unless otherwise specifically defined.

Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model It inside can make changes, modifications, alterations, and variations to the above described embodiments, the scope of the utility model is by claim and its is equal Object limits.

Claims (17)

1. a kind of framework, which is characterized in that for installing input and output mould group, the framework is an integral molding structure and including this Body, the input and output mould group include that laser projection mould group, visual light imaging mould group and infrared imaging mould group, the ontology include Opposite the first face and the second face, second face offer accommodating chamber, and first face is offered to be connected to the accommodating chamber Through-hole, the input and output mould group is housed in the accommodating chamber and from through-hole exposure, and the accommodating chamber includes successively The first chamber, the second chamber and the third chamber of arrangement, for installing the infrared imaging mould group, second chamber is used for first chamber The visual light imaging mould group is installed, the third chamber is for installing the laser projection mould group.

2. framework according to claim 1, which is characterized in that the through-hole includes first through hole, the second through-hole and third Through-hole, the first through hole, second through-hole and the third through-hole respectively with first chamber, second chamber and described The connection of third chamber.

3. framework according to claim 2, which is characterized in that the first through hole, second through-hole, the third are logical The center in hole is located along the same line.

4. framework according to claim 1, which is characterized in that second face offers first separate space, and described first Between the first chamber and second chamber described in separate space interval.

5. framework according to claim 4, which is characterized in that second face offers second separate space, and described second Between the second chamber and the third chamber described in separate space interval.

6. framework according to claim 2, which is characterized in that the framework offers in the side wall of the first through hole A positioning groove, first locating slot are used to limit the installation site of the infrared imaging mould group.

7. framework according to claim 6, which is characterized in that the framework offers in the side wall of second through-hole Two locating slots, second locating slot are used to limit the installation site of the visual light imaging mould group.

8. framework according to claim 1, which is characterized in that the ontology includes side wall, side wall connection described the On one side with second face, the side wall includes opposite side wall and downside wall, the side wall with the third chamber pair The position answered opens up jagged.

9. framework according to claim 1, which is characterized in that offer framework location hole, the frame on first face Body location hole is used to position the installation site of the framework.

10. a kind of in-out box characterized by comprising

Input and output mould group, the input and output mould group include laser projection mould group, visual light imaging mould group and infrared imaging mould Group；With

Framework described in any one of claim 1-9, the infrared imaging mould group be mounted on it is described first intracavitary, it is described visible Light imaging modules are mounted on described second intracavitary, and it is intracavitary that the laser projection mould group is mounted on the third.

11. a kind of electronic device characterized by comprising

Shell；With

In-out box described in any one of claim 10, the in-out box are mounted in the shell.

12. electronic device according to claim 11, which is characterized in that the electronic device further includes being fixed on the shell Intracorporal mainboard, the input and output mould group are electrically connected with the mainboard, and the mainboard is formed with installing port, and the framework is worn It the installing port and is fixedly connected with the mainboard.

13. electronic device according to claim 11, which is characterized in that the shell includes front housing and rear shell, before described Shell and the rear shell offset respectively with first face and second face to clamp the framework.

14. electronic device according to claim 11, which is characterized in that the in-out box further include receiver, Infrared light compensating lamp, proximity sensor and optical flame detector, the electronic device further include the flexible circuit board of installation on the housing, The receiver, the infrared light compensating lamp, the proximity sensor and the optical flame detector are installed on the flexible circuit board.

15. electronic device according to claim 14, which is characterized in that the flexible circuit board includes first segment, second Section and linkage section, the linkage section connect the first segment and the second segment, and the first segment is parallel with the second segment to be set It sets, the infrared light compensating lamp, the proximity sensor and the optical flame detector are both connected on the first segment, and the receiver connects It connects on the second segment.

16. electronic device according to claim 14 or 15, which is characterized in that the receiver, the infrared light compensating lamp, The proximity sensor and the optical flame detector are respectively positioned on the side opposite with second chamber of first chamber；Or it is described called Device, the infrared light compensating lamp, the proximity sensor and the optical flame detector are being respectively positioned on the third chamber with the second chamber phase The side of back.

17. electronic device according to claim 16, which is characterized in that the electronic device further includes cover board, the lid Plate is located at the opposite two sides of front housing with the input and output Mo Zu respectively, the front housing offer the first perforation, the second perforation and Third perforation, first perforation is corresponding with the infrared imaging mould group, second perforation and the visual light imaging mould group Corresponding, the third perforation is corresponding with the laser projection mould group, and the cover board is worn with first perforation and the third Hole corresponding position is formed with infrared through ink.