CN207491067U - Double camera modules and its photosensory assembly and electronic equipment - Google Patents

Abstract

Double camera modules and its photosensory assembly and electronic equipment, wherein the photosensory assembly of double camera modules, including：One disjunctor encapsulation part and a photographic department；The photographic department includes a circuit plate body and two sensitive chips, circuit plate body described in the disjunctor encapsulation part integral packaging and each sensitive chip.

Description

Double camera modules and its photosensory assembly and electronic equipment

Technical field

The utility model is related to camera module fields, further, are related to an array camera module and its photosensory assembly.

Background technology

At present, most of electronic product all integrates more functions increasingly, this trend causes gas producing formation transboundary to go out It is not poor, for example, mobile phone be highly integrated via initial communication equipment after form collection communication, camera shooting, online, a navigation etc. Diversification, three-dimensional function are integrated arrival mobile electronic device.

However, the camera module for being configured in mobile electronic device at present is single-lens camera module mostly, this list mirror Head camera module is that all can not meet user in the quality of image or effect to set mobile electron either in shooting Standby multi-functional application demand.

Occur and ever more popular is the camera module for having more than a camera lens, such as twin-lens camera shooting mould Group, twin-lens camera module provides the style of shooting of apish eyes structure, and this twin-lens camera module is in 3D Shooting and scanning, hand gesture location identification, color fidelity, rapid focus, panorama all various aspects such as shooting, background blurring shooting deeply The performance more more excellent than single-lens camera module is suffered from, therefore, the camera module for having more than a camera lens is to image from now on The important directions of the development of module industry.During using twin-lens camera module filmed image, twin-lens camera module Image is obtained from two positions respectively using two imaging modules with differences in spatial location, then according to image combining method After the Image compounding shot respectively to two imaging modules, the final image of more camera lens camera modules is obtained.It is appreciated that It is, in this process, the one of the image effects such as resolving power, shading, color of each imaging modules of more camera lens camera modules Cause property and in horizontal, vertically, longitudinally three directions deviation, is the weight for the image quality for weighing twin-lens camera module Want index.

However, the structure of current stage manufacture, the technique of assembling twin-lens camera module and twin-lens camera module is all remote It can not far ensure the image quality of twin-lens camera module.Fig. 1 shows the twin-lens camera module of the prior art, including one Wiring board 10P, two microscope base 20P and two image-forming module 30P, each image-forming module 30P respectively include a motor camera lens Component 31P.Each microscope base 20P is individually located in the homonymy of the wiring board 10P, and each microscope base 20P passes through The wiring board 10P links together, and each motor lens assembly 31P is separately positioned on each microscope base 20P, with It is supported by each microscope base 20P.It is understood that the packaging technology of the twin-lens camera module from the prior art From the point of view of, each microscope base 20P is individually mounted on the wiring board 10P, so as to lead to each microscope base The more difficult to govern control such as size, position between 20P so that so that size between each twin-lens camera module stent, The consistency of the parameters such as position is poor.From the point of view of the structure of the twin-lens camera module of the prior art, each microscope base Independently, and each microscope base 20P is only attached 20P by the wiring board 10P, due to the wiring board 10P PCB circuit board is usually selected, so that wiring board 10P's is more soft and easily deformable in itself, at this moment, the twin-lens The whole rigidity of camera module is difficult to ensure that, the use process after twin-lens camera module, which is assembled, to be completed In, such structure is easy to cause between each element of the image-forming module 30P, such as the motor lens assembly 31P Relative size is unstable, position of related features is big, and the optical axis of each image-forming module 30P easily deviates preset position etc. and asks The generation of topic, once the appearance of any one of these situations, all can give the twin-lens camera module image quality, such as The final imaging effect such as Image compounding brings uncontrollable factor or larger adverse effect.

In addition, the assembling of more camera lens camera modules is based on traditional COB (Chip On Board chip packages) technique, On the wiring board 10P usually there is the circuit devcie 11P of protrusion, and a sensitive chip 12P, institute are installed on the wiring board It states sensitive chip 12P and the wiring board 10P is usually connected to by gold thread 121P, and usually arc-shaped convex of the gold thread 121P Go out with the circuit plate body, therefore, these protrusion the circuit devcie 11P and the gold thread 121P for camera module Assembling also brings some unfavorable factors.

The circuit devcie 11P and gold thread 21P is directly exposed to the surface of the wiring board 10P, therefore rear During continuous assembling, for example the processes such as the microscope base 20P, the welding motor lens assembly 31P are pasted, inevitably It is affected, solder resist, dust during welding etc. is easily attached to the circuit devcie 11P, and the circuit devcie 11P and institute Sensitive chip 12P is stated to be located in an interconnected space, therefore dust pollutant is easy to influence the sensitive chip 12P, such influence may cause the camera module after assembling to there are the bad phenomenons such as dirty stain, reduce product yield.

Secondly, the microscope base 20P is located at the outside of the circuit devcie 11P, therefore is installing the microscope base 20P and institute When stating wiring board 10P, need to reserve certain safe distance between the microscope base 20P and the circuit devcie 11P, and in water Square to and upwardly direction be required for reserved safe distance, this increases the demand of camera module thickness to a certain extent Amount, makes its thickness be difficult to reduce.

In addition, for the molding of the opposite single camera of the molding of multi-cam, the coordination being related between multiple camera modules Problem requires optical axis consistent between a plurality of lenses, and the consistency of a plurality of lenses optical axis based on traditional COB techniques is rareer To guarantee.And multi-cam module overall volume is larger, it is more sensitive to the intensity and flatness of wiring board, therefore wiring board Thickness is larger.

Utility model content

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein photosensory assembly packet A disjunctor encapsulation part and a photographic department are included, the photographic department includes a circuit plate body and a sensitive chip, the sensitive chip The circuit plate body is connected to by the disjunctor encapsulation part integral packaging.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein the photosensitive core Piece is electrically connected to the circuit plate body by an at least connecting line, and the disjunctor encapsulation part coats the connecting line.

One of the utility model is designed to provide an array camera module and its photosensory assembly and its manufacturing method, Described in sensitive chip there is a photosensitive area and a non-photo-sensing area, the disjunctor encapsulation part extends to the non-photo-sensing area, with to The mouldable region of the interior extension disjunctor encapsulation part, and reduce the outer edge of the photosensory assembly.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein described photosensitive group Part includes a circuit plate body and an at least circuit element, and the circuit element protrudes from the circuit plate body, the circuit Element is coated by the disjunctor encapsulation part, so as to be directly exposed to outside.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein the disjunctor seals Dress portion includes an optical filter construction section, suitable for installing multiple optical filters, without additional independent support member.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein the wiring board Main body has multiple inner groovies, and each sensitive chip is arranged in the inner groovy, in order to reduce the sensitive chip With the relative altitude of the circuit plate body, so as to reduce the requirement for height to the disjunctor encapsulation part.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein the wiring board Main body has multiple accesses and multiple external grooves, and the external groove is communicated in the access, and the external groove is pacified suitable for upside-down mounting Fill the sensitive chip.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein the wiring board Portion includes a reinforcing layer, the wiring board bottom part body is set to lamination, to enhance the structural strength of the circuit plate body And heat dissipation performance.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein described state circuit Plate body has an at least reinforced hole, and the disjunctor encapsulation part extends into the reinforced hole, so as to enhance the line plate body Structural strength.

One of the utility model is designed to provide an array camera module and its photosensory assembly, wherein the disjunctor seals Dress portion includes a camera lens construction section, suitable for installing a plurality of lenses, so as to provide installation site for the camera lens.

In order to realize more than purpose of utility model, the one side of the utility model provides photosensitive group of an array camera module Part, including a disjunctor encapsulation part and a photographic department；The photographic department includes a circuit plate body and at least two sensitive chips, institute It states disjunctor encapsulation part and is molded to the circuit plate body and each sensitive chip.

Another embodiment according to the present utility model, it is logical that disjunctor encapsulation part described in the photosensory assembly forms at least two Hole, each through-hole is opposite with each sensitive chip, to provide the sensitive chip passage of light.

Another embodiment according to the present utility model, each through-hole of disjunctor encapsulation part described in the photosensory assembly Bottom in from the bottom to top gradually it is increased skewed, to increase the light ray flux of the sensitive chip.

Another embodiment according to the present utility model, disjunctor encapsulation part top described in the photosensory assembly are in plane Shape, for installing stent, camera lens, motor or the optical filter of the array camera module.

Another embodiment according to the present utility model, disjunctor encapsulation part top described in the photosensory assembly have at least Two mounting grooves, each mounting groove are communicated in the corresponding through-hole, for install the optical filter of the array camera module, Camera lens or motor.

Another embodiment according to the present utility model, disjunctor encapsulation part described in the photosensory assembly include a cladding Section, an optical filter construction section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively by the packet It covers section and molds extension upwards, and inside is in step-like, in order to install the optical filter and camera lens of the array camera module.

Another embodiment according to the present utility model, optical filter construction section described in the photosensory assembly have at least two Mounting groove is communicated in the corresponding through-hole, forms the first step-like rank, described in order to install the optical filter Camera lens construction section has at least two camera lens mounting grooves, forms the step-like second-order, in order to install the array camera shooting The camera lens of module.

Another embodiment according to the present utility model, camera lens construction section described in the photosensory assembly have at least two mirrors Head inner wall, the camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.

Another embodiment according to the present utility model, photographic department described in the photosensory assembly include at least one connection Line, each connecting line are electrically connected the sensitive chip and the circuit plate body, and the disjunctor encapsulation part coats the connection Line, so that the connecting line will not be directly exposed to outside.

Another embodiment according to the present utility model, connecting line described in the photosensory assembly are selected from combination：Gold thread, silver One kind in line, copper wire or aluminum steel.

Another embodiment according to the present utility model, connecting line described in the photosensory assembly curvedly connect described Circuit plate body and the sensitive chip, to reduce the damage to the connecting line.

Another embodiment according to the present utility model, each sensitive chip includes a photosensitive area in the photosensory assembly With a non-photo-sensing area, the non-photo-sensing area extends to the sense around photosensitive area periphery, the disjunctor encapsulation part molding The non-photo-sensing area of optical chip to extend the inside mouldable range of the disjunctor encapsulation part, reduces the disjunctor encapsulation part Outside Dimensions.

Another embodiment according to the present utility model, photographic department described in the photosensory assembly include an at least circuit elements Part, the circuit element protrude from the circuit plate body, and the disjunctor encapsulation part coats the circuit element, so that described Circuit element will not be directly exposed to outside.

Another embodiment according to the present utility model, the selection combination of circuit element described in the photosensory assembly：Resistance, One or more of which in capacitance, diode, triode, potentiometer, relay and driver.

Another embodiment according to the present utility model, photographic department described in the photosensory assembly filter including at least two Piece, the optical filter are covered in the sensitive chip, and the disjunctor encapsulation part takes shape in the circuit plate body, the photosensitive core Piece and the optical filter in order to protect the sensitive chip by the optical filter, and reduce the array camera module Back focal length reduces its height.

Another embodiment according to the present utility model, photographic department described in the photosensory assembly include a reinforcing layer, institute It states reinforcing layer laminate and is set to the wiring board bottom part body, to enhance the structural strength of the circuit plate body.

Another embodiment according to the present utility model, reinforcing layer described in the photosensory assembly is metallic plate, with enhancing The heat dissipation performance of the photographic department.

Another embodiment according to the present utility model, photographic department described in the photosensory assembly include a shielded layer, institute It states shielded layer and wraps up the circuit plate body and the disjunctor encapsulation part, to enhance the electromagnetism interference of the photosensory assembly Energy.

Another embodiment according to the present utility model, shielded layer described in the photosensory assembly are metallic plate or metal Net.

Another embodiment according to the present utility model, circuit plate body is reinforced at least one in the photosensory assembly Hole, the disjunctor encapsulation part extend into the reinforced hole, in order to enhance the structural strength of the circuit plate body.

Another embodiment according to the present utility model, reinforced hole described in the photosensory assembly are groove-like.

Another embodiment according to the present utility model, reinforced hole described in the photosensory assembly is through-hole, so that institute The moulding material and the circuit plate body for stating disjunctor encapsulation part come into full contact with, and easily fabricated.

Another embodiment according to the present utility model, the material of circuit plate body described in the photosensory assembly can select From combination：Rigid Flex, ceramic substrate, PCB hardboards or FPC.

Another embodiment according to the present utility model, the material of disjunctor encapsulation part described in the photosensory assembly are selected from group It closes：It is one or more in nylon, LCP, PP or resin.

Another embodiment according to the present utility model, photosensory assembly described in the photosensory assembly include at least two motors Connection structure, the motor connection structure include an at least lead, and the lead is set to the disjunctor encapsulation part, and is electrically connected In the circuit plate body, the lead includes a motor connecting pin, the disjunctor encapsulation part is revealed in, in order to connect a horse Up to pin.

Another embodiment according to the present utility model, photosensory assembly described in the photosensory assembly include at least two motors Connection structure, the motor connection structure includes an at least lead and at least a pin slot, the lead are arranged at the company Body encapsulation part, and the circuit plate body is electrically connected to, the pin slot is arranged at the disjunctor encapsulation part upper end, described Lead includes a motor connecting pin, and the motor connects end line in the groove bottom wall, in order to which a motor pin is plugged in institute The motor connecting pin is electrically connected to when stating pin slot.

Another embodiment according to the present utility model, photosensory assembly described in the photosensory assembly include at least two motors Connection structure, the motor connection structure include at least a pin slot and at least a circuit junction, the circuit junction electrical connection In the circuit plate body, the pin slot is arranged at the disjunctor encapsulation part, is extended to by the circuit plate body described The top of disjunctor encapsulation part, and the circuit junction is revealed in the pin slot, in order to which a motor pin is plugged in described draw The circuit junction is electrically connected to during foot slot.

Another embodiment according to the present utility model, photosensory assembly described in the photosensory assembly include at least two motors Connection structure, the motor connection structure include at least one engraving circuit, and the engraving circuit is set to the disjunctor encapsulation part, The circuit plate body is electrically connected to, in order to be electrically connected a motor pin.

Another embodiment according to the present utility model carves circuit with the side of electronics carving described in the photosensory assembly Formula is set to the disjunctor encapsulation part.

The another aspect of the utility model provides an array camera module, including the photosensory assembly described in one and at least two Camera lens；The camera lens is located at the photosensitive path of the sensitive chip of the photosensory assembly.

Array camera module described in another embodiment according to the present utility model includes an at least stent, and the stent is pacified Loaded on the photosensory assembly, the array camera module includes at least two optical filters, and each optical filter is installed in the branch Frame.

Another embodiment according to the present utility model, the array camera module include at least two motors, each camera lens The corresponding motor is installed in, each motor is installed in the photosensory assembly.

Another embodiment according to the present utility model, the array camera module include at least two optical filters, each filter Mating plate is installed in the photosensory assembly.

Another embodiment according to the present utility model, the array camera module include at least two optical filters, each filter Mating plate is by integral packaging in the corresponding sensitive chip.

The utility model also provides the photosensory assembly of a pair of camera module, including：One disjunctor encapsulation part and a photographic department, The photographic department includes a circuit plate body and two sensitive chips, and the disjunctor encapsulation part integral packaging is in the circuit plate body With the sensitive chip, wherein the disjunctor encapsulation part forms two through hole, each through-hole provides light to the sensitive chip Access, wherein the disjunctor encapsulation part is also equipped with a stent, the stent is suitable for two optical filters of installation.

In some embodiments, in the photosensory assembly of double camera modules, the disjunctor encapsulation part it is each described logical Hole is increased from the bottom to top skewed in internal diameter.

In some embodiments, in the photosensory assembly of double camera modules, the stents of two monomers is installed on described Disjunctor encapsulation part, to install two optical filters respectively.

In some embodiments, in the photosensory assembly of double camera modules, the stent of disjunctor is installed on described Disjunctor encapsulation part, for installing two optical filters.

In some embodiments, in the photosensory assembly of double camera modules, the cantilever tip is suitable for described in installation The camera lens of double camera modules.

In some embodiments, in the photosensory assembly of double camera modules, the cantilever tip is suitable for described in installation The motor of double camera modules.

In some embodiments, in the photosensory assembly of double camera modules, the photographic department includes multiple connecting lines, Each connecting line is electrically connected the sensitive chip and the circuit plate body, and the disjunctor encapsulation part coats the connecting line, So that the connecting line will not be directly exposed to outside, wherein the connecting line is selected from combination：Gold thread, silver wire, copper wire or aluminium One kind in line.

In some embodiments, in the photosensory assembly of double camera modules, each sensitive chip includes photosensitive area With non-photo-sensing area, the non-photo-sensing area extends to described photosensitive around photosensitive area periphery, the disjunctor encapsulation part molding The non-photo-sensing area of chip.

In some embodiments, in the photosensory assembly of double camera modules, the photographic department includes multiple circuit elements Part, the circuit element protrude from the circuit plate body, and the disjunctor encapsulation part coats at least one circuit element, so that Outside will not be directly exposed to by obtaining the circuit element, wherein circuit element selection combination：Resistance, capacitance, diode, three One or more of which in grade pipe, potentiometer, relay and driver.

In some embodiments, in the photosensory assembly of double camera modules, the photographic department includes a reinforcing layer, institute It states reinforcing layer laminate and is set to the wiring board bottom part body, to enhance the structural strength of the circuit plate body.

In some embodiments, in the photosensory assembly of double camera modules, the photographic department includes a shielded layer, institute It states shielded layer and wraps up the circuit plate body and the disjunctor encapsulation part, to enhance the electromagnetism interference of the photosensory assembly Energy.

In some embodiments, in the photosensory assembly of double camera modules, the material of the circuit plate body can be with Selected from combination：Rigid Flex, ceramic substrate, PCB hardboards or FPC.

In some embodiments, in the photosensory assembly of double camera modules, the material of the disjunctor encapsulation part is selected from Combination：One kind in epoxy resin, nylon, LCP or PP.

In some embodiments, in the photosensory assembly of double camera modules, the photosensory assembly connects including two motors Binding structure, each motor connection structure are selected from following one of which：

Each motor connection structure includes lead, and the lead is set to the disjunctor encapsulation part, and is electrically connected to institute Circuit plate body is stated, the lead includes motor connecting pin, the disjunctor encapsulation part is revealed in, in order to connect motor pin；

Each motor connection structure includes a lead and a pin slot, and the lead is arranged at the disjunctor encapsulation Portion, and the circuit plate body is electrically connected to, the pin slot is arranged at the disjunctor encapsulation part upper end, the lead packet A motor connecting pin is included, the motor connects end line in the groove bottom wall, in order to which motor pin is plugged in the pin slot When be electrically connected to the motor connecting pin；

Each motor connection structure includes a pin slot and a circuit junction, and the circuit junction is electrically connected to the line Road plate body, the pin slot are arranged at the disjunctor encapsulation part, and extending to the disjunctor by the circuit plate body encapsulates The top in portion, and the circuit junction is revealed in the pin slot, is electrically connected when being plugged in the pin slot in order to motor pin It is connected to the circuit junction；

Each motor connection structure includes an engraving circuit, and the engraving circuit is set to the disjunctor encapsulation part, electricity The circuit plate body is connected to, in order to be electrically connected motor pin；With

Each motor connection structure is will be described in the motor and the photosensory assembly by traditional welding procedure Circuit plate body is connected.

The utility model also provides a pair of camera module, described photosensitive including two camera lenses and above-mentioned double camera modules Component.

The utility model also provides a pair of camera module, including two camera lenses and a photosensory assembly, the photosensory assembly packet A disjunctor encapsulation part and a photographic department are included, the photographic department includes a circuit plate body and two sensitive chips, the disjunctor encapsulation Portion's integral packaging is in the circuit plate body and the sensitive chip, wherein the disjunctor encapsulation part forms two through hole, it is each described Through-hole provides passage of light to the sensitive chip, and the photographic department further includes multiple connecting lines, each connecting line electrical connection The sensitive chip and the circuit plate body, the disjunctor encapsulation part coats the connecting line, so that the connecting line is not It can be directly exposed to outside, each sensitive chip includes photosensitive area and non-photo-sensing area, and the non-photo-sensing area is around the sense Light area periphery, the disjunctor encapsulation part molding extend to the non-photo-sensing area of the sensitive chip and positioned at the photosensitive areas Outside, wherein the photographic department includes multiple circuit elements, the circuit element protrudes from the circuit plate body, the disjunctor At least one circuit element described in encapsulation part cladding, so that the circuit element will not be directly exposed to outside, wherein institute State circuit element selection combination：One of which in resistance, capacitance, diode, triode, potentiometer, relay and driver It is or a variety of.

Description of the drawings

Fig. 1 is that cuing open for prior art twin-lens camera module shows schematic diagram.

Fig. 2 is the stereogram of the photosensory assembly of first preferred embodiment according to the present utility model.

Fig. 3 is the sectional view of the photosensory assembly of first preferred embodiment according to the present utility model.

Fig. 4 is the manufacturing process schematic diagram of the photosensory assembly of first preferred embodiment according to the present utility model.

Fig. 5 is the manufacturing method schematic diagram of the photosensory assembly of first preferred embodiment according to the present utility model.

Fig. 6 A, 6B are the different camera module cut-away views of first preferred embodiment according to the present utility model.

Fig. 7 A, 7B and 7C are the motor connection structures of the photosensory assembly of first preferred embodiment according to the present utility model Different embodiments.

Fig. 8 is another camera module sectional view of first preferred embodiment according to the present utility model.

Fig. 9 is that the array camera module of second preferred embodiment according to the present utility model and its cuing open for photosensory assembly are shown Figure.

Figure 10 is the array camera module of third preferred embodiment according to the present utility model and its cuing open for photosensory assembly Diagram.

Figure 11 is the 4th array camera module of preferred embodiment according to the present utility model and its cuing open for photosensory assembly Diagram.

Figure 12 is the 5th array camera module of preferred embodiment according to the present utility model and its cuing open for photosensory assembly Diagram.

Figure 13 is the 6th array camera module of preferred embodiment according to the present utility model and its cuing open for photosensory assembly Diagram.

Figure 14 is the 7th array camera module of preferred embodiment according to the present utility model and its cuing open for photosensory assembly Diagram.

Figure 15 is the 8th array camera module of preferred embodiment according to the present utility model and its cuing open for photosensory assembly Diagram.

Figure 16 is the manufacturing method schematic diagram of the photosensory assembly of above preferred embodiment according to the present utility model.

Figure 17 is the 9th camera module of preferred embodiment and its sectional view of photosensory assembly according to the present utility model.

Specific embodiment

It is described below to disclose the utility model so that those skilled in the art can realize the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs The other technologies scheme of case and spirit and scope without departing from the utility model.

It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instructions such as " outer " or position close System is based on orientation shown in the drawings or position relationship, is for only for ease of description the utility model and simplifies description, without It is instruction or implies that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that limitation to the utility model.

As shown in Fig. 2 to Fig. 6 A, the photosensory assembly and camera module of first preferred embodiment according to the present utility model. The photosensory assembly 20 is used for array camera module described in assembly, so as to obtain the camera module of moulding type.It is described photosensitive Component 20 includes a disjunctor encapsulation part 21 and a photographic department 22, is connected to 21 integral packaging of disjunctor encapsulation part described photosensitive Portion 22, molding be connected to as described in photographic department 12.

The photographic department 22 includes a circuit plate body 222 and two sensitive chips 221, and each sensitive chip 221 is set It is placed in the circuit plate body 222.This embodiment according to the present utility model, the molding of the sensitive chip 221 ground connection In the circuit plate body 222.More specifically, the disjunctor encapsulation part 21 (Molding on by way of being molded into chip Chip, MOC) molding be connected to the photographic department 22.

The disjunctor encapsulation part 21 forms two through hole 2100, so that the disjunctor encapsulation part 21 is respectively around each described 221 outside of sensitive chip, and passage of light of each camera lens 50 with the corresponding sensitive chip 221 is provided.It is each described Sensitive chip 221 is arranged at the circuit plate body 222 of position corresponding to each through-hole 2100.

The disjunctor encapsulation part 21 includes a connector 214 and two outer ring bodies 215, and the connector 214 molds integrally It is connected between two outer ring body 215, and the outer shroud is divided into adjacent two parts, form two through-holes 2100, two chips are located at the both sides of the connector 214, so as to be suitable for being used to assemble the array camera module.Value It obtains one to be mentioned that, the connector 214 is the common portion of two camera lenses 50, i.e., each described when installing the camera lens 50 Camera lens 50 respectively occupies the 214 corresponding part of connector.

According to this embodiment of the utility model, the photographic department 22 is including a connection circuit (not shown) and extremely A few circuit element 223.The connection circuit defaults in the circuit plate body 222, and the circuit element 223 is electrically connected to institute Connection circuit and the sensitive chip 221 are stated, for the photosensitive course of work of the sensitive chip 221.The circuit element 223 are projectedly set to the circuit plate body 222.The circuit element 223 can be, citing ground but be not limited to, resistance, electricity Appearance, diode, triode, potentiometer, relay or driver etc..

It is noted that the circuit element 223 is coated on inside it by the disjunctor encapsulation part 21, so that institute Stating circuit element 223 will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 221 Environment in, so as to when being assembled into the array camera module, the pollutions such as dust will not be infected on the circuit element 223 Object will not influence the sensitive chip 221, different from traditional camera module circuit element 223 expose existing way, such as Capacitance resistance ware so as to prevent dust, sundries from staying in 223 surface of circuit element by way of molding and coating, avoids dirt It contaminates the sensitive chip 221 and camera module is caused the bad phenomenons such as dirty stain occur.

It is noted that in this embodiment, protruding the circuit plate body 222 with the circuit element 223 is Example illustrates, and in the other embodiment of utility model, the circuit element 223 is embedded in the circuit plate body 222 Inside, without protruding from the circuit plate body 222, those skilled in the art is it should be understood that the circuit element 223 Structure, type and installation position be not the utility model limitation.

This preferred embodiment according to the present utility model, the photographic department 22 includes multiple connecting lines 224, for being electrically connected Connect each sensitive chip 221 and the circuit plate body 222.Further, each connecting line 224 may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..

It is noted that each connecting line 224 is molded into inside the disjunctor encapsulation part 21, so as to by The disjunctor encapsulation part 21 coats each connecting line 224, without being directly exposed to outside, so as to assemble the battle array During row camera module so that the connecting line 224 will not be touched damage, while reduce environmental factor to a described by any The influence of connecting line 224, such as temperature so that the communication connection between the sensitive chip 221 and the circuit plate body 222 is steady Fixed, this point is not to be provided in the prior art completely.

The bottom of the through-hole 2100 of the disjunctor encapsulation part 21 is in gradually increased skewed from the bottom to top.

It is noted that the disjunctor encapsulation part 21 coats the circuit element 223 and the connecting line 224, have The advantage of the circuit element 223 and the connecting line 224 and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the disjunctor encapsulation part 21 is not limited to coat the circuit element 223 or described Connecting line 224.That is, in the other embodiment of the utility model, the disjunctor encapsulation part 21 can be directly molded into It the circuit plate body 222 for the circuit element 223 not protruded or is molded into outside the circuit element 223 The different locations such as side, surrounding.

Further, the sensitive chip 221 has a photosensitive area 2211 and a non-photo-sensing area 2212, the non-photo-sensing area 2212 are surrounded on 2211 periphery of photosensitive area.For carrying out photosensitization, the connecting line 224 connects the photosensitive area 2211 In the non-photo-sensing area 2212.

This preferred embodiment according to the present utility model, the disjunctor encapsulation part 21 extend the sensitive chip 221 The non-photo-sensing area 2212, so as to which the lamination by way of molding of sensitive chip 221 is fixed on the wiring board master Body 222.Mode in this way, the mode (Molding on Chip, MOC) for being such as molded into chip expand the disjunctor envelope The inside mouldable range in dress portion 21, so as to reduce the circuit plate body 222 and the disjunctor encapsulation part 21 The structural moiety in outside further reduces the length and width dimensions of the molding photographic department 22, reduces by the battle array of its assembling The length and width dimensions of row camera module.

In this embodiment of the utility model, the disjunctor encapsulation part 21 is raisedly around the sensitive chip 221 2211 outside of the photosensitive area, particularly, the disjunctor encapsulation part 21 is integrally closed connection so that has good Leakproofness, so as to which when the photosensory assembly 20 be used to assemble the array camera module, the sensitive chip 221 is sealed In inside, space in a closing is formed.

With reference to Fig. 4 and Fig. 5, specifically, when manufacturing the photosensory assembly 20, a traditional wiring board conduct can be chosen The circuit plate body 222 sets two sensitive chips 221 in the circuit plate body 222, for example mounts each described Sensitive chip 221 is electrically connected to the circuit plate body 222, and by the sensitive chip 221 by the connecting line 224, For example the mode of gold thread is beaten, and then the circuit plate body 222 after preliminary assembling and 221 component of the sensitive chip are enterprising With injection molding machine, SMT will be carried out by insert molding (Insert Molding) technique for row integral packaging, such as the mode molded Wiring board after technique (Surface Mount Technology surface mount process) carries out molding and forms the disjunctor encapsulation Portion 21 forms the disjunctor encapsulation part 21 by mould pressing process common in semiconductor packages.The circuit plate body 222 Can with selected as, illustrate ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboards (without soft board) etc.. The mode that the disjunctor encapsulation part 21 is formed can be with selected as, and illustrating ground but is not limited to, Shooting Technique, mould pressing process etc..It is described The material that disjunctor encapsulation part 21 can select for, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can be adopted Use resin.It will be apparent to a skilled person that the aforementioned manufacture that can be selected and the material that can be selected, only The mode that can implement of the utility model as an example is not the limitation of the utility model.Above-mentioned integral packaging mistake Journey only illustrates a kind of mode that can implement of the utility model as an example, what those skilled in the art should understand that It is that the manufacturing sequence of the photosensory assembly 20 is not the limitation of the utility model.

Further, the disjunctor encapsulation part 21 includes a cladding 211 and one optical filter construction section 212 of section, the optical filter The cladding section 211 is integrally connected to the molding of construction section 212, cladding section 211 molding is connected to the circuit plate body 222, for coating the circuit element 223 and the connecting line 224.The optical filter construction section 212 is used to install the filter Mating plate 40, that is to say, that when the photosensory assembly 20 be used to assemble the array camera module, the array camera module Optical filter 40 be installed in the optical filter construction section 212 so that the optical filter 40 is located at the sense of the sensitive chip 221 On light path, and do not need to provide additional 40 mounting bracket of optical filter.That is, the disjunctor encapsulation part 21 has here There is a function of conventional stent, but the advantage based on moulding technology, 212 top of optical filter construction section can be by mold Technology mode, make it have good planarization, so that the optical filter 40 is entirely mounted, this point is also excellent In traditional camera module.

Further, the optical filter construction section 212 has two mounting grooves 2121, and each support slot is communicated in corresponding The through-hole 2100, respectively two optical filters 40 provide sufficient installation space so that each optical filter 40 will not be convex For the top surface of optical filter construction section 212.That is, the disjunctor encapsulation part 21 is equipped with two tankages 2121, so as to In each optical filter 40 of installation to the disjunctor encapsulation part 21, and each optical filter is caused not protrude from the disjunctor envelope Dress portion 21.Particularly, the optical filter 40 is cutoff filter IRCF.

It is noted that in this embodiment of the utility model, the mounting groove 2121 can be used for installation filter Mating plate 20, and in other implementations of the utility model, the mounting groove 2121 can be used for installing the array camera module Motor or the components such as camera lens, those skilled in the art it should be understood that the mounting groove 2121 shape with purposes simultaneously It is not the limitation of the utility model.

It is noted that the inner wall of the disjunctor encapsulation part 21 can be set according to the shape of the connecting line 224 It puts, for example is set as skewed, so as to the sensitive chip 221 be allowd to receive while connecting line 224 are coated To more light.Those skilled in the art is it should be understood that the shape of the disjunctor encapsulation part 21 is not that this practicality is new The limitation of type.

Further, this preferred embodiment according to the present utility model, the photosensory assembly 20 connect including at least two motors Binding structure 23, each motor connection structure 23 are used to connect a motor 60 of the array camera module.The motor 60 has There is an at least motor pin 61.Each motor connection structure 23 includes an at least lead 231, and each lead 231 is for electricity Connect the motor 60 and the circuit plate body 222.Each lead 231 is electrically connected to circuit plate body 222.Further, The lead 231 is electrically connected to the connection circuit of the circuit plate body 222.The lead 231 is arranged at the disjunctor envelope Dress portion 21, and extend to the top of the disjunctor encapsulation part 21.The lead 231 includes a motor connecting pin 2311, appears In the top of the disjunctor encapsulation part 21, for being electrically connected the motor pin 61 of the motor 60.It is noted that institute State lead 231 embedding manner can be set when forming the disjunctor encapsulation part 21.In traditional connection mode, such as drive The components such as motor are all to be connected to wiring board by setting individual conducting wire, and manufacturing process is relative complex, and new in this practicality The mode of the lead 231 is buried during this molding of type can replace traditional motor the technical process such as to weld, and cause Circuit connection is more stablized.Particularly, in the one of the utility model implements, the lead 231 is a conducting wire, is embedded in institute It states inside disjunctor encapsulation part 21.Citing ground, the motor pin 61 can be connected to the motor by anisotropic conductive film Connecting pin 2311 can also be connected to the motor connecting pin 2311 by welding.

It is noted that the burial place of the lead 231 and the motor connecting pin 2311 of the lead 231 It can be arranged as required in the position of the disjunctor encapsulation part 21 display, for example, in an embodiment of the utility model, institute The periphery of the disjunctor encapsulation part 21 can be arranged at by stating the motor connecting pin 2311 of lead 231, i.e., described disjunctor envelope The top surface in dress portion 21, the top surface of the optical filter construction section 212, and in another embodiment of the utility model, it is described Motor connecting pin 2311 can be arranged at the interior of the disjunctor encapsulation part 21 and enclose, i.e., the installation of described disjunctor encapsulation part 21 2121 bottom surface of slot, so as to provide the motor 60 different installation sites.In other words, when the motor 60 needs to install During to 21 top of disjunctor encapsulation part, the motor connecting pin 2311 is set to the peripheral top surface of the disjunctor encapsulation part 21, When the motor 60 needs to install to the mounting groove 2121, the motor connecting pin 2311 is set to the disjunctor encapsulation It is enclosed in portion 21, i.e., described 2121 bottom surface of mounting groove.

That is, when manufacturing the photosensory assembly 20,221, the photosensitive core is first mounted, then in the circuit In plate body 222 and the sensitive chip 221, the disjunctor encapsulation part 21 is molded in a manner of MOC, and can be in molding The lead 231 is set, and the lead 231 is caused to be electrically connected to institute inside the disjunctor encapsulation part 21 with embedding manner Circuit plate body 222 is stated, and the motor connecting pin 2311 of the lead 231 is caused to be shown in the top of the disjunctor encapsulation part End, in order to be connected to the motor pin 61 of the motor 60.Citing ground be used to assemble institute in the photosensory assembly 20 When stating array camera shooting molding, each motor pin 61 of the motor 60 is connected to the lead 231 by welding The motor connecting pin 2311 so that the motor 60 is electrically connected to the circuit plate body 222, and need to set single Only conducting wire connects the motor 60 and the circuit plate body 222, and causes the motor pin 61 of the motor 60 Length can reduce.

It is a camera module of first preferred embodiment according to the present utility model with reference to Fig. 2 to Fig. 6 A, the array Camera module can be a dynamic burnt camera module (Automatic Focus Camera Module, AFCM).The array is taken the photograph As module includes a photosensory assembly 20, two optical filters 40, two 60 and two camera lenses 50 of motor.

Each optical filter 40 is installed in the photosensory assembly 20, and each camera lens 50 is installed in each motor 60, each motor 60 is installed on the photosensory assembly 20.

Further, the optical filter 40 is installed in the described of the disjunctor encapsulation part 21 of the photosensory assembly 20 The mounting groove 2121 of optical filter construction section 212.Each motor 60 is installed in the disjunctor of the photosensory assembly 20 The optical filter construction section top in module portion 21.

Further, the motor pin 61 of the motor 60 is electrically connected to the motor of the motor connection structure 23 Connecting pin 2311, so as to be electrically connected to the circuit plate body 222 by the motor connection structure 23.

It will be apparent to a skilled person that the structure and type of above-mentioned array camera module are only as an example, come Illustrate the mode that the array camera module can be carried out, be not the limitation of the utility model.

It is an equivalent reality of the motor connection structure of above preferred embodiment according to the present utility model with reference to Fig. 7 A Apply example.The motor connection structure 23 includes a pin slot 233, and the pin slot 233 is used to accommodate the array camera module The motor 60 the motor pin 61.The pin slot 233 is arranged at 21 upper end of disjunctor encapsulation part.The horse Include 234 each lead 234 of an at least lead up to connection structure 23 for being electrically connected the motor 60 and the wiring board master Body 222.The lead 234 is arranged at the disjunctor encapsulation part 21, and extends upwardly to the institute of the disjunctor encapsulation part 21 State the groove bottom wall of pin slot 233.The lead 234 includes a motor connecting pin 2341, is revealed in the disjunctor encapsulation part 21 The groove bottom wall of the pin slot 233, for being electrically connected the pin 41 of the motor 60.Particularly, in a kind of embodiment In, the motor connecting pin 2341 may be implemented as a pad.The lead 234 may be implemented as a conducting wire, be buried Inside the disjunctor encapsulation part 21.

That is, when manufacturing the photosensory assembly 20,221, the photosensitive core is first mounted, then in the circuit In plate body 222 and the sensitive chip 221, the disjunctor encapsulation part 21 is molded in a manner of MOC, and preset pre- fixed length The pin slot 233 of degree, and the lead 234 can be set in molding with embedding manner, and cause 234 electricity of lead The circuit plate body 222 is connected to, and the motor connecting pin 2341 of the lead 234 is caused to be shown in the disjunctor envelope The groove bottom wall of the pin slot 233 in dress portion 21, in order to be connected to the pin 41 of the motor 60.Citing ground, in institute When stating photosensory assembly 20 and be used to assembling the camera shooting molding, each pin 41 of the motor 60 is inserted into the pin slot 233, and it is connected to the motor connecting pin 2341 of the lead 234 by welding, so that the motor 60 The circuit plate body 222 is electrically connected to, and needs to set individual conducting wire by the motor 60 and the circuit plate body 222 Connection, and the pin 42 of the motor 60 can be connected steadily prevents from external unwanted touching the horse Up to pin 61.Particularly, the lead 234 may be implemented as a conducting wire, be embedded in inside the disjunctor encapsulation part 21.

It is another equivalence enforcement of the motor connection structure of above preferred embodiment according to the present utility model with reference to Fig. 7 B Example.The motor connection structure 23 includes a pin slot 235, and the pin slot 235 is used to accommodate the array camera module The pin 41 of the motor 60.The pin slot 235 is arranged at the disjunctor encapsulation part 21.The motor connection structure 23 include an at least circuit junction 232, and the circuit junction 232 defaults in the circuit plate body 222, and is electrically connected to The 222 connection circuit in the circuit plate body.Further, each pin slot 235 is by the disjunctor encapsulation part 21 Top extend to the circuit plate body 222, and the circuit junction 232 is shown.In a kind of way of example, The motor pin 61 is inserted into the pin slot 235, and can be welded to connect with the circuit junction 232.

That is, when manufacturing the photosensory assembly 20, default each circuit connects in the circuit plate body 222 Point 232, and then photosensitive 221, the core is mounted, then in the circuit plate body 222 and the sensitive chip 221, with The mode of MOC molds the disjunctor encapsulation part 21, and the pin slot 235 of default predetermined length, and causes the circuit Contact 232 is shown by the pin slot 235, in order to be connected to the motor pin 61 of the motor 60.Citing ground, When the photosensory assembly 20 be used to assemble the camera shooting molding, each motor pin 61 of the motor 60 is inserted into described draw Foot slot 235, and it is connected to the circuit junction 232 in circuit plate body 222 by welding, so that the horse The circuit plate body 222 is electrically connected to, and so that the motor pin 61 of the motor 60 can steadily connect up to 60 It connects, prevents outside is unwanted from touching the motor pin 61.

It is another equivalence enforcement of motor connection structure in above-mentioned preferred implementation according to the present utility model with reference to Fig. 7 C Example.The motor connection structure 23 includes an engraving circuit 236, and the engraving circuit 236 is used to be electrically connected the wiring board master The components such as the connection circuit, the sensitive chip 221 and motor on body 222.Citing ground but be not limited to, the engraved lines Road 236 can be set by way of electronics carving (LDS) when forming the disjunctor encapsulation part 21.In traditional connection mode In, the components such as drive motor are all to be connected to wiring board by setting individual conducting wire, and manufacturing process is relative complex, and The mode of the engraving circuit 236 is set in this molding of the utility model can replace traditional motor the techniques such as to weld Process, and circuit connection is more stablized.More specifically, the forming process of the engraving circuit 236 can be present institute The setting engraving slot of disjunctor encapsulation part 21 is stated, circuit is then set in a manner of plating in the engraving slot.

In one embodiment of the utility model, the motor 60 of the array camera module is connected to the sense The mode of optical assembly 20 is illustrated by taking the connection mode of the motor connection structure 23 as an example, such as described to use the lead 231 mode, and in the other embodiment of the utility model, the connection mode of the motor 60 can also with Fig. 7 A, 7B with And the corresponding connection modes of 7C are combined, such as using the pin slot 233 and lead 234, the pin slot 235 and the electricity Road contact 232.And in another embodiment of the utility model, with reference to Fig. 6 B, the motor 60 can pass through traditional mode The photosensory assembly 10 is connected to, such as by welding.Those skilled in the art is it should be understood that the motor 60 and the photosensory assembly 10 connection mode be not the utility model limitation.

With reference to Fig. 8, another camera module of first preferred embodiment according to the present utility model.The array images mould Group can be a fixed-focus module.The array camera module includes a photosensory assembly 20, two 40 and two institutes of optical filter State camera lens 50.

Each optical filter 40 is installed in the photosensory assembly 20, and each camera lens 50 is installed in the photosensory assembly On 20.

More specifically, each optical filter 40 is installed in each institute of the disjunctor encapsulation part 21 of the photosensory assembly 20 State the mounting groove 2121 of optical filter construction section 212.Each camera lens 50 is installed in the company of the photosensory assembly 20 The top of body encapsulation part 21.

It's also worth mentioning that each camera lens 50 is installed in the disjunctor encapsulation part 21 of the photosensory assembly 20 So as to which the disjunctor encapsulation part 21 is equivalent to the function of the stent in traditional camera module, branch is provided for the camera lens 50 for top Support, fixed position, but assemble and be but different from tradition COB technical process.The stent of the camera module of traditional COB techniques is with viscous The mode of patch is fixed on wiring board, and the disjunctor encapsulation part 21 is fixed on the circuit plate body 222 by moulding technology, Do not need to paste fixation procedure, molding mode relative to paste it is fixed with better connective stability and technical process can Control property, and the glue space that reserved AA is adjusted is not needed between the disjunctor encapsulation part 21 and the circuit plate body 222, Therefore the reserved space of traditional camera module AA adjustment is reduced so that the thickness of camera module is reduced；On the other hand, institute It states disjunctor encapsulation part 21 and coats the circuit element 223 and the connecting line 224 so that traditional cradling function and circuit element 223 and the connecting line 224 can spatially overlap, do not need to as traditional camera module, around circuit devcie Reserved safe distance, so that the height of the disjunctor encapsulation part 21 with cradling function can be arranged on smaller model It encloses, so as to further provide the space that camera module thickness can reduce.In addition, the replacement of disjunctor encapsulation part 21 is traditional Stent avoids the heeling error that stent is brought when pasting and assembling, reduces the cumulative limit of camera module assembling.It is and described Disjunctor encapsulation part 21 coats the connecting line 224, and the disjunctor encapsulation part 21 extends to the non-photo-sensing of the sensitive chip 221 Area 2212 so that the disjunctor encapsulation part 21 can be to contract, so as to further reduce the transverse direction of the array camera module Length and width dimensions.

As shown in figure 9, be second preferred embodiment according to the present utility model array camera module and its photosensitive group Part.Different from above preferred embodiment, the circuit plate body 222H has two inner groovy 2222H, each photosensitive core Piece 221 is arranged in the inner groovy 2222H, so that the sensitive chip 221 and the circuit plate body 222H Relative altitude reduces, and so as to coat the sensitive chip 221 when the disjunctor encapsulation part 21, reduces to the disjunctor encapsulation part 21 Requirement for height, so as to reduce the height for the array camera module that the photosensory assembly 20 assembles.

As shown in Figure 10, be third preferred embodiment according to the present utility model array camera module and its photosensitive group Part.

Different from above preferred embodiment, in this embodiment of the utility model, the photosensory assembly 20 The photographic department 22 includes a reinforcing layer 225I, is connected to the reinforcing layer 225I laminations 222 bottom of circuit plate body, In order to strengthen the structural strength of the circuit plate body 222.That is, the disjunctor in the circuit plate body 222 Region bottom where encapsulation part 21 and the sensitive chip 221 mounts the reinforcing layer 225I, so that the circuit Plate body 222 reliablely and stablely supports the disjunctor encapsulation part 21 and the sensitive chip 221.

Further, the reinforcing layer 225I is a metallic plate, and the metallic plate is attached at the circuit plate body 222 Bottom increases the structural strength of the circuit plate body 222, on the other hand, increases the heat dissipation performance of the photosensory assembly 20, energy Effectively scatter and disappear the heat that the sensitive chip 221 is sent out.

It is noted that FPC (Flex Print Circuit, flexibility printing may be used in the circuit plate body 222 Circuit board), and pass through the rigidity of FPC described in the reinforcing layer 225I so that the FPC with excellent bending performance disclosure satisfy that institute State the bearing requirements of photosensory assembly 20.That is, the selectable range of the circuit plate body 222 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RG (Rigid Flex, Rigid Flex).Pass through The reinforcing layer 225I increases the structural strength of the circuit plate body 222 and improves heat dissipation performance, so as to reduce State the thickness of circuit plate body 222 so that the institute that the height of the photosensory assembly 20 further reduces and obtained by its assembling The height for stating array camera module reduces.

As shown in figure 11, be the 4th preferred embodiment according to the present utility model array camera module and its photosensitive group The cut-away view of part.

Different from above preferred embodiment, the circuit plate body 222J has an at least reinforced hole 2221J, described Disjunctor encapsulation part is extended into the reinforced hole 2221J, so as to enhance the structural strength of the circuit plate body 222J.

The position of the reinforced hole 2221J can select as needed and the structural strength need according to the wiring board It asks to set, such as in symmetrical structure.By the setting of the reinforced hole 2221J so that the knot of the circuit plate body 222J Structure intensity enhancing so as to reduce the thickness of the circuit plate body 222J, reduces the thickness of the camera module by its assembling, And improve the heat dissipation performance of the photosensory assembly 20.

It is noted that the reinforced hole 2221J is groove-like, and during so as to manufacture the photosensory assembly 20, the company The moulding material of body encapsulation part will not be leaked out by the reinforced hole 2221J.

As shown in figure 12, be the 5th preferred embodiment according to the present utility model array camera module and its photosensitive group Part 20.

Different from above preferred embodiment, the circuit plate body 222K has an at least reinforced hole 2221K, described Disjunctor encapsulation part is extended into the reinforced hole 2221K, so as to enhance the structural strength of the circuit plate body 222K.

The position of the reinforced hole 2221K can select as needed and the structural strength need according to the wiring board It asks to set, such as in symmetrical structure.By the setting of the reinforced hole 2221K so that the knot of the circuit plate body 222K Structure intensity enhancing so as to reduce the thickness of the circuit plate body 222K, reduces the thickness of the camera module by its assembling, And improve the heat dissipation performance of the photosensory assembly 20.

It is noted that the reinforced hole 2221K is perforation, that is to say, that across the circuit plate body 222K, So that the both sides connection of the circuit plate body 222K, during so as to manufacture the photosensory assembly 20, the mould of the disjunctor encapsulation part Moulding material is adequately combined with the circuit plate body 222K, forms more firm composite structure, and relatively described recessed The structure of slot, the perforation are easier to fabricate.

As shown in figure 13, be the 6th preferred embodiment according to the present utility model array camera module and its photosensitive group Part.

The disjunctor encapsulation part 21L includes a cladding section 211L, an optical filter construction section 212L and a camera lens construction section Integrally molding is connected to the cladding section successively by 213L, the optical filter construction section 212L and the camera lens construction section 213L 211L, the cladding section 211L moldings are connected to the circuit plate body 222, for coating the circuit element 223 and described Connecting line 224.The optical filter construction section 212L is for two optical filters 40 of installation, that is to say, that when the photosensory assembly 20 when be used to assemble the array camera module, and each optical filter 40 of the array camera module is installed in the optical filter Construction section 212L so that each optical filter 40 is located on the photosensitive path of each sensitive chip 221, and does not need to offer volume Outer 40 mounting bracket of optical filter.That is, the disjunctor encapsulation part 21L has the function of conventional stent here, still Advantage based on moulding technology, the optical filter construction section 212L tops can make it have by the technology mode of mold Good planarization, so that each optical filter 40 is entirely mounted, this point is also an advantage over traditional array camera shooting Module.The camera lens construction section 213L is for two camera lenses 50 of installation, that is to say, that when the photosensory assembly 20 is used for group When filling the array camera module, each camera lens 50 is installed in the camera lens construction section of the disjunctor encapsulation part 21L On the inside of 213L, in order to provide stable installation site for the camera lens 50.

The disjunctor encapsulation part 21L includes a connector 214L and two outer ring body 215L, the connector 214L moldings one It is connected to body between the two outer ring bodies 215L, and the outer shroud is divided into adjacent two parts, it is described logical to form two Hole 2100L, two chips are located at the both sides of the connector 214L, so as to image mould suitable for be used to assemble the array Group.It is noted that the connector 214L is the common portion of two camera lenses 50, i.e., when installing the camera lens 50, Each camera lens 50 respectively occupies the corresponding parts of the connector 214L.

Further, the optical filter construction section 212L has two mounting groove 2121L, each mounting groove 2121L connections In the corresponding through-hole 2100L, sufficient installation space is provided for the optical filter 40 so that the optical filter 40 will not be convex For the top surface of optical filter construction section.The camera lens construction section 213L has two camera lens mounting groove 2131L, the camera lens peace Tankage 2131L is communicated in the corresponding through-hole 2100L, and sufficient installation space is provided for the camera lens 50.

In other words, the optical filter construction section 212L and the camera lens construction section 213L are integrally upwardly extended, and interior Portion forms step-like structure, and respectively described optical filter 40 and the camera lens 50 provide support fixed position, without carrying The optical filter 40 and the camera lens 50 are installed for additional component.

It is in closed annular that the camera lens construction section 213L, which has two camera lens inner wall 2132L, the camera lens inner wall 2132L, is fitted Installation space is provided in respectively each camera lens 50.It is noted that in the camera lens of the camera lens construction section 213L Wall 2132L surfacings so as to the camera lens 50 suitable for installation non-threaded, form fixed-focus module.Particularly, the camera lens 50 The camera lens construction section 213L can be fixed on by way of bonding.

It is the photosensory assembly and camera module of the 7th preferred embodiment according to the present utility model with reference to Figure 14.It is different from Above preferred embodiment, the photosensory assembly 20 include a shielded layer 227, and the shielded layer 227 wraps up the wiring board Main body 222 and the disjunctor encapsulation part 21, so as to while the structural strength for enhancing the circuit plate body 222, enhance institute State the anti-electromagnetic interference capability of photosensory assembly 20.

As shown in Figure 15 and Figure 16, be the 8th preferred embodiment according to the present utility model array camera module and its Photosensory assembly.The array camera module includes a photosensory assembly 20N.The camera lens 50 is installed in the photosensory assembly 20N On, assembling forms the array camera module.

Particularly, the camera lens 50 can be fixed on the disjunctor envelope of the photosensory assembly 20N by way of bonding The top of dress portion 21N, and by moulding technology the characteristics of mold manufacturing so that the top of the disjunctor encapsulation part 21N has Preferable planarization provides good mounting condition, so as to obtain good camera module for the camera lens 50.Described photosensitive group Part 20N is used for array camera module described in assembly, so as to obtain the camera module of moulding type.

The photosensory assembly 20N includes a disjunctor encapsulation part 21N and a photographic department 22N, the disjunctor encapsulation part 21N moldings Ground is connected to the photographic department 22N.

The circuit plate portion includes circuit plate body a 222N, the disjunctor encapsulation part 21N and forms two through hole 2100N, with So that the disjunctor encapsulation part 21N is respectively around on the outside of each sensitive chip 221N, and provide each camera lens 50 with The passage of light of the corresponding sensitive chip 221N.Each sensitive chip 221N is arranged at each through-hole 2100N institutes The circuit plate body 222N of corresponding position.

The disjunctor encapsulation part 21N includes a connector 214N and two outer ring body 215N, the connector 214N moldings one It is connected to body between the two outer ring bodies 215N, and the outer shroud is divided into adjacent two parts, it is described logical to form two Hole 2100N, two chips are located at the both sides of the connector 214N, so as to image mould suitable for be used to assemble the array Group.It is noted that the connector 214N is the common portion of two camera lenses 50, i.e., when installing the camera lens 50, Each camera lens 50 respectively occupies the corresponding parts of the connector 214N.

The photographic department 22N includes a circuit plate body 222N and two sensitive chip 221N, each sensitive chip 221N It is arranged on the circuit plate body 222N.This embodiment according to the present utility model, the sensitive chip 221N moldings Ground is connected to the circuit version main body.

According to this embodiment of the utility model, the photographic department 22N is including a connection circuit (not shown) and extremely A few circuit element 223N.The connection circuit defaults in the circuit plate body 222N, the circuit element 223N electrical connections In the connection circuit and the sensitive chip 221N, for the photosensitive course of work of the sensitive chip 221N.The electricity Circuit component 223N is projectedly set to the circuit plate body 222N.The circuit element 223N can be, citing ground but unlimited In resistance, capacitance, diode, triode, potentiometer, relay or driver etc..

It is noted that the circuit element 223N is coated on inside it by the disjunctor encapsulation part 21N, so that The circuit element 223N will not be directly exposed in space, more specifically, be not exposed to and the sensitive chip 221N In the environment communicated, so as to which when being assembled into the array camera module, dust etc. will not be infected on the circuit element 223N Pollutant will not influence the sensitive chip 221N, the presence exposed different from circuit element 223N in traditional camera module Mode, such as capacitance resistance ware, so as to prevent dust, sundries from staying in the circuit element 223N tables by way of molding and coating Face avoids polluting the sensitive chip 221N and camera module being caused the bad phenomenons such as dirty stain occur.

This preferred embodiment according to the present utility model, the photographic department 22N includes multiple connecting line 224N, for electricity Connect each sensitive chip 221N and the circuit plate body 222N.Further, each connecting line 224N can be carried out Specifically but to be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..

It is noted that each connecting line 224N is molded into inside the disjunctor encapsulation part 21N, so as to borrow The disjunctor encapsulation part 21N is helped to coat each connecting line 224N, without being directly exposed to outside, so as to assemble When stating array camera module so that the connecting line 224N will not be touched damage, while reduce environmental factor pair by any The influence of a connecting line 224N, such as temperature so that between the sensitive chip 221N and the circuit plate body 222N Stable connection is communicated, this point is not to be provided in the prior art completely.

It is noted that the disjunctor encapsulation part 21N coats the circuit element 223N and connecting line 224N, With protecting, the circuit element 223N's and connecting line 224N and its camera module for more being had performance etc. is excellent Gesture, but those skilled in the art is it should be understood that the disjunctor encapsulation part 21N is not limited to coat the circuit element 223N or described connecting lines 224N.That is, in the other embodiment of the utility model, the disjunctor encapsulation part 21N can To be directly molded into the circuit plate body 222N for the circuit element 223N not protruded or be molded into described The different locations such as circuit element 223N outsides, surrounding.

Further, the sensitive chip 221N has an a photosensitive area 2211N and non-photo-sensing area 2212N, the non-photo-sensing Area 2212N is surrounded on the photosensitive area 2211N peripheries.The photosensitive area 2211N is used to carry out photosensitization, the connecting line 224N is connected to the non-photo-sensing area 2212N.

This preferred embodiment according to the present utility model, the disjunctor encapsulation part 21N extend the sensitive chip The non-photo-sensing area 2212N of 221N, so as to which sensitive chip 221N laminations by way of molding are fixed on the line Road plate body 222N.Mode in this way, the mode (Molding on chip) for being such as molded into chip expand the company The inside mouldable range of body encapsulation part 21N, so as to reduce the circuit plate body 222N and disjunctor encapsulation The structural moiety in the outside of portion 21N further reduces the length and width dimensions of the molding photographic department 22N parts, reduces by its assembling The array camera module length and width dimensions.

The photosensory assembly 20N further comprises two optical filter 226N, each optical filter 226N moldings ground lamination setting In on the corresponding sensitive chip 221N.The edge of each optical filter 226N is molded into the disjunctor encapsulation part 21N, from And the fixed optical filter 226N.It is noted that the optical filter 226N is covered in above the sensitive chip 221N, The sensitive chip 221N with external environment is isolated, the sensitive chip 221N is protected to be damaged.

When manufacturing the photosensitive circuit pack of the molding, the sensitive chip 221N is first attached at the circuit plate body 222N, and the sensitive chip 221N and the circuit plate body 222N are connected to by described, and then by the optical filter 226N It is attached on the sensitive chip 221N, further, by the circuit plate body 222N and sensitive chip 221N and described Optical filter 226N is molded, and forms the disjunctor encapsulation part 21N.In molding, since the optical filter 226N is covered in institute It states on sensitive chip 221N, therefore injury of the mold of molding for the sensitive chip 221N can be prevented, and due to described The distance of the optical filter 226N and sensitive chip 221N reduces, therefore can cause the rear coke of the camera module by its assembling Teaching aid reduces, so as to reduce the height of the array camera module, on the other hand, due to not needing to carry for the optical filter 226N For additional support member, therefore also to a certain extent so that the thickness of the array camera module is further reduced.

In this embodiment of the utility model, the disjunctor encapsulation part 21N is raisedly around each photosensitive core On the outside of the photosensitive area 2211N of piece 221N, particularly, the disjunctor encapsulation part 21N is integrally closed connection so that has good Good leakproofness, thus when the photosensory assembly 20N be used to assemble the array camera module, the sensitive chip 221N Inside is sealed in, forms space in a closing.

Specifically, when manufacturing the photosensory assembly 20N, a traditional wiring board can be chosen as the wiring board master Body 222N sets a sensitive chip 221N on the circuit plate body 222N, the sensitive chip 221N is passed through institute Connecting line 224N electrical connections are stated, each optical filter 226N overlappings are further attached at the corresponding sensitive chip 221N On, and then molded on the molding circuit plate body 222N after tentatively assembling and sensitive chip 221N components, such as use Injection molding machine will carry out SNT techniques (Surface Mount Technology by insert molding (Insert Molding) technique Surface mount process) after wiring board carry out molding and form the disjunctor encapsulation part 21N or with mould common in semiconductor packages Pressure technique forms the disjunctor encapsulation part 21N.The circuit plate body 222N can with selected as, illustrate ground but be not limited to, it is soft or hard Board, ceramic substrate (without soft board), PCB hardboards (without soft board) etc..The mode that the disjunctor encapsulation part 21N is formed can be with Selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the disjunctor encapsulation part 21N can be selected for, Citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer polymerization Object), PP (Polypropylene, polypropylene) etc., resin may be used in mould pressing process.It should be understood by those skilled in the art that It is the aforementioned manufacture that can be selected and the material that can be selected, be illustrative only the utility model can be real The mode applied not is the limitation of the utility model.

With reference to Figure 17, the array camera module and its wiring board group of the 9th preferred embodiment according to the present utility model Part.Different from above preferred embodiment, the array camera module includes an at least stent 70, for installing each filter Mating plate 40, each camera lens 50 or each motor 60.This embodiment according to the present utility model, the stent 70 are mounted In the disjunctor encapsulation part 11, each optical filter 40 is installed in the stent 70, and each motor 60 is installed in described Stent 70.The concrete shape of the stent 70 can be arranged as required to, for example set boss, in order to install each optical filtering Piece.Shown stent 70 can be a disjunctor stent, that is to say, that can with the multiple optical filters 40 of once mounting or Support unit, that is, one optical filter 40 of installation.In this embodiment of the utility model, the stent 70 is preferred For disjunctor stent.Those skilled in the art is it should be understood that the concrete shape of the stent 70 is not the utility model Limitation.

It should be understood by those skilled in the art that the embodiment of foregoing description and attached the utility model shown in figure is only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The work(of the utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, the embodiment of the utility model Can there are any deformation or modification.

Claims (17)

1. the photosensory assembly of pair camera module, which is characterized in that including：Disjunctor encapsulation part and photographic department, the photographic department include Circuit plate body and two sensitive chips, the disjunctor encapsulation part integral packaging in the circuit plate body and the sensitive chip, Wherein described disjunctor encapsulation part forms two through hole, and each through-hole provides passage of light to the sensitive chip, wherein the company Body encapsulation part is also equipped with stent, and the stent is suitable for installation optical filter.

2. photosensory assembly according to claim 1, wherein each through-hole of the disjunctor encapsulation part in internal diameter by down toward It is upper increased skewed.

3. photosensory assembly according to claim 1, the stent of two of which monomer is installed on the disjunctor encapsulation part, to divide It An Zhuan not two optical filters.

4. the stent of photosensory assembly according to claim 1, wherein disjunctor is installed on the disjunctor encapsulation part, with In two optical filters of installation.

5. photosensory assembly according to claim 1, wherein the cantilever tip is suitable for installing the mirror of double camera modules Head.

6. photosensory assembly according to claim 1, wherein the cantilever tip is suitable for installing the horse of double camera modules It reaches.

7. photosensory assembly according to any one of claims 1 to 6, wherein the photographic department includes connecting line, each connection Line is electrically connected the sensitive chip and the circuit plate body, and the disjunctor encapsulation part coats the connecting line, so that described Connecting line will not be directly exposed to outside, wherein the connecting line is selected from combination：One kind in gold thread, silver wire, copper wire or aluminum steel.

8. according to the photosensory assembly any in claim 1 to 6, wherein each sensitive chip includes photosensitive area and non-sense Light area, the non-photo-sensing area extend to the sensitive chip around photosensitive area periphery, the disjunctor encapsulation part molding The non-photo-sensing area.

9. according to the photosensory assembly any in claim 1 to 6, wherein the photographic department includes circuit element, the electricity Circuit component protrudes from the circuit plate body, and the disjunctor encapsulation part coats at least one circuit element, so that the electricity Circuit component will not be directly exposed to outside, wherein circuit element selection combination：Resistance, capacitance, diode, triode, electricity One or more of which in position device, relay and driver.

10. according to the photosensory assembly any in claim 1 to 6, wherein the photographic department includes reinforcing layer, the reinforcing Layer laminate is set to the wiring board bottom part body, to enhance the structural strength of the circuit plate body.

11. according to the photosensory assembly any in claim 1 to 6, wherein the photographic department includes shielded layer, the shielding Layer wraps up the circuit plate body and the disjunctor encapsulation part, to enhance the electromagnetism interference performance of the photosensory assembly.

12. according to the photosensory assembly any in claim 1 to 6, wherein the material of the wiring board main body can be selected from Combination：Rigid Flex, ceramic substrate, PCB hardboards or FPC.

13. according to the photosensory assembly any in claim 1 to 6, wherein the material of the disjunctor encapsulation part is selected from combination： One kind in epoxy resin, nylon, LCP or PP.

14. according to the photosensory assembly any in claim 1 to 6, wherein the photosensory assembly includes two motors connection knot Structure, each motor connection structure are selected from following one of which：

Each motor connection structure includes lead, and the lead is set to the disjunctor encapsulation part, and is electrically connected to the line Road plate body, the lead include motor connecting pin, the disjunctor encapsulation part are revealed in, in order to connect motor pin；

Each motor connection structure includes lead and pin slot, and the lead is arranged at the disjunctor encapsulation part, and is electrically connected The circuit plate body is connected to, the pin slot is arranged at the disjunctor encapsulation part upper end, and the lead connects including motor End is connect, the motor connects end line in the groove bottom wall, is electrically connected to when being plugged in the pin slot in order to motor pin The motor connecting pin；

Each motor connection structure includes pin slot and circuit junction, and the circuit junction is electrically connected to the wiring board master Body, the pin slot are arranged at the disjunctor encapsulation part, and the top of the disjunctor encapsulation part is extended to by the circuit plate body End, and the circuit junction is revealed in the pin slot, and institute is electrically connected to when being plugged in the pin slot in order to motor pin State circuit junction；

Each motor connection structure includes engraving circuit, and the engraving circuit is set to the disjunctor encapsulation part, is electrically connected to The circuit plate body, in order to be electrically connected motor pin；With

Each motor connection structure is the circuit by the motor and the photosensory assembly by traditional welding procedure Plate body is connected.

15. pair camera module, which is characterized in that including two camera lenses and according to any described photosensitive group in claim 1-14 Part.

16. pair camera module, which is characterized in that including two camera lenses and photosensory assembly, the photosensory assembly includes disjunctor encapsulation part And photographic department, the photographic department include circuit plate body and two sensitive chips, the disjunctor encapsulation part integral packaging is in the line Road plate body and the sensitive chip, wherein the disjunctor encapsulation part forms two through hole, each through-hole gives the sensitive chip Passage of light is provided, the photographic department further includes connecting line, and each connecting line is electrically connected the sensitive chip and the circuit Plate body, the disjunctor encapsulation part coat the connecting line, so that the connecting line will not be directly exposed to outside, it is each described Sensitive chip includes photosensitive area and non-photo-sensing area, and the non-photo-sensing area is peripheral around the photosensitive area, the disjunctor encapsulation part Molding extends to the non-photo-sensing area of the sensitive chip and positioned at the outside of the photosensitive area, wherein the photographic department includes Circuit element, the circuit element protrude from the circuit plate body, at least one electricity described in the disjunctor encapsulation part cladding Circuit component, so that the circuit element will not be directly exposed to outside, wherein circuit element selection combination：Resistance, electricity One or more of which in appearance, diode, triode, potentiometer, relay and driver.

17. electronic equipment, which is characterized in that including double camera modules as described in any in claim 15 to 16.