CN105744131B - Array camera module and its circuit board module and manufacturing method - Google Patents

Array camera module and its circuit board module and manufacturing method Download PDF

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Publication number
CN105744131B
CN105744131B CN201610148338.0A CN201610148338A CN105744131B CN 105744131 B CN105744131 B CN 105744131B CN 201610148338 A CN201610148338 A CN 201610148338A CN 105744131 B CN105744131 B CN 105744131B
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CN
China
Prior art keywords
circuit board
wiring board
encapsulation part
main body
board module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610148338.0A
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Chinese (zh)
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CN105744131A (en
Inventor
王明珠
赵波杰
田中武彦
陈飞帆
丁亮
蒋恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201610148338.0A priority Critical patent/CN105744131B/en
Priority to US15/075,192 priority patent/US10750071B2/en
Publication of CN105744131A publication Critical patent/CN105744131A/en
Priority to US15/317,118 priority patent/US10197890B2/en
Priority to CN201680082094.9A priority patent/CN108702431A/en
Priority to EP16890345.8A priority patent/EP3419276A4/en
Priority to KR1020207036744A priority patent/KR102320911B1/en
Priority to KR1020207019624A priority patent/KR102195988B1/en
Priority to PCT/CN2016/103250 priority patent/WO2017140118A1/en
Priority to KR1020187026153A priority patent/KR102134529B1/en
Priority to JP2018542703A priority patent/JP7005505B2/en
Priority to TW106108564A priority patent/TWI657306B/en
Priority to TW106108561A priority patent/TWI648586B/en
Priority to TW106203625U priority patent/TWM556869U/en
Priority to US15/460,213 priority patent/US10630876B2/en
Priority to US15/460,216 priority patent/US9781324B2/en
Priority to TW106203628U priority patent/TWM559422U/en
Priority to TW107147598A priority patent/TWI701493B/en
Priority to US15/460,221 priority patent/US9894772B2/en
Priority to US15/460,207 priority patent/US9955055B2/en
Priority to US15/460,231 priority patent/US9876948B2/en
Priority to US15/460,235 priority patent/US10277792B2/en
Priority to US15/461,413 priority patent/US9876949B2/en
Priority to US15/460,236 priority patent/US10084949B2/en
Priority to US15/784,171 priority patent/US10237460B2/en
Priority to US16/101,509 priority patent/US10367983B2/en
Priority to US16/157,082 priority patent/US10670946B2/en
Priority to US16/436,934 priority patent/US10735637B2/en
Application granted granted Critical
Publication of CN105744131B publication Critical patent/CN105744131B/en
Priority to US16/855,988 priority patent/US11163216B2/en
Priority to US16/908,723 priority patent/US11303789B2/en
Priority to US16/919,065 priority patent/US11706516B2/en
Priority to US17/685,587 priority patent/US11743569B2/en
Priority to US18/203,252 priority patent/US20230300442A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

An array camera module and its circuit board module and manufacturing method, wherein the circuit board module of the array camera module includes: a wiring board portion and a disjunctor encapsulation part；The wiring board portion is used to be electrically connected at least two sensitive chips of the array camera module, and the disjunctor encapsulation part integral packaging is in the wiring board portion.

Description

Array camera module and its circuit board module and manufacturing method
Technical field
The present invention relates to camera module fields, further, are related to an array camera module and its circuit board module and system Make method.
Background technique
Currently, most of electronic product all integrates more functions increasingly, this trend goes out gas producing formation transboundary It is not poor, for example, mobile phone be highly integrated via initial communication equipment after form a collection communication, camera shooting, online, navigate etc. Diversification, three-dimensional function are integrated arrival mobile electronic device.
However, the camera module for being configured in mobile electronic device at present is single-lens camera module mostly, this list mirror Head camera module is either that all can no longer meet user in the quality of image or effect to set mobile electron in shooting Standby multi-functional application demand.
Have already appeared and ever more popular be have more than the camera module of a camera lens, such as twin-lens image mould Group, twin-lens camera module provides the style of shooting of apish eyes structure, and this twin-lens camera module is in 3D All various aspects such as shooting and scanning, hand gesture location identification, color fidelity, rapid focus, panorama deeply shooting, background blurring shooting The performance more more excellent than single-lens camera module is suffered from, therefore, the camera module for having more than a camera lens is to image from now on The important directions of the development of mould group industry.During using twin-lens camera module filmed image, twin-lens camera module Image is obtained from two positions respectively using two imaging modules with differences in spatial location, then according to image composition method After the Image compounding shot respectively to two imaging modules, the final image of more camera lens camera modules is obtained.It is understood that It is, in this process, the one of the image effects such as resolving power, shading, color of each imaging modules of more camera lens camera modules Cause property, and be the weight for measuring the image quality of twin-lens camera module in horizontal, vertically, longitudinally three directions deviation Want index.
However, the structure of current stage manufacture, the technique of assembling twin-lens camera module and twin-lens camera module is all remote The image quality of twin-lens camera module is not can guarantee far.Fig. 1 shows the twin-lens camera module of the prior art comprising one Wiring board 10P, two microscope base 20P and two image-forming module 30P, each image-forming module 30P respectively include a motor camera lens Component 31P.Each microscope base 20P is individually located in the ipsilateral of the wiring board 10P, and each microscope base 20P passes through The wiring board 10P links together, and each motor lens assembly 31P is separately positioned on each microscope base 20P, with It is supported by each microscope base 20P.It is understood that coming from the packaging technology of the twin-lens camera module of the prior art See, each microscope base 20P be individually be mounted on the wiring board 10P, thus will lead to each microscope base 20P it Between the more difficult to govern control such as size, position so that making size, the position etc. between each twin-lens camera module bracket The consistency of parameter is poor.From the point of view of the structure of the twin-lens camera module of the prior art, each microscope base 20P difference It is independent, and each microscope base 20P only passes through the wiring board 10P and is attached, since the wiring board 10P is usually selected PCB circuit board, so that wiring board 10P's is more soft and easily deformable in itself, at this moment, the twin-lens camera module Whole rigidity is difficult to ensure, in the use process after twin-lens camera module is assembled to be completed, such knot Structure is easy to cause the relative size between each element of the image-forming module 30P, such as the motor lens assembly 31P unstable Calmly, the generation for the problems such as position of related features is big, and the optical axis of each image-forming module 30P is easy deviation preset position, one Any one of these situations of denier occur, and can all give the image quality of the twin-lens camera module, such as Image compounding etc. Final imaging effect brings uncontrollable factor or larger adverse effect.
In addition, the assembling of more camera lens camera modules be based on traditional COB (Chip On Board chip package) technique, Usually there is the circuit devcie 11P of protrusion on the wiring board 10P, and a sensitive chip 12P, institute are installed on the wiring board It states sensitive chip 12P and usually passes through gold thread 121P and be connected to the wiring board 10P, and usually arc-shaped convex of the gold thread 121P Out with the wiring board main body, therefore, the circuit devcie 11P and the gold thread 121P of these protrusions are for camera module Assembling also brings some unfavorable factors.
The circuit devcie 11P and gold thread 121P is directly exposed to the surface of the wiring board 10P, therefore rear During continuous assembling, for example the processes such as the microscope base 20P, the welding motor lens assembly 31P are pasted, inevitably It is affected, solder resist, dust when welding etc. be easy to be attached to the circuit devcie 11P, and the circuit devcie 11P and institute It states sensitive chip 12P to be located in an interconnected space, therefore dust pollutant is easy to influence the sensitive chip 12P, such influence may cause the camera module after assembling there are bad phenomenons such as pitch-black points, reduce product yield.
Secondly, the microscope base 20P is located at the outside of the circuit devcie 11P, therefore the microscope base 20P and described is being installed When wiring board 10P, need to reserve certain safe distance between the microscope base 20P and the circuit devcie 11P, and in level Direction and upwardly direction require reserved safe distance, this increases the demand of camera module thickness to a certain extent Amount, is difficult to decrease its thickness.
In addition, the molding of single camera opposite for the molding of multi-cam, the coordination being related between multiple camera modules Problem requires optical axis consistent between a plurality of lenses, and the consistency of a plurality of lenses optical axis based on traditional COB technique is rareer To guarantee.And multi-cam mould group overall volume is larger, it is more sensitive to the intensity and flatness of wiring board, therefore wiring board Thickness is larger.
Summary of the invention
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Stating circuit board module includes a disjunctor encapsulation part and a wiring board portion, and the disjunctor encapsulation part encapsulated moulding is in the wiring board Portion, the disjunctor encapsulation part are suitable for corresponding a plurality of lenses.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Stating circuit board module includes a wiring board main body and an at least circuit element, and the circuit element protrudes from the wiring board master Body, the circuit element is coated by the disjunctor encapsulation part, so that outside will not be directly exposed to.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Stating array camera module includes multiple sensitive chips, and the disjunctor encapsulation part is around the outside of each sensitive chip.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Stating disjunctor encapsulation part includes an optical filter construction section, is suitable for installing multiple optical filters, without additional independent support portion Part.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Wiring board main body is stated with multiple inner groovies, each sensitive chip is arranged in the inner groovy, described in order to reduce The relative altitude of sensitive chip and the wiring board main body, to reduce the requirement for height to the disjunctor encapsulation part.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Wiring board main body is stated with multiple accesses and multiple external grooves, the external groove is connected to the access, and the external groove is suitable for The sensitive chip is installed to upside-down mounting.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Stating wiring board portion includes a reinforcing layer, is set to the wiring board bottom part body, lamination to enhance the wiring board main body Structural strength and heat dissipation performance.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Wiring board main body is stated with an at least reinforced hole, the disjunctor encapsulation part extends into the reinforced hole, thus described in enhancing The structural strength of line plate main body.
It is an object of the present invention to provide an array camera module and its circuit board module and manufacturing method, wherein institute Stating disjunctor encapsulation part includes a camera lens construction section, is suitable for installation a plurality of lenses, to provide installation site for the camera lens.
In order to realize that the above goal of the invention, an aspect of of the present present invention provide the circuit board module of an array camera module, Include: a wiring board portion, is used to be electrically connected at least two sensitive chips of the array camera module；It is encapsulated with a disjunctor Portion；The disjunctor encapsulation part integral packaging is in the wiring board portion.
An embodiment according to the present invention, disjunctor encapsulation part described in the circuit board module form at least two through hole, respectively The through-hole is opposite with each sensitive chip, to provide the sensitive chip passage of light.
An embodiment according to the present invention, disjunctor encapsulation part top described in the circuit board module in planar, with In bracket, camera lens, motor or the optical filter of installing the array camera module.
An embodiment according to the present invention, disjunctor encapsulation part top described in the circuit board module is at least two installations Slot, each mounting groove are connected to the corresponding through-hole, to be respectively used to install the bracket of the array camera module, filter Piece, camera lens or motor.
An embodiment according to the present invention, disjunctor encapsulation part described in the circuit board module include a cladding section, a filter Mating plate construction section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively upward by the cladding section Molding extends, and internal in step-like, in order to install the optical filter and camera lens of the array camera module.
An embodiment according to the present invention, optical filter construction section described in the circuit board module is at least two installations Slot, each mounting groove are connected to the corresponding through-hole, the first step-like rank are formed, in order to install the optical filtering Piece, the camera lens construction section have at least two camera lens mounting grooves, and each camera lens mounting groove is connected to the corresponding through-hole, shape At the step-like second-order, in order to install the camera lens of the array camera module.
An embodiment according to the present invention, camera lens construction section described in the circuit board module have at least two camera lenses Wall, each camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
An embodiment according to the present invention, wiring board portion described in the circuit board module include an at least circuit element, The circuit element protrudes from the wiring board main body, and the disjunctor encapsulation part coats the circuit element, so that the electricity Circuit component will not be directly exposed to outside.
An embodiment according to the present invention, circuit element described in the circuit board module selection combination: resistance, capacitor, One or more of them in diode, triode, potentiometer, relay and relay.
An embodiment according to the present invention, wiring board portion described in the circuit board module includes a reinforcing layer, described to add Gu layer laminate is set to the wiring board bottom part body, to enhance the structural strength of the wiring board main body.
An embodiment according to the present invention, reinforcing layer described in the circuit board module is metal plate, to enhance the line The heat dissipation performance in road plate portion.
An embodiment according to the present invention, wiring board portion described in the circuit board module include a shielded layer, the screen It covers layer and wraps up the wiring board main body and the disjunctor encapsulation part, to enhance the electromagnetism interference performance of the circuit board module.
An embodiment according to the present invention, shielded layer described in the circuit board module are metal plate or metal mesh.
An embodiment according to the present invention, wiring board main body has an at least reinforced hole in the circuit board module, described Disjunctor encapsulation part extends into the reinforced hole, in order to enhance the structural strength of the wiring board main body.
An embodiment according to the present invention, reinforced hole described in the circuit board module are groove-like.
An embodiment according to the present invention, reinforced hole described in the circuit board module is through-hole, so that the disjunctor The moulding material of encapsulation part comes into full contact with the wiring board main body, and easily fabricated.
An embodiment according to the present invention, wiring board main body has at least two accesses in the circuit board module, is suitable for each The sensitive chip is installed on the wiring board main body from the wiring board main body back side direction.
An embodiment according to the present invention, access described in the circuit board module is in step-like, in order to be the sense Optical chip provides stable installation site.
An embodiment according to the present invention, the material of wiring board main body described in the circuit board module can be selected from group It closes: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
An embodiment according to the present invention, the material of disjunctor encapsulation part described in the circuit board module are selected from combination: ring One of oxygen resin, nylon, LCP or PP or a variety of.
An embodiment according to the present invention, circuit board module described in the circuit board module are connected including at least two motors Structure, each motor connection structure include an at least lead, and the lead is set to the disjunctor encapsulation part, and is electrically connected to The wiring board main body, the lead include a motor connecting pin, the disjunctor encapsulation part are revealed in, in order to connect a motor Pin.
An embodiment according to the present invention, circuit board module described in the circuit board module are connected including at least two motors Structure, each motor connection structure includes an at least lead and at least a pin slot, the lead are arranged at the disjunctor Encapsulation part, and it is electrically connected to the wiring board main body, the pin slot is arranged at disjunctor encapsulation part upper end, described to draw Line includes a motor connecting pin, motor connection end line in the groove bottom wall, in order to a motor pin be plugged in it is described The motor connecting pin is electrically connected to when pin slot.
An embodiment according to the present invention, circuit board module described in the circuit board module are connected including at least two motors Structure, each motor connection structure include at least a pin slot and at least a circuit junction, and the circuit junction is electrically connected to The wiring board main body, the pin slot are arranged at the disjunctor encapsulation part, extend to the company by the wiring board main body The top of body encapsulation part, and the circuit junction is revealed in the pin slot, in order to which a motor pin is plugged in the pin The circuit junction is electrically connected to when slot.
An embodiment according to the present invention, circuit board module described in the circuit board module are connected including at least two motors Structure, each motor connection structure include at least one engraving route, and the engraving route is set to the disjunctor encapsulation part, electricity It is connected to the wiring board main body, in order to be electrically connected a motor pin.
An embodiment according to the present invention, engraving route described in the circuit board module are arranged in a manner of laser formation In the disjunctor encapsulation part.
Another aspect of the present invention provides the manufacturing method of the circuit board module of an array camera module comprising step: The one disjunctor encapsulation part of unitary packed in a wiring board main body.
According to another embodiment of the present invention, comprising steps of being arranged at least in the manufacturing method of the circuit board module Two through hole is to the disjunctor encapsulation part.
According to another embodiment of the present invention, comprising steps of by described in the manufacturing method of the circuit board module Disjunctor encapsulation part coats the circuit element for protruding from the wiring board main body.
According to another embodiment of the present invention, comprising steps of in the company in the manufacturing method of the circuit board module Body encapsulation part top forms at least two mounting grooves, in order to mounting bracket, optical filter, motor or camera lens.
According to another embodiment of the present invention, comprising steps of upwardly extending in the manufacturing method of the circuit board module The disjunctor encapsulation part, and to form two stage stepped structures inside each institute's through-hole, in order to install optical filter or camera lens.
According to another embodiment of the present invention, comprising steps of in the line in the manufacturing method of the circuit board module An at least groove-like reinforced hole is set in the plate main body of road, and the disjunctor encapsulation part is made to extend into the reinforced hole.
According to another embodiment of the present invention, comprising steps of in the line in the manufacturing method of the circuit board module An at least through hole shape reinforced hole is set in the plate main body of road, and the disjunctor encapsulation part is made to extend into the reinforced hole.
According to another embodiment of the present invention, comprising steps of in the line in the manufacturing method of the circuit board module Road plate main body bottom attaches a reinforcing layer, to enhance the structural strength of the wiring board main body.
According to another embodiment of the present invention, comprising steps of in the line in the manufacturing method of the circuit board module Road plate main body and the disjunctor encapsulation part coat a shielded layer, to enhance the electromagnetism interference performance of the circuit board module.
According to another embodiment of the present invention, comprising steps of burying multiple in the manufacturing method of the circuit board module Lead makes the lead be electrically connected the wiring board main body to the disjunctor encapsulation part, in order to be separately connected a motor.
According to another embodiment of the present invention, comprising steps of setting is multiple in the manufacturing method of the circuit board module Pin slot makes the motor connecting pin of the lead be revealed in the pin slot to disjunctor encapsulation part upper end.
According to another embodiment of the present invention, comprising steps of being arranged at least in the manufacturing method of the circuit board module A corresponding at least pin slot is arranged to the disjunctor encapsulation part, so that institute to the wiring board main body in one circuit junction It states circuit junction and is revealed in the pin slot, be electrically connected to the circuit when being inserted into the pin slot in order to a motor pin and connect Point.
According to another embodiment of the present invention, comprising steps of setting is multiple in the manufacturing method of the circuit board module Route is carved to the disjunctor encapsulation part, the engraving route is electrically connected to the wiring board main body, in order to be electrically connected One motor.
According to another embodiment of the present invention, engraving route described in the manufacturing method of the circuit board module is with laser Molding mode is set to the disjunctor encapsulation part.
Another aspect of the present invention provides an array camera module comprising circuit board module described in one, at least camera lens At least sensitive chip；Each camera lens is located at the photosensitive path of the corresponding sensitive chip, and each sensitive chip is electrically connected It is connected to the circuit board module.
According to another embodiment of the present invention, the camera module includes a bracket, and the bracket is installed in described Circuit pack is molded, the camera module includes at least two optical filters, and each optical filter is installed in the bracket.
According to another embodiment of the present invention, the camera module includes at least two motors, and each camera lens is mounted In the corresponding motor, each motor is installed on the circuit board module.
According to another embodiment of the present invention, the camera module includes at least two optical filters, each optical filter quilt It is installed on the circuit board module.
Detailed description of the invention
Fig. 1 is that cuing open for prior art twin-lens camera module shows schematic diagram.
Fig. 2A is that the array camera module of first preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Fig. 2 B is another array camera module and its wiring board cut-away view of first preferred embodiment according to the present invention.
Fig. 3 is the manufacturing process schematic diagram of the circuit board module of first preferred embodiment according to the present invention.
Fig. 4 is the circuit board module manufacturing method schematic diagram of first preferred embodiment according to the present invention.
Fig. 5 A, 5B and 5C are the motor connection structures of the molding circuit pack of first preferred embodiment according to the present invention Different embodiments.
Fig. 6 is another array camera module schematic diagram of first preferred embodiment according to the present invention.
Fig. 7 is that the array camera module of second preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Fig. 8 is that the array camera module of third preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Fig. 9 is that the array camera module of the 4th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Figure 10 is that the array camera module of the 5th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Figure 11 is that the array camera module of the 6th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Figure 12 is that the array camera module of the 7th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Figure 13 is that the array camera module of the 8th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Figure 14 is the 9th array camera module of preferred embodiment according to the present invention and its section view of circuit board module Figure.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back Other technologies scheme from the spirit and scope of the present invention.
It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art Language is not considered as limiting the invention.
If Fig. 2A to Fig. 4 is the array camera module and its route board group of first preferred embodiment according to the present invention Part.The array camera module can be applied to various electronic equipments, to assist user that can image by the array Mould group shoots the image of object or person, such as the array camera module can be used to shoot the image of object or personage Or the image datas such as video.Preferably, the array camera module can be applied to a mobile electronic device, such as described Mobile electronic device can be but not limited to mobile phone or tablet computer equipment.
As shown in Fig. 2 B to Fig. 4, the array camera module of the invention is implemented as one in following description with it The contents of the present invention and advantage are illustrated for the array camera module of twin-lens.The array camera module includes a route board group Part 10, two camera lenses 50 and two sensitive chips 30.
It is noted that the present invention is disclosed for convenience, in this embodiment in accordance with the invention, with two camera lenses It is illustrated for the 50 array camera modules constituted, and in other embodiments of the invention, involved 50 He of camera lens The quantity of the sensitive chip 30 can be more, and such as three or more, those skilled in the art is it should be understood that it is counted Amount is not the limitation of array camera module of the invention.
Further, each sensitive chip 30 is installed in the mould group circuit board module, each camera lens respectively 50 are installed on the circuit board module 10, and each camera lens 50 is located at each of corresponding position sensitive chip 30 Photosensitive path, the circuit board module 10 can be coupled to the electronic equipment.Those skilled in the art should understand that , a camera lens 50 and a sensitive chip 30 can cooperate for filmed image.Specifically, it is clapped Object is taken the photograph, the light reflected such as object or person can be received after through the camera lens 50 by the sensitive chip 30 to carry out Photoelectric conversion, in other words, the sensitive chip 30 can convert optical signal into electric signal, and the electric signal can pass through The circuit board module 10 is transferred into the electronic equipment, to generate on the electronic equipment relevant to reference object Image.
The circuit board module 10 includes a disjunctor encapsulation part 11 and a wiring board portion 12,11 one of disjunctor encapsulation part Encapsulation ground be connected to the wiring board portion 12, mold be connected to as described in wiring board portion 12.More specifically, the disjunctor encapsulation (Molding On Board, the MOB) molding by way of being molded into wiring board of portion 11 is connected to the wiring board portion 12.
The wiring board portion 12 includes a wiring board main body 121, and the disjunctor encapsulation part 11 forms two through hole 1100, so that The disjunctor encapsulation part 11 respectively around each 30 outside of the sensitive chip, and provide each camera lens 50 with it is corresponding The passage of light of the sensitive chip 30.Each sensitive chip 30 is arranged at the line of position corresponding to each through-hole 1100 Road plate main body 121.
The disjunctor encapsulation part 11 includes a connector 114 and two outer ring bodies 115, and the molding of connector 114 is integrally It is connected between two outer ring body 115, and two outer ring bodies 115 is divided into adjacent two parts, form two through hole 1100, two sensitive chips 30 are located at the two sides of the connector 114, to be suitable for being used to assemble the array camera shooting mould Group.It is noted that the connector 114 is the common portion of two camera lenses 50, i.e., when installing the camera lens 50, respectively The camera lens 50 respectively occupies the corresponding part of the connector 114.
The wiring board portion 12 includes a connection line (not shown) and an at least circuit element 122.The connection Route defaults in the wiring board main body 121, and the circuit element 122 is electrically connected to the connection line and the photosensitive core Piece 30, for the photosensitive course of work of the sensitive chip 30.The circuit element 122 can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay, driver etc..
In this embodiment in accordance with the invention, the corresponding each sensitive chip 30 of each circuit element 122, in order to match Close the work of each sensitive chip 30.
It is noted that the circuit element 122 can be coated on inside by the disjunctor encapsulation part 11, so that The circuit element 122 will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 30 Enclosed environment in, different from the existing way of circuit element 122 in traditional camera module, such as capacitance resistance ware, to prevent Dust, sundries stay in circuit element 122, pollute sensitive chip 30.In this embodiment, convex with the circuit element 122 It is illustrated for the wiring board main body 121 out, in the other embodiments of invention, the circuit element 122 is embedded in Inside the wiring board main body 121, without protruding from the wiring board main body 121, what those skilled in the art should understand that It is that structure, type and the setting position of the circuit element 121 are not limitation of the invention.It is understood that two institutes The circuit element 122 that can have protrusion between sensitive chip 30 is stated, can be coated by the connector 114, in this way The additional installation space that microscope base is needed in traditional array mould group is not needed, to make the array camera module of the invention Size reduces.
It is noted that the disjunctor encapsulation part 11, which coats the circuit element 122, has the protection circuit element Advantage in terms of 122 advantage and corresponding camera module, it will be understood by those skilled in the art that the disjunctor Encapsulation part 11 is not limited to coat the circuit element 122.That is, in other embodiments of the invention, the disjunctor envelope Dress portion 11 can directly be molded into the wiring board for the circuit element 122 not protruded, and be also possible to be molded into the circuit The different locations such as outside, the surrounding of element 122.
It is noted that in one embodiment of this invention, the disjunctor encapsulation part 11 is raisedly around the sense 30 outside of optical chip, particularly, the disjunctor encapsulation part 11 is integrally closed connection, makes it have good leakproofness, thus When each camera lens 50 is installed in the disjunctor encapsulation part 11, each sensitive chip 30 is sealed in inside, shape respectively At space in corresponding closing.
It specifically, can be in a traditional wiring board conduct when manufacturing the circuit board module 10 referring to Fig. 3 and Fig. 4 The wiring board main body 121 is molded on 121 surface of wiring board main body.For example, in one embodiment, note can be used Molding machine will carry out SMT technique (Surface Mount Technology table by insert molding (insert molding) technique Face attachment process) after wiring board carry out integral packaging, such as molded packages form the disjunctor encapsulation part 11, or pass through half Common mould pressing process forms the disjunctor encapsulation part 11 in conductor encapsulation.Further, each sensitive chip 30 is mounted on Each sensitive chip 30 is then electrically connected with the wiring board main body 121, for example beats by the wiring board main body 121 Gold thread electrical connection.The wiring board main body 121 can choose for, citing ground but be not limited to, Rigid Flex, ceramic substrate are (no Band soft board), PCB hardboard (without soft board) etc..The mode that the disjunctor encapsulation part 11 is formed can choose as, citing ground but unlimited In Shooting Technique, mould pressing process etc..The material that the disjunctor encapsulation part 11 can choose is, citing ground but is not limited to, and is molded work Skill can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, Polypropylene) etc., mould pressing process can use epoxy resin.It can choose it will be apparent to a skilled person that aforementioned Manufacture and the material that can choose are illustrative only the mode that can be implemented of the invention, are not the present invention Limitation.
In other embodiments of the invention, the process for manufacturing the circuit board module 10 is also possible that first to the line Road plate 121 carries out SMT technique, and then each sensitive chip 30 is mounted on the wiring board main body 121, and will be each described Sensitive chip 30 is electrically connected with the wiring board main body 121, for example plays gold thread electrical connection, then will be to the wiring board master Body 121 carries out integral packaging, such as molded packages, the disjunctor encapsulation part 11 is formed by way of insert molding, or pass through Common mould pressing process forms the disjunctor encapsulation part 11 in semiconductor packages.Those skilled in the art it should be understood that The manufacturing sequence of the circuit board module 10 is not limitation of the invention.
It's also worth mentioning that each camera lens 50 is installed in the disjunctor encapsulation part of the circuit board module 10 11, so that the disjunctor encapsulation part 11 is equivalent to the function of the bracket in traditional camera module, for the camera lens 50 provide support, Fixed position, but assemble and be but different from tradition COB technical process.The bracket of the camera module of traditional COB technique is to paste Mode is fixed on wiring board, and the disjunctor encapsulation part 11 by way of being molded into wiring board (Molding On Board, MOB it) is fixed on the wiring board main body 121, does not need to paste fixation procedure, molding mode is fixed with more preferable relative to pasting Connective stability and technical process controllability, and between the disjunctor encapsulation part 11 and the wiring board main body 121 The glue space of reserved AA adjustment is not needed, therefore reduces the reserved space of traditional camera module AA adjustment, so that array is taken the photograph As the thickness of mould group is reduced；On the other hand, the disjunctor encapsulation part 11 is coated on the circuit element 122, so that traditional Cradling function and circuit element 122 can spatially overlap, do not need as traditional camera module, in circuit devcie week Reserved safe distance is enclosed, so that the height of the disjunctor encapsulation part 11 with cradling function can be set in lesser model It encloses, to further provide the space that camera module thickness can reduce.In addition, the replacement of disjunctor encapsulation part 11 is traditional Bracket avoids bracket bring heeling error when pasting assembling, and the accumulation for reducing the array camera module assembling is public Difference.
It's also worth mentioning that the shape of the disjunctor encapsulation part 11 can more it needs to be determined that, such as in the circuit 122 position of element extends internally, and forms a protrusion, thus increase the corresponding width of the disjunctor encapsulation part 11, and There is no the position of the circuit element 122, the disjunctor molded section 11 consistently extends, and forms the shape of comparison rule, and wide It spends smaller.Those skilled in the art is it should be understood that the concrete shape of the disjunctor encapsulation part 11 is not of the invention Limitation.
Further, the disjunctor encapsulation part 11 includes a cladding section 111 and an optical filter construction section 112, the optical filter It is integrally connected to the molding of construction section 112 the cladding section 111, the molding of cladding section 111 is connected to the wiring board main body 121, for coating the circuit element 122.The optical filter construction section 112 is for installing two optical filters 40, the optical filter 40 may be implemented as but be not limited to cutoff filter (IRCF).
That is, when the circuit board module 10 be used to assemble the array camera module, the array camera shooting Each optical filter 40 of mould group is installed in the optical filter construction section 112, so that the optical filter 40 is located at corresponding institute It states on the photosensitive path of sensitive chip 30, and does not need to provide additional 40 mounting bracket of optical filter.That is, the disjunctor Encapsulation part 11 has the function of conventional stent here, but the advantage based on moulding technology, the optical filter construction section 112 push up Portion can make it have good planarization by the technology mode of mold so that the optical filter 40 entirely by Installation, this point are also an advantage over traditional camera module.
Further, the optical filter construction section 112 forms two mounting grooves 1121, and each mounting groove 1121 is respectively communicated with In the corresponding through-hole 1100, sufficient installation space is provided for the optical filter 40, so that the optical filter 40 will not be convex For the top surface of optical filter construction section 112.That is, two mounting grooves are arranged in 11 upper end of disjunctor encapsulation part 1121, thus respectively by the optical filter 40 it is stable be installed on the disjunctor encapsulation part 11, and disjunctor envelope will not be protruded from The top in dress portion 11.
It is noted that in this embodiment in accordance with the invention, the mounting groove 1121 can be used for installing the filter Mating plate 40, and in other implementations of the invention, the mounting groove 1121 can be used to install the horse of the array camera module It reaches or the components such as camera lens, those skilled in the art is it should be understood that the purposes of the mounting groove 1211 is not the present invention Limitation.
This embodiment according to the invention, the sensitive chip 30 are connected to the route by an at least connecting line 31 Plate main body 121, and it is electrically connected to the connection line.The lead may be implemented as, citing ground but be not limited to, gold thread, Copper wire, aluminum steel, silver wire.Particularly, the connecting line 31 of the sensitive chip 30 can be connected to by traditional COB mode The wiring board main body 121, citing ground but be not limited to, the mode of welding.That is, the sensitive chip 30 and the route The connection of plate main body 121 can make full use of existing mature interconnection technique, to reduce the cost of improved technology, to traditional technique It is made full use of with equipment, avoids the wasting of resources.Certainly, those skilled in the art is it is to be understood that the sense The connection of optical chip 30 and the wiring board main body 121 can also pass through other any goals of the invention of the invention that can be realized Connection type realize, the present invention it is unrestricted in this regard.
It is noted that each sensitive chip 30 is arranged at the line in of the invention this embodiment The upper surface of road plate main body 121, the disjunctor encapsulation part 11 are manufacturing the route around the outside of the sensitive chip 30 It when board group part 10, can choose different manufacturing sequences, citing ground but be not limited to, it in one embodiment, can be first described Two sensitive chips 30 are installed, then in each 30 outside of sensitive chip, the wiring board main body in wiring board main body 121 121 upper mold mouldings will protrude above the circuit element 122 of the wiring board main body 121 at the disjunctor encapsulation part 11 It is coated on inside it.And in another embodiment of the invention, can first the 121 upper mold moulding of wiring board main body at The disjunctor encapsulation part 11, and the circuit element 122 that will protrude above the wiring board main body 121 is coated on inside it, Then the sensitive chip 30 is installed on the wiring board main body 121, is located at the inside of the disjunctor encapsulation part 11.
In this embodiment in accordance with the invention, it is illustrated by taking the array camera module of the composition of two camera lenses 50 as an example, A kind of mode that the array camera module can be carried out, and by the advantage of moulding technology, it is two 40 Hes of optical filter Two camera lenses 50 provide consistent installation environment, so that the array camera module obtains more preferably optical property.? In the other embodiment of the present invention, the array camera module can also include more than two camera modules, correspondingly, the line Road board group part 10 forms more than two through-holes 1100, those skilled in the art it should be understood that the camera lens 50 number Amount is not limitation of the invention.
Referring to Fig. 6, in of the invention one preferable embodiment, each camera lens 50 can respectively include one Optical lens 50, each optical lens 50 can be directly connected in the disjunctor encapsulation part of the circuit board module 10 11.That is, in this embodiment, the camera lens 50 is tight shot component, i.e., the focal length of the described camera lens 50 can not Freely to be adjusted, it will be appreciated by those skilled in the art that, the optical lens 50 described in the invention can be with It is directly connected in the disjunctor encapsulation part 11, is connected to the feelings of the disjunctor by a shell including the optical lens 50 Condition.And in preferable embodiment of the invention, referring to Fig. 2 B, the array camera module includes a motor 60, each The motor 60 is installed in the disjunctor encapsulation part 11, and the camera lens 50 can be drivingly coupled to the motor 60, thus The motor 60 can drive the optics to move along the photosensitive path of the sensitive chip 30, to adjust the camera lens 50 Focal length.That is, in this embodiment, the camera lens 50 is 50 component of zoom lens, i.e., the focal length of the described camera lens 50 It can be adjusted, such as user is when using the 50 camera module filmed image of twin-lens, it can be by adjusting the mirror First 50 focal length adjusts shooting effect.
It is noted that this preferred embodiment according to the present invention, the disjunctor encapsulation part 11 can be used to support Each optical filter 40, each camera lens 50 or each motor 60 are installed, have the function of conventional stent, and based on molding Advantage, the disjunctor encapsulation part 11 can control the planarization and consistency of the disjunctor encapsulation part by mold, to be Each colour filter of the array camera module, 40, each camera lens 50 and each motor 60 provide smooth and consistent Installation environment, to be easier to ensure that the consistency of each camera lens optical axis, this point is that traditional array camera module is not easy to reach It arrives.
It's also worth mentioning that integrally disjunctor is molded to wiring board main body 121 to the disjunctor encapsulation part 11, enhancing The structural strength of the wiring board main body, therefore the array camera module of relatively traditional COB mode, array of the invention are taken the photograph As the wiring board main body 121 of mould group can achieve smaller thickness, and it can satisfy each camera lens and the requirement of each motor strength. On the other hand, the disjunctor encapsulation part 11 can make the distance between each described camera lens 50 reduce, therefore further decrease institute State the lateral length and width dimensions of array camera module.
Further, this preferred embodiment according to the present invention, the circuit board module 10 are connected including at least two motors Structure 13 is respectively used to connect two motors 60 of the array camera module.Each motor 60 has an at least motor pin 61.Each motor connection structure 13 includes an at least lead 131, and each lead 131 is for being electrically connected 60 He of motor The wiring board main body 121.Each lead 131 is electrically connected to wiring board main body 121.Further, each lead 131 is electrically connected It is connected to the connection circuit of the wiring board main body 121.The lead 131 is arranged at the disjunctor encapsulation part 11, and extends To the top of the disjunctor encapsulation part 11.The lead 131 includes a motor connecting pin 1311, is revealed in the disjunctor encapsulation part 11 top, for being electrically connected the pin 61 of the motor 60.It is noted that the lead 131 can formed Embedding manner is arranged when the disjunctor encapsulation part 11.In traditional connection type, the components such as drive motor all pass through Individual conducting wire is set to be connected to wiring board, manufacturing process is relative complex, and buries in this molding of the invention described The mode of lead 131 can replace traditional motor the technical process such as to weld, and make circuit connection more stable.Especially Ground, in an implementation of the invention, the lead 131 is a conducting wire, is embedded in inside the disjunctor encapsulation part 11.Citing Ground, the motor pin 61 can be connected to the motor connecting pin 1311 by anisotropic conductive film, can also pass through weldering The mode connect is connected to the motor connecting pin 1311.
It is noted that the burial place of the lead 131 and the motor connecting pin 1311 of the lead 131 It can according to need setting in the position of the disjunctor encapsulation part 11 display, for example, in one embodiment of this invention, it is described to draw The motor connecting pin 1311 of line 131 can be arranged at the periphery of the disjunctor encapsulation part 11, i.e., the described disjunctor encapsulation part 11 top surface, the top surface of the optical filter construction section 112, and in another embodiment of the invention, the motor connection End 1311 can be arranged at the interior of the disjunctor encapsulation part 11 and enclose, i.e., 1121 bottom of the mounting groove of the described disjunctor encapsulation part 11 Face, so as to provide the motor 60 different installation sites.In other words, when the motor 60 needs to install to the company When at the top of body encapsulation part, the motor connecting pin 1311 is set to disjunctor encapsulation part periphery top surface, when the motor 60 When needing installation to the mounting groove 1121, the motor connecting pin 1311 is set to the interior of the disjunctor encapsulation part 11 and encloses, i.e., 1121 bottom surface of mounting groove.
That is, can first mount each sensitive chip 30 to the line when manufacturing the circuit board module 10 Road plate main body 121 is then molded the disjunctor encapsulation part 11 in a manner of MOB in the wiring board main body 121, and molded When the lead 131 can be arranged inside the disjunctor encapsulation part 11 with embedding manner, and the lead 131 is electrically connected It is connected to the wiring board main body 121, and the motor connecting pin 1311 of the lead 131 is made to be shown in the disjunctor encapsulation The top in portion, in order to be connected to the motor pin 61 of the motor 60.Citing ground, the circuit board module 10 by with When assembling camera shooting molding, each pin 41 of the motor 60 is connected to the lead 131 by welding The motor connecting pin 1311 so that the motor 60 is electrically connected to the wiring board main body 121, and need to be arranged single Only conducting wire connects the motor 60 and the wiring board main body 121, and makes the motor pin 61 of the motor 60 Length can reduce.
It is an equivalent embodiment of the motor connection structure of above preferred embodiment according to the present invention referring to Fig. 5 A. Each motor connection structure 13 includes a pin slot 133, and the pin slot 133 is used to accommodate the institute of the array camera module State the motor pin 61 of motor 60.The pin slot 133 is arranged at 11 upper end of disjunctor encapsulation part.The motor connects Binding structure 13 includes at least each lead 134 of a lead 134 for being electrically connected the motor 60 and the wiring board main body 121.The lead 134 is arranged at the disjunctor encapsulation part 11, and extends upwardly to the described of the disjunctor encapsulation part 11 The groove bottom wall of pin slot 133.The lead 134 includes a motor connecting pin 1341, is revealed in the institute of the disjunctor encapsulation part 11 The groove bottom wall for stating pin slot 133, for being electrically connected the motor pin 61 of the motor 60.Particularly, in a kind of embodiment party In formula, the motor connecting pin 1341 may be implemented as a pad.The lead 134 may be implemented as a conducting wire, be buried Inside the disjunctor encapsulation part 11.
That is, the sensitive chip 30 is first mounted, then in the route when manufacturing the circuit board module 10 In plate main body 122, the disjunctor encapsulation part 11, and the pin slot 133 of default predetermined length are molded in a manner of MOB, And the lead 134 can be set with embedding manner in molding, and the lead 134 is made to be electrically connected to the wiring board master Body 122, and the motor connecting pin 1341 of the lead 134 is made to be shown in the pin slot of the disjunctor encapsulation part 11 133 groove bottom wall, in order to be connected to the pin 41 of the motor 60.Citing ground, the circuit board module 10 by with When assembling camera shooting molding, each motor pin 61 of the motor 60 is inserted into the pin slot 133, and passes through welding Mode be connected to the motor connecting pin 1341 of the lead 134 so that the motor 60 is electrically connected to the line Road plate main body 122, and need to be arranged individual conducting wire and connect the motor 60 and the wiring board main body 122, and make institute Can steadily connecting for the motor pin 61 of motor 60 is stated, prevents outside is unwanted from touching the motor pin 61. Particularly, the lead 134 may be implemented as a conducting wire, be embedded in inside the disjunctor encapsulation part 11.
It is another equivalent embodiment of the motor connection structure of above preferred embodiment according to the present invention referring to Fig. 5 B. Each motor connection structure 13 includes a pin slot 135, and the pin slot 135 is used to accommodate the institute of the array camera module State the motor pin 61 of motor 60.The pin slot 135 is arranged at the disjunctor encapsulation part 11.The motor connection knot Structure 13 includes an at least circuit junction 132, and the circuit junction 132 defaults in the wiring board main body 122, and is electrically connected to 122 connection line in the wiring board main body.Further, each pin slot 135 is by the disjunctor encapsulation part 11 Top extend to the wiring board main body 122, and the circuit junction 132 is shown.In a kind of way of example, The motor pin 61 is adapted for insertion into the pin slot 135, and can be welded to connect with the circuit junction 132.
That is, presetting each circuit in the wiring board main body 122 when manufacturing the circuit board module 10 Contact 132, and then 121, the photosensitive core is mounted, then in the wiring board main body 122, molded in a manner of MOB described Disjunctor encapsulation part 11, and the pin slot 135 of default predetermined length, and the circuit junction 132 is drawn by described Foot slot 135 is shown, in order to be connected to the motor pin 61 of the motor 60.Citing ground, in the circuit board module 10 When be used to assemble camera shooting molding, each motor pin 61 of the motor 60 is inserted into the pin slot 135, and passes through The mode of welding is connected to the circuit junction 132 in wiring board main body 122, so that the motor 60 is electrically connected to institute Wiring board main body 122 is stated, and the motor pin 61 of the motor 60 is steadily connected, prevents outside from not needing Touch the motor pin 61.
It is another equivalent embodiment of motor connection structure in above-mentioned preferred implementation according to the present invention referring to Fig. 5 C.Institute Stating motor connection structure 13 includes an engraving route 136, and the engraving route 136 is for being electrically connected the wiring board main body 122 On the components such as the connection line, the sensitive chip 30 and motor.Citing ground but be not limited to, the engraving route 136 It can be arranged by way of laser formation (LDS) when forming the disjunctor encapsulation part 11.It is all in traditional connection type Such as drive motor component is all to be connected to wiring board by the way that individual conducting wire is arranged, and manufacturing process is relative complex, and at this The mode that the engraving route 136 is arranged when this molding of invention can replace traditional motor the technical process such as to weld, and And make circuit connection more stable.More specifically, the forming process of the engraving route 136 can be, the present disjunctor The setting engraving slot of encapsulation part 11, is then arranged circuit in the engraving slot in a manner of plating.
In one embodiment of the invention, the motor 60 of the array camera module is connected to the disjunctor envelope The mode of dress is illustrated by taking the connection type of the motor connection structure 13 as an example, such as the side using the lead 131 Formula, and in other embodiments of the invention, the connection type of the motor 60 can also company corresponding with Fig. 5 A, 5B and 5C The mode of connecing is combined, such as using the pin slot 133 and lead 134, the pin slot 135 and the circuit junction 132.And In one embodiment of this invention, referring to Fig. 2A, the motor 60 can be connected to the route board group by traditional mode Part 10, such as by welding.Those skilled in the art is it should be understood that the motor 60 and the route board group The connection type of part 10 is not limitation of the present invention.
As shown in fig. 7, being the array camera module and its circuit board module of second preferred embodiment according to the present invention 10.It is not both that the circuit board module 10 includes a wiring board main body 121A with above preferred embodiment.The wiring board main body 121A includes two inner groovy 1211A, and each sensitive chip 30 is arranged in the corresponding inner groovy 1211A.It is different from Circuit board module 10 in above-described embodiment, the sensitive chip 30 are arranged in the inner groovy 1211A, and by the sensitive chip 30 are accommodated therein, so that the sensitive chip 30 will not obviously protrude from the upper surface of the wiring board main body 121A, so that The height of the relatively described disjunctor encapsulation part 11 of the sensitive chip 30 reduces, to reduce the sensitive chip 30 to the disjunctor The height limitation of encapsulation part 11, provides a possibility that further decreasing height.
Further, the sensitive chip 30 is connected to the wiring board main body 121 by the connecting line 31, and is electrically connected It is connected to the connection line.The lead may be implemented as, citing ground but be not limited to, gold thread, copper wire, aluminum steel, silver wire.Also It is to say, the sensitive chip 30 and the connecting line 31 are all located in the inner groovy 1211A of the wiring board main body 121A. In one embodiment, it when manufacturing the circuit board module 10, needs first to be arranged on the wiring board main body 121A in described Groove 1211A.That is, opening the inner groovy 1211A on traditional wiring board, it is described photosensitive to be adapted to receiving installation Chip 30.
Fig. 8 is that the array camera module of third preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Different from above preferred embodiment, the circuit board module 10 includes a wiring board main body 121B, the line Road plate main body 121B is suitable for installing the sensitive chip 30 with the lower part of two access 1212B, each access 1212B.Each institute Stating access 1212B makes the two sides wiring board main body 121B or more be connected, thus when the sensitive chip 30 is by the line The back side of road plate main body 121B and when photosensitive area is installed on the wiring board main body 121B upward, the sensitive chip 30 Photosensitive area can receive the light entered by the camera lens 50.
Further, there are the wiring board master two external groove 1213B, each external groove 1213B to be connected to corresponding The access 1212B provides the installation site of the sensitive chip 30.Particularly, when the sensitive chip 30 is installed in institute When stating external groove 1213B, the outer surface of the sensitive chip 30 is consistent with the surface of the wiring board main body 121B, is located at same Plane, to guarantee the profile pattern of the circuit board module 10.
In this embodiment in accordance with the invention, the access 1212B is in step-like, consequently facilitating installing the sensitive chip 30, stable installation site is provided for the sensitive chip 30, and show its photosensitive area in interior space.
It is noted that in this embodiment in accordance with the invention, provide it is a kind of different from traditional chip mounting means, That is, flip-chip mode (Flip Chip, FC).By the sensitive chip 30 from the back side direction of the wiring board main body 121B It is installed on the wiring board main body 121B, rather than as needing the front from the wiring board main body 121B in above-described embodiment, That is, from the top of the wiring board main body 121B, and the photosensitive area of the sensitive chip 30 is installed on the wiring board upward Main body 121B.Such structure and mounting means, so that the sensitive chip 30 and the disjunctor encapsulation part 11 are relatively independent, The installation of the sensitive chip 30 not will receive the influence of the disjunctor encapsulation part 11, the disjunctor encapsulation part 11 it is molded Influence to the sensitive chip 30 is also smaller.In addition, the sensitive chip 30 is embedded in the outside of the wiring board main body 121B Face, and the medial surface of the wiring board main body 121B will not be protruded from, so that being reserved on the inside of the wiring board main body 121B Bigger space, so that the height of the disjunctor encapsulation part 11 not will receive the height limitation of the sensitive chip 30, so that institute Smaller height can be reached by stating disjunctor encapsulation part 11.
It is noted that in other embodiments of the invention, the optical filter is installed in the upper end of the access 1212B 40, that is to say, that do not need the optical filter 40 being installed on the disjunctor encapsulation part 11, to reduce the array camera shooting mould The back focal length of group, reduces the height of the camera shooting.Particularly, it is cutoff filter that the optical filter 40, which can be carried out example, IRCF。
Fig. 9 is that the array camera module of the 4th preferred embodiment according to the present invention and its cuing open for circuit board module 10 are shown Figure.
The circuit board module 10 includes a reinforcing layer 123C, is connected to the wiring board to the reinforcing layer 123C lamination 121 bottom of main body, in order to reinforce the structural strength of the wiring board main body 121.That is, in the wiring board main body The region bottom at 30 place of the disjunctor encapsulation part 11 and the sensitive chip mounts the reinforcing layer 123C on 121, thus So that the wiring board main body 121 reliablely and stablely supports the disjunctor encapsulation part 11 and the sensitive chip 30.
Further, the reinforcing layer 123C is a metal plate, and the metal plate is attached at the bottom of the wiring board main body 121 Layer, increases the structural strength of the wiring board main body 121, on the other hand, increases the heat dissipation performance of the circuit board module, can have Imitate the heat that the sensitive chip 30 that scatters and disappears issues.
It is noted that the wiring board main body 121 can be using FPC (Flex Print Circuit, flexibility printing Circuit board), and by the rigidity of FPC described in the reinforcing layer 123C, so that the FPC with excellent bending performance can satisfy institute State the bearing requirements of circuit board module.That is, the selectable range of the wiring board main body 121 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RG (Rigid Flex, Rigid Flex).By described Reinforcing layer 123B increases the structural strength of the wiring board main body 121 and improves heat dissipation performance, so as to reduce the line The thickness of road plate main body 121 so that the height of the circuit board module further decreases, and assembles obtained camera shooting mould by it The height of group reduces.
Figure 10 is that the array camera module of the 5th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Different from above preferred embodiment, the wiring board main body 121D has an at least reinforced hole 1214D, described Disjunctor encapsulation part 11 extends into the reinforced hole 1214D, to enhance the structural strength of the wiring board main body 121D.
The position of the reinforced hole 1214D can according to need selection, and the structural strength need according to the wiring board It asks to be arranged, for example is in symmetrical structure.By the reinforced hole 1214D, the knot so that the wiring board main body 121D is set Structure enhanced strength reduces the thickness of the camera module by its assembling so as to reduce the thickness of the wiring board main body 121D, And improve the heat dissipation performance of the circuit board module.
It is noted that the reinforced hole 1214D is groove-like, thus when manufacturing the circuit board module, the company The moulding material of body encapsulation part 11 will not be leaked out by the reinforced hole 1214D.
Figure 11 is the 6th array camera module of preferred embodiment according to the present invention and its cuing open for circuit board module 10 Diagram.
Different from above preferred embodiment, the wiring board main body 121E has an at least reinforced hole 1214E, described Disjunctor encapsulation part 11 extends into the reinforced hole 1214E, to enhance the structural strength of the wiring board main body 121E.
The position of the reinforced hole 1214E can according to need selection, and the structural strength need according to the wiring board It asks to be arranged, for example is in symmetrical structure.By the reinforced hole 1214E, the knot so that the wiring board main body 121E is set Structure enhanced strength reduces the thickness of the camera module by its assembling so as to reduce the thickness of the wiring board main body 121E, And improve the heat dissipation performance of the circuit board module.
It is noted that the reinforced hole 1214E is perforation, that is to say, that across the wiring board main body 121E, So that the two sides of the wiring board main body 121E are connected to, thus when manufacturing the circuit board module, the disjunctor encapsulation part 11 Moulding material fully in conjunction with the wiring board main body 121E, forms stronger composite structure, and relatively described The structure of groove-like, the perforation are easier to fabricate.
Figure 12 is that the array camera module of the 7th preferred embodiment according to the present invention and its cuing open for circuit board module are shown Figure.
Different from above preferred embodiment, the disjunctor encapsulation part 11F includes a cladding section 111F, optical filter peace Fill section 112F and camera lens construction section a 113F, the optical filter construction section 112F and camera lens construction section 113F successively integrally Molding is connected to the cladding section 111F, and the cladding section 111F molding is connected to the wiring board main body 121, for coating State circuit element 122 and the connecting line 31.The optical filter construction section 112F is used to install the optical filter 40, that is, It says, when the circuit board module be used to assemble the array camera module, 40 quilt of optical filter of the array camera module It is installed on the optical filter construction section 112F, so that the optical filter 40 is located on the photosensitive path of the sensitive chip 30, and It does not need to provide additional 40 mounting bracket of optical filter.That is, the disjunctor encapsulation part 11F has conventional stent here Function, but the advantage based on moulding technology can be by the technique side of mold at the top of the optical filter construction section 112F Formula makes it have good planarization, so that the optical filter 40 is entirely mounted, this point is also an advantage over traditional Camera module.The camera lens construction section 113F is for installing the camera lens 50, that is to say, that when the circuit board module is used for When assembling the array camera module, the camera lens 50 is installed in the camera lens construction section of the disjunctor encapsulation part 11F On the inside of 11F3, in order to provide stable installation site for the camera lens 50.
Further, there is the optical filter construction section 112F two mounting groove 1121F, the mounting groove 1121F to be connected to The corresponding through-hole 1100F provides sufficient installation space for each optical filter 40, so that each optical filter 40 is stablized Installation.There are the camera lens construction section 113F two camera lens mounting groove 1131F, each camera lens mounting groove 1131F to be connected to correspondence The through-hole 1100F, respectively each camera lens 50 provides sufficient installation space.
In other words, the optical filter construction section 112F and the camera lens construction section 113F are integrally upwardly extended, and interior Portion forms step-like structure, and the respectively described optical filter 40 and the camera lens 50, which provide, supports fixed position, without mentioning The optical filter 40 and the camera lens 50 are installed for additional component.
The camera lens construction section 113F has two camera lens inner wall 1132F, and each camera lens inner wall 1132F is in close ring respectively Shape is suitable for camera lens 50 and provides installation space.It is noted that each camera lens inner wall of the camera lens construction section 1132F 1132F surfacing forms fixed-focus mould group to be suitable for installing the non-threaded camera lens 50.Particularly, the camera lens 50 can The camera lens construction section 113F is fixed in a manner of through bonding.
Referring to Fig.1 3, it is the circuit board module and camera module of the 9th preferred embodiment according to the present invention.It is different from Above preferred embodiment, the circuit board module 10 include a shielded layer 126, and the shielded layer 126 wraps up the route Plate main body 122 and the disjunctor encapsulation part 11, thus while enhancing the structural strength of the wiring board main body 122, enhancing The anti-electromagnetic interference capability of the circuit board module 10.
Referring to Fig.1 4, the camera module and its circuit board module of the according to the present invention ten preferred embodiment.It is different from Above preferred embodiment, the camera module include an at least bracket 70, for installing each optical filter 40, each described Camera lens 50 or each motor 60.This embodiment according to the invention, the bracket 70 are installed in the disjunctor encapsulation part 11, each optical filter 40 is installed in the bracket 70, and each motor 60 is installed in the bracket 70.The bracket 70 Concrete shape can according to need setting, such as setting boss, in order to install each optical filter.Shown bracket 70 can be with It is a disjunctor bracket, that is to say, that support unit can be also possible to, that is, pacify with the multiple optical filters 40 of once mounting Fill the optical filter 40.In this embodiment in accordance with the invention, the bracket 70 is preferably disjunctor bracket.The skill of this field Art personnel are it should be understood that the concrete shape of the bracket 70 is not limitation of the invention.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims (43)

1. the circuit board module of an array camera module characterized by comprising
One wiring board portion is used to be electrically connected at least two sensitive chips of the array camera module；With
One disjunctor encapsulation part；The disjunctor encapsulation part integral packaging is in the wiring board portion, wherein the disjunctor encapsulation part is formed At least two through hole, each through-hole is opposite with each sensitive chip, to provide the passage of light of the sensitive chip.
2. circuit board module according to claim 1, wherein disjunctor encapsulation part top is in planar, for installing Bracket, camera lens, motor or the optical filter of the array camera module.
3. circuit board module according to claim 1, wherein disjunctor encapsulation part top has at least two mounting grooves, respectively The mounting groove is connected to the corresponding through-hole, to be respectively used to install bracket, optical filter, the mirror of the array camera module Head or motor.
4. circuit board module according to claim 1, wherein the disjunctor encapsulation part includes a cladding section, optical filter peace Dress section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively molded upwards by the cladding section and are prolonged It stretches, and internal in step-like, in order to install the optical filter and camera lens of the array camera module.
5. circuit board module according to claim 4, wherein the optical filter construction section has at least two mounting grooves, each institute It states mounting groove and is connected to the corresponding through-hole, form the first step-like rank, it is described in order to install the optical filter Camera lens construction section has at least two camera lens mounting grooves, and each camera lens mounting groove is connected to the corresponding through-hole, described in formation Step-like second-order, in order to install the camera lens of the array camera module.
6. circuit board module according to claim 5, wherein the camera lens construction section has at least two camera lens inner walls, each institute It is smooth to state camera lens inner wall surface, is suitable for that a non-threaded camera lens is installed.
7. circuit board module according to any one of claims 1 to 6, wherein the wiring board portion includes an at least circuit elements Part, the circuit element protrude from the wiring board main body, and the disjunctor encapsulation part coats the circuit element, so that described Circuit element will not be directly exposed to outside.
8. circuit board module according to claim 7, wherein circuit element selection combination: resistance, capacitor, two poles One or more of them in pipe, triode, potentiometer and relay.
9. circuit board module according to claim 7, wherein the wiring board portion includes a reinforcing layer, the reinforcing stacking Layer is set to the wiring board bottom part body, to enhance the structural strength of the wiring board main body.
10. circuit board module according to claim 9, wherein the reinforcing layer is metal plate, to enhance the wiring board The heat dissipation performance in portion.
11. circuit board module according to claim 7, wherein the wiring board portion includes a shielded layer, the shielded layer The wiring board main body and the disjunctor encapsulation part are wrapped up, to enhance the electromagnetism interference performance of the circuit board module.
12. circuit board module according to claim 11, wherein the shielded layer is metal plate or metal mesh.
13. circuit board module according to claim 7, wherein wiring board main body has an at least reinforced hole, the disjunctor Encapsulation part extends into the reinforced hole, in order to enhance the structural strength of the wiring board main body.
14. circuit board module according to claim 13, wherein the reinforced hole is groove-like.
15. circuit board module according to claim 13, wherein the reinforced hole is through-hole, so that the disjunctor encapsulates The moulding material in portion comes into full contact with the wiring board main body, and easily fabricated.
16. circuit board module according to claim 7, wherein wiring board main body has at least two accesses, it is suitable for each described Sensitive chip is installed on the wiring board main body from the wiring board main body back side direction.
17. circuit board module according to claim 16, wherein the access is in step-like, in order to be the photosensitive core Piece provides stable installation site.
18. circuit board module according to claim 7, wherein the material of the wiring board main body can be selected from combination: soft Harden plywood, ceramic substrate, PCB hardboard or FPC.
19. circuit board module according to claim 7, wherein the material of the disjunctor encapsulation part is selected from combination: asphalt mixtures modified by epoxy resin One of rouge, nylon, LCP or PP or a variety of.
20. circuit board module according to claim 7, wherein the circuit board module includes at least two motors connection knot Structure comprising an at least lead, the lead are set to the disjunctor encapsulation part, and are electrically connected to the wiring board main body, institute Stating lead includes a motor connecting pin, the disjunctor encapsulation part is revealed in, in order to connect a motor pin.
21. circuit board module according to claim 7, wherein the circuit board module includes at least two motor connection structures, Each motor connection structure includes an at least lead and an at least pin slot, and the lead is arranged at the disjunctor encapsulation Portion, and it is electrically connected to the wiring board main body, the pin slot is arranged at disjunctor encapsulation part upper end, the lead packet A motor connecting pin is included, the motor connecting pin is revealed in the pin slot, in order to which a motor pin is plugged in the pin The motor connecting pin is electrically connected to when slot.
22. circuit board module according to claim 7, wherein the circuit board module includes at least two motors connection knot Structure, each motor connection structure include at least a pin slot and at least a circuit junction, and the circuit junction is electrically connected to institute Wiring board main body is stated, the pin slot is arranged at the disjunctor encapsulation part, extends to the disjunctor by the wiring board main body The top of encapsulation part, and the circuit junction is revealed in the pin slot, in order to which a motor pin is plugged in the pin slot When be electrically connected to the circuit junction.
23. circuit board module according to claim 7, wherein the circuit board module includes at least two motors connection knot Structure, each motor connection structure include at least one engraving route, and the engraving route is set to the disjunctor encapsulation part, is electrically connected It is connected to the wiring board main body, in order to be electrically connected a motor pin.
24. circuit board module according to claim 23, wherein the engraved lines road is set in a manner of laser formation The disjunctor encapsulation part.
25. the manufacturing method of the circuit board module of an array camera module, which is characterized in that comprising steps of in a wiring board master One disjunctor encapsulation part of unitary packed on body, setting at least two through hole to the disjunctor encapsulation part, two through-holes at least Two sensitive chips are opposite, to provide the passage of light of the sensitive chip.
26. the manufacturing method of circuit board module according to claim 25, including step: being encapsulated by the disjunctor Portion coats the circuit element for protruding from the wiring board main body.
27. the manufacturing method of circuit board module according to claim 25, including step: in the disjunctor encapsulation part Top forms at least two mounting grooves, in order to mounting bracket, optical filter, motor or camera lens.
28. the manufacturing method of circuit board module according to claim 25, including step: upwardly extending the disjunctor Encapsulation part, and to form two stage stepped structures inside each institute's through-hole, in order to install optical filter or camera lens.
29. the manufacturing method of circuit board module according to claim 25, including step: in the disjunctor encapsulation part The through-hole inner wall be arranged helicitic texture, in order to install threaded camera lens.
30. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: in the line An at least groove-like reinforced hole is set in the plate main body of road, and the disjunctor encapsulation part is made to extend into the reinforced hole.
31. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: in the line An at least through hole shape reinforced hole is set in the plate main body of road, and the disjunctor encapsulation part is made to extend into the reinforced hole.
32. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: in the line Road plate main body bottom attaches a reinforcing layer, to enhance the structural strength of the wiring board main body.
33. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: in the line Road plate main body and the disjunctor encapsulation part coat a shielded layer, to enhance the electromagnetism interference performance of the circuit board module.
34. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: burying multiple Lead makes the lead be electrically connected the wiring board main body to the disjunctor encapsulation part, in order to be separately connected a motor.
35. according to the manufacturing method of any circuit board module of claim 34, including step: multiple pins are arranged Slot makes the motor connecting pin of the lead be revealed in the pin slot to disjunctor encapsulation part upper end.
36. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: setting is multiple Corresponding pin slot is arranged to the disjunctor encapsulation part, so that the circuit connects to the wiring board main body in circuit junction Point is revealed in the pin slot, is electrically connected to the circuit junction when being inserted into the pin slot in order to motor pin.
37. according to the manufacturing method of any circuit board module of claim 25 to 29, including step: setting is multiple Route is carved to the disjunctor encapsulation part, the engraving route is electrically connected to the wiring board main body, in order to be electrically connected One motor.
38. the manufacturing method of the circuit board module according to claim 37, wherein the engraved lines road is with laser formation Mode is set to the disjunctor encapsulation part.
39. according to the manufacturing method of any circuit board module of claim 25 to 29, wherein the disjunctor encapsulation part is logical It crosses injection molding or mould pressing process is integrally formed at the wiring board main body.
40. an array camera module characterized by comprising
One according to claim 1 to 24 any circuit board modules；
At least two camera lenses；With
At least two sensitive chips；Each camera lens is located at the photosensitive path of the corresponding sensitive chip, each sensitive chip It is electrically connected to the circuit board module.
41. array camera module according to claim 40, wherein the array camera module includes an at least bracket, institute It states bracket and is installed in the circuit board module, the array camera module includes at least two optical filters, each optical filter quilt It is installed on the bracket.
42. array camera module according to claim 40, wherein the array camera module includes at least two motors, respectively The camera lens is installed in the corresponding motor, and each motor is installed on the circuit board module.
43. array camera module according to claim 40, wherein the array camera module includes at least two optical filters, Each optical filter is installed in the circuit board module.
CN201610148338.0A 2016-02-18 2016-03-15 Array camera module and its circuit board module and manufacturing method Active CN105744131B (en)

Priority Applications (32)

Application Number Priority Date Filing Date Title
CN201610148338.0A CN105744131B (en) 2016-03-15 2016-03-15 Array camera module and its circuit board module and manufacturing method
US15/075,192 US10750071B2 (en) 2016-03-12 2016-03-20 Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
US15/317,118 US10197890B2 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
CN201680082094.9A CN108702431A (en) 2016-02-18 2016-10-25 Array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment
EP16890345.8A EP3419276A4 (en) 2016-02-18 2016-10-25 Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
KR1020207036744A KR102320911B1 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, cirduit board assembly and manufacturing method thereof for electronic device
KR1020207019624A KR102195988B1 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, cirduit board assembly and manufacturing method thereof for electronic device
PCT/CN2016/103250 WO2017140118A1 (en) 2016-02-18 2016-10-25 Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
KR1020187026153A KR102134529B1 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, circuit board assembly and method for manufacturing the same for electronic devices
JP2018542703A JP7005505B2 (en) 2016-02-18 2016-10-25 Manufacturing methods for array imaging modules and molded photosensitive assemblies, circuit board assemblies, and their electronic devices.
TW107147598A TWI701493B (en) 2016-03-15 2017-03-15 One-piece base assembly, camera module and array camera module based on integrated packaging process
TW106108561A TWI648586B (en) 2016-03-15 2017-03-15 Camera module and array camera module based on integrated packaging process
TW106203625U TWM556869U (en) 2016-03-15 2017-03-15 Photographing module and array photographing module based upon integrally packaging technique
US15/460,213 US10630876B2 (en) 2016-02-18 2017-03-15 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US15/460,216 US9781324B2 (en) 2016-02-18 2017-03-15 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
TW106203628U TWM559422U (en) 2016-03-15 2017-03-15 Array camera module and its molded photosensitive assembly, circuit board assembly, and electronic device
TW106108564A TWI657306B (en) 2016-03-15 2017-03-15 Array camera module and molded photosensitive component thereof, circuit board assembly and manufacturing method, and electronic device
US15/460,221 US9894772B2 (en) 2016-02-18 2017-03-15 Manufacturing method of molded photosensitive assembly for electronic device
US15/460,207 US9955055B2 (en) 2016-02-18 2017-03-15 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US15/460,231 US9876948B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,235 US10277792B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/461,413 US9876949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,236 US10084949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/784,171 US10237460B2 (en) 2016-03-12 2017-10-15 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/101,509 US10367983B2 (en) 2016-03-12 2018-08-12 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/157,082 US10670946B2 (en) 2016-02-18 2018-10-10 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US16/436,934 US10735637B2 (en) 2016-03-12 2019-06-11 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/855,988 US11163216B2 (en) 2016-02-18 2020-04-22 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US16/908,723 US11303789B2 (en) 2016-03-12 2020-06-22 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/919,065 US11706516B2 (en) 2016-03-12 2020-07-01 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/685,587 US11743569B2 (en) 2016-03-12 2022-03-03 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US18/203,252 US20230300442A1 (en) 2016-03-12 2023-05-30 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

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