CN108270948A

CN108270948A - Camera module and its molded case circuit plate component and manufacturing method and the electronic equipment with camera module

Info

Publication number: CN108270948A
Application number: CN201611261899.8A
Authority: CN
Inventors: 陈振宇; 王明珠; 田中武彦; 郭楠; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2018-07-10
Also published as: WO2018121752A1; CN110089100A; CN112600999A

Abstract

The present invention provides a camera module and its molded case circuit plate component and manufacturing method and the electronic equipment with camera module, wherein the molded case circuit plate component includes a molded base and an at least circuit board.The circuit board includes an at least substrate and an at least connecting plate, wherein described connecting plate is connected to the substrate, the substrate is for a conducting at least sensitive chip, wherein described molded base is at least integrally incorporated into the substrate, so that the sensitive chip corresponds to the optical window of the molded base.

Description

Camera module and its molded case circuit plate component and manufacturing method and with camera module Electronic equipment

Technical field

The present invention relates to optical imaging field, a more particularly to camera module and its molded case circuit plate component and manufacturing method And the electronic equipment with camera module.

Background technology

In recent years, camera module is had developed into for one of standard configuration of electronic equipment, wherein camera module not only Can help camera module obtain about scene or the image of object, but also the operation from user can be received so that Electronic equipment provides various functions, this causes electronic equipment to have increasingly been towards intelligent direction development.In addition, in the market for just It is increasingly pursued in the lightening electronic equipment for carrying and using so that the lighter and thinner development for having become electronic equipment Trend, and the lightening and intelligentized development trend of electronic equipment causes its size and image quality requirement to camera module Also to come harsher.Therefore, how to solve ensureing even to reduce camera shooting on the basis of the image quality for improving camera module The volume of module and in this process existing various problems are the present invention in the emphasis being next discussed.

Invention content

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the volume of the camera module can be reduced, so that the camera module is especially suitable In being applied to pursue lightening electronic equipment.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the circuit board assemblies form a molding base by molding process on an at least substrate Seat, so that the camera module is compact-sized.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the circuit board assemblies provide a connecting plate, the module connecting side electricity of the connecting plate It is connected to the substrate.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the molded base is moulded on the substrate first, then again by the connecting plate The module connecting side be electrically connected to the substrate.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein when carrying out molding process, a molding tool can directly apply pressure to the substrate Be used to connect the position of the module connecting side of the connecting plate, with effectively reinforce the substrate and the connecting plate it Between the validity that connects.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein can be by multiple substrate arrangement version units in a row, with simultaneously to multiple described Substrate is moulded, so as to for the substrate after soft or hard combination version or connection soft board, obtain higher Alignment efficiency and higher molding efficiencies, so as to improve the production efficiency of the camera module.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the molded base can further embed the connection of the substrate and the connecting plate Position, in such manner, it is possible to ensure the reliability of the link position.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the molded base can further embed the connection of the substrate and the connecting plate Position, in this way, the reinforcement feature of the substrate and the connecting plate can be substituted for reinforcing by the molded base, to save Space and reduction process.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the molded base can also further prolong to the equipment connecting side of the connecting plate It stretches, to reach positioning, limiting, fixation and the demand for blocking isostructuralism.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the molded base can further wrap up connecting the substrate and the connection The part of the spilling of the conducting medium of plate, to prevent the conducting medium overflowed from polluting the camera module, it can also be ensured that The aesthetics of the appearance of the camera module.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the connecting plate can be electrically connected at least part at the back side of the substrate, this Sample when carrying out molding process to the substrate, can further improve utilization rate and the raising of the horizontal size of layout unit The density of the substrate of the layout unit, so as to obtain better stock utilization and production efficiency.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the connecting plate can be connected with the side of the substrate, in such manner, it is possible to make the company The extending direction of the extending direction of fishplate bar and the substrate is inconsistent, in order to subsequently connect the connecting plate and electronic equipment It connects.

It is an object of the present invention to provide a camera module and its molded case circuit plate component and manufacturing method and bands There is the electronic equipment of camera module, wherein the connecting plate can be connected with the side of the substrate, in such manner, it is possible to reduce described The whole volume of camera module, to reduce the camera module occupied space in the electronic equipment.

One side under this invention, the present invention further provides a molded case circuit plate component, including：

One molded base, wherein the molded base has an at least optical window；With

An at least circuit board, wherein the circuit board includes an at least substrate and an at least connecting plate, wherein the connection Plate is connected to the substrate, and the substrate is for a conducting at least sensitive chip, wherein the molded base is integrally incorporated into The substrate, so that the sensitive chip corresponds to the optical window of the molded base.

According to one embodiment of present invention, the connecting plate is connected to the front of the substrate.

According to one embodiment of present invention, the connecting plate is connected to the back side of the substrate.

According to one embodiment of present invention, the connecting plate is connected to the side of the substrate.

According to one embodiment of present invention, the molded base further embeds the company of the connecting plate and the substrate Connect position.

Other side under this invention, the present invention further provides a camera module, including：

An at least optical lens；

An at least sensitive chip；And

An at least circuit board assemblies, wherein the circuit board assemblies include an at least molded base and an at least circuit board, Wherein described molded base has an at least optical window, wherein the circuit board includes an at least substrate and an at least connecting plate, Described in connecting plate be connected to the substrate, the substrate and the sensitive chip are switched on, and the molded base is integrally The substrate is incorporated into, so that the sensitive chip corresponds to the optical window of the molded base, the optical lens is protected It holds in the photosensitive path of the sensitive chip.

One side under this invention, the present invention further provides the manufacturing methods of a molded case circuit plate component, wherein institute Manufacturing method is stated to include the following steps：

(a) there is a molded base of an at least optical window in an at least substrate upper mold fixture；With

(b) one connecting plate of connection is to the substrate, the molded case circuit plate component is made.

According to one embodiment of present invention, the step (b) is before the step (a), so as to first connect the company Then fishplate bar moulds the molded base to the substrate in the substrate.

According to one embodiment of present invention, before the step (a), at least two substrate arrangements is made to form one Layout unit in the step (a), while moulds the layout unit at least two substrates.

Other side under this invention, the present invention further provides an electronic equipment, including：

One electronic equipment ontology；With

An at least camera module, wherein the camera module is arranged at the electronic equipment ontology, wherein the camera shooting Module further comprises：

An at least optical lens；

An at least sensitive chip；And

Description of the drawings

Fig. 1 is the stereoscopic schematic diagram of an electronic equipment of a preferred embodiment under this invention.

Fig. 2 is the stereoscopic schematic diagram of a camera module of a preferred embodiment under this invention.

Fig. 3 A are the schematic cross-sectional views of the camera module of above-mentioned preferred embodiment under this invention.

Fig. 3 B are the section views of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Fig. 4 is the section view signal of a circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Figure.

Fig. 5 is the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention One of schematic diagram.

Fig. 6 is the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Two schematic diagram.

Fig. 7 is the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Three schematic cross-sectional view.

Fig. 8 is the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Four schematic cross-sectional view.

Fig. 9 is the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Five schematic cross-sectional view.

Figure 10 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Six rapid schematic cross-sectional view.

Figure 11 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Seven rapid schematic cross-sectional view.

Figure 12 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Eight rapid schematic cross-sectional view.

Figure 13 is that the section view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention is shown It is intended to.

Figure 14 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 15 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 16 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 17 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 18 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 19 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 20 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 21 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 22 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 23 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 24 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 25 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 26 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 27 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 28 A are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 28 B are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 29 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 30 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 31 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 32 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 33 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 34 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 35 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 36 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 37 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 38 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 39 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 40 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 41 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 42 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 43 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 44 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 45 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 46 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 47 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 48 A are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 48 B are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 49 A are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 49 B are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 50 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 51 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention One of rapid schematic diagram.

Figure 52 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Two rapid schematic diagram.

Figure 53 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Three rapid schematic cross-sectional view.

Figure 54 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Four rapid schematic cross-sectional view.

Figure 55 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Five rapid schematic cross-sectional view.

Figure 56 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Six rapid schematic cross-sectional view.

Figure 57 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Seven rapid schematic cross-sectional view.

Figure 58 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Eight rapid schematic cross-sectional view.

Figure 59 is the manufacture step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention Nine rapid schematic cross-sectional view.

Figure 60 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 61 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 62 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 63 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 64 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 65 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 66 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 67 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 68 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 69 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 70 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 71 A are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 71 B are the section views of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 72 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.Figure 73 is that the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention is shown It is intended to.

Figure 74 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 75 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 76 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 77 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 78 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 79 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 80 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 81 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 82 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 83 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 84 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 85 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 86 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 87 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 88 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 89 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 90 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 91 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 92 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 93 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 94 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 95 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 96 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 97 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 98 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 99 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 100 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 101 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 102 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 103 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 104 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 105 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 106 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 107 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 108 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 109 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Figure 110 is the section view of another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention Schematic diagram.

Specific embodiment

It is described below to disclose the present invention so that those skilled in the art can realize the present invention.It is excellent in being described below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description The present invention basic principle can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back Other technologies scheme from the spirit and scope of the present invention.

It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instructions such as " outer " or position close System is based on orientation shown in the drawings or position relationship, is for only for ease of the description present invention and simplifies description, without referring to Show or imply signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore above-mentioned art Language is not considered as limiting the invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no It is understood that as the limitation to quantity.

With reference to Fig. 1 of the Figure of description of the present invention, the one of a preferred embodiment under this invention carries camera module Electronic equipment is set forth, wherein the electronic equipment includes an at least camera module 100 and an electronic equipment ontology 200, Described in camera module 100 be arranged at the electronic equipment ontology 200, for the electronic equipment ontology 200 is helped to shoot Image.

It is noted that although the shown in Figure 1 camera module 100 is arranged at the electronic equipment sheet The embodiment at the back side (side that facing away from the display screen of the electronic equipment ontology 200) of body 200, it is possible to understand that It is that the camera module 100 can also be arranged at front (the electronic equipment ontology of the electronic equipment ontology 200 The side of 200 display screen) or at least one camera module 100 be arranged at the electronic equipment ontology 200 The back side and at least one camera module 100 are arranged at the front of the electronic equipment ontology 200.Certainly, this field Technical staff is it is understood that it is also that have can that the camera module 100 is arranged on the side of the electronic equipment ontology 200 Can.

In addition, the type of the camera module 100 is unrestricted in the electronic equipment of the present invention, although such as Fig. 1 Camera module 100 described in the example shown is implemented as single-lens camera module, and in other examples, the camera shooting mould Group 100 can also be implemented as array camera module, such as, but not limited to twin-lens camera module.

In addition, although the electronic equipment ontology 200 of the electronic equipment shown in Figure 1 is carried out for intelligence The example of energy mobile phone, in other examples, the electronic equipment ontology 200 can also be implemented as tablet computer, electric paper Book, MP3/4/5, personal digital assistant, camera, television set, washing machine, refrigerator etc. are any can be configured the camera module 100 electronic product.

With reference to figs. 2 to Fig. 3 B, the camera module 100 includes an at least optical lens 10, at least a sensitive chip 20 And an at least circuit board assemblies 30, wherein the sensitive chip 20 is connected to the circuit board assemblies 30 switched only, it is described Optical lens 10 is maintained at the photosensitive path of the sensitive chip 20.In addition, the circuit board assemblies 30 can be with the electricity Sub- apparatus body 200 is connected with each other, such as the circuit board assemblies 30 and the electronic equipment ontology 200 can be electrically connected, So that the camera module 100 is connected to the electronic equipment ontology 200.The light being reflected by the object is from the optical lens 10 enter the inside of the camera modules 100, are then received by the sensitive chip 20 and are carried out photoelectric conversion and be imaged, thus The image about object is obtained, wherein the digital signal of the image about object can subsequently be sent to the electronic equipment Ontology 200 can be such as, but not limited to stored in the memory of the electronic equipment ontology 200, can also pass through the electricity The sub- storage of apparatus body 200 can also be shown in high in the clouds on the display screen of the electronic equipment ontology 200.

The circuit board assemblies 30 include a circuit board 31 and a molded base 32.It is hard that the circuit board 31 includes at least one The substrate 311 of matter and at least one soft connecting plate 312, the substrate 311 have at least one smooth 3111 He of pasting area One fringe region 3112, the connecting plate 312 has a module connecting side 3121 and an equipment connecting side 3122, wherein described Sensitive chip 20 is mounted on the pasting area 3111 of the substrate 311, the molded base 32 and the substrate 311 The fringe region 3112 integrally combines, wherein the molded base 32 has an at least optical window 321, wherein the photosensitive core The photosensitive region of piece 20 corresponds to the optical window 321 of the molded base 32.The module connecting side of the connecting plate 312 3121 and the fringe region 3112 of the substrate 311 be electrically connected together so that the circuit of the connecting plate 312 and The circuit of the substrate 311 is switched on, wherein the equipment connecting side 3122 of the connecting plate 312 can be electrically connected to The electronic equipment ontology 200.

It can be switched between the sensitive chip 20 and the substrate 311 by an at least lead 33, wherein described draw Line 33 can make two ends of the lead 33 be respectively communicated with the sensitive chip 20 and the substrate by routing technique 311.The routing direction of the lead 33 is unrestricted in the present invention, such as the routing direction of the lead 33 can be from institute Sensitive chip 20 is stated to the substrate 31 or from the substrate 31 to the sensitive chip 20.The type of the lead 33 It is unrestricted, such as the lead 33 can be gold thread, silver wire, copper wire etc..

Further, the substrate 311 of the circuit board 31 has a front 3113 and a back side 3114, wherein described Front 3113 and the back side 3114 correspond.It is understood that under normal conditions, the front of the substrate 311 3113 and the back side 3114 be used to define the thickness of the substrate 311.It is understood that the substrate 311 is included at least Layer of plate, such as the substrate 311 may be implemented as one layer of hardboard, at this point, the surface on the top of the substrate 311 is determined Justice is described positive 3113, and the surface of the lower part of the substrate 311 is defined as the back side 3114.For example described substrate again 311 can also afterwards be formed by multi-layered board is overlapped, it is understood, therefore, that only by the uppermost of the substrate 311 The exposed side of layer of plate is defined as described positive 3113 and by the exposed of the nethermost layer of plate of the substrate 31 Side be defined as the back side 3114.It is understood that the pasting area 3111 and the edge of the substrate 311 Region 3112 is both formed in described positive the 3113 of the substrate 311.

In addition, the substrate 311 from the point of view of vertical view state, is typically to be square, such as can be square, Can be rectangle, nevertheless, it will be appreciated by those skilled in the art that, the substrate 311 can also have other spies Fixed shape, such as the vertical view state of the substrate 311 can be in substantially rectangular, the camera module 100 of the invention exists This respect is unrestricted.

In addition, the module connecting side 3121 of the connecting plate 312 is generally connected to the described of the substrate 311 The side of fringe region 3112, next, for convenience of description, by the quilt of the fringe region 3112 of the substrate 311 Side for connecting the module connecting side 3121 of the connecting plate 312 is defined as a connection edge side 31121 and by institute State the module connecting side 3121 for being not applied to connect the connecting plate 312 of the fringe region 3112 of substrate 311 Side be defined as a free edge side 31122.It is understood, therefore, that positive 3113 shape of the substrate 311 Into the pasting area 3111, the connection edge side 31121 and the free edge side 31122.

It is noted that the type of the substrate 311 unrestricted, example in the camera module 100 of the present invention Such as described substrate 311 can be but not limited to hardboard, Rigid Flex, ceramic wafer, in addition, the type of the connecting plate 312 Also it is unrestricted in the camera module 100 of the present invention.

The circuit board assemblies 30 can also include an at least electronic component 34, electronics member device described in wherein at least one Part 34 can be mounted on the fringe region 3112 of the substrate 311 of the circuit board 31, it is preferable that the electronics member Device 34 is mounted on the free edge side 31122 of the substrate 311.The molded base 32 can not have after shaping The electronic component 34 is embedded, at least part or the embedding of at least one electronic component 34 can also be embedded Whole electronic components 34.It is understood that when the molded base 32 embeds the electronics member device after shaping During part 34, the electronic component 34 and external environment can be prevented to contact by the molded base 32, it is described so as to avoid The surface oxidation of electronic component 34.When the molded base 32 embeds whole electronic components 34 after shaping, The adjacent electronic component 34 can be isolated in the molded base 32, the adjacent electronic component 34 to be prevented phase occur The bad phenomenon mutually interfered, in addition, the molded base 32 also is able to the spacing smaller for making the adjacent electronic component 34, from And enable the free edge side 31122 of the substrate 311 by attachment greater number and the larger sized electronics Component 34.

In addition, the electronic component 34 and the sensitive chip 20 can be also isolated in the molded base 32, to avoid The cast on the surface of the electronic component 34 or the link position of the electronic component 34 and the substrate 311 Cast pollutes the photosensitive region of the sensitive chip 20.For example, the molded base 32 can be by embedding the electronics member The electronic component 34 and the sensitive chip 20 is isolated in the mode of device 34, can also make the electronic component 34 and institute It states mode of the sensitive chip 20 respectively positioned at the both sides of the molded base 32 and the electronic component 34 and described photosensitive is isolated Chip 20.

In some other examples, the electronic component 34 can also be mounted on the back of the body of the substrate 311 Face 3114, mode in this way can be further reduced the length and width dimensions of the camera module 100, can also be isolated described Electronic component 34 and the sensitive chip 20.

It is noted that the type of the electronic component 34 is unrestricted, such as the electronic component 34 can be with It is implemented as but is not limited to driver, relay, processor, resistance, capacitance etc..

Further, with continued reference to attached drawing 3A, the camera module 100 includes an at least filter element 40, wherein described Filter element 40 is maintained between the sensitive chip 20 and the optical lens 10, so as to enter from the optical lens 10 The light being reflected by the object of the inside of the camera module 100, across after the filter element 40 again by the photosensitive core Piece 20 receives, mode in this way, can improve the image quality of the camera module 100.The class of the filter element 40 Type is unrestricted, is chosen as needed, such as in this illustration, the filter element 40 may be implemented as infrared section Only optical filter.

The filter element 40 is mounted on the top surface of the molded base 32, so that the filter element 40 is protected It holds between the optical lens 10 and the sensitive chip 20.

Further, the top surface of the molded base 32 has at least an outer surface 322 and at least an inner surface 323, wherein in one example, plane and the inner surface where the outer surface 322 of the molded base 32 Plane where 323 is in approximately the same plane, and the filter element 40 is mounted on the inside table of the molded base 32 Face 323.In another example, the plane where the outer surface 322 of the molded base 32 and the inner surface Plane where 323 is with the plane where difference in height, such as the outer surface 322 of the molded base 32 higher than described Plane where inner surface 323, so as to which the molded base 32 be made to form at least optical filter attachment slot 324, wherein described Optical filter attachment slot 324 is communicated in the optical window 321, wherein being mounted on the inner surface 323 of the molded base 32 The filter element 40 be housed inside in optical filter attachment slot 324.

In this variant embodiment of the camera module 100 shown in attached drawing 3B, the camera module 100 into One step includes the stent 50 of an at least frame shape, wherein the filter element 40 is mounted on the stent 50,50 quilt of stent The inner surface 323 of the molded base 32 is mounted on, so that the filter element 40 is maintained at the optical lens Between 10 and the sensitive chip 20, mode in this way can reduce the size of the filter element 40, with described in reduction The manufacture cost of camera module 100.

The camera module 100 can be an auto-focusing and zoom camera module, refer to the attached drawing 3A and Fig. 3 B, institute It states camera module 100 and may further include an at least driver 60, wherein the optical lens 10 is driveably set to The driver 60, the driver 60 is mounted on the outer surface 322 of the molded base 32, so that the optics Camera lens 10 is maintained at the photosensitive path of the sensitive chip 20.The driver 60 can drive the optical lens 10 along The photosensitive path movement of the sensitive chip 20, with the opposite position by adjusting the optical lens 10 and the sensitive chip 20 The mode put realizes focusing and the zoom of the camera module 100.It is noted that the driver 60 can be carried out For but be not limited to voice coil motor.

In addition, the camera module 100 can also be implemented as fixed-focus camera module, that is, the optical lens 10 and institute Stating the distance of sensitive chip 20 does not allow to be adjusted.For example, in one embodiment, can the optics be made by a lens barrel Camera lens 10 is maintained on the photosensitive path of the sensitive chip 20, wherein the lens barrel can be mounted on the molding base The outer surface 322 of seat 32 can also integrally extend from the outer surface 322 of the molded base 32, another In one embodiment, can also the optical lens 10 be directly mounted on the molded base 32, such as the optical lens 10 can be the outer surface 322 for being mounted on the molded base 32.

With reference to the present invention Figure of description Fig. 5 to Figure 11, the circuit board assemblies 30 of the camera module 100 Manufacturing process is set forth.

Two or more the substrate 311 can be arranged together to form a spelling by refer to the attached drawing 5 and Fig. 6 Version unit 300, in order to subsequently carry out molding process.Such as in this illustration, multiple substrates 311 can be arranged in Two rows form the layout unit 300.Then each electronic component 34 can be mounted on each substrate respectively 311 fringe region 3112.Preferably, each electronic component 34 can be mounted on each substrate respectively The 311 free edge side 31122.Nevertheless, it will be appreciated by those skilled in the art that, by the electronics member device Part 34 is mounted on the connection edge side 31121 of the substrate 311 or mounts the electronic component 34 mounted in described What the back side 3114 of substrate 311 was possible to.In addition, also also first the electronic component 34 can be mounted on described Then substrate 311 rearranges the substrate 311 and forms the layout unit 30.

It is noted that the substrate 311 can also be aligned to other patterns or the substrate 311 also may be used Not to be arranged, so as in subsequent molding process, can individually perform molding process on the substrate 311 and It is formed and the substrate 311 molded base 32 joined integrally.

Preferably, the range of the distance between adjacent described substrate 311 of the layout unit 300 be 0.01mm~ 500mm (including 0.01mm and 500mm), preferably 0.05mm~200mm (including 0.05mm and 200mm).The layout unit 300 minimum dimension range is 1mm~100000mm (including 1mm and 100000mm), preferably 10mm~1000mm (including 10mm and 1000mm).

The layout unit 300 is placed in a molding tool 400 and carries out by refer to the attached drawing 7, Fig. 8, Fig. 9 and Figure 10 Molding process.

Specifically, the molding die 400 includes a mold 401 and once mold 402, wherein the mold At least one of 401 and the lower mold 402 mold can be operated, so that the molding die 400 can be molded and be pulled out Mould, wherein when the mold 401 and the lower mold 402 are molded, in the mold 401 and the lower mold 402 Between can form an at least molding space 403.In addition, when forming two between the mold 401 and the lower mold 402 It, can be with shape between the mold 401 and the lower mold 402 during a or more than two molding spaces 403 Into an at least communicating passage 404, for connecting the adjacent molding space 403.

Further, the mold 401 can include a molding induction element 4011 and an at least optical window profile member 4012, wherein each optical window profile member 4012 is separately formed in the molding induction element 4011, in the molding A molding guiding groove 4013 is formed between induction element 4011 and the optical window profile member 4012.It is it is noted that each The optical window profile member 4012 integrally formed can be molded in the molding induction element 4011 or each optical window Element 4012 can also take shape in split the molding induction element 4012.

When the mold 401 and the lower mold 402 are molded, the molding die 400 is in each molding The position of guiding groove 4013 forms each molding space 403.In addition, the molding die 400 can also include a covering Film 405, wherein the cover film 405 is overlappingly set to the forming surface 4014 of the mold 401, such as the cover film 405 can be such that the cover film 405 overlappingly sets in a manner of being attached at the forming surface 4014 of the mold 401 In the forming surface 4014 of the mold 401.It is noted that the forming surface 4014 of the present invention is at least wrapped The stitching surface of the optical window profile member 4012 is included, the inner surface of the molding induction element 4011 can also be included.

When the layout unit 300 is placed into the molding die 400, the layout unit 300 it is each described At least part of the fringe region 3112 of substrate 311 corresponds to each molding space 403, wherein each described The stitching surface of optical window profile member 4012 can be pressed together on the described of each substrate 311 of the layout unit 300 respectively Pasting area 3111.It is understood that the stitching surface of the optical window profile member 4012 can be isolated in the cover film 405 With the pasting area 3111 of the substrate 311, to protect the pasting area 3111.Preferably, the cover film 405 has It is flexible, to buffer the molding die 400 when being molded to impact caused by the substrate 311.

The moulding material 500 of one flow-like is added at least one molding space 300, the moulding material 500 can fill whole molding spaces 403 of the full molding die 400, and in institute by the communicating passage 404 It states moulding material 500 to cure and after draft operation is carried out to the molding die 400, is formed and tied with 311 one of substrate The molded base 32 closed, wherein forming the molded base 32 in the 4012 corresponding position of optical window profile member The optical window 321.It is understood that when the moulding material 500 forms the mould in the molding die 400 after curing During pedestal 32 processed, the cover film 405 be located at the molded base 32 and the mold 401 the forming surface 4014 it Between, so as to which the cover film 405 can be convenient for the molding die 400 by carry out draft operation, such as the cover film 405 is just In the mold 401 by draft.

It is noted that the moulding material 500 can be but not limited to solid particle, liquid, liquid and solid The mixture of grain.

Refer to the attached drawing 3A, Fig. 3 B and Figure 10, for the ease of 400 draft of molding die, the molded base 32 Inner surface 325 is preferably inclined-plane, specifically, setting the extending direction of the inner surface 325 of the molded base 32 and described The angle parameter that the optical axis of sensitive chip 20 is formed is α, and wherein the value range of parameter alpha is 0 °~60 ° (including 0 ° and 60 °), Preferably 5 °~35 ° (including 5 ° and 35 °).

It then,, can be to described in composition after carrying out molding process on the layout unit 300 shown in refer to the attached drawing 11 Each substrate 311 of layout unit 300 is detached, to obtain the semi-finished product of the circuit board assemblies 30, such as can be with The circuit board group is obtained by the extra part in techniques removal molding and/or the substrate 311 such as cutting or etching The semi-finished product of part 30.

It is noted that in one example, for the ease of cutting by the layout unit after carry out molding process 300, as well as abrasion, cutting blade can form a slight tapered cross-section, the circuit board group obtained after cutting The separation side of the semi-finished product of part 30 also can be there are one slight gradient, refer to the attached drawing 11, if the half of the circuit board assemblies 30 into The angle parameter that the extending direction of the side 3115 of the substrate 311 of product and the optical axis of the sensitive chip 20 are formed is β, Ranging from 0 °~10 ° (including 0 ° and 10 °) of middle parameter beta, preferably 0 °~5 ° (including 0 ° and 5 °).In another example In, for the ease of etching, as well as the continuity of etching, the semi-finished product of the circuit board assemblies 30 that are obtained after etching Detach side also can a slight gradient, refer to the attached drawing 11, if the substrates 311 of the semi-finished product of the circuit board assemblies 30 The angle parameter that the extending direction of the side 3115 and the optical axis of the sensitive chip 20 are formed is the range of β, wherein parameter beta For 0 °~10 ° (including 0 ° and 10 °), preferably 0 °~5 ° (including 0 ° and 5 °).It is, of course, understood that the circuit board The gradient of the side 3115 of the substrate 311 of the semi-finished product of component 30 can also be removed in subsequent technique, example Can be by polishing grinding or the side 3115 of substrate 311 as described in flash removed technique is gone to make obtains vertical, light Sliding, mellow and full side form.

The module connecting side 3121 of the connecting plate 312 is electrically connected to the substrate 311 by refer to the attached drawing 12 The connection edge side 31121, to obtain the circuit board assemblies 30.It such as can be by a conducting medium by the connecting plate The 312 module connecting side 3121 and the connection edge side 31121 of the substrate 311 are electrically connected, wherein institute State the molding connecting side 32121 of connecting plate 312 and the connection mode of the connection edge side 31121 of the substrate 311 May be implemented as but be not limited to ACF, ACP, welding, connector etc..

Then, the sensitive chip 20 is mounted on by refer to the attached drawing 4 by the optical window 321 of the molded base 32 The pasting area 3111 of the substrate 311, and can be by routing technique in the sensitive chip 20 and the substrate At least one lead 33 is formed between 311, the substrate 311 and the sensitive chip 20 is connected, and it is described photosensitive Chip 20 corresponds to the optical window 321 of the molded base 32.

It is, of course, understood that the sensitive chip 20 can also be first mounted on to the attachment of the substrate 311 Region 3111 and the conducting sensitive chip 20 and the substrate 311, then again connect the module of the connecting plate 312 The connection edge side 31121 of side 3121 and the substrate 311 is electrically connected.

With continued reference to attached drawing 12, the module connecting side 3121 of the connecting plate 312 is being connected to the substrate 311 The connection edge side 31121 after, the module connecting side 3121 of the connecting plate 312 can cover the substrate 311 The connection edge side 31121 at least part.For example, this embodiment of the camera module 100 in the present invention In, the connection edge side 31121 of the substrate 311 has 311212 on the inside of edge outside 311211 and an edge, Described in 311212 be located on the outside of the edge between 311211 and the outer surface 326 of the molded base 32 on the inside of edge, Described in the module connecting side 3121 of connecting plate 312 be electrically connected to 311211 on the outside of the edge of the substrate 311, That is, there is safe distance between the connecting plate 312 and the outer surface 326 of the molded base 32.

If the width dimensions in the edge outside 311211 of the substrate 311 are L1, the edge of the substrate 311 The width dimensions of inside 311212 are L2, wherein 311211 width dimensions are L1's on the outside of the edge of the substrate 311 Value range is 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.1mm~2mm (including 0.1mm and 2mm), wherein On the inside of the edge of the substrate 311 311212 width dimensions be the value range of L2 be 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.05mm~2mm (including 0.05mm and 2mm).

It it is understood that can also be first by the module connecting side 3121 and the substrate 311 of the connecting plate 312 31121 Electricity Federation of connection edge side after, then by the molding die 400 carry out molding process, in this way, attached drawing 7 to In Fig. 9, the molding die 400 can apply pressure to the link position of the substrate 311 and the connecting plate 312, with effectively Reinforce the validity connected between the substrate 311 and the connecting plate 312.

In addition, the present invention to it after typesetting unit 300 described in 311 arrangement form of substrate by will carry out molding process Mode, mass molding can be carried out or be electrically connected heel row by the connecting plate 312 and the substrate 311 Row are formed after the typesetting unit 300 carries out the mode of molding process to it, can improve alignment efficiency and higher molding effect Rate.

It is understood that follow-up, the filter element 40 can be mounted on to the molded base 32 and made described Optical lens 10 is maintained at the photosensitive path of the sensitive chip 20 by the driver 60 or described lens barrel etc., with The camera module 100 is made.

Attached drawing 13 shows a variant embodiment of the camera module 100, wherein the molded base 32 into Embed the link position of the substrate 311 and the connecting plate 312 after type, such as can be first by the connecting plate 312 and described Substrate 311 is electrically connected and then carries out molding process, so that the molded base 32 embeds the substrate after shaping 311 and the link position of the connecting plate 312, mode in this way, on the one hand, can ensure the substrate 311 and described The reliability of the link position of connecting plate 312, on the other hand, it may not be necessary to which additional component fixes 311 He of substrate The link position of the connecting plate 312, to save space and reduce process, in another aspect, the molded base 32 can be into one Step embeds at least part of the connecting plate 312, to reach positioning, limiting, fixation, the needs for blocking isostructuralism.With it is upper State that embodiment is similar, the value range of the width dimensions L1 of the outer ledge 311211 of the substrate 311 is 0.01mm ~5mm (including 0.01mm and 5mm), preferably 0.1mm~2mm (including 0.1mm and 2mm), the inside of the molded base 32 Width dimensions of the identity distance from the outer ledge 311211 are 0.01mm~8mm (including 0.01mm and 8mm), preferably 0.05mm~3mm (including 0.05mm and 3mm).

Attached drawing 14 shows a variant embodiment of the camera module 100, wherein the molded base 32 into one Step embeds at least part in the non-photo-sensing region of the sensitive chip 20, so that the sensitive chip 20, the substrate 311 It is integrally combined with the molded base 32, and the lead 33 can also be embedded in the inside of the molded base 32, To ensure the good electrical of the lead 33 by the molded base 32.For example, first the sensitive chip 20 can be mounted In the pasting area 3111 of the substrate 311, molding process then is carried out to it again, in such manner, it is possible to which molding is made to obtain institute State at least part that molded base 32 embeds the non-photo-sensing region of the sensitive chip 20.

Attached drawing 15 shows another variant embodiment of the camera module 100, wherein the camera module 100 into One step includes the supporting member 70 of an at least frame shape, wherein the supporting member 70 can be arranged at the institute of the substrate 311 The fringe region 3112 of the substrate 311 can be formed in by stating fringe region 3112 or the supporting member 70, wherein The molded base 32 at least embeds the outer side edges 71 of the supporting member 70 after shaping, so that the sensitive chip 20, institute It states substrate 311, the supporting member 70 and the molded base 32 integrally to combine, wherein the molded base 32 can wrap It buries at least part of the lead 33 or the supporting member 70 embeds at least part of the lead 33, the institute It states molded base 32 and the supporting member 70 embeds at least part of the lead 33 respectively.In other examples, institute At least part of top surface 72 of the supporting member 70 can also further be embedded by stating molded base 32.

The supporting member 70 can by but be not limited to glue formed after hardening either metal plating or change plating shape Into or solution coating after lose solvent cures and formed so that the supporting member 70 protrudes from the institute of the substrate 311 Front 3113 is stated, so as to which in a molding process, the supporting member 70 can stop that the moulding material 500 enters the base The pasting area 3111 of plate 311, to ensure the flatness of the pasting area 3111.In addition, the supporting member 70 There can be elasticity, so as to when the molding die 400 is molded, result from the mold 401 and the lower mold 402 Impact force can be absorbed by the supporting member 70 and avoid acting on the substrate 311, in addition, the supporting member 70 The molding in the top surface 72 and the mold 401 of the supporting member 70 can be prevented by way of deformation Gap is generated between face 4014.Also, the supporting member 70 can support the forming surface 4014 of the mold 401, The mold 401 to be prevented to apply pressure to the lead 33, so as to ensure the lead 33 it is good electrically.

Attached drawing 16 shows another variant embodiment of the camera module 100, wherein the supporting member 70 also may be used The photosensitive core can also be formed in be arranged on the non-photo-sensing region of the sensitive chip 20 or the supporting member 70 The non-photo-sensing region of piece 20, thus in molding process, the molded base 32, the substrate 311,20 and of the sensitive chip The supporting member 70 can be combined integrally.

Attached another variant embodiment Figure 17 shows the camera module 100, wherein the filter element 40 can With after the sensitive chip 20 is overlapped in, then molding process is carried out, so that the molded base 32 further embeds The edge of the filter element 40, that is, the molded base 32, the substrate 311, the sensitive chip 20 and the optical filtering Element 40 can be combined integrally.

Attached drawing 18 shows another variant embodiment of the camera module 100, wherein in the filter element 40 After being overlapped in the sensitive chip 20, the supporting member 70 at the edge of the filter element 40 is set or forms the branch Element 70 is held, so as to which in molding process, the molded base 32 can embed at least part of the supporting member 70, with Make the molded base 32, the substrate 311, the sensitive chip 20, the filter element 40 and the supporting member 70 can Integrally to combine.

Attached drawing 19 shows another variant embodiment of the camera module 100, wherein the substrate 311 has An at least accommodation space 3116, the accommodation space 3116 may be implemented as groove, for accommodating the sensitive chip 20, lead to Such mode is crossed, the height dimension of the camera module 100 can be reduced.

Attached drawing 20 shows another variant embodiment of the camera module 100, wherein the molded base 32 can Further to embed the non-photo-sensing region of the sensitive chip 20.

Attached drawing 21 shows another variant embodiment of the camera module 100, wherein the accommodation space 3116 Through-hole is may be implemented as, wherein the sensitive chip 20 is maintained in the accommodation space 3116, and the photosensitive core Piece 20 and the substrate 311 are switched on, in this way, the height dimension of the camera module 100 can be reduced further.

Attached drawing 22 shows another variant embodiment of the camera module 100, wherein the molded base 32 can Further to embed the non-photo-sensing region of the sensitive chip 20.

Attached drawing 23 shows another variant embodiment of the camera module 100, wherein the circuit board assemblies 30 Further comprise an at least reinforcement part 35, wherein the reinforcement part 35 is integrally with reference to the back side with the substrate 311 3114, with by the intensity of substrate 311 described in 35 reinforcement of reinforcement part, mode in this way, the substrate 311 can select With thinner plank, to reduce the height dimension of the camera module 100.The reinforcement part 35 and the molded base 32 can be separately formed by the same process in the back side 3114 of the substrate 311 and described positive 3113, can also First described positive 3113 in the substrate 311 mould the molded base 32, then again at the back side of the substrate 311 The 3114 molding reinforcement parts 35, can also first mould the reinforcement part 35 at the back side 3114 of the substrate 311, then Positive 3113 molding molded base 32 of the substrate 311.

Attached drawing 24 shows another variant embodiment of the camera module 100, wherein the substrate 311 has The accommodation space 3116 of through-hole is implemented as, the sensitive chip 20 is mounted on the reinforcement part 35, and positioned at institute It states in accommodation space 3116, wherein the sensitive chip 20 is switched on by the lead 33 and the substrate 311, in this way, institute The flatness for stating sensitive chip 20 is not only restricted to the flatness of the substrate 311, so that the substrate 311 can select thickness The thinner plank of degree, so as to further reduce the height dimension of the camera module.

Attached drawing 25 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 into one Step has a holding tank 351, wherein the holding tank 351 of the reinforcement part 35 corresponds to the receiving of the substrate 311 Space 3116, wherein the sensitive chip 20 is housed inside the holding tank 315 of the reinforcement part 35, and described photosensitive Chip 20 corresponds to the accommodation space 3116 of the substrate 311, in such manner, it is possible to make the flatness of the sensitive chip 20 The flatness of the substrate 311 is not limited by, and further reduces the height dimension of the camera module 100.

Attached drawing 26 shows another variant embodiment of the camera module 100, wherein the substrate 311 has At least one keeps space 3117, wherein the holding space 3117 is implemented as groove, wherein one of the molded base 32 Divide the holding space 3117 for taking shape in the substrate 311.

Attached drawing 27 shows another variant embodiment of the camera module 100, wherein the institute of the substrate 311 It states and space 3117 is kept to be implemented as through-hole, wherein a part for the molded base 32 takes shape in the described of the substrate 311 Keep space 3117.It is understood that in other examples, at least one holding space 3117 may be implemented as Through-hole, the holding space 3117 in addition may be implemented as groove.

Attached drawing 28A shows another variant embodiment of the camera module 100, wherein the substrate 311 is extremely A few holding space 3117 is implemented as through-hole, wherein in a molding process, passing through the moulding material 500 described It is respectively formed behind holding space 3117 in described positive the 3113 of the substrate 311 and the back side 3114 and is integrally incorporated into institute State the molded base 32 of substrate 311 and the reinforcement part 35.

Attached drawing 28B shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 The substrate 311 can be mounted on by reverse installation process, and the photosensitive region of the sensitive chip 20 passes through the substrate 311 accommodation space 3116 for being implemented as through-hole corresponds to the optical window 321 of the molded base 32.

It is noted that the camera module 100 is implemented as array camera module in following description, and By taking the array camera module is further embodied as twin-lens camera module as an example, to illustrate the camera shooting of the present invention The feature and advantage of module 100, it is to be understood that the array camera module can also have more described optical lens 10, therefore, the camera module 100 of twin-lens camera module is simultaneously not construed as to the camera module 100 of the invention Content and range limitation.

Attached drawing 29 shows another variant embodiment of the camera module 100, wherein the camera module 100 wraps Two described 10, two sensitive chips 20 of optical lens and the circuit board assemblies 30 are included, wherein the circuit Plate component 30 includes a circuit board 31, at least one molded base 32 and at least two groups of leads 33, wherein institute State circuit board 31 include at least one substrate 311 and at least one connecting plate 312, the connecting plate 312 it is described Module connecting side 3121 is electrically connected to the connection edge side 31121 of the substrate 311, and there are two the tools of substrate 311 The pasting area 3111, wherein each sensitive chip 20 is mounted on each attachment of the substrate 311 respectively Region 3111, and each sensitive chip 20 and the substrate 311 are connected by the lead 33, wherein the molding base 32 tool of seat is there are two the optical window 321, so that each sensitive chip 20 corresponds respectively to each optical window 321, wherein Each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.

In addition, the camera module 100 can also include two drivers 60, wherein each optical lens 10 It is driveably set to each driver 60 respectively, each driver 60 is mounted on the molded base respectively 32, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.

Further, the camera module 100 can further include an at least filter element 40, wherein each described Filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.For example, each institute The molded base 32 can be mounted on respectively by stating filter element 40, so that each filter element 40 is respectively held in Between each optical lens 10 and each sensitive chip 20.

It is noted that the camera module 100 shown in attached drawing 29 is merely illustrative, when 100 quilt of camera module Be embodied as comprising more described optical lens 10 when, the quantity of the sensitive chip 20, the quantity of the filter element 40 with And the quantity of the driver 60 can be consistent with the quantity of the optical lens 10.In addition, the molded base 32 also may be used Further to embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 30 shows another variant embodiment of the camera module 100, wherein the circuit board assemblies 30 The circuit board 31 can include two substrates 311 and two connecting plates 312, wherein each connecting plate 312 are electrically connected in each substrate 311, wherein each substrate 311 is respectively provided with a pasting area 3111, wherein the sensitive chip 20 is mounted on each pasting area 3111 of each substrate 311 respectively, wherein The molded base 32 is integrally incorporated into each substrate 3111, so that two substrates 3111 and the molded base 32 are combined as a whole.In addition, the molded base 32 can also further embed the non-sense of at least one sensitive chip 20 Light region.

Attached drawing 31 shows another variant embodiment of the camera module 100, wherein the camera module 100 into One step includes an at least lens barrel 80.Specifically, the camera module 100 can include two lens barrels in this illustration 80, wherein each optical lens 10 is arranged at the lens barrel 80 respectively, each lens barrel 80 is mounted on institute respectively Molded base 32 is stated, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20. In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 32 shows another variant embodiment of the camera module 100, wherein each lens barrel 80 The molded base 32 can integrally be extended respectively, that is, the lens barrel 80 can with the molded base 32 integrally into Type.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 33 shows another variant embodiment of the camera module 100, one of them described lens barrel 80 1 The molded base 32 is extended to body, another described lens barrel 80 is mounted on the molded base 32.In addition, the molding Pedestal 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 34 shows another variant embodiment of the camera module 100, one of them described optical lens 10 are driveably set to the driver 60, and the driver 60 is mounted on the molded base 32, described in another Optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 is mounted on the molded base 32.In addition, the mould Pedestal 32 processed can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 35 shows another variant embodiment of the camera module 100, one of them described optical lens 10 are driveably set to the driver 60, and the driver 60 is mounted on the molded base 32, described in another Optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 integrally extends the molded base 32.In addition, institute The non-photo-sensing region of at least one sensitive chip 20 can also further be embedded by stating molded base 32.

Attached drawing 36 shows another variant embodiment of the camera module 100, wherein the camera module 100 into One step includes an at least bearing 90, wherein the molded base 32 moulds a part for the substrate 311, so that at least one institute The optical window 321 that sensitive chip 20 corresponds to the molded base 32 is stated, the bearing 90 is mounted on the substrate 311 Another part, so that the sensitive chip 20 corresponds to the light hole 91 of the bearing 90, wherein each optical lens 10 It is driveably set to each driver 60 respectively, at least one driver 60 is mounted on the molded base 32, the driver 60 in addition is mounted on the bearing 90, so that each optical lens 10 is respectively held in often The photosensitive path of a sensitive chip 20.It is understood that each optical lens 10 is respectively arranged at each institute It states lens barrel 80 or at least one optical lens 10 is set to the driver 60, by the other optical lens 10 be set to the bearing 90 be also it is possible.In addition, the molded base 32 can also further embed it is at least one described The non-photo-sensing region of sensitive chip 20.

Attached drawing 37 shows another variant embodiment of the camera module 100, wherein the camera module 100 The molded base 32 can also further embed the link position of the connecting plate 312 and the substrate 311, with described in guarantee Circuit board 31 is in the reliability of the connecting plate 312 and the link position of the substrate 311.In addition, the molded base 32 The non-photo-sensing region of at least one sensitive chip 20 can further be embedded.

Attached drawing 38 shows another variant embodiment of the camera module 100, wherein by the supporting member 70 are set to the fringe region 3112 of the substrate 311 or the supporting member 70 are made to be formed in the substrate 311 The fringe region 3112 after, then molding process is carried out, so that the molded base 32 embeds the supporting member 70 extremely A few part, so that the substrate 311, the molded base 32 and the supporting member 70 integrally combine.It is in addition, described Molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 39 shows another variant embodiment of the camera module 100, wherein the molded base 32 can Further to embed the non-photo-sensing region of the sensitive chip 20, so that the substrate 311, the sensitive chip 20, the mould Pedestal 32 processed integrally combines.In addition, the molded base 32 can also further embed at least one sensitive chip 20 Non-photo-sensing region.

Attached drawing 40 shows another variant embodiment of the camera module 100, wherein by the supporting member 70 are set to the non-photo-sensing region of the sensitive chip 20 or the supporting member 70 are made to be formed in the sensitive chip 20 Behind non-photo-sensing region, then molding process is carried out, so that the molded base 32 embeds at least part of the supporting member 70, So that the substrate 311, the sensitive chip 20, the molded base 32 and the supporting member 70 integrally combine.In addition, The molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 41 shows another variant embodiment of the camera module 100, wherein the institute of the substrate 311 The reinforcement part 35 can also be at least partly molded by stating the back side 3114, with the intensity of substrate described in reinforcement 311, in such manner, it is possible to It is further ensured that the flatness of the sensitive chip 20.In addition, the molded base 32 can also further embed it is at least one The non-photo-sensing region of the sensitive chip 20.

Attached drawing 42 shows another variant embodiment of the camera module 100, wherein the substrate 311 has At least one accommodation space 3116, wherein each sensitive chip 20 is housed inside each accommodation space respectively 3116, to reduce the height of the camera module 100.It is understood that the accommodation space 3116 may be implemented as it is recessed Slot can also be implemented as through-hole.In addition, the molded base 32 can also further embed at least one photosensitive core The non-photo-sensing region of piece 20.

Attached drawing 43 shows another variant embodiment of the camera module 100, wherein the substrate 311 also may be used With at least one accommodation space 3116, so as to which a sensitive chip 20 can be mounted on the substrate 311 The pasting area 3111, another described sensitive chip 20 can be housed inside the accommodation space 3116, in such manner, it is possible to Make two sensitive chips 20 that there is difference in height.In addition, the molded base 32 can also further embed at least one institute State the non-photo-sensing region of sensitive chip 20.

Attached drawing 44 shows another variant embodiment of the camera module 100, the back side of the substrate 311 3114 at least part are molded the reinforcement part 35, wherein each sensitive chip 20 is mounted on the reinforcement part respectively 35, so that the flatness of each sensitive chip 20 is no longer limited by the flatness of the substrate 311, so that the base Plate 311 can be selected thinner plank, further to reduce the height dimension of the camera module 100.In addition, the molding Pedestal 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 45 shows another variant embodiment of the camera module 100, the back side of the substrate 311 3114 can also at least partly be molded the reinforcement part 35, one of them described sensitive chip 20 is mounted on the reinforcement Portion 35, another sensitive chip 20 are mounted on the pasting area 3111 of the substrate 311, so that two institutes Sensitive chip 20 is stated with difference in height.In addition, the molded base 32 can also further embed at least one photosensitive core The non-photo-sensing region of piece 20.

Attached drawing 46 shows another variant embodiment of the camera module 100, wherein the filter element 40 Quantity may be implemented as one, so as to which each optical lens 10 can correspond respectively to the difference of the filter element 40 Position.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 47 shows another variant embodiment of the camera module 100, optical filtering described in wherein at least one Element 40 can be arranged at least one stent 50 respectively, wherein described in each the stent 50 is mounted on respectively Molded base 32, so that the filter element 40 for being each arranged at the stent 50 is respectively held in each light It learns between camera lens 10 and each sensitive chip 20.Also, the size of the filter element 40 can be reduced, to reduce State the manufacture cost of camera module 100.In addition, the molded base 32 can also further embed at least one photosensitive core The non-photo-sensing region of piece 20.

Attached drawing 48A shows another variant embodiment of the camera module 100, wherein the filter element 40 Quantity and the quantity of the optical lens 10 and the sensitive chip 20 correspond, and the stent 50 may be implemented as one A, wherein each filter element 40 is arranged at the different location of the stent 50 respectively, the stent 50 is mounted on The molded base 32, so that each filter element 40 is respectively held in each optical lens 10 and each Between the sensitive chip 20.In addition, the molded base 32 can also further embed at least one sensitive chip 20 Non-photo-sensing region.

Attached drawing 48B shows another variant embodiment of camera module 100, sensitive chip described in wherein at least one 20 can be mounted on the substrate 311, and the photosensitive region of the sensitive chip 20 can pass through institute by reverse installation process The accommodation space 3116 for being implemented as through-hole for stating substrate 311 corresponds to the optical window 321 of the molded base 32.To the greatest extent Pipe passes through upside-down mounting work in this example of the camera module 100 shown in attached drawing 48B, with two sensitive chips 20 Skill is mounted on the substrate 311, and in an other example, at least one sensitive chip 20 can also be passed through Reverse installation process is mounted on the substrate 311 and at least another described sensitive chip 20 is directly mounted on the substrate 311 The pasting area 3111 or the accommodation space that another described sensitive chip 20 is maintained to the substrate 311 3116.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 49A shows another variant embodiment of the camera module 100, wherein the circuit board assemblies 30 The module connecting side 3121 of the connecting plate 312 of the circuit board 31 can also not be electrically connected to the substrate Described positive the 3113 of 311, such as in this example of the camera module 100 shown in attached drawing 49A, the connecting plate The 312 module connecting side 3121 can also be electrically connected to the back side 3114 of the substrate 311, in this way, being electrically connected When connecing the module connecting side 3121 of the connecting plate 312 and the substrate 311, without the concern for the sensitive chip 20 Size and position, in order to make.

It is noted that the module connecting side 3121 of the connecting plate 312 is being electrically connected to the substrate 311 The back side 3114 after, the module connecting side 3121 of the connecting plate 312 can cover the back of the body of the substrate 311 At least part in face 3114.Such as in this example of the camera module 100 shown in attached drawing 49A, the connecting plate The 312 module connecting side 3121 can be electrically connected to the side at the back side 3114 of the substrate 311, and at other Example in, the module connecting side 3121 of the connecting plate 312 can also cover the entire back of the body of the substrate 311 Face 3114, as shown in Figure 50.Certainly, in other examples, the module two of the connecting plate 312, which is borrowed, surveys 3121 and institute State substrate 311 link position can also be in " mouth " font, " C " font, " L " shape or other any possible shapes, certainly, It can also be irregular shape, be chosen as needed.

It is noted that the back side 3114 of the substrate 311 can also be out-of-flatness, such as the back side 3114 can be equipped with a short slot 31141, for accommodating the connection at the back side 3114 for being electrically connected to the substrate 311 The module connecting side 3121 of plate 312, so as to reduce the height of the camera module 100, refer to the attached drawing 49B.

With further reference to attached drawing 49A, when the module connecting side 3121 of the connecting plate 312 and the substrate 311 During the side electrical connection at the back side 3114, if the module connecting side 3121 and the substrate 311 of the connecting plate 312 The back side 3114 overlapping region width parameter for L3, wherein the module connecting side 3121 of the connecting plate 312 Value range with the width parameter L3 of the overlapping region at the back side 3114 of the substrate 311 be 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.1mm~2mm (including 0.1mm and 2mm).

In addition, the preferably inclined-plane of the inner surface 325 of the molded base 32, in order to be moulded by molding process 400 draft of molding die after the molded base 32.Preferably, the inner surface 325 of the molded base 32 and institute It is 0 °~60 ° (including 0 ° and 60 °) to state the range of angle parameter alpha that the optical axis of sensitive chip 20 is formed, preferably 5 °~35 ° (including 5 ° and 35 °).

In addition, the driver 60 further has an at least driver pin 61, wherein 61 energy of the driver pin The substrate 311, and 61 energy of the driver pin are extended to after enough passing through the molded base 32 from the driver 60 Enough it is connected to the substrate 311.It is noted that the driver pin 61 according to the present invention passes through the molding Pedestal 32 refers to that the driver pin 61 extends to lower part from the top of the molded base 32, such as the driver draws Foot 61 can be passed through from the inside of the molded base 32, can also extend along the surface of the molded base 32.

Further, the molded base 32 is equipped with an at least driver pin slot 327, draws for accommodating the driver Foot 61.Wherein described driver pin slot 327 is located at the outer surface 326 of the molded base 32, such as the molding base The outer surface 326 of seat 32 can form the driver pin slot 327 by way of recess.The molded base 32 The outer surface 326 forms at least one first cell wall 3271 and at least two second cell walls 3272, the second cell wall described in two of which 3272 are located at the both sides of first cell wall 3271, with by first cell wall 3271 and each second cell wall, 3272 boundary The fixed driver pin slot 327.Preferably, the inclined-plane of first cell wall 3271, if the extension of first cell wall 3271 The angle parameter that the optical axis direction of direction and the sensitive chip 20 is formed is θ, and wherein parameter θ is acute angle.Preferably, parameter θ Value range be 3 °~45 ° (including 3 ° and 45 °), preferably 3 °~15 ° (including 3 ° and 15 °).In addition, the molding base Seat 32 the outer surface 326 can also Formation cross-section be arc the driver pin slot 327, wherein the driver draws The extending direction of foot slot 327 can be inclined.If the extending direction of the driver pin slot 327 and the sensitive chip 20 The angle parameter that is formed of optical axis direction for θ, wherein parameter θ is acute angle.Preferably, the value range of parameter θ is 3 °~45 ° (including 3 ° and 45 °), preferably 3 °~15 ° (including 3 ° and 15 °).

With reference to the present invention Figure of description attached drawing 51 to Figure 58, the circuit board assemblies of the camera module 100 30 manufacturing process is set forth.

Refer to the attached drawing 51 and Figure 52, the substrate 311 that can be spaced two or more are arranged together to be formed One layout unit 300, in order to subsequently carry out molding process.It is understood that due to described in the present invention In this embodiment of camera module 100, it may not be necessary to which described positive 3113 in the substrate 311 reserve described in electrical connection The position of the module connecting side 3121 of connecting plate 312, each substrate 311 of the layout unit 300 can be by more Add and be compactly close together, to improve the utilization rate of the layout unit 300.The adjacent base of the layout unit 300 The distance range of plate 311 be 0.01mm~500mm (including 0.01mm and 500mm), preferably 0.05mm~200mm (including 0.05mm and 200mm).Local molding stability during molding process, the minimum of the layout unit 300 are carried out to improve Size range is 1mm~100000mm (including 1mm and 100000mm), preferably 10mm~1000mm (including 10mm and 1000mm)。

It is noted that the connecting plate 312 first can also be electrically connected to the substrate before molding process 311 back side 3114, at this point, the molding die 400 needs to be reserved mold pressing width and pattern draft.Then, Each electronic component 34 is mounted on to the fringe region 3112 of the substrate 311 respectively.Certainly, the skill of this field Art personnel are it is understood that it is also that have can that the electronic component 34 is mounted on the back side 3114 of the substrate 311 Can.

It is understood that can also each electronic component 34 first be mounted on the substrate 311, then again will Typesetting unit 300 described in each 311 arrangement form of substrate.

The layout unit 300 is placed in the molding die 400 by refer to the attached drawing 53, Figure 54, Figure 55 and Figure 56 Carry out molding process.

Refer to the attached drawing 57, can be to forming the layout unit after carrying out molding process on the layout unit 300 300 each substrate 311 is detached, to obtain the semi-finished product of the circuit board assemblies 30, such as can by but not It is limited to cut or the techniques such as etches and each substrate 311 for forming the layout unit 300 is detached.

It is noted that in one example, for the ease of cutting by the layout unit after carry out molding process 300, as well as abrasion, cutting blade can form a slight tapered cross-section, the circuit board group obtained after cutting The separation side of the semi-finished product of part 30 also can be there are one slight gradient, refer to the attached drawing 11, if the half of the circuit board assemblies 30 into The angle parameter that the extending direction of the side 3115 of the substrate 311 of product and the optical axis of the sensitive chip 20 are formed is β, Ranging from 0 °~10 ° (including 0 ° and 10 °) of middle parameter beta, preferably 0 °~5 ° (including 0 ° and 5 °).In another example In, for the ease of etching, as well as the continuity of etching, the semi-finished product of the circuit board assemblies 30 that are obtained after etching Separation side also can one slight treat gradient, refer to the attached drawing 11, if the substrate 311 of the semi-finished product of the circuit board assemblies 30 with irreverence The side 3115 extending direction and the sensitive chip 20 optical axis formed angle parameter be β, wherein parameter beta model It encloses for 0 °~10 ° (including 0 ° and 10 °), preferably 0 °~5 ° (including 0 ° and 5 °).It is, of course, understood that the circuit The gradient of the side 3115 of the substrate 311 of the semi-finished product of plate component 30 can also be removed in subsequent technique, Such as can by polishing grinding or go the techniques such as flash removed make the substrate 311 the side 3115 obtain it is vertical, Smooth, mellow and full side form.

The module connecting side 3121 of the connecting plate 312 is electrically connected to the substrate 311 by refer to the attached drawing 58 The side at the back side 3114, to obtain the circuit board assemblies 30.

The sensitive chip 20 is mounted on by the optical window 321 of the molded base 32 described by refer to the attached drawing 59 The pasting area 3111 of substrate 311, and can by routing technique the sensitive chip 20 and the substrate 311 it Between form at least one lead 33, the substrate 311 and the sensitive chip 20, and the sensitive chip 20 is connected Corresponding to the optical window 321 of the molded base 32.

Attached drawing 60 shows another variant embodiment of the camera module 100, wherein the molded base 32 into One step embeds at least part in the non-photo-sensing region of the sensitive chip 20, so that the sensitive chip 20, the substrate 311 and the molded base 32 integrally combine, and the lead 33 can also be embedded in the interior of the molded base 32 Portion, to ensure the good electrical of the lead 33 by the molded base 32.For example, the camera module 100 this In example, the sensitive chip 20 can be first mounted on to the pasting area 3111 of the substrate 31, then again to its into Row molding process, in such manner, it is possible to which molding is made to obtain the non-photo-sensing region that the molded base 32 embeds the sensitive chip 20 At least partially.

Attached drawing 61 shows another variant embodiment of the camera module 100, wherein the camera module 100 into One step includes the supporting member 70 of an at least frame shape, wherein the supporting member 70 can be arranged at the institute of the substrate 311 The fringe region 3112 of the substrate 311 can be formed in by stating fringe region 3112 or the supporting member 70, wherein The molded base 32 at least embeds the outer side edges 71 of the supporting member 70 after shaping, so that the substrate 311, the branch It holds element 70 and the molded base 32 integrally combines, wherein the molded base 32 can embed the lead 33 extremely A few part or the supporting member 70 embed at least part of the lead 33, the molded base 32 and institute State at least part that supporting member 70 embeds the lead 33 respectively.In other examples, the molded base 32 also may be used Further to embed at least part of the top surface 72 of the supporting member 70.

Attached drawing 62 shows another variant embodiment of the camera module 100, wherein the supporting member 70 also may be used The photosensitive core can also be formed in be arranged on the non-photo-sensing region of the sensitive chip 20 or the supporting member 70 The non-photo-sensing region of piece 20, thus in molding process, the molded base 32, the substrate 311,20 and of the sensitive chip The supporting member 70 can be combined integrally.

Attached drawing 63 shows another variant embodiment of the camera module 100, wherein the substrate 311 has An at least accommodation space 3116, wherein the accommodation space 3116 is used to accommodate the sensitive chip 20, in such manner, it is possible to reduce The height dimension of the camera module 100, wherein the sensitive chip 20 is mounted on the connecting plate 312, thus by The connecting plate 312 makes the sensitive chip 20 be maintained in the accommodation space 3116.Preferably, the accommodation space 3116 may be implemented as through-hole.Nevertheless, it will be appreciated by those skilled in the art that, in the camera module 100 Other examples in, the accommodation space 3116 can also be implemented as groove.

Attached drawing 64 shows another variant embodiment of the camera module 100, wherein the molded base 32 can Further to embed at least part in the non-photo-sensing region of the sensitive chip 20.

Attached drawing 65 shows another variant embodiment of the camera module 100, wherein the connecting plate 312 The link position at the back side 3114 of the module connecting side 3121 and the substrate 311 can be in " mouth " font, that is, described The module connecting side 3121 of connecting plate 312 has a through-hole 3123, the module connecting side 3121 of the connecting plate 312 After the back side 3114 of the substrate 311 is electrically connected to, the through-hole 3123 of the connecting plate 312 corresponds to The accommodation space 3116 of the substrate 311, wherein at least part of the sensitive chip 20 can be housed inside it is described In the through-hole 3123 of connecting plate 312, in this way, can not be contacted between the sensitive chip 20 and the connecting plate 312, lead to Such mode is crossed, makes the flatness of the sensitive chip 20 will not be by the influence of the connecting plate 312, to be taken the photograph described in guarantee As the image quality of module 100.

Attached drawing 66 shows another variant embodiment of the camera module 100, wherein the institute of the substrate 311 The part for stating the back side 3114 be used to connect the module connecting side 3121 of the connecting plate 312, the substrate 311 it is another A part can be integrally with reference to the reinforcement part 35, wherein the sensitive chip 20 can be directly mounted on the reinforcement Portion 35, in this way, the flatness of the sensitive chip 20 can be ensured by the reinforcement part 35, further to improve the camera shooting mould The image quality of group 100.

Attached drawing 67 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 also may be used To form a holding tank 351, wherein the sensitive chip 20 is housed inside the holding tank 351 of the reinforcement part 35, with Further reduce the height of the camera module 100.

Attached drawing 68 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can be with Further embed the connection at the module connecting side 3121 of the connecting plate 312 and the back side 3114 of the substrate 311 Position, to ensure the reliability of the link position, so as to prevent the module connecting side 3121 of the connecting plate 312 from institute The back side 3114 for stating substrate 311 comes off.The back side 3114 of the substrate 311 is equipped with the short slot 31141, for holding Receive the module connecting side 3121 of the connecting plate 312.

Attached drawing 69 shows another variant embodiment of the camera module 100, wherein the substrate 311 has At least one keeps space 3117, wherein a part of of the molded base 32 can the integrally formed institute in the substrate 311 It states and keeps space 3117, to prevent the molded base 32 and the substrate 311 from coming off, so as to ensure the camera module 100 Reliability.Preferably, the holding space 3117 of the substrate 311 may be implemented as through-hole, nevertheless, in institute In other examples for stating camera module 100, the holding space 3117 of the substrate 311 can also be implemented as blind hole or A part of holding space 3117 of person is implemented as through-hole, space 3117 is kept to be implemented as blind hole described in another part.

Attached drawing 70 shows another variant embodiment of the camera module 100, wherein the one of the reinforcement part 35 Part can be integrally formed in the holding space 3117 of the substrate 311, to prevent the reinforcement part 35 and the base Plate 311 comes off, so as to ensure the reliability of the camera module 100.

Attached drawing 71A shows another variant embodiment of the camera module 100, wherein the substrate 311 is extremely A few holding space 3117 is implemented as through-hole, wherein in a molding process, passing through the moulding material 500 described It is respectively formed behind holding space 3117 in described positive the 3113 of the substrate 311 and the back side 3114 and is integrally incorporated into institute State the molded base 32 of substrate 311 and the reinforcement part 35.

Attached drawing 71B shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 The substrate 311 can be mounted on by reverse installation process, and the photosensitive region of the sensitive chip 20 passes through the substrate 311 accommodation space 3116 for being implemented as through-hole corresponds to the optical window 321 of the molded base 32.

Attached drawing 72 shows another variant embodiment of the camera module 100, wherein the camera module 100 wraps Two described 10, two sensitive chips 20 of optical lens and the circuit board assemblies 30 are included, wherein the circuit Plate component 30 includes 31, molded bases 32 of circuit board and lead 33, wherein institute at least described in two groups It states circuit board 31 and includes a substrate 311 and a connecting plate 312, the module of the connecting plate 312 connects Side 3121 is electrically connected to the back side 3114 of the substrate 311, and there are two the pasting areas for the tool of substrate 311 3111, wherein each sensitive chip 20 is mounted on each pasting area 3111 of the substrate 311 respectively, and Each sensitive chip 20 and the substrate 311 are connected by the lead 33, wherein there are two the tools of the molded base 32 The optical window 321, so that each sensitive chip 20 corresponds respectively to each optical window 321, wherein each optics Camera lens 10 is respectively held in the photosensitive path of each sensitive chip 20.

Further, the camera module 100 can further include at least two filter elements 40, wherein each described Filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.For example, each institute The molded base 32 can be mounted on respectively by stating filter element 40, so that each filter element 40 is respectively held in Between each optical lens 10 and each sensitive chip 20.

It is noted that the camera module 100 shown in attached drawing 72 is merely illustrative, when 100 quilt of camera module Be embodied as comprising more described optical lens 10 when, the quantity of the sensitive chip 20, the quantity of the filter element 40 with And the quantity of the driver 60 can be consistent with the quantity of the optical lens 10.In addition, the molded base 32 also may be used Further to embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 73 shows another variant embodiment of the camera module 100, wherein the circuit board assemblies 30 The circuit board 31 can also include two substrates 311 and two connecting plates 312, wherein each connecting plate 312 are connected to each substrate 311 by Electricity Federation respectively, wherein each substrate 311 is respectively provided with an attachment area Domain 3111, wherein the sensitive chip 20 is mounted on each pasting area 3111 of each substrate 311 respectively, Described in molded base 32 be integrally incorporated into each substrate 3111 so that two substrates 3111 and the molding base Seat 32 is combined as a whole.In addition, the molded base 32 can also further embed the non-of at least one sensitive chip 20 Photosensitive region.

Attached drawing 74 shows another variant embodiment of the camera module 100, wherein the camera module 100 into One step includes an at least lens barrel 80.Specifically, the camera module 100 can include two lens barrels in this illustration 80, wherein each optical lens 10 is arranged at the lens barrel 80 respectively, each lens barrel 80 is mounted on institute respectively Molded base 32 is stated, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20. In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 75 shows another variant embodiment of the camera module 100, wherein each lens barrel 80 The molded base 32 can integrally be extended respectively, that is, the lens barrel 80 can with the molded base 32 integrally into Type.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 76 shows another variant embodiment of the camera module 100, one of them described lens barrel 80 1 The molded base 32 is extended to body, another described lens barrel 80 is mounted on the molded base 32.In addition, the molding Pedestal 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 77 shows another variant embodiment of the camera module 100, one of them described optical lens 10 are driveably set to the driver 60, and the driver 60 is mounted on the molded base 32, described in another Optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 is mounted on the molded base 32.In addition, the mould Pedestal 32 processed can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 78 shows another variant embodiment of the camera module 100, one of them described optical lens 10 are driveably set to the driver 60, and the driver 60 is mounted on the molded base 32, described in another Optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 integrally extends the molded base 32.In addition, institute The non-photo-sensing region of at least one sensitive chip 20 can also further be embedded by stating molded base 32.

Attached drawing 79 shows another variant embodiment of the camera module 100, wherein the camera module 100 into One step includes a bearing 90, wherein the molded base 32 moulds a part for the substrate 311, so that a photosensitive core Piece 20 corresponds to the optical window 321 of the molded base 32, and the bearing 90 is mounted on another portion of the substrate 311 Point so that the sensitive chip 20 corresponds to the light hole 91 of the bearing 90, wherein each optical lens 10 respectively by Each driver 60 is driveably set to, a driver 60 is mounted on the molded base 32, another The driver 60 is mounted on the bearing 90 so that each optical lens 10 be respectively held in it is each described photosensitive The photosensitive path of chip 20.It is understood that by each optical lens 10 be respectively arranged at each lens barrel 80 or One optical lens 10 is set to the driver 60 by person, another described optical lens 10 is set to the branch Seat 90 is also possible.In addition, the molded base 32 can also further embed the non-of at least one sensitive chip 20 Photosensitive region.

Attached drawing 80 shows another variant embodiment of the camera module 100, wherein the molded base 32 At least part in the non-photo-sensing region of the sensitive chip 20 can be further embedded, so that the molded base 32, described Sensitive chip 20 and the substrate 311 integrally combine.In addition, the molded base 32 can also further embed it is at least one The non-photo-sensing region of the sensitive chip 20.

Attached drawing 81 shows another variant embodiment of the camera module 100, wherein by the supporting member After 70 are set to the substrate 311 or the supporting member 70 is made to take shape in the substrate 311, then molding process is carried out, with The molded base 32 is made to embed at least part of the supporting member 70, so that the molded base 32, the base Plate 311 and the supporting member 70 integrally combine.In addition, the molded base 32 can also further embed at least one institute State the non-photo-sensing region of sensitive chip 20.

Attached drawing 82 shows another variant embodiment of the camera module 100, wherein by the supporting member 70 are set to the non-photo-sensing region of the sensitive chip 20 or the supporting member 70 are made to take shape in the sensitive chip 20 Behind non-photo-sensing region, then molding process is carried out, so that the molded base 32 embeds at least part of the supporting member 70, So that the molded base 32, the sensitive chip 20, the substrate 311 and the supporting member 70 integrally combine. In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 83 shows another variant embodiment of the camera module 100, wherein the substrate 311 has At least one accommodation space 3116, such as in this particular example, the camera module 100 can include two institutes Accommodation space 3116 is stated, for accommodating each sensitive chip 20, in such manner, it is possible to reduce the height of the camera module 100 Size.Preferably, the accommodation space 3116 may be implemented as through-hole, certainly, in other examples, the accommodation space 3116 can also be implemented as blind hole.In addition, the molded base 32 can also further embed at least one photosensitive core The non-photo-sensing region of piece 20.

Attached drawing 84 shows another variant embodiment of the camera module 100, wherein the institute of the substrate 311 The quantity for stating accommodation space 3116 is less than the quantity of the sensitive chip 20, such as the substrate 311 can have there are one described in Accommodation space 3116, one of them sensitive chip 20 are mounted on the pasting area 3111 of the substrate 311, separately One sensitive chip 20 is maintained at the accommodation space 3116, in such manner, it is possible to have two sensitive chips 20 Difference in height.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 85 shows another variant embodiment of the camera module 100, wherein the connecting plate 312 The module connecting side 3121 is mounted on the side at the back side 3114 of the substrate 311, the back of the body of the substrate 311 The opposite side in face 3114 can also be moulded at least one reinforcement part 35 by molding process, wherein each photosensitive core Piece 20 is mounted on the reinforcement part 35 respectively, so that each sensitive chip 20 can get along well, the substrate 311 contacts, from And the substrate 311 is enabled to select thinner plank, to reduce the height dimension of the camera module 100, and protect Demonstrate,prove the flatness of the sensitive chip 20.In addition, the molded base 32 can also further embed it is at least one described photosensitive The non-photo-sensing region of chip 20.

Attached drawing 86 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can be with Further embed the connection at the module connecting side 3121 of the connecting plate 312 and the back side 3114 of the substrate 311 Position, to ensure the reliability of the link position.In addition, the molded base 32 can also further embed at least one institute State the non-photo-sensing region of sensitive chip 20.

Attached drawing 87 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 also may be used To further provide for an at least holding tank 351, such as in this embodiment, the holding tank 351 of the reinforcement part 35 Quantity is consistent with the quantity of each sensitive chip 20, so that each sensitive chip 20 is housed inside the reinforcement respectively Each holding tank 351 in portion 35, nevertheless, in other examples, the quantity of the holding tank 351 can also be less than The quantity of the sensitive chip 20, so that each sensitive chip 20 has difference in height.In addition, the molded base 32 The non-photo-sensing region of at least one sensitive chip 20 can further be embedded.

Attached drawing 88 shows another variant embodiment of the camera module 100, wherein the substrate 311 has At least one holding space 3117, wherein a part of of the molded base 32 can be integrally formed in the substrate 311 each holding space 3117.It is understood that the holding space 3117 may be implemented as through-hole, also may be used To be implemented as blind hole.In addition, the molded base 32 can also further embed the non-of at least one sensitive chip 20 Photosensitive region.

Attached drawing 89 shows another variant embodiment of the camera module 100, wherein the substrate 311 is extremely Few one described to keep space 3117 to may be implemented as through-hole, and so as in a molding process, the moulding material 500 can be It is respectively formed integrally in described positive the 3113 of the substrate 311 and the back side 3114 after across the holding space 3117 It is incorporated into the molded base 32 of the substrate 311 and the reinforcement part 35.In addition, the molded base 32 can also be into one Step embeds the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 90 shows another variant embodiment of the camera module 100, wherein the filter element 40 Quantity may be implemented as one, so as to which each optical lens 10 is respectively by the different positions corresponding to the filter element 40 It puts.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 91 shows another variant embodiment of the camera module 100, wherein each filter element 40 can be arranged at each stent 50 respectively, wherein each stent 50 is mounted on the molded base respectively 32, so that each filter element 40 is respectively held in each optical lens 10 and each sensitive chip 20 Between.Also, the size of the filter element 40 can be reduced, to reduce the manufacture cost of the camera module 100.Separately Outside, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 92 shows another variant embodiment of the camera module 100, wherein the filter element 40 Quantity and the quantity of the optical lens 10 and the sensitive chip 20 correspond, and the stent 50 may be implemented as one A, wherein each filter element 40 is arranged at the different location of the stent 50 respectively, the stent 50 is mounted on The molded base 32, so that each filter element 40 is respectively held in each optical lens 10 and each Between the sensitive chip 20.In addition, the molded base 32 can also further embed at least one sensitive chip 20 Non-photo-sensing region.

Attached drawing 93 shows another variant embodiment of camera module 100, sensitive chip described in wherein at least one 20 can be mounted on the substrate 311, and the photosensitive region of the sensitive chip 20 can pass through institute by reverse installation process The accommodation space 3116 for being implemented as through-hole for stating substrate 311 corresponds to the optical window 321 of the molded base 32.To the greatest extent Pipe passes through upside-down mounting work in this example of the camera module 100 shown in attached drawing 93, with two sensitive chips 20 Skill is mounted on the substrate 311, and in an other example, a sensitive chip 20 can also be passed through upside-down mounting Technique is mounted on the substrate 311 and another described sensitive chip 20 is directly mounted on to the patch of the substrate 311 Dress region 3111 or the accommodation space 3116 that another described sensitive chip 20 is maintained to the substrate 311.Separately Outside, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 94 shows another variant embodiment of the camera module 100, wherein the connecting plate 312 The module connecting side 3121 can also be connected to the side 3115 of the substrate 311, that is to say, that the connecting plate The extending direction of 312 extending direction and the substrate 311 can be inconsistent, for example, the extending direction of the connecting plate 312 and The extending direction of the substrate 311 can be mutually perpendicular to, in this way, the camera module 100 is installed on the electronic equipment During ontology 200, the phenomenon that the radian that the connecting plate 312 is bent can be avoided excessive and be broken.

In other words, the camera module 100 of the invention makes the extending direction of the connecting plate 312 and the substrate 311 Difference needs angle to be bent, the camera module 100 is being installed on institute so as to the reserved connecting plate 312 When stating electronic equipment ontology 200, the connecting plate 312 can be made to deform as small as possible, so as to ensure the camera module 100 Reliability.Preferably, one 90 ° or the folder close to 90 ° can be generated between the connecting plate 312 and the substrate 311 Angle to further reduce the volume of the camera module 100, sets so as to reduce the camera module 100 in the electronics Occupied space in standby ontology 200.

Further, the side 3115 that be used to connect the connecting plate 312 of the substrate 311 forms a company Socket part 31150, wherein the thickness of the connecting portion 31150 is set as parameter H, wherein the thickness parameter H of the connecting portion 31150 Value range is 0.01mm~10mm (including 0.01mm and 10mm), preferably 0.1mm~5mm (including 0.1mm and 5mm), this Sample can ensure the reliability of the link position of the connecting plate 312 and the substrate 311.It is understood that the substrate The thickness of 311 connecting portion 31150 can be different from the thickness of the other positions of the substrate 311, such as the substrate The thickness of 311 connecting portion 31150 can be more than the thickness of the other positions of the substrate 311, can also the substrate The consistency of thickness of the thickness of 311 connecting portion 31150 and the other positions of the substrate 311.In addition, the substrate 311 At least one side 3115 form the connecting portion 31150.

It is noted that in one embodiment of the camera module 100 of the present invention, it can be first to the substrate 311 carry out molding process, are then again connected to the connecting plate 312 described in the substrate 311 by the conducting medium Connecting portion 31150.It, can also be first by the connecting plate 312 in another embodiment of the camera module 100 of the present invention The connecting portion 31150 of the substrate 311 is connected to by the conducting medium, then carries out molding process again, in this way, energy It is enough embedded in the molded base 32 for being integrally incorporated into the substrate 311 and connects the substrate using the conducting medium 311 and the conducting medium that overflows of when connecting plate 312, pollute the camera shooting mould to avoid the follow-up conducting medium The other component of group 100, and can ensure aesthetics.

It is noted that the connecting plate 312 is formerly connected to the substrate 311 by the conducting medium The connecting portion 31150, when then carrying out molding process again, the connecting plate 312 can be placed in the molding die 400 In the groove held successfully in advance, so as to not influence flatness and stability that 311 part of substrate is put, to ensure molding process Mass carry out.

In addition, the substrate 311 has the accommodation space 3116, for accommodating the sensitive chip 20, in such manner, it is possible to Reduce the height of the camera module 100.It is noted that the accommodation space 3116 may be implemented as through-hole, also may be used To be implemented as groove.

Attached drawing 95 shows another variant embodiment of the camera module 100, wherein the molded base 32 can Further to embed the non-photo-sensing region of the sensitive chip 20, so that the substrate 311, the molded base 32 and the sense Optical chip 20 integrally combines.

Attached drawing 96 shows another variant embodiment of the camera module 100, wherein the substrate 311 also may be used To be equipped with the supporting member 70 or form the supporting member 70, the molded base 32 can embed the supporting member 70 at least part, so that the substrate 311, the supporting member 70 and the molded base 32 integrally combine.

Attached drawing 97 shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 Non-photo-sensing region can also be equipped with the supporting member 70 or form the supporting member 70, and the molded base 32 can wrap At least part of the supporting member 70 is buried, so that the substrate 311, the supporting member 70,32 and of the molded base The sensitive chip 20 integrally combines.

Attached drawing 98 shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 can To be mounted on the substrate 311 by reverse installation process, so that the photosensitive region of the sensitive chip 20 passes through the substrate 311 The accommodation space 3116 correspond to the molded base 32 the optical window 321.

Attached drawing 99 shows another variant embodiment of the camera module 100, wherein the institute of the substrate 311 Stating the back side 3114 can also be integrally with reference to the reinforcement part 35, with by the strong of substrate 311 described in 35 reinforcement of reinforcement part Degree.In addition, the sensitive chip 20 can be directly mounted on the reinforcement part 35, in this way, the sensitive chip 20 is smooth Degree can be ensured by the reinforcement part 35, to improve the image quality of the camera module 100.

Attached drawing 100 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 The holding tank 351 can be equipped with, for accommodating the sensitive chip 20, in such manner, it is possible to further by camera module described in ground 100 height.

Attached drawing 101 shows another variant embodiment of the camera module 100, and the substrate 311 can be equipped with At least one holding space 3117, holding space 3117 may be implemented as through-hole described in wherein at least one, in this way, In molding process, the moulding material 500 can be across after being implemented as the holding space 3117 of through-hole, respectively described Described positive the 3113 of substrate 311 and the back side 3114 form the molded base for being integrally incorporated into the substrate 311 32 and the reinforcement part 35.

Attached drawing 102 shows another variant embodiment of the camera module 100, wherein the camera module 100 Including two described 10, two sensitive chips 20 of optical lens and the circuit board assemblies 30, wherein the electricity Road plate component 30 includes 31, molded bases 32 of circuit board and lead 33 at least described in two groups, wherein The circuit board 31 includes a substrate 311 and a connecting plate 312, and the module of the connecting plate 312 connects The connecting portion 31150 that side 3121 is electrically connected to the substrate 311 is connect, the tool of substrate 311 accommodates sky there are two described Between 3116, for accommodating each sensitive chip 20 respectively, and each sensitive chip is connected by the lead 33 20 and the substrate 311, wherein the tool of the molded base 32 is there are two the optical window 321, so that each sensitive chip 20 Each optical window 321 is corresponded respectively to, wherein each optical lens 10 is respectively held in each sensitive chip 20 photosensitive path.In addition, the molded base 32 can also further embed the non-sense of at least one sensitive chip 20 Light region.

Attached drawing 103 shows another variant embodiment of the camera module 100, wherein the molded base 32 can Further to embed at least part in the non-photo-sensing region of the sensitive chip 20, so that the substrate 311, the molding base Seat 32 and each sensitive chip 20 integrally combine.In addition, the molded base 32 can also further embed at least one The non-photo-sensing region of a sensitive chip 20.

Attached drawing 104 shows another variant embodiment of the camera module 100, wherein the substrate 311 also may be used To be equipped with the supporting member 70 or form the supporting member 70, the molded base 32 can embed the supporting member 70 at least part, so that the substrate 311, the supporting member 70 and the molded base 32 integrally combine.In addition, The molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 105 shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 Non-photo-sensing region can also be equipped with the supporting member 70 or form the supporting member 70, and the molded base 32 can wrap At least part of the supporting member 70 is buried, so that the substrate 311, the supporting member 70,32 and of the molded base Each sensitive chip 20 integrally combines.In addition, the molded base 32 can also further embed it is at least one described The non-photo-sensing region of sensitive chip 20.

Attached drawing 106 shows another variant embodiment of the camera module 100, wherein each sensitive chip 20 can be mounted on the substrate 311 by reverse installation process, so that the photosensitive region of the sensitive chip 20 passes through the base The accommodation space 3116 of plate 311 corresponds to the optical window 321 of the molded base 32.Certainly, in the camera module In 100 other examples, a sensitive chip 20 can also be mounted on the substrate 311 by reverse installation process and made Another sensitive chip 20 is maintained at the accommodation space 3116 of the substrate 311.In addition, the molded base 32 The non-photo-sensing region of at least one sensitive chip 20 can also further be embedded.

Attached drawing 107 shows another variant embodiment of the camera module 100, wherein the institute of the substrate 311 Stating the back side 3114 can also be at least partly integrally with reference to the reinforcement part 35, with by substrate described in 35 reinforcement of reinforcement part 311 intensity.In addition, each sensitive chip 20 can be directly mounted on the reinforcement part 35 respectively, in this way, each institute Stating the flatness of sensitive chip 20 can be ensured by the reinforcement part 35, to improve the imaging product of the camera module 100 Matter.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 108 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 The holding tank 351 can be equipped with, for accommodating each sensitive chip 20, in such manner, it is possible to further by camera shooting described in ground The height of module 100.For example, in this illustration, the quantity of the holding tank 351 of the reinforcement part 35 and the photosensitive core The quantity of piece 20 is consistent, so that each sensitive chip 20 can be housed inside the receiving of the reinforcement part 35 Slot 351.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.

Attached drawing 109 shows another variant embodiment of the camera module 100, wherein the institute of the reinforcement part 35 The quantity of the sensitive chip 20 can be less than by stating the quantity of holding tank 351, so as to which a sensitive chip 20 is housed inside The holding tank of the reinforcement part 35, another described sensitive chip 20 are mounted on the reinforcement part 35, in this way so that two A sensitive chip 20 can have difference in height.In addition, the molded base 32 can also further embed at least one institute State the non-photo-sensing region of sensitive chip 20.

Attached drawing 110 shows another variant embodiment of the camera module 100, and the substrate 311 can be equipped with At least one holding space 3117, holding space 3117 may be implemented as through-hole described in wherein at least one, in this way, In molding process, the moulding material 500 can be across after being implemented as the holding space 3117 of through-hole, respectively described Described positive the 3113 of substrate 311 and the back side 3114 form the molded base for being integrally incorporated into the substrate 311 32 and the reinforcement part 35.In addition, the molded base 32 can also further embed at least one sensitive chip 20 Non-photo-sensing region.

It will be understood by those skilled in the art that foregoing description and attached the embodiment of the present invention shown in figure be only used as citing and It is not intended to limit the present invention.

The purpose of the present invention has been fully and effectively achieved.The function and structural principle of the present invention is opened up in embodiment Show and illustrate, under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims

A 1. molded case circuit plate component, which is characterized in that including：

One molded base, wherein the molded base has an at least optical window；With

An at least circuit board, wherein the circuit board includes an at least substrate and an at least connecting plate, wherein the connecting plate quilt Be connected to the substrate, the substrate for a conducting at least sensitive chip, wherein the molded base be integrally incorporated into it is described Substrate, so that the sensitive chip corresponds to the optical window of the molded base.
2. circuit board assemblies according to claim 1, wherein the connecting plate is connected to the front of the substrate.
3. circuit board assemblies according to claim 1, wherein the connecting plate is connected to the back side of the substrate.
4. circuit board assemblies according to claim 1, wherein the connecting plate is connected to the side of the substrate.
5. circuit board assemblies according to claim 2, wherein the molded base further embeds the connecting plate and institute State the link position of substrate.
A 6. camera module, which is characterized in that including：

An at least optical lens；

An at least sensitive chip；And

An at least circuit board assemblies, wherein the circuit board assemblies include an at least molded base and an at least circuit board, wherein The molded base has an at least optical window, wherein the circuit board includes an at least substrate and an at least connecting plate, wherein institute It states connecting plate and is connected to the substrate, the substrate and the sensitive chip are switched on, and the molded base integrally combines In the substrate, so that the sensitive chip corresponds to the optical window of the molded base, the optical lens is maintained at The photosensitive path of the sensitive chip.
7. the manufacturing method of a molded case circuit plate component, which is characterized in that the manufacturing method includes the following steps：

(a) there is a molded base of an at least optical window in an at least substrate upper mold fixture；With

(b) one connecting plate of connection is to the substrate, the molded case circuit plate component is made.
8. manufacturing method according to claim 7, wherein the step (b) is before the step (a), so as to first connect Then the connecting plate moulds the molded base to the substrate in the substrate.
9. manufacturing method according to claim 7 or 8 wherein before the step (a), makes at least two substrates One layout unit of arrangement form in the step (a), while moulds the layout list at least two substrates Member.
A 10. electronic equipment, which is characterized in that including：

One electronic equipment ontology；With

An at least camera module, wherein the camera module is arranged at the electronic equipment ontology, wherein the camera module Further comprise：

An at least optical lens；

An at least sensitive chip；And

An at least circuit board assemblies, wherein the circuit board assemblies include an at least molded base and an at least circuit board, wherein The molded base has an at least optical window, wherein the circuit board includes an at least substrate and an at least connecting plate, wherein institute It states connecting plate and is connected to the substrate, the substrate and the sensitive chip are switched on, and the molded base integrally combines In the substrate, so that the sensitive chip corresponds to the optical window of the molded base, the optical lens is maintained at The photosensitive path of the sensitive chip.