CN110769130A

CN110769130A - Molding assembly, camera module, molding assembly splicing plate and manufacturing method

Info

Publication number: CN110769130A
Application number: CN201810834100.2A
Authority: CN
Inventors: 黄威威; 梅哲文; 梅其敏; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-07-26
Filing date: 2018-07-26
Publication date: 2020-02-07
Anticipated expiration: 2038-07-26
Also published as: CN112740646B; CN110769130B; CN112740646A

Abstract

A molding assembly, a camera module, a molded assembly panel and a manufacturing method. The molding assembly comprises a circuit board, wherein the circuit board is provided with a molding area, a mounting area and at least two pad areas, the molding area surrounds the mounting area, the pad areas are arranged at the corners of the circuit board and are positioned at the outer sides of the corresponding corners of the molding area so as to be electrically connected with an actuator, and the pad areas are provided with an avoiding boundary, wherein the angle formed by the avoiding boundary is larger than 90 degrees; and the molding part covers the molding area, surrounds the mounting area, and is provided with an optical window, and the molding part avoids the bonding pad area along the avoiding boundary, so that the defect rate in production is reduced.

Description

Molding assembly, camera module, molding assembly splicing plate and manufacturing method

Technical Field

The invention relates to the field of molding, in particular to a molding component, a camera module, a molded component spliced plate and a manufacturing method, which are suitable for an automatic zooming camera module and can reduce the reject ratio.

Background

With the development of the camera module industry, common camera modules in the market are classified into a fixed focus camera module (FF) and an auto zoom camera module (AF). Conventional auto-zoom camera modules typically achieve zooming by an actuator, such as a motor, which requires the actuator to be electrically connected to a circuit board. The circuit board of the conventional automatic zoom camera module is specially reserved with a pad area for electrically connecting with actuators such as a motor.

As the camera module industry is more and more tending to develop miniaturization, manufacturers will use a molding process to minimize the size of the camera module, such as MOC process or MOB process. The capacitor at the edge of the circuit board, even the edge part of the photosensitive chip, is coated by a molding mirror seat, thereby realizing the purposes of increasing the strength of the circuit board and reducing the size of the circuit board. When the molding process is applied to the automatic zooming camera module, the molding area needs to avoid the pad area, and the molding material is prevented from covering the pad area, so that the motor can be electrically connected with the circuit board.

A problem that follows is that, as shown in fig. 1, the reserved pad area 11A of the prior art is provided in a square shape, that is, the corner of the molding area 12A is provided with a concave apex 121A that is concave at a right angle for fitting and forming the pad area 11A. Correspondingly, the molding fluid needs to continuously make a right-angle turn at the concave vertex angle 121A to avoid, which causes the molding fluid to flow back, flow rate unevenness and the like, and is difficult to control.

In addition, the boundary of the square pad region 11A blocks the molding fluid. The molding channel formed between the adjacent pad regions 11A may be under-molded due to the blockage of the pad regions 11A. For the MOC process, the molding material encapsulates electronic components such as capacitors and gold wires which are positioned at the edge of the circuit board, and molding fluid with uneven speed can impact the gold wires, the capacitors and the like, so that poor contact of the electronic components is caused.

Disclosure of Invention

It is an object of the present invention to provide a molded component, camera module, molded component panel and method of making wherein the molded side of a land area has an avoiding boundary edge that reduces obstruction to the flow of molding fluid as compared to prior art square land area designs.

It is another object of the present invention to provide a molded component, camera module, molded component panel and method of manufacture wherein the relief boundary reduces the likelihood of flow inequality conditions as compared to prior art square pad area designs.

Another object of the present invention is to provide a mold assembly, a camera module, a mold assembly panel and a method for manufacturing the same, wherein the variation range of the flow velocity of the molding fluid is reduced compared to the design of the square pad area in the prior art, the impact on the electronic components such as the capacitor and the gold wire encapsulated by the molding fluid is reduced, and the poor contact of the electronic components is avoided.

Another object of the present invention is to provide a mold assembly, a camera module, a mold assembly panel and a method for making the same, wherein the relief boundary allows the molding fluid to flow in sufficiently compared to the design of the prior art square pad area, thereby reducing the possibility of poor phenomena such as incomplete injection molding and reducing the fraction defective.

Another objective of the present invention is to provide a molding assembly, a camera module, a jointed molding assembly and a method for manufacturing the same, in which a buffer channel communicates with the flow channel on the pad region side and the flow channel inlet/outlet thereof, so as to provide a buffer space for the flow of the molding fluid, and adapt to the change of the flow channel, thereby controlling the flow rate more easily.

Another object of the present invention is to provide a molding assembly, a camera module, a panel of molding assemblies, and a method for making the same, wherein the buffer channel prevents the molding fluid from continuously turning at right angles, thereby preventing the molding fluid from flowing back and uneven flow rate.

Another object of the present invention is to provide a molding assembly, a camera module, a jointed molding assembly board of molding assemblies and a manufacturing method thereof, wherein the molding fluid flows into the flow channel on the side of the bonding pad area from the buffer flow channel, and the possibility of splashing of the molding fluid is reduced compared with the continuous right-angle turning of the molding fluid in the prior art, so as to avoid the occurrence of the adverse phenomena of incomplete injection molding, etc.

Another object of the present invention is to provide a mold assembly, a camera module, a mold assembly panel and a method for making the same, wherein the angle formed by the land area on the molding side is greater than 90 ° for forming the relief boundary and the buffer runner of the land area.

Another object of the present invention is to provide a molded component, a camera module, a molded component panel and a method for making the same, wherein the two pad regions can be disposed on the same side of the molded component or diagonally on the circuit board, so as to be suitable for electrically connecting different actuators.

It is another object of the present invention to provide a molded component, a camera module, a molded component panel and a method of making the same, wherein the molded component panel is easily manufactured when both of the pad regions can be disposed on the same side of the molded component.

Another object of the present invention is to provide a mold assembly, a camera module, a mold assembly panel and a method for manufacturing the same, wherein when two of the pad regions can be disposed on the same side of the mold assembly, they can be disposed on one connector disposing side, or on the opposite side of the connector disposing side, or on any adjacent side of the connector disposing side, according to the need or different applicable actuators, without limitation.

Another objective of the present invention is to provide a mold assembly, a camera module, a mold assembly splicing plate and a manufacturing method thereof, wherein the manufacturing method is applied to an auto focus module (AF) to reduce the defect rate of the molding process.

To achieve at least one of the above objects, according to one aspect of the present invention, there is further provided a molding member comprising:

a circuit board, wherein the circuit board has a molding region, a mounting region and at least two pad regions, wherein the molding region surrounds the mounting region, wherein the pad regions are disposed at corners of the circuit board outside of corresponding corners of the molding region for electrically connecting an actuator, wherein the pad regions have an avoiding boundary, wherein the avoiding boundary forms an angle greater than 90 °; and

a molding portion, wherein the molding portion covers the molding region, the molding portion surrounds the mounting region and has an optical window, and wherein the molding portion avoids the pad region along the avoiding boundary.

According to one embodiment of the invention, the relief boundary of the land area forms an angle of 180 °.

According to an embodiment of the invention, the angle formed by the avoiding boundary of the pad region is an obtuse angle.

According to one embodiment of the invention, the narrowest dimensional extent of the mould section is at least 0.15 mm.

According to one embodiment of the invention, adjacent disc regions are symmetrically arranged.

According to one embodiment of the present invention, at least two of the pad regions are disposed on a mounting side of the circuit board, wherein the mounting side is provided for mounting a connector.

According to one embodiment of the present invention, at least two of the pad regions are disposed on opposite sides of a mounting side of the circuit board, wherein the mounting side is for mounting a connector.

According to one embodiment of the present invention, at least two of the pad regions are disposed on a side adjacent to a mounting side of the circuit board, wherein the mounting side is provided for mounting a connector.

According to an embodiment of the present invention, the molding assembly further includes a photosensitive element, wherein the photosensitive element is mounted to the mounting region and is closely surrounded by the molding portion, and wherein the light window corresponds to the photosensitive element to form a photosensitive path.

According to one embodiment of the present invention, the molding part is encapsulated in an edge portion of the photosensitive element.

According to one embodiment of the present invention, the molding assembly further comprises at least one electronic component, wherein the electronic component is operably mounted to the molding region, wherein the molding portion encapsulates the electronic component.

According to another aspect of the present invention, the present invention further provides a camera module, including:

a molded component as described in any of the above;

a lens assembly; and

an actuator, wherein the actuator drivably supports the lens assembly on the mold assembly such that the lens assembly corresponds to the optical window of the mold assembly, wherein the actuator is operably connected to the pad region of the circuit board.

In another aspect, the present invention provides a panel of molded components for use in forming a plurality of molded components as described above by cutting, comprising:

a circuit board panel, wherein the circuit board panel has a plurality of molding regions, a plurality of mounting regions and a plurality of main pad regions, wherein the molding regions are arranged in an array on the circuit board panel, wherein adjacent molding regions border, wherein the molding regions correspondingly surround the mounting regions, wherein the main pad regions are cut and separated to form pad regions at corners of the molded component, wherein the pad regions formed after cutting have an avoiding boundary, wherein the angle formed by the avoiding boundary is greater than 90 °; and

a unitary molding, wherein the unitary molding covers the molding area, surrounds the mounting area, and defines a plurality of light windows.

According to one embodiment of the invention, the main pad area is arranged on the length side of the circuit board jointed board at intervals, so that the pad area formed after cutting is positioned at the corner of the mounting side of the obtained molded component.

According to one embodiment of the invention, the main welding areas are arranged at the corners of the adjacent molding areas on the connecting side in the same column, so that the pad areas formed after cutting are positioned at the corners on the opposite side of the mounting side of the obtained molding component.

According to one embodiment of the invention, the main welding areas are arranged at the corners of the adjacent sides of the molding areas of two adjacent columns in the same group, so that the pad areas formed after cutting are positioned at the corners of the adjacent sides of the mounting side of the obtained molding component.

According to one embodiment of the invention, the main welding area is arranged at the adjacent side corner of the same side of the molding area of each column, so that the pad area formed after cutting is positioned at the adjacent side corner of the mounting side of the obtained molding component.

According to one embodiment of the invention, the main welding area is arranged at one side corner adjacent to the mounting side of the molding area in the same row, so that the pad area formed by separating the main welding area after cutting is positioned at one side adjacent to the mounting side of the molding component.

According to one embodiment of the invention, the angle formed by the relief boundary forming the pad region after cutting is 180 °.

According to one embodiment of the present invention, the angle formed by the avoiding boundary forming the pad region after cutting is an obtuse angle.

According to one embodiment of the invention, the molded component panels further comprise a plurality of photosensitive elements, wherein the photosensitive elements are mounted at the corresponding mounting areas and are closely surrounded by the one-piece molding parts, and the light windows correspond to the photosensitive elements so as to form a photosensitive path.

According to one embodiment of the invention, the one-piece molding part is encapsulated at the edge part of the photosensitive element.

According to one embodiment of the invention, the molded component panel further comprises a plurality of electronic components, wherein the electronic components are operatively disposed in the corresponding molded regions and encapsulated by the one-piece molded portions.

According to another aspect of the present invention, there is further provided a method of molding an assembly, comprising:

(1) fixing a circuit board on a lower die, wherein the circuit board has a molding area, a mounting area and at least two pad areas, the molding area surrounds the mounting area, the pad areas are arranged at the corners of the circuit board and are positioned at the outer sides of the corresponding corners of the molding area, the pad areas have an avoiding boundary, and the angle formed by the avoiding boundary is larger than 90 degrees;

(2) closing an upper mold to the lower mold, wherein the upper mold is pressed on the bonding pad area

And the mounting area, a molding space is formed between the upper die and the molding area of the circuit board, wherein the molding space is provided with a buffer flow channel formed along the avoiding boundary;

(3) injecting a molding material into the molding space;

(4) solidifying the molding material to form a connected molding part covering the molding area;

(5) removing the upper mold and the lower mold to form the molded component.

Drawings

FIG. 1 is a perspective view of a prior art molded assembly.

Fig. 2 is a top view of a molded component circuit board according to a preferred embodiment of the present invention.

Fig. 3 is a perspective view of the molding assembly according to the above preferred embodiment of the present invention.

Fig. 4 is a top view of a circuit board panel of a molded component panel according to a preferred embodiment of the present invention.

FIG. 5 is a perspective view of the molded component panels according to the preferred embodiment of the present invention suitable for use in the production of the molded components according to the preferred embodiment.

Fig. 6 is a cross-sectional view taken along the line a-a during molding of the panels of the molded component according to the preferred embodiment of the invention.

Fig. 7 is a cross-sectional view taken along the direction B-B during molding of the panels of the molded component according to the preferred embodiment of the present invention.

Figure 8 is a perspective view of a first variant embodiment of the molding assembly according to the above preferred embodiment of the invention.

Fig. 9 is a perspective view of a first alternate embodiment molded component panel according to the preferred embodiment of the present invention suitable for use in the production of the molded components described above in the first alternate embodiment.

Figure 10 is a perspective view of a second alternative embodiment of the molding assembly according to the above preferred embodiment of the present invention.

Fig. 11 is a perspective view of a second alternative embodiment molded component panel according to the preferred embodiment of the present invention, suitable for use in the production of the molded components described in the second alternative embodiment.

FIG. 12 is a perspective view of another panel of molded components according to a second alternative embodiment of the preferred embodiment of the invention, suitable for use in the production of the molded components described in the second alternative embodiment.

Fig. 13 is a perspective view of another panel of molded components according to a second alternative embodiment of the preferred embodiment of the invention, suitable for use in the production of the molded components described in the second alternative embodiment.

Fig. 14 is a top view of a molded component circuit board panel according to a second preferred embodiment of the present invention.

Fig. 15 is a perspective view of the molded component according to the second preferred embodiment of the present invention.

Fig. 16 is a top view of a circuit board panel of a molded component panel according to a second preferred embodiment of the present invention.

Fig. 17 is a perspective view of a panel of the molded component according to the second preferred embodiment of the invention, suitable for use in the production of the molded component according to the second preferred embodiment.

Figure 18 is a perspective view of a molding assembly according to a variant embodiment of the second preferred embodiment of the invention.

Fig. 19 is a perspective view of a panel of a molded component according to an alternate embodiment of the second preferred embodiment of the present invention, suitable for use in the production of the molded component described in the alternate embodiment.

Figure 20 is a perspective view of a molding assembly according to another variant embodiment of the above-described second preferred embodiment of the invention.

Fig. 21 is a perspective view of a panel of molded components according to another alternative embodiment of the second preferred embodiment of the present invention, suitable for use in the production of molded components according to the alternative embodiment.

Fig. 22 is a perspective view of another molded component panel according to another variation of the second preferred embodiment of the present invention, suitable for use in the production of the molded component described in the above-described another variation.

Fig. 23 is a perspective view of another molded component panel according to another alternative embodiment of the second preferred embodiment of the present invention, suitable for use in the production of the molded component described in the alternative embodiment.

Fig. 24 is a perspective view of an auto-zoom camera module according to an embodiment of the present invention.

Fig. 25 is a sectional view of the automatic zoom camera module according to the above-described embodiment of the present invention.

Fig. 26 is a sectional view of the automatic zoom camera module according to the above-described another embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

As shown in fig. 2 to 24, the present invention provides a mold assembly, a camera module and a mold assembly panel, which are designed to solve the drawbacks of the prior art by redesigning the area of the panel to reduce the defect rate of the auto focus module (AF) production.

A molding assembly 100 in accordance with a preferred embodiment of the present invention is shown in fig. 2 and 3. The molding assembly 100 includes a circuit board 110 and a molding part 120, wherein the molding part 120 is integrally molded with the circuit board 110 to define an optical window 130 for forming a photosensitive path.

Specifically, the circuit board 110 has a molding region 111, a mounting region 112 and at least two pad regions 113, wherein the molding region 111 surrounds the mounting region 112 in a closed manner, the pad regions 113 are disposed at corners of the circuit board 110 and located outside corners corresponding to the molding region 111, and at least two pad regions 113 are respectively used for electrically connecting positive and negative electrodes of an actuator.

The present invention is illustrated with the two pad regions 113 as an example, and is not limited thereto. Those skilled in the art will appreciate that more than two of the pad regions 113 may be used and designed as desired. For convenience of illustration and distinction, the two pad regions 113 are respectively referred to as a first pad region 113 'and a second pad region 113 ", wherein the characteristics of the first pad region 113' and the second pad region 113" may be mutually applicable, and the description of the present invention is omitted.

During molding, the molding region 111 is covered with a molding fluid, and the molding portion 120 is formed after curing. That is, the molding portion 120 covers the molding region 111, closely surrounding the mounting region 112. The mounting area 112 is not covered by the molding fluid, and provides space for mounting the photosensitive element 140 and/or the at least one electronic component 150. While the components mounted in the mounting region 112 may be different for different molding processes, as shown in fig. 23 and 24, for example, for the MOC process, the photosensitive element 140 is electrically connected and attached to the mounting region 112, and the edge region is located in the molding region 111, so that the cured molding part 120 is molded on the edge region of the photosensitive element 140; for the MOB process, for example, the photosensitive element 140 is electrically connected to be attached to the mounting region 112, and the electronic component 150 is mounted to the molding region 111, so that the cured molding part 120 encapsulates the electronic component 150.

The first pad area 113 'and the second pad area 113 ″ are mirror images, and are not covered by the molding fluid, so as to form a first welding space 160' and a second pad area 160 ″ for electrically connecting actuators such as motors, thereby assembling and manufacturing the auto zoom camera module. That is, during molding, the molding fluid flows out of the first land area 113', the second land area 113 ″ and the mounting area 112 to form the molding portion 120. The first and second bonding spaces 160 'and 160 ″ are formed at outer corners of the molding part 120 to correspond to the first and second pad regions 113' and 113 ″, respectively.

In a preferred embodiment of the present invention, the first pad area 113 'and the second pad area 113 "are implemented in a triangular shape, and correspondingly, the first soldering space 160' and the second pad area 160" extend upward from the circuit board 110, as shown in fig. 2 and 3.

The first pad region 113 'of the triangle shape has two first outer sides 1131', 1132 'and a first avoiding boundary side 1133', wherein the first outer sides 1131 ', 1132' and the first avoiding boundary side 1133 'are connected end to form the first pad region 113'. Since the first pad region 113 ' is disposed at a corner of the circuit board 110, the two first outer sides 1131 ', 1132 ' are implemented as adjacent sides of the top corner of the circuit board 110. The first avoiding boundary edge 1133 'coincides with the boundary of the molding region 111, that is, the first pad region 113' forms the first avoiding boundary edge 1133 'on the molding side (the side in contact with the molding region 111) to separate and delimit the first pad region 113' and the molding region 111.

Correspondingly, the triangular second pad region 113 "is formed by two second outer sides 1131", 1132 "and a second avoiding boundary edge 1133" in an end-to-end manner, wherein the two second outer sides 1131 ", 1132" are implemented as adjacent edges of the top corner of the circuit board 110, and wherein the second avoiding boundary edge 1133 "is also part of the boundary of the molding region 111 for separating and delimiting the second pad region 113" and the molding region 111. The second, non-overlapping dividing edge 1133 "is also located on the molding side of the second pad region 113" and is in contact with the molding region 111.

The first diverging boundary edge 1133' and the second diverging boundary edge 1133 "form an angle greater than 90 °. In the preferred embodiment, the first and second avoiding boundary edges 1133', 1133 ″ form an angle of 180 °, i.e., are implemented as a straight line, and are thus obliquely formed at corresponding corners of the circuit board 110.

During molding, the molding fluid needs to flow along the inclined evacuation boundary 1133 'to evacuate the first land area 113' within the area defined by the molding area 111. Compared with a square right-angle design, the inclined first avoiding boundary edge 1133' and the second avoiding boundary edge 1133 ″ have less obstruction to the molding fluid, so that the molding fluid can flow in sufficiently. Meanwhile, the increase amplitude of the flowing speed of the molding fluid is reduced, and the condition of uneven flow speed is lightened. Particularly, in the MOC or MOB process, the molding fluid needs to pass through the electronic component 150, the variation range of the flowing speed of the molding fluid is reduced, the impact on the encapsulated electronic components 150 such as capacitors and gold wires is reduced, and the situations such as poor contact of the electronic components 150 are avoided.

Compared with the square right-angle design, the flow channel correspondingly formed during molding is not a continuous right-angle size abrupt change, but forms a first buffer flow channel and a second buffer flow channel which are inclined corresponding to the first avoiding boundary edge 1133' and the second avoiding boundary edge 1133 ″ respectively. The molding fluid flows along the inclined first buffer runner and the second buffer runner, the size change of the runners can be adapted, the continuous right-angle turning is not needed, and the possibility of the molding fluid splashing, backflow or uneven flow speed is reduced.

Furthermore, the first and second avoidance boundary edges 1133', 1133 ″ are spaced a greater minimum distance from the inner edge 1111 of the molding region 111 than the prior art square design for an equivalent area. The specific explanation conforms to the basic common general knowledge of mathematics, and under the same area, the boundary sides of the square pad regions form right-angle projections, but in the preferred embodiment of the invention, the triangular first pad regions 113 'disperse the right-angle regions of the square pad regions, so that the distance between the vertex point 11111 of the first inner edge and the first avoiding boundary side 1133' is larger.

As shown in fig. 3, in the preferred embodiment of the present invention, the first pad region 113' and the second pad region 113 ″ having a triangular shape are formed on the mounting side of a connector 114, and are respectively disposed at both corners of the mounting side of the connector 114.

At this time, the first pad area 113 'and the second pad area 113 ″ are located on the same side, and a pad area side flow path is formed between the first pad area 113' and the second pad area 113 ″ during molding. The flow of the molding fluid into and out of the land area side flow path needs to avoid the first land area 113' and the second land area 113 ″ on both sides, respectively. Due to the existence of the first avoiding boundary 1133' and the second avoiding boundary 1133 ", the limitation of the molding fluid to enter and exit the flow channel on the pad area side is reduced compared with the prior art, and thus poor injection molding occurs on the molding part 120 formed on the surface of the flow channel on the pad area side.

That is, the design of the present invention accommodates the trend toward smaller camera modules without affecting the molding process and the formation of the molded part. The prior art achieves miniaturization by reducing the size of the runner, or the narrowest part of the molding portion, but this affects the flow of molding fluid into and out of the runner on the land area side, which affects the formation of the molding portion. The invention meets the miniaturization trend of the camera module by redesigning the pad area, and simultaneously does not influence the molding process and the formation of the molding part.

In actual production, in order to realize miniaturization of the camera module, the size of the pad region side runner or the molding part is 0.1mm at the narrowest, and the circulation of molding materials is influenced. The design of the invention can make the narrowest dimension of the molding part be 0.15mm, and even the narrowest dimension of the molding part is increased, the whole miniaturization is not influenced.

As shown in FIGS. 4 and 5, to implement the molded component 100 of the preferred embodiment of the present invention, the molded component 100 may be formed by cutting a panel 200 of the preferred embodiment of the molded component. The molded component panel 200 includes a circuit board panel 210 and a one-piece molded portion 220, wherein the one-piece molded portion 220 is integrally formed on the circuit board panel 210 through a molding process.

The circuit board jointed board 210 is provided with a plurality of molding regions 111, a plurality of mounting regions 112 and a plurality of main pad regions 211, wherein the molding regions 111 are arranged in the circuit board jointed board 210 in an array manner, adjacent molding regions 111 are bordered, the molding regions 111 correspondingly surround the mounting regions 112, and the triangular main pad regions 211 are arranged on two length sides of the circuit board jointed board 210 corresponding to the molding regions 111.

When molding, the molding area 111 is covered by molding fluid, and since the adjacent molding areas 111 are bordered, the molding fluid is solidified after covering all the molding areas 111, and the connected molding part 220 is formed. That is, the one-piece molding part 220 covers all of the molding region 111. The mounting area 112 is not covered by molding fluid and the formed one-piece molding 220 surrounds the mounting area 112. The light sensing chip 140 is mounted on the mounting region 112, and the one-piece molding part 220 defines a light window 130 corresponding to the light sensing chip 140 for forming a light sensing path.

The circuit board panel 210 includes a plurality of connectors 114, wherein the connectors 114 are correspondingly disposed on two opposite sides of the circuit board panel 210 to electrically connect corresponding regions. The invention is illustrated with the opposite mounting sides of the connector 114 being the length of the panel 210 and the opposite sides of the connector 114 being wider, but not limited to. The direction along the long extension direction of the circuit board panels 210 is the length direction, and the direction along the wide extension direction of the circuit board panels 210 is the width direction. Correspondingly, the elements are arrayed in a row along the length direction and arrayed in a column along the width direction. This is for convenience of description only and is not limiting.

In order to obtain the molding assembly 100 of the preferred embodiment, the main pad region 211 is formed at the lengthwise side of the circuit board panel 210, outside the corner of the mounting side (the side where the connector 114 is mounted) of the molding region 111, so that after cutting, the pad region 113 is formed at the corner of the mounting side of the molding region 111. In the preferred embodiment, the major pad areas 211 at the two widthwise ends of the molded component panel 200 are right triangles, and the other major pad areas 211 are isosceles triangles separated by a widthwise cut to form two right triangles of the pad areas 113.

After injection of molding fluid from one width end of the molded component panel 200, molding fluid flows along the lengthwise and widthwise channels defined by the molding region 111. When the molding fluid escapes along the escape boundary of the main pad region 211 (the side in contact with the molding region 111), the obstruction of the molding fluid is small because the escape boundary is inclined. Especially for the runner formed between two adjacent main bonding pad areas 211, the molding fluid can be fully filled, the condition of incomplete injection molding of the plate splicing process is reduced, and the overall yield is improved.

As shown in fig. 6 and 7, the mold 300 used for manufacturing the molded component panels 200 includes an upper mold 310 and a lower mold 320, wherein the upper mold 310 and the lower mold 320 are combined to define a molding space 330, and a fluid molding material is introduced into the molding space 330 to perform molding steps. The molding portion of the mold 300 is the same as a conventional mold except that the bottom surface of the mold 310 of the present invention is in contact with the main pad region 211 to prevent the main pad region 211 from being uncovered and molded, thereby forming the bonding space.

Specifically, the circuit board panel 210 is fixed to the lower mold 320, wherein the upper mold 310 and the lower mold 320 are closed, and the molding space 330 defined by the two corresponds to the molding region 111, so that the fluid molding material forms the integral molding portion 220 integrally molded on the circuit board panel 210 after being cured.

Preferably, a pressing edge is reserved on the periphery of the circuit board jointed board 210 for pressing the upper mold 310, so that the molding space 330 is closed, and leakage of molding material is avoided. After molding, the reserved press-fit edge can be cut off, reducing the overall volume. The stitching edges on the connecting side may not be cut due to the connection of the connectors, as shown in the figures such as fig. 3 and 8. That is, when the pad region of the molding assembly is located at the connection side, a bonding edge is not covered between the two pad regions.

The upper mold 310 further includes a plurality of first protrusions 311 corresponding to the mounting regions 112 and a plurality of second protrusions 312 corresponding to the main pad regions 211, wherein the first protrusions 311 and the second protrusions 312 are formed by being protruded from a bottom surface of the upper mold 310. The second protrusion 312 is formed and sized to correspond to the shape and size of the main pad area 211 so as to cover the main pad area 211, preventing the molding fluid from covering the main pad area 211. In the preferred embodiment, the cross-section of the second bump 312 is implemented as a triangle corresponding to the main pad region 211.

The first protrusion 311 covers the mounting region 112, prevents the molding material from contaminating the photosensitive element 140, and forms a plurality of light windows 130. For example, in the MOC process, the photosensitive element 140 and the electronic component 150 may be mounted and then molded, and the bottom surface of the first protruding portion 311 is abutted against the surface of the photosensitive element 140; in the MOB process, the photosensitive element 140 and the electronic component 150 may be molded, and the bottom surface of the first protruding portion 311 is abutted against the surface of the circuit board corresponding to the mounting region 112, which is only by way of example and is not limited herein.

Preferably, in order to facilitate the drawing, the sizes of the first protruding portion 311 and the second protruding portion 312 are gradually reduced from top to bottom, so as to reduce the drawing resistance. Correspondingly, the size of the optical window 130 is gradually reduced from top to bottom; the size of the bonding space corresponding to the main pad region 211 is gradually reduced from top to bottom.

After curing and drawing, the molded component panels 200 are cut along predetermined cut lines to form a plurality of the molded components 100 of the preferred embodiment described above. Specifically, the circuit board panels 210 are cut to form a plurality of circuit boards 110, the molding regions 111 are separated from each other, and the corresponding one-piece molding portions 220 are cut to form the molding portions 120. At this time, the main pad region 211 is partitioned to form the pad region 113 at a corner of the mounting side of the mold assembly 100.

As shown in fig. 8 to 9, which is a first modified example of the preferred embodiment, unlike the preferred embodiment, in the mold assembly 100A, the first pad area 113' a and the second pad area 113 "a of a triangular shape are disposed at opposite side corners of the mounting side, not the mounting side where the connector 114A is mounted.

Correspondingly, as shown in fig. 9, in order to form the molded component 100A after cutting, in the molded component panel 200A, the main welding regions 211A are disposed at the corners of the adjacent sides of the molded regions 111A in the same column, so that the first pad regions 113' a and the second pad regions 113 "a formed by separating the main welding regions 211A after cutting are disposed at the opposite sides of the mounting side of the molded component 100A.

Further, in the first variation of the preferred embodiment, the main welding regions 211A in the middle area are formed as squares, which are divided into four parts by cutting in the length and width directions, and are located at the corners of the corresponding molded component 100A, except that the main welding regions 211A at both width ends of the molded component panel 200A are formed as triangles and divided into two parts by cutting in the length direction.

Correspondingly, in the mold 300, except that the cross sections of the first protrusions 311 at the two width ends of the upper mold 310 are triangular, the cross sections of the first protrusions 311 at the middle region are square, and the size and the shape of the first protrusions correspond to those of the main welding region 211.

As shown in fig. 10 to 13, a second modified example of the preferred embodiment is different from the preferred embodiment in that, in the mold assembly 100B, the first pad region 113' B and the second pad region 113 "B of a triangular shape are disposed on the adjacent side of the mounting side, instead of the mounting side on which the connector 114B is mounted.

Correspondingly, as shown in fig. 11, in order to form the molded component 100B after cutting, in the molded component panel 200B, the main welding region 211B is disposed at a corner of a side adjacent to the mounting side of the molded region 111B in the same row, so that the first pad region 113' B and the second pad region 113 "B formed by separating the main welding region 211B after cutting are disposed at a side adjacent to the mounting side of the molded component 100B. At this time, the pad regions obtained by cutting the molding region 111B in the same row are arranged at the same position, for example, all of the pad regions are located on the adjacent left side of the mounting side of the molding region 111B, or all of the pad regions are located on the adjacent right side of the mounting side of the molding region 111B.

Additionally, the molded component panel 200B can be designed in a variety of ways. As shown in fig. 13, two adjacent rows of the molding regions 111B are taken as a group, and the main welding regions 211B are disposed at the corners of the adjacent sides of the molding regions 111B of two adjacent rows in the same group, wherein the main welding regions 211B at the length ends of the molding assembly panels 200B are implemented as triangles, and are separated into two parts after being cut in the width direction; and the main welding region 211B in the middle region is implemented as a square, and is divided into four parts after being cut in the length direction and the width direction. At this time, the main welding areas 211B of the same cut set of the molded component 100B are located on opposite adjacent sides of the mounting side, i.e., two on the left side of the mounting side and two on the right side of the mounting side.

Correspondingly, in the mold 300, the cross section of the first protruding portion 311 corresponding to the main welding region 211B except for the first protruding portions 311 located at the two ends of the length of the upper mold 310 is triangular, and the cross section of the first protruding portion 311 located in the middle region is square, corresponding to the size and shape of the main welding region 211.

Or as shown in fig. 12, the main welding regions 211B are disposed at the corners of the same row of the molding regions 111B of each row, for example, at the corners of the left row of the molding regions 111B of each row, or at the corners of the right row of the molding regions 111B of each row, wherein the cross section of the main welding regions 211B at the length ends of the molded component panels 200B is implemented as a triangle, and is divided into two parts after being cut in the width direction; and the main welding region 211B located in the middle region is implemented as an isosceles triangle in cross section, and is divided into two parts after being cut in the length direction and the width direction. In this case, the main welding regions 211B of the molded component 100B obtained by cutting the molding regions 111B in the same row are located on the same adjacent side of the mounting side, and the main welding regions 211B of the molded component 100B obtained by cutting the molding regions 111B in two adjacent rows are located on the opposite adjacent side of the mounting side.

Correspondingly, in the mold 300, the cross sections of the first protrusions 311 located at the two ends of the length of the upper mold 310 are triangular, and the cross sections of the first protrusions 311 located at the middle region are isosceles triangles, which correspond to the size and shape of the main welding region 211.

As shown in fig. 14 to 17, a molding assembly 100C according to a second preferred embodiment of the present invention includes a circuit board 110C, a molding portion 120C, a photosensitive element 140C, and at least one electronic component 150C. The circuit board 110C includes a connector 114C and has a molding region 111C, a first pad region 113' C, a second pad region 113 "C, and a mounting region 112C. The first pad region 113 'C is formed by two first outer boundaries 1131' C, 1132 'C and a first avoiding boundary 1133' C connected end to end. The second pad region 113 "C is formed by two first outer boundaries 1131" C, 1132 "C and a second avoiding boundary edge 1133" C connected end to end.

Unlike the above-described preferred embodiment, the first pad region 113 'C is implemented in a trapezoidal shape, wherein the first pad region 113' C forms an angle greater than 90 ° and less than 180 ° with respect to the molding side (the side in contact with the molding region 111C). That is, the first avoiding boundary edge 1133 'C forms an obtuse angle, and compared with the right-angle design in the prior art, the obtuse-angle oblique edge of the first avoiding boundary edge 1133' C can guide the molding fluid, so that the obstruction to the fluid movement is small, the poor injection molding caused by the continuous right-angle turning of the molding fluid is avoided, and the reject ratio is reduced.

Correspondingly, the second pad area 113 "C is also implemented as a trapezoid, which is mirror symmetrical to the first pad area 113' C. Likewise, the second relief boundary edge 1133 "C forms an obtuse angle, i.e., the angle formed by the molding side (the side in contact with the molding region 111C) is greater than 90 ° and less than 180 °.

In the second preferred embodiment, the first pad area 113' C and the second pad area 113 "C of the trapezoidal shape are provided on the mounting side of the mold assembly 100C. In molding, the molding flow path between the first land area 113 'C and the second land area 113 "C is guided in and out by the obtuse angled hypotenuse of the first and second avoiding boundary edges 1133' C and 1133" C, and the molding flow is less restricted and hindered than in a right angle design and can be guided to complete the injection molding.

As shown in fig. 16 and 17, molded component panel 200C is used to produce molded component 100C. Molded component panel 200C includes a circuit board panel 210C and an integral molded portion 220C. The wiring board panel 210C has a plurality of molding regions 111C, a plurality of main pad regions 211C, a plurality of mounting regions 112C, and a plurality of connectors 114C.

In contrast to the above-described preferred embodiment, in order to form the molded component 100C after cutting, the main pad region 211C is implemented in a trapezoidal shape, wherein the angle of the main pad region 211C to the molding side is obtuse. In a second preferred embodiment, the trapezoidal main pad area 211C is disposed at the corner of the mounting side of the molding area 111C, wherein the main pad areas 211C located at the two width ends of the molded component panel 200C are right trapezoid by using the edge of the circuit board, and the other main pad areas 211C located in the middle are isosceles trapezoids, and after cutting along the width direction, the two right trapezoid areas are separated and formed and located at the corresponding corner of the mounting side of the molding area 111C.

Accordingly, unlike the preferred embodiment described above, the location, shape and size of the second protrusion 312 is adapted to the main pad area 211C of the molded component 200C in order to engage and form the molded component panel 200C. That is, in the second preferred embodiment, the cross section of the second convex portion 312 is implemented as a trapezoid. Specifically, the cross-section of second protrusion 312 is implemented as a right trapezoid corresponding to main pad region 211C at both width ends of molded component tile 200C; the cross section of the second convex portion 312 is implemented as an isosceles trapezoid corresponding to the other main pad region 211C located in the middle.

As shown in fig. 18 to 19, a modified example of the second preferred embodiment is different from the second preferred embodiment in that the first pad region 113' D and the second pad region 113 ″ D having a trapezoidal shape are disposed on the opposite side of the mounting side of the molding member 100D rather than the mounting side on which the connector 114D is mounted.

Correspondingly, as shown in fig. 19, in order to form the molded component 100D after cutting, in the molded component panel 200D, the main welding regions 211D are disposed at the corners of the adjacent sides of the molded regions 111D in the same column, so that the first pad regions 113' D and the second pad regions 113 "D formed by separating the main welding regions 211D after cutting are disposed at the opposite sides of the mounting side of the molded component 100D.

Further, in this modified embodiment of the second preferred embodiment, except that the main welding regions 211D at both width ends of the molded component panels 200D are formed in a shape of two right trapezoids which are spliced together in a mirror image manner with the length direction as an axis and are separated into two right trapezoids after being cut in the length direction, the main welding regions 211D at the middle region are formed in a shape of a hexagon and are separated into four right trapezoids after being cut in the length direction and the width direction and are located at the corners of the corresponding molded component 100D.

Correspondingly, in the mold 300, except that the cross sections of the first protrusions 311 located at the two width ends of the upper mold 310 are in a shape of two right-angled trapezoids spliced together with the length direction as an axis in a mirror image manner, the cross section of the first protrusion 311 located in the middle region is in a hexagonal shape, which corresponds to the size and shape of the main welding region 211D.

As shown in fig. 20 to 23, which is another modified example of the second preferred embodiment, unlike the second preferred embodiment, in the mold assembly 100E, the first pad region 113' E and the second pad region 113 ″ E having a trapezoidal shape are disposed on the adjacent side of the mounting side, not the mounting side on which the connector 114E is mounted.

Correspondingly, as shown in fig. 21, in order to form the molded component 100E after cutting, in the molded component panel 200E, the main welding region 211E is disposed at a corner of an adjacent side of the mounting side of the molded region 111E in the same row, so that the first pad region 113' E and the second pad region 113 "E formed by separating the main welding region 211E after cutting are disposed at an adjacent side of the mounting side of the molded component 100E. At this time, the pad regions obtained by cutting the molding region 111B in the same row are arranged at the same position, for example, all of the pad regions are located on the adjacent left side of the mounting side of the molding region 111B, or all of the pad regions are located on the adjacent right side of the mounting side of the molding region 111B.

Additionally, the molded component panel 200E can be designed in a variety of ways. As shown in fig. 23, two adjacent rows of the molding regions 111E are used as a group, and the main welding regions 211E are disposed at the corners of the adjacent sides of the molding regions 111E of two adjacent rows in the same group, wherein the main welding regions 211E at the length end of the molded assembly panel 200E are implemented as two right trapezoids spliced together in a mirror image manner with the width direction as an axis, and are separated into two parts after being cut in the width direction; and the main welding region 211E located in the middle region is implemented as a hexagon, and is divided into four trapezoids after being cut in the length direction and the width direction. At this time, the main welding areas 211E of the four cut molding members 100E of the same group are located on different adjacent sides of the mounting side, i.e., two on the left side of the mounting side and two on the right side of the mounting side.

Correspondingly, in the mold 300, except that the cross sections of the first protrusions 311 located at the two longitudinal ends of the upper mold 310 are in a shape of two right-angled trapezoids spliced together in a mirror image manner with the width direction as an axis, the cross section of the first protrusion 311 located in the middle region is in a hexagonal shape, which corresponds to the size and shape of the main welding region 211E.

Or as shown in fig. 22, the main welding regions 211E are disposed at the corners of the same row of the molding regions 111E of each row, for example, at the corners of the left row of the molding regions 111E of each row, or at the corners of the right row of the molding regions 111E of each row, wherein the cross section of the main welding region 211E at the length end of the molded component panel 200E is trapezoidal, and is divided into two parts after being cut in the width direction; the cross section of the main welding region 211E in the middle region is implemented as two right-angled trapezoids spliced in a mirror image manner with the width direction as an axis, and the main welding region is divided into two parts after being cut in the length direction and the width direction. The main welding areas 211E of the molded component 100E obtained by cutting the molding areas 111E of the same row are located on the same adjacent side of the installation side, and the adjacent rows are located on the opposite adjacent side of the installation side.

Correspondingly, in the mold 300, the cross sections of the first protruding portions 311 located at the two longitudinal ends of the upper mold 310 are trapezoidal, and the cross sections of the first protruding portions 311 located at the other middle region are in a shape of two right-angled trapezoids spliced in a mirror image manner with the width direction as an axis, which corresponds to the size and shape of the main welding region 211E.

That is, the formation and position of the pad region are not limited to each other, and may be combined with each other to form different embodiments, which are not described herein again. The first and second pad regions may also be located at opposite corners of the wiring board to accommodate corresponding actuators. In addition, the first pad area and the second pad area can be in other polygons, such as a hexagon, an octagon and the like, only the angle formed by the avoidance boundary is larger than 90 degrees, compared with the existing 90-degree design, the blockage to the molding fluid is less, and the inclined edge can guide the molding fluid and form a buffer flow channel, so that the molding fluid can be fully filled.

As shown in fig. 24 to 26, a camera module 400 of the present invention is applicable to the molding assembly of the above embodiment. The camera module 400 includes the molding member 100, an actuator 410, and a lens assembly 420, wherein the actuator 410 supports the lens assembly 420 on the molding member 100 in a drivable manner, so that the lens assembly 420 corresponds to the optical window 130 of the molding member 100. The actuator 410 is operatively connected to the first and second pad regions 113', 113 "of the wiring board 110. The first pad region 113' and the second pad region 113 ″ may adopt the features of formation, shape, and position mentioned in the above embodiments, and are not limited thereto. Further, the camera module 400 may further include a color filter supported on the top side of the molding member 100 corresponding to the light window 130 by a bracket or directly.

In the present invention, due to the redesign of the first pad region 113' and the second pad region 113 ", the defect rate of the molding assembly 100 is reduced, and the yield of the camera module 400 is improved.

According to another aspect of the present invention, there is further provided a method of making a panel of molded components, comprising:

step 501, fixing a circuit board jointed board to a lower die, wherein the circuit board jointed board is provided with a plurality of molding areas, a plurality of mounting areas and a plurality of main pad areas, the molding areas are arranged on the circuit board jointed board in an array mode, the adjacent molding areas are connected with each other, the main pad areas are cut and separated to form pad areas located at corners of the molding areas, the pad areas formed after cutting are provided with an avoiding boundary edge, and an angle formed by the avoiding boundary is larger than 90 degrees.

Step 502: and closing an upper die on the lower die, wherein the upper die is pressed on the main bonding pad area and the mounting area, and a forming space is formed between the upper die and the molding area of the circuit board makeup, wherein the forming space is provided with a buffer flow channel formed along the avoiding boundary edge.

Step 503: and injecting a molding material into the molding space.

Step 504: and curing the molding material to form an integral molding part covering the molding area.

Step 505: and mounting a photosensitive chip and/or at least one electronic component in the mounting area, wherein the conjoined molding part surrounds the photosensitive chip and/or the at least one electronic component.

Step 506: removing the upper mold and the lower mold to form the molded component panel.

The step 505 may be performed after the step 504, or before the step 501, where the edge area of the photo sensor chip is located in the molding area, so that the connected molding part of the step 504 is encapsulated in the edge area of the photo sensor chip. That is, according to different process requirements, the order and the position of the photosensitive chip and/or at least one electronic component mounted in step 505 are correspondingly different. It will be appreciated that the placement and features of the main pad area in the panel of molded components are adapted to the main pad area formation and features described above and are cut to form the corresponding molded components described above.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A molded component, comprising:

2. The molding assembly of claim 1, wherein the relief boundary of the land area forms an angle of 180 °.

3. The molded assembly of claim 1, wherein the angle formed by the relief boundary of the land area is an obtuse angle.

4. The molding assembly of claim 1, wherein the narrowest dimensional extent of the mold section is at least 0.15 mm.

5. The molded assembly of any of claims 1 to 4, wherein adjacent ones of said pad regions are symmetrically disposed.

6. The molded assembly of claim 5, wherein at least two of said land areas are disposed on a mounting side of said circuit board, wherein said mounting side is configured to mount a connector.

7. The molded assembly of claim 5, wherein at least two of said land areas are disposed opposite a mounting side of said wiring board, wherein said mounting side is configured to mount a connector.

8. The molded assembly of claim 5, wherein at least two of said land areas are disposed adjacent a mounting side of said circuit board, wherein said mounting side is configured for mounting a connector.

9. The molding assembly of any one of claims 1 to 4, further comprising a photosensitive element, wherein said photosensitive element is mounted to said mounting region and is closely surrounded by said molding portion, wherein said light window corresponds to said photosensitive element forming a photosensitive path.

10. The molding assembly of claim 9, wherein the molding is encapsulated at an edge portion of the photosensitive element.

11. The molding assembly of claim 5, further comprising a photosensitive element, wherein said photosensitive element is mounted to said mounting region and is closely surrounded by said molding portion, and wherein said light window corresponds to said photosensitive element forming a photosensitive path.

12. The molding assembly of claim 11, wherein the molding is encapsulated at an edge portion of the photosensitive element.

13. The mold assembly of any of claims 1 to 4, further comprising at least one electronic component, wherein the electronic component is operably mounted to the mold section, wherein the mold section encapsulates the electronic component.

14. The molding assembly of claim 5, further comprising at least one electronic component, wherein the electronic component is operably mounted to the molding region, wherein the molding portion encapsulates the electronic component.

15. A camera module, comprising:

a molded component according to any one of claims 1 to 14;

a lens assembly; and

16. A molded component panel for use in cutting a plurality of molded components having a land area, comprising:

17. The molded component panel of claim 16, wherein the primary land areas are spaced apart on the length side of the circuit board panel such that the land areas formed after cutting are located at the corners of the resulting molded component mounting side.

18. The molded component panel of claim 16, wherein the primary welding areas are disposed at corners of adjoining sides of adjacent molded areas in a same column, such that the land areas formed after cutting are located at opposite corners of the resulting molded component mounting side.

19. The molded component panel of claim 16, wherein the primary solder areas are disposed at corners of adjacent sides of the molded areas of two adjacent columns in the same group, such that the land areas formed after dicing are located at adjacent side corners of the resulting molded component mounting side.

20. The molded component panel of claim 16, wherein the primary welding areas are disposed at the same row of side corners of the molded areas of each row, such that the land areas formed after cutting are located at adjacent side corners of the mounting side of the resulting molded component.

21. The molded component panel of claim 16, wherein the primary welding areas are disposed at adjacent side corners of the mounting side of the molded areas in a row, such that the land areas defined by the primary welding areas separated after cutting are located adjacent to the mounting side of the molded component.

22. The molded component panel of any one of claims 16 to 21, wherein the relief boundary that forms the land area when cut forms an angle of 180 °.

23. The molded component panel of any one of claims 16 to 21, wherein the angles formed by the relief boundaries that form the land areas after cutting are obtuse angles.

24. The molded component panel according to any one of claims 16 to 21, further comprising a plurality of light sensing elements, wherein the light sensing elements are mounted to the corresponding mounting regions and are closely surrounded by the integral molding portion, wherein the light windows correspond to the light sensing elements for forming a light sensing path.

25. The molded component panel of claim 24, wherein the integral mold is encapsulated in an edge portion of the light-sensing element.

26. The molded component panel according to any one of claims 16 to 21, further comprising a plurality of electronic components, wherein the electronic components are operatively disposed in corresponding ones of the molded regions and encapsulated by the overmold.

27. A method of forming a panel of molded components, comprising:

(a) fixing a circuit board jointed board to a lower die, wherein the circuit board jointed board is provided with a plurality of molding areas, a plurality of mounting areas and a plurality of main pad areas, the molding areas are arranged on the circuit board jointed board in an array mode, the adjacent molding areas are bordered, the main pad areas are cut and separated to form pad areas located at corners of the molding areas, the pad areas formed after cutting are provided with an avoiding boundary edge, and the angle formed by the avoiding boundary is larger than 90 degrees;

(b) closing an upper die to the lower die, wherein the upper die is pressed on the main pad area and the mounting area, and a forming space is formed between the upper die and the molding area of the circuit board makeup, wherein the forming space is provided with a buffer flow channel formed along the avoiding boundary edge;

(c) injecting a molding material into the molding space;

(d) solidifying the molding material to form a connected molding part covering the molding area;

(e) removing the upper mold and the lower mold to form the molded component panel.

28. The method of making a molded component panel as defined in claim 27 wherein step (a) further comprises the steps of:

and (d) mounting a photosensitive chip and/or at least one electronic component in the mounting area, wherein the edge area of the photosensitive chip is positioned in the molding area, so that the conjoined molding part in the step (d) is encapsulated in the edge area of the photosensitive chip.

29. The method of making a molded component panel as defined in claim 27, further comprising the step of, after step (d):

(f) and mounting a photosensitive chip and/or at least one electronic component in the mounting area, wherein the conjoined molding part surrounds the photosensitive chip and/or the at least one electronic component.

30. A method of molding an assembly comprising:

(2) closing an upper mold to the lower mold, wherein the upper mold is pressed on the pad area and the mounting area, and a molding space is formed between the upper mold and the molding area of the circuit board, wherein the molding space is provided with a buffer flow channel formed along the avoiding boundary;

(3) injecting a molding material into the molding space;

(5) removing the upper mold and the lower mold to form the molded component.