JP2014030155A - Housing and solid-state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing that is capable of constituting a solid-state imaging device making it difficult for dust or the like to enter an internal space, and is easy to mold.SOLUTION: A holder 2 comprises an air vent hole 3 that communicates between an internal space and an external space of a solid-state imaging device 1. The air vent hole 3 has a parallel running part 3a along a wall surface of the holder 2.

Description

  The present invention relates to a solid-state imaging device used for a camera or the like.

  In a solid-state imaging device (camera module) applied to a mobile phone camera, a solid-state imaging device, a lens, a lens holder, and a lens barrel are usually integrated in a package.

  Conventionally, a solid-state imaging device incorporated in a mobile device or a mobile phone has been mainly a single focus type. However, the trend toward high pixels, high image quality, and high functionality has progressed, and even in solid-state imaging devices built into mobile phones, zooming and auto-focusing, etc. with the same number of pixels and optical mechanisms as dedicated imaging devices such as digital still cameras, etc. Equipped and increasingly sophisticated.

  In the optical mechanism unit, the function is exhibited only when the design center of the pixel plane in which a plurality of pixels of the solid-state image sensor are arranged coincides with the center (optical axis) of the optical component. If these do not match, there is a problem that the four corners of the image are blurred or dark due to the design of the solid-state imaging device.

  As described above, the prerequisite for high pixel and high functionality of the solid-state imaging device is that the optical center of the image sensor (pixel center) and the optical center of the lens and other elements are in a straight line (light It is essential that the optical axis and the light receiving plane of the solid-state imaging device are orthogonal to each other.

  At the initial stage when a solid-state imaging device was incorporated in a mobile device or a mobile phone, the solid-state imaging device had a very simple configuration from the viewpoint of miniaturization and weight reduction. However, in recent years, the solid-state imaging device uses a precise and high-precision mechanism, and the position at the time of assembling the solid-state imaging device due to factors such as high definition of the light receiving part of the solid-state imaging device (mainly associated with the IC manufacturing process). The accuracy required for the combination is high. On the other hand, due to demands for further downsizing, lightening, and power saving of devices, solid-state imaging devices incorporating mobile devices and mobile phones have complex correction mechanisms that are used in general cameras, etc. It cannot be used.

  In the alignment of optical components during assembly of a conventional solid-state imaging device, the (light-receiving portion) plane of the solid-state imaging device and the mounted wiring board are considered to be the same (or parallel). It was used as a reference for other optical assembly mounting positions of the lens holder.

  The above method has an advantage that a component mounting (soldering) apparatus on a substrate can be diverted, capital investment can be minimized, and know-how regarding component mounting on a substrate can be diverted.

  However, due to the recent increase in accuracy of solid-state imaging devices, variations in the production of wiring boards, variations in the dimensions of other components, and variations in assembly and mounting accuracy have become apparent.

  11 (a) and 11 (b) and FIGS. 12 (a) and 12 (b) show a method for assembling a conventional solid-state imaging device. In the solid-state imaging device 101 shown in FIG. 11, as shown in FIG. 11A, a holder 102 having a mechanism such as an optical unit including a lens 105, a filter 104, and AF (not shown), and a solid-state imaging device 108. And a wiring board 107 provided with wires 109.

  Next, as shown in FIG. 11B, an adhesive 106 is applied in advance to the wiring board 107, and the pixel center R of the solid-state image sensor 108 and the optical center Q of the lens 105 are matched with each other. The wiring board 107 and the holder 102 are bonded with an adhesive 106. When a thermosetting adhesive or a photocurable resin is used for the adhesive 106, the adhesive 106 is cured by heating or UV (ultraviolet light) irradiation.

  In the solid-state imaging device 111 shown in FIG. 12, as shown in FIG. 12A, a holder 102 having a lens 105, a filter 104 a and an adhesive portion 104 b, mechanisms such as AF (not shown), a solid-state imaging device 108. And a wiring substrate 107 including a wire 109 and a pixel element package 110.

  Next, as shown in FIG. 12B, an adhesive 106 is applied in advance to the pixel element package 110, so that the pixel center R of the solid-state image sensor 108 and the optical center Q of the lens 105 coincide. The wiring board 107 and the holder 102 are bonded by the adhesive 106. Since the subsequent operation is the same as the assembly operation of FIG. 11 described above, description thereof is omitted here.

  On the other hand, in order to prevent light and dust from entering from the outside, the inside of the solid-state imaging devices 101 and 111 (the portion where the solid-state imaging element 108 is located) has a highly airtight structure. Therefore, as shown in FIGS. 13A and 13B, when the solid-state imaging devices 101 and 111 are assembled, a solid due to volatile gas (outgas) generated from the adhesive 106 or air expansion during thermosetting. Due to the increase in pressure inside the image sensor 108, there is a problem that the resin is cracked and the resin is cracked during the curing of the bonded portion. Therefore, problems such as cloudiness and condensation occur due to a decrease in strength of the solid-state imaging device 108 due to the adhesion region damaged portion 120 and moisture intrusion into the solid-state imaging devices 101 and 111 via the adhesion region damaged portion 120.

  In addition, the optical center Q of the lens and the pixel center R of the solid-state image sensor 108 do not coincide with each other, causing a specific portion of the image at the time of imaging to be extremely out of focus. In recent years, the mounting density of components has been increased even in portable devices. Therefore, when the external dimensions of the solid-state imaging devices 101 and 111 are changed, the solid-state imaging device is incorporated into a final product (such as a mobile phone or a portable game machine). There is a possibility that 101 and 111 cannot be mounted at a desired location.

  Patent Document 1 discloses an invention relating to prevention of a pressure increase inside a solid-state imaging device, which is the above problem. Specifically, in Patent Document 1, as shown in FIG. 14, an imaging element 202 mounted on a substrate 201, a cylindrical case 203 mounted on the substrate 201 so as to cover the imaging element 202, A solid-state imaging device including an infrared ray removal filter 204 housed in the cylindrical case 203 and having one surface facing the imaging element 202, and a lens 205 housed in the tubular case 203 and facing the other surface of the infrared removal filter 204. An apparatus 200 is disclosed. Further, in the solid-state imaging device 200, the internal space S1 existing between the image sensor 202 and the infrared ray removing filter 204 is communicated with the external space through the vent 203a, and the bottom surface 233a is formed in the pedestal portion 231 of the cylindrical case 203. An inner cylindrical wall portion 233 that has a large number of fine grooves and is surrounded by the outer wall portion 232 protrudes, and the bottom surface 233 a is brought into contact with the peripheral edge portion of the image sensor 202.

JP 2009-60380 A (published on March 19, 2009)

  However, in the conventional technique such as Patent Document 1, since the vent hole 203a is a straight through hole, dust or the like easily enters the inside through the vent hole 203a. Therefore, the groove formed in the bottom surface 233a needs to be a fine groove having a depth of about 1 to 2 microns.

  Since the groove is fine, it is impossible to mold with a mold, and it is considered that a fine groove is formed by cutting or the like. In a normal forming method, a filler (glass fiber or the like) is filled in a resin, and therefore dust generation is caused by the filler at the cut site. In addition, the invention describes the formation of grooves by hairline processing. Usually, hairline processing is a technique in which metal is deposited on the surface of a resin with fine grooves formed by cutting or the like. Processing to create a metal-like texture, such as the surface of a travel carry case). Using a metal-deposited portion in contact with the image sensor may cause an unexpected effect on the image sensor and possibly cause a short circuit.

  In view of the above, an object of the present invention is to provide a housing that can form a solid-state imaging device in which dust or the like hardly enters an internal space and can be easily molded.

  In order to solve the above problems, a housing according to the present invention is a cylindrical housing mounted on a substrate on which a solid-state imaging device of a solid-state imaging device is mounted so as to cover the solid-state imaging device. An air vent hole is provided that communicates an internal space surrounded by the housing and the substrate and an external space of the housing, and the air vent hole has a parallel running portion along a wall surface of the housing. Yes.

  According to said structure, since the air vent hole has the parallel running part along the wall surface of a housing | casing, a path | route becomes long compared with the through-hole which penetrates internal space and external space linearly. For this reason, even if the cross-sectional area of the air vent hole is relatively large, dust or the like hardly enters the internal space. In other words, fine processing is not required to form the air vent hole. Therefore, a solid-state imaging device in which dust or the like hardly enters the internal space can be configured, and a housing that can be easily molded can be provided.

  In the housing according to the present invention, it is preferable that a protrusion is formed on the inner wall of the air vent hole.

  According to said structure, a protrusion part plays the role which prevents the dust etc. which penetrate | invaded the air vent hole from moving to the internal space side. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  In the housing according to the present invention, the protrusions include a plurality of first protrusions formed on one of the inner walls facing each other and a plurality of second protrusions formed on the other of the inner walls facing each other. It is preferable that the said 1st protrusion part and the said 2nd protrusion part are alternately formed along the extending | stretching direction of the said air vent hole.

  According to the above configuration, since the air vent holes are formed in a zigzag shape, it is difficult for dust or the like that has entered the air vent holes to move to the internal space side.

  In the housing according to the present invention, the shape of the protruding portion is such that the resistance to air flowing in the air vent hole toward the external space is smaller than the resistance to air flowing in the air vent hole toward the internal space. The shape is preferred.

  According to said structure, the dust etc. which exist in the inside of an air vent hole move toward an external space rather than an internal space. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  In the housing according to the present invention, the projecting portion may have a tapered cross section perpendicular to both the projecting direction of the projecting portion and the extending direction of the air vent hole.

  In the housing according to the present invention, it is preferable that the tip of the cross section is located on the outer space side with respect to the path of the air vent hole than the center position of the projecting portion forming range in the extending direction of the air vent hole.

  According to said structure, the resistance which the air discharged | emitted from internal space receives by a protrusion part becomes smaller than the resistance which the air which invades from external space receives by a protrusion part. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  In the housing according to the present invention, the protrusion may have a triangular cross section.

  In the housing according to the present invention, in the triangle, an angle between the first side located on the inner space side with respect to the path of the air vent hole and the inner wall is located on the outer space side with respect to the path of the air vent hole. It is preferable that the angle is larger than the angle between the second side and the inner wall.

  According to said structure, the resistance which the air discharged | emitted from internal space receives by a protrusion part becomes smaller than the resistance which the air which invades from external space receives by a protrusion part. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  In the housing according to the present invention, it is preferable that a cross section perpendicular to the extending direction of the air vent hole is rectangular.

  According to said structure, an air vent hole can be easily formed by laser cutting.

  In the housing according to the present invention, it is preferable that a cross section perpendicular to the extending direction of the air vent hole is a triangle.

  According to said structure, an air vent hole can be easily formed by shaping | molding with a metal mold | die.

  In the housing according to the present invention, it is preferable that a groove is formed on a bottom surface bonded to a substrate on which the solid-state imaging element of the solid-state imaging device is mounted, and the groove constitutes the air vent hole.

  According to said structure, a housing | casing can be integrally molded with a metal mold | die.

  In the housing according to the present invention, it is preferable that a protrusion is formed at the bottom of the groove.

  According to the above configuration, dust or the like protrudes when there is an uncured portion of the adhesive for bonding the housing and the substrate on which the solid-state imaging device of the solid-state imaging device is mounted inside the air vent hole. Makes it easier to approach the uncured part. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  In the housing according to the present invention, it is preferable that the groove has a depth change rate with respect to a distance in the extending direction of a predetermined value or less.

  According to said structure, the ceiling area | region of an air vent hole inclines with respect to an extending | stretching direction. Therefore, dust or the like that has entered the air vent hole is likely to approach the uncured portion in the region where the ceiling height of the air vent hole is low. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device. Further, when the predetermined value is reduced, the inclination of the ceiling area of the air vent hole becomes gentle, and the flow of gas discharged from the internal space of the solid-state imaging device becomes smooth.

  In the housing according to the present invention, the air vent hole may be formed in a portion other than the bottom surface bonded to the substrate on which the solid-state imaging element of the solid-state imaging device is mounted.

  In the housing according to the present invention, it is preferable that the length of the air vent hole is ¼ or more of the peripheral length of the housing.

  In the case according to the present invention, it is more preferable that the length of the air vent hole is not less than ½ of the peripheral length of the case.

  In the housing according to the present invention, the length of the air vent hole is more preferably 3/4 or more of the peripheral length of the housing.

  According to said structure, since an air vent hole can be formed very long, it can prevent more reliably that dust etc. penetrate | invade into the internal space of a solid-state imaging device.

  A solid-state imaging device according to the present invention includes a casing according to the present invention and a substrate on which the solid-state imaging element is mounted, and the casing is bonded to the substrate so as to cover the solid-state imaging element. It is a feature.

  According to said structure, since the air vent hole with a long path | route is formed in the housing | casing, it has a structure where dust etc. do not penetrate | invade easily into the internal space in which the solid-state image sensor is mounted. Therefore, the manufacturing yield of the solid-state image sensor can be improved.

  In the solid-state imaging device according to the present invention, the casing has a groove formed on a bottom surface bonded to a substrate on which the solid-state imaging element of the solid-state imaging device is mounted, and the groove constitutes the air vent hole. Preferably, the bottom surface of the housing is bonded to the substrate with an adhesive, and a part of the adhesive is uncured inside the air vent hole.

  According to said structure, since the non-hardened part is equipped with adhesiveness, the dust etc. which penetrate | invade into an air vent from the outside can be made to adhere to a non-hardened part. Accordingly, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  As described above, the casing according to the present invention is a cylindrical casing that is mounted on a substrate on which a solid-state imaging element of a solid-state imaging device is mounted so as to cover the solid-state imaging element. There is an air vent hole that communicates the internal space surrounded by the substrate and the external space of the housing, and the air vent hole has a parallel running portion along the wall surface of the housing, so that dust or the like is present in the internal space. It is possible to configure a solid-state imaging device that is difficult to enter, and to provide an effect that a housing that can be easily molded can be provided.

It is sectional drawing of the solid-state imaging device which concerns on embodiment of this invention. (A) is the figure which looked at the holder of the said solid-state imaging device from the bottom face direction, (b) is the figure which looked at the said holder from the side surface direction. The wiring board before mounting | wearing with the said holder is shown, (a) is a top view of the said wiring board, (b) is sectional drawing of the said wiring board. The solid-state imaging device in the state which mounted and bonded the said holder to the said wiring board is shown, (a) is a perspective view from the bottom face of the said solid-state imaging device, (b) is sectional drawing of the said solid-state imaging device It is. (A)-(c) is a figure which shows the modification of an air vent hole. (A)-(b) is a figure which shows the other modification of an air vent hole all. (A)-(c) is a figure which shows the solid-state imaging device which concerns on the other modification of this invention. (A)-(b) is a figure which shows the holder which concerns on the other modification of this invention. It is a figure which shows the comparative example of a holder. (A)-(b) is a figure which shows the holder which concerns on the further another modification of this invention. It is a figure for demonstrating the assembly method of the conventional solid-state imaging device. It is a figure for demonstrating the assembly method of the other conventional solid-state imaging device. It is a figure for demonstrating the problem in the assembly of the solid-state imaging device shown to FIG. 11 and FIG. It is sectional drawing which shows other conventional solid-state imaging devices.

  An embodiment of the present invention will be described below with reference to FIGS.

(Structure of solid-state imaging device)
FIG. 1 is a cross-sectional view of a solid-state imaging device 1 according to the present embodiment. The solid-state imaging device 1 includes a holder 2, a filter 4, a lens 5, a wiring board 7, and an imaging element 8. The holder 2 has a cylindrical shape having a hollow portion, and a filter 4 and a lens 5 made of a glass substrate are held in the hollow portion. An image sensor 8 is mounted on the wiring board 7, and the image sensor 8 is connected to a wiring (not shown) by a wire 9.

  The holder 2 is mounted on the wiring board 7 so as to cover the image sensor 8. More specifically, the bottom surface of the holder 2 is bonded to the wiring board 7 with the adhesive 6. In the following description, a space surrounded by the holder 2 and the wiring board 7 is referred to as an internal space.

(Holder structure)
2A is a view of the holder 2 as viewed from the bottom surface, and FIG. 2B is a view of the holder 2 as viewed from the side. As shown in FIG. 2A, the bottom surface of the holder 2 is a square frame, and a groove is formed on one side of the bottom surface. This groove constitutes the air vent hole 3 in a state where the holder 2 is mounted on the wiring board 7. One end of the air vent hole 3 communicates with the internal space of the solid-state imaging device 1, and the other end communicates with the external space.

  Further, the air vent hole 3 has a parallel running portion 3 a along the wall surface of the holder 2. The parallel running portion 3a is formed in parallel with the wall surface of the wall portion where the air vent hole 3 is formed. Thereby, the path of the air vent hole 3 has a crank shape, and the path is longer than the configuration in which the air vent hole has only a portion perpendicular to the wall surface of the holder, that is, the air vent hole linearly penetrates the holder. Become. Therefore, it is possible to realize a structure in which dust, dust, foreign matter, and the like from the outside hardly enter the internal space of the solid-state imaging device 1.

  The groove for forming the air vent hole 3 is set to have a depth of 0.2 mm, a width of 0.15 mm, and a length of 10 mm, but the size of the groove is not limited to this. The groove on the bottom surface of the holder 2 can be molded with a mold when the holder is molded. Moreover, you may form a groove | channel by laser cutting after holder shaping | molding.

  In this way, even when the cross-sectional area of the air vent hole 3 is increased, the path of the air vent hole 3 is sufficiently long, so that intrusion of dust or the like into the internal space can be prevented. Therefore, unlike the invention of Patent Document 1, fine processing is not required to form the air vent hole 3. Therefore, the holder 2 can constitute the solid-state imaging device 1 in which dust or the like hardly enters the internal space, and can be easily molded.

  3A and 3B show the wiring board 7 before the holder 2 is mounted. FIG. 3A is a plan view of the wiring board 7 and FIG. 3B is a cross-sectional view of the wiring board 7. An image sensor 8 is mounted on the wiring board 7, and the image sensor 8 is connected to a wiring (not shown) by a wire 9. When the holder 2 is attached to the wiring board 7, the adhesive 6 is applied to a location corresponding to the bottom surface of the holder 2 of the wiring board 7. In this state, the bottom surface of the holder 2 is attached to the area where the adhesive 6 of the wiring board 7 is applied.

  FIG. 4 shows the solid-state imaging device 1 in a state where the holder 2 is mounted and bonded to the wiring board 7.

  FIG. 4A is a perspective view from the bottom surface of the solid-state imaging device 1 in which the holder 2 is mounted and bonded to the wiring board 7. An air vent hole 3 exists in the bonding region P. This indicates that the adhesive 6 is applied to a region of the wiring board 7 where the air vent hole 3 is formed.

  FIG. 4B shows a cross-sectional view of the solid-state imaging device 1 after the holder 2 is mounted and bonded to the wiring board 7. Similar to (a) of FIG. 4, the adhesive 6 is also applied to the formation region of the air vent hole 3.

(Brief Summary)
As described above, the holder 2 according to the present embodiment includes the air vent hole 3 that communicates the internal space and the external space of the solid-state imaging device 1, and the air vent hole 3 is a parallel running portion along the wall surface of the holder 2. 3a. Thereby, since the air vent hole 3 is formed longer than the linearly formed through hole, it is possible to prevent intrusion of dust or the like into the internal space of the solid-state imaging device 1. Further, in order to form the air vent hole 3, no fine processing technique is required. Therefore, the holder can be easily molded using the current manufacturing apparatus without additional capital investment for microfabrication and without adding a new process.

  Next, a modified example in which the function of preventing entry of dust and the like is further described. In addition, in each modification, the same code | symbol is attached | subjected about the member which has the same function as the member already demonstrated for convenience of explanation, and the description is abbreviate | omitted.

(Modification 1)
In order to prevent intrusion of dust or the like from the external space of the solid-state imaging device 1 into the internal space through the air vent hole, it is preferable that a trap (protrusion) is formed on the inner wall of the air vent hole. In this modification, an example of an air vent hole in which a trap is formed will be described.

  (A) of FIG. 5 is sectional drawing of the air vent hole 31 which concerns on this modification. A plurality of traps 51 are formed on the inner wall of the air vent hole 31. More specifically, a plurality of traps 51 are formed on both inner walls facing each other of the air vent hole 31, and the trap 51 formed on one inner wall and the trap 51 formed on the other inner wall are: The air vent holes 3 are alternately formed along the extending direction. That is, the structure of the air vent hole 31 is a zigzag labyrinth structure. Therefore, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device 1.

  The trap 51 shown in FIG. 5A has a symmetrical shape with respect to the thickness direction of the holder 2. Therefore, the resistance to the air flowing toward the external space and the resistance to the air flowing toward the internal space are equal. On the other hand, when the trap has a shape in which the resistance to air flowing toward the external space is smaller than the resistance to air flowing toward the internal space, the function of preventing entry of dust and the like can be further enhanced. . Specific examples thereof are shown in FIGS. 5B and 5C.

  FIG. 5B is a cross-sectional view of the air vent hole 32 according to this modification. A plurality of traps 52 are formed on the inner wall of the air vent hole 32. The trap 52 has a tapered cross section perpendicular to both the protruding direction of the trap 52 and the extending direction of the air vent hole 32. More specifically, the surface located on the inner space side with respect to the route of the air vent hole 3 of the trap 52 is an arcuate curved surface, and the surface located on the outer space side with respect to the route of the air vent hole 3 of the trap 52 is the inner wall. It is a vertical plane. That is, the tip of the cross section of the trap 52 is located on the outer space side with respect to the path of the air vent hole 3 with respect to the center position of the trap 52 forming range in the extending direction of the air vent hole 3.

  Thereby, the air discharged from the internal space is subjected to resistance by the arcuate curved surface of the trap 52, but the curved surface has a streamline shape along the direction toward the external space. Is less than the resistance received by the plane of the trap 52. Accordingly, dust or the like existing inside the air vent hole 32 is more easily moved toward the external space than the internal space.

  FIG. 5C is a cross-sectional view of the air vent hole 33. A plurality of traps 53 are formed on the inner wall of the air vent hole 33. The trap 53 has a triangular cross section perpendicular to both the protruding direction of the trap 52 and the extending direction of the air vent hole 32. Further, in the triangle, the angle between the first side located on the inner space side with respect to the path of the air vent hole 3 and the inner wall is the angle between the second side located on the outer space side with respect to the path of the air vent hole 3 and the inner wall. Bigger than. That is, the apex of the triangle is located closer to the external space with respect to the path of the air vent hole 3.

  Therefore, the angle at which the air entering from the external space hits the trap 53 is closer to 90 ° than the angle at which the air discharged from the internal space hits the trap 53. Therefore, the resistance that the air discharged from the internal space receives by the trap 53 is smaller than the resistance that the air that enters from the external space receives by the trap 53. Accordingly, dust or the like existing inside the air vent hole 32 is more easily moved toward the external space than the internal space.

(Modification 2)
Another modification of the air vent hole is shown in FIG.

  FIG. 6A shows a solid-state imaging device 1a including a holder 2a in which an air vent hole 34 is formed. The air vent hole 34 has a rectangular cross section perpendicular to the extending direction. This shape is easy to process in laser cutting.

  FIG. 6B shows a solid-state imaging device 1b including a holder 2b in which an air vent hole 35 is formed. The air vent hole 35 has a triangular cross section perpendicular to the extending direction. This shape is a shape that is easy to process in molding with a mold.

(Modification 3)
FIG. 7A shows a solid-state imaging device 1c according to this modification. In the solid-state imaging device 1c, a photo-curable adhesive is used as the adhesive 6 that bonds the holder 2 and the wiring board 7 together. Therefore, when the bottom surface of the holder 2 is attached to the area of the wiring board 7 where the adhesive 6 is applied and the adhesive 6 is cured by UV irradiation, it communicates with the external space of the solid-state imaging device 1 in the air vent hole 3. The adhesive 6 near the opening is cured because it is irradiated with UV (cured portion 61). In addition, the adhesive 6 in the vicinity of the opening communicating with the internal space of the solid-state imaging device 1 in the air vent hole 3 may be cured by UV leaking from the lens opening. On the other hand, since UV does not reach the area where UV does not reach in the air vent hole 3, an uncured portion 62 of the adhesive 6 is generated.

  Since the uncured portion 62 has adhesiveness, dust or the like entering the air vent hole 3 from the outside can be attached to the uncured portion 62. Thereby, there exists an effect of preventing entry of the dust and the like into the internal space of the solid-state imaging device 1c.

  Further, as the adhesive 6 used in the bonding process between the holder 2 and the wiring board 7, a two-component mixed epoxy adhesive composed of a main agent and a curing liquid may be used. Specifically, the base material is applied to the wiring substrate 7 and the curing agent is applied to the bottom surface of the holder 2, and the bottom surface of the holder 2 is attached to the region where the main material is applied to the wiring substrate 7. Thereby, the main agent and the curing agent are mixed and cured at the joint portion between the bottom surface of the holder 2 and the wiring board 7. On the other hand, in the inside of the air vent hole 3 (groove forming portion), the main agent and the curing agent are not mixed, and thus are not cured. Alternatively, the curing agent may be applied to the wiring substrate 7, the main agent may be applied to the bottom surface of the holder 2, and the bottom surface of the holder 2 may be attached to the region of the wiring substrate 7 where the curing agent is applied.

  Subsequently, an example of an air vent hole having a shape in which dust or the like easily adheres to the uncured portion 62 will be described.

  FIG. 7A shows a solid-state imaging device 1d according to this modification. The solid-state imaging device 1d is configured by adhering a holder 2d formed with an air vent hole 36 to a wiring board 7. The air vent hole 36 has a shape including a protrusion 54 in its ceiling region. That is, the protrusion 54 is formed on the bottom of the groove for forming the air vent hole 36 formed on the bottom surface of the holder 2d.

  The projection 54 makes it easy for dust and the like to come into contact with the uncured portion 62 of the adhesive 6, and more reliably prevents dust and the like from entering the internal space of the solid-state imaging device 1 d. A plurality of protrusions 54 may be provided in the air vent hole 36.

  FIG. 7B shows a solid-state imaging device 1e according to this modification. The solid-state imaging device 1e is configured by adhering a holder 2e formed with an air vent hole 37 to a wiring board 7. The air vent hole 37 has a ceiling region inclined with respect to the extending direction. That is, the depth of the groove for forming the air vent hole 37 formed on the bottom surface of the holder 2e changes gently. In other words, the groove has a depth change rate with respect to a distance in the extending direction of a predetermined value (for example, 1 mm per 10 cm distance) or less.

  Since dust or the like that has entered the air vent hole 37 easily approaches the uncured portion 62 in a region where the ceiling of the air vent hole 37 is low, the dust or the like can be more reliably prevented from entering the solid-state imaging device 1. I can do it. Furthermore, since the air vent hole 37 is not provided with the projection 54, the flow of gas discharged from the internal space of the solid-state imaging device 1 becomes smoother than the air vent hole 36 shown in FIG.

(Modification 4)
In the above description, the air vent hole is formed only on one side of the bottom surface of the square frame of the holder. However, an air vent hole continuous with a plurality of sides of the bottom surface of the holder may be formed. That is, the length of the air vent hole may be ¼ or more of the peripheral length of the housing. By forming the air vent hole long, it is possible to more reliably prevent dust and the like from entering the internal space of the solid-state imaging device.

  (A) of FIG. 8 is the figure which looked at the holder 2f which concerns on this modification from the bottom face. An air vent hole 38 is formed in the bottom surface of the holder 2f. The opening on the outer space side and the opening on the inner space side of the air vent hole 38 are respectively formed on two opposite sides of the bottom surface of the square frame shape of the holder 2f. The air vent hole 38 is continuously formed on the three sides of the bottom surface of the holder 2f, and the length of the air vent hole 38 is ½ or more of the peripheral length of the holder 2f.

  (B) of FIG. 8 is the figure which looked at the holder 2g which concerns on this modification from the bottom face. An air vent hole 39 is formed on the bottom surface of the holder 2g. The opening on the outer space side and the opening on the inner space side of the air vent hole 39 are respectively formed on two adjacent sides of the bottom surface of the square frame shape of the holder 2g. The air vent hole 39 is continuously formed on the four sides of the bottom surface of the holder 2g, and the length of the air vent hole 39 is 3/4 or more of the peripheral length of the holder 2g.

  As in this modified example, by increasing the length of the air vent hole, it is possible to more reliably prevent dust and the like from entering the solid-state imaging device 1.

(Modification 5)
Although the air vent hole described above is formed on the bottom surface of the holder, the position where the air vent hole is formed may be other than the bottom surface of the holder. However, when the holder is integrally formed by a mold, only a simple through hole 3b can be formed in the holder, as shown in FIG. On the other hand, if the holder is constructed of a plurality of parts, an air vent hole can be formed in addition to the bottom surface of the holder.

  For example, as shown in FIG. 10A, when the holder 2 has a structure in which the upper part 21 and the lower part 22 are joined, a groove 40 is formed in a joint part between the upper part 21 and the lower part 22, and the lower part 22. A groove 41 is formed in a joint portion with the upper portion 21 of the substrate. Accordingly, as shown in FIG. 10B, when the upper portion 21 and the lower portion 22 are joined, the groove 40 and the groove 41 are combined, and the air vent hole 42 can be formed in a portion other than the bottom surface.

(Additional notes)
The air vent hole may be finally closed (such as at the time of shipment).

  The present invention is not limited to the above-described embodiments and modifications, and various modifications can be made within the scope of the claims, and technical means disclosed in different embodiments and modifications are appropriately combined. The form obtained in this manner is also included in the technical scope of the present invention.

  The present invention can be used for a mobile phone with a camera, a digital still camera, a security camera, and the like provided with an optical mechanism such as a solid-state imaging device, a wiring board, a lens and a holder, zoom, and autofocus.

DESCRIPTION OF SYMBOLS 1 Solid-state imaging device 1a Solid-state imaging device 1b Solid-state imaging device 1c Solid-state imaging device 1d Solid-state imaging device 1e Solid-state imaging device 2 Holder 2a Holder 2b Holder 2d Holder 2e Holder 2f Holder 2g Holder 3a Parallel running part 3b Through-hole 4 Filter 5 Lens 6 Adhesive 7 Wiring board 8 Image sensor 9 Wire 21 Upper part 22 Lower part 51 Trap (protrusion part)
52 Trap (protrusion)
53 Trap (protrusion)
54 Protrusion 62 Uncured part

Claims (19)

In a cylindrical housing that is mounted on a substrate on which a solid-state imaging device of a solid-state imaging device is mounted so as to cover the solid-state imaging device,
An air vent hole communicating the internal space surrounded by the housing and the substrate and the external space of the housing;
The said air vent hole has a parallel running part along the wall surface of the said housing | casing, The housing | casing characterized by the above-mentioned.   The casing according to claim 1, wherein a protrusion is formed on an inner wall of the air vent hole. The protrusion includes a plurality of first protrusions formed on one of the inner walls facing each other, and a plurality of second protrusions formed on the other of the inner walls facing each other,
The casing according to claim 2, wherein the first protrusions and the second protrusions are alternately formed along the extending direction of the air vent hole.   The shape of the projecting portion is such that resistance to air flowing in the air vent hole toward the external space is smaller than resistance to air flowing in the air vent hole toward the internal space. The housing according to claim 2 or 3.   The casing according to any one of claims 2 to 4, wherein the protruding portion has a tapered cross section perpendicular to both the protruding direction of the protruding portion and the extending direction of the air vent hole. body.   6. The housing according to claim 5, wherein a tip of the cross section is located on the outer space side with respect to a route of the air vent hole with respect to a center position of a formation range of the protrusion in the extending direction of the air vent hole. body.   The casing according to claim 5 or 6, wherein the protrusion has a triangular cross section.   In the triangle, the angle between the first side located on the inner space side with respect to the path of the air vent hole and the inner wall is such that the second side located on the outer space side with respect to the path of the air vent hole and the inner wall The case according to claim 7, wherein the case is larger than the angle.   The casing according to any one of claims 1 to 8, wherein a cross section perpendicular to the extending direction of the air vent hole is rectangular.   The casing according to any one of claims 1 to 8, wherein a cross section perpendicular to the extending direction of the air vent hole is a triangle. A groove is formed on the bottom surface to be bonded to the substrate on which the solid-state imaging element of the solid-state imaging device is mounted,
The housing according to claim 1, wherein the groove constitutes the air vent hole.   The casing according to claim 11, wherein a protrusion is formed on the bottom of the groove.   The casing according to claim 11, wherein the groove has a depth change rate with respect to a distance in an extending direction of a predetermined value or less.   The housing according to any one of claims 1 to 10, wherein the air vent hole is formed in a portion other than a bottom surface to be bonded to a substrate on which the solid-state imaging device of the solid-state imaging device is mounted. body.   The length of the said air vent hole is 1/4 or more of the perimeter of the said housing | casing, The housing | casing of any one of Claims 1-14 characterized by the above-mentioned.   The casing according to claim 15, wherein the length of the air vent hole is ½ or more of the peripheral length of the casing.   The length of the said air vent hole is 3/4 or more of the perimeter of the said housing | casing, The housing | casing of Claim 16 characterized by the above-mentioned. A housing according to any one of claims 1 to 17,
A substrate on which a solid-state image sensor is mounted,
A solid-state imaging device, wherein the casing is bonded to the substrate so as to cover the solid-state imaging element. The said housing | casing is a housing | casing of any one of Claims 11-13,
The bottom surface of the housing is bonded to the substrate with an adhesive,
The solid-state imaging device according to claim 18, wherein a part of the adhesive is in an uncured state inside the air vent hole.

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