CN101035199A - Making method for the image module with the sensor directly connected and encapsulated together with the soft board - Google Patents
Making method for the image module with the sensor directly connected and encapsulated together with the soft board Download PDFInfo
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- CN101035199A CN101035199A CN 200710038824 CN200710038824A CN101035199A CN 101035199 A CN101035199 A CN 101035199A CN 200710038824 CN200710038824 CN 200710038824 CN 200710038824 A CN200710038824 A CN 200710038824A CN 101035199 A CN101035199 A CN 101035199A
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- soft board
- image sensor
- soft
- image module
- steel plate
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Abstract
This invention discloses methods of production soft image sensor plate connecting directly with the video package module, the characterized of it lies in, it include the following steps: first open a hole in the soft board corresponding image sensor chips installed, take a seat and imaging module size with the reinforcement plate, its fixed the hole in the soft dorsal plate; Image sensor then chip placed in the soft-hole plate, and reinforcement plate fixed link to a video sensor chip with the pin counterparts soft circuit board electrical connectors; Block and the installation of the final lens elements for imaging module package. This invention do not need to use a printed circuit board package, which on only lowered the image of the highly modular, but also saving the cost, improved cooling effect; And connectivity flexibility, customers can choose according to the specific application.
Description
Technical field
The present invention relates to a kind of method for packing that is used for the image module of small-sized electronic product, particularly a kind ofly do not need to adopt printed circuit board (PCB), but image sensor directly is connected the method that encapsulates with soft board.
Background technology
Image module (module of promptly making a video recording) is as a kind of accessory of small-sized electronic product, personal digital aid (PDA) PDA that is widely used in digital camera, has the mobile phone of camera function or has camera function etc. has on the electronic product of camera function, because it is microminiaturized day by day, therefore how to reduce its package dimension, convenience is connected with the electronic product other parts, becomes the center that people pay close attention to.
In the prior art, the image module comprises: a lens unit, a pedestal, a printed circuit board (PCB) (PrintedCircuit Board is abbreviated as pcb board) and an image sensor.Image sensor dice is set at the printed circuit board (PCB) upper surface, by routing, makes the corresponding connection with printed circuit board (PCB) of pin of chip, pedestal is covered on it again, fixes with pcb board, and lens unit is installed on the pedestal.Obtain packaged image module thus.
Packaged image module, need further to be connected with electronic product, the connected mode of its printed circuit board (PCB) and electronic product comprises connector mode, conducting resinl soft board connected mode and surface mount mode, wherein, the surface mount mode begins in industry to be employed in the recent period, because of its have take up room little, connect specific receiving an acclaim such as stable.Yet owing to need in the surface mount process through high-temperature process, the pedestal of image module and lens unit need adopt temperature-resistant material to make, perhaps, pedestal need be made the branch body structure, row connects again after mounting, and this can cause the complicated of the increase of cost and technical process.
On the other hand, above-mentioned and printed circuit board (PCB) encapsulation all-in-one-piece image module because of being subjected to the thickness limits of printed circuit board (PCB), is difficult to further reduce packaging height, and this is restricted the image module in the electronics applications of microminiaturization.
How further reducing the height of image module, save cost and simplify technology, is that the image module needs the problem that solves in microminiaturization is used.
Summary of the invention
The object of the invention provides a kind of encapsulation manufacturing method of image module, and image sensor directly is connected with soft board, saves printed circuit board (PCB), with the height of reduction image module, and reduces cost.
For achieving the above object, the technical solution used in the present invention is: a kind of image sensor directly is connected the manufacture method of the image module of encapsulation with soft board, comprise the following steps: corresponding image sensor dice installation position place's perforate on soft board earlier, get a reinforcement steel plate that cooperates with image module pedestal size, be fixed in the tapping dorsal part of soft board; Image sensor dice is placed in the hole of soft board again, fixedly connected with the reinforcement steel plate, routing makes each pin of image sensor dice be electrically connected with corresponding circuits on the soft board; Pedestal and lens unit are installed at last, are realized the encapsulation of image module.
Technique scheme is by spreading the reinforcement steel plate in the soft board back, and simultaneously, when soft board connected up, in both sides of the edge, and windowed in the place of corresponding image sensor on soft board, can save printed circuit board (PCB) and be convenient to fixed chip and routing with line cloth.
In the technique scheme, fixedly connected by adhesive between described reinforcement steel plate and soft board, fixedly connected by adhesive between described image sensor dice and reinforcement steel plate, after connection, carry out baking-curing.
Described pedestal is fixedlyed connected with soft board and reinforcement steel plate by the connection projection of bottom, fixes by the adhesive adhesive seal between pedestal and soft board.
Because the technique scheme utilization, the present invention compared with prior art has following advantage:
1. because the present invention adopts the structure at the soft board uplifting window, utilize the reinforcement steel plate to realize the fixing of image sensor dice and pedestal, thereby do not need to adopt again printed circuit board (PCB) to encapsulate, both reduced the height of image module, provide cost savings again;
Since the present invention directly between image sensor dice and soft board routing realize being electrically connected, can directly adopt the soft board in the electronic product as required, installation technology cloth is rapid once more to reduce, also can connector be set at the soft board opposite side, connected mode is flexible, can be selected according to concrete applicable cases by the client.
3. owing to image sensor dice among the present invention directly is fixed on the reinforcement steel plate, the reinforcement steel plate has played the effect of radiator, good heat dissipation effect simultaneously.
Description of drawings
Accompanying drawing 1 is the perspective exploded view of the image module of the embodiment of the invention one encapsulation;
Wherein: 1, soft board; 2, image sensor dice; 3, reinforcement steel plate; 4, pedestal; 5, lens unit; 6, projection.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one: a kind of image sensor directly is connected the manufacture method of the image module of encapsulation with soft board, comprise the following steps:
Window in place, corresponding image sensor dice installation position on soft board, gets a reinforcement steel plate that cooperates with image module pedestal size, sticks with glue the tapping dorsal part that agent is fixed in soft board;
To toast and make adhesive solidification through grinding, in the hole that image sensor dice after the cutting place soft board (last slice), sticking with glue agent and fixedly connected with the reinforcement steel plate; Routing makes each pin of image sensor dice be electrically connected with corresponding circuits on the soft board;
Pedestal and lens unit are installed at last, are realized the encapsulation of image module.
Shown in accompanying drawing 1 and accompanying drawing 2, image modular structure schematic diagram for present embodiment encapsulation acquisition, image sensor dice 2 is fixed on the reinforcement steel plate 3 by the hole on the soft board 1, the base of pedestal 4 and soft board 1 are adhesively fixed, 6 of 4 projections on it pass soft board, fixedly connected with the reinforcement steel plate, and pedestal 4 is provided with lens unit 5, as required, can in lens unit 5, cutoff filter be set.
Claims (3)
1. a transducer directly is connected the manufacture method of the image module that encapsulates with soft board, it is characterized in that, comprise the following steps: corresponding image sensor dice 2 installation positions place's perforate on soft board 1 earlier, get a reinforcement steel plate 3 that cooperates with image module pedestal 4 sizes, be fixed in the tapping dorsal part of soft board; Image sensor dice 2 is placed in the hole of soft board again, fixedly connected with the reinforcement steel plate, routing makes each pin of image sensor dice be electrically connected with corresponding circuits on the soft board; Pedestal 4 and lens unit 5 are installed at last, are realized the encapsulation of image module.
2. the manufacture method of image module according to claim 1, it is characterized in that: fixedly connected by adhesive between described reinforcement steel plate and soft board, fixedly connected by adhesive between described image sensor dice and reinforcement steel plate, after connection, carry out baking-curing.
3. the manufacture method of image module according to claim 1 is characterized in that: described pedestal is fixedlyed connected with soft board 1 and reinforcement steel plate 3 by the connection projection 6 of bottom, fixes by the adhesive adhesive seal between pedestal and soft board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710038824 CN101035199A (en) | 2007-03-30 | 2007-03-30 | Making method for the image module with the sensor directly connected and encapsulated together with the soft board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710038824 CN101035199A (en) | 2007-03-30 | 2007-03-30 | Making method for the image module with the sensor directly connected and encapsulated together with the soft board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101035199A true CN101035199A (en) | 2007-09-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710038824 Pending CN101035199A (en) | 2007-03-30 | 2007-03-30 | Making method for the image module with the sensor directly connected and encapsulated together with the soft board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131046A (en) * | 2011-01-25 | 2011-07-20 | 李东 | Lens component for electronic sensor optical imaging device and location method thereof |
| CN101616256B (en) * | 2009-07-17 | 2011-11-16 | 李东 | Electronic sensor-based method and electronic sensor-based device for high-precision positioning of optical imaging system |
| CN102593116A (en) * | 2011-01-12 | 2012-07-18 | 陈淑姿 | Thinned image capture module and manufacturing method thereof |
| CN103163617A (en) * | 2013-03-05 | 2013-06-19 | 南昌欧菲光电技术有限公司 | Lens module |
| CN104159008A (en) * | 2014-07-07 | 2014-11-19 | 江西盛泰光学有限公司 | Camera module |
| CN104580855A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106161908A (en) * | 2016-09-19 | 2016-11-23 | 信利光电股份有限公司 | A kind of camera module and connection base thereof |
| WO2018120299A1 (en) * | 2016-12-27 | 2018-07-05 | 华为技术有限公司 | Camera substrate assembly, camera module and terminal device |
| CN108769495A (en) * | 2018-08-07 | 2018-11-06 | 宁波舜宇光电信息有限公司 | A kind of camera module and assemble method and electronic equipment |
| CN112600999A (en) * | 2016-12-30 | 2021-04-02 | 宁波舜宇光电信息有限公司 | Camera module, molded circuit board assembly thereof, preparation method and electronic equipment |
| CN112600993A (en) * | 2020-05-13 | 2021-04-02 | 立景创新有限公司 | Image acquisition module and assembling method thereof |
| CN112698463A (en) * | 2020-12-29 | 2021-04-23 | 豪威光电子科技（上海）有限公司 | Packaging structure and packaging method of optical element |
| CN115086532A (en) * | 2022-07-15 | 2022-09-20 | 昆山丘钛光电科技有限公司 | Camera module, manufacturing method thereof and mobile terminal |
-
2007
- 2007-03-30 CN CN 200710038824 patent/CN101035199A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101616256B (en) * | 2009-07-17 | 2011-11-16 | 李东 | Electronic sensor-based method and electronic sensor-based device for high-precision positioning of optical imaging system |
| CN102593116A (en) * | 2011-01-12 | 2012-07-18 | 陈淑姿 | Thinned image capture module and manufacturing method thereof |
| CN102131046A (en) * | 2011-01-25 | 2011-07-20 | 李东 | Lens component for electronic sensor optical imaging device and location method thereof |
| CN103163617A (en) * | 2013-03-05 | 2013-06-19 | 南昌欧菲光电技术有限公司 | Lens module |
| CN104159008A (en) * | 2014-07-07 | 2014-11-19 | 江西盛泰光学有限公司 | Camera module |
| CN104580855A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106161908A (en) * | 2016-09-19 | 2016-11-23 | 信利光电股份有限公司 | A kind of camera module and connection base thereof |
| WO2018120299A1 (en) * | 2016-12-27 | 2018-07-05 | 华为技术有限公司 | Camera substrate assembly, camera module and terminal device |
| US11102384B2 (en) | 2016-12-27 | 2021-08-24 | Huawei Technologies Co., Ltd. | Camera substrate assembly, camera module, and terminal device |
| CN112600999A (en) * | 2016-12-30 | 2021-04-02 | 宁波舜宇光电信息有限公司 | Camera module, molded circuit board assembly thereof, preparation method and electronic equipment |
| CN108769495A (en) * | 2018-08-07 | 2018-11-06 | 宁波舜宇光电信息有限公司 | A kind of camera module and assemble method and electronic equipment |
| CN112600993A (en) * | 2020-05-13 | 2021-04-02 | 立景创新有限公司 | Image acquisition module and assembling method thereof |
| CN112698463A (en) * | 2020-12-29 | 2021-04-23 | 豪威光电子科技（上海）有限公司 | Packaging structure and packaging method of optical element |
| CN115086532A (en) * | 2022-07-15 | 2022-09-20 | 昆山丘钛光电科技有限公司 | Camera module, manufacturing method thereof and mobile terminal |
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Open date: 20070912 |