JP4318338B2

JP4318338B2 - Solid-state imaging device and mounting method thereof

Info

Publication number: JP4318338B2
Application number: JP07332999A
Authority: JP
Inventors: 啓二郎板倉
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1999-03-18
Filing date: 1999-03-18
Publication date: 2009-08-19
Anticipated expiration: 2019-03-18
Also published as: JP2000270272A

Description

【０００１】
【発明の属する技術分野】
本発明は、小型ビデオカメラに用いることのできる小型の固体撮像装置およびその実装方法に関するものである。
【０００２】
【従来の技術】
固体撮像装置は、民生用や産業用にと幅広く用いられるようになってきている。
【０００３】
特に、ドアホンやノートパソコンあるいは携帯機器に用いられるビデオカメラは、体積をできるだけ小さくする必要があり、それにともない、これまでに小型の固体撮像装置の開発が進められてきている。
【０００４】
従来の小型の固体撮像装置を、図３に示した斜視図を参照にして説明する。
【０００５】
従来の固体撮像装置は図３に示すように、レンズを通ってやって来た光を電気信号に変換する固体撮像素子１と、固体撮像素子１を駆動するための駆動用半導体集積回路（以降、ＩＣと記す）２と、固体撮像素子１の出力信号を処理する信号処理用ＩＣ３およびチップコンデンサ、チップ抵抗およびチップトランジスタ等からなる半導体素子チップ４のこれらの電子部品が、回路配線が形成された回路基板５の同一平面上に集積化されて実装されている。
【０００６】
【発明が解決しようとする課題】
上記従来の小型の固体撮像装置を用いて、ビデオカメラを製作した場合、図４に示すように、回路基板５の面積が大きいために、結果的にビデオカメラの筐体６の体積が大きくなってしまう。なお、７はビデオカメラのレンズ部である。
【０００７】
本発明は、ビデオカメラの体積をより小さくすることを目的とするものである。
【０００８】
【課題を解決するための手段】
本発明の固体撮像装置は、第１の基板の表面側に固体撮像素子の端子が前記第１の基板の裏面側に貫通しない状態で表面実装され、前記第１の基板の裏面には前記固体撮像素子の少なくとも一辺よりも大きい一辺を有し前記固体撮像素子を駆動させる駆動用半導体集積回路が表面実装され、第２の基板に前記固体撮像素子の出力信号を処理する出力信号処理用半導体集積回路と半導体素子チップが実装され、かつ前記出力信号処理用半導体集積回路が前記第２の基板の前記第１の基板の裏面との対向面に実装され、前記半導体素子チップが前記第２の基板の前記出力信号処理用半導体集積回路とは反対側の面に実装され、前記第１の基板と前記第２の基板の端部同士がフレキシブル基板により電気的に接続されているものである。
【０００９】
これにより、各種の電子部品を多層基板に実装することができるので固体撮像装置を小型化することができる。
【００１０】
さらに、本発明の固体撮像装置は、前記固体撮像素子と前記駆動用半導体集積回路と前記出力信号処理用半導体集積回路および前記半導体素子チップの電子部品の少なくとも１つがパッケージ封止されていないベアチップで実装されているものである。
さらに、前記第１の基板と前記第２の基板は、垂直方向に重なるように配置されているものである。
【００１１】
これにより、電子部品を小型化することができるので、さらに固体撮像装置を小型化することができる。
【００１４】
本発明の固体撮像装置の実装方法は、第１の基板の表面側に固体撮像素子の端子が前記第１の基板の裏面側に貫通しない状態で表面実装し、前記第１の基板の裏面に前記固体撮像素子の少なくとも一辺よりも大きい一辺を有し前記固体撮像素子を駆動させる駆動用半導体集積回路を表面実装する工程と、前記固体撮像素子の出力信号を処理する出力信号処理用半導体集積回路と半導体素子チップのうちの出力信号処理用半導体集積回路を、前記第２の基板の表面に表面実装し、前記半導体素子チップを前記第２の基板の裏面に表面実装する工程と、前記第１の基板と前記第２の基板の端部同士をフレキシブル基板により電気的に接続すること工程と、前記フレキシブル基板を折り曲げることにより前記駆動用半導体集積回路と前記出力信号処理用半導体集積回路とが対向するよう前記第１の基板と前記第２の基板を垂直方向に配置する工程とを備えたものである。
【００１５】
これにより、電子部品を実装した回路基板を多層にすることができるので固体撮像装置を小型化することができる。
【００１６】
【発明の実施の形態】
本発明の実施の形態について、図１を用いて説明する。
【００１７】
図１（ａ）は固体撮像装置の斜視図、図１（ｂ）はその断面図である。
【００１８】
本発明の固体撮像装置は、回路配線が形成された第１のリジッド基板８の表面に固体撮像素子１が、第１のリジッド基板８の裏面に駆動用ＩＣ２が実装され、回路配線が形成された第２のリジッド基板９の表面に信号処理用ＩＣ３が、第２のリジッド基板９の裏面にはチップコンデンサ、チップ抵抗およびチップトランジスタ等の半導体素子チップ４が実装され、第１のリジッド基板８と第２のリジッド基板９のそれぞれの端部間には、両基板の配線と電気的に接続される配線が形成され、かつ、折り曲げられたフレキシブル基板１０が接続され、第２のリジッド基板９の他端には、外部にビデオ信号を出力するための信号配線や電源入力線などの入出力配線等が形成されたフレキシブル基板１１が接続され、第１のリジッド基板８と第２のリジッド基板９が、垂直方向に重なるように配置されている構造である。
【００１９】
次に、本発明の固体撮像装置の実装方法は、第１のリジッド基板８の表面に固体撮像素子１を、第１のリジッド基板８の裏面に駆動用ＩＣ２を実装し、第２のリジッド基板９の表面に信号処理用ＩＣ３を、第２のリジッド基板９の裏面にはチップコンデンサ、チップ抵抗およびチップトランジスタ等からなる半導体素子チップ４を実装し、この実装をする前あるいは後に、第１のリジッド基板８と第２のリジッド基板９のそれぞれの端部間に、両基板の配線と電気的に接続される配線が形成されたフレキシブル基板１０を接続し、また第２のリジッド基板９の他端に、外部にビデオ信号を出力するための信号配線や電源入力線などの入出力配線が形成されたフレキシブル基板１１を接続し、最後に、第１と第２のリジッド基板は垂直方向に重なるようにフレキシブル基板１０を折り曲げる方法である。
【００２０】
そして、このように組み立てた固体撮像装置を図２に示すようにビデオカメラの筐体１２内に組み込む。
【００２１】
このように、従来の各種の電子部品を単一の基板に全て実裝するのではなく、複数のリジッド基板に分割して実裝することで１枚のリジッド基板の面積を小さくでき、かつ、これらのリジッド基板は垂直に重ねられるため、図２に示すようにビデオカメラを製作する場合、各種の電子部品が実装された第１リジッド基板８と第２のリジッド基板９を垂直方向に重ねてカメラの筐体１２に組み込むことができるので従来のビデオカメラよりも体積を小さくすることができる。
【００２２】
なお、実施の形態では、各種の電子部品をパッケージに封止された構造のものを示したが、パッケージに封止されていないベアチップの構造のものでもよい。これにより、さらに小型にすることができる。
【００２３】
また、各種の電子部品を実装する基板としてリジッド基板を用いたが、これに限られるものではなく、回路配線が形成され、かつ、各種の電子部品が実装できる回路基板であればよい。
【００２４】
【発明の効果】
本発明の固体撮像装置およびその実装方法を用いれば、体積の小さいビデオカメラを作製することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態を示す固体撮像装置の斜視図とその断面図
【図２】本発明の固体撮像装置およびその実装方法を用いたビデオカメラの概略斜視図
【図３】従来の固体撮像装置の斜視図
【図４】従来の固体撮像装置を用いたビデオカメラの概略斜視図
【符号の説明】
１固体撮像素子
２駆動用ＩＣ
３信号処理用ＩＣ
４半導体素子チップ
５回路基板
６、１２ビデオカメラの筐体
７レンズ部分
８第１のリジッド基板
９第２のリジッド基板
１０、１１フレキシブル基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a small solid-state imaging device that can be used for a small video camera and a mounting method thereof.
[0002]
[Prior art]
Solid-state imaging devices have been widely used for consumer and industrial purposes.
[0003]
In particular, a video camera used for a door phone, a notebook computer, or a portable device needs to have a volume as small as possible, and accordingly, development of a small solid-state imaging device has been advanced so far.
[0004]
A conventional small solid-state imaging device will be described with reference to the perspective view shown in FIG.
[0005]
As shown in FIG. 3, a conventional solid-state imaging device includes a solid-state imaging device 1 that converts light coming through a lens into an electric signal, and a driving semiconductor integrated circuit (hereinafter referred to as an IC) for driving the solid-state imaging device 1. 2) and a signal processing IC 3 for processing the output signal of the solid-state imaging device 1 and these electronic components of the semiconductor element chip 4 including a chip capacitor, a chip resistor, a chip transistor, etc. It is integrated and mounted on the same plane of the substrate 5.
[0006]
[Problems to be solved by the invention]
When a video camera is manufactured using the conventional small solid-state imaging device, the area of the circuit board 5 is large as shown in FIG. 4, and as a result, the volume of the casing 6 of the video camera increases. End up. Reference numeral 7 denotes a lens portion of the video camera.
[0007]
An object of the present invention is to further reduce the volume of a video camera.
[0008]
[Means for Solving the Problems]
The solid-state imaging device of the present invention is a surface mounted in a state where terminals of the solid-state image pickup element on the surface side of the first substrate does not penetrate to the back surface side of the first substrate, the the back surface of the first substrate solid A semiconductor integrated circuit for driving which has a side larger than at least one side of the image sensor and which drives the solid-state image sensor is surface-mounted, and an output signal processing semiconductor integrated circuit which processes an output signal of the solid-state image sensor on a second substrate A circuit and a semiconductor element chip are mounted, and the output signal processing semiconductor integrated circuit is mounted on a surface of the second substrate facing the back surface of the first substrate, and the semiconductor element chip is mounted on the second substrate. Are mounted on a surface opposite to the output signal processing semiconductor integrated circuit, and ends of the first substrate and the second substrate are electrically connected to each other by a flexible substrate.
[0009]
Thereby, since various electronic components can be mounted on a multilayer substrate, a solid-state imaging device can be reduced in size.
[0010]
Furthermore, the solid-state imaging device of the present invention is a bare chip in which at least one of the solid-state imaging element, the driving semiconductor integrated circuit, the output signal processing semiconductor integrated circuit, and the electronic component of the semiconductor element chip is not packaged. It is what is implemented.
Further, the first substrate and the second substrate are arranged so as to overlap in the vertical direction.
[0011]
Thereby, since an electronic component can be reduced in size, a solid-state imaging device can be further reduced in size.
[0014]
Implementation method of a solid-state imaging device of the present invention, surface mounted in a state where terminals of the solid-state image pickup element on the surface side of the first substrate does not penetrate to the back surface side of the first substrate, the back surface of the first substrate Surface mounting a driving semiconductor integrated circuit that has one side larger than at least one side of the solid-state image sensor and drives the solid-state image sensor; and an output signal processing semiconductor integrated circuit that processes an output signal of the solid-state image sensor And mounting the output signal processing semiconductor integrated circuit among the semiconductor element chips on the surface of the second substrate, and mounting the semiconductor element chip on the back surface of the second substrate; Electrically connecting the ends of the substrate and the second substrate with a flexible substrate, and bending the flexible substrate to provide the driving semiconductor integrated circuit and the output signal processing. And the use semiconductor integrated circuit is obtained by a step of arranging the first substrate and the second substrate so as to face in the vertical direction.
[0015]
As a result, the circuit board on which the electronic component is mounted can be multilayered, so that the solid-state imaging device can be reduced in size.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to FIG.
[0017]
FIG. 1A is a perspective view of a solid-state imaging device, and FIG. 1B is a cross-sectional view thereof.
[0018]
In the solid-state imaging device of the present invention, the solid-state imaging device 1 is mounted on the surface of the first rigid substrate 8 on which circuit wiring is formed, and the driving IC 2 is mounted on the back surface of the first rigid substrate 8 to form circuit wiring. The signal processing IC 3 is mounted on the surface of the second rigid substrate 9, and the semiconductor element chip 4 such as a chip capacitor, chip resistor, and chip transistor is mounted on the back surface of the second rigid substrate 9. Between the respective end portions of the second rigid substrate 9 and a wiring electrically connected to the wirings of both substrates, a bent flexible substrate 10 is connected, and the second rigid substrate 9 is connected. A flexible substrate 11 on which signal wiring for outputting a video signal to the outside and input / output wiring such as a power input line is formed is connected to the other end of the first rigid substrate 8 and the second rigid substrate 8. Gide substrate 9, a structure is arranged so as to overlap in the vertical direction.
[0019]
Next, according to the mounting method of the solid-state imaging device of the present invention, the solid-state imaging device 1 is mounted on the front surface of the first rigid substrate 8, and the driving IC 2 is mounted on the back surface of the first rigid substrate 8. A signal processing IC 3 is mounted on the front surface of the semiconductor substrate 9 and a semiconductor element chip 4 including a chip capacitor, a chip resistor and a chip transistor is mounted on the back surface of the second rigid substrate 9. A flexible substrate 10 having wirings electrically connected to the wirings of both substrates is connected between the end portions of the rigid substrate 8 and the second rigid substrate 9, and the other of the second rigid substrate 9 is connected. The flexible substrate 11 on which signal wiring for outputting a video signal to the outside and input / output wiring such as a power supply input line are formed is connected to the end. Finally, the first and second rigid substrates overlap in the vertical direction. A method of bending the flexible substrate 10 so that.
[0020]
Then, the solid-state imaging device assembled in this way is incorporated into the housing 12 of the video camera as shown in FIG.
[0021]
In this way, it is possible to reduce the area of a single rigid substrate by dividing the various electronic components into a plurality of rigid substrates, instead of actually implementing them on a single substrate, and Since these rigid substrates are vertically stacked, when manufacturing a video camera as shown in FIG. 2, the first rigid substrate 8 and the second rigid substrate 9 on which various electronic components are mounted are vertically stacked. Since it can be incorporated in the camera casing 12, the volume can be reduced as compared with a conventional video camera.
[0022]
In the embodiment, a structure in which various electronic components are sealed in a package is shown, but a structure of a bare chip that is not sealed in a package may be used. As a result, the size can be further reduced.
[0023]
Moreover, although the rigid board | substrate was used as a board | substrate which mounts various electronic components, it is not restricted to this, What is necessary is just a circuit board in which circuit wiring is formed and various electronic components can be mounted.
[0024]
【The invention's effect】
By using the solid-state imaging device and the mounting method of the present invention, a video camera with a small volume can be manufactured.
[Brief description of the drawings]
FIG. 1 is a perspective view of a solid-state imaging device showing an embodiment of the present invention and a sectional view thereof. FIG. 2 is a schematic perspective view of a video camera using the solid-state imaging device of the present invention and its mounting method. FIG. 4 is a schematic perspective view of a video camera using a conventional solid-state imaging device.
1 Solid-state image sensor 2 IC for driving
3 Signal processing IC
4 Semiconductor Element Chip 5 Circuit Boards 6 and 12 Case of Video Camera 7 Lens Part 8 First Rigid Board 9 Second Rigid Board 10 and 11 Flexible Board

Claims

Surface mounted in a state where terminals of the solid-state image pickup element on the surface side of the first substrate does not penetrate to the back surface side of the first substrate, the back surface of the first substrate is larger than at least one side of the solid-state imaging device A driving semiconductor integrated circuit that has one side and drives the solid-state imaging device is surface-mounted,
An output signal processing semiconductor integrated circuit and a semiconductor element chip for processing an output signal of the solid-state imaging device are mounted on a second substrate, and the output signal processing semiconductor integrated circuit is connected to the first substrate of the second substrate. Mounted on a surface opposite to the back surface of the substrate, and the semiconductor element chip is mounted on a surface of the second substrate opposite to the output signal processing semiconductor integrated circuit,
A solid-state imaging device, wherein ends of the first substrate and the second substrate are electrically connected by a flexible substrate.

At least one of the solid-state imaging device, the driving semiconductor integrated circuit, the output signal processing semiconductor integrated circuit, and the electronic component of the semiconductor element chip is mounted by a bare chip that is not packaged. Item 2. The solid-state imaging device according to Item 1.

The solid-state imaging device according to claim 1, wherein the first substrate and the second substrate are disposed so as to overlap in a vertical direction.

A surface of the first substrate is surface-mounted in a state where a terminal of the solid-state imaging element does not penetrate the back side of the first substrate, and one side larger than at least one side of the solid-state imaging device is provided on the back side of the first substrate. And surface-mounting a driving semiconductor integrated circuit for driving the solid-state imaging device,
An output signal processing semiconductor integrated circuit for processing an output signal of the solid-state imaging device and an output signal processing semiconductor integrated circuit among the semiconductor element chips are mounted on the surface of the second substrate, and the semiconductor element chip is mounted Surface mounting on the back surface of the second substrate;
Electrically connecting end portions of the first substrate and the second substrate by a flexible substrate ;
Arranging the first substrate and the second substrate in a vertical direction so that the driving semiconductor integrated circuit and the output signal processing semiconductor integrated circuit face each other by bending the flexible substrate;
A method for mounting a solid-state imaging device.