CN116230727A - Electronic equipment - Google Patents
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- CN116230727A CN116230727A CN202211705105.8A CN202211705105A CN116230727A CN 116230727 A CN116230727 A CN 116230727A CN 202211705105 A CN202211705105 A CN 202211705105A CN 116230727 A CN116230727 A CN 116230727A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention provides an electronic device, wherein a light-transmitting substrate is positioned at the outer side of a photosensitive chip, external ambient light firstly passes through the light-transmitting substrate and then enters and irradiates to a photosensitive surface of the photosensitive chip, so that the photosensitive chip can collect external ambient light and convert collected optical signals into corresponding electric signals; the electronic equipment adopts a fan-out type packaging process to inversely mount a plurality of photosensitive chips on a light-transmitting substrate, and combines a wiring layer between the light-transmitting substrate and the photosensitive chips to realize interconnection packaging among the plurality of photosensitive chips; the total thickness of the light-transmitting substrate and the wiring layer is far smaller than the thickness of a base used by a lens module in the prior art, so that the light and thin design of the electronic equipment is easier to realize; and because a plurality of sensitization chips are through the first metal wire in the wiring layer and realize interconnection, so need not to be in a large number of wire bonding wire routes in the base like prior art to avoid the frame width that is caused by a large number of wire bonding wire routes great, the connection precision is relatively poor, the yield is lower and the higher scheduling problem of consumption.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to electronic equipment.
Background
A CMOS image sensor (CMOS Image Sensor, abbreviated as CIS) chip is an electronic device capable of sensing external light and converting it into an electrical signal, and is widely used in electronic devices such as a video camera. The CIS chip is generally fabricated by a semiconductor fabrication process, and then a package structure is formed by performing a series of packaging processes on the CIS chip.
However, the package structure of the existing CIS chip is large, and in order to obtain better shooting effect, electronic devices such as mobile phones in the prior art often adopt a multi-lens form, each lens is formed by an independent module, so that the multi-lens module is large in size after being combined, and the light and thin design of the electronic device is not facilitated; and the existing CIS chip needs to be wired and routed in a large amount in a plastic or ceramic base, so that the yield is low.
Disclosure of Invention
In view of the above, the present invention provides an electronic device, which has the following technical scheme:
an electronic device, the electronic device comprising:
a light-transmitting substrate comprising a first surface and a second surface disposed opposite to each other;
the wiring layer is positioned on one side of the first surface and comprises at least one layer of first metal wire;
the light-sensitive chips are positioned on one side of the wiring layer, which is away from the light-transmitting substrate, and are electrically connected through the first metal wires, and each light-sensitive chip comprises a light-sensitive surface for sensing light signals, and the light-sensitive surface faces the first surface;
and the frame support protrudes to one side of the second surface.
Compared with the prior art, the invention has the following beneficial effects:
according to the electronic equipment provided by the invention, the light-transmitting substrate is positioned at the outer side of the photosensitive chip, so that external environment light firstly passes through the light-transmitting substrate and then enters the photosensitive surface of the photosensitive chip, the photosensitive chip is enabled to collect external environment light, and the collected light signals are converted into corresponding electric signals.
The electronic equipment adopts a fan-out type packaging process to inversely mount a plurality of photosensitive chips on a light-transmitting substrate, and combines a wiring layer between the light-transmitting substrate and the photosensitive chips to realize interconnection packaging among the plurality of photosensitive chips; the total thickness of the light-transmitting substrate and the wiring layer is far smaller than the thickness of a base used for a lens module in the prior art, so that the light and thin design of the electronic equipment is easier to realize.
And because the plurality of photosensitive chips are interconnected through the first metal wire in the wiring layer, a large number of wire bonding wires in the base are not needed as in the prior art, so that the problems of large frame width, poor connection precision, low yield, high power consumption and the like caused by the large number of wire bonding wires are avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic top view of an electronic device according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view along the AA in FIG. 1 according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention;
fig. 7 is a schematic top view of another electronic device according to an embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view along BB in FIG. 7 according to an embodiment of the present invention;
fig. 9 is a schematic top view of still another electronic device according to an embodiment of the present invention;
FIG. 10 is a schematic cross-sectional view along the direction CC in FIG. 9 according to an embodiment of the present invention;
fig. 11 is a schematic top view of another electronic device according to an embodiment of the present disclosure;
FIG. 12 is a schematic cross-sectional view along DD in FIG. 11 according to an embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view of yet another electronic device according to an embodiment of the present invention;
fig. 14 is a schematic cross-sectional view of still another electronic device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Referring to fig. 1, fig. 1 is a schematic top view of an electronic device according to an embodiment of the present invention, in fig. 1, an electronic device having three photosensitive chips is illustrated as an example, referring to fig. 2, fig. 2 is a schematic cross-sectional view along AA direction in fig. 1 according to an embodiment of the present invention, and the electronic device includes:
a light-transmitting substrate 11, the light-transmitting substrate 11 comprising a first surface and a second surface disposed opposite to each other.
A wiring layer 12 located on the first surface side, the wiring layer 12 including at least one layer of first metal wirings 13.
The plurality of photosensitive chips 14 are located on one side of the wiring layer 12 away from the transparent substrate 11, the plurality of photosensitive chips 14 are electrically connected through the first metal wires 13, and the photosensitive chips 14 comprise a photosensitive surface for sensing optical signals, and the photosensitive surface faces the first surface.
And a frame 15 protruding toward the second surface side.
Specifically, the transparent substrate 11 in the embodiment of the present invention includes, but is not limited to, a glass substrate, for example, may be a quartz glass substrate, wherein the glass substrate has a high light transmittance and high temperature resistance, and the flatness can also satisfy the preparation of the subsequent film layer, so as to improve the structural stability of the electronic device.
The photosensitive chip 14 includes, but is not limited to, a CIS chip for converting a sensed optical signal into an electrical signal; in the electronic device, the light-transmitting substrate 11 is located at the outer side of the photosensitive chip 14, so that external ambient light firstly passes through the light-transmitting substrate 11 and then enters the photosensitive surface of the photosensitive chip 14, thereby the photosensitive chip 14 collects external ambient light and converts the collected light signal into a corresponding electrical signal.
In the embodiment of the invention, the electronic equipment adopts a fan-out type packaging process to flip-chip a plurality of photosensitive chips 14 on a light-transmitting substrate 11, and combines a wiring layer 12 between the light-transmitting substrate 11 and the photosensitive chips 14 to realize interconnection packaging among the plurality of photosensitive chips 14; the total thickness of the transparent substrate 11 and the wiring layer 12 is far smaller than the thickness of the base used in the lens module in the prior art, so that the light and thin design of the electronic equipment is easier to realize.
And because the plurality of photosensitive chips 14 are interconnected through the first metal wires in the wiring layer 12, a large number of wires are not needed to be wired in the base as in the prior art, so that the problems of large frame width, poor connection precision, low yield, high power consumption and the like caused by a large number of wires are avoided.
In addition, in the embodiment shown in fig. 2 and the embodiment similar to fig. 2, since the communication between the photosensitive chips 14 is connected through the wiring layer 12, no module outer frame is required between the adjacent photosensitive chips 14, so that the occupied area of the electronic device is greatly reduced; when the electronic equipment is applied to a mobile phone or other terminal electronic products, more space can be saved for placing other structures, the whole machine is more attractive, and if other structures are not required to be placed, the electronic equipment provided by the embodiment can enable the mobile phone or other terminal electronic products to be lighter and more portable.
Alternatively, in another embodiment of the present invention, as shown in FIG. 2,
the orthographic projection of the plurality of photosensitive chips 14 on the transparent substrate 11 is located within the orthographic projection of the area surrounded by the frame support 15 on the transparent substrate 11.
Specifically, in the embodiment of the present invention, based on the frame support 15 protruding to the second surface side of the light-transmitting substrate 11, the support and fixation of the plurality of photosensitive chips 14 after packaging can be realized, and one support is not required for each lens module to realize fixation as in the prior art, so that the light and thin design of the electronic device can be realized more easily, and the manufacturing cost can be reduced.
Optionally, in another embodiment of the present invention, referring to fig. 3, fig. 3 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention.
The electronic device further includes:
the second metal wire 16 is located at one side of the second surface, and the second metal wire 16 is electrically connected to the first metal wire 13 through a via hole 17 penetrating the transparent substrate 11.
Specifically, in the embodiment of the present invention, by forming the second metal trace 16 on the second surface of the light-transmitting substrate 11, some devices may be disposed on the second surface side of the light-transmitting substrate 11, and then interconnection between the devices may be achieved through the second metal trace 16, the through hole 17 penetrating through the light-transmitting substrate 11, and the first metal trace 13, so that the lateral dimension of the packaged photosensitive chip 14 may be reduced without affecting the normal operation, the packaging dimension may be further reduced, and the devices disposed on the second surface side of the light-transmitting substrate 11 may be generally disposed in the area surrounded by the frame support 15 based on the arrangement of the frame support 15, so that the overall thickness of the packaged photosensitive chip may not be increased.
It should be noted that, the second metal wire 16 is disposed at a position overlapping the first metal wire 13, so that the first metal wire 13 covers the second metal wire 16 and the electrical devices located near the second metal wire 16, and the second metal wire 16 and the electrical devices are prevented from blocking the light emitted to the photosensitive chip 14. The arrangement can fully utilize the space on the opposite side of the second metal wire 16, and avoid placing electrical devices at other positions to occupy the area, thereby further realizing miniaturization of the imaging electronic device.
Optionally, in another embodiment of the present invention, referring to fig. 4, fig. 4 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention.
The electronic device further includes:
a focusing motor 18 located on the second surface side, an induction coil 19 located inside the focusing motor 18, and a lens 20 located between frames of the focusing motor 18.
The induction coil 19 is electrically connected to the second metal trace 16.
Specifically, in the embodiment of the present invention, the induction coil 19 in the focusing motor 18 is electrically connected to the second metal wire 16 to receive a corresponding signal, so that the focusing motor 18 performs a focusing operation, and the focusing motor 18 is located in the area surrounded by the frame support 15, and one focusing motor 18 corresponds to one photosensitive chip 14.
Optionally, in another embodiment of the present invention, referring to fig. 5, fig. 5 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention.
The electronic device further includes:
a first circuit board 21 located on the side of the second surface.
The first circuit board 21 is provided with a plurality of passive devices 22, and the plane of the first circuit board 21 is perpendicular to the plane of the light-transmitting substrate 11.
Specifically, in the embodiment of the present invention, the first circuit board 21 may be fixed to the side wall of the frame 15 or the side wall of the focusing motor 18, and in the embodiment of the present invention, the fixing to the side wall of the focusing motor 18 is described as an example.
In the working process of the electronic device, circuit structures with functions of supplying power, filtering, coupling and the like are necessarily needed for each photosensitive chip 14, so that passive devices 22 such as passive resistors and/or passive capacitors needed by the circuit structures can be fixed on the second surface side of the transparent substrate 11 through the first circuit board 21 in the embodiment of the invention, and the first circuit board 21 is vertically fixed, that is, the plane of the first circuit board 21 is perpendicular to the plane of the transparent substrate 11, so that the transverse dimension of the photosensitive chip 14 after encapsulation is greatly reduced, the encapsulation dimension is further reduced, and higher integration is realized.
In addition, as shown in fig. 5, some circuit structures may be shared between two adjacent photosensitive chips 14, for example, two photosensitive chips 14 share a power supply circuit, so as to reduce the number of required components and reduce the power consumption on the premise of reducing the package size.
Optionally, the first circuit board 21 includes, but is not limited to, a PCB circuit board.
Optionally, in another embodiment of the present invention, referring to fig. 6, fig. 6 is a schematic structural diagram of still another electronic device according to an embodiment of the present invention.
The electronic device further includes:
and a switching circuit board 23, wherein the switching circuit board 23 is electrically connected with the first circuit board 21 and the second metal wire 16 respectively.
Specifically, the switching circuit board 23 in the embodiment of the present invention includes, but is not limited to, an FPC circuit board, for implementing switching between the first circuit board 21 and the second metal wire 16, so as to ensure that the first circuit board 21 can be vertically fixed.
It should be noted that, in some other embodiments, the interposer circuit board 23 may also be electrically connected to the first circuit board 21 and the second metal trace 16 by using conductive adhesive tape or conductive silver paste.
Optionally, in another embodiment of the present invention, referring to fig. 7, fig. 7 is a schematic top view of another electronic device provided in the embodiment of the present invention, fig. 7 is an illustration of an electronic device having three photosensitive chips, referring to fig. 8, fig. 8 is a schematic cross-sectional view along BB direction in fig. 7 provided in the embodiment of the present invention, and the electronic device further includes:
the active chip 24 is located on the first surface side, and the active chip 24 is electrically connected with the photosensitive chip 14 through the first metal wire 13.
Specifically, in the embodiment of the present invention, the active chip 24 includes, but is not limited to, a digital signal processing chip (Digital Signal Process, abbreviated as DSP) for processing the electrical signal converted by the photosensitive chip 14, where the active chip 24 is located on a side of the wiring layer 12 facing away from the transparent substrate 11, and is electrically connected to the photosensitive chip 14 through the first metal trace 13, that is, in the embodiment of the present invention, the active chip 24 and the photosensitive chip 14 are packaged together, because the first metal trace 13 in the wiring layer 12 has higher precision, and smaller line width and line distance, when the active chip 24 is electrically connected to the first metal trace 13, the pin size and pin pitch of the active chip 24 can also be designed to be smaller, that is, the active chip 24 with smaller volume can be used for packaging; obviously, the arrangement mode not only has higher integration level, but also can further reduce the whole size after encapsulation.
In addition, since the active chip 24 and the photosensitive chip 14 are packaged together in the embodiment of the present invention, it is obvious that the active chip 24 and the photosensitive chip 14 can be electrically connected only by using the first metal wire 13 in the wiring layer 12, and the package size of the active chip 24 and the photosensitive chip 14 can be smaller and the connection is more reliable without using other circuit boards.
Alternatively, in another embodiment of the present invention, as shown in fig. 7 and 8, the plurality of photosensitive chips 14 includes a first photosensitive chip 14a and a second photosensitive chip 14b sequentially arranged in the first direction X.
The active die 24 includes a first active die 24a on a side of the first photo-sensing die 14a remote from the second photo-sensing die 14b, and a second active die 24b on a side of the second photo-sensing die 14b remote from the first photo-sensing die 14 a.
The first active chip 24a is electrically connected to the first photosensitive chip 14a through the first metal trace 13, and the second active chip 24b is electrically connected to the second photosensitive chip 14b through the first metal trace 13.
The plurality of photo-sensing chips 14 further includes a third photo-sensing chip 14c located at one side of the first photo-sensing chip 14a in a second direction Y, the first direction X intersecting the second direction Y.
The third photosensitive chip 14c is electrically connected to the first active chip 24a through the first metal trace 13.
Specifically, in the embodiment of the present invention, taking the first direction X and the second direction Y as perpendicular examples, the first photosensitive chip 14a and the third photosensitive chip 14c are correspondingly and electrically connected to the first active chip 24a, the second photosensitive chip 14b is correspondingly and electrically connected to the second active chip 24b, and the optional third photosensitive chip 14c may also be electrically connected to an independent active chip 24, and it is obvious that when the first active chip 24a and the second active chip 24b are oppositely disposed in the second direction Y, the first photosensitive chip 14a and the second photosensitive chip 14b may be simultaneously and electrically connected to one of the active chips 24, and the third photosensitive chip 14c is electrically connected to the other active chip 24.
That is, in the embodiment of the present invention, based on the arrangement situation of the plurality of active chips 24, all the photosensitive chips 14 adjacent to the active chip 24 can be flexibly electrically connected with the active chip 24, so as to effectively reduce the number of active chips 24, realize the control technology of the plurality of photosensitive chips 14 by using the same active chip 24, realize higher degree of integration, furthest reduce the number of components, and further reduce the space size after encapsulation.
Optionally, in another embodiment of the present invention, referring to fig. 9, fig. 9 is a schematic top view of another electronic device provided in the embodiment of the present invention, fig. 9 is an illustration of an electronic device having three photosensitive chips, and referring to fig. 10, fig. 10 is a schematic cross-sectional view along the direction CC in fig. 9 provided in the embodiment of the present invention.
The plurality of photosensitive chips 14 includes a first photosensitive chip 14a and a second photosensitive chip 14b sequentially arranged in the first direction X.
The active die 24 includes a first active die 24a located on a side of the first photo-sensing die 14a remote from the second photo-sensing die 14b.
The wiring layer 12 further includes a third metal trace 26.
The first active chip 24 is electrically connected to the first photosensitive chip 14a through the first metal trace 13, and the first active chip 24 is electrically connected to the second photosensitive chip 14b through the third metal trace 26.
The plurality of photo-sensing chips 14 further includes a third photo-sensing chip 14c located at one side of the first photo-sensing chip 14a in a second direction Y, the first direction X intersecting the second direction Y.
The third photosensitive chip 14c is electrically connected to the first active chip 24a through the first metal trace 13.
Specifically, in the embodiment of the present invention, taking the first direction X and the second direction Y as an example, the three photosensitive chips 14 are all electrically connected to one active chip 24, the first photosensitive chip 14a and the third photosensitive chip 14c of the adjacent first active chip 24a are electrically connected to the first active chip 24a through the first metal trace 13, the second photosensitive chip 14b far from the first active chip 24a is electrically connected to the first active chip 24a through the third metal trace 26, which is the other metal trace, obviously, when the active chip 24 is located at one side of the first photosensitive chip 14a far from the third photosensitive chip 14c, the first photosensitive chip 14a and the second photosensitive chip 14b of the adjacent active chip 24 can be electrically connected to the active chip 24 through the first metal trace 13, and the third photosensitive chip 14c far from the active chip 24 can be electrically connected to the active chip 24 through the third metal trace 26, which is the other metal trace. Wherein the third metal trace 26 is insulated from the first metal trace 13.
That is, in the embodiment of the present invention, the number of active chips 24 can be further reduced by designing the metal traces in the wiring layer 12, so as to implement a technique of controlling the multiple photosensitive chips 14 by using the same active chip 24, implement a higher degree of integration, reduce the number of components to the maximum extent, and further reduce the space size after packaging.
Optionally, in another embodiment of the present invention, as shown in fig. 7 to 10, the electronic device further includes:
the flexible circuit board 25 is located on the first surface side, and the flexible circuit board 24 is electrically connected with the active chip 24 through the first metal wire 13.
The flexible circuit board 25 is located on a side of the active chip 24 away from the photo-sensing chip 14.
Specifically, in the embodiment of the present invention, the flexible circuit board 25 is located at a side of the wiring layer 12 away from the transparent substrate 11, and is electrically connected to the active chip 24 through the first metal wire 13, so as to realize signal transmission between the active chip 24 and the outside, so as to control the working state of the active chip.
As shown in fig. 7 and 10, in the case that the number of active chips 24 is reduced, the number of corresponding flexible circuit boards 25 can be correspondingly reduced, so that a higher degree of integration is achieved, the number of components is reduced to the maximum extent, and the space size after packaging is further reduced.
Optionally, in another embodiment of the present invention, referring to fig. 11, fig. 11 is a schematic top view of another electronic device provided in the embodiment of the present invention, fig. 11 is an illustration of an electronic device having three photosensitive chips, and referring to fig. 12, fig. 12 is a schematic cross-sectional view along the DD direction in fig. 11 provided in the embodiment of the present invention.
The electronic device further includes: a flexible film layer 27 between the wiring layer 12 and the light-transmitting substrate 11, the flexible film layer 27 including at least one bending region 28.
The transparent substrate 11 has a hollowed-out area, the hollowed-out area divides the transparent substrate 11 into a plurality of independent sub-transparent substrates, and the hollowed-out area overlaps the bending area.
At least one photosensitive chip 14 is disposed on the sub-light-transmitting substrate.
The frame support 15 comprises a plurality of independent sub-frame supports, and the sub-frame supports are arranged in one-to-one correspondence with the sub-light-transmitting substrates.
Specifically, in the embodiment of the invention, the flexible film layer 27 is additionally arranged and the transparent substrate 11 is processed to form the hollowed-out area and the bending area, so that the photosensitive chips 14 with different space orientations can share the structures such as the active chip 24 and the flexible circuit board 25, the trans-regional integration of the photosensitive chips of the electronic equipment can be realized, the integration of a higher degree is realized, the number of components is reduced to the greatest extent, the cost is reduced, and the space size after encapsulation is further reduced.
For example, the electronic device includes: a front photosensitive region and a rear photosensitive region. More specifically, when the electronic device is applied to a mobile phone, it may be a front camera and a rear camera of the mobile phone.
The flexible film layer 27 includes one bending region, and sub-light-transmitting substrates disposed on both sides of the bending region and provided with the light-sensing chip 14 are respectively disposed in the front light-sensing region and the rear light-sensing region.
Optionally, in another embodiment of the present invention, referring to fig. 13, fig. 13 is a schematic cross-sectional view of still another electronic device according to an embodiment of the present invention.
The area of the flexible film 27 opposite to the photosensitive chip 14 is a hollowed-out area 29.
Specifically, in the embodiment of the present invention, the area of the flexible film 27 opposite to the photosensitive chip 14 is set as the hollowed-out area 29, when the external ambient light is injected through the transparent substrate 11, at least part of the ambient light can be directly injected into the photosensitive surface of the photosensitive chip 14 through the hollowed-out area 29, and the flexible film 27 is not required to be penetrated any more, so that the loss degree of the flexible film 27 to the external ambient light is reduced, the amount of the ambient light collected by the photosensitive chip 14 is increased, and the imaging precision of the imaging device is further effectively improved.
Optionally, in another embodiment of the present invention, referring to fig. 14, fig. 14 is a schematic cross-sectional view of still another electronic device according to an embodiment of the present invention.
The electronic device further includes:
a protective layer 30 on a side of the wiring layer 12 facing away from the light-transmitting substrate 11.
Specifically, in the embodiment of the present invention, the protective layer 30 is provided to effectively improve the stability of the film layer of the wiring layer 12, relieve the bending stress and bending crack in the bending region of the wiring layer 12, and further improve the connection reliability between the metal trace in the wiring layer 12 and other devices such as the photosensitive chip 14 and the active chip 24.
Optionally, in another embodiment of the present invention, the electronic device further includes a plastic sealing layer 31, where the plastic sealing layer 31 covers the photosensitive chip 14 and the active chip 24, so as to protect the photosensitive chip 14 and the active chip 24.
Specifically, the molding layer 31 may be formed of a material such as an epoxy molding compound (Epoxy Molding Compound, abbreviated as EMC) in the embodiment of the present invention.
It should be noted that the electronic device provided in the embodiment of the present invention may be any electronic device having a display function, such as a mobile phone, a notebook computer, or a video camera.
The foregoing has outlined a detailed description of an electronic device in accordance with the present invention, wherein specific examples are provided herein to illustrate the principles and embodiments of the present invention, and the above examples are provided to assist in understanding the method and core concepts of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include, or is intended to include, elements inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (16)
1. An electronic device, the electronic device comprising:
a light-transmitting substrate comprising a first surface and a second surface disposed opposite to each other;
the wiring layer is positioned on one side of the first surface and comprises at least one layer of first metal wire;
the light-sensitive chips are positioned on one side of the wiring layer, which is away from the light-transmitting substrate, and are electrically connected through the first metal wires, and each light-sensitive chip comprises a light-sensitive surface for sensing light signals, and the light-sensitive surface faces the first surface;
and the frame support protrudes to one side of the second surface.
2. The electronic device of claim 1, wherein orthographic projections of the plurality of photosensitive chips on the light-transmitting substrate are located within orthographic projections of the bezel support-enclosed area on the light-transmitting substrate.
3. The electronic device of claim 1, wherein the electronic device further comprises:
the second metal wire is positioned on one side of the second surface and is electrically connected with the first metal wire through a through hole penetrating through the light-transmitting substrate.
4. The electronic device of claim 3, wherein the electronic device further comprises:
a focusing motor positioned on one side of the second surface and an induction coil positioned inside the focusing motor;
the induction coil is electrically connected with the second metal wire.
5. The electronic device of claim 3, wherein the electronic device further comprises:
a first circuit board positioned on one side of the second surface;
the first circuit board is provided with a plurality of passive devices, and the plane of the first circuit board is perpendicular to the plane of the light-transmitting substrate.
6. The electronic device of claim 5, wherein the electronic device further comprises:
and the switching circuit board is electrically connected with the first circuit board and the second metal wire respectively.
7. The electronic device of claim 1, wherein the electronic device further comprises:
the active chip is positioned on one side of the first surface and is electrically connected with the photosensitive chip through the first metal wire.
8. The electronic device of claim 7, wherein the plurality of photosensitive chips includes a first photosensitive chip and a second photosensitive chip arranged in sequence in a first direction;
the active chip comprises a first active chip which is positioned at one side of the first photosensitive chip far away from the second photosensitive chip, and a second active chip which is positioned at one side of the second photosensitive chip far away from the first photosensitive chip;
the first active chip is electrically connected with the first photosensitive chip through the first metal wire, and the second active chip is electrically connected with the second photosensitive chip through the first metal wire.
9. The electronic device of claim 7, wherein the plurality of photosensitive chips includes a first photosensitive chip and a second photosensitive chip arranged in sequence in a first direction;
the active chip comprises a first active chip which is positioned at one side of the first photosensitive chip far away from the second photosensitive chip;
the wiring layer further comprises a third metal wire;
the first active chip is electrically connected with the first photosensitive chip through the first metal wire, and the first active chip is electrically connected with the second photosensitive chip through the third metal wire.
10. The electronic device of claim 8 or 9, wherein the plurality of photo-sensing chips further comprises a third photo-sensing chip located on one side of the first photo-sensing chip in a second direction, the first direction intersecting the second direction;
the third photosensitive chip is electrically connected with the first active chip through the first metal wire.
11. The electronic device of claim 7, wherein the electronic device further comprises:
and the flexible circuit board is positioned on one side of the first surface and is electrically connected with the active chip through the first metal wire.
12. The electronic device of claim 11, wherein the flexible circuit board is located on a side of the active chip remote from the photosensitive chip.
13. The electronic device of any one of claims 1-12, wherein the electronic device further comprises:
a flexible film layer located between the wiring layer and the light-transmitting substrate, the flexible film layer including at least one bending region;
the light-transmitting substrate is provided with a hollowed-out area, the hollowed-out area divides the light-transmitting substrate into a plurality of independent sub-light-transmitting substrates, and the hollowed-out area is overlapped with the bending area;
at least one photosensitive chip is arranged on the sub-light-transmitting substrate;
the frame support comprises a plurality of independent sub-frame supports, and the sub-frame supports are arranged in one-to-one correspondence with the sub-light-transmitting substrates.
14. The electronic device of claim 13, wherein the area of the flexible film layer opposite the photosensitive chip is a hollowed-out area.
15. The electronic device of claim 13, wherein the electronic device comprises: a front photosensitive region and a rear photosensitive region;
the flexible film layer comprises a bending area, and sub-light-transmitting substrates which are positioned at two sides of the bending area and provided with the photosensitive chips are respectively arranged in the front photosensitive area and the rear photosensitive area.
16. The electronic device of claim 13, wherein the electronic device further comprises:
and the protective layer is positioned on one side of the wiring layer, which is away from the light-transmitting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211705105.8A CN116230727A (en) | 2022-12-29 | 2022-12-29 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211705105.8A CN116230727A (en) | 2022-12-29 | 2022-12-29 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116230727A true CN116230727A (en) | 2023-06-06 |
Family
ID=86575915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211705105.8A Pending CN116230727A (en) | 2022-12-29 | 2022-12-29 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116230727A (en) |
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2022
- 2022-12-29 CN CN202211705105.8A patent/CN116230727A/en active Pending
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